TW202134006A - Jet machining device and jet machining method which can shorten the processing time - Google Patents

Jet machining device and jet machining method which can shorten the processing time Download PDF

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TW202134006A
TW202134006A TW110101413A TW110101413A TW202134006A TW 202134006 A TW202134006 A TW 202134006A TW 110101413 A TW110101413 A TW 110101413A TW 110101413 A TW110101413 A TW 110101413A TW 202134006 A TW202134006 A TW 202134006A
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Taiwan
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nozzles
workpiece
abrasive
jet processing
abrasive material
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TW110101413A
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Chinese (zh)
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神田真治
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日商新東工業股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C7/00Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
    • B24C7/0046Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a gaseous carrier
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C5/00Devices or accessories for generating abrasive blasts
    • B24C5/02Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
    • B24C5/04Nozzles therefor

Abstract

The jet machining device of the present invention comprises a nozzle unit having a plurality of nozzles for spraying an abrasive material to the surface of the workpiece together with compressed air, and a distribution mechanism for distributing the abrasive material to the plurality of nozzles; a storage part for storing the abrasive material inside; a supply part for supplying the abrasive material stored in the storage part to the nozzle unit; and a mobile part for moving at least one of the plurality of nozzles and the workpiece to change the relative position between the plurality of nozzles and the workpiece. The distribution mechanism includes a dispersion member for internally defining a dispersion chamber for dispersing the abrasive material in an aerosol shape, an introduction tube for connecting the supply part and the dispersion chamber and supplying the abrasive material in the supply part to the dispersion chamber, and a delivery tube for connecting the plurality of nozzles and the dispersion chamber and supplying the aerosol-shaped abrasive material in the dispersion chamber to the plurality of nozzles. The dispersion member is provided with an import port communicated with the introduction tube and a delivery port communicated with the delivery tube. The present invention also provides a jet machining method including the steps of preparing a printed circuit board material as the workpiece; forming a resist layer having an opening of [phi]25 [mu]m or more and [phi]80 [mu]m or less on a surface of the printed circuit board material; and spraying the abrasive material on the surface of the printed circuit board material including the resist layer and forming a through hole in the printed circuit board material through the opening of the resist layer, wherein the ratio h/d of the depth h of the through hole to the diameter d of the opening of the resist layer is 0.8 or more and 2.0 or less.

Description

噴射加工裝置及噴射加工方法Jet processing device and jet processing method

本發明係關於一種噴射加工裝置及噴射加工方法。The invention relates to a spray processing device and a spray processing method.

公知有一種噴射加工方法,其藉由將研磨材料與壓縮空氣一起從噴嘴噴射,而於被加工物形成孔、槽之類的較深空間。於此種噴射加工方法中,將形成有遮罩圖案之乾膜形成於被加工物上,從噴嘴噴射研磨材料,而將從乾膜露出之區域從被加工物除去,由此於被加工物形成空間。There is known a jet processing method in which an abrasive is jetted from a nozzle together with compressed air to form a deep space such as a hole and a groove in the workpiece. In this jet processing method, a dry film with a mask pattern is formed on the workpiece, the abrasive material is jetted from a nozzle, and the area exposed from the dry film is removed from the workpiece. Form space.

於噴射加工方法中,特別是在將印刷基板作為被加工物之情形等進行非常微細之加工之情形時,對空間要求加工精度。作為用於形成具有加工精度之空間之技術,公知有專利文獻1所記載之噴射加工方法,即形成導通孔(空間)之多列式基板之製造方法。於專利文獻1中,揭示了將形成有遮罩圖案之乾膜黏貼於被加工物之正背兩面,並從被加工物之正背兩面進行噴射加工之噴射加工方法。 先前技術文獻 專利文獻In the jet processing method, particularly when a printed circuit board is used as a workpiece, etc., when very fine processing is performed, the processing accuracy is required for the space. As a technique for forming a space with processing precision, the jet processing method described in Patent Document 1, that is, a method of manufacturing a multi-line substrate with via holes (spaces) is known. Patent Document 1 discloses a spray processing method in which a dry film formed with a mask pattern is adhered to the front and back sides of the workpiece, and spray processing is performed from the front and back sides of the workpiece. Prior art literature Patent literature

專利文獻1:日本專利6296407號公報Patent Document 1: Japanese Patent No. 6296407

[發明所欲解決之問題][The problem to be solved by the invention]

於專利文獻1所記載之噴射加工中,需要以遮罩圖案一致之方式將乾膜高精度地黏貼於正背兩面,進而於加工之中途使被加工物翻轉,因此存在加工時間變長之擔憂。In the jet processing described in Patent Document 1, the dry film needs to be adhered to both the front and back with high precision in a way that the mask pattern is consistent, and the workpiece is turned over during processing. Therefore, there is a concern that the processing time will be longer. .

鑒於以上,要求提供一種能夠縮短加工時間之噴射加工裝置及噴射加工方法。 [解決問題之技術手段]In view of the above, it is required to provide a spray processing device and a spray processing method that can shorten the processing time. [Technical means to solve the problem]

本發明之一方面係一種噴射加工裝置。噴射加工裝置具備噴嘴單元、貯存部、供給部以及移動部。噴嘴單元具有複數個噴嘴以及分配機構。複數個噴嘴將研磨材料與壓縮空氣一起向被加工物之表面噴射。分配機構將研磨材料分配給複數個噴嘴。貯存部之內部貯存研磨材料。供給部將貯存於貯存部之研磨材料供給至噴嘴單元。移動部使複數個噴嘴及被加工物中之至少一者移動,而變更複數個噴嘴與被加工物之相對位置。One aspect of the present invention is a jet processing device. The jet processing device includes a nozzle unit, a storage unit, a supply unit, and a moving unit. The nozzle unit has a plurality of nozzles and a distribution mechanism. A plurality of nozzles spray abrasive materials and compressed air onto the surface of the workpiece. The distribution mechanism distributes the abrasive material to a plurality of nozzles. Abrasive materials are stored in the storage part. The supply part supplies the abrasive material stored in the storage part to the nozzle unit. The moving part moves at least one of the plurality of nozzles and the workpiece, and changes the relative positions of the plurality of nozzles and the workpiece.

於該噴射加工裝置中,研磨材料被分配機構分配給複數個噴嘴。從複數個噴嘴之每一個向被加工物之表面噴射研磨材料。由於複數個噴嘴並行地向被加工物之表面噴射研磨材料,故與不具備複數個噴嘴之噴射加工裝置相比,該噴射加工裝置能夠縮短加工時間。In this jet processing device, the abrasive material is distributed to a plurality of nozzles by a distribution mechanism. The abrasive material is sprayed from each of the plurality of nozzles to the surface of the workpiece. Since a plurality of nozzles spray abrasives on the surface of the workpiece in parallel, the spray processing device can shorten the processing time compared to a spray processing device that does not have a plurality of nozzles.

於本發明之一實施方式中,分配機構可具有分散構件、導入管以及導出管。分散構件可於內部劃分出將研磨材料呈氣溶膠狀分散之分散室。導入管可將供給部與分散室連結,而將供給部之研磨材料供給至分散室。導出管可將複數個噴嘴與分散室連結,而將分散室之氣溶膠狀之研磨材料供給至複數個噴嘴。該噴射加工裝置由於在分散室中將研磨材料呈氣溶膠狀分散,故能夠向複數個噴嘴均勻地供給研磨材料。In one embodiment of the present invention, the distribution mechanism may have a dispersing member, an introduction pipe, and an output pipe. The dispersing member can divide the dispersing chamber inside to disperse the abrasive material in aerosol form. The introduction pipe can connect the supply part and the dispersion chamber, and supply the abrasive material of the supply part to the dispersion chamber. The outlet pipe can connect a plurality of nozzles with the dispersion chamber, and supply the aerosol-like abrasive material in the dispersion chamber to the plurality of nozzles. Since this jet processing apparatus disperses the abrasive in an aerosol form in the dispersion chamber, it can uniformly supply the abrasive to a plurality of nozzles.

於本發明之一實施方式中,可於分散構件設置有與導入管連通之導入口和與導出管連通之導出口。與導入口對向之分散室之頂面為圓形,導出口可以包圍頂面之中央之方式配置為圓環狀。該噴射加工裝置能夠從頂面之中央朝向配置為圓環狀之導出口均勻地分散氣溶膠狀之研磨材料。In one embodiment of the present invention, the dispersing member may be provided with an inlet communicating with the inlet pipe and an outlet communicating with the outlet pipe. The top surface of the dispersion chamber opposite to the inlet is circular, and the outlet can be arranged in a circular ring shape so as to surround the center of the top surface. The jet processing device can uniformly disperse the aerosol-like abrasive material from the center of the top surface toward the outlet port arranged in an annular shape.

於本發明之一實施方式中,與頂面正交之方向上的頂面與導入口之間的距離可為頂面之直徑之1/5以上1/2以下。該噴射加工裝置藉由將分散室之高度即頂面與導入口之間的距離設定於規定範圍內,能夠抑制分散室內之氣溶膠狀之研磨材料之偏差(即,被導出之研磨材料之量在每個導出口之偏差)。In one embodiment of the present invention, the distance between the top surface in the direction orthogonal to the top surface and the introduction port may be 1/5 or more and 1/2 or less of the diameter of the top surface. By setting the height of the dispersion chamber, that is, the distance between the top surface and the introduction port, within the specified range, the jet processing device can suppress the deviation of the aerosol-like abrasive in the dispersion chamber (that is, the amount of abrasive being led out) Deviation at each outlet).

於本發明之一實施方式中,導入管可為包含與分散構件連結之直線部之圓管。直線部之長度可為直線部中之導入管之內徑之5倍以上。該噴射加工裝置於導入管之直線部對由壓縮空氣形成之研磨材料之流動進行整流,因此能夠促進氣溶膠狀之研磨材料之均勻之分散。In one embodiment of the present invention, the introduction tube may be a round tube including a straight part connected with the dispersion member. The length of the straight part can be more than 5 times the inner diameter of the introduction tube in the straight part. The jet processing device rectifies the flow of the abrasive material formed by compressed air at the straight part of the inlet pipe, so it can promote the uniform dispersion of the aerosol-like abrasive material.

於本發明之一實施方式中,噴射加工裝置可進而具備控制移動部之動作之控制部。控制部可以交替實施第1掃描與第2掃描之方式控制移動部。於第1掃描中,控制部可使複數個噴嘴及被加工物中之至少一者沿著與被加工物之表面平行之第1方向移動。於第2掃描中,控制部可使複數個噴嘴及被加工物中之至少一者沿著與第1方向正交且與被加工物之表面平行之第2方向移動。第2掃描中之移動距離可為設置於複數個噴嘴之噴射口之直徑以下。複數個噴嘴可以於第2方向連接之方式排列設置。藉由如此配置複數個噴嘴,被加工物之表面被噴射研磨材料之位置不會重疊,因此該噴射加工裝置能夠對被加工物之整個表面高效地進行噴射加工。In one embodiment of the present invention, the jet processing device may further include a control unit that controls the operation of the moving unit. The control unit can control the moving unit by alternately performing the first scan and the second scan. In the first scan, the control unit can move at least one of the plurality of nozzles and the workpiece along the first direction parallel to the surface of the workpiece. In the second scan, the control unit can move at least one of the plurality of nozzles and the workpiece along the second direction orthogonal to the first direction and parallel to the surface of the workpiece. The movement distance in the second scan can be less than the diameter of the ejection openings provided in the plurality of nozzles. Multiple nozzles can be arranged in a manner of connecting in the second direction. By arranging a plurality of nozzles in this way, the position where the abrasive material is sprayed on the surface of the workpiece does not overlap, so the spray processing device can efficiently perform spray processing on the entire surface of the workpiece.

於本發明之一實施方式中,噴射加工裝置可進而具備加壓用導管。加壓用導管可向貯存部供給壓縮空氣,對貯存部之內部進行加壓,而將研磨材料向供給部擠出。該噴射加工裝置藉由利用加壓用導管以加壓之方式將研磨材料從貯存部擠出,能夠抑制與研磨材料一起被噴射之壓縮空氣之壓力損失,從而能夠提高噴射加工之加工能力。In one embodiment of the present invention, the jet processing apparatus may further include a pressurizing catheter. The pressurizing duct can supply compressed air to the storage part, pressurize the inside of the storage part, and squeeze the abrasive material to the supply part. The jet processing device uses a pressure pipe to pressurize the abrasive material from the storage part, and can suppress the pressure loss of the compressed air injected together with the abrasive material, thereby improving the processing capability of the jet processing.

本發明之另一方面之噴射加工方法具備以下之(1)~(3)之步驟。 (1)準備作為被加工物之印刷基板材料之步驟。 (2)於印刷基板材料之一個面形成設置有

Figure 02_image003
25 μm以上
Figure 02_image003
80 μm以下之開口之抗蝕劑層之步驟。 (3)向包含抗蝕劑層之印刷基板材料之一個面噴射研磨材料,經由抗蝕劑層之開口於印刷基板材料形成貫通孔之深度h相對於抗蝕劑層之開口之直徑d之比h/d為0.8以上2.0以下之貫通孔之步驟。In another aspect of the present invention, the jet processing method includes the following steps (1) to (3). (1) The step of preparing the printed circuit board material as the object to be processed. (2) Formed and arranged on one surface of the printed circuit board material
Figure 02_image003
25 μm or more
Figure 02_image003
Step of resist layer with openings below 80 μm. (3) The ratio of the polishing material to one surface of the printed circuit board material containing the resist layer, and the depth h of the through hole formed in the printed circuit board material through the opening of the resist layer to the diameter d of the opening of the resist layer h/d is the step of through-holes whose h/d is 0.8 or more and 2.0 or less.

該噴射加工方法藉由將抗蝕劑層之開口設定於上述範圍內,能夠形成具有較高之縱橫比(h/d)之貫通孔。By setting the opening of the resist layer within the above-mentioned range, the spray processing method can form a through hole with a high aspect ratio (h/d).

於本發明之一實施方式中,貫通孔之直徑Da相對於抗蝕劑層之開口之直徑Db之比Da/Db亦可為0.84以上0.94以下。 [發明之效果]In one embodiment of the present invention, the ratio Da/Db of the diameter Da of the through hole to the diameter Db of the opening of the resist layer may be 0.84 or more and 0.94 or less. [Effects of Invention]

本發明之技術可提供一種能夠縮短加工時間之噴射加工裝置及噴射加工方法。The technology of the present invention can provide a spray processing device and a spray processing method capable of shortening the processing time.

以下,參照圖式,對本發明之實施方式進行說明。再者,於以下之說明中,對相同或相當要素標註相同符號,省略重複之說明。圖式之尺寸比率不一定與說明之尺寸比率一致。「上」「下」「左」「右」之詞語只要沒有特別說明,則表示圖示之狀態,便於進行說明。X軸方向、Y軸方向以及Z軸方向係三維空間之正交座標系中之相互正交之軸向。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the following description, the same or equivalent elements are denoted with the same reference numerals, and repeated descriptions are omitted. The size ratio of the drawing is not necessarily consistent with the size ratio of the description. As long as the words "up", "down", "left" and "right" are not specified, they indicate the state of the icon for ease of description. The X-axis direction, the Y-axis direction, and the Z-axis direction are the axial directions orthogonal to each other in the orthogonal coordinate system of the three-dimensional space.

(噴射加工裝置) 圖1係表示實施方式之噴射加工裝置之整體剖視圖。噴射加工裝置1係噴射由供給部2供給之定量之研磨材料3之裝置。噴射加工裝置1藉由將研磨材料3向被加工物4之表面噴射,而進行作為切斷、槽加工、開孔加工等切削加工方法之一之噴射加工。研磨材料3例如係氧化鋁粉末、生鐵磨料、鑄模磨料等。被加工物4例如可列舉陶瓷材料、玻璃材料等硬脆材料、CFRP(Carbon Fiber Reinforced Plastics:碳纖維增強塑膠)材料等難切削材料,或者印刷基板材料等。印刷基板材料係於絕緣材料或者玻璃環氧基板形成有導電性薄膜之基材。(Jet processing device) FIG. 1 is an overall cross-sectional view showing the jet processing apparatus of the embodiment. The jet processing device 1 is a device that jets a fixed amount of abrasive 3 supplied by the supply part 2. The jet processing device 1 jets the abrasive 3 onto the surface of the workpiece 4 to perform jet processing as one of cutting processing methods such as cutting, grooving, and drilling. The abrasive 3 is, for example, alumina powder, pig iron abrasive, mold abrasive, and the like. Examples of the workpiece 4 include hard and brittle materials such as ceramic materials and glass materials, difficult-to-cut materials such as CFRP (Carbon Fiber Reinforced Plastics) materials, and printed circuit board materials. The printed substrate material is a base material on which a conductive film is formed on an insulating material or a glass epoxy substrate.

噴射加工裝置1具備供給部2、加工部5、篩選部6、集塵部7以及控制部9。噴射加工裝置1將經由供給部2供給來之研磨材料3於加工部5與壓縮空氣一起作為氣固兩相流朝向被加工物4之表面噴射,而進行噴射加工。噴射加工裝置1於加工部5對被噴射之研磨材料3進行回收並再使用。當於加工部5對被加工物4進行噴射加工時,會產生包含使用過之研磨材料3之粉粒體8。粉粒體8例如包含可再使用之研磨材料3、因破碎、磨損而成為不可再使用之尺寸之研磨材料3及被加工物4之切削粉。噴射加工裝置1將粉粒體8從加工部5移送至篩選部6。噴射加工裝置1將粉粒體8中之可再使用之研磨材料3從篩選部6移送至供給部2,並進行噴射。噴射加工裝置1將不可再使用之研磨材料3及切削粉從篩選部6輸送至集塵部7,進行收集。The jet processing device 1 includes a supply unit 2, a processing unit 5, a screening unit 6, a dust collecting unit 7, and a control unit 9. The jet processing device 1 jets the abrasive 3 supplied via the supply part 2 in the processing part 5 together with compressed air as a gas-solid two-phase flow toward the surface of the workpiece 4 to perform jet processing. The jet processing device 1 recovers the jetted abrasive 3 in the processing part 5 and reuses it. When the to-be-processed object 4 is spray-processed in the processing part 5, powder and granular bodies 8 containing the used abrasive 3 are produced. The powder body 8 includes, for example, a reusable abrasive material 3, an abrasive material 3 of a size that is not reusable due to crushing and abrasion, and cutting powder of the workpiece 4. The jet processing device 1 transfers the powder and granular body 8 from the processing section 5 to the screening section 6. The jet processing device 1 transfers the reusable abrasive 3 in the powder or granular body 8 from the screening part 6 to the supply part 2 and sprays it. The jet processing device 1 transports the non-reusable abrasive 3 and cutting powder from the screening part 6 to the dust collecting part 7 for collection.

(供給部) 圖1所示之供給部2具備貯存部10、填充部20、輥30、驅動部40以及取出部50。貯存部10於內部貯存研磨材料3。於貯存部10連結有供給壓縮空氣之加壓用導管73,從而貯存部10之內部被壓縮空氣加壓。(Supply Department) The supply unit 2 shown in FIG. 1 includes a storage unit 10, a filling unit 20, a roller 30, a driving unit 40, and a take-out unit 50. The storage part 10 stores the abrasive material 3 inside. A pressurizing duct 73 for supplying compressed air is connected to the storage portion 10, so that the inside of the storage portion 10 is pressurized by the compressed air.

填充部20連結於貯存部10之下方。於填充部20之下方連結有收容輥30、驅動部40以及取出部50之一部分之框體。輥30為圓柱形狀,於作為圓形之兩側面之中心連接有旋轉軸(未圖示)。又,於輥30之表面沿與旋轉軸平行之方向等間隔地形成有複數條槽。驅動部40係用於使輥30以旋轉軸為軸心進行旋轉之機構。取出部50係以覆蓋輥30之槽之一部分之方式形成之壓縮空氣之流路。於取出部50連結有供給壓縮空氣之管路(未圖示)。The filling part 20 is connected below the storage part 10. Below the filling part 20, a frame body of a part of the housing roller 30, the driving part 40, and the take-out part 50 is connected. The roller 30 has a cylindrical shape, and a rotating shaft (not shown) is connected to the center of the two sides that are circular. In addition, a plurality of grooves are formed at equal intervals on the surface of the roller 30 in a direction parallel to the rotation axis. The drive unit 40 is a mechanism for rotating the roller 30 about the axis of rotation. The take-out part 50 is a flow path of compressed air formed to cover a part of the groove of the roller 30. A pipeline (not shown) for supplying compressed air is connected to the extraction part 50.

貯存於貯存部10之研磨材料3被移送至填充部20。然後,研磨材料3被壓縮空氣產生之按壓力填充於輥30之槽。輥30藉由驅動部40之動作而旋轉,因此對所有槽連續地填充研磨材料3。藉由輥30之旋轉而從填充部20到達取出部50之研磨材料3被壓縮空氣從槽擠出至噴嘴單元U。之後,研磨材料3經由噴嘴單元U被供給至噴嘴502。The abrasive 3 stored in the storage part 10 is transferred to the filling part 20. Then, the grinding material 3 is filled in the groove of the roller 30 by the pressing force generated by the compressed air. The roller 30 is rotated by the operation of the driving unit 40, and therefore all the grooves are continuously filled with the abrasive 3. The grinding material 3 reaching the take-out part 50 from the filling part 20 by the rotation of the roller 30 is extruded from the groove to the nozzle unit U by the compressed air. After that, the abrasive 3 is supplied to the nozzle 502 via the nozzle unit U.

(加工部) 加工部5對被加工物4進行噴射加工。加工部5具有殼體501、噴嘴單元U、加工台503以及移動部M。於殼體501之內部劃分有加工室509。(Processing Department) The processing part 5 performs jet processing on the workpiece 4. The processing part 5 has a housing 501, a nozzle unit U, a processing table 503, and a moving part M. A processing chamber 509 is divided inside the housing 501.

噴嘴單元U具有分配機構550與複數個噴嘴502。複數個噴嘴502例如配置於加工室509內之上部。複數個噴嘴502沿著與被加工物4之表面正交之Z軸延伸,各個噴射口與被加工物4之表面對向。複數個噴嘴502將研磨材料3與壓縮空氣一起向被加工物4之表面噴射。複數個噴嘴502將研磨材料3作為與壓縮空氣之混合流體(氣固兩相流)從各個噴射口噴射。複數個噴嘴502各自之噴射口為圓形。複數個噴嘴502沿著X軸排列設置(參照圖4)。再者,X軸之負方向係後述之進給方向。The nozzle unit U has a distribution mechanism 550 and a plurality of nozzles 502. The plurality of nozzles 502 are arranged on the upper part of the processing chamber 509, for example. A plurality of nozzles 502 extend along the Z axis orthogonal to the surface of the workpiece 4, and each injection port faces the surface of the workpiece 4. A plurality of nozzles 502 spray the abrasive 3 together with compressed air onto the surface of the workpiece 4. The plurality of nozzles 502 spray the abrasive 3 as a mixed fluid (gas-solid two-phase flow) with compressed air from each injection port. The ejection ports of the plurality of nozzles 502 are circular. A plurality of nozzles 502 are arranged side by side along the X axis (refer to FIG. 4). Furthermore, the negative direction of the X axis is the feed direction described later.

如圖2及圖3所示,分配機構550具有導入管551、分散構件552以及複數根導出管553。於分散構件552之內部劃分有分散室552S。導入管551之一端與供給部2連結,另一端與分散室552S連結。於分散構件552設置有與導入管551連通之導入口551H。複數根導出管553之個數與複數個噴嘴502之個數相同。複數根導出管553各自之一端與複數個噴嘴502中之一個連結,另一端與分散室552S連結。於分散構件552,與複數根導出管553分別對應地設置有導出口553H。As shown in FIGS. 2 and 3, the distribution mechanism 550 has an introduction pipe 551, a dispersion member 552, and a plurality of outlet pipes 553. Inside the dispersing member 552, a dispersing chamber 552S is divided. One end of the introduction pipe 551 is connected to the supply part 2, and the other end is connected to the dispersion chamber 552S. The dispersing member 552 is provided with an introduction port 551H communicating with the introduction pipe 551. The number of the plurality of outlet pipes 553 is the same as the number of the plurality of nozzles 502. One end of each of the plurality of outlet pipes 553 is connected to one of the plurality of nozzles 502, and the other end is connected to the dispersion chamber 552S. The dispersing member 552 is provided with a lead-out port 553H corresponding to a plurality of lead-out pipes 553, respectively.

研磨材料3被壓縮空氣之氣流從取出部50擠出至噴嘴單元U之導入管551。包含被擠出至導入管551之研磨材料3之氣流通過導入管551被供給至分散室552S。導入管551亦可包含與分散室552S連結之直線部551S。藉由將直線部551S設為規定長度之直線狀之圓管,包含研磨材料3之氣流於被供給至分散室552S前被整流。即,於包含研磨材料3之氣流中,能夠促進研磨材料3之分散。例如,亦可將直線部551S之沿著鉛垂方向(Z軸方向)之管長設為直線部551S中之導入管551之內徑之5倍以上,較佳為10倍以上。藉由適當地設定直線部551S之長度,能夠使研磨材料3高效地分散。The abrasive material 3 is extruded from the take-out part 50 to the introduction pipe 551 of the nozzle unit U by the flow of compressed air. The air flow containing the abrasive 3 extruded into the introduction pipe 551 is supplied to the dispersion chamber 552S through the introduction pipe 551. The introduction pipe 551 may also include a straight portion 551S connected to the dispersion chamber 552S. By setting the linear portion 551S as a linear circular pipe with a predetermined length, the air flow containing the abrasive 3 is rectified before being supplied to the dispersion chamber 552S. That is, in the airflow containing the abrasive 3, the dispersion of the abrasive 3 can be promoted. For example, the tube length along the vertical direction (Z-axis direction) of the linear portion 551S may be 5 times or more of the inner diameter of the introduction tube 551 in the linear portion 551S, preferably 10 times or more. By appropriately setting the length of the linear portion 551S, the abrasive 3 can be efficiently dispersed.

分散室552S將從導入管551供給來之研磨材料3均勻地分散。分散室552S將研磨材料3呈氣溶膠狀分散。分散室552S之與導入口551H對向之頂面552A為圓形。此處,因導入口551H與頂面552A之間之距離(高度H),氣溶膠之濃度之均勻性受損,或者於複數個噴嘴502中噴射研磨材料3時之壓力受損。為了保持氣溶膠之濃度之均勻性,且不對複數個噴嘴502之噴射研磨材料3之噴射壓力造成影響,亦可將高度H設定為頂面之直徑D1之1/5以上1/2以下。The dispersion chamber 552S uniformly disperses the abrasive 3 supplied from the introduction pipe 551. The dispersion chamber 552S disperses the abrasive 3 in an aerosol state. The top surface 552A of the dispersion chamber 552S facing the inlet 551H is circular. Here, due to the distance (height H) between the inlet 551H and the top surface 552A, the uniformity of the aerosol concentration is impaired, or the pressure when the abrasive 3 is sprayed in the plurality of nozzles 502 is impaired. In order to maintain the uniformity of the aerosol concentration without affecting the spray pressure of the abrasive material 3 sprayed by the plurality of nozzles 502, the height H can also be set to 1/5 or more and 1/2 or less of the diameter D1 of the top surface.

複數個導出口553H以包圍分散構件552之頂面552A之中央之方式配置為圓環狀。從導入口551H供給來之研磨材料3抵碰到與導入口551H對向之圓形之頂面552A而呈氣溶膠狀分散。氣溶膠狀之研磨材料3從圓形之頂面552A之中央朝向外緣均勻地分散。呈氣溶膠狀分散之研磨材料3從複數個導出口553H經由軟管向複數個噴嘴502分別壓出,並被複數個噴嘴502噴射出。複數個導出口553H能夠配置為相對於複數個噴嘴502之每一個均勻地壓出研磨材料3。作為一例,導出管553於頂面552A之外緣附近等間隔且同心狀地配置。The plurality of outlets 553H are arranged in an annular shape so as to surround the center of the top surface 552A of the dispersion member 552. The abrasive 3 supplied from the inlet 551H abuts against the circular top surface 552A facing the inlet 551H and is dispersed in an aerosol state. The aerosol-like abrasive material 3 is evenly dispersed from the center of the circular top surface 552A toward the outer edge. The abrasive 3 dispersed in the form of aerosol is respectively pushed out from the plurality of outlets 553H to the plurality of nozzles 502 via hoses, and is ejected by the plurality of nozzles 502. The plurality of outlets 553H can be configured to uniformly press out the abrasive 3 with respect to each of the plurality of nozzles 502. As an example, the outlet pipes 553 are arranged concentrically at equal intervals in the vicinity of the outer edge of the top surface 552A.

移動部M係變更被加工物4與複數個噴嘴502之相對位置之驅動部。移動部M可使被加工物4移動,可使複數個噴嘴502移動,亦可使被加工物4及複數個噴嘴502雙方移動。於本實施方式中,對具有噴嘴驅動部504及被加工物驅動部505作為移動部M,使複數個噴嘴502及被加工物4雙方移動之構成進行說明。The moving part M is a driving part which changes the relative position of the to-be-processed object 4 and a plurality of nozzles 502. The moving part M can move the workpiece 4 and can move a plurality of nozzles 502, and can also move both the workpiece 4 and the plurality of nozzles 502. In this embodiment, a configuration in which the nozzle drive unit 504 and the workpiece drive unit 505 are provided as the moving unit M, and both the plurality of nozzles 502 and the workpiece 4 are moved will be described.

加工台503係供被加工物4載置之台。加工台503配置於加工室509內。如圖4所示,加工台503於複數個噴嘴502噴射研磨材料3之噴射方向上,以載置被加工物4之面與複數個噴嘴502之延伸方向(Z軸方向)正交之方式載置於被加工物驅動部505上。加工台503之載置被加工物4之面亦可為吸附被加工物4之面。The processing table 503 is a table on which the to-be-processed object 4 is placed. The processing table 503 is arranged in the processing room 509. As shown in FIG. 4, the processing table 503 is placed in the jetting direction of the abrasive material 3 by the plurality of nozzles 502 so that the surface on which the workpiece 4 is placed is orthogonal to the extending direction (Z-axis direction) of the plurality of nozzles 502. It is placed on the to-be-processed object drive part 505. The surface of the processing table 503 on which the processed object 4 is placed may also be a surface on which the processed object 4 is adsorbed.

噴嘴驅動部504配置於殼體501之上部。噴嘴驅動部504與複數個噴嘴502連接。噴嘴驅動部504以複數個噴嘴502噴射研磨材料3之噴射區域與被加工物4進行相對移動之方式使複數個噴嘴502移動。被加工物驅動部505配置於殼體501之下部。被加工物驅動部505與加工台503之下表面連接。被加工物驅動部505以複數個噴嘴502噴射研磨材料3之噴射區域與被加工物4進行相對移動之方式使載置有被加工物4之加工台503移動。被加工物驅動部505例如為X-Y工作台等驅動機構。噴嘴驅動部504及被加工物驅動部505之相對移動所形成之軌跡(掃描軌跡)由控制部9控制。The nozzle driving unit 504 is arranged on the upper part of the housing 501. The nozzle driving unit 504 is connected to a plurality of nozzles 502. The nozzle driving unit 504 moves the plurality of nozzles 502 such that the spray area of the abrasive 3 and the workpiece 4 are relatively moved by the nozzles 502. The workpiece driving unit 505 is arranged at the lower part of the housing 501. The workpiece drive unit 505 is connected to the lower surface of the processing table 503. The workpiece drive unit 505 moves the processing table 503 on which the workpiece 4 is placed such that the spray area of the abrasive 3 and the workpiece 4 are moved relative to each other by a plurality of nozzles 502 jetting. The workpiece drive unit 505 is, for example, a drive mechanism such as an X-Y table. The trajectory (scanning trajectory) formed by the relative movement of the nozzle driving unit 504 and the workpiece driving unit 505 is controlled by the control unit 9.

控制部9控制移動部M之動作。控制部9例如由具有CPU(Central Processing Unit:中央處理單元)等運算裝置、ROM(Read Only Memory:唯讀記憶體)、RAM(Random Access Memory:隨機存取記憶體)、HDD(Hard Disk Drive:硬碟驅動器)等記憶裝置以及通信裝置等之通用電腦構成。控制部9例如亦可為PLC(Programmable Logic Controller:可編程邏輯控制器)、DSP(Digital Signal Processor:數位信號處理器)等運動控制器。控制部9亦可為控制噴射加工裝置1整體之硬體。The control unit 9 controls the operation of the moving unit M. The control unit 9 is composed of, for example, a computing device such as a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and HDD (Hard Disk Drive). : Hard disk drive) and other general-purpose computers such as memory devices and communication devices. The control unit 9 may also be a motion controller such as PLC (Programmable Logic Controller) or DSP (Digital Signal Processor). The control unit 9 may also be a hardware that controls the entire jet processing device 1.

圖5係表示被加工物4及複數個噴嘴502之相對移動形成之、與被加工物4之表面平行之方向之軌跡(掃描軌跡)之模式圖。掃描軌跡表示沿著X軸方向及與X軸方向正交之Y軸方向之Z字形形狀。控制部9以被加工物4及複數個噴嘴502描繪此種掃描軌跡之方式控制移動部M之動作。基於該圖之掃描軌跡進行說明。首先,以複數個噴嘴502中之配置於X軸之最靠正方向之位置之噴嘴502A之噴射區域與掃描軌跡上之起點S重疊之方式,調整被加工物4與複數個噴嘴502之相對位置。起點S於掃描軌跡中設置於X軸之最靠正方向且Y軸之最靠負方向之位置。於該情形時,由於其他噴嘴以於X軸之負方向連接之方式排列,因此,其他噴嘴之噴射區域與從起點S觀時配置於X軸之負方向之其他起點(未圖示)重疊。以下,將噴嘴502A之噴射區域作為「噴射區域」進行說明。FIG. 5 is a schematic diagram showing a trajectory (scanning trajectory) in a direction parallel to the surface of the workpiece 4 formed by the relative movement of the workpiece 4 and a plurality of nozzles 502. The scan trajectory represents a zigzag shape along the X-axis direction and the Y-axis direction orthogonal to the X-axis direction. The control unit 9 controls the operation of the moving unit M such that the workpiece 4 and the plurality of nozzles 502 trace such a scanning trajectory. The description is based on the scanning trajectory of the figure. First, adjust the relative positions of the workpiece 4 and the plurality of nozzles 502 in such a way that the ejection area of the nozzle 502A, which is arranged in the most positive direction of the X-axis, among the plurality of nozzles 502 overlaps the starting point S on the scanning track. . The starting point S is set in the most positive direction of the X-axis and the most negative position of the Y-axis in the scanning trajectory. In this case, since the other nozzles are arranged in a manner connected in the negative direction of the X axis, the spray areas of the other nozzles overlap with other starting points (not shown) arranged in the negative direction of the X axis when viewed from the starting point S2. Hereinafter, the spray area of the nozzle 502A will be described as the "spray area".

首先,控制部9以噴射區域從起點S沿著與被加工物4之表面平行之Y軸方向(第1方向)移動之方式控制被加工物驅動部505之動作(第1掃描)。具體而言,使被加工物4沿著Y軸之負方向移動。繼而,若噴射區域到達Y軸之負方向之端,則控制部9以噴射區域沿著與Y軸方向正交且與被加工物4之表面平行之X軸方向(第2方向)移動之方式控制噴嘴驅動部504之動作(第2掃描)。具體而言,使複數個噴嘴502沿著X軸之負方向(本說明書中亦記為進給方向)移動。繼而,控制部9以噴射區域沿著Y軸方向移動之方式控制被加工物驅動部505之動作。具體而言,使被加工物4沿著Y軸之正方向移動。若噴射區域到達第1方向之上側之端,則控制部9以噴射區域沿著進給方向移動之方式控制噴嘴驅動部504之動作。藉由交替重複該動作,而描繪掃描軌跡。此處,從噴嘴502A噴射之氣固兩相流具有速度分佈,從而會根據距噴嘴502A之位置使研磨力產生差異。進給方向之移動距離考慮該研磨力之差異而被設定。進給方向之移動距離例如亦可不包含0且為噴嘴502A之噴射口之直徑以下。First, the control unit 9 controls the operation (first scan) of the workpiece driving unit 505 so that the ejection area moves from the starting point S in the Y-axis direction (first direction) parallel to the surface of the workpiece 4. Specifically, the workpiece 4 is moved in the negative direction of the Y axis. Then, when the injection area reaches the end of the negative direction of the Y-axis, the control unit 9 moves the injection area along the X-axis direction (second direction) orthogonal to the Y-axis direction and parallel to the surface of the workpiece 4 The operation of the nozzle drive unit 504 is controlled (second scan). Specifically, the plurality of nozzles 502 are moved along the negative direction of the X axis (also referred to as the feed direction in this specification). Then, the control unit 9 controls the operation of the workpiece driving unit 505 so that the ejection area moves in the Y-axis direction. Specifically, the workpiece 4 is moved in the positive direction of the Y axis. When the spray area reaches the upper end in the first direction, the control unit 9 controls the operation of the nozzle drive unit 504 so that the spray area moves in the feed direction. By alternately repeating this action, the scanning trajectory is drawn. Here, the gas-solid two-phase flow sprayed from the nozzle 502A has a velocity distribution, so that the grinding force will be different according to the position from the nozzle 502A. The movement distance in the feed direction is set in consideration of the difference in the grinding force. The movement distance in the feed direction may not include 0, and may be less than or equal to the diameter of the injection port of the nozzle 502A, for example.

(篩選部) 篩選部6對在加工部5對被加工物4進行噴射加工之過程中產生之粉粒體8進行回收。篩選部6將粉粒體8中之可再使用之研磨材料3輸送至後述之貯存部10。篩選部6將粉粒體8中之不可再使用之研磨材料3、被加工物4剝離而產生之切削粉等輸送至後述之集塵器702。篩選部6具有回收導管601以及分級部602。回收導管601係一端與加工部5連接,另一端與分級部602連接之管。回收導管601使粉粒體8乘著後述之集塵器702產生之氣流從加工部5向篩選部6之分級部602輸送。(Screening Department) The screening part 6 collects the powder and granular body 8 produced in the process of the processing part 5 spraying the to-be-processed object 4. The screening part 6 transports the reusable abrasive 3 in the powder and granular body 8 to the storage part 10 described later. The screening part 6 conveys the grinding material 3 that is not reusable in the granular material 8 and the cutting powder generated by the peeling of the workpiece 4 to the dust collector 702 described later. The screening unit 6 has a recovery duct 601 and a classification unit 602. The recovery pipe 601 is a tube connected to the processing part 5 at one end and connected to the classification part 602 at the other end. The recovery duct 601 transports the powder and granular material 8 from the processing section 5 to the classification section 602 of the screening section 6 on the airflow generated by the dust collector 702 described later.

分級部602之上部與後述之集塵導管701連通。分級部602於下部與貯存部10連通。分級部602例如為研缽狀之中空構造。分級部602將從回收導管601輸送來之粉粒體8分級為可再使用之研磨材料3、不可再使用之研磨材料3及切削粉。分級部602例如為旋風分離器。The upper part of the classification part 602 communicates with the dust collection duct 701 mentioned later. The classification part 602 communicates with the storage part 10 at the lower part. The classification part 602 is a mortar-shaped hollow structure, for example. The classification part 602 classifies the powder and granular material 8 conveyed from the recovery duct 601 into reusable abrasive 3, non-reusable abrasive 3, and cutting powder. The classification unit 602 is, for example, a cyclone separator.

粉粒體8例如於分級部602內回轉。粉粒體8中之可再使用之研磨材料3比不可再使用之研磨材料3及切削粉重。作為較重之粒子之可再使用之研磨材料3於回轉速度降低時因重力而向分級部602下部落下並收集。壓縮空氣未流入貯存部10之內部,且分級部602與貯存部10之間之閥打開,使貯存部10與分級部602連通之情形時,收集在分級部602下部之可再使用之研磨材料3被送至供給部2之貯存部10。作為較輕之粒子之不可再使用之研磨材料3及切削粉被送至與分級部602上部連接之後述之集塵導管701。The powder and granular body 8 revolves in the classification unit 602, for example. The reusable abrasive 3 in the powder body 8 is heavier than the non-reusable abrasive 3 and cutting powder. The reusable abrasive 3, which is a heavier particle, drops to the lower part of the classification part 602 and is collected due to gravity when the rotation speed is reduced. When the compressed air does not flow into the storage part 10, and the valve between the classification part 602 and the storage part 10 is opened to connect the storage part 10 and the classification part 602, the reusable abrasive material collected in the lower part of the classification part 602 is collected 3 is sent to the storage section 10 of the supply section 2. The abrasive material 3 and the cutting powder that are not reusable as lighter particles are sent to the dust collecting duct 701 which is connected to the upper part of the classification part 602 and described later.

(集塵部) 集塵部7對由篩選部6回收之不可再使用之研磨材料3及切削粉進行收集。集塵部7具有集塵導管701以及集塵器702。集塵導管701係一端與分級部602連接,另一端與集塵器702連接之管。集塵導管701將不可再使用之研磨材料3及切削粉從分級部602向集塵器702輸送。(Dust collection department) The dust collecting part 7 collects the non-reusable abrasive 3 and cutting powder recovered by the screening part 6. The dust collecting part 7 has a dust collecting duct 701 and a dust collector 702. The dust collecting duct 701 is a tube connected to the classification part 602 at one end and connected to the dust collector 702 at the other end. The dust collecting duct 701 conveys the non-reusable abrasive 3 and cutting powder from the classification part 602 to the dust collector 702.

集塵器702對從集塵導管701輸送來之不可再使用之研磨材料3及切削粉進行收集。集塵器702具有未圖示之吸引力產生源以及過濾器。藉由使吸引力產生源動作,而於與集塵器702連通之加工室509、回收導管601、分級部602以及集塵導管701內產生朝向集塵器702之氣流。藉由吸引力產生源之動作,從集塵導管701輸送來之不可再使用之研磨材料3及切削粉與空氣一起被吸引至集塵器702內。於集塵器702內,過濾器配置於集塵導管701與吸引力產生源之路徑上。過濾器捕獲不可再使用之研磨材料3及切削粉。藉由過濾器,僅空氣被移送至吸引力產生源。捕獲到之不可再使用之研磨材料3及切削粉能夠藉由取下過濾器而進行回收。The dust collector 702 collects the non-reusable abrasive 3 and cutting powder conveyed from the dust collecting duct 701. The dust collector 702 has a suction source and a filter which are not shown in the figure. By operating the suction force generating source, an airflow toward the dust collector 702 is generated in the processing chamber 509, the recovery duct 601, the classification part 602, and the dust collection duct 701 which are connected to the dust collector 702. Due to the action of the source of attraction, the unusable abrasive 3 and cutting powder conveyed from the dust collecting duct 701 are sucked into the dust collector 702 together with air. In the dust collector 702, the filter is arranged on the path between the dust collecting duct 701 and the source of attraction. The filter captures the abrasive material 3 and cutting powder that can no longer be used. With the filter, only air is transferred to the source of attraction. The captured non-reusable abrasive 3 and cutting powder can be recovered by removing the filter.

(噴射加工裝置之步驟) 對噴射加工裝置1進行之噴射加工步驟進行說明。此處,以將印刷基板材料作為被加工物4,形成用於形成導通孔、通孔之貫通孔之噴射加工為例進行說明。印刷基板係藉由在聚醯亞胺、聚酯等絕緣體片材以及玻璃環氧基板之表面黏貼銅等導體箔而製作。圖6係表示實施方式之噴射加工裝置1之整體步驟之流程圖。(Steps of jet processing device) The spray processing steps performed by the spray processing device 1 will be described. Here, the blasting process of forming through holes for forming via holes and through holes using a printed circuit board material as the workpiece 4 will be described as an example. The printed circuit board is made by pasting a conductor foil such as copper on the surface of an insulator sheet such as polyimide, polyester, etc. and a glass epoxy substrate. FIG. 6 is a flowchart showing the overall steps of the jet processing apparatus 1 of the embodiment.

首先,進行被加工物4之準備步驟(步驟S1)。於步驟S1中,在被加工物4之表面形成遮罩圖案。具體而言,對被加工物4進行加熱,藉由層壓機在加熱後之被加工物4(之表面)黏貼遮罩材料。然後,將黏貼有遮罩材料之被加工物4配置於曝光機。於曝光機中,使用CCD(Charge Coupled Device:電荷耦合元件)照相機將圖案原版之位置對準被加工物4,進行曝光。然後,將被曝光之被加工物4配置於顯影機。於顯影機中,藉由一面使被加工物4旋轉一面噴附顯影液,而形成抗蝕劑層之遮罩圖案。此處,抗蝕劑層設置有與加工目標之孔對應之至少

Figure 02_image003
25 μm以上
Figure 02_image003
80 μm以下之開口。First, the preparation step of the workpiece 4 (step S1) is performed. In step S1, a mask pattern is formed on the surface of the object 4 to be processed. Specifically, the workpiece 4 is heated, and the mask material is pasted on the heated workpiece 4 (the surface thereof) by a laminator. Then, the to-be-processed object 4 to which the mask material is pasted is arrange|positioned in an exposure machine. In the exposure machine, a CCD (Charge Coupled Device) camera is used to align the position of the original pattern with the workpiece 4 for exposure. Then, the exposed workpiece 4 is placed in a developing machine. In the developing machine, by rotating the workpiece 4 on one side while spraying the developer on the other side, a mask pattern of the resist layer is formed. Here, the resist layer is provided with at least
Figure 02_image003
25 μm or more
Figure 02_image003
Openings below 80 μm.

繼而,進行噴射加工裝置1之準備步驟(步驟S2)。於步驟S2中,對基於噴嘴驅動部504之複數個噴嘴502與被加工物4之距離、複數個噴嘴502噴射研磨材料3之噴射壓力等進行調整。對於噴射壓力之調整而言,首先經由軟管向複數個噴嘴502供給壓縮空氣。繼而,藉由操作壓力閥而將研磨材料3之噴射壓力調整為規定之壓力。於噴射壓力之調整後,停止壓縮空氣之供給。Then, the preparation step of the jet processing apparatus 1 is performed (step S2). In step S2, the distance between the plurality of nozzles 502 and the workpiece 4 based on the nozzle driving unit 504, the injection pressure of the abrasive material 3 injected by the plurality of nozzles 502, and the like are adjusted. For the adjustment of the injection pressure, first, compressed air is supplied to a plurality of nozzles 502 via a hose. Then, the injection pressure of the abrasive 3 is adjusted to a predetermined pressure by operating the pressure valve. After adjusting the injection pressure, stop the supply of compressed air.

又,於步驟S2中,控制部9設定移動部M之動作模式。動作模式包含複數個噴嘴502之掃描軌跡以及移動速度、掃描次數等。表示動作模式之設定資訊被記憶於控制部9之記憶裝置。In addition, in step S2, the control unit 9 sets the operation mode of the moving unit M. The operation mode includes scanning trajectories, moving speeds, and scanning times of a plurality of nozzles 502. The setting information indicating the operation mode is stored in the storage device of the control unit 9.

結束該等調整後,將研磨材料3投入供給部2之貯存部10。投入與噴射量相應量之研磨材料3。After finishing these adjustments, the abrasive 3 is put into the storage part 10 of the supply part 2. Put in an amount of abrasive 3 corresponding to the amount of spray.

繼而,接著進行被加工物4之設置步驟(S3)。於步驟S3中,被加工物4通過設置於加工室509之觀察窗而載置於加工台503之與複數個噴嘴502對向之面上。Then, the step of setting the workpiece 4 (S3) is performed. In step S3, the workpiece 4 is placed on the surface of the processing table 503 facing the plurality of nozzles 502 through the observation window provided in the processing chamber 509.

繼而,進行噴射加工步驟(S4)。於步驟S4中,首先,將壓縮空氣通過加壓用導管73供給至貯存部10。接下來,藉由向貯存部10之內部供給壓縮空氣,而對貯存部10之內部進行加壓,貯存部10與分級部602之間之閥關閉。由此,貯存部10被密封。接下來,研磨材料3於貯存部10內被壓縮空氣加壓,向填充部20移動。接下來,研磨材料3藉由壓縮空氣之按壓力填充於輥30之槽。研磨材料3通過貯存部10及填充部20被壓縮空氣加壓,由此密集地填充於每個槽。接下來,輥30以由控制部9設定之速度藉由驅動部40之動力進行旋轉。接下來,填充於槽之研磨材料3藉由轉動處理(S21)中之輥30之旋轉而移動至取出部50之位置,從而形成流路。接下來,從管路供給之壓縮空氣被供給至流路。壓縮空氣於與槽之延伸方向平行之方向產生氣流。藉由壓縮空氣產生之氣流,將填充於槽之研磨材料3擠出至噴嘴單元U。Then, the blast processing step (S4) is performed. In step S4, first, compressed air is supplied to the storage unit 10 through the pressurizing duct 73. Next, by supplying compressed air to the inside of the storage section 10 to pressurize the inside of the storage section 10, the valve between the storage section 10 and the classification section 602 is closed. Thereby, the storage part 10 is sealed. Next, the abrasive 3 is pressurized by compressed air in the storage part 10 and moves to the filling part 20. Next, the abrasive 3 is filled in the groove of the roller 30 by the pressing force of compressed air. The abrasive material 3 is pressurized by compressed air through the storage part 10 and the filling part 20, thereby densely filling each groove. Next, the roller 30 is rotated by the power of the driving unit 40 at a speed set by the control unit 9. Next, the abrasive 3 filled in the groove is moved to the position of the take-out part 50 by the rotation of the roller 30 in the rotation process (S21), thereby forming a flow path. Next, the compressed air supplied from the pipeline is supplied to the flow path. The compressed air generates airflow in a direction parallel to the extending direction of the groove. The abrasive material 3 filled in the groove is extruded to the nozzle unit U by the airflow generated by the compressed air.

與壓縮空氣一起被擠出至噴嘴單元U之研磨材料3朝向噴嘴單元U之分配機構550。被供給至分配機構550之導入管551之研磨材料3於通過導入管551時被整流,而進行初始之分散。被供給至分散構件552之研磨材料3於分散室552S中呈氣溶膠狀分散。分散開之研磨材料3與壓縮空氣一起從導出管553被壓出。The abrasive material 3 extruded into the nozzle unit U together with the compressed air faces the dispensing mechanism 550 of the nozzle unit U. The abrasive 3 supplied to the introduction pipe 551 of the distribution mechanism 550 is rectified when passing through the introduction pipe 551, and is initially dispersed. The abrasive 3 supplied to the dispersion member 552 is dispersed in an aerosol state in the dispersion chamber 552S. The dispersed abrasive 3 is pressed out from the outlet pipe 553 together with the compressed air.

從導出管553被壓出之研磨材料3經由軟管供給至複數個噴嘴502。藉由將研磨材料3與壓縮空氣一起作為混合流體從複數個噴嘴502進行噴射,而對被加工物4進行噴射加工。被加工物驅動部505基於在準備步驟(S3)中設定之掃描軌跡、掃描速度、掃描次數等,使被加工物驅動部505上之被加工物4及加工台503相對於複數個噴嘴502進行相對移動。基於由控制部9設定之掃描軌跡對被加工物4進行加工。此處,複數個噴嘴502以沿著X軸方向連接之方式排列設置,因此與配置一個噴嘴之情形相比,能夠將掃描次數設定得較少。又,與配置一個噴嘴之情形、或將複數個噴嘴以沿著Y軸方向連接之方式排列設置之情形相比,能夠將進給方向之移動距離設定得較短。即,藉由減少掃描次數,並且縮短進給方向之移動距離,能夠減少研磨材料3與抗蝕劑層過度碰撞。其結果,能夠減少對抗蝕劑層之損傷。因此,能夠對從抗蝕劑層之開口部(孔)露出之被加工物4之表面有效地進行切削加工,因此能夠高精度地形成貫通孔。若抗蝕劑層之損傷較大,則會於孔貫通前導致抗蝕劑層之開口部破損。藉由利用一實施方式之噴射加工裝置1進行噴射加工,能夠形成縱橫比(貫通孔之深度h相對於抗蝕劑層之開口部之直徑d之比即h/d)為0.8以上2.0以下之貫通孔。The abrasive 3 extruded from the outlet pipe 553 is supplied to the plurality of nozzles 502 via hoses. By spraying the abrasive 3 together with compressed air as a mixed fluid from a plurality of nozzles 502, the workpiece 4 is spray-processed. The workpiece drive unit 505 makes the workpiece 4 and the processing table 503 on the workpiece drive unit 505 perform relative to the plurality of nozzles 502 based on the scan trajectory, scan speed, and number of scans set in the preparation step (S3). Relative movement. The workpiece 4 is processed based on the scan trajectory set by the control unit 9. Here, a plurality of nozzles 502 are arranged in a row so as to be connected along the X-axis direction. Therefore, the number of scans can be set to be less than when one nozzle is arranged. In addition, compared with the case where one nozzle is arranged or the case where a plurality of nozzles are arranged in a row so as to be connected along the Y-axis direction, the movement distance in the feed direction can be set to be shorter. That is, by reducing the number of scans and shortening the moving distance in the feed direction, it is possible to reduce excessive collision of the abrasive 3 with the resist layer. As a result, damage to the resist layer can be reduced. Therefore, the surface of the workpiece 4 exposed from the opening (hole) of the resist layer can be effectively cut, so that the through hole can be formed with high accuracy. If the damage of the resist layer is large, the opening of the resist layer will be damaged before the hole penetrates. By using the spray processing device 1 of one embodiment to perform spray processing, it is possible to form an aspect ratio (the ratio of the depth h of the through hole to the diameter d of the opening of the resist layer, that is, h/d) of 0.8 or more and 2.0 or less Through hole.

於一實施方式之噴射加工裝置1中,藉由使複數個噴嘴502之噴射口為圓形,並對各個配置複數個噴嘴502之間隔進行調整,能夠獲得噴射流整體上速度分佈之偏差較小且能夠進行廣泛之加工之噴射流。於將噴嘴之噴射口以形成與一實施方式之噴射加工裝置1相同之加工寬度之噴射流之方式設為矩形之情形時,噴射流之速度分佈之偏差較大。其結果,與一實施方式之噴射加工裝置1相比,於噴射流之速度分佈之偏差較大之噴射加工裝置中,需要增加掃描次數,或縮短向進給方向之移動距離。因此,一實施方式之噴射加工裝置1更能夠高精度地進行噴射加工。藉由利用一實施方式之噴射加工裝置1進行加工,能夠形成在被加工物4之表面形成之貫通孔之直徑Da相對於在抗蝕劑層形成之開口部之直徑Db之比即Da/Db為0.84以上0.94以下之孔。In the jet processing device 1 of one embodiment, by making the jet openings of the plurality of nozzles 502 circular, and adjusting the intervals between the plurality of nozzles 502, it is possible to obtain a small deviation in the velocity distribution of the jet flow as a whole And can carry out a wide range of processing jet stream. When the jet opening of the nozzle is rectangular in a manner that forms a jet with the same processing width as the jet processing device 1 of one embodiment, the velocity distribution of the jet has a large deviation. As a result, compared with the jet processing device 1 of one embodiment, in a jet processing device with a large deviation in the velocity distribution of the jet, it is necessary to increase the number of scans or shorten the movement distance in the feed direction. Therefore, the jet processing apparatus 1 of one embodiment can perform jet processing with higher accuracy. By processing with the jet processing apparatus 1 of one embodiment, the ratio of the diameter Da of the through hole formed on the surface of the workpiece 4 to the diameter Db of the opening formed in the resist layer is Da/Db It is a hole above 0.84 and below 0.94.

於設定之掃描及加工完成之情形時,停止從複數個噴嘴502噴射研磨材料3及壓縮空氣。When the set scanning and processing are completed, stop spraying the abrasive 3 and compressed air from the plurality of nozzles 502.

又,於噴射加工步驟(S4)中,亦進行集塵步驟。於集塵步驟中,集塵器702在加工室509、回收導管601、分級部602以及集塵導管701之內部,產生朝向集塵器702吸引粉粒體8及空氣之氣流。藉由集塵器702進行動作而產生之氣流,使得加工室509內產生之粉粒體8依序移動至加工室509、回收導管601、分級部602。藉由分級部602進行之分級,可再使用之研磨材料3被回收至貯存部10,不可再使用之研磨材料3及切削粉通過集塵導管701被回收至集塵器702。In addition, in the blast processing step (S4), the dust collection step is also performed. In the dust collection step, the dust collector 702 generates an air flow that sucks the powder and granular material 8 and air toward the dust collector 702 inside the processing chamber 509, the recovery duct 601, the classification part 602, and the dust collection duct 701. The air flow generated by the operation of the dust collector 702 causes the powder and granular body 8 generated in the processing chamber 509 to move to the processing chamber 509, the recovery duct 601, and the classification unit 602 in sequence. Through the classification by the classification unit 602, the reusable abrasive 3 is recovered to the storage unit 10, and the non-reusable abrasive 3 and cutting powder are recovered to the dust collector 702 through the dust collecting duct 701.

最後,進行被加工物回收步驟(S5)。於步驟S5中,被加工物4通過殼體501之觀察窗,從加工台503之面上被回收。Finally, the process of recovering the processed material (S5) is performed. In step S5, the processed object 4 passes through the observation window of the housing 501 and is recovered from the surface of the processing table 503.

以上,對本發明之實施方式進行了說明,但本發明並不限定於上述實施方式。能夠於不變更發明主旨之範圍內進行適當變更。又,上述實施方式能夠於不矛盾之範圍內進行組合。The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments. Appropriate changes can be made within the scope of not changing the spirit of the invention. In addition, the above-mentioned embodiments can be combined within a range that does not contradict each other.

(實施方式之效果) 以上,根據本實施方式之噴射加工裝置1,藉由將複數個噴嘴502以沿著掃描軌跡中之進給方向連接之方式排列設置,能夠獲得廣泛之噴射區域。藉由具有分配機構550,能夠對複數個噴嘴502均勻地供給研磨材料3,因此所有之複數個噴嘴502能夠具有相同之加工能力。其結果,於與被加工物4碰撞之區域,能夠獲得速度分佈較小之噴射流(即,加工能力之偏差較小之噴射區域)。(Effects of implementation) As described above, according to the jet processing apparatus 1 of the present embodiment, by arranging a plurality of nozzles 502 in a row in a manner connected along the feed direction in the scanning track, a wide jet area can be obtained. With the distribution mechanism 550, the abrasive material 3 can be uniformly supplied to the plurality of nozzles 502, so all the plurality of nozzles 502 can have the same processing capability. As a result, it is possible to obtain a jet stream with a small velocity distribution in the area where it collides with the workpiece 4 (that is, a jet area with a small deviation in processing ability).

由於噴射加工裝置1具備複數個噴嘴502,因此能夠縮短對被加工物4噴射研磨材料3之時間。因此,能夠兼得縮短加工時間與減輕對被加工物4之損傷。又,由於具備能夠將從單一之貯存部10供給來之研磨材料3均勻地分配給複數個噴嘴502之分配機構550,因此整體之加工精度提高。Since the jet processing apparatus 1 includes a plurality of nozzles 502, the time for jetting the abrasive 3 to the workpiece 4 can be shortened. Therefore, it is possible to reduce the processing time and the damage to the workpiece 4 at the same time. In addition, since the distribution mechanism 550 that can uniformly distribute the abrasive 3 supplied from the single storage portion 10 to the plurality of nozzles 502 is provided, the overall processing accuracy is improved.

分配機構550構成為依序連結於導入管551、分散構件552、導出管553,由此能夠以簡單之構造對所有噴嘴賦予大致相同之加工能力。藉由使分散構件552之分散室552S之頂面552A為圓形,將導出管以包圍頂面552A之中央之方式配置為圓環狀,能夠將在分散室552S被分散成均勻濃度之氣溶膠狀態之研磨材料3供給至所有之複數個噴嘴502。分散室552S藉由使高度為頂面552A之直徑之1/5以上1/2以下,能夠獲得優異之分散效果。又,藉由將在導入管551中與分散室552S連結之直線部551S設為管長為內徑之5倍以上之圓管,能夠將研磨材料3以初始分散之狀態導入分散構件552。The distribution mechanism 550 is configured to be sequentially connected to the introduction pipe 551, the dispersing member 552, and the outlet pipe 553, so that it is possible to provide substantially the same processing capability to all nozzles with a simple structure. By making the top surface 552A of the dispersing chamber 552S of the dispersing member 552 circular, and the outlet pipe is arranged in a circular ring to surround the center of the top surface 552A, the aerosol of uniform concentration can be dispersed in the dispersing chamber 552S The abrasive 3 in the state is supplied to all the plural nozzles 502. The dispersion chamber 552S can obtain an excellent dispersion effect by setting the height to be 1/5 or more and 1/2 or less of the diameter of the top surface 552A. In addition, by setting the straight portion 551S connected to the dispersion chamber 552S in the introduction pipe 551 as a round pipe whose pipe length is 5 times or more of the inner diameter, the abrasive 3 can be introduced into the dispersion member 552 in an initially dispersed state.

由於能夠獲得速度分佈較小之噴射流,故能夠減少使被加工物4相對於複數個噴嘴502相對移動而描繪掃描軌跡之次數,或者能夠延長向進給方向之移動距離(不包含0且為複數個噴嘴502之噴射口之直徑以下)。其結果,能夠減少研磨材料3與被加工物4過度碰撞,因此能夠減少對被加工物4造成之損傷。Since a jet stream with a small velocity distribution can be obtained, it is possible to reduce the number of times the workpiece 4 is moved relative to the plurality of nozzles 502 to draw a scanning path, or it is possible to extend the moving distance in the feed direction (not including 0 and being The diameter of the jet port of the plurality of nozzles 502 is less than or equal to). As a result, it is possible to reduce excessive collision between the abrasive 3 and the workpiece 4, and therefore it is possible to reduce damage to the workpiece 4.

藉由採用對貯存部10進行加壓而經由供給部2將研磨材料3擠出至朝向分配機構550之導入管551之構成,能夠降低壓縮空氣之壓力損失。其結果,能夠提高加工能力,由此能夠減少使被加工物4相對於噴嘴相對移動而描繪掃描軌跡之次數。又,由於研磨材料3之加工能力較高,故能夠縮短使研磨材料3與被加工物4接觸之時間,因此能夠兼得縮短加工時間與減輕對被加工物4之損傷。By adopting a configuration in which the storage portion 10 is pressurized to extrude the abrasive 3 through the supply portion 2 to the introduction pipe 551 toward the distribution mechanism 550, the pressure loss of the compressed air can be reduced. As a result, it is possible to improve the processing capability, and thereby it is possible to reduce the number of times the workpiece 4 is moved relative to the nozzle to draw a scanning trajectory. In addition, since the processing ability of the abrasive 3 is high, the time for bringing the abrasive 3 into contact with the workpiece 4 can be shortened. Therefore, it is possible to shorten the processing time and reduce the damage to the workpiece 4 at the same time.

複數個噴嘴502以沿著X軸方向連接之方式排列設置。藉由如此配置複數個噴嘴502,能夠兼得縮短加工時間與減輕對被加工物4之損傷。A plurality of nozzles 502 are arranged side by side in a manner of being connected along the X-axis direction. By arranging a plurality of nozzles 502 in this way, it is possible to reduce the processing time and the damage to the workpiece 4 at the same time.

噴射加工裝置1能夠兼得縮短加工時間與減輕對被加工物4之損傷。於進行孔加工、槽加工之情形時,在被加工物4設置有抗蝕劑層,但噴射加工裝置1能夠減輕對該抗蝕劑層之損傷。例如,於對作為被加工物4之一例之印刷基板材料進行使通孔、導通孔等貫通孔開口之噴射加工之情形時,能夠減輕對抗蝕劑層之損傷,由此能夠進行高精度之噴射加工。即,藉由利用本實施方式之噴射加工裝置1進行噴射加工,即使於形成有開口部為

Figure 02_image003
25 μm以上
Figure 02_image003
80 μm以下般極小徑之抗蝕劑圖案之情形時,若縱橫比(h/d)為0.8以上2.0以下,則亦能夠以通常之噴射加工中難以實現之精度進行加工。又,若形成於被加工物4之貫通孔之直徑Da相對於形成於抗蝕劑層之開口部之直徑Db之比即Da/Db為0.84以上0.94以下,則能夠以通常之噴射加工中難以實現之精度進行加工。The jet processing device 1 can both shorten the processing time and reduce the damage to the workpiece 4. In the case of hole processing and groove processing, a resist layer is provided on the workpiece 4, but the spray processing apparatus 1 can reduce damage to the resist layer. For example, when the printed circuit board material, which is an example of the workpiece 4, is sprayed to open through holes such as through-holes and vias, damage to the resist layer can be reduced, thereby enabling high-precision spraying. Processing. That is, by performing blast processing using the blast processing apparatus 1 of this embodiment, even when the opening is formed, it is
Figure 02_image003
25 μm or more
Figure 02_image003
In the case of a resist pattern with an extremely small diameter of 80 μm or less, if the aspect ratio (h/d) is 0.8 or more and 2.0 or less, it can be processed with a precision that is difficult to achieve in normal blast processing. In addition, if the ratio of the diameter Da of the through hole formed in the workpiece 4 to the diameter Db of the opening formed in the resist layer, that is, Da/Db is 0.84 or more and 0.94 or less, it can be difficult to perform in normal jet processing. The precision achieved is processed.

根據本實施方式之噴射加工裝置1及噴射加工方法,能夠藉由僅從一側噴射研磨材料3來進行如上所述之高精度之加工。又,能夠改善空間之垂直性。特別適用於形成用於形成作為微細孔之導通孔或通孔之孔。According to the jet processing apparatus 1 and the jet processing method of this embodiment, it is possible to perform high-precision processing as described above by jetting the abrasive 3 from only one side. In addition, the verticality of the space can be improved. It is particularly suitable for forming holes for forming via holes or through holes as fine holes.

(變化例) 實施方式中之分散構件552不僅可為圓柱形狀,亦可為圓錐形狀、圓錐台形狀。由於該等形狀係從導入部朝向底面連續地擴徑之形狀,因此,能夠使研磨材料3以成為更均勻之濃度之氣溶膠之方式進行分散。(Variation example) The dispersing member 552 in the embodiment can be not only a cylindrical shape, but also a conical shape or a truncated cone shape. Since these shapes are shapes whose diameters are continuously expanded from the introduction part toward the bottom surface, the abrasive 3 can be dispersed in a more uniform concentration aerosol.

1:噴射加工裝置 2:供給部 3:研磨材料 4:被加工物 5:加工部 6:篩選部 7:集塵部 8:粉粒體 9:控制部 10:貯存部 20:填充部 30:輥 40:驅動部 50:取出部 73:加壓用導管 501:殼體 502:噴嘴 503:加工台 504:噴嘴驅動部 505:被加工物驅動部 509:加工室 550:分配機構 551:導入管 551S:直線部 552:分散構件 552A:頂面 553:導出管 601:回收導管 602:分級部 701:集塵導管 702:集塵器 M:移動部 U:噴嘴單元1: Jet processing device 2: Supply Department 3: Abrasive materials 4: processed objects 5: Processing Department 6: Screening Department 7: Dust collection department 8: Powder and granule 9: Control Department 10: Storage Department 20: Filling part 30: Roll 40: Drive 50: Take out part 73: Compression catheter 501: Shell 502: Nozzle 503: processing table 504: Nozzle Drive 505: Workpiece drive unit 509: Processing Room 550: distribution agency 551: introduction tube 551S: straight part 552: Dispersion Component 552A: Top surface 553: export tube 601: Recovery Conduit 602: Classification Department 701: Dust Collection Conduit 702: Dust Collector M: Mobile Department U: Nozzle unit

圖1係表示實施方式之噴射加工裝置之整體剖視圖。 圖2係表示分配機構之立體圖。 圖3係圖2之分配裝置之透視剖視圖。 圖4係表示噴嘴之配置狀態之模式圖。 圖5係表示利用移動部使噴嘴與被加工物相對移動而產生之掃描軌跡之模式圖。 圖6係噴射加工處理之流程圖。FIG. 1 is an overall cross-sectional view showing the jet processing apparatus of the embodiment. Fig. 2 is a perspective view showing the distribution mechanism. Figure 3 is a perspective cross-sectional view of the dispensing device of Figure 2; Fig. 4 is a schematic diagram showing the disposition state of the nozzles. Fig. 5 is a schematic diagram showing a scanning trajectory generated by the relative movement of the nozzle and the workpiece by the moving part. Figure 6 is a flow chart of the blasting process.

1:噴射加工裝置 1: Jet processing device

2:供給部 2: Supply Department

3:研磨材料 3: Abrasive materials

5:加工部 5: Processing Department

6:篩選部 6: Screening Department

7:集塵部 7: Dust collection department

8:粉粒體 8: Powder and granule

9:控制部 9: Control Department

10:貯存部 10: Storage Department

20:填充部 20: Filling part

30:輥 30: Roll

40:驅動部 40: Drive

73:加壓用導管 73: Compression catheter

501:殼體 501: Shell

502:噴嘴 502: Nozzle

503:加工台 503: processing table

504:噴嘴驅動部 504: Nozzle Drive

505:被加工物驅動部 505: Workpiece drive unit

509:加工室 509: Processing Room

550:分配機構 550: distribution agency

551:導入管 551: introduction tube

551S:直線部 551S: straight part

552:分散構件 552: Dispersion Component

553:導出管 553: export tube

601:回收導管 601: Recovery Conduit

602:分級部 602: Classification Department

701:集塵導管 701: Dust Collection Conduit

702:集塵器 702: Dust Collector

M:移動部 M: Mobile Department

Claims (9)

一種噴射加工裝置,其具備: 噴嘴單元,其具有將研磨材料與壓縮空氣一起向被加工物之表面噴射之複數個噴嘴、及將上述研磨材料分配給上述複數個噴嘴之分配機構; 貯存部,其內部貯存上述研磨材料; 供給部,其將貯存於上述貯存部之上述研磨材料供給至上述噴嘴單元;以及 移動部,其使上述複數個噴嘴及上述被加工物中之至少一者移動,而變更上述複數個噴嘴與上述被加工物之相對位置。A jet processing device, which is provided with: A nozzle unit, which has a plurality of nozzles for spraying abrasive materials and compressed air onto the surface of the workpiece, and a distribution mechanism for distributing the abrasive materials to the plurality of nozzles; The storage part stores the above-mentioned abrasive materials inside; A supply part that supplies the abrasive material stored in the storage part to the nozzle unit; and A moving part that moves at least one of the plurality of nozzles and the workpiece to change the relative position of the plurality of nozzles and the workpiece. 如請求項1之噴射加工裝置,其中上述分配機構包含: 分散構件,其內部劃分出將上述研磨材料呈氣溶膠狀分散之分散室; 導入管,其將上述供給部與上述分散室連結,而將上述供給部之上述研磨材料供給至上述分散室;以及 導出管,其將上述複數個噴嘴與上述分散室連結,而將上述分散室之氣溶膠狀之研磨材料供給至上述複數個噴嘴。Such as the jet processing device of claim 1, wherein the above-mentioned distribution mechanism includes: A dispersing member, the inside of which is divided into a dispersing chamber for dispersing the above-mentioned abrasive material in aerosol form; An introduction pipe that connects the supply part and the dispersion chamber, and supplies the abrasive material of the supply part to the dispersion chamber; and An outlet pipe connects the plurality of nozzles with the dispersion chamber, and supplies the aerosol-like abrasive in the dispersion chamber to the plurality of nozzles. 如請求項2之噴射加工裝置,其中於上述分散構件設置有與上述導入管連通之導入口及與上述導出管連通之導出口, 與上述導入口對向之上述分散室之頂面為圓形, 上述導出口以包圍上述頂面之中央之方式配置為圓環狀。The jet processing device of claim 2, wherein the dispersing member is provided with an inlet communicating with the inlet pipe and an outlet communicating with the outlet pipe, The top surface of the dispersion chamber opposite to the inlet is circular, The lead-out port is arranged in an annular shape so as to surround the center of the top surface. 如請求項3之噴射加工裝置,其中與上述頂面正交之方向之上述頂面與上述導入口之間的距離為上述頂面之直徑之1/5以上1/2以下。The jet processing device of claim 3, wherein the distance between the top surface in a direction orthogonal to the top surface and the introduction port is 1/5 or more and 1/2 or less of the diameter of the top surface. 如請求項2至4中任一項之噴射加工裝置,其中上述導入管係包含與上述分散構件連結之直線部之圓管, 上述直線部之長度為上述直線部中之上述導入管之內徑之5倍以上。The jet processing device according to any one of claims 2 to 4, wherein the introduction pipe system includes a round pipe with a straight portion connected to the dispersion member, The length of the straight portion is more than 5 times the inner diameter of the introduction tube in the straight portion. 如請求項1至5中任一項之噴射加工裝置,其進而具備控制上述移動部之動作之控制部, 上述控制部以交替實施第1掃描與第2掃描之方式控制上述移動部, 於上述第1掃描中,使上述複數個噴嘴及上述被加工物中之至少一者沿著與上述被加工物之表面平行之第1方向移動, 於上述第2掃描中,使上述複數個噴嘴及上述被加工物中之至少一者沿著與上述第1方向正交且與上述被加工物之表面平行之第2方向移動, 上述第2掃描中之移動距離為設置於上述複數個噴嘴之噴射口之直徑以下, 上述複數個噴嘴以於上述第2方向連接之方式排列設置。Such as the jet processing device of any one of claims 1 to 5, which further includes a control unit that controls the operation of the above-mentioned moving unit, The control unit controls the moving unit to alternately perform the first scan and the second scan, In the first scan, at least one of the plurality of nozzles and the workpiece is moved in a first direction parallel to the surface of the workpiece, In the second scan, at least one of the plurality of nozzles and the workpiece is moved in a second direction orthogonal to the first direction and parallel to the surface of the workpiece, The movement distance in the second scan is less than the diameter of the ejection openings of the plurality of nozzles, The plurality of nozzles are arranged side by side so as to be connected in the second direction. 如請求項1至6中任一項之噴射加工裝置,其進而具備加壓用導管,該加壓用導管向上述貯存部供給壓縮空氣,對上述貯存部之內部進行加壓,而將上述研磨材料向上述噴嘴單元擠出。The jet processing apparatus according to any one of claims 1 to 6, further provided with a pressurizing conduit that supplies compressed air to the storage portion, pressurizes the inside of the storage portion, and polishes the The material is extruded to the nozzle unit described above. 一種噴射加工方法,其係如請求項1至7中任一項之噴射加工裝置之噴射加工方法,具備如下步驟: 準備作為上述被加工物之印刷基板材料; 於上述印刷基板材料之一面形成設置有
Figure 03_image003
25 μm以上
Figure 03_image003
80 μm以下之開口之抗蝕劑層;以及 向包含上述抗蝕劑層之上述印刷基板材料之上述一面噴射上述研磨材料,經由上述抗蝕劑層之開口於上述印刷基板材料形成貫通孔; 上述貫通孔之深度h相對於上述抗蝕劑層之開口之直徑d之比h/d為0.8以上2.0以下。
A jet processing method, which is the jet processing method of the jet processing device according to any one of claims 1 to 7, comprising the following steps: preparing a printed board material as the object to be processed; forming and setting on one surface of the printed board material Have
Figure 03_image003
25 μm or more
Figure 03_image003
A resist layer with an opening of 80 μm or less; and the above-mentioned abrasive material is sprayed onto the one surface of the above-mentioned printed circuit board material containing the above-mentioned resist layer, and a through hole is formed in the above-mentioned printed circuit board material through the opening of the resist layer; The ratio h/d of the depth h of the through hole to the diameter d of the opening of the resist layer is 0.8 or more and 2.0 or less.
如請求項8之噴射加工方法,其中上述貫通孔之直徑Da相對於上述抗蝕劑層之開口之直徑Db之比Da/Db為0.84以上0.94以下。The jet processing method of claim 8, wherein the ratio Da/Db of the diameter Da of the through hole to the diameter Db of the opening of the resist layer is 0.84 or more and 0.94 or less.
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