TW202134006A - Jet machining device and jet machining method which can shorten the processing time - Google Patents
Jet machining device and jet machining method which can shorten the processing time Download PDFInfo
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- TW202134006A TW202134006A TW110101413A TW110101413A TW202134006A TW 202134006 A TW202134006 A TW 202134006A TW 110101413 A TW110101413 A TW 110101413A TW 110101413 A TW110101413 A TW 110101413A TW 202134006 A TW202134006 A TW 202134006A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
- B24C7/0046—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a gaseous carrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C5/00—Devices or accessories for generating abrasive blasts
- B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
- B24C5/04—Nozzles therefor
Abstract
Description
本發明係關於一種噴射加工裝置及噴射加工方法。The invention relates to a spray processing device and a spray processing method.
公知有一種噴射加工方法,其藉由將研磨材料與壓縮空氣一起從噴嘴噴射,而於被加工物形成孔、槽之類的較深空間。於此種噴射加工方法中,將形成有遮罩圖案之乾膜形成於被加工物上,從噴嘴噴射研磨材料,而將從乾膜露出之區域從被加工物除去,由此於被加工物形成空間。There is known a jet processing method in which an abrasive is jetted from a nozzle together with compressed air to form a deep space such as a hole and a groove in the workpiece. In this jet processing method, a dry film with a mask pattern is formed on the workpiece, the abrasive material is jetted from a nozzle, and the area exposed from the dry film is removed from the workpiece. Form space.
於噴射加工方法中,特別是在將印刷基板作為被加工物之情形等進行非常微細之加工之情形時,對空間要求加工精度。作為用於形成具有加工精度之空間之技術,公知有專利文獻1所記載之噴射加工方法,即形成導通孔(空間)之多列式基板之製造方法。於專利文獻1中,揭示了將形成有遮罩圖案之乾膜黏貼於被加工物之正背兩面,並從被加工物之正背兩面進行噴射加工之噴射加工方法。 先前技術文獻 專利文獻In the jet processing method, particularly when a printed circuit board is used as a workpiece, etc., when very fine processing is performed, the processing accuracy is required for the space. As a technique for forming a space with processing precision, the jet processing method described in Patent Document 1, that is, a method of manufacturing a multi-line substrate with via holes (spaces) is known. Patent Document 1 discloses a spray processing method in which a dry film formed with a mask pattern is adhered to the front and back sides of the workpiece, and spray processing is performed from the front and back sides of the workpiece. Prior art literature Patent literature
專利文獻1:日本專利6296407號公報Patent Document 1: Japanese Patent No. 6296407
[發明所欲解決之問題][The problem to be solved by the invention]
於專利文獻1所記載之噴射加工中,需要以遮罩圖案一致之方式將乾膜高精度地黏貼於正背兩面,進而於加工之中途使被加工物翻轉,因此存在加工時間變長之擔憂。In the jet processing described in Patent Document 1, the dry film needs to be adhered to both the front and back with high precision in a way that the mask pattern is consistent, and the workpiece is turned over during processing. Therefore, there is a concern that the processing time will be longer. .
鑒於以上,要求提供一種能夠縮短加工時間之噴射加工裝置及噴射加工方法。 [解決問題之技術手段]In view of the above, it is required to provide a spray processing device and a spray processing method that can shorten the processing time. [Technical means to solve the problem]
本發明之一方面係一種噴射加工裝置。噴射加工裝置具備噴嘴單元、貯存部、供給部以及移動部。噴嘴單元具有複數個噴嘴以及分配機構。複數個噴嘴將研磨材料與壓縮空氣一起向被加工物之表面噴射。分配機構將研磨材料分配給複數個噴嘴。貯存部之內部貯存研磨材料。供給部將貯存於貯存部之研磨材料供給至噴嘴單元。移動部使複數個噴嘴及被加工物中之至少一者移動,而變更複數個噴嘴與被加工物之相對位置。One aspect of the present invention is a jet processing device. The jet processing device includes a nozzle unit, a storage unit, a supply unit, and a moving unit. The nozzle unit has a plurality of nozzles and a distribution mechanism. A plurality of nozzles spray abrasive materials and compressed air onto the surface of the workpiece. The distribution mechanism distributes the abrasive material to a plurality of nozzles. Abrasive materials are stored in the storage part. The supply part supplies the abrasive material stored in the storage part to the nozzle unit. The moving part moves at least one of the plurality of nozzles and the workpiece, and changes the relative positions of the plurality of nozzles and the workpiece.
於該噴射加工裝置中,研磨材料被分配機構分配給複數個噴嘴。從複數個噴嘴之每一個向被加工物之表面噴射研磨材料。由於複數個噴嘴並行地向被加工物之表面噴射研磨材料,故與不具備複數個噴嘴之噴射加工裝置相比,該噴射加工裝置能夠縮短加工時間。In this jet processing device, the abrasive material is distributed to a plurality of nozzles by a distribution mechanism. The abrasive material is sprayed from each of the plurality of nozzles to the surface of the workpiece. Since a plurality of nozzles spray abrasives on the surface of the workpiece in parallel, the spray processing device can shorten the processing time compared to a spray processing device that does not have a plurality of nozzles.
於本發明之一實施方式中,分配機構可具有分散構件、導入管以及導出管。分散構件可於內部劃分出將研磨材料呈氣溶膠狀分散之分散室。導入管可將供給部與分散室連結,而將供給部之研磨材料供給至分散室。導出管可將複數個噴嘴與分散室連結,而將分散室之氣溶膠狀之研磨材料供給至複數個噴嘴。該噴射加工裝置由於在分散室中將研磨材料呈氣溶膠狀分散,故能夠向複數個噴嘴均勻地供給研磨材料。In one embodiment of the present invention, the distribution mechanism may have a dispersing member, an introduction pipe, and an output pipe. The dispersing member can divide the dispersing chamber inside to disperse the abrasive material in aerosol form. The introduction pipe can connect the supply part and the dispersion chamber, and supply the abrasive material of the supply part to the dispersion chamber. The outlet pipe can connect a plurality of nozzles with the dispersion chamber, and supply the aerosol-like abrasive material in the dispersion chamber to the plurality of nozzles. Since this jet processing apparatus disperses the abrasive in an aerosol form in the dispersion chamber, it can uniformly supply the abrasive to a plurality of nozzles.
於本發明之一實施方式中,可於分散構件設置有與導入管連通之導入口和與導出管連通之導出口。與導入口對向之分散室之頂面為圓形,導出口可以包圍頂面之中央之方式配置為圓環狀。該噴射加工裝置能夠從頂面之中央朝向配置為圓環狀之導出口均勻地分散氣溶膠狀之研磨材料。In one embodiment of the present invention, the dispersing member may be provided with an inlet communicating with the inlet pipe and an outlet communicating with the outlet pipe. The top surface of the dispersion chamber opposite to the inlet is circular, and the outlet can be arranged in a circular ring shape so as to surround the center of the top surface. The jet processing device can uniformly disperse the aerosol-like abrasive material from the center of the top surface toward the outlet port arranged in an annular shape.
於本發明之一實施方式中,與頂面正交之方向上的頂面與導入口之間的距離可為頂面之直徑之1/5以上1/2以下。該噴射加工裝置藉由將分散室之高度即頂面與導入口之間的距離設定於規定範圍內,能夠抑制分散室內之氣溶膠狀之研磨材料之偏差(即,被導出之研磨材料之量在每個導出口之偏差)。In one embodiment of the present invention, the distance between the top surface in the direction orthogonal to the top surface and the introduction port may be 1/5 or more and 1/2 or less of the diameter of the top surface. By setting the height of the dispersion chamber, that is, the distance between the top surface and the introduction port, within the specified range, the jet processing device can suppress the deviation of the aerosol-like abrasive in the dispersion chamber (that is, the amount of abrasive being led out) Deviation at each outlet).
於本發明之一實施方式中,導入管可為包含與分散構件連結之直線部之圓管。直線部之長度可為直線部中之導入管之內徑之5倍以上。該噴射加工裝置於導入管之直線部對由壓縮空氣形成之研磨材料之流動進行整流,因此能夠促進氣溶膠狀之研磨材料之均勻之分散。In one embodiment of the present invention, the introduction tube may be a round tube including a straight part connected with the dispersion member. The length of the straight part can be more than 5 times the inner diameter of the introduction tube in the straight part. The jet processing device rectifies the flow of the abrasive material formed by compressed air at the straight part of the inlet pipe, so it can promote the uniform dispersion of the aerosol-like abrasive material.
於本發明之一實施方式中,噴射加工裝置可進而具備控制移動部之動作之控制部。控制部可以交替實施第1掃描與第2掃描之方式控制移動部。於第1掃描中,控制部可使複數個噴嘴及被加工物中之至少一者沿著與被加工物之表面平行之第1方向移動。於第2掃描中,控制部可使複數個噴嘴及被加工物中之至少一者沿著與第1方向正交且與被加工物之表面平行之第2方向移動。第2掃描中之移動距離可為設置於複數個噴嘴之噴射口之直徑以下。複數個噴嘴可以於第2方向連接之方式排列設置。藉由如此配置複數個噴嘴,被加工物之表面被噴射研磨材料之位置不會重疊,因此該噴射加工裝置能夠對被加工物之整個表面高效地進行噴射加工。In one embodiment of the present invention, the jet processing device may further include a control unit that controls the operation of the moving unit. The control unit can control the moving unit by alternately performing the first scan and the second scan. In the first scan, the control unit can move at least one of the plurality of nozzles and the workpiece along the first direction parallel to the surface of the workpiece. In the second scan, the control unit can move at least one of the plurality of nozzles and the workpiece along the second direction orthogonal to the first direction and parallel to the surface of the workpiece. The movement distance in the second scan can be less than the diameter of the ejection openings provided in the plurality of nozzles. Multiple nozzles can be arranged in a manner of connecting in the second direction. By arranging a plurality of nozzles in this way, the position where the abrasive material is sprayed on the surface of the workpiece does not overlap, so the spray processing device can efficiently perform spray processing on the entire surface of the workpiece.
於本發明之一實施方式中,噴射加工裝置可進而具備加壓用導管。加壓用導管可向貯存部供給壓縮空氣,對貯存部之內部進行加壓,而將研磨材料向供給部擠出。該噴射加工裝置藉由利用加壓用導管以加壓之方式將研磨材料從貯存部擠出,能夠抑制與研磨材料一起被噴射之壓縮空氣之壓力損失,從而能夠提高噴射加工之加工能力。In one embodiment of the present invention, the jet processing apparatus may further include a pressurizing catheter. The pressurizing duct can supply compressed air to the storage part, pressurize the inside of the storage part, and squeeze the abrasive material to the supply part. The jet processing device uses a pressure pipe to pressurize the abrasive material from the storage part, and can suppress the pressure loss of the compressed air injected together with the abrasive material, thereby improving the processing capability of the jet processing.
本發明之另一方面之噴射加工方法具備以下之(1)~(3)之步驟。 (1)準備作為被加工物之印刷基板材料之步驟。 (2)於印刷基板材料之一個面形成設置有25 μm以上80 μm以下之開口之抗蝕劑層之步驟。 (3)向包含抗蝕劑層之印刷基板材料之一個面噴射研磨材料,經由抗蝕劑層之開口於印刷基板材料形成貫通孔之深度h相對於抗蝕劑層之開口之直徑d之比h/d為0.8以上2.0以下之貫通孔之步驟。In another aspect of the present invention, the jet processing method includes the following steps (1) to (3). (1) The step of preparing the printed circuit board material as the object to be processed. (2) Formed and arranged on one surface of the printed circuit board material 25 μm or more Step of resist layer with openings below 80 μm. (3) The ratio of the polishing material to one surface of the printed circuit board material containing the resist layer, and the depth h of the through hole formed in the printed circuit board material through the opening of the resist layer to the diameter d of the opening of the resist layer h/d is the step of through-holes whose h/d is 0.8 or more and 2.0 or less.
該噴射加工方法藉由將抗蝕劑層之開口設定於上述範圍內,能夠形成具有較高之縱橫比(h/d)之貫通孔。By setting the opening of the resist layer within the above-mentioned range, the spray processing method can form a through hole with a high aspect ratio (h/d).
於本發明之一實施方式中,貫通孔之直徑Da相對於抗蝕劑層之開口之直徑Db之比Da/Db亦可為0.84以上0.94以下。 [發明之效果]In one embodiment of the present invention, the ratio Da/Db of the diameter Da of the through hole to the diameter Db of the opening of the resist layer may be 0.84 or more and 0.94 or less. [Effects of Invention]
本發明之技術可提供一種能夠縮短加工時間之噴射加工裝置及噴射加工方法。The technology of the present invention can provide a spray processing device and a spray processing method capable of shortening the processing time.
以下,參照圖式,對本發明之實施方式進行說明。再者,於以下之說明中,對相同或相當要素標註相同符號,省略重複之說明。圖式之尺寸比率不一定與說明之尺寸比率一致。「上」「下」「左」「右」之詞語只要沒有特別說明,則表示圖示之狀態,便於進行說明。X軸方向、Y軸方向以及Z軸方向係三維空間之正交座標系中之相互正交之軸向。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the following description, the same or equivalent elements are denoted with the same reference numerals, and repeated descriptions are omitted. The size ratio of the drawing is not necessarily consistent with the size ratio of the description. As long as the words "up", "down", "left" and "right" are not specified, they indicate the state of the icon for ease of description. The X-axis direction, the Y-axis direction, and the Z-axis direction are the axial directions orthogonal to each other in the orthogonal coordinate system of the three-dimensional space.
(噴射加工裝置)
圖1係表示實施方式之噴射加工裝置之整體剖視圖。噴射加工裝置1係噴射由供給部2供給之定量之研磨材料3之裝置。噴射加工裝置1藉由將研磨材料3向被加工物4之表面噴射,而進行作為切斷、槽加工、開孔加工等切削加工方法之一之噴射加工。研磨材料3例如係氧化鋁粉末、生鐵磨料、鑄模磨料等。被加工物4例如可列舉陶瓷材料、玻璃材料等硬脆材料、CFRP(Carbon Fiber Reinforced Plastics:碳纖維增強塑膠)材料等難切削材料,或者印刷基板材料等。印刷基板材料係於絕緣材料或者玻璃環氧基板形成有導電性薄膜之基材。(Jet processing device)
FIG. 1 is an overall cross-sectional view showing the jet processing apparatus of the embodiment. The jet processing device 1 is a device that jets a fixed amount of abrasive 3 supplied by the
噴射加工裝置1具備供給部2、加工部5、篩選部6、集塵部7以及控制部9。噴射加工裝置1將經由供給部2供給來之研磨材料3於加工部5與壓縮空氣一起作為氣固兩相流朝向被加工物4之表面噴射,而進行噴射加工。噴射加工裝置1於加工部5對被噴射之研磨材料3進行回收並再使用。當於加工部5對被加工物4進行噴射加工時,會產生包含使用過之研磨材料3之粉粒體8。粉粒體8例如包含可再使用之研磨材料3、因破碎、磨損而成為不可再使用之尺寸之研磨材料3及被加工物4之切削粉。噴射加工裝置1將粉粒體8從加工部5移送至篩選部6。噴射加工裝置1將粉粒體8中之可再使用之研磨材料3從篩選部6移送至供給部2,並進行噴射。噴射加工裝置1將不可再使用之研磨材料3及切削粉從篩選部6輸送至集塵部7,進行收集。The jet processing device 1 includes a
(供給部)
圖1所示之供給部2具備貯存部10、填充部20、輥30、驅動部40以及取出部50。貯存部10於內部貯存研磨材料3。於貯存部10連結有供給壓縮空氣之加壓用導管73,從而貯存部10之內部被壓縮空氣加壓。(Supply Department)
The
填充部20連結於貯存部10之下方。於填充部20之下方連結有收容輥30、驅動部40以及取出部50之一部分之框體。輥30為圓柱形狀,於作為圓形之兩側面之中心連接有旋轉軸(未圖示)。又,於輥30之表面沿與旋轉軸平行之方向等間隔地形成有複數條槽。驅動部40係用於使輥30以旋轉軸為軸心進行旋轉之機構。取出部50係以覆蓋輥30之槽之一部分之方式形成之壓縮空氣之流路。於取出部50連結有供給壓縮空氣之管路(未圖示)。The filling
貯存於貯存部10之研磨材料3被移送至填充部20。然後,研磨材料3被壓縮空氣產生之按壓力填充於輥30之槽。輥30藉由驅動部40之動作而旋轉,因此對所有槽連續地填充研磨材料3。藉由輥30之旋轉而從填充部20到達取出部50之研磨材料3被壓縮空氣從槽擠出至噴嘴單元U。之後,研磨材料3經由噴嘴單元U被供給至噴嘴502。The abrasive 3 stored in the
(加工部)
加工部5對被加工物4進行噴射加工。加工部5具有殼體501、噴嘴單元U、加工台503以及移動部M。於殼體501之內部劃分有加工室509。(Processing Department)
The
噴嘴單元U具有分配機構550與複數個噴嘴502。複數個噴嘴502例如配置於加工室509內之上部。複數個噴嘴502沿著與被加工物4之表面正交之Z軸延伸,各個噴射口與被加工物4之表面對向。複數個噴嘴502將研磨材料3與壓縮空氣一起向被加工物4之表面噴射。複數個噴嘴502將研磨材料3作為與壓縮空氣之混合流體(氣固兩相流)從各個噴射口噴射。複數個噴嘴502各自之噴射口為圓形。複數個噴嘴502沿著X軸排列設置(參照圖4)。再者,X軸之負方向係後述之進給方向。The nozzle unit U has a
如圖2及圖3所示,分配機構550具有導入管551、分散構件552以及複數根導出管553。於分散構件552之內部劃分有分散室552S。導入管551之一端與供給部2連結,另一端與分散室552S連結。於分散構件552設置有與導入管551連通之導入口551H。複數根導出管553之個數與複數個噴嘴502之個數相同。複數根導出管553各自之一端與複數個噴嘴502中之一個連結,另一端與分散室552S連結。於分散構件552,與複數根導出管553分別對應地設置有導出口553H。As shown in FIGS. 2 and 3, the
研磨材料3被壓縮空氣之氣流從取出部50擠出至噴嘴單元U之導入管551。包含被擠出至導入管551之研磨材料3之氣流通過導入管551被供給至分散室552S。導入管551亦可包含與分散室552S連結之直線部551S。藉由將直線部551S設為規定長度之直線狀之圓管,包含研磨材料3之氣流於被供給至分散室552S前被整流。即,於包含研磨材料3之氣流中,能夠促進研磨材料3之分散。例如,亦可將直線部551S之沿著鉛垂方向(Z軸方向)之管長設為直線部551S中之導入管551之內徑之5倍以上,較佳為10倍以上。藉由適當地設定直線部551S之長度,能夠使研磨材料3高效地分散。The
分散室552S將從導入管551供給來之研磨材料3均勻地分散。分散室552S將研磨材料3呈氣溶膠狀分散。分散室552S之與導入口551H對向之頂面552A為圓形。此處,因導入口551H與頂面552A之間之距離(高度H),氣溶膠之濃度之均勻性受損,或者於複數個噴嘴502中噴射研磨材料3時之壓力受損。為了保持氣溶膠之濃度之均勻性,且不對複數個噴嘴502之噴射研磨材料3之噴射壓力造成影響,亦可將高度H設定為頂面之直徑D1之1/5以上1/2以下。The
複數個導出口553H以包圍分散構件552之頂面552A之中央之方式配置為圓環狀。從導入口551H供給來之研磨材料3抵碰到與導入口551H對向之圓形之頂面552A而呈氣溶膠狀分散。氣溶膠狀之研磨材料3從圓形之頂面552A之中央朝向外緣均勻地分散。呈氣溶膠狀分散之研磨材料3從複數個導出口553H經由軟管向複數個噴嘴502分別壓出,並被複數個噴嘴502噴射出。複數個導出口553H能夠配置為相對於複數個噴嘴502之每一個均勻地壓出研磨材料3。作為一例,導出管553於頂面552A之外緣附近等間隔且同心狀地配置。The plurality of
移動部M係變更被加工物4與複數個噴嘴502之相對位置之驅動部。移動部M可使被加工物4移動,可使複數個噴嘴502移動,亦可使被加工物4及複數個噴嘴502雙方移動。於本實施方式中,對具有噴嘴驅動部504及被加工物驅動部505作為移動部M,使複數個噴嘴502及被加工物4雙方移動之構成進行說明。The moving part M is a driving part which changes the relative position of the to-
加工台503係供被加工物4載置之台。加工台503配置於加工室509內。如圖4所示,加工台503於複數個噴嘴502噴射研磨材料3之噴射方向上,以載置被加工物4之面與複數個噴嘴502之延伸方向(Z軸方向)正交之方式載置於被加工物驅動部505上。加工台503之載置被加工物4之面亦可為吸附被加工物4之面。The processing table 503 is a table on which the to-
噴嘴驅動部504配置於殼體501之上部。噴嘴驅動部504與複數個噴嘴502連接。噴嘴驅動部504以複數個噴嘴502噴射研磨材料3之噴射區域與被加工物4進行相對移動之方式使複數個噴嘴502移動。被加工物驅動部505配置於殼體501之下部。被加工物驅動部505與加工台503之下表面連接。被加工物驅動部505以複數個噴嘴502噴射研磨材料3之噴射區域與被加工物4進行相對移動之方式使載置有被加工物4之加工台503移動。被加工物驅動部505例如為X-Y工作台等驅動機構。噴嘴驅動部504及被加工物驅動部505之相對移動所形成之軌跡(掃描軌跡)由控制部9控制。The
控制部9控制移動部M之動作。控制部9例如由具有CPU(Central Processing Unit:中央處理單元)等運算裝置、ROM(Read Only Memory:唯讀記憶體)、RAM(Random Access Memory:隨機存取記憶體)、HDD(Hard Disk Drive:硬碟驅動器)等記憶裝置以及通信裝置等之通用電腦構成。控制部9例如亦可為PLC(Programmable Logic Controller:可編程邏輯控制器)、DSP(Digital Signal Processor:數位信號處理器)等運動控制器。控制部9亦可為控制噴射加工裝置1整體之硬體。The
圖5係表示被加工物4及複數個噴嘴502之相對移動形成之、與被加工物4之表面平行之方向之軌跡(掃描軌跡)之模式圖。掃描軌跡表示沿著X軸方向及與X軸方向正交之Y軸方向之Z字形形狀。控制部9以被加工物4及複數個噴嘴502描繪此種掃描軌跡之方式控制移動部M之動作。基於該圖之掃描軌跡進行說明。首先,以複數個噴嘴502中之配置於X軸之最靠正方向之位置之噴嘴502A之噴射區域與掃描軌跡上之起點S重疊之方式,調整被加工物4與複數個噴嘴502之相對位置。起點S於掃描軌跡中設置於X軸之最靠正方向且Y軸之最靠負方向之位置。於該情形時,由於其他噴嘴以於X軸之負方向連接之方式排列,因此,其他噴嘴之噴射區域與從起點S觀時配置於X軸之負方向之其他起點(未圖示)重疊。以下,將噴嘴502A之噴射區域作為「噴射區域」進行說明。FIG. 5 is a schematic diagram showing a trajectory (scanning trajectory) in a direction parallel to the surface of the
首先,控制部9以噴射區域從起點S沿著與被加工物4之表面平行之Y軸方向(第1方向)移動之方式控制被加工物驅動部505之動作(第1掃描)。具體而言,使被加工物4沿著Y軸之負方向移動。繼而,若噴射區域到達Y軸之負方向之端,則控制部9以噴射區域沿著與Y軸方向正交且與被加工物4之表面平行之X軸方向(第2方向)移動之方式控制噴嘴驅動部504之動作(第2掃描)。具體而言,使複數個噴嘴502沿著X軸之負方向(本說明書中亦記為進給方向)移動。繼而,控制部9以噴射區域沿著Y軸方向移動之方式控制被加工物驅動部505之動作。具體而言,使被加工物4沿著Y軸之正方向移動。若噴射區域到達第1方向之上側之端,則控制部9以噴射區域沿著進給方向移動之方式控制噴嘴驅動部504之動作。藉由交替重複該動作,而描繪掃描軌跡。此處,從噴嘴502A噴射之氣固兩相流具有速度分佈,從而會根據距噴嘴502A之位置使研磨力產生差異。進給方向之移動距離考慮該研磨力之差異而被設定。進給方向之移動距離例如亦可不包含0且為噴嘴502A之噴射口之直徑以下。First, the
(篩選部)
篩選部6對在加工部5對被加工物4進行噴射加工之過程中產生之粉粒體8進行回收。篩選部6將粉粒體8中之可再使用之研磨材料3輸送至後述之貯存部10。篩選部6將粉粒體8中之不可再使用之研磨材料3、被加工物4剝離而產生之切削粉等輸送至後述之集塵器702。篩選部6具有回收導管601以及分級部602。回收導管601係一端與加工部5連接,另一端與分級部602連接之管。回收導管601使粉粒體8乘著後述之集塵器702產生之氣流從加工部5向篩選部6之分級部602輸送。(Screening Department)
The
分級部602之上部與後述之集塵導管701連通。分級部602於下部與貯存部10連通。分級部602例如為研缽狀之中空構造。分級部602將從回收導管601輸送來之粉粒體8分級為可再使用之研磨材料3、不可再使用之研磨材料3及切削粉。分級部602例如為旋風分離器。The upper part of the
粉粒體8例如於分級部602內回轉。粉粒體8中之可再使用之研磨材料3比不可再使用之研磨材料3及切削粉重。作為較重之粒子之可再使用之研磨材料3於回轉速度降低時因重力而向分級部602下部落下並收集。壓縮空氣未流入貯存部10之內部,且分級部602與貯存部10之間之閥打開,使貯存部10與分級部602連通之情形時,收集在分級部602下部之可再使用之研磨材料3被送至供給部2之貯存部10。作為較輕之粒子之不可再使用之研磨材料3及切削粉被送至與分級部602上部連接之後述之集塵導管701。The powder and
(集塵部)
集塵部7對由篩選部6回收之不可再使用之研磨材料3及切削粉進行收集。集塵部7具有集塵導管701以及集塵器702。集塵導管701係一端與分級部602連接,另一端與集塵器702連接之管。集塵導管701將不可再使用之研磨材料3及切削粉從分級部602向集塵器702輸送。(Dust collection department)
The
集塵器702對從集塵導管701輸送來之不可再使用之研磨材料3及切削粉進行收集。集塵器702具有未圖示之吸引力產生源以及過濾器。藉由使吸引力產生源動作,而於與集塵器702連通之加工室509、回收導管601、分級部602以及集塵導管701內產生朝向集塵器702之氣流。藉由吸引力產生源之動作,從集塵導管701輸送來之不可再使用之研磨材料3及切削粉與空氣一起被吸引至集塵器702內。於集塵器702內,過濾器配置於集塵導管701與吸引力產生源之路徑上。過濾器捕獲不可再使用之研磨材料3及切削粉。藉由過濾器,僅空氣被移送至吸引力產生源。捕獲到之不可再使用之研磨材料3及切削粉能夠藉由取下過濾器而進行回收。The
(噴射加工裝置之步驟)
對噴射加工裝置1進行之噴射加工步驟進行說明。此處,以將印刷基板材料作為被加工物4,形成用於形成導通孔、通孔之貫通孔之噴射加工為例進行說明。印刷基板係藉由在聚醯亞胺、聚酯等絕緣體片材以及玻璃環氧基板之表面黏貼銅等導體箔而製作。圖6係表示實施方式之噴射加工裝置1之整體步驟之流程圖。(Steps of jet processing device)
The spray processing steps performed by the spray processing device 1 will be described. Here, the blasting process of forming through holes for forming via holes and through holes using a printed circuit board material as the
首先,進行被加工物4之準備步驟(步驟S1)。於步驟S1中,在被加工物4之表面形成遮罩圖案。具體而言,對被加工物4進行加熱,藉由層壓機在加熱後之被加工物4(之表面)黏貼遮罩材料。然後,將黏貼有遮罩材料之被加工物4配置於曝光機。於曝光機中,使用CCD(Charge Coupled Device:電荷耦合元件)照相機將圖案原版之位置對準被加工物4,進行曝光。然後,將被曝光之被加工物4配置於顯影機。於顯影機中,藉由一面使被加工物4旋轉一面噴附顯影液,而形成抗蝕劑層之遮罩圖案。此處,抗蝕劑層設置有與加工目標之孔對應之至少25 μm以上80 μm以下之開口。First, the preparation step of the workpiece 4 (step S1) is performed. In step S1, a mask pattern is formed on the surface of the
繼而,進行噴射加工裝置1之準備步驟(步驟S2)。於步驟S2中,對基於噴嘴驅動部504之複數個噴嘴502與被加工物4之距離、複數個噴嘴502噴射研磨材料3之噴射壓力等進行調整。對於噴射壓力之調整而言,首先經由軟管向複數個噴嘴502供給壓縮空氣。繼而,藉由操作壓力閥而將研磨材料3之噴射壓力調整為規定之壓力。於噴射壓力之調整後,停止壓縮空氣之供給。Then, the preparation step of the jet processing apparatus 1 is performed (step S2). In step S2, the distance between the plurality of
又,於步驟S2中,控制部9設定移動部M之動作模式。動作模式包含複數個噴嘴502之掃描軌跡以及移動速度、掃描次數等。表示動作模式之設定資訊被記憶於控制部9之記憶裝置。In addition, in step S2, the
結束該等調整後,將研磨材料3投入供給部2之貯存部10。投入與噴射量相應量之研磨材料3。After finishing these adjustments, the abrasive 3 is put into the
繼而,接著進行被加工物4之設置步驟(S3)。於步驟S3中,被加工物4通過設置於加工室509之觀察窗而載置於加工台503之與複數個噴嘴502對向之面上。Then, the step of setting the workpiece 4 (S3) is performed. In step S3, the
繼而,進行噴射加工步驟(S4)。於步驟S4中,首先,將壓縮空氣通過加壓用導管73供給至貯存部10。接下來,藉由向貯存部10之內部供給壓縮空氣,而對貯存部10之內部進行加壓,貯存部10與分級部602之間之閥關閉。由此,貯存部10被密封。接下來,研磨材料3於貯存部10內被壓縮空氣加壓,向填充部20移動。接下來,研磨材料3藉由壓縮空氣之按壓力填充於輥30之槽。研磨材料3通過貯存部10及填充部20被壓縮空氣加壓,由此密集地填充於每個槽。接下來,輥30以由控制部9設定之速度藉由驅動部40之動力進行旋轉。接下來,填充於槽之研磨材料3藉由轉動處理(S21)中之輥30之旋轉而移動至取出部50之位置,從而形成流路。接下來,從管路供給之壓縮空氣被供給至流路。壓縮空氣於與槽之延伸方向平行之方向產生氣流。藉由壓縮空氣產生之氣流,將填充於槽之研磨材料3擠出至噴嘴單元U。Then, the blast processing step (S4) is performed. In step S4, first, compressed air is supplied to the
與壓縮空氣一起被擠出至噴嘴單元U之研磨材料3朝向噴嘴單元U之分配機構550。被供給至分配機構550之導入管551之研磨材料3於通過導入管551時被整流,而進行初始之分散。被供給至分散構件552之研磨材料3於分散室552S中呈氣溶膠狀分散。分散開之研磨材料3與壓縮空氣一起從導出管553被壓出。The
從導出管553被壓出之研磨材料3經由軟管供給至複數個噴嘴502。藉由將研磨材料3與壓縮空氣一起作為混合流體從複數個噴嘴502進行噴射,而對被加工物4進行噴射加工。被加工物驅動部505基於在準備步驟(S3)中設定之掃描軌跡、掃描速度、掃描次數等,使被加工物驅動部505上之被加工物4及加工台503相對於複數個噴嘴502進行相對移動。基於由控制部9設定之掃描軌跡對被加工物4進行加工。此處,複數個噴嘴502以沿著X軸方向連接之方式排列設置,因此與配置一個噴嘴之情形相比,能夠將掃描次數設定得較少。又,與配置一個噴嘴之情形、或將複數個噴嘴以沿著Y軸方向連接之方式排列設置之情形相比,能夠將進給方向之移動距離設定得較短。即,藉由減少掃描次數,並且縮短進給方向之移動距離,能夠減少研磨材料3與抗蝕劑層過度碰撞。其結果,能夠減少對抗蝕劑層之損傷。因此,能夠對從抗蝕劑層之開口部(孔)露出之被加工物4之表面有效地進行切削加工,因此能夠高精度地形成貫通孔。若抗蝕劑層之損傷較大,則會於孔貫通前導致抗蝕劑層之開口部破損。藉由利用一實施方式之噴射加工裝置1進行噴射加工,能夠形成縱橫比(貫通孔之深度h相對於抗蝕劑層之開口部之直徑d之比即h/d)為0.8以上2.0以下之貫通孔。The abrasive 3 extruded from the
於一實施方式之噴射加工裝置1中,藉由使複數個噴嘴502之噴射口為圓形,並對各個配置複數個噴嘴502之間隔進行調整,能夠獲得噴射流整體上速度分佈之偏差較小且能夠進行廣泛之加工之噴射流。於將噴嘴之噴射口以形成與一實施方式之噴射加工裝置1相同之加工寬度之噴射流之方式設為矩形之情形時,噴射流之速度分佈之偏差較大。其結果,與一實施方式之噴射加工裝置1相比,於噴射流之速度分佈之偏差較大之噴射加工裝置中,需要增加掃描次數,或縮短向進給方向之移動距離。因此,一實施方式之噴射加工裝置1更能夠高精度地進行噴射加工。藉由利用一實施方式之噴射加工裝置1進行加工,能夠形成在被加工物4之表面形成之貫通孔之直徑Da相對於在抗蝕劑層形成之開口部之直徑Db之比即Da/Db為0.84以上0.94以下之孔。In the jet processing device 1 of one embodiment, by making the jet openings of the plurality of
於設定之掃描及加工完成之情形時,停止從複數個噴嘴502噴射研磨材料3及壓縮空氣。When the set scanning and processing are completed, stop spraying the abrasive 3 and compressed air from the plurality of
又,於噴射加工步驟(S4)中,亦進行集塵步驟。於集塵步驟中,集塵器702在加工室509、回收導管601、分級部602以及集塵導管701之內部,產生朝向集塵器702吸引粉粒體8及空氣之氣流。藉由集塵器702進行動作而產生之氣流,使得加工室509內產生之粉粒體8依序移動至加工室509、回收導管601、分級部602。藉由分級部602進行之分級,可再使用之研磨材料3被回收至貯存部10,不可再使用之研磨材料3及切削粉通過集塵導管701被回收至集塵器702。In addition, in the blast processing step (S4), the dust collection step is also performed. In the dust collection step, the
最後,進行被加工物回收步驟(S5)。於步驟S5中,被加工物4通過殼體501之觀察窗,從加工台503之面上被回收。Finally, the process of recovering the processed material (S5) is performed. In step S5, the processed
以上,對本發明之實施方式進行了說明,但本發明並不限定於上述實施方式。能夠於不變更發明主旨之範圍內進行適當變更。又,上述實施方式能夠於不矛盾之範圍內進行組合。The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments. Appropriate changes can be made within the scope of not changing the spirit of the invention. In addition, the above-mentioned embodiments can be combined within a range that does not contradict each other.
(實施方式之效果)
以上,根據本實施方式之噴射加工裝置1,藉由將複數個噴嘴502以沿著掃描軌跡中之進給方向連接之方式排列設置,能夠獲得廣泛之噴射區域。藉由具有分配機構550,能夠對複數個噴嘴502均勻地供給研磨材料3,因此所有之複數個噴嘴502能夠具有相同之加工能力。其結果,於與被加工物4碰撞之區域,能夠獲得速度分佈較小之噴射流(即,加工能力之偏差較小之噴射區域)。(Effects of implementation)
As described above, according to the jet processing apparatus 1 of the present embodiment, by arranging a plurality of
由於噴射加工裝置1具備複數個噴嘴502,因此能夠縮短對被加工物4噴射研磨材料3之時間。因此,能夠兼得縮短加工時間與減輕對被加工物4之損傷。又,由於具備能夠將從單一之貯存部10供給來之研磨材料3均勻地分配給複數個噴嘴502之分配機構550,因此整體之加工精度提高。Since the jet processing apparatus 1 includes a plurality of
分配機構550構成為依序連結於導入管551、分散構件552、導出管553,由此能夠以簡單之構造對所有噴嘴賦予大致相同之加工能力。藉由使分散構件552之分散室552S之頂面552A為圓形,將導出管以包圍頂面552A之中央之方式配置為圓環狀,能夠將在分散室552S被分散成均勻濃度之氣溶膠狀態之研磨材料3供給至所有之複數個噴嘴502。分散室552S藉由使高度為頂面552A之直徑之1/5以上1/2以下,能夠獲得優異之分散效果。又,藉由將在導入管551中與分散室552S連結之直線部551S設為管長為內徑之5倍以上之圓管,能夠將研磨材料3以初始分散之狀態導入分散構件552。The
由於能夠獲得速度分佈較小之噴射流,故能夠減少使被加工物4相對於複數個噴嘴502相對移動而描繪掃描軌跡之次數,或者能夠延長向進給方向之移動距離(不包含0且為複數個噴嘴502之噴射口之直徑以下)。其結果,能夠減少研磨材料3與被加工物4過度碰撞,因此能夠減少對被加工物4造成之損傷。Since a jet stream with a small velocity distribution can be obtained, it is possible to reduce the number of times the
藉由採用對貯存部10進行加壓而經由供給部2將研磨材料3擠出至朝向分配機構550之導入管551之構成,能夠降低壓縮空氣之壓力損失。其結果,能夠提高加工能力,由此能夠減少使被加工物4相對於噴嘴相對移動而描繪掃描軌跡之次數。又,由於研磨材料3之加工能力較高,故能夠縮短使研磨材料3與被加工物4接觸之時間,因此能夠兼得縮短加工時間與減輕對被加工物4之損傷。By adopting a configuration in which the
複數個噴嘴502以沿著X軸方向連接之方式排列設置。藉由如此配置複數個噴嘴502,能夠兼得縮短加工時間與減輕對被加工物4之損傷。A plurality of
噴射加工裝置1能夠兼得縮短加工時間與減輕對被加工物4之損傷。於進行孔加工、槽加工之情形時,在被加工物4設置有抗蝕劑層,但噴射加工裝置1能夠減輕對該抗蝕劑層之損傷。例如,於對作為被加工物4之一例之印刷基板材料進行使通孔、導通孔等貫通孔開口之噴射加工之情形時,能夠減輕對抗蝕劑層之損傷,由此能夠進行高精度之噴射加工。即,藉由利用本實施方式之噴射加工裝置1進行噴射加工,即使於形成有開口部為25 μm以上80 μm以下般極小徑之抗蝕劑圖案之情形時,若縱橫比(h/d)為0.8以上2.0以下,則亦能夠以通常之噴射加工中難以實現之精度進行加工。又,若形成於被加工物4之貫通孔之直徑Da相對於形成於抗蝕劑層之開口部之直徑Db之比即Da/Db為0.84以上0.94以下,則能夠以通常之噴射加工中難以實現之精度進行加工。The jet processing device 1 can both shorten the processing time and reduce the damage to the
根據本實施方式之噴射加工裝置1及噴射加工方法,能夠藉由僅從一側噴射研磨材料3來進行如上所述之高精度之加工。又,能夠改善空間之垂直性。特別適用於形成用於形成作為微細孔之導通孔或通孔之孔。According to the jet processing apparatus 1 and the jet processing method of this embodiment, it is possible to perform high-precision processing as described above by jetting the abrasive 3 from only one side. In addition, the verticality of the space can be improved. It is particularly suitable for forming holes for forming via holes or through holes as fine holes.
(變化例)
實施方式中之分散構件552不僅可為圓柱形狀,亦可為圓錐形狀、圓錐台形狀。由於該等形狀係從導入部朝向底面連續地擴徑之形狀,因此,能夠使研磨材料3以成為更均勻之濃度之氣溶膠之方式進行分散。(Variation example)
The dispersing
1:噴射加工裝置
2:供給部
3:研磨材料
4:被加工物
5:加工部
6:篩選部
7:集塵部
8:粉粒體
9:控制部
10:貯存部
20:填充部
30:輥
40:驅動部
50:取出部
73:加壓用導管
501:殼體
502:噴嘴
503:加工台
504:噴嘴驅動部
505:被加工物驅動部
509:加工室
550:分配機構
551:導入管
551S:直線部
552:分散構件
552A:頂面
553:導出管
601:回收導管
602:分級部
701:集塵導管
702:集塵器
M:移動部
U:噴嘴單元1: Jet processing device
2: Supply Department
3: Abrasive materials
4: processed objects
5: Processing Department
6: Screening Department
7: Dust collection department
8: Powder and granule
9: Control Department
10: Storage Department
20: Filling part
30: Roll
40: Drive
50: Take out part
73: Compression catheter
501: Shell
502: Nozzle
503: processing table
504: Nozzle Drive
505: Workpiece drive unit
509: Processing Room
550: distribution agency
551:
圖1係表示實施方式之噴射加工裝置之整體剖視圖。 圖2係表示分配機構之立體圖。 圖3係圖2之分配裝置之透視剖視圖。 圖4係表示噴嘴之配置狀態之模式圖。 圖5係表示利用移動部使噴嘴與被加工物相對移動而產生之掃描軌跡之模式圖。 圖6係噴射加工處理之流程圖。FIG. 1 is an overall cross-sectional view showing the jet processing apparatus of the embodiment. Fig. 2 is a perspective view showing the distribution mechanism. Figure 3 is a perspective cross-sectional view of the dispensing device of Figure 2; Fig. 4 is a schematic diagram showing the disposition state of the nozzles. Fig. 5 is a schematic diagram showing a scanning trajectory generated by the relative movement of the nozzle and the workpiece by the moving part. Figure 6 is a flow chart of the blasting process.
1:噴射加工裝置 1: Jet processing device
2:供給部 2: Supply Department
3:研磨材料 3: Abrasive materials
5:加工部 5: Processing Department
6:篩選部 6: Screening Department
7:集塵部 7: Dust collection department
8:粉粒體 8: Powder and granule
9:控制部 9: Control Department
10:貯存部 10: Storage Department
20:填充部 20: Filling part
30:輥 30: Roll
40:驅動部 40: Drive
73:加壓用導管 73: Compression catheter
501:殼體 501: Shell
502:噴嘴 502: Nozzle
503:加工台 503: processing table
504:噴嘴驅動部 504: Nozzle Drive
505:被加工物驅動部 505: Workpiece drive unit
509:加工室 509: Processing Room
550:分配機構 550: distribution agency
551:導入管 551: introduction tube
551S:直線部 551S: straight part
552:分散構件 552: Dispersion Component
553:導出管 553: export tube
601:回收導管 601: Recovery Conduit
602:分級部 602: Classification Department
701:集塵導管 701: Dust Collection Conduit
702:集塵器 702: Dust Collector
M:移動部 M: Mobile Department
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JP2020-174852 | 2020-10-16 | ||
JP2020174852A JP2021120178A (en) | 2020-01-30 | 2020-10-16 | Blast processing device and blast processing method |
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