TW202128536A - Delivering method thereof - Google Patents

Delivering method thereof Download PDF

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TW202128536A
TW202128536A TW109102039A TW109102039A TW202128536A TW 202128536 A TW202128536 A TW 202128536A TW 109102039 A TW109102039 A TW 109102039A TW 109102039 A TW109102039 A TW 109102039A TW 202128536 A TW202128536 A TW 202128536A
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temporary
electronic component
operated
working
electronic components
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TW109102039A
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TWI718852B (en
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李子瑋
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鴻勁精密股份有限公司
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Abstract

A delivering method for an electronic component includes a first receiving step, a feeding step, and a second receiving step. The first receiving step is that a delivering mechanism transfers an operated electronic component according to a first delivering route form an operation device to a temporary storing device which is located by the side of another operation device to temporarily receive the electronic component. The feeding step is that the delivering mechanism transfers an unoperated electronic component according to a second delivering route form the temporary storing device to the said another operation device to execute a preset operation. The second receiving step is that the delivering mechanism transfers the operated electronic component according to a third delivering route form the said another operation device to another temporary storing device to temporarily receive the electronic component. Thereby, the delivering mechanism is able to transfer the electronic component between two operation devices and two temporary storing devices sequentially and quickly.

Description

電子元件運料方法及其應用之作業設備Electronic component transportation method and its application operating equipment

本發明係提供一種有效縮短電子元件運料作業時間,進而提高生產效能之電子元件運料方法及其應用之作業設備。The present invention provides an electronic component transportation method and application equipment that can effectively shorten the transportation time of electronic components, thereby improving production efficiency.

在現今,電子元件於製作完成後,必須經由測試作業設備執行測試作業,以淘汰出不良品;請參閱第1圖,測試作業設備係於機台11之下方配置一測試機12,測試機12電性連接複數個位於機台11上方之第一測試器131、第二測試器132、第三測試器133及第四測試器134,測試作業設備另於機台11上方配置載台14及移料機構15,載台14係設置供料槽141及收料槽142,以分別承置待測電子元件及已測電子元件,移料機構15係設置第一移料器151及第二移料器152,以分別移載待測電子元件及已測電子元件。Nowadays, after the production of electronic components is completed, testing operations must be performed through testing equipment to eliminate defective products; please refer to Figure 1, the testing equipment is located under the machine 11 with a testing machine 12, testing machine 12 The first tester 131, the second tester 132, the third tester 133, and the fourth tester 134 are electrically connected to the plurality of first testers 131, the second tester 132, the third tester 133, and the fourth tester 134 above the machine table 11. The feeding mechanism 15 and the carrier 14 are provided with a feeding trough 141 and a receiving trough 142 to respectively hold the electronic components to be tested and the tested electronic components, and the material moving mechanism 15 is provided with a first shifter 151 and a second shifter The device 152 is used to transfer the electronic component to be tested and the electronic component to be tested, respectively.

由於載台14之供料槽141係承置待測電子元件,於執行運料作業時 ,移料機構15係以第二移料器152於載台14之供料槽141取出待測電子元件,並移載至第一測試器131,再以第一移料器151於第一測試器131取出已測電子元件,第一移料器151位移返回至載台14處,將已測電子元件移入載台14之收料槽142;當完成第一測試器131之供料/收料作業後,移料機構15即往返於載台14及第二測試器132間執行下一次供料/收料作業,相同地,移料機構15之第二移料器152於載台14之供料槽141取出下一待測電子元件,並移載至第二測試器132,再以第一移料器151於第二測試器132取出下一已測電子元件,第一移料器151位移返回至載台14處,將下一已測電子元件移入載台14之收料槽142;依此運料作動時序,移料機構15即往返於載台14及第三測試器133間執行供料/收料作業,以及往返於載台14及第四測試器133間執行供料/收料作業。Since the feeding trough 141 of the carrier 14 holds the electronic components to be tested, when carrying out the transportation operation , The material transfer mechanism 15 uses the second material shifter 152 to take out the electronic component to be tested from the feeding slot 141 of the carrier 14 and transfers it to the first tester 131, and then uses the first material shifter 151 to perform the first test The tester 131 takes out the tested electronic components, and the first shifter 151 moves back to the carrier 14 to move the tested electronic components into the receiving chute 142 of the carrier 14; when the feeding/receiving of the first tester 131 is completed After the operation, the material transfer mechanism 15 will reciprocate between the carrier 14 and the second tester 132 to perform the next feeding/receiving operation. The chute 141 takes out the next electronic component to be tested and transfers it to the second tester 132, and then uses the first shifter 151 to take out the next tested electronic component from the second tester 132, and the first shifter 151 is displaced Return to the carrier 14 and move the next tested electronic component into the receiving chute 142 of the carrier 14; according to the movement sequence of the material, the material-moving mechanism 15 will reciprocate between the carrier 14 and the third tester 133. The feeding/receiving operation, and the feeding/receiving operation between the carrier 14 and the fourth tester 133.

惟,移料機構15於執行第一測試器131、第二測試器132、第三測試器133及第四測試器134的供料作業及收料作業,必須每次於第一測試器131與載台14間作往返位移運送待測電子元件及已測電子元件後,再於第二測試器132與載台14間作往返位移運送待測電子元件及已測電子元件,依此類推,移料機構15於各測試器及載台14間作多次往返位移運送待測電子元件及已測電子元件的運料方法相當耗費時間,若測試器配置數量繁多,相對地更增加往返位移之運料時間。However, when the material moving mechanism 15 performs the feeding and receiving operations of the first tester 131, the second tester 132, the third tester 133, and the fourth tester 134, it must be connected to the first tester 131 and After the carrier 14 performs reciprocating displacement to transport the electronic components to be tested and the electronic components to be tested, the second tester 132 and the carrier 14 perform reciprocating displacements to transport the electronic components to be tested and the electronic components to be tested, and so on. The material mechanism 15 performs multiple reciprocating displacements between the testers and the carrier 14 to transport the electronic components to be tested and the electronic components to be tested. The transportation method is quite time-consuming.料时间。 Material time.

再者,測試機12必須等待全部之第一測試器131、第二測試器132、第三測試器133及第四測試器134完成電子元件供料作業後,方可同步進行測試作業,但在第一測試器131、第二測試器132、第三測試器133及第四測試器134相當耗時供料/收料之運料作業情況下,測試機12勢必耗時空等,以致無法提高測試生產效能。Furthermore, the testing machine 12 must wait for all the first tester 131, the second tester 132, the third tester 133, and the fourth tester 134 to complete the electronic component supply operation before the test operation can be performed simultaneously. The first tester 131, the second tester 132, the third tester 133 and the fourth tester 134 are quite time-consuming in the case of feeding/receiving materials, the tester 12 will inevitably consume time and space, so that the test cannot be improved. Production efficiency.

本發明之目的一,係提供一種電子元件運料方法,包含第一轉運收料手段、轉運供料手段及第二轉運收料手段,第一轉運收料手段係移料機構於一作業器取出已作業電子元件,並依第一運料路徑運送至另一作業器側方之一暫置器暫置收料,轉運供料手段係移料機構於該一暫置器取出待作業電子元件,並依第二運料路徑運送至該另一作業器以供料而執行預設作業,第二轉運收料手段係移料機構於該另一作業器取出另一已作業電子元件,並依第三運料路徑運送至另一暫置器暫置收料;藉此移料機構係以順向作動時序而依序於二作業器及二暫置器間迅速運送已作業/待作業之電子元件,進而有效縮短運料作業時間,達到提高生產效能之實用效益。The first objective of the present invention is to provide an electronic component transportation method, which includes a first transfer receiving means, a transfer feeding means, and a second transfer receiving means. The first transfer receiving means is taken out by a working device by a transfer mechanism The electronic components have been processed and are transported to a temporary storage device on the side of another operating device according to the first transportation path to temporarily receive the materials. It is transported to the other operating device according to the second transport path to perform the preset operation. The three material transport paths are transported to another temporary device for temporary collection; by this, the material moving mechanism is to quickly transport the electronic components that have been operated/to be operated between the second working device and the second temporary device in a forward action sequence , Thereby effectively shortening the transportation time and achieving the practical benefits of improving production efficiency.

本發明之目的二,係提供一種作業設備,包含機台、作業裝置、暫置裝置、輸送裝置及中央控制裝置,作業裝置係配置於機台,並設置複數個作業器,以及設置至少一電性連接複數個作業器之作業機,複數個作業器對複數個電子元件執行預設作業;暫置裝置係配置於機台,並於複數個作業器之側方設置複數個暫置器,以供暫置待作業電子元件及已作業電子元件;輸送裝置係配置於機台,並設有移料機構,以於複數個作業器及複數個暫置器間移載待作業電子元件及已作業電子元件,中央控制裝置係用以控制及整合各裝置作動 ,以執行自動化作業,達到提升作業效能之實用效益。The second objective of the present invention is to provide a working equipment, including a machine, a working device, a temporary device, a conveying device, and a central control device. A working machine that is connected to multiple working devices, which performs preset operations on a plurality of electronic components; the temporary device is arranged on the machine, and a plurality of temporary devices are set on the side of the multiple working devices to It is used to temporarily place the electronic components to be operated and the electronic components that have been operated; the conveying device is arranged on the machine and is equipped with a material transfer mechanism to transfer the electronic components to be operated and the operated electronic components between a plurality of operating devices and a plurality of temporary devices Electronic components, the central control device is used to control and integrate the actions of each device , In order to perform automated operations to achieve the practical benefits of enhancing operational efficiency.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable your reviewer to have a better understanding of the present invention, a preferred embodiment is given with the accompanying drawings. The details are as follows:

請參閱第2圖,本發明作業設備包含機台20、作業裝置30、暫置裝置40、輸送裝置50及中央控制裝置(圖未示出),更包含供料裝置60及收料裝置70。Please refer to FIG. 2, the working equipment of the present invention includes a machine 20, a working device 30, a temporary device 40, a conveying device 50 and a central control device (not shown in the figure), and further includes a feeding device 60 and a receiving device 70.

該作業裝置30係配置於機台20,並設置複數個作業器,以及設置至少一電性連接複數個作業器之作業機,複數個作業器對複數個電子元件執行預設作業;更進一步,作業器可為測試器或檢知器等,以執行電性測試作業或檢知作業,作業機可為測試機或檢知機,於本實施例中,作業裝置30係於機台20之第一側配置複數個為測試器之第一至四作業器,以及於機台20之第二側配置複數個為測試器之第五至八作業器;茲以第一側之第一至四作業器為例,其係為第一作業器31、第二作業器32、第三作業器33及第四作業器34,以供對複數個電子元件執行測試作業,作業裝置30另於機台20之下方配置一為測試機35之作業機,測試機35電性連接第一作業器31、第二作業器32、第三作業器33及第四作業器34。The working device 30 is configured on the machine 20, and is provided with a plurality of working devices, and at least one working machine electrically connected to a plurality of working devices, and the plurality of working devices perform preset operations on a plurality of electronic components; further, The working device can be a tester or a detector, etc., to perform electrical testing or inspection operations. The working machine can be a testing machine or a detection machine. One side is equipped with a plurality of first to fourth operating devices as testers, and a plurality of fifth to eighth operating devices as testers are arranged on the second side of the machine 20; hereby the first to fourth operations on the first side For example, the first working device 31, the second working device 32, the third working device 33, and the fourth working device 34 are used to perform test operations on a plurality of electronic components. The working device 30 is separate from the machine 20 A working machine of the testing machine 35 is arranged below, and the testing machine 35 is electrically connected to the first working machine 31, the second working machine 32, the third working machine 33 and the fourth working machine 34.

該暫置裝置40係配置於機台20,並於複數個作業器之側方設置複數個暫置器,以供暫置待作業電子元件及已作業電子元件;更進一步,暫置器可與一作業器作同列配置,亦或暫置器配置於二作業器之間,又暫置器可以同一盛裝具(如料盤)盛裝待測電子元件及已測電子元件,亦或暫置器可以不同盛裝具(如料盤)各別盛裝待測電子元件或已測電子元件;於本實施例中,暫置裝置40係於機台20第一側之第一至四作業器側方配置第一至四暫置器,以及於機台20第二側之第五至八作業器側方配置第五至八暫置器;茲以第一側之第一至四暫置器為例,暫置裝置40係於第一作業器31之同列側方設置第一暫置器41,第一暫置器41係以一為料盤之盛裝具盛裝待測電子元件及已測電子元件,以及於第二作業器32之同列側方設置第二暫置器42,第二暫置器42係以一為料盤之盛裝具盛裝待測電子元件及已測電子元件,以及於第三作業器33之同列側方設置第三暫置器43,第三暫置器43係以一為料盤之盛裝具盛裝待測電子元件及已測電子元件,以及於第四作業器34之同列側方設置第四暫置器44,第四暫置器44係以一為料盤之盛裝具盛裝待測電子元件及已測電子元件。The temporary device 40 is arranged on the machine 20, and a plurality of temporary devices are arranged on the side of the plurality of working devices for temporarily storing the electronic components to be operated and the electronic components that have been operated; further, the temporary device can be combined with One working device is arranged in the same row, or the temporary device is arranged between two working devices, and the temporary device can be the same container (such as a tray) to hold the electronic components to be tested and the tested electronic components, or the temporary device can Different containers (such as trays) respectively hold electronic components to be tested or electronic components tested; One to four temporary devices, and the fifth to eighth temporary devices on the side of the fifth to eighth operation devices on the second side of the machine 20; hereby take the first to fourth temporary devices on the first side as an example, temporarily The placing device 40 is to set a first temporary device 41 on the same row side of the first working device 31. The first temporary device 41 uses a container as a tray to hold the electronic components to be tested and the electronic components to be tested, and A second temporary device 42 is arranged on the side of the second working device 32 in the same row. The second temporary device 42 uses a container as a tray to hold the electronic components to be tested and the electronic components to be tested, and the third working device 33 The third temporary device 43 is arranged on the side of the same row. The third temporary device 43 is a container that is a tray to hold the electronic components to be tested and the electronic components that have been tested, and is arranged on the same row side of the fourth working device 34 The fourth temporary receptacle 44, the fourth temporary receptacle 44 uses a container as a tray to hold the electronic components to be tested and the electronic components to be tested.

該輸送裝置50係配置於機台20,並設有至少一移料機構,至少一移料機構係於複數個作業器及複數個暫置器間移載待作業電子元件及已作業電子元件;輸送裝置50更包含設置至少一載台,至少一載台係承載待作業電子元件或已作業電子元件,更進一步,輸送裝置50可配置一具有供料槽及收料槽之載台,以供載送待作業電子元件及已作業電子元件,亦或配置一具供料槽之載台及另一具收料槽之載台,以分別載送待作業電子元件或已作業電子元件;於本實施例中,輸送裝置50係於機台20第一側配置一具有供料槽及收料槽之載台 ,以及於機台20第二側配置另一具有供料槽及收料槽之載台;茲以第一側之載台為例,載台51係配置供料槽511及收料槽512,供料槽511係供載送待作業電子元件,收料槽512係供載送已作業電子元件。The conveying device 50 is disposed on the machine table 20 and is provided with at least one material moving mechanism. The at least one material moving mechanism transfers the electronic components to be operated and the electronic components that have been operated between a plurality of working devices and a plurality of temporary devices; The conveying device 50 further includes at least one carrier. The at least one carrier carries the electronic components to be operated or the electronic components that have been operated. Furthermore, the conveying device 50 can be configured with a carrier with a feeding trough and a receiving trough for Carry the electronic components to be operated and the electronic components that have been operated, or configure a carrier with a feeding chute and another carrier with a receiving chute to respectively carry the electronic components to be operated or the electronic components that have been operated; In the embodiment, the conveying device 50 is equipped with a carrier with a feeding trough and a receiving trough on the first side of the machine 20 , And the second side of the machine 20 is equipped with another carrier with a feeding trough and a receiving trough; taking the carrier on the first side as an example, the carrier 51 is equipped with a feeding trough 511 and a receiving trough 512, The supply tank 511 is for carrying electronic components to be operated, and the receiving tank 512 is for carrying electronic components that have been operated.

該移料機構可配置二同步位移之第一拾取器及第二拾取器,亦或配置二分別位移之第一拾取器及第二拾取器,以供取放待作業電子元件及已作業電子元件;於本實施例中,移料機構係於機台20第一側配置一具第一拾取器及第二拾取器之移料機構,以及於機台20第二側配置另一具第一拾取器及第二拾取器之移料機構;茲以第一側之移料機構為例,移料機構係設置第一拾取器521及第二拾取器522,第一拾取器521係作Z方向位移,以供取放已作業電子元件,第二拾取器522係作Z方向位移,以供取放待作業電子元件,第一拾取器521及第二拾取器522並由第一驅動源53驅動作X-Y方向位移,以供位移至第一至四作業器31~34及第一至四暫置器41~44及載台51。The material moving mechanism can be configured with two synchronously displaced first pickers and second pickers, or two separately displaced first pickers and second pickers for picking and placing electronic components to be operated and electronic components already operated In this embodiment, the material moving mechanism is configured on the first side of the machine 20 with a first picker and a second picker, and the second side of the machine 20 is equipped with another first pick The material moving mechanism of the second picker and the second picker; take the material moving mechanism of the first side as an example, the material moving mechanism is equipped with a first picker 521 and a second picker 522, and the first picker 521 is displaced in the Z direction , For picking and placing electronic components that have been operated, the second picker 522 is displaced in the Z direction for picking and placing electronic components to be processed, the first picker 521 and the second picker 522 are driven by the first drive source 53 Displacement in the XY direction for displacement to the first to fourth working devices 31 to 34 and the first to fourth temporary devices 41 to 44 and the stage 51.

該供料裝置60係裝配於機台20,並設有至少一供料器61,以供容置待作業之電子元件;該收料裝置70係裝配於機台20,並設有至少一收料器71,以供容置已作業之電子元件;該輸送裝置50另於機台20配置有換料機構,換料機構係設有至少一換料器54,以於載台51、供料裝置60及收料裝置70間移載待作業電子元件及已作業電子元件;中央控制裝置(圖未示出)係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。The feeding device 60 is assembled on the machine 20 and is provided with at least one feeder 61 for accommodating electronic components to be operated; the feeding device 70 is assembled on the machine 20 and is provided with at least one receiving device The feeder 71 is used for accommodating the electronic components that have been operated; the conveying device 50 is also equipped with a refueling mechanism on the machine 20. The electronic components to be operated and the electronic components that have been operated are transferred between the device 60 and the material receiving device 70; the central control device (not shown) is used to control and integrate the actions of each device to perform automated operations and achieve the practicality of enhancing the operating efficiency benefit.

請參閱第3、4圖,本發明之電子元件運料方法包含第一轉運收料手段、轉運供料手段及第二轉運收料手段,第一轉運收料手段係移料機構於一作業器取出已作業電子元件,並依第一運料路徑運送至另一作業器側方之一暫置器暫置收料,例如移料機構之第一拾取器521於第一作業器31取出已作業電子元件,並依第一運料路徑運送至第二作業器32側方之第二暫置器42;轉運供料手段係移料機構於該一暫置器取出待作業電子元件,並依第二運料路徑運送至該另一作業器,例如移料機構之第二拾取器522於第二暫置器42取出待作業電子元件,並依第二運料路徑運送至第二作業器32;第二轉運收料手段係移料機構於該另一作業器取出已作業電子元件,並依第三運料路徑運送至另一暫置器,例如移料機構之第一拾取器521於第二作業器32取出已作業電子元件,並依第三運料路徑運送至第三暫置器43。Please refer to Figures 3 and 4, the electronic component transportation method of the present invention includes a first transfer receiving means, a transfer feeding means, and a second transfer receiving means. The first transfer receiving means is a transfer mechanism in a working device. Take out the electronic components that have been operated, and transport them to a temporary storage device on the side of another manipulator according to the first transport path to temporarily collect the materials. The electronic components are transported to the second temporary device 42 on the side of the second working device 32 according to the first material transportation path; The second material transport path is transported to the other operating device, for example, the second picker 522 of the material moving mechanism takes out the electronic components to be processed in the second temporary device 42 and transports the electronic components to the second operating device 32 according to the second transport path; The second transfer and collection means is that the transfer mechanism takes out the operated electronic components from the other working device, and transports them to another temporary device according to the third transfer path, for example, the first picker 521 of the transfer mechanism is in the second The working device 32 takes out the operated electronic components and transports them to the third temporary holder 43 according to the third transportation path.

本發明之電子元件運料方法應用於作業設備之第一實施例,茲以機台20一側之作業裝置30、暫置裝置40及輸送裝置50運送電子元件為例,輸送裝置50之移料機構係執行入料手段,入料手段係為移料機構於載台51或又一暫置器取出待作業之電子元件,並移載至該一作業器,若移料機構於又一暫置器取料,該又一暫置器係執行初始供料手段,初始供料手段係以人工方式或移料機構將複數個待作業電子元件移入於又一暫置器;於本實施例中,第一暫置器41係執行初始供料手段,以人工方式或移料機構將複數個待作業電子元件82移入一為第一暫置器41之又一暫置器而供料;移料機構執行入料手段,係以第二拾取器522依入料路徑於第一暫置器41取出待作業電子元件82,並作X方向位移 ,而以最短運送行程將待作業電子元件82運送至第一作業器31,由於第一作業器31具有已作業電子元件81,移料機構係以第一拾取器521先取出已作業電子元件81,並以第二拾取器522將待作業電子元件82移入第一作業器31;移料機構執行第一轉運收料手段,移料機構之第一拾取器521依第一運料路徑將第一作業器31處取出之已作業電子元件81作順向位移而運送至下一第二暫置器42暫置收料 ,移料機構之第一拾取器521並不會將已作業電子元件81返回位移運送至載台51 ;移料機構執行轉運供料手段,由於移料機構之第一拾取器521及第二拾取器522已位於第二暫置器42處,移料機構之第二拾取器522即可直接於第二暫置器42取出下一待作業電子元件84,並依第二運料路徑作X方向位移,而以最短運送行程將下一待作業電子元件84運送至第二作業器32,移料機構之第二拾取器522並不會返回位移至載台51取料;又第二作業器32具有已作業電子元件83,移料機構係以第一拾取器521先取出已作業電子元件83,並以第二拾取器522將待作業電子元件84移入第二作業器32;移料機構執行第二轉運收料手段,移料機構之第一拾取器521依第三運料路徑將第二作業器32處取出之已作業電子元件83作順向位移而運送至下一第三暫置器43暫置收料,移料機構之第一拾取器521並不會將已作業電子元件83返回位移運送至載台51。The electronic component transportation method of the present invention is applied to the first embodiment of the working equipment. Here, the working device 30, the temporary device 40 and the conveying device 50 on the side of the machine 20 are used as an example to convey the electronic components. The mechanism is to implement the feeding means, and the feeding means is the moving mechanism to take out the electronic components to be operated on the stage 51 or another temporary device and transfer them to the working device. If the moving mechanism is in another temporary location The other temporary device is to perform the initial feeding means, and the initial feeding means is to manually move a plurality of electronic components to be operated into another temporary device by means of a manual method or a material moving mechanism; in this embodiment, The first temporary device 41 implements the initial feeding means, and manually or a material moving mechanism moves a plurality of electronic components 82 to be operated into another temporary device of the first temporary device 41 for feeding; The feeding means is executed by using the second picker 522 according to the feeding path to take out the electronic component 82 to be operated from the first temporary device 41 and move it in the X direction , And the electronic component 82 to be worked is transported to the first working device 31 with the shortest transport stroke. Since the first working device 31 has the working electronic component 81, the moving mechanism uses the first picker 521 to first take out the working electronic component 81 , And use the second picker 522 to move the electronic component 82 to be worked into the first working device 31; The operated electronic component 81 taken out from the working device 31 is moved forward and transported to the next second temporary device 42 for temporary collection , The first picker 521 of the material-moving mechanism does not return the operated electronic component 81 to the carrier 51 ; The moving mechanism implements the transfer feeding means. Since the first picker 521 and the second picker 522 of the moving mechanism are already located at the second temporary holder 42, the second picker 522 of the moving mechanism can be directly in the first The second temporary device 42 takes out the next electronic component 84 to be operated, and moves it in the X direction according to the second conveying path, and conveys the next electronic component 84 to be operated to the second worker 32 with the shortest conveying stroke. The material moving mechanism The second picker 522 does not move back to the carrier 51 to take the material; and the second manipulator 32 has the operated electronic component 83, and the material moving mechanism uses the first picker 521 to first take out the operated electronic component 83, and Use the second picker 522 to move the electronic component 84 to be worked into the second working device 32; The operated electronic components 83 taken out at 32 positions are moved forward and transported to the next third temporary loader 43 for temporary collection. The first picker 521 of the material moving mechanism does not return the operated electronic components 83 for displacement and transportation. To carrier 51.

依上述電子元件運料方法之作動時序,移料機構之第二拾取器522可直接於第三暫置器43取出待作業電子元件86,並作X方向位移,以最短運送行程將待作業電子元件86運送至第三作業器33,然第三作業器33具有已作業電子元件85,移料機構係以第一拾取器521可先取出已作業電子元件85,並以第二拾取器522將待作業電子元件86移入第三作業器33,再令第一拾取器521將取出之已作業電子元件85作順向位移而運送至下一第四暫置器44暫置收料,移料機構之第二拾取器522可直接於第四暫置器44取出待作業電子元件88,並作X方向位移 ,以最短運送行程將待作業電子元件88運送至第四作業器34,第四作業器34具有已作業之電子元件87,移料機構係以第一拾取器521先取出已作業電子元件87 ,再以第二拾取器522將待作業電子元件88移入第四作業器34;於第一作業器31、第二作業器32、第三作業器33及第四作業器34分別移入待測電子元件82、84、86、88後,測試機35即對第一~四作業器31、32、33、34內之待測電子元件82、84、86、88同步執行測試作業;因此,移料機構之第一拾取器521及第二拾取器522毋須多次往返第一~四作業器31、32、33、34及載台51間而供料及收料,可大幅節省運料作業時間而提高生產效能。According to the operation sequence of the above-mentioned electronic component transportation method, the second picker 522 of the material moving mechanism can directly take out the electronic component 86 to be operated from the third temporary device 43, and move it in the X direction, so as to transfer the electronic component to be operated with the shortest transportation stroke. The component 86 is transported to the third working device 33, and the third working device 33 has the operated electronic component 85. The electronic component 86 to be worked is moved into the third working device 33, and the first picker 521 is then made to move the taken-out working electronic component 85 in a forward direction and transport it to the next fourth temporary holder 44 for temporary collection and material transfer mechanism The second picker 522 can directly take out the electronic component 88 to be operated from the fourth temporary device 44 and move it in the X direction , The electronic component 88 to be worked is transported to the fourth working device 34 with the shortest transportation stroke. The fourth working device 34 has the working electronic component 87. The material moving mechanism uses the first picker 521 to first take out the working electronic component 87 , And then use the second picker 522 to move the electronic component 88 to be worked into the fourth working device 34; move the electronic component to be tested into the first working device 31, the second working device 32, the third working device 33 and the fourth working device 34 respectively After the components 82, 84, 86, and 88, the testing machine 35 will perform the testing operations on the electronic components 82, 84, 86, 88 to be tested in the first to fourth working devices 31, 32, 33, 34; therefore, the material is moved The first picker 521 and the second picker 522 of the mechanism do not need to go back and forth between the first to fourth manipulators 31, 32, 33, 34 and the carrier 51 multiple times for feeding and receiving, which can greatly save the time of transportation and increase Production efficiency.

電子元件運料方法更包含第一統整收料手段及第二統整收料手段 ,第一統整收料手段係於一作業器及另一作業器執行預設作業之時程中,移料機構之拾取器係於一暫置器及載台間移載一已作業電子元件收料,再於另一暫置器與載台間移載另一已作業電子元件收料;例如當移料機構配置較少數量之拾取器時,移料機構即可利用第一作業器31、第二作業器32、第三作業器33及第四作業器34同時執行測試作業之時程,以第一拾取器521將一由第四作業器34取出之最後已作業電子元件87移載至載台51之收料槽512收料,再作Y方向位移,於第二暫置器42、第三暫置器43、第四暫置器44及載台51間分批移載已作業電子元件85、83、81,使載台51載出複數個已作業電子元件87、85、83、81。The electronic component transportation method further includes the first integrated receiving method and the second integrated receiving method , The first integrated material receiving means is in the time course of a working device and another working device performing a preset operation, and the picker of the material moving mechanism is used to transfer an already operated electronic component between a temporary device and a carrier Receiving materials, and then transfer another electronic component that has been operated between another temporary device and the stage to receive materials; for example, when the material moving mechanism is equipped with a smaller number of pickers, the material moving mechanism can use the first working device 31 , The second working device 32, the third working device 33, and the fourth working device 34 are simultaneously executing the time schedule of the test operation, and the first picker 521 is used to transfer the last operated electronic component 87 taken out by the fourth working device 34 Receiving the material in the receiving chute 512 of the carrier 51, and then move it in the Y direction, and transfer the materials in batches between the second temporary holder 42, the third temporary holder 43, the fourth temporary holder 44 and the carrier 51. The electronic components 85, 83, and 81 cause the stage 51 to load a plurality of electronic components 87, 85, 83, and 81 that have been operated.

第二統整收料手段於一作業器及另一作業器執行預設作業之時程中,移料機構之拾取器係依序位移至一暫置器及另一暫置器取出一已作業電子元件及另一已作業電子元件,再移載至載台收料;例如當移料機構配置數量較多之拾取器時,移料機構即可於第一作業器31、第二作業器32、第三作業器33及第四作業器34執行測試作業之時程,令第一拾取器521除移載原本由第四作業器34取出之最後已作業電子元件87外,並作Y方向位移,依序於第四暫置器44、第三暫置器43、第二暫置器42處取出已作業電子元件85、83、81,再一次移載至載台之收料槽,載台可視作業所需而配置預設數量之供料槽及收料槽,使載台51載出複數個已作業電子元件87、85、83、81。The second integrated material receiving means is in the time course of a working device and another working device executing a preset operation, the picker of the material moving mechanism is sequentially shifted to a temporary device and another temporary device to take out an already operated The electronic component and another electronic component that has already been operated are then transferred to the carrier for receiving; for example, when the transfer mechanism is equipped with a large number of pickers, the transfer mechanism can be used in the first operating device 31 and the second operating device 32. , The third operating device 33 and the fourth operating device 34 perform the test operation schedule, so that the first picker 521 transfers the last electronic component 87 that was originally taken out by the fourth operating device 34 and moves in the Y direction , Take out the operated electronic components 85, 83, 81 from the fourth temporary device 44, the third temporary device 43, and the second temporary device 42 in sequence, and then transfer them to the receiving chute of the carrier again, the carrier A preset number of feeding troughs and receiving troughs can be arranged according to the needs of the operation, so that the carrier 51 can load a plurality of electronic components 87, 85, 83, 81 that have been operated.

請參閱第3、5圖,係本發明電子元件運料方法應用於作業設備之第二實施例,其與第一實施例之差異在於輸送裝置50之移料機構執行入料手段 ,入料手段係移料機構之第二拾取器522於載台51之供料槽511取出待作業電子元件82,並移載至第一作業器31,由於第一作業器31具有已作業電子元件81,移料機構係以第一拾取器521先取出已作業電子元件81,再以第二拾取器522將待作業電子元件82移入第一作業器31;後續之第一作業器31、第二作業器32、第三作業器33及第四作業器34的電子元件運料方法則相同第一實施例,於第一~四作業器31、32、33、34分別移入待測電子元件82、84、86、88後,測試機35即對第一~四作業器31、32、33、34內之待測電子元件82、84、86、88同步執行測試作業;因此,移料機構之第一拾取器521及第二拾取器522毋須多次往返第一~四作業器31、32、33、34及載台51而供料及收料,可大幅節省運料作業時間而提高生產效能。Please refer to Figures 3 and 5, which are the second embodiment of the electronic component transportation method of the present invention applied to work equipment. The difference from the first embodiment is that the material moving mechanism of the conveying device 50 executes the material feeding means. , The feeding means is the second picker 522 of the transfer mechanism to take out the electronic component 82 to be operated from the feeding slot 511 of the carrier 51, and transfer it to the first operating device 31, because the first operating device 31 has operating electronics Component 81, the material moving mechanism uses the first picker 521 to first take out the electronic component 81 that has been operated, and then uses the second picker 522 to move the electronic component 82 to be operated into the first worker 31; The electronic component transportation method of the second working device 32, the third working device 33 and the fourth working device 34 is the same as that of the first embodiment, and the electronic components to be tested 82 are moved into the first to fourth working devices 31, 32, 33, and 34 respectively. After, 84, 86, and 88, the testing machine 35 will simultaneously perform the testing operations on the electronic components 82, 84, 86, and 88 to be tested in the first to fourth operating devices 31, 32, 33, and 34; therefore, the moving mechanism The first picker 521 and the second picker 522 do not need to go back and forth between the first to fourth manipulators 31, 32, 33, 34 and the carrier 51 multiple times to feed and receive materials, which can greatly save the transportation time and improve the production efficiency.

[習知] 11:機台 12:測試機 131:第一測試器 132:第二測試器 133:第三測試器 134:第四測試器 14:載台 141:供料槽 142:收料槽 15:移料機構 151:第一移料器 152:第二移料器 [本發明] 20:機台 30:作業裝置 31:第一作業器 32:第二作業器 33:第三作業器 34:第四作業器 35:測試機 40:暫置裝置 41:第一暫置器 42:第二暫置器 43:第三暫置器 44:第四暫置器 50:輸送裝置 51:載台 511:供料槽 512:收料槽 521:第一拾取器 522:第二拾取器 53:第一驅動源 54:換料器 60:供料裝置 61:供料器 70:收料裝置 71:收料器 81、82、83、84、85、86、87、88:電子元件[Learning] 11: Machine 12: Test machine 131: First Tester 132: The second tester 133: Third Tester 134: Fourth Tester 14: Stage 141: supply trough 142: Receiving chute 15: Material transfer mechanism 151: The first shifter 152: Second shifter [this invention] 20: Machine 30: operating device 31: The first working device 32: The second working device 33: The third operating device 34: The fourth working device 35: test machine 40: Temporary device 41: The first temporary device 42: second temporary device 43: Third Temporary 44: Fourth Temporary 50: Conveying device 51: Stage 511: supply trough 512: receiving chute 521: First Picker 522: Second Picker 53: The first drive source 54: Changer 60: Feeding device 61: feeder 70: Receiving device 71: Receiver 81, 82, 83, 84, 85, 86, 87, 88: electronic components

第1圖:習知測試作業設備之移料機構作動示意圖。 第2圖:本發明作業設備之各裝置配置示意圖。 第3圖:本發明電子元件運料方法之流程圖。 第4圖:本發明電子元件運料方法第一實施例之使用示意圖。 第5圖:本發明電子元件運料方法第二實施例之使用示意圖。Figure 1: Schematic diagram of the movement of the material-moving mechanism of the conventional test equipment. Figure 2: Schematic diagram of each device configuration of the working equipment of the present invention. Figure 3: The flow chart of the electronic component transportation method of the present invention. Figure 4: A schematic diagram of the use of the first embodiment of the electronic component transportation method of the present invention. Figure 5: A schematic diagram of the use of the second embodiment of the electronic component transportation method of the present invention.

20:機台20: Machine

30:作業裝置30: operating device

31:第一作業器31: The first working device

32:第二作業器32: The second working device

33:第三作業器33: The third operating device

34:第四作業器34: The fourth working device

35:測試機35: test machine

40:暫置裝置40: Temporary device

41:第一暫置器41: The first temporary device

42:第二暫置器42: second temporary device

43:第三暫置器43: Third Temporary

44:第四暫置器44: Fourth Temporary

50:輸送裝置50: Conveying device

51:載台51: Stage

512:收料槽512: receiving chute

521:第一拾取器521: First Picker

522:第二拾取器522: Second Picker

81、82、83、84、85、86、87、88:電子元件81, 82, 83, 84, 85, 86, 87, 88: electronic components

Claims (10)

一種作業設備,包含: 機台; 作業裝置:係配置於該機台,並設置複數個作業器,以及設置至少一電性連接 該複數個作業器之作業機,該複數個作業器對複數個電子元件執行 預設作業; 暫置裝置:係配置於該機台,並於該複數個作業器之側方設置複數個暫置器, 以供暫置待作業電子元件及已作業電子元件; 輸送裝置:係配置於該機台,並設置至少一移料機構,該移料機構係於該複數 個作業器及該複數個暫置器間移載該待作業電子元件及該已作業電 子元件; 中央控制裝置:係用以控制及整合各裝置作動,以執行自動化作業。A kind of work equipment, including: Machine; Working device: It is configured on the machine, with multiple working devices, and at least one electrical connection The working machine of the plurality of working devices, the plurality of working devices execute the plurality of electronic components Preset job Temporary device: It is arranged on the machine, and a plurality of temporary devices are installed on the side of the plurality of working devices, For temporary storage of electronic components to be operated and electronic components that have already been operated; Conveying device: It is arranged on the machine and is provided with at least one material moving mechanism, and the material moving mechanism is connected to the plurality of Transfer the electronic components to be operated and the operated electrical components between a working device and the plurality of temporary Sub-element Central control device: It is used to control and integrate the actions of various devices to perform automated operations. 依申請專利範圍第1項所述之作業設備,更包含載台,該載台係設有至少一供料槽及至少一收料槽,以承置該待作業電子元件及該已作業電子元件。The operating equipment described in item 1 of the scope of the patent application further includes a carrier, the carrier is provided with at least one feeding chute and at least one receiving chute to hold the electronic component to be operated and the electronic component already operated . 依申請專利範圍第1項所述之作業設備,其中,該暫置裝置之該暫置器係與一該作業器作同列配置。According to the operating device described in item 1 of the scope of patent application, the temporary device of the temporary device is arranged in the same row as a working device. 依申請專利範圍第1項所述之作業設備,其中,該暫置裝置之該暫置器係配置於複數個該作業器之間。According to the operating equipment described in item 1 of the scope of patent application, the temporary device of the temporary device is arranged between a plurality of the operating devices. 一種電子元件運料方法,包含: 第一轉運收料手段:係移料機構於一作業器取出至少一已作業電子元件,並依 第一運料路徑運送至另一作業器側方之一暫置器; 轉運供料手段:係該移料機構於該一暫置器取出至少一待作業電子元件,並依 第二運料路徑運送至該另一作業器; 第二轉運收料手段:係該移料機構於該另一作業器取出至少另一已作業電子元 件,並依第三運料路徑運送至另一暫置器。An electronic component transportation method, including: The first transfer and collection means: the transfer mechanism takes out at least one electronic component that has been operated on a working device, and The first material transport path is transported to a temporary holder on the side of another working machine; Transfer feeding means: the transfer mechanism takes out at least one electronic component to be operated from the temporary holder, and according to The second material transport path is transported to the other working device; The second transfer and collection means: the transfer mechanism takes out at least another electronic element that has been operated on the other working device Parts, and are transported to another temporary holder according to the third transport path. 依申請專利範圍第5項所述之電子元件運料方法,更包含入料手段,該入料手段係該移料機構於又一暫置器取出待作業之電子元件,並移載至該一作業器。According to the electronic component transportation method described in item 5 of the scope of patent application, it further includes a material feeding means. Job device. 依申請專利範圍第6項所述之電子元件運料方法,更包含初始供料手段,該初始供料手段係以人工方式或該移料機構將待作業電子元件移入於該又一暫置器。According to the electronic component transportation method described in item 6 of the scope of patent application, it further includes an initial feeding means. The initial feeding means moves the electronic components to be operated into the other temporary holder manually or by the transfer mechanism. . 依申請專利範圍第5項所述之電子元件運料方法,更包含入料手段,該入料手段係該移料機構於載台取出待作業之電子元件,並移載至該一作業器。The electronic component transportation method described in item 5 of the scope of patent application further includes a material feeding means. The material feeding means is that the material moving mechanism takes out the electronic components to be operated on the carrier and transfers them to the working device. 依申請專利範圍第5項所述之電子元件運料方法,更包含第一統整收料手段,該第一統整收料手段係於該一作業器及該另一作業器執行預設作業之時程中,該移料機構係於該一暫置器及載台間移載該至少一已作業電子元件,再於該另一暫置器與該載台間移載該至少另一已作業電子元件。According to the electronic component transportation method described in item 5 of the scope of patent application, it further includes a first integrated receiving means, and the first integrated receiving means performs a preset operation on the one operating device and the other operating device In the course of time, the material transfer mechanism transfers the at least one electronic component between the one temporary device and the carrier, and then transfers the at least another electronic component between the other temporary device and the carrier. Operational electronic components. 依申請專利範圍第5項所述之電子元件運料方法,更包含第二統整收料手段,該第二統整收料手段於該一作業器及該另一作業器執行預設作業之時程中,該移料機構係位移至該一暫置器及該另一暫置器取出該至少一已作業電子元件及該至少另一已作業電子元件,再移載至載台收料。According to the electronic component transportation method described in item 5 of the scope of patent application, it further includes a second integrated receiving means that performs a preset operation on the one operating device and the other operating device In the course of time, the material moving mechanism is moved to the one temporary holder and the other temporary holder to take out the at least one operated electronic component and the at least another operated electronic component, and then transfer them to the carrier for receiving.
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