TW202127093A - 灰場成像之裝置及方法 - Google Patents

灰場成像之裝置及方法 Download PDF

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Publication number
TW202127093A
TW202127093A TW109142605A TW109142605A TW202127093A TW 202127093 A TW202127093 A TW 202127093A TW 109142605 A TW109142605 A TW 109142605A TW 109142605 A TW109142605 A TW 109142605A TW 202127093 A TW202127093 A TW 202127093A
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TW
Taiwan
Prior art keywords
wafer
light beam
light
lens
path
Prior art date
Application number
TW109142605A
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English (en)
Chinese (zh)
Inventor
秀梅 劉
Original Assignee
美商科磊股份有限公司
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Publication date
Application filed by 美商科磊股份有限公司 filed Critical 美商科磊股份有限公司
Publication of TW202127093A publication Critical patent/TW202127093A/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW109142605A 2019-12-03 2020-12-03 灰場成像之裝置及方法 TW202127093A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962943170P 2019-12-03 2019-12-03
US62/943,170 2019-12-03
US17/106,046 2020-11-27
US17/106,046 US11397153B2 (en) 2019-12-03 2020-11-27 Apparatus and method for gray field imaging

Publications (1)

Publication Number Publication Date
TW202127093A true TW202127093A (zh) 2021-07-16

Family

ID=76092124

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109142605A TW202127093A (zh) 2019-12-03 2020-12-03 灰場成像之裝置及方法

Country Status (6)

Country Link
US (2) US11397153B2 (https=)
JP (1) JP7592088B2 (https=)
KR (1) KR102914290B1 (https=)
CN (1) CN114746739B (https=)
TW (1) TW202127093A (https=)
WO (1) WO2021113273A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240020346A (ko) * 2022-08-05 2024-02-15 삼성디스플레이 주식회사 포토마스크 장치 및 이를 이용한 포토마스크 검사 방법
US20260023325A1 (en) * 2024-07-17 2026-01-22 Applied Materials, Inc. Digital lithography apparatus with imaging device positioned to mitigate moire effect

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6882417B2 (en) 2002-03-21 2005-04-19 Applied Materials, Inc. Method and system for detecting defects
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
JP2005070477A (ja) 2003-08-26 2005-03-17 Yokogawa Electric Corp 焦点移動機構およびそれを用いた光学顕微鏡
US7239389B2 (en) 2004-07-29 2007-07-03 Applied Materials, Israel, Ltd. Determination of irradiation parameters for inspection of a surface
US7400390B2 (en) * 2004-11-29 2008-07-15 Applied Materials, Israel, Ltd. Inspection system and a method for aerial reticle inspection
JP2007024758A (ja) 2005-07-20 2007-02-01 Tokyo Seimitsu Co Ltd 光学式検査装置及びその照明方法
JP5639169B2 (ja) * 2009-07-22 2014-12-10 ケーエルエー−テンカー・コーポレーションＫｌａ−Ｔｅｎｃｏｒ Ｃｏｒｐｏｒａｔｉｏｎ 暗視野検査システムおよび暗視野検査システムを構成する方法
KR20120043850A (ko) 2010-10-27 2012-05-07 삼성전자주식회사 레이저 광학계 및 이를 가지는 리페어 장치 및 방법
WO2013011508A2 (en) 2011-07-19 2013-01-24 Nova Measuring Instruments Ltd. Optical system and method for measuring in patterned stuctures
RU2509718C1 (ru) * 2012-08-07 2014-03-20 Корпорация "САМСУНГ ЭЛЕКТРОНИКС Ко., Лтд." Оптическая измерительная система и способ измерения критического размера
US9696264B2 (en) * 2013-04-03 2017-07-04 Kla-Tencor Corporation Apparatus and methods for determining defect depths in vertical stack memory
US9891175B2 (en) * 2015-05-08 2018-02-13 Kla-Tencor Corporation System and method for oblique incidence scanning with 2D array of spots
JP6640482B2 (ja) * 2015-07-31 2020-02-05 株式会社ニューフレアテクノロジー パターン検査装置及びパターン検査方法
US9874526B2 (en) * 2016-03-28 2018-01-23 Kla-Tencor Corporation Methods and apparatus for polarized wafer inspection
US10887580B2 (en) 2016-10-07 2021-01-05 Kla-Tencor Corporation Three-dimensional imaging for semiconductor wafer inspection
KR102027986B1 (ko) * 2017-04-13 2019-10-04 재단법인 경북아이티융합 산업기술원 비전 카메라를 이용한 비드 인식 장치 및 그 방법
KR102368435B1 (ko) 2017-07-28 2022-03-02 삼성전자주식회사 기판 검사 장치, 기판 검사 방법 및 이를 이용한 반도체 소자의 제조 방법

Also Published As

Publication number Publication date
KR20220104823A (ko) 2022-07-26
JP2023505437A (ja) 2023-02-09
JP7592088B2 (ja) 2024-11-29
US20220317062A1 (en) 2022-10-06
CN114746739A (zh) 2022-07-12
WO2021113273A1 (en) 2021-06-10
KR102914290B1 (ko) 2026-01-16
US11965835B2 (en) 2024-04-23
CN114746739B (zh) 2025-04-04
US20210164916A1 (en) 2021-06-03
US11397153B2 (en) 2022-07-26

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