JP7592088B2 - グレイ視野撮像装置及び方法 - Google Patents

グレイ視野撮像装置及び方法 Download PDF

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Publication number
JP7592088B2
JP7592088B2 JP2022532673A JP2022532673A JP7592088B2 JP 7592088 B2 JP7592088 B2 JP 7592088B2 JP 2022532673 A JP2022532673 A JP 2022532673A JP 2022532673 A JP2022532673 A JP 2022532673A JP 7592088 B2 JP7592088 B2 JP 7592088B2
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wafer
light beam
path
illumination
light
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JP2023505437A (ja
JP2023505437A5 (https=
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シウメイ リウ
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KLA Corp
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KLA Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2022532673A 2019-12-03 2020-12-01 グレイ視野撮像装置及び方法 Active JP7592088B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962943170P 2019-12-03 2019-12-03
US62/943,170 2019-12-03
US17/106,046 2020-11-27
US17/106,046 US11397153B2 (en) 2019-12-03 2020-11-27 Apparatus and method for gray field imaging
PCT/US2020/062759 WO2021113273A1 (en) 2019-12-03 2020-12-01 Apparatus and method for gray field imaging

Publications (3)

Publication Number Publication Date
JP2023505437A JP2023505437A (ja) 2023-02-09
JP2023505437A5 JP2023505437A5 (https=) 2023-09-12
JP7592088B2 true JP7592088B2 (ja) 2024-11-29

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JP2022532673A Active JP7592088B2 (ja) 2019-12-03 2020-12-01 グレイ視野撮像装置及び方法

Country Status (6)

Country Link
US (2) US11397153B2 (https=)
JP (1) JP7592088B2 (https=)
KR (1) KR102914290B1 (https=)
CN (1) CN114746739B (https=)
TW (1) TW202127093A (https=)
WO (1) WO2021113273A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240020346A (ko) * 2022-08-05 2024-02-15 삼성디스플레이 주식회사 포토마스크 장치 및 이를 이용한 포토마스크 검사 방법
US20260023325A1 (en) * 2024-07-17 2026-01-22 Applied Materials, Inc. Digital lithography apparatus with imaging device positioned to mitigate moire effect

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006047308A (ja) 2004-07-29 2006-02-16 Applied Materials Israel Ltd 表面を検査するための照射パラメータの決定
JP2007024758A (ja) 2005-07-20 2007-02-01 Tokyo Seimitsu Co Ltd 光学式検査装置及びその照明方法
US20140168646A1 (en) 2011-07-19 2014-06-19 Nova Measuring Instruments Ltd. Optical system and method for measuring in patterned structures
JP2016516307A (ja) 2013-04-03 2016-06-02 ケーエルエー−テンカー コーポレイション 垂直スタックメモリにおいて欠陥深さを決定するための装置および方法
JP2019535143A (ja) 2016-10-07 2019-12-05 ケーエルエー コーポレイション 半導体ウェハ検査用三次元イメージング

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6882417B2 (en) 2002-03-21 2005-04-19 Applied Materials, Inc. Method and system for detecting defects
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
JP2005070477A (ja) 2003-08-26 2005-03-17 Yokogawa Electric Corp 焦点移動機構およびそれを用いた光学顕微鏡
US7400390B2 (en) * 2004-11-29 2008-07-15 Applied Materials, Israel, Ltd. Inspection system and a method for aerial reticle inspection
JP5639169B2 (ja) * 2009-07-22 2014-12-10 ケーエルエー−テンカー・コーポレーションＫｌａ−Ｔｅｎｃｏｒ Ｃｏｒｐｏｒａｔｉｏｎ 暗視野検査システムおよび暗視野検査システムを構成する方法
KR20120043850A (ko) 2010-10-27 2012-05-07 삼성전자주식회사 레이저 광학계 및 이를 가지는 리페어 장치 및 방법
RU2509718C1 (ru) * 2012-08-07 2014-03-20 Корпорация "САМСУНГ ЭЛЕКТРОНИКС Ко., Лтд." Оптическая измерительная система и способ измерения критического размера
US9891175B2 (en) * 2015-05-08 2018-02-13 Kla-Tencor Corporation System and method for oblique incidence scanning with 2D array of spots
JP6640482B2 (ja) * 2015-07-31 2020-02-05 株式会社ニューフレアテクノロジー パターン検査装置及びパターン検査方法
US9874526B2 (en) * 2016-03-28 2018-01-23 Kla-Tencor Corporation Methods and apparatus for polarized wafer inspection
KR102027986B1 (ko) * 2017-04-13 2019-10-04 재단법인 경북아이티융합 산업기술원 비전 카메라를 이용한 비드 인식 장치 및 그 방법
KR102368435B1 (ko) 2017-07-28 2022-03-02 삼성전자주식회사 기판 검사 장치, 기판 검사 방법 및 이를 이용한 반도체 소자의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006047308A (ja) 2004-07-29 2006-02-16 Applied Materials Israel Ltd 表面を検査するための照射パラメータの決定
JP2007024758A (ja) 2005-07-20 2007-02-01 Tokyo Seimitsu Co Ltd 光学式検査装置及びその照明方法
US20140168646A1 (en) 2011-07-19 2014-06-19 Nova Measuring Instruments Ltd. Optical system and method for measuring in patterned structures
JP2016516307A (ja) 2013-04-03 2016-06-02 ケーエルエー−テンカー コーポレイション 垂直スタックメモリにおいて欠陥深さを決定するための装置および方法
JP2019535143A (ja) 2016-10-07 2019-12-05 ケーエルエー コーポレイション 半導体ウェハ検査用三次元イメージング

Also Published As

Publication number Publication date
KR20220104823A (ko) 2022-07-26
JP2023505437A (ja) 2023-02-09
US20220317062A1 (en) 2022-10-06
TW202127093A (zh) 2021-07-16
CN114746739A (zh) 2022-07-12
WO2021113273A1 (en) 2021-06-10
KR102914290B1 (ko) 2026-01-16
US11965835B2 (en) 2024-04-23
CN114746739B (zh) 2025-04-04
US20210164916A1 (en) 2021-06-03
US11397153B2 (en) 2022-07-26

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