TW202124305A - Glass cutting method and glass material using the ultrasonic wave to make the glass linear generate frictional heat and cutting into the incision - Google Patents

Abstract

The invention provides a glass cutting method and a glass material produced by the cutting method. The glass cutting method does not have complicated devices and can obtain a beautiful cutting surface with high efficiency and high precision. A method for cutting glass, comprising: contacting the ultrasonic vibrating blade of an ultrasonic cutting machine with the part to be cut of the glass; making the ultrasonic vibrating blade ultrasonically vibrate; while using the ultrasonic wave to make the glass linear generate frictional heat and cutting into the incision.

Description

Glass cutting method and glass material

The present invention relates to a method for cutting glass and a glass material cut thereby.

Conventionally, as a method of cutting a brittle material such as glass into a predetermined size, the following methods are known: 1) Using a cutting edge embedded with abrasive grains harder than glass, such as a round blade embedded with diamond abrasive grains, etc. , The method of physically cutting glass; 2) Cracking a part of the glass, and spreading the crack by applying pressure, that is, using the stress generated on the glass to be greater than the bending strength of the glass to cut (cut) the glass. As a method of cutting glass by the latter cutting method, cutting by manual cutting is generally used. Manual cutting is the following method: first press the glass on a disk-shaped blade that is rotated by a motor, etc., physically set an incision with a depth of less than 3mm on the glass, and then apply pressure to the glass or heat or cool the vicinity of the incision. As a result, mechanical stress or thermal stress is generated on the glass, thereby cutting the glass.

In manual cutting or the like, it is preferable to make the direction of the crack coincide with the predetermined direction. However, since the glass and the disc-shaped blade are in point contact, the thermal stress acting on the crack has a concentric distribution from the contact point of the glass and the blade, and the concentric heat distribution acts on the glass and the blade. Therefore, depending on the shape of the glass sample, the crack cannot be expanded in a predetermined direction, and the glass cannot be cut to the correct size. In particular, for glass with a large thickness, it is difficult to apply uniform mechanical stress to the glass that causes cracks to equally propagate in the required cutting direction. Therefore, the cut surface becomes a curved surface, and there is also a problem that it is difficult to cut neatly.

As a method for solving such a problem, for example, Patent Document 1 discloses a method of "cutting using the internal stress generated in the glass by applying equal lateral pressure to the side surface of the glass to be cut". This method describes that it is suitable for materials with a high unit price because no chips are generated and there is little loss.

In addition, Patent Document 2 discloses "a cutting method in which a brittle material is heated along the cutting line, and the brittle material is cooled on the cutting line. The surface of the brittle material is cracked by thermal stress, and the surface of the brittle material is cracked along the cutting line. The fracture is broken, and the compression stress of the brittle material changes to the tensile stress or near the stress inflection point at which the compressive stress of the brittle material changes to the tensile stress caused by the expansion of the brittle material on the cutting line of the brittle material is cooled, and the surface of the brittle material is generated. "Crack" method. This method describes that it has the advantages of being able to perform work more efficiently and obtaining a beautiful cut surface.

However, the method of using lateral pressure disclosed in Patent Document 1 is used for filing a glass with a large number of micro-cracks on the surface such as a workpiece, a heat-cutting piece, etc., the internal cracks may not be one, and it is difficult to correct the target position. Cut off. In addition, in the laser beam-based cutting method disclosed in Patent Document 2, since the laser beam irradiation method and the cooling method are repeated along the cutting line, the device becomes complicated. In addition, the microscopic heat distribution on the glass surface , Starting from the irradiation point of the laser and forming concentric circles, the cracks do not necessarily extend in a predetermined direction (depth direction), especially thick glass is difficult to cut.

In addition, there are methods in which glass is placed on a linear heating wire after heating, cracks are generated on the end surface of the glass, and the glass is cut by extending the cracks in the direction of the thermal stress portion generated in the heating wire. Although this method imparts a linear heat distribution to the glass, the physical stress imparted to the glass is only the thermal stress caused by thermal expansion. Therefore, the availability and accuracy of the cutting strongly depend on the shape of the glass of the base material. The position that can be cut is limited to the center of the glass. As a result, it is only suitable for the method of halving a relatively large plate glass, and is not suitable for manufacturing small cut workpieces of arbitrary shapes. [Existing technical literature] [Patent Literature]

[Patent Document 1]: (Japan) JP-A 61-266323 [Patent Document 2]: (Japan) JP 2004-155159

[Problems to be solved by the invention]

The present invention provides a glass cutting method and a glass material obtained by the cutting method. The glass cutting method does not require a complicated device and can efficiently and accurately obtain a beautiful cutting surface. [Proposal to solve the problem]

The inventors of the present invention found that when an ultrasonic cutting machine is used, the state of the cut surface is particularly superior compared to conventional manual cutting, and completed the present invention. The present invention includes the following contents. [1] A method for cutting glass, comprising: contacting the ultrasonic vibrating blade of an ultrasonic cutting machine with a part of the glass to be cut; causing the ultrasonic vibrating blade to ultrasonically vibrate; and using the ultrasonic to make The step of cutting the glass into the incision while generating frictional heat in a linear shape. [2] The method for cutting glass according to claim 1, wherein the frequency of the ultrasonic vibration is 5 kHz or more and 50 kHz or less. [3] The method for cutting glass according to claim 1 or 2, wherein the amplitude of the ultrasonic vibration is 5 μm or more and 40 μm or less. [4] A glass material obtained by the cutting method described in claim 1. [5] The glass material according to claim 4, wherein the waviness of the cut surface of the glass material is 100 or less. [6] A method of manufacturing a glass material, comprising: a step of bringing an ultrasonic vibration blade of an ultrasonic cutting machine into contact with a part of the glass to be cut; a step of subjecting the ultrasonic vibration blade to ultrasonic vibration; and using the ultrasonic wave The step of cutting the glass into the incision while generating frictional heat in a linear shape. [7] A glass material having at least a surface with a waviness of 100 or less and a surface roughness Ra of 500 μm or less. [8] The glass material according to [7], wherein the surface is a cut surface. [9] The glass material according to [7] or [8], wherein the content of boron and/or alkali components and/or fluorine in the surface is higher than that of the glass material that is not contained in the surface. The content of these elements in the surface is high. [10] The glass material according to [7] or [8], wherein the content of boron and/or alkali components and/or fluorine in the surface is higher than that of the glass material that is not contained in the surface. The content of these elements in the surface is higher than 5%. [Invention Effect]

In the present invention, the ultrasonic vibration blade of the ultrasonic cutting machine performs ultrasonic vibration on the part of the glass to be cut, so that the contact state between the glass and the ultrasonic vibration blade is not the point contact of the circular blade of the conventional diamond cutting machine, but the line Uniform contact. Thereby, it has a characteristic that the heat distribution generated in the glass by the cutting blade also becomes linear. As a result, since the ultrasonic cutting machine forms a cut while heating the glass in a linear shape, the waviness is small and a beautiful cut surface can be obtained. If the waviness of the cut surface is small, the amount of polishing can be suppressed in the subsequent polishing step, and the amount of glass chips can be reduced.

[Glass cutting method] Hereinafter, the glass cutting method of the ultrasonic cutting machine will be described with reference to the drawings. Fig. 1 is a perspective view showing the cutting of glass by an ultrasonic cutting machine. FIG. 2 is a schematic diagram showing the heat distribution at the time of cutting by the ultrasonic cutting machine 1. The ultrasonic vibrating blade 11 of the ultrasonic cutting machine 1 is brought into contact with the portion G1 of the glass G to be cut to be cut, and ultrasonic vibration is applied to the ultrasonic vibrating blade 11 in the direction of the arrow 11a indicating the vibration direction. The ultrasonic vibrating blade 11 that is vibrated by the ultrasonic is in contact with the glass G, and the portion G1 to be cut is linearly generated frictional heat, and is a linearly generated cut. Thereby, due to the linear thermal stress and the linear mechanical stress generated in the direction of the glass to be cut, the glass can be cut without substantially applying other pressure to the glass base material.

When the ultrasonic vibration blade of the ultrasonic cutting machine is an ultrasonic vibration blade 11 like the cutting machine shown in Figure 1, the heat generated by the ultrasonic vibration is distributed linearly with the linear heating part as the center (Figure 2 ). The frictional heat is generated linearly, and mechanical stress is generated by the linear cuts. This generates cracks at the position where the ultrasonic vibrating blade touches and cuts the glass. Therefore, the cut surface at the time of cutting becomes a clean surface, that is, Smooth and small waviness surface. The definition of waviness will be described later.

The depth of the cracks generated by the ultrasonic cutting machine 1 also depends on the thickness of the glass, and is cut into a depth of about 0.2 to 2 mm, preferably 0.2 mm to 1 mm or less. This cutting depth is shallower than that of conventional manual cutting. It should be noted that the time required for cutting is not particularly limited. However, since the glass is cut by the above-mentioned mechanism, it is not good to apply only mechanical stress before sufficient frictional heat is generated. On the contrary, when the frictional heat spreads outside the cut part It is not good to apply mechanical stress only afterwards. From such a viewpoint, the time required for the cracking can be appropriately changed according to the hardness and size of the glass. The lower limit of the cutting time when actually cutting the glass is 0.1 second/mm or more as a standard, preferably 0.3 second/mm, more preferably 0.5 second/mm, and still more preferably about 0.1 second/mm. The upper limit of the cutting time is preferably about 15 seconds/mm, more preferably about 10 seconds/mm, and more preferably about 5 seconds/mm. On the contrary, if the cutting time exceeds 30 seconds/mm or 60 seconds/mm, the frictional heat will diffuse to the periphery and the mechanical stress will be reduced, which is not preferable.

The size of the glass used for cutting is not particularly limited, but in the case of rectangular parallelepiped glass, it may be glass having a height of 1 to 40 mm, a width of 1 to 40 mm, and a length of, for example, 10 mm or more. It should be noted that it is not limited to a rectangular parallelepiped, and can also be used for cylindrical glass, triangular columnar glass, and the like. (The difficulty of cutting at this time can be distinguished according to the difficulty of cutting shown later.)

(Ultrasonic cutting machine) As the ultrasonic cutting machine used in the present invention, commercially available products can be used. For example, the ultrasonic small cutting machine USW-334 manufactured by Honda Electronics Co., Ltd. can be used. The lower limit of the ultrasonic frequency of the ultrasonic cutting machine is preferably 5 kHz or higher, more preferably 10 kHz or higher, further preferably 15 kHz or higher, and the upper limit is preferably 50 kHz or lower, more preferably 45 kHz or lower, and still more preferably 40 kHz or lower. In addition, the lower limit of the amplitude of the ultrasonic vibration blade is preferably 5 μm or more, more preferably 10 μm or more, and the upper limit is preferably 40 μm or less, and more preferably 30 μm or less. In addition, the output of the ultrasonic vibration blade is not particularly limited, but for example, from 5W to 500W, the lower limit of the output can be changed to, for example, 5W, 10W, 20W, 30W, 40W, 50W, 60W, 70W, 80W, 90W, 100W, 150W ..., the upper limit can also be changed to 30W, 60W, 80W, 100W, 150W, 200W, 300W, 400W, 500W, and the output is appropriately changed according to the hardness of the glass, the width at the time of cutting, and the ease of cutting described later. The output range may be, for example, 10W~30W, 20W~60W, 40W~100W, 100W~300W, 200W~400W, etc. When the hardness of the glass is high, by increasing the output, the frictional heat in the shear direction of the glass can be increased, and the glass can be cut. Therefore, when the hardness of the glass is high, it fluctuates according to the difficulty of cutting, but it can be broken by setting the output to 80W or more, for example. However, if the output is made too large, it is difficult to heat the glass unless the contact between the glass and the blade is made uniform, and therefore there is no need to increase the output beyond the output that can be cut by the glass. The size of the ultrasonic vibration blade is not particularly limited, and the thickness of the blade is preferably 0.1 mm or more and 1.0 mm or less, and more preferably 0.3 mm or more and 0.8 mm or less. The overall length of the ultrasonic vibration blade can be appropriately selected according to the size of the cut glass, and for example, a length of 20 mm or more and 100 mm or less can be used. The material is not particularly limited as long as it has a predetermined hardness such as ceramics and metals, and steel materials such as SKH51 can be used. As shown in Figure 1, the ultrasonic vibrating blade of the ultrasonic cutting machine is a thin-plate blade like the shape of the blade of a paper cutting machine, but it is not limited to such an ultrasonic vibrating blade. For example, a point-contact pen-shaped blade can also be used. Ultrasonic vibration blade. At this time, by cutting in by scribing a line on the glass in a contact state, linear cracks are generated, and it is possible to make a cut that is close to the same shape as in the case of an ultrasonic vibrating blade. The vibration direction of the ultrasonic wave uses the direction of the vibration in the direction of the shaft of the shank of the ultrasonic cutting machine (the direction of 11a in FIG. 1 ).

On the other hand, as shown in FIG. 3, the conventional manual cutting slicing makes the disc-shaped blade 21 contact the glass G, physically forms a cut with a depth of about 3 mm, and then cuts the glass. However, in such a device, the contact points are concentrated at one point and there is a distribution of thermal stress other than the direction in which you want to cut. Therefore, if the cutting difficulty described below is high, it is difficult to cut neatly.

[Difficulty of cutting off] The cutting method of the present invention has the characteristic of being able to cut neatly even when the cutting difficulty is high. The rupture difficulty of the glass was calculated by the formula shown in Fig. 5. The more difficult the glass is to cut, the more difficult it is to cut. In the formula of cutting difficulty, T is the thickness, W is the width, and L is the length. In the formula, the smaller the value of T/L and W/L, the easier it is to cut, and they are preferably 1 or less respectively. In addition, with regard to the thickness T, the smaller the thickness, the easier it is to cut.

Regarding the cutting difficulty, in conventional cutting by manual cutting, if the cutting difficulty exceeds 2, the cutting becomes difficult, and even if it is possible to cut, the waviness described later increases. Therefore, in conventional manual cutting, it is generally suitable for glass with a height of 5-20mm and a width of 5-20mm. In contrast, in the cutting method using the ultrasonic cutting machine of the present invention, even when the cutting difficulty is 2 to 5, cutting can be performed with a small waviness. In addition, the glass can be easily cut by expanding the ultrasonic output of the cutting blade, that is, the amplitude of the reciprocating motion in the direction of cutting the glass.

[Glass with cut surface] Next, the glass material cut by the cutting method of the present invention will be described. The glass material has the characteristics of small waviness, small surface roughness Ra, and, depending on the situation, a cut surface with a high boron content on the surface. It should be noted that in this specification, a cut surface refers to a surface newly generated by cutting.

(Waviness of cut surface) The cut surface of the glass obtained by the glass cutting method of the present invention has a feature of low waviness. The waviness of the fractured surface refers to the flatness of the fractured surface, and is defined by the numerical value obtained by the following measurement method. The method of measuring the waviness of the cut surface will be described with reference to FIG. 6. Regarding the waviness, a vertical plane at an angle of 90° with respect to the plane is pressed against the cut surface, and the size of the gap D between the vertical plane and the above-mentioned cut surface is measured N times (assuming N=5 in the embodiment of the present invention), The gap D per thickness T of the glass, that is, the average value of D/T, was measured as the waviness. If the waviness is small, the angle formed by the bottom surface of the glass and the cut surface is close to 90°. As shown in FIG. 6, in the case of prismatic glass, it is close to a rectangular parallelepiped. Therefore, the variation between individual glass materials is also reduced, the polishing amount can be suppressed in the subsequent polishing step, etc., and the amount of glass chips can be reduced. When the cutting difficulty is 2 to 5 (for example, when the cutting difficulty is 3), the waviness of the cut surface is preferably 100 or less, more preferably 80 or less, and further preferably 60 or less. In the case of the cutting method using the conventional manual cutting, since the cut portion that becomes the starting point of the cutting is a point, the heat spreads in a circular shape with the point as the center. In this case, the waviness of the cut surface is large, and when the cutting difficulty is 2 to 5 (for example, when the cutting difficulty is 3), the waviness exceeds 100. In contrast to this, in the present invention, since the incision is made linearly while applying ultrasonic waves, the incision portion that becomes the starting point of the cutting is linear. In this case, since the thermal diffusion is wide, the waviness of the cut surface is small.

(Surface roughness of cut surface Ra) Compared with the cut surface obtained by physical cutting, the cut surface obtained according to the present invention has a smaller surface roughness Ra. If the surface roughness Ra is small, it is easy to understand the inside of the glass even without polishing, and it is possible to visually observe impurities and the like. In the cutting by a normal glass cutter, the surface roughness Ra is large, and it becomes a rubbing glass shape, and the inside of the glass cannot be visually observed. The Ra of at least one cut surface of the glass material of the present invention is preferably 500 nm or less, more preferably 400 nm or less, still more preferably 300 nm or less, still more preferably 200 nm or less, and still more preferably 100 or less, especially It is preferably 20 nm or less, for example, 5 nm or less.

(Glass component) The component of the glass material of the present invention is not particularly limited, and it can be applied to various glasses. For example, phosphate glass and/or borate glass and/or silicate glass can be mentioned. In particular, the present invention can be easily applied to materials with low bending strength and large coefficient of thermal expansion. As a standard of bending strength, in ordinary optical glass, when the standard is 150 (unit: Pa) or less or 120 or less, the strength of the glass that is easily applicable to the present invention is preferably 100 or less, more preferably 85 or less, and more It is preferably 75 or less, still more preferably 65 or less, and still more preferably 55 or less. Further, as a standard expansion coefficient, an average coefficient of linear expansion of 100 ~ 300 ℃, preferably 60 × 10 ^{- 7} (Unit: K ^{- 1)} or more, more preferably 80 × 10 ^{- 7} or more, further more best of 100 × 10 ^{- 7} or more, further preferably 120 × 10 ^{- 7} or more, further preferably 130 × 10 ^{- 7} or more, particularly preferably 140 × 10 ^{- 7} above. It should be noted that for the bending strength σ, the upper and lower surfaces are ground and the edges are chamfered with C0.2 (mm) (right-angled isosceles triangles with a side length of 0.2mm are removed) width 4×thickness 3×40 (mm) glass specimens (number of specimens, ten), the breaking load P(N) is measured according to the "three-point bending test method" stipulated in JIS R 1601:2008, which can be determined by σ=3PL/ (2w·t ² ) to calculate. Here, L is the distance between fulcrums (mm), w is the width (mm) of the sample, and t is the thickness (mm) of the sample. Obtained bending strength σ may be expressed in units of MPa, for example, may be used ^{1MPa = 1.01972 × 10 - 1 kgf} / mm 2, and in kgf / mm ² in terms of units appropriately. In addition, the average linear expansion coefficient α of 100℃~300℃ refers to the measurement method of the Japan Optical Glass Industry Association standard JOGIS08, using a glass round rod with a length of 20mm, a diameter of 5mm to a diameter of 4 ± 0.5mm, and a differential thermal expansion meter to 4 The sample is heated while rising at a constant rate of °C per minute, and the elongation rate of the sample with respect to the temperature is measured to obtain the result.

It should be noted that the flexural strength σ is mainly determined by the content of alkaline elements and the content of SiO ₂ in the glass, but is also affected by other elements. Specifically, the sum of the mass percentages of the elements (Li, Na, K, Rb, Cs, Mg, Ca, Sr, Ba, Bi) that reduce the bending strength σ is set to A (wherein, Li, Na, K, The total of Rb and Cs is 10 times), and the sum of the mass percentages of the elements (Si, B, P, Nb) that increase the bending strength σ is set to B, the larger the value of A/B, the greater the glass The easier it is to cut. When it is easy to cut, the value of A/B should be 0 or more, with 0.1 or more, 0.2 or more, 0.4 or more, 0.8 or more, 1.2 or more, 1.6 or more, 2.0 or more, 2.4 or more, 2.8 or more, 3.2 or more, 3.5 or more, 4.0 The above order is better. In addition, for A and B, the following formula (where W (X) represents the mass% of the element X contained in the glass, for example, W (Li) represents the mass% of the Li component). A=W[(Li)+W(Na)+W(K)+W(Rb)+W(Cs)]×10+W(Mg)+W(Ca)+W(Sr)+W(Ba) +W(Bi)] B=[W(Si)×10]+W(B)+W(P)+W(Nb)+W(La) In addition, the present invention can be used even if it is not a glass with a small bending strength σ Be applicable. Hard glass, that is, glass with an A/B value of 1.0 or less, or glass of 0.5 or less, 1 or less, or 0.0 can be cut by paying attention to the output of the cutting blade. For example, the A/B value of glass D is 0.0, but by expanding the ultrasonic output of the cutting blade, that is, the amplitude of the reciprocating motion in the direction of cutting the glass, the glass can be cut as shown in the examples.

(The element content rate and composition distribution of the cut surface) For example, when the glass contains a silicate skeleton, elements such as alkali ions are also eluted from the strong Si—O glass structure, and the content of alkali elements on the polished surface may decrease. In addition, when the glass contains boron, the boron on the surface of the glass is in a state capable of reacting with water and eluting, so the unprocessed free surface after the glass is manufactured (the so-called free surface refers to the surface in contact with the atmosphere when the glass is cured) Or, the boron content of the polished surface processed by polishing with water is low. Furthermore, when the glass contains halogen ions such as fluorine (chlorine, bromine, iodine, etc.), due to the exchange reaction between oxygen ions and halogen ions on the glass surface, the amount of halogen ions decreases, and the glass surface is exposed to the atmosphere. The component distribution on the glass surface may be different from the component distribution inside the sample. In contrast, the cut surface obtained by the present invention is a cut surface that cuts the inside of the glass (block-shaped glass structure) as the surface. In addition, since water is not used for cutting, the composition distribution of the entire glass is uniform. Therefore, the content of boron and/or alkali components and/or fluorine in the fractured surface of the glass of the present invention is higher than the content of these elements in the glass surface such as the free surface and the polished surface that are not contained in the glass material. High (calculated by atomic mass %). In more detail, the content of boron and/or alkali components and/or fluorine in the fractured surface in the glass material, and the content of these elements in the glass surface such as the free surface and the polished surface that are not contained in the above-mentioned surface In comparison, it is preferably 5% or more, more preferably 7% or more, and still more preferably 10% or more. It should be noted that these values are calculated by (content of boron and/or alkali component and/or fluorine in the fractured surface)/(content of these elements not included in the glass surface of the fractured surface). When the glass sample of the present invention is deformed by reheating, etc., pressurizing, etc., the glass on the surface of the sample is folded into the inside of the optical element to some extent, but at this time, the difference in the component distribution between the surface of the sample and the inside of the sample is small Therefore, the fine difference in refractive index between the surface and the inside of the sample is also small, so an optically homogeneous optical element can be obtained. This effect is remarkable when the lens is used in a higher performance optical system. [Example]

Example Hereinafter, the present invention will be further described with examples. It should be noted that the present invention is not limited to the examples.

[Ultrasonic cutting machine] As the ultrasonic cutting machine, the ultrasonic small cutting machine USW-334 manufactured by Honda Electronics Co., Ltd. was used. The material of the ultrasonic vibration blade is SKH51, and ultrasonic vibration with a frequency of 22 kHz and an amplitude of 5 to 30 μm is applied, and the following cutting is performed.

[Production based on cut glass material]

(Determination of optical glass characteristics) Using optical glass grade high-purity oxides, hydroxides, carbonates, nitrates, chlorides, fluorides, sulfates and other raw materials, weigh and mix the raw materials to obtain the glasses A~D and tables with Table 1 The glass (glass E) of the component described in the section of the section of the section 4 was used as a blending raw material. Next, put each blended raw material into a platinum crucible and heat it to the specified temperature as described above. In a nitrogen atmosphere, after melting for two or four hours from the start of melting, stirring for homogenization, and then standing for clarification. , Into the mold. After the glass is cured, it is then transferred to an electric furnace heated to a temperature close to the slow cooling point of the glass, and slowly cooled to room temperature. In this way, a block made of the glass of each example was produced. From each obtained glass block, glass of a predetermined size required for the measurement was cut out, polished, and characteristics were evaluated. Regarding glasses A to D, Table 1 and Table 2 show the components and characteristics, and Table 3 shows the results of the slicing. Regarding the glass E, Table 4 shows the components of the cut surface, the polished surface, and the free-form surface. It should be noted that there is no limitation on the amount of glass raw materials, but when reproducing the examples, depending on the specific gravity of the glass, it is also possible to use raw materials capable of forming glass of about 200g, 300g, 400g, and 500g to make samples for cutting. It is possible to cut glass whose volume as glass is larger than the size described in the examples for cutting.

(Example One) The glass A of 10mm (thickness)×10mm (width)×100mm (length) is made into a rectangular parallelepiped of 10mm (thickness)×10mm (width)×20mm (length after cutting) in a state where the ease of cutting is 0.50 Next, make the above-mentioned ultrasonic cutting machine contact the part that you want to cut, and after cutting into the incision with ultrasonic vibration, press the base material glass with your hand to generate tensile stress in the cut part of the glass material, and apply pressure to cut the glass. Obtain slice A1.

(Example 2) The length after cutting was changed to 15 mm, and in a state where the ease of cutting was 0.69, the glass A of 10 mm (thickness)×10 mm (width)×100 mm (length) was cut in the same manner as in Example 1, to obtain a slice A2.

(Example Three) The length after cutting was changed to 10 mm, and in a state where the ease of cutting was 1.25, glass A of 10 mm (thickness) × 10 mm (width) × 100 mm (length) was cut in the same manner as in Example 1, to obtain a slice A3.

(Embodiment Four) The thickness was changed to 20mm, the width was changed to 20mm (width), the length after cutting was changed to 20mm, and the cutting difficulty was 3.00, the same as in Example 1, 20mm (thickness) × 20mm (width) was cut. ×100mm (length) of glass A, to obtain a slice A4.

(Example 5) Change the thickness to 20mm, change the width to 38mm (width), and change the length after cutting to 38mm. With the cutting difficulty of 4.66, cut 20mm (thickness) x 38mm (width) in the same way as in Example 1. ×100mm (length) of glass A, to obtain a slice A5.

(Example 6) Except having changed glass A to glass B, it cut|disconnected similarly to Example 1, and obtained the slice B1.

(Example 7) Except having changed glass A to glass B, it cut|disconnected like Example 3, and obtained the slice B2.

(Embodiment 8) The length after cutting was changed to 7.5 mm, and in a state where the cutting difficulty was 2.03, the cutting was performed in the same manner as in Example 7 to obtain a slice B3.

(Example 9) Except having changed glass A to glass C, it cut|disconnected similarly to Example 1, and obtained the slice C1.

(Embodiment 10) Except that glass A was changed to glass C, it was cut in the same manner as in Example 2 to obtain a slice C2.

(Embodiment 11) Except having changed glass A to glass C, it cut|disconnected like Example 3, and obtained the slice C3.

(Example 12) The thickness was changed to 15mm, the width was changed to 15mm, the length after cutting was changed to 15mm, and the cutting difficulty was 2.06, 15mm (thickness) × 15mm (width) × 100mm was cut in the same manner as in Example 9 ( Length) of glass C to obtain slice C4.

(Example 13) The length after cutting was changed to 12.5 mm, and in a state where the cutting difficulty was 2.72, it was cut in the same manner as in Example 12 to obtain a slice C5.

(Embodiment Fourteen) The length after cutting was changed to 10 mm, and in a state where the cutting difficulty was 3.94, it was cut in the same manner as in Example 12 to obtain a slice C6.

(Embodiment 15) Except having changed glass A to glass D, it cut|disconnected like Example 3, and obtained the slice D1.

[Measurement of waviness of cut surface] Regarding the waviness, the vertical plane at an angle of 90° with respect to the plane was pressed against the sectioned section cut in the embodiment, the size of the gap D between the vertical plane and the above sectioned plane was measured five times, and the thickness T of the glass was measured five times. The gap D, that is, the average value of D/T, is measured as the waviness. As a measurement device for waviness, an L-shaped bracket (manufactured by Sigma Koki Co., Ltd.) was used (see FIG. 6). The results are shown in Figure 7. For samples with low easiness of cutting, the waviness of manual cutting is the same as that of the samples obtained by the present invention. On the other hand, even if the easiness of cutting of the present invention is 0.30 or more, 0.50 or more, 0.70 or more, 0.90 or more, 1.00 or more, 1.25 Above, 1.50 or above, 1.75 or above, or 2.00 or above, for example, even if it is 1.00 to 5.00, the waviness is smaller than that of manual cutting and can be cut to a desired size.

[表2]

[表3]

[Table 1]

[Table 2]

[table 3]

[Measurement of surface roughness Ra of cut surface] In the measurement of the surface roughness Ra of the glass, a NewView 7300 manufactured by ZYGO was used as a scanning white interferometer device. The measuring range is 0.36mm×0.27mm. The roughness Ra when glass A was cut into 10 mm×10 mm×10 mm was 14.98 nm (the glass material of Example 3 was used). On the other hand, as a reference example of the glass surface not included in the cut surface described in the present invention, when glass A is cut into 10mm×10mm×10mm with a glass cutter (with a round blade embedded with diamond abrasive grains) , Since the glass surface is in the state of rubbing the glass, it is impossible to observe the internal situation. In addition, Ra is 1000 μm, which is a value larger than the fracture surface Ra. Furthermore, as a reference example, when the glass A was cut into 10 mm×10 mm×10 mm, and the cut surface was polished, the Ra of the polished surface was 1.19.

[Determination of elemental composition on the surface] X-ray photoelectron spectroscopy (X-Surface Roughness Ray Photoelectron Spectroscopy, abbreviation: XPS) was used to measure the elemental composition of the surface of glass E. As an X-ray photoelectron spectrometer, K-Alpha+ manufactured by Thermo Fisher Scientific was used. For the cut surface cut by the ultrasonic cutting machine described in this specification and the non-cut surface (polished surface and free surface) described in this specification, the elemental composition (atomic% unit) of the surface was measured. The results are shown in Table 4. On the glass surface, compared with the inside of the glass, there is a tendency for the content of carbon and oxygen to increase by forming carbonate through the reaction with carbon dioxide and water in the air. In addition, there are ions such as boron and alkali elements that are easily eluted into the water. However, despite this, it can be seen that the cut surface obtained in the present invention has a high content of boron and alkali elements relative to the polished surface and the free surface, and has a component ratio closer to the inside of the glass.

[Table 4]

G: Glass G1, G2: The part you want to cut 1: Ultrasonic cutting machine 11: Ultrasonic vibration blade 11a: Arrow indicating the vibration direction of the ultrasonic vibrating blade 2: Manual cutting 21: Disc blade 22: Motor 3, 4: heating part D: The gap distance between the cut surface and the almost surface T: thickness W: width L: length

Fig. 1 is a perspective view showing a state in which an incision is made in glass G using an ultrasonic cutting machine used in the present invention. Fig. 2 is a schematic diagram showing the heat distribution when the ultrasonic cutting machine of the present invention is brought into contact. Fig. 3 is a perspective view showing a state when an incision is made in a conventional cutting method. Fig. 4 is a schematic diagram showing the heat distribution when the cut is made in the conventional cutting method. Fig. 5 is a diagram showing a formula for calculating the ease of cutting N of a glass material and the meaning of variables in the formula. Fig. 6 is a side view when the waviness X of a glass material having a cut surface is measured. Fig. 7 is a graph showing the relationship between the cutting difficulty N and the waviness X.

G: Glass

G1: The part you want to cut

1: Ultrasonic cutting machine

11: Ultrasonic vibration blade

11a: Arrow indicating the vibration direction of the ultrasonic vibrating blade

Claims (10)

A method for cutting glass, comprising: contacting the ultrasonic vibrating blade of an ultrasonic cutting machine with the part of the glass to be cut; making the ultrasonic vibrating blade ultrasonically vibrate; and while using the ultrasonic wave The step of cutting into the incision while generating frictional heat on the glass in a linear shape. The glass cutting method according to claim 1, wherein the frequency of the ultrasonic vibration is 5 kHz or more and 50 kHz or less. The glass cutting method according to claim 1 or 2, wherein the amplitude of the ultrasonic vibration is 5 μm or more and 40 μm or less. A glass material characterized by being obtained by the cutting method as described in claim 1. The glass material according to claim 4, wherein the waviness of the cut surface of the glass material is 100 or less. A method for manufacturing a glass material, comprising: contacting the ultrasonic vibration blade of an ultrasonic cutting machine with a part of the glass to be cut; causing the ultrasonic vibration blade to ultrasonically vibrate; and using the ultrasonic wave The step of cutting the glass into the incision while generating frictional heat in a linear shape. A glass material characterized by having at least a surface with a waviness of 100 or less and a surface roughness Ra of 500 μm or less. The glass material according to claim 7, wherein the surface is a cut surface. The glass material according to claim 7 or 8, wherein the content of boron and/or alkali components and/or fluorine in the surface is higher than that of these elements in the glass material not contained in the glass surface of the surface The content rate is high. The glass material according to claim 7 or 8, wherein the content of boron and/or alkali components and/or fluorine in the surface is higher than that of these elements in the glass material not contained in the glass surface of the surface The content rate is higher than 5%.

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