KR100916611B1 - Apparatus for cutting having it and cutting method - Google Patents

Abstract

According to the present invention, a scribing method, a scribing device, and a cutting method for cutting a brittle material such as glass or ceramic to be stably and reliably and improving the life of the scribing device can be cut. Apparatus and cutting method, characterized in that the ultrasonic wave is used to modulate the frequency of the ultrasonic wave, causing a vertical crack mainly in the cutting material to perform a precise cutting smooth in the fracture surface, the state or the exterior of the cutting material Even if the environment changes, frequency modulation can optimize the scribing process of the material to be cut, enabling smooth processing, extending the frequency range of use with fast response time, improving the reliability and life of the device, and improving the power used. By not varying to provide stable power over the entire surface of the material to be cut, especially Even if the cutting material is enlarged, it generates uniform cracks, prevents overheating of the ultrasonic vibrator and improves cooling ability, thereby suppressing the occurrence of transverse waves and improving the cracking pattern. The process time can be shortened and the separate equipment and process can be omitted accordingly.

Ultrasound, frequency modulation, scribing

Description

Cutting device and cutting method {Apparatus for cutting having it and cutting method}

The present invention relates to a scribing method, a scribing device, a cutting device including the same, and a cutting method, and more particularly, to stably and reliably cut when cutting brittle materials such as glass or ceramics to be processed. The present invention relates to a scribing method, a scribing device, a cutting device including the same, and a cutting method for improving the service life of the scribing device.

In general, a scribing device refers to a device for forming a continuous groove along a cut line on a ceramic substrate such as a glass plate, a silicon substrate, or alumina, and the scribed cutting object is subjected to a stress or an impact Simply cut. As a method for scribing such brittle materials, a dicing method using a blade such as a diamond high-speed grinding wheel, a scribing method through laser irradiation, or a scribing method using ultrasonic waves is used. However, when scribing using a diamond high-speed grinding wheel, the cost is excessively consumed and it takes a long time. In addition, in the method of laser irradiation, the efficiency of the scribing of the glass material decreases due to diffuse reflection on the glass surface, or an unwanted portion is scribed, which is not suitable for applying to a material such as ceramic. There is a problem.

For this reason, in recent years, a scribing method has been used in which an ultrasonic vibration is added to a diamond wheel to generate cracks on the surface of brittle material such as glass. In the scribing method using the ultrasonic wave, when the ultrasonic oscillator oscillates power having a specific frequency, for example, a frequency of 27 kHz and supplies it to the ultrasonic vibrator, the piezoelectric vibrator converts electrical energy into physical energy and is connected thereto. The vibrating diamond wheel vibrates, and the added diamond wheel performs a scribing process while moving the surface of the material to be cut to cause longitudinal cracking, or vertical cracking, below the surface of the material to be cut. After the end is cut by performing a separate breaking process.

However, in the conventional scribing method using ultrasonic waves, when no matching is made when the oscillation frequency is supplied from the ultrasonic oscillator to the ultrasonic vibrator, that is, when resonance is not performed smoothly, a carrier wave is generated and the amplitude applied to the diamond wheel is reduced. Changes occur so that there is no constant cracking of the material to be cut during the scribing process, which reduces the reliability of the final product and the scribing device itself. In addition, in the state in which resonance is not smoothly performed, transverse waves are generated in the ultrasonic vibrator in addition to the carrier generation as described above, so that undesired cracks, ie, transverse propagation of the cracks due to the transverse waves, cause the cutting surface to be smooth in a subsequent breaking process. Or by-products such as debris are generated and a separate process for cleaning them is required. In addition, even if the oscillation frequency achieves almost perfect resonance before the start of the scribing process, the condition of the frequency varies according to the surface condition, the strength, and the degree of bending of the material to be cut. There is a need. If the carrier is ignored and continues to be used while the oscillation frequency of the ultrasonic oscillator is maintained, it affects the lifespan of the ultrasonic oscillator and thus not only adversely affects the reliability of the apparatus but also the productivity of the material to be processed. This problem is particularly noticeable when scribing glass for an enlarged liquid crystal display device, which requires a long distance and a long scribing process.

In order to reduce the generation of carrier waves by reflecting these carriers to the ultrasonic oscillator, the carrier current is measured and converted into a voltage, and when the voltage level rises above a certain level, the output is reduced and supplied to the ultrasonic vibrator. However, since this method reduces the output energy, the scribing process conditions are changed so that a uniform crack is not generated over the entire surface of the cutting material. In addition, when the frequency of the ultrasonic oscillator is artificially changed in this manner, the response time is slow, and since the operating range of the frequency is narrow, accurate serial resonance has been difficult. In particular, when exceeding the range in the operating frequency range, there is a problem that it is difficult to perform a smooth process, such as overheating of the ultrasonic vibrator and stopping the process by the power cut by the overcurrent. When overheating occurs in the ultrasonic vibrator, the matching is not performed by the frequency oscillated in the ultrasonic oscillator, so that a transverse wave is generated, and the transverse wave induces the transverse crack propagation as described above, and the subsequent breaking process is performed. It makes it difficult.

The present invention has been made in order to solve the above problems, it is possible to perform a precise cutting of the fracture surface smoothly by causing a vertical crack mainly in the cutting material, even if the state or the external environment of the cutting material is changed by frequency modulation An object of the present invention is to provide a scribing method and a scribing apparatus for optimizing a scribing process of a material to be made to proceed smoothly.

It is also an object of the present invention to provide a scribing method and scribing apparatus which can have a fast response time, expand the use frequency range, and improve the reliability and life of the apparatus.

The present invention provides a scribing method and a scribing apparatus for supplying a stable power by not varying the power used to generate a uniform crack over the entire surface of the material to be cut, in particular even when the size of the material to be cut is increased. For the purpose of

In addition, an object of the present invention is to provide a scribing method and scribing apparatus to prevent overheating of the ultrasonic vibrator and to improve the cooling ability to suppress the generation of shear waves and to improve the crack appearance.

In addition, an object of the present invention is to provide a cutting device and a cutting method for shortening the process time by performing the cutting process immediately after the scribing process is completed and no separate equipment and processes are required.

The scribing method according to the present invention is a scribing method using ultrasonic waves, and characterized in that the frequency of the ultrasonic waves is modulated.

Here, the frequency modulation is characterized in that for modulating the first frequency oscillated by the ultrasonic oscillator, the second frequency which is a carrier wave for the first frequency transmitted from the ultrasonic oscillator, or the first frequency transmitted from the ultrasonic oscillator And measuring and calculating second frequencies as carriers with respect to the first frequency, and reflecting them back to the ultrasonic oscillator.

Alternatively, the frequency modulation may include transmitting power having a first frequency from the ultrasonic oscillator to the ultrasonic vibrator; Conveying power having a second frequency in the ultrasonic vibration unit; Measuring and calculating the first frequency and the second frequency and returning the result to the ultrasonic oscillator; And transmitting power having the second frequency from the ultrasonic oscillator to the ultrasonic vibrator.

The frequency modulation outputs power having a first frequency from the ultrasonic oscillator to the ultrasonic vibrator, calculates a difference between the first frequency and a second frequency carried by the ultrasonic vibrator, and feeds it back to the ultrasonic oscillator. And outputting power having the third frequency corrected by the difference between the first frequency and the second frequency to the ultrasonic vibration unit.

Here, the third frequency is characterized in that the same as the second frequency.

In this case, the first frequency may be 20 to 30 Hz, and the first frequency may have a tolerance range of ± 1500 Hz.

The scribing apparatus according to the present invention is a scribing apparatus using ultrasonic waves, and characterized in that it comprises means for modulating the frequency of the ultrasonic waves.

Here, the means for modulating the frequency of the ultrasonic wave may be means for modulating the first frequency oscillated by the ultrasonic oscillator to a second frequency which is a carrier wave for the first frequency transmitted by the ultrasonic oscillator.

In this case, the scribing apparatus includes an ultrasonic oscillator for generating a supply power having a variable frequency; An ultrasonic vibrator for receiving power from the ultrasonic oscillator; And a cutting unit driven by the power supplied to the ultrasonic vibration unit, wherein the power supply may have a frequency of 20 to 30 Hz, and the frequency of the power supply may have a tolerance range of ± 1500 Hz.

In addition, the fluid supply unit for supplying a fluid to the ultrasonic vibration unit may include a guide unit for communicating the fluid supplied to the ultrasonic vibration unit.

Preferably, at least one or more of the ultrasonic oscillator or the ultrasonic vibrator includes means for filtering the transverse wave of the frequency.

In addition, the frequency modulation means includes an automatic frequency control unit for measuring the frequency of the power supply and the frequency of the carrier power, calculates the difference and regressively reflects the frequency of the power supply.

Cutting device according to the present invention, the mounting table is mounted to the cutting material; A scribing apparatus installed at an upper portion of the seating table to scribe a cutting material; And a fluid injector for injecting fluid toward the scribed cut material.

Here, the scribing apparatus is a scribing apparatus using ultrasonic waves, characterized in that it comprises a means for modulating the ultrasonic waves.

Cutting method according to the invention, the step of mounting the cutting material; Scribing the cut material by using a scribing device using ultrasonic waves and including means for modulating the ultrasonic waves; And cutting by spraying a fluid on the scribed cutting material.

Here, the scribing may include using a scribing apparatus that uses ultrasonic waves and includes means for modulating the ultrasonic waves.

Preferably, the fluid is sprayed on the scribed portion of the cutting material.

The frequency modulation scribing method according to the present invention as described above can mainly perform a vertical crack in the material to be cut to perform a precise cut smooth surface.

In addition, the present invention can smoothly proceed by optimizing the scribing process of the cutting material by frequency modulation even if the state of the cutting material or the external environment changes.

In addition, with the scribing method and scribing apparatus according to the present invention, it is possible to increase the frequency range of use with a quick response time and to improve the reliability and life of the apparatus.

Further, by not varying the power used, it is possible to supply stable power and to generate uniform cracks over the entire surface of the cut material, especially when the cut material becomes large.

In addition, it is possible to prevent overheating of the ultrasonic vibrator and to improve the cooling capacity, thereby suppressing the occurrence of shear waves and improving the crack appearance.

Furthermore, by the cutting device and the cutting method according to the present invention, by performing the cutting process immediately after the end of the scribing process, it is possible to shorten the process time and to omit the separate equipment and process accordingly.

Hereinafter, a scribing method, a scribing apparatus, a cutting apparatus including the same, and a cutting method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. Like reference numerals in the drawings refer to like elements.

1 is a perspective view of a scribing apparatus according to an embodiment of the present invention, Figures 2a and 2b is a conceptual diagram of a scribing apparatus according to an embodiment of the present invention, Figures 3a and 3b is an embodiment of the present invention Is a block diagram of a scribing method according to the present invention. 3A and 3B, which illustrate block diagrams of a scribing method according to an embodiment of the present invention, illustrate a scribing method in a scribing apparatus corresponding to FIGS. 2A and 2B, respectively.

1 and 2A, the scribing apparatus 10 according to the embodiment of the present invention includes an ultrasonic oscillator 100 for generating a supply power having a variable frequency; An ultrasonic vibrator 200 which receives a supply power from the ultrasonic oscillator 100; Cutting unit 400 is driven by the power supplied to the ultrasonic vibrator (200); And an automatic frequency controller 300 for measuring the frequency of the power supply and the frequency of the carrier power, calculating the difference, and feeding back the ultrasonic oscillator 100.

The ultrasonic oscillator 100 is configured to supply power to the ultrasonic vibrator 200 at a specific frequency. At this time, the specific frequency is an inaudible frequency of 20 Hz or more and 30 Hz or less, and the ultrasonic oscillator 100 in the embodiment of the present invention oscillates an inaudible frequency of 27 Hz. The ultrasonic oscillator 100 outputs power having a frequency of 27 kHz to the ultrasonic vibrator 200 through the output unit 110, for example, 300 W of power, and the frequency of the output power is the first measurement unit 310. It is measured at. The frequency range oscillated by the ultrasonic oscillator 100 is preferably 20 to 30 Hz. If the frequency exceeds 30 kHz, excessive vibration may adversely affect the life and performance of the device 10. However, the frequency range used is not necessarily limited to the above range, and a wider range may be used due to other driving conditions or device improvements.

The ultrasonic vibrator 200 receives the power of the frequency 27 kHz, 300 W output from the ultrasonic oscillator 100 through the output unit 110, and includes a piezoelectric vibrator to convert electrical energy into physical energy. Physical energy is transmitted to the diamond wheel 410 via a cut 400 connected to the ultrasonic vibrator 200. As a result, a physical force having a frequency of 27 Hz is added to the diamond wheel 410.

The diamond wheel 410 is a rigid material and is configured to rotate in accordance with the movement of the scribing apparatus 10. The diamond wheel 410 forms a groove while pressing and rotating the surface of the cut material, and at the same time, generates a crack propagating downward from the groove. . In addition, the diamond wheel 410 is vibrated and pressurized by the frequency below the surface of the cutting material under the influence of the physical force of the frequency of the ultrasonic vibrator 200 as described above.

The automatic frequency control unit 300 measures the frequency returned from the first measuring instrument 310 and the ultrasonic vibrator 200 to the ultrasonic oscillator 100 to measure the output frequency transmitted from the ultrasonic oscillator 100 to the ultrasonic vibrator 200. It is connected to the second measuring instrument 320 to measure, and also to transmit a control signal to the ultrasonic oscillator 100. Here, the first instrument 310 for measuring the output frequency may be configured separately, or may be integrally formed with the output terminal of the output unit 110 of the ultrasonic oscillator 100. The second instrument 320 for measuring the carrier frequency may also be separately configured, or may be integrally formed with the carrier of the carrier 120. Of course, the automatic frequency control unit 300 may also be configured integrally with the ultrasonic oscillator 100. The automatic frequency control unit 300 is configured to compare the output frequency measured by the first instrument 310 and the carrier frequency measured by the second instrument 320 to calculate the difference value.

Since the first measuring unit 310 may be integrated with the output terminal of the ultrasonic oscillator 100 output unit 110, the automatic frequency adjusting unit 300, in fact, as shown in Figure 2b, ultrasonic wave from the ultrasonic vibrator 200 It may have only the configuration of the second measuring instrument 320 for measuring the frequency conveyed to the oscillator 100. In this case, the automatic frequency control unit 300 may be provided as some components of the ultrasonic oscillator 100.

Here, the output unit 110 may be connected to the ultrasonic oscillator 100 and the ultrasonic vibrator 200, the carrier 120 may be connected to the ultrasonic vibrator 200 and the automatic frequency control unit 300, automatic frequency adjustment It may be branched to the unit 300 and the ultrasonic oscillator 100. When the ultrasonic oscillator 100 and the ultrasonic vibrator 200 are connected to the cathode and the anode, when the output unit 110 becomes a cathode, the carrier unit 120 becomes an anode and the output unit 110 becomes an anode. The carrier 120 may be a cathode.

Hereinafter, the operation of the scribing apparatus 10 according to the embodiment of the present invention will be described.

First, the ultrasonic oscillator 100 oscillates power at a frequency of 27 kHz and 300 W, and the oscillated power is transmitted to the ultrasonic vibrator 200 through the output unit 110. At this time, the output unit 110 measures the frequency of the power output through the first instrument 310.

The power delivered to the ultrasonic vibrator 200 is converted into physical energy, which is added to the diamond wheel 410 of the cut 400. The physical force of 27 kHz frequency added to the diamond wheel 410 acts on the diamond wheel 410 to generate 27 kHz vibration when scribing the cut material, and scribing by the vibration generated in this way At the same time, the diamond wheel 410 is rotated while vibrating pressure under the cut surface.

At this time, the generated crack is preferably a crack (C ₁ ) in the same direction as the pressing direction of the diamond wheel 410 to the cutting material 900, as shown in FIG. In order to generate the crack C ₁ , the vibration added to the diamond wheel 410 of the cutting part 400 is preferably added only to the longitudinal wave. If the oscillation comprising a transverse wave component, and the blood cut material 900 side destined crack direction (C ₂₎ is generated, as shown Figure 4b when attached to the diamond wheel 410, these cracks (C ₂₎ switch because of the Cry Further process to cause fine defects in the subsequent breaking process of cutting the frozen cutting material 900, or to separate the fine fragments generated at the time of break or require a separate treatment process to roughen the cutting surface is roughened need. In addition, since the crack C ₂ makes the vertical depth of the crack shallow with respect to the thickness of the cutting material 900, the cutting material 900 may not be cut during the breaking process, and thus the process yield and Productivity may be lowered. Therefore, a means for filtering the transverse wave is required for frequencies having a longitudinal wave and a transverse wave, and the filtering means may be provided with either or both of the ultrasonic oscillator 100 or the ultrasonic vibrator 200, and the output unit 110 may be provided. It may be provided in.

If the surface state of the material to be cut, such as surface curvature, flatness or surface strength is varied, the frequency of 27 kHz may be conveyed with a predetermined deviation, and the conveyed power is conveyed to the conveying unit 120. do. In this case, the conveyed power is conveyed to the automatic frequency adjusting unit 300 or the ultrasonic oscillator 100 and the automatic frequency adjusting unit 300, and the conveying unit 120 carries the frequency of the power conveyed through the second measuring unit 320. Is measured.

The output frequency F ₁ measured through the first instrument 310 and the carrier frequency F ₂ measured through the second instrument 320 are input to the automatic frequency controller 300 and the automatic frequency controller At 300, the difference between the output frequency F ₁ and the carrier frequency F ₂ is calculated (F ₁ -F ₂ = C). The difference value C between the output frequency F ₁ and the carrier frequency F ₂ may be adjusted to be output by being reflected by the ultrasonic oscillator 100.

If the difference C between the output frequency F ₁ and the carrier frequency F ₂ is not substantially zero, for example, the output frequency F ₁ measured by the first instrument 310 is 27 kHz and the second instrument If the carrier frequency F ₂ measured at 320 is 26 kHz, the difference value C becomes 1 kHz and this information is reflected on the ultrasonic oscillator 100 so that the frequency output thereafter may be adjusted to 26 kHz. have. This frequency adjustment is made until the difference C between the output frequency F ₁ and the carrier frequency F ₂ becomes almost zero, and if the difference C is zero, the output frequency F ₁ . Since the matching of the carrier frequency F ₂ is made, no further frequency adjustment is necessary. Therefore, if the output frequency F ₁ is 27 kHz and the carrier frequency F ₂ is 27 kHz, the difference value C becomes 0, so that the frequency is not adjusted.

The automatic frequency control unit 300 measures only the carrier frequency F ₂ conveyed from the ultrasonic vibrator 200 to the ultrasonic oscillator 100, and outputs a frequency corresponding to the carrier frequency F ₂ in the ultrasonic oscillator 100. You can also output (F ₁ ).

That is, as shown in FIG. 3B, after oscillating and outputting an arbitrary output frequency F ₁ , the carrier frequency F ₂ to be conveyed is measured to output the output frequency F ₁ corresponding to the carrier frequency F ₂ . You can also output

Unlike the conventional method of measuring the current and converting the voltage into a voltage and then adjusting the output power when the magnitude of the voltage exceeds the allowable value, the frequency modulation and the frequency being returned are measured in real time. By directly reflecting the difference to the ultrasonic oscillator 100, the operation time is much shorter than the conventional method, it is possible to further shorten the response time of the ultrasonic oscillator 100 to the carrier power, due to the shortened response time It can respond quickly to changes in the surface state of the cutting material.

Table 1 below examines the allowable frequency range to ensure a stable process in the prior art and examples when having an initial output frequency of 27 kHz.

Conventional example Example Frequency range 27 ㎑ ± 100 ㎐ 27 ㎑ ± 1500 ㎐

In the conventional example, when the frequency exceeds ± 100 kHz based on the initial output frequency of 27 kHz, it becomes difficult to perform a smooth process such as overheating of the ultrasonic vibrator and stopping the process by cutting off the power due to overcurrent. In particular, when overheating occurs in the ultrasonic vibrator, matching is not performed due to the frequency oscillated in the ultrasonic oscillator, so that a transverse wave is generated. Such transverse waves induce transverse crack propagation and make subsequent fracture processes difficult. .

On the contrary, in the embodiment, the scribing process could be performed without difficulty even if the frequency was varied up to ± 1500 kHz with respect to the initial output frequency of 27 kHz. That is, in the embodiment, the allowable frequency range is ± 1500 kHz based on the initial output frequency of 27 kHz, and thus the allowable frequency range is improved by about 15 times based on the initial output frequency of 27 kHz. In contrast to the conventional example, in which the response characteristic of the frequency is relatively slow using the power variable method through the current measurement, in the embodiment of the present invention, the frequency modulation method uses the frequency modulation method so that the response to the frequency change is relatively quick and the allowable frequency is reduced. It is possible to extend the scope of. This wider allowable frequency range ensures a stable process in the scribing process and can further improve the reliability of the scribing device and the scribed material to be processed using the device. Furthermore, in the embodiment of the present invention, unlike the conventional method of using the feedback method of varying the output power, it is possible to supply stable power by varying only the output frequency, so that the scribing process is performed under stable conditions. In the creeping process, the cracks can be uniformly formed on the surface of the material to be cut.

5 is a conceptual diagram of a scribing apparatus according to another embodiment of the present invention.

The scribing apparatus 10 according to another embodiment of the present invention is further provided with a cooling unit 500, the cooling unit 500 is a fluid supply unit 510 and the ultrasonic supply of a fluid to the ultrasonic vibration unit 200 and ultrasonic It includes a guide unit 520 for communicating the fluid supplied to the vibrator 200.

In the scribing apparatus using conventional ultrasonic waves, when the series resonance is not properly performed, that is, when the output frequency and the carrier frequency do not coincide, the output energy is almost not consumed in the ultrasonic vibrator 200 and some heat or shear wave It may also act as a. In this case, the scribing process is different from the initial state, the crack of the cut material being scribed is unevenly generated, the generation of carrier wave increases when the overheating of the ultrasonic vibrator 200 occurs, and the power cutoff due to the overcurrent occurs. The process must be stopped. In addition, the occurrence of undesired cracks (C ₂ ), such as in Figure 4b due to the shear wave causes a decrease in the productivity and quality of the product.

In order to solve the heating problem caused by the remaining energy due to the partial consumption of the output energy supplied to the ultrasonic vibrator 200, as shown in FIG. 5, the cooling unit 500 may be provided. FIG. 5 has a form in which the cooling unit 500 is further provided in the scribing apparatus 10 of FIGS. 1 and 2A.

The cooling unit 500 is an air jet port 510 for injecting air as a cooling means toward the ultrasonic vibrator 200 on the ultrasonic vibrator 200 and the air jetted toward the ultrasonic vibrator 200 from the air jet port 510. Includes a guide 520 to guide the cutting unit 400 connected to the ultrasonic vibrator 200.

The air injection hole 510 is disposed above the ultrasonic vibrator 200 and is configured to inject air onto the ultrasonic vibrator 200, and the air used may be conventional compressed air. Of course, other fluids may also be used in addition to air as the cooling means, and the fluid as the cooling means may be determined in consideration of the required process and cost / productivity. The air injected from the air injection port 510 to the ultrasonic vibrator 200 is distributed to the cutting unit 400 through the ultrasonic vibrator 200 and is discharged to the outside from the lower portion of the cutting unit 400. The guide 520 is configured from the air jet port 510 to the lower part of the cut part 400 via the ultrasonic vibrator 200 to distribute the injected air to the lower part of the cut part 400 without being dispersed.

The heat generation problem can be solved by the configuration of the cooling unit 500, and the cooling action prevents the occurrence of transverse waves caused by the lack of matching with extra energy. Crack propagation can be suppressed and vertical cracks deeper in the longitudinal direction can be generated. The occurrence of deep vertical cracks in the longitudinal direction may also advantageously work when the cutting material 900 is cut by a subsequent breaking process.

6 is a conceptual diagram of a cutting device according to an embodiment of the present invention, Figure 7 is a perspective view of a cutting device according to an embodiment of the present invention, Figure 8 is a flow chart of a cutting method according to an embodiment of the present invention.

First, referring to FIGS. 6 and 7, the cutting device 1 according to the embodiment of the present invention includes the above-described scribing device 10 and the seating part 600, and the seating part 600 is a bloody body. And a stage 610 on which the cutting material 900 is seated and injection means 650 for injecting a fluid in the direction of the cutting material 900 in the stage 610.

The seating part 600 has a stage 610 on which the cutting material 900 is mounted, and the stage 610 is a stage 610 for supplying fluid from the supply pipe 630 and the supply pipe 630 to supply fluid from the outside. At least one injection hole 650 for spraying in one direction of the, ie, the direction to be cut 900 mounted on the stage 610. The stage 610 may be configured on the support 620 to be placed in direct contact with the cutting material 900, and may be configured to be movable in the x-y-z direction for a scribing process. The stage 610 in FIG. 6 represents a stage 610 on which a glass substrate or the like is seated as the cut material, as shown in FIG. 7. In addition, a stage in which a wafer or the like may be seated as the cut material may also be used.

Apart from the movement of the stage 610 in the xyz direction, the scribing device 10 is also movable in the xyz direction through the plotter 690, and either the stage 610 or the scribing device 10 or Both may be movable.

The support 620 securely mounts the cutting device 1 on the ground and secures a moving space in the x-y-z direction of the stage 610. Alternatively, the moving space in the x-y-z direction of the scribing device 10 through the plotter 690 is secured. In order to stabilize the ground of the cutting device 1, the support 620 may be leveled by a fluid including air.

An injection hole 650 is formed in the stage 610 in communication with a supply pipe 630 for supplying a fluid from the outside, and the injection hole 650 is directly contacted with the stage 610 to be cut to be cut 900. Is configured to face the opposite side of the scribed surface. Preferably, the injection hole 650 is configured to correspond to the portion where the groove of the cutting material 900 to be scribed is formed.

The controller 700 provides an interface between the user and the cutting device 1, and controls the movement of the seating unit 600 in the xyz direction of the stage 610 or the movement of the scribing device 10 in the xyz direction. And an ultrasonic oscillator 100 (FIGS. 2A and 2B) of the scribing apparatus 10 or an automatic frequency control unit 700 (FIGS. 2A and 2B).

Hereinafter, a cutting method according to an embodiment of the present invention.

First, the cutting material 900 is mounted on the stage 610 of the seating portion 600 through the transfer means (not shown) (S1). A scribing process is performed on the seated cutting material 900 through the scribing apparatus 10 (S3). The scribed position of the cutting material 900 is drawn in advance to scribe the cutting material 900 while the stage 610 or the scribing device 10 moves.

When the scribing process is completed, the scribing apparatus 10 retreats on the surface of the cutting material 900, and the fluid supplied from the supply pipe 630 passes through the stage 610 and is cut at the injection hole 650. The ashes 900 are sprayed toward the rear surface of the surface on which the material 900 is placed, that is, the scribed surface of the cutting material 900 (S5). Herein, the fluid may be air, and other fluids such as nitrogen may be used in addition to air, and may be determined in consideration of required processes and productivity against cost. After the scribing process of the cutting material 900 is performed through the scribing apparatus 10 described above, the cutting material 900 having a crack is sprayed from the injection hole 650 of the seating part 600. The fluid receives a certain force, which contributes to the propagation of the crack. Therefore, the crack propagates in the thickness direction of the cut material 900 and the cut object 900 is cut according to the shape in which the crack is formed.

The cut piece of the cut material 900 to be cut is carried out from the cutting device 1 through a separate conveying means to terminate the cutting process (S7).

9 is a conceptual diagram showing the operation of the conventional example and the embodiment using the apparatus of FIG.

Conventional Example The scribing arranged near to cutting the rupture means (B) position to the propagation depth secluded crack (C _a) to cutting in the thickness direction of the cutting member 900 of the ice-step cracking (C _a) with After cutting, the cutting force 900 had to be cut by applying a separate force to the cutting material 900. However, in this embodiment, the propagation depth of the crack C _b is deeper than in the prior art so that the crack C _b can be propagated with less force. Accordingly, the cutting object 900 can be cut by sufficiently propagating the crack C _{b by} only spraying the fluid through the injection hole 650 of the seating part 600 as shown in FIG. 6.

Although the technical spirit of the present invention has been described in detail according to the above-described preferred embodiment, it should be noted that the above-described embodiment is for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical idea of the present invention.

1 is a perspective view of a scribing apparatus according to an embodiment of the present invention,

2A and 2B are conceptual views of a scribing apparatus according to an embodiment of the present invention;

3A and 3B are block diagrams of a scribing method according to an embodiment of the present invention;

4A and 4B are conceptual views showing cracking patterns in the generation of longitudinal waves, longitudinal waves, and transverse waves, respectively;

5 is a conceptual diagram of a scribing apparatus according to another embodiment of the present invention;

6 is a conceptual diagram of a cutting device according to an embodiment of the present invention;

7 is a perspective view of a cutting device according to an embodiment of the present invention,

8 is a flowchart of a cutting method according to an embodiment of the present invention;

9 is a conceptual diagram showing the operation of the conventional example and the embodiment using the apparatus of FIG.

<Explanation of symbols for the main parts of the drawings>

1 ... cutting device, 10 ... scribing device,

100 ... ultrasonic oscillator, 200 ... ultrasonic oscillator,

300 ... automatic frequency control, 900 ... cutting material.

Claims (5)

delete delete delete delete Mounting the cutting material; Scribing using ultrasonic waves oscillated by an ultrasonic wave oscillator, wherein the scribing comprises feeding back a carrier frequency of the ultrasonic waves to modulate the oscillation frequency; And, Injecting a fluid corresponding to at least a scribed portion of the cutting material, and propagating a crack formed in the scribing step only by spraying the fluid to cut the cutting material, In the scribing step, the oscillation frequency of the ultrasonic wave corresponds to the carrier frequency, Modulate the first frequency oscillated by the ultrasonic oscillator to a second frequency, which is a carrier wave for the first frequency transmitted by the ultrasonic oscillator, Transmitting power having a first frequency from the ultrasonic oscillator to an ultrasonic vibrator, conveying power having a second frequency from the ultrasonic vibrator, measuring and calculating the first frequency and the second frequency, and calculating the result. Returning to the ultrasonic oscillator and transmitting power having the second frequency from the ultrasonic oscillator to the ultrasonic oscillator; The ultrasonic oscillator outputs a power having a first frequency to the ultrasonic vibrator, calculates a difference between the first frequency and the second frequency conveyed by the ultrasonic vibrator and feeds it back to the ultrasonic oscillator to feed the ultrasonic oscillator to the ultrasonic vibrator. Outputting and modulating power having a third frequency corrected by a difference between a first frequency and the second frequency Cutting method characterized in that.

Images