TW202123536A - Electronic device - Google Patents

Abstract

An electronic device includes a flexible wireless communication chip. The flexible wireless communication chip includes a flexible substrate, a wireless communication circuit layer, a first insulating layer, a first electrode, a second electrode, a second insulating layer, a first pad and a second pad. The wireless communication circuit layer is disposed on the flexible substrate. The first insulating layer is disposed on the wireless communication circuit layer. The first electrode and the second electrode are disposed on the first insulating layer. The first electrode and the second electrode are separated from each other and are electrically connected to the wireless communication circuit layer, respectively. The second insulating layer is disposed on the first electrode and the second electrode. The first pad and the second pad are disposed on the second insulating layer, and are electrically connected to the first electrode and the second electrode, respectively. At least one of the first electrode and the second electrode has main parts separated from each other. Vertical projections of the main parts on the flexible substrate are disposed between a vertical projection of the first pad on the flexible substrate and a vertical projection of the second pad on the flexible substrate.

Description

Electronic device

The present invention relates to an electronic device.

Near Field Communication (NFC) technology allows two electronic devices equipped with induction coils to communicate wirelessly within a distance of a few centimeters. This non-contact data exchange mechanism has the advantages of high response speed, high security, convenience, etc. Therefore, in recent years, many products on the market have integrated near-field wireless communication functions, such as electronic ticket cards (for example: leisure card Etc.), electronic payment devices (for example: smart phones, smart watches, etc.), etc. Users only need to bring an object with a near-field wireless communication tag (NFC tag) close to a card reader (NFC reader) to complete identity verification and data exchange in a short time, providing users with a more convenient lifestyle.

A near-field wireless communication tag (NFC tag) includes an induction coil and a wireless communication chip electrically connected to the induction coil. The resonant frequency of the near-field wireless communication tag is determined by the capacitance of the induction coil and the built-in capacitance of the wireless communication chip. Generally speaking, the wireless communication chip is arranged in the area enclosed by the induction coil, and the wireless communication chip will shield the magnetic field lines of the induction coil, which affects the working efficiency of the induction coil. In addition, the capacitors built into the wireless communication chip make the area of the wireless communication chip larger.

The invention provides an electronic device with good performance.

An electronic device of the present invention includes a flexible wireless communication chip. The flexible wireless communication chip includes a flexible substrate, a wireless communication circuit layer, a first insulating layer, a first electrode, a second electrode, a second insulating layer, a first pad, and a second pad. The wireless communication circuit layer is arranged on the flexible substrate. The first insulating layer is arranged on the wireless communication circuit layer. The first electrode and the second electrode are arranged on the first insulating layer. The first electrode and the second electrode are separated from each other and each electrically connected to the wireless communication circuit layer. The second insulating layer is disposed on the first electrode and the second electrode. The first pad and the second pad are disposed on the second insulating layer, and are electrically connected to the first electrode and the second electrode, respectively. At least one of the first electrode and the second electrode has a plurality of main parts spaced apart from each other. The plurality of vertical projections of the main parts on the flexible substrate are arranged between the vertical projection of the first pad on the flexible substrate and the vertical projection of the second pad on the flexible substrate.

In an embodiment of the present invention, the above-mentioned electronic device further includes an induction coil, wherein the first end and the second end of the induction coil are electrically connected to the first pad and the second pad of the flexible wireless communication chip, respectively. The multiple windings of the induction coil overlap multiple main parts of the flexible wireless communication chip.

In an embodiment of the present invention, the above-mentioned plurality of main parts includes a plurality of first main parts of the first electrode and a plurality of second main parts of the second electrode, a plurality of first main parts and a plurality of second main parts. The parts are alternately arranged in the first direction, and each first main part and a corresponding second main part overlap the same winding of the induction coil.

In an embodiment of the present invention, the first electrode has a first alternating current signal, the second electrode has a second alternating current signal, the amplitude of the first alternating current signal is substantially the same as that of the second alternating current signal, and the first alternating current signal The signal is opposite in phase to the second AC signal.

In an embodiment of the present invention, the above-mentioned multiple main parts are arranged in the first direction, and one main part has multiple first sub-parts and multiple second sub-parts, and each first sub-part is in the first direction. The upward width is greater than the width of each second sub-portion in the first direction, the plurality of first sub-portions and the plurality of second sub-portions are alternately arranged in the second direction, and the first direction and the second direction are staggered.

In an embodiment of the present invention, the above-mentioned second sub-part has a break.

In an embodiment of the present invention, the above-mentioned multiple main portions include multiple first main portions of the first electrode and multiple second main portions of the second electrode, and multiple second main portions and multiple first main portions. The main parts are arranged sequentially in the first direction.

In an embodiment of the present invention, the above-mentioned plurality of main parts includes a plurality of first main parts of the first electrode and a plurality of second main parts of the second electrode, and the plurality of first main parts are arranged in the first direction , A plurality of second main parts are arranged in a first direction, and each first main part and a corresponding second main part are arranged in a second direction, wherein the first direction and the second direction are staggered.

In an embodiment of the present invention, the above-mentioned multiple main portions include multiple first main portions of the first electrode and multiple second main portions of the second electrode, and multiple first main portions and multiple second main portions The main parts are alternately arranged in the first direction.

In an embodiment of the present invention, the above-mentioned main portion includes a plurality of first main portions of the first electrode, the first electrode further has a first extension portion extending in a first direction, and the plurality of first main portions are in the first direction. Are arranged in the direction and connected with the first extension part, the second electrode has a second extension part, and a plurality of first main parts are arranged between the first extension part and the second extension part.

In an embodiment of the present invention, the above-mentioned electronic device further includes an induction coil, wherein the first end and the second end of the induction coil are electrically connected to the first pad and the second pad of the flexible wireless communication chip, respectively. The multiple windings of the induction coil overlap the multiple first main parts of the first electrode of the flexible wireless communication chip, and the multiple windings of the induction coil span the first electrode and the first electrode of the flexible wireless communication chip. The first extension portion and the second extension portion of the second electrode.

Reference will now be made in detail to the exemplary embodiments of the present invention, and examples of the exemplary embodiments are illustrated in the accompanying drawings. Whenever possible, the same component symbols are used in the drawings and descriptions to indicate the same or similar parts.

It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements can also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connected" can refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that there are other elements between two elements.

As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account the measurement in question and the The specific amount of measurement-related error (ie, the limitation of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, "about", "approximately" or "substantially" as used herein can be based on optical properties, etching properties or other properties to select a more acceptable range of deviation or standard deviation, and not one standard deviation can be applied to all properties .

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

FIG. 1 is a schematic diagram of an electronic device 10 according to an embodiment of the invention.

FIG. 2 is a partially enlarged schematic diagram of the electronic device 10 according to an embodiment of the invention. Figure 2 corresponds to the part R of Figure 1. FIG. 1 omits the illustration of the first electrode 140 and the second electrode 150 of FIG. 2.

FIG. 3 is a schematic cross-sectional view of an electronic device 10 according to an embodiment of the invention. Figure 3 corresponds to the section line A-A' of Figure 2.

FIG. 4 is a schematic diagram of an equivalent circuit of the electronic device 10 according to an embodiment of the invention.

Please refer to FIGS. 1, 2 and 3, the electronic device 10 includes a flexible wireless communication chip 100 and an induction coil 200. The induction coil 200 is used to send and/or receive electromagnetic waves. The induction coil 200 is also called an antenna (Antenna). The first end 200a and the second end 200b of the induction coil 200 are electrically connected to the first pad 170 and the second pad 180 of the flexible wireless communication chip 100, respectively.

For example, in this embodiment, the induction coil 200 can be formed on a flexible substrate 300 first; then, a conductive material (such as silver glue; not shown) is used to bond with the flexible wireless communication chip 100. However, the present invention is not limited to this. In other embodiments, the induction coil 200 can also be transferred to the flexible substrate 110 of the flexible wireless communication chip 100 to be combined with the wireless communication circuit layer of the flexible wireless communication chip 100 120 is electrically connected, and the electronic device 10 does not necessarily need to include the flexible substrate 300.

Please refer to FIG. 2 and FIG. 3, the flexible wireless communication chip 100 includes a flexible substrate 110. The material of the flexible substrate 110 includes a flexible material. For example, in this embodiment, the flexible material may include organic polymers, such as polyimide (PI), polyethylene naphthalate (PEN), and polyethylene terephthalate. Polyethylene terephthalate (PET), polycarbonates (PC), polyether sulfone (PES) or polyarylate, or other suitable materials, or at least two of the foregoing materials的组合。 The combination.

The flexible wireless communication chip 100 further includes a wireless communication circuit layer 120 disposed on the flexible substrate 110. For example, in this embodiment, the wireless communication circuit layer 120 may include a divider (Divider; not shown), a decoder (Decoder; not shown) electrically connected to the divider, and The memory of the decoder (not shown). For example, in this embodiment, at least one of the frequency divider, the decoder, and the memory may include a circuit unit formed by electrically connecting a plurality of thin film transistors 122, but the invention is not limited thereto.

The flexible wireless communication chip 100 further includes a first insulating layer 130, a first electrode 140, a second electrode 150, a second insulating layer 160, a first pad 170, and a second pad 180.

The first insulating layer 130 is disposed on the wireless communication circuit layer 120. The wireless communication circuit layer 120 is located between the first insulating layer 130 and the flexible substrate 110. The first electrode 140 and the second electrode 150 are disposed on the first insulating layer 130. The first insulating layer 130 is located between the first electrode 140 and the wireless communication circuit layer 120. The first insulating layer 130 is located between the second electrode 150 and the wireless communication circuit layer 120.

The first electrode 140 and the second electrode 150 are separated from each other and are each electrically connected to the wireless communication circuit layer 120. Specifically, in this embodiment, the first insulating layer 130 has a first contact window 131 and a second contact window 132; the first electrode 140 has a first connection portion 141 overlapping the first contact window 131, and the first connection The portion 141 is filled into the first contact window 131 of the first insulating layer 130, so that the first electrode 140 is electrically connected to the first end 120-1 of the wireless communication circuit layer 120; the second electrode 150 has a second contact window 132 The overlapping second connecting portion 151 is filled in the second contact window 132 of the first insulating layer 130 to electrically connect the second electrode 150 to the second end 120-2 of the wireless communication circuit layer 120.

For example, in this embodiment, the first electrode 140 and the second electrode 150 can be selectively formed on the same conductive layer. However, the present invention is not limited to this. In other embodiments, the first electrode 140 and the second electrode 150 may also be formed on two different conductive layers above the wireless communication circuit layer 120, respectively.

The second insulating layer 160 is disposed on the first electrode 140 and the second electrode 150. The first electrode 140 and the second electrode 150 are located between the second insulating layer 160 and the first insulating layer 130. The first pad 170 and the second pad 180 are disposed on the second insulating layer 160. The second insulating layer 160 is located between the first pad 170 and the first electrode 140. The second insulating layer 160 is located between the second pad 180 and the second electrode 150.

The first pad 170 and the second pad 180 are electrically connected to the first electrode 140 and the second electrode 150, respectively. Specifically, in this embodiment, the second insulating layer 160 has a first contact window 161 and a second contact window 162, and the first pad 170 is electrically connected to the first contact window 161 through the first contact window 161 of the second insulating layer 160 The first connecting portion 141 of an electrode 140; the second pad 180 is electrically connected to the second connecting portion 151 of the second electrode 150 through the second contact window 162 of the second insulating layer 160.

Based on the consideration of conductivity, in this embodiment, the first electrode 140 and/or the second electrode 150 may use a metal material. However, the present invention is not limited to this. In other embodiments, the first electrode 140 and the second electrode 150 may also use other conductive materials. For example: alloys, nitrides of metallic materials, oxides of metallic materials, oxynitrides of metallic materials, or stacked layers of metallic materials and other conductive materials.

In this embodiment, the material of the first insulating layer 130 and/or the material of the second insulating layer 160 may be an inorganic material (for example: silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of the foregoing materials). ), organic materials or a combination of the above.

For example, in this embodiment, the material of the first pad 170 and/or the material of the second pad 180 may be a transparent conductive material, which includes a metal oxide, such as indium tin oxide, indium zinc oxide , Aluminum tin oxide, aluminum zinc oxide, indium germanium zinc oxide, other suitable oxides, or a stacked layer of at least two of the above, but the present invention is not limited thereto.

It is worth noting that at least one of the first electrode 140 and the second electrode 150 has a plurality of main portions 190 (marked in FIG. 2) separated from each other, and the plurality of main portions 190 are on the flexible substrate 110. The vertical projection is arranged between the vertical projection of the first pad 170 on the flexible substrate 110 and the vertical projection of the second pad 180 on the flexible substrate 110.

，其中C為電子裝置10的諧振電容，而L為感應線圈200的電感。Referring to FIGS. 2, 3, and 4, in this embodiment, the multiple main portions 190 of at least one of the first electrode 140 and the second electrode 150 and the multiple windings 200c of the induction coil 200 (or in other words, The multiple turns of the induction coil 200) overlap. The multiple winding wires 200c of the induction coil 200, the first electrode 140/second electrode 150 of the flexible wireless communication chip 100, and a second insulating layer disposed between the winding wire 200c and the first electrode 140/second electrode 150 160 can form a plurality of capacitors C1, C2, C3, C4. The resonant capacitor C of the electronic device 10 can be formed by a plurality of capacitors C1, C2, C3, and C4 in parallel, where C=C1+C2+C3+C4. The electronic device 10 has a resonance frequency f (Resonance frequency),

, Where C is the resonant capacitance of the electronic device 10, and L is the inductance of the induction coil 200.

Please refer to FIGS. 1, 2, 3, and 4, the flexible wireless communication chip 100 spans multiple windings 200c of the induction coil 200 to be electrically connected to the first end 200a and the second end 200b of the induction coil 200; The resonant capacitor C of the electronic device 10 is formed by overlapping the first electrode 140/the second electrode 150 of the flexible wireless communication chip 100 and the windings 200c of the induction coil 200. Thereby, the resonant capacitor C of the electronic device 10 hardly needs to occupy the area H enclosed by the winding 200c, and will not shield the magnetic lines of force of the induction coil 200, and the induction coil 200 has high working efficiency.

In addition, the first electrode 140/second electrode 150 used as the electrode of the resonant capacitor C is disposed above the wireless communication circuit layer 120 of the flexible wireless communication chip 100, and the first electrode 140/second electrode 150 is connected to the wireless communication circuit layer 120. The main circuits of the communication circuit layer 120 (for example: at least one of frequency divider, decoder, memory, etc.) overlap. Therefore, the arrangement of the first electrode 140/the second electrode 150 hardly increases the flexible wireless communication chip 100 area. The flexible wireless communication chip 100 has the advantages of a small area and can be used as a part of the resonant capacitor C.

2 and 3, in this embodiment, the plurality of main portions 190 of at least one of the first electrode 140 and the second electrode 150 may optionally include the plurality of first main portions 143 of the first electrode 140 And a plurality of second main portions 153 of the second electrode 150. The plurality of first main portions 143 of the first electrode 140 and the plurality of second main portions 153 of the second electrode 150 overlap the plurality of winding wires 200 c of the induction coil 200.

In this embodiment, in order to reduce the metal shielding effect of the first electrode 140 and the second electrode 150, and to achieve a larger resonant capacitance C, the multiple first main portions 143 and the second electrode 150 of the first electrode 140 The plurality of second main parts 153 may completely overlap the plurality of winding wires 200 c of the induction coil 200. For example, in this embodiment, the width W1 of each first main portion 143 in the first direction d1 may be substantially equal to the line width W of a corresponding winding 200c, and each second main portion 153 is The width W2 in the first direction d1 may be substantially equal to the line width W of a corresponding winding 200c, but the present invention is not limited thereto.

In this embodiment, the first electrode 140 further has a first extension portion 142, the first extension portion 142 is connected to the first connection portion 141 and extends in the first direction d1, and the plurality of first main portions 143 are in the first direction d1. Aligned on top and connected with the first extension 142. The plurality of winding wires 200 c of the induction coil 200 cross the first extension 142 of the first electrode 140.

The first extension portion 142 is mainly used to electrically connect the first main portion 143 and the first end 120-1 of the wireless communication circuit layer 120. In this embodiment, the first extension portion 142 does not need to have a large area, and the width LH1 of the first extension portion 142 in the second direction d2 may be much smaller than the length L1 of the first main portion 143 in the second direction d2, but The present invention is not limited to this.

In this embodiment, the second electrode 150 further has a second extension portion 152, which is connected to the second connection portion 151 and extends in the third direction d3, and the plurality of second main portions 153 are in the third direction d3. It is arranged on the upper side and connected to the second extension part 152. The plurality of winding wires 200 c of the induction coil 200 span the second extension portion 152 of the second electrode 150. The first main portion 143 of the first electrode 140 and the second main portion 153 of the second electrode 150 are disposed between the first extension portion 142 and the second extension portion 152.

In this embodiment, the first direction d1 and the third direction d3 can be opposite; that is, the first extension 142 of the first electrode 140 and the second extension 152 of the second electrode 150 can extend in opposite directions , But the present invention is not limited to this.

The second extension portion 152 is mainly used to electrically connect the second main portion 153 and the second end 120-2 of the wireless communication circuit layer 120. In this embodiment, the second extension portion 152 does not need to have a large area, and the width LH2 of the second extension portion 152 in the second direction d2 may be much smaller than the length L2 of the second main portion 153 in the second direction d2.

In this embodiment, the plurality of second main portions 153 of the second electrode 150 and the plurality of first main portions 143 of the first electrode 140 may be sequentially arranged in the first direction d1, and overlapped with the induction coil 200 respectively. Multiple windings 200c. However, the present invention is not limited to this. In other embodiments, the plurality of first main portions 143 of the first electrode 140 and the plurality of second main portions 153 of the second electrode 150 can also be arranged in other ways. The formula illustrates it.

It must be noted here that the following embodiments use the element numbers and part of the content of the foregoing embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

FIG. 5 is a partially enlarged schematic diagram of an electronic device 10A according to an embodiment of the invention. Fig. 5 can also correspond to the part R of Fig. 1. FIG. 1 omits the illustration of the first electrode 140 and the second electrode 150 in FIG. 5.

FIG. 6 is a schematic cross-sectional view of an electronic device 10A according to an embodiment of the invention. Fig. 6 corresponds to the section line B-B' of Fig. 5.

The electronic device 10A of FIGS. 5 and 6 is similar to the electronic device 10 of FIGS. 2 and 3, and the difference between the two is: the shape of the first main portion 143 and the second main portion 153 of the electronic device 10A is the same as the shape of the electronic device 10 The shapes of the one main part 143 and the second main part 153 are different.

Referring to FIG. 5, specifically, in this embodiment, a plurality of main parts 190 are arranged in the first direction d1, and each main part 190 may have a plurality of first sub-parts 191 and a plurality of second sub-parts 192 , The width w1 of each first sub-portion 191 in the first direction d1 is greater than the width w2 of each second sub-portion 192 in the first direction d1, a plurality of first sub-portions 191 and a plurality of second sub-portions 192 They are alternately arranged and connected to each other in the second direction d2.

5 and 6, the resonant capacitor C of the electronic device 10A (refer to FIG. 4) is formed by a plurality of capacitors C1, C2, C3, and C4 in parallel, where C=C1+C2+C3+C4. The size of each capacitor C1, C2, C3, C4 is proportional to the area of the main portion 190. In this embodiment, if the size of the resonant capacitor C of the electronic device 10A needs to be adjusted, the second sub-portion 192 of the main portion 190 can be cut off, so as to reserve an appropriate number of the first portions 191 that are electrically connected to the wireless communication circuit layer 120. In turn, the required resonant capacitance C is obtained.

FIG. 7 is a partially enlarged schematic diagram of an electronic device 10A' according to an embodiment of the present invention. FIG. 7 can also correspond to the part R of FIG. 1. FIG. 1 omits the illustration of the first electrode 140 and the second electrode 150 in FIG. 7.

The second sub-portion 192 of at least one main portion 190 in FIG. 5 is disconnected to form the electronic device 10A' of FIG. 7. In other words, FIG. 7 shows the electronic device 10A' after the adjustment of the resonant capacitor C (refer to FIG. 4). In the embodiment of FIG. 7, at least one second sub-portion 192 has a break 192a. For example, in this embodiment, the disconnection 192a is formed by cutting the second sub-part 192 with a laser, but the invention is not limited to this.

FIG. 8 is a partially enlarged schematic diagram of an electronic device 10B according to an embodiment of the invention. FIG. 8 can also correspond to the part R of FIG. 1. FIG. 1 omits the illustration of the first electrode 140 and the second electrode 150 of FIG. 8.

FIG. 9 shows the first AC signal S140 of the first electrode 140 in FIG. 8 and the second AC signal S150 of the second electrode 150 in FIG. 8.

The electronic device 10B in FIG. 8 is similar to the electronic device 10 in FIG. 2. The difference between the two is that the relative positions of the first main portion 143/second main portion 153 and the induction coil 200 are different.

Referring to FIG. 8, in this embodiment, the plurality of first main portions 143 and the plurality of second main portions 153 of the flexible wireless communication chip 100 are alternately arranged in the first direction d1, and each first main portion 143 and a corresponding second main portion 153 overlap the same winding 200c of the induction coil 200 (or the same turn of the induction coil 200). 8 and 9, in this embodiment, the first electrode 140 has a first AC signal S140, the second electrode 150 has a second AC signal S150, the amplitude A140 of the first AC signal S140 and the second AC signal S150 The amplitude A150 of is substantially the same, and the phases of the first AC signal S140 and the second AC signal S150 are opposite. Thereby, the coupling effect between the first electrode 140 and the wireless communication circuit 120 and the coupling effect between the second electrode 150 and the wireless communication circuit 120 can be offset, and the wireless communication circuit 120 under the first electrode 140/the second electrode 150 is prevented from being affected. The influence of AC signal coupling noise.

FIG. 10 is a partially enlarged schematic diagram of an electronic device 10C according to an embodiment of the invention. FIG. 10 can also correspond to the part R of FIG. 1. FIG. 1 omits the illustration of the first electrode 140 and the second electrode 150 of FIG. 10.

The electronic device 10C of FIG. 10 is similar to the aforementioned electronic device 10, and the difference between the two is: the arrangement of the first main portion 143 and the second main portion 153 of the electronic device 10C is the same as that of the first main portion 143 and the second main portion of the electronic device 10 The two main parts 153 are arranged in different ways.

10, specifically, in this embodiment, the plurality of first main portions 143 of the first electrode 140 are arranged in the first direction d1, and the plurality of second main portions 153 of the second electrode 150 are arranged in the first direction d1. Arranged in the direction d1, each first main portion 143 and a corresponding second main portion 153 are arranged in the second direction d2, and each first main portion 143 and a corresponding second main portion 153 overlap the same line Winding 200c (or the same turn of induction coil 200).

FIG. 11 is a partially enlarged schematic diagram of an electronic device 10D according to an embodiment of the invention. FIG. 11 can also correspond to the part R of FIG. 1. FIG. 1 omits the illustration of the first electrode 140 and the second electrode 150 of FIG. 11.

The electronic device 10D of FIG. 11 is similar to the aforementioned electronic device 10, and the difference between the two is: the arrangement of the first main portion 143 and the second main portion 153 of the electronic device 10D is the same as that of the first main portion 143 and the second main portion of the electronic device 10 The two main parts 153 are arranged in different ways.

Referring to FIG. 11, specifically, in this embodiment, the plurality of first main portions 143 of the first electrode 140 and the plurality of second main portions 153 of the second electrode 150 are alternately arranged in the first direction d1 and are respectively arranged A plurality of winding wires 200c (or multiple turns of the induction coil 200) overlapped with the induction coil 200.

FIG. 12 is a partially enlarged schematic diagram of an electronic device 10E according to an embodiment of the invention. FIG. 12 may also correspond to the part R of FIG. 1. FIG. 1 omits the illustration of the first electrode 140 and the second electrode 150 in FIG. 12.

The electronic device 10E of FIG. 12 is similar to the electronic device 10 of FIG. 2. The difference between the two is: the shape of the first electrode 140 and the second electrode 150 of the electronic device 10E is the same as that of the first electrode 140 and the second electrode 150 of the electronic device 10 The shapes are different.

12, specifically, in this embodiment, the second electrode 150 can omit the second main portion 153 of the second electrode 150 in FIG. 2, and the number of the first main portion 143 of the first electrode 140 can be designed to More.

10, 10A, 10A’, 10B, 10C, 10D, 10E: electronic device 100: Flexible wireless communication chip 110: Flexible substrate 120: wireless communication circuit layer 120-1: first end 120-2: second end 122: thin film transistor 130: first insulating layer 131: first contact window 132: second contact window 140: first electrode 141: The first connection part 142: first extension 143: The first main part 150: second electrode 151: The second connecting part 152: second extension 153: The second main part 160: second insulating layer 161: first contact window 162: second contact window 170: first pad 180: second pad 190: Main Department 191: The first sub-part 192: The second sub-part 192a: Break 200: induction coil 200a: first end 200b: second end 200c: winding 300: Flexible substrate A140, A150: Amplitude A-A’, B-B’: cut line C: Resonant capacitor C1, C2, C3, C4: Capacitance d1: first direction d2: second direction d3: Third party H: area L: Inductance L1, L2: length R: Partial S140: The first AC signal S150: Second AC signal W1, W2, LH1, LH2, w1, w2: width W: line width

FIG. 1 is a schematic diagram of an electronic device 10 according to an embodiment of the invention. FIG. 2 is a partially enlarged schematic diagram of the electronic device 10 according to an embodiment of the invention. FIG. 3 is a schematic cross-sectional view of an electronic device 10 according to an embodiment of the invention. FIG. 4 is a schematic diagram of an equivalent circuit of the electronic device 10 according to an embodiment of the invention. FIG. 5 is a partially enlarged schematic diagram of an electronic device 10A according to an embodiment of the invention. FIG. 6 is a schematic cross-sectional view of an electronic device 10A according to an embodiment of the invention. FIG. 7 is a partially enlarged schematic diagram of an electronic device 10A' according to an embodiment of the present invention. FIG. 8 is a partially enlarged schematic diagram of an electronic device 10B according to an embodiment of the invention. FIG. 9 shows the first AC signal S140 of the first electrode 140 in FIG. 8 and the second AC signal S140 of the second electrode 150 in FIG. 8. FIG. 10 is a partially enlarged schematic diagram of an electronic device 10C according to an embodiment of the invention. FIG. 11 is a partially enlarged schematic diagram of an electronic device 10D according to an embodiment of the invention. FIG. 12 is a partially enlarged schematic diagram of an electronic device 10E according to an embodiment of the invention.

10: Electronic device

100: Flexible wireless communication chip

110: Flexible substrate

120: wireless communication circuit layer

120-1: first end

120-2: second end

122: thin film transistor

130: first insulating layer

131: first contact window

132: second contact window

140: first electrode

141: The first connection part

143: The first main part

150: second electrode

151: The second connecting part

153: The second main part

160: second insulating layer

161: first contact window

162: second contact window

170: first pad

180: second pad

200: induction coil

200a: first end

200b: second end

200c: winding

300: Flexible substrate

A-A’: Cut line

C1, C2, C3, C4: Capacitance

Claims (11)

An electronic device, including: A flexible wireless communication chip, including: A flexible substrate; A wireless communication circuit layer arranged on the flexible substrate; A first insulating layer disposed on the wireless communication circuit layer; A first electrode and a second electrode are disposed on the first insulating layer, wherein the first electrode and the second electrode are separated from each other and are each electrically connected to the wireless communication circuit layer; A second insulating layer disposed on the first electrode and the second electrode; A first pad and a second pad are disposed on the second insulating layer and are electrically connected to the first electrode and the second electrode, respectively; Wherein, at least one of the first electrode and the second electrode has a plurality of main parts spaced apart from each other, and a plurality of vertical projections of the main parts on the flexible substrate are arranged on the first pad on the Between a vertical projection on the flexible substrate and a vertical projection of the second pad on the flexible substrate. The electronic device according to claim 1, further comprising: An induction coil, wherein a first end and a second end of the induction coil are respectively electrically connected to the first pad and the second pad of the flexible wireless communication chip, and the plurality of induction coils The windings overlap the main parts of the flexible wireless communication chip. The electronic device according to claim 2, wherein the main parts include a plurality of first main parts of the first electrode and a plurality of second main parts of the second electrode, the first main parts and the first main parts The two main parts are alternately arranged in a first direction, and each of the first main parts and the corresponding one of the second main parts overlap the same winding of the induction coil. The electronic device according to claim 3, wherein the first electrode has a first AC signal, the second electrode has a second AC signal, and the amplitude of the first AC signal and the amplitude of the second AC signal are substantially The same, and the phases of the first AC signal and the second AC signal are opposite. The electronic device according to claim 1, wherein the main parts are arranged in a first direction, one main part has a plurality of first sub-parts and a plurality of second sub-parts, and each of the first sub-parts is arranged in a first direction. The width in the first direction is greater than the width of each second sub-portion in the first direction, the first sub-portions and the second sub-portions are alternately arranged in a second direction, and the first The direction is staggered with this second direction. The electronic device according to claim 5, wherein one of the second sub-parts has a disconnection. The electronic device according to claim 1, wherein the main parts include a plurality of first main parts of the first electrode and a plurality of second main parts of the second electrode, and the second main parts and the second main parts The first main parts are sequentially arranged in a first direction. The electronic device according to claim 1, wherein the main parts include a plurality of first main parts of the first electrode and a plurality of second main parts of the second electrode, and the first main parts are a first The second main parts are arranged in the first direction, and each of the first main parts and a corresponding second main part are arranged in a second direction, wherein the first direction and the second main part are arranged in a second direction. Staggered in two directions. The electronic device according to claim 1, wherein the main parts include a plurality of first main parts of the first electrode and a plurality of second main parts of the second electrode, and the first main parts and the second main parts The second main parts are alternately arranged in a first direction. The electronic device according to claim 1, wherein the main portions include a plurality of first main portions of the first electrode, the first electrode further has a first extension portion extending in a first direction, and the first The main portions are arranged in the first direction and connected to the first extension portion, the second electrode has a second extension portion, and the first main portions are disposed between the first extension portion and the second extension portion between. The electronic device according to claim 10 further includes: An induction coil, wherein a first end and a second end of the induction coil are respectively electrically connected to the first pad and the second pad of the flexible wireless communication chip, and a plurality of windings of the induction coil The wires overlap the first main parts of the first electrode of the flexible wireless communication chip, and the winding wires of the induction coil span the first electrode and the second electrode of the flexible wireless communication chip The first extension part and the second extension part.

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