TW202122555A - Solvent-free curable composition, cured layer and color filter - Google Patents
Solvent-free curable composition, cured layer and color filter Download PDFInfo
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- TW202122555A TW202122555A TW109130931A TW109130931A TW202122555A TW 202122555 A TW202122555 A TW 202122555A TW 109130931 A TW109130931 A TW 109130931A TW 109130931 A TW109130931 A TW 109130931A TW 202122555 A TW202122555 A TW 202122555A
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- solvent
- curable composition
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- 239000000203 mixture Substances 0.000 title claims abstract description 112
- 239000000126 substance Substances 0.000 claims abstract description 129
- 239000002096 quantum dot Substances 0.000 claims abstract description 94
- 150000001875 compounds Chemical class 0.000 claims abstract description 70
- 239000000178 monomer Substances 0.000 claims abstract description 35
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- 239000004094 surface-active agent Substances 0.000 claims description 14
- 229910052731 fluorine Inorganic materials 0.000 claims description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 9
- 239000011737 fluorine Substances 0.000 claims description 9
- 239000003505 polymerization initiator Substances 0.000 claims description 8
- 239000003112 inhibitor Substances 0.000 claims description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 230000004048 modification Effects 0.000 claims description 5
- 238000012986 modification Methods 0.000 claims description 5
- 125000006832 (C1-C10) alkylene group Chemical group 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- KQIGMPWTAHJUMN-UHFFFAOYSA-N 3-aminopropane-1,2-diol Chemical compound NCC(O)CO KQIGMPWTAHJUMN-UHFFFAOYSA-N 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 125000001033 ether group Chemical group 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 33
- 238000002360 preparation method Methods 0.000 description 32
- 230000000052 comparative effect Effects 0.000 description 26
- 239000010410 layer Substances 0.000 description 21
- 238000006243 chemical reaction Methods 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 16
- 239000002904 solvent Substances 0.000 description 16
- 238000003786 synthesis reaction Methods 0.000 description 15
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 10
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 8
- -1 3-oxetanyl Chemical group 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 239000002270 dispersing agent Substances 0.000 description 7
- 239000000976 ink Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 239000003446 ligand Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- UGZAJZLUKVKCBM-UHFFFAOYSA-N 6-sulfanylhexan-1-ol Chemical compound OCCCCCCS UGZAJZLUKVKCBM-UHFFFAOYSA-N 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 4
- 238000006386 neutralization reaction Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- LAQYHRQFABOIFD-UHFFFAOYSA-N 2-methoxyhydroquinone Chemical compound COC1=CC(O)=CC=C1O LAQYHRQFABOIFD-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical class NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 229910007709 ZnTe Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- KQNZLOUWXSAZGD-UHFFFAOYSA-N benzylperoxymethylbenzene Chemical compound C=1C=CC=CC=1COOCC1=CC=CC=C1 KQNZLOUWXSAZGD-UHFFFAOYSA-N 0.000 description 2
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000007942 carboxylates Chemical class 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- KJIFKLIQANRMOU-UHFFFAOYSA-N oxidanium;4-methylbenzenesulfonate Chemical compound O.CC1=CC=C(S(O)(=O)=O)C=C1 KJIFKLIQANRMOU-UHFFFAOYSA-N 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- ZWAJLVLEBYIOTI-OLQVQODUSA-N (1s,6r)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCC[C@@H]2O[C@@H]21 ZWAJLVLEBYIOTI-OLQVQODUSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- FJKOQFIGFHTRRW-UHFFFAOYSA-N (2-methoxy-3-methylphenyl)-(3-methylphenyl)methanone Chemical compound COC1=C(C)C=CC=C1C(=O)C1=CC=CC(C)=C1 FJKOQFIGFHTRRW-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- BUZYGTVTZYSBCU-UHFFFAOYSA-N 1-(4-chlorophenyl)ethanone Chemical compound CC(=O)C1=CC=C(Cl)C=C1 BUZYGTVTZYSBCU-UHFFFAOYSA-N 0.000 description 1
- PYKHTOHGCVJJMZ-UHFFFAOYSA-N 1-(4-phenylsulfanylphenyl)butan-1-one Chemical compound C1=CC(C(=O)CCC)=CC=C1SC1=CC=CC=C1 PYKHTOHGCVJJMZ-UHFFFAOYSA-N 0.000 description 1
- JNGALPZRHWQEEZ-UHFFFAOYSA-N 1-(4-phenylsulfanylphenyl)octan-1-one Chemical compound C1=CC(C(=O)CCCCCCC)=CC=C1SC1=CC=CC=C1 JNGALPZRHWQEEZ-UHFFFAOYSA-N 0.000 description 1
- IMDHDEPPVWETOI-UHFFFAOYSA-N 1-(4-tert-butylphenyl)-2,2,2-trichloroethanone Chemical compound CC(C)(C)C1=CC=C(C(=O)C(Cl)(Cl)Cl)C=C1 IMDHDEPPVWETOI-UHFFFAOYSA-N 0.000 description 1
- VMCRQYHCDSXNLW-UHFFFAOYSA-N 1-(4-tert-butylphenyl)-2,2-dichloroethanone Chemical compound CC(C)(C)C1=CC=C(C(=O)C(Cl)Cl)C=C1 VMCRQYHCDSXNLW-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- GKZPEYIPJQHPNC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GKZPEYIPJQHPNC-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- CLDZVCMRASJQFO-UHFFFAOYSA-N 2,5-bis(2,4,4-trimethylpentan-2-yl)benzene-1,4-diol Chemical compound CC(C)(C)CC(C)(C)C1=CC(O)=C(C(C)(C)CC(C)(C)C)C=C1O CLDZVCMRASJQFO-UHFFFAOYSA-N 0.000 description 1
- ZHUWKKIRCLKYNJ-UHFFFAOYSA-N 2,5-bis(2-methylpentan-2-yl)benzene-1,4-diol Chemical compound CCCC(C)(C)C1=CC(O)=C(C(C)(C)CCC)C=C1O ZHUWKKIRCLKYNJ-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JJBFVQSGPLGDNX-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)COC(=O)C(C)=C JJBFVQSGPLGDNX-UHFFFAOYSA-N 0.000 description 1
- DQMOHZLFVGYNAN-UHFFFAOYSA-N 2-(2-phenylethenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound ClC(Cl)(Cl)C1=NC(C(Cl)(Cl)Cl)=NC(C=CC=2C=CC=CC=2)=N1 DQMOHZLFVGYNAN-UHFFFAOYSA-N 0.000 description 1
- QRHHZFRCJDAUNA-UHFFFAOYSA-N 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound C1=CC(OC)=CC=C1C1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 QRHHZFRCJDAUNA-UHFFFAOYSA-N 0.000 description 1
- MPNIGZBDAMWHSX-UHFFFAOYSA-N 2-(4-methylphenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound C1=CC(C)=CC=C1C1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 MPNIGZBDAMWHSX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- YHBWXWLDOKIVCJ-UHFFFAOYSA-N 2-[2-(2-methoxyethoxy)ethoxy]acetic acid Chemical compound COCCOCCOCC(O)=O YHBWXWLDOKIVCJ-UHFFFAOYSA-N 0.000 description 1
- ZJRNXDIVAGHETA-UHFFFAOYSA-N 2-[2-(3,4-dimethoxyphenyl)ethenyl]-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound C1=C(OC)C(OC)=CC=C1C=CC1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 ZJRNXDIVAGHETA-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- AAXRSWGYLGOFQP-UHFFFAOYSA-N 2-butoxy-1-(2-butoxyphenyl)ethanone Chemical compound CCCCOCC(=O)C1=CC=CC=C1OCCCC AAXRSWGYLGOFQP-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- MRDMGGOYEBRLPD-UHFFFAOYSA-N 2-ethoxy-1-(2-ethoxyphenyl)ethanone Chemical compound CCOCC(=O)C1=CC=CC=C1OCC MRDMGGOYEBRLPD-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- HAZQZUFYRLFOLC-UHFFFAOYSA-N 2-phenyl-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound ClC(Cl)(Cl)C1=NC(C(Cl)(Cl)Cl)=NC(C=2C=CC=CC=2)=N1 HAZQZUFYRLFOLC-UHFFFAOYSA-N 0.000 description 1
- WYYQKWASBLTRIW-UHFFFAOYSA-N 2-trimethoxysilylbenzoic acid Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1C(O)=O WYYQKWASBLTRIW-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical group CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- OKISUZLXOYGIFP-UHFFFAOYSA-N 4,4'-dichlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=C(Cl)C=C1 OKISUZLXOYGIFP-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- OKUJJVAASUSBCG-UHFFFAOYSA-N 5-sulfanylpentan-1-ol Chemical compound OCCCCCS OKUJJVAASUSBCG-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- RKDKLCYPNIDCNU-UHFFFAOYSA-N C(C1=CC=CC=C1)(=O)OC.C(C1=CC=CC=C1)(=O)C1=CC=CC=C1 Chemical compound C(C1=CC=CC=C1)(=O)OC.C(C1=CC=CC=C1)(=O)C1=CC=CC=C1 RKDKLCYPNIDCNU-UHFFFAOYSA-N 0.000 description 1
- YYLLIJHXUHJATK-UHFFFAOYSA-N Cyclohexyl acetate Chemical compound CC(=O)OC1CCCCC1 YYLLIJHXUHJATK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910004262 HgTe Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- CQHKDHVZYZUZMJ-UHFFFAOYSA-N [2,2-bis(hydroxymethyl)-3-prop-2-enoyloxypropyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(CO)COC(=O)C=C CQHKDHVZYZUZMJ-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- HAMNKKUPIHEESI-UHFFFAOYSA-N aminoguanidine Chemical compound NNC(N)=N HAMNKKUPIHEESI-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- CLHAOIOLCMPIRX-UHFFFAOYSA-N benzoic acid diphenylmethanone Chemical compound OC(=O)C1=CC=CC=C1.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 CLHAOIOLCMPIRX-UHFFFAOYSA-N 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- HXTBYXIZCDULQI-UHFFFAOYSA-N bis[4-(methylamino)phenyl]methanone Chemical compound C1=CC(NC)=CC=C1C(=O)C1=CC=C(NC)C=C1 HXTBYXIZCDULQI-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- MGNCLNQXLYJVJD-UHFFFAOYSA-N cyanuric chloride Chemical compound ClC1=NC(Cl)=NC(Cl)=N1 MGNCLNQXLYJVJD-UHFFFAOYSA-N 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- BLCKNMAZFRMCJJ-UHFFFAOYSA-N cyclohexyl cyclohexyloxycarbonyloxy carbonate Chemical compound C1CCCCC1OC(=O)OOC(=O)OC1CCCCC1 BLCKNMAZFRMCJJ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- MOXUSPIFBCWPHJ-UHFFFAOYSA-N diazidoamine Chemical compound [N-]=[N+]=NNN=[N+]=[N-] MOXUSPIFBCWPHJ-UHFFFAOYSA-N 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-O diazynium Chemical compound [NH+]#N IJGRMHOSHXDMSA-UHFFFAOYSA-O 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- IRECAYDEBUSTTP-UHFFFAOYSA-N diphenylmethanone;prop-2-enoic acid Chemical compound OC(=O)C=C.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 IRECAYDEBUSTTP-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052949 galena Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 150000007857 hydrazones Chemical class 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- WXVQVZBJMWDACQ-UHFFFAOYSA-N isocyanato 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)ON=C=O WXVQVZBJMWDACQ-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- DAHPIMYBWVSMKQ-UHFFFAOYSA-N n-hydroxy-n-phenylnitrous amide Chemical compound O=NN(O)C1=CC=CC=C1 DAHPIMYBWVSMKQ-UHFFFAOYSA-N 0.000 description 1
- ZNPKAOCQMDJBIK-UHFFFAOYSA-N nitrocyanamide Chemical compound [O-][N+](=O)NC#N ZNPKAOCQMDJBIK-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000012264 purified product Substances 0.000 description 1
- 238000006862 quantum yield reaction Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 235000019281 tert-butylhydroquinone Nutrition 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- CWHJLNJICCBAOK-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-6-yl)ethyl]silane Chemical compound C1CCCC2OC21CC[Si](OC)(OC)OC CWHJLNJICCBAOK-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229940057402 undecyl alcohol Drugs 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/12—Esters of monohydric alcohols or phenols
- C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/015—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction
- G02F1/017—Structures with periodic or quasi periodic potential variation, e.g. superlattices, quantum wells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/015—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction
- G02F1/017—Structures with periodic or quasi periodic potential variation, e.g. superlattices, quantum wells
- G02F1/01791—Quantum boxes or quantum dots
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133617—Illumination with ultraviolet light; Luminescent elements or materials associated to the cell
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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Abstract
Description
本揭露是有關於一種無溶劑的硬化性組成物、一種使用所述組成物的硬化層以及一種包括所述硬化層的彩色濾光片。[ 相關申請案的交叉參考 ] The present disclosure relates to a solvent-free curable composition, a hardened layer using the composition, and a color filter including the hardened layer. [ Cross reference of related applications ]
本申請案主張於2019年10月24日在韓國智慧財產局提出申請的韓國專利申請案第10-2019-0133235號的優先權及權利,所述韓國專利申請案的全部內容併入本案供參考。This application claims the priority and rights of the Korean patent application No. 10-2019-0133235 filed with the Korean Intellectual Property Office on October 24, 2019. The entire content of the Korean patent application is incorporated into this case for reference. .
在一般量子點的情況下,由於具有疏水性的表面特性,其中分散有量子點的溶劑受到限制,且因此難以引入極性系統(例如黏合劑或硬化性單體)中。In the case of general quantum dots, due to the hydrophobic surface characteristics, the solvent in which the quantum dots are dispersed is limited, and therefore it is difficult to introduce into a polar system (such as a binder or a hardenable monomer).
例如,即使在積極研究量子點油墨組成物的情況下,極性在初始步驟中相對低,且其可分散在用於具有高疏水性的硬化性組成物的溶劑中。因此,由於以組成物的總量計,難以包含20重量%或大於20重量%的量子點,因此無法將油墨的光效率提高至某一水準以上。儘管另外添加及分散量子點來提高光效率,但黏度會超過能夠噴墨的範圍(12厘泊),且因此可處理性可能不令人滿意。For example, even when a quantum dot ink composition is actively studied, the polarity is relatively low in the initial step, and it can be dispersed in a solvent for a hardenable composition having high hydrophobicity. Therefore, since it is difficult to contain 20% by weight or more of quantum dots based on the total amount of the composition, the light efficiency of the ink cannot be increased to a certain level or more. Although additional quantum dots are added and dispersed to improve light efficiency, the viscosity will exceed the range (12 centipoise) capable of inkjetting, and therefore the handleability may be unsatisfactory.
為達成能夠噴墨的黏度範圍,以組成物的總量計,藉由50重量%或大於50重量%的溶劑來降低油墨固體含量的方法,其在黏度方面亦提供稍微令人滿意的結果。然而,就黏度而言,其可被認為是令人滿意的結果,但由於溶劑揮發、噴嘴堵塞、射出後隨著時間流逝單層減少而導致的噴嘴乾燥可能變得更差,且難以控制硬化後的厚度偏差。因此,難以將其應用於實際製程。In order to achieve the ink-jet viscosity range, based on the total composition, the method of reducing the solid content of the ink by 50% by weight or more than 50% by weight of the solvent also provides slightly satisfactory results in terms of viscosity. However, in terms of viscosity, it can be considered a satisfactory result, but the nozzle drying may become worse due to solvent volatilization, nozzle clogging, and single layer reduction over time after injection, and it is difficult to control hardening After the thickness deviation. Therefore, it is difficult to apply it to the actual manufacturing process.
因此,不包含溶劑的無溶劑的量子點油墨是應用於實際製程的最期望形式。將量子點本身應用於溶劑型組成物的當前技術現在受到一定程度的限制。Therefore, a solvent-free quantum dot ink that does not contain a solvent is the most desirable form for practical application. The current technology of applying quantum dots themselves to solvent-based compositions is currently limited to a certain extent.
如迄今所報導的,在溶劑型組成物的情況下,以溶劑型組成物的總量計,未被表面改質(配位體取代)的量子點具有20重量%至25重量%的含量。因此,由於黏度限制,難以提高光效率及吸收率。同時,已經嘗試在其他改進方向上降低量子點含量且增加光擴散劑(散射體)的含量,但此亦未能解決沈澱問題及低光效率問題。As reported so far, in the case of a solvent-based composition, the quantum dots that have not been surface modified (ligand substituted) have a content of 20% to 25% by weight based on the total amount of the solvent-based composition. Therefore, it is difficult to improve the light efficiency and absorption rate due to viscosity limitations. At the same time, attempts have been made to reduce the content of quantum dots and increase the content of light diffusing agents (scatterers) in other directions for improvement, but this has failed to solve the problems of precipitation and low light efficiency.
一實施例是提供一種無溶劑的硬化性組成物,所述組成物包含用同時具有極性部分及非極性部分的化合物進行表面改質的量子點。One embodiment is to provide a solvent-free curable composition comprising quantum dots surface-modified with a compound having both a polar part and a non-polar part.
另一實施例是提供一種使用無溶劑的硬化性組成物生產的硬化層。Another embodiment is to provide a hardened layer produced using a solvent-free hardenable composition.
另一實施例是提供一種包括所述硬化層的彩色濾光片。Another embodiment is to provide a color filter including the hardened layer.
一實施例提供一種無溶劑的硬化性組成物,所述組成物包含:量子點,用由化學式1表示的化合物進行表面改質;及可聚合單體,在末端處具有碳-碳雙鍵。An embodiment provides a solvent-free curable composition, the composition comprising: quantum dots, which are surface modified with a compound represented by Chemical Formula 1; and a polymerizable monomer, which has a carbon-carbon double bond at the end.
[化學式1] [Chemical formula 1]
在化學式1中, L1 、L3 及L5 獨立地為單鍵、經取代或未經取代的C1至C20伸烷基、經取代或未經取代的C3至C20伸環烷基、經取代或未經取代的C6至C20伸芳基或者經取代或未經取代的C2至C20伸雜芳基, L2 及L4 獨立地為單鍵、*-O-*、*-S-*、*-C(=O)O-*或*-OC(=O)-*, R1 為經取代或未經取代的C1至C20烷基或者經取代或未經取代的C6至C20芳基, n為6至15的整數,且 m為1至10的整數。In Chemical Formula 1, L 1 , L 3 and L 5 are independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted Or unsubstituted C6 to C20 arylene group or substituted or unsubstituted C2 to C20 heteroaryl group, L 2 and L 4 are independently single bonds, *-O-*, *-S-*, *-C(=O)O-* or *-OC(=O)-*, R 1 is a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C6 to C20 aryl group, n is an integer from 6 to 15, and m is an integer from 1 to 10.
化學式1可由化學式1-1至化學式1-3中的一者表示。Chemical formula 1 may be represented by one of Chemical formula 1-1 to Chemical formula 1-3.
[化學式1-1] [Chemical formula 1-1]
[化學式1-2] [Chemical formula 1-2]
[化學式1-3] [Chemical formula 1-3]
在化學式1-1至化學式1-3中, L1 、L3 及L5 獨立地為單鍵、經取代或未經取代的C1至C20伸烷基、經取代或未經取代的C3至C20伸環烷基、經取代或未經取代的C6至C20伸芳基或者經取代或未經取代的C2至C20伸雜芳基, R1 及R2 獨立地為經取代或未經取代的C1至C20烷基或者經取代或未經取代的C6至C20芳基, n為6至15的整數, m為1至10的整數,且 P為0至4的整數。In Chemical Formula 1-1 to Chemical Formula 1-3, L 1 , L 3 and L 5 are independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 Cycloalkylene, substituted or unsubstituted C6 to C20 arylene or substituted or unsubstituted C2 to C20 heteroaryl, R 1 and R 2 are independently substituted or unsubstituted C1 To C20 alkyl or substituted or unsubstituted C6 to C20 aryl, n is an integer from 6 to 15, m is an integer from 1 to 10, and P is an integer from 0 to 4.
化學式1可由化學式2至化學式5中的一者表示。Chemical formula 1 may be represented by one of Chemical formula 2 to Chemical formula 5.
[化學式2] [Chemical formula 2]
[化學式3] [Chemical formula 3]
[化學式4] [Chemical formula 4]
[化學式5] [Chemical formula 5]
所述量子點可具有500奈米至680奈米的最大螢光發射波長。The quantum dots may have a maximum fluorescence emission wavelength of 500 nm to 680 nm.
所述可聚合單體可具有220克/莫耳至1,000克/莫耳的分子量。The polymerizable monomer may have a molecular weight of 220 g/mole to 1,000 g/mole.
可聚合單體可由化學式6表示。The polymerizable monomer can be represented by Chemical Formula 6.
[化學式6] [Chemical formula 6]
在化學式6中, R3 及R4 獨立地為氫原子或者經取代或未經取代的C1至C10烷基, L6 及L8 獨立地為經取代或未經取代的C1至C10伸烷基,且 L7 為經取代或未經取代的C1至C10伸烷基或醚基(*-O-*),且*為連接點。In Chemical Formula 6, R 3 and R 4 are independently a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group, and L 6 and L 8 are independently a substituted or unsubstituted C1 to C10 alkylene group , And L 7 is a substituted or unsubstituted C1 to C10 alkylene or ether group (*-O-*), and * is the point of attachment.
所述無溶劑的硬化性組成物可包含1重量%至60重量%的量子點及40重量%至99重量%的可聚合單體。The solvent-free curable composition may include 1% to 60% by weight of quantum dots and 40% to 99% by weight of polymerizable monomers.
所述無溶劑的硬化性組成物可更包含聚合起始劑、光擴散劑或其組合。The solvent-free curable composition may further include a polymerization initiator, a light diffusing agent, or a combination thereof.
所述光擴散劑可包含硫酸鋇、碳酸鈣、二氧化鈦、氧化鋯或其組合。The light diffusion agent may include barium sulfate, calcium carbonate, titanium dioxide, zirconium oxide, or a combination thereof.
所述無溶劑的硬化性組成物可更包含聚合抑制劑;丙二酸;3-胺基-1,2-丙二醇;矽烷偶合劑;調平劑;氟系界面活性劑;或其組合。The solvent-free curable composition may further include a polymerization inhibitor; malonic acid; 3-amino-1,2-propanediol; a silane coupling agent; a leveling agent; a fluorine-based surfactant; or a combination thereof.
另一實施例提供一種使用無溶劑的硬化性組成物生產的硬化層。Another embodiment provides a hardened layer produced using a solvent-free hardenable composition.
所述硬化層可具有小於或等於540奈米的發射波長。The hardened layer may have an emission wavelength less than or equal to 540 nanometers.
另一實施例提供一種包括硬化層的彩色濾光片。Another embodiment provides a color filter including a hardened layer.
另一實施例提供一種包括彩色濾光片的顯示裝置。Another embodiment provides a display device including a color filter.
以下詳細說明中包含本發明的其他實施例。The following detailed description includes other embodiments of the present invention.
一實施例提供一種無溶劑的硬化性組成物,所述組成物包含用同時具有極性部分及非極性部分的化合物進行表面改質的量子點,且所述表面改質化合物有助於在量子點之間形成預定間隙,且因此可降低由無溶劑的硬化性組成物形成的硬化層的發射波長,並達成高顏色再現性,並且同時防止硬化層的性質(例如耐光性、耐熱性等)劣化。One embodiment provides a solvent-free curable composition. The composition includes quantum dots that are surface-modified with a compound having both a polar part and a non-polar part, and the surface-modifying compound helps in the quantum dots A predetermined gap is formed between them, and therefore, the emission wavelength of the hardened layer formed of the solvent-free curable composition can be reduced, and high color reproducibility can be achieved, and at the same time, the deterioration of the hardened layer's properties (such as light resistance, heat resistance, etc.) can be prevented .
在下文中詳細闡述本發明的實施例。然而,該些實施例為示範性的,本發明不限於此,且本發明由申請專利範圍的範圍界定。Hereinafter, embodiments of the present invention are explained in detail. However, these embodiments are exemplary, the present invention is not limited thereto, and the present invention is defined by the scope of the patent application.
如本文所使用,當不另外提供具體定義時,「烷基」是指C1至C20烷基,「烯基」是指C2至C20烯基,「環烯基」是指C3至C20環烯基,「雜環烯基」是指C3至C20雜環烯基,「芳基」是指C6至C20芳基,「芳基烷基」是指C6至C20芳基烷基,「伸烷基」是指C1至C20伸烷基,「伸芳基」是指C6至C20伸芳基,「烷基伸芳基」是指C6至C20烷基伸芳基,「伸雜芳基」是指C3至C20伸雜芳基,且「伸烷氧基」是指C1至C20伸烷氧基。As used herein, when specific definitions are not otherwise provided, "alkyl" refers to C1 to C20 alkyl, "alkenyl" refers to C2 to C20 alkenyl, and "cycloalkenyl" refers to C3 to C20 cycloalkenyl , "Heterocyclenyl" refers to C3 to C20 heterocycloalkenyl, "aryl" refers to C6 to C20 aryl, "arylalkyl" refers to C6 to C20 arylalkyl, "alkylene" Refers to C1 to C20 alkylene, "Arylene" refers to C6 to C20 arylene, "Alkyl aryl" refers to C6 to C20 alkyl aryl, and "heteroaryl" refers to C3 to C20 Heteroaryl, and "alkoxy" refers to C1 to C20 alkoxy.
如本文所使用,當不另外提供具體定義時,「經取代」是指至少一個氫原子經選自以下的取代基代替:鹵素原子(F、Cl、Br或I)、羥基、羥基、C1至C20烷氧基、硝基、氰基、胺基、亞胺基、疊氮基、脒基、肼基、腙基、羰基、胺甲醯基、硫醇基、酯基、醚基、羧基或其鹽、磺酸基或其鹽、磷酸或其鹽、C1至C20烷基、C2至C20烯基、C2至C20炔基、C6至C20芳基、C3至C20環烷基、C3至C20環烯基、C3至C20環炔基、C2至C20雜環烷基、C2至C20雜環烯基、C2至C20雜環炔基、C3至C20雜芳基或其組合。As used herein, when no specific definition is provided otherwise, "substituted" means that at least one hydrogen atom is replaced by a substituent selected from the group consisting of halogen atoms (F, Cl, Br or I), hydroxyl, hydroxyl, C1 to C20 alkoxy, nitro, cyano, amine, imino, azide, amidino, hydrazine, hydrazone, carbonyl, carbamoyl, thiol, ester, ether, carboxyl or Its salt, sulfonic acid group or its salt, phosphoric acid or its salt, C1 to C20 alkyl, C2 to C20 alkenyl, C2 to C20 alkynyl, C6 to C20 aryl, C3 to C20 cycloalkyl, C3 to C20 ring Alkenyl, C3 to C20 cycloalkynyl, C2 to C20 heterocycloalkyl, C2 to C20 heterocycloalkenyl, C2 to C20 heterocycloalkynyl, C3 to C20 heteroaryl, or a combination thereof.
如本文所使用,當不另外提供具體定義時,「雜」是指在化學式中包含N、O、S及P中的至少一個雜原子。As used herein, when no specific definition is provided otherwise, "hetero" refers to the inclusion of at least one heteroatom among N, O, S, and P in the chemical formula.
如本文所使用,當不另外提供具體定義時,「(甲基)丙烯酸酯」是指「丙烯酸酯」及「甲基丙烯酸酯」兩者,且「(甲基)丙烯酸」是指「丙烯酸」及「甲基丙烯酸」。As used herein, when no specific definition is provided otherwise, "(meth)acrylate" refers to both "acrylate" and "methacrylate", and "(meth)acrylic acid" refers to "acrylic acid" And "methacrylic acid".
如本文所使用,當不另外提供具體定義時,「組合」是指混合或共聚合。As used herein, when no specific definition is provided otherwise, "combination" refers to mixing or copolymerization.
如本文所使用,當不另外提供定義時,當在化學式中化學鍵並未繪製在應給出處時,氫原子鍵結在所述位置處。As used herein, when no additional definition is provided, when the chemical bond is not drawn where it should be given in the chemical formula, the hydrogen atom is bonded at that position.
此外,在本說明書中,當不另外提供定義時,「*」是指與相同或不同原子或化學式連接的點。In addition, in this specification, when no additional definition is provided, "*" means a point connected to the same or different atom or chemical formula.
目前正在積極開發的量子點顯示產品最大的優點是具有寬的視角,但亦可達成接近100%的高顏色再現性。為達成此目標,塗佈的量子點單膜(藉由對量子點硬化性組成物進行硬化而形成的硬化層)應具有能夠在預定厚度下達成高顏色再現性的發射波長區,即小於或等於540奈米的發射波長(短波長)區。然而,就一般量子點合成而言,量子點單膜傾向於具有長的發射波長,其中量子點單膜的較短發射波長帶來較高的藍色光轉換率及較高的耐熱性穩定性,但量子點單膜的較長發射波長導致較低的光轉換率及較弱的耐熱性,且因此,至目前為止,量子點單膜具有長波長區中的發射波長,且因此不能達成高顏色再現性。The biggest advantage of the quantum dot display products currently being actively developed is that they have a wide viewing angle, but they can also achieve close to 100% high color reproducibility. To achieve this goal, the coated quantum dot single film (the hardened layer formed by hardening the quantum dot hardenable composition) should have an emission wavelength region capable of achieving high color reproducibility at a predetermined thickness, that is, less than or The emission wavelength (short wavelength) region equal to 540 nanometers. However, in terms of general quantum dot synthesis, quantum dot single films tend to have long emission wavelengths, and the shorter emission wavelengths of quantum dot single films bring higher blue light conversion efficiency and higher heat resistance stability. However, the longer emission wavelength of the quantum dot single film leads to lower light conversion efficiency and weaker heat resistance, and therefore, so far, the quantum dot single film has an emission wavelength in the long wavelength region, and therefore cannot achieve high color Reproducibility.
在實施例中,合成的量子點-配位體結構的結構被改變(被表面改質),使得即使具有長波長發光特性的量子點亦可具有短波長,以提供無溶劑的硬化性組成物,所述組成物形成具有短波長區中的發射波長的硬化層,且因此達成高顏色再現性,並同時保持優異的耐熱性、耐光性等。In the embodiment, the structure of the synthesized quantum dot-ligand structure is changed (modified by the surface), so that even quantum dots with long-wavelength light-emitting characteristics can also have short wavelengths to provide a solvent-free curable composition The composition forms a hardened layer having an emission wavelength in the short wavelength region, and thus achieves high color reproducibility while maintaining excellent heat resistance, light resistance, etc.
具體而言,根據實施例的無溶劑的硬化性組成物包含用由化學式1表示的化合物進行表面改質的量子點。Specifically, the solvent-free curable composition according to the embodiment includes quantum dots surface-modified with a compound represented by Chemical Formula 1.
[化學式1] [Chemical formula 1]
在化學式1中, L1 、L3 及L5 獨立地為單鍵、經取代或未經取代的C1至C20伸烷基、經取代或未經取代的C3至C20伸環烷基、經取代或未經取代的C6至C20伸芳基或者經取代或未經取代的C2至C20伸雜芳基, L2 及L4 獨立地為單鍵、*-O-*、*-S-*、*-C(=O)O-*或*-OC(=O)-*, R1 為經取代或未經取代的C1至C20烷基或者經取代或未經取代的C6至C20芳基, n為6至15的整數,且 m為1至10的整數。In Chemical Formula 1, L 1 , L 3 and L 5 are independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted Or unsubstituted C6 to C20 arylene group or substituted or unsubstituted C2 to C20 heteroaryl group, L 2 and L 4 are independently single bonds, *-O-*, *-S-*, *-C(=O)O-* or *-OC(=O)-*, R 1 is a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C6 to C20 aryl group, n is an integer from 6 to 15, and m is an integer from 1 to 10.
由化學式1表示的化合物包括以適當比率混合的極性部分及非極性部分,且因此可改善量子點在整個組成物中的分散性及聚集程度(參考圖1)。隨著分散性劣化且聚集程度增加,長波長中的發光特性可大大增加,且在實施例中,由化學式1表示的化合物可用作量子點的表面改質的材料,以改善上述問題。The compound represented by Chemical Formula 1 includes a polar part and a non-polar part mixed in an appropriate ratio, and thus can improve the dispersion and aggregation degree of quantum dots in the entire composition (refer to FIG. 1). As the dispersibility deteriorates and the degree of aggregation increases, the light emission characteristics in long wavelengths may be greatly increased, and in an embodiment, the compound represented by Chemical Formula 1 may be used as a material for surface modification of quantum dots to improve the above problems.
用由化學式1表示的化合物進行表面改質的量子點對具有極性基團的配位體(即,在末端處具有碳-碳雙鍵的可聚合單體)具有高親和力,且因此可非常容易地製備成高濃度或高度縮合的量子點分散體(量子點關於單體的分散性得到改善),並且因此對達成無溶劑的硬化性組成物及提高光效率具有非常積極的影響。The quantum dot surface-modified with the compound represented by Chemical Formula 1 has a high affinity for a ligand having a polar group (ie, a polymerizable monomer having a carbon-carbon double bond at the terminal), and therefore can be very easily It is prepared into a high-concentration or highly condensed quantum dot dispersion (the dispersibility of quantum dots with respect to monomers is improved), and therefore has a very positive effect on achieving a solvent-free curable composition and improving light efficiency.
另一方面,藉由在量子點合成期間使量子點的核大小更小,已作出了將硬化層的發射波長向短波長轉變的傳統努力。然而,含有量子點的硬化層的發射波長可能向短波長轉變,但存在例如耐光性、耐熱性等性質極大劣化的問題,且因此,已經連續進行了對同樣地保持傳統性質(耐光性、耐熱性等)以及達成高顏色再現性的方法的研究,並且結果,實施例提供能夠達成高顏色再現性且亦防止傳統性質(耐光性、耐熱性)劣化的無溶劑的硬化性組成物。On the other hand, by making the core size of the quantum dot smaller during the synthesis of the quantum dot, conventional efforts have been made to change the emission wavelength of the hardened layer to a shorter wavelength. However, the emission wavelength of the hardened layer containing quantum dots may shift to short wavelengths, but there is a problem that properties such as light resistance, heat resistance, etc. are greatly degraded, and therefore, the same has been continuously performed to maintain the traditional properties (light resistance, heat resistance, etc.). Research on methods to achieve high color reproducibility, and the results, the examples provide a solvent-free curable composition capable of achieving high color reproducibility and also preventing deterioration of conventional properties (light resistance, heat resistance).
具體而言,根據實施例的無溶劑的硬化性組成物包含:量子點,用由化學式1表示的化合物進行表面改質;及可聚合單體,在末端處具有碳-碳雙鍵。Specifically, the solvent-free curable composition according to the embodiment includes: quantum dots, which are surface-modified with a compound represented by Chemical Formula 1; and polymerizable monomers, which have carbon-carbon double bonds at the ends.
由於具有強疏水性的烷基鏈被引入至硫醇基鄰近結構中,且具有強親水性的伸烷基二醇鏈被引入至相對的端,因此由化學式1表示的化合物總體上是兩親性的,且甚至可對用於表現出長波長的發射波長的單層的量子點進行表面改質,且因此會降低發射波長並提高耐熱性等。Since the alkyl chain having strong hydrophobicity is introduced into the adjacent structure of the thiol group, and the alkylene glycol chain having strong hydrophilicity is introduced to the opposite end, the compound represented by Chemical Formula 1 is generally amphiphilic It is flexible, and even a single-layer quantum dot used to exhibit a long-wavelength emission wavelength can be surface-modified, and therefore the emission wavelength will be reduced and heat resistance will be improved.
在化學式1中,當n是小於或等於5的整數時,含量子點的硬化層的發射波長難以降低,且因此不容易達成高顏色再現性,但當n是大於或等於16的整數時,所述組成物具有如此低的黏度以至於不利於噴墨,且因此在耐熱性等方面是不利的。In Chemical Formula 1, when n is an integer less than or equal to 5, the emission wavelength of the hardened layer containing sub-dots is difficult to decrease, and therefore it is not easy to achieve high color reproducibility, but when n is an integer greater than or equal to 16, The composition has such a low viscosity that it is not conducive to ink jetting, and thus is disadvantageous in terms of heat resistance and the like.
例如,化學式1可由化學式1-1至化學式1-3中的一者表示。For example, Chemical Formula 1 may be represented by one of Chemical Formula 1-1 to Chemical Formula 1-3.
[化學式1-1] [Chemical formula 1-1]
[化學式1-2] [Chemical formula 1-2]
[化學式1-3] [Chemical formula 1-3]
在化學式1-1至化學式1-3中, L1 、L3 及L5 獨立地為單鍵、經取代或未經取代的C1至C20伸烷基、經取代或未經取代的C3至C20伸環烷基、經取代或未經取代的C6至C20伸芳基或者經取代或未經取代的C2至C20伸雜芳基, R1 及R2 獨立地為經取代或未經取代的C1至C20烷基或者經取代或未經取代的C6至C20芳基, n為6至15的整數, m為1至10的整數,且 P為0至4的整數。In Chemical Formula 1-1 to Chemical Formula 1-3, L 1 , L 3 and L 5 are independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 Cycloalkylene, substituted or unsubstituted C6 to C20 arylene or substituted or unsubstituted C2 to C20 heteroaryl, R 1 and R 2 are independently substituted or unsubstituted C1 To C20 alkyl or substituted or unsubstituted C6 to C20 aryl, n is an integer from 6 to 15, m is an integer from 1 to 10, and P is an integer from 0 to 4.
例如,在化學式1中,n可為6至11的整數。For example, in Chemical Formula 1, n may be an integer from 6 to 11.
例如,在化學式1中,R1 可由化學式R-1至化學式R-4中的一者表示,但不必受限於此。For example, in Chemical Formula 1, R 1 may be represented by one of Chemical Formula R-1 to Chemical Formula R-4, but is not necessarily limited thereto.
[化學式R-1] [Chemical formula R-1]
[化學式R-2] [Chemical formula R-2]
[化學式R-3] [Chemical formula R-3]
[化學式R-4] [Chemical formula R-4]
例如,化學式1可由化學式2至化學式5中的一者表示。For example, Chemical Formula 1 may be represented by one of Chemical Formula 2 to Chemical Formula 5.
[化學式2] [Chemical formula 2]
[化學式3] [Chemical formula 3]
[化學式4] [Chemical formula 4]
[化學式5] [Chemical formula 5]
至此,包含量子點的硬化性組成物(油墨)已經朝向與量子點具有良好相容性的特定單體發展,且此外,已經商業化。So far, curable compositions (inks) containing quantum dots have been developed toward specific monomers that have good compatibility with quantum dots, and in addition, have been commercialized.
另一方面,由於一般及廣泛使用的可聚合單體、-烯-系單體(包括乙烯系單體、丙烯酸酯系單體、甲基丙烯酸酯系單體等,其包括單官能單體或多官能單體)與量子點具有低的相容性,並且在量子點的分散性方面受到限制,因此有效地將其應用於含量子點的硬化性組成物的各種開發實質上是困難的。最重要的是,-烯-系單體沒有顯示出高濃度量子點分散性,且因此難以應用於含量子點的硬化性組成物。On the other hand, due to the generally and widely used polymerizable monomers,-vinyl monomers (including vinyl monomers, acrylate monomers, methacrylate monomers, etc., which include monofunctional monomers or The polyfunctional monomer) has low compatibility with quantum dots and is limited in the dispersibility of quantum dots. Therefore, it is substantially difficult to effectively apply it to various developments of curable compositions containing quantum dots. Most importantly, the -ene-based monomer does not show high-concentration quantum dot dispersibility, and therefore it is difficult to apply it to a curable composition containing quantum dots.
由於該些缺點,含量子點的硬化性組成物已經被開發成具有包含相當量(大於或等於50重量%)的溶劑的組成物,但當溶劑含量增加時,噴墨可處理性可能劣化。因此,為滿足噴墨可處理性,對無溶劑的硬化性組成物的需求不斷增加。Due to these shortcomings, a curable composition containing sub-dots has been developed to have a composition containing a considerable amount (greater than or equal to 50% by weight) of solvent, but when the solvent content increases, inkjet processability may be deteriorated. Therefore, in order to satisfy inkjet processability, there is an increasing demand for solvent-free curable compositions.
本發明提供一種需求不斷增加的無溶劑的硬化性組成物,且藉由使用包括在末端處具有碳-碳雙鍵的化合物的可聚合單體以及用由化學式1表示的化合物進行表面改質的量子點,即使在無溶劑系統中亦可提高用於硬化性組成物的量子點的親和力,以達成量子點的高濃度分散性及甚至鈍化效果,同時不損害量子點的自然光學特性。The present invention provides a solvent-free curable composition whose demand is increasing, and by using a polymerizable monomer including a compound having a carbon-carbon double bond at the terminal, and a compound represented by Chemical Formula 1 for surface modification Quantum dots can increase the affinity of quantum dots used in curable compositions even in solvent-free systems, so as to achieve high-concentration dispersibility and even passivation effects of quantum dots without compromising the natural optical properties of quantum dots.
以下,詳細闡述構成無溶劑的硬化性組成物的每一組分。量子點 Hereinafter, each component constituting the solvent-free curable composition will be explained in detail. Quantum dots
包含在無溶劑的硬化性組成物中的量子點是用由化學式1表示的化合物進行表面改質的量子點。The quantum dots contained in the solvent-free curable composition are quantum dots whose surface is modified with a compound represented by Chemical Formula 1.
例如,量子點在360奈米至780奈米、例如400奈米至780奈米的波長區中吸收光,且在500奈米至700奈米、例如500奈米至580奈米的波長區中發射螢光或在600奈米至680奈米的波長區中發射螢光。亦即,量子點在500奈米至680奈米下可具有最大螢光發射波長(λem )。For example, quantum dots absorb light in the wavelength region of 360 nanometers to 780 nanometers, such as 400 nanometers to 780 nanometers, and in the wavelength region of 500 nanometers to 700 nanometers, such as 500 nanometers to 580 nanometers. Emit fluorescence or emit fluorescence in the wavelength region of 600 nm to 680 nm. That is, quantum dots can have a maximum fluorescence emission wavelength (λ em ) under 500 nanometers to 680 nanometers.
量子點可獨立地具有20奈米至100奈米、例如20奈米至50奈米的半高寬(full width at half maximum,FWHM)。當量子點具有所述範圍的半高寬(FWHM)時,由於高顏色純度,當用作彩色濾光片中的顏色材料時,顏色再現性增加。The quantum dots may independently have a full width at half maximum (FWHM) of 20 nanometers to 100 nanometers, for example, 20 nanometers to 50 nanometers. When the quantum dot has the full width at half maximum (FWHM) of the range, due to high color purity, color reproducibility increases when used as a color material in a color filter.
量子點可獨立地為有機材料、或無機材料或者有機材料與無機材料的混成(混合物)。The quantum dots can independently be organic materials, inorganic materials, or a mixture (mixture) of organic materials and inorganic materials.
量子點可獨立地由核及圍繞核的殼構成,且核及殼可獨立地具有由II-IV族、III-V族等構成的核、核/殼、核/第一殼/第二殼、合金、合金/殼等的結構,但不限於此。Quantum dots can be independently composed of a core and a shell surrounding the core, and the core and shell can independently have a core, core/shell, core/first shell/second shell composed of II-IV groups, III-V groups, etc. , Alloy, alloy/shell, etc., but not limited to this.
舉例而言,所述核可至少包含選自CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、HgS、HgSe、HgTe、GaN、GaP、GaAs、InP、InAs及其合金的至少一種材料,但不必受限於此。環繞所述核的所述殼可至少包含選自CdSe、ZnSe、ZnS、ZnTe、CdTe、PbS、TiO、SrSe、HgSe及其合金的至少一種材料,但不必受僅限於此。For example, the core may include at least one material selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs, and alloys thereof. Limited to this. The shell surrounding the core may include at least one material selected from CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe, and alloys thereof, but is not necessarily limited to this.
在實施例中,由於近來全世界對環境的關注已大大增加,且有毒材料的管制已加強,因此使用量子效率(量子產率)稍低但對環境無害的無鎘的發光材料(InP/ZnS、InP/ZnSe/ZnS等)來替代具有鎘系核的發光材料,但不必受限於此。In the examples, since the world’s attention to the environment has been greatly increased recently, and the control of toxic materials has been strengthened, cadmium-free luminescent materials (InP/ZnS) with slightly lower quantum efficiency (quantum yield) but not harmful to the environment are used. , InP/ZnSe/ZnS, etc.) to replace luminescent materials with cadmium-based nuclei, but not limited to this.
在核/殼結構的量子點的情況下,包括殼的整體大小(平均粒徑)可為1奈米至15奈米、例如5奈米至15奈米。In the case of a core/shell structured quantum dot, the overall size (average particle size) including the shell may be 1 nanometer to 15 nanometers, for example, 5 nanometers to 15 nanometers.
舉例而言,量子點可獨立地包括紅色量子點、綠色量子點或其組合。紅色量子點可獨立地具有10奈米至15奈米的平均粒徑。綠色量子點可獨立地具有5奈米至8奈米的平均粒徑。For example, the quantum dots may independently include red quantum dots, green quantum dots, or a combination thereof. The red quantum dots may independently have an average particle diameter of 10 nm to 15 nm. The green quantum dots may independently have an average particle diameter of 5 nm to 8 nm.
另一方面,為達成量子點的分散穩定性,根據實施例的無溶劑的硬化性組成物可更包含分散劑。分散劑有助於例如量子點等光轉換材料在無溶劑的硬化性組成物中的均勻分散性,且可包括非離子分散劑、陰離子分散劑或陽離子分散劑。具體而言,分散劑可為聚烷二醇或其酯、聚氧化烯烴、多元醇酯環氧烷加成產物、醇環氧烷加成產物、磺酸酯、磺酸鹽、羧酸酯、羧酸鹽、烷基醯胺環氧烷加成產物、烷基胺等,且其可單獨使用或者以二或更多者的混合物形式使用。以光轉換材料(例如量子點)的固體含量計,可使用0.1重量%至100重量%、例如10重量%至20重量%的量的分散劑。On the other hand, in order to achieve dispersion stability of quantum dots, the solvent-free curable composition according to the embodiment may further include a dispersant. The dispersant contributes to the uniform dispersibility of the light conversion material such as quantum dots in the solvent-free curable composition, and may include a nonionic dispersant, an anionic dispersant, or a cationic dispersant. Specifically, the dispersant may be polyalkylene glycol or its ester, polyoxyalkylene, polyol ester alkylene oxide addition product, alcohol alkylene oxide addition product, sulfonate, sulfonate, carboxylate, Carboxylate, alkyl amine alkylene oxide addition product, alkyl amine, etc., and they may be used alone or in the form of a mixture of two or more. Based on the solid content of the light conversion material (for example, quantum dots), the dispersant may be used in an amount of 0.1% by weight to 100% by weight, for example, 10% by weight to 20% by weight.
以無溶劑的硬化性組成物的總量計,可包含1重量%至60重量%、例如3重量%至50重量%的量的用化學式1進行表面改質的量子點。當包含處於所述範圍內的表面改質的量子點時,可提高光轉換率,且圖案特性及顯影特性不受干擾,使得其可具有優異的可處理性。在末端處具有碳 - 碳雙鍵的可聚合單體 Based on the total amount of the solvent-free curable composition, the quantum dots surface-modified using Chemical Formula 1 may be included in an amount of 1% to 60% by weight, for example, 3% to 50% by weight. When the surface-modified quantum dots within the range are included, the light conversion rate can be improved, and the pattern characteristics and development characteristics are not disturbed, so that it can have excellent handleability. Polymerizable monomers with carbon- carbon double bonds at the ends
以無溶劑的硬化性組成物的總量計,應包含40重量%至99重量%、例如50重量%至97重量%的量的在末端處具有碳-碳雙鍵的單體。當包含處於所述範圍內的在末端處具有碳-碳雙鍵的單體時,可製備具有能夠噴墨的黏度的無溶劑的硬化性組成物,且製備的無溶劑的硬化性組成物中的量子點可具有改善的分散性,由此改善光學特性。Based on the total amount of the solvent-free curable composition, the monomer having a carbon-carbon double bond at the terminal should be contained in an amount of 40% to 99% by weight, for example, 50% to 97% by weight. When a monomer having a carbon-carbon double bond at the end is contained within the range, a solvent-free curable composition having a viscosity capable of inkjet can be prepared, and the prepared solvent-free curable composition The quantum dots can have improved dispersibility, thereby improving optical properties.
例如,在末端處具有碳-碳雙鍵的單體可具有220克/莫耳至1,000克/莫耳的分子量。當在末端處具有碳-碳雙鍵的單體具有處於所述範圍內的分子量時,可有利地進行噴墨,此乃因其不會增加組成物的黏度且不妨礙量子點的光學特性。For example, a monomer having a carbon-carbon double bond at the terminal may have a molecular weight of 220 g/mole to 1,000 g/mole. When the monomer having a carbon-carbon double bond at the end has a molecular weight within the range, ink jetting can be advantageously performed because it does not increase the viscosity of the composition and does not hinder the optical properties of the quantum dots.
例如,在末端處具有碳-碳雙鍵的單體可由化學式6表示,但不必受限於此。For example, a monomer having a carbon-carbon double bond at the terminal can be represented by Chemical Formula 6, but it is not necessarily limited thereto.
[化學式6] [Chemical formula 6]
在化學式6中, R3 及R4 可獨立地為氫原子或者經取代或未經取代的C1至C10烷基, L6 及L8 可獨立地為經取代或未經取代的C1至C10伸烷基,且 L7 可為經取代或未經取代的C1至C10伸烷基或醚基(*-O-*),且*為連接點。In Chemical Formula 6, R 3 and R 4 may independently be a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group, and L 6 and L 8 may independently be a substituted or unsubstituted C1 to C10 alkyl group. Alkyl group, and L 7 may be a substituted or unsubstituted C1 to C10 alkylene group or ether group (*-O-*), and * is the point of attachment.
例如,在末端處具有碳-碳雙鍵的單體可由化學式6-1或6-2表示,但不必受限於此。For example, a monomer having a carbon-carbon double bond at the terminal may be represented by Chemical Formula 6-1 or 6-2, but it is not necessarily limited thereto.
[化學式6-1] [Chemical formula 6-1]
[化學式6-2] [Chemical formula 6-2]
例如,除了上述化學式6-1或化學式6-2的化合物之外,在末端處具有碳-碳雙鍵的單體可更包括乙二醇二丙烯酸酯、三乙烯乙二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、新戊二醇二丙烯酸酯、季戊四醇二丙烯酸酯、季戊四醇三丙烯酸酯、二季戊四醇二丙烯酸酯、二季戊四醇三丙烯酸酯、二季戊四醇五丙烯酸酯、季戊四醇六丙烯酸酯、雙酚A二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、酚醛環氧丙烯酸酯、乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、丙二醇二甲基丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、1,6-己二醇二甲基丙烯酸酯或其組合。For example, in addition to the compound of the above-mentioned chemical formula 6-1 or chemical formula 6-2, the monomer having a carbon-carbon double bond at the terminal may further include ethylene glycol diacrylate, triethylene glycol diacrylate, 1 ,4-Butanediol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate , Dipentaerythritol pentaacrylate, pentaerythritol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, novolac epoxy acrylate, ethylene glycol dimethacrylate, triethylene glycol dimethyl Acrylate, propylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, or a combination thereof.
此外,與在末端處具有碳-碳雙鍵的單體一起,可更包括傳統熱固性或光硬化性組成物的常用單體。例如,單體更包括氧雜環丁烷系化合物,如雙[1-乙基(3-氧雜環丁基)]甲醚等。聚合起始劑 In addition, together with monomers having carbon-carbon double bonds at the ends, common monomers of conventional thermosetting or photocuring compositions may be further included. For example, the monomer further includes oxetane-based compounds, such as bis[1-ethyl(3-oxetanyl)] methyl ether and the like. Polymerization initiator
根據實施例的無溶劑的硬化性組成物可更包含聚合起始劑,例如光聚合起始劑、熱聚合起始劑或其組合。The solvent-free curable composition according to the embodiment may further include a polymerization initiator, such as a photopolymerization initiator, a thermal polymerization initiator, or a combination thereof.
光聚合起始劑是常用於感光性樹脂組成物的起始劑,例如苯乙酮系化合物、二苯甲酮系化合物、噻噸酮系化合物、安息香系化合物、三嗪系化合物、肟系化合物、胺基酮系化合物等,但不必受限於此。Photopolymerization initiators are initiators commonly used in photosensitive resin compositions, such as acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, and oxime-based compounds , Aminoketone compounds, etc., but not necessarily limited to this.
苯乙酮系化合物的實例可為2,2'-二乙氧基苯乙酮、2,2'-二丁氧基苯乙酮、2-羥基-2-甲基苯丙酮、對第三丁基三氯苯乙酮、對第三丁基二氯苯乙酮、4-氯苯乙酮、2,2'-二氯-4-苯氧基苯乙酮、2-甲基-1-(4-(甲硫基)苯基)-2-嗎啉基丙-1-酮、2-苯甲基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁-1-酮等。Examples of acetophenone compounds may be 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyl Trichloroacetophenone, p-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-( 4-(Methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan- 1-ketone etc.
二苯甲酮系化合物的實例可為二苯甲酮、苯甲酸苯甲醯基酯、苯甲酸苯甲醯基甲酯、4-苯基二苯甲酮、羥基二苯甲酮、丙烯酸化二苯甲酮、4,4'-雙(二甲基胺基)二苯甲酮、4,4'-雙(二乙基胺基)二苯甲酮、4,4'-二甲基胺基二苯甲酮、4,4'-二氯二苯甲酮、3,3'-二甲基-2-甲氧基二苯甲酮等。Examples of benzophenone-based compounds can be benzophenone, benzophenone benzoate, benzophenone methyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, two acrylate Benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylamino Benzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.
噻噸酮系化合物的實例可為噻噸酮、2-甲基噻噸酮、異丙基噻噸酮、2,4-二乙基噻噸酮、2,4-二異丙基噻噸酮、2-氯噻噸酮等。Examples of thioxanthone compounds can be thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone , 2-Chlorothioxanthone and so on.
安息香系化合物的實例可為安息香、安息香甲醚、安息香乙醚、安息香異丙醚、安息香異丁醚、苯甲基二甲基縮酮等。Examples of benzoin-based compounds may be benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.
三嗪系化合物的實例可為2,4,6-三氯-s-三嗪、2-苯基-4,6-雙(三氯甲基)-s-三嗪、2-(3',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-s-三嗪、2-(4'-甲氧基萘基)-4,6-雙(三氯甲基)-s-三嗪、2-(對甲氧基苯基)-4,6-雙(三氯甲基)-s-三嗪、2-(對甲苯基)-4,6-雙(三氯甲基)-s-三嗪、2-聯苯基-4,6-雙(三氯甲基)-s-三嗪、雙(三氯甲基)-6-苯乙烯基-s-三嗪、2-(萘酚1-基)-4,6-雙(三氯甲基)-s-三嗪、2-(4-甲氧基萘酚1-基)-4,6-雙(三氯甲基)-s-三嗪、2-4-雙(三氯甲基)-6-胡椒基-s-三嗪、2-4-雙(三氯甲基)-6-(4-甲氧基苯乙烯基)-s-三嗪等。Examples of triazine-based compounds may be 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3', 4'-Dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloro) Methyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis (Trichloromethyl)-s-triazine, 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s -Triazine, 2-(naphthol 1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthol 1-yl)-4,6- Bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-( 4-methoxystyryl)-s-triazine and the like.
肟系化合物的實例可為O-醯基肟系化合物、2-(O-苯甲醯基肟)-1-[4-(苯硫基)苯基]-1,2-辛二酮、1-(O-乙醯基肟)-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]乙酮、O-乙氧基羰基-α-氧基胺基-1-苯基丙-1-酮等。O-醯基肟系化合物的具體實例可為1,2-辛二酮、2-二甲基胺基-2-(4-甲基苯甲基)-1-(4-嗎啉-4-基-苯基)-丁-1-酮、1-(4-苯硫基苯基)-丁烷-1,2-二酮-2-肟-O-苯甲酸酯、1-(4-苯硫基苯基)-辛烷-1,2-二酮-2-肟-O-苯甲酸酯、1-(4-苯硫基苯基)-辛-1-酮肟-O-乙酸酯、1-(4-苯硫基苯基)-丁-1-酮肟- O-乙酸酯等。Examples of oxime-based compounds can be O-acyl oxime-based compounds, 2-(O-benzyl oxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1 -(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl- α-Oxyamino-1-phenylpropan-1-one and the like. Specific examples of O-acetoxime-based compounds may be 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholine-4- -Phenyl)-butan-1-one, 1-(4-phenylthiophenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4- Phenylthiophenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylthiophenyl)-octan-1-one oxime-O-ethyl Ester, 1-(4-phenylthiophenyl)-butan-1-one oxime-O-acetate, etc.
胺基酮系化合物的實例可為2-苯甲基-2-二甲基胺基-1-(4-嗎啉苯基)-丁酮-1等。Examples of the aminoketone compound may be 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 and the like.
光聚合起始劑除所述化合物之外可更包含咔唑系化合物、二酮系化合物、硼酸鋶系化合物、重氮系化合物、咪唑系化合物、聯咪唑系化合物等。The photopolymerization initiator may further include a carbazole-based compound, a diketone-based compound, a borate-based compound, a diazonium-based compound, an imidazole-based compound, a biimidazole-based compound, and the like in addition to the above-mentioned compounds.
光聚合起始劑可與能夠藉由吸收光引起化學反應且變得激發並隨後傳輸其能量的光增感劑一起使用。The photopolymerization initiator can be used together with a photosensitizer capable of causing a chemical reaction by absorbing light and becoming excited and then transferring its energy.
光增感劑的實例可為四乙二醇雙-3-巰基丙酸酯、季戊四醇四-3-巰基丙酸酯、二季戊四醇四-3-巰基丙酸酯等。Examples of photosensitizers may be tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetra-3-mercaptopropionate, dipentaerythritol tetra-3-mercaptopropionate, and the like.
熱聚合起始劑的實例可為過氧化物,具體而言過氧化苯甲醯、過氧化二苯甲醯、過氧化月桂基、過氧化二月桂基、過氧化二-第三丁基、過氧化環己烷、過氧化甲乙酮、氫過氧化物(例如第三丁基氫過氧化物、枯烯氫過氧化物)、過氧化二碳酸二環己基酯、2,2-偶氮-雙(異丁腈)、過苯甲酸第三丁酯等,例如2,2'-偶氮雙-2-甲基丙腈,但未必受限於此,且可使用此項技術中眾所習知的任何一種。Examples of thermal polymerization initiators may be peroxides, specifically, benzyl peroxide, dibenzyl peroxide, lauryl peroxide, dilauryl peroxide, di-tert-butyl peroxide, Cyclohexane oxide, methyl ethyl ketone peroxide, hydroperoxides (such as tertiary butyl hydroperoxide, cumene hydroperoxide), dicyclohexyl peroxydicarbonate, 2,2-azo-bis( Isobutyronitrile), tert-butyl perbenzoate, etc., such as 2,2'-azobis-2-methylpropionitrile, but not necessarily limited to this, and well-known in the art can be used any type.
以無溶劑的硬化性組成物的總量計,可包含0.1重量%至5重量%、例如1重量%至4重量%的量的聚合起始劑。當聚合起始劑包括在所述範圍內時,由於曝光或熱硬化期間的充分硬化,可獲得優異的可靠性,且防止由於非反應起始劑導致的透射率劣化,由此防止量子點的光學特性劣化。光擴散劑(或光擴散劑分散體) Based on the total amount of the solvent-free curable composition, the polymerization initiator may be included in an amount of 0.1% to 5% by weight, for example, 1% to 4% by weight. When the polymerization initiator is included in the range, due to sufficient hardening during exposure or thermal hardening, excellent reliability can be obtained, and deterioration of transmittance due to non-reactive initiators is prevented, thereby preventing quantum dots from being degraded The optical characteristics are degraded. Light diffuser (or light diffuser dispersion)
根據實施例的無溶劑的硬化性組成物可更包含光擴散劑。The solvent-free curable composition according to the embodiment may further include a light diffusing agent.
舉例而言,光擴散劑可包括硫酸鋇(BaSO4 )、碳酸鈣(CaCO3 )、二氧化鈦(TiO2 )、氧化鋯(ZrO2 )或其組合。For example, the light diffusion agent may include barium sulfate (BaSO 4 ), calcium carbonate (CaCO 3 ), titanium dioxide (TiO 2 ), zirconium oxide (ZrO 2 ), or a combination thereof.
光擴散劑可反射前述量子點中未被吸收的光,且容許量子點再次吸收反射光。亦即,光擴散劑可增加被量子點吸收的光量,且提高硬化性組成物的光轉換效率。The light diffusing agent can reflect the unabsorbed light in the aforementioned quantum dots and allow the quantum dots to absorb the reflected light again. That is, the light diffusing agent can increase the amount of light absorbed by the quantum dots and improve the light conversion efficiency of the curable composition.
光擴散劑可具有150奈米至250奈米、且具體而言180奈米至230奈米的平均粒徑(D50 )。當光擴散劑的平均粒徑處於所述範圍內時,其可具有更佳的光擴散效果並提高光轉換效率。 The light diffusing agent may have an average particle diameter (D 50 ) of 150 nanometers to 250 nanometers, and specifically 180 nanometers to 230 nanometers. When the average particle diameter of the light diffusing agent is within the range, it can have a better light diffusing effect and improve light conversion efficiency.
以無溶劑的硬化性組成物的總量計,可包含1重量%至20重量%、例如5重量%至10重量%的量的光擴散劑。當以無溶劑的硬化性組成物的總量計,包含小於1重量%的量的光擴散劑時,由於光擴散劑的使用,難以期望光轉換效率提高效果,而當包含大於20重量%的光擴散劑時,存在量子點可能沈澱的可能性。其他添加劑 Based on the total amount of the solvent-free curable composition, the light diffusing agent may be included in an amount of 1% to 20% by weight, for example, 5% to 10% by weight. When the light diffusing agent is contained in an amount of less than 1% by weight based on the total amount of the solvent-free curable composition, it is difficult to expect the light conversion efficiency improvement effect due to the use of the light diffusing agent, and when it contains more than 20% by weight In the case of light diffusing agents, there is a possibility that quantum dots may precipitate. Other additives
為達成量子點的穩定性及分散改善,根據實施例的無溶劑的硬化性組成物可更包含聚合抑制劑。In order to improve the stability and dispersion of the quantum dots, the solvent-free curable composition according to the embodiment may further include a polymerization inhibitor.
聚合抑制劑可包括氫醌系化合物、兒茶酚系化合物或其組合,但不必受限於此。當根據實施例的無溶劑的硬化性組成物更包含氫醌系化合物、兒茶酚系化合物或其組合時,可防止在塗佈無溶劑的硬化性組成物後曝光期間的室溫交聯。The polymerization inhibitor may include a hydroquinone-based compound, a catechol-based compound, or a combination thereof, but is not necessarily limited thereto. When the solvent-free curable composition according to the embodiment further includes a hydroquinone-based compound, a catechol-based compound, or a combination thereof, it is possible to prevent crosslinking at room temperature during exposure after coating the solvent-free curable composition.
例如,氫醌系化合物、兒茶酚系化合物或其組合可為氫醌、甲基氫醌、甲氧基氫醌、第三丁基氫醌、2,5-二第三丁基氫醌、2,5-雙(1,1-二甲基丁基)氫醌、2,5-雙(1,1,3,3-四甲基丁基)氫醌、兒茶酚、第三丁基兒茶酚、4-甲氧基苯酚、五倍子酚、2,6-二-第三丁基-4-甲基苯酚、2-萘酚、三(N-羥基-N-亞硝基苯基胺基-O,O')鋁或其組合,但不必受限於此。For example, the hydroquinone-based compound, the catechol-based compound, or a combination thereof may be hydroquinone, methylhydroquinone, methoxyhydroquinone, tertiary butyl hydroquinone, 2,5-di tertiary butyl hydroquinone, 2,5-bis(1,1-dimethylbutyl)hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl)hydroquinone, catechol, tertiary butyl Catechol, 4-methoxyphenol, gallic phenol, 2,6-di-tert-butyl-4-methylphenol, 2-naphthol, tris(N-hydroxy-N-nitrosophenylamine) Base-O,O') aluminum or a combination thereof, but not necessarily limited thereto.
氫醌系化合物、兒茶酚系化合物或其組合可以分散體的形式使用。以無溶劑的硬化性組成物的總量計,可包含0.001重量%至3重量%、例如0.1重量%至2重量%的量的分散體形式的聚合抑制劑。當包括處於所述範圍內的聚合抑制劑時,可解決在室溫下的時間流逝,且同時可防止靈敏度劣化及表面分層現象。The hydroquinone-based compound, the catechol-based compound, or a combination thereof can be used in the form of a dispersion. Based on the total amount of the solvent-free curable composition, the polymerization inhibitor in the form of a dispersion may be included in an amount of 0.001% to 3% by weight, for example, 0.1% to 2% by weight. When the polymerization inhibitor in the range is included, the lapse of time at room temperature can be solved, and at the same time, deterioration of sensitivity and surface delamination can be prevented.
此外,根據實施例的無溶劑的硬化性組成物可更包含丙二酸;3-胺基-1,2-丙二醇;矽烷系偶合劑;調平劑;氟系界面活性劑;或其組合,以改善耐熱性及可靠性。In addition, the solvent-free curable composition according to the embodiment may further include malonic acid; 3-amino-1,2-propanediol; silane coupling agent; leveling agent; fluorine-based surfactant; or a combination thereof, To improve heat resistance and reliability.
舉例而言,根據實施例的無溶劑的硬化性組成物可更包含具有例如乙烯基、羧基、甲基丙烯醯氧基、異氰酸酯基、環氧基等反應性取代基的矽烷系偶合劑以改善與基板的緊密接觸性質。For example, the solvent-free curable composition according to the embodiment may further include a silane coupling agent having reactive substituents such as vinyl, carboxyl, methacryloxy, isocyanate, epoxy, etc. to improve Close contact with the substrate.
矽烷系偶合劑的實例可為三甲氧基矽烷基苯甲酸、γ-甲基丙烯酸基氧基丙基三甲氧基矽烷、乙烯基三乙醯氧基矽烷、乙烯基三甲氧基矽烷、γ-異氰酸酯丙基三乙氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、β-環氧環己基乙基三甲氧基矽烷等,且該些偶合劑可單獨使用或者以兩種或更多種的混合物形式使用。Examples of silane-based coupling agents may be trimethoxysilyl benzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyl triethoxysilane, vinyl trimethoxysilane, and γ-isocyanate. Propyl triethoxy silane, γ-glycidoxy propyl trimethoxy silane, β-epoxycyclohexyl ethyl trimethoxy silane, etc., and these coupling agents can be used alone or in two or more Used in the form of a mixture of species.
以100重量份的無溶劑的硬化性組成物計,可使用0.01重量份至10重量份的量的矽烷系偶合劑。當包含處於所述範圍內的矽烷系偶合劑時,緊密接觸性質、儲存能力等得以改善。The silane coupling agent can be used in an amount of 0.01 parts by weight to 10 parts by weight based on 100 parts by weight of the solvent-free curable composition. When the silane coupling agent is included in the above range, the close contact properties, storage capacity, etc. are improved.
此外,無溶劑的硬化性組成物可視需要更包含界面活性劑(例如氟系界面活性劑)以改善塗佈性質並抑制斑點的產生,即改善調平效能。In addition, the solvent-free curable composition may further include a surfactant (such as a fluorine-based surfactant) as needed to improve coating properties and suppress the occurrence of spots, that is, to improve leveling performance.
氟系界面活性劑可具有4,000克/莫耳至10,000克/莫耳、且具體而言6,000克/莫耳至10,000克/莫耳的低重量平均分子量。此外,氟系界面活性劑可具有18毫牛/米至23毫牛/米(在0.1%的聚乙二醇單甲醚乙酸酯(polyethylene glycol monomethylether acetate,PGMEA)溶液中測得)的表面張力。當氟系界面活性劑具有處於所述範圍內的重量平均分子量及表面張力時,調平效能可進一步改善,且當施加狹縫塗佈作為高速塗佈時,可提供優異的特性,乃因可藉由在高速塗佈期間防止斑點產生並抑制蒸氣產生而較少地產生膜缺陷。The fluorine-based surfactant may have a low weight average molecular weight of 4,000 g/mol to 10,000 g/mol, and specifically, 6,000 g/mol to 10,000 g/mol. In addition, the fluorine-based surfactant can have a surface of 18 mN/m to 23 mN/m (measured in a 0.1% polyethylene glycol monomethylether acetate (PGMEA) solution) tension. When the fluorine-based surfactant has a weight average molecular weight and surface tension within the range, the leveling performance can be further improved, and when slit coating is applied as high-speed coating, it can provide excellent characteristics because it can By preventing spot generation and suppressing vapor generation during high-speed coating, film defects are less generated.
氟系界面活性劑的實例可為BM-1000® 及BM-1100® (BM化學公司(BM Chemie Inc.));美佳法(MEGAFACE)F 142D® 、F 172® 、F 173® 及F 183® (大日本油墨化工有限公司(Dainippon Ink Kagaku Kogyo Co., Ltd.));弗洛拉德(FULORAD)FC-135® 、弗洛拉德FC-170C® 、弗洛拉德FC-430® 及弗洛拉德FC-431® (住友3M有限公司(Sumitomo 3M Co., Ltd.));沙福隆(SURFLON)S-112® 、沙福隆S-113® 、沙福隆S-131® 、沙福隆S-141® 及沙福隆S-145® (旭硝子玻璃有限公司(ASAHI Glass Co., Ltd.));以及SH-28PA® 、SH-190®、SH-193® 、SZ-6032® 及SF-8428® 等(東麗矽酮有限公司(Toray Silicone Co., Ltd.));大日本油墨化工有限公司(DIC Co., Ltd.)的F-482、F-484、F-478、F-554等。Examples of fluorine-based surfactants can be BM-1000 ® and BM-1100 ® (BM Chemie Inc.); MEGAFACE F 142D ® , F 172 ® , F 173 ® and F 183 ® (Dainippon Ink Kagaku Kogyo Co., Ltd.); Florad FC-135 ® , Florad FC-170C ® , Florard FC-430 ® and Florard FC-431 ® (Sumitomo 3M Co., Ltd.); SURFLON S-112 ® , Saffron S-113 ® , Saffron S-131 ® , Saffron S-141 ® and Saffron S-145 ® (ASAHI Glass Co., Ltd.); and SH-28PA ® , SH-190®, SH-193 ® , SZ- 6032 ® and SF-8428 ®, etc. (Toray Silicone Co., Ltd.); Dainippon Ink Chemical Co., Ltd. (DIC Co., Ltd.) F-482, F-484, F -478, F-554, etc.
此外,除了氟系界面活性劑之外,根據實施例的無溶劑的硬化性組成物可更包含矽酮系界面活性劑。矽酮系界面活性劑的具體實例可為東芝矽酮有限公司(Toshiba silicone Co., Ltd.)的TSF400、TSF401、TSF410、TSF4440等,但不限於此。In addition, in addition to the fluorine-based surfactant, the solvent-free curable composition according to the embodiment may further include a silicone-based surfactant. Specific examples of silicone-based surfactants can be TSF400, TSF401, TSF410, TSF4440, etc. of Toshiba silicone Co., Ltd., but are not limited thereto.
以100重量份的無溶劑的硬化性組成物計,可包含0.01重量份至5重量份、例如0.1重量份至2重量份的量的界面活性劑。當包含處於所述範圍內的界面活性劑時,在噴射的組成物中較少地生成異物。Based on 100 parts by weight of the solvent-free curable composition, the surfactant may be included in an amount of 0.01 parts by weight to 5 parts by weight, for example, 0.1 parts by weight to 2 parts by weight. When the surfactant is contained in the above range, less foreign matter is generated in the sprayed composition.
另外,除非性質劣化,否則根據實施例的無溶劑的硬化性組成物可更包含預定量的其他添加劑,例如抗氧化劑、穩定劑等。In addition, unless the properties are deteriorated, the solvent-free curable composition according to the embodiment may further include a predetermined amount of other additives, such as antioxidants, stabilizers, and the like.
另一實施例提供一種使用上述無溶劑的硬化性組成物生產的硬化層。Another embodiment provides a hardened layer produced using the above solvent-free hardenable composition.
由於硬化層是藉由對根據實施例的無溶劑的硬化性組成物進行硬化而生產的,因此其可具有小於或等於540奈米的發射波長,由此最終達成高顏色再現性並保持優異的性質,例如耐熱性及耐光性。Since the hardened layer is produced by hardening the solvent-free hardenable composition according to the embodiment, it can have an emission wavelength less than or equal to 540 nm, thereby finally achieving high color reproducibility and maintaining excellent Properties, such as heat resistance and light resistance.
生產硬化層的一種方法可包括:使用噴墨噴射方法將上述無溶劑的硬化性組成物塗佈在基板上以形成圖案(S1);及對圖案進行硬化(S2)。 (S1)形成圖案One method of producing a hardened layer may include: coating the above-mentioned solvent-free hardenable composition on a substrate using an inkjet jet method to form a pattern (S1); and hardening the pattern (S2). (S1) Pattern formation
可期望以噴墨噴射方法將無溶劑的硬化性組成物在基板上塗佈成0.5微米至20微米。噴墨噴射方法可藉由每一噴嘴噴射單一顏色且因此重複噴射與所需數目的顏色相等的次數來形成圖案,但圖案可藉由每一噴墨噴嘴同時噴射所需數目的顏色來形成,以減少製程。 (S2)硬化It can be expected that the solvent-free curable composition is coated on the substrate to a thickness of 0.5 μm to 20 μm by an inkjet jet method. The inkjet ejection method can form a pattern by ejecting a single color from each nozzle and thus repeating ejection as many times as the required number of colors, but the pattern can be formed by ejecting the required number of colors from each inkjet nozzle at the same time. To reduce the manufacturing process. (S2) Hardening
對所獲得的圖案進行硬化以獲得畫素。本文中,硬化方法可為熱硬化或光硬化製程。熱硬化製程可在大於或等於100℃下、期望地在100℃至300℃的範圍內、且更期望地在160℃至250℃的範圍內執行。光硬化製程可包括照射光化射線,例如190奈米至450奈米、例如200奈米至500奈米的紫外(ultraviolet,UV)射線。使用例如具有低壓、高壓或超高壓的汞燈、金屬鹵素燈、氬氣雷射等光源來執行照射。視需要亦可使用X射線、電子束等。The obtained pattern is hardened to obtain pixels. Here, the hardening method may be a thermal hardening or light hardening process. The thermal hardening process may be performed at a temperature greater than or equal to 100°C, desirably in the range of 100°C to 300°C, and more desirably in the range of 160°C to 250°C. The photohardening process may include irradiating actinic rays, such as ultraviolet (UV) rays of 190 nanometers to 450 nanometers, such as 200 nanometers to 500 nanometers. Irradiation is performed using light sources such as mercury lamps, metal halide lamps, argon lasers, etc. having low pressure, high pressure, or ultrahigh pressure. X-rays, electron beams, etc. can also be used as needed.
生產硬化層的其他方法可包括使用前述無溶劑的硬化性組成物及溶劑型硬化性組成物藉由如下光刻方法來生產硬化層。 (1)塗佈及膜形成Other methods of producing the hardened layer may include using the aforementioned solvent-free hardenable composition and solvent-based hardenable composition to produce the hardened layer by the following photolithography method. (1) Coating and film formation
利用旋塗或狹縫塗佈方法、輥塗方法、網版印刷方法、塗料器方法等在經受預定預處理的基板上將前述硬化性組成物塗佈成具有期望的厚度,例如介於2微米至10微米範圍內的厚度。然後,將經塗佈的基板在70℃至90℃的溫度下加熱1分鐘至10分鐘,以移除溶劑並形成膜。 (2)曝光The aforementioned curable composition is coated on a substrate subjected to a predetermined pretreatment by spin coating or slit coating method, roll coating method, screen printing method, coater method, etc., to have a desired thickness, for example, between 2 microns To a thickness in the range of 10 microns. Then, the coated substrate is heated at a temperature of 70°C to 90°C for 1 minute to 10 minutes to remove the solvent and form a film. (2) Exposure
在安放具有預定形狀的遮罩之後,藉由190奈米至450奈米、例如200奈米至500奈米的例如UV射線等光化射線來照射所得膜以形成期望的圖案。使用例如具有低壓、高壓或超高壓的汞燈、金屬鹵素燈、氬氣雷射等光源來執行照射。視需要亦可使用X射線、電子束等。After placing a mask having a predetermined shape, the resulting film is irradiated with actinic rays such as UV rays of 190 nm to 450 nm, for example, 200 nm to 500 nm, to form a desired pattern. Irradiation is performed using light sources such as mercury lamps, metal halide lamps, argon lasers, etc. having low pressure, high pressure, or ultrahigh pressure. If necessary, X-rays, electron beams, etc. can also be used.
當使用高壓汞燈時,曝光製程使用例如500毫焦/平方公分或小於500毫焦/平方公分的光劑量(利用365奈米感測器)。然而,所述光劑量可依據硬化性組成物的每一組分的種類、其組合比率及乾膜厚度而變化。 (3)顯影When using a high-pressure mercury lamp, the exposure process uses, for example, a light dose of 500 mJ/cm² or less than 500 mJ/cm² (using a 365nm sensor). However, the light dose may vary depending on the type of each component of the curable composition, its combination ratio and the thickness of the dry film. (3) Development
在曝光製程之後,使用鹼性水溶液藉由溶解並移除除了被曝光部分外的多餘部分而將被曝光膜顯影,以形成影像圖案。換言之,當使用鹼性顯影溶液來顯影時,溶解未曝光區,且形成影像彩色濾光片圖案。 (4)後處理After the exposure process, an alkaline aqueous solution is used to develop the exposed film by dissolving and removing excess parts except the exposed part to form an image pattern. In other words, when an alkaline developing solution is used for development, the unexposed area is dissolved and an image color filter pattern is formed. (4) Post-processing
可再次加熱或藉由光化射線等照射所顯影影像圖案來進行硬化,以達成耐熱性、耐光性、緊密接觸性質、抗裂性、耐化學性、高強度、儲存穩定性等方面的優異品質。It can be reheated or cured by irradiating the developed image pattern with actinic rays to achieve excellent quality in terms of heat resistance, light resistance, close contact properties, crack resistance, chemical resistance, high strength, storage stability, etc. .
另一實施例提供一種包括硬化層的彩色濾光片以及一種包括所述彩色濾光片的顯示裝置。Another embodiment provides a color filter including a hardened layer and a display device including the color filter.
在下文中,參考實例更詳細地說明本發明。然而,該些實例不應在任何意義上被解釋為限制本發明的範圍。(合成配位體化合物) 合成例 1 Hereinafter, the present invention is explained in more detail with reference to examples. However, these examples should not be construed as limiting the scope of the present invention in any sense. (Synthesis of Ligand Compound) Synthesis Example 1
將30克6-巰基-1-己醇、40克[2-(2-甲氧基乙氧基)乙氧基]乙酸及6.4克對甲苯磺酸放入反應燒瓶中,並分散在300毫升環己烷中。向反應燒瓶安裝迪安斯塔克(dean stark)冷凝器後,對分散體進行了回流及攪拌。一小時後,藉由量測理論H2 O產率,完成了反應,且然後冷卻至室溫。向其中添加了過量的水以使反應猝滅,且然後藉由依次藉由向其中添加乙酸乙酯(ethyle acetate,EA)溶劑進行萃取、中和及濃縮對所得物進行了純化。對所獲得的產物進行了真空乾燥以獲得由化學式2表示的化合物。Put 30 grams of 6-mercapto-1-hexanol, 40 grams of [2-(2-methoxyethoxy)ethoxy]acetic acid and 6.4 grams of p-toluenesulfonic acid into the reaction flask and disperse them in 300 ml In cyclohexane. After installing a dean stark condenser in the reaction flask, the dispersion was refluxed and stirred. After one hour, the reaction was completed by measuring the theoretical H 2 O yield, and then cooled to room temperature. An excess of water was added thereto to quench the reaction, and then the resultant was purified by sequentially adding ethyle acetate (EA) solvent thereto for extraction, neutralization, and concentration. The obtained product was vacuum dried to obtain the compound represented by Chemical Formula 2.
[化學式2] 合成例 2 [Chemical formula 2] Synthesis Example 2
除了使用11-巰基-1-十一烷醇代替6-巰基-1-己醇之外,根據與合成例1相同的方法獲得了由表示的化合物。Except that 11-mercapto-1-undecyl alcohol was used instead of 6-mercapto-1-hexanol, the compound represented by was obtained according to the same method as in Synthesis Example 1.
[化學式3] 合成例 3 [Chemical formula 3] Synthesis Example 3
將對甲苯磺酸(p-toluenesulfonic,p-Ts)、30克聚(乙二醇)n 甲醚(n = 9;PEG9ME,漢濃化學公司(Hannong Chemicals Inc.))及7.5克3-巰基丙酸混合,且然後攪拌了5小時以製備羧酸化合物。隨後,向其中添加了9.4克6-巰基-1-己醇及2克對甲苯磺酸,且然後分散在300毫升環己烷中。在下文中,執行與合成例1相同的合成方法來獲得由化學式4表示的化合物。P-toluenesulfonic acid (p-toluenesulfonic, p-Ts), 30 grams of poly(ethylene glycol) n methyl ether (n = 9; PEG9ME, Hannong Chemicals Inc.) and 7.5 grams of 3-mercapto Propionic acid was mixed, and then stirred for 5 hours to prepare a carboxylic acid compound. Subsequently, 9.4 g of 6-mercapto-1-hexanol and 2 g of p-toluenesulfonic acid were added thereto, and then dispersed in 300 ml of cyclohexane. Hereinafter, the same synthesis method as Synthesis Example 1 is performed to obtain the compound represented by Chemical Formula 4.
[化學式4] 合成例 4 [Chemical formula 4] Synthesis Example 4
將20克鄰苯二甲酸酐及115.7克(環氧乙烷)n 甲醚(n = 9;EO9-ME,漢濃化學公司)在氮氣氛下混合了5小時以獲得由化學式5表示的化合物。20 grams of phthalic anhydride and 115.7 grams of (ethylene oxide) n methyl ether (n = 9; EO9-ME, Hanno Chemical Co.) were mixed for 5 hours under a nitrogen atmosphere to obtain the compound represented by Chemical Formula 5 .
[化學式5] 比較合成例 1 [Chemical formula 5] Comparative Synthesis Example 1
在氮氣氣氛下,將100克PH-4(漢農化學公司)及22克NaOH充分分散在500毫升四氫呋喃(tetrahydrofuran,THF)及100毫升H2 O中。將所獲得的分散體冷卻至0℃,且向其中滴加了藉由溶解15克對甲苯磺酸而製備的THF溶液。當添加完成後,在室溫下將所獲得的混合物攪拌了15小時。向其中添加了過量的水以完成反應,且藉由向其中添加乙酸乙酯(EA)進行萃取、中和及濃縮對所得物進行了純化,且然後在真空下進行了乾燥。將50克所獲得的產物溶解在300毫升乙醇中,且向其中添加了12.5克硫脲,且然後回流並攪拌了15小時。隨後,向其中添加了NaOH溶液,且然後另外攪拌了5小時。當反應完成時,藉由萃取、中和及濃縮對所得物進行了純化。將純化的產物在真空烘箱中乾燥了24小時,以獲得由化學式C-1表示的化合物。Under a nitrogen atmosphere, 100 g of PH-4 (Hannon Chemical Company) and 22 g of NaOH were thoroughly dispersed in 500 ml of tetrahydrofuran (THF) and 100 ml of H 2 O. The obtained dispersion was cooled to 0°C, and a THF solution prepared by dissolving 15 g of p-toluenesulfonic acid was added dropwise thereto. When the addition was complete, the obtained mixture was stirred at room temperature for 15 hours. Excess water was added thereto to complete the reaction, and the resultant was purified by adding ethyl acetate (EA) thereto for extraction, neutralization, and concentration, and then dried under vacuum. 50 g of the obtained product was dissolved in 300 ml of ethanol, and 12.5 g of thiourea was added thereto, and then refluxed and stirred for 15 hours. Subsequently, a NaOH solution was added thereto, and then stirred for another 5 hours. When the reaction was completed, the resultant was purified by extraction, neutralization, and concentration. The purified product was dried in a vacuum oven for 24 hours to obtain a compound represented by Chemical Formula C-1.
[化學式C-1] 比較合成例 2 [Chemical formula C-1] Comparative Synthesis Example 2
分別將5.82克2-巰基-1-乙醇、13.3克2-2-(2-甲氧基乙氧基)乙氧基乙酸及2.1克對甲苯磺酸一水合物放入2頸圓底燒瓶中,且然後溶解在300毫升環己烷中。在緊固具有注射孔的迪安斯塔克後,向其連接冷凝器。將所獲得的溶液回流了8小時以完成反應。(檢查迪安斯塔克中收集的最終水量)。將反應物移至分液漏斗中,且然後進行了萃取、中和並在移除溶劑後在真空烘箱中進行了乾燥,以獲得由化學式C-2表示的化合物。Put 5.82 grams of 2-mercapto-1-ethanol, 13.3 grams of 2-2-(2-methoxyethoxy)ethoxyacetic acid and 2.1 grams of p-toluenesulfonic acid monohydrate into a 2-neck round bottom flask respectively , And then dissolved in 300 ml of cyclohexane. After fastening the Dean Stark with the injection hole, connect the condenser to it. The obtained solution was refluxed for 8 hours to complete the reaction. (Check the final amount of water collected in Dean Stark). The reactant was moved to a separatory funnel, and then extraction, neutralization, and drying were performed in a vacuum oven after removing the solvent to obtain a compound represented by Chemical Formula C-2.
[化學式C-2] 比較合成例 3 [Chemical formula C-2] Comparative Synthesis Example 3
除了使用5-巰基-1-戊醇代替6-巰基-1-己醇之外,根據與合成例1相同的方法獲得了由化學式C-3表示的化合物。Except that 5-mercapto-1-pentanol was used instead of 6-mercapto-1-hexanol, a compound represented by Chemical Formula C-3 was obtained according to the same method as in Synthesis Example 1.
[化學式C-3] 比較合成例 4 [Chemical formula C-3] Comparative Synthesis Example 4
除了使用16-巰基-1-己醇代替6-巰基-1-己醇之外,根據與合成例1相同的方法獲得了由化學式C-4表示的化合物。Except for using 16-mercapto-1-hexanol instead of 6-mercapto-1-hexanol, a compound represented by Chemical Formula C-4 was obtained according to the same method as in Synthesis Example 1.
[化學式C-4] (製備用配位體進行表面改質的量子點的分散體) 製備例 1 [Chemical formula C-4] (Preparation of dispersion of quantum dots surface-modified with ligands) Preparation Example 1
將磁棒放入3頸圓底圓燒瓶中,且對量子點-CHA(乙酸環己酯(cyclohexyl acetate))溶液(固體含量:26重量%)進行了秤重並添加至其中。向其中添加了由化學式2表示的配位體。The magnetic rod was put into a 3-neck round-bottomed round flask, and a quantum dot-CHA (cyclohexyl acetate) solution (solid content: 26% by weight) was weighed and added to it. A ligand represented by Chemical Formula 2 is added thereto.
將混合物充分混合了1分鐘,且然後在氮氣氣氛下在80℃下進行了攪拌。當反應完成時,將所得物冷卻至室溫,且將量子點反應溶液添加至環己烷中以獲得沈澱物。藉由離心分離將沈澱的量子點粉末與溶劑分離。倒出溶劑並丟棄,且然後將沈澱物在真空烘箱中充分乾燥了一天以獲得表面改質的量子點。The mixture was thoroughly mixed for 1 minute, and then stirred at 80°C under a nitrogen atmosphere. When the reaction is completed, the resultant is cooled to room temperature, and the quantum dot reaction solution is added to cyclohexane to obtain a precipitate. The precipitated quantum dot powder is separated from the solvent by centrifugal separation. The solvent was poured out and discarded, and then the precipitate was sufficiently dried in a vacuum oven for one day to obtain quantum dots with modified surface.
將40克表面改質的量子點與52.999克由化學式6-2表示的單體(1,6-己二醇二丙烯酸酯;美源商業有限公司(Miwon Commercial Co., Ltd.))攪拌了12小時,以獲得表面改質的量子點分散體。40 grams of the surface-modified quantum dots and 52.999 grams of the monomer represented by the chemical formula 6-2 (1,6-hexanediol diacrylate; Miwon Commercial Co., Ltd.) were stirred 12 hours to obtain a surface-modified quantum dot dispersion.
[化學式6-2] 製備例 2 [Chemical formula 6-2] Preparation Example 2
除了使用由化學式3表示的化合物代替由化學式2表示的化合物之外,根據與製備例1相同的方法獲得了表面改質的量子點分散體。製備例 3 A surface-modified quantum dot dispersion was obtained according to the same method as Preparation Example 1, except that the compound represented by Chemical Formula 3 was used instead of the compound represented by Chemical Formula 2. Preparation Example 3
除了使用由化學式4表示的化合物代替由化學式2表示的化合物之外,根據與製備例1相同的方法獲得了表面改質的量子點分散體。製備例 4 A surface-modified quantum dot dispersion was obtained according to the same method as Preparation Example 1, except that the compound represented by Chemical Formula 4 was used instead of the compound represented by Chemical Formula 2. Preparation Example 4
除了使用由化學式5表示的化合物代替由化學式2表示的化合物之外,根據與製備例1相同的方法獲得了表面改質的量子點分散體。比較製備例 1 A surface-modified quantum dot dispersion was obtained according to the same method as Preparation Example 1, except that the compound represented by Chemical Formula 5 was used instead of the compound represented by Chemical Formula 2. Comparative Preparation Example 1
除了使用由化學式C-1表示的化合物代替由化學式2表示的化合物之外,根據與製備例1相同的方法獲得了表面改質的量子點分散體。比較製備例 2 A surface-modified quantum dot dispersion was obtained according to the same method as Preparation Example 1, except that the compound represented by Chemical Formula C-1 was used instead of the compound represented by Chemical Formula 2. Comparative Preparation Example 2
除了使用由化學式C-2表示的化合物代替由化學式2表示的化合物之外,根據與製備例1相同的方法獲得了表面改質的量子點分散體。比較製備例 3 A surface-modified quantum dot dispersion was obtained according to the same method as Preparation Example 1, except that the compound represented by Chemical Formula C-2 was used instead of the compound represented by Chemical Formula 2. Comparative Preparation Example 3
除了使用由化學式C-3表示的化合物代替由化學式2表示的化合物之外,根據與製備例1相同的方法獲得了表面改質的量子點分散體。比較製備例 4 A surface-modified quantum dot dispersion was obtained according to the same method as Preparation Example 1, except that the compound represented by Chemical Formula C-3 was used instead of the compound represented by Chemical Formula 2. Comparative Preparation Example 4
除了使用由化學式C-4表示的化合物代替由化學式2表示的化合物之外,根據與製備例1相同的方法獲得了表面改質的量子點分散體。(製備無溶劑的硬化性組成物) 實例 1 A surface-modified quantum dot dispersion was obtained according to the same method as Preparation Example 1, except that the compound represented by Chemical Formula C-4 was used instead of the compound represented by Chemical Formula 2. (Preparation of solvent-free curable composition) Example 1
將0.001克聚合抑制劑(甲基氫醌,東京化學工業有限公司(Tokyo Chemical Industry Co., Ltd.))添加至92.999克根據製備例1的分散體中,且然後攪拌了5分鐘。隨後,向其中添加了3克光起始劑(TPO-L,玻利尼通(Polynetron)),且向其中添加了4克光擴散劑(TiO2 ;SDT89,伊裡多斯有限公司(Iridos Co., Ltd.))。將整個分散體攪拌了一小時以製備無溶劑的硬化性組成物。實例 2 0.001 g of a polymerization inhibitor (methylhydroquinone, Tokyo Chemical Industry Co., Ltd.) was added to 92.999 g of the dispersion according to Preparation Example 1, and then stirred for 5 minutes. Subsequently, 3 grams of photoinitiator (TPO-L, Polynetron) was added to it, and 4 grams of light diffusing agent (TiO 2 ; SDT89, Iridos Co., Ltd. (Iridos) was added to it. Co., Ltd.)). The entire dispersion was stirred for one hour to prepare a solvent-free curable composition. Example 2
除了使用製備例2的分散體代替製備例1的分散體之外,根據與實例1相同的方法製備了無溶劑的硬化性組成物。實例 3 A solvent-free curable composition was prepared according to the same method as Example 1, except that the dispersion of Preparation Example 2 was used instead of the dispersion of Preparation Example 1. Example 3
除了使用製備例3的分散體代替製備例1的分散體之外,根據與實例1相同的方法製備了無溶劑的硬化性組成物。實例 4 A solvent-free curable composition was prepared according to the same method as Example 1, except that the dispersion of Preparation Example 3 was used instead of the dispersion of Preparation Example 1. Example 4
除了使用製備例4的分散體代替製備例1的分散體之外,根據與實例1相同的方法製備了無溶劑的硬化性組成物。比較例 1 A solvent-free curable composition was prepared according to the same method as Example 1, except that the dispersion of Preparation Example 4 was used instead of the dispersion of Preparation Example 1. Comparative example 1
除了使用比較製備例1的分散體代替製備例1的分散體之外,根據與實例1相同的方法製備了無溶劑的硬化性組成物。比較例 2 A solvent-free curable composition was prepared according to the same method as Example 1, except that the dispersion of Comparative Preparation Example 1 was used instead of the dispersion of Preparation Example 1. Comparative example 2
除了使用比較製備例2的分散體代替製備例1的分散體之外,根據與實例1相同的方法製備了無溶劑的硬化性組成物。比較例 3 A solvent-free curable composition was prepared according to the same method as Example 1, except that the dispersion of Comparative Preparation Example 2 was used instead of the dispersion of Preparation Example 1. Comparative example 3
除了使用比較製備例3的分散體代替製備例1的分散體之外,根據與實例1相同的方法製備了無溶劑的硬化性組成物。比較例 4 A solvent-free curable composition was prepared according to the same method as Example 1, except that the dispersion of Comparative Preparation Example 3 was used instead of the dispersion of Preparation Example 1. Comparative example 4
除了使用比較製備例4的分散體代替製備例1的分散體之外,根據與實例1相同的方法製備了無溶劑的硬化性組成物。評價 1 A solvent-free curable composition was prepared according to the same method as Example 1, except that the dispersion of Comparative Preparation Example 4 was used instead of the dispersion of Preparation Example 1. Evaluation 1
針對黏度藉由使用黏度計(流變應力(RheoStress)6000,哈克特赫尼克GmbH公司(HAAKE Technik GmbH))在室溫(25℃)下以100轉/分鐘將根據實例1至4及比較例1至4的無溶劑的硬化性組成物量測了2分鐘,且結果示於表1中。For viscosity, by using a viscometer (RheoStress 6000, HAAKE Technik GmbH) at room temperature (25°C) at 100 revolutions per minute, it will be compared according to Examples 1 to 4 The solvent-free curable compositions of Examples 1 to 4 were measured for 2 minutes, and the results are shown in Table 1.
(表1)
(單位:厘泊)
參考表1,包含用由化學式1表示的化合物進行表面改質的量子點的無溶劑的硬化性組成物被證明具有有利於噴墨的黏度。(一般而言,當組成物的黏度為10厘泊至35厘泊時,有利於噴墨。)具體而言,當在化學式1中n是小於或等於5或者大於或等於16的整數時,所述組成物具有太高的黏度,且不利於噴墨等,並且因此表現出可處理性劣化。評價 2 With reference to Table 1, a solvent-free curable composition containing quantum dots surface-modified with a compound represented by Chemical Formula 1 proved to have a viscosity favorable for inkjet. (Generally speaking, when the viscosity of the composition is 10 to 35 cps, it is advantageous for inkjet.) Specifically, when n is an integer less than or equal to 5 or greater than or equal to 16, in the chemical formula 1, The composition has too high viscosity and is not conducive to inkjet or the like, and therefore exhibits deterioration in handleability. Evaluation 2
使用旋轉塗佈機(800轉/分鐘,5秒,奧普提科特(Opticoat)MS-A150,三笠有限公司(Mikasa Co., Ltd.))將根據實例1至實例4及比較例1至比較例4的每一無溶劑的硬化性組成物在黃色光致抗蝕劑(yellow photoresist,YPR)上塗佈至15微米厚,且在氮氣氣氛下用395奈米紫外曝光機用5000毫焦進行了曝光(83℃,10秒)。隨後,將每一2公分×2公分的單膜樣品裝載在積分球設備(QE-2100,大塚電子有限公司(Otsuka Electronics, Co., Ltd.))中,並量測光轉換率。此後,將裝載的單膜樣品在180℃下在氮氣氛乾燥爐中乾燥了30分鐘,且然後量測了曝光後乾燥前的光保持率。此外,在300奈米至800奈米處量測了每一單膜的最大發射波長,且量測結果示於表2中。Using a spin coater (800 revolutions per minute, 5 seconds, Opticoat MS-A150, Mikasa Co., Ltd.) will be used according to Example 1 to Example 4 and Comparative Example 1 to Each solvent-free curable composition of Comparative Example 4 was coated on a yellow photoresist (YPR) to a thickness of 15 microns, and was used in a nitrogen atmosphere with a 395nm UV exposure machine with 5000 millijoules Exposure was performed (83°C, 10 seconds). Subsequently, each 2 cm×2 cm single film sample was loaded in an integrating sphere device (QE-2100, Otsuka Electronics, Co., Ltd.), and the light conversion rate was measured. Thereafter, the loaded single film sample was dried in a nitrogen atmosphere drying oven at 180° C. for 30 minutes, and then the light retention rate after exposure and before drying was measured. In addition, the maximum emission wavelength of each single film was measured from 300 nm to 800 nm, and the measurement results are shown in Table 2.
(表2)
參考表2,由根據實施例的無溶劑的硬化性組成物形成的硬化層具有小於或等於540奈米的最大發射波長,且因此達成了高顏色再現性,並同時表現出優異的光保持率,且此外,其特性(例如耐熱性、耐光性等)沒有劣化。Referring to Table 2, the hardened layer formed of the solvent-free hardenable composition according to the embodiment has a maximum emission wavelength of less than or equal to 540 nm, and thus achieves high color reproducibility, and at the same time exhibits excellent light retention And in addition, its characteristics (such as heat resistance, light resistance, etc.) are not deteriorated.
儘管本發明已結合目前視為實用的示例性實施例加以闡述,然而應理解本發明不限於所揭露的實施例,而是相反地旨在涵蓋包含在隨附申請專利範圍的精神及範圍內的各種修改及等效佈置。因此,應理解上述實施例為示範性的,而不以任何方式限制本發明。Although the present invention has been described in conjunction with exemplary embodiments that are currently regarded as practical, it should be understood that the present invention is not limited to the disclosed embodiments, but instead is intended to cover the spirit and scope included in the scope of the appended patents. Various modifications and equivalent arrangements. Therefore, it should be understood that the above-mentioned embodiments are exemplary and do not limit the present invention in any way.
無no
圖1對比示出以下兩個圖式:用同時具有極性部分及非極性部分的化合物進行表面改質的量子點單分散在無溶劑的硬化性組成物中,而用僅具有極性部分的化合物進行表面改質的量子點聚集在無溶劑的硬化性組成物中。Figure 1 compares the following two diagrams: Quantum dots modified with a compound having a polar part and a non-polar part are monodispersed in a solvent-free curable composition, and a compound having only a polar part is used for surface modification. The surface-modified quantum dots are gathered in a solvent-free curable composition.
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