TW202121967A - Heat dissipation system - Google Patents

Abstract

A heat dissipation system includes a single fan, first and second heat sources, first, second, and third heat pipes, and first and second heat dissipation arrays. The first heat pipe is thermally coupled to the first heat source. The third heat pipe is thermally coupled to the first and second heat pipes at a first position and a second position, respectively. The first heat dissipation array is thermally coupled to the third heat pipe and distributed at two sides of the first position. The second heat dissipation array is thermally coupled to the third heat pipe and distributed at two sides of the second position. The single fan is located between the first and second heat sources and is configured to generate a plurality of air flows toward the first and second heat sources and the first and second heat dissipation arrays.

Description

cooling system

The content of the present invention relates to a heat dissipation system, and more particularly to a heat dissipation system with a single fan.

In the cooling system of a high-performance notebook computer system, two fans are often required to meet the cooling requirements. However, the dual-fan cooling system is often accompanied by noise and vibration during use, and the power consumption of the dual-fan is also high.

Therefore, there is a need to provide an improved heat dissipation system to solve the problems faced by the prior art.

According to an embodiment of the present specification, a heat dissipation system includes a single fan, first and second heat sources, first, second, and third heat pipes, and first and second heat dissipation arrays. The first heat pipe is thermally coupled to the first heat source. The third heat pipe thermally couples the first and second heat pipes to the first position and the second position respectively. The first heat dissipation array is thermally coupled to the third heat pipe and distributed on two sides of the first position. The second heat dissipation array is thermally coupled to the third heat pipe and distributed on two sides of the second position. A single fan is located between the first and second heat sources, and is used to generate a plurality of airflows toward the first and second heat sources and the first and second heat dissipation arrays.

In other embodiments of this specification, the heat dissipation system further includes a battery accommodating area separated from the first and second heating sources, and a single fan is further used to generate the battery accommodating area and the battery accommodating area and the first and second heating sources. The plural airflow between.

In other embodiments of this specification, the first heat source includes one of a central processing unit and a graphics processor.

In other embodiments of this specification, the second heat source includes the other of the central processing unit and the graphics processor.

In other embodiments of this specification, the third heat pipe is vertically and thermally coupled to the first and second heat pipes.

In other embodiments of this specification, the first heat dissipation array includes a plurality of first heat dissipation fins, and each of the first heat dissipation fins is vertically thermally coupled to the third heat pipe.

In other embodiments of this specification, the second heat dissipation array includes a plurality of second heat dissipation fins, and each second heat dissipation fin is thermally coupled to the third heat pipe vertically.

In other embodiments of the present specification, a single fan includes a fan blade, a motor, and a plurality of support posts, and a plurality of air outlets are defined between the support posts, and the motor drives the fan blades to generate the airflow through the air outlets. .

In other embodiments of this specification, the heat dissipation system further includes an upper shell plate and a lower shell plate. The single fan, the first, second, and third heat pipes, the first and second heating sources, and the first and second heat dissipation arrays are all located on the upper shell plate. And between the lower shells.

In other embodiments of this specification, one of the upper shell and the lower shell includes an air inlet.

In summary, the heat dissipation system of the present invention uses a single fan to generate multiple airflows toward the surrounding heat sources, heat pipes, and heat dissipation arrays, so that the airflow output by a single fan can be optimally utilized, thereby avoiding the disadvantages of using multiple fans. The support column of the fan replaces the design of the side wall, so that an air outlet is formed between the adjacent support columns, and the support column also forms the support structure inside the electronic device casing.

Hereinafter, the above description will be described in detail by way of implementation, and a further explanation will be provided for the technical solution of the present invention.

Please refer to FIG. 1, which shows a schematic plan view of a heat dissipation system 100 according to an embodiment of the present invention. The heat dissipation system 100 includes a first heat source 104 and a second heat source 106 located on the circuit board 102. The first heat source 104 can be one of a central processing unit and a graphics processor, and the second heat source 106 can be the other of a central processing unit and a graphics processor. When the first and second heating sources are processors with larger heating power, conventionally, it is usually necessary to design an independent heat dissipation system for individual processors. In the embodiment of the present invention, the first heat pipe 120 is configured to be thermally coupled to the first heat source 104, the second heat pipe is configured to be thermally coupled to the second heat source, and the third heat pipe 140 is configured to be thermally coupled to the first and second heat pipes (120, 130). ), so that the heat generated by the first and second heat sources (104, 106) is transferred to the third heat pipe 140 through the first and second heat pipes (120, 130) to facilitate removal.

In the embodiment of the present invention, the third heat pipe 140 is vertically and thermally coupled to the first and second heat pipes (120, 130), but this is not a limitation.

In the embodiment of the present invention, the third heat pipe 140 is thermally coupled to the first and second heat pipes (120, 130) at the first position 125 and the second position 135 respectively, and the first heat dissipation array 150 is configured to be thermally coupled to the third heat pipe 140 and distributed on two sides of the first position 125, and the second heat dissipation array 160 is configured to be thermally coupled to the third heat pipe 140 and distributed on two sides of the second position 135.

In the embodiment of the present invention, the first heat dissipation array 150 includes a plurality of first heat dissipation fins 150a, and each first heat dissipation fin 150a is thermally coupled to the third heat pipe 140 vertically, but it is not limited thereto. The second heat dissipation array 160 includes a plurality of second heat dissipation fins 160a, and each second heat dissipation fin 160a is thermally coupled to the third heat pipe 140 vertically, but is not limited thereto.

In the embodiment of the present invention, a single fan 110 is configured to be located between the first and second heat sources (104, 106) to generate the first heat source 104, the second heat source 106, the first heat dissipation array 150, and the second heat source (104, 106). 2. The plural airflows of the heat dissipation array 160. For example, the air flow 110a generated by the fan 110 faces the first heat source 104, the air flow 110b faces the second heat source 106, the air flow 110c faces the first heat dissipation array 150, and the air flow 110d faces the second heat dissipation array 160.

In the embodiment of the present invention, the heat dissipation system 100 further includes a battery accommodating area 108 for installing the battery 108a. The battery 108a is separated from the first and second heat sources (104, 106) to generate a channel for airflow. The single fan 110 is surrounded by the first, second, and third heat pipes (120, 130, 140) and the battery accommodating area 108. The single fan 110 is further used to generate a plurality of airflows toward the battery accommodating area 108 and between the battery accommodating area 108 and the first and second heat sources (104, 106). For example, the air flow 110e generated by the fan 110 is toward the battery accommodating area 108, the air flow 110f is toward the area between the battery accommodating area 108 and the first heat source 104, and the air flow 110g is toward between the battery accommodating area 108 and the second heat source 106. Area. The air flow 110f will then follow the arrow direction in Figure 1 toward the first heat dissipation array 150, and the air flow 110g will then follow the arrow direction in Figure 1 toward the second heat dissipation array 160, so that the air flow generated by the fan 110 in all directions can be Make full use of it for heat dissipation purposes.

Please refer to FIGS. 2 and 3 at the same time. FIG. 2 is a perspective view of a fan according to an embodiment of the present invention; FIG. 3 is a schematic cross-sectional view of a fan application according to an embodiment of the present invention. The fan 110 includes components such as a bottom plate 112a, a fan blade 112e, a motor 112d, and a plurality of supporting columns 112b. The bottom plate 112a can be locked in the housing of the electronic device through its lock hole 112c. A plurality of supporting pillars 112b protrude from the bottom plate 112a integrally, or are fixed to the bottom plate 112a by bonding, welding, riveting, or the like. A plurality of air outlets are defined between the adjacent support columns 112b for the output of the above-mentioned plurality of airflows (110a-110g). The motor 112d drives the fan blade 112e to generate the air flows (110a-110g) through the air outlets.

In the embodiment of the present invention, the aforementioned heat dissipation system 100 is located between the upper shell 101b and the lower shell 101a. The top ends of the plurality of support posts 112b of the fan 110 are used to abut the upper casing 101b to form a supporting structure inside the casing of the electronic device. In the embodiment of the present invention, the cross-section of the support column 112b is circular or other shapes that are less likely to generate airflow resistance, but it is not limited to this. For example, the cross-section of the support column may be square, rectangular, elliptical, trapezoidal, triangular, or polygonal.

The design of the supporting column of the above-mentioned fan 110 combines the supporting structure with the bottom surface and integrates it on the single fan. Through the adjustment of various parameters, the modularization is applied to various systems, which greatly simplifies the development process. In addition, the flow field and stress analysis can be conducted according to the system strength requirements, and each support position can be configured to reduce noise and increase the strength of the mechanism around the fan, and support the fan blade rotation area to optimize space and efficiency.

In the embodiment of the present invention, after the fan 110 operates, the air is sucked in through the air inlet 103 of the upper shell 101b, and then blown out to the components around the fan 110 through the air outlet. The air inlet 103 can also be provided on the lower shell 101a as required, and is not limited to the upper shell 101b.

In summary, the heat dissipation system of the present invention uses a single fan to generate multiple airflows toward the surrounding heat sources, heat pipes, and heat dissipation arrays, so that the airflow output by a single fan can be optimally utilized, thereby avoiding the disadvantages of using multiple fans. The support column of the fan replaces the design of the side wall, so that an air outlet is formed between the adjacent support columns, and the support column also forms the support structure inside the electronic device casing.

Although the present invention has been invented as above in the preferred embodiment, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the description of the attached symbols is as follows: 100: cooling system 101a: lower shell 101b: upper shell 102: circuit board 103: air inlet 104: The first heat source 106: second heat source 108: battery storage area 108a: battery 110: Fan 110a～110g: airflow 112a: bottom plate 112b: Support column 112c: keyhole 112d: Motor 112e: fan blade 120: The first heat pipe 125: first position 130: second heat pipe 135: second position 140: third heat pipe 150: The first heat dissipation array 150a: first heat sink fin 160: second heat dissipation array 160a: second cooling fin

In order to make the above and other objectives, features, advantages and embodiments of the present invention more comprehensible, the description of the accompanying drawings is as follows: Figure 1 is a schematic plan view of a heat dissipation system according to an embodiment of the present invention; Figure 2 is a perspective view of a fan according to an embodiment of the present invention; and FIG. 3 is a schematic cross-sectional view of a fan application according to an embodiment of the present invention.

100: cooling system

102: circuit board

104: The first heat source

106: second heat source

108: battery storage area

108a: battery

110: Fan

110a~110g: airflow

120: The first heat pipe

125: first position

130: second heat pipe

135: second position

140: third heat pipe

150: The first heat dissipation array

150a: first heat sink fin

160: second heat dissipation array

160a: second cooling fin

Claims (10)

A heat dissipation system, including: The first heat source; A first heat pipe, thermally coupled to the first heat source; Second heat source; A second heat pipe, thermally coupled to the second heat source; The third heat pipe thermally couples the first and second heat pipes at the first position and the second position respectively; A first heat dissipation array, thermally coupled to the third heat pipe and distributed on two sides of the first position; A second heat dissipation array, thermally coupled to the third heat pipe and distributed on two sides of the second position; and A single fan is located between the first and second heat sources, and is used to generate a plurality of airflows toward the first heat source, the second heat source, the first heat dissipation array, and the second heat dissipation array. The heat dissipation system according to claim 1, further comprising a battery accommodating area separated from the first and second heat sources, and the single fan is further used to generate a direction toward the battery accommodating area and the battery accommodating area and the second heating source. 1. Plural airflow between the two heat sources. The heat dissipation system according to claim 1, wherein the first heat source includes one of a central processing unit and a graphics processing unit. The heat dissipation system according to claim 3, wherein the second heat source includes the other of a central processing unit and a graphics processor. The heat dissipation system according to claim 1, wherein the third heat pipe is vertically and thermally coupled to the first and second heat pipes. The heat dissipation system according to claim 1, wherein the first heat dissipation array includes a plurality of first heat dissipation fins, and each of the first heat dissipation fins is vertically thermally coupled to the third heat pipe. The heat dissipation system according to claim 1, wherein the second heat dissipation array includes a plurality of second heat dissipation fins, and each of the second heat dissipation fins is thermally coupled to the third heat pipe vertically. The heat dissipation system according to claim 1, wherein the single fan includes a fan blade, a motor, and a plurality of support columns, and a plurality of air outlets are defined between the support columns, and the motor drives the fan blades to generate the air flows through Some vents. The heat dissipation system according to claim 1, further comprising an upper shell plate and a lower shell plate. The single fan, the first, second, and third heat pipes, the first and second heat sources, and the first and second heat dissipation arrays are all located in the Between the upper shell and the lower shell. The heat dissipation system according to claim 9, wherein one of the upper shell and the lower shell includes an air inlet.

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