TW202115386A - IC material strip checking device - Google Patents

IC material strip checking device Download PDF

Info

Publication number
TW202115386A
TW202115386A TW108137152A TW108137152A TW202115386A TW 202115386 A TW202115386 A TW 202115386A TW 108137152 A TW108137152 A TW 108137152A TW 108137152 A TW108137152 A TW 108137152A TW 202115386 A TW202115386 A TW 202115386A
Authority
TW
Taiwan
Prior art keywords
light
beam splitter
strip
light source
detection lens
Prior art date
Application number
TW108137152A
Other languages
Chinese (zh)
Other versions
TWI717862B (en
Inventor
陸建軍
Original Assignee
大陸商京隆科技（蘇州）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商京隆科技（蘇州）有限公司 filed Critical 大陸商京隆科技（蘇州）有限公司
Application granted granted Critical
Publication of TWI717862B publication Critical patent/TWI717862B/en
Publication of TW202115386A publication Critical patent/TW202115386A/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8914—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the material examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • G01N2021/0112—Apparatus in one mechanical, optical or electronic block

Landscapes

  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Textile Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The present invention discloses an IC material strip checking device. The IC material strip checking device comprises: a work area in which a material strip can move in a predetermined direction; a first light source arranged above the material strip; a first beam splitter arranged above the first light source; a first detection lens, wherein the first detection lens is arranged above the first beam splitter and is configured to receive the first light; a second detection lens, wherein the second detection lens is arranged on the side of the first beam splitter and is configured to receive the second light; a second light source arranged below the material strip; a second beam splitter arranged above the second light source; and a third detection lens, wherein the third detection lens is arranged at the side of the second beam splitter and is configured to receive the light reflected by the second light source irradiating the material strip. The IC material strip inspection device provided by the present invention has the advantages that: multiple photos can be simultaneously obtained by using the IC material strip inspection device to check the sealing condition of the material trip, the marking on the top surface of the internal chip, and the bottom condition of the material trip.

Description

IC料帶檢查裝置IC tape inspection device

本發明是一種有關IC料帶檢查裝置的技術領域，尤其指一種利用多組燈源及多組檢測鏡頭，能同時進行多個項目的檢查。The present invention relates to the technical field of IC material tape inspection devices, in particular to a method that utilizes multiple sets of light sources and multiple sets of inspection lenses to perform inspections of multiple items at the same time.

『IC料帶』用於包裝已封裝完成的芯片成品，阻絶空氣中的雜質、不良氣體、仍至水蒸氣，避免產品運送至使用客戶端前，發生不必要的損壞，進而造成電學性能下降。"IC tape" is used to package the finished chip products that have been packaged to prevent impurities in the air, undesirable gases, and water vapor, and avoid unnecessary damage before the product is shipped to the client, which will cause electrical performance degradation. .

如圖1所示，為傳統IC料帶檢查方式的示意圖。其是在料帶1移動路徑上方設有至少一個檢測鏡頭A，用以拍攝料帶表面的影像。料帶1具有多個凹室11、用以密封的密封膜12及定位孔13。凹室11內放置著封裝完成的芯片(圖中未畫出)。定位孔13供機構帶動料帶1移動。包裝完成的料帶1，在出廠前的檢查作業中，至少必須檢查密封膜12的密封情況、以及芯片頂面的標記，因此設有至少二個檢查停等位置。當料帶1移動至檢測鏡頭A下方，於二個檢測停等位置時須分別停止且依序拍攝，之後再根據所拍攝影像進行分析，判斷是否出現瑕疵。但如此停頓用以拍攝會延長檢查時間，增加工時，降低單元時間的產量。As shown in Figure 1, it is a schematic diagram of the traditional IC tape inspection method. At least one detecting lens A is provided above the moving path of the material belt 1 to capture images of the surface of the material belt. The material belt 1 has a plurality of recesses 11, a sealing film 12 for sealing, and a positioning hole 13. A packaged chip (not shown in the figure) is placed in the cavity 11. The positioning hole 13 is provided for the mechanism to drive the material belt 1 to move. In the inspection operation of the finished tape 1 before leaving the factory, at least the sealing condition of the sealing film 12 and the marking on the top surface of the chip must be inspected, so at least two inspection stop positions are provided. When the tape 1 moves below the inspection lens A, it must be stopped at the two inspection stop positions and taken in sequence, and then analyzed according to the captured image to determine whether there is a defect. However, such a pause for shooting will extend the inspection time, increase man-hours, and reduce the output of unit time.

為解決上述問題，本發明的主要目的是提供一IC料帶檢查裝置，主要是採用三個檢測鏡頭，搭配不同的燈源及分光鏡，可同時對料帶封密性、內部芯片上的標記以及料帶底部情形進行檢查，且在同一時間內拍攝多個影像，因此也可進行動態拍攝，提升單位時間的產能(Unit Per Hour,UPH)。In order to solve the above problems, the main purpose of the present invention is to provide an IC tape inspection device, which mainly uses three inspection lenses, with different light sources and spectroscopes, which can simultaneously seal the tape and the markings on the internal chip. And the bottom of the strip is checked, and multiple images are shot at the same time, so dynamic shooting can also be carried out to improve the productivity per unit time (Unit Per Hour, UPH).

為實現前述目的，本發明採用了如下技術方案：In order to achieve the foregoing objectives, the present invention adopts the following technical solutions:

本發明IC料帶檢查裝置，包括：工作區，供料帶遵循預定方向移動；第一燈源，安裝於料帶上方，第一燈源能發出不同顏色的第一光線及第二光線；第一分光鏡，安裝於第一燈源上方，當第一燈源照射料帶，反射光線經第一分光鏡分光會使第一光線與第二光線分別由頂面及側面通過；第一檢測鏡頭，位於第一分光鏡上方且接收第一光線；第二檢測鏡頭，位於第一分光鏡側邊且接收第二光線；第二燈源，安裝於料帶下方，第二燈源發出第三光線照射料帶；第二分光鏡，位於第二燈源上方，在第二燈源照射後，第三光線通過第二分光鏡照射於料帶，反射光線再經第二分光鏡反射改由側面通過；第三檢測鏡頭，位於第二分光鏡側邊，接收第二燈源照射料帶所反射的光線。The IC material tape inspection device of the present invention includes: a working area where the material supply belt moves in a predetermined direction; a first light source is installed above the material tape, and the first light source can emit first light and second light of different colors; A beam splitter is installed above the first light source. When the first light source illuminates the material strip, the reflected light is split by the first beam splitter to make the first light and the second light pass through the top surface and the side respectively; the first detection lens , Is located above the first beam splitter and receives the first light; the second detection lens is located on the side of the first beam splitter and receives the second light; the second light source is installed under the strip, and the second light source emits the third light Illuminating the tape; the second beam splitter, located above the second light source, after the second light source illuminates, the third light irradiates the tape through the second beam splitter, and the reflected light is reflected by the second beam splitter to pass through the side ; The third detection lens, located on the side of the second beam splitter, receives the light reflected by the second light source irradiated by the tape.

作為較佳優選實施方案之一，第一燈源為方框形無影燈，包括框體、第一光區及第二光區，第一光區提供第一光線且為紅光，第二光區提供第二光線且為藍光。As one of the preferred embodiments, the first light source is a box-shaped shadowless lamp, which includes a frame, a first light area and a second light area. The first light area provides the first light and is red light, and the second light area Provides the second light and is blue light.

作為較佳優選實施方案之一，第一光區環設於框體內框壁靠近下邊緣區域，第一光區具有四個區塊。As one of the preferred embodiments, the first light zone is arranged around the frame wall in the frame body near the lower edge area, and the first light zone has four blocks.

作為較佳優選實施方案之一，第二光區位於框體內框壁上邊緣且呈面對面配置，第二光區具有二個區塊。As one of the preferred embodiments, the second light zone is located on the upper edge of the frame wall inside the frame and is arranged face to face, and the second light zone has two blocks.

作為較佳優選實施方案之一，進一步包括白色燈源，白色燈源安裝於料帶的定位孔下方，但不會影響第二燈源照射。As one of the preferred embodiments, it further includes a white light source, which is installed under the positioning hole of the material belt, but does not affect the second light source to illuminate.

作為較佳優選實施方案之一，進一步包括第一條形燈，第一條形燈位於第一分光鏡與第二檢測鏡頭之間，第一條形燈提供與第二光線相同顏色的光線。As one of the preferred embodiments, it further comprises a first strip light, the first strip light is located between the first beam splitter and the second detection lens, and the first strip light provides light of the same color as the second light.

作為較佳優選實施方案之一，進一步包括第一全反射鏡，第一全反射鏡安裝於第一分光鏡上方，使第一光線經第一全反射鏡反射至第一檢測鏡頭。As one of the preferred embodiments, it further includes a first total reflection mirror, which is installed above the first beam splitter, so that the first light is reflected by the first total reflection mirror to the first detection lens.

作為較佳優選實施方案之一，進一步包括第二全反射鏡，第二全反射鏡安裝第一燈源上方，且鄰近設置於第一分光鏡一側，第一燈源照射料帶，反射光線先經第二全反射鏡反射且由第一分光鏡側面進入，第一分光鏡會讓第二光線通過且被第二檢測鏡頭接收，而第一光線經第一分光鏡反射且改由頂面通過。As one of the preferred embodiments, it further includes a second total reflection mirror, which is installed above the first light source and adjacently arranged on the side of the first beam splitter. The first light source irradiates the strip and reflects light. First, it is reflected by the second total reflection mirror and enters from the side of the first beam splitter. The first beam splitter allows the second light to pass through and is received by the second detection lens, while the first light is reflected by the first beam splitter and changes from the top surface by.

作為較佳優選實施方案之一，進一步包括第二條形燈，第二條形燈安裝於第二全反射鏡與第一分光鏡之間，第二條形燈提供與第一光線相同顏色的光線。As one of the preferred embodiments, it further comprises a second strip light, the second strip light is installed between the second total reflection mirror and the first beam splitter, and the second strip light provides the same color as the first light. Light.

與現有技術相比，本發明具有下列具體的功效： 1.       本發明透過三個檢測鏡頭能獲得多個影像，透過影像檢查料帶的封密狀態、內部芯片上的標記、及料帶底部情形，確保以正確芯片出貨及料帶的包裝品質； 2.       本發明利用第一燈源及第一分光鏡的搭配，可分別供兩個檢測鏡頭獲得不同的影像，藉此避免構件過於多且結構複雜，且能調整檢測鏡頭的所在位置，減小縱向裝置尺寸； 3.       本發明第一光線為紅光，利用紅光穿透料帶表面的封密膜，讓只能接紅光的第一檢測鏡頭獲得較佳之芯片的標記影像，利於標記的檢查； 4.       本發明第二光線為藍光，利用藍光照射於料帶密封接合處，讓只能接收藍光的第二檢測鏡頭可獲得較佳影像，有利判斷料帶與密封膜的密封貼合狀況； 5.       本發明透過三個檢測鏡頭能同時獲得多個影像，可作動態的拍攝，提升產能速度。Compared with the prior art, the present invention has the following specific effects: 1. In the present invention, multiple images can be obtained through three inspection lenses, and the sealing state of the tape, the marks on the internal chip, and the bottom of the tape can be checked through the images to ensure the correct chip shipment and the packaging quality of the tape; 2. The present invention uses the combination of the first light source and the first beam splitter to provide two detection lenses to obtain different images, thereby avoiding too many components and complex structures, and can adjust the position of the detection lens to reduce Longitudinal device size; 3. The first light of the present invention is red light, and red light is used to penetrate the sealing film on the surface of the tape, so that the first detection lens that can only receive red light can obtain a better mark image of the chip, which is conducive to mark inspection; 4. The second light of the present invention is blue light, and the blue light is used to irradiate the sealing joint of the material tape, so that the second detection lens that can only receive blue light can obtain a better image, which is beneficial to judge the sealing and bonding status of the material tape and the sealing film; 5. The present invention can obtain multiple images at the same time through three detection lenses, which can be used for dynamic shooting and increase the production speed.

以下藉由特定的具體實施例說明本發明的實施方式，熟悉此技術領域的人士可由本說明書所揭示的內容輕易地瞭解本發明的其他優點及功效。本發明也可藉由其他不同的具體實例加以施行或應用，本發明說明書中的各項細節也可基於不同觀點與應用在不悖離本發明的精神下進行各種修飾與變更。The following specific examples illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied by other different specific examples, and various details in the specification of the present invention can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention.

如圖2所示，為本發明IC料帶檢查裝置之架構圖。本發明包括工作區20、第一燈源21、第一分光鏡22、第一檢測鏡頭23、第二檢測鏡頭24、第二燈源25、第三檢測鏡頭26以及第二分光镜27。工作區20可供一料帶1遵循預定方向移動。第一燈源21、第一分光鏡22、第一檢測鏡頭23、第二檢測鏡頭24安裝料帶1上方。第一燈源21能產生不同顏色的第一光線211及第二光線212。當第一燈源21照射料帶1，反射光線經第一分光鏡22讓不同顏色光線分別為頂面及側面通過，且分別由第一檢測鏡頭23及第二檢測鏡頭24接收，用以檢查內部芯片頂面的標記及料帶1的密封情況。第二燈源25、第三檢測鏡頭26及第二分光镜27設置於料帶1下方。當第二燈源25照射料帶1底部，第二分光镜27讓光線通過但之後反射光線則經反射改變方向由第三檢測鏡頭26接收，用以檢查料帶1底部狀態；藉由本發明的設計，同一時間能獲得料帶1不同位置的至少三個不同影像，以進行多個檢查，也能採取動態的拍攝，故料帶1不需靜止以供拍攝，提升產能。As shown in FIG. 2, it is a structural diagram of the IC tape inspection device of the present invention. The present invention includes a working area 20, a first light source 21, a first beam splitter 22, a first detection lens 23, a second detection lens 24, a second light source 25, a third detection lens 26 and a second beam splitter 27. The working area 20 can allow a strip 1 to move in a predetermined direction. The first light source 21, the first beam splitter 22, the first detection lens 23, and the second detection lens 24 are installed above the material belt 1. The first light source 21 can generate the first light 211 and the second light 212 of different colors. When the first light source 21 illuminates the tape 1, the reflected light passes through the first beam splitter 22 to allow light of different colors to pass through the top surface and the side surface respectively, and are received by the first detection lens 23 and the second detection lens 24, respectively, for inspection The marking on the top surface of the internal chip and the sealing condition of the tape 1. The second light source 25, the third detection lens 26 and the second beam splitter 27 are arranged under the material belt 1. When the second light source 25 illuminates the bottom of the strip 1, the second beam splitter 27 allows light to pass but then the reflected light changes direction by reflection and is received by the third detection lens 26 to check the bottom state of the strip 1; It is designed that at least three different images of different positions of the strip 1 can be obtained at the same time for multiple inspections, and dynamic shooting can also be adopted. Therefore, the strip 1 does not need to be stationary for shooting, which improves productivity.

接著就各構件的結構作一詳細的說明：Then make a detailed description of the structure of each component:

工作區20為料帶1呈線性移動且被拍攝的工作區域。實際上是利用位於工作區20左右兩側的轉盤及電動馬達(圖中未畫出)帶動料帶1移動，在本實施例為由左向右移動，由於帶動機構可採用習用結構，故不再詳加描述。料帶1具有多個凹室11、用以密封的密封膜12及定位孔13。凹室11內放置著封裝完成的芯片14。定位孔13用以供機構帶動料帶1移動。芯片14頂面以加工方式形成標記，此標記可為產品序號，識別編號如(QR code)、或商標等。本發明IC檢查裝置至少能檢查密封膜12與料帶1的貼合情況、芯片14上的標記圖形、以及料帶1底部情形。The working area 20 is a working area where the material belt 1 moves linearly and is photographed. In fact, the turntable and electric motors (not shown in the figure) located on the left and right sides of the working area 20 are used to drive the material belt 1 to move. In this embodiment, it moves from left to right. Since the drive mechanism can adopt a conventional structure, it is not Describe in more detail. The material belt 1 has a plurality of recesses 11, a sealing film 12 for sealing, and a positioning hole 13. The packaged chip 14 is placed in the cavity 11. The positioning hole 13 is used for the mechanism to drive the material belt 1 to move. A mark is formed on the top surface of the chip 14 in a processing manner. The mark can be a product serial number, an identification number such as (QR code), or a trademark. The IC inspection device of the present invention can at least inspect the adhesion of the sealing film 12 to the tape 1, the marking pattern on the chip 14, and the bottom of the tape 1.

如圖3所示，第一燈源21為一方框形無影燈，包括框體213、第一光區214及第二光區215。第一光區214環設於框體213內框壁靠近下邊緣區域，本實施例具有四個區塊。第一光區214產生紅光，即為第一光線211，此有助於光線穿透密封膜12，以獲得芯片14頂面上的標記圖形。第二光區215位於框體213內框壁上邊緣且呈面對面配置，本實施例具有二個區塊。第二光區215產生藍光，即為第二光線212，此有助於檢查密封膜12是否緊密貼合於料帶1。As shown in FIG. 3, the first light source 21 is a box-shaped shadowless lamp, which includes a frame body 213, a first light area 214 and a second light area 215. The first light zone 214 is arranged around the inner frame wall of the frame body 213 near the lower edge area, and this embodiment has four blocks. The first light area 214 generates red light, that is, the first light 211, which helps the light to penetrate the sealing film 12 to obtain the marking pattern on the top surface of the chip 14. The second light zone 215 is located at the upper edge of the inner frame wall of the frame body 213 and is arranged face to face. This embodiment has two blocks. The second light zone 215 generates blue light, that is, the second light 212, which helps to check whether the sealing film 12 is tightly attached to the material tape 1.

第一分光鏡22安裝於第一燈源21上方，且可讓部份光線通過，部份光線反射。本實施例中，第一分光鏡22能讓紅光通過，但反射藍光使之由側面通過。The first beam splitter 22 is installed above the first light source 21 and allows part of the light to pass through and part of the light to reflect. In this embodiment, the first beam splitter 22 allows red light to pass through, but reflects blue light to pass it from the side.

第一檢測鏡頭23，安裝於第一分光鏡22上方，只接收為紅光的第一光線211。第二檢測鏡頭24，安裝於第一分光鏡22側邊，只接收為藍光的第二光線32。另外本實施例為了提升反射後的藍光強度，進一步包括第一條形燈28。在本實施中第一條形燈28具有兩個且位於第一分光鏡22與第二檢測鏡頭24之間。第一條形燈28能供與第二光線212相同顏色的藍光。The first detection lens 23 is installed above the first beam splitter 22 and only receives the first light 211 that is red light. The second detection lens 24 is installed on the side of the first beam splitter 22 and only receives the second light 32 which is blue light. In addition, in order to increase the intensity of the reflected blue light, this embodiment further includes a first strip lamp 28. In this embodiment, there are two first strip lights 28 and are located between the first beam splitter 22 and the second detection lens 24. The first strip lamp 28 can supply blue light of the same color as the second light 212.

第二燈源25，安裝於料帶1下方。第二燈源25能發出第三光線251，在本實施例中第三光線251為紅光。The second light source 25 is installed under the material belt 1. The second light source 25 can emit a third light 251, and in this embodiment, the third light 251 is red light.

第二分光鏡27安裝於料帶1下方與第二燈源25之間。第二分光鏡27能讓第二燈源25照射的第三光線251通過，但由料帶1反射回的光線則再經反射改由側面通過。第三檢測鏡頭26安裝於第二分光鏡27側邊位置。第三檢測鏡頭26呈橫向設置，能減少裝置縱向尺寸。The second beam splitter 27 is installed between the lower part of the material belt 1 and the second light source 25. The second beam splitter 27 can allow the third light 251 irradiated by the second lamp source 25 to pass, but the light reflected by the material strip 1 is then reflected to pass through the side. The third detection lens 26 is installed at a side position of the second beam splitter 27. The third detection lens 26 is arranged horizontally, which can reduce the longitudinal size of the device.

另外為維持運作時基本亮度，本發明進一步包括一白色燈源29。白色燈源29安裝於第二分光鏡27與料帶1之間。如圖4所示，白色燈源29為條形燈，且安裝於該料帶1的定位孔13下方，故不會影響第二燈源25的照射。In addition, in order to maintain the basic brightness during operation, the present invention further includes a white light source 29. The white light source 29 is installed between the second beam splitter 27 and the material belt 1. As shown in FIG. 4, the white light source 29 is a strip light and is installed under the positioning hole 13 of the material strip 1, so it will not affect the illumination of the second light source 25.

接著，就整體的運作方式作一說明。料帶1經由機構運作遵循預定於工作區20內方向移動，在本實施中是由左向右緩慢地移動。第一燈源21及第二燈源25同時運作。第一燈源21產生不同顏色的第一光線211及第二光線212照射料帶1，反射光線經第一分光鏡22分光使紅光透通且被第一檢測鏡頭23接收，藍光則被反射由側面通過且被第二檢測鏡頭24接收。由紅光穿透密封膜12，可獲得芯片14頂面上較佳的標記圖像，由藍光照射密封膜12與料帶1的貼合情形，所有獲得的圖像經電腦影像處理，就可研判標記的正確性及密封貼合情形。另外第二燈源25以紅光的第三光線251照射料帶1底部，反射光線經第二分光鏡27再反射後經側面通過，由第二檢測鏡頭26獲得料帶1底部影像，確認是否有產生縐折或其他不良情形。如此在同一時間內，可獲得多個影像資料，就能同時檢查密封情況、標記、及料帶1底部情形，且能進行動態的拍攝，提升單元時間內的產能。Next, an explanation will be given on the overall operation. The material belt 1 moves in the direction predetermined in the working area 20 through the operation of the mechanism, and in this embodiment, it moves slowly from left to right. The first light source 21 and the second light source 25 operate simultaneously. The first light source 21 generates the first light 211 and the second light 212 of different colors to irradiate the material belt 1, and the reflected light is split by the first beam splitter 22 so that the red light is transparent and is received by the first detection lens 23, and the blue light is reflected It passes by the side and is received by the second detection lens 24. Red light penetrates the sealing film 12 to obtain a better mark image on the top surface of the chip 14, and blue light illuminates the bonding situation of the sealing film 12 and the tape 1. All the obtained images are processed by computer image processing. Study and judge the correctness of the marking and the sealing condition. In addition, the second lamp source 25 irradiates the bottom of the strip 1 with the third light 251 of red light. The reflected light is reflected by the second beam splitter 27 and then passes through the side. The second detection lens 26 obtains the bottom image of the strip 1 to confirm whether There are creases or other undesirable situations. In this way, multiple image data can be obtained at the same time, and the sealing conditions, markings, and the bottom of the material belt 1 can be checked at the same time, and dynamic shooting can be carried out, which improves the productivity in the unit time.

如圖5所示，為本發明IC料帶檢查裝置第二種實施例的架構圖。在本實施例中，主要增加第一全反射鏡31及第二全反射鏡32，改變光線的反射路徑，進而調整第一檢測鏡頭23的設置位置，如此能降低裝置的縱向尺寸。第一全反射鏡31安裝於第一分光鏡22A上方。第一光線211經第一全反射鏡31反射後投射至呈橫向設置的第一檢測鏡頭23。第二全反射鏡32安裝第一燈源21上方，且鄰近設置於第一分光鏡22A一側。當第一燈源21照射料帶1，反射光線經第二全反射鏡32反射而改變方向由第一分光鏡22A側面進入。在此實施例中第一分光鏡22A改為讓藍光通過，但反射紅光使之由頂面通過。故第二光線212能被第二檢測鏡頭24接收，向上反射的第一光線211則再經第一全反光鏡31反射由第一檢測鏡頭23接收。如此第一檢測鏡頭23能呈橫向方式設置，能減少裝置縱向的尺寸。As shown in FIG. 5, it is a structural diagram of a second embodiment of the IC tape inspection device of the present invention. In this embodiment, the first total reflection mirror 31 and the second total reflection mirror 32 are mainly added to change the reflection path of the light, and then adjust the position of the first detection lens 23, which can reduce the longitudinal size of the device. The first total reflection mirror 31 is installed above the first beam splitter 22A. The first light 211 is reflected by the first total reflection mirror 31 and then projected to the first detection lens 23 arranged in a lateral direction. The second total reflection mirror 32 is installed above the first light source 21 and adjacently arranged on the side of the first beam splitter 22A. When the first light source 21 illuminates the material belt 1, the reflected light is reflected by the second total reflection mirror 32 and changes direction to enter from the side of the first beam splitter 22A. In this embodiment, the first beam splitter 22A is changed to allow blue light to pass through, but reflects red light to pass through the top surface. Therefore, the second light 212 can be received by the second detection lens 24, and the first light 211 reflected upward is reflected by the first total mirror 31 and received by the first detection lens 23. In this way, the first detection lens 23 can be arranged in a horizontal manner, which can reduce the longitudinal size of the device.

另外為避色反射後的第一光線211強度不佳，本發明進一步包括第二條形燈33。在本實施例中第二條形燈33設有兩組，且安裝於第一分光鏡22A與第一全反射镜32之間。第二條形燈33能提供與第一光線211相同顏色的紅光，增加經第一全反射鏡32反射後的光線強度。In addition, the intensity of the first light 211 after color avoidance reflection is not good, and the present invention further includes a second strip lamp 33. In this embodiment, the second strip lights 33 are provided in two groups, and are installed between the first beam splitter 22A and the first total reflection mirror 32. The second strip light 33 can provide red light of the same color as the first light 211 and increase the intensity of the light reflected by the first total reflection mirror 32.

綜合以上所述，本發明IC料帶檢查裝置，於料帶1上方及下方位置分別設有第一檢測鏡頭23、第二檢測鏡頭24及第三檢測鏡頭26，配合不同需求接收特定光線，故能同時對料帶1封密性、內部芯片14的標記及料帶1底部情形進行檢查，且在同一時間內同時拍攝多個影像，因此也可進行動態拍攝，提升單位時間的產能。In summary, the IC tape inspection device of the present invention is provided with a first detection lens 23, a second detection lens 24, and a third detection lens 26 at the upper and lower positions of the tape 1, respectively, to receive specific light according to different needs, so The sealing performance of the tape 1, the marking of the internal chip 14 and the bottom of the tape 1 can be inspected at the same time, and multiple images can be shot at the same time. Therefore, dynamic shooting can also be performed to improve the productivity per unit time.

然而，上述實施例僅例示性說明本發明的功效，而非用於限制本發明，任何熟習此技術領域的人士均可在不違背本發明的精神及範疇下，對上述實施例進行修飾與改變。此外，在上述實施例中的元件的數量僅為例示性說明，也非用於限制本發明。因此本發明的權利保護範圍，應如以下的申請專利範圍所列。However, the above-mentioned embodiments are only illustrative of the effects of the present invention, and are not used to limit the present invention. Anyone familiar with this technical field can modify and change the above-mentioned embodiments without departing from the spirit and scope of the present invention. . In addition, the number of elements in the above-mentioned embodiments is merely illustrative, and is not intended to limit the present invention. Therefore, the protection scope of the present invention should be as listed in the following patent application scope.

1:料帶 11:凹室 12:密封膜 13:定位孔 14:芯片 A:檢測鏡頭 20:工作區 21:第一燈源 211:第一光線 212:第二光線 213:框體 214:第一光區 215:第二光區 22:第一分光鏡 23:第一檢測鏡頭 24:第二檢測鏡頭 25:第二燈源 251:第三光線 26:第三檢測鏡頭 27:第二分光鏡 28:第一條形燈 29:白色燈源 31:第一全反射鏡 32:第二全反射镜 22A:第一分光鏡 33:第二條形燈1: Material belt 11: Alcove 12: Sealing film 13: positioning hole 14: Chip A: Inspection lens 20: Work area 21: The first light source 211: First Ray 212: second light 213: Frame 214: First Light Zone 215: Second Light Zone 22: The first beam splitter 23: The first inspection lens 24: The second detection lens 25: second light source 251: The Third Ray 26: The third inspection lens 27: Second beam splitter 28: The first strip light 29: White light source 31: The first total reflection mirror 32: The second total reflection mirror 22A: The first beam splitter 33: The second strip light

圖1為習用檢驗方式之示意圖。 圖2為本發明IC料帶檢查裝置的第一實施例架構圖。 圖3為本發明第一燈源的放大立體圖； 圖4為本發明呈現第二燈源及白色燈源配置狀態的底視圖； 圖5為本發明IC料帶檢查裝置的第二實施例架構圖。Figure 1 is a schematic diagram of the conventional inspection method. 2 is a structural diagram of the first embodiment of the IC tape inspection device of the present invention. Figure 3 is an enlarged perspective view of the first light source of the present invention; 4 is a bottom view showing the configuration of the second light source and the white light source according to the present invention; Fig. 5 is a structural diagram of the second embodiment of the IC tape inspection device of the present invention.

1:料帶1: Material belt

11:凹室11: Alcove

12:密封膜12: Sealing film

14:芯片14: Chip

20:工作區20: Work area

21:第一燈源21: The first light source

211:第一光線211: First Ray

212:第二光線212: second light

22:第一分光鏡22: The first beam splitter

23:第一檢測鏡頭23: The first inspection lens

24:第二檢測鏡頭24: The second detection lens

25:第二燈源25: second light source

251:第三光線251: The Third Ray

26:第三檢測鏡頭26: The third inspection lens

27:第二分光鏡27: Second beam splitter

28:第一條形燈28: The first strip light

29:白色燈源29: White light source

Claims (9)

一種IC料帶檢查裝置，包括： 工作區，供料帶遵循預定方向移動； 第一燈源，安裝於該料帶上方，該第一燈源發出不同顏色的第一光線及第二光線； 第一分光鏡，安裝於該第一燈源上方，該第一燈源照射該料帶，反射光線經該第一分光鏡使該第一光線與該第二光線分別由頂面及側面通過； 第一檢測鏡頭，位於該第一分光鏡上方且接收該第一光線； 第二檢測鏡頭，位於該第一分光鏡側邊且接收該第二光線； 第二燈源，安裝於該料帶下方，該第二燈源發出第三光線； 第二分光鏡，位於該第二燈源上方，在該第二燈源照射後，該第三光線通過該第二分光鏡照射於該料帶，反射光線再經該第二分光鏡反射改由側面通過；以及 第三檢測鏡頭，位於該第二分光鏡側邊且接收自該料帶反射的該第三光線。An IC material tape inspection device, including: In the working area, the feeding belt moves in the predetermined direction; The first light source is installed above the material belt, and the first light source emits a first light and a second light of different colors; A first beam splitter is installed above the first light source, the first light source illuminates the strip, and the reflected light passes through the first beam splitter so that the first light and the second light pass through the top surface and the side surface respectively; The first detection lens is located above the first beam splitter and receives the first light; The second detection lens is located on the side of the first beam splitter and receives the second light; The second light source is installed under the material belt, and the second light source emits a third light; The second beam splitter is located above the second light source. After the second light source is irradiated, the third light is irradiated on the strip through the second beam splitter, and the reflected light is then reflected by the second beam splitter and changed to Side pass; and The third detection lens is located at the side of the second beam splitter and receives the third light reflected from the strip. 如申請專利範圍第1項所述的IC料帶檢查裝置，該第一燈源為方框形無影燈，包括框體、第一光區及第二光區，該第一光區提供第一光線且為紅光，該第二光區提供第二光線且為藍光。For the IC tape inspection device described in item 1 of the scope of patent application, the first light source is a box-shaped shadowless lamp, which includes a frame, a first light area and a second light area, and the first light area provides the first light And it is red light, and the second light zone provides second light and is blue light. 如申請專利範圍第2項所述的IC料帶檢查裝置，該第一光區環設於該框體內框壁靠近下邊緣區域，該第一光區具有四個區塊。As for the IC tape inspection device described in item 2 of the scope of patent application, the first light zone is arranged around the lower edge area of the frame wall of the frame body, and the first light zone has four zones. 如申請專利範圍第2項所述的IC料帶檢查裝置，該第二光區位於該框體內框壁上邊緣且呈面對面配置，該第二光區具有二個區塊。As for the IC tape inspection device described in item 2 of the scope of patent application, the second light zone is located at the upper edge of the frame wall of the frame body and is arranged face to face, and the second light zone has two zones. 如申請專利範圍第1項所述的IC料帶檢查裝置，進一步包括白色燈源，該白色燈源安裝於該料帶的定位孔下方。The IC strip inspection device as described in item 1 of the scope of patent application further includes a white light source installed under the positioning hole of the strip. 如申請專利範圍第1項所述的IC料帶檢查裝置，進一步包括第一條形燈，該第一條形燈位於該第一分光鏡與該第二檢測鏡頭之間，該第一條形燈提供與該第二光線相同顏色的光線。The IC strip inspection device as described in item 1 of the scope of the patent application further includes a first strip light, the first strip light is located between the first beam splitter and the second detection lens, and the first strip light The lamp provides light of the same color as the second light. 如申請專利範圍第1項所述的IC料帶檢查裝置，進一步包括第一全反射鏡，該第一全反射鏡安裝於該第一分光鏡上方，使該第一光線經該第一全反射鏡反射至該第一檢測鏡頭。The IC tape inspection device as described in item 1 of the scope of patent application further includes a first total reflection mirror installed above the first beam splitter so that the first light is reflected by the first total reflection mirror The mirror reflects to the first detection lens. 如申請專利範圍第1項所述的IC料帶檢查裝置，進一步包括第二全反射鏡，該第二全反射鏡安裝該第一燈源上方，且鄰近設置於該第一分光鏡一側，該第一燈源照射該料帶，光線反射後先經該第二全反射鏡反射且由該第一分光鏡側面進入，該第一分光鏡讓該第二光線通過且被該第二檢測鏡頭接收，而該第一光線經該第一分光鏡反射且改由頂面通過。The IC tape inspection device as described in item 1 of the scope of patent application further includes a second total reflection mirror installed above the first light source and adjacently disposed on one side of the first beam splitter, The first light source illuminates the strip, and the light is reflected by the second total reflection mirror and enters from the side of the first beam splitter. The first beam splitter allows the second light to pass through and is passed by the second detection lens Received, and the first light is reflected by the first beam splitter and passes through the top surface instead. 如申請專利範圍第8項所述的IC料帶檢查裝置，進一步包括第二條形燈，該第二條形燈安裝於該第二全反射鏡與該第一分光鏡之間，該第二條形燈提供與該第一光線相同顏色的光線。The IC tape inspection device as described in item 8 of the scope of patent application further includes a second strip light, the second strip light is installed between the second total reflection mirror and the first beam splitter, and the second The strip light provides light of the same color as the first light.
TW108137152A 2019-10-08 2019-10-15 IC tape inspection device TWI717862B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910950121.5A CN110514670B (en) 2019-10-08 2019-10-08 IC material tape inspection device
CN201910950121.5 2019-10-08

Publications (2)

Publication Number Publication Date
TWI717862B TWI717862B (en) 2021-02-01
TW202115386A true TW202115386A (en) 2021-04-16

Family

ID=68634191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108137152A TWI717862B (en) 2019-10-08 2019-10-15 IC tape inspection device

Country Status (2)

Country Link
CN (1) CN110514670B (en)
TW (1) TWI717862B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023197176A1 (en) * 2022-04-12 2023-10-19 宁德时代新能源科技股份有限公司 Material-strip feeding inspection method and apparatus for stacking machine, and stacking machine, device and medium

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09264722A (en) * 1996-03-28 1997-10-07 Sony Corp Appearance inspecting method and apparatus therefor
US5982493A (en) * 1998-06-02 1999-11-09 Motorola, Inc. Apparatus and method for acquiring multiple images
JP2003254726A (en) * 2002-02-28 2003-09-10 Shibuya Kogyo Co Ltd Device for visual inspection of semi-conductor element
JP2007093258A (en) * 2005-09-27 2007-04-12 Tateyama Machine Kk Visual inspection device
CN108205233A (en) * 2016-12-20 2018-06-26 中国科学院长春光学精密机械与物理研究所 Specular removal LCOS projectors
CN207882160U (en) * 2018-01-17 2018-09-18 武汉楚锐视觉检测科技有限公司 A kind of bottle appearance information detection device based on reflected light path design
JP6570211B1 (en) * 2019-05-29 2019-09-04 ヴィスコ・テクノロジーズ株式会社 Appearance inspection device

Also Published As

Publication number Publication date
TWI717862B (en) 2021-02-01
CN110514670A (en) 2019-11-29
CN110514670B (en) 2024-02-20

Similar Documents

Publication Publication Date Title
KR20120058443A (en) Multi-modal imaging
TWI497059B (en) Multi - surface detection system and method
TWI717862B (en) IC tape inspection device
CN110044926A (en) A kind of lens defect detection device
CN110823902A (en) Light source module and optical detection system
CN104330419A (en) Method and device for detecting film
CN210269638U (en) Detection module and detection machine platform
US9626752B2 (en) Method and apparatus for IC 3D lead inspection having color shadowing
KR102525689B1 (en) Led testing apparatus and method of testing led
KR20140087134A (en) examination apparatus of package
JP3989739B2 (en) Inspection device
JP2012242148A (en) Appearance inspection apparatus and appearance inspection method of transparent bottle
JP2014109530A (en) Defect inspection device and defect inspection method
TWM590243U (en) IC material belt inspection apparatus
JP2008064715A (en) Defect inspection device and defect inspection method
JP2021021592A (en) Inspection system, inspection method, cutting device, and resin molding device
KR101114251B1 (en) 3d surface imaging system
TWM514002U (en) Optical inspection device
KR101437906B1 (en) Apparatus for detecting four way lens of led package
KR20230068578A (en) Micro LED Inspection Device for Performing Photoluminescence Inspection and Automatic Optical Inspection Simultaneously
KR20080088946A (en) Apparatus for inspection of three-dimensional shape and method for inspection by the same
KR101667687B1 (en) Semiconductor Package Inspecting Device
KR102174227B1 (en) Scan device
JP7022661B2 (en) Shape measuring device and shape measuring method
WO2019171756A1 (en) Moulded article imaging method and moulded article imaging device