TWM590243U - IC material belt inspection apparatus - Google Patents

Abstract

An IC material tape inspection device includes: a work area, the material supply tape moves in a predetermined direction; a first light source is installed above the material tape, and the first light source can emit first light and second light of different colors; The beam splitter is installed above the first light source. When the first light source illuminates the material strip, the reflected light is split by the first beam splitter so that the first light and the second light pass through the top surface and the side surface respectively; the first detection lens, It is located above the first beam splitter and receives the first light; the second detection lens is located on the side of the first beam splitter and receives the second light; the second light source is installed under the material strip, and the second light source can emit the third light Irradiate the material strip; the second beam splitter is located above the second light source. After the second light source is irradiated, the third light irradiates the material strip through the second beam splitter, and the reflected light is reflected by the second beam splitter and then passes through the side ; The third inspection lens, located on the side of the second beam splitter, receives the light reflected by the second light source illuminating the tape; by this, multiple photos can be obtained at the same time to check the sealing condition of the tape and the marking on the top surface of the internal chip And the bottom of the tape.

Description

IC strip inspection device

This creation is a technical field related to an IC material tape inspection device, and particularly refers to a multi-group lamp source and multi-group detection lens, which can simultaneously inspect multiple items.

"IC tape" is used to package the finished chip products that have been packaged, to block impurities, bad gases and water vapor in the air, to avoid unnecessary damage to the product before it is shipped to the client, which in turn causes electrical performance to decline .

As shown in Figure 1, it is a schematic diagram of the traditional IC tape inspection method. It is provided with at least one detection lens A above the moving path of the material strip 1 to shoot the image of the surface of the material strip. The tape 1 has a plurality of recesses 11, a sealing film 12 for sealing, and positioning holes 13. Inside the cavity 11 is a packaged chip (not shown). The positioning hole 13 is for the mechanism to drive the material belt 1 to move. The packaged tape 1 must be inspected at least for the sealing condition of the sealing film 12 and the mark on the top surface of the chip during the inspection work before shipment. Therefore, at least two inspection stops are provided. When the material strip 1 moves below the detection lens A, it must be stopped and shot in sequence at the two detection stop positions, and then analyzed based on the captured images to determine whether there is a defect. But such a pause for shooting will prolong inspection time, increase working hours, and reduce the output of unit time.

In order to solve the above problems, the main purpose of this creation is to provide an IC tape inspection device, which mainly uses three detection lenses, with different light sources and spectroscopes, which can simultaneously seal the tape and mark on the internal chip And the bottom of the material belt is checked, and multiple images are shot at the same time, so dynamic shooting can also be performed to increase the unit time (Unit Per Hour, UPH).

In order to achieve the aforementioned purpose, this creation uses the following technical solutions:

This creative IC material tape inspection device includes: a work area where the supply tape moves in a predetermined direction; a first light source is installed above the material tape, and the first light source can emit first light and second light of different colors; A beam splitter is installed above the first light source. When the first light source illuminates the material strip, the reflected light is split by the first beam splitter to cause the first light and the second light to pass through the top surface and the side respectively; the first detection lens , Located above the first beam splitter and receiving the first light; the second detection lens, located on the side of the first beam splitter and receiving the second light; the second light source, installed below the material strip, the second light source emits the third light Irradiate the material strip; the second beam splitter is located above the second light source. After the second light source is irradiated, the third light irradiates the material strip through the second beam splitter, and the reflected light is reflected by the second beam splitter and then passes through the side The third detection lens, located on the side of the second beam splitter, receives the light reflected by the second light source illuminating the material strip.

As one of the preferred embodiments, the first light source is a box-shaped shadowless lamp, including a frame body, a first light area and a second light area, the first light area provides first light and is red light, and the second light area Provide second light and blue light.

As one of the preferred embodiments, the first light zone is located around the lower edge of the frame wall in the frame, and the first light zone has four blocks.

As one of the preferred embodiments, the second light zone is located on the upper edge of the frame wall in the frame and is arranged face-to-face, and the second light zone has two blocks.

As one of the preferred embodiments, a white light source is further included. The white light source is installed below the positioning hole of the tape, but does not affect the illumination of the second light source.

As one of the preferred embodiments, it further includes a first strip lamp, the first strip lamp is located between the first dichroic mirror and the second detection lens, and the first strip lamp provides light of the same color as the second light.

As one of the preferred embodiments, it further includes a first total reflection mirror. The first reflection mirror is installed above the first beam splitter, so that the first light is reflected by the first total reflection mirror to the first detection lens.

As one of the preferred preferred embodiments, it further includes a second total reflection mirror, which is installed above the first lamp source and is disposed adjacent to the side of the first beam splitter. The first lamp source illuminates the material strip and reflects light First reflected by the second total reflection mirror and entered from the side of the first beam splitter, the first beam splitter will let the second light pass through and be received by the second detection lens, and the first light is reflected by the first beam splitter and changed to the top surface by.

As one of the preferred preferred embodiments, it further includes a second strip lamp installed between the second total reflector and the first beam splitter, the second strip lamp provides the same color as the first light Light.

Compared with the existing technology, this creation has the following specific effects: 1. This creation can obtain multiple images through three inspection lenses, check the sealing status of the tape, the mark on the internal chip, and the bottom of the tape through the image to ensure the correct chip shipment and the packaging quality of the tape; 2. This creation uses the combination of the first light source and the first dichroic mirror to provide two detection lenses with different images, thereby avoiding too many components and complicated structure, and can adjust the position of the detection lens to reduce Longitudinal device size; 3. The first light of this creation is red light, and the red light is used to penetrate the sealing film on the surface of the tape, so that the first inspection lens that can only receive red light can obtain a better chip marking image, which is conducive to the inspection of the mark; 4. The second light of this creation is blue light, and the blue light is used to irradiate the sealing joint of the tape, so that the second detection lens that can only receive blue light can obtain a better image, which is beneficial to judge the sealing and sealing condition of the tape and the sealing film; 5. This creation can obtain multiple images at the same time through three inspection lenses, which can be used for dynamic shooting to increase production speed.

The following describes the implementation of the creation by specific specific examples. Those familiar with this technical field can easily understand other advantages and effects of the creation by the content disclosed in this specification. This creation can also be implemented or applied by other specific examples. The details in this creation manual can also be modified and changed based on different viewpoints and applications without departing from the spirit of this creation.

As shown in Fig. 2, it is the architecture diagram of the IC tape inspection device. The composition includes a work area 20, a first light source 21, a first beam splitter 22, a first detection lens 23, a second detection lens 24, a second light source 25, a third detection lens 26, and a second beam splitter 27. The working area 20 allows a material belt 1 to move in a predetermined direction. The first light source 21, the first dichroic mirror 22, the first detection lens 23, and the second detection lens 24 are mounted above the tape 1. The first light source 21 can generate first light 211 and second light 212 of different colors. When the first light source 21 illuminates the material strip 1, the reflected light passes through the first dichroic mirror 22 to let different colors of light pass through the top surface and the side surface, and is received by the first detection lens 23 and the second detection lens 24 for inspection The marking on the top surface of the internal chip and the sealing of the tape 1. The second light source 25, the third detection lens 26, and the second dichroic mirror 27 are disposed below the material strip 1. When the second light source 25 irradiates the bottom of the material strip 1, the second beam splitter 27 allows light to pass through, but then the reflected light changes direction through reflection and is received by the third detection lens 26 for checking the state of the bottom of the material strip 1; By design, at least three different images at different positions of the tape 1 can be obtained at the same time for multiple inspections, and dynamic shooting can also be taken, so the tape 1 does not need to be stationary for shooting, which improves productivity.

Then make a detailed explanation on the structure of each component:

The work area 20 is a work area where the material belt 1 moves linearly and is photographed. Actually, the material belt 1 is driven by the turntables and electric motors (not shown in the figure) located on the left and right sides of the working area 20. In this embodiment, it moves from left to right. Since the driving mechanism can adopt a conventional structure, it does not More detailed description. The tape 1 has a plurality of recesses 11, a sealing film 12 for sealing, and positioning holes 13. Inside the cavity 11 is a packaged chip 14. The positioning hole 13 is used for the mechanism to drive the material belt 1 to move. A mark is formed on the top surface of the chip 14 by processing. The mark may be a product serial number, an identification number such as (QR code), or a trademark. The authoring IC inspection device can at least inspect the adhesion of the sealing film 12 to the tape 1, the marking pattern on the chip 14, and the bottom of the tape 1.

As shown in FIG. 3, the first lamp source 21 is a box-shaped shadowless lamp, including a frame body 213, a first light area 214 and a second light area 215. The first light area 214 is set around the inner wall of the frame 213 near the lower edge area. In this embodiment, there are four blocks. The first light area 214 generates red light, which is the first light 211, which helps the light penetrate the sealing film 12 to obtain the marking pattern on the top surface of the chip 14. The second light zone 215 is located on the upper edge of the inner wall of the frame body 213 and is arranged face-to-face. In this embodiment, there are two blocks. The second light area 215 generates blue light, which is the second light 212, which helps to check whether the sealing film 12 is tightly attached to the material tape 1.

The first dichroic mirror 22 is installed above the first light source 21, and allows part of the light to pass through and part of the light to reflect. In this embodiment, the first beam splitter 22 allows red light to pass, but reflects blue light to pass through the side.

The first detection lens 23 is installed above the first dichroic mirror 22 and receives only the first light 211 that is red light. The second detection lens 24 is installed on the side of the first dichroic mirror 22 and receives only the second light 32 that is blue light. In addition, in order to increase the reflected blue light intensity, this embodiment further includes a first strip lamp 28. In the present embodiment, there are two first strip lamps 28 located between the first dichroic mirror 22 and the second detection lens 24. The first strip lamp 28 can supply blue light of the same color as the second light 212.

The second light source 25 is installed under the material strip 1. The second light source 25 can emit a third light 251. In this embodiment, the third light 251 is red light.

The second dichroic mirror 27 is installed between the lower side of the material strip 1 and the second light source 25. The second dichroic mirror 27 allows the third light 251 irradiated by the second light source 25 to pass, but the light reflected by the material strip 1 is reflected and then passes through the side. The third detection lens 26 is installed at the side of the second dichroic mirror 27. The third detection lens 26 is arranged horizontally, which can reduce the longitudinal size of the device.

In addition, in order to maintain the basic brightness during operation, the creation further includes a white light source 29. The white light source 29 is installed between the second dichroic mirror 27 and the tape 1. As shown in FIG. 4, the white light source 29 is a bar-shaped lamp, and is installed under the positioning hole 13 of the tape 1, so it does not affect the irradiation of the second light source 25.

Next, a description of the overall operation mode. The material belt 1 moves according to the predetermined direction in the working area 20 through the operation of the mechanism, and in this embodiment, moves slowly from left to right. The first light source 21 and the second light source 25 operate simultaneously. The first light source 21 generates the first light 211 and the second light 212 of different colors to irradiate the tape 1, the reflected light is split by the first dichroic mirror 22 to make the red light pass through and received by the first detection lens 23, and the blue light is reflected Passed by the side and received by the second detection lens 24. Through the red light penetrating the sealing film 12, a better marking image on the top surface of the chip 14 can be obtained, and the bonding situation of the sealing film 12 and the tape 1 is irradiated with blue light. All the obtained images are processed by computer image processing. Investigate the correctness of the mark and seal the seal. In addition, the second light source 25 irradiates the bottom of the material strip 1 with the third light 251 of red light, the reflected light is reflected by the second beam splitter 27 and then passes through the side, and the image of the bottom of the material strip 1 is obtained by the second detection lens 26 to confirm whether There are creases or other undesirable conditions. In this way, multiple image data can be obtained at the same time, and the sealing condition, marking, and bottom condition of the tape 1 can be checked at the same time, and dynamic shooting can be performed to increase the productivity in the unit time.

As shown in FIG. 5, it is an architectural diagram of a second embodiment of the authoring IC tape inspection device. In this embodiment, the first total reflection mirror 31 and the second total reflection mirror 32 are mainly added to change the reflection path of the light, and then the installation position of the first detection lens 23 is adjusted, so that the longitudinal size of the device can be reduced. The first total reflection mirror 31 is installed above the first dichroic mirror 22A. The first light 211 is reflected by the first total reflection mirror 31 and is projected to the first detection lens 23 arranged laterally. The second total reflection mirror 32 is installed above the first lamp source 21 and is disposed adjacent to the first dichroic mirror 22A side. When the first lamp source 21 irradiates the material tape 1, the reflected light is reflected by the second total reflection mirror 32 and changes direction to enter the side of the first beam splitter 22A. In this embodiment, the first beam splitter 22A changes to let blue light pass through, but reflects red light to pass through the top surface. Therefore, the second light 212 can be received by the second detection lens 24, and the upwardly reflected first light 211 is reflected by the first total reflection mirror 31 and received by the first detection lens 23. In this way, the first detection lens 23 can be arranged in a horizontal manner, which can reduce the longitudinal size of the device.

In addition, in order to avoid the poor intensity of the first light 211 after color reflection, the creation further includes a second strip light 33. In this embodiment, the second strip lamp 33 is provided with two groups, and is installed between the first dichroic mirror 22A and the first total reflection mirror 32. The second strip lamp 33 can provide red light of the same color as the first light 211 to increase the light intensity reflected by the first total reflection mirror 32.

Based on the above, this creative IC tape inspection device is provided with a first detection lens 23, a second detection lens 24, and a third detection lens 26 above and below the tape 1, respectively, to meet specific needs to receive specific light, so The sealing of the tape 1, the marking of the internal chip 14 and the bottom of the tape 1 can be checked at the same time, and multiple images are shot at the same time, so dynamic shooting can also be performed to increase the productivity per unit time.

However, the above-mentioned embodiments are only illustrative of the effects of this creation, and are not used to limit this creation. Anyone who is familiar with this technical field can modify and change the above-mentioned embodiments without departing from the spirit and scope of this creation. . In addition, the number of elements in the above-mentioned embodiments is merely an illustrative description, and is not intended to limit the creation. Therefore, the scope of protection of the rights of this creation should be as listed in the following patent application scope.

1‧‧‧ material belt 11‧‧‧ Alcove 12‧‧‧Sealing film 13‧‧‧Locating hole 14‧‧‧chip A‧‧‧Detection lens 20‧‧‧Working area 21‧‧‧First light source 211‧‧‧ First light 212‧‧‧Second light 213‧‧‧frame 214‧‧‧ First Light District 215‧‧‧ Second Light District 22‧‧‧The first beam splitter 23‧‧‧ First inspection lens 24‧‧‧Second inspection lens 25‧‧‧Second light source 251‧‧‧ third light 26‧‧‧ Third inspection lens 27‧‧‧Second Beamsplitter 28‧‧‧The first strip light 29‧‧‧White light source 31‧‧‧The first total reflection mirror 32‧‧‧The second total reflection mirror 22A‧‧‧First beam splitter 33‧‧‧The second strip light

Fig. 1 is a schematic diagram of a conventional inspection method. FIG. 2 is a structural diagram of a first embodiment of an authoring IC material tape inspection device. Figure 3 is an enlarged perspective view of the first light source of the creation; FIG. 4 is a bottom view showing the configuration state of the second light source and the white light source for this creation; FIG. 5 is a structural diagram of a second embodiment of an authoring IC tape inspection device.

1‧‧‧ material belt

11‧‧‧ Alcove

12‧‧‧Sealing film

14‧‧‧chip

20‧‧‧Working area

21‧‧‧First light source

211‧‧‧ First light

212‧‧‧Second light

22‧‧‧The first beam splitter

23‧‧‧ First inspection lens

24‧‧‧Second inspection lens

25‧‧‧Second light source

251‧‧‧ third light

26‧‧‧ Third inspection lens

27‧‧‧Second Beamsplitter

28‧‧‧The first strip light

29‧‧‧White light source

Claims (9)

An IC material tape inspection device includes: Work area, the feeding belt moves in accordance with the predetermined direction; The first light source is installed above the material strip, and the first light source emits first light and second light of different colors; The first beam splitter is installed above the first light source, the first light source illuminates the material strip, and the reflected light passes through the first beam splitter to pass the first light and the second light through the top surface and the side surface respectively; The first detection lens is located above the first beam splitter and receives the first light; A second detection lens located on the side of the first beam splitter and receiving the second light; The second light source is installed under the material belt, and the second light source emits third light; The second dichroic mirror is located above the second light source. After the second light source is irradiated, the third light is irradiated to the tape through the second dichroic mirror, and the reflected light is reflected by the second dichroic mirror and changed to Side pass; and The third detection lens is located at the side of the second beam splitter and receives the third light reflected from the material strip. According to the IC tape inspection device described in item 1 of the patent application scope, the first light source is a box-shaped shadowless lamp, including a frame body, a first light area and a second light area, the first light area provides the first light It is red light, and the second light area provides second light and is blue light. According to the IC tape inspection device described in Item 2 of the patent application scope, the first light zone ring is disposed on the inner wall of the frame close to the lower edge area, and the first light zone has four blocks. According to the IC tape inspection device described in Item 2 of the patent application scope, the second light zone is located on the upper edge of the frame wall in the frame and is arranged face-to-face, and the second light zone has two blocks. The IC tape inspection device as described in item 1 of the patent application scope further includes a white light source, and the white light source is installed below the positioning hole of the tape. The IC tape inspection device as described in item 1 of the patent application scope further includes a first strip lamp, the first strip lamp is located between the first beam splitter and the second detection lens, the first strip The lamp provides light of the same color as the second light. The IC tape inspection device as described in item 1 of the patent application scope further includes a first total reflection mirror, which is installed above the first beam splitter so that the first light is reflected by the first total reflection The mirror reflects to the first detection lens. The IC tape inspection device as described in item 1 of the patent application scope further includes a second total reflection mirror, which is installed above the first light source and is disposed adjacent to the side of the first beam splitter, The first light source illuminates the material strip, and after the light is reflected, it is reflected by the second total reflection mirror and enters from the side of the first beam splitter. The first beam splitter allows the second light to pass through and is detected by the second detection lens Received, and the first light is reflected by the first beam splitter and passes through the top surface instead. The IC tape inspection device as described in item 8 of the patent application scope further includes a second strip lamp installed between the second total reflector and the first beam splitter, the second The strip light provides light of the same color as the first light.

Images