CN217426680U - Optical device for visual inspection of tin ball chip product - Google Patents
Optical device for visual inspection of tin ball chip product Download PDFInfo
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- CN217426680U CN217426680U CN202220706139.8U CN202220706139U CN217426680U CN 217426680 U CN217426680 U CN 217426680U CN 202220706139 U CN202220706139 U CN 202220706139U CN 217426680 U CN217426680 U CN 217426680U
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Abstract
The application relates to an optical device for visual inspection of a tin ball chip product, which comprises an infrared camera, a color camera, a spectroscope, a prism and a telecentric lens, wherein the infrared camera is connected with the spectroscope, the spectroscope is connected with the telecentric lens, and the infrared camera and the telecentric lens are respectively positioned at two opposite sides of the spectroscope; the color camera is connected with the prism, the prism is connected with the spectroscope, and the prism is positioned between the infrared camera and the telecentric lens; the telecentric lens is arranged close to the shooting product. The utility model discloses detect and provide a feasible efficient optics scheme to tin ball class product appearance imperfections, can compatible each type of chip kind, all have good detection effect to tin ball, circuit and SMF layer detection, promotion detection efficiency that can be very big reduces the cost of labor, and just the rate of leaking examining also can reduce by a wide margin.
Description
Technical Field
The application relates to the technical field of visual inspection, in particular to an optical device for visual inspection of a tin ball chip product.
Background
At present, in the semiconductor packaging process, the main detection modes are an electrical property test and an X-ray failure test, and the detection aiming at the appearance defect and the surface defect of a product is little; especially, the detection of the packaged product of the solder ball is mainly to perform the electrical performance test through the probe, and the appearance defect detection is usually observed by the human eyes. At present, no good visual scheme exists for the appearance detection of tin ball chips, the main reasons are that tin ball chips are various in product types and different in size, circuits are complex, SMF layers are uneven, reflection brightness difference is large, the existing visual scheme can only detect a few types of products or products with less change, or manual detection is basically used under a microscope, the detection efficiency is low, the detection accuracy is very unstable, and the development of the semiconductor industry is greatly restricted by the problem of poor appearance.
With the rapid development of semiconductor packaging technology, more and more various products need to increase the requirement of appearance defect detection, and under the application of new WL-CSP advanced packaging technology, the solder balls of the existing semiconductor packaging chip products are smaller and smaller, the circuits are more complex and narrower in width, the SMF layer coatings are various and the light reflection is serious, so that the detection difficulty is higher. However, because the efficiency of automatic production is improved, the manual detection efficiency is very low, and because of human eye fatigue or interference of external factors, the uncontrollable missed detection condition is increased, so that the appearance detection of tin ball products must use a machine vision technology to solve the current problem.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an optical device for visual inspection of a tin ball chip product, so as to solve the problems.
The technical scheme of the utility model is realized like this: an optical device for visual inspection of a tin ball chip product comprises an infrared camera, a color camera, a spectroscope, a prism, a telecentric lens and an illumination light source device, wherein the infrared camera is connected with the spectroscope, the spectroscope is connected with the telecentric lens, and the infrared camera and the telecentric lens are respectively positioned at two opposite sides of the spectroscope; the color camera is connected with the prism, the prism is connected with the spectroscope, and the prism is positioned between the infrared camera and the telecentric lens; the telecentric lens is arranged close to the shooting product.
In some embodiments, the lighting source device comprises an arched light source device, and the arched light source device comprises an arched plate and first lamp beads, wherein the first lamp beads are uniformly arranged on the arched plate.
In some embodiments, the first lamp bead is a white light bead.
In some embodiments, the illumination light source device further includes a middle-high angle annular light source device and a low angle annular light source device, the middle-high angle annular light source device is located below the arched light source device, the low angle annular light source device is located below the middle-high angle annular light source device, and the photographic product is located below the low angle annular light source device.
In some embodiments, the medium-high angle annular light source device includes a second annular plate and a second lamp bead, and the second lamp bead is an infrared lamp bead; the second lamp beads are uniformly arranged on the surface of the annular plate in a concentric circle mode, and the included angle between the light beam irradiated by the medium-high angle annular light source device and the horizontal plane is not less than 45 degrees.
In some embodiments, the low-angle annular light source device comprises a third annular plate and a third lamp bead, wherein the third lamp bead is an infrared lamp bead; the third lamp beads are uniformly arranged on the surface of the third annular plate in a concentric circle mode, and the included angle between the light beam irradiated by the low-angle annular light source device and the horizontal plane is smaller than 45 degrees.
In some embodiments, an infrared band filter is disposed in the beam splitter.
The beneficial effect that technical scheme that this application provided brought includes: the utility model discloses a to tin ball class product appearance defect detection provide a feasible efficient optical scheme, can compatible each type of chip kind, all have good detection effect to tin ball, circuit and SMF layer detection, can very big promotion detection efficiency, reduce the cost of labor, and the missed-examination rate also can reduce by a wide margin; the utility model integrates two camera stations, greatly saving space and fitting cost, and being very beneficial to the requirement of production line on-line production detection; thirdly, the utility model can shoot the internal defects of the circuit and SMF layer by the application of the mid-infrared camera, is superior to the detection accuracy of human eyes under a microscope, and can completely replace the current manual detection and liberate the manpower; the utility model discloses an infrared camera and color camera interactive application can be compatible the detection of a plurality of wave band light, combines a plurality of angles of high, medium and low to shine, can detect the appearance defect of product completely, avoids lou examining; (V) the design of this practical telecentric lens has satisfied infrared and mixed multiple wave band requirement of white light, and has increased spectroscope and infrared wave band filter coating and guarantee that two camera light mutual noninterference, and the global design is compact, supports the detection demand of multipurpose.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: 1. an infrared camera; 2. a color camera; 3. a beam splitter; 4. a prism; 5. a telecentric lens; 6. an arched light source device; 7. a medium-high angle annular light source device; 8. a low angle annular light source device; 9. and shooting the product.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1, the present embodiment provides an optical device for visual inspection of solder ball chip production, including an infrared camera 1, a color camera 2, a spectroscope 3, a prism 4, a telecentric lens 5 and an illumination light source device, wherein the infrared camera 1 is connected to the spectroscope 3, the spectroscope 3 is connected to the telecentric lens 5, and the infrared camera 1 and the telecentric lens 5 are respectively located at two opposite sides of the spectroscope 3; the color camera 2 is connected with the prism 4, the prism 4 is connected with the spectroscope 3, and the prism 4 is positioned between the infrared camera 1 and the telecentric lens 5; the telecentric lens 5 is arranged close to the photographic product 9.
The infrared camera 1 is matched with the illumination light source device for shooting, and can shoot the defects of the circuit and the SMF layer through the coating of the shooting product 9. The color camera 2 is matched with the illumination light source device for shooting, so that the real color of a shot product can be restored, and sufficient color information can be provided for the detection processes of defect detection, detection template setting, defect classification and the like. The infrared camera 1 and the color camera 2 do not have a front-back sequence in shooting, and shooting can be triggered completely according to detection requirements in a combined mode.
In some embodiments, the lighting source device includes an arched light source device 6, and the arched light source device 6 includes an arched plate and first beads, and the first beads are uniformly disposed on the arched plate. The first lamp beads are white light lamp beads. The first lamp bead has a large light divergence angle, so that light can be more uniform, and the real color of the shot product 9 can be effectively restored. The color camera 2 is matched with the white arched light source emitted by the arched light source device 6 to shoot, wherein the light source emits light at a high angle and is designed into an arched light shape, so that light rays are better and uniform, the real color of the shot product 9 can be restored, and sufficient color information can be provided for the detection processes of defect detection, detection template setting, defect classification and the like.
In some embodiments, the illumination light source device further includes a middle-high angle annular light source device 7 and a low angle annular light source device 8, the middle-high angle annular light source device 7 is located below the arched light source device 6, the low angle annular light source device 8 is located below the middle-high angle annular light source device 7, and the photographic product 9 is located below the low angle annular light source device 8. The medium-high angle annular light source device 7 comprises a second annular plate and a second lamp bead, and the second lamp bead is an infrared lamp bead; the second lamp beads are uniformly arranged on the surface of the annular plate in a concentric circle mode, and the included angle between the light beam irradiated by the middle-high angle annular light source device 7 and the horizontal plane is not less than 45 degrees. The low-angle annular light source device 8 comprises a third annular plate and a third lamp bead, and the third lamp bead is an infrared lamp bead; the third lamp beads are uniformly arranged on the surface of the third annular plate in a concentric circle mode, and the included angle between the light beam irradiated by the low-angle annular light source device 8 and the horizontal plane is smaller than 45 degrees. The two annular light sources of the middle-high angle annular light source device 7 and the low angle annular light source device 8 are matched in height and angle to trigger photographing respectively, and defects of a solder ball, a circuit and an SMF layer can be effectively detected. The design angles of the second lamp bead and the third lamp bead are small-angle light-emitting designs, and the detection is better for defects such as surface scratches, foreign matters and damages. The infrared camera 1 is matched with an infrared light source emitted by the medium-high angle annular light source device 7 and the low angle annular light source device 8 to shoot, wherein infrared light can penetrate through the coating of a shooting product to shoot the defects of a circuit and the inner part of an SMF layer, and the interference of surface reflection can be reduced. The high and low angles of the infrared light source of the middle and high angle annular light source device 7 and the low angle annular light source device 8 are matched, two images are taken, the height of the light source is adjusted according to the detection requirement, and the defects of the solder ball, the circuit and the SMF layer can be detected more accurately.
In some embodiments, the spectroscope 3 is provided with an infrared band filter. In order to avoid infrared light and white light mutual interference, the utility model discloses increased spectroscope 3 and prism 4 device, changed the light path through the light splitting mode, wherein the infrared band filter coating that spectroscope 3 can increase can shelter from the white light.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. The optical device for visual inspection of the tin ball chip product is characterized by comprising an infrared camera (1), a color camera (2), a spectroscope (3), a prism (4), a telecentric lens (5) and an illumination light source device, wherein the infrared camera (1) is connected with the spectroscope (3), the spectroscope (3) is connected with the telecentric lens (5), and the infrared camera (1) and the telecentric lens (5) are respectively positioned at two opposite sides of the spectroscope (3); the color camera (2) is connected with the prism (4), the prism (4) is connected with the spectroscope (3), and the prism (4) is positioned between the infrared camera (1) and the telecentric lens (5); the telecentric lens (5) is arranged close to the shooting product (9).
2. The optical device for visual inspection of solder ball chip products as claimed in claim 1, wherein said illumination light source device comprises an arched light source device (6), said arched light source device (6) comprises an arched plate and first beads, said first beads are uniformly disposed on said arched plate.
3. The optical device for visual inspection of solder ball chip products of claim 2 wherein said first bead is a white bead.
4. The optical device for visual inspection of solder ball chip products of claim 2, wherein said illumination light source device further comprises a middle high angle ring light source device (7) and a low angle ring light source device (8), said middle high angle ring light source device (7) is located below said arch light source device (6), said low angle ring light source device (8) is located below said middle high angle ring light source device (7), and said camera product (9) is located below said low angle ring light source device (8).
5. The optical device for visually inspecting solder ball chip products as claimed in claim 4, wherein said medium-high angle annular light source device (7) comprises a second annular plate, a second lamp bead, said second lamp bead being an infrared lamp bead; the second lamp beads are uniformly arranged on the surface of the annular plate in a concentric circle mode, and the included angle between the light beam irradiated by the middle-high angle annular light source device (7) and the horizontal plane is not less than 45 degrees.
6. The optical device for visually inspecting solder ball chip products of claim 4 wherein said low angle annular light source means (8) comprises a third annular plate, a third bead, said third bead being an infrared bead; the third lamp beads are uniformly arranged on the surface of the third annular plate in a concentric circle mode, and the included angle between the light beam irradiated by the low-angle annular light source device (8) and the horizontal plane is smaller than 45 degrees.
7. The optical device for visual inspection of tin ball chip products as claimed in claim 1, wherein said beam splitter (3) is provided with an infrared band filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220706139.8U CN217426680U (en) | 2022-03-29 | 2022-03-29 | Optical device for visual inspection of tin ball chip product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220706139.8U CN217426680U (en) | 2022-03-29 | 2022-03-29 | Optical device for visual inspection of tin ball chip product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217426680U true CN217426680U (en) | 2022-09-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220706139.8U Active CN217426680U (en) | 2022-03-29 | 2022-03-29 | Optical device for visual inspection of tin ball chip product |
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| Country | Link |
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| CN (1) | CN217426680U (en) |
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- 2022-03-29 CN CN202220706139.8U patent/CN217426680U/en active Active
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