TW202114507A - Heat dissipation system - Google Patents

Abstract

A heat dissipation system is used for coupling a heat source. The heat dissipation system includes a centrifugal fan, a heat pipe, a heat sink and a heat-guiding frame. The centrifugal fan includes a case and a fan. The case has a containing space and an inlet and an outlet connecting the containing space. The fan locates in the containing space. The heat pipe couple with the heat source. The heat sink locates at the outlet and couples with the heat pipe. The heat guiding frame includes a heat absorbing frame and a heat dissipation frame. The heat absorbing frame is used for mounting the heat source and couples with the heat source. The heat dissipation frame mounts on the case of the centrifugal fan and the part of the heat dissipation frame locates in the containing space. The heat dissipation frame couples with the heat absorbing frame.

Description

cooling system

The present invention relates to a heat dissipation system, especially a heat dissipation system with dual heat conduction paths.

With the changes in people's computer usage habits, notebook computers have become a very important product type on the market. Because laptops are small and easy to carry, people often take laptops for commuting, do some paperwork in the office, read some articles or videos on the Internet in coffee shops, and may also use laptops with three or five friends to play a few times. Field video game. If the user particularly requires the fluency or screen detail of the notebook computer in video games, the notebook computer needs to be equipped with a higher-end processor and display chip. However, higher-end processors and display chips are accompanied by the problem of excessive waste heat generation, and the size of the notebook computer is limited, and the heat dissipation design is often not ideal.

Traditionally, some notebook computers are designed with fans inside, which use airflow to dissipate the waste heat inside the notebook computers. However, as the performance of notebook computers has become more and more excellent, the waste heat generated by the notebook computers has also increased sharply. Therefore, the traditional air-cooled heat dissipation design will be difficult to achieve the required heat dissipation effect.

The present invention is to provide a heat dissipation system, so as to improve the heat dissipation effect of the heat dissipation system.

The heat dissipation system disclosed in an embodiment of the present invention is suitable for thermally coupling to a heat source. The heat dissipation system includes a centrifugal fan, a heat pipe, a radiator and a heat-conducting frame group. The centrifugal fan includes a casing and a fan blade. The shell has an accommodating space and an air inlet and an air outlet communicating with the accommodating space. The fan blade is located in the accommodating space. The heat pipe is thermally coupled to the heat source. The radiator is located at the air outlet and is thermally coupled to the heat pipe. The heat-conducting rack group includes a heat-absorbing rack and a heat-dissipating rack. The heat absorption rack is used for assembly of the heat source and is thermally coupled with the heat source. The heat dissipation frame is installed on the casing of the centrifugal fan and partly located in the accommodating space. The heat dissipation frame is thermally coupled to the heat absorption frame.

According to the heat dissipation system of the above embodiment, in addition to the heat conduction path of the original heat pipe, the heat absorption rack thermally coupled to the heat source is thermally coupled to the heat dissipation rack installed in the centrifugal fan, so that the heat generated by the heat source can be conducted through the heat pipe. To the radiator, it is taken away by the cooling airflow of the centrifugal fan, and it can also be conducted to the heat sink through the heat-conducting rack group, and taken away by the cooling airflow of the centrifugal fan. That is to say, in addition to the heat conduction path of the traditional heat pipe, this embodiment further adds the heat conduction path of the heat conducting rack assembly to improve the heat dissipation efficiency of the heat source.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figure 1 to Figure 4. Fig. 1 is a three-dimensional schematic diagram of the heat dissipation system according to the first embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of FIG. 1 from another perspective. Fig. 3 is an exploded schematic diagram of Fig. 1. Fig. 4 is a schematic partial cross-sectional view of Fig. 1.

The heat dissipation system 10 of this embodiment is suitable for thermally coupling to a heat source 20. The heat source 20 is, for example, a high-heating element such as a central processing wafer and a display wafer. The heat dissipation system 10 includes a centrifugal fan 100, a heat pipe 200, a radiator 300 and a heat conducting rack 400.

The centrifugal fan 100 includes a casing 110 and a fan blade 120. The housing 110 has an accommodating space S and an air inlet O1 and an air outlet O2 communicating with the accommodating space S. Specifically, the housing 110 includes a bottom plate 111 and a cover plate 112. The bottom plate 111 has a central portion 1111, a plurality of connecting portions 1112 and an outer ring portion 1113. The outer ring portion 1113 surrounds the central portion 1111 and is separated from each other. The connecting portions 1112 connect the central portion 1111 and the outer ring portion 1113 and are separated from each other to form a hollow groove between any two adjacent connecting portions 1112. The cover plate 112 is assembled to the outer ring portion 1113 of the bottom plate 111. The fan blade 120 is located in the accommodating space S and is rotatably installed in the central portion 1111.

The heat pipe 200 is thermally coupled to the heat source 20. The heat sink 300 is, for example, a heat dissipation fin. The radiator 300 is located at the air outlet O2 and is thermally coupled to the heat pipe 200 to conduct the heat generated by the heat source 20 to the radiator 300, and then the heat accumulated in the radiator 300 is taken away by the cooling airflow generated by the centrifugal fan 100 .

The heat conducting rack assembly 400 includes a heat absorption rack 410 and a heat dissipation rack 420. The heat absorption frame 410 is used for assembling the heat source 20 and is thermally coupled with the heat source 20. The heat dissipation frame 420 is installed in the casing 110 of the centrifugal fan 100 and is partially located in the accommodating space S. The heat dissipation frame 420 is thermally coupled to the heat absorption frame 410. In this way, the heat generated by the heat source 20 can be conducted to the radiator 300 through the heat pipe 200 to be carried away by the cooling airflow of the centrifugal fan 100, and can also be conducted to the heat dissipation frame 420 through the heat conducting frame set 400, in the same way. It is carried away by the cooling airflow of the centrifugal fan 100. That is to say, in addition to the heat conduction path of the traditional heat pipe 200, this embodiment further adds the heat conduction path of the heat conduction frame assembly 400 to improve the heat dissipation efficiency of the heat source 20.

To explain in another way, the heat-absorbing frame 410 of this embodiment is similar to the traditional metal backplane for central processing unit assembly. The difference is that the traditional metal backplane for central processing unit assembly is not thermally coupled with the fan. However, the heat sink 410 of this embodiment not only has the function of the traditional metal back plate for central processing unit assembly, but also provides another heat conduction path due to the thermal coupling with the heat sink 420 to remove the heat generated by the heat source 20. The heat is transferred to the fan, and the heat is taken away by the airflow generated by the fan.

In this embodiment, the heat dissipation frame 420 includes a substrate 421 and a plurality of heat conducting rings 422. Each heat conducting ring 422 includes a plurality of heat conducting arc fins 4221. These thermally conductive arc pieces 4221 protrude from the substrate 421. These thermally conductive arc fins 4221 are arranged in a ring shape and surround in a circle, and are separated from each other to form a space G between any two adjacent thermally conductive arc fins 4221. The base plate 421 is stacked on the side of the bottom plate 111 facing away from the accommodating space S, and the connecting portions 1112 are located in the vacant space G, respectively. The fan blade 120 has a plurality of heat-conducting rings 121, and the centers of the plurality of heat-conducting rings 121 and the heat-conducting arcs are substantially the same, and are arranged side by side with each other.

The heat conducting rings 121 are separated from the heat conducting arc fins 4221, but the distance between the two is extremely small. Since these heat conduction rings 121 are separated from the heat conduction arc 4221, the heat conduction method between the separated heat conduction ring 121 and the heat conduction arc 4221 should be thermal convection, but because the distance between the heat conduction ring 121 and the heat conduction arc 4221 is extremely small, When the centrifugal fan 10 is running, the boundary layer formed on the heat conducting ring 121 and the boundary layer formed on the heat conducting arc 4221 are destroyed due to the extremely small distance, so that the heat conduction method of the heat conducting ring 121 and the heat conducting arc 4221 is changed to similar Heat conduction, so that the heat conduction between the heat conduction ring 121 and the heat conduction arc piece 4221 achieves an effect close to the heat conduction.

In this embodiment, the numbers of the heat conducting ring 422 and the heat conducting ring 121 are both multiple, but it is not limited thereto. In other embodiments, the number of the heat-conducting ring and the heat-conducting ring may also be single.

In this embodiment, the number of the connecting portion 1112 and the relief space G is three, but it is not limited thereto. In other embodiments, the number of the connecting portion and the giving way space can also be single.

In this embodiment, the heat dissipation frame 420 is riveted to the heat absorption frame 410, but it is not limited to this. In other embodiments, the heat dissipation frame can also be detachably assembled to the heat absorption frame, for example, the heat dissipation frame is assembled to the heat absorption frame through a buckle method.

In this embodiment, the heat dissipation frame 420 is independent of the bottom plate 111, and the area of the base plate 421 of the heat dissipation frame 420 is smaller than the area of the bottom plate 111. The purpose is to make the heat dissipation frame 420 with a smaller area better during machining.的 Machining accuracy. Conversely, if the heat-conducting rings 422 of the heat sink 420 are directly formed on the bottom plate 111 through mechanical processing, the larger area of the bottom plate 111 may be affected and the machining accuracy of the heat-conducting rings 422 may decrease.

According to the heat dissipation system of the above embodiment, in addition to the heat conduction path of the original heat pipe, the heat absorption rack thermally coupled to the heat source is thermally coupled to the heat dissipation rack installed in the centrifugal fan, so that the heat generated by the heat source can be conducted through the heat pipe. To the radiator, it is taken away by the cooling airflow of the centrifugal fan, and it can also be conducted to the heat sink through the heat-conducting rack group, and taken away by the cooling airflow of the centrifugal fan. That is to say, in addition to the heat conduction path of the traditional heat pipe, this embodiment further adds the heat conduction path of the heat conducting rack assembly to improve the heat dissipation efficiency of the heat source.

Although the present invention is disclosed in the foregoing embodiments, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

10: Cooling system 20: Heat source 100: Centrifugal fan 110: shell 111: bottom plate 1111: Central 1112: Connection Department 1113: Outer Ring 112: cover 120: fan blade 121: heat conduction ring 200: heat pipe 300: radiator 400: Heat conduction rack group 410: heat sink 420: heat sink 421: Substrate 422: heat conduction ring 4221: Thermally conductive arc sheet S: housing space O1: Air inlet O2: Outlet G: Make room

Fig. 1 is a three-dimensional schematic diagram of the heat dissipation system according to the first embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of FIG. 1 from another perspective. Fig. 3 is an exploded schematic diagram of Fig. 1. Fig. 4 is a schematic partial cross-sectional view of Fig. 1.

10: Cooling system

20: Heat source

100: Centrifugal fan

110: shell

111: bottom plate

1111: Central

1112: Connection Department

1113: Outer Ring

112: cover

200: heat pipe

300: radiator

400: Heat conduction rack group

410: heat sink

420: heat sink

Claims (10)

A heat dissipation system adapted to be thermally coupled to a heat source, including: A centrifugal fan includes a housing and a fan blade, the housing has an accommodating space and an air inlet and an air outlet communicating with the accommodating space, the fan blade is located in the accommodating space; a heat pipe, thermally coupled In the heat source; a radiator located at the air outlet and thermally coupled to the heat pipe; and a heat conducting rack set, including a heat absorption rack and a heat dissipation rack, the heat absorption rack is used for assembly of the heat source and heats with the heat source Coupled, the heat dissipation frame is installed on the casing of the centrifugal fan and partly located in the accommodating space, and the heat dissipation frame is thermally coupled to the heat absorption frame. As for the heat dissipation system described in claim 1, wherein the housing includes a bottom plate and a cover plate, the bottom plate has a central part, an outer ring part and a plurality of connecting parts, and the outer ring part surrounds the central part Inside and separated from each other, the connecting portions are connected to the central portion and the outer ring portion and separated from each other to form a hollow groove between any two adjacent connecting portions, and the cover plate is assembled to the outer ring portion of the bottom plate , The fan blade is rotatably installed on the central part. For the heat dissipation system described in claim 2, wherein the heat dissipation frame includes a substrate and at least one heat conduction ring, the at least one heat conduction ring includes a plurality of heat conduction arc fins, and the heat conduction arc fins protrude from the substrate. The heat-conducting arc fins are arranged in a ring to form a circle and are separated from each other to form a space between any two adjacent heat-conducting arc fins. The substrate is stacked on the side of the bottom plate facing away from the accommodating space. Moreover, the connecting parts are respectively located in the vacant space. As for the heat dissipation system described in item 3 of the scope of patent application, the number of the connecting portion and the space for giving way is three. According to the heat dissipation system described in item 3 of the scope of patent application, the fan blade has at least one heat conduction ring, and the center of the at least one heat conduction ring and the at least one heat conduction arc are substantially the same and are arranged side by side with each other. For the heat dissipation system described in item 3 of the scope of patent application, the number of the at least one heat conducting ring and the at least one heat conducting ring are both multiple. The heat dissipation system described in item 2 of the scope of patent application, wherein the heat dissipation frame is detachably assembled to the heat absorption frame. The heat dissipation system described in item 7 of the scope of patent application, wherein the heat dissipation frame is riveted to the heat absorption frame. The heat dissipation system described in item 7 of the scope of patent application, wherein the area of the substrate of the heat dissipation frame is smaller than the area of the bottom plate. In the heat dissipation system described in item 1 of the scope of patent application, the heat sink is a heat dissipation fin.

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