TW202113306A - Holding member, inspection mechanism, cutting device, manufacturing method of holding object and manufacturing method of holding member - Google Patents

Abstract

Provided is a holding member which can precisely perform edge detection of holding objects sucked and held respectively by a plurality of suction holes. The holding member holds a plurality of holding objects and is used for optical inspection. The holding member includes: a holding portion provided with a plurality of suction holes sucking to hold the holding objects and grooves arranged between the plurality of suction holes; and a reflection portion which is arranged in the grooves and has a higher reflection ratio than the holding portion, wherein the reflection portion has a flat surface.

Description

Holding member, inspection mechanism, cutting device, manufacturing method of holding object, and manufacturing method of holding member

The present invention relates to a technique of a holding member for holding a holding object for optical inspection, an inspection mechanism and cutting device using the holding member, a method of manufacturing the holding object using the cutting device, and a method of manufacturing the holding member.

Patent Document 1 discloses an appearance inspection device for electronic components. The visual inspection device of the electronic component detects the edge of the inspected portion of the electronic component, and based on the position of the edge, measures the size of the inspected portion and determines whether it is qualified. The appearance inspection device for electronic parts is characterized by including: an image input unit that photographs the inspection part from a prescribed direction; an illumination unit that can respectively irradiate the inspection part with light from at least two directions that form an acute angle with the photographing direction; and a photographing control unit According to the light irradiation in each direction generated by the lighting unit, the image input unit is operated to perform shooting; and the edge position detection unit detects the edge position of the electrode part based on the image signal obtained by each light irradiation.

Known technical literature Patent literature Patent Document 1: Japanese Patent Laid-Open No. 8-184410

In the appearance inspection apparatus for electronic parts disclosed in Patent Document 1, the illuminator is arranged symmetrically across the imaging center of the camera, the inspection part is irradiated with light in one direction from the illuminator on the left, and the inspection part is irradiated from the illuminator on the right. Shine light in the other direction. The brightness value of each image data obtained from the illumination from two directions is compared, and the part where the difference in lightness and darkness occurs due to the presence or absence of shadows and color parts is explored, and the edge position of the inspection part is detected. However, in Patent Document 1, there is no description of edge detection for the holding object to be sucked and held by each of the plurality of suction holes of the holding member.

The present invention is made in view of the above situation, and the problem to be solved is to provide a holding member, an inspection mechanism, a cutting device, and a holding object that can accurately perform edge detection of a holding object that is sucked and held by a plurality of suction holes. The manufacturing method of the object and the manufacturing method of the holding member.

The problem to be solved by the present invention is as described above. In order to solve the problem, the holding member of the present invention holds a plurality of holding objects for optical inspection, and includes: a holding portion provided with a plurality of suction holding the holding objects A hole and a groove arranged between the plurality of suction holes; and a reflecting part provided in the groove and having a higher reflectivity than the holding part; and the reflecting part has a flat surface.

In addition, the inspection mechanism of the present invention inspects the holding object held by the holding member.

In addition, the cutting device of the present invention includes: a cutting mechanism that cuts the cut object to obtain a plurality of the holding objects; and the inspection mechanism; The holding object obtained by the institution is inspected.

In addition, the method of manufacturing the object to be held of the present invention uses the cutting device to produce the object to be held.

In addition, the method of manufacturing a holding member of the present invention is a method of manufacturing a holding member that holds a plurality of holding objects for optical inspection, and the method of manufacturing the holding member includes a resin filling step. The holding part of the resin is filled into the groove, and the groove is arranged between the plurality of suction holes for sucking and holding the holding object; and the resin hardening step is to harden the resin.

According to the present invention, it is possible to accurately perform edge detection of the holding object adsorbed and held by each of the plurality of suction holes.

First, using FIG. 1, the configuration of the cutting device 1 of the present embodiment will be described. In the present embodiment, for example, the configuration of the cutting device 1 when the package substrate P is used as the object to be cut by the cutting device 1, which is a resin-sealed substrate on which a semiconductor wafer is mounted, will be described. to make.

As the package substrate P, for example, a ball grid array (BGA) package substrate, a chip size package (CSP) package substrate, a light emitting diode (LED) package substrate, etc. are used. In addition, as the object to be cut, not only the package substrate P but also a sealed lead frame may be used. The sealed lead frame is formed by resin sealing a lead frame on which a semiconductor chip is mounted.

In addition, in the following, for both surfaces of the package substrate P, the surface on the resin sealing side is referred to as mold face, and the surface on the opposite side to the mold surface is referred to as ball face/lead face. .

The cutting device 1 includes a cutting module A and an inspection module B as constituent elements. Each component is detachable and replaceable with respect to other components.

The cutting module A is a component that mainly performs cutting of the package substrate P. The cutting module A mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle 6, a conveying unit 7, and a control unit 8.

The substrate supply unit 3 supplies the package substrate P. The substrate supply part 3 pushes out the package substrate P piece by piece from a magazine M in which a plurality of package substrates P are accommodated, and supplies it to the positioning part 4 described later. Place the package substrate P with the ball surface/wire facing upward.

The positioning part 4 positions the package substrate P supplied from the substrate supply part 3. The positioning part 4 arranges and positions the package substrate P pushed out from the substrate supply part 3 on the rail part 4a. After that, the positioning unit 4 conveys the positioned package substrate P to a cutting table 5 described later.

The cutting table 5 holds the package substrate P to be cut. In this embodiment, the cutting device 1 configured with a double cutting table including two cutting tables 5 is illustrated. The cutting table 5 is provided with a holding member 5 a that sucks and holds the package substrate P conveyed by the positioning portion 4 from below. In addition, the cutting table 5 is provided with a rotating mechanism 5b capable of rotating the holding member 5a in the θ direction in the figure, and a moving mechanism 5c capable of moving the holding member 5a in the Y direction in the figure.

The spindle 6 cuts the package substrate P and singulates it into a plurality of semiconductor packages S (see FIG. 2(a) and FIG. 2(b)). In this embodiment, the cutting device 1 having a dual-spindle configuration including two spindles 6 is exemplified. The main shaft 6 can move in the X direction and the Z direction in the figure. On the main shaft 6, a rotating knife 6a for cutting the package substrate P is installed.

The main shaft 6 is provided with a cutting water nozzle that sprays cutting water to the rotating blade 6a rotating at a high speed, a cooling water nozzle that sprays cooling water, and a cleaning water nozzle that sprays cleaning water for cleaning cutting chips (all not shown) Show) etc.

After the cutting table 5 sucks the packaging substrate P, the position of the packaging substrate P is confirmed by the first position confirmation camera 5d. After that, the cutting table 5 moves so as to approach the main shaft 6 in the Y direction in the figure. After the cutting table 5 moves below the main shaft 6, the cutting table 5 and the main shaft 6 are moved relative to each other, thereby cutting the package substrate P. Every time the package substrate P is cut by the spindle 6, the position of the package substrate P and the like are confirmed by the second position confirmation camera 6b. Here, when confirming with the first position confirming camera 5d, for example, the position of the mark indicating the cutting position provided on the package substrate P can be confirmed. When confirming with the second position confirming camera 6b, for example, the position where the package substrate P is cut, the width of the cut, and the like can be confirmed. In addition, the confirmation using the confirmation camera may not use the first position confirmation camera 5d but only the second position confirmation camera 6b for confirmation.

After the cutting table 5 completes the cutting of the package substrate P, it maintains a state of adsorbing the plurality of singulated semiconductor packages S, and moves so as to move away from the main shaft 6 in the Y direction in the figure. At this time, the upper surface (ball surface/lead surface) of the semiconductor package S is cleaned and dried by the first cleaner 5e.

The transport unit 7 transports the semiconductor package S to the inspection table 11 of the inspection module B. The transport unit 7 sucks the semiconductor package S held by the cutting table 5 from above, and transports it to the inspection module B. At this time, the lower surface (mold surface) of the semiconductor package S is cleaned and dried by the second cleaner 7a.

The control unit 8 controls the operation of each part of the cutting module A. The control unit 8 controls the operations of the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle 6, the conveying unit 7, and the like. In addition, the operation of each part of the cutting module A can be arbitrarily changed (adjusted) using the control unit 8.

The inspection module B is a component that mainly performs inspection of the semiconductor package S. The inspection module B mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a configuration unit 14, an extraction unit 15, and a control unit 16.

The inspection station 11 holds the semiconductor package S for optical inspection. The inspection table 11 can move along the X direction in the figure. In addition, the inspection table 11 can be turned upside down. The inspection table 11 is provided with a holding member 100 that sucks and holds the semiconductor package S.

The first optical inspection camera 12 and the second optical inspection camera 13 optically inspect the surface (ball surface/wire surface and mold surface) of the semiconductor package S. The first optical inspection camera 12 and the second optical inspection camera 13 are arranged in the vicinity of the inspection table 11 facing upward. The first optical inspection camera 12 and the second optical inspection camera 13 are each provided with an illumination device (not shown) capable of irradiating light during inspection.

The first optical inspection camera 12 inspects the mold surface of the semiconductor package S transported to the inspection table 11 by the transport unit 7. After that, the transport unit 7 mounts the semiconductor package S on the holding member 100 of the inspection table 11. After the holding member 100 sucks and holds the semiconductor package S, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13, and the second optical inspection camera 13 inspects the solder ball surface and the lead surface of the semiconductor package S. For example, the first optical inspection camera 12 can inspect the notch of the semiconductor package S or the characters marked on the semiconductor package S, and the like. In addition, for example, the second optical inspection camera 13 can inspect the size and shape of the semiconductor package S, the positions of solder balls/wires, and the like.

The arranging unit 14 is used to arrange the semiconductor package S whose inspection has been completed. The arrangement part 14 can move along the Y direction in the figure. The inspection table 11 arranges the semiconductor package S that has been inspected by the first optical inspection camera 12 and the second optical inspection camera 13 in the arrangement portion 14.

The extraction part 15 transfers and stores the semiconductor package S arranged in the arrangement part 14 on the tray. Based on the inspection results obtained by the first optical inspection camera 12 and the second optical inspection camera 13, a good product and a defective product are distinguished, and the separated semiconductor package S is stored in the tray by the extraction part 15. At this time, the extraction unit 15 stores the good products in the semiconductor package S in the good product tray 15a and the defective products in the defective product tray 15b, respectively. When the tray is filled with semiconductor packages S, another empty tray is appropriately supplied.

The control unit 16 controls the operation of each unit of the inspection module B. The control unit 16 controls the operations of the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement unit 14, the extraction unit 15, and the like. In addition, the operation of each unit of the inspection module B can be arbitrarily changed (adjusted) using the control unit 16.

As described above, the cutting device 1 of the present embodiment can cut the package substrate P and singulate it into a plurality of semiconductor packages S.

Next, the structure of the holding member 100 provided in the inspection table 11 is demonstrated using FIG. 2 (a) and FIG. 2 (b). In addition, the directions indicated by arrow U, arrow D, arrow L, arrow R, arrow F, and arrow B shown in the figure are defined as the upper direction, the lower direction, the left direction, the right direction, the front direction, and the rear direction, respectively. To explain. In addition, for convenience of description, the holding member 100 shown in the figure is appropriately simplified for illustration. The actual structure of the holding member 100 (for example, the number and arrangement of the suction holes 111 and the suction surfaces 113 described later) is not limited to the illustration.

As described above, the holding member 100 holds the plurality of semiconductor packages S when the plurality of semiconductor packages S are optically inspected. The holding member 100 mainly includes a resin sheet 110 as a holding part and a resin reflection part 120 as a reflection part. In addition, in (a) of FIG. 2, in order to distinguish the resin sheet 110 and the resin reflection portion 120, the resin reflection portion 120 is indicated by diagonal lines.

The resin sheet 110 is a member formed in a rectangular plate shape. As the material of the resin sheet 110, for example, silicone-based resin, fluorine-based resin, or the like is used. In this embodiment, in order to diffuse the static electricity of the semiconductor package S to be held, the resin sheet 110 is made to contain carbon to improve conductivity (static diffusivity). Therefore, the resin sheet 110 is formed in a blackish color. The resin sheet 110 is mainly formed with suction holes 111 and grooves 112.

The adsorption hole 111 is a hole for adsorbing the semiconductor package S. The suction hole 111 is formed to penetrate the resin sheet 110 in the vertical direction (thickness direction). A plurality of suction holes 111 are formed at fixed intervals in the front and rear and left and right.

The groove 112 is a part formed so as to dent the surface (upper surface) of the resin sheet 110. The groove 112 is formed, for example, in a lattice shape that partitions adjacent suction holes 111 back and forth and left and right. As described above, by forming the groove 112, on the upper surface of the resin sheet 110, a rectangular (square) suction surface 113 is formed around each suction hole 111. The suction surface 113 is formed in substantially the same shape as the outer shape (rectangular) of the semiconductor package S to be sucked.

The resin reflection part 120 is provided so as to fill the groove 112 of the resin sheet 110. As the material of the resin reflection portion 120, for example, silicone-based resin, fluorine-based resin, or the like is used. In this embodiment, the resin reflection part 120 is made to include titanium oxide. Therefore, the resin reflection part 120 is formed in a whitish color. In addition, as a result, the resin reflection portion 120 has a higher reflectance (ratio of the reflected light beam to the incident light beam) than the resin sheet 110.

In addition, the material used for coloring the resin reflection part 120 is not limited to the titanium oxide, as long as the resin reflection part 120 can have a higher reflectance than the resin sheet 110. For example, metallic pigments (flake other than lead, alloys for plating, aluminum, tin, zinc, chromium, gold, silver, platinum, etc.), flake alumina, white pigments (titanium oxide, oxide Zinc, etc.), pearlescent pigments (mica, silica, glass, etc.), retroreflective materials (glass beads, etc.), and diluents and extenders (calcium titanate, aluminum hydroxide, barium sulfate, etc.), etc.

The resin reflection part 120 is provided so as to fill the entire groove 112 of the resin sheet 110. The resin reflection part 120 is formed to have a flat surface (that is, an upper side surface exposed from the groove 112 ). As described above, by forming the surface of the resin reflection portion 120 to be flat, it is possible to suppress the diffuse reflection of light.

Using FIG. 3, the flat surface of the resin reflection part 120 is demonstrated concretely. As shown in FIG. 3, when the holding member 100 is cut in parallel to the depth direction (up-down direction) of the groove 112 and cross-sectional observation is performed, the surface of the resin reflection portion 120 is formed such that the height difference L is a predetermined value or less. Here, the height difference L of the surface of the resin reflection portion 120 refers to the highest position and the lowest position of the surface of the resin reflection portion 120 in a direction perpendicular to the surface (adsorption surface 113) of the resin sheet 110 (the up and down direction in the illustration). Poor location. In addition, FIG. 3 shows an example in which the position of the upper surface of the resin sheet 110 coincides with the highest position of the resin reflection part 120.

Here, a specific measurement method will be described. First, two points are designated on the upper surface of the resin sheet 110, and a straight line a passing through the two points is drawn. Since the position of the upper surface of the resin sheet 110 coincides with the highest position of the resin reflection part 120, the straight line a represents the highest position of the resin reflection part 120. Next, a straight line b parallel to the straight line a is made, and the straight line b is moved to the lowest part of the surface of the resin reflection part 120. Based on the distance between the straight line a and the straight line b, the height difference L of the surface of the resin reflection portion 120 is measured. In addition, when the highest position of the resin reflection part 120 does not match the position of the upper surface of the resin sheet 110, the height difference L is measured based on the distance between the highest position and the lowest position (straight line b) of the resin reflection part 120. When measuring the surface of the resin reflection part 120, a digital microscope (model: VHX-5000) manufactured by KEYENCE Corporation was used.

In this embodiment, the surface of the resin reflection part 120 is formed so that the height difference L may be 50 micrometers or less. As described above, when the height difference L is 50 μm or less, the surface of the resin reflection portion 120 is flat. In addition, the smaller the height difference L of the surface of the resin reflection portion 120 is, the easier it is to suppress the diffuse reflection of light. Therefore, the surface of the resin reflection part 120 is more preferably formed so that the height difference L is 45 μm or less, 40 μm or less, 35 μm or less, 30 μm or less, 25 μm or less, or 20 μm or less.

The holding member 100 configured in the above-described manner is used to hold the semiconductor package S to be inspected. Specifically, as shown in FIGS. 2(a) and 2(b), in a state where the semiconductor packages S are placed one by one on each suction surface 113, air is sucked from below the holding member 100 through the suction holes 111 As a result, the semiconductor package S is sucked and held on the sucking surface 113. The semiconductor package S held by the holding member 100 is photographed by the second optical inspection camera 13 (refer to FIG. 1 ), and the size of the outer shape portion and the like are inspected.

Here, when the holding member 100 is viewed from above, a resin reflection portion 120 having a relatively high reflectance is arranged around the semiconductor package S. As described above, by arranging the resin reflection part 120, the contrast of the edge part of the semiconductor package S (the boundary part between the semiconductor package S and the resin reflection part 120) can be made clear when imaging with the second optical inspection camera 13. As a result, the second optical inspection camera 13 can easily and accurately detect the edge of the semiconductor package S. Along with this, the time for detecting the edge of the semiconductor package S can be shortened.

Furthermore, in this embodiment, the surface of the resin reflection part 120 is formed flat (the height difference L is 50 μm or less). By forming the surface of the resin reflection part 120 flat, the diffuse reflection of light can be suppressed. Thereby, when shooting with the second optical inspection camera 13, the contrast of the edge portion of the semiconductor package S can be made clear.

<Example 1> Next, a method of manufacturing the holding member 100 using the dispenser D will be described using FIGS. 4 and 5(a) to 5(c).

As shown in FIG. 4, the manufacturing method of the holding member 100 of Embodiment 1 mainly includes a plasma irradiation step S11, a resin filling step S12, and a resin curing step S13.

The plasma irradiation step S11 is a step of irradiating the resin sheet 110 with plasma. In the plasma irradiation step S11, first, the resin sheet 110 on which the suction holes 111 and grooves 112 are formed is prepared. Next, plasma is irradiated to the resin sheet 110 (especially the groove 112) (see FIG. 5(a)). By applying plasma (plasma treatment) to the resin sheet, especially the groove 112, the surface tension of the resin sheet 110 can be controlled (the wettability of the resin sheet 110 is improved), and the surface of the resin reflection portion 120 described later can be formed. flat. For plasma irradiation, for example, argon gas can be used.

After the plasma irradiation step S11, a resin filling step S12 is performed. The resin filling step S12 is a step of filling the groove 112 of the resin sheet 110 with the resin R used as the material of the resin reflection portion 120. In the resin filling step S12, the resin R is discharged by the dispenser D, and the resin R is supplied to the groove 112 of the resin sheet 110 (refer to FIG. 5(b)). After the dispenser D fills the groove 112 in the longitudinal direction with the resin R, it fills the groove 112 in the short direction with the resin R. At this time, a sufficient amount of resin R is supplied so that the groove 112 is filled with the resin R. The filling of the resin R is not limited to the above-mentioned order, and the resin R may be filled in the groove 112 in the longitudinal direction after the resin R is filled in the groove 112 in the short side direction.

For the dispenser D, for example, a jet dispenser is preferably used, and a piezoelectric jet dispenser can be used. Piezoelectric jet dispenser is a dispenser that uses piezoelectric elements. The piezoelectric element generates slight deformation when voltage is applied. The micro displacement generated by the piezoelectric element causes the connected rod to repeatedly move back and forth, opening and closing the valve at high speed. Therefore, an appropriate amount of resin R can be ejected. In addition, even in the case of using a high-viscosity resin R, if a piezoelectric jet dispenser is used, it is possible to reduce the occurrence of stringiness in the resin R after ejection.

After the resin filling step S12, the resin curing step S13 is performed. The resin hardening step S13 is a step of hardening the resin R. For example, the resin sheet 110 and the like are heated in an oven at 60°C for one hour. The heating method is not limited to heating using an oven, and for example, a hot plate may be used for heating. Thereby, the resin R filled in the groove 112 is hardened, and the resin reflection part 120 is formed (refer FIG.5(c)).

<Example 2> Next, a method of manufacturing another holding member 100 will be described using FIGS. 6 to 8(a) to 8(c).

As shown in FIG. 6, the manufacturing method of the holding member 100 of Embodiment 2 mainly includes a resin filling step S21, a resin defoaming step S22, a flat member arranging step S23, a resin hardening step S24, a flat member unloading step S25, and a resin removing step S26. And the secondary hardening step S27.

The resin filling step S21 is a step of filling the groove 112 of the resin sheet 110 with the resin R used as the material of the resin reflection portion 120. In the resin filling step S21, first, the resin sheet 110 in which the suction holes 111 and the grooves 112 are formed is prepared (see FIG. 7(a)). Next, the resin R is supplied to the upper surface (the surface on which the groove 112 is formed) of the resin sheet 110 (see FIG. 7(b)). At this time, a sufficient amount of resin R is supplied so that the groove 112 is filled with resin R. By supplying the resin R to the upper side of the resin sheet 110, the resin R not only penetrates into the inside of the groove 112 but also penetrates into the inside of the adsorption hole 111, and the resin R also adheres to the surface of the resin sheet 110.

After the resin filling step S21, the resin defoaming step S22 is performed. The resin defoaming step S22 is a step of defoaming the resin R. Specifically, the resin sheet 110 to which the resin R has been supplied is placed in a predetermined container, and the container is brought into a vacuum state using a vacuum pump. Thereby, the air (air bubbles) contained in the resin R is removed.

After the resin defoaming step S22, a flat member arranging step S23 is performed. The flat member arranging step S23 is a step of arranging the flat member F on the upper surface of the resin sheet 110. In the flat member arrangement step S23, first, the flat member F is placed on the resin R supplied to the upper surface of the resin sheet 110 (see FIG. 7(c)).

Here, as the flat member F, a member having a flat surface is used. In the present embodiment, as the flat member F, a film-like member (mirror film) having a mirror surface (a surface polished to reflect the object by light reflection) is used.

Next, the resin sheet 110 (resin R) is pressed against the flat member F (refer to FIG. 7(d)). For example, the flat member F is pressed against the resin sheet 110 by sequentially applying force from the center side to the outside of the flat member F using a tool such as a blade. Thereby, the air (air bubbles) between the flat member F and the resin R is removed. In addition, by pressing the flat member F against the resin R, the surface shape (mirror surface) of the flat member F is transferred to the surface of the resin R, and the surface of the resin R is made flat.

In addition, by pressing the resin sheet 110 against the flat member F, the resin R between the flat member F and the resin sheet 110 is extruded to the outside. However, the resin R between the flat member F and the resin sheet 110 is not completely discharged, and the thickness of the resin R accumulated on the upper side of the resin sheet 110 is reduced, and the resin R is on the upper side of the resin sheet 110 (adsorption surface 113). A thin film of resin R remains.

After the flat member arranging step S23, the resin curing step S24 is performed. The resin curing step S24 is a step of curing the resin R (primary curing). In the resin curing step S24, the resin sheet 110 on which the flat member F is arranged is turned upside down (see FIG. 8(a)). Next, using a predetermined molding die, force is applied (pressing) so as to sandwich the resin sheet 110 and the flat member F up and down. Next, the resin sheet 110 and the like are kept pressed and appropriately heated. For example, the resin sheet 110 and the like are heated in an oven at 60°C for one hour. As a result, the resin R is cured to some extent (primary curing). As described above, by pressing the resin sheet 110 and the like, the resin R of the resin sheet 110 is hardened while maintaining the pressure applied to the resin R of the resin sheet 110 by the flat member F, the surface deformation of the resin R caused by heating can be suppressed, and the surface of the resin R can be kept flat.

In addition, in the resin curing step S24, the resin sheet 110 is turned upside down and then cured once, but it is not necessary to turn the resin sheet 110 upside down.

After the resin hardening step S24, the flat member unloading step S25 is performed. The flat member unloading step S25 is a step of unloading the flat member F from the resin sheet 110. In the flat member unloading step S25, the resin sheet 110 is turned upside down again. Next, the flat member F is unloaded from the resin sheet 110 (in more detail, the resin R that has been cured once) (see FIG. 8(b)).

After the flat member unloading step S25, the resin removing step S26 is performed. The resin removal step S26 is a step of removing useless resin R from the resin sheet 110. In the resin removal step S26, the resin R other than the resin R filled in the groove 112 of the resin sheet 110 is removed (see FIG. 8(c)). Specifically, the thin film of resin R remaining on the upper side surface (adsorption surface 113) of the resin sheet 110 is removed. In addition, the resin R that has penetrated into the inside of the adsorption hole 111 of the resin sheet 110 is removed. In addition, if there is resin R adhering to other parts of the resin sheet 110 (for example, the outer surface, etc.), the resin R is also removed.

In addition, the method of removing resin R is not specifically limited. The resin R can be removed manually by the operator, or can be removed using an appropriate tool or device. For example, a grinding device such as a grinder can be used to remove the resin R, or a laser or the like can be used to remove the resin R.

After the resin removal step S26, a secondary hardening step S27 is performed. The secondary hardening step S27 is a step of further hardening (secondary hardening) the resin R filled in the groove 112 of the resin sheet 110. In the secondary curing step S27, the resin sheet 110 and the like are appropriately heated. For example, the resin sheet 110, etc., are heated in an oven at 60°C for four hours, or heated in an oven at 150°C for one hour. Thereby, the resin R filled in the groove 112 is further cured (secondary curing), and the resin reflection portion 120 is formed.

As described above, the holding member 100 of the present embodiment holds a plurality of semiconductor packages S (holding objects) for optical inspection, and includes: a resin sheet 110 (holding portion) provided with a plurality of semiconductor packages S for sucking and holding the semiconductor packages S The suction hole 111 and the groove 112 arranged between the plurality of suction holes 111; and the resin reflection part 120 (reflecting part), which is provided in the groove 112, has a higher reflectance than the resin sheet 110. The resin reflection part 120 has a flat surface.

By configuring in this manner, the edge detection of the semiconductor package S sucked and held by each of the plurality of suction holes 111 can be performed with high accuracy. That is, by providing the resin reflection portion 120 with a relatively high reflectance, the contrast between the resin reflection portion 120 and the boundary portion of the semiconductor package S sucked by the suction hole 111 can be made clear. In addition, since the surface of the resin reflection portion 120 is formed flat, the diffuse reflection of light can be suppressed, and the contrast can be made clearer.

In addition, when the surface of the resin reflection portion 120 is viewed in a cross section cut in parallel with the depth direction of the groove 112, the height difference is 50 μm or less.

By configuring in this way, the edge detection of the semiconductor package S can be performed with higher accuracy. That is, by suppressing the height difference of the surface of the resin reflection part 120 to a predetermined value or less, the diffuse reflection of light can be suppressed effectively.

In addition, the inspection module B (inspection mechanism) of the present embodiment inspects the semiconductor package S held by the holding member 100.

By configuring in this manner, it is possible to perform edge detection of the semiconductor package S with high accuracy with a simple configuration.

In addition, the cutting device 1 of the present embodiment includes: a cutting module A (cutting mechanism), cutting the package substrate P (cutting object) to obtain a plurality of the semiconductor packages S; and an inspection module B. Using the inspection module B, the semiconductor package S obtained by the cutting module A is inspected.

By configuring in this manner, it is possible to perform edge detection of the semiconductor package S with high accuracy with a simple configuration.

In addition, the manufacturing method of the semiconductor package S of the present embodiment uses the cutting device 1 to manufacture the semiconductor package S.

By configuring in this manner, it is possible to perform edge detection of the semiconductor package S with high accuracy with a simple configuration. Furthermore, the productivity of the semiconductor package S can be improved.

In addition, in the method of manufacturing the holding member 100 of this embodiment, the holding member 100 holds a plurality of semiconductor packages S (holding objects) for optical inspection, and the method of manufacturing the holding member 100 includes: a resin filling step S12 (resin filling step S21 ), for the resin sheet 110 (holding portion) provided with grooves 112, the grooves 112 are filled with resin R, and the grooves 112 are arranged between the plurality of suction holes 111 for sucking and holding the semiconductor package S; and In the resin hardening step S13 (resin hardening step S24), the resin R is hardened.

By configuring in this way, the holding member 100 can be easily manufactured. In addition, by using the holding member 100 obtained by the method of manufacturing the holding member 100 of the present embodiment, it is possible to perform edge detection of the semiconductor package S with high accuracy with a simple configuration.

In addition, in the resin filling step S12, a dispenser D is used to eject the resin R, and the resin R is filled into the groove 112.

By configuring in this way, the holding member 100 can be easily manufactured. That is, by filling the groove 112 with the resin R by the dispenser D with a relatively high ejection accuracy of the resin R, it is possible to easily and accurately fill the groove 112 with the resin R.

In addition, the manufacturing method of the holding member 100 of the present embodiment further includes a plasma irradiation step S11 in which plasma irradiation is performed on the resin sheet 110 before the resin filling step S12.

By configuring in this manner, the surface of the resin reflection portion 120 can be easily formed flat. That is, by improving the wettability of the resin sheet 110 (especially the groove 112), the surface of the resin R filled in the groove 112 can be flattened, and the surface of the resin reflection portion 120 formed by curing the resin R can be flattened.

In addition, the manufacturing method of the holding member 100 of the present embodiment further includes a resin defoaming step S22. After the resin filling step S21, the resin R is defoamed.

By configuring in this way, the surface of the resin R (resin reflection portion 120) can be easily formed more flat. That is, by removing the air (air bubbles) contained in the resin R, it is possible to suppress the unevenness or deformation of the surface of the resin R due to the air bubbles.

In addition, the manufacturing method of the holding member 100 of the present embodiment further includes a flat member arranging step S23. After the resin filling step S21, a flat member F is arranged on the surface of the resin sheet 110.

By configuring in this way, the surface of the resin R (resin reflection portion 120) can be easily formed more flat. That is, by arranging the flat member F on the surface of the resin sheet 110, the surface of the resin R filled in the groove 112 can be formed flat.

In addition, in the method of manufacturing the holding member 100 of this embodiment, in the resin curing step S24, the resin R filled in the groove 112 is pressed by the flat member F. R hardened.

By configuring in this way, the surface of the resin R (resin reflection portion 120) can be easily formed more flat. That is, it is possible to suppress the deformation of the surface of the resin R accompanying hardening.

In addition, in the resin filling step 21, the resin R is also filled into the plurality of adsorption holes 111, and the manufacturing method of the holding member 100 of this embodiment further includes: a flat member unloading step S25, in the After the resin hardening step S24, the flat member F is unloaded from the surface of the resin sheet 110; and the resin removing step S26, after the flat member unloading step S25, the resin attached to the resin sheet 110 is removed The resin R other than the groove 112.

By configuring in this manner, it is possible to obtain the holding member 100 from which the useless resin R is removed. That is, the resin R other than the resin R (resin reflecting portion 120) arranged in the groove 112 is useless for improving the accuracy of edge detection of the semiconductor package S. By removing the resin R, it is possible to suppress the remaining useless resin R. This leads to problems (such as hindering the adsorption of the semiconductor package S, etc.).

In addition, the manufacturing method of the holding member 100 of the present embodiment further includes a secondary hardening step S27, after the resin hardening step S24, the resin R is further hardened.

By configuring in this manner, deformation of the holding member 100 can be suppressed. That is, by hardening the resin R in multiple times, it is possible to suppress deformation (warpage, etc.) of the holding member 100.

In addition, in the resin filling step 21, the resin R is also filled into the plurality of the adsorption holes 111, and the manufacturing method of the holding member 100 of this embodiment further includes: a flat member unloading step S25, in which the resin R After the curing step S24, the flat member F is unloaded from the surface of the resin sheet 110; the resin removal step S26, after the flat member unloading step S25, the groove 112 attached to the resin sheet 110 is removed Other than the resin R; and the secondary hardening step S27, after the resin removing step S26, the resin R is further hardened.

By configuring in this manner, the useless resin R can be easily removed. That is, the resin R can be removed in the middle of curing the resin R (after the resin curing step S24 and before the secondary curing step S27), so the resin R can be easily removed.

In addition, the semiconductor package S of this embodiment is an embodiment of the holding object of the present invention. Moreover, the resin sheet 110 of this embodiment is an embodiment of the holding part of this invention. In addition, the resin reflection part 120 of this embodiment is an embodiment of the reflection part of this invention. In addition, the cutting module A of this embodiment is an embodiment of the cutting mechanism of the present invention. In addition, the inspection module B of this embodiment is an embodiment of the inspection mechanism of the present invention. In addition, the package substrate P of this embodiment is an embodiment of the cutting object of the present invention.

As mentioned above, although an embodiment of this invention was described, this invention is not limited to the said embodiment, It can change suitably within the range of the technical idea of the invention described in the scope of the claim.

For example, the configuration of the cutting device 1 illustrated in this embodiment is an example, and the specific configuration can be changed as appropriate.

For example, in this embodiment, the cutting module A and the inspection module B each include a control section (control section 8 and control section 16), but the present invention is not limited to this, and each control section may be integrated into one control section. , Or divided into three or more control parts. In addition, the cutting device 1 of the present embodiment has a dual cutting table configuration including two cutting tables 5, but the present invention is not limited to this, and only one cutting table 5 may be included. In addition, the cutting device 1 of the present embodiment has a dual-spindle configuration including two spindles 6, but the present invention is not limited to this, and may include only one spindle 6.

In addition, in the present embodiment, the holding member 100 is provided on the inspection table 11, but the present invention is not limited to this. The holding member 100 may be provided on the transport section 7, or at the inspection table 11 and the transport section 7. The holding member 100 is provided on both sides. The cutting device 1 may include only the first optical inspection camera 12 corresponding to the conveying unit 7 on which the holding member 100 is provided, or the second optical inspection camera 13 corresponding to the inspection table 11 on which the holding member 100 is provided. constitute.

In addition, in the present embodiment, the resin reflection portion 120 has a higher reflectance than the resin sheet 110, but it does not necessarily have to have a higher reflectance for all wavelengths of light. That is, the holding member 100 is used for the optical inspection performed by the camera (the second optical inspection camera 13 in this embodiment), so at least the light of the wavelength corresponding to the characteristics of the camera (the available wavelength information) It is only necessary that the resin reflection portion 120 has a higher reflectance than the resin sheet 110.

In addition, the reflectance is the reflectance of the light source used for inspection. As the light source, a single light source can be used, multiple light sources with the same wavelength range of the emitted light (illumination light) can be used, or the emitted light (illumination light) can be used. Multiple light sources with different wavelength regions. In addition, the reflectance is based on the detection by the camera, but the detection by the camera can be the detection in the full wavelength region of a single or multiple light sources, the detection in the wavelength region of a part of the multiple light sources, or It is the detection of a part of the wavelength region of a single light source.

In addition, the manufacturing method of the holding member 100 of this embodiment is an example, and the order of steps and specific content can be changed arbitrarily.

For example, in this embodiment, it is illustrated that the flat member unloading step S25 and the resin removing step S26 are performed before the secondary hardening step S27, and the flat member unloading step S25 and the resin removing step S26 may be performed after the secondary hardening step S27. Specifically, it can be set as the order of resin hardening step S24, flat member unloading step S25, resin removing step S26, secondary hardening step S27, resin hardening step S24, flat member unloading step S25, secondary hardening step S27, resin removal The order of step S26, or the order of resin hardening step S24, secondary hardening step S27, flat member unloading step S25, and resin removing step S26.

In addition, the resin defoaming step S22, the flat member arranging step S23, the flat member unloading step S25, the resin removing step S26, and the second embodiment can also be performed in the same manner as in the second embodiment (refer to FIG. 6) in the first embodiment (refer to FIG. 4). Secondary hardening step S27. In this case, the order and specific content of the steps can also be changed arbitrarily.

In addition, in the present embodiment, in the case of manufacturing the holding member 100, the resin R is cured twice (resin curing step S24 and secondary curing step S27), but the present invention is not limited to this. For example, the resin R may be finally hardened only through the resin hardening step S24 (that is, only one step). Thereby, the manufacturing process of the holding member 100 can be simplified. In this case, it can be heated in an oven at 60° C. for five hours, etc., and the heating temperature and heating time can be appropriately adjusted so that the resin R can be fully cured in the resin curing step S24. In addition, in this case, the secondary hardening step S27 is not required, so by performing the flat member unloading step S25 and the resin removing step S26 after the resin hardening step S24, the manufacturing of the holding member 100 is ended.

In addition, in the present embodiment, as the flat member F pressed against the resin R, a mirror surface sheet is used, but the present invention is not limited to this. That is, as long as the resin reflection portion 120 having a flat surface can be obtained after the resin R is cured (at the time when the manufacturing of the holding member 100 is finished), the flat member F is not limited. For example, the flat member F may not have a mirror surface. In addition, the flat member F is not limited to a sheet shape.

1: Cut off device 3: Substrate supply section 4: Positioning part 4a: Track part 5: Cut off the table 5a: Holding member 5b: Rotating mechanism 5c: mobile mechanism 5d: Confirm the camera in the first position 5e: first cleaner 6: Spindle 6a: Rotary knife 6b: The second position to confirm the camera 7: Transport Department 7a: Second cleaner 8: Control Department 11: Inspection table 12: The first optical inspection camera 13: The second optical inspection camera 14: Configuration Department 15: Extraction section 15a: Good product tray 15b: Defective product tray 16: Control Department 100: holding member 110: Resin sheet 111: adsorption hole 112: Slot 113: Adsorption surface 120: Resin reflector A: Cut off the module B: Check the module D: Allocator F: Flat member M: Material box P: Package substrate R: Resin S: Semiconductor package

Fig. 1 is a schematic plan view showing the overall configuration of a cutting device according to an embodiment of the present invention. Fig. 2(a) is a schematic plan view of the holding member. Fig. 2(b) is an X-X cross-sectional view. 3 is a schematic cross-sectional view showing the shape of the surface of the resin reflection part. 4 is a diagram showing a method of manufacturing the holding member of Example 1. FIG. 5(a) to 5(c) are schematic cross-sectional views sequentially showing how the holding member was manufactured in Example 1. FIG. FIG. 6 is a diagram showing a method of manufacturing a holding member of Example 2. FIG. 7(a) to 7(d) are schematic cross-sectional views sequentially showing how the holding member is manufactured in Example 2. FIG. 8(a) to 8(c) are schematic cross-sectional views showing continuation of FIGS. 7(a) to 7(d).

100: holding member

110: Resin sheet

111: adsorption hole

112: Slot

113: Adsorption surface

120: Resin reflector

Claims (14)

A holding member, which holds a plurality of holding objects for optical inspection, includes: The holding portion is provided with a plurality of adsorption holes for adsorbing and holding the object to be held, and a groove arranged between the plurality of adsorption holes; and The reflecting part is arranged in the groove and has a higher reflectivity than the holding part, Wherein the reflecting part has a flat surface. The holding member according to claim 1, wherein the surface has a height difference of 50 μm or less when viewed in a cross section cut in parallel with the depth direction of the groove. An inspection mechanism that inspects the holding object held by the holding member according to claim 1 or 2. A cutting device includes: The inspection agency as described in claim 3; and The cutting mechanism cuts the cut object to obtain a plurality of the holding objects, The inspection mechanism is used to inspect the holding object obtained by the cutting mechanism. A method for manufacturing a holding object, which uses the cutting device according to claim 4 to produce the holding object. A manufacturing method of a holding member, wherein the holding member holds a plurality of holding objects for optical inspection, and the manufacturing method of the holding member includes: In the resin filling step, for the holding portion provided with the groove, the groove is filled with resin, and the groove is arranged between a plurality of suction holes for sucking and holding the holding object; and The resin hardening step hardens the resin. The method of manufacturing a holding member according to claim 6, wherein the resin filling step uses a dispenser to eject the resin and fill the groove with the resin. The manufacturing method of the holding member according to claim 7, further comprising: In the plasma irradiation step, plasma irradiation is performed on the holding portion before the resin filling step. The manufacturing method of the holding member according to claim 6, further comprising: In the resin defoaming step, after the resin filling step, the resin is defoamed. The manufacturing method of the holding member according to claim 6, further comprising: A flat member arranging step includes arranging a flat member on the surface of the holding portion after the resin filling step. The method of manufacturing a holding member according to claim 10, wherein in the resin hardening step, the resin is hardened in a state where pressure is applied to the resin filled in the groove by the flat member. The method of manufacturing a holding member according to claim 10 or 11, wherein in the resin filling step, the resin is also filled into the plurality of adsorption holes, and The manufacturing method of the holding member further includes: A flat member unloading step, after the resin hardening step, unloading the flat member from the surface of the holding portion; and In the resin removal step, after the flat member unloading step, the resin attached to the groove of the holding portion is removed. The manufacturing method of the holding member according to any one of claim 6 to claim 11, further comprising: In the secondary hardening step, after the resin hardening step, the resin is further hardened. The method of manufacturing a holding member according to claim 10 or 11, wherein in the resin filling step, the resin is also filled into the plurality of adsorption holes, and The manufacturing method of the holding member further includes: A flat member unloading step, after the resin hardening step, unload the flat member from the surface of the holding portion; A resin removing step, after the flat member unloading step, removing the resin attached to the groove of the holding portion; and In the secondary hardening step, after the resin removing step, the resin is further hardened.

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