TW202112480A - Pcplate assembly, apparatus for producing glass laminate including the same, and method of producing glass laminate - Google Patents
Pcplate assembly, apparatus for producing glass laminate including the same, and method of producing glass laminate Download PDFInfo
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- TW202112480A TW202112480A TW109116883A TW109116883A TW202112480A TW 202112480 A TW202112480 A TW 202112480A TW 109116883 A TW109116883 A TW 109116883A TW 109116883 A TW109116883 A TW 109116883A TW 202112480 A TW202112480 A TW 202112480A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0461—Welding tables
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laminated Bodies (AREA)
Abstract
Description
相關申請案之交叉引用Cross-reference of related applications
本申請案要求2019年5月30月在韓國智慧財產局提交的韓國專利申請案第10-2019-0064073號的權益,其揭示內容全部以引用方式併入本文。This application claims the rights and interests of the Korean Patent Application No. 10-2019-0064073 filed with the Korean Intellectual Property Office on May 30, 2019, the disclosure of which is fully incorporated herein by reference.
一或多個實施例係關於玻璃板組件、包含該玻璃板組件的用於生產玻璃疊層板的裝置、及生產玻璃疊層板的方法,並且更具體而言,係關於在玻璃疊層板的雷射切割中使用的玻璃板組件、包含該玻璃板組件的用於生產玻璃疊層板的裝置、及使用該裝置來生產玻璃疊層板的方法。One or more embodiments relate to a glass plate assembly, an apparatus for producing a glass laminate including the glass plate assembly, and a method for producing a glass laminate, and more specifically, to a glass laminate The glass plate assembly used in laser cutting of, a device for producing a glass laminate including the glass plate assembly, and a method for producing a glass laminate using the device.
玻璃疊層板包含基底薄板及黏附至基底薄板的玻璃層,並且玻璃疊層板用於各種領域諸如汽車零件、電子裝置零件、建築結構零件、及其類似領域。總體上,玻璃疊層板具有相對較小厚度,並且基底薄板及玻璃層表現出彼此不同的物理特性。因此,可能很難藉由使用習知機械加工方法來切割玻璃疊層板而不在玻璃層中出現裂縫。為了切割玻璃疊層板,已經提出連續地執行雷射光束照射及吹洗空氣供應的方法,但是玻璃疊層板可能由於其較小厚度而移動或振動。在此情況下,出現玻璃疊層板的切割不均勻性或切割缺陷,諸如玻璃疊層板的切割位置偏離目標位置、不規則切割截面形狀、或在玻璃層中出現裂縫。The glass laminate includes a base sheet and a glass layer adhered to the base sheet, and the glass laminate is used in various fields such as automobile parts, electronic device parts, building structure parts, and the like. In general, the glass laminate has a relatively small thickness, and the base sheet and the glass layer exhibit different physical properties from each other. Therefore, it may be difficult to cut the glass laminate without cracks in the glass layer by using conventional machining methods. In order to cut the glass laminate, a method of continuously performing laser beam irradiation and blowing air supply has been proposed, but the glass laminate may move or vibrate due to its small thickness. In this case, cutting unevenness or cutting defects of the glass laminated plate occur, such as the cutting position of the glass laminated plate deviating from the target position, irregular cut cross-sectional shape, or the occurrence of cracks in the glass layer.
一或多個實施例包括在玻璃疊層板的雷射切割中使用的玻璃板組件、及包含該玻璃板組件的用於生產玻璃疊層板的裝置。One or more embodiments include a glass plate assembly used in laser cutting of a glass laminate, and an apparatus for producing a glass laminate including the glass plate assembly.
一或多個實施例包括使用包含玻璃板組件的用於生產玻璃疊層板的裝置來生產玻璃疊層板的方法,由此可增強切割均勻性並且可防止出現切割缺陷。One or more embodiments include a method of producing a glass laminate using an apparatus for producing a glass laminate including a glass plate assembly, whereby cutting uniformity can be enhanced and the occurrence of cutting defects can be prevented.
額外態樣部分地在以下說明書中闡明並且部分地由說明書顯而易知,或可藉由實踐所提供的實施例而習得。The additional aspects are partly clarified in the following description and partly apparent from the description, or can be learned by practicing the provided examples.
根據一或多個實施例,玻璃板組件在用於生產玻璃疊層板的裝置中使用。玻璃板組件包含:底板,該底板包括至少一個狹槽,雷射光束被組配來穿過該至少一個狹槽;可撓性磁鐵,該可撓性磁鐵安置在底板的第一表面上並且包括與至少一個狹槽連通的至少一個開口;及引導部分,該引導部分沿著可撓性磁鐵的一邊緣來安置在底板的第一表面上並且在與底板的第一表面的邊緣平行的第一方向上延伸。According to one or more embodiments, the glass plate assembly is used in an apparatus for producing glass laminates. The glass plate assembly includes: a bottom plate, the bottom plate includes at least one slot, the laser beam is assembled to pass through the at least one slot; a flexible magnet, the flexible magnet is arranged on the first surface of the bottom plate and includes At least one opening communicating with the at least one slot; and a guide portion, the guide portion being arranged on the first surface of the bottom plate along an edge of the flexible magnet and on the first surface parallel to the edge of the first surface of the bottom plate Extend in the direction.
在一些實施例中,玻璃疊層板可包括金屬薄板及附接至金屬薄板的玻璃層,金屬薄板可包括鋼、不銹鋼、鎳、鈷、或包含此等金屬中之至少一者的金屬合金,並且金屬薄板可被組配來藉由磁力而固定在可撓性磁鐵上。In some embodiments, the glass laminate may include a metal sheet and a glass layer attached to the metal sheet. The metal sheet may include steel, stainless steel, nickel, cobalt, or a metal alloy containing at least one of these metals, And the thin metal plate can be assembled to be fixed on the flexible magnet by magnetic force.
在一些實施例中,可撓性磁鐵可具有約100高斯至約3,000高斯的磁通量密度。In some embodiments, the flexible magnet may have a magnetic flux density of about 100 Gauss to about 3,000 Gauss.
在一些實施例中,至少一個狹槽可包括在第一方向上延伸並且彼此平行地間隔開的複數個第一狹槽。In some embodiments, the at least one slot may include a plurality of first slots extending in the first direction and spaced parallel to each other.
在一些實施例中,第一狹槽可在相等距離下彼此間隔開。In some embodiments, the first slots may be spaced apart from each other at equal distances.
在一些實施例中,玻璃板組件可包括:外部周向部分,引導部分安置在該外部周向部分上;及中心部分,在平面圖中檢視時,該中心部分藉由外部周向部分包圍並且與外部周向部分間隔開,並且至少一個狹槽可在中心部分與外部周向部分之間界定。In some embodiments, the glass plate assembly may include: an outer circumferential portion on which the guide portion is disposed; and a central portion, when viewed in a plan view, the central portion is surrounded by the outer circumferential portion and is in contact with The outer circumferential portions are spaced apart, and at least one slot may be defined between the central portion and the outer circumferential portion.
在一些實施例中,至少一個狹槽可包括在第一方向上平行延伸的一對第一狹槽,及在第二方向上平行延伸並且與該對第一狹槽相交的一對第二狹槽,第二方向垂直於第一方向並且平行於底板的第一表面,並且在平面圖中檢視時,中心部分可藉由該對第一狹槽及該對第二狹槽包圍。In some embodiments, the at least one slot may include a pair of first slots extending in parallel in the first direction, and a pair of second slots extending in parallel in the second direction and intersecting the pair of first slots. For the groove, the second direction is perpendicular to the first direction and parallel to the first surface of the bottom plate, and when viewed in a plan view, the central part can be surrounded by the pair of first slots and the pair of second slots.
在一些實施例中,相對於底板的第一表面,在垂直於第一表面的第三方向上,引導部分的上部表面可處於比可撓性磁鐵的上部表面更高的水準處。In some embodiments, with respect to the first surface of the bottom plate, in a third direction perpendicular to the first surface, the upper surface of the guide portion may be at a higher level than the upper surface of the flexible magnet.
在一些實施例中,至少一個狹槽可藉由從底板的第一表面延伸至第二表面的相反側壁來界定,第二表面與第一表面相反,並且處於與第一表面相同水準下的至少一個狹槽的第一寬度可小於處於與第二表面相同水準下的至少一個狹槽的第二寬度。In some embodiments, the at least one slot may be defined by opposite side walls extending from the first surface to the second surface of the bottom plate. The second surface is opposite to the first surface and is at least at the same level as the first surface. The first width of one slot may be smaller than the second width of at least one slot at the same level as the second surface.
在一些實施例中,底板的相反側壁中的每一個可從底板的第一表面至第二表面為傾斜的。In some embodiments, each of the opposite side walls of the bottom plate may be inclined from the first surface to the second surface of the bottom plate.
在一些實施例中,底板的相反側壁中的每一個可包括底板的第一與第二表面之間的梯級部分。In some embodiments, each of the opposite side walls of the bottom plate may include a stepped portion between the first and second surfaces of the bottom plate.
根據一或多個實施例,用於切割玻璃疊層板的用於生產玻璃疊層板的裝置包含:裝載台,該裝載台包括複數個吸氣孔;玻璃板組件,該玻璃板組件安裝在裝載台上並且玻璃疊層板被組配來藉由磁力而固定在該玻璃板組件上;及雷射光束照射單元,該雷射光束照射單元被組配來用雷射光束照射玻璃疊層板。玻璃板組件包含:底板,該底板包括至少一個狹槽,雷射光束被組配來穿過該至少一個狹槽;可撓性磁鐵,該可撓性磁鐵安置在底板的第一表面上並且包括與至少一個狹槽連通的至少一個開口;及引導部分,該引導部分沿著可撓性磁鐵的一邊緣來安置在底板的第一表面上並且在與底板的第一表面的邊緣平行的第一方向上延伸。According to one or more embodiments, the apparatus for producing glass laminates for cutting glass laminates includes: a loading station, the loading station includes a plurality of suction holes; a glass plate assembly, the glass plate assembly is installed on On the loading table and the glass laminate is assembled to be fixed on the glass plate assembly by magnetic force; and a laser beam irradiation unit, which is assembled to irradiate the glass laminate with the laser beam . The glass plate assembly includes: a bottom plate, the bottom plate includes at least one slot, the laser beam is assembled to pass through the at least one slot; a flexible magnet, the flexible magnet is arranged on the first surface of the bottom plate and includes At least one opening communicating with the at least one slot; and a guide portion, the guide portion being arranged on the first surface of the bottom plate along an edge of the flexible magnet and on the first surface parallel to the edge of the first surface of the bottom plate Extend in the direction.
在一些實施例中,至少一個狹槽可與複數個吸氣孔垂直地重疊,並且雷射光束可被組配來在至少一個狹槽延伸的方向上照射至玻璃疊層板上。In some embodiments, the at least one slot may vertically overlap the plurality of suction holes, and the laser beam may be configured to irradiate the glass laminate in the direction in which the at least one slot extends.
在一些實施例中,雷射光束照射單元可包括:光纖雷射照射部分,該光纖雷射照射部分被組配來用雷射光束照射玻璃疊層板;及吹洗空氣供應部分,該吹洗空氣供應部分被組配來將吹洗空氣供應至雷射光束所照射的區域,以便將在雷射光束切割玻璃疊層板時所產生的玻璃疊層板的碎片或毛刺經由至少一個狹槽來傳遞至複數個吸氣孔中。In some embodiments, the laser beam irradiation unit may include: an optical fiber laser irradiation part configured to irradiate the glass laminate with the laser beam; and a purge air supply part, the purge air supply part The air supply part is configured to supply the purging air to the area irradiated by the laser beam, so that the fragments or burrs of the glass laminate produced when the laser beam cuts the glass laminate are passed through at least one slot Pass to a plurality of suction holes.
在一些實施例中,玻璃疊層板可包括金屬薄板及附接至金屬薄板的玻璃層,金屬薄板可包括鋼、不銹鋼、鎳、鈷、或包含此等金屬中之至少一者的金屬合金,並且金屬薄板可被組配來藉由磁力而固定在玻璃板組件的可撓性磁鐵上。In some embodiments, the glass laminate may include a metal sheet and a glass layer attached to the metal sheet. The metal sheet may include steel, stainless steel, nickel, cobalt, or a metal alloy containing at least one of these metals, And the thin metal plate can be assembled to be fixed on the flexible magnet of the glass plate assembly by magnetic force.
在一些實施例中,玻璃板組件的引導部分可與玻璃疊層板的邊緣接觸,並且玻璃疊層板可被組配來安置在玻璃板組件上。In some embodiments, the guide portion of the glass plate assembly may be in contact with the edge of the glass laminate plate, and the glass laminate plate may be assembled to be placed on the glass plate assembly.
根據一或多個實施例,使用玻璃板組件來生產玻璃疊層板的方法包括:將玻璃板組件安置在包括複數個吸氣孔的裝載台上,其中玻璃板組件包含含有至少一個狹槽的底板,及可撓性磁鐵,該可撓性磁鐵安置在底板的第一表面上並且包括與至少一個狹槽連通的至少一個開口;將玻璃疊層板安置在玻璃板組件上;及在至少一個狹槽延伸的方向上將雷射光束發射至玻璃疊層板上,以便切割玻璃疊層板的部分,該部分與至少一個狹槽重疊。According to one or more embodiments, a method of using a glass plate assembly to produce a glass laminated plate includes: placing the glass plate assembly on a loading platform including a plurality of suction holes, wherein the glass plate assembly includes at least one slot A bottom plate, and a flexible magnet, the flexible magnet is disposed on the first surface of the bottom plate and includes at least one opening communicating with the at least one slot; the glass laminate is disposed on the glass plate assembly; and the at least one The laser beam is emitted to the glass laminate in the direction in which the slot extends, so as to cut a portion of the glass laminate that overlaps with at least one slot.
在一些實施例中,玻璃板組件可進一步包括沿著可撓性磁鐵的一邊緣來安置在底板的第一表面上的引導部分,並且玻璃疊層板的安置可包括將玻璃疊層板安置在玻璃板組件上以使得玻璃疊層板的邊緣與引導部分接觸並且玻璃疊層板藉由磁力而固定在可撓性磁鐵上。In some embodiments, the glass plate assembly may further include a guide portion disposed on the first surface of the bottom plate along an edge of the flexible magnet, and the positioning of the glass laminate may include positioning the glass laminate on On the glass plate assembly so that the edge of the glass laminate is in contact with the guide part and the glass laminate is fixed on the flexible magnet by magnetic force.
在一些實施例中,方法可進一步包括,在發射雷射光束之後,將吹洗空氣供應至雷射光束所照射的玻璃疊層板的部分,以便將雷射光束切割的玻璃疊層板的碎片或毛刺經由至少一個狹槽來傳遞至複數個吸氣孔中。In some embodiments, the method may further include, after emitting the laser beam, supplying purge air to the part of the glass laminate irradiated by the laser beam, so as to cut the fragments of the glass laminate by the laser beam Or the burr is transferred to a plurality of suction holes through at least one slot.
在一些實施例中,在吹洗空氣的供應中,玻璃板組件及玻璃疊層板可不由於吹洗空氣而導致移動或振動。In some embodiments, in the supply of purge air, the glass plate assembly and the glass laminate may not move or vibrate due to the purge air.
根據生產根據實施例的玻璃疊層板的方法、藉由使用根據實施例的用於生產玻璃疊層板的裝置,可在玻璃疊層板切割過程中增強切割均勻性並且可防止切割缺陷的發生。例如,玻璃疊層板可藉由可撓性磁鐵的磁力而穩固地及臨時地固定至玻璃板組件上,並且因此玻璃疊層板不可移動或振動,即使在雷射照射之後,在相對高壓力下注射吹洗空氣時亦如此。因此,可防止玻璃疊層板的切割位置偏離、切割缺陷、或類似問題。另外,玻璃疊層板可藉由連續地執行雷射照射操作及吹洗空氣供應操作來切割,並且因此使用根據實施例的生產玻璃疊層板的方法來生產的玻璃疊層板可具有極好的切割橫截面品質。According to the method of producing the glass laminate according to the embodiment, by using the apparatus for producing the glass laminate according to the embodiment, the cutting uniformity can be enhanced during the cutting of the glass laminate and the occurrence of cutting defects can be prevented . For example, the glass laminate can be firmly and temporarily fixed to the glass plate assembly by the magnetic force of the flexible magnet, and therefore the glass laminate cannot move or vibrate, even after laser irradiation, under relatively high pressure This is also true when the air is purged under the injection. Therefore, it is possible to prevent deviation of the cutting position of the glass laminate, cutting defects, or the like. In addition, the glass laminate can be cut by continuously performing the laser irradiation operation and the blowing air supply operation, and therefore the glass laminate produced using the method for producing the glass laminate according to the embodiment may have excellent Cutting cross-section quality.
現將詳細參考實施例,該等實施例的實例示出於附圖中,其中相同參考數字在全篇中指代相同元件。在此方面,本發明實施例可具有不同形式並且不應被視為限於本文闡明的描述。因此,實施例在下文僅僅藉由參考附圖來描述,以便解釋本說明書的態樣。在要素清單之前的表述諸如「……中之至少一者」限定整個要素清單並且不限定清單的個別要素。Reference will now be made in detail to the embodiments. Examples of the embodiments are shown in the drawings, in which the same reference numbers refer to the same elements throughout the text. In this regard, the embodiments of the present invention may have different forms and should not be considered as limited to the description set forth herein. Therefore, the embodiments are described below only by referring to the accompanying drawings in order to explain the aspect of the specification. Expressions before the element list such as "at least one of..." limit the entire element list and do not limit the individual elements of the list.
在下文,本揭示案的示例性實施例參考附圖來詳細描述。然而,本發明的實施例可以各種其他形式來限定並且不應被視為限於本文闡明的實施例。提供本發明的實施例以便向普通熟習此項技術者更完全地解釋本揭示案。相同參考數字指示相同元件。此外,在附圖中的各種元件及區域加以示意性地示出。因此,本揭示案不限於在附圖中示出的相對大小或間隔。Hereinafter, exemplary embodiments of the present disclosure are described in detail with reference to the accompanying drawings. However, the embodiments of the present invention may be defined in various other forms and should not be regarded as limited to the embodiments set forth herein. The embodiments of the present invention are provided in order to more fully explain the present disclosure to those skilled in the art. The same reference numbers indicate the same elements. In addition, various elements and regions in the drawings are schematically shown. Therefore, the present disclosure is not limited to the relative sizes or intervals shown in the drawings.
第1圖係示出根據實施例的用於生產玻璃疊層板的裝置1的示意圖。第2圖係示出根據實施例的玻璃板組件的平面圖。第3圖係沿著第2圖的線III-III’獲得的截面圖。第4圖係示出根據藉由使用根據實施例的用於生產玻璃疊層板的裝置1來生產根據實施例的玻璃疊層板的方法而生產的玻璃疊層板160的橫截面視圖。Fig. 1 is a schematic diagram showing an apparatus 1 for producing glass laminates according to an embodiment. Fig. 2 is a plan view showing the glass plate assembly according to the embodiment. Fig. 3 is a cross-sectional view taken along the line III-III' of Fig. 2. FIG. 4 is a cross-sectional view showing a
參考第1圖至第4圖,用於生產玻璃疊層板的裝置1可包括雷射光束照射單元10、位置移動控制單元20、裝載台30、及玻璃板組件100。Referring to FIGS. 1 to 4, the apparatus 1 for producing glass laminates may include a laser
雷射光束照射單元10可包括雷射照射部分12及吹洗空氣供應部分14。雷射光束照射單元10可連接至位置移動控制單元20並且在第一方向(D1方向)及第二方向(D2方向)上移動裝載台30。The laser
雷射照射部分12可被組配來照射用於切割玻璃疊層板160的雷射光束。當雷射光束從雷射照射部分12發射至例如玻璃疊層板160上時,玻璃疊層板160的至少一部分可得以熔化及切割。雷射照射部分12的實例可包括但不限於光纖雷射裝置、CO2
雷射裝置、及YAG雷射裝置。雷射照射部分12可包括任何類型的具有一定功率輸出的雷射裝置,該功率輸出能夠熔化包含在玻璃疊層板160例如金屬薄板162中的材料的至少一部分。例如,雷射照射部分12可包括具有約100 W至約10 kW的功率輸出的光纖雷射裝置。The
吹洗空氣供應部分14可被組配來將吹洗空氣供應至玻璃疊層板的切割部分以便移除可能由於雷射光束從玻璃疊層板160的切割部分上切割所產生的金屬熔化物、碎片、或毛刺。吹洗空氣供應部分14可經由連接至泵浦的空氣噴嘴將吹洗空氣供應至玻璃疊層板160的切割部分。The purge
裝載台30可為玻璃板組件100及玻璃疊層板160安置在其上的工作台。裝載台30可包括複數個吸氣孔30H。吸氣孔30H可穿過裝載台30,並且在玻璃疊層板160的切割部分處產生的碎片或毛刺可穿過吸氣孔30H並且收集在裝載台30下方的收集容器(未展示)中。雖然在第1圖中示出吸氣孔30H呈吸氣孔30H在第一方向(D1方向)上延伸的多個線形式,但是裝載台30及吸氣孔30H的形狀不限於此。The loading table 30 may be a work table on which the
可在玻璃疊層板160安裝於玻璃板組件100上的狀態下將玻璃板組件100放置在裝載台30上,並且可將雷射光束及吹洗空氣沿著目標切割線(未展示)連續地從雷射光束照射單元10供應至玻璃疊層板160以使得玻璃疊層板160的目標切割線得以切割。The
玻璃板組件100可包括底板110、可撓性磁鐵120、及引導部分130。The
底板110可包括相反彼此的第一表面110F1及第二表面110F2。底板110可包括從第一表面110F1延伸至第二表面110F2並且穿過底板110的複數個狹槽110H。狹槽110H係藉由從底板110的第一表面110F1延伸至第二表面110F2的側壁110S來界定的空間,雷射光束及吹洗空氣可穿過狹槽110H,並且狹槽110H可與玻璃疊層板160上的目標切割線垂直地重疊。The
在示例性實施例中,底板110可由例如金屬、木材、無機材料、有機材料、或其組合製成,但是本揭示案不限於此。例如,底板110可包括鋁、銅、鐵、鎳、或其組合。為了在將玻璃疊層板160安裝於底板110上並且將雷射光束及吹洗空氣供應至底板110及玻璃疊層板160上時確保機械穩定性,底板110可包括足夠穩固的材料。底板110可足夠重以便在供應吹洗空氣時不振動或移動,同時足夠輕型以便在反覆地裝載至裝載台30上並且從裝載台30上卸載時允許簡易操作。例如,底板110可具有約2 mm至約100 mm的厚度t11(參見第3圖),但是本揭示案不限於此。In an exemplary embodiment, the
可撓性磁鐵120可安置在底板110的第一表面110F1上。雖然未展示,但是可藉由使用黏著劑層(未展示)將可撓性磁鐵120附接至底板110的第一表面110F1。可撓性磁鐵120可包括複數個開口120H,並且可撓性磁鐵120的開口120H可相應地與底板110的狹槽110H連通。例如,在玻璃疊層板160的雷射切割期間,雷射光束及吹洗空氣可穿過可撓性磁鐵120的開口120H及底板110的狹槽110H。The
在示例性實施例中,可撓性磁鐵120可具有約100高斯至約3,000高斯的磁通量密度。因此,當玻璃疊層板160安裝於可撓性磁鐵120上時,玻璃疊層板160可藉由磁力固定至可撓性磁鐵120。在示例性實施例中,可撓性磁鐵120可具有約0.1 mm至約20 mm的厚度t12(參見第3圖),但是本揭示案不限於此。In an exemplary embodiment, the
引導部分130可在可撓性磁鐵120的一側經安置在底板110的第一表面110F1上並且在第一方向(D1方向)上延伸。在此處,第一方向(D1方向)表示與底板110的第一表面110F1的一邊緣平行的方向。如第1圖中示出,引導部分130可僅安置在底板110的邊緣上。在另一實施例中,引導部分130可安置在底板110的至少兩個邊緣上。引導部分130及底板110可整體地形成,但是本揭示案不限於此。The
相對於底板110的第一表面110F1,在垂直於第一表面110F1的第三方向(D3方向)上,引導部分130的上部表面可處於比可撓性磁鐵120的上部表面120U更高的水準處。當玻璃疊層板160安裝於玻璃板組件100上時,玻璃疊層板160的側向表面可與引導部分130接觸。因此,引導部分130可精確地調節玻璃疊層板160的安裝位置,並且在玻璃疊層板160的安裝過程中,操作容易性可藉由引導部分130來增強。Relative to the first surface 110F1 of the
如第2圖中示出,狹槽110H(及相應地與狹槽110H連通的開口120H)可在第一方向(D1方向)上、在相同距離下、彼此平行地間隔開。在平面圖中,每個狹槽110H的在第二方向(D2方向)上的寬度w11可在約2 mm至約20 mm範圍內。每個狹槽110H的在第二方向(D2方向)上的寬度w11可基於待切割的玻璃疊層板區段160P(參見第10圖)的尺寸、玻璃疊層板160的材料、雷射光束的功率、吹洗空氣的壓力、及其類似因素來適當地選擇。例如,當每個狹槽110H的寬度w11小於約2 mm時,玻璃疊層板160的金屬熔化物、碎片、或毛刺變得附接至狹槽110H的內部,並且由此可能堵塞狹槽110H,或每個狹槽110H的寬度w11小於注射至玻璃疊層板160上的吹洗空氣流的直徑以致於發生玻璃疊層板160的不當移動或振動。當每個狹槽110H的寬度w11大於約20 mm時,玻璃疊層板160的不被玻璃板組件100支撐的部分的面積增加,並且因此,可由於雷射光束照射或吹洗空氣注射而導致發生玻璃疊層板160的不當移動或振動。As shown in Figure 2, the
在平面圖中,複數個狹槽110H的兩個相鄰狹槽110H之間的第一距離d11可根據待切割的玻璃疊層板區段160P(參見第10圖)的目標尺寸來確定。例如,當生產具有水平寬度大於垂直寬度的長方形或條棒形狀的玻璃疊層板區段160P時,狹槽110H之間的第一距離d11可對應於所需玻璃疊層板區段160P的垂直寬度。亦即,狹槽110H之間的第一距離d11及狹槽110H的數目可根據玻璃疊層板區段160P的目標垂直寬度來確定。In a plan view, the first distance d11 between two
如第4圖中示出,玻璃疊層板160可包括金屬薄板162、黏著劑層164、及玻璃層166。黏著劑層164可佈置在玻璃層166與金屬薄板162之間以使得玻璃層166的底部表面面對金屬薄板162的上部表面。玻璃疊層板160可包括彼此相反的第一主要表面160F1及第二主要表面160F2,玻璃疊層板160的第一主要表面160F1對應於與玻璃層166的底部表面相反的玻璃層166的上部表面,並且玻璃疊層板160的第二主要表面160F2可對應於與金屬薄板162的上部表面相反的金屬薄板162的底部表面。在其他實施例中,可省去黏著劑層164,並且玻璃層166可直接黏附至金屬薄板162上。As shown in FIG. 4, the
金屬薄板162可包括鋼、不銹鋼、鎳、鈷、或包括其中之至少一者的金屬合金。金屬薄板162可包括鐵磁材料,並且因此金屬薄板162可藉由磁力固定至可撓性磁鐵120上。在示例性實施例中,金屬薄板162可具有約0.1 mm至約5 mm的厚度t21。更具體而言,金屬薄板162的厚度t21可在約0.2 mm與約3 mm之間。The
玻璃層166可由玻璃、陶瓷、玻璃-陶瓷、或其組合形成。玻璃層166可包括例如硼矽酸鹽、鋁矽酸鹽、硼鋁矽酸鹽、鹼金屬硼矽酸鹽、鹼金屬鋁矽酸鹽、鹼金屬硼鋁矽酸鹽、鹼石灰、或其組合,但是本揭示案不限於此。例如,玻璃層166可為在Corning® Willow®玻璃(Corning Incorporated, Corning, New York, USA)的產品名稱下的市售可撓性玻璃或在Corning® Gorilla®玻璃(Corning Incorporated, Corning, New York, USA)的產品名稱下的市售化學強化玻璃。例如,玻璃層166可使用模製過程來形成,諸如下拉過程諸如熔融拉製過程或狹槽拉製過程、浮法過程、上拉過程、或滾壓過程。在示例性實施例中,玻璃層166可具有約0.1 mm至約2.0 mm的厚度t22。更具體而言,玻璃層166的厚度t22可在約0.15 mm與約1.5 mm之間。The
黏著劑層164可將玻璃層166連接至金屬薄板162,並且可例如由壓敏黏著劑(pressure sensitive adhesive;PSA)或光學透明黏著劑(optically clear adhesive;OCA)形成,但是本揭示案不限於此。The
由於金屬薄板162經由玻璃疊層板160的第二主要表面160F2暴露,因此在將玻璃疊層板160安裝於玻璃板組件100上時,金屬薄板162可被安置成與可撓性磁鐵120的上部表面120U接觸。在此方面,金屬薄板162可藉由磁力來穩固地固定在可撓性磁鐵120上。另外,當藉由在狹槽110H延伸的方向上照射雷射光束並且供應吹洗空氣來執行玻璃疊層板160的切割過程時,已經切割並且從玻璃疊層板160上分離的玻璃疊層板區段160P(參見第10圖)可藉由磁力來固定並且保持在可撓性磁鐵120的上部表面120U上。因此,可在玻璃疊層板160的切割過程中防止切割不均勻性或切割缺陷的發生,並且玻璃疊層板區段160P可表現出極好的切割橫截面品質。Since the
第5圖係示出根據其他示例性實施例的玻璃板組件100A的橫截面視圖。第5圖係沿著第2圖的線III-III’獲得的截面圖。Fig. 5 shows a cross-sectional view of a
參考第5圖,底板110A可包括界定複數個狹槽110HA的複數個側壁110SA,並且每個側壁110SA可包括梯級部分112。各狹槽110HA可在與底板110A的第二表面110F2相鄰的區域中、藉由梯級部分112在橫向方向上延伸。例如,每個狹槽110HA可在與底板110A的第一表面110F1相同的水準處具有第一寬度w11a,並且可在與底板110A的第二表面110F2相同的水準處具有大於第一寬度w11a的第二寬度w12a。每個狹槽110HA的在第二方向(D2方向)上的第一寬度w11a可在約2 mm至約20 mm範圍內,並且每個狹槽110HA的在第二方向(D2方向)上的第二寬度w12a可在約3 mm至約40 mm範圍內。Referring to FIG. 5, the
根據上述實施例,因為每個狹槽110HA的第二寬度w12a大於第一寬度w11a,所以在玻璃疊層板160的切割過程中雷射光束照射的部分中所產生的金屬熔化物、碎片、或毛刺可不附接至狹槽110HA的側壁或可不堵塞狹槽110HA,並且可藉由吹洗空氣來容易地轉移至裝載台30的吸氣孔30H。According to the above-mentioned embodiment, since the second width w12a of each slot 110HA is greater than the first width w11a, the metal melt, fragments, or metal melt generated in the portion irradiated by the laser beam during the cutting process of the
第6圖係示出根據其他示例性實施例的玻璃板組件的橫截面視圖;第6圖係沿著第2圖的線III-III’獲得的截面圖。Fig. 6 is a cross-sectional view showing a glass plate assembly according to other exemplary embodiments; Fig. 6 is a cross-sectional view taken along the line III-III' of Fig. 2.
參考第6圖,底板110B可包括複數個狹槽110HB,並且每個狹槽110HB可包括傾斜並且在第一方向(D1方向)上延伸的一對側壁110SB。該對側壁110SB可相對於底板110B的第一表面110F1、在相互相反的傾斜角度下傾斜。例如,歸因於在相互相反的傾斜角度下傾斜的該對側壁110SB,每個狹槽110HB可在與底板110B的第二表面110F2相鄰的區域中、在橫向方向上延伸。例如,每個狹槽110HB可在與底板110B的第一表面110F1相同的水準處具有第一寬度w11b,並且可在與底板110B的第二表面110F2相同的水準處具有大於第一寬度w11b的第二寬度w12b。每個狹槽110HB的在第二方向(D2方向)上的第一寬度w11b可在約2 mm至約20 mm範圍內,並且每個狹槽110HB的在第二方向(D2方向)上的第二寬度w12b可在約3 mm至約40 mm範圍內。Referring to FIG. 6, the
根據上述實施例,因為每個狹槽110HB的第二寬度w12b大於第一寬度w11b,所以在玻璃疊層板160的切割過程中雷射光束照射的部分中所產生的金屬熔化物、碎片、或毛刺可不附接至狹槽110HB的側壁或可不堵塞狹槽110HB,並且可藉由吹洗空氣來容易地轉移至裝載台30的吸氣孔30H。According to the above-mentioned embodiment, since the second width w12b of each slot 110HB is greater than the first width w11b, the metal melt, fragments, or metal melt generated in the portion irradiated by the laser beam during the cutting process of the
第7圖係示出根據其他示例性實施例的玻璃板組件的平面圖;第8A圖及第8B圖係沿著第7圖的線XIII-XIII’獲得的橫截面視圖。Fig. 7 is a plan view showing a glass plate assembly according to other exemplary embodiments; Figs. 8A and 8B are cross-sectional views taken along the line XIII-XIII' of Fig. 7.
參考第7圖、第8A圖、及第8B圖,底板110C可包括一對第一狹槽110HC1及一對第二狹槽110HC2。該對第一狹槽110HC1可在第一方向(D1方向)上平行延伸,並且該對第二狹槽110HC2可在第二方向(D2方向)上平行延伸。該對第二狹槽110HC2中的每一個及該對第一狹槽110HC1中的每一個可在相交區域110HX處相交。Referring to FIG. 7, FIG. 8A, and FIG. 8B, the
因為該對第二狹槽110HC2與該對第一狹槽110HC1相交,所以玻璃板組件100C可包括中心部分100C1及外部周向部分100C2。例如,當在平面圖中檢視時,中心部分100C1可藉由該對第一狹槽110HC1及該對第二狹槽110HC2包圍,並且外部周向部分100C2可圍繞在該對第一狹槽110HC1與該對第二狹槽110HC2之間的中心部分100C1來定位。例如,外部周向部分100C2可包括引導部分130及底板110C的最外層邊緣。中心部分100C1可與外部周向部分100C2間隔開,並且該對第一狹槽110HC1及該對第二狹槽110HC2可在中心部分100C1與外部周向部分100C2之間界定。Because the pair of second slots 110HC2 intersect the pair of first slots 110HC1, the
在示例性實施例中,如第8A圖中示出,中心部分100C1及外部周向部分100C2可彼此分離並且各自獨立地裝載至裝載台30上或從裝載台30上卸載。在此方面,中心部分100C1與外部周向部分100C2之間的在第二方向(D2方向)上的分隔距離w21(或該對第一狹槽110HC1的在第二方向(D2方向)上的寬度)可在約2 mm至約20 mm範圍內。In an exemplary embodiment, as shown in FIG. 8A, the central portion 100C1 and the outer circumferential portion 100C2 may be separated from each other and be independently loaded onto or unloaded from the
在其他實施例中,如第8B圖中示出,中心部分100C1可經由附接至玻璃板組件100C的底部表面(或底板110C的第二表面110F2)的金屬橋140來連接至外部周向部分100C2。在此情況下,該對第一狹槽110HC1及該對第二狹槽110HC2可安置在固定位置處,並且該對第一狹槽110HC1及該對第二狹槽110HC2中的每一個的寬度可不改變。同時,為了使該對第一狹槽110HC1及該對第二狹槽110HC2的位置固定,亦可使用其他任意緊固構件來代替第8B圖中示出的金屬橋140。In other embodiments, as shown in Figure 8B, the central portion 100C1 may be connected to the outer circumferential portion via a
在示例性實施例中,該對第一狹槽110HC1及該對第二狹槽110HC2的相對位置可根據待切割的玻璃疊層板區段160P(參見第圖10)的目標尺寸來確定。例如,待切割的玻璃疊層板區段160P的在第二方向(D2方向)上的水平寬度可對應於該對第一狹槽110HC1之間的第一距離d21,並且待切割的玻璃疊層板區段160P的在第一方向(D1方向)上的垂直寬度可對應於該對第二狹槽110HC2之間的第二距離d22。In an exemplary embodiment, the relative positions of the pair of first slots 110HC1 and the pair of second slots 110HC2 may be determined according to the target size of the
第9圖係示出根據實施例的生產玻璃疊層板的方法的流程圖。第10圖係示出第9圖的生產玻璃疊層板的方法的吹洗空氣供應操作(操作S240)的示意性橫截面視圖。Fig. 9 is a flowchart showing a method of producing a glass laminate according to an embodiment. Fig. 10 is a schematic cross-sectional view showing the purge air supply operation (operation S240) of the method of producing a glass laminate of Fig. 9.
藉由使用包含根據第1圖至第8B圖示出的示例性實施例的玻璃板組件100、100A、100B、或100C的用於生產玻璃疊層板的裝置1來生產玻璃疊層板的方法參考第9圖及第10圖來描述。例如,生產玻璃疊層板的方法可為藉由使用裝置1來切割玻璃疊層板160而形成玻璃疊層板區段160P的方法。在第10圖中,示出藉由使用玻璃板組件100A來生產玻璃疊層板的方法。A method for producing a glass laminate by using the apparatus 1 for producing a glass laminate including the
首先,可將包括含有至少一個狹槽110HA的底板110A、可撓性磁鐵120、及引導部分130的玻璃板組件100A安置在裝載台30上(操作S210)。First, the
在示例性實施例中,可將玻璃板組件100A安裝在裝載台30上以使得玻璃板組件100A的至少一個狹槽110HA與裝載台30的複數個吸氣孔30H垂直地重疊。例如,可將玻璃板組件100A安裝在裝載台30上以使得裝載台30的上部表面不被至少一個狹槽110HA暴露。當裝載台30的上部表面被至少一個狹槽110HA暴露時,在後續過程中照射至玻璃板組件100A上的雷射光束可能使裝載台30部分地損壞。In an exemplary embodiment, the
隨後,可將玻璃疊層板160安置在玻璃板組件100A上以使得玻璃疊層板160的邊緣160E與引導部分130接觸並且藉由磁力而固定至可撓性磁鐵120(操作S220)。Subsequently, the
在示例性實施例中,如上參考第4圖所述,玻璃疊層板160可為板形結構,其中金屬薄板162及玻璃層166藉由黏著劑層164來彼此附接。玻璃疊層板160的金屬薄板162可包括鋼、不銹鋼、鎳、鈷、或包括其中之至少一者的金屬合金,並且因此,金屬薄板162可藉由磁力而穩固地附接至可撓性磁鐵120。In an exemplary embodiment, as described above with reference to FIG. 4, the
在示例性實施例中,引導部分130在第一方向(D1方向)上、在底板110A的第一表面110F1上延伸,並且引導部分130的上部表面處於比可撓性磁鐵120的上部表面更高的水準。因此,在將玻璃疊層板160安裝在玻璃板組件100A上以使得玻璃疊層板160的邊緣160E與引導部分130接觸的過程中,可防止玻璃疊層板160的未對準或類似問題。In an exemplary embodiment, the
隨後,雷射光束可在至少一個狹槽110HA延伸的方向上進行照射,從而切割玻璃疊層板160(操作S230)。Subsequently, the laser beam may be irradiated in the direction in which the at least one slot 110HA extends, thereby cutting the glass laminate 160 (operation S230).
在示例性實施例中,雷射光束照射單元10(參看第1圖)可連接至位置移動控制單元20(參看第1圖),並且可被組配來沿著玻璃疊層板160的預定目標切割線(未展示)移動。雷射光束照射單元10可包括雷射照射部分12(參看第1圖)及吹洗空氣供應部分14。In an exemplary embodiment, the laser beam irradiation unit 10 (see Figure 1) can be connected to the position movement control unit 20 (see Figure 1), and can be configured to follow a predetermined target of the
在示例性實施例中,雷射光束可從雷射照射部分12發射至玻璃疊層板160的目標切割位置以使得玻璃疊層板160例如金屬薄板162的至少一部分可得以熔化。例如,藉由雷射光束產生的熱量可局部集中在玻璃疊層板160的已經用雷射光束照射的目標切割位置,並且因此,金屬薄板162可得以熔化及切割。另外,在玻璃疊層板160的目標切割位置的再冷卻期間,可在玻璃層166中局部地產生應力,並且因此,玻璃層166可藉由所產生應力的傳輸或擴散而得以切割。In an exemplary embodiment, the laser beam may be emitted from the
隨後,可將吹洗空氣供應至玻璃疊層板160以便將切割玻璃疊層板160的碎片168R傳遞至裝載台30的吸氣孔30H(操作S240)。Subsequently, purge air may be supplied to the
在示例性實施例中,吹洗空氣可從雷射光束照射單元10的吹洗空氣供應部分14注射至吸氣孔30H中。吹洗空氣流藉由第10圖中的點線箭頭來示意性地示出。In an exemplary embodiment, the purge air may be injected from the purge
在示例性實施例中,吹洗空氣供應操作可在雷射光束照射操作之後執行。在其他實施例中,雷射照射部分12可在沿著目標切割線連續移動的同時將雷射光束連續發射至玻璃疊層板160上,並且吹洗空氣供應部分14可在雷射照射部分12之後、沿著目標切割線連續移動的同時將吹洗空氣注射至雷射光束照射玻璃疊層板160的部分。In an exemplary embodiment, the purge air supply operation may be performed after the laser beam irradiation operation. In other embodiments, the
在吹洗空氣供應操作中,玻璃疊層板160的已經用雷射光束照射的部分可加以冷卻以便在玻璃層166中局部地產生應力,由此誘導或促進切割玻璃層166。另外,藉由吹洗空氣供應操作的切割玻璃疊層板160的碎片168R(或玻璃疊層板160的金屬熔化物或毛刺)可轉移至吸氣孔30H中。由於玻璃疊層板160藉由磁力來穩固地附接至玻璃板組件100A,因此可防止玻璃疊層板160的不當移動或振動,即使當吹洗空氣在相對高壓力下注射時亦如此。In the purge air supply operation, the portion of the
可執行上述操作,以便由此完成玻璃疊層板區段160P從玻璃疊層板160的生產。在將玻璃疊層板160切割成複數個玻璃疊層板區段160P的情況下,因為已經切割的玻璃疊層板區段160P在玻璃板組件100A上保持在藉由磁力而與其固定的狀態下,所以由於注射吹洗空氣而導致的玻璃疊層板區段160P的移動或振動可得以防止。The above-mentioned operations may be performed to thereby complete the production of the
隨後,可卸載玻璃疊層板區段160P,並且可將另一個玻璃疊層板160安置在玻璃板組件100A上並且可在其上反覆地執行切割過程(亦即,操作S220至S240可反覆地執行)。因此,可重新使用玻璃板組件100A,此舉為節約的。Subsequently, the
根據上述生產方法,因為玻璃疊層板160藉由可撓性磁鐵120的磁力而穩固地及臨時地固定至玻璃板組件100A上,所以玻璃疊層板160不可移動或振動,即使在雷射照射之後,在相對高壓力下注射吹洗空氣時亦如此。因此,可防止玻璃疊層板160的切割位置偏離、切割缺陷、或類似問題的發生。另外,因為玻璃疊層板160可藉由連續地執行雷射照射操作及吹洗空氣供應操作來切割,所以玻璃疊層板區段160P可具有極好的切割橫截面品質。According to the above production method, because the
應瞭解本文所述實施例應僅以描述性含義來考量並且並非出於限制目的。每個實施例內的特徵或態樣的描述通常被視為可用於在其他實施例中的其他類似特徵或態樣。It should be understood that the embodiments described herein should only be considered in a descriptive sense and not for the purpose of limitation. The description of the features or aspects within each embodiment is generally considered to be applicable to other similar features or aspects in other embodiments.
雖然一或多個實施例已參考附圖來描述,但是普通熟習此項技術者應瞭解可在其中產生形式及細節的各種變化而不脫離如以下請求項中定義的本揭示案的精神及範疇。Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art should understand that various changes in form and details can be produced therein without departing from the spirit and scope of the present disclosure as defined in the following claims .
1:裝置
10:雷射光束照射單元
12:雷射照射部分
14:吹洗空氣供應部分
20:位置移動控制單元
30:裝載台
30H:吸氣孔
100:玻璃板組件
100A:玻璃板組件
100C:玻璃板組件
100C1:中心部分
100C2:外部周向部分
110:底板
110A:底板
110B:底板
110C:底板
110H:狹槽
110HA:狹槽
110HB:狹槽
110HC1:第一狹槽
110HC2:第二狹槽
110HX:相交區域
110SA:側壁
110SB:側壁
110F1:第一表面
110F2:第二表面
110S:側壁
112:梯級部分
120:可撓性磁鐵
120H:開口
120U:上部表面
130:引導部分
140金屬橋
160:玻璃疊層板
160F1:第一主要表面
160F2:第二主要表面
160P:玻璃疊層板區段
162:金屬薄板
164:黏著劑層
166:玻璃層
168R:碎片
D1:方向
D2:方向
D3:方向
t11:厚度
t12:厚度
t21:厚度
t22:厚度
w11:寬度
w11a:第一寬度
w11b:第一寬度
w12a:第二寬度
w12b:第二寬度
w21:分隔距離
d11:距離
d21:第一距離
d22:第二距離
III-III’:線
S210:操作
S220:操作
S230:操作
S240:操作1: device
10: Laser beam irradiation unit
12: Laser irradiation part
14: Purge air supply part
20: Position movement control unit
30:
根據以下結合附圖進行的實施例的描述,此等及/或其他態樣變得顯而易知並且更容易理解:According to the following description of the embodiments in conjunction with the accompanying drawings, these and/or other aspects become obvious and easier to understand:
第1圖係示出根據實施例的用於生產玻璃疊層板的裝置的示意圖;Figure 1 is a schematic diagram showing an apparatus for producing glass laminates according to an embodiment;
第2圖係示出根據實施例的玻璃板組件的平面圖;Figure 2 is a plan view showing the glass plate assembly according to the embodiment;
第3圖係沿著第2圖的線III-III’獲得的截面圖;Figure 3 is a cross-sectional view taken along the line III-III' of Figure 2;
第4圖係示出根據藉由使用根據實施例的用於生產玻璃疊層板的裝置來生產根據實施例的玻璃疊層板的方法而生產的玻璃疊層板的橫截面視圖;Figure 4 is a cross-sectional view showing a glass laminate produced according to a method of producing a glass laminate according to an embodiment by using the apparatus for producing a glass laminate according to an embodiment;
第5圖係示出根據其他示例性實施例的玻璃板組件的橫截面視圖;Figure 5 shows a cross-sectional view of a glass plate assembly according to other exemplary embodiments;
第6圖係示出根據其他示例性實施例的玻璃板組件的橫截面視圖;Figure 6 shows a cross-sectional view of a glass plate assembly according to other exemplary embodiments;
第7圖係示出根據其他示例性實施例的玻璃板組件的平面圖;Figure 7 is a plan view showing a glass plate assembly according to other exemplary embodiments;
第8A圖及第8B圖係沿著第7圖的線XIII-XIII’獲得的橫截面視圖;Figures 8A and 8B are cross-sectional views taken along the line XIII-XIII' of Figure 7;
第9圖係示出根據實施例的生產玻璃疊層板的方法的流程圖;及Figure 9 is a flowchart showing a method of producing a glass laminate according to an embodiment; and
第10圖係示出第9圖的生產玻璃疊層板的方法的吹洗空氣供應操作(操作S240)的示意性橫截面視圖。Fig. 10 is a schematic cross-sectional view showing the purge air supply operation (operation S240) of the method of producing a glass laminate of Fig. 9.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic deposit information (please note in the order of deposit institution, date and number) no Foreign hosting information (please note in the order of hosting country, institution, date, and number) no
1:裝置 1: device
10:雷射光束照射單元 10: Laser beam irradiation unit
12:雷射照射部分 12: Laser irradiation part
14:吹洗空氣供應部分 14: Purge air supply part
20:位置移動控制單元 20: Position movement control unit
30:裝載台 30: loading platform
30H:吸氣孔 30H: Suction hole
100:玻璃板組件 100: glass plate assembly
110:底板 110: bottom plate
110H:狹槽 110H: Slot
120:可撓性磁鐵 120: Flexible magnet
130:引導部分 130: boot part
160:玻璃疊層板 160: glass laminated board
D1:方向 D1: direction
D2:方向 D2: Direction
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190064073A KR20200137539A (en) | 2019-05-30 | 2019-05-30 | Plate assembly, apparatus for producing glass laminate including the same, and method for producing glass laminate |
KR10-2019-0064073 | 2019-05-30 |
Publications (1)
Publication Number | Publication Date |
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TW202112480A true TW202112480A (en) | 2021-04-01 |
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TW109116883A TW202112480A (en) | 2019-05-30 | 2020-05-21 | Pcplate assembly, apparatus for producing glass laminate including the same, and method of producing glass laminate |
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KR (1) | KR20200137539A (en) |
TW (1) | TW202112480A (en) |
WO (1) | WO2020243257A1 (en) |
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US20070228616A1 (en) * | 2005-05-11 | 2007-10-04 | Kyu-Yong Bang | Device and method for cutting nonmetalic substrate |
KR101159414B1 (en) * | 2007-04-19 | 2012-06-28 | 가부시키가이샤 아루박 | Substrate holding mechanism and substrate assembling apparatus provided with the same |
DE202019100025U1 (en) * | 2019-01-03 | 2019-01-17 | Litz Hitech Corporation | Hybrid processing machine with the possibility for both laser cutting and ultrasonic grinding |
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KR20200137539A (en) | 2020-12-09 |
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