TW202112480A - Pcplate assembly, apparatus for producing glass laminate including the same, and method of producing glass laminate - Google Patents

Pcplate assembly, apparatus for producing glass laminate including the same, and method of producing glass laminate Download PDF

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TW202112480A
TW202112480A TW109116883A TW109116883A TW202112480A TW 202112480 A TW202112480 A TW 202112480A TW 109116883 A TW109116883 A TW 109116883A TW 109116883 A TW109116883 A TW 109116883A TW 202112480 A TW202112480 A TW 202112480A
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glass
glass laminate
slot
plate assembly
bottom plate
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TW109116883A
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Chinese (zh)
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金珠錫
李宇鎭
朴喆熙
申東根
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美商康寧公司
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074Glass products comprising an outer layer or surface coating of non-glass material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1825Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833Positioning, e.g. registration or centering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0461Welding tables
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/18Layered products comprising a layer of metal comprising iron or steel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/061Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0004Cutting, tearing or severing, e.g. bursting; Cutter details
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/08Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/102Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laminated Bodies (AREA)

Abstract

A plate assembly used in an apparatus for producing a glass laminate includes: a base plate including at least one slot through which laser beams are configured to pass; a flexible magnet placed on a first surface of the base plate and including at least one opening in communication with the at least one slot; and a guide portion placed on one side of the flexible magnet on the first surface of the base plate and extending in a first direction parallel to the first surface of the base plate.

Description

玻璃板組件,包含該玻璃板組件的用於生產玻璃疊層板的裝置以及用於生產玻璃疊層板的方法Glass plate assembly, device for producing glass laminate and method for producing glass laminate containing the glass plate assembly

相關申請案之交叉引用Cross-reference of related applications

本申請案要求2019年5月30月在韓國智慧財產局提交的韓國專利申請案第10-2019-0064073號的權益,其揭示內容全部以引用方式併入本文。This application claims the rights and interests of the Korean Patent Application No. 10-2019-0064073 filed with the Korean Intellectual Property Office on May 30, 2019, the disclosure of which is fully incorporated herein by reference.

一或多個實施例係關於玻璃板組件、包含該玻璃板組件的用於生產玻璃疊層板的裝置、及生產玻璃疊層板的方法,並且更具體而言,係關於在玻璃疊層板的雷射切割中使用的玻璃板組件、包含該玻璃板組件的用於生產玻璃疊層板的裝置、及使用該裝置來生產玻璃疊層板的方法。One or more embodiments relate to a glass plate assembly, an apparatus for producing a glass laminate including the glass plate assembly, and a method for producing a glass laminate, and more specifically, to a glass laminate The glass plate assembly used in laser cutting of, a device for producing a glass laminate including the glass plate assembly, and a method for producing a glass laminate using the device.

玻璃疊層板包含基底薄板及黏附至基底薄板的玻璃層,並且玻璃疊層板用於各種領域諸如汽車零件、電子裝置零件、建築結構零件、及其類似領域。總體上,玻璃疊層板具有相對較小厚度,並且基底薄板及玻璃層表現出彼此不同的物理特性。因此,可能很難藉由使用習知機械加工方法來切割玻璃疊層板而不在玻璃層中出現裂縫。為了切割玻璃疊層板,已經提出連續地執行雷射光束照射及吹洗空氣供應的方法,但是玻璃疊層板可能由於其較小厚度而移動或振動。在此情況下,出現玻璃疊層板的切割不均勻性或切割缺陷,諸如玻璃疊層板的切割位置偏離目標位置、不規則切割截面形狀、或在玻璃層中出現裂縫。The glass laminate includes a base sheet and a glass layer adhered to the base sheet, and the glass laminate is used in various fields such as automobile parts, electronic device parts, building structure parts, and the like. In general, the glass laminate has a relatively small thickness, and the base sheet and the glass layer exhibit different physical properties from each other. Therefore, it may be difficult to cut the glass laminate without cracks in the glass layer by using conventional machining methods. In order to cut the glass laminate, a method of continuously performing laser beam irradiation and blowing air supply has been proposed, but the glass laminate may move or vibrate due to its small thickness. In this case, cutting unevenness or cutting defects of the glass laminated plate occur, such as the cutting position of the glass laminated plate deviating from the target position, irregular cut cross-sectional shape, or the occurrence of cracks in the glass layer.

一或多個實施例包括在玻璃疊層板的雷射切割中使用的玻璃板組件、及包含該玻璃板組件的用於生產玻璃疊層板的裝置。One or more embodiments include a glass plate assembly used in laser cutting of a glass laminate, and an apparatus for producing a glass laminate including the glass plate assembly.

一或多個實施例包括使用包含玻璃板組件的用於生產玻璃疊層板的裝置來生產玻璃疊層板的方法,由此可增強切割均勻性並且可防止出現切割缺陷。One or more embodiments include a method of producing a glass laminate using an apparatus for producing a glass laminate including a glass plate assembly, whereby cutting uniformity can be enhanced and the occurrence of cutting defects can be prevented.

額外態樣部分地在以下說明書中闡明並且部分地由說明書顯而易知,或可藉由實踐所提供的實施例而習得。The additional aspects are partly clarified in the following description and partly apparent from the description, or can be learned by practicing the provided examples.

根據一或多個實施例,玻璃板組件在用於生產玻璃疊層板的裝置中使用。玻璃板組件包含:底板,該底板包括至少一個狹槽,雷射光束被組配來穿過該至少一個狹槽;可撓性磁鐵,該可撓性磁鐵安置在底板的第一表面上並且包括與至少一個狹槽連通的至少一個開口;及引導部分,該引導部分沿著可撓性磁鐵的一邊緣來安置在底板的第一表面上並且在與底板的第一表面的邊緣平行的第一方向上延伸。According to one or more embodiments, the glass plate assembly is used in an apparatus for producing glass laminates. The glass plate assembly includes: a bottom plate, the bottom plate includes at least one slot, the laser beam is assembled to pass through the at least one slot; a flexible magnet, the flexible magnet is arranged on the first surface of the bottom plate and includes At least one opening communicating with the at least one slot; and a guide portion, the guide portion being arranged on the first surface of the bottom plate along an edge of the flexible magnet and on the first surface parallel to the edge of the first surface of the bottom plate Extend in the direction.

在一些實施例中,玻璃疊層板可包括金屬薄板及附接至金屬薄板的玻璃層,金屬薄板可包括鋼、不銹鋼、鎳、鈷、或包含此等金屬中之至少一者的金屬合金,並且金屬薄板可被組配來藉由磁力而固定在可撓性磁鐵上。In some embodiments, the glass laminate may include a metal sheet and a glass layer attached to the metal sheet. The metal sheet may include steel, stainless steel, nickel, cobalt, or a metal alloy containing at least one of these metals, And the thin metal plate can be assembled to be fixed on the flexible magnet by magnetic force.

在一些實施例中,可撓性磁鐵可具有約100高斯至約3,000高斯的磁通量密度。In some embodiments, the flexible magnet may have a magnetic flux density of about 100 Gauss to about 3,000 Gauss.

在一些實施例中,至少一個狹槽可包括在第一方向上延伸並且彼此平行地間隔開的複數個第一狹槽。In some embodiments, the at least one slot may include a plurality of first slots extending in the first direction and spaced parallel to each other.

在一些實施例中,第一狹槽可在相等距離下彼此間隔開。In some embodiments, the first slots may be spaced apart from each other at equal distances.

在一些實施例中,玻璃板組件可包括:外部周向部分,引導部分安置在該外部周向部分上;及中心部分,在平面圖中檢視時,該中心部分藉由外部周向部分包圍並且與外部周向部分間隔開,並且至少一個狹槽可在中心部分與外部周向部分之間界定。In some embodiments, the glass plate assembly may include: an outer circumferential portion on which the guide portion is disposed; and a central portion, when viewed in a plan view, the central portion is surrounded by the outer circumferential portion and is in contact with The outer circumferential portions are spaced apart, and at least one slot may be defined between the central portion and the outer circumferential portion.

在一些實施例中,至少一個狹槽可包括在第一方向上平行延伸的一對第一狹槽,及在第二方向上平行延伸並且與該對第一狹槽相交的一對第二狹槽,第二方向垂直於第一方向並且平行於底板的第一表面,並且在平面圖中檢視時,中心部分可藉由該對第一狹槽及該對第二狹槽包圍。In some embodiments, the at least one slot may include a pair of first slots extending in parallel in the first direction, and a pair of second slots extending in parallel in the second direction and intersecting the pair of first slots. For the groove, the second direction is perpendicular to the first direction and parallel to the first surface of the bottom plate, and when viewed in a plan view, the central part can be surrounded by the pair of first slots and the pair of second slots.

在一些實施例中,相對於底板的第一表面,在垂直於第一表面的第三方向上,引導部分的上部表面可處於比可撓性磁鐵的上部表面更高的水準處。In some embodiments, with respect to the first surface of the bottom plate, in a third direction perpendicular to the first surface, the upper surface of the guide portion may be at a higher level than the upper surface of the flexible magnet.

在一些實施例中,至少一個狹槽可藉由從底板的第一表面延伸至第二表面的相反側壁來界定,第二表面與第一表面相反,並且處於與第一表面相同水準下的至少一個狹槽的第一寬度可小於處於與第二表面相同水準下的至少一個狹槽的第二寬度。In some embodiments, the at least one slot may be defined by opposite side walls extending from the first surface to the second surface of the bottom plate. The second surface is opposite to the first surface and is at least at the same level as the first surface. The first width of one slot may be smaller than the second width of at least one slot at the same level as the second surface.

在一些實施例中,底板的相反側壁中的每一個可從底板的第一表面至第二表面為傾斜的。In some embodiments, each of the opposite side walls of the bottom plate may be inclined from the first surface to the second surface of the bottom plate.

在一些實施例中,底板的相反側壁中的每一個可包括底板的第一與第二表面之間的梯級部分。In some embodiments, each of the opposite side walls of the bottom plate may include a stepped portion between the first and second surfaces of the bottom plate.

根據一或多個實施例,用於切割玻璃疊層板的用於生產玻璃疊層板的裝置包含:裝載台,該裝載台包括複數個吸氣孔;玻璃板組件,該玻璃板組件安裝在裝載台上並且玻璃疊層板被組配來藉由磁力而固定在該玻璃板組件上;及雷射光束照射單元,該雷射光束照射單元被組配來用雷射光束照射玻璃疊層板。玻璃板組件包含:底板,該底板包括至少一個狹槽,雷射光束被組配來穿過該至少一個狹槽;可撓性磁鐵,該可撓性磁鐵安置在底板的第一表面上並且包括與至少一個狹槽連通的至少一個開口;及引導部分,該引導部分沿著可撓性磁鐵的一邊緣來安置在底板的第一表面上並且在與底板的第一表面的邊緣平行的第一方向上延伸。According to one or more embodiments, the apparatus for producing glass laminates for cutting glass laminates includes: a loading station, the loading station includes a plurality of suction holes; a glass plate assembly, the glass plate assembly is installed on On the loading table and the glass laminate is assembled to be fixed on the glass plate assembly by magnetic force; and a laser beam irradiation unit, which is assembled to irradiate the glass laminate with the laser beam . The glass plate assembly includes: a bottom plate, the bottom plate includes at least one slot, the laser beam is assembled to pass through the at least one slot; a flexible magnet, the flexible magnet is arranged on the first surface of the bottom plate and includes At least one opening communicating with the at least one slot; and a guide portion, the guide portion being arranged on the first surface of the bottom plate along an edge of the flexible magnet and on the first surface parallel to the edge of the first surface of the bottom plate Extend in the direction.

在一些實施例中,至少一個狹槽可與複數個吸氣孔垂直地重疊,並且雷射光束可被組配來在至少一個狹槽延伸的方向上照射至玻璃疊層板上。In some embodiments, the at least one slot may vertically overlap the plurality of suction holes, and the laser beam may be configured to irradiate the glass laminate in the direction in which the at least one slot extends.

在一些實施例中,雷射光束照射單元可包括:光纖雷射照射部分,該光纖雷射照射部分被組配來用雷射光束照射玻璃疊層板;及吹洗空氣供應部分,該吹洗空氣供應部分被組配來將吹洗空氣供應至雷射光束所照射的區域,以便將在雷射光束切割玻璃疊層板時所產生的玻璃疊層板的碎片或毛刺經由至少一個狹槽來傳遞至複數個吸氣孔中。In some embodiments, the laser beam irradiation unit may include: an optical fiber laser irradiation part configured to irradiate the glass laminate with the laser beam; and a purge air supply part, the purge air supply part The air supply part is configured to supply the purging air to the area irradiated by the laser beam, so that the fragments or burrs of the glass laminate produced when the laser beam cuts the glass laminate are passed through at least one slot Pass to a plurality of suction holes.

在一些實施例中,玻璃疊層板可包括金屬薄板及附接至金屬薄板的玻璃層,金屬薄板可包括鋼、不銹鋼、鎳、鈷、或包含此等金屬中之至少一者的金屬合金,並且金屬薄板可被組配來藉由磁力而固定在玻璃板組件的可撓性磁鐵上。In some embodiments, the glass laminate may include a metal sheet and a glass layer attached to the metal sheet. The metal sheet may include steel, stainless steel, nickel, cobalt, or a metal alloy containing at least one of these metals, And the thin metal plate can be assembled to be fixed on the flexible magnet of the glass plate assembly by magnetic force.

在一些實施例中,玻璃板組件的引導部分可與玻璃疊層板的邊緣接觸,並且玻璃疊層板可被組配來安置在玻璃板組件上。In some embodiments, the guide portion of the glass plate assembly may be in contact with the edge of the glass laminate plate, and the glass laminate plate may be assembled to be placed on the glass plate assembly.

根據一或多個實施例,使用玻璃板組件來生產玻璃疊層板的方法包括:將玻璃板組件安置在包括複數個吸氣孔的裝載台上,其中玻璃板組件包含含有至少一個狹槽的底板,及可撓性磁鐵,該可撓性磁鐵安置在底板的第一表面上並且包括與至少一個狹槽連通的至少一個開口;將玻璃疊層板安置在玻璃板組件上;及在至少一個狹槽延伸的方向上將雷射光束發射至玻璃疊層板上,以便切割玻璃疊層板的部分,該部分與至少一個狹槽重疊。According to one or more embodiments, a method of using a glass plate assembly to produce a glass laminated plate includes: placing the glass plate assembly on a loading platform including a plurality of suction holes, wherein the glass plate assembly includes at least one slot A bottom plate, and a flexible magnet, the flexible magnet is disposed on the first surface of the bottom plate and includes at least one opening communicating with the at least one slot; the glass laminate is disposed on the glass plate assembly; and the at least one The laser beam is emitted to the glass laminate in the direction in which the slot extends, so as to cut a portion of the glass laminate that overlaps with at least one slot.

在一些實施例中,玻璃板組件可進一步包括沿著可撓性磁鐵的一邊緣來安置在底板的第一表面上的引導部分,並且玻璃疊層板的安置可包括將玻璃疊層板安置在玻璃板組件上以使得玻璃疊層板的邊緣與引導部分接觸並且玻璃疊層板藉由磁力而固定在可撓性磁鐵上。In some embodiments, the glass plate assembly may further include a guide portion disposed on the first surface of the bottom plate along an edge of the flexible magnet, and the positioning of the glass laminate may include positioning the glass laminate on On the glass plate assembly so that the edge of the glass laminate is in contact with the guide part and the glass laminate is fixed on the flexible magnet by magnetic force.

在一些實施例中,方法可進一步包括,在發射雷射光束之後,將吹洗空氣供應至雷射光束所照射的玻璃疊層板的部分,以便將雷射光束切割的玻璃疊層板的碎片或毛刺經由至少一個狹槽來傳遞至複數個吸氣孔中。In some embodiments, the method may further include, after emitting the laser beam, supplying purge air to the part of the glass laminate irradiated by the laser beam, so as to cut the fragments of the glass laminate by the laser beam Or the burr is transferred to a plurality of suction holes through at least one slot.

在一些實施例中,在吹洗空氣的供應中,玻璃板組件及玻璃疊層板可不由於吹洗空氣而導致移動或振動。In some embodiments, in the supply of purge air, the glass plate assembly and the glass laminate may not move or vibrate due to the purge air.

根據生產根據實施例的玻璃疊層板的方法、藉由使用根據實施例的用於生產玻璃疊層板的裝置,可在玻璃疊層板切割過程中增強切割均勻性並且可防止切割缺陷的發生。例如,玻璃疊層板可藉由可撓性磁鐵的磁力而穩固地及臨時地固定至玻璃板組件上,並且因此玻璃疊層板不可移動或振動,即使在雷射照射之後,在相對高壓力下注射吹洗空氣時亦如此。因此,可防止玻璃疊層板的切割位置偏離、切割缺陷、或類似問題。另外,玻璃疊層板可藉由連續地執行雷射照射操作及吹洗空氣供應操作來切割,並且因此使用根據實施例的生產玻璃疊層板的方法來生產的玻璃疊層板可具有極好的切割橫截面品質。According to the method of producing the glass laminate according to the embodiment, by using the apparatus for producing the glass laminate according to the embodiment, the cutting uniformity can be enhanced during the cutting of the glass laminate and the occurrence of cutting defects can be prevented . For example, the glass laminate can be firmly and temporarily fixed to the glass plate assembly by the magnetic force of the flexible magnet, and therefore the glass laminate cannot move or vibrate, even after laser irradiation, under relatively high pressure This is also true when the air is purged under the injection. Therefore, it is possible to prevent deviation of the cutting position of the glass laminate, cutting defects, or the like. In addition, the glass laminate can be cut by continuously performing the laser irradiation operation and the blowing air supply operation, and therefore the glass laminate produced using the method for producing the glass laminate according to the embodiment may have excellent Cutting cross-section quality.

現將詳細參考實施例,該等實施例的實例示出於附圖中,其中相同參考數字在全篇中指代相同元件。在此方面,本發明實施例可具有不同形式並且不應被視為限於本文闡明的描述。因此,實施例在下文僅僅藉由參考附圖來描述,以便解釋本說明書的態樣。在要素清單之前的表述諸如「……中之至少一者」限定整個要素清單並且不限定清單的個別要素。Reference will now be made in detail to the embodiments. Examples of the embodiments are shown in the drawings, in which the same reference numbers refer to the same elements throughout the text. In this regard, the embodiments of the present invention may have different forms and should not be considered as limited to the description set forth herein. Therefore, the embodiments are described below only by referring to the accompanying drawings in order to explain the aspect of the specification. Expressions before the element list such as "at least one of..." limit the entire element list and do not limit the individual elements of the list.

在下文,本揭示案的示例性實施例參考附圖來詳細描述。然而,本發明的實施例可以各種其他形式來限定並且不應被視為限於本文闡明的實施例。提供本發明的實施例以便向普通熟習此項技術者更完全地解釋本揭示案。相同參考數字指示相同元件。此外,在附圖中的各種元件及區域加以示意性地示出。因此,本揭示案不限於在附圖中示出的相對大小或間隔。Hereinafter, exemplary embodiments of the present disclosure are described in detail with reference to the accompanying drawings. However, the embodiments of the present invention may be defined in various other forms and should not be regarded as limited to the embodiments set forth herein. The embodiments of the present invention are provided in order to more fully explain the present disclosure to those skilled in the art. The same reference numbers indicate the same elements. In addition, various elements and regions in the drawings are schematically shown. Therefore, the present disclosure is not limited to the relative sizes or intervals shown in the drawings.

第1圖係示出根據實施例的用於生產玻璃疊層板的裝置1的示意圖。第2圖係示出根據實施例的玻璃板組件的平面圖。第3圖係沿著第2圖的線III-III’獲得的截面圖。第4圖係示出根據藉由使用根據實施例的用於生產玻璃疊層板的裝置1來生產根據實施例的玻璃疊層板的方法而生產的玻璃疊層板160的橫截面視圖。Fig. 1 is a schematic diagram showing an apparatus 1 for producing glass laminates according to an embodiment. Fig. 2 is a plan view showing the glass plate assembly according to the embodiment. Fig. 3 is a cross-sectional view taken along the line III-III' of Fig. 2. FIG. 4 is a cross-sectional view showing a glass laminate 160 produced according to a method of producing a glass laminate according to the embodiment by using the apparatus 1 for producing a glass laminate according to the embodiment.

參考第1圖至第4圖,用於生產玻璃疊層板的裝置1可包括雷射光束照射單元10、位置移動控制單元20、裝載台30、及玻璃板組件100。Referring to FIGS. 1 to 4, the apparatus 1 for producing glass laminates may include a laser beam irradiation unit 10, a position movement control unit 20, a loading table 30, and a glass plate assembly 100.

雷射光束照射單元10可包括雷射照射部分12及吹洗空氣供應部分14。雷射光束照射單元10可連接至位置移動控制單元20並且在第一方向(D1方向)及第二方向(D2方向)上移動裝載台30。The laser beam irradiation unit 10 may include a laser irradiation part 12 and a purge air supply part 14. The laser beam irradiation unit 10 may be connected to the position movement control unit 20 and move the loading table 30 in a first direction (D1 direction) and a second direction (D2 direction).

雷射照射部分12可被組配來照射用於切割玻璃疊層板160的雷射光束。當雷射光束從雷射照射部分12發射至例如玻璃疊層板160上時,玻璃疊層板160的至少一部分可得以熔化及切割。雷射照射部分12的實例可包括但不限於光纖雷射裝置、CO2 雷射裝置、及YAG雷射裝置。雷射照射部分12可包括任何類型的具有一定功率輸出的雷射裝置,該功率輸出能夠熔化包含在玻璃疊層板160例如金屬薄板162中的材料的至少一部分。例如,雷射照射部分12可包括具有約100 W至約10 kW的功率輸出的光纖雷射裝置。The laser irradiation part 12 may be configured to irradiate a laser beam for cutting the glass laminate 160. When the laser beam is emitted from the laser irradiation part 12 onto, for example, the glass laminate 160, at least a part of the glass laminate 160 can be melted and cut. Examples of the laser irradiation part 12 may include, but are not limited to, an optical fiber laser device, a CO 2 laser device, and a YAG laser device. The laser irradiation part 12 may include any type of laser device having a certain power output capable of melting at least a part of the material contained in the glass laminate 160 such as the metal thin plate 162. For example, the laser irradiation part 12 may include an optical fiber laser device having a power output of about 100 W to about 10 kW.

吹洗空氣供應部分14可被組配來將吹洗空氣供應至玻璃疊層板的切割部分以便移除可能由於雷射光束從玻璃疊層板160的切割部分上切割所產生的金屬熔化物、碎片、或毛刺。吹洗空氣供應部分14可經由連接至泵浦的空氣噴嘴將吹洗空氣供應至玻璃疊層板160的切割部分。The purge air supply part 14 may be configured to supply purge air to the cutting part of the glass laminate in order to remove the metal melt, which may be produced by the laser beam cutting from the cutting part of the glass laminate 160, Fragments, or burrs. The purge air supply part 14 may supply purge air to the cutting part of the glass laminate 160 via an air nozzle connected to a pump.

裝載台30可為玻璃板組件100及玻璃疊層板160安置在其上的工作台。裝載台30可包括複數個吸氣孔30H。吸氣孔30H可穿過裝載台30,並且在玻璃疊層板160的切割部分處產生的碎片或毛刺可穿過吸氣孔30H並且收集在裝載台30下方的收集容器(未展示)中。雖然在第1圖中示出吸氣孔30H呈吸氣孔30H在第一方向(D1方向)上延伸的多個線形式,但是裝載台30及吸氣孔30H的形狀不限於此。The loading table 30 may be a work table on which the glass plate assembly 100 and the glass laminated plate 160 are placed. The loading platform 30 may include a plurality of suction holes 30H. The suction hole 30H may pass through the loading table 30, and fragments or burrs generated at the cut portion of the glass laminate 160 may pass through the suction hole 30H and be collected in a collection container (not shown) below the loading table 30. Although it is shown in FIG. 1 that the suction hole 30H is in the form of a plurality of lines extending in the first direction (D1 direction) of the suction hole 30H, the shapes of the loading table 30 and the suction hole 30H are not limited to this.

可在玻璃疊層板160安裝於玻璃板組件100上的狀態下將玻璃板組件100放置在裝載台30上,並且可將雷射光束及吹洗空氣沿著目標切割線(未展示)連續地從雷射光束照射單元10供應至玻璃疊層板160以使得玻璃疊層板160的目標切割線得以切割。The glass plate assembly 100 can be placed on the loading table 30 with the glass laminated plate 160 mounted on the glass plate assembly 100, and the laser beam and blowing air can be continuously placed along the target cutting line (not shown) The laser beam irradiation unit 10 is supplied to the glass laminated plate 160 so that the target cutting line of the glass laminated plate 160 is cut.

玻璃板組件100可包括底板110、可撓性磁鐵120、及引導部分130。The glass plate assembly 100 may include a bottom plate 110, a flexible magnet 120, and a guiding part 130.

底板110可包括相反彼此的第一表面110F1及第二表面110F2。底板110可包括從第一表面110F1延伸至第二表面110F2並且穿過底板110的複數個狹槽110H。狹槽110H係藉由從底板110的第一表面110F1延伸至第二表面110F2的側壁110S來界定的空間,雷射光束及吹洗空氣可穿過狹槽110H,並且狹槽110H可與玻璃疊層板160上的目標切割線垂直地重疊。The bottom plate 110 may include a first surface 110F1 and a second surface 110F2 opposite to each other. The bottom plate 110 may include a plurality of slots 110H extending from the first surface 110F1 to the second surface 110F2 and passing through the bottom plate 110. The slot 110H is a space defined by the sidewall 110S extending from the first surface 110F1 of the bottom plate 110 to the second surface 110F2. The laser beam and the blowing air can pass through the slot 110H, and the slot 110H can overlap the glass The target cutting lines on the ply 160 overlap vertically.

在示例性實施例中,底板110可由例如金屬、木材、無機材料、有機材料、或其組合製成,但是本揭示案不限於此。例如,底板110可包括鋁、銅、鐵、鎳、或其組合。為了在將玻璃疊層板160安裝於底板110上並且將雷射光束及吹洗空氣供應至底板110及玻璃疊層板160上時確保機械穩定性,底板110可包括足夠穩固的材料。底板110可足夠重以便在供應吹洗空氣時不振動或移動,同時足夠輕型以便在反覆地裝載至裝載台30上並且從裝載台30上卸載時允許簡易操作。例如,底板110可具有約2 mm至約100 mm的厚度t11(參見第3圖),但是本揭示案不限於此。In an exemplary embodiment, the bottom plate 110 may be made of, for example, metal, wood, inorganic material, organic material, or a combination thereof, but the present disclosure is not limited thereto. For example, the bottom plate 110 may include aluminum, copper, iron, nickel, or a combination thereof. In order to ensure mechanical stability when the glass laminate 160 is mounted on the bottom plate 110 and the laser beam and the blowing air are supplied to the bottom plate 110 and the glass laminate 160, the bottom plate 110 may include a sufficiently stable material. The bottom plate 110 may be heavy enough not to vibrate or move when the purge air is supplied, and light enough to allow easy operation when repeatedly loaded on and unloaded from the loading table 30. For example, the bottom plate 110 may have a thickness t11 of about 2 mm to about 100 mm (see FIG. 3), but the present disclosure is not limited thereto.

可撓性磁鐵120可安置在底板110的第一表面110F1上。雖然未展示,但是可藉由使用黏著劑層(未展示)將可撓性磁鐵120附接至底板110的第一表面110F1。可撓性磁鐵120可包括複數個開口120H,並且可撓性磁鐵120的開口120H可相應地與底板110的狹槽110H連通。例如,在玻璃疊層板160的雷射切割期間,雷射光束及吹洗空氣可穿過可撓性磁鐵120的開口120H及底板110的狹槽110H。The flexible magnet 120 may be disposed on the first surface 110F1 of the bottom plate 110. Although not shown, the flexible magnet 120 can be attached to the first surface 110F1 of the bottom plate 110 by using an adhesive layer (not shown). The flexible magnet 120 may include a plurality of openings 120H, and the opening 120H of the flexible magnet 120 may communicate with the slot 110H of the bottom plate 110 accordingly. For example, during the laser cutting of the glass laminate 160, the laser beam and the blowing air can pass through the opening 120H of the flexible magnet 120 and the slot 110H of the bottom plate 110.

在示例性實施例中,可撓性磁鐵120可具有約100高斯至約3,000高斯的磁通量密度。因此,當玻璃疊層板160安裝於可撓性磁鐵120上時,玻璃疊層板160可藉由磁力固定至可撓性磁鐵120。在示例性實施例中,可撓性磁鐵120可具有約0.1 mm至約20 mm的厚度t12(參見第3圖),但是本揭示案不限於此。In an exemplary embodiment, the flexible magnet 120 may have a magnetic flux density of about 100 Gauss to about 3,000 Gauss. Therefore, when the glass laminate 160 is mounted on the flexible magnet 120, the glass laminate 160 can be fixed to the flexible magnet 120 by magnetic force. In an exemplary embodiment, the flexible magnet 120 may have a thickness t12 of about 0.1 mm to about 20 mm (see FIG. 3), but the present disclosure is not limited thereto.

引導部分130可在可撓性磁鐵120的一側經安置在底板110的第一表面110F1上並且在第一方向(D1方向)上延伸。在此處,第一方向(D1方向)表示與底板110的第一表面110F1的一邊緣平行的方向。如第1圖中示出,引導部分130可僅安置在底板110的邊緣上。在另一實施例中,引導部分130可安置在底板110的至少兩個邊緣上。引導部分130及底板110可整體地形成,但是本揭示案不限於此。The guide part 130 may be disposed on the first surface 110F1 of the bottom plate 110 on one side of the flexible magnet 120 and extend in the first direction (D1 direction). Here, the first direction (D1 direction) means a direction parallel to an edge of the first surface 110F1 of the bottom plate 110. As shown in FIG. 1, the guide portion 130 may only be disposed on the edge of the bottom plate 110. In another embodiment, the guide part 130 may be disposed on at least two edges of the bottom plate 110. The guide portion 130 and the bottom plate 110 may be integrally formed, but the present disclosure is not limited thereto.

相對於底板110的第一表面110F1,在垂直於第一表面110F1的第三方向(D3方向)上,引導部分130的上部表面可處於比可撓性磁鐵120的上部表面120U更高的水準處。當玻璃疊層板160安裝於玻璃板組件100上時,玻璃疊層板160的側向表面可與引導部分130接觸。因此,引導部分130可精確地調節玻璃疊層板160的安裝位置,並且在玻璃疊層板160的安裝過程中,操作容易性可藉由引導部分130來增強。Relative to the first surface 110F1 of the bottom plate 110, in the third direction (D3 direction) perpendicular to the first surface 110F1, the upper surface of the guide portion 130 may be at a higher level than the upper surface 120U of the flexible magnet 120 . When the glass laminate 160 is installed on the glass plate assembly 100, the lateral surface of the glass laminate 160 may contact the guide portion 130. Therefore, the guide part 130 can precisely adjust the installation position of the glass laminate 160, and the ease of operation can be enhanced by the guide part 130 during the installation process of the glass laminate 160.

如第2圖中示出,狹槽110H(及相應地與狹槽110H連通的開口120H)可在第一方向(D1方向)上、在相同距離下、彼此平行地間隔開。在平面圖中,每個狹槽110H的在第二方向(D2方向)上的寬度w11可在約2 mm至約20 mm範圍內。每個狹槽110H的在第二方向(D2方向)上的寬度w11可基於待切割的玻璃疊層板區段160P(參見第10圖)的尺寸、玻璃疊層板160的材料、雷射光束的功率、吹洗空氣的壓力、及其類似因素來適當地選擇。例如,當每個狹槽110H的寬度w11小於約2 mm時,玻璃疊層板160的金屬熔化物、碎片、或毛刺變得附接至狹槽110H的內部,並且由此可能堵塞狹槽110H,或每個狹槽110H的寬度w11小於注射至玻璃疊層板160上的吹洗空氣流的直徑以致於發生玻璃疊層板160的不當移動或振動。當每個狹槽110H的寬度w11大於約20 mm時,玻璃疊層板160的不被玻璃板組件100支撐的部分的面積增加,並且因此,可由於雷射光束照射或吹洗空氣注射而導致發生玻璃疊層板160的不當移動或振動。As shown in Figure 2, the slots 110H (and corresponding openings 120H communicating with the slots 110H) may be spaced parallel to each other at the same distance in the first direction (D1 direction). In a plan view, the width w11 of each slot 110H in the second direction (D2 direction) may range from about 2 mm to about 20 mm. The width w11 of each slot 110H in the second direction (D2 direction) may be based on the size of the glass laminate section 160P (see FIG. 10) to be cut, the material of the glass laminate 160, the laser beam The power, the pressure of the purge air, and the like are appropriately selected. For example, when the width w11 of each slot 110H is less than about 2 mm, metal melts, fragments, or burrs of the glass laminate 160 become attached to the inside of the slot 110H, and thus may block the slot 110H , Or the width w11 of each slot 110H is smaller than the diameter of the purge air flow injected onto the glass laminate 160 so that improper movement or vibration of the glass laminate 160 occurs. When the width w11 of each slot 110H is greater than about 20 mm, the area of the portion of the glass laminate 160 that is not supported by the glass plate assembly 100 increases, and therefore, it may be caused by laser beam irradiation or blowing air injection Improper movement or vibration of the glass laminate 160 occurs.

在平面圖中,複數個狹槽110H的兩個相鄰狹槽110H之間的第一距離d11可根據待切割的玻璃疊層板區段160P(參見第10圖)的目標尺寸來確定。例如,當生產具有水平寬度大於垂直寬度的長方形或條棒形狀的玻璃疊層板區段160P時,狹槽110H之間的第一距離d11可對應於所需玻璃疊層板區段160P的垂直寬度。亦即,狹槽110H之間的第一距離d11及狹槽110H的數目可根據玻璃疊層板區段160P的目標垂直寬度來確定。In a plan view, the first distance d11 between two adjacent slots 110H of the plurality of slots 110H may be determined according to the target size of the glass laminate section 160P (see FIG. 10) to be cut. For example, when producing a rectangular or bar-shaped glass laminate section 160P with a horizontal width greater than a vertical width, the first distance d11 between the slots 110H may correspond to the vertical of the desired glass laminate section 160P width. That is, the first distance d11 between the slots 110H and the number of the slots 110H can be determined according to the target vertical width of the glass laminate section 160P.

如第4圖中示出,玻璃疊層板160可包括金屬薄板162、黏著劑層164、及玻璃層166。黏著劑層164可佈置在玻璃層166與金屬薄板162之間以使得玻璃層166的底部表面面對金屬薄板162的上部表面。玻璃疊層板160可包括彼此相反的第一主要表面160F1及第二主要表面160F2,玻璃疊層板160的第一主要表面160F1對應於與玻璃層166的底部表面相反的玻璃層166的上部表面,並且玻璃疊層板160的第二主要表面160F2可對應於與金屬薄板162的上部表面相反的金屬薄板162的底部表面。在其他實施例中,可省去黏著劑層164,並且玻璃層166可直接黏附至金屬薄板162上。As shown in FIG. 4, the glass laminate 160 may include a metal thin plate 162, an adhesive layer 164, and a glass layer 166. The adhesive layer 164 may be arranged between the glass layer 166 and the metal thin plate 162 such that the bottom surface of the glass layer 166 faces the upper surface of the metal thin plate 162. The glass laminate 160 may include a first major surface 160F1 and a second major surface 160F2 opposite to each other. The first major surface 160F1 of the glass laminate 160 corresponds to the upper surface of the glass layer 166 opposite to the bottom surface of the glass layer 166 , And the second main surface 160F2 of the glass laminate 160 may correspond to the bottom surface of the metal thin plate 162 opposite to the upper surface of the metal thin plate 162. In other embodiments, the adhesive layer 164 may be omitted, and the glass layer 166 may be directly adhered to the thin metal plate 162.

金屬薄板162可包括鋼、不銹鋼、鎳、鈷、或包括其中之至少一者的金屬合金。金屬薄板162可包括鐵磁材料,並且因此金屬薄板162可藉由磁力固定至可撓性磁鐵120上。在示例性實施例中,金屬薄板162可具有約0.1 mm至約5 mm的厚度t21。更具體而言,金屬薄板162的厚度t21可在約0.2 mm與約3 mm之間。The thin metal plate 162 may include steel, stainless steel, nickel, cobalt, or a metal alloy including at least one of them. The thin metal plate 162 may include a ferromagnetic material, and thus the thin metal plate 162 may be fixed to the flexible magnet 120 by magnetic force. In an exemplary embodiment, the metal thin plate 162 may have a thickness t21 of about 0.1 mm to about 5 mm. More specifically, the thickness t21 of the metal thin plate 162 may be between about 0.2 mm and about 3 mm.

玻璃層166可由玻璃、陶瓷、玻璃-陶瓷、或其組合形成。玻璃層166可包括例如硼矽酸鹽、鋁矽酸鹽、硼鋁矽酸鹽、鹼金屬硼矽酸鹽、鹼金屬鋁矽酸鹽、鹼金屬硼鋁矽酸鹽、鹼石灰、或其組合,但是本揭示案不限於此。例如,玻璃層166可為在Corning® Willow®玻璃(Corning Incorporated, Corning, New York, USA)的產品名稱下的市售可撓性玻璃或在Corning® Gorilla®玻璃(Corning Incorporated, Corning, New York, USA)的產品名稱下的市售化學強化玻璃。例如,玻璃層166可使用模製過程來形成,諸如下拉過程諸如熔融拉製過程或狹槽拉製過程、浮法過程、上拉過程、或滾壓過程。在示例性實施例中,玻璃層166可具有約0.1 mm至約2.0 mm的厚度t22。更具體而言,玻璃層166的厚度t22可在約0.15 mm與約1.5 mm之間。The glass layer 166 may be formed of glass, ceramic, glass-ceramic, or a combination thereof. The glass layer 166 may include, for example, borosilicate, aluminosilicate, boroaluminosilicate, alkali metal borosilicate, alkali metal aluminosilicate, alkali metal boroaluminosilicate, soda lime, or a combination thereof , But this disclosure is not limited to this. For example, the glass layer 166 may be a commercially available flexible glass under the product name of Corning® Willow® glass (Corning Incorporated, Corning, New York, USA) or a commercially available flexible glass in Corning® Gorilla® glass (Corning Incorporated, Corning, New York, USA). , USA) commercially available chemically strengthened glass under the product name. For example, the glass layer 166 may be formed using a molding process, such as a down-drawing process such as a fusion-drawing process or a slot-drawing process, a float process, a pull-up process, or a rolling process. In an exemplary embodiment, the glass layer 166 may have a thickness t22 of about 0.1 mm to about 2.0 mm. More specifically, the thickness t22 of the glass layer 166 may be between about 0.15 mm and about 1.5 mm.

黏著劑層164可將玻璃層166連接至金屬薄板162,並且可例如由壓敏黏著劑(pressure sensitive adhesive;PSA)或光學透明黏著劑(optically clear adhesive;OCA)形成,但是本揭示案不限於此。The adhesive layer 164 may connect the glass layer 166 to the metal sheet 162, and may be formed of, for example, a pressure sensitive adhesive (PSA) or an optically clear adhesive (OCA), but the present disclosure is not limited to this.

由於金屬薄板162經由玻璃疊層板160的第二主要表面160F2暴露,因此在將玻璃疊層板160安裝於玻璃板組件100上時,金屬薄板162可被安置成與可撓性磁鐵120的上部表面120U接觸。在此方面,金屬薄板162可藉由磁力來穩固地固定在可撓性磁鐵120上。另外,當藉由在狹槽110H延伸的方向上照射雷射光束並且供應吹洗空氣來執行玻璃疊層板160的切割過程時,已經切割並且從玻璃疊層板160上分離的玻璃疊層板區段160P(參見第10圖)可藉由磁力來固定並且保持在可撓性磁鐵120的上部表面120U上。因此,可在玻璃疊層板160的切割過程中防止切割不均勻性或切割缺陷的發生,並且玻璃疊層板區段160P可表現出極好的切割橫截面品質。Since the thin metal plate 162 is exposed through the second main surface 160F2 of the glass laminated plate 160, when the glass laminated plate 160 is mounted on the glass plate assembly 100, the thin metal plate 162 can be placed on top of the flexible magnet 120. The surface 120U is in contact. In this regard, the thin metal plate 162 can be firmly fixed on the flexible magnet 120 by magnetic force. In addition, when the cutting process of the glass laminate 160 is performed by irradiating the laser beam in the direction in which the slot 110H extends and supplying purge air, the glass laminate 160 that has been cut and separated from the glass laminate 160 The section 160P (see FIG. 10) can be fixed and held on the upper surface 120U of the flexible magnet 120 by magnetic force. Therefore, the occurrence of cutting unevenness or cutting defects can be prevented during the cutting process of the glass laminated plate 160, and the glass laminated plate section 160P can exhibit excellent cutting cross-sectional quality.

第5圖係示出根據其他示例性實施例的玻璃板組件100A的橫截面視圖。第5圖係沿著第2圖的線III-III’獲得的截面圖。Fig. 5 shows a cross-sectional view of a glass plate assembly 100A according to other exemplary embodiments. Fig. 5 is a cross-sectional view taken along the line III-III' of Fig. 2.

參考第5圖,底板110A可包括界定複數個狹槽110HA的複數個側壁110SA,並且每個側壁110SA可包括梯級部分112。各狹槽110HA可在與底板110A的第二表面110F2相鄰的區域中、藉由梯級部分112在橫向方向上延伸。例如,每個狹槽110HA可在與底板110A的第一表面110F1相同的水準處具有第一寬度w11a,並且可在與底板110A的第二表面110F2相同的水準處具有大於第一寬度w11a的第二寬度w12a。每個狹槽110HA的在第二方向(D2方向)上的第一寬度w11a可在約2 mm至約20 mm範圍內,並且每個狹槽110HA的在第二方向(D2方向)上的第二寬度w12a可在約3 mm至約40 mm範圍內。Referring to FIG. 5, the bottom plate 110A may include a plurality of side walls 110SA defining a plurality of slots 110HA, and each side wall 110SA may include a step portion 112. Each slot 110HA may extend in the lateral direction by the step portion 112 in an area adjacent to the second surface 110F2 of the bottom plate 110A. For example, each slot 110HA may have a first width w11a at the same level as the first surface 110F1 of the bottom plate 110A, and may have a first width w11a greater than the first width w11a at the same level as the second surface 110F2 of the bottom plate 110A. Two width w12a. The first width w11a of each slot 110HA in the second direction (D2 direction) may range from about 2 mm to about 20 mm, and the first width w11a of each slot 110HA in the second direction (D2 direction) The second width w12a may be in the range of about 3 mm to about 40 mm.

根據上述實施例,因為每個狹槽110HA的第二寬度w12a大於第一寬度w11a,所以在玻璃疊層板160的切割過程中雷射光束照射的部分中所產生的金屬熔化物、碎片、或毛刺可不附接至狹槽110HA的側壁或可不堵塞狹槽110HA,並且可藉由吹洗空氣來容易地轉移至裝載台30的吸氣孔30H。According to the above-mentioned embodiment, since the second width w12a of each slot 110HA is greater than the first width w11a, the metal melt, fragments, or metal melt generated in the portion irradiated by the laser beam during the cutting process of the glass laminate 160 The burr may not be attached to the side wall of the slot 110HA or may not block the slot 110HA, and can be easily transferred to the suction hole 30H of the loading table 30 by blowing air.

第6圖係示出根據其他示例性實施例的玻璃板組件的橫截面視圖;第6圖係沿著第2圖的線III-III’獲得的截面圖。Fig. 6 is a cross-sectional view showing a glass plate assembly according to other exemplary embodiments; Fig. 6 is a cross-sectional view taken along the line III-III' of Fig. 2.

參考第6圖,底板110B可包括複數個狹槽110HB,並且每個狹槽110HB可包括傾斜並且在第一方向(D1方向)上延伸的一對側壁110SB。該對側壁110SB可相對於底板110B的第一表面110F1、在相互相反的傾斜角度下傾斜。例如,歸因於在相互相反的傾斜角度下傾斜的該對側壁110SB,每個狹槽110HB可在與底板110B的第二表面110F2相鄰的區域中、在橫向方向上延伸。例如,每個狹槽110HB可在與底板110B的第一表面110F1相同的水準處具有第一寬度w11b,並且可在與底板110B的第二表面110F2相同的水準處具有大於第一寬度w11b的第二寬度w12b。每個狹槽110HB的在第二方向(D2方向)上的第一寬度w11b可在約2 mm至約20 mm範圍內,並且每個狹槽110HB的在第二方向(D2方向)上的第二寬度w12b可在約3 mm至約40 mm範圍內。Referring to FIG. 6, the bottom plate 110B may include a plurality of slots 110HB, and each slot 110HB may include a pair of side walls 110SB that are inclined and extend in the first direction (D1 direction). The pair of side walls 110SB may be inclined at opposite inclination angles relative to the first surface 110F1 of the bottom plate 110B. For example, due to the pair of side walls 110SB inclined at mutually opposite inclination angles, each slot 110HB may extend in the lateral direction in an area adjacent to the second surface 110F2 of the bottom plate 110B. For example, each slot 110HB may have a first width w11b at the same level as the first surface 110F1 of the bottom plate 110B, and may have a first width w11b greater than the first width w11b at the same level as the second surface 110F2 of the bottom plate 110B. Two width w12b. The first width w11b of each slot 110HB in the second direction (D2 direction) may range from about 2 mm to about 20 mm, and the first width w11b of each slot 110HB in the second direction (D2 direction) The second width w12b may be in the range of about 3 mm to about 40 mm.

根據上述實施例,因為每個狹槽110HB的第二寬度w12b大於第一寬度w11b,所以在玻璃疊層板160的切割過程中雷射光束照射的部分中所產生的金屬熔化物、碎片、或毛刺可不附接至狹槽110HB的側壁或可不堵塞狹槽110HB,並且可藉由吹洗空氣來容易地轉移至裝載台30的吸氣孔30H。According to the above-mentioned embodiment, since the second width w12b of each slot 110HB is greater than the first width w11b, the metal melt, fragments, or metal melt generated in the portion irradiated by the laser beam during the cutting process of the glass laminate 160 The burr may not be attached to the side wall of the slot 110HB or may not block the slot 110HB, and can be easily transferred to the suction hole 30H of the loading table 30 by blowing air.

第7圖係示出根據其他示例性實施例的玻璃板組件的平面圖;第8A圖及第8B圖係沿著第7圖的線XIII-XIII’獲得的橫截面視圖。Fig. 7 is a plan view showing a glass plate assembly according to other exemplary embodiments; Figs. 8A and 8B are cross-sectional views taken along the line XIII-XIII' of Fig. 7.

參考第7圖、第8A圖、及第8B圖,底板110C可包括一對第一狹槽110HC1及一對第二狹槽110HC2。該對第一狹槽110HC1可在第一方向(D1方向)上平行延伸,並且該對第二狹槽110HC2可在第二方向(D2方向)上平行延伸。該對第二狹槽110HC2中的每一個及該對第一狹槽110HC1中的每一個可在相交區域110HX處相交。Referring to FIG. 7, FIG. 8A, and FIG. 8B, the bottom plate 110C may include a pair of first slots 110HC1 and a pair of second slots 110HC2. The pair of first slots 110HC1 may extend in parallel in the first direction (D1 direction), and the pair of second slots 110HC2 may extend in parallel in the second direction (D2 direction). Each of the pair of second slots 110HC2 and each of the pair of first slots 110HC1 may intersect at the intersection area 110HX.

因為該對第二狹槽110HC2與該對第一狹槽110HC1相交,所以玻璃板組件100C可包括中心部分100C1及外部周向部分100C2。例如,當在平面圖中檢視時,中心部分100C1可藉由該對第一狹槽110HC1及該對第二狹槽110HC2包圍,並且外部周向部分100C2可圍繞在該對第一狹槽110HC1與該對第二狹槽110HC2之間的中心部分100C1來定位。例如,外部周向部分100C2可包括引導部分130及底板110C的最外層邊緣。中心部分100C1可與外部周向部分100C2間隔開,並且該對第一狹槽110HC1及該對第二狹槽110HC2可在中心部分100C1與外部周向部分100C2之間界定。Because the pair of second slots 110HC2 intersect the pair of first slots 110HC1, the glass plate assembly 100C may include a central portion 100C1 and an outer circumferential portion 100C2. For example, when viewed in a plan view, the central portion 100C1 can be surrounded by the pair of first slots 110HC1 and the pair of second slots 110HC2, and the outer circumferential portion 100C2 can surround the pair of first slots 110HC1 and the pair of slots 110HC1. Position the central part 100C1 between the second slots 110HC2. For example, the outer circumferential portion 100C2 may include the guide portion 130 and the outermost edge of the bottom plate 110C. The central portion 100C1 may be spaced apart from the outer circumferential portion 100C2, and the pair of first slots 110HC1 and the pair of second slots 110HC2 may be defined between the central portion 100C1 and the outer circumferential portion 100C2.

在示例性實施例中,如第8A圖中示出,中心部分100C1及外部周向部分100C2可彼此分離並且各自獨立地裝載至裝載台30上或從裝載台30上卸載。在此方面,中心部分100C1與外部周向部分100C2之間的在第二方向(D2方向)上的分隔距離w21(或該對第一狹槽110HC1的在第二方向(D2方向)上的寬度)可在約2 mm至約20 mm範圍內。In an exemplary embodiment, as shown in FIG. 8A, the central portion 100C1 and the outer circumferential portion 100C2 may be separated from each other and be independently loaded onto or unloaded from the loading platform 30. In this regard, the separation distance w21 in the second direction (D2 direction) between the central portion 100C1 and the outer circumferential portion 100C2 (or the width of the pair of first slots 110HC1 in the second direction (D2 direction) ) Can be in the range of about 2 mm to about 20 mm.

在其他實施例中,如第8B圖中示出,中心部分100C1可經由附接至玻璃板組件100C的底部表面(或底板110C的第二表面110F2)的金屬橋140來連接至外部周向部分100C2。在此情況下,該對第一狹槽110HC1及該對第二狹槽110HC2可安置在固定位置處,並且該對第一狹槽110HC1及該對第二狹槽110HC2中的每一個的寬度可不改變。同時,為了使該對第一狹槽110HC1及該對第二狹槽110HC2的位置固定,亦可使用其他任意緊固構件來代替第8B圖中示出的金屬橋140。In other embodiments, as shown in Figure 8B, the central portion 100C1 may be connected to the outer circumferential portion via a metal bridge 140 attached to the bottom surface of the glass plate assembly 100C (or the second surface 110F2 of the bottom plate 110C) 100C2. In this case, the pair of first slots 110HC1 and the pair of second slots 110HC2 may be placed at fixed positions, and the width of each of the pair of first slots 110HC1 and the pair of second slots 110HC2 may not be change. At the same time, in order to fix the positions of the pair of first slots 110HC1 and the pair of second slots 110HC2, any other fastening members may be used instead of the metal bridge 140 shown in FIG. 8B.

在示例性實施例中,該對第一狹槽110HC1及該對第二狹槽110HC2的相對位置可根據待切割的玻璃疊層板區段160P(參見第圖10)的目標尺寸來確定。例如,待切割的玻璃疊層板區段160P的在第二方向(D2方向)上的水平寬度可對應於該對第一狹槽110HC1之間的第一距離d21,並且待切割的玻璃疊層板區段160P的在第一方向(D1方向)上的垂直寬度可對應於該對第二狹槽110HC2之間的第二距離d22。In an exemplary embodiment, the relative positions of the pair of first slots 110HC1 and the pair of second slots 110HC2 may be determined according to the target size of the glass laminate section 160P (see FIG. 10) to be cut. For example, the horizontal width of the glass laminate section 160P to be cut in the second direction (D2 direction) may correspond to the first distance d21 between the pair of first slots 110HC1, and the glass laminate to be cut The vertical width of the plate section 160P in the first direction (D1 direction) may correspond to the second distance d22 between the pair of second slots 110HC2.

第9圖係示出根據實施例的生產玻璃疊層板的方法的流程圖。第10圖係示出第9圖的生產玻璃疊層板的方法的吹洗空氣供應操作(操作S240)的示意性橫截面視圖。Fig. 9 is a flowchart showing a method of producing a glass laminate according to an embodiment. Fig. 10 is a schematic cross-sectional view showing the purge air supply operation (operation S240) of the method of producing a glass laminate of Fig. 9.

藉由使用包含根據第1圖至第8B圖示出的示例性實施例的玻璃板組件100、100A、100B、或100C的用於生產玻璃疊層板的裝置1來生產玻璃疊層板的方法參考第9圖及第10圖來描述。例如,生產玻璃疊層板的方法可為藉由使用裝置1來切割玻璃疊層板160而形成玻璃疊層板區段160P的方法。在第10圖中,示出藉由使用玻璃板組件100A來生產玻璃疊層板的方法。A method for producing a glass laminate by using the apparatus 1 for producing a glass laminate including the glass plate assembly 100, 100A, 100B, or 100C according to the exemplary embodiment shown in FIG. 1 to FIG. 8B Refer to Figure 9 and Figure 10 for description. For example, the method of producing the glass laminate may be a method of forming the glass laminate section 160P by cutting the glass laminate 160 using the apparatus 1. In Fig. 10, a method of producing a glass laminate by using the glass plate assembly 100A is shown.

首先,可將包括含有至少一個狹槽110HA的底板110A、可撓性磁鐵120、及引導部分130的玻璃板組件100A安置在裝載台30上(操作S210)。First, the glass plate assembly 100A including the bottom plate 110A including at least one slot 110HA, the flexible magnet 120, and the guide portion 130 may be placed on the loading platform 30 (operation S210).

在示例性實施例中,可將玻璃板組件100A安裝在裝載台30上以使得玻璃板組件100A的至少一個狹槽110HA與裝載台30的複數個吸氣孔30H垂直地重疊。例如,可將玻璃板組件100A安裝在裝載台30上以使得裝載台30的上部表面不被至少一個狹槽110HA暴露。當裝載台30的上部表面被至少一個狹槽110HA暴露時,在後續過程中照射至玻璃板組件100A上的雷射光束可能使裝載台30部分地損壞。In an exemplary embodiment, the glass plate assembly 100A may be installed on the loading table 30 so that at least one slot 110HA of the glass plate assembly 100A and the plurality of suction holes 30H of the loading table 30 vertically overlap. For example, the glass plate assembly 100A may be installed on the loading table 30 so that the upper surface of the loading table 30 is not exposed by the at least one slot 110HA. When the upper surface of the loading table 30 is exposed by the at least one slot 110HA, the laser beam irradiated to the glass plate assembly 100A in the subsequent process may partially damage the loading table 30.

隨後,可將玻璃疊層板160安置在玻璃板組件100A上以使得玻璃疊層板160的邊緣160E與引導部分130接觸並且藉由磁力而固定至可撓性磁鐵120(操作S220)。Subsequently, the glass laminate 160 may be placed on the glass plate assembly 100A so that the edge 160E of the glass laminate 160 is in contact with the guide portion 130 and fixed to the flexible magnet 120 by magnetic force (operation S220).

在示例性實施例中,如上參考第4圖所述,玻璃疊層板160可為板形結構,其中金屬薄板162及玻璃層166藉由黏著劑層164來彼此附接。玻璃疊層板160的金屬薄板162可包括鋼、不銹鋼、鎳、鈷、或包括其中之至少一者的金屬合金,並且因此,金屬薄板162可藉由磁力而穩固地附接至可撓性磁鐵120。In an exemplary embodiment, as described above with reference to FIG. 4, the glass laminate 160 may have a plate-shaped structure, in which the metal thin plate 162 and the glass layer 166 are attached to each other by the adhesive layer 164. The metal thin plate 162 of the glass laminate 160 may include steel, stainless steel, nickel, cobalt, or a metal alloy including at least one of them, and therefore, the metal thin plate 162 may be firmly attached to the flexible magnet by magnetic force 120.

在示例性實施例中,引導部分130在第一方向(D1方向)上、在底板110A的第一表面110F1上延伸,並且引導部分130的上部表面處於比可撓性磁鐵120的上部表面更高的水準。因此,在將玻璃疊層板160安裝在玻璃板組件100A上以使得玻璃疊層板160的邊緣160E與引導部分130接觸的過程中,可防止玻璃疊層板160的未對準或類似問題。In an exemplary embodiment, the guide portion 130 extends in the first direction (D1 direction) on the first surface 110F1 of the bottom plate 110A, and the upper surface of the guide portion 130 is higher than the upper surface of the flexible magnet 120. Level. Therefore, in the process of mounting the glass laminate 160 on the glass plate assembly 100A so that the edge 160E of the glass laminate 160 is in contact with the guide portion 130, misalignment of the glass laminate 160 or the like can be prevented.

隨後,雷射光束可在至少一個狹槽110HA延伸的方向上進行照射,從而切割玻璃疊層板160(操作S230)。Subsequently, the laser beam may be irradiated in the direction in which the at least one slot 110HA extends, thereby cutting the glass laminate 160 (operation S230).

在示例性實施例中,雷射光束照射單元10(參看第1圖)可連接至位置移動控制單元20(參看第1圖),並且可被組配來沿著玻璃疊層板160的預定目標切割線(未展示)移動。雷射光束照射單元10可包括雷射照射部分12(參看第1圖)及吹洗空氣供應部分14。In an exemplary embodiment, the laser beam irradiation unit 10 (see Figure 1) can be connected to the position movement control unit 20 (see Figure 1), and can be configured to follow a predetermined target of the glass laminate 160 The cutting line (not shown) moves. The laser beam irradiation unit 10 may include a laser irradiation part 12 (refer to FIG. 1) and a purge air supply part 14.

在示例性實施例中,雷射光束可從雷射照射部分12發射至玻璃疊層板160的目標切割位置以使得玻璃疊層板160例如金屬薄板162的至少一部分可得以熔化。例如,藉由雷射光束產生的熱量可局部集中在玻璃疊層板160的已經用雷射光束照射的目標切割位置,並且因此,金屬薄板162可得以熔化及切割。另外,在玻璃疊層板160的目標切割位置的再冷卻期間,可在玻璃層166中局部地產生應力,並且因此,玻璃層166可藉由所產生應力的傳輸或擴散而得以切割。In an exemplary embodiment, the laser beam may be emitted from the laser irradiation part 12 to the target cutting position of the glass laminate 160 so that at least a part of the glass laminate 160, such as the metal thin plate 162, may be melted. For example, the heat generated by the laser beam can be locally concentrated on the target cutting position of the glass laminate 160 that has been irradiated with the laser beam, and therefore, the thin metal plate 162 can be melted and cut. In addition, during the re-cooling of the target cutting position of the glass laminate 160, stress may be locally generated in the glass layer 166, and therefore, the glass layer 166 may be cut by the transmission or diffusion of the generated stress.

隨後,可將吹洗空氣供應至玻璃疊層板160以便將切割玻璃疊層板160的碎片168R傳遞至裝載台30的吸氣孔30H(操作S240)。Subsequently, purge air may be supplied to the glass laminate 160 so as to transfer the fragments 168R of the cut glass laminate 160 to the suction holes 30H of the loading table 30 (operation S240).

在示例性實施例中,吹洗空氣可從雷射光束照射單元10的吹洗空氣供應部分14注射至吸氣孔30H中。吹洗空氣流藉由第10圖中的點線箭頭來示意性地示出。In an exemplary embodiment, the purge air may be injected from the purge air supply part 14 of the laser beam irradiation unit 10 into the suction hole 30H. The purge air flow is schematically shown by the dotted arrow in Figure 10.

在示例性實施例中,吹洗空氣供應操作可在雷射光束照射操作之後執行。在其他實施例中,雷射照射部分12可在沿著目標切割線連續移動的同時將雷射光束連續發射至玻璃疊層板160上,並且吹洗空氣供應部分14可在雷射照射部分12之後、沿著目標切割線連續移動的同時將吹洗空氣注射至雷射光束照射玻璃疊層板160的部分。In an exemplary embodiment, the purge air supply operation may be performed after the laser beam irradiation operation. In other embodiments, the laser irradiation part 12 may continuously emit the laser beam onto the glass laminate 160 while continuously moving along the target cutting line, and the purge air supply part 14 may be in the laser irradiation part 12 After that, while continuously moving along the target cutting line, purge air is injected into the part where the laser beam irradiates the glass laminate 160.

在吹洗空氣供應操作中,玻璃疊層板160的已經用雷射光束照射的部分可加以冷卻以便在玻璃層166中局部地產生應力,由此誘導或促進切割玻璃層166。另外,藉由吹洗空氣供應操作的切割玻璃疊層板160的碎片168R(或玻璃疊層板160的金屬熔化物或毛刺)可轉移至吸氣孔30H中。由於玻璃疊層板160藉由磁力來穩固地附接至玻璃板組件100A,因此可防止玻璃疊層板160的不當移動或振動,即使當吹洗空氣在相對高壓力下注射時亦如此。In the purge air supply operation, the portion of the glass laminate 160 that has been irradiated with the laser beam may be cooled to locally generate stress in the glass layer 166, thereby inducing or facilitating the cutting of the glass layer 166. In addition, the fragments 168R of the cut glass laminate 160 (or the metal melt or burrs of the glass laminate 160) by the purge air supply operation can be transferred to the suction hole 30H. Since the glass laminate 160 is firmly attached to the glass plate assembly 100A by magnetic force, improper movement or vibration of the glass laminate 160 can be prevented even when the purge air is injected under a relatively high pressure.

可執行上述操作,以便由此完成玻璃疊層板區段160P從玻璃疊層板160的生產。在將玻璃疊層板160切割成複數個玻璃疊層板區段160P的情況下,因為已經切割的玻璃疊層板區段160P在玻璃板組件100A上保持在藉由磁力而與其固定的狀態下,所以由於注射吹洗空氣而導致的玻璃疊層板區段160P的移動或振動可得以防止。The above-mentioned operations may be performed to thereby complete the production of the glass laminate section 160P from the glass laminate 160. In the case of cutting the glass laminate 160 into a plurality of glass laminate sections 160P, the cut glass laminate section 160P is held on the glass plate assembly 100A in a state of being fixed to it by magnetic force Therefore, the movement or vibration of the glass laminate section 160P due to the injection of the purge air can be prevented.

隨後,可卸載玻璃疊層板區段160P,並且可將另一個玻璃疊層板160安置在玻璃板組件100A上並且可在其上反覆地執行切割過程(亦即,操作S220至S240可反覆地執行)。因此,可重新使用玻璃板組件100A,此舉為節約的。Subsequently, the glass laminate section 160P may be unloaded, and another glass laminate 160 may be placed on the glass plate assembly 100A and the cutting process may be repeatedly performed thereon (that is, operations S220 to S240 may be repeated carried out). Therefore, the glass plate assembly 100A can be reused, which is economical.

根據上述生產方法,因為玻璃疊層板160藉由可撓性磁鐵120的磁力而穩固地及臨時地固定至玻璃板組件100A上,所以玻璃疊層板160不可移動或振動,即使在雷射照射之後,在相對高壓力下注射吹洗空氣時亦如此。因此,可防止玻璃疊層板160的切割位置偏離、切割缺陷、或類似問題的發生。另外,因為玻璃疊層板160可藉由連續地執行雷射照射操作及吹洗空氣供應操作來切割,所以玻璃疊層板區段160P可具有極好的切割橫截面品質。According to the above production method, because the glass laminate 160 is firmly and temporarily fixed to the glass plate assembly 100A by the magnetic force of the flexible magnet 120, the glass laminate 160 cannot move or vibrate, even under laser irradiation. After that, the same is true when injecting purge air under relatively high pressure. Therefore, it is possible to prevent the occurrence of deviation of the cutting position of the glass laminate 160, cutting defects, or the like. In addition, because the glass laminate 160 can be cut by continuously performing the laser irradiation operation and the blowing air supply operation, the glass laminate section 160P may have excellent cutting cross-sectional quality.

應瞭解本文所述實施例應僅以描述性含義來考量並且並非出於限制目的。每個實施例內的特徵或態樣的描述通常被視為可用於在其他實施例中的其他類似特徵或態樣。It should be understood that the embodiments described herein should only be considered in a descriptive sense and not for the purpose of limitation. The description of the features or aspects within each embodiment is generally considered to be applicable to other similar features or aspects in other embodiments.

雖然一或多個實施例已參考附圖來描述,但是普通熟習此項技術者應瞭解可在其中產生形式及細節的各種變化而不脫離如以下請求項中定義的本揭示案的精神及範疇。Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art should understand that various changes in form and details can be produced therein without departing from the spirit and scope of the present disclosure as defined in the following claims .

1:裝置 10:雷射光束照射單元 12:雷射照射部分 14:吹洗空氣供應部分 20:位置移動控制單元 30:裝載台 30H:吸氣孔 100:玻璃板組件 100A:玻璃板組件 100C:玻璃板組件 100C1:中心部分 100C2:外部周向部分 110:底板 110A:底板 110B:底板 110C:底板 110H:狹槽 110HA:狹槽 110HB:狹槽 110HC1:第一狹槽 110HC2:第二狹槽 110HX:相交區域 110SA:側壁 110SB:側壁 110F1:第一表面 110F2:第二表面 110S:側壁 112:梯級部分 120:可撓性磁鐵 120H:開口 120U:上部表面 130:引導部分 140金屬橋 160:玻璃疊層板 160F1:第一主要表面 160F2:第二主要表面 160P:玻璃疊層板區段 162:金屬薄板 164:黏著劑層 166:玻璃層 168R:碎片 D1:方向 D2:方向 D3:方向 t11:厚度 t12:厚度 t21:厚度 t22:厚度 w11:寬度 w11a:第一寬度 w11b:第一寬度 w12a:第二寬度 w12b:第二寬度 w21:分隔距離 d11:距離 d21:第一距離 d22:第二距離 III-III’:線 S210:操作 S220:操作 S230:操作 S240:操作1: device 10: Laser beam irradiation unit 12: Laser irradiation part 14: Purge air supply part 20: Position movement control unit 30: loading platform 30H: Suction hole 100: glass plate assembly 100A: Glass plate assembly 100C: Glass plate assembly 100C1: central part 100C2: Outer circumferential part 110: bottom plate 110A: bottom plate 110B: bottom plate 110C: bottom plate 110H: Slot 110HA: Slot 110HB: Slot 110HC1: first slot 110HC2: second slot 110HX: Intersecting area 110SA: side wall 110SB: side wall 110F1: First surface 110F2: second surface 110S: side wall 112: Step section 120: Flexible magnet 120H: opening 120U: upper surface 130: boot part 140 metal bridge 160: glass laminated board 160F1: the first major surface 160F2: second major surface 160P: Glass laminated board section 162: Sheet metal 164: Adhesive layer 166: glass layer 168R: Fragment D1: direction D2: Direction D3: Direction t11: thickness t12: thickness t21: thickness t22: thickness w11: width w11a: first width w11b: first width w12a: second width w12b: second width w21: separation distance d11: distance d21: first distance d22: second distance III-III’: Line S210: Operation S220: Operation S230: Operation S240: Operation

根據以下結合附圖進行的實施例的描述,此等及/或其他態樣變得顯而易知並且更容易理解:According to the following description of the embodiments in conjunction with the accompanying drawings, these and/or other aspects become obvious and easier to understand:

第1圖係示出根據實施例的用於生產玻璃疊層板的裝置的示意圖;Figure 1 is a schematic diagram showing an apparatus for producing glass laminates according to an embodiment;

第2圖係示出根據實施例的玻璃板組件的平面圖;Figure 2 is a plan view showing the glass plate assembly according to the embodiment;

第3圖係沿著第2圖的線III-III’獲得的截面圖;Figure 3 is a cross-sectional view taken along the line III-III' of Figure 2;

第4圖係示出根據藉由使用根據實施例的用於生產玻璃疊層板的裝置來生產根據實施例的玻璃疊層板的方法而生產的玻璃疊層板的橫截面視圖;Figure 4 is a cross-sectional view showing a glass laminate produced according to a method of producing a glass laminate according to an embodiment by using the apparatus for producing a glass laminate according to an embodiment;

第5圖係示出根據其他示例性實施例的玻璃板組件的橫截面視圖;Figure 5 shows a cross-sectional view of a glass plate assembly according to other exemplary embodiments;

第6圖係示出根據其他示例性實施例的玻璃板組件的橫截面視圖;Figure 6 shows a cross-sectional view of a glass plate assembly according to other exemplary embodiments;

第7圖係示出根據其他示例性實施例的玻璃板組件的平面圖;Figure 7 is a plan view showing a glass plate assembly according to other exemplary embodiments;

第8A圖及第8B圖係沿著第7圖的線XIII-XIII’獲得的橫截面視圖;Figures 8A and 8B are cross-sectional views taken along the line XIII-XIII' of Figure 7;

第9圖係示出根據實施例的生產玻璃疊層板的方法的流程圖;及Figure 9 is a flowchart showing a method of producing a glass laminate according to an embodiment; and

第10圖係示出第9圖的生產玻璃疊層板的方法的吹洗空氣供應操作(操作S240)的示意性橫截面視圖。Fig. 10 is a schematic cross-sectional view showing the purge air supply operation (operation S240) of the method of producing a glass laminate of Fig. 9.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic deposit information (please note in the order of deposit institution, date and number) no Foreign hosting information (please note in the order of hosting country, institution, date, and number) no

1:裝置 1: device

10:雷射光束照射單元 10: Laser beam irradiation unit

12:雷射照射部分 12: Laser irradiation part

14:吹洗空氣供應部分 14: Purge air supply part

20:位置移動控制單元 20: Position movement control unit

30:裝載台 30: loading platform

30H:吸氣孔 30H: Suction hole

100:玻璃板組件 100: glass plate assembly

110:底板 110: bottom plate

110H:狹槽 110H: Slot

120:可撓性磁鐵 120: Flexible magnet

130:引導部分 130: boot part

160:玻璃疊層板 160: glass laminated board

D1:方向 D1: direction

D2:方向 D2: Direction

Claims (20)

一種在用於生產一玻璃疊層板的一裝置中使用的玻璃板組件,該玻璃板組件包含: 一底板,該底板包含至少一個狹槽,雷射光束被組配來穿過該至少一個狹槽; 一可撓性磁鐵,該可撓性磁鐵安置在該底板的一第一表面上並且包含與該至少一個狹槽連通的至少一個開口;及 一引導部分,該引導部分沿著該可撓性磁鐵的一邊緣來安置在該底板的該第一表面上並且在與該底板的該第一表面的一邊緣平行的一第一方向上延伸。A glass plate assembly used in a device for producing a glass laminate, the glass plate assembly comprising: A bottom plate, the bottom plate includes at least one slot, and the laser beam is configured to pass through the at least one slot; A flexible magnet disposed on a first surface of the bottom plate and including at least one opening communicating with the at least one slot; and A guide portion arranged on the first surface of the bottom plate along an edge of the flexible magnet and extending in a first direction parallel to an edge of the first surface of the bottom plate. 如請求項1所述之玻璃板組件,其中該玻璃疊層板包含一金屬薄板及附接至該金屬薄板的一玻璃層, 其中該金屬薄板包含鋼、不銹鋼、鎳、鈷、或包含此等金屬中之至少一者的一金屬合金,並且 該金屬薄板被組配來藉由磁力而固定在該可撓性磁鐵上。The glass plate assembly according to claim 1, wherein the glass laminate includes a thin metal plate and a glass layer attached to the thin metal plate, Wherein the metal sheet contains steel, stainless steel, nickel, cobalt, or a metal alloy containing at least one of these metals, and The thin metal plate is assembled to be fixed on the flexible magnet by magnetic force. 如請求項1所述之玻璃板組件,其中該可撓性磁鐵具有約100高斯至約3,000高斯的一磁通量密度。The glass plate assembly according to claim 1, wherein the flexible magnet has a magnetic flux density of about 100 Gauss to about 3,000 Gauss. 如請求項1之玻璃板組件,其中該至少一個狹槽包括在該第一方向上延伸並且彼此平行地間隔開的複數個第一狹槽。The glass plate assembly of claim 1, wherein the at least one slot includes a plurality of first slots extending in the first direction and spaced parallel to each other. 如請求項4所述之玻璃板組件,其中該等第一狹槽在相等距離下彼此間隔開。The glass plate assembly according to claim 4, wherein the first slots are spaced apart from each other at equal distances. 如請求項1所述之玻璃板組件,其中該玻璃板組件包含: 一外部周向部分,該引導部分安置在該外部周向部分上;及 一中心部分,在一平面圖中檢視時,該中心部分藉由該外部周向部分包圍並且與該外部周向部分間隔開, 其中該至少一個狹槽在該中心部分與該外部周向部分之間界定。The glass plate assembly according to claim 1, wherein the glass plate assembly includes: An outer circumferential part on which the guide part is arranged; and A central part, the central part is surrounded by the outer circumferential part and spaced apart from the outer circumferential part when viewed in a plan view, Wherein the at least one slot is defined between the central part and the outer circumferential part. 如請求項6所述之玻璃板組件,其中該至少一個狹槽包括: 在該第一方向上平行延伸的一對第一狹槽;及 在一第二方向上平行延伸並且與該對第一狹槽相交的一對第二狹槽,該第二方向垂直於該第一方向並且平行於該底板的該第一表面,並且 在一平面圖中檢視時,該中心部分藉由該對第一狹槽及該對第二狹槽包圍。The glass plate assembly according to claim 6, wherein the at least one slot includes: A pair of first slots extending in parallel in the first direction; and A pair of second slots extending in parallel in a second direction and intersecting the pair of first slots, the second direction being perpendicular to the first direction and parallel to the first surface of the bottom plate, and When viewed in a plan view, the central part is surrounded by the pair of first slots and the pair of second slots. 如請求項1所述之玻璃板組件,其中相對於該底板的該第一表面,在垂直於該第一表面的一第三方向上,該引導部分的一上部表面處於比該可撓性磁鐵的一上部表面更高的一水準處。The glass plate assembly according to claim 1, wherein with respect to the first surface of the bottom plate, in a third direction perpendicular to the first surface, an upper surface of the guide portion is positioned at a position greater than that of the flexible magnet A higher level on an upper surface. 如請求項1所述之玻璃板組件,其中該至少一個狹槽藉由從該底板的該第一表面延伸至一第二表面的相反側壁來界定,該第二表面與該第一表面相反,並且 處於與該第一表面相同水準下的該至少一個狹槽的一第一寬度小於處於與該第二表面相同水準下的該至少一個狹槽的一第二寬度。The glass plate assembly according to claim 1, wherein the at least one slot is defined by opposite side walls extending from the first surface of the bottom plate to a second surface, the second surface being opposite to the first surface, and A first width of the at least one slot at the same level as the first surface is smaller than a second width of the at least one slot at the same level as the second surface. 如請求項9所述之玻璃板組件,其中該底板的該等相反側壁中的每一個從該底板的該第一表面至該第二表面為傾斜的。The glass plate assembly according to claim 9, wherein each of the opposite side walls of the bottom plate is inclined from the first surface to the second surface of the bottom plate. 如請求項9所述之玻璃板組件,其中該底板的該等相反側壁中的每一個包括該底板的該第一表面與該第二表面之間的一梯級部分。The glass plate assembly according to claim 9, wherein each of the opposite side walls of the bottom plate includes a step portion between the first surface and the second surface of the bottom plate. 一種用於切割一玻璃疊層板的用於生產一玻璃疊層板的裝置,該裝置包含: 一裝載台,該裝載台包括複數個吸氣孔; 一玻璃板組件,該玻璃板組件安裝在該裝載台上並且該玻璃疊層板被組配來藉由磁力而固定在該玻璃板組件上;及 一雷射光束照射單元,該雷射光束照射單元被組配來用雷射光束照射該玻璃疊層板, 其中該玻璃板組件包含: 一底板,該底板包含至少一個狹槽,該等雷射光束被組配來穿過該至少一個狹槽; 一可撓性磁鐵,該可撓性磁鐵安置在該底板的一第一表面上並且包含與該至少一個狹槽連通的至少一個開口;及 一引導部分,該引導部分沿著該可撓性磁鐵的一邊緣來安置在該底板的該第一表面上並且在與該底板的該第一表面的一邊緣平行的一第一方向上延伸。A device for producing a glass laminate for cutting a glass laminate, the device comprising: A loading platform, the loading platform includes a plurality of suction holes; A glass plate assembly, the glass plate assembly is installed on the loading table and the glass laminate plate is assembled to be fixed on the glass plate assembly by magnetic force; and A laser beam irradiating unit, the laser beam irradiating unit is configured to irradiate the glass laminate with a laser beam, The glass plate assembly includes: A bottom plate, the bottom plate includes at least one slot, and the laser beams are assembled to pass through the at least one slot; A flexible magnet disposed on a first surface of the bottom plate and including at least one opening communicating with the at least one slot; and A guide portion arranged on the first surface of the bottom plate along an edge of the flexible magnet and extending in a first direction parallel to an edge of the first surface of the bottom plate. 如請求項12所述之裝置,其中該至少一個狹槽與該等複數個吸氣孔垂直地重疊,並且 該等雷射光束被組配來在該至少一個狹槽延伸的一方向上照射至該玻璃疊層板上。The device according to claim 12, wherein the at least one slot vertically overlaps the plurality of suction holes, and The laser beams are assembled to irradiate the glass laminate in the direction in which the at least one slot extends. 如請求項13所述之裝置,其中該雷射光束照射單元包含: 一光纖雷射照射部分,該光纖雷射照射部分被組配來用該等雷射光束照射該玻璃疊層板;及 一吹洗空氣供應部分,該吹洗空氣供應部分被組配來將吹洗空氣供應至該等雷射光束所照射的一區域,以便將在該等雷射光束切割該玻璃疊層板時所產生的該玻璃疊層板的碎片或毛刺經由該至少一個狹槽來傳遞至該等複數個吸氣孔中。The device according to claim 13, wherein the laser beam irradiation unit includes: An optical fiber laser irradiating part, the optical fiber laser irradiating part is configured to irradiate the glass laminate with the laser beams; and A purge air supply part, the purge air supply part is configured to supply the purge air to an area irradiated by the laser beams, so that when the laser beams cut the glass laminate The generated fragments or burrs of the glass laminate are transferred to the plurality of suction holes through the at least one slot. 如請求項13所述之裝置,其中該玻璃疊層板包含一金屬薄板及附接至該金屬薄板的一玻璃層, 其中該金屬薄板包含鋼、不銹鋼、鎳、鈷、或包含此等金屬中之至少一者的一金屬合金,並且 該金屬薄板被組配來藉由該磁力而固定在該玻璃板組件的該可撓性磁鐵上。The device according to claim 13, wherein the glass laminate includes a metal sheet and a glass layer attached to the metal sheet, Wherein the metal sheet contains steel, stainless steel, nickel, cobalt, or a metal alloy containing at least one of these metals, and The thin metal plate is assembled to be fixed on the flexible magnet of the glass plate assembly by the magnetic force. 如請求項15所述之裝置,其中該玻璃板組件的該引導部分與該玻璃疊層板的一邊緣接觸,並且該玻璃疊層板被組配來安置在該玻璃板組件上。The device according to claim 15, wherein the guide portion of the glass plate assembly is in contact with an edge of the glass laminate plate, and the glass laminate plate is assembled to be placed on the glass plate assembly. 一種使用一玻璃板組件來生產一玻璃疊層板的方法,該方法包括: 將該玻璃板組件安置在包括複數個吸氣孔的一裝載台上,其中該玻璃板組件包含含有至少一個狹槽的一底板,及一可撓性磁鐵,該可撓性磁鐵安置在該底板的一第一表面上並且包含與該至少一個狹槽連通的至少一個開口; 將一玻璃疊層板安置在該玻璃板組件上;及 在該至少一個狹槽延伸的一方向上將雷射光束發射至該玻璃疊層板上,以便切割該玻璃疊層板的一部分,該部分與該至少一個狹槽重疊。A method of using a glass plate assembly to produce a glass laminated plate, the method comprising: The glass plate assembly is placed on a loading platform including a plurality of suction holes, wherein the glass plate assembly includes a bottom plate containing at least one slot, and a flexible magnet, and the flexible magnet is placed on the bottom plate On a first surface of and including at least one opening communicating with the at least one slot; Placing a glass laminate on the glass plate assembly; and A laser beam is emitted to the glass laminate in a direction in which the at least one slot extends, so as to cut a part of the glass laminate, which overlaps the at least one slot. 如請求項17所述之方法,其中該玻璃板組件進一步包含一引導部分,該引導部分沿著該可撓性磁鐵的一邊緣來安置在該底板的該第一表面上,並且 該玻璃疊層板的安置包括將該玻璃疊層板安置在該玻璃板組件上以使得該玻璃疊層板的一邊緣與該引導部分接觸並且該玻璃疊層板藉由磁力而固定在該可撓性磁鐵上。The method according to claim 17, wherein the glass plate assembly further includes a guide portion disposed on the first surface of the bottom plate along an edge of the flexible magnet, and The placement of the glass laminate includes placing the glass laminate on the glass plate assembly so that an edge of the glass laminate is in contact with the guide portion and the glass laminate is fixed to the glass by magnetic force. On the flexible magnet. 如請求項17所述之方法,其進一步包括在發射該等雷射光束之後,將吹洗空氣供應至該等雷射光束所照射的該玻璃疊層板的一部分,以便將該等雷射光束切割的該玻璃疊層板的碎片或毛刺經由該至少一個狹槽來傳遞至該等複數個吸氣孔中。The method according to claim 17, further comprising, after emitting the laser beams, supplying purge air to a part of the glass laminate irradiated by the laser beams, so that the laser beams The cut fragments or burrs of the glass laminate are transferred to the plurality of suction holes through the at least one slot. 如請求項19所述之方法,其中在該吹洗空氣的供應中,該玻璃板組件及該玻璃疊層板不由於該吹洗空氣而導致移動或振動。The method according to claim 19, wherein in the supply of the purge air, the glass plate assembly and the glass laminate do not move or vibrate due to the purge air.
TW109116883A 2019-05-30 2020-05-21 Pcplate assembly, apparatus for producing glass laminate including the same, and method of producing glass laminate TW202112480A (en)

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