TW202112190A - Touch module and manufacturing method thereof - Google Patents

Abstract

A method of manufacturing an electronic module includes the following steps: Providing a circuit film, the circuit film includes a flexible transfer sheet. Reverse folding the flexible transfer sheet to form a connecting sheet body and a reverse folding sheet body. Placing the circuit film in a mold, to cause the mold compressed the reverse folding sheet body. And injecting liquid plastic into a cavity through a gate of the mold, the liquid plastic impacts the reverse folding sheet body to make a part of it pressed tight against the mold, the liquid plastic covering the connecting sheet body and the reverse folding sheet body except a part that is pressed tight against the mold. Thereby, the complexity of the mold design can be reduced and the manufacturing cost can be reduced.

Description

Electronic module and manufacturing method thereof

The present invention relates to an electronic module and a manufacturing method thereof, in particular to an electronic module that is coated with a flexible transmission sheet through a molding method and a manufacturing method thereof.

When a functional chip and an external transmission line are to be packaged together, the mold usually needs to design a groove to accommodate an external part of the external transmission line, and the shape of the groove must match the shape of the external part to prevent plastic from being injected into the mold When inside, it flows into the groove to cover the outer part. However, the aforementioned method will increase the complexity of the mold design.

Another method is based on the above method, and further a holder is sleeved on the external part of the external transmission line, so that a part of the external part exposes the holder. When the mold is closed, the holder will be clamped so that the outer part is held by the holder and fixed. At the same time, the holder will also close the groove to prevent the plastic from flowing into the groove. However, the method of using the holder to hold the external part undoubtedly adds to the manufacturing cost.

Therefore, one object of the present invention is to provide a method for manufacturing an electronic module that can overcome at least one of the disadvantages of the prior art.

Therefore, the manufacturing method of the electronic module of the present invention includes the following steps:

Providing a circuit film, the circuit film including a flexible transmission sheet;

The flexible transmission sheet is folded back to form a connecting sheet body, and a folded sheet body connected to the connecting sheet body and folded against the connecting sheet body;

Placing the circuit film in a mold, so that the mold compresses the reflex sheet body; and

Inject liquid plastic into a mold cavity through a gate of the mold spaced apart from the reverse-folded sheet body, the liquid plastic impacts the reverse-folded sheet body to make a part of it abut against the mold, and the liquid plastic covers the connecting sheet Except for the part of the body and the reverse-folded sheet that is close to the mold, the part of the reverse-folded sheet that is close to the mold is exposed, and the liquid plastic is cured to form an insulating plastic layer.

Another object of the present invention is to provide an electronic module that can overcome at least one of the disadvantages of the prior art.

Therefore, the electronic module of the present invention includes a circuit film and an insulating plastic layer.

The circuit film includes a flexible transmission sheet, the flexible transmission sheet has a connecting sheet body, and a reflex sheet body connected to the connecting sheet body and folded relative to the connecting sheet body. An insulating plastic layer is formed on one side of the circuit film with the flexible transmission sheet, and the insulating plastic layer covers the connecting sheet body and a part of the reflex sheet body and exposes the other part of the reflex sheet body.

The effect of the present invention is that the mold does not need to be specially designed to accommodate the grooves of the reverse-folded sheet body of the flexible transmission sheet, or to design a holder to hold the reverse-folded sheet body, thereby reducing the complexity of mold design Degree and can reduce the cost of manufacturing. In addition, the inverted sheet body of the flexible transmission sheet can be directly electrically connected to an external electronic component, or can be electrically connected to an external electronic component in the opened state, thereby increasing the flexibility in use.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

1 and 2, FIG. 1 is a step flow chart of the first embodiment of the manufacturing method of the electronic module of the present invention, including the following steps: providing circuit film step S1, reflexing step S2, placing the circuit film on the mold Step S3, and molding step S4.

2 is a step flow chart of the step S1 of providing a circuit film in the first embodiment, including the following substeps: step S11 of providing an insulating substrate, step S12 of forming a conductive layer, step S13 of forming a circuit pattern layer, step S14 of forming an insulating layer , Forming an adhesive layer step S15, forming step S16, cutting step S17, and assembling a flexible transmission sheet step S18.

2 and 3, in step S11 of providing an insulating substrate, a transparent insulating film 11 is provided. The transparent insulating film 11 is made of, for example, polycarbonate (PC) or polymethyl methacrylate (PMMA). It has an inner surface 111 and an outer surface 112 (as shown in FIG. 9) opposite to the inner surface 111. The outer surface 112 is a touch surface for the user's finger to touch. The ink is printed on the inner surface 111 of the transparent insulating film 11 through, for example, a screen printing method to form a plurality of rectangular frame patterns. The ink of the first embodiment is black insulating ink as an example, and the number of rectangular frame patterns is two. example. Each rectangular frame pattern constitutes a decoration layer 12, and the decoration layer 12 has an inner surface 121. The decoration layer 12 and the transparent insulating film 11 together constitute an insulating substrate 10.

2 and 4, in the step S12 of forming a conductive layer, a transparent conductive ink is printed on the inner surface 121 of each decorative layer 12 of the insulating substrate 10 through, for example, screen printing, and the transparent insulating layer surrounded by each decorative layer 12 The inner surface 111 area of the diaphragm 11 forms two rectangular patterns. The transparent conductive ink of the first embodiment may be PEDOT/PSS conductive ink, nano silver wire conductive ink or graphene conductive ink. The size of each rectangular pattern is smaller than the size of the corresponding decoration layer 12 and constitutes a conductive layer 13, and each conductive layer 13 has a peripheral portion 131 formed on and overlapping the corresponding decoration layer 12.

2 and 5, in the step S13 of forming a circuit pattern layer, conductive silver paste is printed on the peripheral portion 131 of each conductive layer 13 and the corresponding decoration layer 12 by, for example, screen printing, to form two circuit pattern layers 14. Each circuit pattern layer 14 has a plurality of electrode units 141 formed on the peripheral portion 131 corresponding to the conductive layer 13 and a contact unit 142 formed on the corresponding decoration layer 12. A part of each circuit pattern layer 14 is formed on the outer peripheral portion 131 of the corresponding conductive layer 13, so that each decoration layer 12 can cover a part of the aforementioned circuit pattern layer 14 to prevent it from being directly exposed on the inner surface 111 of the transparent insulating film 11. The number of electrode units 141 of each circuit pattern layer 14 is four as an example, and the four electrode units 141 are connected to each other through the conductive layer 13. The four electrode units 141 will form a uniform electric field after voltage is applied. When the user's finger touches the outer surface 112 (as shown in FIG. 9) corresponding to the area surrounded by the circuit pattern layer 14, the contact between the finger and the electrode unit 141 A coupling capacitance is generated between the four electrode units 141 to sense the capacitance change value to estimate the position of the finger touch. In this way, the surface capacitive touch function is provided. The contact unit 142 is used for electrically connecting with an external electronic component (not shown), thereby enabling the external electronic component to transmit power and signals through the contact unit 142 and the circuit pattern layer 14.

2, 5 and 6, in the step S14 of forming an insulating layer, a transparent insulating ink is printed on each circuit pattern layer 14 except for the contact unit 142, each conductive layer 13 and each decoration by, for example, screen printing. Layer 12 to form two rectangular patterns. The size of each rectangular pattern is the same as the size of the corresponding decoration layer 12 and constitutes an insulating layer 15. The insulating layer 15 has an opening 151 through which the contact unit 142 is exposed. The design of each insulating layer 15 can provide a shielding function to prevent external signals from interfering with the electrode unit 141 corresponding to the circuit pattern layer 14.

Referring to FIGS. 2, 6 and 7, in the step S15 of forming an adhesive layer, an adhesive is printed on each insulating layer 15 by, for example, a screen printing method to form two rectangular patterns. The size of each rectangular pattern is the same as the size of the corresponding insulating layer 15 and constitutes a bonding layer 16. The next layer 16 has a through hole 161 communicating with the corresponding opening 151, and the through hole 161 is for the corresponding contact unit 142 to be exposed. The subsequent layer 16 has good heat resistance, and is used to protect the aforementioned circuit pattern layer 14 to avoid the influence of high temperature plastic on the circuit pattern layer 14 when the subsequent molding step S4 shown in FIG. 1 is performed. In addition, the adhesive layer 16 also has good adhesion, and can firmly adhere to the plastic in the subsequent molding step S4.

Referring to Figures 2, 8 and 9, in the forming step S16, the two regions of the insulating substrate 10 corresponding to the adhesive layer 16 are thermally pressed together by means of hot pressing, so that the aforementioned two of the transparent insulating film 11 Each two-dimensional flat area protrudes toward the outer surface 112 into two three-dimensional structures.

Referring to FIGS. 2 and 10, in the cutting step S17, two three-dimensional structures are cut on the transparent insulating film 11 of the insulating substrate 10 through a stamping method (as shown in FIG. 10).

Referring to FIGS. 2, 10 and 11, in the step S18 of assembling the flexible transmission sheet, first, a conductive adhesive film 17 is pasted on the contact unit 142 through the through hole 161 and the opening 151 (as shown in FIG. 6 ). Subsequently, a rectangular flexible transmission sheet 18 is adhered to the conductive adhesive film 17 so that the flexible transmission sheet 18 is electrically connected to the contact unit 142 through the conductive adhesive film 17. At this point, the production of a circuit film 1 is completed. In the first embodiment, the conductive adhesive film 17 may be an anisotropic conductive film (ACF) or an omnidirectional conductive adhesive film (OCF). The flexible transmission sheet 18 is a flexible circuit board and has a flexible copper foil substrate 180 and a plurality of conductive portions 181 formed on the flexible copper foil substrate 180 and spaced apart from each other. The material of the flexible copper foil substrate 180 is polyimide (PI), and the material of each conductive portion 181 is copper foil.

Referring to FIGS. 1 and 12, in the reversing step S2, the flexible transmission sheet 18 is reflexed along a first rotation direction R1 to form a connecting sheet body 182 and a reversing sheet body 183. The connecting piece 182 is located in the opening 151 and the through hole 161 and is electrically connected to the contact unit 142 of the circuit pattern layer 14 through the conductive adhesive film 17. The inverted sheet body 183 has a connecting portion 184 connected to the connecting sheet body 182 and a free end 185 opposite to the connecting portion 184. The inverted sheet body 183 has a length L defined between the connecting portion 184 and the free end 185. In the first embodiment, the length L can be any value between 5 mm and 20 mm.

1 and 13, in the step S3 of placing the circuit film on the mold, a mold 2 includes a first mold 21 and a second mold 22. The first mold 21 is formed with a groove 211 for accommodating the circuit film 1. The second mold 22 is located at one side of the first mold 21 and has a convex portion 221 for passing through the groove 211, and the convex portion 221 has a mold surface 222. The second mold 22 is formed with a runner 223, and the runner 223 has a gate 224 located on the mold surface 222 of the convex portion 221 and adjacent to the top end thereof. The circuit film 1 is placed in the groove 211 so that the connecting portion 184 and the free end 185 of the inverted sheet body 183 of the flexible transmission sheet 18 face downward and upward, respectively.

14 and 15, then, the second mold 22 will move along a mold clamping direction D, during the movement of the second mold 22, the mold surface 222 of the convex portion 221 will first touch the free end of the reflex sheet body 183 185 and apply pressure to it, so that the reverse-folded sheet body 183 is bent and deformed relative to the connecting sheet body 182 through the connecting portion 184 and approaches the connecting sheet body 182. When the second mold 22 moves to a mold clamping position penetrated in the groove 211 as shown in FIG. 14, the mold surface 222 of the convex portion 221 compresses the reverse-folded sheet body 183 to a compressed state, and at the same time, the convex portion 221 The mold surface 222 also covers the side of the reversal sheet body 183 opposite to the connecting sheet body 182. At this time, the gate 224 of the runner 223 is spaced above the free end 185 of the inverted sheet body 183, that is, on the side of the free end 185 opposite to the connecting portion 184.

Subsequently, the molding step S4 is performed. The liquid plastic 190 is injected into a cavity 23 formed by the mold surface 222 of the protrusion 221 and the groove 211 through the gate 224 of the runner 223, and the liquid plastic 190 will flow along a flow direction F. When the liquid plastic 190 flows downward, it will flow to the connecting portion 184 via the free end 185 and impact the reflex sheet body 183 during the downward flow. In the first embodiment, a thickness T of the cavity 23 is smaller than the length L of the reverse-folded sheet body 183 (as shown in FIG. 12), and the thickness T is, for example, 1 mm. Since the thickness T of the cavity 23 is less than the length L of the reverse-folded sheet body 183, the liquid plastic 190 will stretch the reverse-folded sheet body 183 when it impacts, so that a part of the reverse-folded sheet body 183 is connected to the body through the connecting portion 184 The sheet body 182 is bent to form a first section 186, and the rest of the reflexed sheet body 183 is bent relative to the first section 186 to form a second section 187 with a free end 185. Since a surface 188 of the second section 187 abuts against the mold surface 222 of the convex portion 221 and is blocked by it, the reverse-folded sheet body 183 will maintain a stretched state as shown in FIG. 15 without being caused by liquid plastic. The continuous impact of 190 continued to deform.

Since the surface 188 of the second section 187 abuts against and is shielded by the mold surface 222 of the convex portion 221, it can prevent the liquid plastic 190 from leaking into the surface 188 and the mold surface 222 after filling the mold cavity 23. As a result, the liquid plastic 190 only covers the part of the reflex sheet body 183 except for the surface 188 but not the surface 188.

15 and 16, the liquid plastic 190 fills the mold cavity 23 and solidifies to form an insulating plastic layer 19 after a period of cooling time. The insulating plastic layer 19 is adhered to the adhesive layer 16 and covers the connecting sheet body 182, the connecting portion 184 and the part of the inverted sheet body 183 except for the surface 188. After that, drive the second mold 22 to move in a direction opposite to the mold clamping direction D (as shown in FIG. 14) and return to the position shown in FIG. 13, at this time, the circuit film 1 and the insulating plastic layer 19 can be shared. The constituted electronic module 100 is taken out from the groove 211 of the first mold 21. The electronic module 100 can be applied to, for example, a touch screen of a smart phone or an in-vehicle system.

Since the surface 188 is not covered by the insulating plastic layer 19, the surface 188 can be exposed, so that, for example, an external electronic component (not shown) of a circuit board can be directly electrically connected to the conductive portion 181 on the surface 188 (As shown in Figure 11). Since the conductive layer 13 and the circuit pattern layer 14 of the electronic module 100 are covered by the insulating decoration layer 12 and the insulating layer 15, the touch circuit formed by the conductive layer 13 and the circuit pattern layer 14 can be prevented from being damaged or The failure is caused by environmental influences. In addition, since the circuit pattern layer 14 is a single-layer circuit made of transparent conductive ink printed by a screen printing method, the manufacturing method of the circuit pattern layer 14 is very much in comparison with the existing method of forming circuit patterns by etching or laser engraving. It is simple and convenient, which can greatly reduce the complexity and labor hours of the manufacturing process. Furthermore, since the circuit pattern layer 14 is a single-layer circuit, the overall thickness of the electronic module 100 can be reduced to make it lighter and thinner.

Refer to Figure 11 and Figure 17, because the material of the liquid plastic 190 (as shown in Figure 15 ) can be polycarbonate (PC), or acrylonitrile-butadiene-styrene copolymer (ABS), or liquid silicon The flexible copper foil substrate 180 of the flexible transmission sheet 18 is made of polyimide (PI), the conductive part 181 is made of copper foil, and the flexible transmission sheet 18 is made of the same material as that of the liquid plastic 190 The material is not adhesive. Therefore, the cured insulating plastic layer 19 will not adhere to the flexible copper foil substrate 180 and the conductive portion 181 of the flexible transmission sheet 18. Therefore, the user can easily peel off the second section 187 at the free end 185 and drive it to rotate in a second rotation direction R2 to open the second section 187 and peel off the insulating plastic layer 19. Thereby, it is convenient to electrically connect the conductive portion 181 on the second segment 187 to an external electronic component later. The second section 187 of the flexible transmission sheet 18 can be directly electrically connected to the external electronic component at the position shown in FIG. 16, or electrically connected to the external electronic component in the opened state shown in FIG. 17, thereby Can increase flexibility in use.

14 and 15, since the length L of the reverse-folded sheet body 183 (as shown in FIG. 12) is much greater than the thickness T of the cavity 23, the liquid plastic 190 can stretch the reverse-folded sheet body 183 when it impacts. The surface 188 of the second section 187 can abut against the mold surface 222 of the convex portion 221 and maintain the reverse-folded sheet body 183 in a stretched state. In this way, it is possible to prevent the reverse-folded sheet body 183 from being deformed due to the continuous impact of the liquid plastic 190, and the liquid plastic 190 can cover the part of the reverse-folded sheet body 183 except the surface 188.

Compared with the prior art in the manufacturing method of the first embodiment, the second mold 22 of the mold 2 does not need to be specially designed to accommodate the groove of the inverted sheet body 183 of the flexible transmission sheet 18, or is designed to hold The retainer of the reversal sheet body 183 can thereby reduce the complexity of the design of the mold 2 and reduce the manufacturing cost.

It should be noted that in other implementations of the first embodiment, if the electronic module 100 does not need to have a three-dimensional shape, the sub-step forming step S16 can be omitted in the step S1 of providing the circuit film.

Referring to FIG. 18, FIG. 19 and FIG. 20, it is the second embodiment of the manufacturing method of the electronic module of the present invention. The overall steps are roughly the same as those of the first embodiment, except that the forms of the decoration layer 12 and the conductive layer 13 are different.

In the second embodiment, the pattern constituting each decorative layer 12 is a rectangular pattern, and the ink printed into the rectangular pattern is an insulating ink with a color. In the step S12 of forming a conductive layer (as shown in FIG. 2), an opaque conductive ink is printed on the inner surface 121 of each decorative layer 12 to form the conductive layer 13. The aforementioned opaque conductive ink is an example of a conductive carbon ink. In the step S13 of forming the circuit pattern layer (as shown in FIG. 2 ), conductive silver paste is printed on each conductive layer 13 and the corresponding decoration layer 12 to form the circuit pattern layer 14. The formed electronic module 110 can be applied to fields with panel and shell parts, such as home appliance trim panels or car interior panels, for use as a touch switch.

To sum up, in the manufacturing method of the electronic module of the various embodiments, the second mold 22 of the mold 2 does not need to be specially designed to accommodate the grooves of the inverted sheet body 183 of the flexible transmission sheet 18, or is designed By holding the retaining member of the inverted sheet body 183, the design complexity of the mold 2 can be reduced and the manufacturing cost can be reduced. In addition, the second section 187 of the flexible transmission sheet 18 can be directly electrically connected to an external electronic component, or can be electrically connected to an external electronic component in the opened state, thereby increasing flexibility in use. Furthermore, the manufacturing method of the circuit pattern layer 14 is very simple and convenient, which can greatly reduce the process complexity and man-hours, and the circuit pattern layer 14 is a single-layer circuit, which can reduce the overall thickness of the electronic module 100 to make it lighter and thinner. So it can indeed achieve the purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

100, 110: electronic module 1: Circuit film 10: Insulating substrate 11: Transparent insulating diaphragm 111: inner surface 112: Outer surface 12: Decorative layer 121: inner surface 13: conductive layer 131: Peripheral 14: circuit pattern layer 141: Electrode unit 142: Contact Unit 15: Insulation layer 151: Hole 16: Next layer 161: Through hole 17: Conductive adhesive film 18: Flexible transmission sheet 180: Flexible copper foil substrate 181: Conductive part 182: Connecting the sheet body 183: Reverse Fold Body 184: Connection 185: free end 186: First paragraph 187: second paragraph 188: Surface 190: Liquid plastic 19: Insulating plastic layer 2: Mould 21: The first model 211: Groove 22: second mode 221: Convex 222: Die surface 223: Runner 224: Gate 23: Mould cavity D: Clamping direction F: Flow direction L: length T: thickness R1: The first direction of rotation R2: The second direction of rotation S1: Provide circuit film steps S11: Steps to provide insulating substrate S12: step of forming conductive layer S13: step of forming circuit pattern layer S14: step of forming insulating layer S15: forming the next layer step S16: forming steps S17: Cutting step S18: Steps for assembling flexible transmission sheet S2: Reverse step S3: Place the circuit film on the mold step S4: Molding step

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: 1 is a step flow chart of the first embodiment of the manufacturing method of the electronic module of the present invention; 2 is a step flow chart of the steps of providing circuit film in the first embodiment; Figure 3 is a top view illustrating the first embodiment of printing ink on a transparent insulating film to form two decorative layers; Figure 4 is a top view illustrating the first embodiment of printing transparent conductive ink to form two conductive layers; 5 is a top view illustrating the first embodiment of printing conductive silver paste to form two circuit pattern layers; Figure 6 is a plan view illustrating the first embodiment of printing transparent insulating ink to form two insulating layers; Figure 7 is a top view illustrating the first embodiment of printing adhesive to form two adhesive layers; FIG. 8 is a top view illustrating the thermal compression bonding of an insulating substrate in the first embodiment; Fig. 9 is a side view of Fig. 8 illustrating that the insulating base material of the first embodiment is formed into two three-dimensional structures; FIG. 10 is a top view illustrating that the first embodiment cuts the three-dimensional structure on the insulating substrate, and pastes a conductive adhesive film on a contact unit; Figure 11 is a top view illustrating the first embodiment of sticking a flexible transmission sheet to the conductive adhesive film; 12 is a cross-sectional view of a circuit film of the first embodiment, illustrating that the flexible transmission sheet is folded back to form a connecting sheet body and a reversed sheet body; 13 is a cross-sectional view illustrating that the circuit film used in the first embodiment is placed in a groove of a first mold; 14 is a cross-sectional view similar to FIG. 13, illustrating that a second mold used in the first embodiment moves to a mold clamping position and compresses the reverse-folded sheet body into a compressed state; 15 is a cross-sectional view similar to FIG. 14, illustrating that the liquid plastic of the first embodiment impacts the reverse-folded sheet body and expands it into an expanded state; 16 is a cross-sectional view of the electronic module of the first embodiment, illustrating that a surface of the reverse-folded sheet body is exposed; 17 is a cross-sectional view of the electronic module of the first embodiment, illustrating that the second section of the reverse-folded sheet body is opened and peeled off an insulating plastic layer; 18 is a top view of the transparent insulating film used in the second embodiment of the manufacturing method of the electronic module of the present invention, illustrating the printing of opaque conductive ink to form the two conductive layers; 19 is a top view illustrating the second embodiment of printing conductive silver paste to form the two circuit pattern layers; and 20 is a cross-sectional view of the electronic module of the second embodiment.

S1: Provide circuit film steps

S2: Reverse step

S3: Place the circuit film on the mold step

S4: Molding step

Claims (10)

A manufacturing method of an electronic module includes the following steps: Providing a circuit film, the circuit film including a flexible transmission sheet; The flexible transmission sheet is folded back to form a connecting sheet body, and a folded sheet body connected to the connecting sheet body and folded against the connecting sheet body; Placing the circuit film in a mold, so that the mold compresses the reflex sheet body; and Inject liquid plastic into a mold cavity through a gate of the mold spaced apart from the reverse-folded sheet body, the liquid plastic impacts the reverse-folded sheet body to make a part of it abut against the mold, and the liquid plastic covers the connecting sheet Except for the part of the body and the reverse-folded sheet that is close to the mold, the part of the reverse-folded sheet that is close to the mold is exposed, and the liquid plastic is cured to form an insulating plastic layer. The method of manufacturing an electronic module according to claim 1, wherein the material of the liquid plastic and the material of the flexible transmission sheet are not adhesive, so that the portion of the reflex sheet body that is tightly against the mold can be lifted Open and peel off the insulating plastic layer. The method for manufacturing an electronic module according to claim 1, wherein the reverse-folded sheet body has a length, and a thickness of the mold cavity is smaller than the length of the reverse-folded sheet body. The method of manufacturing an electronic module according to claim 3, wherein the reverse-folded sheet body has a connecting portion connecting the connecting sheet body, and a free end opposite to the connecting portion, the connecting portion and the free end The length is defined therebetween, and the gate is located on the side of the free end opposite to the connecting portion. The method of manufacturing an electronic module according to claim 4, wherein the liquid plastic flows through the free end to the connecting portion in a flow direction and impacts the reverse-folded sheet body, so that the reverse-folded sheet body forms a through-the-connection Section relative to the first section bent relative to the connecting piece body, and a second section bent relative to the first section and spaced apart from the connecting piece body, the second section having the free end, and a The surface of the mold covered by it, the liquid plastic covers the part of the reflex sheet body except the surface and exposes the surface, the material of the liquid plastic and the material of the flexible transmission sheet are not adhesive, so The second section of the inverted sheet body can be opened to peel off the insulating plastic layer. The method for manufacturing an electronic module according to any one of claims 1 to 5, wherein the step of providing the circuit film includes: Provide an insulating substrate; Forming a conductive layer on the insulating substrate; Forming a circuit pattern layer having a plurality of electrode units formed on the conductive layer and a contact unit formed on the insulating substrate; and The flexible transmission sheet is electrically connected to the contact unit. An electronic module, including: A circuit film, comprising a flexible transmission sheet, the flexible transmission sheet has a connecting sheet body, and a reflex sheet body connected to the connecting sheet body and folded relative to the connecting sheet body; and An insulating plastic layer is formed on the side of the circuit film with the flexible transmission sheet, and the insulating plastic layer covers the connecting sheet body and a part of the reflex sheet body and exposes the other part of the reflex sheet body . The electronic module according to claim 7, wherein the reverse-folded sheet body further has a connecting portion connecting the connecting sheet body, a first section bent relative to the connecting sheet body through the connecting portion, and a relative The first section is bent and is spaced apart from the connecting piece. The second section has a free end and a surface. The insulating plastic layer covers the part of the reverse-folded piece except the surface. Make the surface exposed. The electronic module according to claim 8, wherein the material of the insulating plastic layer and the material of the flexible transmission sheet are not adhesive, and the second section can be lifted to peel off the insulating plastic layer. The electronic module according to any one of claims 7 to 9, wherein the circuit film further includes an insulating substrate, a conductive layer, and a circuit pattern layer, and the conductive layer is formed on the insulating substrate, The circuit pattern layer has a plurality of electrode units formed on the conductive layer, and a contact unit formed on the insulating base material and electrically connected to the connecting sheet body.

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