KR20200117609A - Method for mafacturing in mold electronics molding mounted connector terminals - Google Patents

Method for mafacturing in mold electronics molding mounted connector terminals Download PDF

Info

Publication number
KR20200117609A
KR20200117609A KR1020190039966A KR20190039966A KR20200117609A KR 20200117609 A KR20200117609 A KR 20200117609A KR 1020190039966 A KR1020190039966 A KR 1020190039966A KR 20190039966 A KR20190039966 A KR 20190039966A KR 20200117609 A KR20200117609 A KR 20200117609A
Authority
KR
South Korea
Prior art keywords
mold
printed circuit
insert injection
film
connector terminal
Prior art date
Application number
KR1020190039966A
Other languages
Korean (ko)
Other versions
KR102204529B1 (en
Inventor
정민화
김승현
박희열
표중화
Original Assignee
유한회사 대구특수금속
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유한회사 대구특수금속 filed Critical 유한회사 대구특수금속
Priority to KR1020190039966A priority Critical patent/KR102204529B1/en
Publication of KR20200117609A publication Critical patent/KR20200117609A/en
Application granted granted Critical
Publication of KR102204529B1 publication Critical patent/KR102204529B1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G06F3/04144—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position using an array of force sensing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/0055—Shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/26—Component parts, details or accessories; Auxiliary operations
    • B29C51/30—Moulds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention relates to a method for manufacturing an in-mold electronic circuit molded article (A) integrated with a connector terminal portion. The method includes the steps of: printing a terminal pattern (28) by using a carbon paste continuously to a printed circuit pattern (26a) printed in a press processing region (Y) of an in-mold printed circuit film (20) to prepare a connector terminal portion (32); adhering an insert injection protective film (30) made of a heat resistant resin and having a thickness of 100-250 micrometers onto the printed circuit pattern (26a); carrying out partial thermal molding of the in-mold printed circuit film (20) for forming a three-dimensional surface, while conforming to an insert injection mold; forming stairs in the in-mold printed circuit film (20) through step folding in such a manner that the connector terminal portion (32) may be disposed at the upper side of one side of an insert injection mold (40) in the press processing region (Y); introducing the in-mold printed circuit film (20) having a three-dimensional curved surface portion to the insert injection mold (40) to carry out insert injection molding in such a manner that a molten injection resin solution may be introduced to the cavity (34) of the rear space portion of the in-mold printed circuit film (20) corresponding to the thermal molding region (X), and the connector terminal portion (32) of the in-mold circuit film (20) corresponding to the press processing region (Y) may be protected with the close contact structure of the upper and lower molds (40a, 40b) of the insert injection mold (40) and the insert injection protective film (30); and demolding the article and allowing the connector terminal portion (32) to stand erect.

Description

커넥터단자부 일체형 인몰드 전자회로 성형물의 제조방법{METHOD FOR MAFACTURING IN MOLD ELECTRONICS MOLDING MOUNTED CONNECTOR TERMINALS}Manufacturing method of molded in-mold electronic circuit with connector terminal part {METHOD FOR MAFACTURING IN MOLD ELECTRONICS MOLDING MOUNTED CONNECTOR TERMINALS}

본 발명은 인몰드 전자회로 성형물 제조에 관한 것으로, 특히 커넥터단자부가 일체형으로 제조되는 인몰드 전자회로 성형물 제조방법의 개량에 관한 것이다. The present invention relates to manufacturing an in-mold electronic circuit molded article, and more particularly, to an improvement of a method for manufacturing an in-mold electronic circuit molded article in which a connector terminal portion is integrally manufactured.

요즈음 부품형태의 제품성형물을 전자 컴포넌트와 전기적으로 연결하기 위해서, 도 1의 일예와 같이 플렉서블 인쇄회로필름(2)을 사출성형물 예컨대 IML(In Mold Labeling) 제품성형물(3)의 내측일면에 접착제로 부착하여 사용한다. Nowadays, in order to electrically connect a product molded product in the form of a part to an electronic component, as shown in the example of FIG. 1, a flexible printed circuit film 2 is attached to the inner side of an injection molded product such as an IML (In Mold Labeling) product molded with an adhesive. Attach and use.

사출성형물의 일예인 IML(In Mold Labeling) 제품성형물(3)은 그래픽인쇄면이 용기 표면에 노출된 형태가 아닌 용기 내부에 매립된 형태로서 최종 제품이 부드럽고 매끄러운 표면을 제공하므로 표면이 쉽게 벗겨지지 않는 고급스런 제품으로 각광받고 있다. IML (In Mold Labeling) product molding (3), an example of injection molding, is a form embedded inside the container rather than the form exposed on the surface of the container. The final product provides a smooth and smooth surface, so the surface is not easily peeled off. It is in the spotlight as a high-quality product that is not.

도 1에 도시된 바와 같이, 제품성형물(3)에 접착제에 의해 부착되는 인쇄회로필름(2)에는 전자컴포넌트와 사용자 인터페이스를 연결하기 위한 터치센서부(4)가 마련될 수 있으며 또 인쇄회로패턴라인(6)을 형성하고 외부로 돌출되는 플렉서블 인쇄회로 케이블(8)을 연장 형성하되 제로삽입력(ZIF) 커넥터 등과의 연결을 위한 커넥터단자부(10)가 카본페이스트로 형성되게 구성한다. As shown in FIG. 1, a touch sensor unit 4 for connecting electronic components and a user interface may be provided on the printed circuit film 2 attached to the product molded by an adhesive. A line 6 is formed and the flexible printed circuit cable 8 protruding outward is extended, but the connector terminal portion 10 for connection to a zero insertion input (ZIF) connector is formed of carbon paste.

그런데 이러한 플렉서블 인쇄회로케이블(8)의 선단에 형성된 커넥터단자부(10)는 인쇄회로필름(2)이 접착제로 부착되어 있는 관계로 별도 제작 및 접착제 부착 등에 의한 작업공수가 많아지고 제조 작업성이 좋지 못하며 장기 사용시에 필름의 열화에 의한 신뢰성이 저하되는 문제가 있다. 또 장기 사용에 따른 접착제 결합력이 약화되어서 인쇄회로필름(2)의 정전용량형 터치센서 등에 수분 유입이 되면서 그 기능이 저하될 수 있으며 심지어 인쇄회로필름(2)이 제품성형물(3)로부터 분리되는 문제가 발생할 여지도 있다. However, since the connector terminal 10 formed at the tip of the flexible printed circuit cable 8 is attached to the printed circuit film 2 with an adhesive, the number of work required by separately manufacturing and attaching the adhesive increases, and the manufacturing workability is good. There is a problem that reliability is deteriorated due to deterioration of the film during long-term use. In addition, since the adhesive bonding force due to long-term use is weakened, moisture is introduced into the capacitive touch sensor of the printed circuit film (2), and its function may deteriorate, and even the printed circuit film (2) is separated from the product molding (3). There is also room for problems.

공개특허공보 제10-2019-0020968호 "이중사출구조의 케이블 커넥터의 제조방법 및 이에 의해 제조된 케이블 커넥터"Unexamined Patent Publication No. 10-2019-0020968 "Method of manufacturing a cable connector having a double injection structure and a cable connector manufactured thereby"

따라서 본 발명의 목적은 인쇄회로필름과 커넥터단자부가 제품성형물과 일체형으로 인서트 사출성형하면서도 커넥터단자부의 내구 신뢰성과 전기연결성이 양호하며 제조공정이 단순화되고 작업공수는 줄어들 수 있도록 하는 커넥터단자부 일체형 인몰드 전자회로 성형물의 제조방법을 제공함에 있다. Accordingly, an object of the present invention is to insert injection molding of the printed circuit film and the connector terminal unit integrally with the product molded product, while the durability reliability and electrical connection of the connector terminal unit are good, and the manufacturing process is simplified and the work man-hour is reduced. It is to provide a method of manufacturing an electronic circuit molded article.

상기한 목적에 따른 본 발명은, 커넥터단자부 일체형 인몰드 전자회로 성형물의 제조방법에 있어서, In accordance with the present invention according to the above object, in a method of manufacturing an in-mold electronic circuit molded article integrated with a connector terminal unit,

투명성 및 내열성을 갖는 100~300㎛두께의 열가소성수지 투명필름(22)과 열가소성 투명필름(22) 배면상에 5~15㎛두께의 그래픽인쇄층(24)과 도전성 잉크를 이용하여 Using a 5-15 μm thick graphic printing layer 24 and conductive ink on the back of the 100-300 μm-thick thermoplastic resin transparent film 22 and the thermoplastic transparent film 22 having transparency and heat resistance.

5~35㎛두께의 인쇄회로층(26)을 차례로 형성하여 인몰드용 인쇄회로필름(20)을 마련하되 열성형 영역부(X)와 커넥터단자부 형성을 위한 프레스가공 영역부(Y)로 구분하며 프레스 가공영역부(Y)에는 열가소성수지 투명필름(22)상에 인쇄회로층(26)의 인쇄회로패턴(26a)이 형성되게 하는 제1 과정과, Printed circuit layers 26 having a thickness of 5 to 35 μm are sequentially formed to prepare a printed circuit film 20 for in-mold, but divided into a thermoforming area (X) and a press processing area (Y) for forming a connector terminal. A first process of forming a printed circuit pattern 26a of the printed circuit layer 26 on the thermoplastic resin transparent film 22 in the press processing area portion Y, and

인몰드용 인쇄회로필름(20)의 프레스 가공영역부(Y)에 인쇄형성된 인쇄회로패턴(26a)에 연이어 카본페이스트를 이용하여 단자패턴(28)을 인쇄형성하여 커넥터 단자부(32)를 마련하는 제2 과정과, A terminal pattern 28 is formed by printing a terminal pattern 28 using carbon paste in succession to the printed circuit pattern 26a printed on the press-processed area portion Y of the in-mold printed circuit film 20 to provide the connector terminal portion 32. Course 2,

프레스 가공영역부(Y)의 인쇄회로패턴(26a)상에는 100~250㎛두께의 내열성수지재 인서트사출 보호필름(30)을 접착형성하는 제3 과정과, A third process of bonding and forming an insert injection protective film 30 of a heat-resistant resin material having a thickness of 100 to 250 μm on the printed circuit pattern 26a of the press processing area portion Y, and

상기 제3과정을 거친 인몰드용 인쇄회로필름(20)을 인서트 사출금형에 맞으며 입체 표면형성을 위해 부분 열성형하되 열성형 영역부(X)에는 열성형하고, 프레스 가공영역부(Y)에는 커넥터 단자부(32)가 인서트 사출금형(40)의 일측 계단부 상측에 위치하게 되도록 인몰드용 인쇄회로필름(20)을 프레스 절곡으로 계단형성하는 제4 과정과, The in-mold printed circuit film 20 that has passed through the third process is fitted with an insert injection mold and partially thermoformed to form a three-dimensional surface, but thermoformed in the thermoforming area (X), and the connector in the press processing area (Y). A fourth process of forming a step by press bending the in-mold printed circuit film 20 so that the terminal part 32 is positioned above the step part on one side of the insert injection mold 40,

열성형과 프레스 절곡으로 입체곡면 표면부를 갖는 인몰드용 인쇄회로필름(20)을 인서트 사출금형(40)에 투입하되 열성형 영역부(X)에 해당하는 인몰드용 인쇄회로필름(20)의 배면공간부에는 인서트 사출금형(40)의 캐비티(34)가 마련되고 프레스 가공영역부(Y)에 해당하는 인몰드회로필름(20)의 커넥터단자부(32)가 인서트 사출금형(40)의 상하금형(40a)(40b)의 밀착 구조와 인서트사출 보호필름(30)에 의해 보호되게 한 상태에서 사출수지용융액을 인서트 사출금형(40)에 주입하여 인서트 사출성형이 이루어져서 열성형 영역부(X)에 해당하는 인몰드회로필름(20)의 배면부에 1~3mm두께의 인몰드 수지층(36)이 형성되게 하는 제5 과정과, Insert the in-mold printed circuit film 20 having a three-dimensional curved surface by thermoforming and press bending into the insert injection mold 40, but the rear space of the in-mold printed circuit film 20 corresponding to the thermoforming area (X) A cavity 34 of the insert injection mold 40 is provided in the part, and the connector terminal 32 of the in-mold circuit film 20 corresponding to the press processing area part Y is the upper and lower molds of the insert injection mold 40 ( Insert injection molding is performed by injecting the injection resin melt into the insert injection mold 40 in a state protected by the adhesion structure of 40a) (40b) and the insert injection protective film 30, corresponding to the thermoforming area (X) A fifth process of forming an in-mold resin layer 36 having a thickness of 1 to 3 mm on the rear surface of the in-mold circuit film 20,

제5과정에서 성형된 커넥터단자부 일체형 인몰드 전자회로 성형물(A)을 인서트 사출금형(40)에서 탈형한 후 커넥터단자부(32)를 직립으로 세우는 제6 과정으로 이루어짐을 특징으로 한다. It is characterized in that it consists of a sixth process in which the connector terminal part 32 is erected upright after the connector terminal part-integrated in-mold electronic circuit molded product (A) molded in the fifth step is demolded from the insert injection mold 40.

또한 본 발명의 커넥터단자부 일체형 인몰드 전자회로 성형물의 제조방법은, 직립으로 세워진 커넥터단자부(32)의 열가소성수지 투명필름(22)면에 보강 플레이트(38)를 부착 형성하는 제7 과정을 더 가짐을 특징으로 한다. In addition, the manufacturing method of the connector terminal unit integrated in-mold electronic circuit molded article of the present invention further has a seventh process of attaching the reinforcing plate 38 to the thermoplastic resin transparent film 22 surface of the connector terminal unit 32 erected upright. It features.

본 발명은 인쇄회로필름과 커넥터단자부가 제품성형물과 일체형으로 인서트 사출성형하여서 커넥터단자부의 전기연결성이 양호하면서도 제조공정이 단순화하고 작업공수는 줄어들 수 있는 장점이 있다. The present invention has the advantage that the printed circuit film and the connector terminal part are insert injection-molded integrally with the product molded product, so that the electrical connection of the connector terminal part is good, while the manufacturing process is simplified and the working man-hours can be reduced.

도 1은 종래기술에 따른 사출성형물과 플렉서블 인쇄회로필름이 본딩 결합되는 형태를 설명하기 위한 사진 예시 도면,
도 2 및 도 3은 본 발명의 실시예에 따른 커넥터단자부 일체형 인몰드 전자회로 성형물의 제조절차 개략도. 1 is an exemplary photographic view for explaining a form in which an injection molded product according to the prior art and a flexible printed circuit film are bonded to each other,
2 and 3 are schematic diagrams of a manufacturing procedure of an in-mold electronic circuit molded article integrated with a connector terminal unit according to an embodiment of the present invention.

이하 본 발명의 바람직한 실시 예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

본 발명에서는 커넥터단자부를 갖는 인쇄회로필름이 인서트 사출성형하여서 인몰드 전자회로 성형물을 구성하되 사출물과는 독립된 커넥터단자부가 내구 신뢰성과 전기연결성이 양호하며 인쇄회로필름을 접착하지 않고 일체 인서트사출 성형함에 의한 제조공정 단순화와 작업 공수가 줄어들도록 구현한다. In the present invention, a printed circuit film having a connector terminal part is insert injection-molded to form an in-mold electronic circuit molding, but the connector terminal part independent from the injection product has good durability and electrical connectivity, and the integrated insert injection molding is performed without bonding the printed circuit film. It is implemented to simplify the manufacturing process and reduce the number of man-hours.

도 2 및 도 3은 본 발명의 실시예에 따른 커넥터단자부 일체형 인몰드 전자회로 성형물(A)의 제조 절차 개략도이다. 2 and 3 are schematic diagrams of a manufacturing procedure of an in-mold electronic circuit molded article (A) integrated with a connector terminal unit according to an embodiment of the present invention.

본 발명의 실시예에 따라, 도 3의 (g)에 도시된 바와 같은, 커넥터단자부(32)가 인서트 사출성형으로 제품성형물에 일체형으로 탑재 가능하도록 하는 인몰드 전자회로 성형물(A)을 구성하기 위해 인서트 사출성형에 투입될 인몰드용 인쇄회로필름(20)을 먼저 제조한다. According to an embodiment of the present invention, as shown in (g) of FIG. 3, the connector terminal part 32 can be integrally mounted on a product molded article by insert injection molding to construct an in-mold electronic circuit molded article (A). For this purpose, the printed circuit film 20 for in-mold to be injected into the insert injection molding is first manufactured.

인몰드용 인쇄회로필름(20)은 투명성 및 내열성을 갖는 열가소성수지 투명필름(22)과 그래픽인쇄층(24)과 인쇄회로층(26)이 형성된 구성을 가진다. The in-mold printed circuit film 20 has a configuration in which a thermoplastic resin transparent film 22 having transparency and heat resistance, a graphic printing layer 24 and a printed circuit layer 26 are formed.

인몰드용 인쇄회로필름(20)을 구성하는 열가소성수지 투명필름(22)은 투광성 재질 바람직하게는 투명필름으로 구성된다. The thermoplastic resin transparent film 22 constituting the in-mold printed circuit film 20 is made of a translucent material, preferably a transparent film.

부연 설명하면, 열가소성수지 필름(22)은 인서트 사출시의 고온에 충분히 견딜 수 있는 내열성 수지재로서 열성형이나 인서트 사출시 변형이 가능하며 내열성을 갖는 PET(polyethylene terephthalate) 수지나 PC(PolyCarbonate) 수지를 사용한다. To further explain, the thermoplastic resin film 22 is a heat-resistant resin material that can sufficiently withstand high temperatures during insert injection, and can be deformed during thermoforming or insert injection, and has heat resistance PET (polyethylene terephthalate) resin or PC (polycarbonate) resin. Use.

그리고 본 발명에 따라 열가소성수지 투명필름(22)의 두께는 100~300㎛의 범위를 갖는다. 만일 필름(22)의 두께가 100㎛ 미만이면 그래픽 인쇄층(24)이나 인쇄회로층(28) 인쇄중 주름지거나 제대로 펼쳐있지 않는 등과 같은 인쇄작업성이 떨어지고 입체형태의 열성형 형태를 유지하는 것이 어려우며, 필름(22)의 두께가 300㎛을 초과하면 필름(22)의 응력이 너무 센 관계로 인서트 사출성형이 잘 되질 않고 사출성형중에 깨지는 현상도 야기되며 입체형상의 열성형이 이루어지는 과정에 어려움이 있다는 것에, 100~300㎛의 두께 범위의 임계적 의의가 있다.And the thickness of the thermoplastic resin transparent film 22 according to the present invention has a range of 100 ~ 300㎛. If the thickness of the film 22 is less than 100 μm, printing workability such as wrinkled or not properly spread during printing of the graphic print layer 24 or the printed circuit layer 28 is poor, and it is necessary to maintain the three-dimensional thermoforming form. It is difficult, and if the thickness of the film 22 exceeds 300㎛, the stress of the film 22 is too high, so that the insert injection molding does not work well, and the phenomenon of cracking during injection molding is also caused. That there is a critical significance in the thickness range of 100 to 300㎛.

이러한 구성된 열가소성수지 투명필름(22) 배면상에는 도 2의 (a)에서와 같이, 스크린인쇄방식 등으로 그래픽이미지를 갖는 그래픽 인쇄층(24)이 5~15㎛두께로 인쇄 형성되게 하고, 또 열가소성수지 필름(22)의 그래픽 인쇄층(24) 상에는 전도성 잉크(예컨대 실버 페이스트)를 이용한 스크린인쇄 등으로 인쇄회로패턴이나 터치입력부, RFID안테나 등이 포함된 5~35㎛ 두께의 인쇄회로층(26)이 인쇄 형성되게 한다. On the back of the thermoplastic resin transparent film 22 configured as above, a graphic printing layer 24 having a graphic image by a screen printing method or the like is formed to be printed in a thickness of 5 to 15 μm, as in FIG. 2 (a), and On the graphic printing layer 24 of the resin film 22, a printed circuit layer 26 having a thickness of 5 to 35 μm including a printed circuit pattern, a touch input unit, an RFID antenna, etc. by screen printing using conductive ink (eg, silver paste). ) To be printed.

또 인몰드용 인쇄회로필름(20)은 도 2의 (a)에서와 같이 열성형 영역부(X)와 커넥터단자부 형성을 위한 프레스가공 영역부(Y)로 구분하며, 프레스 가공영역부(Y)에는 열가소성수지 투명필름(22)상에 인쇄회로층(26)의 인쇄회로패턴(26a)이 형성되게 한다. In addition, the in-mold printed circuit film 20 is divided into a thermoforming area (X) and a press processing area (Y) for forming a connector terminal, as shown in Fig. 2(a), and a press processing area (Y). The printed circuit pattern 26a of the printed circuit layer 26 is formed on the thermoplastic resin transparent film 22.

그후 인몰드 인쇄회로필름(20)에서는 도 2의 (b)에서와 같이, 인몰드용 인쇄회로필름(20)의 프레스 가공영역부(Y)에 인쇄형성된 인쇄회로패턴(26a)에 연이어 카본페이스트(cabon paste)를 이용하여 단자패턴(28)을 인쇄형성하여서 커넥터 단자부(32)를 마련한다. Thereafter, in the in-mold printed circuit film 20, as shown in FIG. 2(b), a carbon paste (the printed circuit pattern 26a) printed on the press-processed area portion Y of the in-mold printed circuit film 20 is followed by a carbon paste ( The terminal pattern 28 is printed using cabon paste) to prepare the connector terminal portion 32.

그 다음에는, 도 2의 (c)에서와 같이, 프레스 가공영역부(Y)의 인쇄회로패턴(26a)상에는 100~250㎛두께의 내열성수지재 인서트사출 보호필름(30)을 접착형성하되, 단자패턴(28)은 노출되도록 형성한다. Next, as in (c) of FIG. 2, a heat-resistant resin insert-injection protective film 30 having a thickness of 100 to 250 μm is adhered and formed on the printed circuit pattern 26a of the press processing area portion Y, The terminal pattern 28 is formed to be exposed.

인쇄회로패턴(26a)을 인서트 사출시의 고열로부터 보호하기 위해 덮는 인서트사출 보호필름(30)은 내열성을 갖는 PET(polyethylene terephthalate) 수지나 PC(PolyCarbonate) 수지, PU(Polyurethane) 수지중 하나를 사용하며, 고가이지만 내열성이 더 우수한 PI(poly imide)수지도 선택해서 사용할 수 있다. The insert injection protective film 30, which covers the printed circuit pattern 26a from high heat during insert injection, uses one of PET (polyethylene terephthalate) resin, PC (polycarbonate) resin, and PU (polyurethane) resin having heat resistance. It is expensive, but PI (poly imide) resin with better heat resistance can also be selected and used.

인서트 사출 보호필름(30)을 인쇄회로패턴(26a) 위에 덮은 다음, 본 발명에서는 도 2의 (d)에서와 같이, 인몰드용 인쇄회로필름(20)을 인서트 사출금형(40)에 맞으며 입체 표면형성을 위해 부분 열성형하되 열성형 영역부(X)에는 열성형하고, 프레스 가공영역부(Y)에는 커넥터 단자부(32)가 인서트 사출금형(40)의 일측 계단부 상측에 위치하게 되도록 인몰드용 인쇄회로필름(20)을 프레스 절곡으로 계단형성한다. After covering the insert injection protective film 30 on the printed circuit pattern 26a, in the present invention, as shown in Fig. 2(d), the in-mold printed circuit film 20 fits the insert injection mold 40 and has a three-dimensional surface For forming, it is partially thermoformed, but thermoformed in the thermoforming area (X), and in the press processing area (Y), the connector terminal part (32) is located above the stepped part of one side of the insert injection mold (40). The printed circuit film 20 is stepped by press bending.

본 발명에서 커넥터 단자부(32)가 있는 프레스 가공영역부(Y)에는 열성형을 하질 않는 이유는 프레스 절곡으로 옆으로 누워 있는 커넥터 단자부(32)를 인서트 사출성형을 수행한 다음 직립상태로 세울 수 있도록 하기 위함이다. 또 커넥터 단자부(32)를 프레스 절곡으로 계단부 상측에 위치시킴과 동시에 가장자리측으로 향해 옆으로 누워 있게 하는 것은 인서트 사출성형시에 커넥터 단자부(32) 특히 단자패턴(28)이 고온의 사출수지용융액에 닿지 않도록 하기 위함이다. In the present invention, the reason why thermoforming is not performed on the press-processed area portion (Y) with the connector terminal portion (32) is that the connector terminal portion (32) lying on its side by press bending can be inserted into an upright state after performing insert injection molding. It is to be. In addition, placing the connector terminal part 32 on the upper side of the stepped part by press bending and laying it sideways toward the edge side is to ensure that the connector terminal part 32, especially the terminal pattern 28, is applied to the hot injection resin melt during insert injection molding. This is to avoid touching it.

전기한 바와 같이 도 2의 (d)단계를 거치게 되면 열성형과 프레스 절곡으로 입체곡면 표면부를 갖는 인몰드용 인쇄회로필름(20)을 얻게 되며, 그 후에는 도 3의 (e)에서와 같이, 인서트 사출을 수행한다. As described above, when step (d) of FIG. 2 is passed, an in-mold printed circuit film 20 having a three-dimensional curved surface is obtained by thermoforming and press bending, and after that, as in FIG. 3 (e), Perform insert injection.

도 3을 참조하면, 열성형과 프레스 절곡으로 입체곡면 표면부를 갖는 인몰드용 인쇄회로필름(20)을 도 3의 (e)에서와 같이, 인서트 사출금형(40)에 투입하되 열성형 영역부(X)에 해당하는 인몰드용 인쇄회로필름(20)의 배면공간부에는 인서트 사출금형(40)의 캐비티(34)가 마련되고 프레스 가공영역부(Y)에 해당하는 인몰드회로필름(20)의 커넥터단자부(32)가 인서트 사출금형(40)의 상하금형(40a)(40b)의 밀착 구조와 인서트사출 보호필름(30)에 의해 보호되게 한 상태가 되게 한다. Referring to FIG. 3, the in-mold printed circuit film 20 having a three-dimensional curved surface by thermoforming and press bending is injected into the insert injection mold 40 as shown in FIG. 3(e), but the thermoforming area part ( In the rear space portion of the in-mold printed circuit film 20 corresponding to X), a cavity 34 of the insert injection mold 40 is provided, and the in-mold circuit film 20 corresponding to the press processing area portion Y The connector terminal part 32 is in a state in which the contact structure of the upper and lower molds 40a and 40b of the insert injection mold 40 and the insert injection protective film 30 protects it.

이렇게 인몰드용 인쇄회로필름(20)을 인서트 사출금형(40)에 투입한 후 고온의 사출수지용융액을 금형주입구를 통해 인서트 사출금형(40)에 주입하여서 인서트 사출성형이 이루어져서 열성형 영역부(X)에 해당하는 인몰드회로필름(20)의 배면부에는 1~3mm두께의 인몰드 수지층(36)이 형성되게 하며, 이때 사출수지용용액은 인서트 사출금형(40)의 상하금형(40a)(40b)의 밀착 구조와 인서트사출 보호필름(30)의 보호에 의해서 인몰드용 인쇄회로필름(20)의 커넥터단자부(32) 및 단자패턴(28)에는 접근하지 못한다. In this way, after injecting the printed circuit film 20 for in-mold into the insert injection mold 40, a high-temperature injection resin melt is injected into the insert injection mold 40 through the mold inlet, so that the insert injection molding is performed and the thermoforming area (X ), the in-mold resin layer 36 having a thickness of 1 to 3 mm is formed on the rear portion of the in-mold circuit film 20, and the injection resin solution is the upper and lower molds 40a and 40b of the insert injection mold 40. ) And the protection of the insert-injection protective film 30, the connector terminal 32 and the terminal pattern 28 of the in-mold printed circuit film 20 are not accessible.

상기 사출수지용융액은 내열성 및 절연성 수지 재질로서 PC(PolyCarbonate)수지, ABS(acrylonitrile butadien styrene)수지, PMMA(Poly Methyl Methacrylate)수지가 양호하다.The injection resin melt is a heat-resistant and insulating resin material, such as PC (Poly Carbonate) resin, ABS (acrylonitrile butadien styrene) resin, PMMA (Poly Methyl Methacrylate) resin.

인서트 사출성형시 인몰드용 인쇄회로필름(20)의 배면에 형성되는 인몰드 수지층(36)은 투광성 내지 투명성 수지재질로 형성되는 것이 바람직하며, 그 두께는 1~3mm이다. During insert injection molding, the in-mold resin layer 36 formed on the rear surface of the in-mold printed circuit film 20 is preferably formed of a light-transmitting or transparent resin material, and its thickness is 1 to 3 mm.

인몰드 수지층(36)의 두께가 1mm 미만이면 금형캐비티 수지용융액의 흐르는 공간이 부족하여 인몰드 수지층(36) 형성에 있어 불량이 될 가능성이 있고, 만일 인몰드 수지층(36)의 두께가 3mm를 초과하면 인쇄회로층(28)에 주로 구비되는 정전용량형 터치센서부의 감지 작동에 불량이 생길 수 있다는데에, 그 범위의 임계적 의의가 있다. If the thickness of the in-mold resin layer 36 is less than 1 mm, there is a possibility that the in-mold resin layer 36 may be defective due to insufficient flow space of the mold cavity resin melt, and if the thickness of the in-mold resin layer 36 If is greater than 3mm, there is a critical significance of the range, since a defect may occur in the sensing operation of the capacitive touch sensor unit mainly provided in the printed circuit layer 28.

도 3의 (e)와 함께 전술하였듯이 인몰드 수지층(36)이 형성되게 인서트 사출성형한 다음, 본 발명에서는 인서트 사출 성형물을 탈형 및 냉각함으로써 도 3의 (f)와 같이 커넥터단자부(32)가 옆으로 누워 있는 커넥터단자부 일체형 인몰드 전자회로 성형물(A)을 얻는다. After insert injection molding so that the in-mold resin layer 36 is formed as described above with FIG. 3(e), in the present invention, the insert injection molded product is demolded and cooled, so that the connector terminal part 32 as shown in FIG. 3(f) A connector terminal unit-integrated in-mold electronic circuit molded product (A) lying on its side is obtained.

커넥터단자부 일체형 인몰드 전자회로 성형물(A)을 인서트 사출금형(40)에서 도 3의 (f)에서와 같이 탈형한 다음, 본 발명에서는 도 3의 (g)에서와 같이 커넥터단자부(32)를 직립되게 세우는 작업을 수행한다. 커넥터단자부(32)의 직립은 힘을 가해서 성취될 수 있으며 상대방 암 커넥터와의 연결성이 양호하게 된다. After the connector terminal part integrated in-mold electronic circuit molded product (A) is demolded from the insert injection mold 40 as in FIG. 3(f), in the present invention, the connector terminal part 32 is removed as in FIG. 3(g). Perform the task of standing upright. The uprightness of the connector terminal portion 32 can be achieved by applying force, and the connection with the counterpart female connector is good.

또 그 후 본 발명에서는 도 3의 (g)에서와 같이, 직립으로 세워진 커넥터단자부(32)의 열가소성수지 투명필름(22)면에 보강 플레이트(38)를 부착 형성함으로써 커넥터단지부(32)가 인몰드 전자회로 성형물(A)의 측부에 견고히 직립 고정되도록 한다. After that, in the present invention, as shown in Fig. 3(g), the connector terminal portion 32 is formed by attaching a reinforcing plate 38 to the surface of the thermoplastic resin transparent film 22 of the connector terminal portion 32 erected upright. The in-mold electronic circuit is firmly fixed to the side of the molded article (A).

상술한 본 발명의 설명에서는 구체적인 실시 예에 관해 설명하였으나, 여러 가지 변형이 본 발명의 범위에서 벗어나지 않고 실시할 수 있다. 따라서 본 발명의 범위는 설명된 실시 예에 의하여 정할 것이 아니고 특허청구범위 및 그 특허청구범위와 균등한 것에 의해 정해 져야 한다. In the above description of the present invention, specific embodiments have been described, but various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be determined by the described embodiments, but should be determined by the claims and equivalents to the claims.

(2)-- 인쇄회로필름 (3)-- 제품성형물
(4)-- 터치센서부 (6)-- 인쇄회로패턴라인
(8)-- 플렉서블 인쇄회로 케이블 (10)-- 커넥터단자부
(20)-- 인몰드용 인쇄회로필름 (22)-- 열가소성수지 투명필름
(24)-- 그래픽인쇄층 (26)-- 인쇄회로층
(26a)-- 인쇄회로패턴 (28)-- 단자패턴
(30)-- 인서트사출 보호필름 (32)-- 커넥터단자부
(34)-- 캐비티 (36)-- 인몰드 수지층
(38)-- 보강플레이트 (40)-- 인서트 사출금형
(40a)-- 상형금형 (40b)-- 하형금형
(X)-- 열성형 영역부 (Y)-- 프레스 가공 영역부
(A)-- 커넥터단자부 일체형 인몰드 전자회로 성형물(2)-- Printed circuit film (3)-- Product molding
(4)-- Touch sensor part (6)-- Printed circuit pattern line
(8)-- Flexible printed circuit cable (10)-- Connector terminal part
(20)-- Printed circuit film for in-mold (22)-- Thermoplastic transparent film
(24)-- Graphic printed layer (26)-- Printed circuit layer
(26a) - Printed circuit pattern (28) - Terminal pattern
(30)-- Insert injection protective film (32)-- Connector terminal part
(34)-- Cavity (36)-- In-mold resin layer
(38)-- Reinforcement plate (40)-- Insert injection mold
(40a)-- Upper mold (40b)-- Lower mold
(X) - Thermoforming area (Y) - Press processing area
(A)-- In-mold electronic circuit molded product with integrated connector terminal

Claims (2)

커넥터단자부 일체형 인몰드 전자회로 성형물의 제조방법에 있어서,
투명성 및 내열성을 갖는 100~300㎛두께의 열가소성수지 투명필름(22)과 열가소성 투명필름(22) 배면상에 5~15㎛두께의 그래픽인쇄층(24)과 도전성 잉크를 이용하여 5~35㎛두께의 인쇄회로층(26)을 차례로 형성하여 인몰드용 인쇄회로필름(20)을 마련하되 열성형 영역부(X)와 커넥터단자부 형성을 위한 프레스가공 영역부(Y)로 구분하며 프레스 가공영역부(Y)에는 열가소성수지 투명필름(22)상에 인쇄회로층(26)의 인쇄회로패턴(26a)이 형성되게 하는 제1 과정과,
인몰드용 인쇄회로필름(20)의 프레스 가공영역부(Y)에 인쇄형성된 인쇄회로패턴(26a)에 연이어 카본페이스트를 이용하여 단자패턴(28)을 인쇄형성하여 커넥터 단자부(32)를 마련하는 제2 과정과,
프레스 가공영역부(Y)의 인쇄회로패턴(26a)상에는 100~250㎛두께의 내열성수지재 인서트사출 보호필름(30)을 접착형성하는 제3 과정과,
상기 제3과정을 거친 인몰드용 인쇄회로필름(20)을 인서트 사출금형에 맞으며 입체 표면형성을 위해 부분 열성형하되 열성형 영역부(X)에는 열성형하고, 프레스 가공영역부(Y)에는 커넥터 단자부(32)가 인서트 사출금형(40)의 일측 계단부 상측에 위치하게 되도록 인몰드용 인쇄회로필름(20)을 프레스 절곡으로 계단형성하는 제4 과정과,
열성형과 프레스 절곡으로 입체곡면 표면부를 갖는 인몰드용 인쇄회로필름(20)을 인서트 사출금형(40)에 투입하되 열성형 영역부(X)에 해당하는 인몰드용 인쇄회로필름(20)의 배면공간부에는 인서트 사출금형(40)의 캐비티(34)가 마련되고 프레스 가공영역부(Y)에 해당하는 인몰드회로필름(20)의 커넥터단자부(32)가 인서트 사출금형(40)의 상하금형(40a)(40b)의 밀착 구조와 인서트사출 보호필름(30)에 의해 보호되게 한 상태에서 사출수지용융액을 인서트 사출금형(40)에 주입하여 인서트 사출성형이 이루어져서 열성형 영역부(X)에 해당하는 인몰드회로필름(20)의 배면부에 1~3mm두께의 인몰드 수지층(36)이 형성되게 하는 제5 과정과,
제5과정에서 성형된 커넥터단자부 일체형 인몰드 전자회로 성형물(A)을 인서트 사출금형(40)에서 탈형한 후 커넥터단자부(32)를 직립으로 세우는 제6 과정으로 이루어짐을 특징으로 하는 커넥터단자부 일체형 인몰드 전자회로 성형물의 제조방법.
In the method of manufacturing an in-mold electronic circuit molded article integrated with a connector terminal portion,
Using a 5 to 15 μm thick graphic printing layer 24 and conductive ink on the back of the 100 to 300 μm thick thermoplastic resin transparent film 22 and thermoplastic transparent film 22 with transparency and heat resistance A printed circuit layer 26 of thickness is sequentially formed to prepare a printed circuit film 20 for in-mold, but divided into a thermoforming area (X) and a press processing area (Y) for forming a connector terminal, and press processing area In (Y), a first process for forming the printed circuit pattern 26a of the printed circuit layer 26 on the thermoplastic resin transparent film 22, and
A terminal pattern 28 is formed by printing a terminal pattern 28 using carbon paste in succession to the printed circuit pattern 26a printed on the press-processed area portion Y of the in-mold printed circuit film 20 to provide the connector terminal portion 32. Course 2,
A third process of bonding and forming an insert injection protective film 30 of a heat-resistant resin material having a thickness of 100 to 250 μm on the printed circuit pattern 26a of the press processing area portion Y, and
The in-mold printed circuit film 20 that has passed through the third process is fitted with an insert injection mold and partially thermoformed to form a three-dimensional surface, but thermoformed in the thermoforming area (X), and the connector in the press processing area (Y). A fourth process of forming a step by press bending the in-mold printed circuit film 20 so that the terminal part 32 is positioned above the step part on one side of the insert injection mold 40,
Insert the in-mold printed circuit film 20 having a three-dimensional curved surface by thermoforming and press bending into the insert injection mold 40, but the rear space of the in-mold printed circuit film 20 corresponding to the thermoforming area (X) A cavity 34 of the insert injection mold 40 is provided in the part, and the connector terminal 32 of the in-mold circuit film 20 corresponding to the press processing area part Y is the upper and lower molds of the insert injection mold 40 ( Insert injection molding is performed by injecting the injection resin melt into the insert injection mold 40 in a state protected by the adhesion structure of 40a) (40b) and the insert injection protective film 30, corresponding to the thermoforming area (X) A fifth process of forming an in-mold resin layer 36 having a thickness of 1 to 3 mm on the rear surface of the in-mold circuit film 20,
Connector terminal integrated in-mold, characterized in that it consists of a sixth step of erecting the connector terminal part 32 upright after removing the molded product (A) of the connector terminal part integrated in-mold electronic circuit molded in the 5th process from the insert injection mold 40 De electronic circuit molding product manufacturing method.
 제1항에 있어서, 직립으로 세워진 커넥터단자부(32)의 열가소성수지 투명필름(22)면에 보강 플레이트(38)를 부착 형성하는 제7 과정을 더 가짐을 특징으로 하는 커넥터단자부 일체형 인몰드 전자회로 성형물의 제조방법.The integrated in-mold electronic circuit according to claim 1, further comprising a seventh process of attaching and forming a reinforcing plate (38) to the surface of the thermoplastic resin transparent film (22) of the connector terminal portion (32) erected upright. Method of making a molding.
KR1020190039966A 2019-04-05 2019-04-05 Method for mafacturing in mold electronics molding mounted connector terminals KR102204529B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020190039966A KR102204529B1 (en) 2019-04-05 2019-04-05 Method for mafacturing in mold electronics molding mounted connector terminals

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190039966A KR102204529B1 (en) 2019-04-05 2019-04-05 Method for mafacturing in mold electronics molding mounted connector terminals

Publications (2)

Publication Number Publication Date
KR20200117609A true KR20200117609A (en) 2020-10-14
KR102204529B1 KR102204529B1 (en) 2021-01-20

Family

ID=72846846

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190039966A KR102204529B1 (en) 2019-04-05 2019-04-05 Method for mafacturing in mold electronics molding mounted connector terminals

Country Status (1)

Country Link
KR (1) KR102204529B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023126109A1 (en) * 2021-12-29 2023-07-06 Luxottica S.R.L. Eyeglasses component and its production method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002176066A (en) * 2000-12-08 2002-06-21 Sony Corp Semiconductor memory medium and manufacturing method thereof
JP2005032815A (en) * 2003-07-08 2005-02-03 Alps Electric Co Ltd Flexible wiring board and its manufacturing method
JP2011238429A (en) * 2010-05-10 2011-11-24 Shin Etsu Polymer Co Ltd Heat seal connector
KR20190020968A (en) 2017-08-22 2019-03-05 주식회사 사마스전자 Method for manufacturing cable connector having double insert molding structure, and a cable connector manufactured thereby

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002176066A (en) * 2000-12-08 2002-06-21 Sony Corp Semiconductor memory medium and manufacturing method thereof
JP2005032815A (en) * 2003-07-08 2005-02-03 Alps Electric Co Ltd Flexible wiring board and its manufacturing method
JP2011238429A (en) * 2010-05-10 2011-11-24 Shin Etsu Polymer Co Ltd Heat seal connector
KR20190020968A (en) 2017-08-22 2019-03-05 주식회사 사마스전자 Method for manufacturing cable connector having double insert molding structure, and a cable connector manufactured thereby

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023126109A1 (en) * 2021-12-29 2023-07-06 Luxottica S.R.L. Eyeglasses component and its production method

Also Published As

Publication number Publication date
KR102204529B1 (en) 2021-01-20

Similar Documents

Publication Publication Date Title
EP2695715B1 (en) Device module and method of manufacturing the same
CN104853896B (en) The main body manufactured by in-mold process and the method for manufacturing the main body
JP6480989B2 (en) Molded product, electrical product, and method for producing molded product
US8238073B2 (en) In-molded capacitive sensors
KR102464287B1 (en) Method of manufacturing electronic assembly and electronic assembly
CN102202477B (en) Electronic device shell
CN110324973B (en) Film-coated injection-molded circuit structure and method for manufacturing same
WO2011020946A2 (en) Electronic device
KR102204529B1 (en) Method for mafacturing in mold electronics molding mounted connector terminals
JP6468927B2 (en) Molding method and molding die for sensor-integrated resin molded product
JP2022081517A (en) Molded product, electrical product, and manufacturing method of molded product
CN101272901A (en) In mold manufacturing of an object comprising a functional element
CN108021296A (en) Integral intelligent surface structure function part and its manufacture method
KR101537161B1 (en) Surface panel with detection function and method for manufacturing thereof
CN215006604U (en) Touch panel with thin film circuit board
WO2016059927A1 (en) Molded article, electrical component sheet, and method for manufacturing molded article and electrical product
CN210091114U (en) Touch panel
KR102097993B1 (en) In mold electronics molding mounted connector terminals hving waterproofing and durability
CN101447354A (en) In-mold molding touch control module and manufacturing method thereof
JP6283878B2 (en) Panel integrated touch sensor and method for manufacturing panel integrated touch sensor
TWI781702B (en) In-mold electronics manufacturing process made electronic component and manufacturing method thereof
CN109791455B (en) Method for manufacturing input device
CN212555356U (en) Exempt from anti high temperature of silk screen printing and mould plastics textured shell
TW202112190A (en) Touch module and manufacturing method thereof
CN115915602A (en) Molded electronic component and method of making the same

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant