TW202111426A - Manufacturing method of a patterned resin device - Google Patents

Abstract

A manufacturing method of a patterned resin device includes a substrate preparation step, a protective film setting step, a patterning step, and a cleaning step. The substrate preparation step is to provide a resin substrate. The protective film setting step is to provide a protective film on the resin substrate. The patterning step applies energy to a predetermined area on the resin substrate to pattern the surface of the glue substrate. The cleaning step is to clean and remove the protective film to form a patterned resin device. By forming a protective film formed on the surface of the resin substrate, the dust or debris generated during the pattering step can be fully removed from the surface of the resin substrate in the cleaning step, such that the defects caused by the dust or debris in subsequent processes can be prevented. Therefore, the patterned resin device can be applied to precise processes.

Description

Manufacturing method of patterned glue material device

This application relates to the field of glue patterning, in particular to a method for manufacturing a patterned glue device.

Due to the characteristics of the soft colloidal material itself, it has controllable viscosity and is suitable for various component transfer processes. Therefore, patterned adhesive materials have been more and more widely used in various fields, such as patterned sapphire substrate imprinting materials And other optical applications.

At present, the common method of manufacturing the patterned adhesive device is hot embossing or UV embossing. However, due to the characteristics of the soft colloidal material, it may cause uncontrollable displacement when it is released from the mold due to shrinkage, uneven curing, etc. It may also be due to the impact of the imprinted mold on the surface characteristics, or residual release agent. These problems have caused problems such as material residues and difficult control of precision, and have caused restrictions on subsequent manufacturing processes.

In addition, if it is patterned by post-curing processing, the surface is prone to large damage, and because of its viscosity, it is easy to adhere to debris and difficult to clean and remove. This is prone to debris and pollution when applied to high-precision manufacturing processes, which affects the subsequent process yield and requires more equipment maintenance time.

Here, a method for manufacturing a patterned adhesive material device is provided. The manufacturing method of the patterned adhesive device includes a substrate preparation step, a protective film setting step, a patterning step, and a cleaning step. The substrate preparation step is to provide a glue substrate. The protective film setting step is to set the protective film on the adhesive substrate. The patterning step is to apply energy to a predetermined area on the glue substrate to pattern the surface of the glue substrate. The cleaning step is to clean and remove the protective film to form a patterned adhesive device.

In some embodiments, the patterning step is to perform laser cutting on a predetermined area on the adhesive substrate to form a groove in the predetermined area. Further, in some embodiments, the wavelength of the laser source used for laser cutting is 200-580 nm.

In some embodiments, the adhesive substrate is selected from silicone, polydimethylsiloxane (PDMS), polyimide (PI), polyurethane (PU), acrylic A group consisting of force, latex, and epoxy.

In some embodiments, in the protective film setting step, the protective film is provided on the adhesive substrate in a pasting manner. In other embodiments, in the protective film setting step, the protective liquid is coated on the surface of the adhesive substrate, and then dried to form the protective film.

In some embodiments, the thickness of the protective film is 0.2 to 15um.

In some embodiments, the protective film includes an amphoteric polymer and a light absorber.

In more detail, in some embodiments, (polyvinylpyrrolidone, PVP), polyvinylpyrrolidone/vinyl acetate (PVP/VA), polyethylene glycol (PEG), polyepoxy Ethane (PEO), poly(2-ethyl-2-oxazoline) (poly(2-ethyl-2-oxazoline)), and polyacrylic acid (PAA) constitute a group.

In more detail, in some embodiments, the light absorber is selected from the group consisting of salicylate light absorbers, benzophenone light absorbers, benzotriazole light absorbers, triazine light absorbers, and tetrapyrroles. The group consisting of pigments, terpene pigments, polyphenol pigments, food coloring yellow No. 4 and food coloring red No. 7.

In summary, by forming the protective film on the surface of the adhesive substrate, the removed debris can be prevented from sticking to the surface of the adhesive substrate during the patterning step and is difficult to remove, causing serious defects in the subsequent manufacturing process. Furthermore, this manufacturing method can make the pattern fine, and can be applied to a precise manufacturing process.

Fig. 1 is a flowchart of a manufacturing method of a patterned adhesive device. Figure 2 is a schematic diagram of the substrate preparation steps. Figure 3 is a schematic diagram of the protective film setting steps. FIG. 4 is a schematic diagram of an embodiment of the patterning step. Fig. 5 is a three-dimensional schematic diagram of a patterned glue device. Hereinafter, FIGS. 1 to 5 will be used to describe the manufacturing method of the patterned glue device.

As shown in FIG. 1, the manufacturing method S1 of the patterned adhesive device includes a substrate preparation step S10, a protective film setting step S20, a patterning step S30, and a cleaning step S40. As shown in FIG. 2, the substrate preparation step S10 is to provide an adhesive substrate 10. Since the adhesive substrate 10 is relatively soft and easily deformed, the adhesive substrate 10 is usually placed on the carrier 500 to facilitate subsequent steps. Further, the adhesive substrate 10 can also be formed on the carrier 500 by spin coating or pouring into a mold and pressing, and then curing by heating or light. Here, the carrier 500 is usually a light-transmitting material with a relatively hard hardness, for example, a quartz plate, a glass plate, and the like.

Further, the adhesive substrate 10 can be made of at least one of materials such as silicone, polydimethylsiloxane, polyimide, polyurethane, acrylic, latex, or epoxy. to make.

As shown in FIG. 3, the protective film setting step S20 is to install the protective film 20 on the adhesive substrate 10. The thickness of the protective film 20 is 0.2-15um, preferably 0.5-10um. In some embodiments, the protective film 20 can be pre-finished, and is provided on the adhesive substrate 10 in a whole pasting manner to cover the surface of the adhesive substrate 10. In other embodiments, the protective liquid is applied on the surface of the adhesive substrate 10 through spin coating, and then the protective film 20 is formed by drying. However, the above is only an example, not a limitation. Furthermore, the protective film 20 is further formed on the surface of the carrier board 500.

The patterning step S30 is to apply energy to a predetermined area on the adhesive substrate 10 to pattern the surface of the adhesive substrate 10. Here, various high-energy methods can be applied to implement patterning. As shown in FIG. 4, in the first embodiment, the patterning step S30 is to perform laser cutting in a preset area on the adhesive substrate 10 through the laser source 200, so that the preset area forms a groove 15 in Therefore, the wavelength of the laser source 200 is 200-580 nm, that is, the wavelength range between ultraviolet light and green light. In more detail, the laser source 200 can use a 532nm green laser, a 355nm UV laser, or the like. Here, although the laser source 200 is only shown to be cut in a single direction, in fact, the laser source 200 can be cut through lateral and vertical movement. Since the focal point of the laser source 200 is small, fine patterns can be generated. In addition, the selection of the laser source 200 can select a wavelength band that the plastic substrate 10 does not absorb, so as to prevent the material of the plastic substrate 10 from deteriorating.

In more detail, the laser cutting method of the laser source 200 can be cut from the inside, and then gradually cut outwards, so as to prevent the debris generated during patterning from accumulating on the side. However, although laser cutting is used as an example method of the patterning step S30, this is not a limitation. Other methods using high energy, such as plasma or lithography, and etching, can also be used for the patterning step. S30.

The cleaning step S40 is to remove the protective film 20 through cleaning. The cleaning can be through water, acid cleaning or organic solvents, but it must be considered that it does not react with the adhesive substrate 10. Furthermore, an ultrasonic water tank can also be used for cleaning, so that all particles sticking to the surface are removed together with the protective film 20. Further, in the cleaning step S40, the protective film 20 formed on the carrier 500 is also removed.

As shown in FIG. 5, after the cleaning step S40, the patterned glue device 100 can be obtained. The carrier 500 can be shipped as an integrated unit with the patterned glue device 100. The patterned structure of the patterned adhesive device 100 can be applied to the transfer of various patterned arrangements.

In more detail, in some embodiments, the protective film 20 may include an amphoteric polymer and a light absorber. The amphoteric polymer can contact the plastic substrate 10 at the hydrophobic end to strengthen the adhesive properties of the protective film 20 and the plastic substrate 10. In addition, the hydrophilic end makes the protective film 20 easy to dissolve so that it can be removed after the patterning step S30. The water and the cleaning liquid are removed, and the debris generated in the patterning step S30 is removed at the same time. In this way, no debris will be adhered to the patterned adhesive device 100 to avoid affecting the subsequent manufacturing process. The light absorber further assists the protective film 20 in absorbing energy.

In more detail, the amphoteric polymer may include polyvinylpyrrolidone, polyvinylpyrrolidone-vinyl acetate copolymer, polyethylene glycol, polyethylene oxide, poly(2-ethyl-2-oxazoline), or polyvinylpyrrolidone. At least one of acrylic. The light absorber may include a salicylate-based light absorber, a benzophenone-based light absorber, a benzotriazole-based light absorber, a triazine-based light absorber, a tetrapyrrole-based pigment, a terpene-based pigment, and a polyphenol At least one of the pigment, food coloring yellow No. 4, and food coloring red No. 7, which can be adjusted according to the laser source 200 or light used. The above is only an example, not a limitation.

In summary, the manufacturing method of the patterned adhesive material device can solve the problem of deviation in the prior art when it is released from the mold. In addition, the protective film 20 is formed on the surface of the adhesive substrate 10, and the patterning In step S30, the removed debris can be prevented from sticking to the surface of the adhesive substrate 10 and difficult to be removed, causing serious defects in the subsequent manufacturing process. Furthermore, the manufacturing method S1 of the patterned adhesive material device can produce fine patterns on the adhesive material substrate 10, and can be applied to a precise manufacturing process. For example, the adhesiveness of the patterned adhesive device 100 can be used as an adhesion carrier for the mass transfer of Micro-LEDs.

10: Adhesive substrate 15: Groove 20: Protective film 100: Patterned glue device 200: Laser source 500: carrier board S1: Manufacturing method of patterned glue device S10: Substrate preparation steps S20: protective film setting steps S30: Patterning step S40: Cleaning steps

Fig. 1 is a flowchart of a manufacturing method of a patterned adhesive device. Figure 2 is a schematic diagram of the substrate preparation steps. Figure 3 is a schematic diagram of the protective film setting steps. FIG. 4 is a schematic diagram of an embodiment of the patterning step. Fig. 5 is a three-dimensional schematic diagram of a patterned glue device.

S1: Manufacturing method of patterned glue device

S10: Substrate preparation steps

S20: protective film setting steps

S30: Patterning step

S40: Cleaning steps

Claims (10)

A method for manufacturing a patterned adhesive material device, including: A substrate preparation step, providing an adhesive substrate; A protective film setting step, setting a protective film on the adhesive substrate; A patterning step, applying energy to a predetermined area on the adhesive substrate to pattern a surface of the adhesive substrate; and In a cleaning step, the protective film is cleaned and removed to form a patterned adhesive device. The method for manufacturing a patterned adhesive device according to claim 1, wherein the patterning step is to perform laser cutting on the predetermined area on the adhesive substrate to form a groove in the predetermined area. The method for manufacturing a patterned adhesive device according to claim 2, wherein the wavelength of a laser source used for laser cutting is 200-580 nm. The method for manufacturing a patterned adhesive device according to claim 1, wherein the adhesive substrate is selected from the group consisting of silicone, polydimethylsiloxane, polyimide, polyurethane, acrylic, and latex , And the group consisting of epoxy resin. The method for manufacturing a patterned adhesive material device according to claim 1, wherein in the protective film setting step, the protective film is arranged on the adhesive substrate in a pasting manner. The method for manufacturing a patterned adhesive device according to claim 1, wherein in the protective film setting step, a protective liquid is applied to the surface of the adhesive substrate, and then dried to form the protective film. The method for manufacturing a patterned adhesive device according to claim 1, wherein the thickness of the protective film is 0.2 to 15 um. The method for manufacturing a patterned adhesive device according to claim 1, wherein the protective film includes an amphoteric polymer and a light absorber. The method for manufacturing a patterned adhesive device according to claim 8, wherein the amphoteric polymer is selected from polyvinylpyrrolidone, polyvinylpyrrolidone-vinyl acetate copolymer, polyethylene glycol, polyethylene oxide, poly (2-Ethyl-2-oxazoline), and the group consisting of polyacrylic acid. The method for manufacturing a patterned adhesive device according to claim 8, wherein the light absorber is selected from the group consisting of a salicylate light absorber, a phenone light absorber, and a benzotriazole light absorber The group consisting of edible agents, triazine-based light absorbers, tetrapyrrole-based pigments, terpene-based pigments, polyphenol-based pigments, food coloring yellow 4 and food coloring red 7.

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