TWI799497B - Protective liquid and protective film for laser cutting soft resin materials - Google Patents
Protective liquid and protective film for laser cutting soft resin materials Download PDFInfo
- Publication number
- TWI799497B TWI799497B TW108102096A TW108102096A TWI799497B TW I799497 B TWI799497 B TW I799497B TW 108102096 A TW108102096 A TW 108102096A TW 108102096 A TW108102096 A TW 108102096A TW I799497 B TWI799497 B TW I799497B
- Authority
- TW
- Taiwan
- Prior art keywords
- protective
- laser cutting
- resin materials
- soft resin
- protective film
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D139/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Coating compositions based on derivatives of such polymers
- C09D139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
- C09D139/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/32—Radiation-absorbing paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/48—Stabilisers against degradation by oxygen, light or heat
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108102096A TWI799497B (en) | 2019-01-18 | 2019-01-18 | Protective liquid and protective film for laser cutting soft resin materials |
CN202010053149.1A CN111454634A (en) | 2019-01-18 | 2020-01-17 | Protective liquid and protective film for laser cutting of soft colloid material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108102096A TWI799497B (en) | 2019-01-18 | 2019-01-18 | Protective liquid and protective film for laser cutting soft resin materials |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202028263A TW202028263A (en) | 2020-08-01 |
TWI799497B true TWI799497B (en) | 2023-04-21 |
Family
ID=71676929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108102096A TWI799497B (en) | 2019-01-18 | 2019-01-18 | Protective liquid and protective film for laser cutting soft resin materials |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN111454634A (en) |
TW (1) | TWI799497B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI768239B (en) * | 2019-09-05 | 2022-06-21 | 群越材料股份有限公司 | Manufacturing method of a patterned resin device |
CN112853458A (en) * | 2021-01-08 | 2021-05-28 | 常州晶业液态金属有限公司 | Method for processing amorphous alloy by electrochemical material removal |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201831583A (en) * | 2017-02-24 | 2018-09-01 | Mti有限公司 | Coating agent composition for wafer protection in laser scribing process preventing a wafer from being damaged in laser scribing through easy attachment and enhanced adhesion to a surface of the wafer and improving cleaning ability |
TW201833235A (en) * | 2017-03-09 | 2018-09-16 | 大陸商深圳怡鈦積科技股份有限公司 | Protective film composition for laser cutting with high thermal stability reducing thermal effect, completely preserving integrity once the base materials have been processed, and protecting the flatness and the accuracy of cutting line width |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8563115B2 (en) * | 2008-08-12 | 2013-10-22 | Xerox Corporation | Protective coatings for solid inkjet applications |
-
2019
- 2019-01-18 TW TW108102096A patent/TWI799497B/en active
-
2020
- 2020-01-17 CN CN202010053149.1A patent/CN111454634A/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201831583A (en) * | 2017-02-24 | 2018-09-01 | Mti有限公司 | Coating agent composition for wafer protection in laser scribing process preventing a wafer from being damaged in laser scribing through easy attachment and enhanced adhesion to a surface of the wafer and improving cleaning ability |
TW201833235A (en) * | 2017-03-09 | 2018-09-16 | 大陸商深圳怡鈦積科技股份有限公司 | Protective film composition for laser cutting with high thermal stability reducing thermal effect, completely preserving integrity once the base materials have been processed, and protecting the flatness and the accuracy of cutting line width |
Also Published As
Publication number | Publication date |
---|---|
CN111454634A (en) | 2020-07-28 |
TW202028263A (en) | 2020-08-01 |
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