CN111454634A - Protective liquid and protective film for laser cutting of soft colloid material - Google Patents
Protective liquid and protective film for laser cutting of soft colloid material Download PDFInfo
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- CN111454634A CN111454634A CN202010053149.1A CN202010053149A CN111454634A CN 111454634 A CN111454634 A CN 111454634A CN 202010053149 A CN202010053149 A CN 202010053149A CN 111454634 A CN111454634 A CN 111454634A
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- light absorber
- laser cutting
- protective
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- amphoteric polymer
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- 230000001681 protective effect Effects 0.000 title claims abstract description 70
- 239000000463 material Substances 0.000 title claims abstract description 55
- 239000000084 colloidal system Substances 0.000 title claims abstract description 45
- 238000003698 laser cutting Methods 0.000 title claims abstract description 34
- 239000007788 liquid Substances 0.000 title abstract description 15
- 239000006096 absorbing agent Substances 0.000 claims abstract description 47
- 229920000642 polymer Polymers 0.000 claims abstract description 22
- 125000000524 functional group Chemical group 0.000 claims abstract description 20
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims abstract description 15
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims abstract description 15
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims abstract description 15
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 14
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims abstract description 8
- 239000004349 Polyvinylpyrrolidone-vinyl acetate copolymer Substances 0.000 claims abstract description 7
- 229920002125 Sokalan® Polymers 0.000 claims abstract description 7
- 229920006187 aquazol Polymers 0.000 claims abstract description 7
- 239000012861 aquazol Substances 0.000 claims abstract description 7
- 235000019448 polyvinylpyrrolidone-vinyl acetate copolymer Nutrition 0.000 claims abstract description 7
- 239000004584 polyacrylic acid Substances 0.000 claims abstract description 6
- 239000000049 pigment Substances 0.000 claims description 18
- 239000003963 antioxidant agent Substances 0.000 claims description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000004014 plasticizer Substances 0.000 claims description 14
- 239000012760 heat stabilizer Substances 0.000 claims description 12
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 11
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 9
- 239000012964 benzotriazole Substances 0.000 claims description 9
- 150000001412 amines Chemical class 0.000 claims description 7
- 239000004611 light stabiliser Substances 0.000 claims description 7
- RNFAKTRFMQEEQE-UHFFFAOYSA-N Tripropylene glycol butyl ether Chemical compound CCCCOC(CC)OC(C)COC(O)CC RNFAKTRFMQEEQE-UHFFFAOYSA-N 0.000 claims description 6
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 6
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 5
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 claims description 5
- 239000001263 FEMA 3042 Substances 0.000 claims description 5
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 5
- 239000012965 benzophenone Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 235000011187 glycerol Nutrition 0.000 claims description 5
- 229960001860 salicylate Drugs 0.000 claims description 5
- 150000004756 silanes Chemical class 0.000 claims description 5
- 229920002545 silicone oil Polymers 0.000 claims description 5
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 claims description 5
- 229940033123 tannic acid Drugs 0.000 claims description 5
- 235000015523 tannic acid Nutrition 0.000 claims description 5
- 229920002258 tannic acid Polymers 0.000 claims description 5
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002518 antifoaming agent Substances 0.000 claims description 4
- 150000008442 polyphenolic compounds Chemical class 0.000 claims description 4
- 235000013824 polyphenols Nutrition 0.000 claims description 4
- 150000003505 terpenes Chemical class 0.000 claims description 4
- 235000007586 terpenes Nutrition 0.000 claims description 4
- 150000003873 salicylate salts Chemical group 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 claims description 2
- 239000002530 phenolic antioxidant Substances 0.000 claims 1
- 125000003158 alcohol group Chemical group 0.000 abstract description 3
- 239000011241 protective layer Substances 0.000 description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 8
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 230000003078 antioxidant effect Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- -1 Polydimethylsiloxane Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 201000010099 disease Diseases 0.000 description 2
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 235000002864 food coloring agent Nutrition 0.000 description 2
- 239000004816 latex Substances 0.000 description 2
- 229920000126 latex Polymers 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000003017 thermal stabilizer Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D139/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Coating compositions based on derivatives of such polymers
- C09D139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
- C09D139/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/32—Radiation-absorbing paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/48—Stabilisers against degradation by oxygen, light or heat
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a protective liquid and a protective film for laser cutting of a soft colloid material. The protective solution comprises an amphoteric polymer, an anhydrous solvent, a film forming aid and a light absorber. The amphoteric polymer comprises lipophilic functional group and hydrophilic functional group, accounting for 5-40 wt%, wherein the amphoteric polymer is selected from the group consisting of polyvinylpyrrolidone, polyvinylpyrrolidone-vinyl acetate copolymer, polyethylene glycol, polyethylene oxide, Poly (2-ethyl-2-oxazoline), and polyacrylic acid. The anhydrous solvent is alcohol solvent, ether solvent or their combination, and accounts for 60-95 wt%. The film forming aid is 0.001 to 10 wt%. The light absorber is 0.00001 to 10 wt%.
Description
Technical Field
The invention relates to the field of laser cutting, in particular to a protective liquid and a protective film for laser cutting of a soft colloid material.
Background
Conventionally, soft colloidal materials such as silicone rubber, Polydimethylsiloxane (PDMS), Polyimide (PI), Polyurethane (PU), acryl, latex, epoxy resin, etc. are difficult to be precisely cut by a mechanical cutting method due to their characteristics, and are generally difficult to be formed by a process such as potting, etc. and thus difficult to have high precision. Thus, the application field of the soft colloid material is considerably limited. The manufacturing cost is also high.
In recent years, the laser cutting technology has been advanced, and stable laser sources have been developed for industrial mass production, so that the possibility of cutting soft colloid materials by using laser is greatly improved. However, since most of these soft colloid materials are organic materials, there are some problems in cutting the surface of the soft colloid material directly by using a laser, and firstly, the surface is easily damaged due to high energy of the laser, and in addition, the soft colloid has viscosity, easily adheres to debris caused by laser cutting, and is difficult to clean and remove. This is likely to cause chipping and contamination when applied to a high-precision process. Thus, the application field of the soft gel material is limited.
Disclosure of Invention
Herein, a protective solution for laser cutting of soft adhesive material is provided. The protective solution contains an amphoteric polymer, an anhydrous solvent, a film forming aid and a light absorber. The amphoteric polymer comprises lipophilic functional groups and hydrophilic functional groups, and accounts for 5-40 wt%, wherein the amphoteric polymer is selected from the group consisting of polyvinylpyrrolidone (PVP), polyvinylpyrrolidone-vinyl acetate copolymer (PVP/VA), polyethylene glycol (PEG), polyethylene oxide (PEO), poly (2-ethyl-2-oxazoline), and polyacrylic acid (PAA). The anhydrous solvent is alcohol solvent, ether solvent or their combination, and accounts for 60-95 wt%. The film forming aid is 0.001 to 10 wt%. The light absorber is 0.00001 to 10 wt%.
In some embodiments, the light absorber is selected from the group consisting of salicylate-based light absorbers, benzophenone-based light absorbers, benzotriazole-based light absorbers, triazine-based light absorbers, tetrapyrrole-based pigments, terpene-based pigments, polyphenol-based pigments, food color yellow number four, and food color red number seven. Further, in some embodiments, the light absorber absorbs at a wavelength of 200-580 nm.
In some embodiments, the coalescing agent is selected from the group consisting of hydrolyzed silane compounds, tannic acid, and low molecular weight polyethylene glycols.
In some embodiments, the protective solution for the laser soft colloid material further comprises a thermal stabilizer. The heat stabilizer is selected from the group consisting of hindered amine light stabilizers, hindered phenol antioxidants, phosphite antioxidants, and alcohol antioxidants. The heat stabilizer is 0.0001 to 10 wt%.
In some embodiments, the protective solution for laser soft colloid material further comprises a plasticizer selected from the group consisting of glycerin, silicone oil, triethylene Glycol, and Tripropylene Glycol Butyl Ether (TPnB), wherein the plasticizer is 0.0001 to 15 wt%.
In some embodiments, the protective solution for the laser soft colloid material further comprises an antifoaming agent or a leveling agent, wherein the antifoaming agent or the leveling agent accounts for 0.0001 to 5 wt%.
The protective film for laser cutting of the soft colloid material is also provided. The protective film comprises an amphoteric polymer, a film forming aid, a light absorber and a plasticizer. The amphoteric polymer comprises lipophilic functional group and hydrophilic functional group, accounting for 60-95 wt%, wherein the amphoteric polymer is selected from the group consisting of polyvinylpyrrolidone, polyvinylpyrrolidone-vinyl acetate copolymer, polyethylene glycol, polyethylene oxide, poly (2-ethyl-2-oxazoline), and polyacrylic acid. 0.1 to 25 wt% of a film-forming aid, 0.001 to 25 wt% of a light absorber, and 0.1 to 30 wt% of a plasticizer.
In some embodiments, the light absorber is selected from the group consisting of salicylate-based light absorbers, benzophenone-based light absorbers, benzotriazole-based light absorbers, and triazine-based light absorbers. Further, in some embodiments, the light absorber absorbs at a wavelength of 200-600 nm.
In some embodiments, the plasticizer is selected from the group consisting of glycerin, silicone oil, triethylene glycol, tripropylene glycol butyl ether.
In some embodiments, the anhydrous solvent has a polarity of less than 6.
In some embodiments, the coalescent is selected from the group consisting of hydrolyzed silane compounds, such as hydrolyzed tetraethoxysilane, tannic acid, and low molecular weight polyethylene glycols.
In some embodiments, the protective film for laser cutting the soft colloid material further comprises a stabilizer. The heat stabilizer is selected from the group consisting of hindered amine light stabilizer, hindered phenol antioxidant, phosphite antioxidant, and alcohol antioxidant, and the heat stabilizer is 0.1 to 25 wt%.
In the foregoing embodiments, the protective liquid or the protective film is easy to have affinity with the soft colloid material through its lipophilic functional group, so that the protective liquid or the protective film can be coated or disposed on the surface of the soft colloid material. After laser cutting, the protective liquid or the protective film can be removed by cleaning through the hydrophilic functional group, and the residual scraps caused by laser cutting can be taken away. In addition, the light absorbent can absorb partial energy, so that the soft colloid material is prevented from being directly damaged by high energy, and a better cutting effect is achieved. The soft colloid material can be cut by laser through the protective liquid or the protective film, so that the more precise size is achieved, the manufacturing cost and time are reduced, and the application field of the soft colloid material can be expanded.
Drawings
None.
Detailed Description
The invention provides a protective solution for laser cutting of a soft colloid material, which is coated on the surface of the soft colloid material, such as silica gel, Polydimethylsiloxane (PDMS), PI, PU, acrylic, latex, epoxy resin and the like, to form a protective layer for laser cutting.
The protective solution for laser cutting of the soft colloid material comprises oleophilic functional groups and hydrophilic functional groups, and accounts for 5 to 40 wt%, preferably 5 to 20 wt%. The amphoteric polymer is selected from the group consisting of polyvinylpyrrolidone, polyvinylpyrrolidone-vinyl acetate copolymer, polyethylene glycol, polyethylene oxide, poly (2-ethyl-2-oxazoline), and polyacrylic acid. The anhydrous solvent is alcohol solvent, ether solvent or their combination, and accounts for 60-95 wt%. Preferably 80 to 95%. The film-forming assistant is present in an amount of 0.001 to 10 wt%, preferably 0.01 to 6 wt%. The light absorber is present in an amount of 0.00001 to 10 wt%, preferably 0.001 to 6 wt%.
Here, the lipophilic functional group of the amphoteric polymer can easily have affinity with the soft colloid material due to the hydrophobic property of the surface of the soft colloid material, so that the protective liquid forms a protective layer on the soft colloid material. After laser cutting, the protective liquid can be sufficiently removed from the surface of the soft colloid material by cleaning through the hydrophilic functional group. The anhydrous solvent can dissolve the amphoteric polymer and aid in coating, and has a boiling point of 40-120 deg.C. In addition, the hydrophobicity of the soft colloid material is difficult to be completely matched with a strong polar solvent, and the polarity value of water is about 10.2, so that a coated protective layer is easy to have serious holes and protective retraction during laser cutting. More specifically, the polarity of the anhydrous solvent is less than 6, so that the matching effect can be achieved, and the defect of cracking, separation or collapse of the protective layer caused by laser cutting can be avoided.
The light absorber is mainly used for the energy of the specific wave band of the laser, and the high power of the laser is prevented from directly damaging the surface of the soft colloid material. Here, the light absorber is selected from the group consisting of a salicylate-based light absorber, a benzophenone-based light absorber, a benzotriazole-based light absorber, a triazine-based light absorber, a tetrapyrrole-based pigment, a terpene-based pigment, a polyphenol-based pigment, an edible pigment yellow number four and an edible pigment red number seven. Further, the light absorbing agent absorbs light with a wavelength of 200-580nm, i.e., the wavelength range from ultraviolet light to green light, preferably 400-550 nm. The film forming assistant is used for enabling the protective solution to easily form a film and forming the film on the surface of the soft colloid material. The film forming aid is selected from the group consisting of hydrolyzed silane compounds, tannic acid, and low molecular weight polyethylene glycols. Low molecular weight polyethylene glycol generally refers to molecular weights below 6,000. The film-forming assistant usually has plural hydroxyl (-OH) groups and generates hydrogen bonds with the amphoteric polymer to increase the mechanical properties after film formation and prevent cracking after cutting. Here, the hydrosilane compound may be Tetraethoxysilane (TEOS), however, this is merely an example and is not intended to be limiting.
In some embodiments, the protective solution for the laser soft colloid material further comprises a thermal stabilizer. The heat stabilizer is selected from the group consisting of hindered amine light stabilizers, hindered phenol antioxidants, phosphite antioxidants, and alcohol antioxidants. The heat stabilizer is 0.0001 to 10 wt%, preferably 0.01 to 6 wt%. The heat stabilizer can be used for capturing free radicals generated in the laser cutting process and preventing the phenomena of difficult dissolution and separation generated by crosslinking.
In some embodiments, the protective solution for the laser soft colloid material further comprises a plasticizer selected from the group consisting of glycerin, silicone oil, triethylene glycol, and tripropylene glycol butyl ether, wherein the plasticizer is 0.0001 to 15 wt%, preferably 0.01 to 6 wt%. The plasticizer increases flexibility after film forming, and can be adjusted according to different soft colloid materials.
Furthermore, in order to avoid foaming of the protective solution or uneven coating, a defoaming agent or a leveling agent may be added to the protective solution, so that the thickness of the protective layer formed when the protective layer is coated on the soft colloid material is more uniform.
The following are presented as examples and related experimental data, and the experimental results are shown in table 1. Here, the protective solution of experimental example one is 11 wt% of polyvinylpyrrolidone, 88.2 wt% of a mixed solvent of propylene glycol methyl ether and ethanol, 0.55 wt% of TEOS, and 0.22 wt% of a benzotriazole-based light absorber. The protective solution of experimental example two contained 10.96 wt% of polyvinylpyrrolidone, 87.7 wt% of a mixed solvent of propylene glycol methyl ether and ethanol, and 0.58 wt% of TEOS. 0.21 wt% of a benzotriazole-based light absorber, and 0.548 wt% of a hindered amine light stabilizer. The protective solution of comparative example one contains 11.1 wt% of polyvinylpyrrolidone and 88.8 wt% of a mixed solvent of propylene glycol methyl ether and ethanol. The protective solution of comparative example two contained 11 wt% of polyvinylpyrrolidone, 88.4 wt% of a mixed solvent of propylene glycol methyl ether and ethanol, and 0.55 wt% of TEOS. The protective solution of comparative example three was 11 wt% of polyvinylpyrrolidone, 88.2 wt% of water, 0.55 wt% of TEOS, and 0.22 wt% of a benzotriazole-based light absorber. The protective solution of comparative example four was 11 wt% of polyvinylpyrrolidone, 88.2 wt% of methanol, 0.55 wt% of TEOS, and 0.22 wt% of a benzotriazole-based light absorber. The protective solution was coated on the surface of PDMS, and the PDMS was cut with ultraviolet (355nm) laser, and the results after cutting and cleaning were observed for comparison.
TABLE 1
| Film shrinkage/breakage | Residue after cleaning | |
| Experimental example 1 | Is free of | Is free of |
| Experimental example two | Is free of | Is free of |
| Comparative example 1 | Is free of | Severe severity of disease |
| Comparative example II | Is free of | Is provided with |
| Comparative example III | Severe severity of disease | Micro-scale |
| Comparative example four | Is provided with | Is free of |
As can be understood from the above table 1, by controlling the polarity of the solvent to be less than 6, the protective layer formed on the soft colloid material can be coated on the surface of the soft colloid material, and the protective layer formed on the soft colloid material can not be detached, damaged, or collapsed during laser cutting. On the other hand, when the polarity exceeds 6, for example, the polarity of methanol is 6.6, there is a situation of recession or breakage. In addition, the light absorber and the film forming assistant are added, so that the protective liquid can be taken away by cleaning after laser cutting, and the residue can be reduced.
In the present application, the protective liquid may be cured to form a protective film by previously volatilizing a solvent and adding a plasticizer. Thus, the mode of coating can be changed into the mode of attaching. The protective film contains an amphoteric polymer, a film-forming aid, a light absorber, and a plasticizer. The amphoteric polymer comprises lipophilic functional group and hydrophilic functional group, and accounts for 60-95 wt%, preferably 75-80 wt%, wherein the amphoteric polymer is selected from the group consisting of polyvinylpyrrolidone, polyvinylpyrrolidone-vinyl acetate copolymer, polyethylene glycol, polyethylene oxide, poly (2-ethyl-2-oxazoline), and polyacrylic acid. The film-forming assistant is 0.1 to 25 wt%, preferably 1 to 15 wt%, the light absorber is 0.001 to 25 wt%, preferably 0.01 to 15 wt%, and the plasticizer is 0.1 to 30 wt%, preferably 0.5 to 20 wt%.
Further, in some embodiments, the protective film for laser cutting the soft colloid material further comprises a stabilizer. The heat stabilizer is selected from the group consisting of hindered amine light stabilizer, hindered phenol antioxidant, phosphite antioxidant, and alcohol antioxidant, and the heat stabilizer is 0.1 to 25 wt%, preferably 1 to 15 wt%.
As described above, the protective solution or the protective film is easily compatible with the soft colloid material through the lipophilic functional group, so that the protective solution or the protective film can be coated or disposed on the surface of the soft colloid material. After laser cutting, the protective liquid or film can be removed by cleaning due to the hydrophilic functional group, and the cutting debris can be taken away. In addition, the light absorbent can absorb partial energy, so that the soft colloid material is prevented from being directly damaged by high energy, and a better cutting effect is achieved.
In addition, the protective liquid or the protective film is formed on the surface of the soft colloid material, so that the soft colloid material can be subjected to laser cutting to achieve accurate size and achieve the effect of quick manufacturing. Because the protective film or the protective liquid can avoid the scraps remained on the surface of the cut soft colloid material, the method can be applied to more precise manufacturing procedures. For example, the soft colloid material after laser cutting can be applied to the optical application industry, such as one of the processes of Patterning Sapphire Substrate (PSS), patterning is carried out by transferring photoresist through a patterned silicon film, and the silicon film used in the process can form micron-sized optical patterns by matching femtosecond laser with the protective layer provided by the invention.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes and modifications can be made without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (14)
1. A protective solution for laser cutting of soft colloid material, comprising:
an amphoteric polymer comprising lipophilic functional groups and hydrophilic functional groups, wherein the weight percentage of the amphoteric polymer is 5 to 40%, wherein the amphoteric polymer is selected from the group consisting of polyvinylpyrrolidone, polyvinylpyrrolidone-vinyl acetate copolymer, polyethylene glycol, polyethylene oxide, poly (2-ethyl-2-oxazoline), and polyacrylic acid;
anhydrous solvent, which is alcohol solvent, ether solvent or their combination, accounting for 60-95 wt%;
a film-forming aid in an amount of 0.001 to 10 wt%; and
light absorber, 0.00001 to 10 wt%.
2. The protective solution for laser cutting of soft gel material as claimed in claim 1, wherein:
the light absorber is selected from the group consisting of a salicylate light absorber, a benzophenone light absorber, a benzotriazole light absorber, a triazine light absorber, a tetrapyrrole pigment, a terpene pigment, a polyphenol pigment, an edible pigment yellow No. four and an edible pigment red No. seven.
3. The protective solution for laser cutting of soft gel material as claimed in claim 2, wherein:
the light absorbing agent absorbs light at a wavelength of 200-580 nm.
4. The protective solution for laser cutting of soft gel material as claimed in claim 1, wherein:
the film-forming aid is selected from the group consisting of hydrolyzed silane compounds, tannic acid, and low molecular weight polyethylene glycol.
5. The protective solution for laser cutting of soft gel material as claimed in claim 1, wherein:
the heat stabilizer accounts for 0.0001 to 10 wt%, and is selected from the group consisting of hindered amine light stabilizers, hindered phenol antioxidants, phosphite antioxidants and alcohol antioxidants.
6. The protective solution for laser cutting of soft gel material as claimed in claim 1, wherein:
also comprises a plasticizer which accounts for 0.0001 to 15 weight percent and is selected from the group consisting of glycerol, silicone oil, triethylene glycol and tripropylene glycol butyl ether.
7. The protective solution for laser cutting of soft gel material as claimed in claim 1, wherein:
also comprises an antifoaming agent.
8. The protective solution for laser cutting of soft gel material as claimed in claim 1, wherein:
the anhydrous solvent has a polarity of less than 6.
9. A protective film for laser cutting of soft adhesive material, comprising:
an amphoteric polymer comprising lipophilic functional groups and hydrophilic functional groups, wherein the weight percentage of the amphoteric polymer is 60 to 95%, wherein the amphoteric polymer is selected from the group consisting of polyvinylpyrrolidone, polyvinylpyrrolidone-vinyl acetate copolymer, polyethylene glycol, polyethylene oxide, poly (2-ethyl-2-oxazoline), and polyacrylic acid;
a film forming aid in an amount of 0.1 to 25 wt%;
a light absorber, comprising 0.001 to 25 wt%; and
a plasticizer in an amount of 0.1 to 30 wt%.
10. The protective film according to claim 9, wherein:
the light absorber is selected from the group consisting of salicylate light absorber, benzophenone light absorber, benzotriazole light absorber, triazine light absorber, tetrapyrrole pigment, terpene pigment, polyphenol pigment, edible pigment yellow No. four and edible pigment red No. seven.
11. The protective film according to claim 9, wherein:
the light absorbing agent absorbs light at a wavelength of 200-580 nm.
12. The protective film according to claim 9, wherein:
the plasticizer is selected from the group consisting of glycerin, silicone oil, triethylene glycol and tripropylene glycol butyl ether.
13. The protective film according to claim 9, wherein:
the coalescing agent is selected from the group consisting of hydrolyzed silane compounds, tannic acid, and low molecular weight polyethylene glycols.
14. The protective film according to claim 9, wherein:
also included is a heat stabilizer selected from the group consisting of hindered amine light stabilizers, hindered phenolic antioxidants, phosphite antioxidants, and alcohol antioxidants, and the heat stabilizer comprises from 0.1 to 25 wt%.
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| Application Number | Priority Date | Filing Date | Title |
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| TW108102096A TWI799497B (en) | 2019-01-18 | 2019-01-18 | Protective liquid and protective film for laser cutting soft resin materials |
| TW108102096 | 2019-01-18 |
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| CN111454634A true CN111454634A (en) | 2020-07-28 |
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| CN112853458A (en) * | 2021-01-08 | 2021-05-28 | 常州晶业液态金属有限公司 | Method for processing amorphous alloy by electrochemical material removal |
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| TWI768239B (en) * | 2019-09-05 | 2022-06-21 | 群越材料股份有限公司 | Manufacturing method of a patterned resin device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2674726C (en) * | 2008-08-12 | 2013-10-15 | Xerox Corporation | Protective coatings for solid inkjet applications |
| CN108690421A (en) * | 2017-03-09 | 2018-10-23 | 深圳怡钛积科技股份有限公司 | High-thermal-stability laser cutting protective film composition |
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| TWI625354B (en) * | 2017-02-24 | 2018-06-01 | Mti有限公司 | Coating composition for protecting wafers in laser scribing process |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2674726C (en) * | 2008-08-12 | 2013-10-15 | Xerox Corporation | Protective coatings for solid inkjet applications |
| CN108690421A (en) * | 2017-03-09 | 2018-10-23 | 深圳怡钛积科技股份有限公司 | High-thermal-stability laser cutting protective film composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112853458A (en) * | 2021-01-08 | 2021-05-28 | 常州晶业液态金属有限公司 | Method for processing amorphous alloy by electrochemical material removal |
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