TW202110980A - Resin particles, conductive particles, conductive material and connection structure - Google Patents

Abstract

The present invention provides resin particles which are able to be effectively suppressed in aggregation, and which are capable of effectively enhancing adhesion to conductive parts if conductive particles are obtained by forming the conductive parts on the surfaces of the resin particles so as to be used for electrical connection between electrodes, while being also capable of effectively lowering the connection resistance. With respect to the resin particles according to the present invention, the ratio of the OH- ion strength to the total strength of all negative ions in the outer surfaces of the resin particles is 2.0 * 10-2 or more if a negative spectrum is obtained by means of time-of-flight secondary ion mass spectrometry.

Description

Resin particles, conductive particles, conductive materials, and connection structures

The present invention relates to a resin particle as a polymer of a polymerizable component. In addition, the present invention relates to a conductive particle, a conductive material, and a connection structure using the above-mentioned resin particles.

Anisotropic conductive materials such as anisotropic conductive paste and anisotropic conductive film are widely known. In the above-mentioned anisotropic conductive material, conductive particles are dispersed in a binder resin.

The above-mentioned anisotropic conductive material is used to electrically connect the electrodes of various connection object members such as flexible printed circuit boards (FPC), glass substrates, glass epoxy substrates, and semiconductor wafers to obtain a connection structure. Moreover, as the said electroconductive particle, the electroconductive particle which has a substrate particle and a conductive layer arrange|positioned on the surface of this substrate particle may be used. As the above-mentioned substrate particles, resin particles may be used.

As an example of the above-mentioned conductive particles, Patent Document 1 below discloses metal-coated fine particles provided with synthetic resin fine particles and a metal film formed on the surface thereof. In the above-mentioned metal-coated fine particles, the above-mentioned synthetic resin fine particles are composed of a copolymer obtained by polymerizing a monomer mixture containing a carboxyl group-containing monomer and a polyfunctional monomer.

In addition, various adhesives are used in order to bond two connection target members and the like (adherent body). In order to make the thickness of the adhesive layer formed by the adhesive uniform, and to control the interval (gap) between two connection object members and the like (adherent bodies), a gap material (spacer) may be blended in the adhesive. As the aforementioned gap material (spacer), resin particles are sometimes used. [Prior technical literature] [Patent literature]

[Patent Document 1] Japanese Patent Laid-Open No. 10-259253

[The problem to be solved by the invention]

In recent years, when a conductive material or a connecting material containing conductive particles is used to electrically connect the electrodes, it is expected that the electrodes will be reliably electrically connected even at a relatively low pressure and the connection resistance will be reduced. For example, in the manufacturing method of liquid crystal display devices, when mounting a flexible substrate in the FOG (film on glass) process, an anisotropic conductive material is placed on the glass substrate and the flexible substrate is laminated , Perform thermo-compression bonding. In recent years, the narrower edge of liquid crystal panels and the thinning of glass substrates have been promoted. In this case, when the flexible substrate is mounted, if the thermal compression bonding is performed at a higher pressure and a higher temperature, the flexible substrate may be deformed, which may cause display unevenness. Therefore, when mounting the flexible substrate in the FOG method, it is expected to perform thermocompression bonding with a relatively low pressure. In addition, in addition to the FOG method, it is sometimes required to relatively reduce the pressure and temperature during thermocompression bonding.

When used as conductive particles using the previous resin particles, if the electrodes are electrically connected with a relatively low pressure, the connection resistance may increase. The reason for this may be that the conductive particles are not in sufficient contact with the electrode (adherent body), or the adhesion between the resin particles and the conductive part arranged on the surface of the resin particle is low, and the conductive part is broken or peeled off. In the previous resin particles, the improvement of the adhesion between the resin particle and the conductive part arranged on the surface of the resin particle is limited, and it is sometimes difficult to sufficiently improve the adhesion between the resin particle and the conductive part arranged on the surface of the resin particle Sex.

In addition, with regard to the conventional resin particles, when the conductive portion (plating layer) is formed by plating, there are cases where the resin particles agglomerate with each other and the plating cannot be performed satisfactorily. As a result, there are cases where the particle size of the conductive particles is uneven, or the thickness of the conductive portion in the conductive particles is uneven, and the conductive particles are not in uniform contact with the electrode, resulting in an increase in connection resistance.

In addition, when the conventional resin particles are used as the gap material (spacer), it is difficult to maintain a good dispersion state, and the resin particles may agglomerate with each other. In addition, in the conventional resin particles, there are cases where the resin particles are not in sufficient contact with the connection object member or the like (adherent body), and a sufficient gap control effect cannot be obtained.

The object of the present invention is to provide a resin particle which can effectively suppress aggregation and can effectively improve the adhesion with the conductive portion when the conductive particles with conductive portions formed on the surface are used to electrically connect the electrodes. Furthermore, the connection resistance can be effectively reduced. In addition, an object of the present invention is to provide conductive particles, conductive materials, and connection structures using the above-mentioned resin particles. [Technical means to solve the problem]

^{According to the broad aspect of the present invention, there is provided a resin particle, wherein the ratio of the intensity of OH-} ions to the total intensity of all anions when anion mass spectrum is obtained by time-of-flight secondary ion mass spectrometry on the outer surface of the resin particle It is 2.0×10 ^-2 or more.

In a specific form of the resin particles of the present invention, the compressive modulus of elasticity at 10% compression is 500 N/mm ² or more and 4500 N/mm ² or less.

In a specific form of the resin particles of the present invention, the compression modulus of elasticity when compressed by 30% is 300 N/mm ² or more and 4000 N/mm ² or less.

In a specific form of the resin particle of the present invention, the resin particle is a polymer containing a plurality of polymerizable components of a polymerizable compound.

In a specific form of the resin particle of the present invention, the polymerizable component constituting the polymer includes a crosslinkable compound, and in 100% by weight of the polymerizable component, the content of the crosslinkable compound is 30% by weight the above.

In a specific form of the resin particles of the present invention, the polymerizable component constituting the polymer includes a crosslinkable compound and a polymerizable compound having a polar functional group, and in 100% by weight of the polymerizable component, the The content of the crosslinkable compound is less than 30% by weight, and the content of the polymerizable compound having a polar functional group in 100% by weight of the polymerizable component is 0.5% by weight or more and 30% by weight or less.

In a specific form of the resin particle of the present invention, the above-mentioned polymerizable compound having a polar functional group includes a polymerizable compound having a hydroxyl group, a polymerizable compound having a carboxyl group, or a polymerizable compound having a phosphoric acid group.

In a specific form of the resin particles of the present invention, the crosslinkable compound includes divinylbenzene, tetramethylene glycol di(meth)acrylate, and 1,4-butanediol di(methyl) Acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, glycerol di(meth)acrylate, or 2-(meth)acryloyloxyethyl acid phosphate.

In a specific aspect of the resin particle of the present invention, the above-mentioned resin particle is used as a spacer or used to obtain a conductive particle having the above-mentioned conductive part by forming a conductive part on the surface.

According to a broad aspect of the present invention, there is provided conductive particles including the above-mentioned resin particles and a conductive part arranged on the surface of the above-mentioned resin particles.

In a specific aspect of the conductive particle of the present invention, the conductive particle further includes an insulating substance arranged on the outer surface of the conductive part.

In a specific aspect of the conductive particle of the present invention, the conductive particle has protrusions on the outer surface of the conductive portion.

According to a broad aspect of the present invention, there is provided a conductive material including conductive particles and a binder resin, and the conductive particles include the resin particles and a conductive portion arranged on the surface of the resin particles.

According to a broad aspect of the present invention, there is provided a connection structure including: a first connection object member having a first electrode on the surface, a second connection object member having a second electrode on the surface, and a connection between the first connection object member and the The connection part to which the second connection object member is connected, wherein the connection part is formed of conductive particles or is formed of the conductive material containing the conductive particles and a binder resin, and the conductive particles include the resin particles and are arranged on the resin In the conductive portion on the surface of the particle, the first electrode and the second electrode are electrically connected by the conductive particle. [Effects of the invention]

The resin particles of the present invention, for the outside surface of the resin particles by obtaining a time-of-flight secondary ion mass spectrometry negative ion mass spectrum, OH ^- ions with respect to the intensity ratio of the sum of the intensities of all the ions is 2.0 × 10 ^{- 2} or more. Since the resin particles of the present invention have the above-mentioned structure, aggregation can be effectively suppressed, and when the conductive particles with conductive portions formed on the surface are used to electrically connect electrodes, the adhesiveness with the conductive portions can be effectively improved. In turn, the connection resistance can be effectively reduced.

Hereinafter, the details of the present invention will be described.

(Resin Particles) Regarding the resin particles of the present invention, when the negative ion mass spectrum is obtained by time-of-flight secondary ion mass spectrometry on the outer surface of the resin particle, ^{the ratio of the intensity of OH-} ions to the sum of the intensities of all negative ions is 2.0 ×10 ^-2 or more.

Since the resin particles of the present invention have the above-mentioned structure, aggregation can be effectively suppressed, and when the conductive particles with conductive portions formed on the surface are used to electrically connect electrodes, the adhesiveness with the conductive portions can be effectively improved. Furthermore, the connection resistance can be effectively reduced.

Regarding the resin particles of the present invention, when the negative ion mass spectrum is obtained by time-of-flight secondary ion mass spectrometry, ^{the intensity of OH-} ions meets a specific relationship, so relatively more hydroxyl groups can be arranged on the outer surface of the resin particle. If a hydroxyl group is arranged on the outer surface of the resin particle, the adhesion between the resin particle and the conductive part can be improved by the interaction with the hydroxyl group, thereby effectively suppressing the occurrence of cracking of the conductive part or peeling of the conductive part. In addition, in the conductive particles using the resin particles of the present invention, the connection resistance between the electrodes can be effectively reduced, so that the connection reliability between the electrodes can be effectively improved. For example, even if the connection structure in which the electrodes are electrically connected by using the conductive particles of the resin particles of the present invention is left for a long time under high temperature and high humidity conditions, the connection resistance is not likely to become higher, making it even more difficult. Poor continuity occurs.

Furthermore, in the resin particles of the present invention, agglomeration of the resin particles can be effectively suppressed. As a result, when the resin particles of the present invention are used as the gap material (spacer), the dispersed state can be maintained well, and the particle size of the spacer can be made uniform. Furthermore, it can fully contact with the connection object member etc., and a sufficient gap control effect can be acquired.

Regarding the resin particles of the present invention, for the outer surface of the resin particles, when the negative ion mass spectrum is obtained by time-of-flight secondary ion mass spectrometry (TOF-SIMS), ^{the ratio of the intensity of OH-} ions to the sum of the intensities of all negative ions ( ^{The sum of the intensity of OH-} ion/the intensity of all negative ions) is 2.0×10 ^-2 or more.

In the TOF-SIMS measurement, the outer surface of the resin particles was sputtered twice, and the TOF-SIMS measurement ratio ( ^{the sum of the intensity of OH-} ions/the total intensity of all negative ions) was used. The measurement is carried out in a state where 40-60 of the above resin particles are arranged in a 500 μm×500 μm area, and the ratio when the cumulative number of detections reaches 50 ( ^{the intensity of OH-} ion/the intensity of all negative ions) The total) of the average value. Furthermore, when it is difficult to arrange 40-60 pieces in a region of 500 μm×500 μm depending on the size of the above-mentioned resin particles, the number of arrangement can be appropriately reduced before measurement. In the above measurement, for example, a measurement result of a thickness region of about 2 nm from the outer surface of the resin particle toward the inner side is obtained. In addition, in the above measurement, it is preferable ^{to calculate the above ratio by arithmetically averaging the ratio of three arbitrarily selected resin particles (the sum of the intensity of OH-} ions/the intensity of all negative ions).

The above-mentioned ratio ( ^{the sum of the intensity of OH-} ions/the intensity of all negative ions) is preferably 2.5×10 ^-2 or more, more preferably 3.0×10 ^-2 or more. The upper limit of the above-mentioned ratio ( ^{the intensity of OH-} ions/the sum of the intensities of all negative ions) is not particularly limited. The above-mentioned ratio ( ^{the sum of the intensity of OH-} ions/the intensity of all negative ions) may be 9.0×10 ^-2 or less. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

In the above TOF-SIMS, "TOF-SIMS 5" manufactured by ION TOF is used. In order to use the TOF-SIMS analyzer to measure the strength and total ionic strength ^{of the OH- ions on the outer surface of the resin particles, for example, a Bi 3+} ion gun is used as the primary ion source for the measurement, and the measurement is performed under the condition of 25 keV. can. Sputtering is a method in which inert gas such as argon is introduced in a vacuum, and a negative voltage is applied to the target to generate glow discharge, ionize the inert gas atoms, and cause gas particles to hit the surface of the target at high speed and hit the surface strongly. The surface of the target can be ground at a depth of nanometer to micrometer. Specifically, for example, by using O ₂ ⁺ for sputtering, the surface of the resin particles can be excavated at a depth of about 1 nm/second. ^{The ratio of the OH-} ion intensity and the total ionic intensity in a region with a thickness of about 2 nm from the outer surface of the resin particle toward the inner side can be measured by performing sputtering twice and using TOF-SIMS.

The compressive elastic modulus (10% K value) when the above resin particles are compressed by 10% is preferably 500 N/mm ² or more, more preferably 1000 N/mm ² or more, and preferably 6000 N/mm ² or less, It is more preferably 5000 N/mm ² or less, still more preferably 4500 N/mm ² or less, and particularly ^{preferably 3500 N/mm 2} or less. If the 10% K value is greater than or equal to the lower limit and less than or equal to the upper limit, aggregation can be further effectively suppressed. In addition, if the 10% K value is above the above lower limit and below the above upper limit, when conductive particles with conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved In addition, the connection resistance can be further effectively reduced.

The compression modulus (30% K value) when the above resin particles are compressed by 30% is preferably 300 N/mm ² or more, more preferably 500 N/mm ² or more, and preferably 5500 N/mm ² or less, It is more preferably 4500 N/mm ² or less, still more preferably 4000 N/mm ² or less, and particularly ^{preferably 3000 N/mm 2} or less. If the 30% K value is greater than or equal to the lower limit and less than or equal to the upper limit, aggregation can be further effectively suppressed. In addition, if the 30% K value is above the above lower limit and below the above upper limit, when conductive particles with conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved In addition, the connection resistance can be further effectively reduced.

The compressive elastic modulus (10% K value and 30% K value) in the resin particles can be measured as follows.

Using a micro-compression tester, compress one resin particle on a cylindrical (50 μm diameter, diamond-made) smooth indenter end face at 25°C, a compression speed of 0.3 mN/sec, and a maximum test load of 20 mN. Measure the load value (N) and compression displacement (mm) at this time. The above-mentioned compression modulus (10% K value or 30% K value) can be obtained by the following formula based on the obtained measured value. As the above-mentioned micro-compression tester, for example, "Fischerscope H-100" manufactured by Fischer Corporation or the like is used. The compression modulus of elasticity (10% K value or 30% K value) in the above resin particles is preferably obtained by comparing the compression modulus of elasticity (10% K value or 30% K value) of arbitrarily selected 50 resin particles. ) Is calculated by arithmetic average.

10%K value or 30%K value (N/mm ² )=(3/2 ^1/2 )・F・S ^-3/2・R ^-1/2 F: resin particle compression deformation is 10% or 30% Load value (N) S: 10% or 30% compression displacement of resin particle compression deformation (mm) R: Resin particle radius (mm)

The above-mentioned compression modulus generally and quantitatively indicates the hardness of the resin particles. By using the above-mentioned compression modulus, the hardness of the resin particles can be expressed quantitatively and singly.

The compression recovery rate of the resin particles is preferably 5% or more, more preferably 10% or more, and preferably 60% or less, and more preferably 45% or less. If the compression recovery rate is equal to or higher than the lower limit and equal to or lower than the upper limit, aggregation can be more effectively suppressed. In addition, the compression recovery rate is above the above lower limit and below the above upper limit, when conductive particles with conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved. Furthermore, the connection resistance can be further effectively reduced.

The compression recovery rate in the resin particles can be measured as follows.

Spread the resin particles on the sample table. For one resin particle to be dispersed, apply a load (inverted load value) in the center direction of the resin particle at 25°C on the end surface of the smooth indenter of a cylinder (50 μm in diameter, made of diamond) using a micro compression tester until the resin is reached The particles are compressed and deformed by 30%. After that, unloading is performed to the load value for the origin (0.40 mN). The load-compression displacement during this period is measured, and the compression recovery rate can be calculated according to the following formula. Furthermore, the load speed is set to 0.33 mN/sec. As the above-mentioned micro-compression tester, for example, "Fischerscope H-100" manufactured by Fischer Corporation or the like is used.

Compression recovery rate (%)=[L2/L1]×100 L1: Compression displacement from the original load value to the reverse load value when the load is applied L2: The self-reverse load value to the origin when the load is released Unloading displacement up to load value

The use of the above-mentioned resin particles is not particularly limited. The above-mentioned resin particles can be preferably used for various applications. The above-mentioned resin particles are preferably used as a spacer or used to obtain conductive particles having the above-mentioned conductive part by forming a conductive part on the surface. In the conductive particle, the conductive portion is formed on the surface of the resin particle. The above-mentioned resin particles are preferably used to obtain conductive particles having the above-mentioned conductive part by forming a conductive part on the surface. The above-mentioned conductive particles are preferably used for electrically connecting electrodes. The said electroconductive particle can also be used as a gap material (spacer). The above-mentioned resin particles are preferably used as a gap material (spacer). As a method of using the aforementioned gap material (spacer), spacers for liquid crystal display elements, spacers for gap control, spacers for stress relaxation, and the like can be cited. The above-mentioned gap control spacers can be used to control the gap of laminated chips or electronic component devices to ensure the height and flatness of the support, and to control the gap of optical components to ensure the smoothness of the glass surface and the thickness of the adhesive layer. The above-mentioned spacer for stress relaxation can be used for stress relaxation of a sensor chip, etc., stress relaxation of a connection part connecting two connection object members, and the like. In addition, when the above-mentioned resin particles are used as the gap material (spacer), the dispersed state can be maintained well, so that the particle size of the spacer can be made uniform. Furthermore, it can fully contact with the connection object member etc., and a sufficient gap control effect can be acquired.

The above-mentioned resin particles are preferably used as a spacer for liquid crystal display elements, and are preferably used as a peripheral sealant for liquid crystal display elements. In the peripheral sealant for liquid crystal display elements, the resin particles preferably function as spacers. Since the resin particles have good compression deformation characteristics and good compression failure characteristics, the resin particles are used as spacers and arranged between substrates, or conductive parts are formed on the surface to be used as conductive particles between electrodes. In the case of electrical connection, spacers or conductive particles are efficiently arranged between substrates or between electrodes. Furthermore, in the resin particles, since damage to the members for liquid crystal display elements, etc., can be suppressed, it is difficult to cause connection failures in the liquid crystal display element using the spacer for liquid crystal display elements and the connection structure using the conductive particles. And the display is poor.

Furthermore, the above-mentioned resin particles can also be preferably used as inorganic fillers, additives for color enhancers, shock absorbers, or vibration absorbers. For example, the aforementioned resin particles can be used as a substitute for rubber or springs.

Hereinafter, other details of the resin particles will be described.

(Other details of resin particles) The above-mentioned resin particles are preferably polymers containing polymerizable components of a plurality of polymerizable compounds. In the above-mentioned resin particles, it is preferable that the center part of the resin particle and the surface part of the resin particle are composed of the same polymerizable component. The blending ratio of the polymerizable component in the center portion of the resin particle and the blending ratio of the polymerizable component in the surface portion of the resin particle may be the same or different. The composition ratio of the constituent components of the center portion of the resin particle and the composition ratio of the constituent components of the surface portion of the resin particle may be the same or different. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

In the above-mentioned resin particles, it is preferable that the center part of the resin particle is formed of a center part forming material, and the surface part of the resin particle is formed of a surface part forming material. In the resin particles, it is preferable that the composition of the center portion forming material and the composition of the surface portion forming material are the same. In the resin particles, the composition ratio of the center part forming material and the composition ratio of the surface part forming material may be the same or different. Furthermore, in the resin particles, it is preferable that there is a region containing both the center portion forming material and the surface portion forming material. In the above-mentioned resin particles, it is preferable that the resin particle has a region in the center portion that contains the center portion forming material and does not contain the surface portion forming material or contains less than 25% by weight of the surface portion forming material. In the above-mentioned resin particles, it is preferable that the resin particles have a region on the surface portion that contains the surface portion forming material and does not contain the center portion forming material or contains less than 25% by weight of the center portion forming material. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

The above-mentioned resin particles are preferably core-shell particles that do not have a core and an outer shell arranged on the surface of the core, and preferably do not have an interface between the core and the outer shell in the resin particle. The above-mentioned resin particle preferably does not have an interface in the resin particle, and more preferably does not have an interface where different surfaces are in contact with each other. The above-mentioned resin particles preferably have no discontinuous parts on the surface, and preferably have no discontinuous parts on the structured surface. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

In the above-mentioned resin particles, it is preferable that the above-mentioned polymerizable component constituting the above-mentioned polymer contains a crosslinkable compound. When the polymerizable component constituting the polymer contains a crosslinkable compound, the content of the crosslinkable compound in 100% by weight of the polymerizable component is preferably 30% by weight or more, more preferably 40% by weight or more . The upper limit of the content of the above-mentioned crosslinkable compound is not particularly limited. The content of the crosslinkable compound is preferably 80% by weight or less, more preferably 70% by weight or less, and still more preferably 60% by weight or less. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

In the resin particles, the polymerizable component constituting the polymer may be a polymerizable component that includes a crosslinkable compound that does not have a polar functional group and does not include a crosslinkable compound that has a polar functional group, and may include a polymerizable component that does not have polarity. Either one of the cross-linkable compound with a functional group and the polymerizable component of the cross-linkable compound with a polar functional group. In the above-mentioned resin particles, the above-mentioned polymerizable component constituting the above-mentioned polymer may be a polymerizable component including a crosslinkable compound having no polar functional group and no crosslinking compound having a polar functional group. In the resin particles, the polymerizable component constituting the polymer may be a polymerizable component including a crosslinkable compound having no polar functional group and a crosslinkable compound having a polar functional group.

When the polymerizable component constituting the polymer contains a crosslinkable compound without a polar functional group and does not contain a crosslinkable compound with a polar functional group, in 100% by weight of the polymerizable component, the above-mentioned non-polar The content of the crosslinkable compound of the functional group is preferably 30% by weight or more, more preferably 40% by weight or more. The upper limit of the content of the crosslinkable compound having no polar functional group is not particularly limited. The content of the crosslinkable compound having no polar functional group is preferably 80% by weight or less, more preferably 70% by weight or less, and still more preferably 60% by weight or less. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

When the polymerizable component constituting the polymer includes a crosslinkable compound having no polar functional group and a crosslinkable compound having a polar functional group, in 100% by weight of the polymerizable component, the aforementioned polymer does not have a polar functional group The total content of the crosslinkable compound and the crosslinkable compound having a polar functional group is preferably 30% by weight or more, more preferably 40% by weight or more. The upper limit of the total content of the crosslinkable compound having no polar functional group and the crosslinkable compound having a polar functional group is not particularly limited. The total content of the crosslinkable compound having no polar functional group and the crosslinkable compound having a polar functional group is preferably 80% by weight or less, more preferably 70% by weight or less , and still more preferably 60% by weight or less. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

In the resin particles, the polymerizable component constituting the polymer preferably includes a crosslinkable compound and a polymerizable compound having a polar functional group. When the polymerizable component constituting the polymer includes a crosslinkable compound and a polymerizable compound having a polar functional group, the content of the crosslinkable compound in 100% by weight of the polymerizable component is preferably less than 30 % By weight, more preferably 20% by weight or less. The lower limit of the content of the crosslinkable compound is not particularly limited. The content of the above-mentioned crosslinkable compound may be 5% by weight or more. When the polymerizable component constituting the polymer includes a crosslinkable compound and a polymerizable compound having a polar functional group, the content of the polymerizable compound having a polar functional group in 100% by weight of the polymerizable component is preferable It is 0.5% by weight or more, more preferably 2% by weight or more, and preferably 30% by weight or less, and more preferably 20% by weight or less. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

In the resin particles, the polymerizable component constituting the polymer preferably contains a crosslinkable compound having no polar functional group and a polymerizable compound having no crosslinkability and having a polar functional group. When the polymerizable component constituting the polymer includes a crosslinkable compound having no polar functional group and a polymerizable compound having no crosslinkability and having a polar functional group, in 100% by weight of the polymerizable component, the above The content of the crosslinkable compound having no polar functional group is preferably less than 30% by weight, more preferably 20% by weight or less. The lower limit of the content of the crosslinkable compound having no polar functional group is not particularly limited. The content of the above-mentioned crosslinkable compound having no polar functional group may be 5% by weight or more. When the polymerizable component constituting the polymer includes a crosslinkable compound having no polar functional group and a polymerizable compound having no crosslinkability and having a polar functional group, in 100% by weight of the polymerizable component, the above The content of the polymerizable compound having no crosslinkability and having a polar functional group is preferably 0.5% by weight or more, more preferably 2% by weight or more, and preferably 30% by weight or less, and more preferably 20% by weight or less. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

And, other than for the surface of the resin particles, by obtaining the time-of-flight secondary ion mass spectrometry negative ion mass spectrum, easier to OH ^- ions with respect to the intensity ratio of the sum of the intensities of all the ions to 2.0 × 10 ^{- From} the viewpoint of 2 or more, the resin particles preferably satisfy any of the following relationships. 1) The polymerizable component constituting the polymer includes a crosslinkable compound, and the content of the crosslinkable compound in 100% by weight of the polymerizable component is 30% by weight or more. 2) The polymerizable component constituting the polymer includes a crosslinkable compound and a polymerizable compound having a polar functional group, and in 100% by weight of the polymerizable component, the content of the crosslinkable compound is less than 30% by weight. The content of the polymerizable compound having a polar functional group is 0.5% by weight or more and 30% by weight or less.

Especially in 1) above, if the content of the crosslinkable compound is 30% by weight or more and 80% by weight or less, it is easier to ^{set the ratio of the strength of OH-} ions to the sum of the strengths of all negative ions 2.0×10 ^-2 or more.

The above-mentioned polymerizable compound having a polar functional group is not particularly limited. The above-mentioned polar functional group is not particularly limited. As said polar functional group, a hydroxyl group, a carboxyl group, a sulfonic acid group, a phosphoric acid group, etc. are mentioned. Only 1 type may be used for the said polymerizable compound which has a polar functional group, and 2 or more types may be used together.

Examples of polymerizable compounds having a hydroxyl group include: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, and glycerol di(methyl) Acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-hydroxy-3-(meth)acryloxypropyl (meth)acrylate, pentaerythritol tri(meth)acrylate , 2-(meth)acryloyloxyethyl-2-hydroxypropyl phthalate, and polyethylene glycol (meth)acrylate, etc.

Examples of the polymerizable compound having a carboxyl group include (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, 2-(meth)acryloxyethyl succinate, and the like.

Examples of the polymerizable compound having a sulfonic acid group include 3-sulfopropyl (meth)acrylate and the like.

Examples of the polymerizable compound having a phosphoric acid group include 2-(meth)acryloyloxyethyl acid phosphoric acid and the like.

In the aforementioned resin particles, the aforementioned polymerizable compound having a polar functional group preferably includes a polymerizable compound having a hydroxyl group, a polymerizable compound having a carboxyl group, or a polymerizable compound having a phosphoric acid group. Among the resin particles, the polymerizable compound having a polar functional group more preferably includes 2-hydroxypropyl (meth)acrylate, (meth)acrylic acid, and 2-(meth)acryloxyethyl succinate , Or 2-(meth)acryloyloxyethyl acid phosphoric acid. In the resin particles, the polymerizable compound having a polar functional group further preferably contains (meth)acrylic acid, 2-(meth)acryloyloxyethyl succinate, or 2-(methyl) acid phosphoric acid. ) Allyloxyethyl. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

The above-mentioned crosslinkable compound is not particularly limited. Examples of the above-mentioned crosslinkable compound include divinylbenzene, (di/tri/tetra)methylene glycol (meth)acrylate, (di/tri/tetra)ethylene glycol (meth)acrylate, Polytetramethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol (meth)acrylate, 1,9-nonane Alcohol (meth)acrylate, dimethylol tricyclodecane dimethacrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, glycerol di(meth)acrylate, and 2-(meth)acryloyloxyethyl acid phosphoric acid ("LIGHT ESTER P-2M" manufactured by Kyoeisha Chemical Co., Ltd.), etc. As for the said crosslinkable compound, only 1 type may be used, and 2 or more types may be used together.

In the resin particles, the crosslinkable compound preferably includes the following compounds. Examples of the above-mentioned compounds include divinylbenzene, tetramethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, pentaerythritol tri(meth)acrylate, and pentaerythritol Tetra(meth)acrylate, glycerol di(meth)acrylate, and 2-(meth)acryloyloxyethyl acid phosphoric acid (“LIGHT ESTER P-2M” manufactured by Kyoeisha Chemical Co., Ltd.), etc. . Among the resin particles, the crosslinkable compound is more preferably glycerol di(meth)acrylate, 2-(meth)acryloyloxyethyl acid phosphoric acid ("LIGHT ESTER" manufactured by Kyoeisha Chemical Co., Ltd.) P-2M”), or pentaerythritol tri(meth)acrylate. If the above-mentioned resin particles satisfy the above-mentioned preferable form, aggregation can be further effectively suppressed. In addition, if the above-mentioned resin particles satisfy the above-mentioned preferred form, when the conductive particles having conductive parts formed on the surface are used to electrically connect the electrodes, the adhesion with the conductive parts can be further effectively improved, and furthermore, Further effectively reduce the connection resistance.

The above-mentioned polymerizable compound having a polar functional group may be a crosslinkable compound. The above-mentioned crosslinkable compound may be a polymerizable compound having a polar functional group. When the polymerizable component includes a compound having crosslinkability, a polar functional group, and a polymerizability, the polymerizable compound includes both a crosslinkable compound and a polymerizable compound having a polar functional group. The content of the aforementioned crosslinkable compound includes the content of the aforementioned compound having crosslinkability, polar functional group and polymerizability. The content of the aforementioned polymerizable compound having a polar functional group includes the content of the aforementioned compound having crosslinkability, polar functional group, and polymerizability.

In the above-mentioned resin particles, the above-mentioned polymerizable component constituting the above-mentioned polymer does not contain or contains a non-crosslinkable compound. In the above-mentioned resin particles, the above-mentioned polymerizable component constituting the above-mentioned polymer may not contain a non-crosslinkable compound. In the above-mentioned resin particles, the above-mentioned polymerizable component constituting the above-mentioned polymer may include a non-crosslinkable compound. The aforementioned non-crosslinkable compound may be a non-crosslinkable compound that does not have a polar functional group. The said non-crosslinkable compound may use only 1 type, and may use 2 or more types together.

Examples of the above non-crosslinkable compounds include: vinyl compounds such as styrene monomers such as styrene, α-methylstyrene, and chlorostyrene; methyl vinyl ether, ethyl vinyl ether, and propyl ethylene Vinyl ether compounds such as vinyl ether; vinyl acetate, vinyl butyrate, vinyl laurate, vinyl stearate and other acid vinyl ester compounds; halogen-containing monomers such as vinyl chloride and vinyl fluoride; as (meth)acrylic acid Compounds of methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (methyl) ) Alkyl (meth)acrylate compounds such as lauryl acrylate, cetyl (meth)acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate, isopropyl (meth)acrylate, etc. ; (Meth) acrylate compounds containing oxygen atoms such as 2-hydroxyethyl (meth)acrylate, glycerol (meth)acrylate, polyoxyethylene (meth)acrylate, glycidyl (meth)acrylate, etc. ; (Meth)acrylonitrile and other nitrile-containing monomers; (meth)acrylic acid trifluoromethyl, (meth)acrylic acid pentafluoroethyl and other halogen-containing (meth)acrylate compounds; as α-olefin compounds Olefin compounds such as diisobutylene, isobutylene, Linealene, ethylene, and propylene; isoprene and butadiene as conjugated diene compounds.

When the polymerizable component constituting the polymer contains the non-crosslinkable compound, the content of the non-crosslinkable compound in 100% by weight of the polymerizable component may be 1% by weight or more, or may be 5% by weight % Or more, may be 10% by weight or more, may be 20% by weight or more, may be 30% by weight or more, or may be 40% by weight or more. When the polymerizable component constituting the polymer contains the non-crosslinkable compound, the content of the non-crosslinkable compound in 100% by weight of the polymerizable component may be 90% by weight or less, or 80% by weight % Or less, may be 70% by weight or less, may be 60% by weight or less, or may be 50% by weight or less.

The particle size of the above-mentioned resin particles can be appropriately set according to the application. The particle size of the resin particles is preferably 0.5 μm or more, more preferably 1 μm or more, and preferably 500 μm or less, more preferably 300 μm or less, still more preferably 100 μm or less, and still more preferably 50 μm or less , Particularly preferably less than 30 μm. If the particle diameter of the said resin particle is more than the said lower limit and the said upper limit or less, the resin particle can be used more suitably for the use of a conductive particle or a spacer. If the particle diameter of the said resin particle is 0.5 micrometer or more and 500 micrometer or less, the said resin particle can be used suitably for the application of electroconductive particle. If the particle diameter of the resin particles is 0.5 μm or more and 500 μm or less, the resin particles can be suitably used for spacer applications.

The particle diameter of the resin particles is preferably an average particle diameter, and more preferably a number average particle diameter. The particle diameter of the above-mentioned resin particles is obtained by observing any 50 resin particles with an electron microscope or an optical microscope and calculating the average value of the particle diameters of each resin particle, or by a particle size distribution measuring device. In the observation with an electron microscope or an optical microscope, the particle size of each resin particle is calculated as the particle size of the circle equivalent diameter. In the observation with an electron microscope or an optical microscope, the average particle diameter of any 50 resin particles in terms of circle-equivalent diameter is almost equal to the average particle diameter of sphere-equivalent diameter. In the particle size distribution measuring device, the particle size of each resin particle is determined as the particle size in terms of the equivalent diameter of the sphere. The average particle size of the resin particles is preferably calculated by a particle size distribution measuring device.

Moreover, when measuring the particle diameter of the said resin particle in electroconductive particle, it can measure as follows, for example.

The conductive particles are added to "Technovit 4000" manufactured by Kulzer Corporation so that the content of the conductive particles becomes 30% by weight and dispersed to prepare an embedded resin body for conductive particle inspection. An ion milling device ("IM4000" manufactured by Hitachi High-Technologies Corporation) was used to cut the cross section of the conductive particles by dispersing near the center of the conductive particles embedded in the resin body for inspection. Then, using an electric field emission scanning electron microscope (FE-SEM), the image magnification was set to 25000 times, 50 conductive particles were randomly selected, and the resin particles of each conductive particle were observed. The particle diameter of the resin particles in each conductive particle is measured, and the arithmetic average is performed, and the obtained value is taken as the particle diameter of the resin particle.

The coefficient of variation (CV value) of the particle diameter of the resin particles is preferably 10% or less, more preferably 7% or less. If the coefficient of variation of the particle diameter of the resin particles is equal to or less than the upper limit, the resin particles can be more preferably used for spacers and conductive particles.

The aforementioned coefficient of variation (CV value) can be measured as follows.

CV value (%)=(ρ/Dn)×100 ρ: the standard deviation of the particle size of the resin particles Dn: the average value of the particle size of the resin particles

The shape of the resin particles is not particularly limited. The shape of the above-mentioned resin particles may be a spherical shape, a shape other than a spherical shape, or a shape such as a flat shape.

(Conductive particles) The above-mentioned conductive particles include the above-mentioned resin particles and a conductive part arranged on the surface of the above-mentioned resin particles.

Fig. 1 is a cross-sectional view showing conductive particles according to the first embodiment of the present invention.

The conductive particle 1 shown in FIG. 1 has the resin particle 11 and the conductive part 2 arrange|positioned on the surface of the resin particle 11. As shown in FIG. The conductive part 2 is in contact with the surface of the resin particle 11. The conductive part 2 covers the surface of the resin particle 11. The conductive particle 1 is a coated particle in which the surface of the resin particle 11 is covered with the conductive portion 2. In the conductive particle 1, the conductive part 2 is a single-layer conductive part (conductive layer).

Fig. 2 is a cross-sectional view showing conductive particles according to a second embodiment of the present invention.

The conductive particle 21 shown in FIG. 2 has a resin particle 11 and a conductive part 22 arranged on the surface of the resin particle 11. The conductive portion 22 as a whole has a first conductive portion 22A on the resin particle 11 side and a second conductive portion 22B located on the side opposite to the resin particle 11 side.

In the conductive particle 1 shown in FIG. 1 and the conductive particle 21 shown in FIG. 2, only the conductive part 22 is different. That is, in the conductive particle 1, the conductive part of the one-layer structure is formed, while in the conductive particle 21, the first conductive part 22A and the second conductive part 22B of the two-layer structure are formed. The first conductive portion 22A and the second conductive portion 22B may be formed as different conductive portions, or may be formed as the same conductive portion.

The first conductive portion 22A is arranged on the surface of the resin particle 11. The first conductive portion 22A is arranged between the resin particles 11 and the second conductive portion 22B. The first conductive portion 22A is in contact with the resin particles 11. The second conductive portion 22B is in contact with the first conductive portion 22A. The first conductive portion 22A is arranged on the surface of the resin particle 11, and the second conductive portion 22B is arranged on the surface of the first conductive portion 22A.

Fig. 3 is a cross-sectional view showing conductive particles according to a third embodiment of the present invention.

The conductive particle 31 shown in FIG. 3 has a resin particle 11, a conductive portion 32, a plurality of core materials 33, and a plurality of insulating materials 34. The conductive portion 32 is arranged on the surface of the resin particle 11. A plurality of core materials 33 are arranged on the surface of the resin particle 11. The conductive portion 32 is arranged on the surface of the resin particle 11 so as to cover the resin particle 11 and the plurality of core materials 33. In the conductive particles 31, the conductive portion 32 is a single-layer conductive portion (conductive layer).

The conductive particle 31 has a plurality of protrusions 31a on the outer surface. In the conductive particles 31, the conductive portion 32 has a plurality of protrusions 32a on the outer surface. The plurality of core materials 33 can swell the outer surface of the conductive portion 32. The outer surface of the conductive portion 32 is raised by a plurality of core materials 33, thereby forming protrusions 31a and 32a. A plurality of core materials 33 are embedded in the conductive part 32. A core material 33 is arranged inside the protrusions 31a and 32a. In the conductive particles 31, a plurality of core materials 33 are used in order to form the protrusions 31a and 32a. In the above-mentioned conductive particles, the above-mentioned protrusions may be formed without using a plurality of the above-mentioned core materials. The said electroconductive particle does not need to have a plurality of said core materials.

The conductive particles 31 have an insulating substance 34 arranged on the outer surface of the conductive portion 32. At least a part of the outer surface of the conductive portion 32 is covered with an insulating material 34. The insulating substance 34 is formed of an insulating material and is an insulating particle. In this way, the conductive particle of the present invention may have an insulating substance arranged on the outer surface of the conductive part. However, the said electroconductive particle may not necessarily have an insulating substance. The above-mentioned conductive particles may not include a plurality of insulating substances.

Conductive part: The metal used to form the above-mentioned conductive part is not particularly limited. Examples of the above metals include gold, silver, palladium, copper, platinum, zinc, iron, tin, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, thallium, germanium, cadmium, silicon, tungsten , Molybdenum and their alloys, etc. In addition, examples of the above-mentioned metal include tin-doped indium oxide (ITO), solder, and the like. From the viewpoint of further improving the connection reliability between the electrodes, the above-mentioned metal is preferably an alloy containing tin, nickel, palladium, copper or gold, and preferably nickel or palladium.

In addition, since the conduction reliability can be effectively improved, the conductive portion and the outer surface portion of the conductive portion preferably contain nickel. The content of nickel in 100% by weight of the conductive portion containing nickel is preferably 10% by weight or more, more preferably 50% by weight or more, still more preferably 60% by weight or more, still more preferably 70% by weight or more, and particularly preferably More than 90% by weight. The content of nickel in 100% by weight of the conductive portion containing nickel may be 97% by weight or more, 97.5% by weight or more, or 98% by weight or more.

Furthermore, the surface of the conductive part is mostly oxidized and there are hydroxyl groups. Generally speaking, the surface of the conductive part formed of nickel has hydroxyl groups due to oxidation. An insulating substance can be placed on the surface of such a conductive part having a hydroxyl group (the surface of the conductive particle) via a chemical bond.

The above-mentioned conductive part may be formed of a single layer like the conductive particles 1 and 31. The above-mentioned conductive part may be formed of a plurality of layers like the conductive particles 21. That is, the above-mentioned conductive part may have a laminated structure of two or more layers. When the conductive portion is formed of multiple layers, the outermost layer is preferably a gold layer, a nickel layer, a palladium layer, a copper layer, or an alloy layer containing tin and silver, and more preferably a gold layer. When the outermost layer is the better conductive parts, the connection resistance between the electrodes can be further effectively reduced. In addition, when the outermost layer is a gold layer, the corrosion resistance can be further effectively improved.

The method of forming the said conductive part on the surface of the said resin particle is not specifically limited. As a method of forming the above-mentioned conductive part, for example, a method using electroless plating, a method using electroplating, a method using physical vapor deposition, and coating a metal powder or a slurry containing a metal powder and a binder on the resin The method of the surface of the particle, etc. The method of electroless plating is preferable because the conductive part can be easily formed. Examples of the method using physical vapor deposition include methods such as vacuum vapor deposition, ion plating, and ion sputtering.

The particle size of the conductive particles is preferably 0.5 μm or more, more preferably 1 μm or more, and preferably 500 μm or less, more preferably 300 μm or less, still more preferably 100 μm or less, and still more preferably 50 μm Below, it is particularly preferably 30 μm or less. If the particle size of the conductive particles is above the above lower limit and below the above upper limit, when the conductive particles are used to connect the electrodes, the contact area between the conductive particles and the electrode becomes sufficiently large, and it is not easy to form on the conductive part. Conductive particles that aggregate when formed. In addition, the gap between the electrodes connected via the conductive particles does not become too large, and the conductive portion is not easily peeled off from the surface of the resin particles. Moreover, if the particle diameter of the said electroconductive particle is more than the said lower limit and the said upper limit or less, the electroconductive particle can be used suitably for the use of a conductive material.

The particle diameter of the above-mentioned conductive particle means the diameter when the conductive particle is a true spherical shape, and when the conductive particle is a shape other than a true spherical shape, it means the diameter when it is assumed to be a true sphere equivalent to its volume .

The particle diameter of the conductive particles is preferably an average particle diameter, and more preferably a number average particle diameter. The particle size of the above-mentioned conductive particles is obtained by observing any 50 conductive particles with an electron microscope or an optical microscope and calculating the average value, or by using a particle size distribution measuring device. In the observation with an electron microscope or an optical microscope, the particle diameter of each conductive particle is calculated as the diameter of a circle equivalent. In observation with an electron microscope or an optical microscope, the average particle diameter of any 50 conductive particles in terms of circle-equivalent diameter is almost equal to the average particle diameter of sphere-equivalent diameter. In the particle size distribution measuring device, the particle size of each conductive particle is calculated as the particle size in the equivalent diameter of the sphere. The particle size of the conductive particles is preferably calculated by a particle size distribution measuring device.

The thickness of the conductive portion is preferably 0.005 μm or more, more preferably 0.01 μm or more, and preferably 10 μm or less, more preferably 1 μm or less, and still more preferably 0.3 μm or less. The thickness of the above-mentioned conductive part is the thickness of the entire conductive part when the conductive part is a multilayer. If the thickness of the conductive portion is greater than or equal to the above lower limit and less than or equal to the above upper limit, sufficient conductivity can be obtained, the conductive particles will not become too hard, and the conductive particles will be sufficiently deformed during the connection between the electrodes.

When the above-mentioned conductive part is formed of a plurality of layers, the thickness of the conductive part of the outermost layer is preferably 0.001 μm or more, more preferably 0.01 μm or more, and preferably 0.5 μm or less, and more preferably 0.1 μm or less. If the thickness of the conductive portion of the outermost layer is more than the lower limit and less than the upper limit, the coating of the outermost layer by the conductive portion becomes uniform, the corrosion resistance is sufficiently improved, and the connection resistance between the electrodes is sufficiently reduced. Furthermore, when the outermost layer is a gold layer, the thinner the thickness of the gold layer, the lower the cost.

The thickness of the said conductive part can be measured by observing the cross section of a conductive particle using a transmission electron microscope (TEM), for example. Regarding the thickness of the above-mentioned conductive part, it is preferable to calculate the average thickness of any five parts of the conductive part as the thickness of the conductive part of one conductive particle, and it is more preferable to calculate the average thickness of the entire conductive part as Calculate the thickness of the conductive part of one conductive particle. It is preferable that the thickness of the said electroconductive part is calculated|required by calculating the average value of the thickness of the electroconductive part of each electroconductive particle for arbitrary 10 electroconductive particles.

Core material: The above-mentioned conductive particles preferably have protrusions on the outer surface of the above-mentioned conductive part. It is more preferable that the said electroconductive particle has a plurality of protrusions on the outer surface of the said electroconductive part. By providing the conductive particles with a plurality of protrusions on the outer surface of the conductive portion, the reliability of conduction between the electrodes can be further improved. In many cases, an oxide film is formed on the surface of the electrode connected by the above-mentioned conductive particles. Furthermore, an oxide film is often formed on the surface of the conductive part of the said electroconductive particle. By using the above-mentioned conductive particles having protrusions, the conductive particles are arranged between the electrodes and then pressure-bonded, whereby the oxide film is effectively removed by the protrusions. Therefore, the electrode and the conductive particle can be brought into contact with each other more reliably, and the connection resistance between the electrodes can be further effectively reduced. Furthermore, when the conductive particles have an insulating substance on the surface, or when the conductive particles are dispersed in a binder resin to be used as a conductive material, the protrusions of the conductive particles can be used to connect the conductive particles and the electrode. The insulating material or adhesive resin is effectively eliminated. Therefore, the reliability of the conduction between the electrodes can be further effectively improved.

By embedding the core material in the conductive portion, a plurality of protrusions can be easily formed on the outer surface of the conductive portion. However, it is not necessary to use the core material to form protrusions on the surface of the conductive part of the conductive particles.

As a method of forming protrusions on the surface of the above-mentioned conductive particles, a method of forming a conductive portion by electroless plating after the core material is attached to the surface of the resin particle; and by electroless plating on the surface of the resin particle After the conductive part is formed, the core material is attached, and then the conductive part is formed by electroless plating. Moreover, it is also possible to form protrusions without using the above-mentioned core material.

As a method of forming the above-mentioned protrusion, the following method etc. can also be mentioned. A method of adding a core material in the middle of forming a conductive part on the surface of a resin particle by electroless plating. As a method of forming protrusions by electroless plating without using a core material, a metal core is generated by electroless plating, and the metal core is attached to the surface of resin particles or conductive parts, and then conductive is formed by electroless plating Department of the method.

The material of the above-mentioned core substance is not particularly limited. Examples of the material of the above-mentioned core material include conductive materials and non-conductive materials. Examples of the above-mentioned conductive substance include conductive non-metals such as metals, metal oxides, zinc, and conductive polymers, and the like. As said conductive polymer, polyacetylene etc. are mentioned. Examples of the aforementioned non-conductive material include silica, alumina, barium titanate, and zirconia. Metals are preferred because they can improve conductivity and thereby effectively reduce connection resistance. The above-mentioned core material is preferably metal particles. The metal as the material of the above-mentioned core substance can be suitably used as the metal exemplified as the metal for forming the above-mentioned conductive portion.

Insulating material: The above-mentioned conductive particles preferably further include an insulating material arranged on the outer surface of the above-mentioned conductive part. In this case, if the conductive particles are used for the connection between the electrodes, the short circuit between the adjacent electrodes can be further prevented. Specifically, when a plurality of conductive particles are in contact with each other, an insulating substance is present between the plurality of electrodes, so that it is possible to prevent short circuits between the electrodes adjacent in the lateral direction rather than between the upper and lower electrodes. Furthermore, when the electrodes are connected, the conductive particles are pressurized with two electrodes, whereby the insulating material between the conductive portion of the conductive particles and the electrodes can be easily removed. When the above-mentioned conductive particle has a plurality of protrusions on the outer surface of the conductive part, the insulating material between the conductive part of the conductive particle and the electrode can be eliminated more easily.

In terms of easier removal of the above-mentioned insulating material during pressure bonding between electrodes, the above-mentioned insulating material is preferably insulating particles.

Examples of materials for the above-mentioned insulating materials include polyolefin compounds, (meth)acrylate polymers, (meth)acrylate copolymers, block polymers, thermoplastic resins, cross-linked products of thermoplastic resins, and thermosetting resins. Resin and water-soluble resin, etc. As for the material of the said insulating substance, only 1 type may be used, and 2 or more types may be used together.

As said polyolefin compound, polyethylene, an ethylene-vinyl acetate copolymer, an ethylene-acrylate copolymer, etc. are mentioned. As said (meth)acrylate polymer, polymethyl (meth)acrylate, polydodecyl (meth)acrylate, polystearyl (meth)acrylate, etc. are mentioned. Examples of the block polymer include polystyrene, styrene-acrylate copolymer, SB-type styrene-butadiene block copolymer, and SBS-type styrene-butadiene block copolymer, and These hydrides, etc. As said thermoplastic resin, an ethylene-type polymer, an ethylene-type copolymer, etc. are mentioned. As said thermosetting resin, epoxy resin, phenol resin, melamine resin, etc. are mentioned. Examples of the crosslinking of the above-mentioned thermoplastic resin include introduction of polyethylene glycol methacrylate, alkoxylated trimethylolpropane methacrylate, alkoxylated pentaerythritol methacrylate, and the like. As said water-soluble resin, polyvinyl alcohol, polyacrylic acid, polyacrylamide, polyvinylpyrrolidone, polyethylene oxide, methyl cellulose, etc. are mentioned. In addition, chain transfer agents can also be used to adjust the degree of polymerization. As a chain transfer agent, mercaptans, carbon tetrachloride, etc. are mentioned.

As a method of disposing an insulating substance on the surface of the conductive portion, a chemical method, a physical or mechanical method, etc. can be cited. Examples of the above-mentioned chemical methods include interfacial polymerization, suspension polymerization in the presence of particles, and emulsion polymerization. Examples of the above-mentioned physical or mechanical methods include spray drying, mixing, electrostatic adsorption, spraying, dipping, and vacuum deposition. In terms that the insulating material is not easily detached, a method of disposing the insulating material on the surface of the conductive portion via a chemical bond is preferable.

The outer surface of the conductive portion and the surface of the insulating material may be respectively coated with a compound having a reactive functional group. The outer surface of the conductive part and the surface of the insulating material may not be directly chemically bonded, or may be chemically bonded indirectly by a compound having a reactive functional group. After the carboxyl group is introduced to the outer surface of the conductive part, the carboxyl group may be chemically bonded to the functional group on the surface of the insulating material via a polymer electrolyte such as polyethyleneimine.

(Conductive material) The conductive material of the present invention includes the above-mentioned conductive particles and a binder. The said electroconductive particle is equipped with the said resin particle, and the electroconductive part arrange|positioned on the surface of the said resin particle. The above-mentioned conductive particles are preferably dispersed in a binder for use, and preferably dispersed in a binder for use as a conductive material. The aforementioned conductive material is preferably an anisotropic conductive material. The above-mentioned conductive material is preferably used for electrical connection between electrodes. The above-mentioned conductive material is preferably a conductive material for circuit connection.

The above-mentioned binder resin is not particularly limited. As the above-mentioned binder resin, a well-known insulating resin can be used. The above-mentioned binder resin preferably contains a thermoplastic component (thermoplastic compound) or a curable component, and more preferably contains a curable component. As said curable component, a photocurable component and a thermosetting component are mentioned. The photocurable component preferably contains a photocurable compound and a photopolymerization initiator. It is preferable that the said thermosetting component contains a thermosetting compound and a thermosetting agent. Examples of the above-mentioned binder resin include vinyl resins, thermoplastic resins, curable resins, thermoplastic block copolymers, elastomers, and the like. The said binder resin may use only 1 type, and may use 2 or more types together.

As said vinyl resin, vinyl acetate resin, acrylic resin, styrene resin, etc. are mentioned, for example. As said thermoplastic resin, polyolefin resin, ethylene-vinyl acetate copolymer, polyamide resin, etc. are mentioned, for example. As said curable resin, epoxy resin, urethane resin, polyimide resin, unsaturated polyester resin, etc. are mentioned, for example. Furthermore, the above-mentioned curable resin may be a room temperature curable resin, a thermosetting resin, a light curable resin, or a moisture curable resin. The above-mentioned curable resin may be used in combination with a curing agent. Examples of the above-mentioned thermoplastic block copolymers include styrene-butadiene-styrene block copolymers, styrene-isoprene-styrene block copolymers, and styrene-butadiene-styrene block copolymers. The hydrogenated product of block copolymer, and the hydrogenated product of styrene-isoprene-styrene block copolymer, etc. As said elastomer, a styrene-butadiene copolymer rubber, an acrylonitrile-styrene block copolymer rubber, etc. are mentioned, for example.

In addition to the conductive particles and the binder resin, the conductive material may also include fillers, extenders, softeners, plasticizers, polymerization catalysts, curing catalysts, colorants, antioxidants, and heat stabilizers. , Light stabilizers, UV absorbers, lubricants, antistatic agents and flame retardants and other additives.

The method for dispersing the conductive particles in the binder resin can use a conventionally known dispersion method, and is not particularly limited. As a method of dispersing the conductive particles in the binder resin, for example, the following methods can be cited. A method of adding the conductive particles to the binder resin and then kneading and dispersing them with a planetary mixer or the like. A method in which the conductive particles are uniformly dispersed in water or an organic solvent using a homogenizer or the like, then added to the binder resin, and kneaded and dispersed by a planetary mixer or the like. A method of diluting the above-mentioned binder resin with water, an organic solvent, etc., adding the above-mentioned conductive particles, and then kneading and dispersing them with a planetary mixer or the like.

The viscosity (η25) of the conductive material at 25°C is preferably 30 Pa·s or more, more preferably 50 Pa·s or more, and preferably 400 Pa·s or less, and more preferably 300 Pa·s or less. If the viscosity of the conductive material at 25°C is above the above lower limit and below the above upper limit, the connection reliability between the electrodes can be further effectively improved. The above-mentioned viscosity (η25) can be appropriately adjusted by the type and amount of the compounding ingredients.

The above-mentioned viscosity (η25) can be measured, for example, using an E-type viscometer ("TVE22L" manufactured by Toki Sangyo Co., Ltd.) at 25°C and 5 rpm.

The aforementioned conductive material can be used in the form of a conductive paste, a conductive film, and the like. When the conductive material of the present invention is a conductive film, a film containing no conductive particles may be laminated on a conductive film containing conductive particles. The aforementioned conductive paste is preferably an anisotropic conductive paste. The above-mentioned conductive film is preferably an anisotropic conductive film.

In 100% by weight of the conductive material, the content of the binder resin is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 50% by weight or more, particularly preferably 70% by weight or more, and more preferably It is 99.99% by weight or less, more preferably 99.9% by weight or less. If the content of the binder resin is greater than or equal to the aforementioned lower limit and less than or equal to the aforementioned upper limit, the conductive particles are efficiently arranged between the electrodes, and the connection reliability of the connection object member connected via the conductive material is further improved.

In 100% by weight of the conductive material, the content of the conductive particles is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, and preferably 80% by weight or less, more preferably 60% by weight or less, and more preferably It is 40% by weight or less, more preferably 20% by weight or less, and particularly preferably 10% by weight or less. If the content of the conductive particles is greater than or equal to the aforementioned lower limit and less than or equal to the aforementioned upper limit, the connection resistance between the electrodes can be further effectively reduced, and the connection reliability between the electrodes can be further effectively improved.

(Connection structure) A connection structure can be obtained by connecting the connection object member using the above-mentioned conductive particles or a conductive material containing the above-mentioned conductive particles and a binder resin.

The connection structure includes a first connection object member having a first electrode on the surface, a second connection object member having a second electrode on the surface, and a connection portion that connects the first connection object member and the second connection object member. In the connection structure, the connection portion is formed of conductive particles, or is formed of the conductive material containing the conductive particles and the binder resin. The said electroconductive particle is equipped with the said resin particle, and the electroconductive part arrange|positioned on the surface of the said resin particle. In the connection structure, the first electrode and the second electrode are electrically connected by the conductive particles.

When the above-mentioned conductive particles are used alone, the connection portion itself is conductive particles. That is, the said 1st connection object member and the said 2nd connection object member are connected by the said electroconductive particle. The conductive material used to obtain the connection structure is preferably an anisotropic conductive material.

4 is a cross-sectional view showing an example of a connection structure using conductive particles according to the first embodiment of the present invention.

The connection structure 41 shown in FIG. 4 includes a first connection object member 42, a second connection object member 43, and a connection portion 44 that connects the first connection object member 42 and the second connection object member 43. The connecting portion 44 is formed of a conductive material including the conductive particles 1 and a binder resin. In FIG. 4, the conductive particles 1 are schematically illustrated for the sake of illustration. Other conductive particles such as the conductive particles 21 and 31 may be used instead of the conductive particles 1.

The first connection object member 42 has a plurality of first electrodes 42a on the surface (upper surface). The second connection object member 43 has a plurality of second electrodes 43a on the surface (lower surface). The first electrode 42a and the second electrode 43a are electrically connected by one or more conductive particles 1. Therefore, the first and second connection object members 42 and 43 are electrically connected by the conductive particles 1.

The manufacturing method of the said connection structure is not specifically limited. As an example of the manufacturing method of the connection structure, after arranging the said conductive material between a 1st connection object member and a 2nd connection object member, after obtaining a laminated body, the method of heating and pressurizing the laminated body, etc. are mentioned. The pressure at the time of pressurization is preferably 40 MPa or more, more preferably 60 MPa or more, and preferably 90 MPa or less, and more preferably 70 MPa or less. The temperature during the heating is preferably 80°C or higher, more preferably 100°C or higher, and preferably 140°C or lower, and more preferably 120°C or lower.

The above-mentioned first connection target member and second connection target member are not particularly limited. Specific examples of the first connection target member and the second connection target member include semiconductor wafers, semiconductor packages, LED (light-emitting diode) wafers, LED packages, capacitors, and diodes. Electronic parts, and electronic parts such as resin films, printed circuit boards, flexible printed circuit boards, flexible flat cables, rigid flexible substrates, glass epoxy substrates, and circuit boards such as glass substrates. The first connection target member and the second connection target member are preferably electronic components.

The above-mentioned conductive material is preferably a conductive material used to connect electronic parts. The above-mentioned conductive paste is a paste-like conductive material, and is preferably applied in a paste-like state on the connection object member.

The said conductive particle, the said conductive material, and the said connection material can also be used suitably for a touch panel. Therefore, the above-mentioned connection object member is also preferably a flexible substrate or a connection object member in which electrodes are arranged on the surface of a resin film. The above-mentioned connection object member is preferably a flexible substrate, and is preferably a connection object member in which an electrode is arranged on the surface of a resin film. When the above-mentioned flexible substrate is a flexible printed circuit board or the like, the flexible substrate usually has electrodes on the surface.

Examples of electrodes provided on the above-mentioned connection object member include metal electrodes such as gold electrodes, nickel electrodes, tin electrodes, aluminum electrodes, copper electrodes, molybdenum electrodes, silver electrodes, SUS (Steel Use Stainless) electrodes, and tungsten electrodes. . When the connection object member is a flexible printed circuit board, the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, a silver electrode, or a copper electrode. When the connection object member is a glass substrate, the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, or a tungsten electrode. Furthermore, when the above-mentioned electrode is an aluminum electrode, it may be an electrode formed only of aluminum, or an electrode with an aluminum layer on the surface area of the metal oxide layer. As the material of the metal oxide layer, indium oxide doped with trivalent metal element, zinc oxide doped with trivalent metal element, and the like can be cited. As said trivalent metal element, Sn, Al, Ga, etc. are mentioned.

In addition, the above-mentioned resin particles can be suitably used as spacers for liquid crystal display elements. The said 1st connection object member may be a 1st member for liquid crystal display elements. The said 2nd connection object member may be a 2nd member for liquid crystal display elements. The connecting portion may be a state where the first liquid crystal display element member and the second liquid crystal display element member are opposed to each other and the outer periphery of the first liquid crystal display element member and the second liquid crystal display element member are sealed. Sealing department.

The said resin particle can also be used as a peripheral sealing agent for liquid crystal display elements. The liquid crystal display element includes a first member for liquid crystal display elements and a second member for liquid crystal display elements. The liquid crystal display element further includes: a sealing portion that connects the first liquid crystal display element member and the second liquid crystal display element member in a state where the first liquid crystal display element member and the second liquid crystal display element member face each other Peripheral sealing; and liquid crystal, which is arranged inside the sealing portion and between the first liquid crystal display element member and the second liquid crystal display element member. This liquid crystal display element applies a liquid crystal dropping method, and the said sealing part is formed by thermally hardening the sealing compound for liquid crystal dropping methods.

In the above-mentioned liquid crystal display element, the arrangement density of the spacers ^{for the liquid crystal display element per 1 mm 2 is preferably 10 pcs/mm 2} or more, preferably 1000 pcs/mm ² or less. If the above arrangement density is 10 pieces/mm ² or more, the element gap becomes more uniform. If the above-mentioned arrangement density is 1000 pieces/mm ² or less, the contrast of the liquid crystal display element becomes better.

(Electronic component device) The above-mentioned resin particles or conductive particles can also be arranged between the first ceramic member and the second ceramic member on the outer periphery of the first ceramic member and the second ceramic member, and used as a gap control material and a conductive connection material .

Fig. 5 is a cross-sectional view showing an example of an electronic component device using the resin particles of the present invention. Fig. 6 is a cross-sectional view showing an enlarged view of the joint portion of the electronic component device shown in Fig. 5.

The electronic component device 81 shown in FIGS. 5 and 6 includes a first ceramic member 82, a second ceramic member 83, a bonding portion 84, an electronic component 85, and a lead frame 86.

The first and second ceramic members 82 and 83 are formed of ceramic materials, respectively. The first and second ceramic members 82 and 83 are, for example, housings, respectively. The first ceramic member 82 is, for example, a substrate. The second ceramic member 83 is, for example, a cover. The first ceramic member 82 has a convex portion protruding to the second ceramic member 83 side (upper side) on the outer peripheral portion. The first ceramic member 82 has a recess formed on the side (upper side) of the second ceramic member 83 to form an internal space R for accommodating the electronic component 85. In addition, the first ceramic member 82 may not have convex portions. The second ceramic member 83 has a convex portion protruding to the first ceramic member 82 side (lower side) on the outer peripheral portion. The second ceramic member 83 has a recess formed on the side (lower side) of the first ceramic member 82 to form an internal space R for accommodating the electronic component 85. In addition, the second ceramic member 83 may not have convex portions. The internal space R is formed by the first ceramic member 82 and the second ceramic member 83.

The joining portion 84 joins the outer peripheral portion of the first ceramic member 82 and the outer peripheral portion of the second ceramic member 83. Specifically, the joining portion 84 joins the convex portion of the outer peripheral portion of the first ceramic member 82 and the convex portion of the outer peripheral portion of the second ceramic member 83.

The first and second ceramic members 82 and 83 joined through the joining portion 84 form a package. The internal space R is formed by packaging. The joint 84 seals the internal space R in a liquid-tight and air-tight manner. The joining part 84 is a sealing part.

The electronic component 85 is arranged in the internal space R of the above-mentioned package. Specifically, the electronic component 85 is arranged on the first ceramic member 82. In this embodiment, two electronic components 85 are used.

The junction 84 includes a plurality of resin particles 11 and glass 84B. The bonding portion 84 is formed using a bonding material including a plurality of resin particles 11 different from the glass particles and glass 84B. This bonding material is a bonding material for ceramic packages. The said bonding material may contain the said electroconductive particle instead of the said resin particle.

The bonding material may include a solvent or a resin. At the junction 84, glass 84B such as glass particles is melted and solidified after bonding.

Examples of electronic components include sensor elements, MEMS (Micro Electro Mechanical System), bare wafers, and the like. Examples of the above-mentioned sensor element include: pressure sensor element, acceleration sensor element, CMOS (Complementary Metal Oxide Semiconductor) sensor element, CCD (Charge Coupled Device, charge coupled device) sensor Sensor components and the housings of the above-mentioned various sensor components, etc.

The lead frame 86 is arranged between the outer peripheral portion of the first ceramic member 82 and the outer peripheral portion of the second ceramic member 83. The lead frame 86 extends to the inner space R side and the outer space side of the package. The terminals of the electronic component 85 and the lead frame 86 are electrically connected via wires.

The joining portion 84 directly joins the outer peripheral portion of the first ceramic member 82 and the outer peripheral portion of the second ceramic member 83 partially directly and partially indirectly. Specifically, the bonding portion 84 is located between the outer periphery of the first ceramic member 82 and the outer periphery of the second ceramic member 83 where the lead frame 86 exists, and the outer periphery of the first ceramic member 82 is connected to the outer periphery of the second ceramic member 83 via the lead frame 86. The outer periphery of the second ceramic member 83 is indirectly joined. Between the outer periphery of the first ceramic member 82 and the outer periphery of the second ceramic member 83, the lead frame 86 is present. The first ceramic member 82 is in contact with the lead frame 86, and the lead frame 86 is connected to the first ceramic member 82 and The joining portion 84 is in contact with each other. Furthermore, the bonding portion 84 is in contact with the lead frame 86 and the second ceramic member 83, and the second ceramic member 83 is in contact with the bonding portion 84. The junction 84 is located between the outer circumference of the first ceramic member 82 and the outer circumference of the second ceramic member 83 where the lead frame 86 is not present, and separates the outer circumference of the first ceramic member 82 and the outer circumference of the second ceramic member 83 Direct bonding. Between the outer periphery of the first ceramic member 82 and the outer periphery of the second ceramic member 83 where the lead frame 86 is not present, the junction 84 is in contact with the first ceramic member 82 and the second ceramic member 83.

Between the outer periphery of the first ceramic member 82 and the outer periphery of the second ceramic member 83 where the lead frame 86 exists, the gap distance between the outer periphery of the first ceramic member 82 and the outer periphery of the second ceramic member 83 is determined by The plurality of resin particles 11 included in the joint 84 are controlled.

The joining portion may directly or indirectly join the outer peripheral portion of the first ceramic member and the outer peripheral portion of the second ceramic member. Furthermore, electrical connection methods other than the lead frame can also be used.

The electronic component device may include, for example, the electronic component device 81, a first ceramic member formed of a ceramic material, a second ceramic member formed of a ceramic material, a junction, and an electronic component. In the electronic component device described above, the joining portion may directly or indirectly join the outer peripheral portion of the first ceramic member and the outer peripheral portion of the second ceramic member. In the above electronic component device, a package can be formed by the first and second ceramic members joined via the joining portion. In the above-mentioned electronic component device, the above-mentioned electronic component may be arranged in the internal space of the above-mentioned package, and the above-mentioned joint portion includes a plurality of resin particles and glass.

In addition, as the bonding material used in the electronic component device 81, the bonding material for ceramic encapsulation can be used in the electronic component device to form the bonding portion, and includes resin particles and glass. Furthermore, an electrical connection method that only contains resin particles and does not contain glass can also be used. Moreover, the said junction part may contain the said electroconductive particle instead of the said resin particle.

Hereinafter, the present invention will be specifically described with reference to examples and comparative examples. The present invention is not limited to the following examples.

(Example 1) (1) Production of resin particles Polystyrene (PS) particles with an average particle diameter of 0.80 μm were prepared as seed particles. 3.9 parts by weight of the polystyrene particles, 500 parts by weight of ion-exchanged water, and 120 parts by weight of a 5 wt% aqueous solution of polyvinyl alcohol were mixed to prepare a mixed solution (seed particle dispersion). Disperse the above-mentioned mixed liquid by ultrasonic waves, put it in a separable flask, and stir uniformly.

In addition, divinylbenzene ("DVB960" manufactured by NS Styrene Monomer) was prepared as a cross-linking compound. To 100 parts by weight of divinylbenzene, 2 parts by weight of 2,2'-azobis(methyl isobutyrate) ("V-601" manufactured by Wako Pure Chemical Industries, Ltd.), and benzyl peroxide (Japanese 2 parts by weight of "Nyper BW" manufactured by the oil company, 8 parts by weight of triethanolamine lauryl sulfate, 100 parts by weight of ethanol, and 1000 parts by weight of ion-exchanged water were added to prepare an emulsion.

The emulsified liquid was further added to the mixed liquid in the separable flask and stirred for 4 hours to allow the seed particles to absorb the monomer to obtain a suspension containing the seed particles after the monomer swelled.

Thereafter, 490 parts by weight of a 5 wt% aqueous solution of polyvinyl alcohol was added, heating was started, and a reaction was performed at 85° C. for 10 hours to obtain resin particles.

(2) Production of conductive particles The obtained resin particles are washed and classified, and then dried. After that, a nickel layer was formed on the surface of the obtained resin particles by an electroless plating method to produce conductive particles. Furthermore, the thickness of the nickel layer is 0.1 μm.

(3) Preparation of conductive material (anisotropic conductive paste) To make conductive material (anisotropic conductive paste), prepare the following materials.

(Material of conductive material (anisotropic conductive paste)) Thermosetting compound A: epoxy compound ("EP-3300P" manufactured by Nagase ChemteX) Thermosetting compound B: epoxy compound ("EPICLON manufactured by DIC" HP-4032D") Thermosetting compound C: Epoxy compound ("Epogosey PT" manufactured by Yokkaichi Synthetic Co., Polytetramethylene glycol diglycidyl ether) Thermosetting agent: Thermal cation generator (Sanshin Chemical Co., Ltd.) San-Aid manufactured by "SI-60") Filler: Silica (average particle size 0.25 μm)

The conductive material (anisotropic conductive paste) is produced in the following manner.

(Method for making conductive material (anisotropic conductive paste)) Prepare 10 parts by weight of thermosetting compound A, 10 parts by weight of thermosetting compound B, 15 parts by weight of thermosetting compound C, 5 parts by weight of thermosetting agent, and 20 parts by weight of filler was used to obtain a formulation. Furthermore, after adding the obtained conductive particles so that the content in 100% by weight of the formulation became 10% by weight, they were stirred at 2000 rpm for 5 minutes using a planetary mixer to obtain a conductive material (anisotropic conductive paste).

(4) Fabrication of the connection structure Prepare a glass substrate with an aluminum electrode pattern with L/S of 20 μm/20 μm on the upper surface as the first connection object member. In addition, a semiconductor wafer having a gold electrode pattern (gold electrode thickness 20 μm) with L/S of 20 μm/20 μm on the lower surface was prepared as the second connection object member.

The conductive material (anisotropic conductive paste) immediately after production was coated on the upper surface of the glass substrate in a thickness of 30 μm to form a layer of conductive material (anisotropic conductive paste). Then, the above-mentioned semiconductor wafer is laminated on the upper surface of the conductive material (anisotropic conductive paste) layer with the electrodes facing each other. After that, while adjusting the temperature of the heating head so that the temperature of the conductive material (anisotropic conductive paste) layer becomes 170°C, the heating head is placed on the upper surface of the semiconductor wafer to make the conductive material (each The anisotropic conductive paste) layer is cured under the conditions of 170° C., 1 MPa, and 15 seconds to obtain a connection structure.

(Example 2) When producing resin particles, 100 parts by weight of divinylbenzene (crosslinkable compound) was changed to 50 parts by weight of divinylbenzene ("DVB960" manufactured by NS Styrene Monomer) and pentaerythritol triacrylate (total) "Light acrylate PE-4A" manufactured by Eisha Chemical Co., Ltd.) 50 parts by weight. Except for the above-mentioned changes, in the same manner as in Example 1, resin particles, conductive particles, conductive materials, and connection structures were obtained.

(Example 3) When making resin particles, 100 parts by weight of divinylbenzene (crosslinkable compound) was changed to polytetramethylene glycol diacrylate (Light acrylate PTMGA-250 manufactured by Kyoeisha Chemical Co., Ltd.) ") 80 parts by weight. When producing resin particles, 20 parts by weight of styrene (manufactured by NS Styrene Monomer), which is a non-crosslinkable compound, was further used. Except for the above-mentioned changes, in the same manner as in Example 1, resin particles, conductive particles, conductive materials, and connection structures were obtained.

(Example 4) When making resin particles, 100 parts by weight of divinylbenzene (crosslinkable compound) was changed to 1,4-butanediol dimethacrylate ("LIGHT ESTER 1.4" manufactured by Kyoeisha Chemical Co., Ltd.) BG") 60 parts by weight. In the production of resin particles, 40 parts by weight of isoacrylate ("Light acrylate IB-XA" manufactured by Kyoeisha Chemical Co., Ltd.), which is a non-crosslinkable compound, was further used. Except for the above-mentioned changes, in the same manner as in Example 1, resin particles, conductive particles, conductive materials, and connection structures were obtained.

(Example 5) When making resin particles, 100 parts by weight of divinylbenzene (crosslinkable compound) was changed to polytetramethylene glycol diacrylate (Light acrylate PTMGA-250 manufactured by Kyoeisha Chemical Co., Ltd.) ") 30 parts by weight. In the production of resin particles, 70 parts by weight of isopropyl acrylate ("Light acrylate IB-XA" manufactured by Kyoeisha Chemical Co., Ltd.), which is a non-crosslinkable compound, was further used. Except for the above-mentioned changes, in the same manner as in Example 1, resin particles, conductive particles, conductive materials, and connection structures were obtained.

(Example 6) When making resin particles, 100 parts by weight of divinylbenzene (crosslinkable compound) was changed to 50 parts by weight of glycerol dimethacrylate ("LIGHT ESTER G-101P" manufactured by Kyoeisha Chemical Co., Ltd.) Copies. When producing resin particles, 50 parts by weight of cyclohexyl methacrylate ("LIGHT ESTER CH" manufactured by Kyoeisha Chemical Co., Ltd.), which is a non-crosslinkable compound, was further used. Except for the above-mentioned changes, in the same manner as in Example 1, resin particles, conductive particles, conductive materials, and connection structures were obtained.

(Example 7) When producing resin particles, 100 parts by weight of divinylbenzene (crosslinkable compound) was changed to 20 parts by weight of divinylbenzene ("DVB960" manufactured by NS Styrene Monomer). In the production of resin particles, 79.5 parts by weight of cyclohexyl methacrylate ("LIGHT ESTER CH" manufactured by Kyoeisha Chemical Co., Ltd.) as a non-crosslinkable compound and a polymerizable compound with a polar functional group are used. Methacrylic acid ("LIGHT ESTER A" manufactured by Kyoeisha Chemical Co., Ltd.) 0.5 parts by weight. Except for the above-mentioned changes, in the same manner as in Example 1, resin particles, conductive particles, conductive materials, and connection structures were obtained.

(Example 8) When producing resin particles, polystyrene particles (seed particles) with an average particle diameter of 0.80 μm were changed to polystyrene particles with an average particle diameter of 3 μm. When making resin particles, 100 parts by weight of divinylbenzene (crosslinkable compound) was changed to 5 parts by weight of polytetramethylene glycol diacrylate ("Light acrylate PTMGA-250" manufactured by Kyoeisha Chemical Co., Ltd.) . When making resin particles, use 65 parts by weight of isoacrylate ("Light acrylate IB-XA" manufactured by Kyoeisha Chemical Co., Ltd.) as a non-crosslinkable compound, and an acid as a polymerizable compound with a polar functional group Formula 2-methacryloxyethyl phosphate ("LIGHT ESTER P-1M" manufactured by Kyoeisha Chemical Co., Ltd.) 30 parts by weight. Except for the above-mentioned changes, resin particles were obtained in the same manner as in Example 1.

When producing conductive particles, the thickness of the nickel layer was changed from 0.1 μm to 1 μm.

In addition to the above changes, conductive particles, conductive materials, and connection structures were obtained.

(Comparative Example 1) When making resin particles, 100 parts by weight of divinylbenzene (crosslinkable compound) was changed to 20 parts by weight of divinylbenzene ("DVB960" manufactured by NS Styrene Monomer). When producing resin particles, 80 parts by weight of cyclohexyl methacrylate ("LIGHT ESTER CH" manufactured by Kyoeisha Chemical Co., Ltd.), which is a non-crosslinkable compound, was further used. Except for the above-mentioned changes, in the same manner as in Example 1, resin particles, conductive particles, conductive materials, and connection structures were obtained.

(Comparative Example 2) When producing resin particles, polystyrene particles (seed particles) with an average particle diameter of 0.80 μm were changed to polystyrene particles with an average particle diameter of 3 μm. When making resin particles, 100 parts by weight of divinylbenzene (crosslinkable compound) was changed to 7.5 parts by weight of polytetramethylene glycol diacrylate ("Light acrylate PTMGA-250" manufactured by Kyoeisha Chemical Co., Ltd.) . In the production of resin particles, 82.5 parts by weight of isoacrylate ("Light acrylate IB-XA" manufactured by Kyoeisha Chemical Co., Ltd.), which is a non-crosslinkable compound, was further used. Except for the above-mentioned changes, resin particles were obtained in the same manner as in Example 1.

When producing conductive particles, the thickness of the nickel layer was changed from 0.1 μm to 1 μm.

In addition to the above changes, conductive particles, conductive materials, and connection structures were obtained.

(Evaluation) (1) Particle size of resin particles and conductive particles Use a precision particle size distribution measuring device ("Multisizer 3" manufactured by Beckman Coulter) to measure the particle size of the obtained resin particles and conductive particles.

(2) Compression modulus of resin particles By the above method and using a micro compression tester (Fischerscope H-100 made by Fischer), measure the compression modulus of resin particles (10% K value and 30% K value).

(3) Compression recovery rate of resin particles The compression recovery rate of the obtained resin particles was measured by the above method and using a micro compression tester ("Fischerscope H-100" manufactured by Fischer).

(4) Time-of-flight secondary ion mass spectrometry (TOF-SIMS) of resin particles Using the obtained resin particles, time-of-flight secondary ion mass spectrometry (TOF-SIMS) was performed. Specifically, the analysis is performed in the following manner. The TOF-SIMS mentioned above uses "TOF-SIMS 5" manufactured by ION TOF. In order to use the TOF-SIMS analyzer to measure the strength and total ionic strength ^{of the OH- ions on the outer surface of the resin particles, the Bi 3+} ion gun was used as the primary ion source for the measurement, and the measurement was performed under the condition of 25 keV. Sputtering is to introduce an inert gas such as argon in a vacuum, apply a negative voltage to the target to generate glow discharge, ionize the inert gas atoms and grind the surface of the target. By performing sputtering twice, and using TOF-SIMS, the detection result of each ion intensity in a region with a thickness of about 2 nm from the outer surface of the resin particle toward the inner side is obtained.

^{According to the obtained results, the ratio of the intensity of OH-} ions to the total intensity of all negative ions when the negative ion mass spectrum is obtained by time-of-flight secondary ion mass spectrometry (TOF-SIMS) calculated from the outer surface of the resin particles ( ^{The intensity of OH-the} sum of the intensity of all negative ions).

(5) Cohesiveness of resin particles The precipitation rate when the obtained resin particles are mixed with an organic solvent and left to stand is measured to evaluate the cohesiveness of the resin particles. 2.5 g of the obtained resin particles and 25 mL of acetone were mixed to prepare a mixed solution. The mixed solution was dispersed by ultrasonic using an ultrasonic cleaner ("VS-1003" manufactured by AS ONE) 1 minute. After that, put it into a 20 mL glass measuring cylinder and let it stand still. The precipitation of the resin particles was confirmed every 60 minutes to calculate the actual precipitation rate. Calculate the ratio of the theoretical precipitation rate to the measured precipitation rate ([theoretical precipitation rate (m/h)/measured precipitation rate value (m/h)]), and make judgments based on the following criteria.

In addition, the theoretical precipitation rate is calculated using the Stokes formula. This formula assumes the existence of a single particle in a true spherical shape. However, since the item of slurry concentration is not included, it is not considered.

Theoretical precipitation rate (m/h) = D _p ² (ρ _{p- ρ f} )g/18η D _p : particle size of resin particles (m) ρ _p : density of resin particles (kg/m ³ ) ρ _f : acetone Density (kg/m ³ ): 784 kg/m ³ g: Acceleration of gravity (m/s) η: Viscosity of acetone (kg/m·s): 0.00032 kg/m·s

The density of the resin particles was measured using a dry automatic density meter ("AccuPyc" manufactured by Shimadzu Corporation). The density of resin particles was measured using the following resin particles, which were obtained by immersing 1 g of resin particles in 100 g of methanol at 25°C for 20 hours, and then vacuum drying at 40°C for 12 hours.

[Criteria for judging the agglomeration of resin particles] ○: The value of the above ratio ([theoretical precipitation rate (m/h)/measured precipitation rate value (m/h)]) does not reach 0.55 (the aggregation of resin particles is not confirmed at all The agglomerate) △: The value of the above ratio ([theoretical sedimentation rate (m/h)/measured sedimentation rate value (m/h)]) is 0.55 or more and less than 0.75 (agglomeration of resin particles is slightly confirmed Substance) ×: The value of the above ratio ([theoretical precipitation rate (m/h)/measured precipitation rate value (m/h)]) is above 0.75 (condensation of resin particles is confirmed)

(6) Thickness of the conductive part The obtained conductive particles are added to the "Technovit 4000" manufactured by Kulzer Corporation so that the content becomes 30% by weight, and they are dispersed to prepare an embedded resin body for inspection. Using an ion milling device ("IM4000" manufactured by Hitachi High-Technologies Corporation), the cross section of the conductive particles was cut out by dispersing in the vicinity of the center of the conductive particles embedded in the resin body for inspection.

Then, using an electric field emission type transmission electron microscope (FE-TEM) ("JEM-ARM200F" manufactured by JEOL Ltd.), the image magnification was set to 50,000 times, and 10 conductive particles were randomly selected, and each Observe the conductive part of the conductive particle. The thickness of the conductive part in each conductive particle is measured, and the arithmetic average is performed, and the obtained value is taken as the thickness of the conductive part.

(7) Adhesion between resin particles and conductive parts For the obtained connection structure, use a scanning electron microscope ("Regulus 8220" manufactured by Hitachi High-Technologies Corporation) to observe the conductive particles in the connection part. Regarding the conductive part arranged on the surface of the resin particle, check whether the conductive part is broken or the conductive part is peeled off. In addition, the number of observed conductive particles was 100. The adhesion between the resin particles and the conductive part was judged according to the following criteria.

[Criteria for judging the adhesion between resin particles and conductive parts] ○ ○ ○: 0 conductive particles that cause cracks or peeling of the conductive parts ○ ○: Conductivity that causes cracks or peeling of the conductive parts More than 0 particles and less than 15 particles ○: More than 15 conductive particles and less than 30 conductive particles that have broken or peeled off the conductive part △: More than 15 conductive particles have broken or peeled off the conductive part 30 and less than 50 ×: More than 50 conductive particles have broken or peeled off the conductive part

(8) Connection reliability (between upper and lower electrodes) The connection resistance between the upper and lower electrodes of the 100 connection structures obtained by the four-terminal method was measured. Calculate the average value of the connection resistance. Furthermore, the connection resistance can be obtained by measuring the voltage when a certain current flows according to the relationship of voltage=current×resistance. The reliability of the connection is determined based on the following criteria.

[Judgment criteria for connection reliability] ○ ○ ○: The average value of the connection resistance is 1.5 Ω or less ○ ○: The average value of the connection resistance exceeds 1.5 Ω and is less than 2.0 Ω ○: The average value of the connection resistance exceeds 2.0 Ω and is 5.0 Ω or less △: The average value of the connection resistance exceeds 5.0 Ω and is less than 10 Ω ×: The average value of the connection resistance exceeds 10 Ω

(9) Connection reliability under high temperature and high humidity conditions Put the 100 connection structures obtained in the above (8) connection reliability evaluation at 85°C and 85%RH for 100 hours. For the 100 connection structures after placement, it was evaluated whether there was a poor continuity between the upper and lower electrodes. Determine the connection reliability after high temperature and high humidity conditions according to the following criteria.

[Judgment criteria for connection reliability after high temperature and high humidity conditions] ○ ○: The number of continuity failures in 100 connection structures is less than 1 ○: The number of continuity failures in 100 connection structures 2 or more and 5 or less △: Among 100 connection structures, the number of continuity failures is 6 or more and 10 or less. ×: Among 100 connection structures, the number of continuity failures is 11 or more

Tables 1 and 2 show the materials at the time of production of the resin particles of Examples 1 to 8 and Comparative Examples 1 and 2. The results are shown in Tables 3 and 4 below.

[Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Particle dispersion Kind of particles species PS particles PS particles PS particles PS particles PS particles Average particle size (μm) 0.8 0.8 0.8 0.8 0.8 Emulsion Cross-linking compound species Divinylbenzene Divinylbenzene Polytetramethylene glycol diacrylate 1,4-Butanediol dimethacrylate Polytetramethylene glycol diacrylate Allocation amount (parts by weight) 100 50 80 60 30 species - Pentaerythritol triacrylate - - - Allocation amount (parts by weight) - 50 - - - Non-crosslinking compound species - - Styrene Isoacrylate acrylate Isoacrylate acrylate Allocation amount (parts by weight) - - 20 40 70 Polymeric compounds with polar functional groups species - - - - - Allocation amount (parts by weight) - - - - -

[Table 2] Example 6 Example 7 Example 8 Comparative example 1 Comparative example 2 Particle dispersion Kind of particles species PS particles PS particles PS particles PS particles PS particles Average particle size (μm) 0.8 0.8 3 0.8 3 Emulsion Cross-linking compound species Glycerol dimethacrylate Divinylbenzene Polytetramethylene glycol diacrylate Divinylbenzene Polytetramethylene glycol diacrylate Allocation amount (parts by weight) 50 20 5 20 7.5 species - - - - - Allocation amount (parts by weight) - - - - - Non-crosslinking compound species Cyclohexyl methacrylate Cyclohexyl methacrylate Isoacrylate acrylate Cyclohexyl methacrylate Isoacrylate acrylate Allocation amount (parts by weight) 50 79.5 65 80 82.5 Polymeric compounds with polar functional groups species - Methacrylate 2-methacryloxyethyl phosphate - - Allocation amount (parts by weight) - 0.5 30 - -

[table 3] Example 1 Example 2 Example 3 Example 4 Example 5 Evaluation of resin particles Particle size (μm) 5.0 3.1 25.4 3.2 3.3 10%K value (N/mm ² ) 5280 4390 690 3060 2680 30%K value (N/mm ² ) 5050 3620 390 2450 1320 Compression recovery rate (%) 60 45 55 36 25 Ratio of (OH ^- ions intensity / total intensity of all the anion) (× 10 ^{- 2)} 4.8 8.3 4.2 3.8 3.1 Agglutination ○ ○ ○ ○ ○ Evaluation of conductive particles Particle size (μm) 5.1 3.2 25.5 3.3 3.4 Thickness of conductive part (μm) 0.1 0.1 0.1 0.1 0.1 Adhesion between resin particles and conductive parts ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Evaluation of connection structure Connection reliability ○ ○ ○ ○ ○ ○ ○ Connection reliability (after high temperature and high humidity) ○ ○ ○ ○ ○ ○

[Table 4] Example 6 Example 7 Example 8 Comparative example 1 Comparative example 2 Evaluation of resin particles Particle size (μm) 3.5 2.1 20.2 2.1 20.3 10%K value (N/mm ² ) 4070 3300 2130 3160 2200 30%K value (N/mm ² ) 2360 1430 760 1450 740 Compression recovery rate (%) 25 13 7 12 7 Ratio of (OH ^- ions intensity / total intensity of all the anion) (× 10 ^{- 2)} 6.2 5.9 7.4 1.8 1.2 Agglutination ○ ○ ○ △ X Evaluation of conductive particles Particle size (μm) 3.6 2.2 21.2 2.2 21.3 Thickness of conductive part (μm) 0.1 0.1 1 0.1 1 Adhesion between resin particles and conductive parts ○ ○ ○ ○ ○ ○ ○ ○ ○ △ X Evaluation of connection structure Connection reliability ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ △ Connection reliability (after high temperature and high humidity) ○ ○ ○ ○ ○ ○ △ X

(10) Examples of use as spacers for gap control Production of bonding materials for ceramic packaging: The following bonding material for ceramic packaging was obtained, which contained 30 parts by weight of the resin particles obtained in Examples 1-8 and 70 parts by weight of glass (composition: Ag-V-Te-W-P-W-Ba-O, melting point 264°C).

Manufacturing of electronic parts and devices: Using the obtained bonding material, the electronic component device shown in FIG. 5 was fabricated. Specifically, the bonding material is applied to the outer periphery of the first ceramic member by a screen printing method. After that, the second ceramic member is arranged to face each other, and the joining portion is irradiated with a semiconductor laser to be fired, thereby joining the first ceramic member and the second ceramic member.

In the obtained electronic component device, the interval between the first ceramic member and the second ceramic member was well restricted. In addition, the obtained electronic component device performed well. In addition, the airtightness inside the package is also well maintained. In addition, the resin particles are well dispersed in the junction.

1: conductive particles 2: conductive part 11: Resin particles 21: Conductive particles 22: Conductive part 22A: The first conductive part 22B: The second conductive part 31: Conductive particles 31a: protrusion 32: Conductive part 32a: protrusion 33: core material 34: Insulating substance 41: Connection structure 42: The first connection object member 42a: first electrode 43: The second connection object member 43a: second electrode 44: Connection part 81: Electronic parts device 82: The first ceramic component 83: The second ceramic component 84: Joint 84B: Glass 85: electronic parts 86: lead frame R: Internal space

Fig. 1 is a cross-sectional view showing conductive particles according to the first embodiment of the present invention. Fig. 2 is a cross-sectional view showing the conductive particle according to the second embodiment of the present invention. Fig. 3 is a cross-sectional view showing the conductive particle according to the third embodiment of the present invention. Fig. 4 is a cross-sectional view showing an example of a connection structure using conductive particles according to the first embodiment of the present invention. Fig. 5 is a cross-sectional view showing an example of an electronic component device using the resin particles of the present invention. Fig. 6 is a cross-sectional view showing an enlarged view of the joint part in the electronic component device shown in Fig. 5.

1: conductive particles

2: conductive part

11: Resin particles

Claims (14)

^{A resin particle in which the ratio of the intensity of OH-} ions to the sum of the intensities of all anions is 2.0×10 ^-2 or more when the negative ion mass spectrum is obtained by time-of-flight secondary ion mass spectrometry on the outer surface of the resin particle. For example, the resin particles of claim 1 have a compressive modulus of elasticity of 500 N/mm ² or more and 4500 N/mm ² or less when compressed by 10%. For example, the resin particles of claim 1, the compression modulus of elasticity when compressed by 30% is 300 N/mm ² or more and 4000 N/mm ² or less. The resin particle according to any one of claims 1 to 3, which is a polymer containing polymerizable components of a plurality of polymerizable compounds. The resin particle of claim 4, wherein the polymerizable component constituting the polymer includes a crosslinkable compound, and in 100% by weight of the polymerizable component, the content of the crosslinkable compound is 30% by weight or more. The resin particle of claim 4, wherein the polymerizable component constituting the polymer includes a crosslinkable compound and a polymerizable compound having a polar functional group, and in 100% by weight of the polymerizable component, the crosslinkable compound The content is less than 30% by weight. In 100% by weight of the above-mentioned polymerizable components, the content of the above-mentioned polymerizable compound with a polar functional group is 0.5% by weight or more and 30% by weight or less. The resin particle according to claim 6, wherein the polymerizable compound having a polar functional group includes a polymerizable compound having a hydroxyl group, a polymerizable compound having a carboxyl group, or a polymerizable compound having a phosphoric acid group. The resin particle according to claim 5, wherein the crosslinkable compound comprises divinylbenzene, tetramethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, pentaerythritol three (Meth)acrylate, pentaerythritol tetra(meth)acrylate, glycerol di(meth)acrylate, or 2-(meth)acryloxyethyl acid phosphate. The resin particle according to any one of claims 1 to 3, which is used as a spacer or used to obtain conductive particles having the above-mentioned conductive part by forming a conductive part on the surface. A conductive particle, comprising: the resin particle according to any one of claims 1 to 9 and a conductive part arranged on the surface of the resin particle. The conductive particle according to claim 10, which further includes an insulating substance arranged on the outer surface of the conductive portion. The conductive particle according to claim 10 or 11, which has protrusions on the outer surface of the conductive portion. A conductive material comprising conductive particles and a binder resin, and the conductive particles are provided with the resin particles according to any one of claims 1 to 9 and a conductive part arranged on the surface of the resin particles. A connection structure comprising: a first connection object member with a first electrode on the surface, a second connection object member with a second electrode on the surface, and a connection connecting the first connection object member and the second connection object member Part, and the above-mentioned connecting part is formed of conductive particles or the above-mentioned conductive material containing conductive particles and a binder resin, and the above-mentioned conductive particles are provided with resin particles according to any one of claims 1 to 9 and arrangements On the conductive portion on the surface of the resin particle, the first electrode and the second electrode are electrically connected by the conductive particle.

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