JPWO2020230842A1 - - Google Patents
Info
- Publication number
- JPWO2020230842A1 JPWO2020230842A1 JP2020558069A JP2020558069A JPWO2020230842A1 JP WO2020230842 A1 JPWO2020230842 A1 JP WO2020230842A1 JP 2020558069 A JP2020558069 A JP 2020558069A JP 2020558069 A JP2020558069 A JP 2020558069A JP WO2020230842 A1 JPWO2020230842 A1 JP WO2020230842A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019091545 | 2019-05-14 | ||
PCT/JP2020/019227 WO2020230842A1 (ja) | 2019-05-14 | 2020-05-14 | 樹脂粒子、導電性粒子、導電材料及び接続構造体 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020230842A1 true JPWO2020230842A1 (ja) | 2020-11-19 |
Family
ID=73289805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020558069A Pending JPWO2020230842A1 (ja) | 2019-05-14 | 2020-05-14 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2020230842A1 (ja) |
TW (1) | TW202110980A (ja) |
WO (1) | WO2020230842A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7461272B2 (ja) | 2020-10-19 | 2024-04-03 | 積水化学工業株式会社 | 銀含有粒子及びペースト状組成物 |
WO2024117183A1 (ja) * | 2022-11-30 | 2024-06-06 | 積水化学工業株式会社 | 導電ペースト、rfidインレイ及びrfidインレイの製造方法 |
WO2024117182A1 (ja) * | 2022-11-30 | 2024-06-06 | 積水化学工業株式会社 | 導電ペースト、rfidインレイ及びrfidインレイの製造方法 |
WO2024117181A1 (ja) * | 2022-11-30 | 2024-06-06 | 積水化学工業株式会社 | 導電ペースト、rfidインレイ及びrfidインレイの製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3294146B2 (ja) * | 1997-03-21 | 2002-06-24 | 早川ゴム株式会社 | 金属被覆微粒子及び導電性材料 |
JP2001135141A (ja) * | 1999-11-04 | 2001-05-18 | Soken Chem & Eng Co Ltd | 異方導電接着インキ、液晶表示装置および液晶表示装置の製造方法 |
KR100667374B1 (ko) * | 2004-12-16 | 2007-01-10 | 제일모직주식회사 | 이방전도성 접속부재용 고분자 수지 미립자, 전도성 미립자 및 이를 포함한 이방 전도성 접속재료 |
KR101612564B1 (ko) * | 2008-03-27 | 2016-04-14 | 세키스이가가쿠 고교가부시키가이샤 | 중합체 입자, 도전성 입자, 이방성 도전 재료 및 접속 구조체 |
JP6084866B2 (ja) * | 2012-03-06 | 2017-02-22 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
WO2018230470A1 (ja) * | 2017-06-12 | 2018-12-20 | 積水化学工業株式会社 | 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子 |
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2020
- 2020-05-14 WO PCT/JP2020/019227 patent/WO2020230842A1/ja active Application Filing
- 2020-05-14 JP JP2020558069A patent/JPWO2020230842A1/ja active Pending
- 2020-05-14 TW TW109116079A patent/TW202110980A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202110980A (zh) | 2021-03-16 |
WO2020230842A1 (ja) | 2020-11-19 |
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