TW202109051A - Probe head for high frequency signal test and medium or low frequency signal test at the same time - Google Patents

Abstract

A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.

Description

Probe head that can be used for high frequency and low frequency signal test at the same time

The present invention relates to the probe head of the probe card, and particularly relates to a probe head that can be used for both high-frequency and medium-low frequency signal testing.

Due to market demand, the packaging and testing of integrated circuits (ICs) have developed towards fine pitch and high frequency. However, for vertical probe cards (abbreviated as vertical probe cards), the packaging and testing of integrated circuits have developed towards fine pitch and high frequency. In terms of VPC), due to the limitation of the test machine or cost considerations, or the length of the probe is too long, the test frequency cannot be increased. Therefore, in the high frequency test, some probes in the probe card are mainly used for testing. Loopback test (loopback test), that is, the transmission contact (TX) and receiving contact (RX) of the device under test (device under test; DUT for short; that is, the aforementioned IC) itself sends and receives high-frequency signals, and The signal detection is performed by the test object itself, that is, the high-frequency test signal is not generated by the tester and is not transmitted to the tester. It should be noted that the signal described in this manual can be a digital signal or an analog signal.

In the case of vertical probe cards using spring probes (or pogo pins), in order to meet the needs of fine pitch and high-frequency testing, spring probes (including molded pogo pins, MEMS pogo pins, and other manufacturing methods) The spring needle) needs to be designed to be thinner and shorter, that is, the outer diameter of the spring probe should be small and the length should be short, but if the electrical, mechanical characteristics, force, operating stroke, Lifetime and other factors, it is difficult to make the spring probe small if it is short, and it is difficult to make the details short. In other words, it is difficult for the same spring probe to meet the requirements of fine pitch and high frequency testing at the same time.

The conventional probe card that can be used for high-frequency and low-frequency signal testing is mainly equipped with a switching circuit, so that the same set of probes can be switched to the electrical conduction method for high-frequency loopback testing, and can also be switched to transmit from the tester The electrical conduction method of the medium and low frequency test signals makes the circuit design of the probe card more complicated, and the probe size is difficult to meet the requirements of fine pitch in order to meet the requirements of high frequency testing. Moreover, based on IC design considerations, the center-to-center pitch (pitch) of the contacts usually applied to high-frequency signals will be larger than the center-to-center distances of the contacts applied to other signals. Therefore, even with the aforementioned circuit switching, it is still difficult to connect the same The probes are used for high frequency test and low frequency test respectively.

In view of the above-mentioned deficiencies, the main purpose of the present invention is to provide a probe head that can be used for both high frequency and low frequency signal testing, which can avoid the circuit design of the probe card from being too complicated, and can achieve fine pitch and high frequency testing at the same time. The demand.

To achieve the above objective, the probe head provided by the present invention is used to transmit a first test signal and a second test signal, the frequency of the second test signal is higher than the frequency of the first test signal, and the probe The head includes a probe holder, a first spring probe, and at least two second spring probes. The probe holder includes an upper guide plate, a lower guide plate, and a middle guide plate arranged between the upper guide plate and the lower guide plate. The middle guide plate has a lower surface facing the lower guide plate and at least A conduction unit, the conduction unit includes two conductive contacts arranged on the lower surface, and a connecting circuit located inside the middle guide plate and electrically connected to the two conductive contacts. The first spring probe passes through the upper guide plate, the middle guide plate and the lower guide plate to transmit the first test signal. The at least two second spring probes pass through the lower guide plate to transmit the second test signal. Each of the second spring probes is shorter than the first spring probe and has a top end. The two spring probes are electrically connected to each other by abutting the two conductive contacts of the same conducting unit with their top ends respectively. The lower guide plate has an upper surface facing the middle guide plate, a lower surface opposite to the upper surface and at least a lower mounting hole unit penetrating the upper and lower surfaces of the lower guide plate, and the lower mounting hole unit includes at least Two lower mounting holes and a communication space communicating with the at least two lower mounting holes, each of the lower mounting holes is penetrated with a second spring probe, and each of the second spring probes is partially located in the communication of the lower mounting hole unit In the space. For example, the lower mounting hole unit includes a groove recessed from the upper surface of the lower guide plate to form the communication space, and the lower mounting hole of the lower mounting hole unit penetrates a bottom surface of the groove and under the lower guide plate surface. Alternatively, each of the lower mounting holes includes an upper section and a lower section, the communication space is located between the upper section and the lower section of each of the lower mounting holes, and the upper section is from above the lower guide plate The surface extends downward to the communication space, and the lower section extends upward from the lower surface of the lower guide plate to the communication space.

In other words, the probe head of the present invention is provided with a first spring probe having a longer length and passing through the entire probe base, and a second spring probe having a shorter length and passing only through the lower guide plate, and two second spring probes. The spring probes are electrically connected to each other by the connecting circuit inside the middle guide plate (for example, the internal circuit of a multilayer circuit board, or the internal circuit plus electronic components, etc.). Thereby, the at least two second spring probes can be used to touch the high-frequency signal transmission contact (TX) and the receiving contact (RX) of the object under test, and can also be used for high-frequency signal loopback test (loopback test) For example, the middle guide plate may have a conducting unit for the two second spring probes to abut, and the two second spring probes are a set of transmitting and receiving probes, which are respectively used to touch the object under test Alternatively, the middle guide plate may have two conductive units for two sets of transmitting and receiving probes (that is, a total of four second spring probes) against which the two conductive units are insulated from each other, The two second spring probes connected to each conduction unit are respectively used to touch the transmitting and receiving contacts of the object to be measured, and the second spring probes connected to the two conduction units are a differential pair with each other, which means that the The two conductive units are respectively connected to the two second spring probes to form a signal transmission path, and the two signal transmission paths are used to transmit differential signals with opposite phases. In addition, the first spring probe can be used to touch other contacts of the object to be measured, such as ground contacts, power contacts, and general mid- and low-frequency signal contacts. In this way, each of the second spring probes can be made shorter and thicker to meet the electrical requirements of high-frequency testing, and the first spring probes can be made longer and thinner, so that there are multiple In the case of the first spring probe, the requirement of fine pitch is achieved, so that it can meet the overall test requirements of the IC. In addition, the communication space of the mounting hole unit under the lower guide plate is in communication with at least two of the lower mounting holes, so that at least two of the second spring probes are partially located in the communication space of the same lower mounting hole unit, so that the capacitance and Inductance matching improves the characteristics of the probe card, especially in the case of the aforementioned four second spring probes forming a differential pair for transmitting differential signals, so that the two second spring probes are not electrically connected to each other Located in the connecting space of the same lower mounting hole unit, it can achieve a better matching effect.

The detailed structure, features, assembly or use of the probe head provided by the present invention that can be used for both high-frequency and mid-low-frequency signal testing will be described in the detailed description of the subsequent embodiments. However, those with ordinary knowledge in the field of the present invention should be able to understand that the detailed description and the specific embodiments listed for implementing the present invention are only used to illustrate the present invention, and are not intended to limit the scope of the patent application of the present invention.

The applicant first explains here that in the embodiments and drawings to be introduced below, the same reference numbers indicate the same or similar elements or their structural features. Secondly, when it is mentioned that an element is arranged on another element, it means that the aforementioned element is directly arranged on the other element, or the aforementioned element is indirectly arranged on the other element, that is, there is still another element between the two elements. One or more other elements are provided. When it is mentioned that an element is "directly" arranged on another element, it means that no other element is arranged between the two elements. It should be noted that the various elements and structures in the drawings are illustrative for convenience and are not drawn based on actual proportions and quantities, and if it is possible in implementation, the features of different embodiments can be applied interactively. Furthermore, the "high frequency" and "low frequency" mentioned below mean that the signal transmission speed of "high frequency" is higher than that of "low frequency". For example, when the signal transmission speed of "high frequency" is greater than or equal to 40 At Gbps, the "medium and low frequency" is less than 40 Gbps, but the present invention is not limited to the aforementioned value, that is, the signal transmission speed of the "high frequency" is not limited to greater than or equal to 40 Gbps.

Please refer to FIG. 1, a first preferred embodiment of the present invention provides a probe head 10 that can be used for high-frequency and mid-low-frequency signal testing at the same time. It includes a probe holder 20, a plurality of first spring probes 30, and a plurality of first spring probes. Two spring probes 40, and a positioning film 50. The probe head of this embodiment and the following embodiments can actually be provided with a considerable number of first spring probes 30 and second spring probes 40, and the number of first spring probes 30 is usually much larger than that of the second spring probes. For the number of needles 40, the second spring probes 40 are electrically connected to each other in pairs, and the two pairs of second spring probes 40 form a differential pair. In order to simplify the drawing and facilitate the description, the drawings of the present invention only show A first spring probe 30 and four second spring probes 40 forming a differential pair, and the probe head 10 is provided with a first spring probe 30 and four second spring probes 40 for description.

The probe base 20 includes an upper guide plate 21, a middle guide plate 22, and a lower guide plate 23. The upper and lower guide plates 21 and 23 in this embodiment and the following embodiments are respectively composed of a single plate body. However, each of the upper and lower guide plates 21 and 23 can be formed by stacking a plurality of plates according to design and processing requirements, such as the lower guide plate 23 in FIGS. 9 and 10. Each of the upper and lower guide plates 21, 23 has an upper surface 211, 231 and a lower surface 212, 232 substantially facing opposite directions. The middle guide plate 22 is disposed on the lower surface 212 of the upper guide plate 21 and the lower surface 212 and the lower surface. Between the upper surface 231 of the guide plate 23.

In detail, the guide plate 22 in this embodiment includes a multilayer circuit board 221, the multilayer circuit board 221 has an upper surface 221a and a lower surface 221b substantially facing opposite directions, and the upper surface 221a of the multilayer circuit board 221 The and lower surface 221b respectively face the lower surface 212 of the upper guide plate 21 and the upper surface 231 of the lower guide plate 23. The multi-layer circuit board 221 can be a multi-layer ceramic substrate (MLC for short), a multi-layer organic substrate (MLO for short), or other dielectric layers (materials such as resin, electric A circuit board composed of wood, glass fiber, plastic, etc.) and a metal layer (material such as copper foil, etc.).

The upper, middle, and lower guide plates 21, 22, and 23 respectively have a plurality of upper, middle, and lower perforations 213, 223, 233 (only one of each is shown in the drawing of the present invention), the upper and lower perforations 213, 233 has a large diameter portion 213a, 233a equal to the inner diameter of the middle through hole 223, and a small diameter portion 213b, 233b having an inner diameter smaller than the inner diameter of the large diameter portion 213a, 233a, respectively. The first spring probe 30 passes through an upper through hole 213, a middle through hole 223, and a lower through hole 233 coaxially corresponding to each other, that is, through the upper, middle, and lower guide plates 21, 22, 23 Above and below the surface. In this embodiment, the first spring probe 30 is a traditional spring probe, which includes a housing 31, a spring 32 arranged in the housing 31, and abutting against two ends of the spring 32 and extending respectively. An upper needle shaft 33 and a lower needle shaft 34 extending from the top and bottom ends of the housing 31, wherein the spring 32 is a traditional coil spring made by machining. However, the first spring probe 30 of the present invention is not limited to the aforementioned The traditional spring probe can also be a probe with a spring or other elastic structure processed by photolithography technology or other processing technology, so that it can be obtained by setting the number of coils during processing. The elastic compression stroke and needle pressure. The part of the needle shaft 34 under the first spring probe 30 that protrudes from the bottom end of the housing 31 passes through the small diameter portion 233b of the lower through hole 233, and the bottom end of the housing 31 abuts against the larger, larger diameter of the lower through hole 233. At the junction of the small-diameter portions 233a and 233b, the first spring probe 30 can be prevented from falling out of the probe base 20 downward.

In addition to the aforementioned lower perforation 233, the lower guide plate 23 is also provided with a plurality of lower mounting hole units 24 (only two are shown in the drawing of this embodiment), as shown in FIG. 2, each of the lower mounting holes The unit 24 includes a groove 241 recessed from the upper surface 231 of the lower guide plate 23, and two lower mounting holes 243 penetrating through a bottom surface 242 of the groove 241 and the lower surface 232 of the lower guide plate 23, each of which is installed The hole 243 includes a large-diameter portion 244 connected to the bottom surface 242 of the groove 241, and a small-diameter portion 245 (small-diameter portion 245) extending from the bottom end of the large-diameter portion 244 to the lower surface 232 of the lower guide plate 23 The inner diameter is smaller than the inner diameter of the large-diameter portion 244), each of the lower mounting hole units 24 is provided with two second spring probes 40 passing through the two lower mounting holes 243, and each of the second spring probes The 40 series is partially located in the groove 241. In this embodiment, the second spring probe 40 is a traditional spring probe, which includes a housing 41, a spring 42 arranged in the housing 41, and abutting against the two ends of the spring 42 and extending respectively. An upper needle shaft 43 and a lower needle shaft 44 extending from the top and bottom ends of the housing 41, wherein the spring 42 is a traditional coil spring made by machining. However, the second spring probe 40 of the present invention is not limited to a traditional type The spring probe may also be a probe with a spring or other elastic structure processed by photolithography technology or other processing technology. The lower needle shaft 44 of the second spring probe 40 passes through the small diameter portion 245 of the lower mounting hole 243, and the bottom end of the housing 41 of the second spring probe 40 abuts the large and small diameters of the lower mounting hole 243 At the junction of the diameter parts 244 and 245, the second spring probe 40 can be prevented from falling out of the probe base 20 downward.

The positioning film 50 is disposed between the lower surface 221b of the multilayer circuit board 221 of the middle guide plate 22 and the upper surface 231 of the lower guide plate 23, and is provided with a plurality of positioning holes 51, the first and second spring probes The needles 30 and 40 respectively pass through the positioning holes 51, whereby each of the first and second spring probes 30, 40 can be positioned by the positioning film 50 when the needle is implanted, making the assembly of the probe head 10 easier get on.

In this embodiment, the middle guide plate 22 has a plurality of conduction units 222 (only one is shown in the drawing of this embodiment), and every two second spring probes 40 are mutually electrically connected by one conduction unit 222. Each of the conductive units 222 includes two conductive contacts 224 located on the lower surface 221b of the multilayer circuit board 221 and a connecting circuit 225 located inside the multilayer circuit board 221. More specifically, the connecting circuit 225 as a whole Is an internal circuit located inside the multilayer circuit board 221, that is, the connection circuit (internal circuit) 225 is composed of layered wiring inside the multilayer circuit board 221, and the two conductive contacts 224 are respectively provided in the interior The two ends of the circuit 225 are electrically connected to each other by the internal circuit 225, and the two second spring probes 40 are electrically connected to each other by abutting the two conductive contacts 224 with their top ends 45 respectively. Each of the conducting units 222 and the two second spring probes 40 connected to the conductive contact 224 form a signal transmission path, and the two pairs of second spring probes 40 shown in FIGS. 1 and 2 form a differential Yes, that means, Figures 1 and 2 show four second spring probes 40 arranged in a matrix. The four second spring probes 40 and the two conducting units 222 form two signal transmission paths, and the two signal transmission paths It is used to transmit differential signals with opposite phases (a difference of 180 degrees). However, the second spring probe 40 of the present invention does not necessarily constitute a differential pair, that is, only one pair of the second spring probe 40 is electrically connected to each other as shown in FIG. 1, and each mounting hole The unit 24 may have only a single lower mounting hole 243.

After the aforementioned probe head 10 is assembled, the top end 35 of the first spring probe 30 protrudes from the upper surface 211 of the upper guide plate 21, and then the upper surface 211 of the upper guide plate 21 is fixed to a main A circuit board (not shown in the figure), so that the probe head 10 and the main circuit board form a probe card, or the upper surface 211 of the upper guide plate 21 is fixed to a space converter (not shown in the figure) , The space converter is then fixed to a main circuit board (not shown in the figure), so that the probe head 10, the space converter and the main circuit board form a probe card. At this time, the first spring probe The spring 32 of 30 is slightly compressed, so that the top 35 of the first spring probe 30 retracts into the upper through hole 213 and abuts against an electrical contact of the main circuit board or the space converter (not shown) The main circuit board is used to electrically connect with a testing machine (not shown in the figure). The so-called test machine in this case, in a broad sense, can be a test machine used by an integrated circuit test factory to test the object under test, and furthermore, it can also be a test instrument for high-frequency transmission test signals.

Thereby, when the bottom end 36 of the first spring probe 30 touches an electrical contact (not shown in the figure) of an object under test, the first spring probe 30 can be used in the testing machine and the object under test. Because the length of the first spring probe 30 is longer, it is more suitable for transmitting the ground signal, power signal and general low frequency signal. In addition, the four second spring probes 40 are used as signal output probes (TX probes) and signal receiving probes (RX probes) in pairs, respectively, which are used to touch the high-frequency signal transmission contacts of the object under test. (TX) and the receiving contact (RX). Furthermore, the second spring probe 40 shown in Figure 1 is represented as (+)TX probe and (+)RX probe, or (-)TX Probe and (-)RX probe, and the second spring probe 40 shown in Figure 2 is represented as (+)TX probe and (-)TX probe, or (+)RX probe and (-) ) RX probe, where (+) and (-) indicate that the phase of the signal transmitted by the corresponding probe is positive and negative. In the mode of non-transmission of the differential signal, the two second spring probes 40, which are electrically connected to each other by the conduction unit 222 as shown in FIG. 1, are used as signal output probes (TX probes). And the signal receiving probe (RX probe), the bottom 46 of which is used to touch the high-frequency signal transmitting contact (TX) and receiving contact (RX) of the object under test respectively. In this way, the high-frequency signal transmission contact of the object under test can output high-frequency test signals and sequentially pass through a second spring probe 40 (TX probe), a conductive contact 224, the internal circuit 225, The other conductive contact 224 and the other second spring probe 40 (RX probe) are transmitted to the high-frequency signal receiving contact of the object under test to perform a loopback test of the high-frequency signal. Therefore, the second spring probe 40 can be made shorter and thicker to meet the electrical requirements of high-frequency testing, and the first spring probe 30 can be made longer and thinner to achieve a fine pitch. Requirements, so that it can meet the overall IC test requirements.

It can be seen from the foregoing that the probe head 10 of the present invention uses the first spring probe 30 which has a long length and passes through the entire probe base 20 for medium and low frequency signal testing, and uses a short length to only pass through the lower The second spring probe 40 of the guide plate 23 and the circuit of the middle guide plate 22 are subjected to a high-frequency signal return test. In other words, the probe head 10 uses a first spring probe 30 to transmit a first test signal and at least two second spring probes 40 to transmit a second test signal, wherein the frequency of the second test signal is higher than The frequency of the first test signal, that is, the first test signal is the aforementioned ground signal, power signal, and general low-frequency signal, and the second test signal is the aforementioned high-frequency signal.

As mentioned above, the present invention does not limit the types of the first and second spring probes 30, 40. However, the second spring probe 40 is much shorter in length than the first spring probe 30. Therefore, the first No matter what kind of spring probe is used for the second spring probe 40, its elastic compression stroke and acupuncture system are more difficult to control, while the first spring probe 30 is longer and easier to control its elastic compression stroke and acupuncture pressure, so it is convenient The elastic compression stroke and needle pressure of the first spring probe 30 are matched with the elastic compression stroke and needle pressure of the second spring probe 40. In addition, several stubby spring probes similar to the second spring probe 40 can be arranged around the second spring probes 40 as grounding probes (not shown in the figure), and the grounding probes can be grounded. The probe is electrically connected to the ground circuit (not shown in the figure) inside the middle guide plate 22, so that the transmission path of the high-frequency signal is surrounded by the transmission path of the ground signal, which can make the electrical performance better.

In the aspect shown in FIG. 1 and FIG. 2, the second spring probes 40 that are a differential pair are partially located in the same groove 241, so that the capacitance and inductance can be matched to improve the characteristics of the probe card. The shape of the groove 241 is not limited. For example, the groove 241 may be circular or non-circular. The non-circular shape includes a quadrilateral (square, rectangular), polygonal, or irregular shape. The length of the shortest side of the regular shape or the diameter D of the circle is greater than the center distance of the second spring probes 40 (that is, the second spring probes 40 of a differential pair) in the same lower mounting hole unit 24 ( pitch) P and the maximum diameter of the lower mounting hole 243 (in FIG. 2 is the diameter of the large-diameter portion 244, which is twice the radius r of the large-diameter portion 244), that is, D>P+2r . However, the lower guide plate 23 can also be shown in FIG. 9 by overlapping the upper and lower plates 235 and 236 to form the aforementioned groove 241, that is, for the single second spring probe 40 to pass through. The lower mounting hole 243 penetrates the top surface 237 and the bottom surface of the lower plate body 236 (that is, the lower surface 232 of the lower guide plate 23), and the upper plate body 235 is provided with one and two lower mounting holes 243 to communicate with each other. The hole 25 makes the upper through hole 25 and the top surface 237 of the lower plate 236 jointly form the aforementioned groove 241 for the two second spring probes 40 to be partially contained in the groove 241, which not only It can achieve the aforementioned effect of improving the characteristics of the probe card, and has the advantage of easy processing.

In the aspect of the lower guide plate 23 shown in FIGS. 2 and 9, the lower guide plate 23 is provided with an open groove 241 on its upper surface 231, and a communicating groove 241 is formed in the groove 241 The space 26 makes the two second spring probes 40 of a differential pair partially located in the same communicating space 26, thereby improving the characteristics of the probe card. However, as shown in FIG. 10, the communicating space 26 can also be formed inside the lower guide plate 23 instead of being open. In detail, the lower guide plate 23 includes a lower plate body 236, A middle plate 239 and an upper plate 235, each of the lower mounting holes 243 includes an upper section 243a penetrating through the upper plate 235, and a lower section 243b penetrating the lower plate 236 (including a large diameter portion 244 and small diameter portion 245), the middle plate body 239 is provided with a middle through hole 27 to form the communication space 26 therein, and the communication space 26 is located at the upper section 243a and the lower section 243b of each of the lower mounting holes 243 In between, the upper section 243a extends downward from the upper surface 231 of the lower guide plate 23 to the communicating space 26, and the lower section 243b extends upward from the lower surface 232 of the lower guide plate 23 to the communicating space. 26. The communication space 26 hidden in the lower guide plate 23 can also achieve the aforementioned effect of improving the characteristics of the probe card, and the lower guide plate 23 has a better effect of supporting the probe. Same as the aforementioned groove 241, the middle through hole 27 in FIG. 10 can also be circular or non-circular. The non-circular shape includes a quadrilateral (square, rectangular), polygonal, or irregular shape, and the quadrilateral, polygonal or The length of the shortest side of the irregular shape or the diameter D of the circle is greater than the center distance of the second spring probes 40 (that is, the second spring probes 40 of a differential pair) in the same lower mounting hole unit 24 The sum of P and the maximum diameter of the lower mounting hole 243 (in FIG. 10 is the diameter of the large diameter portion 244, that is, twice the radius r of the large diameter portion 244), that is, D>P+2r.

It is worth mentioning that the communicating space 26 described in the present invention belongs to a part of the lower mounting hole unit 24, and the communicating space 26 only directly communicates with the lower mounting hole 243 contained in the lower mounting hole unit 24 to which it belongs. Directly communicate with the lower mounting hole 243 or the lower perforation 233 of the non-identical lower mounting hole unit 24, so the communicating space 26 only accommodates the second spring probe 40, and the lower mounting hole unit 24 in the present invention is defined as The upper surface 231 and the lower surface 232 of the lower guide plate 23 penetrate through, that is, the uppermost end of the lower mounting hole unit 24 is located on the upper surface 231. It can be seen from the drawings of the present invention that the lower guide plate 23 may (but not necessarily) have a space connecting all the lower mounting hole units 24 and the lower perforation 233, and the space is located above the upper surface 231 of the lower guide plate 23 , And all the first and second spring probes 30, 40 are partially accommodated in the space, so it can be known that the space is not part of the single lower mounting hole unit 24, and it is not only connected to the single lower mounting hole unit 24. The lower mounting hole 243 is included, so the space above the upper surface 231 of the lower guide plate 23 cannot be regarded as the communicating space 26 described in the present invention. In other words, in the present invention, the part of the probe used to transmit the high-frequency return test signal (that is, the second spring probe 40) located in the communication space 26 is the same as the probe used to transmit the medium and low frequency signal (that is, the first spring). The probe 30 or the fourth spring probe 62 in FIG. 11 are separated from each other, and a part of the lower guide plate 23 is interposed between the two.

Please refer to FIG. 3, a second preferred embodiment of the present invention is similar to the aforementioned first preferred embodiment, but the middle guide plate 22 includes a multilayer circuit board 221 and a processable board body 226 (for example, Machinable ceramics), the machinable board 226 is disposed between the upper guide plate 21 and the lower guide 23, and the multilayer circuit board 221 is fixed to the machinable board 226 by pasting or screwing. One faces the mounting surface 226a of the lower guide plate 23. The structure and function of the multilayer circuit board 221 of this embodiment are the same as the multilayer circuit board 221 of the first preferred embodiment, that is, it is provided with a conduction unit 222 that electrically connects the second spring probes 40 to each other in pairs. Including conductive contacts 224 and connection circuits 225), but the multilayer circuit board 221 of this embodiment has a small area and thickness, and is indirectly connected to the upper and lower guide plates 21, 23 through the processable board body 226 .

Since the electrical contact of the object to be tested for transmitting high-frequency signals is usually located near its edge, the second spring probe 40 for transmitting high-frequency signals is usually located near the edge of the probe base 20. In this case, the middle guide plate 22 is provided with a block for the second spring probe 40 to press against the multilayer circuit board 221 and a block for the first spring probe 30 to pass through the middle through hole 223. There are obvious divisions, as shown in Figure 3. However, according to different test requirements, the first spring probe 30 may still need to be arranged around the second spring probe 40, or the distribution range of the second spring probe 40 may differ from the distribution range of the first spring probe 30. Staggered without obvious separation. In this case, the shape of the multilayer circuit board 221 can be designed to match the distribution of the first and second spring probes 30, 40, such as the first invention shown in FIGS. 4 and 5 The third preferred embodiment (wherein FIG. 5 only draws the outline shape of the multilayer circuit board 221 without drawing the conductive contacts 224), the multilayer circuit board 221 is covered by the mounting surface 226a of the processable board body 226 The area avoids the area where the middle through hole 223 is provided, so that the first spring probe 30 only passes through the processable board body 226 and does not pass through the multilayer circuit board 221. Alternatively, the area covered by the mounting surface 226a of the processable board body 226 of the multilayer circuit board 221 may also include one or more middle perforations 223, such as a fourth preferred embodiment of the present invention shown in FIGS. 6 and 7 For example (wherein FIG. 7 only draws the outer contour shape of the multilayer circuit board 221 and the middle perforation 223 without drawing the conductive contact 224), that is, the one or more middle perforations 223 penetrate the processable board body 226 and The multi-layer circuit board 221 has its corresponding first spring probe 30 passing through the processable board body 226 and the multi-layer circuit board 221.

Please refer to FIG. 8. A fifth preferred embodiment of the present invention is similar to the second preferred embodiment described above, except that the processable plate 226 of this embodiment has a groove 226b provided on the mounting surface 226a. And the connecting circuit 229 of the middle guide plate 22 includes an electronic component 227 located on the upper surface 221a of the multilayer circuit board 221 and in the groove 226b, and located inside the multilayer circuit board 221 and electrically connected to the electronic component 227 of the two internal circuits 228, the two internal circuits 228 are respectively electrically connected to the two conductive contacts 224 located on the lower surface 221b of the multilayer circuit board 221, and the two second spring probes 40 are respectively pressed against with their tops 45 The two conductive contacts 224 are electrically connected to each other. In this way, the high-frequency test signal output by the high-frequency signal transmission contact of the object under test sequentially passes through the second spring probe 40 (TX probe), the conductive contact 224, and the internal circuit 228 , The electronic component 227, the other internal circuit 228, the other conductive contact 224, and the other second spring probe 40 (RX probe) to be transmitted to the high frequency signal receiving contact of the object under test, to Perform loopback test of high frequency signal. The electronic component 227 can be a capacitor, an inductance, a resistor, or a combination of at least two of them. The method of disposing the electronic component 227 in this way is particularly suitable for the situation where the electronic component needs to be placed very close to the probe. The placement position of the electronic component 227 (that is, the position of the recess 226b) is not limited to just above the two second spring probes 40, and each of the internal circuits 228 can be formed by the internal layered wiring of the multilayer circuit board 221 Extending in any direction, the electronic component 227 can be arranged at any position on the upper surface 221a of the multilayer circuit board 221, so as to improve the flexibility of the arrangement of the electronic component.

The aforementioned method of forming the connecting circuit 229 by the electronic component 227 and the two internal circuits 228 can also be applied to the middle guide plate 22 in other aspects, as long as the middle guide plate 22 includes the processable board body 226 and the multilayer circuit board 221, for example, can be applied to the guide plate 22 in the third and fourth preferred embodiments.

Similar to the first preferred embodiment, the internal circuits 225, 228 included in the connecting circuits 225, 229 that electrically connect the two conductive contacts 224 in the foregoing second to fifth preferred embodiments are completely located in the multilayer circuit Inside the board 221, and the two conductive contacts 224 are provided on the lower surface 221b of the multilayer circuit board 221 and are respectively connected to the two ends of the internal circuit 225 or the two internal circuits 228, and the two second spring probes 40 are respectively The top end 45 abuts against the two conductive contacts 224 to be electrically connected to each other.

As mentioned above, the probe head 10 of the present invention can simultaneously use the longer first spring probe 30 and the shorter second spring probe 40 to perform the medium and low frequency test and the high frequency signal return test respectively. Therefore, The invention can be used for high-frequency and medium-low frequency signal testing at the same time on the premise of avoiding the circuit design of the probe card from being too complicated, and can meet the requirements of fine pitch and high-frequency testing at the same time.

In addition, as shown in a sixth preferred embodiment of the present invention as shown in FIG. 11, the probe head 10 of the present invention can be formed by two shorter spring probes and the internal circuit of the center guide plate similar to the first spring. The structure of the probe 30. In detail, this embodiment is similar to the first preferred embodiment described above, except that the first spring probe 30 is not shown, and the probe head 10 of this embodiment further includes a penetrating through the upper guide plate The third spring probe 61 of 21, and a fourth spring probe 62 passing through the lower guide plate 23. The structures of the third and fourth spring probes 61, 62 are the same as those of the first and second spring probes 30, 40 has the same structure, and the lengths of the third and fourth spring probes 61, 62 are about the length of the second spring probe 40 and are much shorter than the first spring probe 30. The third and fourth spring probes 61, 62 62 is electrically connected to each other through another connecting circuit 63 inside the middle guide plate 22. In this embodiment, the connecting circuit 63 is a plated through hole with a conductive layer on the inner surface. The third and fourth spring probes The pins 61 and 62 are electrically connected to each other by abutting the upper and lower ends of the plated through hole 63 with their bottom and top ends, respectively. Such a structure composed of the third and fourth spring probes 61, 62 and the connecting circuit 63 inside the middle guide plate 22 can also be used to transmit medium and low frequency signals or ground signals. This structure can also be applied to the aforementioned second to fifth In the preferred embodiment.

Finally, it must be explained again that the constituent elements disclosed in the previously disclosed embodiments of the present invention are only examples and are not intended to limit the scope of the case. Alternatives or changes to other equivalent elements should also be the scope of the patent application for this case. Covered.

10: Probe head 20: Probe holder 21: Upper guide plate 211: upper surface 212: lower surface 213: Upper Piercing 213a: Large diameter part 213b: Small diameter part 22: Middle guide plate 221: Multilayer circuit board 221a: upper surface 221b: lower surface 222: conduction unit 223: Middle Piercing 224: Conductive contact 225: Connection circuit (internal wiring) 226: Machinable board 226a: mounting surface 226b: Groove 227: Electronic Components 228: Internal wiring 229: Connection Circuit 23: Lower guide plate 231: upper surface 232: lower surface 233: Under Piercing 233a: Large diameter part 233b: Small diameter part 235, 236: (upper and lower) plate body 237: top surface 239: Middle plate body 24: Lower mounting hole unit 241: Groove 242: Bottom 243: Lower mounting hole 243a: Upper section 243b: Lower section 244: large diameter part 245: Small Diameter 25: upper through hole 26: Connected Space 27: Middle through hole 30: The first spring probe 31: Shell 32: Spring 33: Upper needle shaft 34: Lower needle shaft 35: top 36: bottom end 40: second spring probe 41: Shell 42: spring 43: Upper needle shaft 44: Lower needle shaft 45: top 46: bottom end 50: positioning film 51: positioning hole 61: The third spring probe 62: The fourth spring probe 63: Connection circuit (plated through hole) D: length/diameter P: Center spacing r: radius

FIG. 1 is a schematic cross-sectional view of a probe head that can be used for high-frequency and mid-low-frequency signal testing at the same time according to a first preferred embodiment of the present invention. 2 is a partial cross-sectional view of the probe head that can be used for high-frequency and mid-low-frequency signal testing at the same time according to the first preferred embodiment of the present invention, taken along any section line 2-2 of FIG. 1. 3 is a schematic cross-sectional view of a probe head that can be used for high-frequency and mid-low-frequency signal testing at the same time according to a second preferred embodiment of the present invention. 4 is a schematic cross-sectional view of a probe head that can be used for high-frequency and mid-low-frequency signal testing at the same time according to a third preferred embodiment of the present invention. 5 is a schematic bottom view of a middle guide plate of a probe head that can be used for testing high frequency and low frequency signals at the same time according to the third preferred embodiment of the present invention. 6 is a schematic cross-sectional view of a probe head that can be used for high-frequency and mid-low-frequency signal testing at the same time according to a fourth preferred embodiment of the present invention. FIG. 7 is a schematic bottom view of a middle guide plate of a probe head that can be used for testing high frequency and low frequency signals at the same time according to the fourth preferred embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of a probe head that can be used for both high-frequency and mid-low-frequency signal testing provided by a fifth preferred embodiment of the present invention. Figures 9 and 10 are similar to Figure 2, but show different implementations of a lower guide plate of the probe head. 11 is a schematic cross-sectional view of a probe head that can be used for both high-frequency and mid-low frequency signal testing provided by a sixth preferred embodiment of the present invention.

10: Probe head

20: Probe holder

21: Upper guide plate

211: upper surface

212: lower surface

213: Upper Piercing

213a: Large diameter part

213b: Small diameter part

22: Middle guide plate

221: Multilayer circuit board

221a: upper surface

221b: lower surface

222: conduction unit

223: Middle Piercing

224: Conductive contact

225: Connection circuit (internal circuit)

23: Lower guide plate

231: upper surface

232: lower surface

233: Under Piercing

233a: Large diameter part

233b: Small diameter part

243: Lower mounting hole

30: The first spring probe

31: Shell

32: Spring

33: Upper needle shaft

34: Lower needle shaft

35: top

36: bottom end

40: second spring probe

41: Shell

42: spring

43: Upper needle shaft

44: Lower needle shaft

45: top

46: bottom end

50: positioning film

51: positioning hole

Claims (18)

A probe head that can be used for both high-frequency and mid-low-frequency signal testing. It is used to transmit a first test signal and a second test signal. The frequency of the second test signal is higher than the frequency of the first test signal. , The probe head contains: A probe holder includes an upper guide plate, a lower guide plate, and a middle guide plate arranged between the upper guide plate and the lower guide plate. The middle guide plate has a lower surface facing the lower guide plate and At least one conduction unit, the conduction unit includes two conductive contacts arranged on the lower surface, and a connection circuit located inside the middle guide plate and electrically connected to the two conductive contacts; A first spring probe passing through the upper guide plate, the middle guide plate and the lower guide plate to transmit the first test signal; and At least two second spring probes pass through the lower guide plate for transmitting the second test signal, each of the second spring probes is shorter than the first spring probe and has a top end, and the second spring probe The two spring probes are electrically connected to each other with their tops abutting against the two conductive contacts of the same conducting unit; Wherein, the lower guide plate has an upper surface facing the middle guide plate, a lower surface opposite to the upper surface and at least a lower mounting hole unit penetrating the upper surface and the lower surface of the lower guide plate, and the lower mounting hole unit It includes at least two lower mounting holes and a communication space communicating with the at least two lower mounting holes, each of the lower mounting holes is penetrated with a second spring probe, and each of the second spring probes is partially located in the lower mounting hole In the connecting space of the unit. As described in item 1 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the lower guide plate has two lower mounting hole units, and each of the lower mounting hole units is provided with each other The second spring probe of the differential pair. As described in item 1 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the middle guide plate includes a multilayer circuit board provided with the conductive contacts, and the connection circuit includes At least one internal circuit located inside the multilayer circuit board. As described in item 3 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the connecting circuit is an internal circuit as a whole. As described in item 3 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the middle guide plate further includes a processable plate body, the processable plate body has a downward guide facing the The mounting surface of the board, the multilayer circuit board is fixed on the mounting surface of the processable board. As described in item 5 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the processable board body has a groove provided on the mounting surface, and the multilayer circuit board has an orientation The mounting surface of the processable board body and the upper surface of the groove, the connecting circuit includes an electronic component arranged on the upper surface of the multilayer circuit board and located in the groove of the processable board body, and electrically connected to the The electronic components are electrically connected to the two internal circuits with the two conductive contacts respectively. As described in item 5 of the scope of patent application, the probe head that can be used for high frequency and low frequency signal testing at the same time, wherein the first spring probe passes through the processable board body and does not pass through the multilayer circuit board. As described in item 5 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the first spring probe passes through the processable board and the multilayer circuit board. As described in item 1 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time further includes a positioning film arranged between the middle guide plate and the lower guide plate, and the first The spring probe and the second spring probe respectively pass through one of the positioning holes of the positioning film. As described in item 1 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the lower mounting hole unit includes a recess that is recessed from the upper surface of the lower guide plate to form the communicating space The lower mounting hole of the lower mounting hole unit penetrates a bottom surface of the groove and the lower surface of the lower guide plate. As described in item 10 of the scope of patent application, the probe head that can be used for both high frequency and low frequency signal testing, wherein the groove of the lower mounting hole unit is non-circular, and the length of one of the shortest sides is greater than the same The sum of a center distance of the second spring probe in the groove and a maximum diameter of the lower mounting hole. As described in item 10 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the groove of the lower mounting hole unit is circular, and one of its diameters is larger than that in the same groove The sum of a center distance of the second spring probe and a maximum diameter of the lower mounting hole. As described in item 10 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the lower guide plate includes a lower plate body, and a stack is arranged on a top surface of the lower plate body The upper plate body, the lower mounting holes penetrate through the top surface and a bottom surface of the lower plate body, the upper plate body is provided with an upper through hole, and the upper through hole and the top surface of the lower plate body together form the lower mounting The groove of the hole unit. As described in item 1 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein each of the lower mounting holes includes an upper section and a lower section, and the connecting space is located at each of the lower sections. Between the upper section and the lower section of the mounting hole, the upper section extends downward from the upper surface of the lower guide plate to the communicating space, and the lower section extends upward from the lower surface of the lower guide plate to The connected space. As described in item 14 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the lower guide plate includes a lower plate body, a middle plate body and an upper plate stacked in sequence The upper section and the lower section of each of the lower mounting holes respectively penetrate the upper plate body and the lower plate body, and the middle plate body is provided with a middle through hole to form the communication space therein. As described in item 15 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the middle through hole is non-circular, and the length of one of the shortest sides is greater than the same middle through hole The sum of a center distance of the second spring probe inside and a maximum diameter of the lower mounting hole. As described in item 15 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the middle through hole is circular, and its diameter is larger than the second in the same middle through hole The sum of a center distance of the spring probe and a maximum diameter of the lower mounting hole. As described in item 1 of the scope of patent application, the probe head that can be used for high-frequency and low-frequency signal testing at the same time, wherein the probe head further includes a third spring probe passing through the upper guide plate, and a penetrating Through the fourth spring probe of the lower guide plate, the third spring probe and the fourth spring probe are electrically connected to each other through another connection circuit inside the middle guide plate.

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