TW202107654A - Substrate processing device, control method, and computer-readable storage medium - Google Patents

Abstract

An object of the invention is to provide a substrate processing device which is effective in reducing the amount of particulate matter in a process liquid discharged onto a substrate. A substrate processing device according to one aspect of the invention comprises a discharge section having a nozzle that discharges a process liquid onto a substrate, a liquid feed section which feeds the process liquid to the discharge section, a replenishment section which replenishes the liquid feed section with process liquid to be fed to the discharge section, a connection section having a switching valve that opens and closes the connection between the replenishment section and the liquid feed section, a filter which removes foreign matter contained in the process liquid with which the liquid feed section is replenished from the replenishment section, a replenishment preparation section which opens the switching valve after reducing the pressure difference between the inside of the replenishment section and the inside of the liquid feed section, and a replenishment control section which starts the process of replenishing the liquid feed section with process liquid from the replenishment section in a state where the replenishment preparation section has opened the switching valve.

Description

Substrate processing device, control method and computer readable recording medium

The invention relates to a substrate processing device, a control method, and a computer-readable recording medium.

Patent Document 1 discloses a processing liquid supply device that supplies a processing liquid from a processing liquid supply source to an object to be processed through a discharge section. The processing liquid supply device includes: a first pump provided on the downstream side of the processing liquid supply source; a filter section provided on the secondary side of the first pump to remove foreign matter in the processing liquid; and a second pump, Set on the secondary side of the filter section. In addition, the processing liquid supply device includes a control unit, and executes a step of causing the processing liquid introduced into the first pump to pass through the filter unit and to be supplied to the second pump. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2017-220547 A

[The problem to be solved by the invention]

The present invention provides a substrate processing device, a control method, and a computer-readable recording medium, which can effectively reduce particles in a processing liquid sprayed on a substrate. [Means to Solve the Problem]

A substrate processing apparatus according to an embodiment of the present invention includes: a jetting part having a nozzle for jetting a processing liquid to a substrate; a liquid feeding part, which delivers the processing liquid to the jetting part; a replenishing part, which supplements the liquid feeding part for delivery to the jetting part The connection part has a switching valve that opens or closes the replenishment part and the liquid feeding part; a filter that removes foreign matter contained in the treatment liquid that is replenished from the replenishment part to the liquid feeding part; the replenishment preparation part, After reducing the pressure difference between the replenishing part and the liquid feeding part, the switching valve is opened; and the replenishing control part starts to replenish the processing liquid from the replenishing part with the switching valve opened by the replenishing preparation part. Liquid delivery department. [Effect of Invention]

According to the present invention, a substrate processing apparatus, a control method, and a computer-readable recording medium can be provided, which can effectively reduce the particles in the processing liquid sprayed on the substrate.

Hereinafter, various exemplified implementation aspects will be described with reference to the drawings. In the description, the same elements or elements with the same functions are attached with the same symbols, and repeated descriptions are omitted.

[First implementation aspect] First, referring to FIGS. 1 to 18, the substrate processing system of the first embodiment will be described.

[Substrate Processing System] The substrate processing system 1 shown in FIG. 1 is a system that performs formation of a photosensitive film, exposure of the photosensitive film, and development of the photosensitive film on a substrate. The substrate to be processed is, for example, a semiconductor wafer W. The substrate to be processed is not limited to a semiconductor wafer, and may be, for example, a glass substrate, a mask substrate, an FPD (Flat Panel Display, flat panel display), and the like. The photosensitive film is, for example, a photoresist film. The substrate processing system 1 includes a coating and developing device 2 and an exposure device 3. The exposure device 3 performs exposure processing of the photoresist film (photosensitive film) formed on the wafer W (substrate). Specifically, the exposure target part of the photoresist film is irradiated with energy rays by a method such as immersion exposure. The coating and developing device 2 performs a process of forming a photoresist film on the surface of the wafer W (substrate) before the exposure process of the exposure device 3, and performs a process of developing the photoresist film after the exposure process.

[Substrate Processing Equipment] Hereinafter, the structure of the coating and developing device 2 will be described as an example of a substrate processing device. As shown in FIGS. 1 and 2, the coating and developing device 2 includes a mounting block 4, a processing block 5, an interface block 6, and a control device 100.

The placement block 4 executes the introduction of the wafer W in the coating and developing device 2 and the removal of the wafer W from the coating and developing device 2. For example, the mounting block 4 can support a plurality of carriers C for the wafer W, and a transfer device A1 including a transfer arm is built-in. The carrier C accommodates a plurality of circular wafers W, for example. The transfer device A1 takes out the wafer W from the carrier C and transfers it to the processing block 5, receives the wafer W from the processing block 5 and returns it to the carrier C.

The processing block 5 has a plurality of processing modules 11, 12, 13, and 14. The processing modules 11, 12, 13, and 14 have built-in liquid processing units U1, heat treatment units U2, and a conveying device A3 including a conveying arm that conveys the wafer W to these units.

The processing module 11 uses the liquid processing unit U1 and the heat treatment unit U2 to form an underlayer film on the surface of the wafer W. The liquid processing unit U1 of the processing module 11 coats the wafer W with the processing liquid for forming the underlying film. The heat treatment unit U2 of the processing module 11 performs various heat treatments accompanying the formation of the underlying film.

The processing module 12 uses the liquid processing unit U1 and the heat treatment unit U2 to form a photoresist film on the lower film. The liquid processing unit U1 of the processing module 12 coats the processing liquid for forming the photoresist film on the lower layer film. The heat treatment unit U2 of the processing module 12 performs various heat treatments accompanying the formation of the photoresist film.

The processing module 13 uses the liquid processing unit U1 and the heat treatment unit U2 to form an upper film on the photoresist film. The liquid processing unit U1 of the processing module 13 coats the liquid for forming the upper layer film on the photoresist film. The heat treatment unit U2 of the processing module 13 performs various heat treatments accompanying the formation of the upper layer film.

The processing module 14 uses the liquid processing unit U1 and the heat treatment unit U2 to perform development processing on the exposed photoresist film. The liquid processing unit U1 coats the surface of the exposed wafer W with a developer. In addition, the liquid processing unit U1 washes away the applied developer with a rinse liquid. The heat treatment unit U2 performs various heat treatments accompanying the development process. Specific examples of the heat treatment include heat treatment (PEB, Post Exposure Bake, post-exposure bake) before development treatment, heat treatment after development treatment (PB, Post Bake, post bake), and the like.

A pallet unit U10 is installed on the side of the placement block 4 in the processing block 5. The shed unit U10 is divided into a plurality of units arranged side by side along the vertical direction. A conveying device A7 including a lifting arm is installed near the shed unit U10. The transport device A7 causes the wafer W to move up and down between the units of the pallet unit U10.

A shed unit U11 is installed on the side of the interface block 6 in the processing block 5. The shed unit U11 is divided into a plurality of units arranged side by side along the vertical direction.

The interface block 6 transfers the wafer W between it and the exposure device 3. For example, the interface block 6 has a built-in conveying device A8 including a transfer arm, and is connected to the exposure device 3. The transfer device A8 transfers the wafer W arranged in the stage unit U11 to the exposure device 3. The transport device A8 receives the wafer W from the exposure device 3 and returns it to the gantry unit U11.

The control device 100, for example, controls the coating and developing device 2 to perform coating and developing processing in accordance with the following steps. First, the control device 100 controls the transfer device A1 to transfer the wafer W in the carrier C to the pallet unit U10, and controls the transfer device A7 to arrange the wafer W in the unit for the processing module 11.

Next, the control device 100 controls the transfer device A3 to transfer the wafer W of the gantry unit U10 to the liquid processing unit U1 and the heat treatment unit U2 in the processing module 11. In addition, the control device 100 controls the liquid processing unit U1 and the heat treatment unit U2 to form an underlayer film on the surface of the wafer W. After that, the control device 100 controls the transfer device A3 to return the wafer W on which the underlayer film is formed to the stage unit U10, and controls the transfer device A7 to arrange the wafer W in the unit for the processing module 12.

Next, the control device 100 controls the transfer device A3 to transfer the wafer W of the pallet unit U10 to the liquid processing unit U1 and the heat treatment unit U2 in the processing module 12. In addition, the control device 100 controls the liquid processing unit U1 and the heat treatment unit U2 to form a photoresist film on the lower film of the wafer W. After that, the control device 100 controls the transfer device A3 to return the wafer W to the gantry unit U10, and controls the transfer device A7 to arrange the wafer W in the unit for the processing module 13.

Next, the control device 100 controls the transfer device A3 to transfer the wafer W of the pallet unit U10 to each unit in the processing module 13. In addition, the control device 100 controls the liquid processing unit U1 and the heat treatment unit U2 to form an upper layer film on the photoresist film of the wafer W. After that, the control device 100 controls the transfer device A3 to transfer the wafer W to the pallet unit U11.

Next, the control device 100 controls the transfer device A8 to send the wafer W of the gantry unit U11 to the exposure device 3. After that, the control device 100 controls the transport device A8 to "receive the exposed wafer W from the exposure device 3 and arrange it in a unit for the processing module 14 of the stage unit U11".

Next, the control device 100 controls the transport device A3 to transport the wafer W of the shed unit U11 to each unit in the processing module 14, and controls the liquid processing unit U1 and the heat treatment unit U2 to photoresist the wafer W The film is subjected to development processing. After that, the control device 100 controls the transfer device A3 to return the wafer W to the gantry unit U10, and controls the transfer device A7 and the transfer device A1 to return the wafer W to the carrier C. Above, the coating and developing process is completed.

In addition, the specific structure of the substrate processing apparatus is not limited to the structure of the coating and developing apparatus 2 exemplified above. As long as the substrate processing apparatus includes a liquid processing unit that ejects a processing liquid to the wafer W to perform liquid processing, and a control device that can control these units, it may be any device.

(Liquid handling unit) 3 and 4, an example of the liquid processing unit U1 of the processing module 12 will be described in detail. The liquid processing unit U1 includes a rotation holding unit 20 and a processing liquid supply unit 29.

The rotation holding unit 20 holds and rotates the wafer W in accordance with an operation instruction of the control device 100. The rotation holding part 20 includes a holding part 21 and a driving part 22. The holding portion 21 supports the center portion of the wafer W horizontally arranged with the surface Wa facing upward, and holds the wafer W by suction (for example, vacuum suction) or the like. The driving unit 22 is, for example, a rotary actuator using an electric motor or the like as a power source, and rotates the holding unit 21 around a vertical rotation axis. Thereby, the wafer W rotates around a vertical rotation axis.

The processing liquid supply unit 29 supplies the processing liquid to the wafer W rotated and held by the rotation holding unit 20. As shown in FIGS. 3 and 4, the processing liquid supply unit 29 includes a discharge unit 30, a liquid feeding unit 60, a replenishment unit 50, a first connection unit 80 (connection unit), and a second connection unit 90.

The ejection unit 30 ejects the processing liquid onto the surface Wa of the wafer W. The ejection unit 30 includes a nozzle 31 and a liquid feeding pipe 32. The nozzle 31 ejects the processing liquid to the wafer W. The nozzle 31, as shown in FIG. 3, is arranged above the wafer W, for example, and ejects the processing liquid downward. The liquid feeding pipe 32 guides the processing liquid to the nozzle 31. The processing liquid is sprayed onto the wafer W from the nozzle 31 to apply (supply) the processing liquid to the wafer W.

As shown in FIG. 4, the liquid feeding unit 60 sends the treatment liquid to the ejection unit 30. Specifically, the liquid delivery unit 60 delivers the processing liquid to the ejection unit 30 (nozzle 31) at a predetermined pressure. The liquid feeding part 60 includes: a liquid feeding pipe 61, a filter 63, a pressure feeding part 64 (pressure feeding part for ejection), branch pipes 62a, 62b, a first connecting valve 67, a second connecting valve 68, and a pressure measuring part 69.

The liquid feeding pipe 61 guides the processing liquid to the ejection unit 30. Specifically, the liquid feeding tube 61 is connected to an end on the upstream side of the liquid feeding tube 32 of the ejection unit 30. The filter 63 is provided in the liquid feeding pipe 61 and removes foreign matter contained in the processing liquid. The filter 63 traps foreign matter contained in the processing liquid passing through the liquid feeding pipe 61.

The pressure feed unit 64 receives the processing liquid through the liquid feed pipe 61, pressurizes the received processing liquid, and sends it to the ejection unit 30. The pressure feed unit 64 includes, for example, a pump 76, a pump drive unit 77, a flow rate measurement unit 65, and a pressure measurement unit 66.

The pump 76 has a storage chamber that stores the processing liquid, and a contraction part that shrinks the storage chamber. The pump 76 uses the contraction part to expand the storage chamber to receive the treatment liquid, and uses the contraction part to contract the storage chamber to send out the treatment liquid. The pump 76, for example, may also be a tube pump, a diaphragm pump, or a telescopic pump.

The pump driving unit 77 drives the pump 76 in accordance with an operation instruction from the control device 100. Specifically, the pump driving part 77 operates (drives) the contraction part to cause the storage chamber of the pump 76 to contract the contraction part (drive). For example, the pump drive unit 77 is a pneumatic drive unit that uses gas to actuate the constriction. The pump driving part 77 may also contract the storage chamber of the pump 76 by adjusting the pressure (driving pressure) of the above-mentioned gas.

The flow measurement unit 65 acquires information on the amount of the processing liquid phase entering and exiting the pump 76. Since the flow rate of the gas used to drive the pump 76 is related to the amount of the processing liquid phase entering and exiting the pump 76, it is information about the amount of entering and exiting the pump 76 of the processing liquid phase. For example, the flow measurement unit 65 measures the flow rate of the gas flowing in the connecting pipe between the pump 76 and the pump drive unit 77. The flow measurement unit 65 outputs the measured value to the control device 100. The pressure measuring unit 66 obtains information about the pressure in the pump 76. For example, the pressure measuring unit 66 measures the pressure in the connecting pipe between the pump 76 and the pump driving unit 77. The pressure measuring unit 66 outputs the measured value to the control device 100.

The branch pipe 62 a branches from the upstream portion of the filter 63 in the liquid feeding pipe 61, and connects the liquid feeding pipe 61 and the pump 76. The branch pipe 62b branches from the downstream portion of the filter 63 in the liquid feeding pipe 61, and connects the liquid feeding pipe 61 and the pump 76.

The first connecting valve 67 is provided in the branch pipe 62 a, and opens or closes the liquid feeding pipe 61 and the pressure feeding portion 64 in accordance with an operation instruction of the control device 100. The first connection valve 67 is, for example, a pneumatic valve. The second connecting valve 68 is provided in the branch pipe 62b, and opens or closes the liquid feeding pipe 61 and the pressure feeding portion 64 in accordance with an operation instruction of the control device 100. The second connection valve 68 is, for example, a pneumatic valve.

The pressure measuring unit 69 measures the pressure of the processing liquid flowing through the pipeline in the liquid feeding unit 60. For example, the pressure measuring unit 69 measures the pressure between the filter 63 and the pressure feed unit 64. Specifically, the pressure measuring unit 69 is provided in the branch pipe 62b, and measures the pressure (hydraulic pressure) of the processing liquid in the branch pipe 62b. The pressure measuring unit 69 outputs the measured value to the control device 100.

The replenishing unit 50 replenishes the liquid delivery unit 60 with the processing liquid delivered to the ejection unit 30. The replenishing part 50 includes a liquid source 51, a pressure feeding part 53 (pressure feeding part for replenishment), and a delivery pipe 55.

The liquid source 51 is a supply source of the processing liquid that is replenished by the liquid feeding unit 60. The pressure feed unit 53 sends the processing liquid from the liquid source 51 to the liquid feed unit 60. The pressure feed unit 53 temporarily stores, for example, the processing liquid supplied from the liquid source 51, and sends the processing liquid to the liquid feed unit 60 in a pressurized state. Alternatively, the pressure-feeding unit 53 receives the processing liquid by sucking the processing liquid in the liquid source 51, and sends the received processing liquid to the liquid-feeding unit 60, for example. The pressure-feeding unit 53 includes, for example, a pump 56, a pump driving unit 57, and a pressure measuring unit 54.

The pump 56 sucks the treatment liquid in the liquid source 51 and sends the sucked treatment liquid to the ejection unit 30. The pump 56 has, for example, a storage chamber that stores the processing liquid, and a contraction part that shrinks the storage chamber. The pump 56 uses the contraction part to expand the storage chamber to receive the treatment liquid, and uses the contraction part to contract the storage chamber to send out the treatment liquid. The pump 56, for example, may also be a tube pump, a diaphragm pump, or a telescopic pump.

The pump driving unit 57 drives the pump 56 in accordance with an operation instruction from the control device 100. Specifically, the pump driving part 57 operates (drives) the contraction part to contract the storage chamber of the pump 56. For example, the pump drive unit 57 is a pneumatic drive unit that uses gas to move the constriction. The pump driving part 57 may also contract the storage chamber of the pump 56 by adjusting the pressure of the above-mentioned gas (hereinafter referred to as “driving pressure”).

The pressure measuring unit 54 obtains information about the pressure in the pump 56. For example, the pressure measuring unit 54 is connected to a connecting pipe between the pump 56 and the pump driving unit 57, and measures the pressure in the connecting pipe. The pressure measuring unit 54 measures, for example, the pressure of the gas for driving the pump 56. The pressure measuring unit 54 outputs the measured value to the control device 100.

The delivery pipe 55 guides the processing liquid from the pressure delivery unit 53 (pump 56) to the liquid delivery unit 60. Specifically, the delivery pipe 55 is connected to the upstream end of the liquid delivery pipe 61 of the liquid delivery unit 60. That is, the liquid feeding pipe 61 connects the replenishing part 50 and the liquid feeding part 60 with the filter 63 interposed therebetween. The filter 63 removes foreign substances contained in the processing liquid (the processing liquid replenished to the liquid supply unit 60 from the replenishing unit 50) flowing through the flow path in the liquid supply pipe 61.

The first connecting part 80 connects the replenishing part 50 and the liquid feeding part 60. The first connection portion 80 has, for example, a switching valve 71. The switching valve 71 opens or closes the replenishing unit 50 and the liquid feeding unit 60 in accordance with an operation instruction of the control device 100. The switching valve 71 is provided at a connection site between the delivery pipe 55 of the replenishing unit 50 and the liquid delivery pipe 61 of the liquid delivery unit 60. The switching valve 71 is, for example, a pneumatic valve.

The switching valve 71 may be opened and closed with an opening degree change rate smaller than the opening degree change rate of at least one of the first connection valve 67 and the second connection valve 68. The rate of change of opening is the rate of change of valve opening per unit time. When the valve is switched from the closed state to the open state, the opening rate of change is the rate of increase of the valve opening. When the valve is switched from the open state to the closed state, the rate of change of opening is the rate of decrease of the valve opening. For example, a valve that opens and closes at an operating speed slower than the operating speed of at least one of the first connection valve 67 and the second connection valve 68 may be used as the switching valve 71. Alternatively, the control device 100 may be used to control the opening and closing operation of the switching valve 71 at a slower speed than at least one of the first connection valve 67 and the second connection valve 68. The control device 100 may also be used to control the opening and closing operations of the switching valve 71 in a manner that the opening degree gradually changes, so as to satisfy the relationship of the above-mentioned opening degree change rate.

The second connecting portion 90 connects the liquid feeding portion 60 and the ejection portion 30. The second connection portion 90 has a discharge valve 72, for example. The ejection valve 72 opens or closes the liquid feeding unit 60 and the ejection unit 30 in accordance with an operation command of the control device 100. The ejection valve 72 is provided at a connection site between the liquid supply tube 61 of the liquid supply unit 60 and the liquid supply tube 32 of the ejection unit 30. The ejection valve 72 is, for example, a pneumatic valve.

The relationship between the rate of change of opening of the spout valve 72 and the first connecting valve 67 (the second connecting valve 68) may also be the relationship between the rate of change of opening of the switching valve 71 and the first connecting valve 67 (the second connecting valve 68) the same. That is, the ejection valve 72 may be opened and closed with a rate of change of opening degree which is smaller than the rate of change of opening degree of at least one of the first connecting valve 67 and the second connecting valve 68.

(Control device) Next, referring to FIGS. 5 and 6, the control device 100 will be described in detail. The control device 100 executes the action of opening the switching valve 71 after the pressure difference between the replenishing section 50 and the liquid feeding section 60 is reduced; and in the state that the switching valve 71 is opened, the processing from the replenishing section 50 is started The liquid is replenished to the action of the liquid feeding unit 60".

As shown in FIG. 5, the control device 100 includes: an operation command holding unit 102, a first pressure acquiring unit 103, a second pressure acquiring unit 104, a flow rate acquiring unit 105, a hydraulic pressure acquiring unit 106, and a processing liquid supply control unit 101 , As a functional module (hereinafter referred to as "functional module").

The operation instruction holding unit 102 holds an operation instruction that defines the liquid treatment process to be executed in the liquid treatment unit U1. The operation command may also include: the target value (set value) of the ejection pressure when the processing liquid is ejected from the nozzle 31, the execution time of ejecting the processing liquid from the nozzle 31, the target value (set value) of the replenishment pressure and the replenishment flow rate, And the execution time of replenishing the processing liquid from the replenishing unit 50 to the liquid feeding unit 60 and the like.

The first pressure acquisition unit 103 acquires a measurement value from the pressure measurement unit 54. Specifically, the first pressure obtaining unit 103 obtains a measured value indicating the pressure in the connecting pipe between the pump 56 and the pump driving unit 57 (the driving pressure to the pump 56) in the replenishing unit 50. The first pressure acquisition unit 103 outputs the acquired measurement value to the processing liquid supply control unit 101.

The second pressure acquisition unit 104 acquires a measurement value from the pressure measurement unit 66. Specifically, the second pressure acquiring unit 104 acquires a measured value indicating the pressure in the connecting pipe between the pump 76 and the pump driving unit 77 in the liquid feeding unit 60 (the driving pressure to the pump 76). The second pressure acquisition unit 104 outputs the acquired measurement value to the processing liquid supply control unit 101.

The flow rate acquisition unit 105 acquires a measurement value from the flow rate measurement unit 65. Specifically, the flow rate acquisition unit 105 acquires a measured value indicating the flow rate of the gas used to drive the pump 76 in the connecting pipe between the pump 76 and the pump drive unit 77. The flow rate acquisition unit 105 outputs the acquired measurement value to the processing liquid supply control unit 101.

The hydraulic pressure acquisition unit 106 acquires a measurement value from the pressure measurement unit 69. Specifically, the hydraulic pressure acquiring unit 106 acquires a measured value indicating the pressure of the processing liquid between the filter 63 and the pressure feed unit 64 (pump 76). The hydraulic pressure acquisition unit 106 outputs the acquired measurement value to the processing liquid supply control unit 101.

The processing liquid supply control unit 101 controls the processing liquid supply unit 29 to eject the processing liquid from the nozzle 31. The processing liquid supply control unit 101 includes, for example, a discharge preparation unit 111, a discharge control unit 112, a return preparation unit 113, a return control unit 114, a replenishment preparation unit 115, and a replenishment control unit 116 as functional modules.

The ejection preparation unit 111 is configured to perform preparation for ejecting the processing liquid from the nozzle 31. Specifically, the ejection preparation section 111 adjusts the pressure of the processing liquid in the liquid feeding section 60 (hereinafter referred to as “pressure in the liquid feeding section 60”) before starting to eject the processing liquid from the nozzle 31. The ejection preparation section 111 changes the pressure in the liquid feeding section 60 with the ejection valve 72 closed to reduce the pressure difference between the liquid feeding section 60 and the ejection section 30. The ejection preparation unit 111 controls the pump drive unit 77 so that the pressure in the liquid feeding unit 60 approaches the set value based on the measurement value obtained from the pressure measurement unit 69, for example. The ejection preparation unit 111 may adjust the driving pressure from the pump driving unit 77 to the pump 76 in accordance with the deviation of the measured value of the pressure measuring unit 69 from the above-mentioned set value so that the deviation is close to zero. The ejection preparation section 111 opens the ejection valve 72 in a state where the pressure difference between the liquid feeding section 60 and the ejection section 30 is reduced.

The ejection control unit 112 is configured to eject the processing liquid from the nozzle 31 to the wafer W. Specifically, the ejection control unit 112 causes the processing liquid to be ejected from the nozzle 31 to the wafer W in a state where the pressure difference between the liquid feeding unit 60 and the ejection unit 30 is reduced by the ejection preparation unit 111 and the ejection valve 72 is opened. . The ejection control unit 112 controls the pressure feed unit 64 (pump driving unit 77) so that the pressure of the processing liquid sent to the nozzle 31 (hereinafter referred to as “discharge pressure”) follows the target value. The ejection control unit 112 maintains the target value at a fixed set value Pd, and causes the processing liquid to be ejected from the nozzle 31 to the wafer W at a substantially constant flow rate. The ejection control unit 112 may adjust the driving pressure from the pump drive unit 77 to the pump 76 in accordance with the deviation of the measurement value of the pressure measurement unit 69 from the above-mentioned set value Pd so that the deviation is close to zero.

The return preparation unit 113 is configured to perform preparation for processing (hereinafter referred to as “return”) of returning the processing liquid from the liquid feeding unit 60 to the replenishing unit 50. Specifically, the return preparation section 113 adjusts the pressure of the processing liquid in the replenishment section 50 (hereinafter referred to as the "pressure in the replenishment section 50") and the pressure in the liquid delivery section 60 before the start of return. The pressure difference between the replenishing part 50 and the liquid feeding part 60 is reduced. The return preparation unit 113 opens the switching valve 71 in a state in which the pressure difference between the replenishing unit 50 and the liquid feeding unit 60 is reduced.

The return control unit 114 is configured to perform return of the processing liquid from the liquid supply unit 60 to the replenishment unit 50. The return control unit 114 causes the pressure delivery unit 64 (pump 76) to send the processing liquid to the pressure delivery unit 53 ( The return of pump 56) starts. The return control unit 114 may, for example, control the pressure delivery unit 64 (pump drive unit 77) and the pressure delivery unit 53 (pump drive unit 57) so that the pressure of the processing liquid sent from the pressure delivery unit 64 to the pressure delivery unit 53 (Hereinafter referred to as "return pressure") is maintained approximately constant, and the flow rate per unit time of the processing liquid (hereinafter referred to as "return flow rate") is maintained approximately constant".

The replenishment preparation unit 115 is configured to perform preparation for replenishing the processing liquid from the replenishment unit 50 to the liquid feeding unit 60. Specifically, the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 50 and the liquid delivery unit 60 before replenishing the processing liquid from the replenishment unit 50 to the liquid delivery unit 60, and is in a state where the pressure difference is reduced. , Open the switching valve 71. The replenishment preparation unit 115 changes the pressure in the replenishment unit 50 in a state where the switching valve 71 is closed, for example, so that the pressure difference between the replenishment unit 50 and the liquid feeding unit 60 is reduced. Compared with the pressure difference in the replenishment section 50 and the liquid feeding section 60 before the replenishment preparation starts, the replenishment preparation section 115 only needs to reduce the pressure difference at least after the replenishment preparation. As an example, the replenishment preparation unit 115 changes the pressure in the replenishment unit 50 so that the pressure in the replenishment unit 50 and the pressure in the liquid feeding unit 60 approximately match.

As an example of replenishment preparation, the replenishment preparation unit 115 first controls the pressure feed unit 53 (pump driving unit 57) to reduce the pressure difference between the replenishment unit 50 and the liquid feed unit 60 with the switching valve 71 closed. The replenishment preparation unit 115 may also control the pump drive unit 57 so that the measurement value of the pressure measurement unit 54 approaches the set value Pd. For example, the replenishment preparation unit 115 adjusts the driving pressure from the pump driving unit 57 to the pump 56 in accordance with the deviation between the measured value of the pressure measuring unit 54 and the set value Pd so that the deviation is close to zero. Next, the replenishment preparation section 115 controls the pressure feed section 53 based on the measurement value of the pressure measurement section 69 with the switching valve 71 open and the discharge valve 72 and the second connection valve 68 closed, so that the pressure feed section 53 is connected to the pressure The pressure between the sending parts 64 is close to the set value (for example, the set value Pd). For example, the supplement preparation unit 115 adjusts the drive pressure from the pump drive unit 57 to the pump 56 in accordance with the deviation between the measured value of the pressure measurement unit 69 and the set value Pd so that the deviation is close to zero.

Next, the replenishment preparation unit 115 controls the pressure feed unit 64 based on the measurement value of the pressure measurement unit 69 in a state where the switching valve 71 and the ejection valve 72 are closed and the second connection valve 68 is opened so that the pressure in the liquid feed unit 60 Close to the above set value (for example, set value Pd). For example, the supplement preparation unit 115 adjusts the drive pressure from the pump drive unit 77 to the pump 76 in accordance with the deviation of the pressure measurement unit 69 from the set value Pd so that the deviation is close to zero.

The replenishment control unit 116 is configured to replenish the processing liquid from the replenishment unit 50 to the liquid feeding unit 60. Specifically, the replenishment control unit 116 starts to replenish the processing liquid from the replenishment unit 50 to the liquid feeding unit 60 in a state where the switching valve 71 is opened by the replenishment preparation unit 115 (after the switching valve 71 is opened). As an example, the replenishment control unit 116 uses the replenishment preparation unit 115 to sequentially close the switching valve 71, adjust the pressure in the replenishment unit 50, adjust the pressure in the liquid feeding unit 60, and switch the switching valve 71 to the open state again. After that, the replenishment of the processing liquid to the liquid feeding unit 60 is started. The replenishment control unit 116 replenishes the processing liquid from the replenishment unit 50 to the liquid delivery unit 60 in a state where the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 50 and the liquid delivery unit 60.

The replenishment control unit 116 controls any one of the pressure feeding portion 53 and the pressure feeding portion 64 so that the pressure of the processing liquid sent from the pressure feeding portion 53 to the pressure feeding portion 64 (hereinafter referred to as "replenishment pressure") follows the target value . While performing follow-up control of the target value of the supplementary pressure, the supplementary control unit 116 controls the other of the pressure delivery portion 53 (pump driving portion 57) and the pressure delivery portion 64 (pump driving portion 77) so that each unit of the processing liquid The flow rate over time (hereinafter referred to as the "replenishment flow rate") follows the target value. The replenishment control unit 116 controls the pressure feeding portion 53 and the pressure feeding portion 64 from the start of replenishment to the completion of replenishment, so as to implement follow-up control of the replenishment pressure and follow-up control of the replenishment flow rate. The execution period of the follow-up control of the supplementary pressure and the execution period of the follow-up control of the supplemental flow rate may overlap at least partly. As an example, the replenishment control unit 116 controls the pressure feed unit 53 so that the replenishment pressure follows the target value, and at the same time controls the pressure feed unit 64 so that the replenishment flow rate follows the target value.

The replenishment control unit 116 may set the target value of the replenishment pressure as the target value of the discharge pressure (set value Pd) from the start of replenishment to the end of replenishment in the control to make the replenishment pressure follow the target value. For example, the supplementary control unit 116 adjusts the driving pressure from the pump driving unit 57 to the pump 56 in accordance with the deviation between the measured value of the pressure measuring unit 69 and the set value Pd so that the deviation is close to zero. The replenishment control unit 116 may set the target value of the replenishment flow rate to a fixed value from the start of the replenishment to the end of the replenishment in the control to make the replenishment flow rate follow the target value. For example, the replenishment control unit 116 may adjust the driving pressure from the pump drive unit 77 to the pump 76 based on the measurement value of the flow rate measurement unit 65 so that the replenishment flow rate follows the target value. In addition, the replenishment control unit 116 may replace the flow rate measurement unit 65 and use a flow meter provided in the liquid feeding pipe 61 or the branch pipe 62b to perform follow-up control of the replenishment flow rate.

The control device 100 is composed of one or more control computers. For example, the control device 100 has the circuit 120 shown in FIG. 6. The circuit 120 includes one or more processors 121, a memory 122, a storage 123, an input/output port 124, and a timer 125.

The storage 123 has, for example, a computer-readable recording medium such as a hard disk. The recording medium records a program for causing the coating and developing device 2 to execute the liquid treatment process described later. The recording medium may also be removable media such as non-volatile semiconductor memory, magnetic disks, and optical disks. The memory 122 temporarily records the program loaded from the recording medium of the storage 123 and the calculation result of the processor 121. The processor 121 cooperates with the memory 122 to execute the above-mentioned programs to form the above-mentioned functional modules. The input/output port 124 is connected to the pressure feeding parts 53, 64, the switching valve 71, the first connecting valve 67, the second connecting valve 68, the ejection valve 72, the pressure measuring parts 54, 66, 69, the flow measuring part 65, etc. At the same time, the input and output of electronic signals are implemented. The timer 125 measures the elapsed time, for example, by calculating a reference pulse of a fixed period.

In addition, the hardware structure of the control device 100 is not necessarily limited to those that use programs to configure each functional module. For example, each functional module of the control device 100 may also be composed of a dedicated logic circuit or an integrated ASIC (Application Specific Integrated Circuit).

[Processing liquid supply process] Next, referring to FIGS. 7 to 14, as an example of a control method of the substrate processing apparatus, a liquid processing step executed by the control apparatus 100 will be described. Fig. 7 is a flowchart showing an example of a liquid treatment process.

As shown in FIG. 7, the control device 100 first executes steps S01 and S02 in order. In step S01, for example, the ejection preparation unit 111 controls the processing liquid supply unit 29 so as to reduce the pressure difference between the liquid feeding unit 60 and the ejection unit 30 in preparation for ejecting the processing liquid from the nozzle 31. In step S02, for example, the ejection control unit 112 controls the processing liquid supply unit 29 to eject the processing liquid from the nozzle 31 to the wafer W in a state where the pressure difference between the liquid supply unit 60 and the ejection unit 30 is reduced. The detailed content of the spray preparation process and the spray process will be described later.

Next, the control device 100 executes steps S03 and S04 in order. In step S03, for example, the return preparation section 113 controls the processing liquid supply section 29 to reduce the pressure difference between the replenishment section 50 and the liquid supply section 60, and the processing liquid is returned from the liquid supply section 60 to the replenishment section 50. Preparation for the return. In step S04, for example, the return control unit 114 controls the processing liquid supply unit 29 to return the processing liquid from the liquid supply unit 60 in a state where the pressure difference between the replenishing unit 50 and the liquid supply unit 60 is reduced. Part 50 (to implement loopback). The detailed content of the loopback preparation process and loopback process will be described later.

Next, the control device 100 executes steps S05 and S06 in this order. In step S05, for example, the replenishment preparation section 115 controls the processing liquid supply section 29 to reduce the pressure difference between the replenishment section 50 and the liquid supply section 60, and the processing liquid is replenished from the replenishment section 50 to the liquid supply section 60. Preparation. In step S06, for example, the replenishment control unit 116 controls the treatment liquid supply unit 29 to replenish the treatment liquid from the replenishment unit 50 to the liquid supply unit in a state where the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is reduced.部60. The detailed content of supplementary preparation processing and supplementary processing will be described later. According to the above, a series of liquid treatment steps are ended. In addition, in the liquid processing step, the return preparation processing and return processing of steps S03 and S04 may be omitted, and the return processing may be performed once every liquid processing.

(Spit preparation process) FIG. 8(a) is a flowchart showing an example of the ejection preparation process of step S01. As shown in FIG. 8(a), the control device 100 first executes step S11. In step S11, the ejection preparation unit 111 switches the second connection valve 68 from the closed state to the open state while the switching valve 71, the ejection valve 72, the first connection valve 67, and the second connection valve 68 are closed.

Next, the control device 100 executes steps S12 and S13. In step S12, the ejection preparation unit 111 adjusts the pressure in the liquid feeding unit 60. The ejection preparation unit 111 adjusts the pressure in the liquid feeding unit 60 based on the measurement value of the pressure measuring unit 69 as shown in FIG. 9( a ), for example. The ejection preparation unit 111 may also control the pump drive unit 77 so that the measurement value of the pressure measurement unit 69 follows (closes) to the set value Pd of the ejection pressure. For example, the ejection preparation unit 111 may adjust the driving pressure from the pump driving unit 77 to the pump 76 in accordance with the deviation between the measured value of the pressure measuring unit 69 and the set value Pd so that the deviation is close to zero. In FIG. 9(a), the pipelines directly and indirectly connected to the pressure measuring unit 69 are indicated by thick lines, the valve in the open state is indicated by blank, and the valve in the closed state is indicated by black.

The ejection preparation unit 111 repeats steps S12 and S13 from the execution of step S12 to the elapse of a predetermined time. The predetermined time is set in advance by "repeating adjustment of the pressure in the liquid feeding unit 60 until the measured value of the pressure measuring unit 69 substantially matches the set value Pd", and is stored in the operation command holding unit 102. In addition, the ejection preparation unit 111 may repeat the process of step S12 instead of the elapse of a predetermined time until the pressure in the liquid feeding unit 60 reaches the set range including the set value Pd. By executing steps S12 and S13, the ejection preparation section 111 reduces the pressure difference between the liquid feeding section 60 and the ejection section 30 with the ejection valve 72 closed.

When it is judged that the predetermined time has passed, the ejection preparation unit 111 executes step S14. In step S14, for example, the ejection preparation unit 111 switches the ejection valve 72 from the closed state while maintaining the switching valve 71 and the first connection valve 67 in the closed state and the second connection valve 68 in the open state. To open state. At this time, the ejection preparation unit 111 may switch the ejection valve 72 from the closed state to the open state with a smaller rate of change in opening degree (slower operating speed) than the second connection valve 68. As described above, the ejection preparation unit 111 ends the ejection preparation process.

(Spitting process) Fig. 8(b) is a flowchart showing the ejection process of step S02. For example, in a state where the pressure difference between the liquid feeding section 60 and the ejection section 30 is reduced by the ejection preparation section 111 and the ejection valve 72 is opened, as shown in FIG. 8(b), the control device 100 executes steps S21, S22. In step S21, the ejection control unit 112 adjusts the ejection pressure of the processing liquid sent to the nozzle 31. In step S21, control of the ejection control section 112 of the pressure feed section 64 (the contraction section of the pump 76) is started to send the treatment liquid to the ejection section 30 at the set value Pd of the ejection pressure. Thereby, the ejection control unit 112 causes the nozzle 31 to start ejecting the processing liquid while the ejection valve 72 is opened. The ejection control unit 112 continues to adjust the ejection pressure after the ejection starts.

The ejection control unit 112 adjusts the pump drive unit 77 (the pressure applied to the treatment liquid from the pump 76) based on the measurement value of the pressure measurement unit 69 as shown in FIG. 9(b), for example. The ejection control unit 112 may also adjust the pump drive unit 77 so that the ejection pressure of the treatment liquid follows the set value Pd. The ejection control unit 112 may adjust the driving pressure from the pump driving unit 77 to the pump 76 in accordance with the deviation between the measured value of the pressure measuring unit 69 and the set value Pd so that the deviation is close to zero. The ejection control unit 112 repeats the processing of steps S21 and S22 from the execution of step S21 until a predetermined time has elapsed.

When it is determined in step S22 that the predetermined time has passed, the control device 100 executes step S23. In step S23, while maintaining the switching valve 71 and the first connection valve 67 in the closed state, the discharge control unit 112 switches the second connection valve 68 and the discharge valve 72 from the open state to the closed state, respectively. In step S23, the ejection control unit 112 may switch the ejection valve 72 from the open state to the closed state at a rate of change of the opening degree smaller than that of the second connection valve 68 (slower operating speed). After the ejection valve 72 is closed, the pressure in the liquid feeder 60 is maintained at a value close to the set value Pd. The above-mentioned predetermined time is set in the operation command held by the operation command holding unit 102, for example, it is set in advance corresponding to the amount of the treatment liquid used in one liquid treatment. The control device 100 may also control the rotation holder 20 to rotate the wafer W during the execution of step S02, thereby forming a photoresist coating film on the surface Wa of the wafer W.

(Return preparation process) FIG. 10 is a flowchart showing an example of the return preparation process of step S03. As shown in FIG. 10, the control device 100 first executes step S31. In step S31, the return preparation unit 113 adjusts the pressure in the replenishment unit 50 with the switching valve 71 closed to reduce the pressure difference between the replenishment unit 50 and the liquid supply unit 60. The return preparation unit 113 controls, for example, the pump driving unit 57 (pressure in the pump 56) so that the pressure in the replenishing unit 50 approaches the set value Pd of the discharge pressure from the standby pressure Pw1. The standby pressure Pw1 is a set value maintained by the pressure in the replenishing unit 50 during the execution of steps S01 and S02, and may be greater than the set value Pd of the discharge pressure.

Next, the control device 100 executes step S32. In step S32, the return preparation unit 113 switches the switching valve 71 from the closed state to the open state while maintaining the first connection valve 67, the second connection valve 68, and the discharge valve 72 in the closed state. At this time, the return preparation unit 113 may switch the switching valve 71 from the closed state to the open state with a rate of change of the opening degree smaller than that of the second connection valve 68.

Next, the control device 100 executes steps S33 and S34. In step S33, the return preparation unit 113 adjusts the pressure in the replenishment unit 50 again based on the measurement value of the pressure measurement unit 69. The return preparation unit 113, for example, controls the pump drive unit 57 so that the measurement value of the pressure measurement unit 69 approaches the set value Pd. In addition, in step S33, although the switching valve 71 is opened and the replenishing section 50 is connected to the liquid feeding section 60, the pressure feeding section 64 of the liquid feeding section 60 is separated from the pipe connected to the pressure measuring section 69, so the replenishing section 50 The pressure inside is regulated. The loopback preparation unit 113 repeats the processing of steps S33 and S34 from the execution of step S33 to the elapse of a predetermined time. The predetermined time is set in advance in the manner of "repeating adjustment of the pressure in the replenishing unit 50 until the pressure in the replenishing unit 50 approximately matches the set value Pd", and is stored in the operation command holding unit 102.

In step S34, when it is determined that the predetermined time has passed, the control device 100 executes step S35. In step S35, the return preparation unit 113 switches the switching valve 71 from the open state to the closed state while maintaining the second connection valve 68 and the discharge valve 72 in the closed state, and switches the first connection valve 67 from the closed state. The state switches to the open state. At this time, the return preparation unit 113 may switch the switching valve 71 from the open state to the closed state with a smaller rate of change in the opening degree (slower operating speed) than the first connection valve 67.

Next, the control device 100 executes steps S36 and S37. In step S36, the return preparation unit 113 adjusts the pressure in the liquid feeding unit 60 based on the measurement value of the pressure measuring unit 69. The return preparation unit 113, for example, controls the pump drive unit 77 so that the measurement value of the pressure measurement unit 69 approaches the set value Pd. The loopback preparation unit 113 repeats the processing of steps S36 and S37 from the execution of step S36 to the elapse of a predetermined time. The predetermined time is set in advance by “repeating the adjustment of the pressure in the liquid feeding unit 60 until the pressure in the liquid feeding unit 60 substantially matches the set value Pd”, and is stored in the operation command holding unit 102.

In step S37, when it is determined that the predetermined time has passed, the preparation unit 113 is sent back, and step S38 is executed. In step S38, the return control unit 114 switches the switching valve 71 from the closed state to the open state while maintaining the second connection valve 68 and the discharge valve 72 in the closed state and the first connection valve 67 in the open state. status. At this time, the loopback control unit 114 may switch the switching valve 71 from the closed state to the open state with a smaller rate of change in the opening degree (slower operating speed) than the first connection valve 67. According to the above, the return preparation unit 113 ends the return preparation process.

(Loopback control) Fig. 11 is a flowchart showing an example of a loopback control process. As shown in FIG. 11, the control device 100 first executes steps S41 and S42. In step S41, the return control unit 114 adjusts the return pressure of the processing liquid sent from the pressure delivery unit 64 of the liquid delivery unit 60 to the pressure delivery unit 53 of the replenishing unit 50 and the return flow rate of the processing liquid. In step S41, in order to adjust the return pressure and the return flow rate, the return control section 114 starts to control the pressure delivery section 53 and the pressure delivery section 64, thereby starting the return flow, and continues to adjust the return pressure and return flow rate after the start of the return flow. The return control unit 114 controls, for example, the pump drive unit 57 so that the return pressure (measured value of the pressure measurement unit 69) follows the target value to reduce the pressure in the pump 76. In addition, the return control unit 114 controls the pump drive unit 77 based on the measurement value of the flow measurement unit 65 so that the return flow rate follows the target value. The above-mentioned target values of the return pressure and the return flow rate, for example, may be set to fixed values until the return flow is completed. The loopback control unit 114 repeats the processing of steps S41 and S42 from the execution of step S41 until a predetermined time has elapsed. The predetermined time is set in advance so that the loopback ends within the time, and is stored in the operation command holding unit 102.

In step S42, when it is determined that the predetermined time has passed, the control device 100 executes step S43. In step S43, the return control unit 114 switches the switching valve 71 and the first connection valve 67 from the open state to the closed state while maintaining the second connection valve 68 and the discharge valve 72 in the closed state. At this time, the return control unit 114 may switch the switching valve 71 from the open state to the closed state with a smaller rate of change in the opening degree (slower operating speed) than the first connection valve 67. According to the above, the loopback control unit 114 ends the loopback control process.

(Supplementary preparation) FIG. 12 is a flowchart showing an example of the supplementary preparation process of step S05. As shown in FIG. 12, the control device 100 first executes step S51. In step S51, the replenishment preparation unit 115 adjusts the pressure in the replenishment unit 50 with the switching valve 71 closed to reduce the pressure difference between the replenishment unit 50 and the liquid feeding unit 60. The supplementary control unit 116 controls the pressure feed unit 53 (pump drive unit 57) based on the measurement value of the pressure measurement unit 54 as shown in FIG. 14(a), for example.

The replenishment control unit 116 may also control the pump drive unit 57 so that the pressure in the replenishment unit 50 approaches the set value Pd of the discharge pressure. For example, the supplemental control unit 116 may adjust the driving pressure from the pump driving unit 57 to the pump 56 in accordance with the deviation between the measured value of the pressure measuring unit 54 and the set value Pd so that the deviation is close to zero. When the loopback is not performed (when steps S03 and S04 are omitted), the replenishment unit 50 maintains the standby pressure Pw1 before the start of step S05. Therefore, at this time, the replenishment control unit 116 controls the pump drive unit 57 so that the pressure in the replenishment unit 50 approaches the set value Pd from the standby pressure Pw1.

Next, the control device 100 executes step S52. In step S52, the replenishment preparation unit 115, as shown in FIG. 14(b), while maintaining the first connection valve 67, the second connection valve 68, and the discharge valve 72 in a closed state, the switching valve 71 is changed from The closed state switches to the open state. At this time, the replenishment preparation unit 115 may switch the switching valve 71 from the closed state to the open state with a smaller opening degree change rate (slower operating speed) than the second connection valve 68.

Next, the control device 100 executes steps S53 and S54. In step S53, the replenishment preparation unit 115 adjusts the pressure in the replenishment unit 50 again based on the measurement value of the pressure measurement unit 69. Specifically, the replenishment preparation unit 115 controls the pressure-feeding unit 53 so that the pressure between the pressure-feeding unit 53 and the pressure-feeding unit 64 approaches a preset setting value. The replenishment preparation unit 115 may, for example, control the pump drive unit 57 so that the measurement value of the pressure measurement unit 69 approaches the set value Pd. For example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 57 to the pump 56 in response to the deviation between the measured value of the pressure measurement unit 69 and the set value Pd so that the deviation is close to zero. The replenishment preparation unit 115 repeats the processing of steps S53 and S54 from the execution of step S53 to the elapse of a predetermined time. The predetermined time is set in advance so that the pressure in the replenishing unit 50 (the pressure between the pressure feeding portion 53 and the pressure feeding portion 64) substantially coincides with the set value Pd during this time, and is stored in the operation command holding unit 102.

In step S54, when it is determined that the predetermined time has passed, the control device 100 executes step S55. In step S55, the replenishment preparation unit 115, as shown in FIG. 14(c), switches the switching valve 71 from the open state to the closed state while maintaining the first connection valve 67 and the ejection valve 72 in the closed state , And switch the second connection valve 68 from the closed state to the open state. At this time, the replenishment preparation unit 115 may switch the switching valve 71 from the open state to the closed state with a smaller rate of change in the opening degree (slower operating speed) than the second connection valve 68.

Next, the control device 100 executes steps S56 and S57. In step S56, the replenishment preparation unit 115 adjusts the pressure in the liquid feeding unit 60 based on the measurement value of the pressure measuring unit 69. Specifically, the replenishment preparation unit 115 controls the pressure feed unit 64 (pump driving unit 77) based on the measurement value of the pressure measurement unit 69 so that the pressure in the liquid feed unit 60 approaches the set value used in step S53. The replenishment preparation unit 115 may also control the pump drive unit 77 so that the measurement value of the pressure measurement unit 69 approaches the set value Pd. For example, the supplement preparation unit 115 adjusts the driving pressure from the pump driving unit 77 to the pump 76 in response to the deviation between the measured value of the pressure measuring unit 69 and the set value Pd so that the deviation is close to zero. The replenishment preparation unit 115 repeats the processing of steps S56 and S57 from the execution of step S56 to the elapse of a predetermined time. The predetermined time is set in advance so that the pressure in the liquid feeding unit 60 substantially coincides with the set value Pd during the time, and is stored in the operation command holding unit 102.

In step S57, when it is determined that the predetermined time has passed, the control device 100 executes step S58. In step S58, the replenishment control unit 116 switches the switching valve 71 from the closed state to the open state while maintaining the first connection valve 67 and the discharge valve 72 in the closed state and the second connection valve 68 in the open state. status. At this time, the supplementary control unit 116 may switch the switching valve 71 from the closed state to the open state with a smaller rate of change in the opening degree (slower operating speed) than the second connection valve 68. According to the above, the replenishment preparation unit 115 ends the replenishment preparation process.

(Supplementary control) Fig. 13 is a flowchart showing an example of a supplementary control process. As shown in FIG. 13, the control device 100 first executes steps S61 and S62. In step S61, the replenishment control unit 116 adjusts the replenishment pressure of the processing liquid sent from the pressure feed unit 53 of the replenishment unit 50 to the pressure feed unit 64 of the liquid feed unit 60 and the replenishment flow rate of the processing liquid. In order to adjust the replenishing pressure and the replenishing flow rate, the replenishment control unit 116 starts to control the pressure feeding portion 53 and the pressure feeding portion 64, thereby starting to replenish the processing liquid. The replenishment control unit 116 continues to adjust the replenishment pressure and the replenishment flow rate after the replenishment starts. Specifically, the replenishment control unit 116 controls either one of the pressure feeding portion 53 and the pressure feeding portion 64 so that the replenishment pressure follows the target value, and at the same time controls the other of the pressure feeding portion 53 and the pressure feeding portion 64 to make the replenishment The flow follows the target value. As shown in FIG. 14( d ), the replenishment control unit 116 may, for example, control the pressure feed unit 53 (pump driving unit 57) based on the measurement value of the pressure measurement unit 69 so that the replenishment pressure follows the target value. The replenishment control unit 116 may also control the pressure feed unit 64 (pump driving unit 77) based on the measurement value of the flow measurement unit 65 so that the replenishment flow rate follows the target value.

The replenishment control unit 116 repeats the processing of steps S61 and S62 from the execution of step S61 to the elapse of a predetermined time. The predetermined time is set in advance so that the replenishment of the processing liquid to the liquid feeding unit 60 (pump 76) is completed within that time, and is stored in the operation command holding unit 102. The replenishment control unit 116 may also set the target value of the replenishment pressure to the set value Pd of the discharge pressure (the target value of the discharge pressure) in the control to make the replenishment pressure follow the target value, until a predetermined time has elapsed (until the treatment liquid reaches the target value). Until the supplement is completed). For example, the replenishment control unit 116 may adjust the driving pressure from the pump drive unit 57 to the pump 56 from the start of the replenishment to the completion of the replenishment, so that the deviation between the measured value of the pressure measuring unit 69 and the set value Pd is close to zero, and This deviation maintains a state roughly consistent with zero".

In step S62, when it is determined that the predetermined time has passed, the control device 100 executes step S63. In step S63, the replenishment control unit 116 switches the switching valve 71 and the second connection valve 68 from the open state to the closed state while maintaining the first connection valve 67 and the discharge valve 72 in the closed state. At this time, the supplementary control unit 116 may switch the switching valve 71 from the open state to the closed state with a smaller rate of change in the opening degree (slower operating speed) than the second connection valve 68.

Next, the control device 100 executes step S64. In step S64, the control device 100 adjusts the pressure in the pump 56 of the replenishing unit 50 and the pressure in the pump 76 of the liquid feeding unit 60, respectively. The control device 100, for example, controls the pump drive unit 57 based on the measurement value of the pressure measurement unit 54 to adjust the pressure in the pump 56 (the pressure in the replenishment unit 50) to the standby pressure Pw1. The control device 100 controls the pump drive unit 77 based on the measurement value of the pressure measurement unit 66 to adjust the pressure in the pump 76 to the standby pressure Pw2, for example. The standby pressure Pw2 may also be smaller than the standby pressure Pw1. According to the above, the replenishment control unit 116 ends the replenishment control process.

[Effects of Implementation Mode] The coating and developing device 2 described above includes: the ejection section 30 having a nozzle 31 for ejecting the processing liquid onto the wafer W; the liquid supply section 60 which sends the processing liquid to the ejection section 30; and the replenishment section 50 for the liquid supply section 60 Replenishing the processing liquid sent to the ejection unit 30; the first connecting portion 80 has a switching valve 71 that opens or closes the replenishing portion 50 and the liquid feeding portion 60; and the filter 63 is replenishing the replenishing portion 50 to the feeding portion The liquid part 60 removes foreign matter contained in the processing liquid; the replenishment preparation part 115 opens the switching valve 71 after reducing the pressure difference between the replenishment part 50 and the liquid feeding part 60; and the replenishment control part 116 uses the replenishment The preparation unit 115 starts to replenish the processing liquid from the replenishing unit 50 to the liquid feeding unit 60 in a state where the switching valve 71 is opened.

The control method of the coating and developing device 2 described above includes: opening the switching valve 71 after reducing the pressure difference between the replenishing section 50 and the liquid feeding section 60; and starting from the replenishing section with the switching valve 71 open. 50 The operation of replenishing the processing liquid to the liquid feeding unit 60.

If the switching valve 71 is opened in a state where the pressure difference between the replenishing section 50 and the liquid feeding section 60 is large, there is a possibility that the treatment liquid may be damaged in the flow path from the replenishing section 50 to the liquid feeding section 60. Chasing phenomenon. The chasing phenomenon of the treatment liquid refers to the back and forth of the treatment liquid in the flow path. When the chasing phenomenon of the processing liquid occurs, the processing liquid will pass through the filter 63 back and forth, so that particles are likely to be generated from the filter 63. In contrast, in the coating and developing device 2 and the control method described above, the switching valve 71 is opened after the pressure difference between the replenishing section 50 and the liquid feeding section 60 is reduced. Therefore, it is possible to suppress the generation of particles due to the chasing phenomenon of the processing liquid. Therefore, the coating and developing device 2 and the above-mentioned control method are effective for reducing particles in the processing liquid ejected to the wafer W.

In the above-mentioned embodiment, the filter 63 is provided in the liquid feeding part 60. When the switching valve 71 is opened in a state where the pressure difference between the replenishing section 50 and the liquid feeding section 60 is large, in the liquid feeding section 60, a chase phenomenon of the processing liquid to the extent that particles are generated from the filter 63 may occur in the liquid feeding section 60 . On the other hand, in the above-mentioned structure, the switching valve 71 is opened after the pressure difference between the replenishing part 50 and the liquid feeding part 60 is reduced. Therefore, it is effective in suppressing the generation of particles due to the chasing phenomenon of the processing liquid in the liquid feeding section 60.

In the above-mentioned embodiment, the liquid feeding part 60 has: a liquid feeding tube 61 that connects the replenishing part 50 and the ejection part 30 via a filter 63; the pressure feeding part 64 receives processing from the replenishing part 50 via the liquid feeding tube 61 The liquid is sent to the ejection section 30 through the liquid feeding pipe 61; and the second connecting valve 68 opens or closes the liquid feeding pipe 61 and the pressure feeding section 64. The replenishing unit 50 has a liquid source 51 and a pressure feed unit 53 from which the processing liquid is sent from the liquid source 51 to the liquid feed unit 60. The replenishment control unit 116 controls any one of the pressure feeding portion 53 and the pressure feeding portion 64 so that the replenishing pressure from the pressure feeding portion 53 to the pressure feeding portion 64 follows the target value. The replenishment control unit 116 controls the other of the pressure feeding portion 53 and the pressure feeding portion 64 so that the replenishment flow rate from the pressure feeding portion 53 to the pressure feeding portion 64 follows the target value. At this time, the replenishment flow can be adjusted, and the pressure of the treatment liquid during the replenishment process can be adjusted at the same time. As a result, the treatment fluid can be replenished with an appropriate hydraulic pressure that reduces particles.

In the above-mentioned embodiment, the coating and developing device 2 is provided with: the ejection valve 72 to open or close the liquid feeding section 60 and the ejection section 30; and the ejection preparation section 111 to change the pressure in the liquid feeding section 60 to make After the pressure difference between the liquid feeding section 60 and the ejection section 30 is reduced, the ejection valve 72 is opened; and the ejection control section 112 starts to eject the treatment liquid from the nozzle 31 with the ejection valve 72 opened by the ejection preparation section 111 To wafer W. At this time, since the ejection valve 72 is opened in a state in which the pressure difference between the liquid feeding section 60 and the ejection section 30 is reduced, it is possible to suppress the process liquid chasing phenomenon accompanying the opening of the ejection valve 72. Therefore, it is more effective for reducing the particles in the processing liquid ejected to the wafer W.

In the above-mentioned embodiment, the liquid feeding part 60 has: a liquid feeding tube 61 that connects the replenishing part 50 and the ejection part 30 via a filter 63; the pressure feeding part 64 receives processing from the replenishing part 50 via the liquid feeding tube 61 The liquid is sent to the ejection section 30 through the liquid feeding pipe 61; and the second connecting valve 68 opens or closes the liquid feeding pipe 61 and the pressure feeding section 64. The switching valve 71 opens and closes at a rate of change of the opening degree smaller than that of the second connection valve 68. Along with the opening and closing operation of the switching valve 71, the hydraulic pressure fluctuates during the opening and closing operation. In the above structure, the opening and closing operation of the switching valve 71 is performed at a small rate of change in the opening degree, thereby suppressing the hydraulic pressure acting on the filter 63 from drastically changing. Therefore, it is more effective for reducing the particles in the processing liquid ejected to the wafer W.

In the above-mentioned embodiment, the replenishment preparation unit 115 changes the pressure in the replenishment unit 50 with the switching valve 71 closed to reduce the pressure difference between the replenishment unit 50 and the liquid feeding unit 60. At this time, since the pressure in the replenishing section 50 is changed before the switching valve 71 is opened, and the pressure difference between the replenishing section 50 and the liquid feeding section 60 is reduced, it is possible to suppress the processing liquid that occurs when the switching valve 71 is opened. Chasing phenomenon.

In the above-described embodiment, the coating and developing device 2 includes the ejection control unit 112 that controls the pressure feed unit 64 so that the ejection pressure of the processing liquid sent to the nozzle 31 follows the target value. The replenishment preparation unit 115 sets the target value of the replenishment pressure as the target value of the discharge pressure in the control to make the replenishment pressure follow the target value until the replenishment of the treatment liquid is completed. At this time, in the process of replenishing the treatment liquid, since the pressure fluctuation acting on the filter 63 can be suppressed, the generation of particulates from the filter 63 can be further suppressed.

In the above-mentioned embodiment, the coating and developing device 2 includes the ejection valve 72 to open or close the gap between the liquid feeding section 60 and the ejection section 30. The liquid supply unit 60 has: a liquid supply tube 61 that connects the replenishing unit 50 and the ejection unit 30 through a filter 63; The treatment liquid is sent to the ejection part 30; the second connecting valve 68 opens or closes the liquid feeding pipe 61 and the pressure feeding part 64; and the pressure measuring part 69 measures the pressure between the filter 63 and the pressure feeding part 64 . The replenishing unit 50 has a liquid source 51 and a pressure feed unit 53 from which the processing liquid is sent from the liquid source 51 to the liquid feed unit 60. The replenishment preparation unit 115 sequentially performs the following actions: when the switching valve 71 is closed, the pressure feed unit 53 is controlled to reduce the pressure difference between the replenishment unit 50 and the liquid feed unit 60; When the valve 72 and the second connecting valve 68 are closed, the pressure-feeding unit 53 is controlled based on the measured value of the pressure measuring unit 69 so that the pressure between the pressure-feeding unit 53 and the pressure-feeding unit 64 is close to the set value; in the switching valve 71 With the ejection valve 72 closed and the second connection valve 68 open, the pressure feeder 64 is controlled based on the measurement value of the pressure measuring unit 69 so that the pressure in the liquid feeder 60 approaches the above-mentioned set value. At this time, since the switching valve 71 is opened, the pressure in the replenishing section 50 and the pressure in the liquid feeding section 60 are close to the same set value based on the same measured value of the pressure measuring section 69, so before the start of replenishment The pressure difference between the replenishing part 50 and the liquid feeding part 60 is further reduced. Therefore, it is more effective for reducing the particles in the processing liquid ejected to the wafer W.

15(a) and 15(b) are graphs showing an example of the measurement result of the number of particles contained in the treatment liquid after ejection. In FIGS. 15(a) and 15(b), the vertical axis represents the number of particles. In the measurement result shown in FIG. 15(a) and the measurement result shown in FIG. 15(b), the minimum value of the size of the particle to be measured is different from each other. The above-mentioned minimum value of the measurement result shown in FIG. 15(b) is larger than the above-mentioned minimum value of the measurement result shown in FIG. 15(a).

In the measurement of the "comparative example", the switching valve 71 was opened without reducing the pressure difference between the replenishing section 50 and the liquid feeding section 60, and the treatment liquid was started to be discharged from the refilling section 50 with the switching valve 71 open. Replenish to the liquid feeding part 60. The target value of the ejection pressure is maintained at the set value Pd, the pressure in the liquid feeding section 60 during the replenishment preparation is adjusted to be close to the set value Pr, and the pressure in the replenishing section 50 is maintained at the standby time before ejection and during ejection. Set value Pr. The set value Pr is larger than the set value Pd.

In the measurement of "Condition 1", except that the target value of the replenishment pressure was not maintained at the set value Pd during the replenishment process, the liquid treatment process was performed in the same manner as the above-mentioned embodiment. "Condition 1", in the replenishment process of the treatment liquid, the replenishment pressure is not controlled to follow the target value, and the replenishment flow rate to the liquid feeding portion 60 is substantially constant, and the pressure feeding portion of the replenishing portion 50 is controlled. 53 (Pump drive unit 57). In the measurement of "Condition 2", the liquid treatment step was performed in the same manner as in the above-mentioned embodiment. As shown in FIG. 15(a) and FIG. 15(b), by reducing the pressure difference in the state where the switching valve 71 is closed, it can be confirmed that the number of particles contained in the processing liquid has decreased. In addition, if the measurement results of Condition 1 and Condition 2 are compared, it can be seen that by maintaining the supplementary pressure substantially constant, the number of particles is further reduced.

In FIG. 16( a ), the time variation of the measured value (hydraulic pressure) of the pressure measuring unit 69 of the comparative example is shown. In FIG. 16( b ), the time variation of the measurement value (hydraulic pressure) of the pressure measurement unit 69 of Condition 2 is displayed. In the time changes shown in FIG. 16(a) and FIG. 16(b), measured values when the loopback preparation and loopback processing are omitted are displayed. In the comparative example, in the replenishment preparation stage after the end of ejection, the switching valve 71 is opened in a state where the pressure difference between the replenishing section 50 and the liquid feeding section 60 is large. As shown in Fig. 16(a), in the replenishment preparation, the hydraulic pressure fluctuates up and down around the set value Pr. This pressure fluctuation exhibits the above-mentioned chasing phenomenon of the processing liquid. On the other hand, in the measurement result of Condition 2, in the replenishment preparation stage after the end of the ejection, the switching valve 71 is opened in a state where the pressure difference between the replenishing section 50 and the liquid feeding section 60 is reduced. As shown in Fig. 16(b), in the replenishment preparation, the chasing phenomenon (pressure fluctuation) of the above-mentioned treatment liquid is significantly smaller than that of the comparative example. We believe that this chasing phenomenon is suppressed, which is one of the main reasons for the reduction of particles. In addition, during the replenishment of the treatment liquid, the replenishment pressure is maintained approximately constant. We believe that maintaining the supplementary pressure roughly constant is also one of the main reasons for the reduction of particulates.

The above description is based on the first embodiment, but the present invention is not necessarily limited to the above embodiment, and various changes can be made without departing from the spirit of the invention.

(Variation Example 1) In the above-mentioned example, in the ejection process, the treatment liquid is sent from the liquid feeding section 60 to the ejection section 30 without passing through the filter 63, but the ejection process is not limited to this. For example, when the liquid supply unit 60 sends the processing liquid to the ejection unit 30, instead of the branch pipe 62b, the processing liquid may be sent to the ejection unit 30 via the branch pipe 62a and the liquid supply pipe 61. In the ejection preparation process (in the same process as step S12), as shown in FIG. 17(a), the switching valve 71, the ejection valve 72, and the second connection valve 68 are closed and the first connection valve 67 is opened. Next, the ejection preparation unit 111 may also control the pump drive unit 77 based on the measurement value of the pressure measurement unit 69 to adjust the pressure in the liquid feeding unit 60.

Then, the ejection preparation unit 111 may execute the same control as steps S21 to S23 to eject the treatment liquid from the nozzle 31 while the ejection valve 72 is opened. At this time, as shown in FIG. 17( b ), the processing liquid is sent to the ejection unit 30 from the pressure feed unit 64 (pump 76) through the filter 63. During the ejection of the treatment liquid, with the switching valve 71 and the second connection valve 68 closed and the first connection valve 67 and the ejection valve 72 open, the ejection preparation unit 111 controls, for example, based on the measurement value of the pressure measurement unit 69 The pump driving part 77 adjusts the pressure in the liquid feeding part 60.

(Variation Example 2) In the above-mentioned example, during the replenishment process, the replenishment pressure is approximately fixed at the set value Pd from the start of replenishment to the completion of the replenishment, but the target value of the replenishment pressure during the replenishment process is not limited to this. For example, when the set value Pd of the ejection pressure is not suitable for the replenishment of the treatment liquid, the replenishment preparation unit 115 may perform replenishment preparation so that the replenishment pressure is a pressure different from the set value Pd at the start of replenishment. Then, the replenishment control unit 116 may perform control in which the replenishment pressure follows the target value so that the replenishment pressure gradually approaches the set value Pd during the replenishment of the treatment liquid. Fig. 18(a) shows an example when the pressure at the start of replenishment is made higher than the set value Pd of the discharge pressure. Figure 18(b) shows an example when the pressure at the start of replenishment is lower than the set value Pd of the discharge pressure.

As shown in Figure 18 (a), the replenishment preparation unit 115 may also control the processing liquid supply unit 29 in the replenishment preparation process of step S05 so that the pressure in the replenishment unit 50 and the pressure in the liquid supply unit 60 are A setting value greater than the setting value Pd. The replenishment control unit 116 may make the target value of the replenishment pressure gradually approach the set value Pd (the target value of the discharge pressure) from a set value larger than the set value Pd from the start of the replenishment to the completion of the replenishment. Thereby, in the replenishment process of step S06, the replenishment pressure gradually decreases from a value larger than the set value Pd to a set value Pd that is substantially equal to the discharge pressure during discharge.

As shown in Figure 18(b), the replenishment preparation unit 115 may also control the processing liquid supply unit 29 in the replenishment preparation process of step S05 so that the pressure in the replenishment unit 50 and the pressure in the liquid supply unit 60 are The setting value is smaller than the setting value Pd. The replenishment control unit 116 may make the target value of the replenishment pressure gradually approach the set value Pd (the target value of the discharge pressure) from a set value smaller than the set value Pd from the start of the replenishment to the completion of the replenishment. Thereby, in the replenishment process of step S06, the replenishment pressure gradually increases from a value smaller than the set value Pd to a set value Pd that is substantially equal to the discharge pressure during discharge.

The coating and developing device 2 of this modified example 2 includes a discharge control unit 112 that controls the pressure feed unit 64 so that the discharge pressure of the processing liquid sent to the nozzle 31 follows the target value. The replenishment control unit 116 makes the target value of the replenishment pressure gradually approach the target value (set value Pd) of the discharge pressure in the control for making the replenishment pressure follow the target value until the replenishment of the treatment liquid is completed. At this time, it is possible to start the replenishment of the treatment liquid with the replenishment pressure set to a pressure suitable for the replenishment of the treatment liquid, and at the same time approach the target value of the discharge pressure during the replenishment process. As a result, liquid treatment can be performed more efficiently.

In addition, in the liquid treatment process of the above embodiment, the replenishment preparation unit 115 may omit the adjustment of the pressure in the replenishment unit 50 in step S53 and the adjustment of the pressure in the liquid feeding unit 60 in step S56. At this time, the replenishment control unit 116 may start replenishing the treatment liquid after the replenishment preparation unit 115 reduces the pressure difference by adjusting the standby pressure (executes the process of step S51) and opens the switching valve 71 before the replenishment starts.

[Second implementation aspect] Next, referring to FIGS. 19 to 23, the coating and developing device 2 included in the substrate processing system of the second embodiment will be described. In the liquid treatment process performed in the coating and developing device 2 of the second embodiment, the replenishment preparation process of step S05 and the replenishment control process of step S06 are different from those of the first embodiment. In this liquid treatment step, for example, the target value of the ejection pressure is set to the set value Pd, and the pressure in the liquid feeding section 60 before the ejection start and before the replenishment starts, and the replenishment pressure are set to the set value Pr. The set value Pr is larger than the set value Pd.

The replenishment preparation unit 115 changes the pressure in the liquid feeding unit 60 in a state where the switching valve 71 is closed, for example, so that the pressure difference between the replenishing unit 50 and the liquid feeding unit 60 is reduced. The replenishment preparation unit 115 only needs to reduce the pressure difference between the replenishment unit 50 and the liquid supply unit 60 before the replenishment preparation starts, at least after the replenishment preparation. As an example, the replenishment preparation unit 115 changes the pressure in the liquid feeding unit 60 so that the pressure in the liquid feeding unit 60 and the pressure in the replenishing unit 50 approximately match. In this way, in the replenishment preparation of the first embodiment, the pressure in the replenishing section 50 is changed in order to reduce the pressure difference. In contrast, in the replenishment preparation of the second embodiment, the pressure in the liquid feeding section 60 is changed. pressure.

As an example of replenishment preparation, first, the replenishment preparation unit 115 controls the pressure feed unit 64 (pump drive) based on the measurement value of the pressure measurement unit 69 in a state where the switching valve 71 and the discharge valve 72 are closed and the second connection valve 68 is open. Section 77) so that the pressure in the liquid feeding section 60 approaches the set value (for example, the set value Pr). For example, the supplement preparation unit 115 adjusts the pressure from the pump drive unit 77 to the pump 76 in response to the deviation of the measured value of the pressure measurement unit 69 from the set value Pr so that the deviation is close to zero. Next, the replenishment preparation unit 115, after opening the switching valve 71, controls the pressure feed unit 53 based on the measurement value of the pressure measurement unit 69 in a state where the discharge valve 72 and the second connection valve 68 are closed, so that the pressure feed unit 53 The pressure between the pressure feed unit 64 is close to the above-mentioned set value (for example, the set value Pr). For example, the replenishment preparation unit 115 adjusts the pressure from the pump drive unit 57 to the pump 56 in response to the deviation of the measurement value of the pressure measurement unit 69 from the set value Pr so that the deviation is close to zero.

The replenishment control unit 116 uses the replenishment preparation unit 115, for example, to adjust the pressure in the liquid feeding unit 60 and adjusts the pressure in the replenishing unit 50 with the switching valve 71 open, and then starts to replenish the processing liquid from the replenishing unit 50 to the liquid feeding.部60. The replenishing control unit 116 replenishes the processing liquid from the replenishing unit 50 to the liquid feeding unit 60 in a state where the switching valve 71 is open. The replenishment control unit 116 controls the pressure feed unit 53 and the pressure feed unit 64 in the same manner as in the first embodiment to perform follow-up control of the replenishment pressure and follow-up control of the replenishment flow rate. The replenishment control unit 116 may set the target value of the replenishment pressure to the set value Pr from the start of the replenishment to the end of the replenishment in the control to make the replenishment pressure follow the target value. For example, the supplementary control unit 116 adjusts the driving pressure from the pump driving unit 57 to the pump 56 in response to the deviation of the measured value of the pressure measuring unit 69 from the set value Pr so that the deviation is close to zero.

(Supplementary preparation) Fig. 19 is a flowchart showing the supplementary preparation process of the second embodiment. In this replenishment preparation process, for example, in a state where the pressure in the replenishment unit 50 is maintained at the set value Pr, the control device 100 first executes step S151. In step S151, for example, the replenishment control unit 116, as shown in FIG. 21(a), maintains the switching valve 71, the ejection valve 72, and the first connection valve 67 in the closed state, and the second connection valve 68 switches from the closed state to the open state.

Next, the control device 100 executes steps S152 and S153. In step S152, the replenishment control unit 116 adjusts the pressure in the liquid feeding unit 60 with the switching valve 71 closed to reduce the pressure difference between the replenishing unit 50 and the liquid feeding unit 60. The supplementary control unit 116 controls the pressure feed unit 64 (pump drive unit 77) based on the measurement value of the pressure measurement unit 69 as shown in FIG. 21(a), for example. The replenishment control unit 116 may also control the pump drive unit 77 so that the pressure in the liquid feeding unit 60 approaches the set value Pr of the replenishment pressure. For example, the supplemental control unit 116 may adjust the driving pressure from the pump driving unit 77 to the pump 76 in accordance with the deviation between the measured value of the pressure measuring unit 69 and the set value Pr so that the deviation is close to zero. The replenishment control unit 116 repeats the processing of steps S152 and S153 from the execution of step S152 to the elapse of a predetermined time. The predetermined time is set in advance so that the pressure in the liquid feeding unit 60 substantially coincides with the set value Pr during the time, and is stored in the operation command holding unit 102.

In step S153, when it is determined that the predetermined time has passed, the control device 100 executes step S154. In step S154, the replenishment preparation unit 115, as shown in FIG. 21(b), switches the switching valve 71 from the closed state to the open state while maintaining the first connection valve 67 and the ejection valve 72 in the closed state , And switch the second connection valve 68 from the open state to the closed state. At this time, the replenishment preparation unit 115 may switch the switching valve 71 from the closed state to the open state with a smaller opening degree change rate (slower operating speed) than the second connection valve 68.

Next, the control device 100 executes steps S155 and S156. In step S155, for example, the replenishment preparation unit 115 adjusts the pressure in the replenishment unit 50 (between the pressure feed unit 53 and the pressure feed unit 64) based on the measurement value of the pressure measurement unit 69. Specifically, the supplement preparation unit 115 may also control the pressure feeding portion 53 so that the pressure between the pressure feeding portion 53 and the pressure feeding portion 64 is close to the set value used in step S152. The replenishment preparation unit 115 can control the pump drive unit 57 so that the measurement value of the pressure measurement unit 69 approaches the set value Pr, for example. As an example, the supplement preparation unit 115 may adjust the driving pressure from the pump driving unit 57 to the pump 56 in accordance with the deviation between the measured value of the pressure measuring unit 69 and the set value Pr so that the deviation is close to zero. The replenishment preparation unit 115 repeats the processing of steps S155 and S156 from the execution of step S155 to the elapse of a predetermined time. The predetermined time is set in advance so that the pressure between the pressure feeding portion 53 and the pressure feeding portion 64 substantially coincides with the set value Pr within the time, and is stored in the operation command holding portion 102.

In step S156, when it is determined that the predetermined time has passed, the replenishment preparation unit 115 executes step S157. In step S157, the replenishment control unit 116 switches the second connection valve 68 from the closed state to the open state while maintaining the first connection valve 67 and the discharge valve 72 in the closed state and the switching valve 71 in the open state. status. According to the above, the replenishment preparation unit 115 ends the replenishment preparation process.

In the replenishment preparation process of the first embodiment, the pressure adjustment in the replenishment section 50 when the switching valve 71 is in the closed state, the pressure adjustment in the replenishment section 50 when the switching valve 71 is in the open state, and the The switching valve 71 is in the closed state to adjust the pressure in the liquid feeding part 60, and it is performed in this order. In contrast, in the replenishment preparation process of the second embodiment described above, the pressure adjustment in the liquid feeding section 60 when the switching valve 71 is in the closed state, and the pressure adjustment in the replenishment section 50 when the switching valve 71 is in the open state The pressure adjustment of the pressure is carried out in this order.

(Supplementary control) Fig. 20 is a flowchart showing an example of the supplementary control process of the second embodiment. As shown in FIG. 20, the control device 100 executes steps S161 and S162. In step S162, the replenishing control unit 116 starts to control the pressure in order to adjust the replenishing pressure of the processing liquid sent from the pressure feeding portion 53 of the refilling portion 50 to the pressure feeding portion 64 of the liquid feeding portion 60 and the replenishing flow rate of the processing liquid. The feeding part 53 and the pressure feeding part 64 start to replenish the processing liquid by this. The replenishment control unit 116, for example, as shown in FIG. 21(c), executes control that the replenishment pressure and the replenishment flow rate follow the target value, similarly to steps S61 and S62.

The replenishment control unit 116 repeats the processing of steps S161 and S162 from the execution of step S162 to the elapse of a predetermined time. The predetermined time is set in advance so that the replenishment of the processing liquid to the liquid feeding unit 60 (pump 76) is completed within that time, and is stored in the operation command holding unit 102. The replenishment control unit 116 may set the target value of the replenishment pressure to the set value Pr in the control to make the replenishment pressure follow the target value until a predetermined time has elapsed (until the process liquid replenishment is completed). For example, the replenishment control unit 116 may adjust the driving pressure from the pump drive unit 57 to the pump 56 from the start of the replenishment to the completion of the replenishment so that the deviation between the measured value of the pressure measuring unit 69 and the set value Pr is close to zero and the deviation is maintained at A state roughly consistent with zero.

In step S162, when it is determined that the predetermined time has passed, the control device 100 executes step S163. In step S163, the supplementary control unit 116, similarly to step S64, while maintaining the first connection valve 67 and the discharge valve 72 in the closed state, respectively switches the switching valve 71 and the second connection valve 68 from the open state to Disabled. At this time, the supplementary control unit 116 may switch the switching valve 71 from the open state to the closed state with a smaller rate of change in the opening degree (slower operating speed) than the second connection valve 68.

Next, the control device 100 executes step S164. In step S164, the control device 100 adjusts the pressure in the pump 56 of the replenishing unit 50 and the pressure in the pump 76 of the liquid feeding unit 60, respectively. The control device 100, for example, controls the pump drive unit 57 based on the measurement value of the pressure measurement unit 54 to adjust the pressure in the pump 56 (the pressure in the replenishment unit 50) to the set value Pr (standby pressure). The control device 100, for example, controls the pump drive unit 77 based on the measurement value of the pressure measurement unit 66 to adjust the pressure in the pump 76 to a standby pressure lower than the set value Pr. According to the above, the replenishment control unit 116 ends the replenishment control process.

The ejection control of the processing liquid performed in the liquid processing step of the second embodiment may be as shown in FIG. 9(b), and the processing liquid may be sent from the pressure feed unit 64 (pump 76) without passing through the filter 63. To the spitting department 30. Alternatively, as shown in FIG. 17( b ), the processing liquid may be sent to the ejection section 30 from the pressure feed section 64 (pump 76) through the filter 63.

In the return preparation process performed in the liquid treatment process of the second embodiment, the pressure adjustment in the liquid feeding unit 60 when the switching valve 71 is closed may be the same as the above-mentioned supplementary preparation, and the switching valve 71 is the pressure adjustment in the replenishment part 50 in the open state, and it is carried out in this order.

[Effects of the second embodiment] In the coating and developing device 2 and the liquid treatment process of the second embodiment described above, as in the first embodiment, the switching valve is opened after the pressure difference between the replenishing section 50 and the liquid feeding section 60 is reduced. 71. Therefore, when the switching valve 71 is opened, it is possible to suppress the occurrence of the process liquid chase phenomenon in the flow path for replenishing the process liquid from the replenishing part 50 to the liquid feeding part 60. In the second embodiment described above, a filter 63 is provided in the liquid feeding portion 60 to suppress the occurrence of the process liquid chase phenomenon in the liquid feeding portion 60. Therefore, it is effective for reducing the particles in the processing liquid ejected to the wafer W.

In the second embodiment described above, the replenishment preparation section 115 changes the pressure in the liquid feeding section 60 with the switching valve 71 closed to reduce the pressure difference between the replenishing section 50 and the liquid feeding section 60. At this time, since the pressure in the liquid feeding section 60 is changed before the switching valve 71 is opened to reduce the pressure difference between the replenishing section 50 and the liquid feeding section 60, it is possible to suppress the processing that occurs with the opening of the switching valve 71 The chasing phenomenon of liquid. In addition, the volume of the processing liquid in the pressure-feeding section 64 (pump 76) of the liquid-feeding section 60 is often smaller than the volume of the processing liquid in the pressure-feeding section 53 (pump 56) of the replenishing section 50. In addition, in terms of the piping volume to the filter 63 and the pressure measuring part 69, the liquid feeding part 60 side is smaller than the replenishing part 50 side (the distance between the pressure feeding part 64 and the pressure measuring part 69 is smaller than the pressure feeding part The distance between the part 53 and the pressure measuring part 69 is shorter) in many cases. Therefore, since the pressure in the liquid feeding portion 60 is changed in the above-mentioned structure, it is possible to perform pressure control with higher resolution (higher accuracy) and rapid pressure control than in the first embodiment.

In the second embodiment described above, the liquid feeding section 60 has: a liquid feeding tube 61 that connects the replenishing section 50 and the ejection section 30 via a filter 63; and the pressure feeding section 64 is connected from the replenishing section 50 via the liquid feeding tube 61. The treatment liquid is received, and the treatment liquid is sent to the ejection part 30 through the liquid feeding pipe 61; and the second connection valve 68 opens or closes the liquid feeding pipe 61 and the pressure feeding part 64. The replenishing unit 50 has a liquid source 51 and a pressure feed unit 53 from which the processing liquid is sent from the liquid source 51 to the liquid feed unit 60. The replenishment control unit 116 controls any one of the pressure feeding portion 53 and the pressure feeding portion 64 so that the replenishing pressure from the pressure feeding portion 53 to the pressure feeding portion 64 follows the target value. The replenishment control unit 116 controls the other of the pressure feeding portion 53 and the pressure feeding portion 64 so that the replenishment flow rate from the pressure feeding portion 53 to the pressure feeding portion 64 follows the target value. At this time, the replenishment flow can be adjusted, and the pressure of the treatment liquid during the replenishment process can be adjusted at the same time. As a result, the treatment fluid can be replenished with an appropriate hydraulic pressure that reduces particles.

In the second embodiment described above, the coating and developing device 2 includes: the ejection valve 72 to open or close the liquid feeding section 60 and the ejection section 30; and the ejection preparation section 111 to change the pressure in the liquid feeding section 60 The ejection valve 72 is opened after the pressure difference between the liquid feeding section 60 and the ejection section 30 is reduced; and the ejection control section 112 starts the process from the nozzle 31 with the ejection valve 72 opened by the ejection preparation section 111 The liquid is ejected onto the wafer W. At this time, since the ejection valve 72 is opened in a state in which the pressure difference between the liquid feeding section 60 and the ejection section 30 is reduced, it is possible to suppress the chasing phenomenon of the processing liquid accompanying the opening of the ejection valve 72. Therefore, it is more effective for reducing the particles in the processing liquid ejected to the wafer W.

In the second embodiment described above, the liquid feeding section 60 has: a liquid feeding tube 61 that connects the replenishing section 50 and the ejection section 30 via a filter 63; and the pressure feeding section 64 is connected from the replenishing section 50 via the liquid feeding tube 61. The treatment liquid is received, and the treatment liquid is sent to the ejection part 30 through the liquid feeding pipe 61; and the second connection valve 68 opens or closes the liquid feeding pipe 61 and the pressure feeding part 64. The switching valve 71 opens and closes at a rate of change of the opening degree smaller than that of the second connection valve 68. Along with the opening and closing operation of the switching valve 71, the hydraulic pressure fluctuates during the opening and closing operation. In the above structure, by performing the opening and closing operation of the switching valve 71 at a small rate of change in the opening degree, it is possible to suppress the hydraulic pressure acting on the filter 63 from drastically fluctuating. Therefore, it is more effective for reducing the particles in the processing liquid ejected to the wafer W.

In the second embodiment described above, the coating and developing device 2 is provided with: a switching valve 71 to open or close the gap between the replenishing section 50 and the liquid feeding section 60; and a discharge valve to set the gap between the liquid feeding section 60 and the discharging section 30 Open or block. The liquid supply unit 60 has: a liquid supply tube 61 that connects the replenishing unit 50 and the ejection unit 30 through a filter 63; The treatment liquid is sent to the ejection part 30; the second connecting valve 68 opens or closes the liquid feeding pipe 61 and the pressure feeding part 64; and the pressure measuring part 69 measures the pressure between the filter 63 and the pressure feeding part 64 . The replenishing unit 50 has a liquid source 51 and a pressure feed unit 53 from which the processing liquid is sent from the liquid source 51 to the liquid feed unit 60. The replenishment preparation unit 115 sequentially performs the following actions: in a state where the switching valve 71 and the ejection valve 72 are closed and the second connection valve 68 is open, based on the measurement value of the pressure measurement unit 69, the pressure feed unit 64 is controlled to send The pressure in the liquid pipe 61 is close to the set value; and when the switching valve 71 is opened and the discharge valve 72 and the second connecting valve 68 are closed, based on the measured value of the pressure measuring section 69, the pressure feeding section 53 is controlled to make the pressure feeding The pressure between the portion 53 and the pressure-feeding portion 64 is close to the above-mentioned set value. At this time, since the pressure in the replenishing section 50 and the pressure in the liquid feeding section 60 are close to the same set value based on the same measured value of the pressure measuring section 69, it is possible to more reliably reduce the pressure in the replenishing section 50 before the start of replenishment. The pressure difference in the liquid feeding unit 60. Therefore, it is more effective for reducing the particles in the processing liquid ejected to the wafer W. In addition, since it is different from the first embodiment in that the pressure in the liquid feeding section 60 is adjusted first with the switching valve 71 closed, the pressure adjustment range in the replenishing section 50 is small. Therefore, even if the pressure on the liquid feeding portion 60 side and the pressure on the replenishing portion 50 side match the set value before the start of the replenishment of the treatment liquid, more rapid pressure control can be performed compared to the first embodiment.

FIG. 22 is a graph showing an example of the measurement result of the number of particles contained in the treatment liquid after ejection. In Fig. 22, the vertical axis represents the number of particles. In FIG. 22, the measurement result of "Comparative Example 1", the measurement result of "Comparative Example 2", the measurement result of "Condition 1", and the measurement result of "Condition 2" are shown. In the measurement of Comparative Example 1 and Comparative Example 2, the switching valve 71 was opened without reducing the pressure difference between the replenishing section 50 and the liquid feeding section 60, and the processing from the refilling section 50 was started with the switching valve 71 open. The liquid is replenished to the liquid feeding section 60. In Comparative Example 1, the treatment liquid was discharged through the filter 63 during the discharge of the treatment liquid. In Comparative Example 2, the treatment liquid was discharged without passing through the filter 63 during the discharge of the treatment liquid.

In Condition 1 and Condition 2, similar to the liquid treatment process of the second embodiment described above, the pressure difference between the replenishing part 50 and the liquid feeding part 60 is reduced and the switching valve 71 is opened, and then the switching valve 71 is opened. In the state, the replenishment of the processing liquid from the replenishing section 50 to the liquid feeding section 60 starts. Condition 1, in the process of discharging the treatment liquid, the treatment liquid is discharged through the filter 63. Condition 2: In the process of discharging the treatment liquid, the treatment liquid is discharged without passing through the filter 63. Regardless of the aspects of Comparative Example 1, Comparative Example 2, Condition 1, and Condition 2, the pressure at the time of replenishment of the treatment liquid is set to a set value Pr that is larger than the set value Pd of the discharge pressure.

Comparing the measurement results of Comparative Example 1 and Condition 1, it can be seen that by reducing the pressure difference and opening the switching valve 71, the number of particles is reduced. Comparing the measurement results of Comparative Example 2 and Condition 2, it can be seen that by reducing the pressure difference and opening the switching valve 71, the number of particles is reduced. In FIG. 23( a ), the time variation of the measurement value (hydraulic pressure) of the pressure measurement unit 69 of Condition 2 is displayed. It can be seen that the chasing phenomenon (pressure fluctuation) of the processing fluid prepared for replenishment is smaller than the time fluctuation of the hydraulic pressure when the switching valve 71 is opened without reducing the pressure difference [for example, the time fluctuation shown in FIG. 14(a)]. We believe that the suppression of this chasing phenomenon is the main reason for the reduction of particles. In addition, in condition 2, the target value of the replenishment pressure of the processing liquid in the replenishment process is maintained at the set value Pr and the measurement is performed.

(Variation example) The target value of the replenishment pressure of the treatment liquid during the replenishment process can be maintained at the set value Pr as described above, but the target value of the replenishment pressure can be gradually approached to the target value of the discharge pressure until the replenishment of the treatment liquid is completed. . Figure 23(b) shows the time variation of the hydraulic pressure when the pressure at the start of replenishment is set to the set value Pr, and the replenishment pressure is brought close to the set value Pd during the replenishment process. The replenishment control unit 116 may make the target value of the replenishment pressure gradually approach the set value Pd (the target value of the discharge pressure) from the start of replenishment to the completion of the replenishment during the control of the replenishment pressure following the target value. Thereby, in the replenishment process of step S06, the replenishment pressure gradually decreases from the set value Pr to the set value Pd that is substantially equal to the ejection pressure at the time of ejection.

The coating and developing device 2 of the above-mentioned modified embodiment includes a discharge control unit 112 that controls the pressure feed unit 64 so that the discharge pressure of the processing liquid sent to the nozzle 31 follows the target value. The replenishment control unit 116 makes the target value of the replenishment pressure gradually approach the target value of the discharge pressure in the control to make the replenishment pressure follow the target value until the replenishment of the treatment liquid is completed. At this time, it is possible to start the replenishment of the treatment liquid with the replenishment pressure set to a pressure suitable for the replenishment of the treatment liquid, and at the same time approach the target value of the discharge pressure during the replenishment process. As a result, liquid treatment can be performed more efficiently.

In addition, in the liquid treatment process of the second embodiment, the set value Pr of the replenishment pressure and the set value Pd of the discharge pressure may be set to substantially equal values.

[The third aspect of implementation] Next, referring to FIGS. 24 to 29, the coating and developing device 2 included in the substrate processing system of the third embodiment will be described. The liquid processing unit U1 of the coating and developing device 2 of the third embodiment includes a processing liquid supply unit 29A instead of the processing liquid supply unit 29. The processing liquid supply unit 29A, like the processing liquid supply unit 29, supplies the processing liquid to the wafer W rotated and held by the rotation holding unit 20. As shown in FIG. 24, the processing liquid supply unit 29A includes a discharge unit 30, a liquid feeding unit 210, a first connection unit 230 (connection unit), a replenishment unit 250, and a second connection unit 90.

The liquid feeding unit 210 sends the treatment liquid to the ejection unit 30. Specifically, the liquid delivery unit 210 delivers the processing liquid to the ejection unit 30 (nozzle 31) at a predetermined pressure. The liquid feeding section 210 is connected to the ejection section 30 through the second connection section 90 (the ejection valve 72). Between the liquid feeding unit 210 and the ejection unit 30, the ejection valve 72 is opened or closed. The liquid feeding part 210 includes, for example, a liquid feeding tube 212 and a pressure feeding part 214 (pressure feeding part for ejection).

The liquid feeding pipe 212 guides the treatment liquid to the ejection unit 30. Specifically, the liquid feeding tube 212 is connected to the upstream end of the liquid feeding tube 32 of the ejection unit 30 through the ejection valve 72. The pressure feed unit 214 receives the processing liquid from the replenishing unit 250, pressurizes the received processing liquid, and sends it to the ejection unit 30. The pressure feed unit 214 includes, for example, a pump 216, an output valve 218, a pump drive unit 222, and a pressure measurement unit 224.

The pump 216 has a storage chamber that stores the processing liquid, and a contraction part that shrinks the storage chamber. The pump 216 uses the contraction part to expand the storage chamber to receive the treatment liquid, and uses the contraction part to contract the storage chamber to send out the treatment liquid. As the pump 216, for example, a tube pump, a diaphragm pump, or a telescopic pump may also be used. The output valve 218 is provided in the liquid feeding pipe 212 and opens and closes the flow path in the liquid feeding pipe 212 according to an operation instruction of the control device 100. The output valve 218 is, for example, a pneumatic valve.

The pump driving unit 222 drives the pump 216 in accordance with an operation instruction of the control device 100. Specifically, the pump driving part 222 operates (drives) the contraction part to contract the storage chamber of the pump 216. For example, the pump driving part 222 is a pneumatic driving part that uses gas to actuate the contraction part. The pump driving part 222 may also adjust the pressure (driving pressure) of the above-mentioned gas to shrink the storage chamber of the pump 216. The pressure measuring unit 224 obtains information about the pressure in the pump 216. For example, the pressure measuring unit 224 measures the pressure in the connecting pipe between the pump 216 and the pump driving unit 222. The pressure measuring unit 224 outputs the measured value to the control device 100.

The first connecting part 230 connects the liquid feeding part 210 and the replenishing part 250. The liquid feeding part 210 receives the processing liquid through the first connection part 230. The first connecting portion 230 includes, for example, a connecting pipe 232, a filter 234, a first switching valve 236 (switching valve), and a second switching valve 238.

The pipe 232 is connected to guide the processing liquid to the liquid feeding unit 210 (pump 216). Specifically, the downstream end of the connecting pipe 232 is connected to the liquid feeding part 210, and the upstream end of the connecting pipe 232 is connected to the replenishing part 250. In this manner, the connecting pipe 232 connects the liquid feeding unit 210 (pump 216) and the replenishing unit 250 to form a flow path for replenishing the processing liquid from the replenishing unit 250 to the liquid feeding unit 210. The filter 234 is installed in the connecting pipe 232, and removes foreign matter contained in the processing liquid. Specifically, the filter 234 removes foreign substances contained in the processing liquid (processing liquid replenished from the replenishing section 250 to the liquid feeding section 210) flowing through the flow path in the connecting pipe 232.

The first switching valve 236 and the second switching valve 238 open or close the liquid feeding part 210 and the replenishing part 250. The first switching valve 236 is provided downstream of the filter 234 in the connecting pipe 232. The first switching valve 236 opens or closes the flow path in the connecting pipe 232 in accordance with the operation instruction of the control device 100. The second switching valve 238 is provided upstream of the filter 234 in the connecting pipe 232. The second switching valve 238 opens or closes the flow path in the connecting pipe 232 in accordance with the operation instruction of the control device 100. The first switching valve 236 and the second switching valve 238 are, for example, pneumatic valves.

The replenishing unit 250 replenishes the liquid delivery unit 210 with the processing liquid delivered to the ejection unit 30. The replenishing part 250 includes, for example, a liquid source 252, a storage tank 254, a pressure feeding part 256 (pressure feeding part for replenishment), and a liquid feeding pipe 262.

The liquid source 252 is a supply source of the processing liquid that is replenished by the liquid feeding unit 210. The liquid source 252 supplies the processing liquid to the pressure feeding part 256 through the liquid feeding pipe 262. The storage tank 254 is provided in the liquid feeding pipe 262 and temporarily stores the processing liquid supplied to the pressure feeding part 256.

The pressure feed unit 256 feeds the processing liquid from the storage tank 254 to the liquid feed unit 210 through the first connection section 230. The pressure feed unit 256 receives the processing liquid from the storage tank 254, pressurizes the received processing liquid, and sends it to the first connection portion 230. The pressure feed unit 256 includes, for example, a pump 266, a pump drive unit 272, and a pressure measurement unit 274.

The pump 266 has a storage chamber for storing the processing liquid, and a contraction part for shrinking the storage chamber. The pump 266 uses the contraction part to expand the storage chamber to receive the treatment liquid, and uses the contraction part to contract the storage chamber to send out the treatment liquid. As the pump 266, for example, a tube pump, a diaphragm pump, or a telescopic pump may also be used.

The pump driving unit 272 drives the pump 266 in accordance with an operation instruction from the control device 100. Specifically, the pump driving part 272 operates (drives) the contraction part to contract the storage chamber of the pump 266. For example, the pump drive unit 272 is a pneumatic drive unit that uses gas to actuate the constriction. The pump driving unit 272 may also adjust the pressure (driving pressure) of the above-mentioned gas to shrink the storage chamber of the pump 266. The pressure measuring unit 274 obtains information about the pressure in the pump 266. For example, the pressure measuring unit 274 measures the pressure in the connecting pipe between the pump 266 and the pump driving unit 272. The pressure measuring unit 274 outputs the measured value to the control device 100.

The above processing liquid supply unit 29A is also controlled by the control device 100 in the same manner as the processing liquid supply unit 29 of the first embodiment and the second embodiment. The control device 100 executes the operation of opening the first switching valve 236 after the pressure difference between the replenishing part 250 and the liquid feeding part 210 is reduced; and starting from the replenishing part when the first switching valve 236 is opened 250 to replenish the processing liquid to the action of the liquid feeding unit 210".

The ejection preparation unit 111 of the control device 100 adjusts the pressure of the processing liquid in the liquid feeding unit 210 before starting to eject the processing liquid from the nozzle 31. The ejection preparation section 111 changes the pressure in the liquid feeding section 210 in a state where the output valve 218 is opened and the ejection valve 72 is closed, so that the pressure difference between the liquid feeding section 210 and the ejection section 30 is reduced. The ejection preparation section 111 opens the ejection valve 72 in a state where the pressure difference between the liquid feeding section 210 and the ejection section 30 is reduced.

The replenishment preparation unit 115 of the control device 100 executes preparation for replenishing the processing liquid from the replenishment unit 250 to the liquid feeding unit 210. Specifically, the replenishment preparation unit 115 may also change the pressure in the replenishment unit 250 and the pressure in the liquid feeding unit 210 while the first switching valve 236 and the second switching valve 238 are closed, so that the replenishment unit 250 The pressure difference with the inside of the liquid feeding part 210 is reduced. After that, the replenishment preparation unit 115 opens the second switching valve 238 while maintaining the first switching valve 236 in the closed state, and then changes the pressure between the replenishment unit 250 (pump 266) and the second switching valve 238 And the pressure in the liquid feeding part 210 reduces the pressure difference between the first connecting part 230 and the liquid feeding part 210. Through these processes, compared to the pressure difference between the replenishment part 250 and the liquid feeding part 210 before the replenishment preparation starts, the pressure difference after the replenishment preparation is reduced. The replenishment preparation unit 115 opens the first switching valve 236 in a state where the pressure difference between the replenishment unit 250 and the liquid feeding unit 210 is reduced.

Compared with the pressure difference between the replenishment section 250 and the liquid feeding section 210 before the replenishment preparation starts, the replenishment preparation section 115 only needs to reduce the pressure difference at least after the replenishment preparation. As an example, the replenishment preparation unit 115 controls the pressure feed unit 256 so that the pressure in the replenishment section 250 (the pressure in the first connection section 230) roughly matches the first set value Pr1, and controls the pressure feed unit 214 to deliver the liquid The pressure in the portion 210 approximately matches the second set value Pr2. The first setting value Pr1 and the second setting value Pr2 may be substantially the same as each other, and the first setting value Pr1 may be larger or smaller than the second setting value Pr2. The following is an example in which the first set value Pr1 is set to a value larger than the second set value Pr2. In one example, the first set value Pr1 is set to a value larger than the second set value Pr2 by about 1 kPa to 15 kPa.

As an example of replenishment preparation, first, the replenishment preparation unit 115 controls the pressure feed unit 256 so that the pressure in the replenishment unit 250 approaches the first set value Pr1 with the first switching valve 236 and the second switching valve 238 closed. , And control the pressure feeder 214 so that the pressure in the liquid feeder 210 approaches the second set value Pr2. Then, the replenishment preparation unit 115, after opening the second switching valve 238, controls the pressure feed unit 256 so that the pressure in the first connection portion 230 (from the pressure in the first connecting portion 230) is maintained in the closed state while the first switching valve 236 is maintained in the closed state. The pressure between the replenishing unit 250 and the first switching valve 236 is close to the first set value Pr1, and the pressure feeder 214 is controlled so that the pressure in the liquid feeder 210 approaches the second set value Pr2. The replenishment preparation unit 115 may maintain the output valve 218 of the liquid feeding unit 210 in a closed state during the execution period of the replenishment preparation.

FIG. 25 is a flowchart showing an example of the liquid treatment process of the third embodiment. As shown in FIG. 25, the control device 100 first executes steps S201 and S202 in sequence. In step S201, for example, the ejection preparation unit 111 controls the processing liquid supply unit 29A to reduce the pressure difference between the liquid feeding unit 210 and the ejection unit 30 as preparation for ejecting the processing liquid from the nozzle 31. In step S202, for example, the ejection control unit 112 controls the processing liquid supply unit 29A to eject the processing liquid from the nozzle 31 to the wafer W in a state where the pressure difference between the liquid feeding unit 210 and the ejection unit 30 is reduced. The details of the ejection preparation in step S201 and the ejection process in step S202 will be described later.

Next, the control device 100 executes steps S203 and S204 in order. In step S203, for example, the replenishment preparation unit 115 controls the processing liquid supply unit 29A to reduce the pressure difference between the replenishment unit 250 and the liquid supply unit 210, as a means for replenishing the processing liquid from the replenishment unit 250 to the liquid supply unit 210 ready. In step S204, for example, the replenishment control unit 116 controls the processing liquid supply unit 29A to replenish the processing liquid from the replenishment unit 250 to the liquid delivery unit in a state where the pressure difference between the replenishment unit 250 and the liquid supply unit 210 is reduced.部210. The details of the supplement preparation in step S203 and the supplement processing in step S04 will be described later. According to the above, a series of liquid treatment steps are ended.

FIG. 26(a) is a flowchart showing an example of the ejection preparation process in step S201. As shown in FIG. 26(a), the control device 100 first executes step S211. In step S211, for example, the ejection preparation unit 111 switches the output valve 218 from the closed state to the open state while the first switching valve 236, the second switching valve 238, and the ejection valve 72 are closed.

Next, the control device 100 executes steps S212 and S213. In step S212, for example, the ejection preparation unit 111 adjusts the pressure in the liquid feeding unit 210. The ejection preparation unit 111 adjusts the pressure in the liquid feeding unit 210 (the pressure in the liquid feeding pipe 212) based on the measurement value of the pressure measuring unit 224, for example. The ejection preparation unit 111 may control the pump drive unit 222 so that the measurement value of the pressure measurement unit 224 follows (closes) to the set value Pd of the ejection pressure. For example, the ejection preparation unit 111 may adjust the driving pressure from the pump driving unit 222 to the pump 216 in accordance with the deviation between the measured value of the pressure measuring unit 224 and the set value Pd so that the deviation is close to zero. The ejection preparation unit 111 repeats the processing of steps S212 and S213 until the pressure in the liquid feeding unit 210 reaches the set value Pd. By the execution of steps S212 and S213, the ejection preparation section 111 reduces the pressure difference between the liquid feeding section 210 and the ejection section 30 with the ejection valve 72 closed.

Next, the control device 100 executes step S214. In step S214, for example, the ejection preparation unit 111 switches the ejection valve 72 from the closed state while maintaining the first switching valve 236 and the second switching valve 238 in the closed state and the output valve 218 in the open state. To open state. According to the above, the ejection preparation unit 111 ends the ejection preparation.

FIG. 26(b) is a flowchart showing an example of the ejection control process in step S202. For example, in a state where the pressure difference between the liquid feeding section 210 and the ejection section 30 is reduced by the ejection preparation section 111 and the ejection valve 72 is opened, as shown in FIG. 26(b), the control device 100 executes steps S221, S222. In step S221, the ejection control unit 112 adjusts the ejection pressure of the processing liquid sent to the nozzle 31. In step S221, the ejection control unit 112 starts to control the pressure feed unit 214 (pump driving unit 222) to send the treatment liquid to the ejection unit 30 at the set value Pd of the ejection pressure. Thereby, the ejection control unit 112 starts to eject the processing liquid from the nozzle 31 in a state where the ejection valve 72 is opened. The ejection control unit 112 continues to adjust the ejection pressure after the ejection starts.

The ejection control unit 112 adjusts the pump drive unit 222 (the pressure applied to the treatment liquid from the pump 216) based on the measurement value of the pressure measurement unit 224, for example. The ejection control unit 112 may also adjust the pump driving unit 222 so that the ejection pressure of the treatment liquid follows the set value Pd. The ejection control unit 112 may adjust the driving pressure from the pump driving unit 222 to the pump 216 in accordance with the deviation between the measured value of the pressure measuring unit 224 and the set value Pd so that the deviation is close to zero. The ejection control unit 112 repeats the processing of steps S221 and S222 from the execution of step S221 until a predetermined time has elapsed. The above-mentioned predetermined time is set in the operation command held by the operation command holding unit 102, for example, it is set in advance corresponding to the amount of the treatment liquid used in one liquid treatment.

Next, the control device 100 executes steps S223 and S224 in this order. In step S223, for example, the ejection control unit 112 switches the output valve 218 and the ejection valve 72 from the open state to the closed state while maintaining the first switching valve 236 and the second switching valve 238 in the closed state. In step S234, for example, the ejection control unit 112 controls the pump drive unit 222 based on the measurement value of the pressure measurement unit 224 to adjust the pressure in the liquid feeding unit 210 (the pressure in the pump 216) to the standby pressure Ps2. In addition, the control device 100 may use the pressure feed unit 256 to maintain the pressure in the replenishing unit 250 (the pressure in the pump 266) at the standby pressure Ps1 during the ejection preparation and execution of the ejection processing in steps S201 and S202. The standby pressure Ps1 may be greater than the standby pressure Ps2. The standby pressure Ps1 in the replenishing unit 250 may be set in advance to a value larger than the above-mentioned first set value Pr1. The standby pressure Ps2 in the liquid feeding unit 210 may be set in advance to a value larger than the above-mentioned second set value Pr2.

FIG. 27 is a flowchart showing an example of the supplementary preparation process of step S203. As shown in FIG. 27, the control device 100 first executes steps S231 and S232. In step S231, for example, the replenishment preparation unit 115 adjusts the pressure in the replenishment unit 250 and the pressure in the liquid feeding unit 210 in a state where the first switching valve 236 and the second switching valve 238 are closed, so that the replenishing unit 250 The pressure difference between the inside and the inside of the liquid feeding part 210 is reduced. The replenishment control unit 116 controls the pump drive unit 272 based on the measurement value of the pressure measurement unit 274 in order to adjust the pressure in the replenishment unit 250 as shown in FIG. 28( a ), for example. In addition, the replenishment control unit 116 controls the pump drive unit 222 based on the measurement value of the pressure measurement unit 224 in order to adjust the pressure in the liquid feeding unit 210.

In one example, the replenishment preparation unit 115 controls the pump drive unit 272 so that the pressure in the replenishment unit 250 approaches the first set value Pr1 from the standby pressure Ps1, and controls the pump drive unit 222 so that the pressure in the liquid delivery unit 210 changes from The standby pressure Ps2 is close to the second set value Pr2. The replenishment preparation unit 115 repeats the processes of steps S231 and S232 until the pressure in the replenishment unit 250 reaches the first set value Pr1 and the pressure in the liquid feeding unit 210 reaches the second set value Pr2. By the execution of steps S231 and S232, the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 250 and the liquid supply unit 210 with the first switching valve 236 and the second switching valve 238 closed.

Next, the control device 100 executes step S233. In step S233, for example, the supplement preparation unit 115 switches the second switching valve 238 from the closed state to the open state while maintaining the first switching valve 236, the output valve 218, and the discharge valve 72 in the closed state.

Next, the control device 100 executes steps S234 and S235 in order. In step S234, for example, the replenishment preparation section 115 adjusts the pressure in the first connection section 230 (the pressure of the pump 266) and the liquid delivery section 210 in a state where the second switching valve 238 is opened and the first switching valve 236 is closed. The internal pressure reduces the pressure difference between the first connecting portion 230 (between the pump 266 and the first switching valve 236) and the liquid feeding portion 210. For example, as shown in FIG. 28( b ), the supplementary control unit 116 controls the pump driving unit 272 based on the measurement value of the pressure measurement unit 274 in order to adjust the pressure in the first connection unit 230. In addition, the replenishment control unit 116 controls the pump driving unit 222 to maintain the pressure in the liquid feeding unit 210 at the value adjusted by the execution of steps S231 and S232.

In one example, the replenishment preparation unit 115 controls the pump drive unit 272 so that the pressure between the pump 266 and the first switching valve 236 of the replenishment unit 250 approaches the first set value Pr1. The replenishment preparation unit 115 repeats the processing of steps S234 and S235 until the pressure between the replenishment unit 250 and the first switching valve 236 reaches the first set value Pr1. By executing steps S234 and S235, the replenishment preparation unit 115 reduces the pressure difference between the first connecting portion 230 and the liquid feeding portion 210 in a state where the second switching valve 238 is opened and the first switching valve 236 is closed.

Next, the control device 100 executes step S236. In step S236, for example, the replenishment preparation unit 115 switches the first switching valve 236 from the closed state to the open state when the second switching valve 238 is opened and the output valve 218 and the discharge valve 72 are maintained in the closed state. . Thereby, a flow of the processing liquid flowing from the pump 266 of the liquid feeding unit 210 to the pump 216 of the liquid feeding unit 210 through the filter 234 is generated. According to the above, the replenishment preparation unit 115 ends the replenishment preparation process.

FIG. 29 is a flowchart showing an example of the supplementary control process in step S204. As shown in FIG. 29, the control device 100 first executes steps S241 and S242. In step S241, for example, the replenishment control unit 116 adjusts the replenishment pressure of the processing liquid sent from the pressure delivery unit 256 (pump 266) of the replenishment unit 250 to the pressure delivery unit 214 (pump 216) of the liquid delivery unit 210, and this Replenishment flow rate of treatment liquid. In one example, the replenishment control unit 116, similar to the adjustment of the replenishment pressure and the replenishment flow rate in the first embodiment, controls any one of the pressure feeding portion 256 and the pressure feeding portion 214 so that the replenishing pressure follows the target value, and at the same time, The other of the pressure feeding part 256 and the pressure feeding part 214 is controlled to make the supplementary flow rate follow the target value.

The replenishment control unit 116 repeats the processing of steps S241 and S242 from the execution of step S241 until a predetermined time has elapsed. The predetermined time is set in advance so that the replenishment of the processing liquid to the liquid feeding unit 210 (pump 216) is completed within that time, and is stored in the operation command holding unit 102.

Next, the control device 100 executes step S243. In step S243, the replenishment control unit 116 switches the first switching valve 236 and the second switching valve 238 from the open state to the closed state while maintaining the output valve 218 and the discharge valve 72 in the closed state. Thereby, the flow of the processing liquid from the pump 266 of the replenishing unit 250 to the pump 216 of the liquid sending unit 210 is stopped.

Next, the control device 100 executes step S244. In step S244, for example, the control device 100 adjusts the pressure in the pump 266 of the replenishing unit 250 and the pressure in the pump 216 of the liquid feeding unit 210, respectively. In one example, the control device 100 controls the pump driving unit 272 based on the measurement value of the pressure measuring unit 274 to adjust the pressure in the pump 266 (the pressure in the replenishing unit 250) to the standby pressure Ps1. The control device 100 controls the pump driving unit 222 based on the measurement value of the pressure measuring unit 224 to adjust the pressure in the pump 216 (the pressure in the liquid feeding unit 210) to the standby pressure Ps2. Based on the above, the replenishment control unit 116 ends the replenishment process.

[Effects of the third embodiment] In the coating and developing device 2 and the liquid treatment process of the third embodiment described above, similar to the first and second embodiments, the pressure in the replenishing part 250 and the liquid feeding part 210 is also determined. After the difference is reduced, the first switching valve 236 is opened. Therefore, when the first switching valve 236 is opened, it is possible to suppress the occurrence of the process liquid chase phenomenon in the flow path for replenishing the process liquid from the replenishing part 250 to the liquid feeding part 210. Therefore, it is effective for reducing the particles in the processing liquid ejected to the wafer W.

In the third embodiment described above, the filter 234 is provided in the first connecting portion 230. The first switching valve 236 opens or closes the filter 234 and the liquid feeding unit 210. When the first switching valve 236 is opened, a flow of the processing liquid that passes through the filter 234 and flows to the liquid feeder 210 is generated. If the first switching valve 236 is opened in a state where the pressure difference between the replenishing part 250 and the liquid feeding part 210 is large, the first connecting part 230 that connects the replenishing part 250 and the liquid feeding part 210 may occur from The filter 234 generates a chasing phenomenon of the treatment liquid at the level of particulates. On the other hand, in the above-mentioned structure, the first switching valve 236 is opened after the pressure difference between the replenishing part 250 and the liquid feeding part 210 is reduced. Therefore, it is effective in suppressing the occurrence of particles due to the chasing phenomenon of the processing liquid in the first connecting portion 230.

In the third embodiment described above, the first connection part 230 has a second switching valve 238 for opening or closing the replenishment part 250 and the filter 234. The replenishment preparation unit 115 executes sequentially: an action of reducing the pressure difference between the replenishing unit 250 and the liquid feeding unit 210 when the first switching valve 236 and the second switching valve 238 are closed; and the second switching valve When the 238 is opened and the first switching valve 236 is closed, the pressure difference between the first connecting portion 230 and the liquid feeding portion 210 is reduced. At this time, compared to the state in which the first switching valve 236 and the second switching valve 238 are switched to the open state at approximately the same timing, the pressure upstream of the first switching valve 236 can be set to match the pressure of the first switching valve 236. The pressure difference in the downstream is reduced with higher accuracy. Therefore, it is more effective to suppress the occurrence of particles due to the chasing phenomenon of the processing liquid in the first connecting portion 230. In addition, the piping volume in the replenishing section 250 tends to be larger than the piping volume of the processing liquid in the liquid feeding section 210. In the above configuration, by sequentially opening the switching valve located on the upstream side of the larger pipe volume, the adjustment of the pressure difference between the replenishing part 250 and the liquid feeding part 210 becomes easier.

(Variation example) In the replenishment preparation process of step S203, in the above example, the pressure in the liquid feeding part 210 and the pressure in the replenishment part 250 are respectively changed. However, the replenishment preparation part 115 can also change the pressure of either one of them to make The pressure difference between the liquid feeding unit 210 and the replenishing unit 250 is reduced. For example, the replenishment preparation unit 115 may change the pressure in the replenishing unit 250 without changing the pressure in the liquid feeding unit 210 when the first switching valve 236 and the second switching valve 238 are closed, so that the replenishing unit 250 The pressure difference between the inside and the inside of the liquid feeding part 210 is reduced. Then, the replenishment preparation part 115 may change the pressure in the first connecting part 230 without changing the pressure in the liquid feeding part 210 when the second switching valve 238 is opened and the first switching valve 236 is closed. The pressure difference between the first connecting portion 230 and the liquid feeding portion 210 is reduced.

The replenishment preparation part 115 may also change the pressure in the liquid feeding part 210 without changing the pressure in the replenishing part 250 when the first switching valve 236 and the second switching valve 238 are closed, so that the pressure in the replenishing part 250 and The pressure difference in the liquid feeding unit 210 is reduced. Then, the replenishment preparation unit 115 may also change the pressure in the liquid feeding unit 210 without changing the pressure in the replenishing unit 250 when the second switching valve 238 is opened and the first switching valve 236 is closed, so that the first The pressure difference between the connecting portion 230 and the liquid feeding portion 210 is reduced.

In the above example, although the open and closed states are switched in the order of the second switching valve 238 and the first switching valve 236, the supplementary preparation unit 115 may switch the first switching valve 236 to the open state and then switch the second switching valve 236 to the open state. The switching valve 238 is switched to the open state. Specifically, the replenishment preparation unit 115 may reduce the pressure difference between the replenishment unit 250 and the liquid feeding unit 210 with the first switching valve 236 and the second switching valve 238 closed, and then switch the first switch The valve 236 is switched to the open state. Then, the replenishment preparation unit 115 may also set the inside of the liquid feeding section 210 (more specifically, the inside of the liquid feeding section 210 and the inside of the liquid feeding section 210) in a state where the first switching valve 236 is open and the second switching valve 238 (switching valve) is closed. The pressure difference between the first connecting portion 230 downstream of the second switching valve 238 and the replenishing portion 250 is reduced. After that, the replenishment preparation unit 115 may switch the second switching valve 238 to the open state in order to open the connection between the replenishment unit 250 and the liquid feeding unit 210.

The first connection part 230 may not have the second switching valve 238. At this time, the replenishment preparation unit 115 may also make the replenishment unit 250 in the state where the first switching valve 236 is closed (more specifically, the replenishment unit 250 and the first connection portion 230 are more than the first switch The pressure difference between the valve 236 and the liquid feeding unit 210 is reduced. The first connection part 230 may not have the first switching valve 236. At this time, the replenishment preparation unit 115 can also set the inside of the liquid feeding unit 210 (more specifically, the inside of the liquid feeding unit 210 and the first connecting portion 230) with the second switching valve 238 (switching valve) closed. In the region downstream of the second switching valve 238) and the pressure difference in the replenishing part 250, the pressure difference is reduced.

In addition, the above-mentioned specific examples include the following structures. (Note 1) A substrate processing apparatus is characterized by comprising: a jetting part having a nozzle for jetting a processing liquid to a substrate; a liquid feeding part for sending the processing liquid to the jetting part; a replenishing part for supplementing the liquid feeding part to send the liquid to the jetting part; The treatment liquid in the ejection part; the connection part, which has a switching valve that opens or closes the replenishment part and the liquid feeding part; the filter, which replenishes the foreign matter contained in the treatment liquid of the liquid feeding part from the replenishment part The replenishment preparation section opens the switching valve after reducing the pressure difference between the replenishment section and the liquid feeding section; and the replenishment control section starts from the switching valve in a state where the replenishment preparation section opens the switching valve The replenishing part replenishes the processing liquid to the liquid feeding part; the filter is arranged in the liquid feeding part; the replenishing preparation part changes the pressure in the replenishing part when the switching valve is closed to make the replenishing part The pressure difference with the inside of the liquid feeding part is reduced. (Note 2) The substrate processing apparatus according to Note 1, wherein the liquid feeding section further includes: a liquid feeding pipe connecting the replenishing section and the ejection section via the filter; and a pressure feeding section for ejection from the liquid feeding pipe The replenishing part receives the treatment liquid, and sends the treatment liquid to the ejection part through the liquid feeding pipe; and a valve is connected to open or block the liquid feeding pipe and the pressure feeding part for ejection; the replenishing part, Contains: a liquid source; and a replenishing pressure feeding part from the liquid source to send the processing liquid to the liquid feeding part; the replenishing control part controlling any one of the replenishing pressure feeding part and the ejection pressure feeding part , So that the replenishment pressure from the replenishment pressure feed part to the ejection pressure feed part follows the target value, and the replenishment pressure feed part and the other of the ejection pressure feed part are controlled so that the pressure from the replenishment pressure feeder The replenishment flow rate from the delivery unit to the pressure delivery unit for ejection follows the target value. (Note 3) The substrate processing apparatus according to Note 2, which further includes: a discharge control unit that controls the discharge pressure feed unit so that the discharge pressure of the processing liquid sent to the nozzle follows the target value; the supplementary control unit, In the control to make the supplementary pressure follow the target value, the target value of the supplementary pressure is set as the target value of the discharge pressure until the supplement of the treatment liquid is completed. (Note 4) The substrate processing apparatus as described in Note 2, which further includes: a discharge control unit that controls the discharge pressure feed unit so that the discharge pressure of the processing liquid sent to the nozzle follows the target value; the supplementary control unit In the control to make the supplementary pressure follow the target value, the target value of the supplementary pressure is gradually approached to the target value of the discharge pressure until the supplement of the treatment liquid is completed. (Note 5) The substrate processing apparatus as described in Note 1 or 2, which further includes: an ejection valve for opening or closing the liquid-feeding section and the ejection section; and the ejection preparation section for changing the pressure in the liquid-feeding section to make the After the pressure difference between the liquid feeding section and the ejection section is reduced, the ejection valve is opened; and the ejection control section starts to eject the processing liquid from the nozzle to the substrate while the ejection valve is opened by the ejection preparation section . (Note 6) The substrate processing apparatus according to Note 1, wherein the liquid feeding section further includes: a liquid feeding pipe connecting the replenishing section and the ejection section via the filter; and a pressure feeding section for ejection from the liquid feeding pipe The replenishing part receives the treatment liquid, and sends the treatment liquid to the ejection part through the liquid supply pipe; and connects a valve to open or block the liquid supply pipe and the pressure delivery part for ejection; the switch valve, It opens and closes at a rate of change of the opening degree smaller than that of the connecting valve. (Note 7) The substrate processing apparatus as described in Note 1, which further includes: a discharge valve to open or close the liquid feeding part and the discharge part; the liquid feeding part further comprises: a liquid feeding pipe through which the filter is interposed Connect the replenishment part and the ejection part; a pressure feed part for ejection, receive the treatment liquid from the replenishment part through the liquid feed pipe, and send the treatment liquid to the ejection part through the liquid feed pipe; connect a valve to make the The liquid feeding tube is opened or closed between the pressure feeding part for ejection; and a pressure measuring section that measures the pressure between the filter and the pressure feeding section for ejection; the replenishing section includes: a liquid source; and a pressure for replenishing The feeding part sends the treatment liquid from the liquid source to the liquid feeding part; the replenishment preparation part sequentially performs the following actions: when the switching valve is closed, the replenishing pressure feeding part is controlled to make the replenishment The pressure difference between the inner part and the liquid feeding part is reduced; when the switching valve is opened and the ejection valve and the connecting valve are closed, the replenishing pressure feeding part is controlled based on the measurement value of the pressure measuring part to make the replenishment The pressure between the pressure-feeding part and the pressure-feeding part for ejection is close to the set value; and in the state where the switching valve and the ejection valve are closed and the connecting valve is open, the ejection is controlled based on the measurement value of the pressure measuring section Use a pressure feeder to make the pressure in the liquid feeder close to the set value.

1: Substrate processing system 2: Coating and developing device 3: Exposure device 4: Mounting block 5: Processing block 6: Interface block 11~14: Processing module 20: Rotation holding part 21: Holding part 22: Drive 29, 29A: Treatment liquid supply part 30: Spitting Department 31: Nozzle 32: Liquid delivery pipe 50: Supplementary Department 51: Liquid Source 53: Pressure Delivery Department 54: Pressure measurement department 55: Send out the tube 56: Pump 57: Pump drive 60: Liquid delivery department 61: Liquid delivery pipe 62a, 62b: branch pipe 63: filter 64: Pressure Delivery Department 65: Flow measurement department 66: Pressure measurement department 67: The first connecting valve 68: The second connecting valve 69: Pressure measurement department 71: Switching valve 72: Spit valve 76: Pump 77: Pump drive 80: The first connection 90: 2nd connection part 100: control device 101: Process liquid supply control unit 102: Operation command holding part 103: The first pressure acquisition part 104: The second pressure acquisition part 105: Flow Acquisition Department 106: Hydraulic acquisition department 111: Spit Preparation Department 112: Ejection Control Department 113: Return Preparation Department 114: loopback control department 115: Supplementary Preparation Department 116: Supplementary Control Department 120: Circuit 121: processor 122: memory 123: Storage 124: input and output port 125: timer 210: Liquid Delivery Department 212: Liquid delivery pipe 214: Pressure Delivery Department 216: Pump 218: output valve 222: Pump Drive 224: Pressure Measurement Department 230: The first connection 232: connecting pipe 234: filter 236: The first switching valve 238: 2nd switching valve 250: Supplementary Department 252: Liquid Source 254: storage tank 256: Pressure Delivery Department 262: Liquid Delivery Pipe 266: Pump 272: Pump Drive 274: Pressure Measurement Department A1~A8: Transport device C: carrier P: Pump U1: Liquid handling unit U10, U11: shed unit U2: Heat treatment unit S01~S06,S11~S14,S21~S23,S31~S38,S41~S43,S51~S58,S61~S64,S151~S157,S161~S164,S201~S204,S211~S214,S221~S224,S231~ S236, S241~S244: steps W: Wafer Wa: surface

[Fig. 1] A schematic diagram showing an example of a schematic structure of a substrate processing system. Fig. 2 is a schematic diagram showing an example of the internal structure of the coating and developing device. [Fig. 3] A schematic diagram showing an example of the structure of a liquid processing unit. Fig. 4 is a schematic diagram showing an example of a processing liquid supply unit. Fig. 5 is a block diagram showing an example of the functional structure of the control device. Fig. 6 is a block diagram showing an example of the structure on the hardware of the control device. Fig. 7 is a flowchart showing an example of a liquid treatment process. [FIG. 8] (a) is a flowchart which shows an example of a discharge preparation process. (B) is a flowchart showing an example of the ejection control process. [FIG. 9] (a) is a schematic diagram for demonstrating an example of a discharge preparation process. (B) is a schematic diagram for explaining an example of the ejection control process. [Fig. 10] is a flowchart showing an example of a return preparation process. Fig. 11 is a flowchart showing an example of a loopback control process. [Fig. 12] is a flowchart showing an example of the replenishment preparation process. [Fig. 13] is a flowchart showing an example of a supplementary control process. [Fig. 14] (a) to (c) are schematic diagrams for explaining an example of the supplementary preparation process. (D) is a schematic diagram for explaining an example of the supplementary control process. [Fig. 15] (a) and (b) are diagrams showing an example of the measurement result of the number of fine particles contained in the treatment liquid after ejection. [FIG. 16] (a) and (b) are diagrams showing an example of the temporal variation of hydraulic pressure. [FIG. 17] (a) is a schematic diagram for demonstrating another example of a discharge preparation process. (B) is a schematic diagram for explaining another example of the ejection control process. [Fig. 18] (a) and (b) are diagrams for explaining another example of the adjustment method of the supplementary pressure. [Fig. 19] is a flowchart showing an example of the supplementary preparation process of the second embodiment. [Fig. 20] is a flowchart showing an example of a supplementary control process. [FIG. 21] (a) and (b) are schematic diagrams for explaining an example of a supplementary preparation process. (C) is a schematic diagram for explaining an example of a supplementary control process. [Fig. 22] A graph showing the measurement result of the number of fine particles contained in the treatment liquid. [FIG. 23] (a) and (b) are diagrams which show an example of the time variation of hydraulic pressure. [Fig. 24] A schematic diagram showing an example of a processing liquid supply part of the third embodiment. [Fig. 25] is a flowchart showing an example of a liquid treatment process. [Fig. 26] (a) is a flowchart showing an example of a discharge preparation process. (B) is a flowchart showing an example of the ejection control process. [Fig. 27] is a flowchart showing an example of a replenishment preparation process. [FIG. 28] (a) and (b) are schematic diagrams for explaining an example of a supplementary preparation process. [Fig. 29] is a flowchart showing an example of a supplementary control process.

29: Treatment liquid supply part

30: Spitting Department

31: Nozzle

32: Liquid delivery pipe

50: Supplementary Department

51: Liquid Source

53: Pressure Delivery Department

54: Pressure measurement department

55: Send out the tube

56: Pump

57: Pump drive

60: Liquid delivery department

61: Liquid delivery pipe

62a, 62b: branch pipe

63: filter

64: Pressure Delivery Department

65: Flow measurement department

66: Pressure measurement department

67: The first connecting valve

68: The second connecting valve

69: Pressure measurement department

71: Switching valve

72: Spit valve

76: Pump

77: Pump drive

80: The first connection

90: 2nd connection part

100: control device

Claims (12)

A substrate processing device, including: The ejection part has a nozzle that ejects the processing liquid to the substrate; The liquid delivery unit sends the treatment liquid to the ejection unit; A replenishment part, which supplements the liquid delivery part with the treatment liquid used to deliver the ejection part; The connecting part has a switching valve for opening or closing the replenishment part and the liquid feeding part; A filter to remove foreign matter contained in the processing liquid supplemented by the replenishing part to the liquid feeding part; The replenishment preparation part opens the switching valve after reducing the pressure difference between the replenishment part and the liquid feeding part; and The replenishment control unit starts to replenish the processing liquid from the replenishment unit to the liquid feeding unit in a state where the switching valve is opened by the replenishment preparation unit. Such as the substrate processing apparatus of claim 1, wherein: The filter is installed in the liquid feeding part. Such as the substrate processing apparatus of claim 2, wherein, The replenishment preparation section changes the pressure in the liquid feeding section with the switching valve closed to reduce the pressure difference between the replenishing section and the liquid feeding section. Such as the substrate processing apparatus of claim 2 or 3, wherein, The liquid delivery unit further includes: The liquid feeding pipe is connected to the replenishment part and the spouting part through the filter; A pressure feed unit for ejection, receiving the treatment liquid from the replenishing section via the liquid feed tube, and sends the treatment liquid to the ejection unit via the liquid feed tube; and Connect a valve to open or block the liquid feeding pipe and the pressure feeding part for ejection; The supplementary department includes: Liquid source; and The replenishment pressure feeder sends the treatment liquid from the liquid source to the liquid feeder; The supplementary control department, Control any one of the pressure-feeding part for supplementation and the pressure-feeding part for ejection so that the supplementary pressure from the pressure-feeding part for supplementation to the pressure-feeding part for ejection follows the target value, And the other of the pressure-feeding part for replenishment and the pressure-feeding part for ejection is controlled so that the replenishment flow rate from the pressure-feeding part for supplementation to the pressure-feeding part for ejection follows a target value. Such as the substrate processing apparatus of claim 4, wherein: It further includes: a jetting control unit, which controls the jetting pressure feed unit so that the jetting pressure of the treatment liquid sent to the nozzle follows the target value; The replenishment control unit makes the target value of the replenishment pressure gradually approach the target value of the ejection pressure in the control to make the replenishment pressure follow the target value, until the replenishment of the treatment liquid is completed. Such as the substrate processing apparatus of claim 2 or 3, wherein, The liquid delivery unit further includes: The liquid feeding pipe is connected to the replenishment part and the spouting part through the filter; A pressure feed unit for ejection, receiving the treatment liquid from the replenishing section via the liquid feed tube, and sends the treatment liquid to the ejection unit via the liquid feed tube; and Connect a valve to open or block the liquid feeding pipe and the pressure feeding part for ejection; The switching valve opens and closes at a rate of change of the opening degree smaller than that of the connection valve. Such as the substrate processing apparatus of claim 3, wherein: It further includes: a spray valve to open or block the liquid feeding part and the spray part; The liquid delivery unit further includes: The liquid feeding pipe is connected to the replenishment part and the spouting part through the filter; A pressure feeding part for ejection, receiving the treatment liquid from the replenishing part via the liquid feeding tube, and sending the treatment liquid to the ejection part via the liquid feeding tube; Connect a valve to open or block the liquid feeding pipe and the pressure feeding part for ejection; and The pressure measuring part measures the pressure between the filter and the pressure feeding part for ejection; The supplementary department includes: Liquid source; and The replenishment pressure feeder sends the treatment liquid from the liquid source to the liquid feeder; The supplementary preparation department performs the following actions in order: In a state where the switching valve and the ejection valve are closed and the connection valve is open, based on the measurement value of the pressure measuring section, controlling the ejection pressure feeder so that the pressure in the liquid feeder approaches the set value; and In a state where the switching valve is opened and the ejection valve and the connection valve are closed, the replenishing pressure feeding portion is controlled based on the measurement value of the pressure measuring portion so that the replenishing pressure feeding portion and the ejection pressure feeding portion The pressure between is close to the set value. Such as the substrate processing apparatus of any one of claims 1 to 3, wherein: It also contains: Ejection valve to open or block the liquid feeding part and the ejection part; The ejection preparation section opens the ejection valve after changing the pressure in the liquid feeding section to reduce the pressure difference between the liquid feeding section and the ejection section; and The ejection control section starts ejecting the processing liquid from the nozzle to the substrate in a state where the ejection valve is opened by the ejection preparation section. Such as the substrate processing apparatus of claim 1, wherein: The filter is arranged in the connecting part; The switching valve makes the filter and the liquid feeding part open or close. Such as the substrate processing apparatus of claim 9, wherein: The connecting part further includes: a second switching valve for opening or blocking the supplementary part and the filter; The supplementary preparation department performs the following actions in order: When the switching valve and the second switching valve are closed, the pressure difference between the replenishing part and the liquid feeding part is reduced; and In a state where the second switching valve is opened and the switching valve is closed, the pressure difference between the connecting portion and the liquid feeding portion is reduced. A control method, which is a control method of a substrate processing device, The substrate processing apparatus includes: an ejection section having a nozzle for ejecting a processing liquid to a substrate; a liquid feeding section for sending the processing liquid to the ejection section; a replenishing section for replenishing the liquid feeding section for the ejection section Treatment liquid; a connection part having a switching valve for opening or closing between the replenishing part and the liquid feeding part; and a filter that removes foreign matter contained in the treatment liquid that is replenished from the replenishing part to the liquid feeding part; The control method is characterized by including the following steps: After reducing the pressure difference between the replenishing part and the liquid feeding part, open the switching valve; and In the state where the switching valve is opened, the processing liquid is started to be replenished from the replenishing section to the liquid feeding section. A computer-readable recording medium, which is characterized by: The record is used to make the device implement the control method described in claim 11.

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