TW202308759A - Processing liquid supply apparatus, liquid replacement method, and storage medium - Google Patents

Abstract

The invention provides a processing liquid supply apparatus, a liquid replacement method, and a storage medium capable of properly replacing a liquid in a flow path of a diaphragm pump with another fluid. The processing liquid supply device is capable of supplying a processing liquid from a processing liquid supply source (50) to an object to be processed via a processing liquid flow path and a nozzle (41), and is provided with: an auxiliary pump (62) as a diaphragm pump provided in the processing liquid flow path; a gas supply unit for supplying a gas into the processing liquid flow path; and a control device (100) as a control unit for controlling the operation of the diaphragm pump and the gas supply unit. When liquid in the auxiliary pump (62) is replaced by gas, the control device (100) can cause the processing liquid supply device to execute: a step in which a membrane part (622a) of the auxiliary pump (62) is brought into a contracted state compared to an expanded state; and a step for supplying gas into the auxiliary pump (62) by means of the gas supply unit while maintaining the contracted state of the film unit (622a).

Description

Treatment liquid supply device, liquid replacement method, and memory medium

The disclosure relates to a processing liquid supply device, a liquid replacement method, and a storage medium.

Patent Document 1 discloses a configuration in which a cleaning solution is supplied to a flow path provided with a diaphragm pump to clean the flow path. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2016-87546

[Problem to be Solved by the Invention]

The present disclosure provides a technology for properly performing replacement of the liquid in the flow path of the diaphragm pump with other fluid. [Means to solve the problem]

A processing liquid supply device according to an aspect of the present disclosure is a processing liquid supply device that supplies a processing liquid to an object to be processed from a processing liquid supply source through a processing liquid channel and a nozzle, and includes: a diaphragm pump installed on In the above-mentioned processing liquid flow path; a gas supply part, which supplies gas to the above-mentioned processing liquid flow path; and a control part, which controls the operation of the above-mentioned diaphragm pump and the above-mentioned gas supply part. When the liquid is contained in the liquid, the steps of making the diaphragm part of the diaphragm pump in the contracted state compared with the expanded state are carried out, and while maintaining the contracted state of the diaphragm part, the diaphragm pump is supplied by the gas supply part. The step of supplying the above-mentioned gas inside. [Effect of Invention]

According to the present disclosure, it is possible to provide a technology for properly replacing the liquid in the flow path of the diaphragm pump with other fluids. [Simple description of the diagram]

[ Fig. 1 ] is a schematic diagram showing an example of a schematic configuration of a substrate processing system. [FIG. 2] It is a schematic diagram which shows an example of the internal structure of a coating image development apparatus. [FIG. 3] It is a schematic diagram which shows an example of the structure of a liquid processing unit. [ Fig. 4 ] is a schematic diagram showing an example of a processing liquid supply unit. [ Fig. 5 ] is a block diagram showing an example of the hardware configuration of the control device. [FIG. 6] It is a flowchart which shows an example of the operation method at the time of replacing from liquid to gas. [FIG. 7(a)] and [FIG. 7(b)] are diagrams illustrating an example of the relationship between the shape of the diaphragm pump and the internal displacement state. [ Fig. 8 ] is a flowchart showing an example of an operation method when replacing the liquid with another liquid. [FIG. 9(a)] and [FIG. 9(b)] are diagrams illustrating an example of the relationship between the shape of the diaphragm pump and the internal displacement state.

Hereinafter, various exemplary implementation forms will be described.

In an exemplary embodiment, a treatment liquid supply device is provided. The processing liquid supply device is a processing liquid supply device that supplies the processing liquid to the object to be processed from the processing liquid supply source through the processing liquid flow path and the nozzle, and has a diaphragm pump, which is installed in the above-mentioned processing liquid flow path; the gas supply unit , which supplies gas to the above-mentioned processing liquid flow path; and a control part, which controls the operation of the above-mentioned diaphragm pump and the above-mentioned gas supply part, and the above-mentioned control part is when replacing the liquid in the above-mentioned diaphragm pump with gas. A step of contracting the diaphragm portion of the diaphragm pump from an expanded state, and a step of supplying the gas from the gas supply unit into the diaphragm pump while maintaining the contracted state of the diaphragm portion are carried out.

In the above-mentioned treatment liquid supply device, when the liquid in the diaphragm pump is discharged and replaced with gas, the diaphragm part of the diaphragm pump is in a contracted state compared with the expanded state, and while maintaining this state, the gas is supplied to the inside the diaphragm pump. With such a configuration, when replacing the liquid in the diaphragm pump with gas, it is possible to prevent the liquid from remaining in the pump. Therefore, the replacement of the liquid in the flow path of the diaphragm pump with gas is appropriately performed.

The control unit may supply the different type of liquid into the diaphragm pump while maintaining the expandable state of the diaphragm when replacing the liquid in the diaphragm pump with another type of liquid. With the above configuration, when the liquid in the diaphragm pump is replaced with another type of liquid, mixing of the liquid before replacement and the different type of liquid in the pump is promoted. Therefore, replacement of the liquid in the flow path of the diaphragm pump with another type of liquid is properly performed.

The control unit may control the shape of the diaphragm unit by controlling the pressure of the diaphragm unit pressurized by the pressurizing unit in the diaphragm pump. With the above configuration, it is possible to flexibly control the shape of the diaphragm portion by utilizing the pressurization by the pressurizing portion.

The control unit may maintain the diaphragm when the gas is supplied by the gas supply unit by increasing the pressure of the diaphragm unit pressurized by the pressurizing unit when the liquid in the diaphragm pump is discharged. The appearance of the state of contraction. With the above configuration, even when the flow rate of the gas supplied to the pump is increased, the contracted state of the diaphragm can be maintained, and the liquid in the flow path of the diaphragm pump can be replaced with gas appropriately.

The gas supply unit may be provided separately from a gas supply system used to supply the treatment liquid from the treatment liquid supply source to the treatment liquid flow path, and may be provided upstream of the diaphragm pump to supply the flow of the treatment liquid. The mode of supplying the above-mentioned gas in the road. By adopting the above configuration, replacement of the liquid in the diaphragm pump can be performed independently of the gas supply system around the processing liquid supply source. Furthermore, according to the above configuration, it is possible to prevent the operation of the gas supply part from affecting the gas supply system.

In another exemplary embodiment, a liquid displacement method is provided. The liquid replacement method is a liquid replacement method in a processing liquid supply device that supplies a processing liquid to an object to be processed from a processing liquid supply source through a processing liquid flow path and a nozzle. The processing liquid supply device includes: a diaphragm pump, which is installed in the above-mentioned processing liquid flow path; a gas supply part, which supplies an inert gas to the above-mentioned processing liquid flow path; and a control part, which controls the operation of the above-mentioned diaphragm pump and the above-mentioned gas supply part, including: When the liquid in the pump is replaced with gas, the control unit makes the diaphragm in the diaphragm pump shrink compared to the expanded state, and the control unit maintains the diaphragm. In the contracted state, the above-mentioned inert gas is supplied into the above-mentioned diaphragm pump by the above-mentioned gas supply part, and the above-mentioned liquid in the above-mentioned diaphragm pump is discharged accordingly.

In the above-mentioned liquid replacement method, when the liquid in the diaphragm pump is discharged to replace it with gas, the diaphragm part of the diaphragm pump is contracted from the expanded state, and the gas is supplied to the diaphragm while maintaining this state. inside the pump. With such a configuration, when replacing the liquid in the diaphragm pump with gas, it is possible to prevent the liquid from remaining in the pump. Therefore, the replacement of the liquid in the flow path of the diaphragm pump with gas is appropriately performed.

When replacing the liquid in the diaphragm pump with another type of liquid, the controller may further supply the different type of liquid into the diaphragm pump while maintaining the state where the diaphragm portion can be expanded. appearance. With the above configuration, when the liquid in the diaphragm pump is replaced with another type of liquid, mixing of the liquid before replacement and the different type of liquid in the pump is promoted. Therefore, replacement of the liquid in the flow path of the diaphragm pump with another type of liquid is properly performed.

The control of the shape of the diaphragm part may be performed by controlling the pressure of the diaphragm part pressurized by the pressurizing part in the diaphragm pump. With the above configuration, it is possible to flexibly control the shape of the diaphragm portion by utilizing the pressurization by the pressurizing portion.

When the liquid in the diaphragm pump is discharged, the pressure of the diaphragm part pressurized by the pressurizing part can be increased so that the contraction of the diaphragm part when the inert gas is supplied by the gas supply part can be maintained. The shape of the state. With the above configuration, even when the flow rate of the gas supplied to the pump is increased, the contracted state of the diaphragm can be maintained, and the liquid in the flow path of the diaphragm pump can be replaced with gas appropriately.

The gas supply unit may be provided separately from a gas supply system used to supply the treatment liquid from the treatment liquid supply source to the treatment liquid flow path, and may be provided upstream of the diaphragm pump to the treatment liquid flow path. A state in which an inert gas is supplied inside. By adopting the above configuration, replacement of the liquid in the diaphragm pump can be performed independently of the gas supply system around the processing liquid supply source. Furthermore, according to the above configuration, it is possible to prevent the operation of the gas supply part from affecting the gas supply system.

In an exemplary embodiment, a computer-readable memory medium storing a program for causing a device to perform the above-mentioned liquid replacement method is provided. The memory medium described above has the same effect as the liquid replacement method described above.

[Exemplary Implementation Type] Hereinafter, various exemplary embodiments will be described in detail with reference to the drawings. In addition, in each drawing, the same code|symbol is attached|subjected to the same or equivalent part.

[Substrate Processing System] First, a substrate processing system according to an embodiment will be described with reference to FIGS. 1 to 5 . The substrate processing system 1 shown in FIG. 1 is a system for forming a photosensitive coating, exposing the photosensitive coating, and developing the photosensitive coating on a substrate. The workpiece W (substrate) to be processed is, for example, a substrate for semiconductors. A silicon wafer is used as an example of a substrate. Even if the workpiece W is formed into a circular shape, it may be used. Furthermore, the workpiece W to be processed may be a glass substrate, a photomask substrate, or an FPD (Flat Panel Display). A part of the workpiece W may have a notch that is notched. The notch may be, for example, a groove (U-shaped, V-shaped, or the like), or may be a linear portion (so-called orientation flat) extending linearly. Furthermore, the photosensitive film is, for example, a photoresist film.

The substrate processing system 1 includes a coating and developing device 2 and an exposure device 3 . The exposure device 3 performs exposure processing of the photoresist film (photosensitive film) formed on the workpiece W (substrate). Specifically, energy rays are irradiated to the exposure target portion of the photoresist film by methods such as liquid immersion exposure. The coating and developing device 2 is used to form a photoresist film on the surface of the workpiece W (substrate) before the exposure treatment by the exposure device 3, and to develop the photoresist film after the exposure treatment.

[Substrate Processing Equipment] Hereinafter, the configuration of the coating and developing device 2 will be described as an example of a substrate processing device. As shown in FIGS. 1 and 2 , the coating and developing device 2 includes a carrier block 4 , a processing block 5 , an interface block 6 and a control device 100 .

The carrier block 4 carries out the introduction of the workpiece W into the coating and developing device 2 and the derivation of the workpiece W from the coating and developing device 2 . For example, the carrier block 4 is capable of supporting a plurality of carriers C for the workpiece W, and includes a transfer device A1 including a receiving arm. The carrier C accommodates, for example, a plurality of circular workpieces W. The transport device A1 takes out the workpiece W from the carrier C and delivers it to the processing block 5 , and receives the workpiece W from the processing block 5 and returns it to the carrier C.

The processing block 5 has a plurality of processing modules 11 , 12 , 13 , 14 . The processing modules 11, 12, 13, 14 are equipped with a liquid processing unit U1, a heat processing unit U2, and a transfer device A3 including a transfer arm for transferring the workpiece W to these units.

The processing module 11 forms an underlying film on the surface of the workpiece W through the liquid processing unit U1 and the heat processing unit U2. The liquid processing unit U1 of the processing module 11 coats the workpiece W with a processing liquid for forming an underlayer film. The heat treatment unit U2 of the processing module 11 performs various heat treatments accompanying the formation of the lower layer film.

The processing module 12 forms a photoresist film on the lower layer film through the liquid processing unit U1 and the heat processing unit U2. The liquid processing unit U1 of the processing module 12 coats the processing liquid for forming the photoresist film on the lower layer film. The heat treatment unit U2 of the processing module 12 performs various heat treatments accompanying the formation of the photoresist film.

The processing module 13 forms an upper film on the photoresist film through the liquid processing unit U1 and the heat processing unit U2. The liquid processing unit U1 of the processing module 13 coats the liquid for forming the upper layer film on the photoresist film. The heat treatment unit U2 of the processing module 13 performs various heat treatments accompanying the formation of the upper film.

The processing module 14 uses the liquid processing unit U1 and the thermal processing unit U2 to develop the exposed photoresist film. The liquid processing unit U1 is for coating the developing liquid on the surface of the exposed workpiece W. Furthermore, the liquid processing unit U1 uses a flushing liquid to flush the coated developing liquid. The heat treatment unit U2 performs various heat treatments accompanying the development process. Specific examples of heat treatment include heat treatment before image development (PEB: Post Exposure Bake), heat treatment after image development (PB: Post Bake), and the like.

On the side of the carrier block 4 in the processing block 5, a shelf unit U10 is arranged. The shelf unit U10 is divided into a plurality of units arranged in the vertical direction. A conveying device A7 including a lifting arm is provided near the shelf unit U10. The transfer device A7 raises and lowers the workpiece W between the rack units U10.

On the side of the interface block 6 in the processing block 5, a shelving unit U11 is arranged. The shelf unit U11 is divided into a plurality of units arranged in the vertical direction.

The interface block 6 transmits and receives the workpiece W to and from the exposure device 3 . For example, the interface block 6 incorporates a transfer device A8 including a receiving and receiving arm, and is connected to the exposure device 3 . The transfer device A8 transfers the workpiece W placed on the shelf unit U11 to the exposure device 3 . The transport device A8 receives the workpiece W from the exposure device 3 and returns it to the rack unit U11.

The control device 100 controls the coating and developing device 2 so as to execute coating and developing processing in the following procedure, for example. First, the control device 100 controls the transfer device A1 to transfer the workpiece W in the carrier C to the shelf unit U10, and controls the transfer device A7 to arrange the workpiece W in the unit for the processing module 11.

Next, the control device 100 controls the transfer device A3 in such a manner as to transfer the workpiece W of the rack unit U10 to the liquid processing unit U1 and the heat processing unit U2 in the processing module 11 . Furthermore, the control device 100 controls the liquid processing unit U1 and the heat processing unit U2 so that an underlayer film is formed on the surface of the workpiece W. Afterwards, the control device 100 controls the transfer device A3 to return the workpiece W formed with the lower layer film to the rack unit U10, and controls the transfer device A7 to arrange the workpiece W in the unit for the processing module 12. .

Then, the control device 100 controls the transfer device A3 in such a manner as to transfer the workpiece W of the rack unit U10 to the liquid processing unit U1 and the heat processing unit U2 in the processing module 12 . Moreover, the control device 100 controls the liquid processing unit U1 and the heat processing unit U2 in such a manner that a photoresist film is formed on the lower layer film of the workpiece W. Afterwards, the control device 100 controls the transfer device A3 to return the workpiece W to the shelf unit U10, and controls the transfer device A7 to arrange the workpiece W in the unit for the processing module 13.

Next, the control device 100 controls the transfer device A3 in such a manner as to transfer the workpiece W of the shelf unit U10 to each unit in the processing module 13 . Moreover, the control device 100 controls the liquid processing unit U1 and the heat processing unit U2 in such a manner that an upper layer film is formed on the photoresist film of the workpiece W. Thereafter, the control device 100 controls the transfer device A3 so as to transfer the workpiece W to the shelf unit U11.

Next, the control device 100 controls the transfer device A8 so as to send the workpiece W of the rack unit U11 to the exposure device 3 . Afterwards, the control device 100 controls the transfer device A8 in such a manner that the workpiece W subjected to exposure processing is received from the exposure device 3 and arranged in the rack unit U11 as a unit for the processing module 14,

Next, the control device 100 controls the conveying device A3 in a manner of conveying the workpiece W of the rack unit U11 to each unit in the processing module 14, and controls the liquid in a manner of applying a development process to the photoresist film of the workpiece W. Processing unit U1 and heat processing unit U2. Afterwards, the control device 100 controls the transport device A3 to return the workpiece W to the shelf unit U10, and controls the transport device A7 and the transport device A1 to return the workpiece W to the carrier C. As above, the coating and developing process is completed.

In addition, the specific structure of a substrate processing apparatus is not limited to the structure of the coating image development apparatus 2 illustrated above. As long as the substrate processing apparatus includes a liquid processing unit that discharges a processing liquid on the workpiece W to perform liquid processing, and a control device capable of controlling this, any of them may be used.

(liquid handling unit) Next, an example of the liquid processing unit U1 in the processing module 12 will be described in detail with reference to FIGS. 3 and 4 . The liquid processing unit U1 includes a rotation holding unit 20 and a processing liquid supply unit 30 . The liquid processing unit U1 and the control device 100 (control unit) for controlling the liquid processing unit U1 have a configuration corresponding to the processing liquid supply device in this embodiment.

The rotation holding unit 20 holds and rotates the workpiece W according to an operation instruction from the control device 100 . The rotation holding part 20 has a holding part 21 and a driving part 22 . The holding part 21 supports the center part of the horizontally arranged workpiece W with the surface Wa directed upward, and holds the workpiece W by suction (for example, vacuum suction). The drive unit 22 is a rotary actuator including a power source such as an electric motor, and rotates the holding unit 21 around a vertical rotation axis. Accordingly, the workpiece W rotates around the vertical rotation axis.

The processing liquid supply unit 30 supplies the processing liquid to the workpiece W rotatably held by the rotation holding unit 20 . As shown in FIGS. 3 and 4 , the processing liquid supply unit 30 includes a discharge unit 40 , a processing liquid supply source 50 , and a liquid delivery system 60 . The liquid delivery system 60 is constituted by including a flow path for supplying the treatment liquid, a pump for liquid delivery in the flow path, a valve body, and the like. Furthermore, the liquid feeding system 60 is also configured including a gas supply system 80 for supplying an inert gas that can be used for liquid feeding adjustment and the like.

The discharge unit 40 discharges the processing liquid toward the surface Wa of the workpiece W. As shown in FIG. The discharge unit 40 includes a nozzle 41 and a liquid delivery tube 42 . The nozzle 41 discharges the processing liquid on the workpiece W. As shown in FIG. As shown in FIG. 3 , the nozzle 41 is arranged, for example, above the workpiece W, and discharges the processing liquid downward. The liquid delivery pipe 42 guides the treatment liquid to the nozzle 41 . By discharging the processing liquid toward the workpiece W from the nozzle 41 , the processing liquid is applied (supplied) to the workpiece W. As shown in FIG.

As shown in FIG. 4 , the treatment liquid can be supplied from a treatment liquid supply source 50 . The processing liquid supply source 50 is a liquid tank storing the processing liquid, and is detachable from the liquid feeding system 60 . In addition, when cleaning the liquid supply system 60 , instead of the processing liquid supply source 50 , a cleaning liquid supply source storing a cleaning liquid can be provided at the same position.

The processing liquid supply source 50 is connected to a gas supply source 81 that supplies an inert gas such as nitrogen (N ₂ ) through a gas supply path R81 provided with a valve body V81. The gas supply source 81 and the gas supply path R81 constitute a pressurizing mechanism that pressurizes the liquid surface in the processing liquid supply source 50 to move the processing liquid from the processing liquid supply source 50 . In addition, a path for exhausting inert gas may be separately provided in the gas supply path R81. The gas supply source 81 and the gas supply path R81 are part of the gas supply system 80 . In addition, the gas supply source 81 and the gas supply path R81 function as a gas supply system for moving the processing liquid from the processing liquid supply source 50 (or a supply source connected instead) to the downstream channel L.

In the flow path L1 connected to the processing liquid supply source 50, as the liquid delivery system 60, a valve body V1, an intermediate tank 61, an auxiliary pump 62, a pumping flow path system 70, and a distribution valve (liquid supply system 60) are arranged in sequence from the upstream side. Discharge valve) V2 and valve body V3. The dispensing valve V2 has a function of discharging the processing liquid of a predetermined liquid amount.

The intermediate tank 61 is connected to a gas supply source 82 for supplying an inert gas such as nitrogen (N ₂ ) via a gas supply path R82 provided with a valve body V82 connected to the upstream flow path L1. Furthermore, even the auxiliary pump 62 is connected to the gas supply source 82 via the gas supply path R83 provided with the valve body V83 connected to the upstream flow path L1. These gas supply sources 82 and gas supply paths R82 and R83 are used to replace the liquid in the liquid delivery system 60 including the intermediate tank 61 and the auxiliary pump 62 with gas. This point will be described later. The gas supply source 82 and the gas supply paths R82 and R83 are part of the gas supply system 80 . Furthermore, the gas supply source 82 and the gas supply paths R82 and R83 function as a gas supply unit that discharges the liquid in the auxiliary pump 62 and replaces it with gas. In this regard, the functions of the gas supply source 82 and the gas supply paths R82 and R83 are different from those of the gas supply source 81 and the gas supply path R81.

The intermediate tank 61 stores the processing liquid in the processing liquid supply source 50, sucks it in, and sends the sucked processing liquid downstream. Even if the flow path from the processing liquid supply source 50 is connected to the upper surface of the intermediate tank 61, the flow path to the downstream auxiliary pump 62 may be connected to the lower surface. The intermediate tank 61 has, for example, a storage chamber for storing the treatment liquid, and even if it functions as a pump, the pump may have a constriction portion for contracting the storage chamber. In this case, for example, a tube-type diaphragm pump, a diaphragm pump, or a bellows pump may be used for the intermediate tank 61 . In addition, the discharge pipe 61a for discharging the gas inside may be provided in the intermediate tank 61. The discharge pipe 61a may be used, for example, to discharge the gas separated from the treatment liquid in the storage chamber.

The auxiliary pump 62 has a function of sending liquid to the pumping channel system 70 upstream of the pumping channel system 70 . The auxiliary pump 62 is constituted by, for example, a diaphragm pump. The auxiliary pump 62 includes a pressurizing unit 621 and a pump inner flow path 622 . The pressurizing unit 621 pressurizes the pump inner channel 622 using, for example, the compressed air G1. Furthermore, the pump inner flow path 622 has a diaphragm portion 622 a, and its shape can be forcibly changed by pressurization from the pressurizing portion 621 . By adjusting the compressed air G1, the diaphragm portion 622a of the pump inner channel 622 is deformed. In this way, the auxiliary pump 62 changes the size (capacity) of the pump inner flow path 622 by changing the degree of pressurization of the pump inner flow path 622 by the pressurizing part 621 . That is, by reducing the pressurized state by the pressurizing part 621, the diaphragm of the pump inner flow path 622 is expanded to accommodate the treatment liquid, and the pressurization by the pressurizing part 621 is increased to make the pump flow The diaphragm of the channel 622 contracts to send out the treatment liquid. The auxiliary pump 62 is provided with a valve body V61 for liquid supply and a valve body V62 for liquid discharge.

The pump channel system 70 includes a pump 71 , a collection unit 72 , a filter unit 73 , and a valve body V70 sequentially from the downstream side. In the filter unit 73, a filter for removing fine particles in the treatment liquid is attached.

The pump 71 is for discharging the processing liquid to the nozzle 41, and is constituted by, for example, a diaphragm pump. The pump 71 includes a pressurizing part 711 and a pump internal flow path 712 . The pressurizing unit 711 pressurizes the pump inner channel 712 using, for example, compressed air G1. Furthermore, the pump inner flow path 712 has a diaphragm portion 712 a, and its shape can be forcibly changed by pressurization from the pressurizing portion 711 . By adjusting the compressed air G2, the diaphragm part 712a of the pump inner channel 712 is deformed. By reducing the pressurized state by the pressurizing part 711, expanding the diaphragm of the pump inner flow path 712 to accommodate the treatment liquid, increasing the pressurization by the pressurizing part 711, the pump inner flow path 712 The diaphragm contracts to send out the treatment liquid.

Furthermore, the pump 71 is provided with a valve body V71 for liquid supply, a valve body V72 for liquid discharge, and a valve body V73 for exhaust. The valve body V73 for exhaust and the collection part 72 are connected by the flow path L71. Furthermore, between the upstream side of the valve body V70 and the pump 71 in the flow path L1, a bypass passage L72 having a valve body V75 and bypassing the filter part 73 via the trap part 72 is provided. The filter unit 73 and the collection unit 72 are respectively connected to a discharge path L73 having a valve body (not shown) for exhaust. In addition, in the following embodiments, the flow path L1 as the main flow path, the flow path L71 and the bypass path L72 may be referred to as "flow path L".

Among the valve bodies provided in the above-mentioned liquid delivery system 60, the valve bodies other than the distributing valve V2 can be, for example, air operated machine valves. However, the configuration of the valve body is not limited to this.

Next, the control device 100 will be described in detail with reference to FIGS. 4 and 5 . The control device 100 has a function of sending the processing liquid from the processing liquid supply source 50 to the downstream discharge part 40 (nozzle 41 ) using the processing liquid supply part 30 . Furthermore, it is configured to control each part of the liquid feeding system 60 when replacing the processing liquid supply source 50 and cleaning the liquid feeding system 60 .

As shown in FIG. 4, the control device 100 includes a pump control unit 101, a gas supply control unit 102, a liquid supply control unit 103, and an operation command holding unit 104 as functional modules (hereinafter referred to as “functional modules”). ").

The pump control unit 101 controls the processing liquid supply unit 30 so as to operate the auxiliary pump 62 when performing “substitution operation related to liquid” in the liquid feeding system 60 . A specific action is specified in the action command held in the action command storage unit 104 . The pump control unit 101 controls the auxiliary pump 62 according to the operation command. The replacement action related to liquid refers to the action of replacing the liquid in the liquid delivery system 60 with gas or another type of liquid. In the case of cleaning, maintenance, etc. in the liquid delivery system 60, the treatment liquid in the flow path L of the liquid delivery system 60 is discharged and replaced with gas or another type of liquid. In addition, when replacing with gas, the gas to be replaced becomes the gas used in the gas supply system 80 . Specifically, for example, an inert gas (for example, nitrogen) is used. The liquid to be replaced with another liquid is, for example, a liquid connected to a liquid source instead of the processing liquid supply source 50 (for example, a diluent used as a cleaning liquid, etc.). In addition, the liquid before the replacement also uses the diluent used as the cleaning liquid, for example, it is also assumed that the diluent A of different types is replaced with the diluent B. The pump control unit 101 controls the operation in this way.

The gas supply control unit 102 controls the processing liquid supply unit 30 so as to operate the gas supply system 80 when performing “substitution operation related to liquid” in the liquid delivery system 60 . A specific action is specified in the action command held in the action command storage unit 104 . The gas supply control part 102 controls each part of the gas supply system 80 according to operation commands.

The liquid supply control unit 103 mainly controls the processing liquid supply unit 30 so that the processing liquid is discharged from the nozzle 41 . That is, the liquid supply control unit 103 controls the normal operation of the operation when the processing liquid is supplied to the workpiece W. Furthermore, the liquid supply control unit 103 also has a function of controlling the processing liquid supply unit 30 when the processing liquid supply source 50 is replaced. The operation command held in the operation command storage unit 104 is specified for the operation of each part during these operation times. The liquid supply control unit 103 controls each unit of the processing liquid supply unit 30 according to the operation command.

The operation command storage unit 104 holds operation commands specifying the liquid processing sequence to be executed in the liquid processing unit U1. Even if the operation command includes information specifying the operation of each part when the processing liquid is discharged from the nozzle 41 to the workpiece W, and information specifying the operation of each part when the processing liquid supply source 50 is replaced, it is specified that the liquid supply system 60 should be executed. Information on the operation of each part in the case of the cleaning operation is also acceptable.

The control device 100 is constituted by one or a plurality of control computers. For example, the control device 100 has a circuit 120 shown in FIG. 5 . The circuit 120 has one or more processors 121 , a memory 122 , a storage 123 , an I/O port 124 and a timer 125 .

The storage 123 has a computer-readable storage medium such as a hard disk, for example. The memory medium records a program for causing the coating and developing device 2 to execute the liquid processing steps described later. Even if the memory medium is a removable medium such as a non-volatile semiconductor memory, a magnetic disk, and an optical disk, it may be used. The memory 122 temporarily records the programs loaded from the memory medium of the storage 123 and the calculation results of the processor 121 . The processor 121 cooperates with the memory 122 to execute the above-mentioned programs to form the above-mentioned functional modules. The input/output port 124 performs input and output of electric signals with each part of the processing liquid supply part 30 .

In addition, the hardware configuration of the control device 100 is not necessarily limited to the configuration of each functional module by a program. For example, each functional module of the control device 100 may be constituted by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrating this.

[Liquid replacement method] As an example of the control method of the substrate processing apparatus described above, a method of replacing the liquid in the liquid feeding system 60 (liquid replacement method) will be described.

In the normal operation of supplying the processing liquid to the workpiece W, the processing liquid supplied from the processing liquid supply source 50 exists in the flow path L (flow path L1 , flow path L71 , bypass path L72 ) of the liquid supply system 60 . On the other hand, as described above, in the case of performing the "substitution operation related to liquid", the liquid in the liquid delivery system 60 is replaced with gas or another type of liquid.

First, an example of the operation procedure around the auxiliary pump 62 in the case of replacing the liquid in the flow path L with gas will be described with reference to the flowchart shown in FIG. 6 . This operation corresponds to a so-called liquid removal operation.

First, in step S01 , the control device 100 starts the operation of replacing the liquid (for example, processing liquid) in the flow path L with gas. Specifically, the control device 100 reads, for example, an operation command corresponding to the replacement of liquid into gas held in the operation command storage unit 104 .

Next, in step S02 and step S03, the pump control unit 101 of the control device 100 pressurizes the pressurizing unit 621 of the auxiliary pump 62 (step S02), and limits the shape change of the pump internal flow path 622 (step S03). Specifically, the amount of compressed air G1 supplied to the pressurizing unit 621 is increased to increase the internal pressure of the pressurizing unit 621 . As a result, in the state where the pump inner flow path 622 is slightly contracted, the increase in the cross-sectional area of the pump inner flow path 622 due to the deformation of the diaphragm portion 622a is restricted, and the increase in the capacity of the pump inner flow path 622 as a whole is limited. The size is also limited. Therefore, even if the fluid flowing inside increases, the pump internal flow path 622 is not in a state where the flow path 622 freely changes, and the pressure of the fluid inside changes or the fluid moves downstream.

The degree of pressurization to the pressurizing part 621 is, for example, the degree to which the shape of the pump inner flow path 622 is restricted compared with normal use (when the processing liquid is discharged toward the workpiece W). Furthermore, it can be adjusted so that the volume in the pump inner flow path 622 becomes about 15% to 25% of the volume of the case where the volume of the pump inner flow path 622 becomes the largest. This prevents the diaphragm part 622a from being in a state where the diaphragm part 622a is in close contact with the surrounding pump internal flow path 622 and cannot be easily peeled off due to the pressurization by the pressurizing part 621 so that the volume falls within this range.

In normal use, when the treatment liquid is introduced into the auxiliary pump 62 in the auxiliary pump 62, the introduction amount of the compressed air G1 is reduced so that the pressurization of the pump internal flow path 622 by the pressurizing part 621 (or almost no pressure). In this case, the magnitude of the pressurization by the pressurization unit 621 is, for example, the first pressure. On the other hand, when the processing liquid is discharged downstream from the auxiliary pump 62 , the introduction amount of the compressed air G1 is increased to pressurize the pump inner flow path 622 by the pressurizing part 621 . In this case, the magnitude of the pressurization by the pressurization unit 621 is referred to as, for example, the second pressure. That is, in normal use, the magnitude of the pressurization by the pressurizing unit 621 can be adjusted between the first pressure and the second pressure. The first pressure is, for example, 0 kPa, and the second pressure is, for example, 35 kPa.

On the other hand, although the magnitude of the pressurization in the above-mentioned steps S02 and S03 is larger than the first pressure, it can be set to be smaller than the second pressure. However, as described above, assuming that the shape of the pump inner flow path 622 is restricted, even if the flow rate of the fluid supplied to the pump inner flow path 622 increases, the deformation of the pump inner flow path 622 is also restricted. . As an example, the magnitude of the pressurization in steps S02 and S03 can be set to about 50% to 80% of the second pressure. When the magnitude of the pressurization in steps S02 and S03 is close to the value of the second pressure, there is a possibility that the volume of the pump internal flow path 622 is maintained in a state close to zero. In this case, as described above, for example, the diaphragm portion 622a is in close contact with the surrounding pump internal flow path 622 and cannot be easily separated. When this situation occurs, there is a possibility that the circulation of the gas itself in the pump internal channel 622 to be performed later becomes difficult. On the other hand, by setting the degree of pressurization to be greater than a certain level in advance, it is possible to suppress the deformation of the pump inner flow path 622 in addition to the flow of the gas without any problem when introducing the gas to be performed later. to a certain extent.

Next, in step S04, the gas supply control unit 102 of the control device 100 supplies the inert gas while maintaining the auxiliary pump 62 in the above-mentioned state. Specifically, the inert gas is introduced into the flow path L from the gas supply source 82 via the gas supply path R82 or the gas supply path R83 , and the inert gas is supplied into the auxiliary pump 62 . Which of the gas supply path R82 and the gas supply path R83 is to be used can be changed depending on which region in the liquid feeding system 60 is to be replaced with gas or the like.

By introducing the inert gas into the auxiliary pump 62, the liquid remaining inside is discharged toward the downstream side. At this time, when the flow rate of the inert gas is increased (the flushing pressure is increased), the speed of supplying the inert gas into the pump internal flow path 622 of the auxiliary pump 62 changes. To prevent the liquid in the pump inner flow path 622 from being replaced by an inert gas when the flow rate of the inert gas is increased to a certain level and introduced into the pump inner flow path 622, the liquid before the replacement remains The situation in the pump inner channel 622. Furthermore, as described above, when the inert gas is introduced while the deformation of the pump inner flow path 622 is restricted by the pressurizing part 621, the pressure of the inert gas in the pump inner flow path 622 becomes high, so the liquid Movement toward the downstream side is further promoted. On the other hand, when the flow rate of the inert gas is too small, the inert gas may move downstream without being replaced with the liquid in the pump internal flow path 622 .

7( a ) and FIG. 7( b ) are diagrams schematically showing changes in the residual amount of liquid caused by the deformation of the pump inner channel 622 . In fact, only the diaphragm portion 622a is deformed, but FIG. 7 schematically shows the change in volume of the pump inner flow path 622 due to the deformation of the diaphragm portion 622a. FIG. 7( a ) shows an example of a state in which an inert gas is introduced in a state where deformation of the pump inner flow path 622 is restricted by the pressurizing portion 621 (a state where expansion of the diaphragm portion is suppressed) as described above. As shown in the left diagram of FIG. 7( a ), the liquid F before the original replacement stays in the pump internal flow path 622 . In this state, when the inert gas is introduced while suppressing the change in the shape of the pump internal flow path 622, the liquid F in the pump internal flow path 622 moves downstream as shown in the right figure as shown in the central figure. Generally, the inside is replaced with an inert gas in a state where the residue of the liquid F is suppressed. On the other hand, in the state where the deformation of the pumping inner channel 622 is allowed, the pumping inner channel 622 is deformed by the pressure of the introduced inert gas. Specifically, as shown in the left diagram of FIG. 7( b ), the liquid F before the initial replacement stays in the pump internal flow path 622 . In this state, when an inert gas is introduced without suppressing the change in the shape of the pump inner flow path 622, the liquid F in the pump inner flow path 622 moves to the downstream side as shown in the central figure, but the liquid F in the inert flow path 622 moves downstream. When the pressure of the gas is not quite high, part of the liquid F will remain in the pump internal flow path 622 . As a result, as shown in the right figure, a part of the liquid F remains in the pump inner channel 622 and is replaced with an inert gas.

In this way, when the deformation of the pump internal channel 622 is restricted (suppressed), when the liquid is replaced with a gas (for example, an inert gas), the movement of the liquid F toward the downstream side is promoted along with the introduction of the gas. Therefore, it is easy to prevent the liquid from remaining in the pump inner channel 622 . Therefore, the displacement to gas can be performed while reducing the remaining amount of liquid before the displacement.

Next, an example of the operation procedure around the auxiliary pump 62 in the case of replacing the liquid in the flow path L with another type of liquid will be described with reference to the flowchart shown in FIG. 8 . This work occurs, for example, when the flow path L is cleaned.

First, in step S11, the control device 100 starts the operation of replacing the liquid in the channel L (for example, the first cleaning solution) with another liquid (for example, the second cleaning solution). Specifically, the control device 100 reads, for example, an operation command corresponding to replacement of liquids held in the operation command storage unit 104 .

Next, in step S12 and step S13, the pump control part 101 of the control device 100 pressurizes the pressurizing part 621 of the auxiliary pump 62 (step S12), reduces the pressurization of the pump internal flow path 622, and becomes a shape change Easy state (step S13). Specifically, the amount of the compressed air G1 supplied to the pressurizing unit 621 is reduced to such an extent that the pressurizing unit 621 does not pressurize the pump inner flow path 622 . As a result, when the liquid is introduced into the pump inner flow path 622, the pump inner flow path 622 becomes a freely deformable state. Actually, since the state of the liquid before replacement exists in the pump inner flow path 622, the pump inner flow path 622 becomes a state with a large volume. The magnitude of the pressurization in steps S12 and S13 can be set to the above-mentioned first pressure level. Specifically, the pumping internal flow path 622 can freely deform according to the amount of liquid in the pumping internal flow path 622 .

Next, in step S14, the pump control unit 101 of the control device 100 supplies the replaced liquid while maintaining the auxiliary pump 62 in the above state. Specifically, a supply source for the replaced liquid is provided at a position corresponding to the processing liquid supply source 50 , and the replaced liquid is introduced into the flow path L. As shown in FIG. Accordingly, the substituted liquid is also supplied to the auxiliary pump 62 .

When the substituted liquid is supplied into the auxiliary pump 62 , the pre-substituted liquid and the substituted liquid are first mixed in the pump internal flow path 622 . Furthermore, when the substituted liquid is introduced, the ratio of the substituted liquid in the pump internal flow path 622 gradually increases, and is finally replaced with the substituted liquid. At this time, since the compression by the pressurizing part 621 is reduced to the extent that the pump inner flow path 622 can be freely deformed, the volume in the pump inner flow path 622 is ensured to be large. Therefore, the replacement of the liquid in the pump internal channel 622 can be performed efficiently.

9( a ) and FIG. 9( b ) are diagrams schematically showing the state of movement of the liquid as the state of liquid replacement due to the deformation of the pump inner channel 622 . Also in FIG. 9 , the change in the volume of the pump inner flow path 622 due to the deformation of the diaphragm portion 622 a is schematically shown. FIG. 9( a ) shows a state in which the pump inner channel 622 is not pressurized by the pressurizing part 621 as described above. In this case, since the liquid F before replacement exists in the pump inner flow path 622, the pump inner flow path 622 is in a state with a large volume. When another type of liquid (replaced liquid) is introduced in this state, as shown by the arrows in the figure, a turbulent flow in which the liquid is easily mixed occurs in the center and outer periphery of the pump internal flow path 622 . As a result, mixing and replacement of liquids in the pump inner channel 622 becomes easy. On the other hand, FIG. 9( b ) shows an example of the case where the liquid is replaced in a state where the deformation of the pump inner channel 622 is restricted by the pressurizing part 621 . In this case, the volume of the pump inner flow path 622 is reduced from the stage where the liquid F before replacement exists in the pump inner flow path 622 . When another type of liquid (replaced liquid) is introduced in this state, as shown by the arrows in the figure, the introduced liquid easily and quickly flows to the center and outer periphery of the pump inner flow path 622. downstream side. That is, since it becomes difficult to mix the liquids in the pump inner channel 622, it becomes difficult to replace the liquids. In this way, in the case of mutual replacement of liquids, it is considered that by forming a turbulent state in the flow of the liquid in the pump internal flow path 622, the replacement of the internal liquids is more properly performed.

[effect] In the processing liquid supply apparatus and the liquid replacement method described above, the liquid in the auxiliary pump 62 which is a diaphragm pump is discharged and replaced with gas under the control of the control device 100 as the control unit. At this time, the control device 100 as a control unit controls the diaphragm portion 622a in the auxiliary pump 62 to be in a contracted state compared to an expanded state. Then, the gas is supplied into the auxiliary pump 62 while maintaining the above-mentioned state by the control by the control device 100 . With such a configuration, when the liquid in the auxiliary pump 62 serving as a diaphragm pump is replaced with gas, it is prevented that the liquid remains in the pump. Therefore, the replacement of the liquid in the flow path of the diaphragm pump with gas is appropriately performed.

Here, when the control device 100 as the control unit replaces the liquid in the auxiliary pump 62 as a diaphragm pump with another type of liquid, it supplies the liquid to the auxiliary pump 62 while maintaining the expandable state of the diaphragm portion 622a. Other types of liquids. With the above configuration, when the liquid in the auxiliary pump 62 is replaced with another type of liquid, mixing of the liquid before replacement and the different type of liquid in the pump is promoted. Therefore, replacement of the liquid in the flow path of the auxiliary pump 62 as a diaphragm pump with another type of liquid is properly performed.

Furthermore, by controlling the pressure of the diaphragm portion 622a pressurized by the pressurizing portion 621 in the auxiliary pump 62 as the diaphragm pump by the control device 100 as the control portion, the shape of the diaphragm portion 622a can be controlled. In this case, the shape of the diaphragm portion 622a can be flexibly controlled by the pressurization by the pressurization portion 621 .

In addition, the control device 100 as a control part may increase the pressure of the diaphragm part 622a by the pressurization part 621, when discharging the liquid in the auxiliary pump 62 which is a diaphragm pump. In addition, even by such an operation, the state in which the diaphragm portion 622a is contracted when the gas is supplied may be maintained. With the above configuration, even when the flow velocity of the gas supplied to the pump is increased, the contracted state of the diaphragm part 622a can be maintained, and the flow of liquid from the flow path of the auxiliary pump 62 serving as the diaphragm pump can be appropriately performed. replaced by gas.

In addition, even if the gas supply source 82 and the gas supply paths R82 and R83 functioning as the gas supply unit are volatile, and the gas supply source 81 and the gas supply path R81 used as the gas supply system from the processing liquid supply source 50 are separately The ground can also be set. In addition, the gas supply source 82 and the gas supply paths R82 and R83 may supply gas into the flow path L upstream of the auxiliary pump 62 which is a diaphragm pump. By providing a gas supply unit separately from the gas supply system from the processing liquid supply source, and supplying gas to the flow path L upstream of the diaphragm pump, it is possible to separate the gas supply system from the processing liquid supply source from the gas supply system around the processing liquid supply source. Replace the liquid in the diaphragm pump. Furthermore, according to the above configuration, it is possible to prevent the operation of the gas supply part from affecting the gas supply system.

In the above, although various exemplary embodiments have been described, it is not limited to the above-mentioned exemplary embodiments, and various omissions, substitutions, and changes are possible. Furthermore, elements in different implementation forms can be combined to form other implementation forms.

For example, the configuration of the flow path L between the processing liquid supply source 50 and the nozzle 41 can be appropriately changed. As an example, in the above-mentioned embodiment, the configuration in which the processing liquid is supplied from the processing liquid supply source 50 to one nozzle 41 and the workpiece W is supplied will be described. However, in practice, a plurality of nozzles 41 can be connected to one processing liquid supply source 50 , and the flow path L can be branched midway to supply the processing liquid to each nozzle 41 . Therefore, the configuration of the flow path L can be changed according to the number of nozzles 41 that supply the processing liquid from the processing liquid supply source 50 . Furthermore, the configuration of the liquid delivery system 60 including the pump channel system 70 can also be appropriately changed. Even when the configuration of the liquid feeding system 60 is changed, or when a diaphragm pump is provided on the flow path L, the above configuration can be applied.

In addition, in the above-mentioned embodiment, the structure in which the internal flow path 622 is pressurized and pumped using the compressed air G1 in the auxiliary pump 62 which is a diaphragm pump has been described. However, the diaphragm may be operated in a manner different from so-called air drive using compressed air in the diaphragm pump. For example, well-known methods such as hydraulic drive and motor direct drive can be used.

From the above description, it should be understood that various embodiments of the present disclosure are described in the present specification for the purpose of illustration, and that various changes can be made without departing from the scope and gist of the present disclosure. Therefore, the various implementation forms disclosed in this specification are not intended to be limited, and the essential scope and gist are indicated by the appended claims.

1: Substrate processing system 20: Rotation holding part 21: Keeping Department 22: Drive Department 30: Treatment liquid supply part 40: spit out part 41: Nozzle 42: liquid delivery pipe 50: Treatment liquid supply source 60: Liquid delivery system 61: middle slot 62: Auxiliary pump 70: Pump flow system 80: Gas supply system 81,82: Gas supply source 100: Control device 621: pressurized part 622: Pump internal flow path 622a: Diaphragm R81~83: gas supply path

40: spit out part

41: Nozzle

42: liquid delivery pipe

50: Treatment liquid supply source

60: Liquid delivery system

61: middle slot

61a: discharge pipe

62: Auxiliary pump

621: pressurized part

622: Pump internal flow path

622a: Diaphragm

70: Pump flow system

71: pump

711: pressurized part

712: Pump internal flow path

712a: Diaphragm

72: capture department

73:Filter department

80: Gas supply system

81,82: Gas supply source

100: Control device

101: Pump Control Department

102: Gas supply control department

103: Liquid supply control department

104: Action command holding unit

G1: compressed air

G2: compressed air

L1: flow path

L71: flow path

L72: bypass channel

L73: Discharge path

R81~83: gas supply path

V1: valve body

V2: distribution valve

V3: valve body

V61, V62: valve body

V70: valve body

V71: valve body

V72: valve body

V73: valve body

V75: valve body

V81~83: valve body

Claims (11)

A processing liquid supply device, which is a processing liquid supply device that supplies a processing liquid to an object to be processed from a processing liquid supply source through a processing liquid flow path and a nozzle, comprising: a diaphragm pump, which is installed in the above-mentioned treatment liquid flow path; a gas supply unit for supplying gas into the above-mentioned treatment liquid flow path; and a control unit, which controls the operation of the above-mentioned diaphragm pump and the above-mentioned gas supply unit, When the control unit replaces the liquid in the diaphragm pump with gas, it executes the step of making the diaphragm part of the diaphragm pump contracted compared with the expanded state, and maintains the contracted state of the diaphragm part. , a step of supplying the gas into the diaphragm pump through the gas supply unit. The processing liquid supply device according to claim 1, wherein When replacing the liquid in the diaphragm pump with another type of liquid, the control unit supplies the different type of liquid into the diaphragm pump while maintaining the expandable state of the diaphragm portion. The treatment liquid supply device according to claim 1 or 2, wherein The control unit controls the shape of the diaphragm unit by controlling the pressure of the diaphragm unit pressurized by the pressurizing unit in the diaphragm pump. The treatment liquid supply device according to claim 3, wherein The control unit maintains the contraction of the diaphragm when the gas is supplied by the gas supply unit by increasing the pressure of the diaphragm that is pressurized by the pressurizing unit when discharging the liquid in the diaphragm pump. state. The processing liquid supply device according to claim 1, wherein The gas supply unit is provided separately from a gas supply system used to supply the treatment liquid from the treatment liquid supply source to the treatment liquid flow path, The gas is supplied into the treatment liquid flow path upstream of the diaphragm pump. A liquid replacement method, which is a liquid replacement method in a processing liquid supply device that supplies a processing liquid to an object to be processed from a processing liquid supply source through a processing liquid flow path and a nozzle, The above-mentioned treatment liquid supply device has: a diaphragm pump, which is installed in the above-mentioned treatment liquid flow path; a gas supply unit for supplying gas into the above-mentioned treatment liquid flow path; and a control unit, which controls the operation of the above-mentioned diaphragm pump and the above-mentioned gas supply unit, When replacing the liquid in the above-mentioned diaphragm pump with gas, it includes: a step of bringing the diaphragm portion of the diaphragm pump into a contracted state compared to an expanded state by the control unit, and A step of supplying the gas from the gas supply unit to the diaphragm pump while maintaining the contracted state of the diaphragm by the control unit, thereby discharging the liquid in the diaphragm pump. Such as the liquid replacement method of claim 6, wherein When replacing the liquid in the above-mentioned diaphragm pump with another type of liquid, it further includes: The step of supplying the different type of liquid into the diaphragm pump by the control unit while maintaining the state where the diaphragm portion can be expanded. Such as the liquid replacement method of claim 6 or 7, wherein The control of the shape of the diaphragm part is performed by controlling the pressure of the diaphragm part pressurized by the pressurizing part in the diaphragm pump. Such as the liquid replacement method of claim 8, wherein When the liquid in the diaphragm pump is discharged, by increasing the pressure of the diaphragm part pressurized by the pressurizing part, the state in which the diaphragm part is contracted when the gas is supplied by the gas supply part is maintained. Such as the liquid replacement method of claim 6, wherein The gas supply unit is provided separately from a gas supply system used to supply the treatment liquid from the treatment liquid supply source to the treatment liquid flow path, The gas is supplied into the treatment liquid flow path upstream of the diaphragm pump. A computer-readable memory medium, which stores a program useful for enabling the device to implement the liquid replacement method as claimed in claim 6.

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