KR20220147524A - Processing liquid supply apparatus, liquid replacement method and recording medium - Google Patents

Abstract

The liquid in a flow path of a diaphragm pump is appropriately replaced with another fluid. A treatment liquid supply device supplying a treatment liquid from a treatment liquid supply source (50) to an object to be treated via a treatment liquid flow path and a nozzle (41) comprises: an assist pump (62) which is a diaphragm pump provided in the treatment liquid flow path; a gas supply unit supplying gas into the treatment liquid flow path; and a control device (100) which is a control unit controlling the operation of the diaphragm pump and the gas supply unit. When the liquid in the assist pump (62) is replaced with gas, the control device (100) causes a fram unit (622a) in the assist pump (62) to be in a contracted state compared to an expanded state, and causes gas to be supplied into the assist pump (62) by the gas supply unit while maintaining the contracted state of the fram unit (622a).

Description

Treatment liquid supply device, liquid displacement method and storage medium

The present disclosure relates to a processing liquid supply apparatus, a liquid replacement method, and a storage medium.

Patent Document 1 discloses a configuration in which a cleaning liquid is supplied to a flow path provided with a diaphragm pump to clean the flow path.

Japanese Patent Laid-Open No. 2016-087546

The present disclosure provides a technique for appropriately performing replacement of a liquid in a flow path of a diaphragm pump with another fluid.

A processing liquid supply device according to an aspect of the present disclosure is a processing liquid supply device configured to supply a processing liquid from a processing liquid supply source to a target object through a processing liquid flow path and a nozzle, comprising: a diaphragm pump provided in the processing liquid flow path; a gas supply unit for supplying a gas into the liquid passage, and a control unit for controlling operations of the diaphragm pump and the gas supply unit, wherein the control unit includes: a diaphragm unit in the diaphragm pump when discharging the liquid in the diaphragm pump , making the diaphragm into a contracted state compared to the expanded state, and supplying the gas into the diaphragm pump by the gas supply unit while maintaining the contracted state of the fram unit.

According to the present disclosure, there is provided a technique for appropriately performing replacement of a liquid in a flow path of a diaphragm pump with another fluid.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows an example of the schematic structure of a substrate processing system.
It is a schematic diagram which shows an example of the internal structure of a coating/developing apparatus.
3 is a schematic diagram showing an example of the configuration of a liquid processing unit.
4 is a schematic diagram illustrating an example of a processing liquid supply unit.
Fig. 5 is a block diagram showing an example of the hardware configuration of the control device.
6 is a flowchart showing an example of an operation method at the time of replacing a liquid with a gas.
FIG.7(a), FIG.7(b) is a figure explaining an example of the relationship between the shape of a diaphragm pump, and the internal substitution state.
Fig. 8 is a flowchart showing an example of an operation method when replacing a liquid with another liquid.
Fig.9 (a), Fig.9 (b) is a figure explaining an example of the relationship between the shape of a diaphragm pump, and the internal substitution state.

Hereinafter, various exemplary embodiments will be described.

In one exemplary embodiment, a treatment liquid supply device is provided. The processing liquid supply device is a processing liquid supply device for supplying a processing liquid from a processing liquid supply source to a target object through a processing liquid flow path and a nozzle, and includes a diaphragm pump provided in the processing liquid flow path and supplying gas into the processing liquid flow path. a gas supply unit, and a control unit for controlling the operations of the diaphragm pump and the gas supply unit, wherein the control unit includes, when replacing the liquid in the diaphragm pump with gas, the fram unit in the diaphragm pump in an enlarged state It is made into a comparatively contracted state, and the said gas supply part supplies the said gas into the said diaphragm pump while maintaining the said fram part contracted state.

In the processing liquid supply device described above, when the liquid in the diaphragm pump is discharged and replaced with gas, the fram portion of the diaphragm pump is in a contracted state compared to the expanded state, and while maintaining that state, the gas It is fed into the diaphragm pump. With this configuration, when the liquid in the diaphragm pump is replaced with gas, the liquid is prevented from remaining in the pump. For this reason, replacement of the liquid from the gas in the flow path of the diaphragm pump is performed appropriately.

When the liquid in the diaphragm pump is replaced with another type of liquid, the control unit may supply the different type of liquid into the diaphragm pump while maintaining the expandable state of the diaphragm pump. . By setting it as said structure, when replacing the liquid in a diaphragm pump with another type of liquid, mixing in the pump of the liquid before substitution and another type of liquid is accelerated|stimulated. For this reason, replacement of the liquid in the flow path of the diaphragm pump to another type of liquid is appropriately performed.

The said control part can be set as the aspect which controls the shape of the said fram part by controlling the pressure which pressurizes the said fram part by a press part in the said diaphragm pump. By setting it as said structure, control of the shape of a fram part can be performed flexibly using the press by a press part.

When the liquid in the diaphragm pump is discharged, the control unit increases the pressure for pressurizing the fram part by the pressurizing part to maintain a contracted state of the fram part when the gas is supplied by the gas supply part. You can do it with the sun By setting it as the above structure, even when the flow rate of the gas supplied into the pump is increased, the state in which the fram part is contracted can be maintained, and the liquid in the flow path of the diaphragm pump is replaced with gas appropriately.

The gas supply unit is provided separately from a gas supply system used to supply the processing liquid from the processing liquid supply source toward the processing liquid flow path, and supplies the gas into the processing liquid flow path upstream of the diaphragm pump. You can do it with the sun With the above configuration, the liquid in the diaphragm pump can be replaced independently of the gas supply system around the processing liquid supply source. In addition, according to the above configuration, the operation of the gas supply unit is prevented from affecting the gas supply system.

In another exemplary embodiment, a liquid displacement method is provided. The liquid replacement method is a liquid replacement method in a processing liquid supply device for supplying a processing liquid to a target object from a processing liquid supply source through a processing liquid flow path and a nozzle, wherein the processing liquid supply device includes a diaphragm provided in the processing liquid flow path. a pump, a gas supply unit for supplying an inert gas into the processing liquid flow path, and a control unit for controlling operations of the diaphragm pump and the gas supply unit; , the diaphragm part in the diaphragm pump is brought into a contracted state compared to the expanded state, and the inert gas is fed into the diaphragm pump by the gas supply part while maintaining the contracted state of the fram part by the control part. by supplying, draining the liquid in the diaphragm pump.

In the above liquid replacement method, when the liquid in the diaphragm pump is discharged and replaced with gas, the diaphragm part in the diaphragm pump is in a contracted state compared to the expanded state, and while maintaining that state, the gas is transferred to the diaphragm fed into the pump. With this configuration, when the liquid in the diaphragm pump is replaced with gas, the liquid is prevented from remaining in the pump. For this reason, replacement of the liquid from the gas in the flow path of the diaphragm pump is performed appropriately.

When replacing the liquid in the diaphragm pump with another type of liquid, supplying the different type of liquid into the diaphragm pump while maintaining the expandable state by the control unit can By setting it as said structure, when replacing the liquid in a diaphragm pump with another type of liquid, mixing in the pump of the liquid before substitution and another type of liquid is accelerated|stimulated. For this reason, replacement of the liquid in the flow path of the diaphragm pump to another type of liquid is appropriately performed.

Control of the shape of the said fram part can be made into the aspect performed by controlling the pressure which pressurizes the said fram part by a press part in the said diaphragm pump. By setting it as said structure, control of the shape of a fram part can be performed flexibly using the press by a press part.

When the liquid in the diaphragm pump is discharged, the pressure for pressurizing the fram part by the pressurizing part is increased, so that the fram part is maintained in a contracted state when the inert gas is supplied by the gas supply part. can do. By setting it as the above structure, even when the flow rate of the gas supplied into the pump is increased, the state in which the fram part is contracted can be maintained, and the liquid in the flow path of the diaphragm pump is replaced with gas appropriately.

The gas supply unit is provided separately from a gas supply system used to supply the processing liquid from the processing liquid supply source toward the processing liquid flow path, and supplies an inert gas into the processing liquid flow path upstream of the diaphragm pump. You can do it with the sun With the above configuration, the liquid in the diaphragm pump can be replaced independently of the gas supply system around the processing liquid supply source. In addition, according to the above configuration, the operation of the gas supply unit is prevented from affecting the gas supply system.

In one exemplary embodiment, there is provided a computer-readable storage medium storing a program for causing an apparatus to execute the liquid displacement method described above. The above-described storage medium exhibits the same effect as the above-described liquid replacement method.

[Example embodiment]

Hereinafter, various exemplary embodiments will be described in detail with reference to the drawings. In addition, in each figure, the same code|symbol shall be attached|subjected about the same or equivalent part.

[Substrate processing system]

First, a substrate processing system according to an embodiment will be described with reference to FIGS. 1 to 5 . The substrate processing system 1 shown in FIG. 1 is a system which performs formation of a photosensitive film, exposure of the said photosensitive film, and development of the said photosensitive film with respect to a board|substrate. The workpiece W (substrate) to be processed is, for example, a substrate for semiconductors. The substrate is, for example, a silicon wafer. The work W may be formed in a circular shape. The workpiece W to be processed may be a glass substrate, a mask substrate, a flat panel display (FPD), or the like. The work W may have the groove part cut out in part. The groove portion may be, for example, a notch (a U-shaped or V-shaped groove) or a linear portion extending linearly (so-called orientation flat). In addition, the photosensitive film is a resist film, for example.

The substrate processing system 1 includes a coating/developing apparatus 2 and an exposure apparatus 3 . The exposure apparatus 3 performs exposure processing of the resist film (photosensitive film) formed on the workpiece|work W (substrate). Specifically, an energy ray is irradiated to an exposure target portion of the resist film by a method such as immersion exposure. The coating/developing apparatus 2 performs a process of forming a resist film on the surface of the work W (substrate) before exposure treatment by the exposure apparatus 3 , and develops the resist film after the exposure treatment.

[Substrate processing unit]

Hereinafter, as an example of a substrate processing apparatus, the structure of the coating/developing apparatus 2 is demonstrated. 1 and 2 , the coating/developing apparatus 2 includes a carrier block 4 , a processing block 5 , an interface block 6 , and a control apparatus 100 .

The carrier block 4 introduces the workpiece W into the coating/developing device 2 and takes out the workpiece W from the coating/developing device 2 . For example, the carrier block 4 can support the some carrier C for the workpiece|work W, and has built-in the conveyance apparatus A1 containing a transmission arm. The carrier C accommodates a plurality of circular workpieces W, for example. The conveying apparatus A1 takes out the workpiece|work W from the carrier C, passes it to the processing block 5, receives the workpiece|work W from the processing block 5, and returns it into the carrier C.

The processing block 5 has a plurality of processing modules 11 , 12 , 13 , 14 . The processing modules 11, 12, 13, and 14 incorporate a conveying device A3 including a liquid processing unit U1, a heat processing unit U2, and a conveying arm conveying the workpiece W to these units. are doing

The processing module 11 forms an underlayer film on the surface of the work W by the liquid processing unit U1 and the heat processing unit U2 . The liquid processing unit U1 of the processing module 11 applies a processing liquid for forming an underlayer film on the work W. The heat treatment unit U2 of the treatment module 11 performs various heat treatments accompanying the formation of the underlayer film.

The processing module 12 forms a resist film on the underlayer film by the liquid processing unit U1 and the heat processing unit U2 . The liquid processing unit U1 of the processing module 12 applies a processing liquid for forming a resist film on the underlayer film. The thermal processing unit U2 of the processing module 12 performs various thermal processing accompanying the formation of the resist film.

The processing module 13 forms an upper layer film on the resist film by the liquid processing unit U1 and the heat processing unit U2 . The liquid processing unit U1 of the processing module 13 applies a liquid for forming an upper layer film on the resist film. The heat treatment unit U2 of the treatment module 13 performs various heat treatments accompanying the formation of the upper layer film.

The processing module 14 performs development processing of the resist film after exposure by the liquid processing unit U1 and the heat processing unit U2 . The liquid processing unit U1 applies a developer on the surface of the work W that has been exposed. Further, the liquid processing unit U1 washes off the applied developer with the rinse liquid. The thermal processing unit U2 performs various thermal processing accompanying the developing processing. Specific examples of the heat treatment include heat treatment (PEB: Post Exposure Bake) before developing treatment, heat treatment after developing treatment (PB: Post Bake), and the like.

A shelf unit U10 is provided on the carrier block 4 side in the processing block 5 . The shelf unit U10 is divided into a plurality of cells arranged in the vertical direction. In the vicinity of the shelf unit U10, a conveying device A7 including an elevating arm is provided. The conveying apparatus A7 raises/lowers the workpiece|work W between the cells of the shelf unit U10.

A shelf unit U11 is provided on the interface block 6 side in the processing block 5 . The shelf unit U11 is divided into a plurality of cells arranged in the vertical direction.

The interface block 6 transfers the workpiece W with the exposure apparatus 3 . For example, the interface block 6 incorporates a transfer device A8 including a transfer arm, and is connected to the exposure apparatus 3 . The conveying apparatus A8 delivers the workpiece|work W arranged on the shelf unit U11 to the exposure apparatus 3 . The conveyance apparatus A8 receives the workpiece|work W from the exposure apparatus 3 and returns it to the shelf unit U11.

The control device 100 controls the coating/developing device 2 to perform coating/developing processing in the following procedure, for example. First, the control device 100 controls the transport device A1 to transport the workpiece W in the carrier C to the shelf unit U10 , and transfers the workpiece W to the cell for the processing module 11 . The conveying apparatus A7 is controlled so that it may arrange|position.

Next, the control device 100 controls the transport device A3 to transport the workpiece W of the shelf unit U10 to the liquid processing unit U1 and the heat processing unit U2 in the processing module 11 . In addition, the control device 100 controls the liquid processing unit U1 and the heat processing unit U2 to form an underlayer film on the surface of the work W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W with the underlayer film formed thereon to the shelf unit U10 , and places the workpiece W in the cell for the processing module 12 . The conveying apparatus A7 is controlled so that it may do so.

Next, the control device 100 controls the transport device A3 to transport the workpiece W of the shelf unit U10 to the liquid processing unit U1 and the heat processing unit U2 in the processing module 12 . Further, the control device 100 controls the liquid processing unit U1 and the heat processing unit U2 to form a resist film on the underlayer film of the work W. Thereafter, the control device 100 controls the transport device A3 to return the work W to the shelf unit U10 , and the transport device to place the workpiece W in the cell for the processing module 13 . (A7) is controlled.

Next, the control apparatus 100 controls the conveying apparatus A3 to convey the workpiece|work W of the shelf unit U10 to each unit in the processing module 13 . Further, the control device 100 controls the liquid processing unit U1 and the heat processing unit U2 to form an upper layer film on the resist film of the work W. Thereafter, the control device 100 controls the transport device A3 to transport the work W to the shelf unit U11 .

Next, the control apparatus 100 controls the conveying apparatus A8 to send the workpiece|work W of the shelf unit U11 to the exposure apparatus 3 . Thereafter, the control device 100 receives the workpiece W subjected to the exposure process from the exposure device 3 , and arranges it in the cell for the processing module 14 in the shelf unit U11 , the transport device A8 . ) to control

Next, the control device 100 controls the transport device A3 to transport the workpiece W of the shelf unit U11 to each unit in the processing module 14, and develops the resist film of the workpiece W. The liquid processing unit U1 and the heat processing unit U2 are controlled to perform Thereafter, the control device 100 controls the transport device A3 to return the work W to the shelf unit U10, and the transport device A7 to return the workpiece W into the carrier C, and The conveying apparatus A1 is controlled. As described above, the coating/developing process is completed.

In addition, the specific structure of a substrate processing apparatus is not limited to the structure of the coating/developing apparatus 2 illustrated above. The substrate processing apparatus may be any type as long as it includes a liquid processing unit that performs liquid processing by discharging a processing liquid to the work W, and a control device capable of controlling the liquid processing unit.

(liquid processing unit)

Next, an example of the liquid processing unit U1 in the processing module 12 will be described in detail with reference to FIGS. 3 and 4 . The liquid processing unit U1 includes a rotation holding unit 20 and a processing liquid supply unit 30 . The liquid processing unit U1 and the control device 100 (control unit) that controls the liquid processing unit U1 have a configuration corresponding to the processing liquid supply apparatus in the present embodiment.

The rotation holding unit 20 holds and rotates the work W based on the operation instruction of the control device 100 . The rotation holding unit 20 includes a holding unit 21 and a driving unit 22 . The holding part 21 supports the center part of the workpiece|work W which is horizontally arrange|positioned with the surface Wa facing upward, and holds the said workpiece|work W by adsorption|suction (for example, vacuum suction) etc. The drive part 22 is a rotation actuator using, for example, an electric motor etc. as a power source, and rotates the holding part 21 around a vertical rotation shaft. Thereby, the workpiece|work W rotates about the vertical rotation axis.

The processing liquid supply unit 30 supplies the processing liquid to the work W rotationally held by the rotation holding unit 20 . As shown in FIGS. 3 and 4 , the processing liquid supply unit 30 includes a discharge unit 40 , a processing liquid supply source 50 , and a liquid delivery system 60 . The liquid delivery system 60 includes a flow path for supplying the processing liquid and a pump, a valve, and the like for supplying the liquid in the flow path. In addition, the liquid supply system 60 is configured to include a gas supply system 80 for supplying an inert gas that can be used for adjustment of liquid supply and the like.

The discharge unit 40 discharges the processing liquid toward the surface Wa of the work W. The discharge unit 40 includes a nozzle 41 and a liquid delivery pipe 42 . The nozzle 41 discharges the processing liquid to the work W. As shown in FIG. 3 , the nozzle 41 is disposed above the work W, for example, and discharges the processing liquid downward. The liquid delivery pipe 42 guides the processing liquid to the nozzle 41 . By discharging the treatment liquid from the nozzle 41 toward the work W, the treatment liquid is applied (supplied) to the work W.

As shown in FIG. 4 , the treatment liquid may be supplied from the treatment liquid supply source 50 . The processing liquid supply source 50 is a tank for storing the processing liquid, and is detachable from the liquid delivery system 60 . Also, when cleaning the liquid delivery system 60 , a cleaning liquid supply source for storing the cleaning liquid instead of the processing liquid supply source 50 may be installed in the same place.

The processing liquid supply source 50 is connected to a gas supply source 81 that supplies, for example, an inert gas such as nitrogen (N ₂ ) through a gas supply path R81 provided with a valve V81 . The gas supply source 81 and the gas supply path R81 constitute a pressurization mechanism for moving the processing liquid from the processing liquid supply source 50 by pressurizing the liquid level in the processing liquid supply source 50 . Moreover, the path for exhausting an inert gas may be provided separately in the gas supply path R81. The gas supply source 81 and the gas supply path R81 are a part of the gas supply system 80 . In addition, the gas supply source 81 and the gas supply path R81 function as a gas supply system for moving the processing liquid with respect to the flow path L downstream from the processing liquid supply source 50 (or a supply source connected instead). has a

In a flow path L1 connected to the processing liquid supply source 50 , as a liquid delivery system 60 , in order from the upstream side, a valve V1 , an intermediate tank 61 , an assist pump 62 , a pump flow path system 70 , A dispense valve (liquid discharge valve) V2 and a valve V3 are provided. The dispensing valve V2 has a function of discharging the processing liquid of a preset liquid amount.

The intermediate tank 61 is connected to the flow path L1 upstream thereof, via a gas supply path R82 provided with a valve V82, for example, nitrogen (N ₂ ). It is connected to the gas supply source 82 . The assist pump 62 is also connected to the gas supply source 82 via a gas supply path R83 provided with a valve V83, which is connected to the upstream flow path L1. These gas supply sources 82 and gas supply paths R82 and R83 are used when replacing the liquid in the liquid delivery system 60 including the intermediate tank 61 and the assist pump 62 with gas. This point will be described later. The gas supply source 82 and the gas supply paths R82 and R83 are a part of the gas supply system 80 . Moreover, the gas supply source 82 and the gas supply paths R82 and R83 have a function as a gas supply part for discharging the liquid in the assist pump 62 and replacing it with gas. In this regard, the gas supply source 82 and the gas supply paths R82 and R83 have different functions from the gas supply source 81 and the gas supply path R81 .

The intermediate tank 61 stores and sucks the processing liquid in the processing liquid supply source 50 , and sends the sucked processing liquid toward the downstream. The flow path from the processing liquid supply source 50 may be connected to the upper surface of the intermediate tank 61, and the flow path to the downstream assist pump 62 may be connected to the lower surface. The intermediate tank 61 may have a function as a pump having, for example, a storage chamber for accommodating the processing liquid, and a constriction portion for contracting the storage chamber. In that case, for the intermediate tank 61, for example, a tube fram pump, a diaphragm pump, or a bellows pump may be used. In addition, the intermediate tank 61 may be provided with the discharge pipe 61a for discharging the gas inside. The discharge pipe 61a may be used, for example, in order to discharge the gas separated from the processing liquid in the accommodation chamber.

The assist pump 62 has a function of supplying liquid to the pump flow path system 70 upstream of the pump flow path system 70 . The assist pump 62 is made of, for example, a diaphragm pump. The assist pump 62 includes a pressurizing unit 621 and an internal pump flow path 622 . The pressurizing part 621 pressurizes the flow path 622 in a pump using the compressed air G1, for example. In addition, the flow path 622 in the pump has a fram portion 622a, and its shape can be forcibly changed by pressurization of the pressing portion 621 . By adjusting the compressed air G1, the fram portion 622a of the in-pump flow path 622 is deformed. In this way, the assist pump 62 changes the size (volume) of the inner pump oil passage 622 by changing the degree of pressurization of the inner pump oil passage 622 by the pressurizing unit 621 . That is, in a state in which the pressurization by the pressurizing unit 621 is reduced, the processing liquid is received by expanding the fram of the internal pump flow path 622 , the pressurization by the pressurizing unit 621 is increased, and the internal pump flow path 622 is increased. Shrink the fram to send the treatment solution. The assist pump 62 is provided with a valve V61 for supplying the liquid and a valve V62 for discharging the liquid.

The pump flow path system 70 includes a pump 71 , a trap part 72 , a filter part 73 , and a valve V70 sequentially from the downstream side. A filter for removing particles in the processing liquid is attached to the filter unit 73 .

The pump 71 is for discharging the processing liquid to the nozzle 41, and is, for example, a diaphragm pump. The pump 71 includes a pressurizing part 711 and a flow path 712 in the pump. The pressurization part 711 pressurizes the flow path 712 in a pump using the compressed air G2, for example. In addition, the flow path 712 in the pump has a fram portion 712a, and its shape can be forcibly changed by pressing the pressing portion 711 . By adjusting the compressed air G2, the fram part 712a of the in-pump flow path 712 deform|transforms. In a state in which the pressurization by the pressurizing unit 711 is reduced, the processing liquid is received by enlarging the fram of the internal pump channel 712 , and the pressurization by the pressurizing unit 711 is increased to increase the pressurization of the internal pump channel 712 . Shrink and send the treatment solution.

Further, the pump 71 is provided with a valve V71 for supplying the liquid, a valve V72 for discharging the liquid, and a valve V73 for venting. A flow path L71 is connected between the liquid supply valve V71 and the trap portion 72 . Further, between the upstream side of the valve V70 in the flow path L1 and the pump 71, a trap portion 72 is interposed to bypass the filter portion 73, and a valve V75 is provided. A bypass path L72 is provided. The filter unit 73 and the trap unit 72 are respectively connected to a discharge path L73 having a vent valve (not shown). Moreover, in the following embodiment, the flow path L1 which is a main flow path, the flow path L71, and the bypass path L72 may be referred to as "the flow path L" in some cases.

Among the valves provided in the liquid-delivery system 60, an air operated valve can be used for valves other than the dispensing valve V2, for example. However, the configuration of the valve is not limited thereto.

Next, the control device 100 will be described in detail with reference to FIGS. 4 and 5 . The control device 100 has a function of discharging the processing liquid from the processing liquid supply source 50 to the discharge unit 40 (nozzle 41 ) at the rear stage using the processing liquid supply unit 30 . In addition, when the processing liquid supply source 50 is replaced, the liquid delivery system 60 is cleaned, and the like, each part of the liquid delivery system 60 is controlled.

As shown in FIG. 4 , the control device 100 is a functional module (hereinafter referred to as a 'function module'), and includes a pump control unit 101 , a gas supply control unit 102 , and a liquid supply control unit 103 . and an operation command holding unit 104 .

The pump control unit 101 controls the processing liquid supply unit 30 to operate the assist pump 62 when the 'liquid replacement operation' in the liquid delivery system 60 is performed. A specific operation is specified in the operation command held by the operation command holding unit 104 . The pump control unit 101 controls the assist pump 62 based on the operation command. The liquid replacement operation refers to an operation for replacing the liquid in the liquid delivery system 60 with gas or another type of liquid. In the case of cleaning and maintenance in the liquid delivery system 60 , the operation of discharging the processing liquid in the flow path L of the liquid delivery system 60 and replacing it with a gas or another type of liquid may occur. In the case of substituting with gas, the gas to be replaced becomes the gas used in the gas supply system 80 . Specifically, for example, an inert gas (eg, nitrogen) is used. In addition, when replacing with another liquid, the target liquid is, for example, a liquid to which a liquid source is connected instead of the processing liquid supply source 50 (eg, thinner used as a cleaning liquid, etc.). In addition, a thinner used as a cleaning liquid is also used for the liquid before replacement, and it is also assumed that, for example, a case in which a different kind of thinner A is replaced with a thinner B is used. The pump control unit 101 controls in the case of such an operation.

The gas supply control unit 102 controls the processing liquid supply unit 30 to operate the gas supply system 80 when the 'liquid replacement operation' of the liquid supply system 60 is performed. A specific operation is specified in the operation command held by the operation command holding unit 104 . The gas supply control unit 102 controls each unit of the gas supply system 80 based on the operation command.

The liquid supply control unit 103 mainly controls the processing liquid supply unit 30 to discharge the processing liquid from the nozzle 41 . That is, the liquid supply control unit 103 controls the normal operation, which is an operation at the time of supplying the processing liquid to the workpiece W . In addition, the liquid supply control unit 103 also has a function of controlling the processing liquid supply unit 30 when the processing liquid supply source 50 is replaced. The operation of each unit at the time of these operations is specified in the operation command held in the operation command holding unit 104 . The liquid supply control unit 103 controls each unit of the processing liquid supply unit 30 based on the operation command.

The operation command holding unit 104 holds an operation command that defines the liquid processing sequence to be executed in the liquid processing unit U1 . The operation command includes information defining the operation of each part when discharging the processing liquid from the nozzle 41 to the workpiece W, information defining the operation of each part when replacing the processing liquid supply source 50 , Information etc. which prescribe the operation|movement of each part in the case of performing the washing|cleaning operation|movement of the liquid delivery system 60 may be included.

The control device 100 is constituted by one or a plurality of control computers. For example, the control apparatus 100 has the circuit 120 shown in FIG. The circuit 120 includes one or more processors 121 , a memory 122 , a storage 123 , an input/output port 124 , and a timer (not shown).

The storage 123 has a storage medium readable by a computer, such as a hard disk, for example. In the storage medium, a program for causing the coating/developing apparatus 2 to execute a liquid processing procedure described later is recorded. The storage medium may be a removable medium such as a nonvolatile semiconductor memory, a magnetic disk, or an optical disk. The memory 122 temporarily records the program loaded from the storage medium of the storage 123 and the operation result by the processor 121 . The processor 121 executes the program in cooperation with the memory 122, thereby configuring each of the above-described functional modules. The input/output port 124 inputs/outputs an electric signal between each unit of the processing liquid supply unit 30 .

In addition, the hardware configuration of the control device 100 is not necessarily limited to configuring each function module by a program. For example, each function module of the control device 100 may be configured by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrating the same.

[Liquid displacement method]

As an example of the control method of the said substrate processing apparatus, the method of replacing the liquid in the liquid feeding system 60 (liquid replacement method) is demonstrated.

In the case of the normal operation of performing the processing liquid supply operation to the workpiece W, the processing liquid supply source is provided to the flow path L (the flow path L1, the flow path L71, and the bypass path L72) of the liquid delivery system 60 . A treatment liquid supplied from (50) is present. On the other hand, as described above, in the case of performing the 'replacement operation with respect to the liquid', the liquid in the liquid delivery system 60 is replaced with a gas or another type of liquid.

First, with reference to the flowchart shown in FIG. 6, an example of the procedure of the operation|movement around the assist pump 62 in the case of replacing the liquid in the flow path L with gas is demonstrated. This operation corresponds to the so-called liquid extraction operation.

First, in step S01 , the control device 100 starts the operation of replacing the liquid (eg, the processing liquid) in the flow path L with the gas (gas). Specifically, the control device 100 reads, for example, an operation command that is held in the operation command holding unit 104 and corresponds to the liquid to gas replacement.

Subsequently, in steps S02 and S03, the pump control unit 101 of the control device 100 presses the pressurization unit 621 of the assist pump 62 (step S02), and the flow path in the pump The shape change of 622 is regulated (step S03). Specifically, the amount of compressed air G1 supplied to the pressurizing unit 621 is increased to increase the internal pressure of the pressurizing unit 621 . As a result, in the state where the flow path 622 in the pump is slightly contracted, the increase in the cross-sectional area of the flow path 622 in the pump due to the deformation of the fram part 622a is regulated, and the capacity of the flow path 622 in the pump as a whole is increased. is also regulated. For this reason, even when the fluid flowing through the inside increases, the flow path 622 in the pump is not in a state in which it freely changes, and a change in the pressure of the internal fluid or movement of the fluid downstream may occur.

As the degree of pressurization to the pressurizing unit 621 , for example, the shape of the flow path 622 in the pump is regulated compared with that in normal use (when discharging the processing liquid to the work W). In addition, compared with the volume when the volume of the flow path 622 in the pump is maximized, the volume in the flow path 622 in the pump may be adjusted to be about 15% to 25%. By pressurizing by the pressurizing portion 621 so that the volume is within this range, for example, it is prevented that the fram portion 622a is in close contact with the surrounding pump in-pump flow path 622 and is not easily peeled off.

In normal use, in the assist pump 62 , when the processing liquid is introduced into the assist pump 62 , the introduction amount of the compressed air G1 is reduced to pressurize the flow path 622 in the pump by the pressurizing unit 621 . is not performed (or almost no pressure is applied). Let the magnitude of the press by the press part 621 in this case be 1st pressure, for example. On the other hand, when discharging the processing liquid from the assist pump 62 to the downstream side, the introduction amount of the compressed air G1 is increased to pressurize the flow path 622 in the pump by the pressurizing unit 621 to contract it. Let the magnitude of the press by the press part 621 in this case be a 2nd pressure, for example. That is, in normal use, the magnitude of the pressing by the pressing unit 621 may be adjusted between the first pressure and the second pressure. The first pressure is, for example, 0 kPa, and the second pressure is, for example, 35 kPa.

On the other hand, the magnitude of the pressurization in the above-described steps S02 and S03 is larger than the first pressure, but may be set to a degree smaller than the second pressure. However, as described above, even if the shape of the flow path 622 in the pump is regulated and the flow rate of the fluid supplied to the flow path 622 in the pump increases, the state in which the deformation of the flow path 622 in the pump is regulated. do. As an example, the magnitude of the pressurization in steps S02 and S03 may be about 50% to 80% of the second pressure. When the magnitude of the pressurization in steps S02 and S03 becomes a value close to the second pressure, there is a possibility that the volume of the flow path 622 in the pump is maintained in a state close to zero. In this case, as described above, for example, a situation in which the fram portion 622a is in close contact with the surrounding in-pump flow path 622 may not be easily peeled off. When this situation arises, there is a possibility that the flow itself of the gas in the in-pump flow path 622 implemented at the rear stage becomes difficult. On the other hand, by making the degree of pressurization larger than a certain degree, when the gas implemented at the rear stage is introduced, the flow of the gas is performed without any problem, and the deformation of the flow path 622 in the pump can be suppressed to some extent. have.

Next, in step S04 , the gas supply control unit 102 of the control device 100 supplies the inert gas while maintaining the assist pump 62 in the above state. Specifically, the inert gas is introduced into the flow path L from the gas supply source 82 via the gas supply path R82 or the gas supply path R83 , and the inert gas is supplied into the assist pump 62 . Which of the gas supply path R82 and the gas supply path R83 is used may be changed based on which region of the liquid supply system 60 is replaced with gas or the like.

By introducing an inert gas into the assist pump 62 , the liquid remaining therein is discharged to the downstream side. At this time, when the flow rate of the inert gas is increased (when the purge pressure is increased), the supply rate of the inert gas into the in-pump flow path 622 of the assist pump 62 changes. When the inert gas flow rate is increased to some extent and introduced into the pump internal flow path 622, when the liquid in the pump internal pump flow path 622 is replaced with an inert gas, the liquid before replacement is prevented from remaining in the pump internal pump flow path 622 do. In addition, when the inert gas is introduced in a state where the deformation of the internal pump flow path 622 is regulated by the pressurizing unit 621 as described above, the pressure of the inert gas increases in the pump internal flow path 622, so that downstream The movement of the liquid to the side is further facilitated. On the other hand, when the flow rate of the inert gas is too small, there is a possibility that the inert gas may move downstream without being replaced with the liquid in the flow path 622 in the pump.

7A and 7B are diagrams schematically illustrating a change in the amount of residual liquid according to the presence or absence of deformation of the flow path 622 in the pump. In reality, only the fram part 622a deform|transforms, but in FIG. 7, the change of the volume of the in-pump flow path 622 according to the deformation|transformation of the fram part 622a is shown typically. 7A is an example of a state in which an inert gas is introduced in a state in which the deformation of the flow path 622 in the pump is regulated by the pressurizing part 621 (a state in which the expansion of the fram part is suppressed) as described above. represents As shown in the left figure of FIG.7(a), the liquid F before substitution initially retains in the pump internal flow path 622. As shown in FIG. In this state, when an inert gas is introduced while suppressing a change in the shape of the flow path 622 in the pump, the liquid F in the flow path 622 in the pump moves to the downstream side as shown in the central side view, As shown, the inside is substituted with an inert gas in a state in which the residual of the liquid F is suppressed. On the other hand, in the case of a state allowing the deformation of the flow path 622 in the pump, the flow path 622 in the pump may be deformed by the pressure of the introduced inert gas. Concretely, as shown in the left figure of FIG.7(b), the liquid F before substitution initially retains in the pump internal flow path 622. As shown in FIG. In this state, if the inert gas is introduced without suppressing the change in the shape of the flow path 622 in the pump, the liquid F in the flow path 622 in the pump moves downstream as shown in the central side view, but the inert gas When the pressure of is not high enough, a part of the liquid F may remain in the flow path 622 in the pump. As a result, as shown in the figure on the right, a part of the liquid F remains in the in-pump flow path 622 and is replaced with an inert gas.

In this way, when the displacement of the internal pump flow path 622 is regulated (repressed) and the liquid to gas (for example, inert gas) is replaced, the flow of the liquid F to the downstream side is accompanied by the introduction of the gas. This is promoted For this reason, it becomes easy to prevent the liquid from remaining in the flow path 622 in a pump. For this reason, substitution with a gas can be performed, making the residual amount of the liquid before substitution small.

Next, with reference to the flowchart shown in FIG. 8, an example of the order of the operation|movement around the assist pump 62 in the case of replacing the liquid in the flow path L with another type of liquid is demonstrated. This operation may occur, for example, when cleaning the flow path L.

First, in step S11 , the control device 100 starts the operation of replacing the liquid (eg, the first cleaning liquid) in the flow path L with another liquid (eg, the second cleaning liquid). Specifically, the control device 100 reads, for example, an operation instruction corresponding to the replacement between liquids held in the operation instruction holding unit 104 .

Subsequently, in steps S12 and S13, the pump control unit 101 of the control device 100 presses the pressurization unit 621 of the assist pump 62 (step S12), and the flow path in the pump The pressure applied to 622 is reduced to make the shape change easily (step S13). Specifically, the amount of compressed air G1 supplied to the pressurizing unit 621 is reduced to form a state in which the pressurizing unit 621 does not pressurize the flow path 622 in the pump. As a result, when the liquid is introduced into the pump internal flow passage 622, the pump internal pump flow passage 622 is in a state in which it can be freely deformed. In fact, since the liquid before substitution exists in the internal pump flow path 622, the internal pump flow path 622 becomes a state with a large volume. The magnitude of the pressurization in steps S12 and S13 may be about the first pressure described above. Specifically, the degree to which the flow path 622 in the pump can be freely deformed according to the amount of liquid in the flow path 622 in the pump.

Next, in step S14 , the pump control unit 101 of the control device 100 supplies the liquid after replacement while maintaining the assist pump 62 in the above state. Specifically, a source of the liquid after replacement is provided at a position corresponding to the source of the treatment liquid 50 , and the liquid after replacement is introduced into the flow path L . Thereby, the liquid after replacement is also supplied into the assist pump 62 .

When the liquid after replacement is supplied into the assist pump 62, the liquid before replacement and the liquid after replacement are first mixed in the flow path 622 in the pump. In addition, when the liquid after replacement is introduced, the ratio of the liquid after replacement in the internal pump flow path 622 gradually increases, and finally the liquid after replacement is replaced. At this time, by making the pressure by the pressurizing part 621 small enough to allow the flow path 622 in the pump to be freely deformed, the liquid substitution proceeds in a state in which the volume in the flow path 622 in the pump is large. Therefore, the liquid replacement in the flow path 622 in the pump can be efficiently performed.

9A and 9B are diagrams schematically illustrating the state of movement of the liquid as a liquid substitution state according to the presence or absence of deformation of the flow path 622 in the pump. Also in FIG. 9, the change in the volume of the in-pump flow path 622 according to the deformation|transformation of the fram part 622a is shown typically. FIG. 9A shows a state in which the flow path 622 in the pump is not pressurized by the pressurizing part 621 as described above. In this case, if the liquid F before substitution exists in the pump internal flow path 622, the state of the large volume of the pump internal flow path 622 is formed. In this state, when a different type of liquid (liquid after replacement) is introduced, as shown by an arrow in the figure, turbulence may occur in which the liquid is easily mixed in the center and the outer periphery of the flow path 622 in the pump. As a result, mixing and replacement of the liquid within the pump in-channel 622 tends to proceed. On the other hand, FIG. 9(b) shows an example in the case where the liquid is replaced in a state in which the deformation of the in-pump flow path 622 is regulated by the pressurizing unit 621 . In this case, from the stage in which the liquid F before substitution exists in the internal pump flow path 622, the volume of the internal pump flow path 622 is a small state. In this state, when another type of liquid (liquid after replacement) is introduced, the introduced liquid tends to flow to the downstream side quickly in the central and outer peripheral portions of the pump inner flow passage 622 as indicated by arrows in the figure. That is, since it becomes a situation in which it is difficult to generate|occur|produce the mixing of liquid in the flow path 622 in a pump, it becomes a state in which liquid substitution is difficult to advance. As described above, in the case of replacing liquids, it is assumed that the internal liquid replacement proceeds more appropriately by creating a state in which the flow of the liquid is disturbed in the internal pump flow path 622 .

[Action]

In the processing liquid supply apparatus and liquid replacement method described above, the liquid in the assist pump 62 , which is a diaphragm pump, is discharged and replaced with gas under control by the control apparatus 100 as a control unit. At this time, the control apparatus 100 as a control part controls so that the fram part 622a in the assist pump 62 may be in a contracted state compared with the expanded state. And by control by the control apparatus 100, gas is supplied into the assist pump 62, maintaining said state. By setting it as such a structure, when liquid in the assist pump 62 which is a diaphragm pump is replaced with gas, it is prevented that liquid remains in a pump. For this reason, replacement of the liquid from the gas in the flow path of the diaphragm pump is performed appropriately.

Here, when the liquid in the assist pump 62, which is a diaphragm pump, is replaced with another type of liquid, the control device 100 as a control unit maintains the expandable state of the fram unit 622a while supplying a different type of liquid. Feeding into the assist pump 62 is performed. By setting it as the above structure, when the liquid in the assist pump 62 is replaced with another type of liquid, mixing in the pump of the liquid before replacement and the liquid of another type is accelerated|stimulated. For this reason, replacement of the liquid in the flow path of the assist pump 62 which is a diaphragm pump to another type of liquid is performed appropriately.

Moreover, the control apparatus 100 as a control part controls the shape of the fram part 622a by controlling the pressure which pressurizes the fram part 622a by the press part 621 in the assist pump 62 which is a diaphragm pump. You can do it with the sun. In this case, the shape of the fram portion 622a can be flexibly controlled by using the pressing by the pressing portion 621 .

In addition, the control apparatus 100 as a control part may increase the pressure which pressurizes the fram part 622a by the press part 621, when discharging the liquid in the assist pump 62 which is a diaphragm pump. In addition, by this operation|movement, when gas is supplied, you may maintain the state in which the fram part 622a contracted. With the above configuration, even when the flow rate of the gas supplied into the pump is increased, the contracted state of the fram portion 622a can be maintained, and the liquid in the flow path of the assist pump 62, which is a diaphragm pump, is replaced by gas. This is done appropriately.

In addition, the gas supply source 82 and the gas supply paths R82 and R83 functioning as the gas supply unit are the gas supply source 81 and the gas supply path R81 used as a gas supply system from the processing liquid supply source 50 . It may be provided separately. In addition, the gas supply source 82 and gas supply paths R82, R83 may supply gas into the flow path L in upstream from the assist pump 62 as a diaphragm pump. By providing the gas supply unit separately from the gas supply system from the processing liquid supply source and supplying gas to the flow path L upstream from the diaphragm pump, the diaphragm is independent of the gas supply system around the processing liquid supply source. The liquid in the pump can be replaced. In addition, according to the above configuration, the operation of the gas supply unit is prevented from affecting the gas supply system.

As mentioned above, although various exemplary embodiment was described, it is not limited to the above-mentioned exemplary embodiment, Various abbreviation|omission, substitution, and change may be made|formed. In addition, it is possible to form other embodiments by combining elements in different embodiments.

For example, the configuration of the flow path L between the processing liquid supply source 50 and the nozzle 41 may be appropriately changed. As an example, in the above embodiment, the configuration in which the processing liquid is supplied from the processing liquid supply source 50 to one nozzle 41 and supplied to the work W has been described. However, in reality, a plurality of nozzles 41 are connected to one processing liquid supply source 50 , and the flow path L may branch on the way to supply the processing liquid to each nozzle 41 . Accordingly, the configuration of the flow path L may be changed according to the number of nozzles 41 supplying the treatment liquid from the treatment liquid supply source 50 . Also, the configuration of the liquid delivery system 60 including the pump flow path system 70 may be appropriately changed. Even when the configuration of the liquid delivery system 60 is changed, the above configuration is applicable when the diaphragm pump is provided on the flow path L.

In addition, in the said embodiment, in the assist pump 62 as a diaphragm pump, the structure which pressurizes the flow path 622 in a pump using the compressed air G1 was demonstrated. However, the diaphragm pump may operate the diaphragm in a manner different from the so-called air drive using compressed air. For example, well-known methods, such as hydraulic drive and motor direct drive drive, can be used.

From the above description, various embodiments of the present disclosure have been described herein for purposes of explanation, and it will be understood that various changes may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed in this specification are not intended to be limiting, and the true scope and gist are indicated by the appended claims.

Claims (11)

A processing liquid supply device for supplying a processing liquid from a processing liquid supply source to a processing target object through a processing liquid flow path and a nozzle, comprising:
a diaphragm pump provided in the processing liquid flow path;
a gas supply unit for supplying gas into the processing liquid flow path;
A control unit for controlling the operation of the diaphragm pump and the gas supply unit
have,
When the liquid in the diaphragm pump is replaced with gas, the control unit sets the fram part in the diaphragm pump to a contracted state compared to the expanded state, and maintains the contracted state of the fram part, and the gas supply part supplying the gas into the diaphragm pump by The method of claim 1,
The control unit, when replacing the liquid in the diaphragm pump with another type of liquid, causes the different type of liquid to be supplied into the diaphragm pump while maintaining the expandable state of the diaphragm part, . 3. The method according to claim 1 or 2,
The control unit controls the shape of the fram unit by controlling a pressure of the pressurizing unit to press the fram unit in the diaphragm pump. 4. The method of claim 3,
When the liquid in the diaphragm pump is discharged, the control unit increases the pressure for pressurizing the fram part by the pressurizing part to maintain a contracted state of the fram part when the gas is supplied by the gas supply part. which is a processing liquid supply device. The method of claim 1,
The gas supply unit is provided separately from a gas supply system used to supply the processing liquid from the processing liquid supply source toward the processing liquid flow path,
The processing liquid supply apparatus which supplies the gas into the processing liquid flow path upstream from the said diaphragm pump. A liquid replacement method in a processing liquid supply apparatus for supplying a processing liquid from a processing liquid supply source to a processing target object through a processing liquid flow path and a nozzle, comprising:
The processing liquid supply device includes a diaphragm pump provided in the processing liquid flow path, a gas supply unit for supplying gas into the processing liquid flow path, and a control unit for controlling operations of the diaphragm pump and the gas supply unit,
When replacing the liquid in the diaphragm pump with gas,
making the diaphragm part in the diaphragm pump into a contracted state compared to the expanded state by the control unit;
and discharging the liquid in the diaphragm pump by supplying the gas into the diaphragm pump by the gas supply unit while maintaining the contracted state of the fram unit by the control unit. 7. The method of claim 6,
When replacing the liquid in the diaphragm pump with another type of liquid,
The liquid replacement method further comprising supplying, by the control unit, the different type of liquid into the diaphragm pump while maintaining the expandable state of the fram portion. 8. The method of claim 6 or 7,
The control of the shape of the said fram part is performed by controlling the pressure which pressurizes the said fram part by the pressurizing part in the said diaphragm pump. 9. The method of claim 8,
When discharging the liquid in the diaphragm pump, by increasing the pressure to pressurize the fram part by the pressurizing part, liquid replacement that maintains the state in which the fram part is contracted when the gas is supplied by the gas supply part Way. 7. The method of claim 6,
The gas supply unit is provided separately from a gas supply system used to supply the processing liquid from the processing liquid supply source toward the processing liquid flow path,
and supplying the gas into the processing liquid flow path upstream from the diaphragm pump. A computer-readable storage medium storing a program for causing an apparatus to execute the liquid displacement method according to claim 6 .

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