JP2021016856A - Substrate processing device, control metho, and computer-readable storage medium - Google Patents

Abstract

To provide a substrate processing device which is useful to reduce particles in a process liquid discharged to a substrate.SOLUTION: A substrate processing device includes: a discharge part which has a nozzle for discharging a process liquid to a substrate; a liquid feeding part which feeds the process liquid to the discharge part; a replenishment part which replenishes the liquid feeding part with the process liquid fed to the discharge part; a connection part which has a switching valve for opening/closing between the replenishment part and the liquid feeding part; a filter which eliminates foreign matters contained in the process liquid replenished from the replenishment part to the liquid feeding part; a replenishment preparing part which opens the switching valve after a pressure difference between an inside of the replenishment part and an inside of the liquid feeding part is reduced; a replenishment control part which starts replenishment of the process liquid from the replenishment part to the liquid feeding part in a state that the switching valve is opened by the replenishment preparing part.SELECTED DRAWING: Figure 4

Description

The present disclosure relates to substrate processing devices, control methods, and computer-readable storage media.

Patent Document 1 discloses a processing liquid supply device that supplies a processing liquid from a processing liquid supply source to an object to be processed via a discharge unit. This treatment liquid supply device includes a first pump provided on the downstream side of the treatment liquid supply source, a filter unit provided on the secondary side of the first pump, and a filter unit for removing foreign matter in the treatment liquid. It is provided with a second pump provided on the secondary side of the filter unit. Further, the processing liquid supply device includes a control unit that executes a step of passing the processing liquid introduced into the first pump through a filter and supplying it to the second pump.

JP-A-2017-220547

The present disclosure provides a substrate processing apparatus, a control method, and a computer-readable storage medium useful for reducing particles in a processing liquid discharged onto a substrate.

The substrate processing apparatus according to one aspect of the present disclosure includes a discharge unit having a nozzle for discharging the treatment liquid to the substrate, a liquid supply unit for sending the treatment liquid to the discharge unit, and a liquid supply unit for sending the treatment liquid to the discharge unit. A replenishment unit to be replenished, a connection unit having a switching valve for opening and closing between the replenishment unit and the liquid supply unit, a filter for removing foreign matter contained in the processing liquid replenished from the replenishment unit to the liquid supply unit, and the above. A process from the replenishment unit to the liquid supply unit with the replenishment preparation unit that opens the switching valve after reducing the pressure difference between the replenishment unit and the liquid supply unit and the switching valve opened by the replenishment preparation unit. A replenishment control unit for starting replenishment of the liquid is provided.

According to the present disclosure, a substrate processing apparatus, a control method, and a computer-readable storage medium useful for reducing particles in a processing liquid discharged onto a substrate are provided.

FIG. 1 is a schematic view showing an example of a schematic configuration of a substrate processing system. FIG. 2 is a schematic view showing an example of the internal configuration of the coating and developing apparatus. FIG. 3 is a schematic view showing an example of the configuration of the liquid treatment unit. FIG. 4 is a schematic view showing an example of the treatment liquid supply unit. FIG. 5 is a block diagram showing an example of the functional configuration of the control device. FIG. 6 is a block diagram showing an example of the hardware configuration of the control device. FIG. 7 is a flowchart showing an example of the liquid treatment procedure. FIG. 8A is a flowchart showing an example of the discharge preparation procedure. FIG. 8B is a flowchart showing an example of the discharge control procedure. FIG. 9A is a schematic diagram for explaining an example of the discharge preparation procedure. FIG. 9B is a schematic diagram for explaining an example of the discharge control procedure. FIG. 10 is a flowchart showing an example of the vent preparation procedure. FIG. 11 is a flowchart showing an example of the vent control procedure. FIG. 12 is a flowchart showing an example of the replenishment preparation procedure. FIG. 13 is a flowchart showing an example of the replenishment control procedure. 14 (a) to 14 (c) are schematic views for explaining an example of the replenishment preparation procedure. FIG. 14D is a schematic diagram for explaining an example of the replenishment control procedure. 15 (a) and 15 (b) are graphs showing an example of the measurement result of the number of particles contained in the treatment liquid after discharge. 16 (a) and 16 (b) are graphs showing an example of time fluctuation of hydraulic pressure. FIG. 17A is a schematic diagram for explaining another example of the discharge preparation procedure. FIG. 17B is a schematic diagram for explaining another example of the discharge control procedure. 18 (a) and 18 (b) are graphs for explaining another example of the method of adjusting the replenishment pressure. FIG. 19 is a flowchart showing an example of the replenishment preparation procedure according to the second embodiment. FIG. 20 is a flowchart showing an example of the replenishment control procedure. 21 (a) and 21 (b) are schematic views for explaining an example of the replenishment preparation procedure. FIG. 21C is a schematic diagram for explaining an example of the replenishment control procedure. FIG. 22 is a graph showing the measurement results of the number of particles contained in the treatment liquid. 23 (a) and 23 (b) are graphs showing an example of time fluctuation of hydraulic pressure. FIG. 24 is a schematic view showing an example of the treatment liquid supply unit according to the third embodiment. FIG. 25 is a flowchart showing an example of the liquid treatment procedure. FIG. 26A is a flowchart showing an example of the discharge preparation procedure. FIG. 26B is a flowchart showing an example of the discharge control procedure. FIG. 27 is a flowchart showing an example of the replenishment preparation procedure. 28 (a) and 28 (b) are schematic views for explaining an example of the replenishment preparation procedure. FIG. 29 is a flowchart showing an example of the replenishment control procedure.

Hereinafter, various exemplary embodiments will be described with reference to the drawings. In the description, the same elements or elements having the same function are designated by the same reference numerals, and duplicate description will be omitted.

[First Embodiment]
First, the substrate processing system according to the first embodiment will be described with reference to FIGS. 1 to 18.

[Board processing system]
The substrate processing system 1 shown in FIG. 1 is a system for forming a photosensitive film, exposing the photosensitive film, and developing the photosensitive film on the substrate. The substrate to be processed is, for example, a semiconductor wafer W. The substrate to be processed is not limited to the semiconductor wafer, and may be, for example, a glass substrate, a mask substrate, an FPD (Flat Panel Display), or the like.
The photosensitive film is, for example, a resist film. The substrate processing system 1 includes a coating / developing device 2 and an exposure device 3. The exposure apparatus 3 performs an exposure process of a resist film (photosensitive film) formed on the wafer W (substrate). Specifically, the exposed portion of the resist film is irradiated with energy rays by a method such as immersion exposure. The coating / developing device 2 performs a process of forming a resist film on the surface of the wafer W (substrate) before the exposure process by the exposure device 3, and develops the resist film after the exposure process.

[Board processing equipment]
Hereinafter, the configuration of the coating / developing device 2 will be described as an example of the substrate processing device. As shown in FIGS. 1 and 2, the coating / developing device 2 includes a carrier block 4, a processing block 5, an interface block 6, and a control device 100.

The carrier block 4 introduces the wafer W into the coating / developing device 2 and derives the wafer W from the coating / developing device 2. For example, the carrier block 4 can support a plurality of carriers C for the wafer W, and includes a transfer device A1 including a transfer arm. The carrier C accommodates, for example, a plurality of circular wafers W. The transport device A1 takes out the wafer W from the carrier C, passes it to the processing block 5, receives the wafer W from the processing block 5, and returns it to the carrier C.

The processing block 5 has a plurality of processing modules 11, 12, 13, and 14. The processing modules 11, 12, 13, and 14 include a liquid processing unit U1, a heat treatment unit U2, and a transfer device A3 including a transfer arm for transporting the wafer W to these units.

The processing module 11 forms an underlayer film on the surface of the wafer W by the liquid processing unit U1 and the heat treatment unit U2. The liquid treatment unit U1 of the treatment module 11 coats the treatment liquid for forming the underlayer film on the wafer W. The heat treatment unit U2 of the processing module 11 performs various heat treatments accompanying the formation of the underlayer film.

The treatment module 12 forms a resist film on the lower layer film by the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 of the treatment module 12 applies a treatment liquid for forming a resist film on the lower film. The heat treatment unit U2 of the processing module 12 performs various heat treatments accompanying the formation of the resist film.

The treatment module 13 forms an upper layer film on the resist film by the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 of the treatment module 13 applies a liquid for forming an upper layer film on the resist film. The heat treatment unit U2 of the processing module 13 performs various heat treatments accompanying the formation of the upper layer film.

The processing module 14 develops the resist film after exposure by the liquid processing unit U1 and the heat treatment unit U2. The liquid processing unit U1 applies a developing solution on the surface of the exposed wafer W. Further, the liquid treatment unit U1 rinses the applied developer with a rinse liquid. The heat treatment unit U2 performs various heat treatments associated with the development process. Specific examples of the heat treatment include heat treatment before development treatment (PEB: Post Exposure Bake), heat treatment after development treatment (PB: Post Bake), and the like.

A shelf unit U10 is provided on the carrier block 4 side in the processing block 5. The shelf unit U10 is divided into a plurality of cells arranged in the vertical direction. A transport device A7 including an elevating arm is provided in the vicinity of the shelf unit U10. The transfer device A7 raises and lowers the wafer W between the cells of the shelf unit U10.

A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is divided into a plurality of cells arranged in the vertical direction.

The interface block 6 transfers the wafer W to and from the exposure apparatus 3. For example, the interface block 6 has a built-in transfer device A8 including a transfer arm, and is connected to the exposure device 3. The transfer device A8 passes the wafer W arranged on the shelf unit U11 to the exposure device 3. The transport device A8 receives the wafer W from the exposure device 3 and returns it to the shelf unit U11.

The control device 100 controls the coating / developing device 2 so as to execute the coating / developing process in the following procedure, for example. First, the control device 100 controls the transfer device A1 so as to transfer the wafer W in the carrier C to the shelf unit U10, and controls the transfer device A7 so as to arrange the wafer W in the cell for the processing module 11.

Next, the control device 100 controls the transfer device A3 so as to transfer the wafer W of the shelf unit U10 to the liquid processing unit U1 and the heat treatment unit U2 in the processing module 11. Further, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 so as to form an underlayer film on the surface of the wafer W. After that, the control device 100 controls the transfer device A3 so as to return the wafer W on which the underlayer film is formed to the shelf unit U10, and controls the transfer device A7 so as to arrange the wafer W in the cell for the processing module 12. ..

Next, the control device 100 controls the transfer device A3 so as to transfer the wafer W of the shelf unit U10 to the liquid processing unit U1 and the heat treatment unit U2 in the processing module 12. Further, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 so as to form a resist film on the lower layer film of the wafer W. After that, the control device 100 controls the transfer device A3 so as to return the wafer W to the shelf unit U10, and controls the transfer device A7 so as to arrange the wafer W in the cell for the processing module 13.

Next, the control device 100 controls the transfer device A3 so as to transfer the wafer W of the shelf unit U10 to each unit in the processing module 13. Further, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 so as to form an upper layer film on the resist film of the wafer W. After that, the control device 100 controls the transfer device A3 so as to transfer the wafer W to the shelf unit U11.

Next, the control device 100 controls the transfer device A8 so as to send the wafer W of the shelf unit U11 to the exposure device 3. After that, the control device 100 controls the transfer device A8 so as to receive the exposed wafer W from the exposure device 3 and arrange it in the cell for the processing module 14 in the shelf unit U11.

Next, the control device 100 controls the transfer device A3 so as to transfer the wafer W of the shelf unit U11 to each unit in the processing module 14, and the liquid processing unit U1 so as to develop the resist film of the wafer W. And the heat treatment unit U2 is controlled. After that, the control device 100 controls the transfer device A3 so as to return the wafer W to the shelf unit U10, and controls the transfer device A7 and the transfer device A1 so as to return the wafer W to the carrier C. This completes the coating / developing process.

The specific configuration of the substrate processing apparatus is not limited to the configuration of the coating / developing apparatus 2 illustrated above. The substrate processing apparatus may be any as long as it includes a liquid processing unit that discharges the processing liquid onto the wafer W to perform liquid processing and a control device that can control the liquid processing unit.

(Liquid processing unit)
Subsequently, an example of the liquid processing unit U1 in the processing module 12 will be described in detail with reference to FIGS. 3 and 4. The liquid processing unit U1 includes a rotation holding unit 20 and a processing liquid supply unit 29.

The rotation holding unit 20 holds and rotates the wafer W based on the operation instruction of the control device 100. The rotation holding unit 20 includes a holding unit 21 and a driving unit 22. The holding portion 21 supports the central portion of the wafer W arranged horizontally with the surface Wa facing upward, and holds the wafer W by suction (for example, vacuum suction). The drive unit 22 is a rotary actuator powered by, for example, an electric motor or the like, and rotates the holding unit 21 around a vertical rotation axis. As a result, the wafer W rotates around a vertical rotation axis.

The processing liquid supply unit 29 supplies the processing liquid to the wafer W rotationally held by the rotation holding unit 20. As shown in FIGS. 3 and 4, the treatment liquid supply unit 29 includes a discharge unit 30, a liquid supply unit 60, a replenishment unit 50, a first connection unit 80 (connection unit), and a second connection unit 90. And.

The discharge unit 30 discharges the processing liquid toward the surface Wa of the wafer W. The discharge unit 30 includes a nozzle 31 and a liquid supply pipe 32. The nozzle 31 discharges the processing liquid onto the wafer W. As shown in FIG. 3, the nozzle 31 is arranged above the wafer W, for example, and discharges the processing liquid downward. The liquid feed pipe 32 guides the processing liquid to the nozzle 31. The processing liquid is applied (supplied) to the wafer W by discharging the processing liquid from the nozzle 31 toward the wafer W.

As shown in FIG. 4, the liquid feeding unit 60 sends the processing liquid to the discharging unit 30. Specifically, the liquid feeding unit 60 sends the processing liquid toward the discharge unit 30 (nozzle 31) at a predetermined pressure. The liquid feeding unit 60 includes a liquid feeding pipe 61, a filter 63, a pressure feeding unit 64 (pressure feeding unit for discharging), branch pipes 62a and 62b, a first connection valve 67, a second connection valve 68, and pressure measurement. A unit 69 is provided.

The liquid feed pipe 61 guides the processing liquid to the discharge unit 30. Specifically, the liquid feed pipe 61 is connected to an end portion of the discharge portion 30 on the upstream side of the liquid feed pipe 32. The filter 63 is provided in the liquid feeding pipe 61 and removes foreign matter contained in the treatment liquid. The filter 63 collects foreign matter contained in the processing liquid passing through the liquid feeding pipe 61.

The pressure feeding unit 64 receives the processing liquid through the liquid feeding pipe 61, pressurizes the received processing liquid, and sends it out toward the discharge unit 30. The pumping unit 64 includes, for example, a pump 76, a pump driving unit 77, a flow rate measuring unit 65, and a pressure measuring unit 66.

The pump 76 has a storage chamber for accommodating the treatment liquid and a contracting portion for contracting the storage chamber. The pump 76 expands the storage chamber by the contraction portion to receive the treatment liquid, and contracts the storage chamber by the contraction portion to send out the treatment liquid. As the pump 76, for example, a tube flam pump, a diaphragm pump, or a bellows pump may be used.

The pump drive unit 77 drives the pump 76 based on the operation instruction of the control device 100. Specifically, the pump drive unit 77 operates (drives) the contraction unit so as to contract the storage chamber of the pump 76. For example, the pump drive unit 77 is an air operation type drive unit that operates the contraction unit by gas. The pump driving unit 77 may contract the storage chamber of the pump 76 by adjusting the pressure (driving pressure) of the gas.

The flow rate measuring unit 65 acquires information on the amount of processing liquid entering and exiting the pump 76. Since the flow rate of the gas for driving the pump 76 correlates with the inflow / outflow amount of the processing liquid to the pump 76, it is information regarding the inflow / outflow amount of the treatment liquid to the pump 76. For example, the flow rate measuring unit 65 measures the flow rate of gas flowing in the connecting pipe between the pump 76 and the pump driving unit 77. The flow rate measuring unit 65 outputs the measured value to the control device 100. The pressure measuring unit 66 acquires information on the pressure in the pump 76. For example, the pressure measuring unit 66 measures the pressure in the connecting pipe between the pump 76 and the pump driving unit 77. The pressure measuring unit 66 outputs the measured value to the control device 100.

The branch pipe 62a branches from the upstream portion of the filter 63 of the liquid feed pipe 61, and connects the liquid feed pipe 61 and the pump 76. The branch pipe 62b branches from the downstream portion of the filter 63 of the liquid feed pipe 61, and connects the liquid feed pipe 61 and the pump 76.

The first connection valve 67 is provided in the branch pipe 62a, and opens and closes between the liquid feeding pipe 61 and the pumping unit 64 based on the operation instruction of the control device 100. The first connection valve 67 is, for example, an air operation valve. The second connection valve 68 is provided in the branch pipe 62b, and opens and closes between the liquid feeding pipe 61 and the pumping unit 64 based on the operation instruction of the control device 100. The second connection valve 68 is, for example, an air operation valve.

The pressure measuring unit 69 measures the pressure of the processing liquid flowing through the pipeline in the liquid feeding unit 60. For example, the pressure measuring unit 69 measures the pressure between the filter 63 and the pumping unit 64. Specifically, the pressure measuring unit 69 is provided in the branch pipe 62b and measures the pressure (hydraulic pressure) of the processing liquid in the branch pipe 62b. The pressure measuring unit 69 outputs the measured value to the control device 100.

The replenishing unit 50 replenishes the liquid feeding unit 60 with the processing liquid to be sent toward the discharging unit 30. The replenishment unit 50 includes a liquid source 51, a pumping unit 53 (replenishment pumping unit), and a delivery pipe 55.

The liquid source 51 is a supply source of the treatment liquid to be replenished in the liquid feeding unit 60. The pressure feeding unit 53 sends the processing liquid from the liquid source 51 to the liquid feeding unit 60. For example, the pressure feeding unit 53 temporarily stores the processing liquid supplied from the liquid source 51 and sends the processing liquid to the liquid feeding unit 60 in a pressurized state. Alternatively, the pressure feeding unit 53 receives the processing liquid by sucking the processing liquid in the liquid source 51, for example, and sends the received treatment liquid to the liquid feeding unit 60. The pumping unit 53 includes, for example, a pump 56, a pump driving unit 57, and a pressure measuring unit 54.

The pump 56 sucks in the processing liquid in the liquid source 51 and sends the sucked treatment liquid toward the discharge unit 30. The pump 56 has, for example, a storage chamber for storing the treatment liquid and a contracting portion for contracting the storage chamber. The pump 56 expands the storage chamber by the contraction portion to receive the treatment liquid, and contracts the storage chamber by the contraction portion to send out the treatment liquid. As the pump 56, for example, a tube flam pump, a diaphragm pump, or a bellows pump may be used.

The pump drive unit 57 drives the pump 56 based on an operation instruction to the control device 100. Specifically, the pump drive unit 57 operates (drives) the contraction unit so as to contract the storage chamber of the pump 56. For example, the pump drive unit 57 is an air operation type drive unit that operates the contraction unit with gas. The pump driving unit 57 may contract the storage chamber of the pump 56 by adjusting the pressure of the gas (hereinafter, referred to as “driving pressure”).

The pressure measuring unit 54 acquires information on the pressure in the pump 56. For example, the pressure measuring unit 54 is connected to a connecting pipe between the pump 56 and the pump driving unit 57, and measures the pressure in the connecting pipe. The pressure measuring unit 54 measures, for example, the pressure of a gas for driving the pump 56. The pressure measuring unit 54 outputs the measured value to the control device 100.

The delivery pipe 55 guides the processing liquid from the pumping unit 53 (pump 56) to the liquid feeding unit 60. Specifically, the delivery pipe 55 is connected to the end of the liquid delivery unit 60 on the upstream side of the liquid supply pipe 61. That is, the liquid supply pipe 61 connects the replenishment unit 50 and the liquid supply unit 60 via the filter 63. The filter 63 removes foreign matter contained in the processing liquid (treatment liquid replenished from the replenishment unit 50 to the liquid supply unit 60) flowing through the flow path in the liquid supply pipe 61.

The first connection unit 80 connects the replenishment unit 50 and the liquid supply unit 60. The first connection portion 80 has, for example, a switching valve 71. The switching valve 71 opens and closes between the replenishment unit 50 and the liquid supply unit 60 based on the operation instruction of the control device 100. The switching valve 71 is provided at a connection point between the delivery pipe 55 of the replenishment unit 50 and the liquid supply pipe 61 of the liquid supply unit 60. The switching valve 71 is, for example, an air operation valve.

The switching valve 71 may be opened and closed at an opening degree change rate smaller than that of at least one of the first connection valve 67 and the second connection valve 68. The opening change rate is the rate of change in the valve opening per unit time. When the valve switches from the closed state to the open state, the opening change rate is the rate of increase in the valve opening. When the valve switches from the open state to the closed state, the opening change rate is the decrease rate of the valve opening. For example, as the switching valve 71, a valve that opens and closes at a speed slower than at least one of the first connection valve 67 and the second connection valve 68 may be used. Alternatively, the control device 100 may control the opening / closing operation of the switching valve 71 so as to be slower than the operating speed of at least one of the first connection valve 67 and the second connection valve 68. By controlling the opening / closing operation of the switching valve 71 so that the opening degree gradually changes by the control device 100, the relationship of the opening degree change rate may be satisfied.

The second connection unit 90 connects the liquid supply unit 60 and the discharge unit 30. The second connection portion 90 has, for example, a discharge valve 72. The discharge valve 72 opens and closes between the liquid feeding unit 60 and the discharging unit 30 based on the operation command of the control device 100. The discharge valve 72 is provided at a connection point between the liquid supply pipe 61 of the liquid supply unit 60 and the liquid supply pipe 32 of the discharge unit 30. The discharge valve 72 is, for example, an air operation valve.

The relationship between the opening degree change rate between the discharge valve 72 and the first connection valve 67 (second connection valve 68) is the relationship between the opening degree change rate between the switching valve 71 and the first connection valve 67 (second connection valve 68). May be similar to. That is, the discharge valve 72 may be opened and closed at an opening degree change rate smaller than that of at least one of the first connection valve 67 and the second connection valve 68.

(Control device)
Subsequently, the control device 100 will be described in detail with reference to FIGS. 5 and 6. The control device 100 opens the switching valve 71 after reducing the pressure difference between the replenishing unit 50 and the liquid feeding unit 60, and from the replenishing unit 50 to the liquid feeding unit 60 with the switching valve 71 opened. It is configured to start and execute the replenishment of the treatment liquid.

As shown in FIG. 5, the control device 100 has an operation command holding unit 102, a first pressure acquisition unit 103, and a second pressure acquisition unit 104 as functional modules (hereinafter, referred to as “functional modules”). A flow rate acquisition unit 105, a hydraulic pressure acquisition unit 106, and a processing liquid supply control unit 101 are provided.

The operation command holding unit 102 holds an operation command that defines the liquid processing procedure executed by the liquid processing unit U1. In this operation command, the target value (set value) of the discharge pressure when the processing liquid is discharged from the nozzle 31, the execution time for discharging the processing liquid from the nozzle 31, the target value of the replenishment pressure and the replenishment flow rate (set value), In addition, the execution time for replenishing the processing liquid from the replenishing unit 50 to the liquid feeding unit 60 may be included.

The first pressure acquisition unit 103 acquires the measured value from the pressure measurement unit 54. Specifically, the first pressure acquisition unit 103 acquires a measured value indicating the pressure in the connecting pipe between the pump 56 and the pump drive unit 57 (drive pressure to the pump 56) in the replenishment unit 50. The first pressure acquisition unit 103 outputs the acquired measured value to the processing liquid supply control unit 101.

The second pressure acquisition unit 104 acquires the measured value from the pressure measurement unit 66. Specifically, the second pressure acquisition unit 104 acquires a measured value indicating the pressure in the connecting pipe between the pump 76 and the pump drive unit 77 (drive pressure to the pump 76) in the liquid feeding unit 60. The second pressure acquisition unit 104 outputs the acquired measured value to the processing liquid supply control unit 101.

The flow rate acquisition unit 105 acquires a measured value from the flow rate measurement unit 65. Specifically, the flow rate acquisition unit 105 acquires a measured value indicating the flow rate of the gas for driving the pump 76 in the connecting pipe between the pump 76 and the pump drive unit 77. The flow rate acquisition unit 105 outputs the acquired measured value to the processing liquid supply control unit 101.

The hydraulic pressure acquisition unit 106 acquires a measured value from the pressure measurement unit 69. Specifically, the hydraulic pressure acquisition unit 106 acquires a measured value indicating the pressure of the processing liquid between the filter 63 and the pumping unit 64 (pump 76). The hydraulic pressure acquisition unit 106 outputs the acquired measured value to the processing liquid supply control unit 101.

The processing liquid supply control unit 101 controls the processing liquid supply unit 29 so as to discharge the processing liquid from the nozzle 31. As a functional module, the processing liquid supply control unit 101 includes, for example, a discharge preparation unit 111, a discharge control unit 112, a vent preparation unit 113, a vent control unit 114, a replenishment preparation unit 115, and a replenishment control unit 116. To be equipped with.

The discharge preparation unit 111 is configured to prepare for discharging the processing liquid from the nozzle 31. Specifically, the discharge preparation unit 111 starts discharging the processing liquid from the nozzle 31 before starting the pressure of the processing liquid in the liquid feeding unit 60 (hereinafter, referred to as “pressure in the liquid feeding unit 60”). To adjust. With the discharge valve 72 closed, the discharge preparation unit 111 changes the pressure in the liquid supply unit 60 so as to reduce the pressure difference between the liquid supply unit 60 and the discharge unit 30. The discharge preparation unit 111 controls the pump drive unit 77 so that the pressure in the liquid feeding unit 60 approaches the set value, for example, based on the measured value obtained from the pressure measuring unit 69. The discharge preparation unit 111 may adjust the drive pressure from the pump drive unit 77 to the pump 76 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 69 and the set value. The discharge preparation unit 111 opens the discharge valve 72 in a state where the pressure difference between the liquid feeding unit 60 and the discharge unit 30 is reduced.

The discharge control unit 112 is configured to discharge the processing liquid from the nozzle 31 toward the wafer W. Specifically, in the discharge control unit 112, the pressure difference between the liquid supply unit 60 and the discharge unit 30 is reduced by the discharge preparation unit 111, and the wafer W is connected from the nozzle 31 with the discharge valve 72 opened. Discharge the treatment liquid to the wafer. The discharge control unit 112 controls the pressure feed unit 64 (pump drive unit 77) so that the pressure of the processing liquid sent to the nozzle 31 (hereinafter, referred to as “discharge pressure”) follows the target value. By maintaining the target value at a constant set value Pd, the discharge control unit 112 discharges the processing liquid from the nozzle 31 toward the wafer W at a substantially constant flow rate. The discharge control unit 112 may adjust the drive pressure from the pump drive unit 77 to the pump 76 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 69 and the set value Pd. ..

The vent preparation unit 113 is configured to prepare for a process of returning the processing liquid from the liquid feeding unit 60 to the replenishment unit 50 (hereinafter, referred to as “vent”). Specifically, the vent preparation unit 113 adjusts the pressure of the treatment liquid in the replenishment unit 50 (hereinafter, referred to as “pressure in the replenishment unit 50”) and the pressure in the liquid supply unit 60 before the start of venting. By doing so, the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is reduced. The vent preparation unit 113 opens the switching valve 71 in a state where the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is reduced.

The vent control unit 114 is configured to execute a vent for returning the processing liquid from the liquid feeding unit 60 to the replenishing unit 50. In the vent control unit 114, the processing liquid is transferred from the pressure feed unit 64 (pump 76) to the pressure feed unit 53 (pump 56) in a state where the pressure difference between the replenishment unit 50 and the liquid feed unit 60 is reduced by the vent preparation unit 113. Start the vent to send. In the vent control unit 114, for example, the pressure of the processing liquid sent from the pumping unit 64 to the pumping unit 53 (hereinafter referred to as “vent pressure”) is maintained substantially constant, and the flow rate of the processing liquid per unit time (hereinafter referred to as “vent pressure”) is maintained. , "Bent flow rate") may be controlled so that the pressure feeding unit 64 (pump driving unit 77) and the pressure feeding unit 53 (pump driving unit 57) are maintained substantially constant.

The replenishment preparation unit 115 is configured to prepare for replenishing the processing liquid from the replenishment unit 50 to the liquid supply unit 60. Specifically, the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 50 and the liquid supply unit 60 before replenishing the treatment liquid from the replenishment unit 50 to the liquid supply unit 60, and reduces the pressure difference. The switching valve 71 is opened in the reduced state. The replenishment preparation unit 115 changes the pressure in the replenishment unit 50 so as to reduce the pressure difference between the replenishment unit 50 and the liquid feeding unit 60, for example, with the switching valve 71 closed. The replenishment preparation unit 115 may at least reduce the pressure difference after the replenishment preparation as compared with the pressure difference between the replenishment unit 50 and the liquid feeding unit 60 before the replenishment preparation is started. As an example, the replenishment preparation unit 115 changes the pressure in the replenishment unit 50 so that the pressure in the replenishment unit 50 substantially matches the pressure in the liquid feeding unit 60.

As an example of replenishment preparation, first, the replenishment preparation unit 115 has a pressure feeding unit 53 (pump drive unit 57) so that the pressure difference between the replenishment unit 50 and the liquid feeding unit 60 is reduced with the switching valve 71 closed. ) Is controlled. The replenishment preparation unit 115 may control the pump drive unit 57 so that the measured value of the pressure measuring unit 54 approaches the set value Pd. For example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 57 to the pump 56 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 54 and the set value Pd. Next, in the replenishment preparation unit 115, with the switching valve 71 opened and the discharge valve 72 and the second connection valve 68 closed, the pressure feeding unit 53 and the pressure feeding unit 64 are arranged based on the measured values of the pressure measuring unit 69. The pumping unit 53 is controlled so that the pressure between them approaches a set value (for example, a set value Pd). For example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 57 to the pump 56 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 69 and the set value Pd.

Next, in the replenishment preparation unit 115, with the switching valve 71 and the discharge valve 72 closed and the second connection valve 68 open, the pressure in the liquid feeding unit 60 is increased based on the measured value of the pressure measuring unit 69. The pumping unit 64 is controlled so as to approach the above set value (for example, the set value Pd). For example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 77 to the pump 76 so that the deviation approaches zero according to the deviation between the pressure measurement unit 69 and the set value Pd.

The replenishment control unit 116 is configured to replenish the processing liquid from the replenishment unit 50 to the liquid supply unit 60. Specifically, the replenishment control unit 116 replenishes the processing liquid from the replenishment unit 50 to the liquid supply unit 60 in a state where the switching valve 71 is opened by the replenishment preparation unit 115 (after the switching valve 71 is opened). Let's get started. As an example, in the replenishment control unit 116, the switching valve 71 is opened by the replenishment preparation unit 115, the pressure in the replenishment unit 50 is adjusted, the pressure in the liquid feeding unit 60 is adjusted, and the switching valve 71 is returned to the open state. After the switching is executed in order, the replenishment of the processing liquid to the liquid feeding unit 60 is started. The replenishment control unit 116 replenishes the treatment liquid from the replenishment unit 50 to the liquid supply unit 60 in a state where the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 50 and the liquid supply unit 60.

The replenishment control unit 116 is one of the pumping unit 53 and the pumping unit 64 so that the pressure of the processing liquid (hereinafter referred to as “replenishing pressure”) sent from the pumping unit 53 to the pumping unit 64 follows the target value. To control. While executing the follow-up control of the replenishment pressure to the target value, the replenishment control unit 116 causes the pumping unit 53 to follow the flow rate per unit time of the processing liquid (hereinafter, referred to as “replenishment flow rate”) to the target value. (Pump drive unit 57) and pumping unit 64 (pump drive unit 77) are controlled. The replenishment control unit 116 controls the replenishment pressure feeding unit 53 and the pumping unit 64 from the start of replenishment to the completion of replenishment to perform replenishment pressure follow-up control and replenishment flow rate follow-up control. The execution period of the follow-up control of the replenishment pressure and the execution period of the follow-up control of the replenishment flow rate need only partially overlap. As an example, the replenishment control unit 116 controls the pumping unit 53 so that the replenishment pressure follows the target value, and controls the pumping unit 64 so that the replenishment flow rate follows the target value.

In the control to make the replenishment pressure follow the target value, the replenishment control unit 116 may set the target value of the replenishment pressure to the target value of the discharge pressure (set value Pd) from the start of replenishment to the end of replenishment. For example, the replenishment control unit 116 adjusts the drive pressure from the pump drive unit 57 to the pump 56 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 69 and the set value Pd. The replenishment control unit 116 may set the target value of the replenishment flow rate to a constant value from the start of replenishment to the end of replenishment in the control to make the replenishment flow rate follow the target value. For example, the replenishment control unit 116 may adjust the drive pressure from the pump drive unit 77 to the pump 76 so that the replenishment flow rate follows the target value based on the measured value of the flow rate measurement unit 65. The replenishment control unit 116 may perform follow-up control of the replenishment flow rate by using a flow meter provided in the liquid feed pipe 61 or the branch pipe 62b instead of the flow rate measurement unit 65.

The control device 100 is composed of one or a plurality of control computers. For example, the control device 100 has a circuit 120 shown in FIG. The circuit 120 includes one or more processors 121, a memory 122, a storage 123, an input / output port 124, and a timer 125.

The storage 123 has a computer-readable storage medium, such as a hard disk. The storage medium records a program for causing the coating / developing apparatus 2 to execute the liquid treatment procedure described later. The storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk. The memory 122 temporarily records the program loaded from the storage medium of the storage 123 and the calculation result by the processor 121. The processor 121 constitutes each of the above-mentioned functional modules by executing the above program in cooperation with the memory 122. The input / output port 124 is between the pumping unit 53, 64, the switching valve 71, the first connection valve 67, the second connection valve 68, the discharge valve 72, the pressure measuring unit 54, 66, 69, the flow rate measuring unit 65, and the like. Input and output electric signals with. The timer 125 measures the elapsed time, for example, by counting a reference pulse having a fixed cycle.

The hardware configuration of the control device 100 is not necessarily limited to the one in which each functional module is configured by a program. For example, each functional module of the control device 100 may be composed of a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) in which the logic circuit is integrated.

[Processing liquid supply procedure]
Subsequently, with reference to FIGS. 7 to 14, the liquid processing procedure executed by the control device 100 will be described as an example of the control method of the substrate processing device. FIG. 7 is a flowchart showing an example of the liquid treatment procedure.

As shown in FIG. 7, the control device 100 first executes steps S01 and S02 in order. In step S01, for example, the discharge preparation unit 111 controls the processing liquid supply unit 29 so as to reduce the pressure difference between the liquid feeding unit 60 and the discharge unit 30 in preparation for discharging the processing liquid from the nozzle 31. To do. In step S02, for example, the discharge control unit 112 supplies the processing liquid from the nozzle 31 toward the wafer W in a state where the pressure difference between the liquid feeding unit 60 and the discharge unit 30 is reduced. The unit 29 is controlled. The details of the discharge preparation process and the discharge process will be described later.

Next, the control device 100 executes steps S03 and S04 in order. In step S03, for example, the vent preparation unit 113 processes so as to reduce the pressure difference between the replenishment unit 50 and the liquid supply unit 60 in preparation for venting to return the processing liquid from the liquid supply unit 60 to the replenishment unit 50. The liquid supply unit 29 is controlled. In step S04, for example, the vent control unit 114 returns the processing liquid from the liquid feeding unit 60 to the replenishing unit 50 in a state where the pressure difference between the replenishing unit 50 and the liquid feeding unit 60 is reduced (venting). The processing liquid supply unit 29 is controlled (to be executed). Details of the vent preparation process and the vent process will be described later.

Next, the control device 100 executes steps S05 and S06 in order. In step S05, for example, the replenishment preparation unit 115 prepares to replenish the treatment liquid from the replenishment unit 50 to the liquid supply unit 60 so as to reduce the pressure difference between the replenishment unit 50 and the liquid supply unit 60. Controls the supply unit 29. In step S06, for example, the replenishment control unit 116 causes the replenishment unit 50 to replenish the treatment liquid to the liquid supply unit 60 in a state where the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is reduced. Controls the supply unit 29. The details of the replenishment preparation process and the replenishment process will be described later. This completes a series of liquid treatment procedures. In the liquid treatment procedure, the vent preparation treatment and the vent treatment in steps S03 and S04 may be omitted, and one vent may be performed for each of a plurality of liquid treatments.

(Discharge preparation procedure)
FIG. 8A is a flowchart showing an example of the discharge preparation process in step S01. As shown in FIG. 8A, the control device 100 first executes step S11. In step S11, the discharge preparation unit 111 switches the second connection valve 68 from the closed state to the open state in a state where the switching valve 71, the discharge valve 72, the first connection valve 67, and the second connection valve 68 are closed.

Next, the control device 100 executes steps S12 and S13. In step S12, the discharge preparation unit 111 adjusts the pressure in the liquid feeding unit 60. The discharge preparation unit 111 adjusts the pressure in the liquid feeding unit 60 based on the value measured by the pressure measuring unit 69, for example, as shown in FIG. 9A. The discharge preparation unit 111 may control the pump drive unit 77 so that the value measured by the pressure measuring unit 69 follows (approaches) the set value Pd of the discharge pressure. For example, the discharge preparation unit 111 may adjust the drive pressure from the pump drive unit 77 to the pump 76 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 69 and the set value Pd. Good. In FIG. 9A, the pipelines directly and indirectly connected to the pressure measuring unit 69 are shown by thick lines, the valves in the open state are shown in white, and the valves in the closed state are painted in black. It is indicated by.

The discharge preparation unit 111 repeats steps S12 and S13 from the start of execution of step S12 until a predetermined time elapses. The predetermined time is predetermined so that the adjustment of the pressure in the liquid feeding unit 60 is repeated until the measured value of the pressure measuring unit 69 substantially matches the set value Pd, and is stored in the operation command holding unit 102. There is. In addition, the discharge preparation unit 111 may repeat the process of step S12 until the pressure in the liquid feeding unit 60 reaches the set range including the set value Pd instead of the lapse of the predetermined time. By performing steps S12 and S13, the discharge preparation unit 111 reduces the pressure difference between the liquid feeding unit 60 and the discharge unit 30 with the discharge valve 72 closed.

When it is determined that the predetermined time has elapsed, the discharge preparation unit 111 executes step S14. In step S14, for example, the discharge preparation unit 111 keeps the switching valve 71 and the first connection valve 67 in the closed state, and keeps the second connection valve 68 in the open state, and keeps the discharge valve 72 from the closed state. Switch to the open state. At this time, the discharge preparation unit 111 may switch the discharge valve 72 from the closed state to the open state at an opening change rate (slow operating speed) smaller than that of the second connection valve 68. As described above, the discharge preparation unit 111 ends the discharge preparation process.

(Discharge procedure)
FIG. 8B is a flowchart showing the discharge procedure in step S02. For example, as shown in FIG. 8B, the control device 100 has the discharge preparation unit 111 reducing the pressure difference between the liquid supply unit 60 and the discharge unit 30 and the discharge valve 72 is open. , Steps S21 and S22 are executed. In step S21, the discharge control unit 112 adjusts the discharge pressure of the processing liquid sent to the nozzle 31. In step S21, the discharge control unit 112 starts controlling the pressure feed unit 64 (the contraction part of the pump 76) so as to send the processing liquid to the discharge unit 30 at the set value Pd of the discharge pressure. As a result, the discharge control unit 112 starts discharging the processing liquid from the nozzle 31 with the discharge valve 72 opened. The discharge control unit 112 continues to adjust the discharge pressure even after the start of discharge.

For example, as shown in FIG. 9B, the discharge control unit 112 adjusts the pump drive unit 77 (pressure applied to the processing liquid from the pump 76) based on the value measured by the pressure measurement unit 69. The discharge control unit 112 may adjust the pump drive unit 77 so that the discharge pressure of the processing liquid follows the set value Pd. The discharge control unit 112 may adjust the drive pressure from the pump drive unit 77 to the pump 76 so that the deviation approaches zero according to the deviation between the value measured by the pressure measurement unit 69 and the set value Pd. .. The discharge control unit 112 repeats the processes of steps S21 and S22 until a predetermined time elapses from the start of execution of step S21.

If it is determined in step S22 that the predetermined time has elapsed, the control device 100 executes step S23. In step S23, the discharge control unit 112 switches the second connection valve 68 and the discharge valve 72 from the open state to the closed state, respectively, while keeping the switching valve 71 and the first connection valve 67 in the closed state. In step S23, the discharge control unit 112 may switch the discharge valve 72 from the open state to the closed state at an opening change rate (slow operating speed) smaller than that of the second connection valve 68. After the discharge valve 72 is closed, the pressure in the liquid feeding unit 60 is maintained at a value close to the set value Pd. The predetermined time is set in the operation command held by the operation command holding unit 102, and is set in advance according to, for example, the amount of the processing liquid used in each liquid treatment. A resist coating film may be formed on the surface Wa of the wafer W by the control device 100 controlling the rotation holding unit 20 so that the wafer W rotates during the execution of step S02.

(Vent preparation procedure)
FIG. 10 is a flowchart showing an example of the vent preparation procedure in step S03. As shown in FIG. 10, the control device 100 first executes step S31. In step S31, the vent preparation unit 113 adjusts the pressure in the replenishment unit 50 so that the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is reduced while the switching valve 71 is closed. For example, the vent preparation unit 113 controls the pump drive unit 57 (pressure in the pump 56) so that the pressure in the replenishment unit 50 approaches the set value Pd of the discharge pressure from the standby pressure Pw1. The standby pressure Pw1 is a set value at which the pressure in the replenishment unit 50 is maintained during the execution of steps S01 and S02, and may be larger than the set value Pd of the discharge pressure.

Next, the control device 100 executes step S32. In step S32, the vent preparation unit 113 switches the switching valve 71 from the closed state to the open state while keeping the first connection valve 67, the second connection valve 68, and the discharge valve 72 in the closed state. At this time, the vent preparation unit 113 may switch the switching valve 71 from the closed state to the open state at a rate of change in opening degree smaller than that of the second connection valve 68.

Next, the control device 100 executes steps S33 and S34. In step S33, the vent preparation unit 113 readjusts the pressure in the replenishment unit 50 based on the value measured by the pressure measurement unit 69. The vent preparation unit 113 controls the pump drive unit 57 so that the value measured by the pressure measurement unit 69 approaches the set value Pd, for example. In step S33, the switching valve 71 is opened and the replenishing unit 50 and the liquid feeding unit 60 are connected, but the pressure feeding unit 64 of the liquid feeding unit 60 is separated from the pipeline connected to the pressure measuring unit 69. Therefore, the pressure in the replenishment unit 50 is adjusted. The vent preparation unit 113 repeats the processes of steps S33 and S34 until a predetermined time elapses from the start of execution of step S33. The predetermined time is predetermined so that the adjustment of the pressure in the replenishment unit 50 is repeated until the pressure in the replenishment unit 50 substantially matches the set value Pd, and is stored in the operation command holding unit 102.

If it is determined in step S34 that the predetermined time has elapsed, the control device 100 executes step S35. In step S35, the vent preparation unit 113 switches the switching valve 71 from the open state to the closed state while keeping the second connection valve 68 and the discharge valve 72 in the closed state, and opens the first connection valve 67 from the closed state. Switch to the state. At this time, the vent preparation unit 113 may switch the switching valve 71 from the open state to the closed state at an opening degree change rate (slow operating speed) smaller than that of the first connection valve 67.

Next, the control device 100 executes steps S36 and S37. In step S36, the vent preparation unit 113 adjusts the pressure in the liquid feeding unit 60 based on the value measured by the pressure measuring unit 69. The vent preparation unit 113 controls the pump drive unit 77 so that the value measured by the pressure measurement unit 69 approaches the set value Pd, for example. The vent preparation unit 113 repeats the processes of steps S36 and S37 until a predetermined time elapses from the start of execution of step S36. The predetermined time is predetermined so that the pressure in the liquid feeding unit 60 is repeatedly adjusted until the pressure in the liquid feeding unit 60 substantially matches the set value Pd, and is stored in the operation command holding unit 102. There is.

If it is determined in step S37 that the predetermined time has elapsed, the vent preparation unit 113 executes step S38. In step S38, the vent control unit 114 keeps the second connection valve 68 and the discharge valve 72 in the closed state, keeps the first connection valve 67 in the open state, and opens the switching valve 71 from the closed state. Switch to. At this time, the vent control unit 114 may switch the switching valve 71 from the closed state to the open state at an opening degree change rate (slow operating speed) smaller than that of the first connection valve 67. As described above, the vent preparation unit 113 ends the vent preparation procedure.

(Vent control)
FIG. 11 is a flowchart showing an example of the vent control procedure. As shown in FIG. 11, the control device 100 first executes steps S41 and S42. In step S41, the vent control unit 114 adjusts the vent pressure of the processing liquid sent from the pressure feeding unit 64 of the liquid feeding unit 60 to the pressure feeding unit 53 of the replenishment unit 50, and the vent flow rate of the processing liquid. In step S41, the vent control unit 114 starts venting by starting the control of the pressure feeding unit 53 and the pressure feeding unit 64 in order to adjust the vent pressure and the vent flow rate, and even after the start of the vent, the vent pressure and the vent flow rate Continue adjustment. For example, the vent control unit 114 controls the pump drive unit 57 to reduce the pressure inside the pump 76 so that the vent pressure (measured value by the pressure measuring unit 69) follows the target value. Further, the vent control unit 114 controls the pump drive unit 77 so that the vent flow rate follows the target value based on the value measured by the flow rate measurement unit 65. The above target values of the vent pressure and the vent flow rate may be set to constant values until the vent is completed, for example. The vent control unit 114 repeats the processes of steps S41 and S42 until a predetermined time elapses from the start of execution of step S41. The predetermined time is predetermined so that the venting ends within the time, and is stored in the operation command holding unit 102.

If it is determined in step S42 that the predetermined time has elapsed, the control device 100 executes step S43. In step S43, the vent control unit 114 switches the switching valve 71 and the first connection valve 67 from the open state to the closed state, respectively, while keeping the second connection valve 68 and the discharge valve 72 in the closed state. At this time, the vent control unit 114 may switch the switching valve 71 from the open state to the closed state at an opening degree change rate (slow operating speed) smaller than that of the first connection valve 67. As described above, the vent control unit 114 ends the vent control procedure.

(Preparation for replenishment)
FIG. 12 is a flowchart showing an example of the replenishment preparation procedure in step S05. As shown in FIG. 12, the control device 100 first executes step S51. In step S51, the replenishment preparation unit 115 adjusts the pressure in the replenishment unit 50 so as to reduce the pressure difference between the replenishment unit 50 and the liquid feeding unit 60 with the switching valve 71 closed. The replenishment control unit 116 controls the pumping unit 53 (pump drive unit 57) based on the value measured by the pressure measuring unit 54, for example, as shown in FIG. 14A.

The replenishment control unit 116 may control the pump drive unit 57 so that the pressure in the replenishment unit 50 approaches the set value Pd of the discharge pressure. For example, the replenishment control unit 116 may adjust the drive pressure from the pump drive unit 57 to the pump 56 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 54 and the set value Pd. Good. When venting is not performed (when steps S03 and S04 are omitted), the inside of the replenishment unit 50 is maintained at the standby pressure Pw1 before the start of step S05. Therefore, in this case, the replenishment control unit 116 controls the pump drive unit 57 so that the pressure in the replenishment unit 50 approaches the set value Pd from the standby pressure Pw1.

Next, the control device 100 executes step S52. In step S52, the replenishment preparation unit 115 closes the switching valve 71 while keeping the first connection valve 67, the second connection valve 68, and the discharge valve 72 in the closed state, as shown in FIG. 14 (b). Switch from state to open state. At this time, the replenishment preparation unit 115 may switch the switching valve 71 from the closed state to the open state at an opening degree change rate (slow operating speed) smaller than that of the second connection valve 68.

Next, the control device 100 executes steps S53 and S54. In step S53, the replenishment preparation unit 115 readjusts the pressure in the replenishment unit 50 based on the value measured by the pressure measurement unit 69. Specifically, the replenishment preparation unit 115 controls the pressure feeding unit 53 so that the pressure between the pressure feeding unit 53 and the pressure feeding unit 64 approaches a predetermined set value. The replenishment preparation unit 115 may control the pump drive unit 57 so that the value measured by the pressure measurement unit 69 approaches the set value Pd, for example. For example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 57 to the pump 56 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 69 and the set value Pd. The replenishment preparation unit 115 repeats the processes of steps S53 and S54 until a predetermined time elapses from the start of execution of step S53. The predetermined time is predetermined so that the pressure in the replenishment unit 50 (pressure between the pressure feeding unit 53 and the pressure feeding unit 64) substantially matches the set value Pd within the time, and the operation command holding unit 102 is set. It is remembered.

If it is determined in step S54 that the predetermined time has elapsed, the control device 100 executes step S55. In step S55, as shown in FIG. 14C, the replenishment preparation unit 115 switches the switching valve 71 from the open state to the closed state while keeping the first connection valve 67 and the discharge valve 72 in the closed state. , The second connection valve 68 is switched from the closed state to the open state. At this time, the replenishment preparation unit 115 may switch the switching valve 71 from the open state to the closed state at an opening degree change rate (slow operating speed) smaller than that of the second connection valve 68.

Next, the control device 100 executes steps S56 and S57. In step S56, the replenishment preparation unit 115 adjusts the pressure in the liquid feeding unit 60 based on the value measured by the pressure measuring unit 69. Specifically, the replenishment preparation unit 115 is the pressure feeding unit 64 (pump driving unit 77) so that the pressure in the liquid feeding unit 60 approaches the set value used in step S53 based on the measured value of the pressure measuring unit 69. ) Is controlled. The replenishment preparation unit 115 may control the pump drive unit 77 so that the value measured by the pressure measurement unit 69 approaches the set value Pd. For example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 77 to the pump 76 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 69 and the set value Pd. The replenishment preparation unit 115 repeats the processes of steps S56 and S57 until a predetermined time elapses from the start of execution of step S56. The predetermined time is predetermined so that the pressure in the liquid feeding unit 60 substantially matches the set value Pd within the time, and is stored in the operation command holding unit 102.

If it is determined in step S57 that the predetermined time has elapsed, the control device 100 executes step S58. In step S58, the replenishment control unit 116 keeps the second connection valve 68 and the discharge valve 72 in the closed state, keeps the second connection valve 68 in the open state, and opens the switching valve 71 from the closed state. Switch to. At this time, the replenishment control unit 116 may switch the switching valve 71 from the closed state to the open state at an opening degree change rate (slow operating speed) smaller than that of the second connection valve 68. As described above, the replenishment preparation unit 115 ends the replenishment preparation procedure.

(Replenishment control)
FIG. 13 is a flowchart showing an example of the replenishment control procedure. As shown in FIG. 13, the control device 100 first executes steps S61 and S62. In step S61, the replenishment control unit 116 adjusts the replenishment pressure of the treatment liquid sent from the pressure feeding unit 53 of the replenishment unit 50 to the pressure feeding unit 64 of the liquid feeding unit 60, and the replenishment flow rate of the processing liquid. The replenishment control unit 116 starts replenishment of the treatment liquid by starting control of the pressure feeding unit 53 and the pressure feeding unit 64 in order to adjust the replenishment pressure and the replenishment flow rate. The replenishment control unit 116 continues to adjust the replenishment pressure and the replenishment flow rate even after the start of replenishment. Specifically, the replenishment control unit 116 controls either the pumping unit 53 or the pumping unit 64 so that the replenishment pressure follows the target value, and the replenishment flow rate follows the target value. And the other of the pumping unit 64 are controlled. As shown in FIG. 14D, the replenishment control unit 116 sets the pumping unit 53 (pump drive unit 57) so that the replenishment pressure follows the target value, for example, based on the value measured by the pressure measurement unit 69. You may control it. The replenishment control unit 116 may control the pumping unit 64 (pump drive unit 77) so that the replenishment flow rate follows the target value based on the value measured by the flow rate measuring unit 65.

The replenishment control unit 116 repeats the processes of steps S61 and S62 until a predetermined time elapses from the start of execution of step S61. The predetermined time is predetermined so that the replenishment of the processing liquid to the liquid feeding unit 60 (pump 76) is completed within the time, and is stored in the operation command holding unit 102. In the control to make the replenishment pressure follow the target value, the replenishment control unit 116 sets the target value of the replenishment pressure as the set value Pd of the discharge pressure (target of the discharge pressure) until a predetermined time elapses (until the replenishment of the processing liquid is completed). Value) may be set. For example, the replenishment control unit 116 replenishes from the start to the completion of replenishment so that the deviation between the measured value of the pressure measuring unit 69 and the set value Pd approaches zero and the state in which the deviation substantially coincides with zero is maintained. The drive pressure from the pump drive unit 57 to the pump 56 may be adjusted.

If it is determined in step S62 that the predetermined time has elapsed, the control device 100 executes step S63. In step S63, the replenishment control unit 116 switches the switching valve 71 and the second connection valve 68 from the open state to the closed state, respectively, while keeping the first connection valve 67 and the discharge valve 72 in the closed state. At this time, the replenishment control unit 116 may switch the switching valve 71 from the open state to the closed state at an opening degree change rate (slow operating speed) smaller than that of the second connection valve 68.

Next, the control device 100 executes step S64. In step S64, the control device 100 adjusts the pressure in the pump 56 of the replenishing unit 50 and the pressure in the pump 76 of the liquid feeding unit 60, respectively. The control device 100 adjusts the pressure in the pump 56 (pressure in the replenishment unit 50) to the standby pressure Pw1 by controlling the pump drive unit 57 based on the value measured by the pressure measurement unit 54, for example. The control device 100 adjusts the pressure in the pump 76 to the standby pressure Pw2 by controlling the pump driving unit 77 based on the value measured by the pressure measuring unit 66, for example. The standby pressure Pw2 may be smaller than the standby pressure Pw1. As described above, the replenishment control unit 116 ends the replenishment control procedure.

[Effect of Embodiment]
The coating / developing apparatus 2 described above has a discharge unit 30 having a nozzle 31 for discharging the processing liquid to the wafer W, a liquid feeding unit 60 for sending the processing liquid to the discharge unit 30, and a processing liquid for sending the processing liquid to the discharge unit 30. Is replenished to the liquid supply unit 60 from the replenishment unit 50, the first connection unit 80 having a switching valve 71 that opens and closes between the replenishment unit 50 and the liquid supply unit 60, and the replenishment unit 50. Switching is performed by the filter 63 that removes foreign matter contained in the processing liquid, the replenishment preparation unit 115 that opens the switching valve 71 after reducing the pressure difference between the replenishment unit 50 and the liquid supply unit 60, and the replenishment preparation unit 115. A replenishment control unit 116 for starting replenishment of the processing liquid from the replenishment unit 50 to the liquid supply unit 60 with the valve 71 opened is provided.

The control method of the coating / developing device 2 described above is that the switching valve 71 is opened after reducing the pressure difference between the replenishing unit 50 and the liquid feeding unit 60, and the replenishment is performed with the switching valve 71 opened. This includes starting the replenishment of the processing liquid from the unit 50 to the liquid feeding unit 60.

If the switching valve 71 is opened while the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is large, the processing liquid is hunted in the flow path for replenishing the processing liquid from the replenishing unit 50 to the liquid feeding unit 60. May occur. Hunting of the treatment liquid means that the treatment liquid reciprocates in the flow path. When hunting of the treatment liquid occurs, the treatment liquid passes through the filter 63 so as to reciprocate, so that particles are likely to be generated from the filter 63. On the other hand, in the coating / developing device 2 and the control method, the switching valve 71 is opened after the pressure difference between the replenishing unit 50 and the liquid feeding unit 60 is reduced. Therefore, the generation of particles due to the hunting of the treatment liquid is suppressed. Therefore, the coating / developing apparatus 2 and the above control method are useful for reducing particles in the processing liquid discharged to the wafer W.

In the above-described embodiment, the filter 63 is provided in the liquid feeding unit 60. If the switching valve 71 is opened when the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is large, hunting of the processing liquid to the extent that particles are generated from the filter 63 may occur in the liquid supply unit 60. .. On the other hand, in the above configuration, the switching valve 71 is opened after the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is reduced. Therefore, it is useful for suppressing the generation of particles due to the hunting of the treatment liquid in the liquid feeding unit 60.

In the above-described embodiment, the liquid feeding unit 60 receives and feeds the processing liquid from the replenishing unit 50 via the liquid feeding pipe 61 connecting the replenishing unit 50 and the discharging unit 30 via the filter 63 and the liquid feeding pipe 61. It has a pressure feeding unit 64 that sends the processing liquid to the discharge unit 30 via the liquid pipe 61, and a second connection valve 68 that opens and closes between the liquid feeding pipe 61 and the pressure feeding unit 64. The replenishment unit 50 includes a liquid source 51 and a pressure feeding unit 53 that sends the processing liquid from the liquid source 51 to the liquid feeding unit 60. The replenishment control unit 116 controls either the pumping unit 53 or the pumping unit 64 so that the replenishment pressure from the pumping unit 53 to the pumping unit 64 follows the target value. The replenishment control unit 116 controls the other of the pumping unit 53 and the pumping unit 64 so that the replenishment flow rate from the pumping unit 53 to the pumping unit 64 follows the target value. In this case, the pressure of the treatment liquid being replenished can be adjusted while adjusting the replenishment flow rate. As a result, it becomes possible to replenish the treatment liquid at a hydraulic pressure suitable for reducing particles.

In the above-described embodiment, the coating / developing device 2 reduces the pressure difference between the discharge valve 72 that opens and closes between the liquid supply unit 60 and the discharge unit 30 and the inside of the liquid supply unit 60 and the discharge unit 30. With the discharge preparation unit 111 opening the discharge valve 72 after changing the pressure in the liquid supply unit 60 and the discharge valve 72 opened by the discharge preparation unit 111, the processing liquid is discharged from the nozzle 31 to the wafer W. A discharge control unit 112 for starting is provided. In this case, since the discharge valve 72 is opened in a state where the pressure difference between the inside of the liquid feeding unit 60 and the inside of the discharge unit 30 is reduced, hunting of the processing liquid due to the opening of the discharge valve 72 can be suppressed. .. Therefore, it is more useful for reducing particles in the processing liquid discharged to the wafer W.

In the above-described embodiment, the liquid feeding unit 60 receives and feeds the processing liquid from the replenishing unit 50 via the liquid feeding pipe 61 connecting the replenishing unit 50 and the discharging unit 30 via the filter 63 and the liquid feeding pipe 61. It has a pressure feeding unit 64 that sends the processing liquid to the discharge unit 30 via the liquid pipe 61, and a second connection valve 68 that opens and closes between the liquid feeding pipe 61 and the pressure feeding unit 64. The switching valve 71 opens and closes at a rate of change in opening degree smaller than that of the second connection valve 68. With the opening / closing operation of the switching valve 71, the hydraulic pressure fluctuates during the opening / closing operation. In the above configuration, the switching valve 71 is opened and closed at a small opening change rate, so that a sudden fluctuation in the hydraulic pressure acting on the filter 63 is suppressed. Therefore, it is more useful for reducing particles in the processing liquid discharged to the wafer W.

In the above-described embodiment, the replenishment preparation unit 115 changes the pressure in the replenishment unit 50 so as to reduce the pressure difference between the replenishment unit 50 and the liquid feeding unit 60 with the switching valve 71 closed. In this case, before the switching valve 71 is opened, the pressure in the replenishing unit 50 is changed and the pressure difference between the replenishing unit 50 and the liquid feeding unit 60 is reduced, so that the switching valve 71 is opened. The hunting of the treatment liquid that accompanies this is suppressed.

In the above-described embodiment, the coating / developing device 2 includes a discharge control unit 112 that controls the pressure feeding unit 64 so that the discharge pressure of the processing liquid sent to the nozzle 31 follows the target value. In the control to make the replenishment pressure follow the target value, the replenishment preparation unit 115 sets the target value of the replenishment pressure to the target value of the discharge pressure until the replenishment of the treatment liquid is completed. In this case, since the fluctuation of the pressure acting on the filter 63 is suppressed during the replenishment of the treatment liquid, the generation of particles from the filter 63 can be further suppressed.

In the above-described embodiment, the coating / developing device 2 includes a discharge valve 72 that opens and closes between the liquid feeding unit 60 and the discharging unit 30. The liquid feeding unit 60 receives the processing liquid from the replenishing unit 50 via the liquid feeding pipe 61 connecting the replenishing unit 50 and the discharging unit 30 via the filter 63 and the liquid feeding pipe 61, and discharges the processing liquid through the liquid feeding pipe 61. A pressure feeding unit 64 that sends the processing liquid to the unit 30, a second connection valve 68 that opens and closes between the liquid feeding pipe 61 and the pressure feeding unit 64, and a pressure measuring unit that measures the pressure between the filter 63 and the pressure feeding unit 64. 69 and. The replenishment unit 50 includes a liquid source 51 and a pressure feeding unit 53 that sends the processing liquid from the liquid source 51 to the liquid feeding unit 60. The replenishment preparation unit 115 controls the pressure feeding unit 53 so that the pressure difference between the replenishing unit 50 and the liquid feeding unit 60 is reduced while the switching valve 71 is closed, and the switching valve 71 is opened. With the discharge valve 72 and the second connection valve 68 closed, the pressure feeding unit 53 is set so that the pressure between the pressure feeding unit 53 and the pressure feeding unit 64 approaches the set value based on the measured value of the pressure measuring unit 69. With the control, the switching valve 71 and the discharge valve 72 closed, and the second connection valve 68 open, the pressure in the liquid feeding unit 60 becomes the above set value based on the measured value of the pressure measuring unit 69. Controlling the pumping unit 64 so as to approach each other is executed in order. In this case, with the switching valve 71 open, the pressure in the replenishing unit 50 and the pressure in the liquid feeding unit 60 are brought close to the same set value based on the measured values of the same pressure measuring unit 69, so replenishment is started. Previously, the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is further reduced. Therefore, it is more useful for reducing particles in the processing liquid discharged to the wafer W.

15 (a) and 15 (b) are graphs showing an example of the measurement result of the number of particles contained in the treatment liquid after discharge. In FIGS. 15 (a) and 15 (b), the vertical axis indicates the number of particles. In the measurement result shown in FIG. 15A and the measurement result shown in FIG. 15B, the minimum values of the sizes of the particles to be measured are different from each other. The minimum value in the measurement result shown in FIG. 15 (b) is larger than the minimum value in the measurement result shown in FIG. 15 (a).

In the measurement of the "comparative example", the switching valve 71 is opened without reducing the pressure difference between the replenishing unit 50 and the liquid feeding unit 60, and the replenishing unit 50 to the liquid feeding unit 60 with the switching valve 71 open. The replenishment of the treatment liquid was started. The target value of the discharge pressure is maintained at the set value Pd, the pressure in the liquid feeding unit 60 in preparation for replenishment is adjusted to approach the set value Pr, and the pressure in the replenishment unit 50 during standby before discharge and during discharge is adjusted. Was maintained at the set value Pr. The set value Pr is larger than the set value Pd.

In the measurement of "Condition 1", the liquid treatment procedure was carried out in the same manner as in the above-described embodiment, except that the target value of the replenishment pressure was not maintained at the set value Pd during replenishment. In "Condition 1", in the replenishment process of the processing liquid, the pumping unit of the replenishing unit 50 is provided so that the replenishment flow rate replenished to the liquid feeding unit 60 is substantially constant without controlling the follow-up of the replenishing pressure to the target value. 53 (pump drive unit 57) was controlled. In the measurement of "Condition 2", the liquid treatment procedure was executed in the same manner as in the above-described embodiment. As shown in FIGS. 15 (a) and 15 (b), the number of particles contained in the treatment liquid is reduced by reducing the pressure difference with the switching valve 71 closed. confirmed. Further, when the measurement results of the condition 1 and the condition 2 are compared, it can be seen that the number of particles is further reduced by keeping the replenishment pressure substantially constant.

FIG. 16A shows the time variation of the measured value (hydraulic pressure) of the pressure measuring unit 69 in the comparative example. FIG. 16B shows the time variation of the measured value (hydraulic pressure) of the pressure measuring unit 69 under the condition 2. The time variation shown in FIGS. 16 (a) and 16 (b) shows the measured values when the vent preparation and the bend process are omitted. In the comparative example, the switching valve 71 is opened in a state where the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is large at the stage of replenishment preparation after the end of discharge. As shown in FIG. 16A, the hydraulic pressure fluctuates up and down around the set value Pr in the replenishment preparation. This pressure fluctuation represents the hunting of the treatment liquid described above. On the other hand, according to the measurement result of the condition 2, the switching valve 71 is opened in a state where the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is reduced at the stage of replenishment preparation after the end of discharge. As shown in FIG. 16B, the hunting (pressure fluctuation) of the treatment liquid is clearly smaller in the replenishment preparation than in the comparative example. This suppression of hunting is considered to be one of the factors for reducing particles. Further, the replenishment pressure is maintained substantially constant during the replenishment of the treatment liquid. Maintaining this replenishment pressure substantially constant is also considered to be one of the factors for reducing particles.

Although the first embodiment has been described above, the present disclosure is not necessarily limited to the above-described embodiment, and various changes can be made without departing from the gist thereof.

(Modification example 1)
In the above-described example, in the discharge process, the process liquid is sent from the liquid supply unit 60 to the discharge unit 30 without passing through the filter 63, but the discharge process is not limited to this. For example, when the liquid feeding unit 60 sends the processing liquid to the discharging unit 30, the processing liquid may be sent to the discharging unit 30 via the branch pipe 62a and the liquid feeding pipe 61 instead of the branch pipe 62b. In the discharge preparation procedure (in the same process as in step S12), as shown in FIG. 17A, the switching valve 71, the discharge valve 72, and the second connection valve 68 are closed, and the first connection valve 67 is open. Then, the discharge preparation unit 111 may adjust the pressure in the liquid feeding unit 60 by controlling the pump drive unit 77 based on the measured value of the pressure measuring unit 69.

Then, the discharge preparation unit 111 may discharge the processing liquid from the nozzle 31 with the discharge valve 72 open by executing the same control as in steps S21 to S23. At this time, as shown in FIG. 17B, the processing liquid is sent from the pumping unit 64 (pump 76) to the discharging unit 30 via the filter 63. In the state where the switching valve 71 and the second connection valve 68 are closed and the first connection valve 67 and the discharge valve 72 are open during the discharge of the processing liquid, the discharge preparation unit 111 is set to, for example, the measured value of the pressure measurement unit 69. By controlling the pump drive unit 77 based on this, the pressure in the liquid feeding unit 60 is adjusted.

(Modification 2)
In the above example, in the replenishment process, the replenishment pressure is maintained substantially constant at the set value Pd from the start of replenishment to the completion of replenishment, but the target value of the replenishment pressure during replenishment is not limited to this. For example, when the set value Pd of the discharge pressure is not suitable for replenishing the treatment liquid, the replenishment preparation unit 115 executes replenishment preparation so that the replenishment pressure becomes a pressure different from the set value Pd at the start of replenishment. May be good. Then, the replenishment control unit 116 may execute the follow-up control of the replenishment pressure to the target value so that the replenishment pressure gradually approaches the set value Pd during the replenishment of the treatment liquid. FIG. 18A shows an example in which the pressure at the start of replenishment is higher than the set value Pd of the discharge pressure. FIG. 18B shows an example in which the pressure at the start of replenishment is lower than the set value Pd of the discharge pressure.

As shown in FIG. 18A, in the replenishment preparation process in step S05, the pressure in the replenishment unit 50 and the pressure in the liquid feeding unit 60 are set values larger than the set value Pd. The treatment liquid supply unit 29 may be controlled in this way. The replenishment control unit 116 may gradually bring the target value of the replenishment pressure closer to the set value Pd (target value of the discharge pressure) from a set value larger than the set value Pd from the start of replenishment to the completion of replenishment. As a result, in the replenishment process in step S06, the replenishment pressure gradually decreases from a value larger than the set value Pd to a set value Pd substantially equal to the discharge pressure at the time of discharge.

As shown in FIG. 18B, in the replenishment preparation process in step S05, the pressure in the replenishment unit 50 and the pressure in the liquid feeding unit 60 are set values smaller than the set value Pd. The treatment liquid supply unit 29 may be controlled in this way. The replenishment control unit 116 may gradually bring the target value of the replenishment pressure closer to the set value Pd (target value of the discharge pressure) from a set value smaller than the set value Pd from the start of replenishment to the completion of replenishment. As a result, in the replenishment process in step S06, the replenishment pressure gradually increases from a value smaller than the set value Pd to a set value Pd substantially equal to the discharge pressure at the time of discharge.

The coating / developing device 2 according to the second modification includes a discharge control unit 112 that controls the pressure feeding unit 64 so that the discharge pressure of the processing liquid sent to the nozzle 31 follows the target value. In the control for making the replenishment pressure follow the target value, the replenishment control unit 116 gradually brings the target value of the replenishment pressure closer to the target value of the discharge pressure (set value Pd) until the replenishment of the treatment liquid is completed. In this case, it is possible to approach the target value of the discharge pressure during replenishment while starting the replenishment of the treatment liquid in a state where the replenishment pressure is set to a pressure suitable for replenishing the treatment liquid. As a result, the liquid treatment can be performed more efficiently.

In the liquid treatment procedure according to the above embodiment, the replenishment preparation unit 115 may omit the adjustment of the internal pressure of the replenishment unit 50 in step S53 and the adjustment of the internal pressure of the liquid supply unit 60 in step S56. .. In this case, the replenishment preparation unit 115 reduces the pressure difference by adjusting the standby pressure (processes in step S51), opens the switching valve 71 immediately before the start of replenishment, and then the replenishment control unit 116 replenishes the processing liquid. May start.

[Second Embodiment]
Subsequently, the coating / developing apparatus 2 included in the substrate processing system according to the second embodiment will be described with reference to FIGS. 19 to 23. In the liquid treatment procedure executed in the coating / developing apparatus 2 according to the second embodiment, the replenishment preparation procedure in step S05 and the replenishment control procedure in step S06 are different from those in the first embodiment. In this liquid treatment procedure, for example, the target value of the discharge pressure is set to the set value Pd, and the pressure and the replenishment pressure in the liquid feeding unit 60 before the start of discharge and before the start of replenishment are set to the set value Pr. .. The set value Pr is larger than the set value Pd.

The replenishment preparation unit 115 changes the pressure in the liquid supply unit 60 so as to reduce the pressure difference between the replenishment unit 50 and the liquid supply unit 60, for example, with the switching valve 71 closed. The replenishment preparation unit 115 may at least reduce the pressure difference after the replenishment preparation as compared with the pressure difference between the replenishment unit 50 and the liquid feeding unit 60 before the replenishment preparation is started. As an example, the replenishment preparation unit 115 changes the pressure in the liquid supply unit 60 so that the pressure in the liquid supply unit 60 substantially matches the pressure in the replenishment unit 50. As described above, in the replenishment preparation according to the first embodiment, the pressure in the replenishment unit 50 is changed in order to reduce the pressure difference, whereas in the replenishment preparation according to the second embodiment, the liquid feeding unit 60 The pressure inside is changed.

As an example of replenishment preparation, first, in the replenishment preparation unit 115, with the switching valve 71 and the discharge valve 72 closed and the second connection valve 68 open, the liquid feeding unit 115 is based on the measured value of the pressure measuring unit 69. The pumping unit 64 (pump driving unit 77) is controlled so that the pressure in 60 approaches the set value (for example, the set value Pr). For example, the replenishment preparation unit 115 adjusts the pressure from the pump drive unit 77 to the pump 76 so that the deviation approaches zero according to the deviation between the measured value of the pressure measuring unit 69 and the set value Pr. Next, the replenishment preparation unit 115 opens the switching valve 71, and then, in a state where the discharge valve 72 and the second connection valve 68 are closed, the pressure feeding unit 53 and the pressure feeding unit 115 are based on the measured values of the pressure measuring unit 69. The pumping unit 53 is controlled so that the pressure between 64 and 64 approaches the set value (for example, the set value Pr). For example, the replenishment preparation unit 115 adjusts the pressure from the pump drive unit 57 to the pump 56 so that the deviation approaches zero according to the deviation between the measured value of the pressure measuring unit 69 and the set value Pr.

The replenishment control unit 116 is sent from the replenishment unit 50 after, for example, the pressure in the liquid supply unit 60 is adjusted by the replenishment preparation unit 115 and the pressure in the replenishment unit 50 is adjusted with the switching valve 71 open. The replenishment of the treatment liquid to the liquid portion 60 is started. The replenishment control unit 116 replenishes the processing liquid from the replenishment unit 50 to the liquid supply unit 60 with the switching valve 71 open. Similar to the first embodiment, the replenishment control unit 116 controls the pressure feeding unit 53 and the pressure feeding unit 64 to perform replenishment pressure follow-up control and replenishment flow rate follow-up control. The replenishment control unit 116 may set the target value of the replenishment pressure to the set value Pr from the start of replenishment to the end of replenishment in the control to make the replenishment pressure follow the target value. For example, the replenishment control unit 116 adjusts the drive pressure from the pump drive unit 57 to the pump 56 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 69 and the set value Pr.

(Preparation for replenishment)
FIG. 19 is a flowchart showing a replenishment preparation procedure according to the second embodiment. In this replenishment preparation procedure, for example, the control device 100 first executes step S151 while the pressure in the replenishment unit 50 is maintained at the set value Pr. In step S151, for example, the replenishment control unit 116 keeps the switching valve 71, the discharge valve 72, and the first connection valve 67 in the closed state as shown in FIG. 21A, and the second connection valve 68. Switch from the closed state to the open state.

Next, the control device 100 executes steps S152 and S153. In step S152, the replenishment control unit 116 adjusts the pressure in the liquid supply unit 60 so as to reduce the pressure difference between the replenishment unit 50 and the liquid supply unit 60 with the switching valve 71 closed. The replenishment control unit 116 controls the pumping unit 64 (pump drive unit 77) based on the value measured by the pressure measuring unit 69, for example, as shown in FIG. 21A. The replenishment control unit 116 may control the pump drive unit 77 so that the pressure in the liquid feeding unit 60 approaches the set value Pr of the replenishment pressure. For example, the replenishment control unit 116 may adjust the drive pressure from the pump drive unit 77 to the pump 76 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 69 and the set value Pr. Good. The replenishment control unit 116 repeats the processes of steps S152 and S153 until a predetermined time elapses from the start of execution of step S152. The predetermined time is predetermined so that the pressure in the liquid feeding unit 60 substantially matches the set value Pr within the time, and is stored in the operation command holding unit 102.

If it is determined in step S153 that the predetermined time has elapsed, the control device 100 executes step S154. In step S154, as shown in FIG. 21B, the replenishment preparation unit 115 switches the switching valve 71 from the closed state to the open state while keeping the first connection valve 67 and the discharge valve 72 in the closed state. , The second connection valve 68 is switched from the open state to the closed state. At this time, the replenishment preparation unit 115 may switch the switching valve 71 from the closed state to the open state at an opening degree change rate (slow operating speed) smaller than that of the second connection valve 68.

Next, the control device 100 executes steps S155 and S156. In step S155, for example, the replenishment preparation unit 115 adjusts the pressure in the replenishment unit 50 (between the pumping unit 53 and the pressure feeding unit 64) based on the value measured by the pressure measuring unit 69. Specifically, the replenishment preparation unit 115 may control the pressure feeding unit 53 so that the pressure between the pressure feeding unit 53 and the pressure feeding unit 64 approaches the set value used in step S152. The replenishment preparation unit 115 controls the pump drive unit 57 so that the value measured by the pressure measurement unit 69 approaches the set value Pr, for example. As an example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 57 to the pump 56 according to the deviation between the measured value of the pressure measurement unit 69 and the set value Pr so that the deviation approaches zero. The replenishment preparation unit 115 repeats the processes of steps S155 and S156 until a predetermined time elapses from the start of execution of step S155. The predetermined time is predetermined so that the pressure between the pumping unit 53 and the pumping unit 64 substantially matches the set value Pr within the time, and is stored in the operation command holding unit 102.

If it is determined in step S156 that the predetermined time has elapsed, the replenishment preparation unit 115 executes step S157. In step S157, the replenishment control unit 116 keeps the first connection valve 67 and the discharge valve 72 in the closed state, and keeps the switching valve 71 in the open state, and opens the second connection valve 68 from the closed state. Switch to. As described above, the replenishment preparation unit 115 ends the replenishment preparation procedure.

In the replenishment preparation procedure according to the first embodiment, the pressure adjustment in the replenishment unit 50 when the switching valve 71 is closed, the pressure readjustment in the replenishment unit 50 when the switching valve 71 is open, and the switching valve The pressure in the liquid feeding unit 60 is adjusted in this order when the 71 is closed. On the other hand, in the replenishment preparation procedure according to the second embodiment described above, the pressure in the liquid feeding unit 60 when the switching valve 71 is closed and the pressure in the replenishing unit 50 when the switching valve 71 is open. The pressure is adjusted in this order.

(Replenishment control)
FIG. 20 is a flowchart showing an example of the replenishment control procedure according to the second embodiment. As shown in FIG. 20, the control device 100 executes steps S161 and S162. In step S162, the replenishment control unit 116 adjusts the replenishment pressure of the treatment liquid sent from the pressure feeding unit 53 of the replenishment unit 50 to the pressure feeding unit 64 of the liquid feeding unit 60, and the replenishment flow rate of the processing liquid. And by starting the control of the pressure feeding unit 64, the replenishment of the treatment liquid is started. For example, as shown in FIG. 21C, the replenishment control unit 116 executes follow-up control to the target values of the replenishment pressure and the replenishment flow rate, respectively, as in steps S61 and S62.

The replenishment control unit 116 repeats the processes of steps S161 and S162 until a predetermined time elapses from the start of execution of step S162. The predetermined time is predetermined so that the replenishment of the processing liquid to the liquid feeding unit 60 (pump 76) is completed within the time, and is stored in the operation command holding unit 102. In the control to make the replenishment pressure follow the target value, the replenishment control unit 116 may set the target value of the replenishment pressure to the set value Pr until a predetermined time elapses (until the replenishment of the treatment liquid is completed). For example, the replenishment control unit 116 replenishes from the start to the completion of replenishment so that the deviation between the measured value of the pressure measuring unit 69 and the set value Pr approaches zero and the state in which the deviation substantially coincides with zero is maintained. The drive pressure from the pump drive unit 57 to the pump 56 is adjusted.

If it is determined in step S162 that the predetermined time has elapsed, the control device 100 executes step S163. In step S163, the replenishment control unit 116 changes the switching valve 71 and the second connection valve 68 from the open state to the closed state while keeping the first connection valve 67 and the discharge valve 72 in the closed state as in step S64. Switch each. At this time, the replenishment control unit 116 may switch the switching valve 71 from the open state to the closed state at an opening degree change rate (slow operating speed) smaller than that of the second connection valve 68.

Next, the control device 100 executes step S164. In step S164, the control device 100 adjusts the pressure in the pump 56 of the replenishing unit 50 and the pressure in the pump 76 of the liquid feeding unit 60, respectively. The control device 100 adjusts the pressure in the pump 56 (pressure in the replenishment unit 50) to the set value Pr (standby pressure) by controlling the pump drive unit 57 based on the value measured by the pressure measuring unit 54, for example. To do. The control device 100 adjusts the pressure in the pump 76 to a standby pressure smaller than the set value Pr by, for example, controlling the pump drive unit 77 based on the value measured by the pressure measuring unit 66. As described above, the replenishment control unit 116 ends the replenishment control procedure.

In the discharge control of the treatment liquid performed in the liquid treatment procedure according to the second embodiment, as shown in FIG. 9B, the treatment liquid is discharged from the pumping unit 64 (pump 76) without passing through the filter 63. May be sent to. Alternatively, as shown in FIG. 17B, the processing liquid may be sent from the pumping unit 64 (pump 76) to the discharging unit 30 via the filter 63.

In the vent preparation procedure performed in the liquid treatment procedure according to the second embodiment, the pressure adjustment in the liquid feeding unit 60 with the switching valve 71 closed and the switching valve 71 opened are the same as in the replenishment preparation described above. The pressure adjustment in the replenishment unit 50 in the state may be performed in this order.

[Effect of the second embodiment]
In the coating / developing apparatus 2 and the liquid treatment procedure according to the second embodiment described above, as in the first embodiment, the switching valve is used after the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is reduced. 71 is opened. Therefore, when the switching valve 71 is opened, the occurrence of hunting of the processing liquid in the flow path for replenishing the processing liquid from the replenishing unit 50 to the liquid feeding unit 60 is suppressed. In the second embodiment described above, the filter 63 is provided in the liquid feeding unit 60, and the occurrence of hunting of the treatment liquid is suppressed in the liquid feeding unit 60. Therefore, it is useful for reducing particles in the processing liquid discharged to the wafer W.

In the second embodiment described above, in the state where the switching valve 71 is closed, the replenishment preparation unit 115 applies the pressure in the liquid supply unit 60 so as to reduce the pressure difference between the replenishment unit 50 and the liquid supply unit 60. change. In this case, before the switching valve 71 is opened, the pressure in the liquid feeding unit 60 is changed and the pressure difference between the replenishing unit 50 and the liquid feeding unit 60 is reduced, so that the switching valve 71 is opened. The hunting of the treatment liquid generated in association with this is suppressed. The volume of the processing liquid in the pumping unit 64 (pump 76) of the liquid feeding unit 60 is often smaller than the volume of the processing liquid in the pumping unit 53 (pump 56) of the replenishing unit 50. Further, regarding the piping volume up to the filter 63 and the pressure measuring unit 69, the liquid feeding unit 60 side is smaller than the replenishing unit 50 side (the distance between the pumping unit 64 and the pressure measuring unit 69 is smaller between the pressure feeding unit 53 and the pressure measurement unit 69). Often shorter than the distance to part 69). Therefore, since the pressure in the liquid feeding unit 60 is changed in the above configuration, it is possible to perform (more accurate) pressure control and rapid pressure control with higher resolution than in the first embodiment.

In the second embodiment described above, the liquid feeding unit 60 receives the processing liquid from the liquid feeding pipe 61 connecting the replenishing unit 50 and the discharging unit 30 via the filter 63 and the replenishing unit 50 via the liquid feeding pipe 61. It has a pressure feeding unit 64 that sends the processing liquid to the discharge unit 30 via the liquid feeding pipe 61, and a second connection valve 68 that opens and closes between the liquid feeding pipe 61 and the pressure feeding unit 64. The replenishment unit 50 includes a liquid source 51 and a pressure feeding unit 53 that sends the processing liquid from the liquid source 51 to the liquid feeding unit 60. The replenishment control unit 116 controls either the pumping unit 53 or the pumping unit 64 so that the replenishment pressure from the pumping unit 53 to the pumping unit 64 follows the target value. The replenishment control unit 116 controls the other of the pumping unit 53 and the pumping unit 64 so that the replenishment flow rate from the pumping unit 53 to the pumping unit 64 follows the target value. In this case, the pressure of the treatment liquid being replenished can be adjusted while adjusting the replenishment flow rate. As a result, it becomes possible to replenish the treatment liquid at a hydraulic pressure suitable for reducing particles.

In the second embodiment described above, the coating / developing device 2 reduces the pressure difference between the discharge valve 72 that opens and closes between the liquid supply unit 60 and the discharge unit 30 and the inside of the liquid supply unit 60 and the discharge unit 30. Discharge of the processing liquid from the nozzle 31 to the wafer W in a state where the discharge preparation unit 111 that opens the discharge valve 72 after changing the pressure in the liquid supply unit 60 and the discharge valve 72 are opened by the discharge preparation unit 111. A discharge control unit 112 for starting the above. In this case, since the discharge valve 72 is opened in a state where the pressure difference between the inside of the liquid feeding unit 60 and the inside of the discharge unit 30 is reduced, hunting of the processing liquid due to the opening of the discharge valve 72 can be suppressed. .. Therefore, it is more useful for reducing particles in the processing liquid discharged to the wafer W.

In the second embodiment described above, the liquid feeding unit 60 receives the processing liquid from the liquid feeding pipe 61 connecting the replenishing unit 50 and the discharging unit 30 via the filter 63 and the replenishing unit 50 via the liquid feeding pipe 61. It has a pressure feeding unit 64 that sends the processing liquid to the discharge unit 30 via the liquid feeding pipe 61, and a second connection valve 68 that opens and closes between the liquid feeding pipe 61 and the pressure feeding unit 64. The switching valve 71 opens and closes at a rate of change in opening degree smaller than that of the second connection valve 68. With the opening / closing operation of the switching valve 71, the hydraulic pressure fluctuates during the opening / closing operation. In the above configuration, the switching valve 71 is opened and closed at a small opening change rate, so that a sudden fluctuation in the hydraulic pressure acting on the filter 63 is suppressed. Therefore, it is more useful for reducing particles in the processing liquid discharged to the wafer W.

In the second embodiment described above, the coating / developing device 2 has a switching valve 71 that opens and closes between the replenishment unit 50 and the liquid supply unit 60, and a discharge valve that opens and closes between the liquid supply unit 60 and the discharge unit 30. And. The liquid feeding unit 60 receives the processing liquid from the replenishing unit 50 via the liquid feeding pipe 61 connecting the replenishing unit 50 and the discharging unit 30 via the filter 63 and the liquid feeding pipe 61, and discharges the processing liquid through the liquid feeding pipe 61. A pressure feeding unit 64 that sends the processing liquid to the unit 30, a second connection valve 68 that opens and closes between the liquid feeding pipe 61 and the pressure feeding unit 64, and a pressure measuring unit that measures the pressure between the filter 63 and the pressure feeding unit 64. 69 and. The replenishment unit 50 includes a liquid source 51 and a pressure feeding unit 53 that sends the processing liquid from the liquid source 51 to the liquid feeding unit 60. In the replenishment preparation unit 115, with the switching valve 71 and the discharge valve 72 closed and the second connection valve 68 open, the pressure in the liquid feed pipe 61 becomes a set value based on the measured value of the pressure measuring unit 69. Control the pumping unit 64 so that it approaches, and with the switching valve 71 open and the discharge valve 72 and the second connection valve 68 closed, the pressure feeding unit 53 and pumping are based on the measured values of the pressure measuring unit 69. Controlling the pumping unit 53 so that the pressure between the unit 64 and the unit 64 approaches the set value is executed in order. In this case, since the pressure in the replenishing unit 50 and the pressure in the liquid feeding unit 60 are brought close to the same set value based on the measured values of the same pressure measuring unit 69, the pressure in the replenishing unit 50 and the liquid feeding unit are sent before the start of replenishment. The pressure difference with the inside of the unit 60 is reduced more reliably. Therefore, it is more useful for reducing particles in the processing liquid discharged to the wafer W. Since the pressure in the liquid feeding unit 60 is adjusted first in the state where the switching valve 71 is closed unlike the first embodiment, the pressure adjustment range in the replenishing unit 50 is small. Therefore, even when the pressure on the liquid feeding unit 60 side and the pressure on the replenishing unit 50 side are adjusted to the set values before the start of replenishment of the treatment liquid, quicker pressure control is possible as compared with the first embodiment. Become.

FIG. 22 is a graph showing an example of the measurement result of the number of particles contained in the processing liquid after discharge. In FIG. 22, the vertical axis shows the number of particles. FIG. 22 shows the measurement result in "Comparative Example 1", the measurement result in "Comparative Example 2", the measurement result in "Condition 1", and the measurement result in "Condition 2". In the measurements of Comparative Example 1 and Comparative Example 2, the switching valve 71 was opened without reducing the pressure difference between the replenishing unit 50 and the liquid feeding unit 60, and the liquid was supplied from the replenishing unit 50 with the switching valve 71 open. The replenishment of the treatment liquid to the part 60 was started. In Comparative Example 1, when the treatment liquid was discharged, the treatment liquid was discharged through the filter 63. In Comparative Example 2, when the treatment liquid was discharged, the treatment liquid was discharged without passing through the filter 63.

Under the conditions 1 and 2, the switching valve 71 is opened by reducing the pressure difference between the replenishing unit 50 and the liquid feeding unit 60, and the switching valve 71 is opened, as in the liquid treatment procedure according to the second embodiment. In this state, the replenishment unit 50 started replenishing the treatment liquid to the liquid supply unit 60. Under condition 1, the treatment liquid was discharged through the filter 63 when the treatment liquid was discharged. Under condition 2, the treatment liquid was discharged without passing through the filter 63. In any of Comparative Example 1, Comparative Example 2, Condition 1, and Condition 2, the pressure at the time of replenishing the treatment liquid was set to a set value Pr larger than the set value Pd of the discharge pressure.

Comparing the measurement results of Comparative Example 1 and Condition 1, it can be seen that the number of particles is reduced by reducing the pressure difference and opening the switching valve 71. Comparing the measurement results of Comparative Example 2 and Condition 2, it can be seen that the number of particles is reduced by reducing the pressure difference and opening the switching valve 71. FIG. 23A shows the time variation of the measured value (hydraulic pressure) of the pressure measuring unit 69 under the condition 2. Compared with the time fluctuation of the hydraulic pressure when the switching valve 71 is opened without reducing the pressure difference (for example, the time fluctuation shown in FIG. 14A), the hunting (pressure fluctuation) of the processing liquid in the replenishment preparation is You can see that it is small. This suppression of hunting is considered to be a factor in reducing particles. Under condition 2, the target value of the replenishment pressure of the treatment liquid being replenished was maintained at the set value Pr for the measurement.

(Modification example)
The target value of the replenishment pressure of the treatment liquid being replenished may be maintained at the set value Pr as described above, but the target value of the replenishment pressure is gradually set to the target value of the discharge pressure until the replenishment of the treatment liquid is completed. You may bring them closer. FIG. 23B shows the time variation of the hydraulic pressure when the pressure at the start of replenishment is set to the set value Pr and the replenishment pressure is brought close to the set value Pd during replenishment. In the follow-up control of the replenishment pressure target value, the replenishment control unit 116 gradually brings the replenishment pressure target value closer to the set value Pd (discharge pressure target value) from the set value Pr from the replenishment start to the replenishment completion. May be good. As a result, in the replenishment process in step S06, the replenishment pressure gradually decreases from the set value Pr to the set value Pd substantially equal to the discharge pressure at the time of discharge.

The coating / developing device 2 according to the above modification includes a discharge control unit 112 that controls the pressure feeding unit 64 so that the discharge pressure of the processing liquid sent to the nozzle 31 follows a target value. In the control for making the replenishment pressure follow the target value, the replenishment control unit 116 gradually brings the target value of the replenishment pressure closer to the target value of the discharge pressure until the replenishment of the treatment liquid is completed. In this case, it is possible to approach the target value of the discharge pressure during replenishment while starting the replenishment of the treatment liquid in a state where the replenishment pressure is set to a pressure suitable for replenishing the treatment liquid. As a result, the liquid treatment can be performed more efficiently.

In the liquid treatment procedure according to the second embodiment, the set value Pr of the replenishment pressure and the set value Pd of the discharge pressure may be set to substantially equal values.

[Third Embodiment]
Subsequently, the coating / developing apparatus 2 included in the substrate processing system according to the third embodiment will be described with reference to FIGS. 24 to 29. The liquid treatment unit U1 of the coating / developing apparatus 2 according to the third embodiment includes a treatment liquid supply unit 29A instead of the treatment liquid supply unit 29. The processing liquid supply unit 29A supplies the processing liquid to the wafer W rotationally held by the rotation holding unit 20 in the same manner as the processing liquid supply unit 29. As shown in FIG. 24, the processing liquid supply unit 29A includes a discharge unit 30, a liquid supply unit 210, a first connection unit 230 (connection unit), a replenishment unit 250, and a second connection unit 90. Be prepared.

The liquid feeding unit 210 sends the processing liquid to the discharging unit 30. Specifically, the liquid feeding unit 210 delivers the processing liquid toward the discharge unit 30 (nozzle 31) at a predetermined pressure. The liquid feeding unit 210 is connected to the discharging unit 30 via the second connecting unit 90 (discharge valve 72). The liquid feeding unit 210 and the discharging unit 30 are opened and closed by the discharging valve 72. The liquid feeding unit 210 includes, for example, a liquid feeding pipe 212 and a pressure feeding unit 214 (discharging pressure feeding unit).

The liquid feed pipe 212 guides the processing liquid to the discharge unit 30. Specifically, the liquid feed pipe 212 is connected to the end of the discharge portion 30 on the upstream side of the liquid feed pipe 32 via the discharge valve 72. The pumping unit 214 receives the processing liquid from the replenishing unit 250, pressurizes the received processing liquid, and sends it out toward the discharge unit 30. The pumping unit 214 includes, for example, a pump 216, an output valve 218, a pump driving unit 222, and a pressure measuring unit 224.

The pump 216 has a storage chamber for accommodating the treatment liquid and a contracting portion for contracting the storage chamber. The pump 216 expands the storage chamber by the contraction portion to receive the treatment liquid, and contracts the storage chamber by the contraction portion to send out the treatment liquid. As the pump 216, for example, a tube flam pump, a diaphragm pump, or a bellows pump may be used. The output valve 218 is provided in the liquid feed pipe 212, and opens and closes the flow path in the liquid feed pipe 212 based on the operation instruction of the control device 100. The output valve 218 is, for example, an air operation valve.

The pump drive unit 222 drives the pump 216 based on the operation instruction of the control device 100. Specifically, the pump drive unit 222 operates (drives) the contraction unit so as to contract the storage chamber of the pump 216. For example, the pump drive unit 222 is an air operation type drive unit that operates the contraction unit by gas. The pump drive unit 222 may contract the storage chamber of the pump 216 by adjusting the pressure (drive pressure) of the gas. The pressure measuring unit 224 acquires information on the pressure in the pump 216. For example, the pressure measuring unit 224 measures the pressure in the connecting pipe between the pump 216 and the pump driving unit 222. The pressure measuring unit 224 outputs the measured value to the control device 100.

The first connecting unit 230 connects between the liquid feeding unit 210 and the replenishing unit 250. The liquid feeding unit 210 receives the processing liquid via the first connecting unit 230. The first connecting portion 230 includes, for example, a connecting pipe 232, a filter 234, a first switching valve 236 (switching valve), and a second switching valve 238.

The connecting pipe 232 guides the processing liquid to the liquid feeding unit 210 (pump 216). Specifically, the downstream end of the connecting pipe 232 is connected to the liquid feeding unit 210, and the upstream end of the connecting pipe 232 is connected to the replenishing unit 250. In this way, the connecting pipe 232 connects the liquid feeding unit 210 (pump 216) and the replenishing unit 250, and forms a flow path for replenishing the processing liquid from the replenishing unit 250 to the liquid feeding unit 210. doing. The filter 234 is provided on the connecting pipe 232 and removes foreign matter contained in the treatment liquid. Specifically, the filter 234 removes foreign matter contained in the processing liquid (treatment liquid replenished from the replenishing unit 250 to the liquid feeding unit 210) flowing through the flow path in the connecting pipe 232.

The first switching valve 236 and the second switching valve 238 open and close between the liquid feeding unit 210 and the replenishing unit 250. The first switching valve 236 is provided downstream of the filter 234 of the connecting pipe 232. The first switching valve 236 opens and closes between the filter 234 and the liquid feeding unit 210 in the flow path in the connecting pipe 232 based on the operation instruction of the control device 100. The second switching valve 238 is provided upstream of the filter 234 of the connecting pipe 232. The second switching valve 238 opens and closes between the filter 234 and the replenishment unit 250 in the flow path in the connecting pipe 232 based on the operation instruction of the control device 100. The first switching valve 236 and the second switching valve 238 are, for example, air operation valves.

The replenishing unit 250 replenishes the liquid feeding unit 210 with the processing liquid to be sent toward the discharging unit 30. The replenishment unit 250 includes, for example, a liquid source 252, a storage tank 254, a pressure feeding unit 256 (replenishment pressure feeding unit), and a liquid feeding pipe 262.

The liquid source 252 is a supply source of the treatment liquid to be replenished in the liquid feeding unit 210. The liquid source 252 supplies the processing liquid to the pressure feeding unit 256 via the liquid feeding pipe 262. The storage tank 254 is provided in the liquid feeding pipe 262, and temporarily stores the processing liquid to be supplied to the pumping unit 256.

The pressure feeding unit 256 sends the processing liquid from the storage tank 254 to the liquid feeding unit 210 through the first connecting unit 230. The pumping unit 256 receives the processing liquid from the storage tank 254, pressurizes the received processing liquid, and sends it to the first connection unit 230. The pumping unit 256 includes, for example, a pump 266, a pump driving unit 272, and a pressure measuring unit 274.

The pump 266 has a storage chamber for accommodating the treatment liquid and a contracting portion for contracting the storage chamber. The pump 266 expands the storage chamber by the contraction portion to receive the treatment liquid, and contracts the storage chamber by the contraction portion to send out the treatment liquid. As the pump 266, for example, a tube flam pump, a diaphragm pump, or a bellows pump may be used.

The pump drive unit 272 drives the pump 266 based on the operation instruction of the control device 100. Specifically, the pump drive unit 272 operates (drives) the contraction unit so as to contract the storage chamber of the pump 266. For example, the pump drive unit 272 is an air operation type drive unit that operates the contraction unit by gas. The pump drive unit 272 may contract the storage chamber of the pump 266 by adjusting the pressure (drive pressure) of the gas. The pressure measuring unit 274 acquires information on the pressure in the pump 266. For example, the pressure measuring unit 274 measures the pressure in the connecting pipe between the pump 266 and the pump driving unit 272. The pressure measuring unit 274 outputs the measured value to the control device 100.

The treatment liquid supply unit 29A described above is also controlled by the control device 100 in the same manner as the treatment liquid supply unit 29 according to the first embodiment and the second embodiment. The control device 100 opens the first switching valve 236 after reducing the pressure difference between the replenishing unit 250 and the liquid feeding unit 210, and sends the first switching valve 236 from the replenishing unit 250 in the opened state. It is configured to start replenishing the liquid portion 210 with the treatment liquid and to execute.

The discharge preparation unit 111 of the control device 100 adjusts the pressure of the processing liquid in the liquid feeding unit 210 before starting the discharge of the processing liquid from the nozzle 31. With the output valve 218 open and the discharge valve 72 closed, the discharge preparation unit 111 changes the pressure in the liquid supply unit 210 so as to reduce the pressure difference between the liquid supply unit 210 and the discharge unit 30. .. The discharge preparation unit 111 opens the discharge valve 72 in a state where the pressure difference between the liquid feeding unit 210 and the discharge unit 30 is reduced.

The replenishment preparation unit 115 of the control device 100 prepares for replenishing the processing liquid from the replenishment unit 250 to the liquid supply unit 210. Specifically, the replenishment preparation unit 115 is a replenishment unit so as to reduce the pressure difference between the replenishment unit 250 and the liquid feeding unit 210 in a state where the first switching valve 236 and the second switching valve 238 are closed. The pressure in the 250 and the pressure in the liquid feeding unit 210 may be changed. After that, the replenishment preparation unit 115 reduces the pressure difference between the inside of the first connection unit 230 and the inside of the liquid feeding unit 210 after opening the second switching valve 238 while keeping the first switching valve 236 closed. The pressure between the replenishment unit 250 (pump 266) and the second switching valve 238 and the pressure in the liquid feeding unit 210 are changed so as to be caused. By these treatments, the pressure difference after the replenishment preparation is reduced as compared with the pressure difference between the replenishment unit 250 and the liquid feeding unit 210 before the replenishment preparation is started. The replenishment preparation unit 115 opens the first switching valve 236 in a state where the pressure difference between the replenishment unit 250 and the liquid supply unit 210 is reduced.

The replenishment preparation unit 115 may at least reduce the pressure difference after the replenishment preparation as compared with the pressure difference between the replenishment unit 250 and the liquid feeding unit 210 before the replenishment preparation is started. As an example, the replenishment preparation unit 115 controls the pumping unit 256 so that the pressure in the replenishment unit 250 (the pressure in the first connection unit 230) substantially matches the first set value Pr1, and the replenishment preparation unit 115 in the liquid supply unit 210. The pumping unit 214 is controlled so that the pressure substantially matches the second set value Pr2. The first set value Pr1 and the second set value Pr2 may be substantially the same as each other, and the first set value Pr1 may be larger or smaller than the second set value Pr2. In the following, a case where the first set value Pr1 is set to a value larger than the second set value Pr2 will be illustrated. In one example, the first set value Pr1 is set to a value about 1 kPa to 15 kPa larger than the second set value Pr2.

As an example of replenishment preparation, first, the replenishment preparation unit 115 is pumped so that the pressure in the replenishment unit 250 approaches the first set value Pr1 in a state where the first switching valve 236 and the second switching valve 238 are closed. The unit 256 is controlled, and the pressure feeding unit 214 is controlled so that the pressure in the liquid feeding unit 210 approaches the second set value Pr2. Then, after opening the second switching valve 238, the replenishment preparation unit 115 keeps the first switching valve 236 closed, and the pressure in the first connection unit 230 (from the replenishment unit 250 to the first switching valve 236). The pressure feeding unit 256 is controlled so that the pressure in the liquid feeding unit 210 approaches the first set value Pr1, and the pressure feeding unit 214 is controlled so that the pressure in the liquid feeding unit 210 approaches the second set value Pr2. The replenishment preparation unit 115 may maintain the output valve 218 of the liquid supply unit 210 in a closed state during the execution period of the replenishment preparation.

FIG. 25 is a flowchart showing an example of the liquid treatment procedure according to the third embodiment. As shown in FIG. 25, the control device 100 first executes steps S201 and S202 in order. In step S201, for example, the discharge preparation unit 111 controls the processing liquid supply unit 29A so as to reduce the pressure difference between the liquid feeding unit 210 and the discharge unit 30 in preparation for discharging the processing liquid from the nozzle 31. To do. In step S202, for example, the discharge control unit 112 supplies the processing liquid from the nozzle 31 toward the wafer W in a state where the pressure difference between the liquid feeding unit 210 and the discharge unit 30 is reduced. The unit 29A is controlled. Details of the discharge preparation in step S201 and the discharge process in step S202 will be described later.

Next, the control device 100 executes steps S203 and S204 in order. In step S03, for example, the replenishment preparation unit 115 prepares to replenish the treatment liquid from the replenishment unit 250 to the liquid supply unit 210 so that the pressure difference between the replenishment unit 250 and the liquid supply unit 210 is reduced. Controls the supply unit 29A. In step S204, for example, the replenishment control unit 116 causes the replenishment unit 250 to replenish the treatment liquid to the liquid supply unit 210 in a state where the pressure difference between the replenishment unit 250 and the liquid supply unit 210 is reduced. Controls the supply unit 29A. Details of the replenishment preparation in step S203 and the replenishment process in step S04 will be described later. This completes a series of liquid treatment procedures.

FIG. 26A is a flowchart showing an example of the discharge preparation procedure in step S201. As shown in FIG. 26A, the control device 100 first executes step S211. In step S211, for example, the discharge preparation unit 111 switches the output valve 218 from the closed state to the open state when the first switching valve 236, the second switching valve 238, and the discharge valve 72 are closed.

Next, the control device 100 executes steps S212 and S213. In step S212, for example, the discharge preparation unit 111 adjusts the pressure in the liquid feeding unit 210. The discharge preparation unit 111 adjusts the pressure in the liquid feeding unit 210 (pressure in the liquid feeding pipe 212) based on the value measured by the pressure measuring unit 224, for example. The discharge preparation unit 111 may control the pump drive unit 222 so that the value measured by the pressure measurement unit 224 follows (approaches) the set value Pd of the discharge pressure. For example, the discharge preparation unit 111 may adjust the drive pressure from the pump drive unit 222 to the pump 216 so that the deviation approaches zero according to the deviation between the measured value of the pressure measurement unit 224 and the set value Pd. Good. The discharge preparation unit 111 repeats the processes of steps S212 and S213 until the pressure in the liquid feeding unit 210 reaches the set value Pd. By executing steps S212 and S213, the discharge preparation unit 111 reduces the pressure difference between the liquid supply unit 210 and the discharge unit 30 with the discharge valve 72 closed.

Next, the control device 100 executes step S214. In step S214, for example, the discharge preparation unit 111 keeps the first switching valve 236 and the second switching valve 238 in the closed state, and keeps the output valve 218 in the open state, and keeps the discharge valve 72 from the closed state. Switch to the open state. As described above, the discharge preparation unit 111 completes the discharge preparation.

FIG. 25B is a flowchart showing an example of the discharge control procedure in step S202. For example, with the discharge preparation unit 111 reducing the pressure difference between the liquid supply unit 210 and the discharge unit 30, and the discharge valve 72 being opened, the control device 100 can be used as shown in FIG. 25 (b). , Steps S221 and S222 are executed. In step S221, the discharge control unit 112 adjusts the discharge pressure of the processing liquid sent to the nozzle 31. In step S221, the discharge control unit 112 starts controlling the pressure feed unit 214 (pump drive unit 222) so as to send the processing liquid to the discharge unit 30 at the set value Pd of the discharge pressure. As a result, the discharge control unit 112 starts discharging the processing liquid from the nozzle 31 with the discharge valve 72 opened. The discharge control unit 112 continues to adjust the discharge pressure even after the start of discharge.

The discharge control unit 112 adjusts the pump drive unit 222 (pressure applied to the processing liquid from the pump 216) based on the value measured by the pressure measurement unit 224, for example. The discharge control unit 112 may adjust the pump drive unit 222 so that the discharge pressure of the processing liquid follows the set value Pd. The discharge control unit 112 may adjust the drive pressure from the pump drive unit 222 to the pump 216 so that the deviation approaches zero according to the deviation between the value measured by the pressure measurement unit 224 and the set value Pd. .. The discharge control unit 112 repeats the processes of steps S221 and S222 until a predetermined time elapses from the start of execution of step S221. The predetermined time is set in the operation command held by the operation command holding unit 102, and is set in advance according to, for example, the amount of the processing liquid used in each liquid treatment.

Next, the control device 100 executes steps S223 and S224 in order. In step S223, for example, the discharge control unit 112 switches the output valve 218 and the discharge valve 72 from the open state to the closed state, respectively, while keeping the first switching valve 236 and the second switching valve 238 in the closed state. In step S234, for example, the discharge control unit 112 controls the pump drive unit 222 based on the value measured by the pressure measurement unit 224 to reduce the pressure in the liquid supply unit 210 (pressure in the pump 216) to the standby pressure Ps2. Adjust to. While the discharge preparation and the discharge process of steps S201 and S202 are being executed, the control device 100 causes the pressure feeding unit 256 to maintain the pressure in the replenishing unit 250 (pressure in the pump 266) at the standby pressure Ps1. You may. The standby pressure Ps1 may be larger than the standby pressure Ps2. The standby pressure Ps1 in the replenishment unit 250 may be set to a value larger than the first set value Pr1. The standby pressure Ps2 in the liquid feeding unit 210 may be set to a value larger than the second set value Pr2.

FIG. 27 is a flowchart showing an example of the replenishment preparation procedure in step S203. As shown in FIG. 27, the control device 100 first executes steps S231 and S232. In step S231, for example, the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 250 and the liquid feeding unit 210 in a state where the first switching valve 236 and the second switching valve 238 are closed. The pressure in the replenishing unit 250 and the pressure in the liquid feeding unit 210 are adjusted. The replenishment control unit 116 controls the pump drive unit 272 based on the value measured by the pressure measurement unit 274 in order to adjust the pressure in the replenishment unit 250, for example, as shown in FIG. 28A. Further, the replenishment control unit 116 controls the pump drive unit 222 based on the value measured by the pressure measurement unit 224 in order to adjust the pressure in the liquid supply unit 210.

In one example, the replenishment preparation unit 115 controls the pump drive unit 272 so that the pressure in the replenishment unit 250 approaches the first set value Pr1 from the standby pressure Ps1, and the pressure in the liquid feeding unit 210 changes from the standby pressure Ps2 to the first. 2 The pump drive unit 222 is controlled so as to approach the set value Pr2. The replenishment preparation unit 115 repeats the processes of steps S231 and S232 until the pressure in the replenishment unit 250 reaches the first set value Pr1 and the pressure in the liquid feeding unit 210 reaches the second set value Pr2. By executing steps S231 and S232, the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 250 and the liquid feeding unit 210 in a state where the first switching valve 236 and the second switching valve 238 are closed.

Next, the control device 100 executes step S233. In step S233, for example, the replenishment preparation unit 115 switches the second switching valve 238 from the closed state to the open state while keeping the first switching valve 236, the output valve 218, and the discharge valve 72 in the closed state.

Next, the control device 100 executes steps S234 and S235 in order. In step S234, for example, the replenishment preparation unit 115 is in the first connection unit 230 (between the pump 266 and the first switching valve 236) in a state where the second switching valve 238 is open and the first switching valve 236 is closed. The pressure in the first connecting portion 230 (pressure of the pump 266) and the pressure in the liquid feeding portion 210 are adjusted so as to reduce the pressure difference between the liquid feeding portion 210 and the liquid feeding portion 210. The replenishment control unit 116 controls the pump drive unit 272 based on the value measured by the pressure measurement unit 274 in order to adjust the pressure in the first connection unit 230, for example, as shown in FIG. 28 (b). .. Further, the replenishment control unit 116 controls the pump drive unit 222 so as to maintain the pressure in the liquid feeding unit 210 at a value adjusted by executing steps S231 and S232.

In one example, the replenishment preparation unit 115 controls the pump drive unit 272 so that the pressure between the pump 266 of the replenishment unit 250 and the first switching valve 236 approaches the first set value Pr1. The replenishment preparation unit 115 repeats the processes of steps S234 and S235 until the pressure between the replenishment unit 250 and the first switching valve 236 reaches the first set value Pr1. By executing steps S234 and S235, the replenishment preparation unit 115 makes a pressure difference between the inside of the first connection unit 230 and the inside of the liquid feeding unit 210 in a state where the second switching valve 238 is opened and the first switching valve 236 is closed. Shrink.

Next, the control device 100 executes step S236. In step S236, for example, the replenishment preparation unit 115 opens the second switching valve 238 and switches the first switching valve 236 from the closed state to the open state while keeping the output valve 218 and the discharge valve 72 in the closed state. As a result, a flow of the processing liquid is generated from the pump 266 of the liquid feeding unit 210 to the pump 216 of the liquid feeding unit 210 through the filter 234. As described above, the replenishment preparation unit 115 ends the replenishment preparation process.

FIG. 29 is a flowchart showing an example of the replenishment control procedure in step S204. As shown in FIG. 29, the control device 100 first executes steps S241 and S242. In step S241, for example, the replenishment control unit 116 replenishes the replenishment pressure of the processing liquid sent from the pressure feeding unit 256 (pump 266) of the replenishing unit 250 to the pumping unit 214 (pump 216) of the liquid feeding unit 210, and the replenishment pressure of the processing liquid. Adjust the replenishment flow rate. In one example, the replenishment control unit 116 controls either the pumping unit 256 or the pumping unit 214 so that the replenishment pressure follows the target value, as in the adjustment of the replenishment pressure and the replenishment flow rate in the first embodiment. At the same time, the other of the pumping section 256 and the pumping section 214 is controlled so that the replenishment flow rate follows the target value.

The replenishment control unit 116 repeats the processes of steps S241 and S242 until a predetermined time elapses from the start of execution of step S241. The predetermined time is predetermined so that the replenishment of the processing liquid to the liquid feeding unit 210 (pump 216) is completed within the time, and is stored in the operation command holding unit 102.

Next, the control device 100 executes step S243. In step S243, the replenishment control unit 116 switches the first switching valve 236 and the second switching valve 238 from the open state to the closed state, respectively, while keeping the output valve 218 and the discharge valve 72 in the closed state. As a result, the flow of the processing liquid from the pump 266 of the replenishment unit 250 to the pump 216 of the liquid supply unit 210 is stopped.

Next, the control device 100 executes step S244. In step S244, for example, the control device 100 adjusts the pressure in the pump 266 of the replenishment unit 250 and the pressure in the pump 216 of the liquid supply unit 210, respectively. In one example, the control device 100 adjusts the pressure in the pump 266 (pressure in the replenishment unit 250) to the standby pressure Ps1 by controlling the pump drive unit 272 based on the value measured by the pressure measurement unit 274. The control device 100 adjusts the pressure in the pump 216 (pressure in the liquid feeding unit 210) to the standby pressure Ps2 by controlling the pump driving unit 222 based on the value measured by the pressure measuring unit 224. As described above, the replenishment control unit 116 ends the replenishment process.

[Effect of Third Embodiment]
Also in the coating / developing apparatus 2 and the liquid treatment procedure according to the third embodiment described above, the pressure difference between the replenishing unit 250 and the liquid feeding unit 210 is reduced as in the first and second embodiments. After that, the first switching valve 236 is opened. Therefore, when the first switching valve 236 is opened, the occurrence of hunting of the processing liquid in the flow path for replenishing the processing liquid from the replenishing unit 250 to the liquid feeding unit 210 is suppressed. Therefore, it is useful for reducing particles in the processing liquid discharged to the wafer W.

In the third embodiment described above, the filter 234 is provided in the first connection portion 230. The first switching valve 236 opens and closes between the filter 234 and the liquid feeding unit 210. When the first switching valve 236 is opened, the processing liquid flows to the liquid feeding unit 210 through the filter 234. If the first switching valve 236 opens while the pressure difference between the replenishment unit 250 and the liquid supply unit 210 is large, the filter 234 in the first connection unit 230 that connects the replenishment unit 250 and the liquid supply unit 210 There is a risk of hunting of the processing liquid to the extent that particles are generated from the valve. On the other hand, in the above configuration, the first switching valve 236 is opened after the pressure difference between the replenishment unit 250 and the liquid supply unit 210 is reduced. Therefore, it is useful for suppressing the generation of particles due to the hunting of the treatment liquid in the first connecting portion 230.

In the third embodiment described above, the first connection unit 230 has a second switching valve 238 that opens and closes between the replenishment unit 250 and the filter 234. The replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 250 and the liquid feeding unit 210 with the first switching valve 236 and the second switching valve 238 closed, and the second switching valve 238 opens. , With the first switching valve 236 closed, reducing the pressure difference between the inside of the first connecting portion 230 and the inside of the liquid feeding portion 210 is executed in order. In this case, the pressure upstream of the first switching valve 236 and the pressure downstream of the first switching valve 236 are compared with the case where the first switching valve 236 and the second switching valve 238 are switched to the open state at substantially the same timing. The difference between the two can be reduced with higher accuracy. Therefore, it is more useful for suppressing the generation of particles due to the hunting of the treatment liquid in the first connecting portion 230. The piping volume in the replenishing section 250 tends to be larger than the piping volume of the processing liquid in the liquid feeding section 210. In the above configuration, the pressure difference between the replenishment unit 250 and the liquid supply unit 210 can be easily adjusted by opening the switching valve stepwise in order from the switching valve located on the upstream side where the pipe volume is large.

(Modification example)
In the replenishment preparation procedure of step S203, in the above example, the pressure in the liquid feeding unit 210 and the pressure in the replenishment unit 250 are changed, respectively, but the replenishment preparation unit 115 changes the pressure of either one. The pressure difference between the liquid feeding unit 210 and the replenishing unit 250 may be reduced. For example, the replenishment preparation unit 115 can be used between the replenishment unit 250 and the liquid supply unit 210 without changing the pressure in the liquid supply unit 210 with the first switching valve 236 and the second switching valve 238 closed. The pressure in the replenishment unit 250 may be changed so as to reduce the pressure difference. Then, in the replenishment preparation unit 115, in a state where the second switching valve 238 is opened and the first switching valve 236 is closed, the pressure in the liquid feeding unit 210 is not changed, and the liquid feeding unit is in the first connecting unit 230. The pressure in the first connection portion 230 may be changed so as to reduce the pressure difference with the inside of 210.

The replenishment preparation unit 115 makes a pressure difference between the replenishment unit 250 and the liquid feeding unit 210 without changing the pressure in the replenishment unit 250 with the first switching valve 236 and the second switching valve 238 closed. The pressure in the liquid feeding unit 210 may be changed so as to be reduced. Then, in the replenishment preparation unit 115, in a state where the second switching valve 238 is open and the first switching valve 236 is closed, the pressure in the replenishment unit 250 is not changed, and the inside of the first connection unit 230 and the liquid feeding unit 210 The pressure in the liquid feeding unit 210 may be changed so as to reduce the pressure difference from the inside.

In the above example, the open / closed state is switched in the order of the second switching valve 238 and the first switching valve 236, but the replenishment preparation unit 115 switches the first switching valve 236 to the open state and then switches the second switching state. The valve 238 may be switched to the open state. Specifically, the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 250 and the liquid supply unit 210 in a state where the first switching valve 236 and the second switching valve 238 are closed, and then performs the first switching. The valve 236 may be switched to the open state. Then, in the replenishment preparation unit 115, in a state where the first switching valve 236 is opened and the second switching valve 238 (switching valve) is closed, the inside of the liquid feeding unit 210 (more specifically, the inside of the liquid feeding unit 210 and the first The pressure difference between the connection portion 230 (in the region downstream of the second switching valve 238) and the replenishment portion 250 may be reduced. After that, the replenishment preparation unit 115 may switch the second switching valve 238 to the open state in order to open the space between the replenishment unit 250 and the liquid feeding unit 210.

The first connection portion 230 does not have to have the second switching valve 238. In this case, the replenishment preparation unit 115 is in the replenishment unit 250 (more specifically, from the first switching valve 236 of the replenishment unit 250 and the first connection unit 230) with the first switching valve 236 closed. The pressure difference between the inside of the upstream region) and the inside of the liquid feeding unit 210 may be reduced. The first connection portion 230 does not have to have the first switching valve 236. In this case, the replenishment preparation unit 115 is in the liquid feeding unit 210 (more specifically, in the liquid feeding unit 210 and in the first connecting unit 230) with the second switching valve 238 (switching valve) closed. The pressure difference between the area downstream of the second switching valve 238) and the replenishment unit 250 may be reduced.

The above specific example includes the following configurations.
(Appendix 1)
A discharge section having a nozzle that discharges the processing liquid onto the substrate,
A liquid feeding unit that sends the processing liquid to the discharging unit,
A replenishment unit that replenishes the liquid supply unit with the treatment liquid to be sent to the discharge unit,
A connecting part having a switching valve that opens and closes between the replenishing part and the liquid feeding part,
A filter that removes foreign matter contained in the treatment liquid that is replenished from the replenishing unit to the liquid feeding unit.
A replenishment preparation unit that opens the switching valve after reducing the pressure difference between the replenishment unit and the liquid supply unit.
A replenishment control unit for starting replenishment of the processing liquid from the replenishment unit to the liquid supply unit in a state where the switching valve is opened by the replenishment preparation unit is provided.
The filter is provided in the liquid feeding unit, and is provided in the liquid feeding unit.
The replenishment preparation unit is a substrate processing device that changes the pressure in the replenishment unit so as to reduce the pressure difference between the replenishment unit and the liquid feeding unit in a state where the switching valve is closed.
(Appendix 2)
The liquid feeding unit receives the processing liquid from the replenishing part via the liquid feeding pipe connecting the replenishing part and the discharging part via the filter, and passing through the liquid feeding pipe. Further, it has a discharge pressure feeding part that sends out the processing liquid to the discharge part, and a connection valve that opens and closes between the liquid feeding pipe and the discharge pressure feeding part.
The replenishment unit includes a liquid source and a replenishment pressure feeding unit that sends the treatment liquid from the liquid source to the liquid feeding unit.
The replenishment control unit
One of the replenishment pressure feeding unit and the discharging pressure feeding unit is controlled so that the replenishing pressure from the replenishing pressure feeding unit to the discharging pressure feeding unit follows the target value.
The substrate processing apparatus according to Appendix 2, which controls the other of the replenishment pumping unit and the discharge pumping unit so that the replenishment flow rate from the replenishment pumping unit to the discharge pumping unit follows a target value.
(Appendix 3)
A discharge control unit that controls the discharge pressure feeding unit so that the discharge pressure of the processing liquid sent to the nozzle follows the target value is further provided.
The substrate processing according to Appendix 2, wherein the replenishment control unit sets the target value of the replenishment pressure to the target value of the discharge pressure until the replenishment of the treatment liquid is completed in the control for making the replenishment pressure follow the target value. apparatus.
(Appendix 4)
A discharge control unit that controls the discharge pressure feeding unit so that the discharge pressure of the processing liquid sent to the nozzle follows the target value is further provided.
The substrate according to Appendix 2, wherein the replenishment control unit gradually brings the target value of the replenishment pressure closer to the target value of the discharge pressure until the replenishment of the treatment liquid is completed in the control of making the replenishment pressure follow the target value. Processing equipment.
(Appendix 5)
A discharge valve that opens and closes between the liquid supply unit and the discharge unit,
A discharge preparation unit that opens the discharge valve after changing the pressure in the liquid supply unit so as to reduce the pressure difference between the liquid supply unit and the discharge unit.
The substrate processing apparatus according to Appendix 1 or 2, further comprising a discharge control unit for starting discharge of the processing liquid from the nozzle to the substrate in a state where the discharge valve is opened by the discharge preparation unit.
(Appendix 6)
The liquid feeding unit receives the processing liquid from the replenishing part via the liquid feeding pipe connecting the replenishing part and the discharging part via the filter, and passing through the liquid feeding pipe. Further, it has a discharge pressure feeding part that sends out the processing liquid to the discharge part, and a connection valve that opens and closes between the liquid feeding pipe and the discharge pressure feeding part.
The substrate processing device according to Appendix 1, wherein the switching valve opens and closes at a rate of change in opening degree smaller than that of the connection valve.
(Appendix 7)
A discharge valve that opens and closes between the liquid feed unit and the discharge unit is further provided.
The liquid feeding unit receives the processing liquid from the replenishing part via the liquid feeding pipe connecting the replenishing part and the discharging part via the filter, and the liquid feeding part, and passes through the liquid feeding pipe. The pressure between the discharge pressure feed unit that sends the processing liquid to the discharge unit, the connection valve that opens and closes between the liquid feed pipe and the discharge pressure feed unit, and the filter and the discharge pressure feed unit is measured. It also has a pressure measuring unit and
The replenishment unit includes a liquid source and a replenishment pressure feeding unit that sends the treatment liquid from the liquid source to the liquid feeding unit.
The replenishment preparation unit
Controlling the replenishment pumping unit so that the pressure difference between the replenishing unit and the liquid feeding unit is reduced while the switching valve is closed.
With the switching valve open and the discharge valve and the connection valve closed, the pressure between the replenishment pressure feeding unit and the discharge pressure feeding unit is a set value based on the measured value of the pressure measuring unit. To control the replenishment pumping unit so as to approach
With the switching valve and the discharge valve closed and the connection valve open, the discharge pressure feeding unit so that the pressure in the liquid feeding unit approaches the set value based on the measured value of the pressure measuring unit. The substrate processing apparatus according to Appendix 1, wherein the above-mentioned is controlled and the above is executed in order.

2 ... Coating / developing device, 30 ... Discharging part, 50, 250 ... Replenishing part, 51 ... Liquid source, 53 ... Pumping part, 60, 210 ... Liquid feeding part, 61 ... Liquid feeding tube, 63, 234 ... Filter, 64 ... pumping part, 67 ... first connection valve, 68 ... second connection valve, 69 ... pressure measuring part, 71 ... switching valve, 72 ... discharge valve, 80, 230 ... first connection part, 90 ... second connection part, 100 ... Control device, 111 ... Discharge preparation unit, 112 ... Discharge control unit, 115 ... Replenishment preparation unit, 116 ... Replenishment control unit, 236 ... First switching valve, 238 ... Second switching valve.

Claims (12)

A discharge section having a nozzle that discharges the processing liquid onto the substrate,
A liquid feeding unit that sends the processing liquid to the discharging unit,
A replenishment unit that replenishes the liquid supply unit with the treatment liquid to be sent to the discharge unit,
A connecting part having a switching valve that opens and closes between the replenishing part and the liquid feeding part,
A filter that removes foreign matter contained in the treatment liquid that is replenished from the replenishing unit to the liquid feeding unit.
A replenishment preparation unit that opens the switching valve after reducing the pressure difference between the replenishment unit and the liquid supply unit.
With the switching valve opened by the replenishment preparation unit, a replenishment control unit that starts replenishment of the processing liquid from the replenishment unit to the liquid supply unit.
Substrate processing device. The substrate processing apparatus according to claim 1, wherein the filter is provided in the liquid feeding unit. The substrate processing apparatus according to claim 2, wherein the replenishment preparation unit changes the pressure in the liquid supply unit so as to reduce the pressure difference between the replenishment unit and the liquid supply unit in a state where the switching valve is closed. .. The liquid feeding unit receives the processing liquid from the replenishing part via the liquid feeding pipe connecting the replenishing part and the discharging part via the filter, and passing through the liquid feeding pipe. Further, it has a discharge pressure feeding part that sends out the processing liquid to the discharge part, and a connection valve that opens and closes between the liquid feeding pipe and the discharge pressure feeding part.
The replenishment unit includes a liquid source and a replenishment pressure feeding unit that sends the treatment liquid from the liquid source to the liquid feeding unit.
The replenishment control unit
One of the replenishment pressure feeding unit and the discharging pressure feeding unit is controlled so that the replenishing pressure from the replenishing pressure feeding unit to the discharging pressure feeding unit follows the target value.
The substrate processing apparatus according to claim 2 or 3, which controls the other of the replenishment pumping unit and the discharge pumping unit so that the replenishment flow rate from the replenishment pumping unit to the discharge pumping unit follows a target value. .. A discharge control unit that controls the discharge pressure feeding unit so that the discharge pressure of the processing liquid sent to the nozzle follows the target value is further provided.
The fourth aspect of the present invention, wherein the replenishment control unit gradually brings the target value of the replenishment pressure closer to the target value of the discharge pressure until the replenishment of the treatment liquid is completed in the control for making the replenishment pressure follow the target value. Substrate processing equipment. The liquid feeding unit receives the processing liquid from the replenishing part via the liquid feeding pipe connecting the replenishing part and the discharging part via the filter, and passing through the liquid feeding pipe. Further, it has a discharge pressure feeding part that sends out the processing liquid to the discharge part, and a connection valve that opens and closes between the liquid feeding pipe and the discharge pressure feeding part.
The substrate processing apparatus according to claim 2 or 3, wherein the switching valve opens and closes at a rate of change in opening degree smaller than that of the connection valve. A discharge valve that opens and closes between the liquid feed unit and the discharge unit is further provided.
The liquid feeding unit receives the processing liquid from the replenishing part via the liquid feeding pipe connecting the replenishing part and the discharging part via the filter, and the liquid feeding part, and passes through the liquid feeding pipe. The pressure between the discharge pressure feed unit that sends the processing liquid to the discharge unit, the connection valve that opens and closes between the liquid feed pipe and the discharge pressure feed unit, and the filter and the discharge pressure feed unit is measured. It also has a pressure measuring unit and
The replenishment unit includes a liquid source and a replenishment pressure feeding unit that sends the treatment liquid from the liquid source to the liquid feeding unit.
The replenishment preparation unit
With the switching valve and the discharge valve closed and the connection valve open, the discharge pressure feeding unit is operated so that the pressure in the liquid feeding unit approaches a set value based on the measured value of the pressure measuring unit. To control and
With the switching valve open and the discharge valve and the connection valve closed, the pressure between the replenishment pressure feeding unit and the discharge pressure feeding unit is set based on the measured value of the pressure measuring unit. The substrate processing apparatus according to claim 3, wherein the replenishment pumping unit is controlled so as to approach the value, and the operation is sequentially executed. A discharge valve that opens and closes between the liquid supply unit and the discharge unit,
A discharge preparation unit that opens the discharge valve after changing the pressure in the liquid supply unit so as to reduce the pressure difference between the liquid supply unit and the discharge unit.
The invention according to any one of claims 1 to 4, further comprising a discharge control unit that starts discharging the processing liquid from the nozzle to the substrate in a state where the discharge valve is opened by the discharge preparation unit. Board processing equipment. The filter is provided in the connection portion, and the filter is provided in the connection portion.
The substrate processing device according to claim 1, wherein the switching valve opens and closes between the filter and the liquid feeding unit. The connecting portion further includes a second switching valve that opens and closes between the replenishing portion and the filter.
The replenishment preparation unit
With the switching valve and the second switching valve closed, the pressure difference between the replenishment section and the liquid feeding section is reduced.
The substrate processing apparatus according to claim 9, wherein in a state where the second switching valve is opened and the switching valve is closed, the pressure difference between the inside of the connection portion and the inside of the liquid feeding portion is reduced in order. A discharge unit having a nozzle for discharging the treatment liquid to the substrate, a liquid supply unit for sending the treatment liquid to the discharge unit, and a replenishment unit for replenishing the liquid supply unit with the treatment liquid for sending to the discharge unit. A substrate including a connection portion having a switching valve that opens and closes between the replenishment unit and the liquid supply unit, and a filter for removing foreign matter contained in the treatment liquid replenished from the replenishment unit to the liquid supply unit. It is a control method of the processing device.
Opening the switching valve after reducing the pressure difference between the replenishment section and the liquid feeding section.
A control method including starting replenishment of the processing liquid from the replenishing unit to the liquid feeding unit with the switching valve opened. A computer-readable storage medium that stores a program for causing an apparatus to execute the control method according to claim 11.

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