JP2022075109A - Substrate processing device and substrate processing method - Google Patents

Abstract

To provide a technology that is useful for reducing foreign objects in a process liquid discharged to a substrate.SOLUTION: A substrate processing device includes: a discharge part 30 having a nozzle for discharging a process liquid to a substrate; a liquid sending part 60 which sends the process liquid to the discharge part; and a liquid source 51 serving as a supply source which supplies the process liquid to be sent to the discharge part 30 to the liquid sending part 60. The liquid sending part 60 has: a pipe line in which the process liquid flows; and filters provided at positions different from each other on the pipe line and having collecting characteristics for several types of foreign objects presumed to be contained in the process liquid.SELECTED DRAWING: Figure 4

Description

The present disclosure relates to a substrate processing apparatus and a substrate processing method.

Patent Document 1 discloses a configuration in which a photoresist coating apparatus is provided with a circulation pipe for a supply pipe including a filter unit, and the photoresist is circulated when coating is stopped.

Japanese Unexamined Patent Publication No. 10-172881

The present disclosure provides techniques useful for reducing foreign matter in the processing liquid discharged onto a substrate.

The substrate processing apparatus according to one aspect of the present disclosure includes a discharge unit having a nozzle for discharging the treatment liquid to the substrate, a liquid supply unit for sending the treatment liquid to the discharge unit, and the treatment liquid for sending the treatment liquid to the discharge unit. The liquid feeding unit is provided with a supply source for supplying the liquid feeding unit, and the liquid feeding unit is provided at different positions on the pipeline and the pipeline through which the processing liquid flows, and is assumed to be included in the processing liquid. It has a plurality of filters having different collection characteristics for a plurality of types of foreign substances.

According to the present disclosure, there is provided a technique useful for reducing foreign substances in the processing liquid discharged to the substrate.

FIG. 1 is a schematic diagram showing an example of a schematic configuration of a substrate processing system. FIG. 2 is a schematic diagram showing an example of the internal configuration of the coating / developing device. FIG. 3 is a schematic diagram showing an example of the configuration of the liquid treatment unit. FIG. 4 is a schematic view showing an example of the treatment liquid supply unit. FIG. 5 is a block diagram showing an example of the functional configuration of the control device. FIG. 6 is a block diagram showing an example of the hardware configuration of the control device. FIG. 7 is a flowchart showing an example of the liquid treatment procedure. 8 (a), 8 (b), and 8 (c) are schematic views for explaining an example of the operation of each part in the liquid treatment procedure, respectively. FIG. 9 is a flowchart showing an example of a procedure when the command content is changed according to the foreign matter detection result. 10 (a), 10 (b), and 10 (c) are schematic views for explaining an example of changing the flow of the processing liquid in the liquid feeding unit, respectively. 11 (a) and 11 (b) are schematic views for explaining an example of changing the arrangement of the filters, respectively.

Hereinafter, various exemplary embodiments will be described.

In one exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus supplies the discharge unit having a nozzle for discharging the processing liquid to the substrate, the liquid feeding unit for sending the processing liquid to the discharging unit, and the processing liquid for sending the processing liquid to the discharging unit. The liquid feeding unit is provided at different positions on the pipeline through which the treatment liquid flows, and the liquid feeding unit is provided for a plurality of types of foreign substances that are expected to be contained in the treatment liquid. It has a plurality of filters having different collection characteristics from each other.

In the above-mentioned substrate processing apparatus, since a plurality of filters are provided at different positions on the pipeline through which the processing liquid flows, the processing liquid from the supply source passes through the plurality of filters and is supplied to the nozzle. Further, since these filters have different collection characteristics for a plurality of types of foreign substances that are expected to be contained in the treatment liquid, the plurality of types of foreign substances contained in the treatment liquid can be collected by the plurality of filters. Therefore, it is possible to further reduce the amount of foreign matter in the processing liquid discharged to the substrate.

The plurality of filters may include a filter having a high collection performance for the types of foreign substances having a high frequency of occurrence of defects that may occur after the liquid treatment of the substrate in the subsequent stage among the plurality of types of foreign substances.

As described above, the treatment liquid is configured to pass the treatment liquid through a filter having a high collection performance for foreign substances of a type having a high frequency of occurrence of defects that may occur after the liquid treatment of the subsequent stage on the substrate. It is possible to remove foreign substances with a high frequency of defects. Therefore, it is possible to suppress the occurrence of defects on the substrate.

The plurality of filters may have a mode in which the contact areas of the collecting portion with the treatment liquid are different from each other.

As described above, by using a filter having collection portions having different contact areas with the treatment liquid, the collection characteristics of each type of foreign matter can be made different from each other. By using such a filter, it is possible to select the filter to be used in consideration of the type of foreign matter contained in the treatment liquid.

Among the plurality of filters, the filter having the highest collection performance for the type of foreign matter having a high frequency of occurrence of defects that may occur after the liquid treatment in the subsequent stage on the substrate is located at the most downstream of the pipeline. May be good.

As described above, by arranging the filter having the highest collection performance for the types of foreign substances having a high frequency of occurrence of defects that may occur after the liquid treatment in the subsequent stage on the substrate, the frequency of occurrence of defects is arranged at the most downstream. Foreign matter with a high value is properly removed by the most downstream filter. Therefore, it is possible to suppress the occurrence of defects on the substrate.

The pipeline includes a main pipeline connecting the supply source and the nozzle, and a bypass pipeline formed so as to connect two branch points provided in the main pipeline, and the liquid feeding unit includes a liquid feeding unit. Further, it has a liquid feeding pump provided in the bypass pipeline, and collects foreign matter of a type having a high frequency of defects that may occur after performing the liquid treatment in the subsequent stage on the substrate among the plurality of filters. The first filter having the highest performance is provided on the downstream side of the filter different from the first filter between the two branch points of the main pipeline, and is different from the first filter. At least one of the filters may be provided in the bypass pipeline.

As described above, in a configuration in which the pipeline includes a main pipeline and a bypass pipeline, a first filter having the highest collection performance for a type of foreign matter having a high frequency of defects is provided in the main pipeline. Foreign matter can be appropriately removed using the first filter.

The filter provided in the bypass pipe may be provided on the upstream side of the bypass pipe with respect to the liquid feeding pump.

By providing the bypass pipeline on the upstream side of the liquid feed pump as described above, the liquid feed pump can finally pass the first filter when the treatment liquid is discharged from the nozzle. .. That is, since the first filter can be substantially located on the most downstream side, foreign matter having a high frequency of defects is appropriately removed by the most downstream filter.

The liquid feeding unit further includes a control unit for controlling the liquid feeding unit, and the liquid feeding unit further has a foreign matter detecting unit for detecting foreign matter in the processing liquid on the downstream side of the bypass pipeline from the liquid feeding pump. However, the control unit may be in a mode of controlling to change the flow of the treatment liquid in the main pipe line and the bypass pipe line according to the detection result by the foreign matter detection unit.

As described above, the control unit is configured to change the flow of the treatment liquid in the main pipeline and the bypass pipeline according to the detection result by the foreign matter detection unit, so that, for example, the degree of residual foreign matter in the treatment liquid can be determined. The number of times the treatment liquid has passed through the filter can be changed in consideration. In this way, it is possible to select a control that can more appropriately remove foreign substances in the treatment liquid.

The control unit further includes a control unit that controls the liquid feeding unit, and the control unit changes the filter that the processing liquid last passes through before reaching the nozzle, depending on the state of occurrence of defects in the substrate after processing. As such, it may be an embodiment in which control is performed to change the flow of the treatment liquid in the main pipeline and the bypass pipeline.

As described above, by configuring the control unit to change the filter that passes last before reaching the nozzle according to the occurrence status of defects on the substrate after processing, for example, defects on the substrate after processing. It is possible to pass the filters in a more appropriate order according to the occurrence situation of. Therefore, it is possible to determine an appropriate control content so that defects do not occur in the processed substrate.

In one exemplary embodiment, a substrate processing method is provided. The substrate processing method is a substrate processing method in which a treatment liquid from a supply source is discharged from a nozzle to a substrate via a pipeline, and may be provided at different positions on the pipeline and included in the treatment liquid. Passes through multiple filters with different collection characteristics for the assumed multiple types of foreign matter.

In the above-mentioned substrate processing method, the processing liquid that has passed through a plurality of filters provided at different positions on the pipeline through which the processing liquid flows is supplied to the nozzle. Further, since these filters have different collection characteristics for a plurality of types of foreign substances that are expected to be contained in the treatment liquid, the plurality of types of foreign substances contained in the treatment liquid can be collected by the plurality of filters. Therefore, it is possible to further reduce the amount of foreign matter in the processing liquid discharged to the substrate.

It is also an embodiment in which the treatment liquid is finally passed through the filter having the highest collection performance for the type of foreign matter having a high frequency of occurrence of defects that may occur after the liquid treatment of the substrate in the subsequent stage among the plurality of filters. good.

As described above, the treatment liquid is finally passed through the filter having the highest collection performance for the types of foreign substances having a high frequency of defects that may occur after the liquid treatment in the subsequent stage on the substrate. Foreign matter with a high frequency of defects is properly removed by the most downstream filter. Therefore, it is possible to suppress the occurrence of defects on the substrate.

The pipeline is provided in the main pipeline connecting the supply source and the nozzle, a bypass pipeline formed so as to connect two branch points provided in the main pipeline, and the bypass pipeline. The first of the plurality of filters, which has a liquid feeding pump and has the highest collection performance for foreign matter of a type having a high frequency of occurrence of defects that may occur after performing the liquid treatment in the subsequent stage on the substrate. The filter is provided between the two branch points of the main pipeline on the downstream side of the filter different from the first filter, and at least one of the filters different from the first filter is , May be provided in the bypass pipeline.

As described above, in the configuration in which the pipeline includes the main pipeline and the bypass pipeline, the configuration is such that the first filter having the highest collection performance for foreign substances of a type having a high frequency of defects is provided in the main pipeline. Therefore, the foreign matter can be appropriately removed by using the first filter.

A foreign matter detecting unit for detecting foreign matter in the processing liquid is further provided on the downstream side of the bypass pipeline on the downstream side of the liquid feeding pump, and the main pipeline and the bypass are according to the detection result by the foreign matter detecting unit. The mode may be such that the flow of the treatment liquid in the pipeline is changed.

As described above, by changing the flow of the treatment liquid in the main pipeline and the bypass pipeline according to the detection result by the foreign matter detection unit, for example, the degree of residual foreign matter in the treatment liquid is taken into consideration. The number of times the processing liquid has passed through the filter can be changed. In this way, it is possible to select a control that can more appropriately remove foreign substances in the treatment liquid.

The flow of the treatment liquid in the main pipeline and the bypass pipeline so as to change the filter through which the treatment liquid last passes before reaching the nozzle, depending on the occurrence of defects in the substrate after the treatment. May be changed.

As described above, by configuring the control unit to change the filter that passes last before reaching the nozzle according to the occurrence status of defects on the substrate after processing, for example, defects on the substrate after processing. It is possible to pass the filters in a more appropriate order according to the occurrence situation of. Therefore, it is possible to determine an appropriate control content so that defects do not occur in the processed substrate.

[Explanation of an exemplary embodiment]
Hereinafter, various exemplary embodiments will be described in detail with reference to the drawings. In addition, the same reference numerals are given to the same or corresponding parts in each drawing.

First, the substrate processing system according to the embodiment of the present disclosure will be described with reference to FIGS. 1 to 6.

[Board processing system]
The substrate processing system 1 shown in FIG. 1 is a system that forms a photosensitive film, exposes the photosensitive film, and develops the photosensitive film on the substrate. The photosensitive film is, for example, a resist film.

The substrate processing system 1 includes a coating / developing device 2 and an exposure device 3. The coating / developing apparatus 2 is configured to form a resist film (photosensitive film) on the surface of the work W. Further, the coating / developing device 2 is configured to perform a developing process of the resist film after the exposure process by the exposure device. The exposure device 3 is configured to transfer the work W to and from the coating / developing device 2 to perform an exposure process (pattern exposure) of a resist film formed on the surface of the work W. The exposure apparatus 3 may selectively irradiate the exposed portion of the resist film with energy rays by a method such as immersion exposure. The work W on which a resist film having a predetermined pattern is formed on the surface by the coating / developing device 2 and the exposure device 3 is then subjected to an etching process. In the etching process, for example, the target material in the region not covered by the resist film is processed by dry etching using plasma.

The work W to be processed is, for example, a substrate or a substrate in which a film, a circuit, or the like is formed by being subjected to a predetermined treatment. The substrate included in the work W is, for example, a wafer containing silicon. The work W (substrate) may be formed in a circular shape, or may be formed in a plate shape other than a circular shape such as a polygon. The work W may have a notch portion that is partially cut out. The notch portion may be, for example, a notch (a groove having a U-shape, a V-shape, or the like) or a straight portion extending linearly (so-called orientation flat). The work W to be processed may be a glass substrate, a mask substrate, an FPD (Flat Panel Display), or the like, or may be an intermediate obtained by subjecting these substrates or the like to a predetermined treatment. The diameter of the work W may be, for example, about 200 mm to 450 mm.

The energy ray may be, for example, ionizing radiation, non-ionizing radiation, or the like. Ionizing radiation is radiation that has sufficient energy to ionize an atom or molecule. The ionizing radiation may be, for example, extreme ultraviolet rays (EUV), electron beams, ion beams, X-rays, α-rays, β-rays, γ-rays, heavy particle beams, proton rays and the like. Non-ionizing radiation is radiation that does not have enough energy to ionize an atom or molecule. The non-ionizing radiation may be, for example, g-ray, i-ray, KrF excimer laser, ArF excimer laser, F2 excimer laser and the like.

[Board processing equipment]
Hereinafter, the configuration of the coating / developing device 2 will be described as an example of the substrate processing device. As shown in FIGS. 1 and 2, the coating / developing device 2 includes a carrier block 4, a processing block 5, an interface block 6, and a control device 100.

The carrier block 4 introduces the work W into the coating / developing device 2 and derives the work W from the coating / developing device 2. For example, the carrier block 4 can support a plurality of carriers C for the work W, and has a built-in transfer device A1 including a transfer arm. The carrier C accommodates, for example, a plurality of circular workpieces W. The transport device A1 takes out the work W from the carrier C, passes it to the processing block 5, receives the work W from the processing block 5, and returns it to the carrier C.

The processing block 5 has a plurality of processing modules 11, 12, 13, and 14. The processing modules 11, 12, 13, and 14 include a liquid processing unit U1, a heat treatment unit U2, and a transfer device A3 including a transfer arm for transporting the work W to these units.

The treatment module 11 forms an underlayer film on the surface of the work W by the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 of the treatment module 11 applies the treatment liquid for forming the underlayer film onto the work W. The heat treatment unit U2 of the processing module 11 performs various heat treatments accompanying the formation of the underlayer film.

The treatment module 12 forms a resist film on the lower layer film by the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 of the treatment module 12 applies a treatment liquid for forming a resist film on the lower layer film. The heat treatment unit U2 of the processing module 12 performs various heat treatments accompanying the formation of the resist film.

The treatment module 13 forms an upper layer film on the resist film by the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 of the treatment module 13 applies a liquid for forming an upper layer film on the resist film. The heat treatment unit U2 of the processing module 13 performs various heat treatments accompanying the formation of the upper layer film.

The processing module 14 develops the resist film after exposure by the liquid processing unit U1 and the heat treatment unit U2. The liquid treatment unit U1 applies a developer on the surface of the exposed work W. Further, the liquid treatment unit U1 rinses the applied developer with a rinse liquid. The heat treatment unit U2 performs various heat treatments associated with the development process. Specific examples of the heat treatment include heat treatment before development treatment (PEB: Post Exposure Bake), heat treatment after development treatment (PB: Post Bake), and the like.

A shelf unit U10 is provided on the carrier block 4 side in the processing block 5. The shelf unit U10 is divided into a plurality of cells arranged in the vertical direction. A transport device A7 including an elevating arm is provided in the vicinity of the shelf unit U10. The transport device A7 raises and lowers the work W between the cells of the shelf unit U10.

A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is divided into a plurality of cells arranged in the vertical direction.

The interface block 6 transfers the work W to and from the exposure apparatus 3. For example, the interface block 6 has a built-in transfer device A8 including a transfer arm, and is connected to the exposure device 3. The transport device A8 passes the work W arranged in the shelf unit U11 to the exposure device 3. The transport device A8 receives the work W from the exposure device 3 and returns it to the shelf unit U11.

The control device 100 controls the coating / developing device 2 so as to execute the coating / developing process in the following procedure, for example. First, the control device 100 controls the transfer device A1 so as to transfer the work W in the carrier C to the shelf unit U10, and controls the transfer device A7 so as to arrange the work W in the cell for the processing module 11.

Next, the control device 100 controls the transfer device A3 so as to transfer the work W of the shelf unit U10 to the liquid processing unit U1 and the heat treatment unit U2 in the processing module 11. Further, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 so as to form a lower layer film on the surface of the work W. After that, the control device 100 controls the transfer device A3 so as to return the work W on which the lower layer film is formed to the shelf unit U10, and controls the transfer device A7 so as to arrange the work W in the cell for the processing module 12. ..

Next, the control device 100 controls the transfer device A3 so as to transfer the work W of the shelf unit U10 to the liquid processing unit U1 and the heat treatment unit U2 in the processing module 12. Further, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 so as to form a resist film on the lower film of the work W. After that, the control device 100 controls the transfer device A3 so as to return the work W to the shelf unit U10, and controls the transfer device A7 so as to arrange the work W in the cell for the processing module 13.

Next, the control device 100 controls the transfer device A3 so as to transfer the work W of the shelf unit U10 to each unit in the processing module 13. Further, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 so as to form an upper layer film on the resist film of the work W. After that, the control device 100 controls the transfer device A3 so as to transfer the work W to the shelf unit U11.

Next, the control device 100 controls the transfer device A8 so as to send the work W of the shelf unit U11 to the exposure device 3. After that, the control device 100 controls the transfer device A8 so as to receive the exposed work W from the exposure device 3 and arrange it in the cell for the processing module 14 in the shelf unit U11.

Next, the control device 100 controls the transfer device A3 so as to transfer the work W of the shelf unit U11 to each unit in the processing module 14, and the liquid processing unit U1 so as to perform a development process on the resist film of the work W. And control the heat treatment unit U2. After that, the control device 100 controls the transfer device A3 so as to return the work W to the shelf unit U10, and controls the transfer device A7 and the transfer device A1 so as to return the work W to the carrier C. This completes the coating / developing process.

The specific configuration of the substrate processing apparatus is not limited to the configuration of the coating / developing apparatus 2 exemplified above. The substrate processing apparatus may be any as long as it includes a liquid treatment unit that discharges the treatment liquid to the work W to perform the liquid treatment, and a control device capable of controlling the liquid treatment unit.

(Liquid treatment unit)
Subsequently, an example of the liquid processing unit U1 in the processing module 12 will be described in detail with reference to FIGS. 3 and 4. The liquid processing unit U1 includes a rotation holding unit 20 and a processing liquid supply unit 29.

The rotation holding unit 20 holds and rotates the work W based on the operation instruction of the control device 100. The rotation holding unit 20 includes a holding unit 21 and a driving unit 22. The holding portion 21 supports the central portion of the work W arranged horizontally with the surface Wa facing upward, and holds the work W by suction (for example, vacuum suction). The drive unit 22 is a rotary actuator powered by, for example, an electric motor or the like, and rotates the holding unit 21 around a vertical rotation axis. As a result, the work W rotates around a vertical rotation axis.

The processing liquid supply unit 29 supplies the processing liquid to the work W that is rotationally held by the rotation holding unit 20. As shown in FIGS. 3 and 4, the treatment liquid supply unit 29 includes a discharge unit 30, a liquid supply unit 60, a replenishment unit 50, a first connection unit 81, and a second connection unit 83. ..

The discharge unit 30 discharges the processing liquid toward the surface Wa of the work W. The discharge unit 30 includes a nozzle 31 and a liquid feed pipe 32. The nozzle 31 discharges the processing liquid to the work W. As shown in FIG. 3, the nozzle 31 is arranged above the work W, for example, and discharges the processing liquid downward. The liquid feed pipe 32 guides the processing liquid to the nozzle 31. The processing liquid is applied (supplied) to the work W by discharging the processing liquid from the nozzle 31 toward the work W.

As shown in FIG. 4, the liquid feeding unit 60 sends the processing liquid to the discharging unit 30. Specifically, the liquid feeding unit 60 sends the processing liquid toward the discharging unit 30 (nozzle 31) at a predetermined pressure. The liquid feeding unit 60 includes a liquid feeding pipe 61, a first filter 62, a second filter 63, a pressure feeding unit 64, branch pipes 65a and 65b, a first connection valve 66, a second connection valve 67, and the like. A pressure measuring unit 68 and a foreign matter detecting unit 69 are provided. The liquid feed pipe 61 and the branch pipes 65a and 65b form a pipe line through which the treatment liquid flows. Further, the liquid feeding pipe 61 and the branch pipes 65a and 65b also function as a circulation path for circulating the treatment liquid.

The liquid feed pipe 61 is a main pipe that guides the processing liquid to the discharge unit 30. Specifically, the liquid feed pipe 61 is connected to the end portion of the discharge portion 30 on the upstream side of the liquid feed pipe 32. The first filter 62 is provided in the liquid feeding pipe 61 and removes foreign matter contained in the processing liquid. The first filter 62 collects foreign matter contained in the processing liquid passing through the liquid feeding pipe 61.

The pressure feeding unit 64 receives the processing liquid via the liquid feeding pipe 61, pressurizes the received processing liquid, and sends it out toward the discharge unit 30. The pumping unit 64 includes, for example, a pump 71, a pump driving unit 72, a flow rate measuring unit 73, and a pressure measuring unit 74.

The pump 71 (liquid feeding pump) has an accommodating chamber for accommodating the treatment liquid and a contracting portion for contracting the accommodating chamber. The pump 71 expands the accommodation chamber by the contraction portion to receive the treatment liquid, and contracts the accommodation chamber by the contraction portion to send out the treatment liquid. As the pump 71, for example, a tube flam pump, a diaphragm pump, or a bellows pump may be used.

The pump drive unit 72 drives the pump 71 based on the operation instruction of the control device 100. Specifically, the pump drive unit 72 operates (drives) the contraction unit so as to contract the storage chamber of the pump 71. For example, the pump drive unit 72 is an air operation type drive unit that operates the contraction unit by gas. The pump driving unit 72 may contract the storage chamber of the pump 71 by adjusting the pressure (driving pressure) of the gas.

The flow rate measuring unit 73 acquires information regarding the amount of processing liquid in and out of the pump 71. Since the flow rate of the gas for driving the pump 71 correlates with the amount of the processing liquid in and out of the pump 71, it is information regarding the amount of the processing liquid in and out of the pump 71. For example, the flow rate measuring unit 73 measures the flow rate of gas flowing in the connecting pipe between the pump 71 and the pump driving unit 72. The flow rate measuring unit 73 outputs the measured value to the control device 100. The pressure measuring unit 74 acquires information on the pressure in the pump 71. For example, the pressure measuring unit 74 measures the pressure in the connecting pipe between the pump 71 and the pump driving unit 72. The pressure measuring unit 74 outputs the measured value to the control device 100.

The branch pipe 65a branches from the branch point P1 in the upstream portion of the first filter 62 of the liquid feed pipe 61, and connects the liquid feed pipe 61 and the pump 71. The branch pipe 65b branches from the branch point P2 in the downstream portion of the first filter 62 of the liquid feed pipe 61, and connects the liquid feed pipe 61 and the pump 71. The branch pipe 65a and the branch pipe 65b form a bypass pipe connecting the branch points P1 and P2 in the liquid feed pipe 61 (main pipe). The second filter 63 is provided in the branch pipe 65a and removes foreign matter contained in the treatment liquid. The second filter 63 collects foreign matter contained in the processing liquid passing through the branch pipe 65a.

The first connection valve 66 is provided in the branch pipe 65a, and opens and closes between the liquid feeding pipe 61 and the pumping unit 64 based on the operation instruction of the control device 100. The first connection valve 66 is, for example, an air operation valve. The above-mentioned second filter 63 may be provided on the upstream side of the first connection valve 66. The second connection valve 67 is provided in the branch pipe 65b, and opens and closes between the liquid feeding pipe 61 and the pumping unit 64 based on the operation instruction of the control device 100. The second connection valve 67 is, for example, an air operation valve.

The pressure measuring unit 68 measures the pressure of the processing liquid flowing through the pipeline in the liquid feeding unit 60. For example, the pressure measuring unit 68 measures the pressure between the first filter 62 and the pumping unit 64. Specifically, the pressure measuring unit 68 is provided in the branch pipe 65b, and measures the pressure (hydraulic pressure) of the processing liquid in the branch pipe 65b. The pressure measuring unit 68 outputs the measured value to the control device 100.

The foreign matter detecting unit 69 detects the foreign matter contained in the processing liquid flowing through the pipeline in the liquid feeding unit 60. For example, the foreign matter detecting unit 69 may be provided between the second connection valve 67 and the pressure measuring unit 68 in the branch pipe 65b. Further, the foreign matter detection unit 69 analyzes the scattered light emitted from the branch tube 65b by irradiating the branch tube 65b with the measurement light, and the like, thereby analyzing the number and characteristics (size, size) of the foreign matter in the processing liquid. The type of foreign matter) and the like may be measured. However, the method for detecting a foreign substance by the foreign substance detecting unit 69 is not limited to the above. Further, the installation position of the foreign matter detection unit 69 can be changed as appropriate. The foreign matter detection unit 69 outputs the foreign matter detection result to the control device 100.

The replenishing unit 50 replenishes the liquid feeding unit 60 with the processing liquid to be sent toward the discharging unit 30. The replenishment unit 50 includes a liquid source 51, a pumping unit 53, and a delivery pipe 55.

The liquid source 51 is a supply source of the processing liquid to be replenished in the liquid feeding unit 60. The pressure feeding unit 53 sends the processing liquid from the liquid source 51 to the liquid feeding unit 60. For example, the pressure feeding unit 53 temporarily stores the processing liquid supplied from the liquid source 51, and sends the processing liquid to the liquid feeding unit 60 in a pressurized state. Alternatively, the pressure feeding unit 53 receives the processing liquid by sucking the processing liquid in the liquid source 51, for example, and sends the received processing liquid to the liquid feeding unit 60. The pumping unit 53 includes, for example, a pump 56, a pump driving unit 57, and a pressure measuring unit 54.

The pump 56 sucks in the processing liquid in the liquid source 51 and sends the sucked treatment liquid toward the discharge unit 30. The pump 56 has, for example, an accommodating chamber for accommodating the treatment liquid and a contracting portion for contracting the accommodating chamber. The pump 56 expands the accommodation chamber by the contraction portion to receive the treatment liquid, and contracts the accommodation chamber by the contraction portion to send out the treatment liquid. As the pump 56, for example, a tube flam pump, a diaphragm pump, or a bellows pump may be used.

The pump drive unit 57 drives the pump 56 based on an operation instruction to the control device 100. Specifically, the pump drive unit 57 operates (drives) the contraction unit so as to contract the storage chamber of the pump 56. For example, the pump drive unit 57 is an air operation type drive unit that operates the contraction unit by gas. The pump drive unit 57 may contract the storage chamber of the pump 56 by adjusting the pressure of the gas (hereinafter, referred to as “drive pressure”).

The pressure measuring unit 54 acquires information about the pressure in the pump 56. For example, the pressure measuring unit 54 is connected to a connecting pipe between the pump 56 and the pump driving unit 57, and measures the pressure in the connecting pipe. The pressure measuring unit 54 measures, for example, the pressure of a gas for driving the pump 56. The pressure measuring unit 54 outputs the measured value to the control device 100.

The delivery pipe 55 guides the processing liquid from the pressure feeding unit 53 (pump 56) to the liquid feeding unit 60. Specifically, the delivery pipe 55 is connected to the end of the liquid delivery unit 60 on the upstream side of the liquid supply pipe 61. That is, the liquid feeding pipe 61 is connected between the replenishing unit 50 and the liquid feeding unit 60 via the first filter 62. The first filter 62 removes foreign matter contained in the processing liquid (treatment liquid replenished from the replenishment unit 50 to the liquid supply unit 60) flowing through the flow path in the liquid supply pipe 61.

The first connecting unit 81 connects the replenishing unit 50 and the liquid feeding unit 60. The first connection portion 81 has, for example, a switching valve 82. The switching valve 82 opens and closes between the replenishment unit 50 and the liquid feeding unit 60 based on the operation instruction of the control device 100. The switching valve 82 is provided at a connection point between the delivery pipe 55 of the replenishment unit 50 and the liquid supply pipe 61 of the liquid supply unit 60. The switching valve 82 is, for example, an air operation valve.

The switching valve 82 may be opened and closed at an opening change rate smaller than that of at least one of the first connection valve 66 and the second connection valve 67. The opening change rate is the rate of change in the valve opening per unit time. When the valve switches from the closed state to the open state, the opening change rate is the increase rate of the valve opening. When the valve switches from the open state to the closed state, the opening change rate is the decrease rate of the valve opening.

The second connecting unit 83 connects the liquid feeding unit 60 and the discharging unit 30. The second connection portion 83 has, for example, a discharge valve 84. The discharge valve 84 opens and closes between the liquid feeding unit 60 and the discharging unit 30 based on the operation command of the control device 100. The discharge valve 84 is provided at a connection point between the liquid feed pipe 61 of the liquid feed unit 60 and the liquid supply pipe 32 of the discharge unit 30. The discharge valve 84 is, for example, an air operation valve.

The relationship between the opening change rate between the discharge valve 84 and the first connection valve 66 (second connection valve 67) is the relationship between the opening change rate between the switching valve 82 and the first connection valve 66 (second connection valve 67). May be similar to. That is, the discharge valve 84 may be opened and closed at an opening change rate smaller than that of at least one of the first connection valve 66 and the second connection valve 67.

The treatment liquid supply unit 29 is provided with two filters, a first filter 62 and a second filter 63, as described above. As these two filters, those having different collection characteristics when collecting foreign substances contained in the treatment liquid are selected. The "foreign matter collection characteristic" indicates which type of foreign matter is contained in the treatment liquid and is different from each other and has high collection performance. Further, "high collection performance" means that the collection performance for the foreign matter is higher than the collection performance for the other foreign matter.

When the treatment liquid is a resist liquid, the foreign matter contained in the treatment liquid can be classified into two types, for example, based on the components constituting the foreign matter. Specifically, one is a foreign substance made of the same kind of material as the treatment liquid, and the other is a foreign substance made of a different kind of material. The foreign matter composed of the same kind of material is, for example, a polymer contained in a resist solution in the form of a lump, a substance derived from a residue of the resist solution in the apparatus, or the like. Further, the foreign matter composed of different materials is, for example, a foreign matter adhering to a place where it may come into contact with a treatment liquid such as a pipe of an apparatus. When these two types of foreign matter are supplied onto the work W, it is conceivable that a defect may occur on the work W. In particular, foreign matter composed of different materials may affect the etching performed by utilizing the chemical reaction of the resist liquid with the material.

Further, the filter may have different foreign matter collecting characteristics depending on its shape, material, and the like. For example, when the treatment liquid is a resist liquid, a filter using a hollow fiber membrane as a filtration membrane that functions as a collecting portion is generally used. In such a filter, it is conceivable that the collection characteristics of foreign substances change depending on the surface area of the filtration membrane, that is, the contact area between the filtration membrane and the treatment liquid. As an example, it is assumed that there are two types of filters having different surface areas of filtration membranes. In this case, it is considered that the filter having a large surface area has a higher ability to collect foreign substances composed of the above-mentioned different materials. On the other hand, it is considered that foreign substances composed of the same kind of materials as described above are likely to flow out from a filter having a large surface area to the subsequent stage, and a filter having a small surface area is considered to have higher collection performance. As described above, the collection characteristics of foreign substances by the filter differ from each other depending on the type of the filter. The state where the contact area between the treatment liquid and the collection portion (filtration membrane) is large may be formed by, for example, a long flow path through which the treatment liquid flows, in each portion of the primary side and the secondary side. It may be formed by a large area (that is, a large number of microchannels communicating from the primary side to the secondary side are provided in the collection portion in the filter).

In the present embodiment, as the first filter 62, a filter having a high surface area and a high ability to collect foreign substances composed of different materials is used. Further, as the second filter 63, a filter having a high surface area and a high ability to collect foreign substances made of the same kind of material is used. The selection and arrangement of the filter type can be changed according to the application of the device, the type of the treatment liquid, and the like.

The "type of foreign substance" may be classified based on the "component" of the foreign substance, but may be classified from another viewpoint. For example, they may be classified based on the "size" of the foreign matter. The criteria for classifying the types can be changed depending on the type of the treatment liquid, the content of the treatment for the work W after the treatment liquid is supplied, and the type of defects that may occur due to the foreign matter present in the treatment liquid. In addition, if the classification criteria are changed, the conditions for improving the collection performance may be changed for each type of foreign matter. Therefore, the factors (for example, the material, the contact area with the treatment liquid, etc.) that cause the collection characteristics of each type of foreign matter to change may change between the filters. As described above, the "foreign matter collection characteristic" in the filter may differ depending on the foreign matter classification method.

(Control device)
The control device 100 will be described in detail with reference to FIGS. 5 and 6. As shown in FIG. 5, the control device 100 has an operation command holding unit 102, a first pressure acquisition unit 103, and a second pressure acquisition unit 104 as functional modules (hereinafter referred to as “functional modules”). , A flow rate acquisition unit 105, a hydraulic pressure acquisition unit 106, a change control unit 107, and a processing liquid supply control unit 101.

The operation command holding unit 102 holds an operation command that defines the liquid processing procedure executed in the liquid processing unit U1. This operation command includes a target value (set value) of the discharge pressure when the processing liquid is discharged from the nozzle 31, an execution time for discharging the processing liquid from the nozzle 31, a target value (set value) of the replenishment pressure and the replenishment flow rate. Further, the execution time for replenishing the processing liquid from the replenishing unit 50 to the liquid feeding unit 60 may be included. Further, the operation command may include the content and time of the circulation process for circulating the process liquid before being supplied from the nozzle 31.

The first pressure acquisition unit 103 acquires a measured value from the pressure measurement unit 54. Specifically, the first pressure acquisition unit 103 acquires a measured value indicating the pressure (drive pressure to the pump 56) in the connecting pipe between the pump 56 and the pump drive unit 57 in the replenishment unit 50. The first pressure acquisition unit 103 outputs the acquired measured value to the processing liquid supply control unit 101.

The second pressure acquisition unit 104 acquires the measured value from the pressure measurement unit 74. Specifically, the second pressure acquisition unit 104 acquires a measured value indicating the pressure in the connecting pipe between the pump 71 and the pump drive unit 72 (drive pressure to the pump 71) in the liquid feeding unit 60. The second pressure acquisition unit 104 outputs the acquired measured value to the processing liquid supply control unit 101.

The flow rate acquisition unit 105 acquires a measured value from the flow rate measurement unit 73. Specifically, the flow rate acquisition unit 105 acquires a measured value indicating the flow rate of the gas for driving the pump 71 in the connecting pipe between the pump 71 and the pump drive unit 72. The flow rate acquisition unit 105 outputs the acquired measured value to the processing liquid supply control unit 101.

The hydraulic pressure acquisition unit 106 acquires a measured value from the pressure measurement unit 68. Specifically, the hydraulic pressure acquisition unit 106 acquires a measured value indicating the pressure of the processing liquid between the first filter 62 and the pumping unit 64 (pump 71). The hydraulic pressure acquisition unit 106 outputs the acquired measured value to the processing liquid supply control unit 101.

The change control unit 107 acquires a foreign matter detection result from the foreign matter detection unit 69. Specifically, the change control unit 107 acquires information on the number, size, and the like of foreign substances contained in the processing liquid flowing through the branch pipe 65b. Further, the change control unit 107 determines whether or not to change the content of the operation command executed by the processing liquid supply control unit 101 based on the detection result of the foreign matter. Then, when the content of the operation command is changed, the operation command held by the operation command holding unit 102 is updated. The change control by the change control unit 107 will be described later. If the variable light control is not performed, the change control unit 107 may be omitted.

The processing liquid supply control unit 101 controls the processing liquid supply unit 29 so as to discharge the processing liquid from the nozzle 31. The processing liquid supply control unit 101 includes, for example, a replenishment preparation unit 111, a replenishment control unit 112, a circulation control unit 113, a discharge preparation unit 114, and a discharge control unit 115 as functional modules.

The replenishment preparation unit 111 is configured to prepare for replenishing the processing liquid from the replenishment unit 50 to the liquid feeding unit 60. Specifically, the replenishment preparation unit 111 reduces the pressure difference between the replenishment unit 50 and the liquid supply unit 60 before replenishing the treatment liquid from the replenishment unit 50 to the liquid supply unit 60, and reduces the pressure difference. The switching valve 82 may be opened in the reduced state. The replenishment preparation unit 111 may change the pressure in the replenishment unit 50 so as to reduce the pressure difference between the replenishment unit 50 and the liquid feeding unit 60, for example, with the switching valve 82 closed. As an example of replenishment preparation, the replenishment preparation unit 111 has a pressure feeding unit 53 (pump drive unit 57) so that the pressure difference between the replenishment unit 50 and the liquid feeding unit 60 is reduced while the switching valve 82 is closed. You may control it.

The replenishment control unit 112 is configured to replenish the processing liquid from the replenishment unit 50 to the liquid feeding unit 60. Specifically, the replenishment control unit 112 starts replenishment of the processing liquid from the replenishment unit 50 to the liquid supply unit 60 after opening the switching valve 82. As an example, after opening the switching valve 82, the replenishment control unit 112 sequentially executes adjustment of the pressure in the replenishment unit 50, adjustment of the pressure in the liquid feeding unit 60, and re-switching of the switching valve 82 to the open state. After that, replenishment of the processing liquid to the liquid feeding unit 60 is started. The replenishment control unit 112 replenishes the processing liquid from the replenishment unit 50 to the liquid supply unit 60 in a state where the pressure difference between the replenishment unit 50 and the liquid supply unit 60 is reduced by the replenishment preparation unit 111.

The replenishment control unit 112 controls either the pumping unit 53 or the pumping unit 64 so that the pressure of the processing liquid sent from the pumping unit 53 to the pumping unit 64 follows the target value. While controlling the pressure of the processing liquid to follow the target value, the replenishment control unit 112 has the pumping unit 53 (pump drive unit 57) and the pumping unit so as to make the flow rate of the processing liquid follow the target value per unit time. The other of the unit 64 (pump drive unit 72) may be controlled.

The circulation control unit 113 is configured to circulate the processing liquid in the liquid feeding unit 60. Specifically, the circulation control unit 113 has the pump drive unit 72, the first connection valve 66, and the first connection valve 66 in a state where the processing liquid is replenished by the replenishment control unit 112 and the switching valve 82 and the discharge valve 84 are closed. 2 Controls the opening and closing of the connection valve 67. In this state, by controlling the pumping unit 64 (pump driving unit 72), the processing liquid may be circulated between the liquid feeding pipe 61 and the branch pipes 65a and 65b.

The discharge preparation unit 114 is configured to prepare for discharging the processing liquid from the nozzle 31. Specifically, the discharge preparation unit 114 may adjust the pressure of the processing liquid in the liquid feeding unit 60 before starting the discharge of the processing liquid from the nozzle 31. The discharge preparation unit 114 may change the pressure in the liquid feed unit 60 so as to reduce the pressure difference between the liquid supply unit 60 and the discharge unit 30 with the discharge valve 84 closed.

The discharge control unit 115 is configured to discharge the processing liquid from the nozzle 31 toward the work W. Specifically, the discharge control unit 115 opens the discharge valve 84, and with the discharge valve 84 open, discharges the processing liquid from the nozzle 31 to the work W. The discharge control unit 115 may control the pressure feed unit 64 (pump drive unit 72) so that the pressure of the processing liquid sent to the nozzle 31 follows the target value. Further, the discharge control unit 115 may discharge the processing liquid from the nozzle 31 toward the work W at a substantially constant flow rate by maintaining the target value at a constant set value.

The control device 100 is composed of one or a plurality of control computers. For example, the control device 100 has a circuit 120 shown in FIG. The circuit 120 includes one or more processors 121, a memory 122, a storage 123, an input / output port 124, and a timer 125.

The storage 123 has a storage medium that can be read by a computer, such as a hard disk. The storage medium records a program for causing the coating / developing apparatus 2 to execute the liquid treatment procedure described later. The storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk. The memory 122 temporarily records the program loaded from the storage medium of the storage 123 and the calculation result by the processor 121. The processor 121 constitutes each of the above-mentioned functional modules by executing the above program in cooperation with the memory 122. The input / output port 124 inputs / outputs an electric signal to / from each part of the coating / developing device 2. The timer 125 measures the elapsed time, for example, by counting a reference pulse having a fixed cycle.

The hardware configuration of the control device 100 is not necessarily limited to that constituting each functional module by a program. For example, each functional module of the control device 100 may be configured by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) in which the logic circuit is integrated.

[Processing liquid supply procedure]
With reference to FIGS. 7 and 8, as an example of the control method (board processing method) of the substrate processing apparatus, the liquid processing procedure executed by the control apparatus 100 will be described. FIG. 7 is a flowchart showing an example of the liquid treatment procedure.

As shown in FIG. 7, the control device 100 executes steps S01 and S02 in order. In step S01, for example, the replenishment preparation unit 111 prepares to replenish the processing liquid from the replenishment unit 50 to the liquid supply unit 60 so as to reduce the pressure difference between the replenishment unit 50 and the liquid supply unit 60. Controls the supply unit 29. In step S02, for example, the replenishment control unit 116 causes the replenishment unit 50 to replenish the processing liquid to the liquid feeding unit 60 in a state where the pressure difference between the replenishing unit 50 and the liquid feeding unit 60 is reduced. Controls the supply unit 29.

Next, the control device 100 sequentially executes step S03. In step S03, for example, the circulation control unit 113 controls the opening and closing of the pump drive unit 72, the first connection valve 66, and the second connection valve 67 with the switching valve 82 and the discharge valve 84 closed. In this state, the pumping unit 64 (pump driving unit 72) is controlled. The details of circulation control will be described later.

Next, the control device 100 executes steps S04 and S05 in order. In step S04, for example, the discharge preparation unit 114 controls the processing liquid supply unit 29 so as to reduce the pressure difference between the liquid feeding unit 60 and the discharge unit 30 in preparation for discharging the processing liquid from the nozzle 31. do. In step S05, for example, the discharge control unit 115 supplies the processing liquid from the nozzle 31 toward the work W in a state where the pressure difference between the inside of the liquid feeding unit 60 and the inside of the discharging unit 30 is reduced. The unit 29 is controlled. The details of the discharge preparation process and the discharge process will be described later. This completes a series of liquid treatment procedures.

Here, each of the replenishment, circulation, and discharge processes in the above series of processes will be described with reference to FIG.

In the replenishment control (step S02), the replenishment control unit 112 of the control device 100 switches the switching valve 82 from the closed state to the open state. After that, the replenishment pressure of the processing liquid sent from the pressure feeding unit 53 of the replenishing unit 50 to the pumping unit 64 of the liquid feeding unit 60 and the replenishing flow rate of the processing liquid are adjusted. At this time, as shown in FIG. 8A, the replenishment control unit 112 is a pumping unit 53 (pump drive unit) so as to make the replenishment pressure follow the target value, for example, based on the measured value by the pressure measuring unit 74. 57) may be controlled. The replenishment control unit 112 may control the pumping unit 64 (pump drive unit 72) so that the replenishment flow rate follows the target value based on the measured value by the flow rate measuring unit 65. In FIG. 8A, the pipeline in which the treatment liquid is flowing inside is shown by a thick line, the valve in the open state is shown in white, and the valve in the closed state is shown in black. (The same applies to FIGS. 8 (b) and 8 (c)).

In the circulation control (step S03), the discharge control unit 115 of the control device 100 switches the switching valve 82 from the open state to the closed state. After that, the circulation control unit 113 opens the first connection valve 66 and drives the pumping unit 64 (pump drive unit 72) with the second connection valve 67 closed, so that the processing liquid passes through the second filter 63. Move the treatment liquid so as to do so. After that, the pumping unit 64 (pump drive unit 72) is driven with the first connection valve 66 closed and the second connection valve 67 open. By repeating this operation, the treatment liquid is circulated so that the treatment liquid passes in the order of the second connection valve 67, the pump 71, and the first connection valve 66. At this time, the treatment liquid alternately passes through the first filter 62 and the second filter 63.

In the discharge control (step S05), the discharge control unit 115 of the control device 100 switches the discharge valve 84 from the closed state to the open state with the switching valve 82 and the first connection valve 66 closed. After that, the discharge control unit 115 adjusts the discharge pressure of the processing liquid sent to the nozzle 31. Specifically, the control of the pumping section 64 (the contracting section of the pump 71) is started. As a result, the discharge control unit 115 starts discharging the processing liquid from the nozzle 31 with the discharge valve 84 open. At this time, the discharge control unit 115 may adjust the pump drive unit 72 (pressure applied to the processing liquid from the pump 71) based on the value measured by the pressure measurement unit 68. After a lapse of a predetermined time, the discharge control unit 115 switches the second connection valve 67 and the discharge valve 84 from the open state to the closed state, respectively, while keeping the switching valve 82 and the first connection valve 66 in the closed state. As a result, the discharge is completed.
The predetermined time is set in the operation command held by the operation command holding unit 102, and is set in advance according to, for example, the amount of the processing liquid used in each liquid treatment. While the treatment liquid is being discharged, the control device 100 may control the rotation holding portion 20 so that the work W rotates, so that a resist coating film may be formed on the surface Wa of the work W.

[About changing the movement route of the treatment liquid]
The substrate processing apparatus is provided with a foreign matter detecting unit 69. The change control unit 107 may determine whether or not to change the content of the operation command executed by the processing liquid supply control unit 101 based on the detection result of the foreign matter by the foreign matter detection unit 69. The procedure for changing the processing based on the detection result of the foreign matter will be described with reference to FIGS. 9 and 10.

As shown in FIG. 9, the control device 100 executes step S11. In step S11, for example, the change control unit 107 acquires the detection result by the foreign matter detection unit 69. The detection result by the foreign matter detecting unit 69 may include, for example, information corresponding to the number of foreign matters contained in the processing liquid (the number of foreign matters per unit volume). Further, the detection result may include information indicating what kind of foreign matter is contained in the treatment liquid (what kind of foreign matter is contained and how much).

Next, the control device 100 executes step S12. In step S12, for example, the change control unit 107 determines whether to change the operation command based on the detection result of the foreign matter. Whether or not to change the operation command may be determined based on, for example, a predetermined threshold value for the number of foreign substances in the processing liquid. For example, when the number of foreign substances in the treatment liquid is equal to or less than the threshold value, the operation command may be changed so as to end the circulation of the treatment liquid. Further, when the number of foreign substances in the processing liquid is equal to or more than the threshold value, the operation command may be changed so as to repeat the circulation of the treatment liquid (increase the number of circulations).

If it is determined in step S12 that the content of the operation command is changed, the control device 100 executes step S13. In step S13, for example, the content described in the operation command held by the operation command holding unit 102 is changed. The content to be changed corresponds to a determination criterion such as a change in the number of circulations of the treatment liquid. This completes a series of procedures for changing the content of the directive. When the command content is changed, the processing liquid supply control unit 101 may immediately reflect the changed content and perform processing based on the changed content.

FIGS. 10 (a) and 10 (b) show the difference in the movement path of the treatment liquid depending on the presence or absence of circulation. For example, in FIG. 10A, the treatment liquid circulates in the order of the liquid feed pipe 61, the branch pipe 65b, and 65a, and then reaches the discharge valve 84 in the subsequent stage via the liquid feed pipe 61 and the branch pipe 65b again. Shows. In this case, the treatment liquid passes through the filters in the order of the first filter 62, the second filter 63, and the first filter 62, and then reaches the nozzle in the subsequent stage via the discharge valve 84. It is assumed that the operation command held by the operation command holding unit 102 defines the flow of such a processing liquid.

On the other hand, FIG. 10B shows that the treatment liquid does not circulate and reaches the discharge valve 84 in the subsequent stage via the liquid feed pipe 61 and the branch pipe 65b. In this case, the processing liquid passes only through the first filter 62 and then reaches the nozzle in the subsequent stage via the discharge valve 84. When the branch pipe 65b is provided with the foreign matter detection unit 69 as shown in FIG. 10B, the foreign matter in the treatment liquid can be evaluated when the treatment liquid reaches the branch pipe 65b. Foreign matter may be evaluated at this stage, and the content of subsequent processing may be changed according to the result. For example, when it is determined that the amount of foreign matter in the processing liquid is sufficiently small, the command content may be changed so as to reach the nozzle through the discharge valve 84 as it is as shown in FIG. 10 (b). Further, when it is determined that the treatment liquid contains a certain number of foreign substances, the treatment liquid is controlled to flow to the branch pipe 65a according to the content of the initial command as shown in FIG. 10 (a). You may. In this way, control may be performed to change the flow of the processing liquid by using the detection result by the foreign matter detecting unit 69. When the content of the operation command is changed so as to change the flow of the processing liquid, the control device 100 controls each valve and the pumping unit 64 so that the changed flow of the treatment liquid is formed.

In the above, the flow of the processing liquid in the processing liquid supply unit 29 has been described, but the above-mentioned opening / closing operation of each valve and the operation of the pumping unit 64 are examples, and various operations can be changed by changing the operation of each part. A flow of treatment liquid can be formed. In other words, by changing the opening / closing operation of each valve and the operation of the pumping unit 64, the flow of the processing liquid in the liquid feeding pipe 61, the branch pipes 65b, and 65a can be flexibly controlled. For example, the treatment liquid supply unit 29 can be controlled so that the circulation direction of the treatment liquid is not the direction from the branch pipe 65b to the branch pipe 65a but the opposite direction as shown in FIG. 10 (c). .. Specifically, the first connection valve 66 (see FIG. 4) on the branch pipe 65b is opened, and the second connection valve 67 (see FIG. 4) and the switching valve 82 on the branch pipe 65b are closed. Then, when the pump 71 sucks in the processing liquid, the processing liquid moves in the opposite direction. In this case, the circulation flow of the treatment liquid is formed so as to move the first filter 62 from the downstream side to the upstream side. After performing this circulation in the opposite direction, the processing liquid flowing through the branch pipe 65a causes the branch pipe 65b and the discharge valve 84 by switching the open / closed state of the first connection valve 66 and the second connection valve 67 and operating the pump 71. It may be controlled so that the valve is discharged from the nozzle. In this case, since the processing liquid that has passed through the second filter 63 is discharged from the nozzle, the second filter 63 becomes substantially the most downstream filter. As described above, according to the above-mentioned processing liquid supply unit 29, it is possible to change the filter that is substantially the most downstream by changing the content of the command for controlling the flow of the processing liquid.

Further, as an opportunity to change the flow of the processing liquid, the processing result for the work W in the subsequent stage may be used instead of the detection result by the foreign matter detecting unit 69. For example, when the etching process for the work W is performed in the subsequent stage, the flow of the processing liquid may be changed according to the inspection after etching (AEI: After Etching Inspection). For example, as a result of inspection after etching, it is assumed that many defects derived from foreign substances having high collection performance by the second filter 63 remain. In this case, it is considered that the effect of removing foreign substances by utilizing the collection performance of the second filter 63 is enhanced by passing the treatment liquid in a state where the second filter 63 is arranged in the subsequent stage rather than the first filter 62. Therefore, taking advantage of the fact that the flow of the treatment liquid can be changed, the flow of the treatment liquid may be changed so that the second filter 63 is in the subsequent stage (most downstream).

[Action]
According to the substrate processing apparatus (coating / developing apparatus 2) and the substrate processing method described above, a plurality of filters (first) are located at different positions on the pipelines (liquid feed pipe 61 and branch pipes 65a, 65b) through which the treatment liquid flows. A filter 62 and a second filter 63) are provided. Therefore, the processing liquid from the supply source (liquid source 51) passes through the plurality of filters and is supplied to the nozzle 31. Further, since these filters have different collection characteristics for a plurality of types of foreign substances that are expected to be contained in the treatment liquid, the plurality of types of foreign substances contained in the treatment liquid can be collected by the plurality of filters. Therefore, it is possible to further reduce the amount of foreign matter in the processing liquid discharged to the substrate.

When the treatment liquid is discharged to the substrate for liquid treatment, foreign matter contained in the treatment liquid may cause defects. Therefore, a filter is provided on the flow path to allow the treatment liquid to pass through in order to remove the foreign matter. Is being considered. In the substrate processing apparatus and the substrate processing method described in the above-described embodiment, attention is paid to the fact that there are a plurality of types of foreign substances contained in the processing liquid, and a plurality of filters having different collection characteristics for foreign substances are provided on the pipeline. Therefore, it is possible to effectively remove foreign substances in the treatment liquid by utilizing the collection characteristics different from each other in the plurality of filters. Further, depending on the filter, the components of the treatment liquid remaining when the treatment liquid was previously circulated may flow out to the subsequent stage as a kind of foreign matter. In such a case, for example, by providing a filter having a high collection performance for this kind of foreign matter in the subsequent stage, the foreign matter can be removed from the processing liquid before being discharged to the substrate. As described above, by providing a plurality of filters having different collection characteristics from each other, it is possible to reduce foreign substances in the processing liquid before discharging the filters to the substrate.

In addition, the collection characteristics of the filter may exist in various ways depending on the type of filter, but a filter with high collection performance for foreign substances of a type with a high frequency of defects that may occur after liquid treatment of the subsequent stage on the substrate is selected. Can be used. By allowing the treatment liquid to pass through such a filter, it is possible to remove foreign matter having a high frequency of defects from the treatment liquid. Therefore, it is possible to suppress the occurrence of defects on the substrate.

Further, as a plurality of filters, those having different contact areas with the treatment liquid in the collecting portion (for example, a hollow fiber membrane) may be selected. When a filter having the same shape and material is applied to a specific treatment liquid, the collection characteristics for foreign matter can be changed by making the contact areas of the collection portion with the treatment liquid different from each other. A multi-stage filter of a substrate processing apparatus may be configured by utilizing the characteristics of such a filter.

Further, when a plurality of filters are used, the filter having the highest collection performance for the type of foreign matter having a high frequency of defects that may occur after the liquid treatment in the subsequent stage is performed on the substrate is located at the most downstream of the pipeline. May be good. Further, the most downstream may be substantially the most downstream, and may be any mode in which the processing liquid before being discharged from the nozzle 31 passes last. With such a configuration, foreign matter having a high frequency of defect occurrence is appropriately removed by the most downstream filter, so that the occurrence of defects on the substrate can be suppressed.

The pipeline includes a liquid feed pipe 61 as a main pipeline connecting a supply source and a nozzle, and branch pipes 65a and 65b as a bypass pipeline formed so as to connect two branch points provided in the main pipeline. And may be included. The liquid feeding unit 60 may have a pump 71 as a liquid feeding pump provided in the bypass pipeline. Further, among the plurality of filters, the first filter (first filter 62) having the highest collection performance for the type of foreign matter having a high frequency of defects is located between the two branch points P1 and P2 in the main pipeline. It will be provided. At this time, the first filter 62 may be provided on the downstream side of the other filters. Further, at least one of the filters different from the first filter may be provided in the bypass pipeline. With such a configuration, it is possible to appropriately remove foreign substances that may be related to defects by using the first filter.

The filter provided in the bypass pipe may be provided on the upstream side of the bypass pipe with respect to the liquid feeding pump. In this case, the liquid feeding pump (pump 71) can finally pass the first filter when the processing liquid is discharged from the nozzle 31. That is, since the first filter can be substantially arranged on the most downstream side, foreign matter having a high frequency of defects is appropriately removed by the most downstream filter (first filter 62).

Further, as described in the above embodiment, a control unit (control device 100) that controls the liquid feeding unit 60 may be further provided. Further, the liquid feeding unit 60 may further have a foreign matter detecting unit 69 for detecting foreign matter in the processing liquid on the downstream side of the bypass pipeline on the downstream side of the liquid feeding pump. Further, the control device 100 may perform control to change the flow of the processing liquid in the pipeline according to the detection result by the foreign matter detecting unit 69. In this way, by changing the flow of the treatment liquid in the main pipeline and the bypass pipeline according to the detection result by the foreign matter detection unit 69, for example, the degree of residual foreign matter in the treatment liquid is taken into consideration. The number of times the processing liquid has passed through the filter can be changed. In this way, it is possible to select a control that can more appropriately remove foreign substances in the treatment liquid.

Further, the flow of the treatment liquid in the main pipeline and the bypass pipeline is changed so as to change the filter that the treatment liquid passes through last before reaching the nozzle 31 according to the state of occurrence of defects in the substrate after the treatment. Control may be performed. In this case, for example, the filters can be passed in a more appropriate order according to the state of occurrence of defects on the processed substrate. Therefore, it is possible to determine an appropriate control content so that defects do not occur in the processed substrate.

[Other embodiments]
Although various exemplary embodiments have been described above, various omissions, substitutions, and changes may be made without being limited to the above-mentioned exemplary embodiments. It is also possible to combine elements in different embodiments to form other embodiments.

For example, the configuration between the supply source (liquid source 51) and the nozzle 31, that is, the configuration for supplying the processing liquid to the nozzle 31 (discharge unit 30) includes the configuration of the pumping unit, the pipeline, and the like. It can be changed as appropriate. The arrangement of the supply pump (pump 71) in the pipeline can also be changed as appropriate. Further, the arrangement of the filters can be appropriately changed according to the configuration of the pipeline.

11 (a) and 11 (b) show an example of changing the arrangement of the filter in the same pipeline configuration as the above embodiment. FIG. 11A shows an example in which the second filter 63 is arranged in the branch pipe 65b on the downstream side of the pump 71 instead of on the branch pipe 65a. In such a configuration, when the processing liquid is supplied to the nozzle 31 via the discharge valve 84 in the same operation as that shown in FIG. 8C, the processing liquid passes through the second filter 63 and then passes through the second filter 63. It is supplied to the nozzle 31. On the other hand, depending on the contents of the operation of the pump 71 and the valve, the processing liquid may finally pass through the first filter 62 and be shared with the nozzle 31. As described above, the arrangement of the filter may be on the upstream side or the downstream side of the pump 71.

Further, FIG. 11B shows an example in which the first filter 62 is arranged on the downstream side of the branch point P2 on the downstream side of the branch pipe 65b as a bypass pipe. In this case, the processing liquid that circulates in the circulation passage including the bypass pipe or has passed through the liquid feed pipe 61 always passes through the first filter 62 and is supplied to the nozzle 31 via the discharge valve 84. With such a configuration, it is not possible to realize an embodiment that does not pass through the most downstream first filter 62, but by changing the number of circulations of the treatment liquid in the upstream, for example, control that does not pass through the second filter 63 is possible. Will be. As described above, the arrangement of the filter can be appropriately changed depending on, for example, the characteristics of the treatment liquid and the characteristics of the foreign matter to be removed by the filter. Needless to say, the positional relationship between the valve and the filter can be changed as appropriate.

In addition, the number of filters can be changed as appropriate. Further, when increasing the number of filters, some of the plurality of filters may be of the same type having the same collection characteristics.

Further, although the case where the treatment liquid is a resist liquid has been described in the above embodiment, the same configuration may be provided for a treatment liquid different from the resist liquid.

Further, the configuration may not include the foreign matter detecting unit 69. Further, the foreign matter detection unit 69 may be provided at another position in the pipeline (a position different from the branch pipe 65b).

From the above description, it is understood that the various embodiments of the present disclosure are described herein for purposes of explanation and that various modifications can be made without departing from the scope and gist of the present disclosure. Will. Accordingly, the various embodiments disclosed herein are not intended to be limiting, and the true scope and gist is set forth by the appended claims.

1 ... Substrate processing system, 2 ... Coating / developing device, 3 ... Exposure device, 4 ... Carrier block, 5 ... Processing block, 6 ... Interface block, 20 ... Rotation holding unit, 21 ... Holding unit, 22 ... Drive unit, 29 ... Processing liquid supply unit, 30 ... Discharge unit, 31 ... Nozzle, 32 ... Liquid supply pipe, 50 ... Replenishment unit, 51 ... Liquid source, 53 ... Pressure feed unit, 54 ... Pressure measurement unit, 55 ... Delivery pipe, 56 ... Pump , 57 ... Pump drive unit, 60 ... Liquid feeding unit, 61 ... Liquid feeding pipe, 62 ... First filter, 63 ... Second filter, 64 ... Pressure feeding unit, 65 ... Flow measuring unit, 65a, 65b ... Branch pipe, 66 ... 1st connection valve, 67 ... 2nd connection valve, 68 ... Pressure measurement unit, 69 ... Foreign matter detection unit, 71 ... Pump, 72 ... Pump drive unit, 73 ... Flow measurement unit, 74 ... Pressure measurement unit, 81 ... 1 connection unit, 82 ... switching valve, 83 ... second connection unit, 84 ... discharge valve, 100 ... control device, 101 ... processing liquid supply control unit, 102 ... operation command holding unit, 103 ... first pressure acquisition unit, 104 ... Second pressure acquisition unit, 105 ... Flow rate acquisition unit, 106 ... Hydraulic pressure acquisition unit, 107 ... Change control unit, 111 ... Replenishment preparation unit, 112 ... Replenishment control unit, 113 ... Circulation control unit, 114 ... Discharge preparation unit, 115 ... Discharge control unit.

Claims (13)

A discharge section having a nozzle that discharges the processing liquid to the substrate,
A liquid feeding unit that sends the processing liquid to the discharging unit,
A supply source for supplying the treatment liquid to be sent to the discharge unit, and a supply source for supplying the treatment liquid to the liquid supply unit.
Equipped with
The liquid feeding part is
The pipeline through which the treatment liquid flows and
A substrate processing apparatus having a plurality of filters provided at different positions on the pipeline and having different collection characteristics for a plurality of types of foreign substances that are expected to be contained in the processing liquid. The first aspect of the present invention includes a filter having a high collection performance for a type of foreign matter having a high frequency of defects that may occur after the liquid treatment of the substrate is performed in the subsequent stage among the plurality of types of foreign matter. The substrate processing apparatus described. The substrate processing apparatus according to claim 1 or 2, wherein the plurality of filters have different contact areas with the processing liquid in the collecting portion. Among the plurality of filters, the filter having the highest collection performance for the type of foreign matter having a high frequency of occurrence of defects that may occur after performing the liquid treatment in the subsequent stage on the substrate is located at the most downstream of the pipeline. Item 6. The substrate processing apparatus according to any one of Items 1 to 3. The pipeline includes a main pipeline connecting the supply source and the nozzle, and a bypass pipeline formed so as to connect two branch points provided in the main pipeline.
The liquid feeding unit further has a liquid feeding pump provided in the bypass pipeline.
Of the plurality of filters, the first filter having the highest collection performance for foreign substances of a type having a high frequency of occurrence of defects that may occur after performing the liquid treatment in the subsequent stage on the substrate is the two of the main pipelines. It is provided between the branch points on the downstream side of the filter different from the first filter.
The substrate processing apparatus according to any one of claims 1 to 3, wherein at least one of the filters different from the first filter is provided in the bypass pipeline. The substrate processing apparatus according to claim 5, wherein the filter provided in the bypass pipe is provided on the upstream side of the bypass pipe with respect to the liquid feeding pump. Further provided with a control unit for controlling the liquid feeding unit, the liquid feeding unit is further provided.
The liquid feeding unit further has a foreign matter detecting unit for detecting foreign matter in the processing liquid on the downstream side of the bypass pipeline with respect to the liquid feeding pump.
The substrate processing apparatus according to claim 5 or 6, wherein the control unit controls to change the flow of the processing liquid in the main pipeline and the bypass pipeline according to the detection result by the foreign matter detecting unit. Further provided with a control unit for controlling the liquid feeding unit, the liquid feeding unit is further provided.
The control unit in the main pipeline and the bypass pipeline so as to change the filter through which the processing liquid last passes before reaching the nozzle, depending on the occurrence of defects in the substrate after processing. The substrate processing apparatus according to claim 5 or 6, which controls to change the flow of the processing liquid. A substrate processing method in which a processing liquid from a supply source is discharged from a nozzle to a substrate via a pipeline.
A substrate processing method in which a plurality of filters are provided at different positions on the pipeline and have different collection characteristics for a plurality of types of foreign substances that are expected to be contained in the treatment liquid. The claim that the treatment liquid is finally passed through the filter having the highest collection performance for the type of foreign matter having a high frequency of occurrence of defects that may occur after the liquid treatment of the substrate in the subsequent stage among the plurality of filters. 9. The substrate processing method according to 9. The pipeline is provided in the main pipeline connecting the supply source and the nozzle, a bypass pipeline formed so as to connect two branch points provided in the main pipeline, and the bypass pipeline. With a liquid feeding pump,
Of the plurality of filters, the first filter having the highest collection performance for foreign substances of a type having a high frequency of occurrence of defects that may occur after performing the liquid treatment in the subsequent stage on the substrate is the two of the main pipelines. It is provided between the branch points on the downstream side of the filter different from the first filter.
The substrate processing method according to claim 9, wherein at least one of the filters different from the first filter is provided in the bypass pipeline. Further, a foreign matter detecting unit for detecting foreign matter in the processing liquid is further provided on the downstream side of the bypass pipeline on the downstream side of the liquid feeding pump.
The substrate processing method according to claim 11, wherein the flow of the processing liquid in the main pipeline and the bypass pipeline is changed according to the detection result by the foreign matter detecting unit. The flow of the treatment liquid in the main pipeline and the bypass pipeline so as to change the filter through which the treatment liquid last passes before reaching the nozzle, depending on the occurrence of defects in the substrate after the treatment. 11. The substrate processing method according to claim 11.

Images