TW202104522A - Polishing composition for alminium nitride substrate and method for polishing alminium nitride substrate - Google Patents

Abstract

The present invention provides a polishing agent composition for an aluminum nitride substrate, said polishing agent composition being used to finish-machine an aluminum nitride substrate at a high polishing speed to achieve good surface smoothness. The polishing agent composition for aluminum nitride substrates contains alumina particles, an aliphatic amine compound, an acid and/or a salt thereof, and water. In addition, the pH value (25 DEG C) is 7.5 or more and less than 11.5.

Description

Abrasive composition for aluminum nitride substrate and polishing method for aluminum nitride substrate

The present invention relates to a ceramic material that can be used as various electronic materials represented by materials such as integrated circuits or integrated circuit packages. In particular, it relates to an abrasive composition for polishing aluminum nitride single crystal substrates used to manufacture semiconductor elements or aluminum nitride polycrystalline substrates popularized as high-function heat sinks for semiconductor mounting. An abrasive composition useful for effective polishing of aluminum nitride polycrystalline substrates with excellent heat dissipation properties.

Aluminum nitride has high thermal conductivity, and is excellent in insulation and mechanical strength, so it has gradually become popular as a heat dissipation material for integrated circuits, integrated circuit packages, and the like. Among them, aluminum nitride polycrystals obtained by sintering powders with aluminum nitride as the main component have excellent insulation and mechanical strength, are easy to bond with metal conductors, and have high thermal conductivity. Therefore, they are used for semiconductor mounting The high-function heat sink is gradually and rapidly popularized. Such heat-dissipating substrates are generally manufactured by the following methods.

After the aluminum nitride raw material powder and additives such as a sintering aid are sufficiently mixed, the sintered substrate is formed by forming, debinding, and firing by various forming methods. Afterwards, the surface of the sintered substrate is smoothed by grinding, and then a metal thin film layer is formed on the surface of the sintered substrate, and electronic components (such as laser diodes) are mounted on the metal thin film.

However, due to the miniaturization and high-density requirements of electronic components in recent years, the smoothness accuracy of the surface of the aluminum nitride polycrystalline substrate on which the electronic components are mounted is also required to be significantly improved. Polishing to smooth the surface of the aluminum nitride polycrystalline substrate can be achieved by making a dispersion of abrasive grains exist in the polishing The surface is implemented by pressing the polishing pad to the polishing surface and rubbing it.

However, since the grain boundaries of the aluminum nitride polycrystalline substrate are fragile, in general polishing processing, there is a problem in that degranulation or the like occurs during the polishing processing, and sufficient smoothness cannot be achieved. In the polishing of aluminum nitride polycrystalline substrates, methods have been proposed to improve the surface smoothness while increasing the polishing speed (Patent Documents 1 to 4).

[Prior Technical Literature]

[Patent Literature]

[Patent Document 1] JP 2006-272506 A

[Patent Document 2] Japanese Patent Application Laid-Open No. 4-223852

[Patent Document 3] Japanese Patent Application Laid-Open No. 4-114984

[Patent Document 4] JP 2018-159033 A

Patent Document 1 proposes a method of polishing an aluminum nitride sintered substrate by forming diamond abrasive grains of a specific particle size into fixed abrasive grains having a specific abrasive grain density (amount of abrasive grains per unit volume). Patent Document 2 proposes a method of polishing an aluminum nitride sintered substrate with composite abrasive grains of aluminum oxide and chromium oxide. Patent Document 3 proposes a method of polishing an aluminum nitride sintered substrate by combining a urethane resin polishing pad and cerium oxide abrasive grains. Patent Document 4 proposes a method of polishing an aluminum nitride sintered substrate using an abrasive composition containing aluminum oxide particles, a dispersant, an acid, a hydrogen ion supplier, and water, and having a pH of 0.1 to 5.0. However, with these methods, it is not possible to finish the aluminum nitride substrate into a good surface smoothness at a high polishing speed.

The subject of the present invention is to provide an aluminum nitride substrate polishing composition for finishing an aluminum nitride substrate into a good surface smoothness at a high polishing speed.

As a result of intensive research conducted by the inventors of the present case, they have found that the above-mentioned problems can be solved by using the following abrasive composition, and the invention has been achieved.

[1] An abrasive composition for aluminum nitride substrates, which contains aluminum oxide particles, an aliphatic amine compound, an acid and/or its salt, and water, and has a pH value (25° C.) of 7.5 or more and less than 11.5.

[2] The abrasive composition for aluminum nitride substrates according to [1], wherein the aliphatic amine compound is an aliphatic amine compound having a hydroxyl group.

[3] The abrasive composition for aluminum nitride substrates according to [1], wherein the aliphatic amine compound is an aliphatic amine compound without a hydroxyl group.

[4] The abrasive composition for aluminum nitride substrates according to [1], which contains one or more kinds of aliphatic amine compounds having hydroxyl groups and aliphatic amine compounds having no hydroxyl groups as the aliphatic amine compounds.

[5] The abrasive composition for aluminum nitride substrates according to [2] or [4], wherein the aliphatic amine compound having a hydroxyl group is selected from monoethanolamine, 1-aminopropanol, and 3-aminopropanol , 2-Methylaminoethanol, 2-amino-1-butanol, 2-amino-2-methyl-1-propanol, N,N-diethylhydroxylamine, N,N-dimethyl Ethanolamine, 2-ethylaminoethanol, 2-(butylamino)ethanol, diethanolamine, diisopropanolamine, 2-amino-2-methylpropanediol, N-methyldiethanolamine, triisopropyl At least one of alcoholamine and triethanolamine.

[6] The abrasive composition for aluminum nitride substrates according to [3] or [4], wherein the aliphatic amine compound without a hydroxyl group is selected from ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutyl Amine, secondary butylamine, tertiary butylamine, cyclohexylamine, piperazine, diethylamine, methylpropylamine, ethylpropylamine, triethylamine, ethylenediamine, 1,2-propanediamine, Trimethylene diamine, tetramethylene diamine, pentamethylene diamine, hexamethylene diamine, N,N-dimethylethylenediamine, N-ethylethylenediamine, N,N,N, N-tetramethylethylenediamine, N-methyl-1,3-propanediamine, 1,3-diaminepentane, diethylenetriamine, bis(hexamethylene) At least one of triamine, ethylenetriamine, ethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, and tetramethylhexamethylenediamine.

[7] The abrasive composition for aluminum nitride substrates according to any one of [1] to [6], wherein the acid and/or its salt is selected from inorganic acid and/or its salt, organic acid and/or At least one of its salts.

[8] The abrasive composition for aluminum nitride substrates according to [7], wherein the acid and/or its salt is an inorganic acid and/or its salt, which is selected from the group consisting of nitric acid, sulfuric acid, hydrochloric acid, phosphoric acid and/or At least one of the group consisting of salt.

[9] The abrasive composition for aluminum nitride substrates of [7], wherein the acid and/or its salt is an organic acid and/or its salt, which is selected from oxalic acid, malic acid, citric acid, formic acid, At least one of the group consisting of acetic acid, succinic acid, malonic acid, adipic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid, propionic acid, lactic acid and/or salts thereof.

[10] The abrasive composition for an aluminum nitride substrate according to any one of [1] to [9], wherein the pH value (25° C.) of the abrasive composition is 8.5 or more and less than 10.5.

[11] The abrasive composition for aluminum nitride substrates according to any one of [1] to [10], which is an abrasive composition for aluminum nitride polycrystalline substrates.

[12] A method for polishing an aluminum nitride substrate, which uses the abrasive composition of any one of [1] to [10] to polish the aluminum nitride substrate in a recycling manner.

[13] A polishing method for aluminum nitride polycrystalline substrates, which uses the abrasive composition of [11] in a recycling manner to polish aluminum nitride polycrystalline substrates.

The abrasive composition for aluminum nitride substrates of the present invention can increase the polishing speed and improve the surface smoothness after polishing.

Hereinafter, embodiments of the present invention will be described. The present invention is not limited to the following embodiments, and changes, corrections, and improvements can be made without departing from the scope of the patent application.

1. Abrasive composition

The abrasive composition for an aluminum nitride substrate of the present invention contains alumina particles, an aliphatic amine compound, an acid and/or its salt, and water. In addition, the pH value (25°C) is 7.5 or more and less than 11.5.

(1) Alumina particles

The alumina particles used in the present invention may be α-alumina, or intermediate alumina, or a mixture of α-alumina and intermediate alumina. Examples of intermediate alumina include γ-alumina, δ-alumina, and θ-alumina. When polishing an aluminum nitride substrate, it is preferable to use α-alumina from the viewpoint of increasing the polishing speed as much as possible.

As a raw material for the production of alumina, gibbsite: Al ₂ O _{3 can} be cited. 3H ₂ O, diaspore: Al ₂ O ₃ . H ₂ O, pseudo-diaspore: Al ₂ O ₃ . nH ₂ O(n=1~2) etc. These alumina raw materials are prepared by the following method, for example.

Gibbsite: Al ₂ O ₃ . 3H ₂ O

It is obtained by dissolving bauxite in a hot solution of sodium hydroxide, cooling the solution obtained by removing impurity components by filtration, and drying the resulting precipitate.

Diaspore: Al ₂ O ₃ . H ₂ O

It is obtained by hydrolyzing _{aluminum alkoxide: Al(OR) 3} obtained by the reaction of metal aluminum and alcohol.

Pseudo-diaspore: Al ₂ O ₃ . nH ₂ O(n=1~2)

It is obtained by treating gibbsite in an alkaline gas environment and under water vapor.

By firing these alumina raw materials, α-alumina, γ-alumina, δ-alumina, θ-alumina, and the like are obtained.

The average particle size (D50) of the alumina particles is preferably 0.1 to 10.0 μm, more preferably 0.1~5.0μm, more preferably 0.2~2.0μm. By setting the average particle diameter to 0.1 μm or more, it is possible to suppress a decrease in the polishing rate. By setting the average particle size to 10.0 μm or less, it is possible to suppress the deterioration of the smoothness of the substrate surface after polishing.

The concentration of the alumina particles in the abrasive composition is preferably 1 to 50% by mass, more preferably 2 to 45% by mass, and still more preferably 3 to 40% by mass. If the concentration of alumina particles is less than 1% by mass, a sufficient polishing rate cannot be obtained, and even if it is more than 50% by mass, a higher polishing rate is not observed, which is uneconomical.

In addition, examples of the dispersant for alumina particles include alumina sol, celluloses, polycarboxylic acids (salts), copolymers containing repeating units of polycarboxylic acids, and condensed phosphates.

(2) Aliphatic amine compounds

The abrasive composition of the present invention contains an aliphatic amine compound. Specifically, the aliphatic amine compound which has a hydroxyl group and the aliphatic amine compound which does not have a hydroxyl group are mentioned.

Specific examples of aliphatic amine compounds having a hydroxyl group include monoethanolamine, 1-aminopropanol, 3-aminopropanol, 2-methylaminoethanol, 2-amino-1-butanol, 2 -Amino-2-methyl-1-propanol, N,N-diethylhydroxylamine, N,N-dimethylethanolamine, 2-ethylaminoethanol, 2-(butylamino)ethanol , Diethanolamine, diisopropanolamine, 2-amino-2-methylpropanediol, N-methyldiethanolamine, triisopropanolamine, triethanolamine, etc.

Specific examples of aliphatic amine compounds that do not have a hydroxyl group include ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylamine, secondary butylamine, tertiary butylamine, cyclohexylamine, piperazine, Diethylamine, methylpropylamine, ethylpropylamine, triethylamine, ethylenediamine, 1,2-propanediamine, trimethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylene Diamine, N,N-dimethylethylenediamine, N-ethylethylenediamine, N,N,N,N-tetramethylethylenediamine, N-methyl-1,3-propanediamine, 1,3-Diaminepentane, ethylenetriamine, bis(hexamethylene)triamine, ethylenetriamine, ethylenetetramine, ethylenepentamine, pentaethylenehexamine, tetraethylene Methyl hexamethylene diamine and so on.

The aliphatic amine compound having a hydroxyl group and the aliphatic amine compound having no hydroxyl group may be used alone, respectively, or an aliphatic amine compound having a hydroxyl group and an aliphatic amine compound having no hydroxyl group may be used in combination. If an aliphatic amine compound having a hydroxyl group or an aliphatic amine compound having no hydroxyl group is included, the surface roughness of the substrate is improved. If an aliphatic amine compound having a hydroxyl group and an aliphatic amine compound not having a hydroxyl group are used in combination, in addition to improving the surface roughness of the substrate, the polishing speed is also increased. That is, it is preferable that the abrasive composition contains at least one aliphatic amine compound having a hydroxyl group and an aliphatic amine compound having no hydroxyl group. As a specific example in the case where an aliphatic amine compound having a hydroxyl group and an aliphatic amine compound not having a hydroxyl group are used in combination, for example, diethanolamine and diethylamine are used in combination, and triethanolamine and diethylamine are used in combination.

When an aliphatic amine compound having a hydroxyl group and an aliphatic amine compound not having a hydroxyl group are used in combination, the ratio of the aliphatic amine compound having a hydroxyl group is preferably 10 to 90% by mass relative to the added amount of the total aliphatic amine compound. The ratio of the aliphatic amine compound of the hydroxyl group is preferably 10 to 90% by mass.

The content of the aliphatic amine compound in the abrasive composition is usually 0.00001 to 4.0% by mass, preferably 0.0001 to 2.0% by mass.

(3) Acid and/or its salt

The acid and/or its salt used in the present invention is selected from at least one of inorganic acid and/or its salt, organic acid and/or its salt.

Examples of inorganic acids and/or their salts include nitric acid, sulfuric acid, hydrochloric acid, hydrofluoric acid, phosphoric acid, phosphonic acid, carbonic acid and/or their salts. Among them, nitric acid, sulfuric acid, hydrochloric acid, phosphoric acid and/or are preferred. Its salt. As the kind of salt, ammonium salt, sodium salt, potassium salt, etc. are mentioned.

Examples of organic acids and/or their salts include oxalic acid, malic acid, citric acid, formic acid, acetic acid, succinic acid, malonic acid, adipic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid, and propylene Acid, lactic acid and/or its salt, etc. As the kind of salt, ammonium salt, sodium salt, potassium salt, etc. are mentioned. In the case of polyacid, it may be a partial salt.

The content of the acid and/or its salt in the abrasive composition can be appropriately determined in accordance with the setting of the pH value (25°C).

(4) Oxidizer

The abrasive composition of the present invention may contain an oxidizing agent as an optional component. Examples of the oxidizing agent include hydrogen peroxide, periodic acid-based oxidizing agent, permanganic acid-based oxidizing agent, permetallic acid-based oxidizing agent, and the like. Specific examples include hydrogen peroxide, orthoperiodic acid, orthoperiodate, metaperiodic acid, metaperiodate, permanganic acid, permanganate, permetallic acid, and permetallic acid. Wait. As a more specific example, hydrogen peroxide, normal periodic acid, sodium metaperiodate, potassium permanganate, permolybdic acid, sodium permolybdate, etc. can be mentioned.

The content of the oxidizing agent in the abrasive composition is preferably in the range of 0.1 to 10.0% by mass, and more preferably in the range of 0.2 to 8.0% by mass.

(5) Water

The water used in the present invention is preferably water from which impurities are removed, such as distilled water and ion-exchanged water. In consideration of cleaning properties after grinding, ion exchange water is preferred. Water has the function of controlling the fluidity of the abrasive, so its content can be appropriately set according to the target polishing characteristics such as the polishing speed. For example, the content of water is preferably 40 to 90% by mass of the abrasive composition. If the water content is less than 40% by mass of the abrasive composition, the viscosity of the abrasive becomes high, which may impair fluidity. On the other hand, if the water content exceeds 90% by mass, the concentration of abrasive grains becomes low, and a sufficient polishing rate may not be obtained.

(6) pH

The pH value (25°C) of the abrasive composition of the present invention is 7.5 or more and less than 11.5, preferably 8.5 or more and less than 10.5. If the pH value (25°C) is less than 7.5, the polishing rate becomes insufficient, and productivity decreases. If the pH value (25°C) is 11.5 or higher, the smoothness of the surface of the aluminum nitride substrate after polishing Getting worse. The pH value (25°C) of the abrasive composition can be appropriately set by adjusting the content of the aliphatic amine compound, the content of the acid and/or its salt.

(7) Preparation method of abrasive composition

The abrasive composition of the present invention can be prepared by mixing the components in a conventional method. From an economic point of view, the abrasive composition is usually produced as a concentrated liquid, and it is often diluted during use. The abrasive composition can be used as it is, and if it is a concentrated liquid, it can be diluted and used. When diluting the concentrated solution, the dilution ratio is not particularly limited, and can be appropriately determined according to the concentration of each component in the concentrated solution and the grinding conditions. In addition, the content of each component mentioned above is the content at the time of use.

2. Grinding method of aluminum nitride substrate

The device for polishing aluminum nitride substrates using the abrasive composition of the present invention is not particularly limited. A polishing machine equipped with a jig (carrier) and a polishing pad for holding the aluminum nitride substrate can be used, or a double-sided polishing machine and Any one of single-sided grinders.

The polishing pad is not particularly limited, and conventionally known ones can be used. Examples of the material of the polishing pad include polyurethane. The shape of the polishing pad is preferably, for example, a non-woven fabric shape, a suede shape, or the like.

The method of supplying the abrasive composition of the present invention to the grinder can be a method of supplying the abrasive composition between the polishing pad and the aluminum nitride substrate by a pump or the like in a state where the constituent components of the abrasive composition are sufficiently mixed in advance; A method of mixing and supplying constituent components in the supply line before polishing, etc. From the viewpoint of increasing the polishing speed and reducing the load on the grinder, it is preferable to use a pump or the like in a state where the constituent components of the polishing composition are thoroughly mixed beforehand, and the polishing composition is supplied to The method between the polishing pad and the aluminum nitride substrate. In addition, in the above-mentioned polishing method, as the aluminum nitride substrate, either an aluminum nitride single crystal substrate or an aluminum nitride polycrystalline substrate can be polished.

[Example]

Hereinafter, the present invention will be described in further detail based on examples, but the present invention is not limited to these examples.

[Preparation method of abrasive composition]

The abrasive compositions used in Examples 1 to 11 and Comparative Examples 1 to 3 are abrasive compositions containing the materials described in Table 1 at the contents described in Table 1. Table 2 shows the results of the polishing test using these abrasive compositions.

Table 1

[Average particle size of alumina particles]

The average particle size of the alumina particles used in the present invention is measured using a laser diffraction particle size distribution measuring device (manufactured by Shimadzu Corporation, SALD2200). The average particle diameter of the alumina particles is the average particle diameter (D50) at which the cumulative particle diameter distribution from the small particle diameter side becomes 50% based on the volume.

[Grinding conditions]

The polishing conditions during the polishing test are shown below.

Grinding machine manufactured by Fujitsu Machinery Co., Ltd., SLM-100 (single-side grinding machine)

Diameter of pressure plate 350mm

Object to be polished, manufactured by MARUWA Co., Ltd., polycrystalline aluminum nitride 2inch substrate

Polishing pad SUBA800

Grinding pressure 350gf/cm ²

Platen rotation speed 60rpm

Abrasive supply speed 200ml/min (circulation supply mode)

Grinding time 2hr

[Calculation method of polishing rate]

Polishing speed (μm/hr)=[weight before polishing of aluminum nitride polycrystalline substrate (g)-weight after polishing of aluminum nitride polycrystalline substrate (g)] ÷ polishing area of aluminum nitride polycrystalline substrate (cm ² )÷density of aluminum nitride polycrystalline substrate (g/cm ³ )÷polishing time (min)×1000(μm/cm)×60(min/hr)

[Surface roughness of aluminum nitride polycrystalline substrate (Sa)]

The surface roughness (Sa) was measured using a 3D measuring laser microscope manufactured by OLYMPUS. The measurement conditions used a measurement device (OLS4100 (measurement magnification 2160 times)) manufactured by OLYMPUS, no cutoff, and a measurement area of 128 μm×128 μm.

Table 2

[the study]

Examples 1 to 4 are experimental examples using an abrasive composition containing an aliphatic amine compound without a hydroxyl group as an aliphatic amine compound. Compared with Comparative Example 1 using an abrasive composition containing no aliphatic amine compound, The surface roughness (Sa) is improved.

Examples 5 and 6 are experimental examples in which an abrasive composition containing an aliphatic amine compound having a hydroxyl group is used as an aliphatic amine compound. Compared with Comparative Example 1, the surface roughness (Sa) is improved.

Examples 7 to 9 are experimental examples in which an aliphatic amine compound without a hydroxyl group and an aliphatic amine compound with a hydroxyl group are used in combination. Compared with Example 1, which only uses an aliphatic amine compound without a hydroxyl group, the polishing speed is increased.

From the comparison between Example 10 and Comparative Example 2, it can be seen that by setting the pH (25°C) of the polishing agent composition to 7.5 or more, the polishing rate becomes higher. From the comparison between Example 11 and Comparative Example 3, it can be seen that by making the pH (25°C) of the abrasive composition less than 11.5, the surface roughness (Sa) is reduced.

From the above, it is clear that by using the abrasive composition of the present invention, the balance of the polishing rate and the surface roughness (Sa) of the polycrystalline substrate after polishing is improved.

[Industrial availability]

The abrasive composition of the invention can be used to manufacture aluminum nitride polycrystalline substrates used as heat dissipation substrates for various electronic materials represented by integrated circuits or integrated circuit packages. In addition, an aluminum nitride single crystal substrate used as a substrate material for manufacturing semiconductor devices can also be used for surface treatment to form a substrate surface suitable for epitaxial growth.

Claims (13)

An abrasive composition for aluminum nitride substrates, which contains aluminum oxide particles, an aliphatic amine compound, an acid and/or its salt, and water, and has a pH value (25° C.) of 7.5 or more and less than 11.5. The abrasive composition for aluminum nitride substrates of claim 1, wherein the aliphatic amine compound is an aliphatic amine compound having a hydroxyl group. The abrasive composition for aluminum nitride substrates of claim 1, wherein the aliphatic amine compound is an aliphatic amine compound without a hydroxyl group. The abrasive composition for aluminum nitride substrates according to claim 1, which contains as the aliphatic amine compound one or more of an aliphatic amine compound having a hydroxyl group and an aliphatic amine compound having no hydroxyl group. The abrasive composition for aluminum nitride substrates according to claim 2 or 4, wherein the aliphatic amine compound having a hydroxyl group is selected from monoethanolamine, 1-aminopropanol, 3-aminopropanol, 2-methylamine Ethyl alcohol, 2-amino-1-butanol, 2-amino-2-methyl-1-propanol, N,N-diethylhydroxylamine, N,N-dimethylethanolamine, 2-ethyl Amino ethanol, 2-(butylamino) ethanol, diethanolamine, diisopropanolamine, 2-amino-2-methylpropanediol, N-methyldiethanolamine, triisopropanolamine, triethanolamine At least one of. According to claim 3 or 4, the abrasive composition for aluminum nitride substrates, wherein the aliphatic amine compound without a hydroxyl group is selected from ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylamine, and secondary butyl Amine, tertiary butylamine, cyclohexylamine, piperazine, diethylamine, methylpropylamine, ethylpropylamine, triethylamine, ethylenediamine, 1,2-propanediamine, trimethylenediamine, tetramethylene Diamine, pentamethylene diamine, hexamethylene diamine, N,N-dimethylethylenediamine, N-ethylethylenediamine, N,N,N,N-tetramethylethylenediamine , N-methyl-1,3-propanediamine, 1,3-diaminepentane, diethylenetriamine, bis(hexamethylene)triamine, triethylenetriamine, triethylenetetramine , At least one of tetraethylenepentamine, pentaethylenehexamine, and tetramethylhexamethylenediamine. The abrasive composition for aluminum nitride substrates according to any one of claims 1 to 6, wherein the acid and/or its salt is selected from the group consisting of inorganic acid and/or its salt, organic acid and/or its salt At least one. The abrasive composition for aluminum nitride substrates of claim 7, wherein the acid and/or its salt is an inorganic acid and/or its salt, which is selected from the group consisting of nitric acid, sulfuric acid, hydrochloric acid, phosphoric acid and/or its salt At least one of the group. The abrasive composition for aluminum nitride substrates of claim 7, wherein the acid and/or its salt is an organic acid and/or its salt, which is selected from oxalic acid, malic acid, citric acid, formic acid, acetic acid, succinic acid At least one of the group consisting of, malonic acid, adipic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid, propionic acid, lactic acid and/or salts thereof. The abrasive composition for aluminum nitride substrates according to any one of claims 1 to 9, wherein the pH value (25° C.) of the abrasive composition is 8.5 or more and less than 10.5. The abrasive composition for an aluminum nitride substrate according to any one of claims 1 to 10, wherein the aluminum nitride substrate is an aluminum nitride polycrystalline substrate. A method for polishing an aluminum nitride substrate, which uses the abrasive composition according to any one of claims 1 to 10 in a recycling mode to polish the aluminum nitride substrate. A method for polishing aluminum nitride polycrystalline substrates, which uses the abrasive composition of claim 11 to grind the aluminum nitride polycrystalline substrates in a recycling manner.