TW202102948A - 用於以圖像來曝光材料的系統及方法 - Google Patents

用於以圖像來曝光材料的系統及方法 Download PDF

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TW202102948A
TW202102948A TW109115186A TW109115186A TW202102948A TW 202102948 A TW202102948 A TW 202102948A TW 109115186 A TW109115186 A TW 109115186A TW 109115186 A TW109115186 A TW 109115186A TW 202102948 A TW202102948 A TW 202102948A
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安德 奇兒宏
強德 果傑森
約翰 戴爾
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挪威商維西科技股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
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    • B29C64/10Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
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    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/227Driving means
    • B29C64/236Driving means for motion in a direction within the plane of a layer
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • B29C64/268Arrangements for irradiation using laser beams; using electron beams [EB]
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • B29C64/286Optical filters, e.g. masks
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • B29C64/393Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/704162.5D lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70475Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558Dose control, i.e. achievement of a desired dose

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Abstract

一種用於以圖像來曝光材料的系統,包括曝光平台(12)及電子光投影機(13),該電子光投影機(13)佈置在該曝光平台(12)上方且經調適以朝向佈置於該曝光平台(12)處的材料投射圖像。該電子光投影機及該曝光平台經配置以相對於彼此移動且該電子光投影機(13)經連接至投影機控制單元。該投影機控制單元經配置以提供由圖像資料表示的將曝光的圖像的序列,將靜態圖像圖案疊加至將曝光的該等圖像的邊緣區段上,產生組合圖像的序列,且該電子光投影機(13)經配置以依序地將該等組合圖像曝光至該材料上。

Description

用於以圖像來曝光材料的系統及方法
本發明有關在利用用於將光可聚合物(及其他材料)曝光的裝置,以用於逐層地固化材料來建立3D物體或用於其中僅一層被聚合或曝光的2D直接成像光刻技術之時,用於消除在相鄰曝光條紋中非所欲之不連續效果的製程。常見的用途除了有關PCB、觸控面板、太陽能電池、化學研磨等等之製造的光刻技術所利用的2D直接光刻機之外,將是在3D列印機、快速原型機、快速製造機及類似的逐層建立製程設備中。
當兩個相鄰曝光條紋緊密置放在一起時,聚合材料將依曝光條紋的定位與各條紋中的能量(power)而異。若曝光條紋的定位相對於彼此在x及y方向中良好地對齊(即與圖像像素在相同格線上)且曝光條紋中的能量相同,則結果會是最佳的。相鄰的曝光條紋就能彼此緊密(「背對背」)置放或是具有符合圖像像素格線的一重疊區。若應用了一重疊區,該重疊區中的圖像資料必須在圖像資料集合中之一者上被移除以避免過度曝光。
然而,若在正交於圖像條紋長度之圖像上的能量分佈有特定的變異性,或者若對各曝光條紋而言的圖像定位不是在像素格線上,則聚合材料將具有非所欲的屬性,諸如不連續性或未曝光區。
WO2016/124634描述一種用於曝光光可聚合材料以逐層地固化材料來建立3D物體的方法。曝光的進行是藉由分割將曝光的圖像成為數個子圖像(sub images)以及藉由光投影機作為手段將該等子圖像依序地曝光至該光可聚合材料上,該等子圖像具有至少一個像素的內部距離。
EP3040778描述一種用於在圖像區域上提供來自光投影機之均勻亮度的方法。對於因圖像位置的差異及/或兩相鄰曝光條紋上之亮度均勻性中的差異所致的相鄰曝光條紋之邊緣部分中之曝光結果上之效果降低,該文件沒有解決此問題。
本發明之目的是提供用於逐層地曝光光敏感或光可聚合材料以建立3D物體或用於2D直接成像光刻技術的系統及方法,其減少或消除上述先前技術文件的非所欲效果。
因此本發明的一個目的是提供能夠減少在相鄰曝光條紋之邊緣部分中的曝光結果上的效果的系統及方法,該效果是由圖像位置中的差異及/或兩相鄰曝光條紋上的亮度均勻性中的差異所造成的。
本發明的系統及方法將減輕對於經曝光圖像中之亮度均勻性的需求,也減少控制機器內部之圖像位置的機械力學之容差。當此類參數容差得以減少時較容易提供節省成本的機器,因為亮度均勻性及圖像定位機械力學兩者都需要昂貴的機器部件。
本發明之目的的達成乃藉由申請專利範圍的特徵作為手段。
在一實施例中,用於以圖像曝光材料的系統包含曝光平台及經佈置在該曝光平台上方的電子光投影機。該電子光投影機經調適以朝向佈置於該曝光平台處的材料投射圖像,其中該電子光投影機及該曝光平台經配置以相對於彼此移動,及其中該電子光投影機連接至投影機控制單元。該投影機控制單元經配置以提供將曝光的圖像的序列,其中該等圖像由圖像資料表示,並將靜態圖像圖案疊加至將曝光的該等圖像的邊緣區段上,產生組合圖像的序列。
該投影機控制單元也可經配置以控制靜態圖像圖案到將曝光的該等圖像上的疊加。
該電子光投影機經配置以依序地將該等組合圖像曝光至該材料上。
此系統於該材料處提供所產生之曝光,在相鄰圖像之間的重疊區中提供良好的均勻性。
在一實施例中將曝光的該等圖像乃以CAD(電腦輔助設計)圖像資料的形式,例如儲存在CAD資料檔上。該靜態圖像圖案接著在該圖像區域之各側上經疊加至該圖像資料檔給定的資料圖案上。
將由該電子光投影機曝光的材料是(例如)光敏感或光可聚合材料。在後者的情況中,該系統可如稍早描述地使用於3D列印。
該電子光投影機在一實施例中乃連接至馬達控制器,其提供同步信號至該電子光投影機以供控制該電子光投影機相對於該曝光平台的移動。此種移動致使該投影機能夠建立圖像序列中的下一個圖像。
在一實施例中在該圖像資料被依序地呈現的同時該經疊加圖案是固定的。此表示被投射至將曝光之該材料上的該等圖像在曝光區域上改變,以便形成完整的圖片/物體。然而,該經疊加圖案的功用是為了平滑化相鄰圖像之間的過渡,而可為固定的(即對於序列中的各圖像而言該經疊加圖案的圖像資料是相同的)。
在一實施例中在曝光條紋之一側上的經疊加圖案與相鄰曝光條紋之另一側是互補的。
該經疊加圖案可具有在完整投射圖像寬度與一個投射圖像像素之間的寬度。在大部分實施例中,該寬度比完整投射圖像更細。該經疊加圖案的長度能(例如)對應於在一經投射圖像中的列數,即具有與序列中的各圖像相同的長度。
經疊加圖案能具有不同形狀,諸如例如鋸齒形或階梯鋸齒形,或任何其他適當形狀。
對應於以上說明,一種用於以圖像曝光材料的方法在一實施例中包含下列步驟: -提供將曝光的圖像的序列, -將靜態圖像圖案疊加至將曝光的該等圖像的邊緣區段上,產生組合圖像的序列, -藉由光投影機作為手段,依序地將該等組合圖像曝光至該材料上。
第1圖中圖示了用於逐層地曝光光敏感或光可聚合材料11以建立3D物體或用於2D直接成像光刻技術的系統10。
該系統包含曝光平台12及電子光投影機13,該電子光投影機經佈置在曝光平台12上方。電子光投影機13能朝向曝光平台12發射光14而因此發射到佈置在曝光平台12上之任意媒體11上,藉而投射圖像至該媒體上。媒體11是(例如)光敏感或光可聚合材料。電子光投影機13相對於經曝光材料11移動,同時由馬達控制器提供同步信號15以使該投影機能建立圖像序列中的下一個圖像。
該電子光投影機包含空間調制器,例如DLP/LCD/LCOS或類似的光/能量投影機,其作為用於在3D列印機/快速製造機或2D光刻機(直接成像曝光機)中之光可聚合材料層之固化的固化光/能量的來源。在經投射圖像相對於被曝光材料運動的同時執行該製程,藉而產生相鄰的資料曝光條紋,如第2圖中所示。曝光條紋21、22稍微地重疊,因此提供了重疊區23。
當需要多個曝光條紋時,圖像之上的能量分佈(亮度均勻性)是對於運動系統中使用之投影機的關鍵參數。第3圖圖示一理想狀況,其中能量及圖像定位經正確地對齊,因此提供均勻組合曝光圖像30。
無論是使用一個或多個投影機,若亮度均勻性不在特定容差之內,依所曝光之材料的敏感度而定,在與相鄰的曝光條紋相比時將會非常顯眼。此將在經曝光材料的聚合結果中相鄰條紋之間的邊緣上提供不連續梯級41。第4圖圖示此狀況。
另外,若該(等)投影機相對於經曝光材料的機械對齊容差不是經投射像素大小的一小部分,則在曝光條紋之間x及y方向兩者中都將有圖像的偏移。若相鄰曝光條紋重疊,則此將導致曝光條紋之間的邊緣上的未曝光區或過度曝光區。此種狀況的實例經圖示在第11圖及第12圖中。
當藉由在機器上在y方向及x方向兩者中移動而讓運動系統中之運動期間的曝光所涵蓋的面積比圖像更寬時,該製程將模糊化(smear out)能量差異,並且在曝光條紋之間的共享區域上模糊化曝光條紋之間的圖像偏移差異。此可以被稱為邊緣融合區域(edge blending area)。此種模糊化將確保曝光條紋之間的能量或像素邊緣上的任何差異將不會有不連續的特性,反而是連續的特性。第5圖及第6圖圖示此狀況。該等圖式中的實例顯示兩個曝光條紋51、52,其中第二條紋52的經投射圖像相對於第一條紋51的經投射圖像在x及y方向中都偏移。重疊區53中的圖像因此是兩圖像條紋的邊緣的融合,其中重疊區中的能量分佈經模糊化。第5圖中圖示了代表兩曝光條紋51、52的能量曲線54、55。所造成的重疊區之能量曲線53因此是平滑的、連續的曲線。此種連續特性將改善曝光結果品質。當在僅具一軸(y軸)或具兩軸(x及y軸)的相同系統中使用多個光投影機時也能使用此製程,產生相鄰曝光條紋。
第7圖圖示由電子光投影機曝光至材料上的圖像的實例。該圖像可為(例如)CAD(電腦輔助設計)圖像資料72的形式,其具有在圖像區域之各側上疊加到CAD檔給定之資料圖案上的靜態圖像圖案71。依照特定應用的需求而異,靜態圖像圖案71的寬度能經變化。在極端的情況中,該圖案的寬度能與圖像或曝光條紋一樣寬,同時最小寬度是一個圖像像素。常見地,圖案寬度將與用於此應用中之機械裝備的一般容差相同,即20~200 µm。
隨著CAD檔資料圖案在投影機圖像上方捲動,並同步於經曝光材料置放所在之平台的相對運動,經疊加圖案與CAD檔給定的資料圖案在逐個像素的基礎上經歷邏輯「及」(logical “AND”)運算。
圖像區域的側邊71構成相鄰曝光條紋之間的刻意的重疊區。包括在重疊區中的該部分的圖像內含經疊加圖像圖案。在重疊區內部CAD檔所給定的資料圖案將在相鄰曝光條紋上是相同的,因此重疊區內部第一曝光條紋的右側將與重疊區內部第二曝光條紋的左側相同。相鄰圖像條紋之間的重疊CAD資料也描述在第10圖中。
第8圖及第9圖顯示該經疊加圖案的兩個可能形狀的實例。該等圖式圖示了第一曝光條紋之右側與第二曝光條紋之左側的一區段。在各側上的經疊加圖案是形狀互補的,如第8圖及第9圖中所述。此確保在重疊區中均勻的能量分佈。
依照經曝光聚合材料的特性而定,該經疊加圖案能定制,以在曝光條紋之間的區域中獲得最佳的連續曝光結果。如第7圖至第9圖中顯示,該圖案可在整個圖像條紋長度上重複。
依照所欲之邊緣融合的程度而定,兩相鄰曝光條紋之間的圖像重疊區中的經疊加圖案可在正交於條紋長度的大小(重疊區寬度)上變化。
沿曝光條紋之方向的經疊加圖案長度受限於在一個1圖像中的列數(1 DMD高度)。在第7圖的實例中,該數目是1080(HD)或1600(WQXGA),但也能使用其他圖像解析度,諸如2160(4k)。
在曝光期間,該經疊加圖案可為固定的,同時按照經曝光材料與投影機之間的相對移動,CAD檔所給定的資料圖案經捲動/依序地曝光。
經疊加圖案可由投影機控制單元預先程式化並疊加,該投影機控制單元可經連接至該投影機或包含在該投影機中。控制系統在一實施例中可經程式化在控制該投影機的外部PC中。
藉由利用按照本發明的系統的曝光結果提供了在相鄰曝光條紋之間的連續能量過渡,以及在相鄰曝光條紋之間的連續位置過渡。
10:系統 11:材料 12:曝光平台 13:電子光投影機 14:光 15:同步信號 21:第一曝光條紋 22:第二曝光條紋 23:重疊區 30:組合曝光圖像 51:第一曝光條紋 52:第二曝光條紋 53:重疊區的能量曲線 54:能量曲線 55:能量曲線 71:靜態圖像圖案 72:CAD圖像資料
現將更詳細地並參看隨附圖式描述本發明。
第1圖圖示用於在3D列印機/快速製造機或2D光刻機中固化光可聚合材料層的系統。
第2圖圖示由按照本發明之系統進行的曝光製程。
第3圖圖示在曝光期間的理想狀況,其中來自光投影機而在曝光圖像之上的亮度均勻性是理想的,同時相鄰曝光條紋的定位是理想的。
第4圖圖示在曝光期間的非理想狀況,其中的亮度均勻性致使了相鄰曝光條紋之間的能量不連續性。
第5圖圖示藉由利用該系統的一實施例曝光重疊區之後所造成的能量分佈。
第6圖圖示藉由利用該系統的一實施例曝光重疊區之後所造成的圖像分佈,其中該等重疊區在x及y中有偏移。
第7圖圖示CAD圖像及由電子光投影機曝光至材料上的經疊加圖案的實例。
第8圖圖示在將曝光的圖像的側邊上的經疊加圖案的一個實例。
第9圖圖示在將曝光的圖像的側邊上的經疊加圖案的另一實例。
第10圖圖示如何利用來自圖像投影機的兩個曝光條紋將CAD圖像曝光至光敏感材料的實例。
第11圖圖示致使了曝光條紋之間的邊緣上的未曝光區的兩相鄰圖像之曝光的實例。
第12圖圖示另一個致使了曝光條紋之間的邊緣上的未曝光區的兩相鄰圖像之曝光的另一實例。
10:系統
11:材料
12:曝光平台
13:電子光投影機
14:光
15:同步信號

Claims (15)

  1. 一種用於以圖像來曝光一材料的系統,其中該系統包含一曝光平台(12)及一電子光投影機(13),該電子光投影機(13)佈置在該曝光平台(12)上方且經調適以朝向佈置於該曝光平台(12)處的一材料投射圖像,其中該電子光投影機及該曝光平台經配置以相對於彼此移動且其中該電子光投影機(13)經連接至一投影機控制單元,該投影機控制單元經配置以: -提供由圖像資料表示的將曝光的圖像的一序列, -將一靜態圖像圖案疊加至將曝光的該等圖像的該等邊緣區段上,產生組合圖像的一序列,及 其中該電子光投影機(13)經配置以依序地將該等組合圖像曝光至該材料上。
  2. 如請求項1所述之系統,其中將曝光的該等圖像是以CAD(電腦輔助設計)圖像資料(72)的形式,該CAD圖像資料在該圖像區域的各側上具有一靜態圖像圖案(71)經疊加到由該CAD檔給定之該資料圖案上。
  3. 如請求項1所述之系統,其中該材料(11)是一光敏感或光可聚合材料。
  4. 如請求項1所述之系統,其中該電子光投影機(13)經連接至一馬達控制器,該馬達控制器向該電子光投影機提供一同步信號(15)以用於控制該電子光投影機相對於該曝光平台的該移動,以使該投影機能建立在一圖像序列中的該下一個圖像。
  5. 如請求項1所述之系統,其中在該圖像資料經依序地呈現的同時該經疊加圖案是固定的。
  6. 如請求項1所述之系統,其中在該曝光條紋之一側上的該經疊加圖案與該相鄰曝光條紋之該另一側互補。
  7. 如請求項1所述之系統,其中該投影機控制單元經配置以控制該靜態圖像圖案到將曝光的該等圖像上的該疊加。
  8. 如請求項1所述之系統,其中該經疊加圖案具有的一寬度在一完整投射圖像寬度與一個投射圖像像素之間。
  9. 如請求項1所述之系統,其中該經疊加圖案具有的一長度對應於在一個經投射圖像中的列數。
  10. 如請求項1所述之系統,其中該經疊加圖案是鋸齒形的。
  11. 如請求項10所述之系統,其中該經疊加圖案是階梯鋸齒形的。
  12. 一種用於以圖像來曝光一材料的方法,該方法包含下列步驟: -提供將曝光的圖像的一序列, -將一靜態圖像圖案疊加至將曝光的該等圖像的該等邊緣區段上,產生組合圖像的一序列, -藉由一光投影機作為手段,依序地將該等組合圖像曝光至該材料上。
  13. 如請求項12所述之方法,其中將曝光的該等圖像是以CAD(電腦輔助設計)圖像資料(72)的形式,該CAD圖像資料在該圖像區域的各側上具有一靜態圖像圖案(71)經疊加到由該CAD檔給定之該資料圖案上。
  14. 如請求項12所述之方法,包含:向該電子光投影機提供一同步信號(15)以用於控制該電子光投影機相對於該曝光平台的該移動,以使該投影機能建立在一圖像序列中的該下一個圖像。
  15. 如請求項12所述之方法,控制將曝光之圖像的該序列。
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NO20190617A1 (en) 2020-11-17
EP3969963C0 (en) 2023-08-09
KR20220009433A (ko) 2022-01-24
EP3969963A1 (en) 2022-03-23
EP3969963B1 (en) 2023-08-09
TWI834873B (zh) 2024-03-11
JP2022533136A (ja) 2022-07-21
CN113892060A (zh) 2022-01-04
WO2020229137A1 (en) 2020-11-19

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