TW202102596A - Resin composition, film, near infrared ray-cutting filter, near infrared ray-transmitting filter, solid state imaging element, image display device and infrared ray sensor - Google Patents

Abstract

Provided are: a resin composition that contains a prescribed near infrared ray-absorbing dye, 0.001-1000 ppm by mass of a compound represented by formula (AS1) and a resin; a film; a near infrared ray-cutting filter; a near infrared ray-transmitting filter; a solid state imaging element; an image display device; and an infrared ray sensor. In the formula: RA1 denotes a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or a heterocyclic ring; RA2 and RA3 each independently denote an alkyl group, an alkenyl group, an aryl group or a heterocyclic ring; RA1 and RA2 may bond to each other to form a ring; and RA2 and RA3 may bond to each other to form a ring.

Description

Resin composition, film, near-infrared cut filter, near-infrared transmission filter, solid-state imaging element, image display device, and infrared sensor

The present invention relates to a resin composition containing a squaraine compound. In addition, the present invention relates to a film using a composition containing a squarylium compound, a near-infrared cut filter, a near-infrared transmission filter, a solid-state imaging device, an image display device, and an infrared sensor.

Video cameras, digital cameras, mobile phones with camera functions, etc., use solid-state imaging devices that use color images, that is, CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Film Semiconductor). These solid-state imaging elements use silicon photodiodes with sensitivity to infrared rays in their light-receiving parts. Therefore, a near-infrared cut filter is sometimes installed to perform visibility correction.

The near-infrared cut filter is manufactured using a resin composition containing a near-infrared absorbing dye. As one of the near-infrared absorbing dyes, a squarylium compound is known. In addition, Patent Document 1 and Patent Document 2 describe a squarylium compound having a specific structure as a near-infrared absorbing dye.

[Patent Document 1] International Publication No. 2018/230486 [Patent Document 2] JP 2019-011455 A

The inventors of the present invention conducted studies on films formed using resin compositions containing squaraine compounds described in Patent Document 1 and Patent Document 2. As a result, they found that the films containing squaraine compounds are resistant to light. There is room for further improvement.

The object of the present invention is to provide a resin composition capable of forming a film having excellent light resistance and having excellent storage stability. Furthermore, an object of the present invention is to provide a film, a near-infrared cut filter, a near-infrared transmission filter, a solid-state imaging element, an image display device, and an infrared sensor using the aforementioned resin composition.

式中，Rs¹¹⁹ 及Rs¹²⁰ 分別獨立地表示取代基， A¹ 及A² 分別獨立地表示氧原子或-N（Rs¹²⁵ ）-， Rs¹²¹ ～Rs¹²⁵ 分別獨立地表示氫原子或取代基， E¹ 及E² 分別獨立地表示碳原子、硼原子或-C（=O）-， 在E¹ 為碳原子的情況下ns32為2，在E¹ 為硼原子的情況下ns32為1，在E¹ 為-C（=O）-的情況下ns32為0， 在E² 為碳原子的情況下ns33為2，在E² 為硼原子的情況下ns33為1，在E² 為-C（=O）-的情況下ns33為0， ns30及ns31分別獨立地表示0～5的整數， 在ns30為2以上的情況下，複數個Rs¹¹⁹ 可以相同亦可以不同，複數個Rs¹¹⁹ 中的2個Rs¹¹⁹ 可以彼此鍵結而形成環， 在ns31為2以上的情況下，複數個Rs¹²⁰ 可以相同亦可以不同，複數個Rs¹²⁰ 中的2個Rs¹²⁰ 可以彼此鍵結而形成環， 在ns32為2的情況下，2個Rs¹²¹ 可以相同亦可以不同，2個Rs¹²¹ 可以彼此鍵結而形成環， 在ns33為2的情況下，2個Rs¹²² 可以相同亦可以不同，2個Rs¹²² 可以彼此鍵結而形成環， Ar¹⁰⁰ 表示伸芳基或雜伸芳基， ns100表示0～2的整數， [化學式2]

式（AS1）中，R^A1 表示氫原子、烷基、烯基、芳基或雜環基；R^A2 及R^A3 分別獨立地表示烷基、烯基、芳基或雜環基，R^A1 與R^A2 可以相互鍵結而形成環，R^{A2 與} R^A3 可以相互鍵結而形成環。 ＜2＞如＜1＞所述之樹脂組成物，其中，式（AS1）的R^A2 及R^A3 中的至少一者為烷基。 ＜3＞如＜1＞所述之樹脂組成物，其中，式（AS1）的R^A1 ～R^A3 分別獨立地表示烷基或R^A3 表示烷基，並且R^A2 與R^A3 相互鍵結而形成環。 ＜4＞如＜1＞所述之樹脂組成物，其中，式（As1）所表示之化合物為選自N-甲基吡咯啶酮及二甲基乙醯胺中之至少1種。 ＜5＞如＜1＞至＜4＞之任一項所述之樹脂組成物，其中，式（SQ1）所表示之近紅外線吸收色素為式（SQ2）所表示之近紅外線吸收色素； [化學式3]

式中，L⁴¹ ～L⁴⁴ 分別獨立地表示伸烷基、伸炔基、伸芳基、雜環基或將該等鍵結2個以上而獲得之2價的基團， Z⁴¹ 及Z⁴² 分別獨立地表示單鍵、-O-、-C（=O）-、-S-、-N（R^N1 ）-、-S（=O）-或-S（=O）₂ -， A⁴¹ 及A⁴² 分別獨立地表示氧原子或-N（R^N2 ）-， R^N1 及R^N2 分別獨立地表示氫原子、烷基或芳基， Rs¹⁴¹ 及Rs¹⁴² 分別獨立地表示取代基， ns41及ns42分別獨立地表示0～5的整數， 在ns41為2以上的情況下，複數個Rs¹⁴¹ 可以相同亦可以不同，複數個Rs¹⁴¹ 中的2個Rs¹⁴¹ 可以彼此鍵結而形成環， 在ns42為2以上的情況下，複數個Rs¹⁴² 可以相同亦可以不同，複數個Rs¹⁴² 中的2個Rs¹⁴² 可以彼此鍵結而形成環； 其中，在L⁴¹ ～L⁴⁴ 為伸烷基、Z⁴¹ 及Z⁴² 為單鍵、A⁴¹ 及A⁴² 為-N（R^N2 ）-的情況下，ns41及ns42中的至少一者為1～5的整數。 ＜6＞如＜1＞至＜4＞之任一項所述之樹脂組成物，其中，式（SQ1）所表示之近紅外線吸收色素為式（SQ3）所表示之近紅外線吸收色素； [化學式4]

式中，Q¹ 、Q⁴ 、Q⁵ 、Q⁸ 、Q¹¹ 、Q¹⁴ 、Q¹⁵ 及Q¹⁸ 分別獨立地表示碳原子或氮原子； Rs¹ ～Rs⁵ 、Rs¹¹ ～Rs¹⁵ 分別獨立地表示氫原子、烷基、磺酸基、-SO₃ M¹ 或鹵素原子，M¹ 表示無機陽離子或有機陽離子，Rs² 與Rs³ 、Rs¹² 與Rs¹³ 可以相互鍵結而形成環； Rs²¹ ～Rs²⁸ 、Rs³¹ ～Rs³⁸ 分別獨立地表示氫原子、烷基、烯基、芳基、芳烷基、烷氧基、芳氧基、羥基、-NR^X1 R^X2 、磺酸基、-SO₃ M² 、-SO₂ NR^X1 R^X2 、-COOR^X3 、-CONR^X1 R^X2 、硝基、氰基或鹵素原子，M² 表示無機陽離子或有機陽離子，R^X1 ～R^X3 分別獨立地表示氫原子、烷基、芳基、醯基或雜環基，R^X1 與R^X2 可以相互鍵結而形成環，Rs²¹ ～Rs²⁸ 、Rs³¹ ～Rs³⁸ 中的相鄰之基團彼此可以相互鍵結而形成環； 在Q¹ 為氮原子的情況下，不存在Rs²¹ ，在Q⁴ 為氮原子的情況下，不存在Rs²⁴ ，在Q⁵ 為氮原子的情況下，不存在Rs²⁵ ，在Q⁸ 為氮原子的情況下，不存在Rs²⁸ ，在Q¹¹ 為氮原子的情況下，不存在Rs³¹ ，在Q¹⁴ 為氮原子的情況下，不存在Rs³⁴ ，在Q¹⁵ 為氮原子的情況下，不存在Rs³⁵ ，在Q¹⁸ 為氮原子的情況下，不存在Rs³⁸ 。 ＜7＞如＜1＞至＜6＞之任一項所述之樹脂組成物，其中，上述樹脂係包含具有鹼基之樹脂。 ＜8＞如＜1＞至＜7＞之任一項所述之樹脂組成物，其中，上述樹脂係包含鹼可溶性樹脂。 ＜9＞如＜1＞至＜8＞之任一項所述之樹脂組成物，其係還包含聚合性化合物及光聚合起始劑。 ＜10＞如＜1＞至＜9＞之任一項所述之樹脂組成物，其係還包含使近紅外線透射而遮蔽可見光之色材。 ＜11＞一種膜，其係使用＜1＞至＜10＞之任一項所述之樹脂組成物而獲得。 ＜12＞一種近紅外線截止濾波器，其係具有＜11＞所述之膜。 ＜13＞一種近紅外線透射濾波器，其係具有＜11＞所述之膜。 ＜14＞一種固體攝像元件，其係具有＜11＞所述之膜。 ＜15＞一種圖像顯示裝置，其係具有＜11＞所述之膜。 ＜16＞一種紅外線感測器，其係具有＜11＞所述之膜。 [發明效果]The inventors of the present invention conducted intensive studies on a film obtained by using a resin composition containing a near-infrared absorbing dye represented by the formula (SQ1). As a result, they found that if the film is irradiated with light for a long time, the spectroscopy in the near-infrared region The characteristics tend to change easily, so there is room for further improvement in light resistance. The reason why the spectral characteristics of the near-infrared region of this kind of near-infrared region tend to change when light is irradiated to a film obtained using a resin composition containing a near-infrared absorbing dye represented by the formula (SQ1) for a long time is estimated as follows. It is speculated that the near-infrared absorbing dye represented by the formula (SQ1) has a structure in which a medium-large substituent and a square acid are bonded, so it is difficult to form an association in the film during film formation. Therefore, it is estimated that when the film formed by using the resin composition containing the near-infrared absorbing dye represented by the formula (SQ1) is irradiated with light for a long time, the near-infrared absorbing dye represented by the formula (SQ1) is irradiated with light The area around the square acid is activated and easily decomposed, so that the spectral characteristics of the near-infrared region are likely to change. The inventors of the present invention conducted further studies, and as a result, found that the resin composition containing the near-infrared absorbing dye and resin represented by the formula (SQ1) further contains the compound represented by the formula (AS1) at 0.001 to 1000 mass ppm The storage stability of the resin composition is good, and the generation of foreign substances during storage can be suppressed, and further, a film with excellent light resistance can be formed, and the present invention has been completed. The present invention provides the following. <1> A resin composition containing a near-infrared absorbing dye represented by the following formula (SQ1), 0.001 to 1000 mass ppm of a compound represented by the following formula (AS1), and resin, [Chemical formula 1]

In the formula, Rs ¹¹⁹ and Rs ¹²⁰ each independently represent a substituent, A ¹ and A ² each independently represent an oxygen atom or -N(Rs ¹²⁵ )-, Rs ¹²¹ to Rs ¹²⁵ each independently represent a hydrogen atom or a substituent, E ¹ and E ² each independently represent a carbon atom, a boron atom or -C(=O)-. When E ¹ is a carbon atom, ns32 is 2, and when E ¹ is a boron atom, ns32 is 1. When E ¹ is -C(=O)-, ns32 is 0, when E ² is a carbon atom, ns33 is 2, and when E ² is a boron atom, ns33 is 1, and E ² is -C( =O)-In the case of ns33 is 0, ns30 and ns31 each independently represent an integer from 0 to 5, and when ns30 is 2 or more, the plural Rs ¹¹⁹ may be the same or different, and 2 of the ^{plural Rs 119} Rs ¹¹⁹ can be bonded to each other to form a ring. When ns31 is 2 or more, a plurality of Rs ¹²⁰ can be the same or different. ^{Two Rs 120s} of the plurality of Rs ¹²⁰ can be bonded to each other to form a ring. In ns32 is 2, the two Rs ¹²¹ may be the same also different, two Rs ¹²¹ may be bonded to each other to form a ring, in ns33 it is 2, the two Rs ¹²² may be the same also different, two Rs ¹²² It can be bonded to each other to form a ring, Ar ¹⁰⁰ represents an aryl group or heteroarylene group, and ns100 represents an integer from 0 to 2, [Chemical formula 2]

In the formula (AS1), R ^A1 represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or a heterocyclic group; R ^A2 and R ^A3 each independently represent an alkyl group, an alkenyl group, an aryl group or a heterocyclic group, and R ^A1 and R ^A2 may be bonded to each other to form a ring, and R ^{A2 and} R ^A3 may be bonded to each other to form a ring. <2> The resin composition according to <1>, in which ^{at least one of RA2} and ^RA3 in the formula (AS1) is an alkyl group. <3> The resin composition according to <1>, wherein ^RA1 to ^{RA3 in the} formula (AS1) each independently represent an alkyl group or ^RA3 represents an alkyl group, and ^RA2 and ^RA3 are bonded to each other to form ring. <4> The resin composition according to <1>, wherein the compound represented by formula (As1) is at least one selected from N-methylpyrrolidone and dimethylacetamide. <5> The resin composition according to any one of <1> to <4>, wherein the near-infrared absorbing dye represented by formula (SQ1) is a near-infrared absorbing dye represented by formula (SQ2); [Chemical formula 3]

In the formula, L ⁴¹ to L ⁴⁴ each independently represent an alkylene group, an alkynylene group, an aryl group, a heterocyclic group or a divalent group obtained by bonding two or more of these groups, Z ⁴¹ and Z ⁴² Each independently represents a single bond, -O-, -C(=O)-, -S-, -N(R ^N1 )-, -S(=O)- or -S(=O) ₂ -, A ⁴¹ And A ⁴² each independently represent an oxygen atom or -N(R ^N2 )-, R ^N1 and R ^N2 each independently represent a hydrogen atom, an alkyl group or an aryl group, Rs ¹⁴¹ and Rs ¹⁴² each independently represent a substituent, ns41 and ns42 each independently represent an integer of 0 to 5, in a case where ns41 is 2 or more, plural Rs ¹⁴¹ may be the same can also be different, a plurality of Rs ¹⁴¹ in which two Rs ¹⁴¹ may be bonded to each other to form a ring, in ns42 In the case of 2 or more, the plurality of Rs ¹⁴² may be the same or different, and the two Rs ¹⁴² of the plurality of Rs ¹⁴² may be bonded to each other to form a ring; where L ⁴¹ to L ⁴⁴ are alkylene groups and Z ⁴¹ When and Z ⁴² are a single bond, and A ⁴¹ and A ⁴² are -N(R ^N2 )-, at least one of ns41 and ns42 is an integer of 1 to 5. <6> The resin composition according to any one of <1> to <4>, wherein the near-infrared absorbing dye represented by formula (SQ1) is a near-infrared absorbing dye represented by formula (SQ3); [Chemical formula 4]

In the formula, Q ¹ , Q ⁴ , Q ⁵ , Q ⁸ , Q ¹¹ , Q ¹⁴ , Q ¹⁵ and Q ¹⁸ each independently represent a carbon atom or a nitrogen atom; Rs ¹ to Rs ⁵ , Rs ¹¹ to Rs ¹⁵ each independently Represents a hydrogen atom, an alkyl group, a sulfonic acid group, -SO ₃ M ¹ or a halogen atom, M ¹ represents an inorganic cation or an organic cation, Rs ² and Rs ³ , Rs ¹² and Rs ¹³ can be bonded to each other to form a ring; Rs ²¹ ~Rs ²⁸ and Rs ³¹ to Rs ³⁸ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, a hydroxyl group, -NR ^X1 R ^X2 , a sulfonic acid group, and- SO ₃ M ² , -SO ₂ NR ^X1 R ^X2 , -COOR ^X3 , -CONR ^X1 R ^X2 , nitro, cyano or halogen atom, M ² represents inorganic cation or organic cation, R ^X1 ～R ^X3 each independently represent A hydrogen atom, an alkyl group, an aryl group, an acyl group or a heterocyclic group, R ^X1 and R ^X2 can be bonded to each other to form a ring, and adjacent groups among ^{Rs 21} to Rs ²⁸ and Rs ³¹ to Rs ^{38 can be mutually} Bonded to form a ring; when Q ¹ is a nitrogen atom, Rs ^{21 is} not present, when Q ⁴ is a nitrogen atom, Rs ^{24 is} not present, and when Q ⁵ is a nitrogen atom, Rs ^{25 is not present} , When Q ⁸ is a nitrogen atom, there is no Rs ²⁸ , when Q ¹¹ is a nitrogen atom, there is no Rs ³¹ , when Q ¹⁴ is a nitrogen atom, there is no Rs ³⁴ , and Q ¹⁵ is In the case of a nitrogen atom, Rs ³⁵ does not exist, and when Q ¹⁸ is a nitrogen atom, Rs ³⁸ does not exist. <7> The resin composition according to any one of <1> to <6>, wherein the resin system includes a resin having a basic group. <8> The resin composition according to any one of <1> to <7>, wherein the resin system contains an alkali-soluble resin. <9> The resin composition according to any one of <1> to <8>, which further contains a polymerizable compound and a photopolymerization initiator. <10> The resin composition according to any one of <1> to <9>, which further includes a color material that transmits near-infrared rays and shields visible light. <11> A film obtained by using the resin composition described in any one of <1> to <10>. <12> A near-infrared cut filter having the film described in <11>. <13> A near-infrared transmission filter having the film described in <11>. <14> A solid-state imaging device having the film described in <11>. <15> An image display device having the film described in <11>. <16> An infrared sensor having the film described in <11>. [Effects of the invention]

According to the present invention, it is possible to provide a resin composition, a film, a near-infrared cut filter, a near-infrared transmission filter, a solid-state imaging element, an image display device, and an infrared sensor capable of forming a film with excellent light resistance and excellent storage stability Device.

Hereinafter, the content of the present invention will be described in detail. In this specification, "～" is used to include the numerical value described before and after it as a lower limit and an upper limit. In the label of the group (atomic group) in this specification, the label not marked with substituted and unsubstituted includes a group (atomic group) without a substituent, and also includes a group (atomic group) with a substituent. For example, "alkyl" includes not only unsubstituted alkyl (unsubstituted alkyl) but also substituted alkyl (substituted alkyl). In this specification, unless otherwise specified, "exposure" includes not only exposure using light, but also description using particle beams such as electron beams and ion beams. In addition, as the light used in the exposure, there can be exemplified actinic rays or radiations such as the bright line spectrum of a mercury lamp, extreme ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, and electron beams. In this specification, "(meth)acrylate" means both or either of acrylate and methacrylate, and "(meth)acrylic" means both or either of acrylic acid and methacrylic acid, "(Meth)acryloyl group" means both or either of an acryloyl group and a methacryloyl group. In this specification, weight average molecular weight and number average molecular weight are defined as polystyrene conversion values based on gel permeation chromatography (GPC) measurement. In this specification, Me in the chemical formula represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group. In this specification, near-infrared rays refer to light (electromagnetic waves) with a wavelength of 700 to 2500 nm. In this specification, the total solid content refers to the total mass of the components except the solvent from the total components of the composition. In this specification, a pigment refers to a compound that is difficult to dissolve in a solvent. For example, the solubility of the pigment in 100 g of water at 23° C. and the solubility in 100 g of propylene glycol monomethyl ether acetate at 23° C. are preferably less than 1 g, preferably less than 0.1 g, and more preferably less than 0.01 g. In this specification, the term "step" not only includes an independent step, even when it cannot be clearly distinguished from other steps, as long as the step can achieve the expected effect, it is also included in this term.

＜Resin composition＞ The resin composition of the present invention is characterized by containing a near-infrared absorbing dye represented by formula (SQ1), a compound represented by formula (AS1) at 0.001 to 1,000 ppm by mass, and a resin.

The resin composition of the present invention can form a film having excellent storage stability and capable of suppressing the generation of foreign substances during storage, and further, even if the variation of the spectral characteristics in the near-infrared region of the irradiated light for a long time is suppressed, the film has excellent light resistance. The detailed reason why this effect can be obtained is not clear, but it is speculated as follows. It is estimated that the resin composition of the present invention contains, in addition to the near-infrared absorbing dye and resin represented by the formula (SQ1), the compound represented by the formula (AS1) in an amount of 0.001 to 1000 mass ppm, whereby the film is formed by the formula (AS1) The compound represented by the formula (SQ1) becomes easy to form the association of the near-infrared absorbing dyes represented by the formula (SQ1), and the compound represented by the formula (AS1) in the film is adsorbed on the near-infrared absorption represented by the formula (SQ1) On the surface of the pigment, even if the obtained film is irradiated with light for a long time, the activation of the area around the square acid of the near-infrared absorbing pigment represented by the formula (SQ1) can be suppressed, and the near-infrared absorption represented by the formula (SQ1) can be suppressed The excited state of the dye is stable, and as a result, the decomposition of the near-infrared absorbing dye represented by the formula (SQ1) can be suppressed. Therefore, it is presumed that the resin composition of the present invention can form a film having excellent light resistance in which the variation of the spectral characteristics in the near-infrared region of the irradiated light for a long time is suppressed. In addition, it is estimated that the content of the compound represented by formula (AS1) is 0.001 to 1000 ppm by mass. Therefore, it is possible to suppress aggregation of the near-infrared absorbing dye represented by formula (SQ1) in the resin composition. As a result, it is estimated that excellent The storage stability. Hereinafter, each component of the resin composition of the present invention will be described.

式中，Rs¹¹⁹ 及Rs¹²⁰ 分別獨立地表示取代基， A¹ 及A² 分別獨立地表示氧原子或-N（Rs¹²⁵ ）-， Rs¹²¹ ～Rs¹²⁵ 分別獨立地表示氫原子或取代基， E¹ 及E² 分別獨立地表示碳原子、硼原子或-C（=O）-， 在E¹ 為碳原子的情況下ns32為2，在E¹ 為硼原子的情況下ns32為1，在E¹ 為-C（=O）-的情況下ns32為0， 在E² 為碳原子的情況下ns33為2，在E² 為硼原子的情況下ns33為1，在E² 為-C（=O）-的情況下ns33為0， ns30及ns31分別獨立地表示0～5的整數， 在ns30為2以上的情況下，複數個Rs¹¹⁹ 可以相同亦可以不同，複數個Rs¹¹⁹ 中的2個Rs¹¹⁹ 可以彼此鍵結而形成環， 在ns31為2以上的情況下，複數個Rs¹²⁰ 可以相同亦可以不同，複數個Rs¹²⁰ 中的2個Rs¹²⁰ 可以彼此鍵結而形成環， 在ns32為2的情況下，2個Rs¹²¹ 可以相同亦可以不同，2個Rs¹²¹ 可以彼此鍵結而形成環， 在ns33為2的情況下，2個Rs¹²² 可以相同亦可以不同，2個Rs¹²² 可以彼此鍵結而形成環， Ar¹⁰⁰ 表示伸芳基或雜伸芳基， ns100表示0～2的整數，<<Near-infrared absorbing dye represented by formula (SQ1)>> The resin composition of the present invention contains the near-infrared absorbing dye represented by formula (SQ1). The near-infrared absorbing pigment represented by the formula (SQ1) is preferably a pigment. [Chemical formula 5]

In the formula, Rs ¹¹⁹ and Rs ¹²⁰ each independently represent a substituent, A ¹ and A ² each independently represent an oxygen atom or -N(Rs ¹²⁵ )-, Rs ¹²¹ to Rs ¹²⁵ each independently represent a hydrogen atom or a substituent, E ¹ and E ² each independently represent a carbon atom, a boron atom, or -C(=O)-. When E ¹ is a carbon atom, ns32 is 2, and when E ¹ is a boron atom, ns32 is 1. When E ¹ is -C(=O)-, ns32 is 0, when E ² is a carbon atom, ns33 is 2, and when E ² is a boron atom, ns33 is 1, and E ² is -C( =O)-In the case of ns33 is 0, ns30 and ns31 each independently represent an integer from 0 to 5, and when ns30 is 2 or more, the plural Rs ¹¹⁹ may be the same or different, and 2 of the ^{plural Rs 119} Rs ¹¹⁹ can be bonded to each other to form a ring. When ns31 is 2 or more, a plurality of Rs ¹²⁰ may be the same or different. ^{Two Rs 120s} of a plurality of Rs ¹²⁰ may be bonded to each other to form a ring. In ns32 is 2, the two Rs ¹²¹ may be the same also different, two Rs ¹²¹ may be bonded to each other to form a ring, in ns33 it is 2, the two Rs ¹²² may be the same also different, two Rs ¹²² They can be bonded to each other to form a ring, Ar ¹⁰⁰ represents an aryl group or heteroarylene group, ns100 represents an integer of 0-2,

Examples ^{of the substituent represented by Rs 119} and Rs ¹²⁰ include the groups explained in the substituent T described later, and a halogen atom, an alkyl group, a sulfonic acid group, and -SO ₃ M are preferred. M represents an inorganic cation or an organic cation. As the inorganic cation or organic cation represented by M, known ones can be used without limitation. For example, alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions can be cited. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. The carbon number of the alkyl group is preferably 1-20, more preferably 1-15, more preferably 1-8, still more preferably 1-5, and particularly preferably 1-3. The alkyl group may be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferred, and straight chain is more preferred. The alkyl group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

A ¹ and A ² each independently represent an oxygen atom or ^{-N (Rs 125) -, -} N (Rs 125) - is preferred.

Examples ^{of the substituent represented by Rs 121} to Rs ¹²⁵ include the groups explained in the substituent T described later. Rs ¹²³ to Rs ¹²⁵ are preferably a hydrogen atom, an alkyl group or an aryl group, more preferably a hydrogen atom. Moreover, it ^{is preferable that Rs 121} to Rs ¹²⁵ are each independently a substituent.

E ¹ and E ² each independently represent a carbon atom, a boron atom or -C(=O)-, and a carbon atom is preferred. In addition, it ^{is more preferable that E 1} is a carbon atom and two Rs ¹²¹ are bonded to each other to form a ring, and E ² is a carbon atom and two Rs ¹²² are bonded to each other to form a ring. The ring formed by bonding Rs ^{121 to} each other and the ring formed by ^{bonding of Rs 122 to} each other may be a hydrocarbon ring or a heterocyclic ring. In addition, the hydrocarbon ring and the heterocyclic ring may be an aromatic ring or a non-aromatic ring. In addition, the hydrocarbon ring and the heterocyclic ring may be a monocyclic ring or a condensed ring. As ^{the ring formed by bonding Rs 121 to} each other and the ring formed by ^{bonding of Rs 122 to} each other, a condensed ring is preferred, and a condensed ring of three or more rings is more preferred. In addition, ^{the ring formed by bonding Rs 121 to} each other and the ring formed by ^{bonding of Rs 122 to} each other may further have a substituent. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

ns30 and ns31 each independently represent an integer of 0-5, 0-4 is preferred, 0-3 is more preferred, 0-2 is more preferred, and 0 or 1 is even more preferred. When ns30 is 2 or more, plural Rs ¹¹⁹ may be the same or different. Two ^{Rs 119 of plural Rs 119} may be bonded to each other to form a ring. When ns31 is 2 or more, plural Rs ¹²⁰ It may be the same or different, and two Rs ¹²⁰ of the plurality of Rs ¹²⁰ may be bonded to each other to form a ring. The ring formed by bonding Rs ^{119 to} each other and the ring formed by ^{bonding Rs 120 to} each other may be a hydrocarbon ring or a heterocyclic ring. In addition, the hydrocarbon ring and the heterocyclic ring may be an aromatic ring or a non-aromatic ring. In addition, the hydrocarbon ring and the heterocyclic ring may be a monocyclic ring or a condensed ring. The ring formed by bonding Rs ^{119 to} each other and the ring formed by ^{bonding Rs 120 to} each other is preferably a 5-membered or 6-membered hydrocarbon ring or heterocyclic ring, more preferably a 5-membered or 6-membered hydrocarbon ring .

式中，Xa¹ ～Xa⁸ 分別獨立地表示硫原子、氧原子或NRx^a ，Rx^a 表示氫原子或取代基，*表示鍵結鍵。作為Rx^a 所表示之取代基，可以舉出後述之取代基T中所說明之基團。Ar ¹⁰⁰ represents an aryl group or a hetero aryl group. The arylene group and the heteroarylene group may be a single ring or a condensed ring. As the arylene group and heteroarylene group, a group represented by any one of the following formulas (Ar-1) to (Ar-7) is preferred. [Chemical formula 6]

In the formula, Xa ¹ to Xa ⁸ each independently represent a sulfur atom, an oxygen atom, or NRx ^a , Rx ^a represents a hydrogen atom or a substituent, and * represents a bonding bond. Examples ^{of the substituent represented by Rx a} include the groups explained in the substituent T described later.

ns100 represents an integer of 0-2, 0 or 1 is preferred, and 0 is more preferred.

式中，L⁴¹ ～L⁴⁴ 分別獨立地表示伸烷基、伸炔基、伸芳基、雜環基或將該等鍵結2個以上而獲得之2價的基團， Z⁴¹ 及Z⁴² 分別獨立地表示單鍵、-O-、-C（=O）-、-S-、-N（R^N1 ）-、-S（=O）-或-S（=O）₂ -， A⁴¹ 及A⁴² 分別獨立地表示氧原子或-N（R^N2 ）-， R^N1 及R^N2 分別獨立地表示氫原子、烷基或芳基， Rs¹⁴¹ 及Rs¹⁴² 分別獨立地表示取代基， ns41及ns42分別獨立地表示0～5的整數， 在ns41為2以上的情況下，複數個Rs¹⁴¹ 可以相同亦可以不同，複數個Rs¹⁴¹ 中的2個Rs¹⁴¹ 可以彼此鍵結而形成環， 在ns42為2以上的情況下，複數個Rs¹⁴² 可以相同亦可以不同，複數個Rs¹⁴² 中的2個Rs¹⁴² 可以彼此鍵結而形成環； 其中，在L⁴¹ ～L⁴⁴ 為伸烷基、Z⁴¹ 及Z⁴² 為單鍵、A⁴¹ 及A⁴² 為-N（R^N2 ）-的情況下，ns41及ns42中的至少一者為1～5的整數。The near-infrared absorbing dye represented by the formula (SQ1) is preferably the near-infrared absorbing dye represented by the formula (SQ2). [Chemical formula 7]

In the formula, L ⁴¹ to L ⁴⁴ each independently represent an alkylene group, an alkynylene group, an aryl group, a heterocyclic group or a divalent group obtained by bonding two or more of these groups, Z ⁴¹ and Z ⁴² Each independently represents a single bond, -O-, -C(=O)-, -S-, -N(R ^N1 )-, -S(=O)- or -S(=O) ₂ -, A ⁴¹ And A ⁴² each independently represent an oxygen atom or -N(R ^N2 )-, R ^N1 and R ^N2 each independently represent a hydrogen atom, an alkyl group or an aryl group, Rs ¹⁴¹ and Rs ¹⁴² each independently represent a substituent, ns41 and ns42 each independently represent an integer of 0 to 5, in a case where ns41 is 2 or more, plural Rs ¹⁴¹ may be the same can also be different, a plurality of Rs ¹⁴¹ in which two Rs ¹⁴¹ may be bonded to each other to form a ring, in ns42 In the case of 2 or more, the plurality of Rs ¹⁴² may be the same or different, and the two Rs ¹⁴² of the plurality of Rs ¹⁴² may be bonded to each other to form a ring; where L ⁴¹ to L ⁴⁴ are alkylene groups and Z ⁴¹ When and Z ⁴² are a single bond, and A ⁴¹ and A ⁴² are -N(R ^N2 )-, at least one of ns41 and ns42 is an integer of 1 to 5.

L ⁴¹ to L ⁴⁴ each independently represent an alkylene group, an alkynylene group, an aryl group, a heterocyclic group, or a divalent group obtained by bonding two or more of these groups. The carbon number of the alkylene group is preferably 1-20, more preferably 1-15, more preferably 1-8, still more preferably 1-5, and particularly preferably 1-3. The alkylene group may be any of linear, branched, and cyclic. The alkylene group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned. The carbon number of the alkynylene group is preferably 2-20, more preferably 2-12, particularly preferably 2-8. The alkynylene group may be either straight chain or branched chain. The alkynylene group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned. The carbon number of the arylene group is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The arylene group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned. The heterocyclic group is preferably a monocyclic heterocyclic group or a condensed heterocyclic group having a condensation number of 2-8, and a monocyclic heterocyclic group or a condensed heterocyclic group having a condensation number of 2 to 4 is more preferred. Preferably, a monocyclic heterocyclic group is further preferred. The number of heteroatoms in the ring constituting the heterocyclic group is preferably 1 to 3. The hetero atom constituting the ring of the heterocyclic group is preferably a nitrogen atom, an oxygen atom or a sulfur atom, more preferably a nitrogen atom. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The number of carbon atoms constituting the ring of the heterocyclic group is preferably 3-30, more preferably 3-18, and still more preferably 3-12. The heterocyclic group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

It ^{is preferable that L 41} to L ⁴⁴ each independently represent an aryl group or a heterocyclic group, and an aryl group is more preferable.

Z ⁴¹ and Z ⁴² each independently represent a single bond, -O-, -C(=O)-, -S-, -N(R ^N1 )-, -S(=O)- or -S(=O) ₂ -, a single bond is preferred.

A ⁴¹ and A ⁴² each independently represent an oxygen atom or ^{-N (R N2) -, -} N (R N2) - is preferred. R ^N2 is preferably a hydrogen atom.

The carbon number of the alkyl group represented by R ^N1 and R ^N2 is preferably from 1 to 20, more preferably from 1 to 15, more preferably from 1 to 8, more preferably from 1 to 5, and particularly from 1 to 3 good. The alkyl group may be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferred, and straight chain is more preferred. The alkyl group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned. The carbon number of the aryl group represented by R ^N1 and R ^N2 is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The aryl group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

Examples ^{of the substituent represented by Rs 141} and Rs ¹⁴² include the groups described in the substituent T described later, and halogen atoms, alkyl groups, sulfonic acid groups, and -SO ₃ M are preferred. M represents an inorganic cation or an organic cation. As the inorganic cation or organic cation represented by M, known ones can be used without limitation. For example, alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions can be cited. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. The carbon number of the alkyl group is preferably 1-20, more preferably 1-15, more preferably 1-8, still more preferably 1-5, and particularly preferably 1-3. The alkyl group may be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferred, and straight chain is more preferred. The alkyl group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

ns41 and ns42 each independently represent an integer of 0-5, 0-4 is preferable, 0-3 is more preferable, 0-2 is more preferable, 0 or 1 is still more preferable. When ns41 is 2 or more, the plural Rs ¹⁴¹ may be the same or different. ^{Two Rs 141} of the ^{plural Rs 141} may be bonded to each other to form a ring. When ns42 is 2 or more, the plural Rs ¹⁴² They may be the same or different, and two Rs ¹⁴² of the plurality of Rs ¹⁴² may be bonded to each other to form a ring. The ring formed by bonding Rs ^{141 to} each other and the ring formed by ^{bonding of Rs 142 to} each other may be a hydrocarbon ring or a heterocyclic ring. In addition, the hydrocarbon ring and the heterocyclic ring may be an aromatic ring or a non-aromatic ring. In addition, the hydrocarbon ring and the heterocyclic ring may be a monocyclic ring or a condensed ring. The ring formed by bonding Rs ^{141 to} each other and the ring formed by ^{bonding Rs 142 to} each other is preferably a 5-membered or 6-membered hydrocarbon ring or heterocyclic ring, and more preferably a 5-membered or 6-membered hydrocarbon ring .

式中，Q¹ 、Q⁴ 、Q⁵ 、Q⁸ 、Q¹¹ 、Q¹⁴ 、Q¹⁵ 及Q¹⁸ 分別獨立地表示碳原子或氮原子； Rs¹ ～Rs⁵ 、Rs¹¹ ～Rs¹⁵ 分別獨立地表示氫原子、烷基、磺酸基、-SO₃ M¹ 或鹵素原子，M¹ 表示無機陽離子或有機陽離子，Rs² 與Rs³ 、Rs¹² 與Rs¹³ 可以相互鍵結而形成環； Rs²¹ ～Rs²⁸ 、Rs³¹ ～Rs³⁸ 分別獨立地表示氫原子、烷基、烯基、芳基、芳烷基、烷氧基、芳氧基、羥基、-NR^X1 R^X2 、磺酸基、-SO₃ M² 、-SO₂ NR^X1 R^X2 、-COOR^X3 、-CONR^X1 R^X2 、硝基、氰基或鹵素原子，M² 表示無機陽離子或有機陽離子，R^X1 ～R^X3 分別獨立地表示氫原子、烷基、芳基、醯基或雜環基，R^X1 與R^X2 可以相互鍵結而形成環，Rs²¹ ～Rs²⁸ 、Rs³¹ ～Rs³⁸ 中的相鄰之基團彼此可以相互鍵結而形成環； 在Q¹ 為氮原子的情況下，不存在Rs²¹ ，在Q⁴ 為氮原子的情況下，不存在Rs²⁴ ，在Q⁵ 為氮原子的情況下，不存在Rs²⁵ ，在Q⁸ 為氮原子的情況下，不存在Rs²⁸ ，在Q¹¹ 為氮原子的情況下，不存在Rs³¹ ，在Q¹⁴ 為氮原子的情況下，不存在Rs³⁴ ，在Q¹⁵ 為氮原子的情況下，不存在Rs³⁵ ，在Q¹⁸ 為氮原子的情況下，不存在Rs³⁸ 。The near-infrared absorbing dye represented by the formula (SQ1) is preferably the near-infrared absorbing dye represented by the formula (SQ3). [Chemical formula 8]

In the formula, Q ¹ , Q ⁴ , Q ⁵ , Q ⁸ , Q ¹¹ , Q ¹⁴ , Q ¹⁵ and Q ¹⁸ each independently represent a carbon atom or a nitrogen atom; Rs ¹ to Rs ⁵ , Rs ¹¹ to Rs ¹⁵ each independently Represents a hydrogen atom, an alkyl group, a sulfonic acid group, -SO ₃ M ¹ or a halogen atom, M ¹ represents an inorganic cation or an organic cation, Rs ² and Rs ³ , Rs ¹² and Rs ¹³ can be bonded to each other to form a ring; Rs ²¹ ~Rs ²⁸ and Rs ³¹ to Rs ³⁸ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, a hydroxyl group, -NR ^X1 R ^X2 , a sulfonic acid group, and- SO ₃ M ² , -SO ₂ NR ^X1 R ^X2 , -COOR ^X3 , -CONR ^X1 R ^X2 , nitro, cyano or halogen atom, M ² represents inorganic cation or organic cation, R ^X1 ～R ^X3 each independently represent A hydrogen atom, an alkyl group, an aryl group, an acyl group or a heterocyclic group, R ^X1 and R ^X2 can be bonded to each other to form a ring, and adjacent groups among ^{Rs 21} to Rs ²⁸ and Rs ³¹ to Rs ^{38 can be mutually} Bonded to form a ring; when Q ¹ is a nitrogen atom, Rs ^{21 is} not present, when Q ⁴ is a nitrogen atom, Rs ^{24 is} not present, and when Q ⁵ is a nitrogen atom, Rs ^{25 is not present} , When Q ⁸ is a nitrogen atom, there is no Rs ²⁸ , when Q ¹¹ is a nitrogen atom, there is no Rs ³¹ , when Q ¹⁴ is a nitrogen atom, there is no Rs ³⁴ , and Q ¹⁵ is In the case of a nitrogen atom, Rs ³⁵ does not exist, and when Q ¹⁸ is a nitrogen atom, Rs ³⁸ does not exist.

From the viewpoint of various resistances such as heat resistance and light resistance, it ^{is preferable that Q 1} , Q ⁴ , Q ⁵ , Q ⁸ , Q ¹¹ , Q ¹⁴ , Q ¹⁵ and Q ¹⁸ are carbon atoms.

The alkyl group represented by Rs ¹ to Rs ⁵ and Rs ¹¹ to Rs ¹⁵ preferably has 1 to 20 carbon atoms, more preferably 1 to 15, more preferably 1 to 8, and even more preferably 1 to 5 , 1～3 are particularly good. The alkyl group may be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferred, and straight chain is more preferred. The alkyl group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

In _{-SO 3} M ¹ represented by ^{Rs 1} to Rs ⁵ and Rs ¹¹ to Rs ¹⁵ , as ^{the inorganic cation or organic cation of M 1} , known ones can be used without limitation. For example, alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions can be cited.

Examples ^{of the halogen atom represented by Rs 1} to Rs ⁵ and Rs ¹¹ to Rs ¹⁵ include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

Rs ² and Rs ³ , and Rs ¹² and Rs ¹³ may be bonded to each other to form a ring. The formed ring may be a hydrocarbon ring or a heterocyclic ring. In addition, the hydrocarbon ring and the heterocyclic ring may be an aromatic ring or a non-aromatic ring. In addition, the hydrocarbon ring and the heterocyclic ring may be a monocyclic ring or a condensed ring. The formed ring is preferably a 5-membered or 6-membered hydrocarbon ring or heterocyclic ring, and more preferably a 5-membered or 6-membered hydrocarbon ring.

Regarding Rs ¹ to Rs ⁵ , from the viewpoint of imparting resistance, Rs ¹ to Rs ⁵ are hydrogen atoms or 4 of Rs ¹ to Rs ⁵ are hydrogen atoms and 1 is a sulfonic acid group, -SO ₃ M ¹ or halogen Atoms are preferred. Among these, it ^{is particularly preferable that Rs 1} to Rs ⁵ are hydrogen atoms, or ^{that 4 of Rs 1} to Rs ⁵ are hydrogen atoms and one is a sulfonic acid group or a halogen atom. Regarding Rs ¹¹ to Rs ¹⁵ , from the viewpoint of imparting resistance, Rs ¹¹ to Rs ¹⁵ are hydrogen atoms or 4 of Rs ¹¹ to Rs ¹⁵ are hydrogen atoms and 1 is a sulfonic acid group, -SO ₃ M ¹ Or a halogen atom is preferred. Among these, it ^{is particularly preferable that Rs 11} to Rs ¹⁵ are hydrogen atoms, or 4 of Rs ¹¹ to Rs ¹⁵ are hydrogen atoms and 1 is a sulfonic acid group or a halogen atom.

The alkyl groups and alkoxy groups represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ preferably have 1 to 20 carbon atoms, more preferably 1 to 15, more preferably 1 to 8, and 1 to 5 More preferably, 1 to 3 are particularly preferred. The alkyl group and the alkoxy group may be any of linear, branched, and cyclic, and linear or branched is preferred, and linear is more preferred. The alkyl group and the alkoxy group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

The carbon number of the alkenyl group represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ is preferably 2-20, more preferably 2-12, and particularly preferably 2-8. The alkenyl group may be either straight chain or branched chain, and straight chain is preferred. The alkenyl group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

The aryl groups and aryloxy groups represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ preferably have 6 to 30 carbon atoms, more preferably 6 to 20, and even more preferably 6 to 12 carbon atoms. The aryl group and the aryloxy group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

The carbon number of the aralkyl group represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ is preferably 7-40, more preferably 7-30, and still more preferably 7-25.

In _{-SO 3} M ² represented by ^{Rs 21} to Rs ²⁸ and Rs ³¹ to Rs ³⁸ , known ones can be used without limitation as ^{the inorganic cation or organic cation of M 2.} For example, alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions can be cited.

Examples ^{of the halogen atom represented by Rs 21} to Rs ²⁸ and Rs ³¹ to Rs ³⁸ include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

In Rs ²¹ ～Rs ²⁸ , Rs ³¹ ～Rs ³⁸ represented by -NR ^X1 R ^X2 , -SO ₂ NR ^X1 R ^X2 , -COOR ^X3 and -CONR ^X1 R ^X2 , R ^X1 ～R ^X3 each independently represent hydrogen Atom, alkyl group, aryl group, acyl group or heterocyclic group.

The carbon number of the alkyl group represented by R ^X1 to R ^X3 is preferably from 1 to 20, more preferably from 1 to 15, more preferably from 1 to 8, more preferably from 1 to 5, and particularly from 1 to 3 good. The alkyl group may be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferred, and straight chain is more preferred. The alkyl group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

The carbon number of the aryl group represented by R ^X1 to R ^X3 is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The aryl group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

The heterocyclic group represented by R ^X1 to R ^X3 is preferably a monocyclic heterocyclic group or a condensed ring heterocyclic group with a condensation number of 2-8, and a monocyclic heterocyclic group or a condensation number of 2 to 4 The heterocyclic group of the condensed ring is more preferable, and the heterocyclic group of a monocyclic ring is still more preferable. The number of heteroatoms in the ring constituting the heterocyclic group is preferably 1 to 3. The hetero atom constituting the ring of the heterocyclic group is preferably a nitrogen atom, an oxygen atom or a sulfur atom, more preferably a nitrogen atom. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The number of carbon atoms constituting the ring of the heterocyclic group is preferably 3-30, more preferably 3-18, and still more preferably 3-12. The heterocyclic group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned. As a specific example of a heterocyclic group, a pyridyl group etc. are mentioned. The pyridyl group may have a substituent.

Examples of the acyl group represented by R ^X1 to R ^X3 include a formyl group, an alkylcarbonyl group, and an arylcarbonyl group. The carbon number of the alkylcarbonyl group is preferably 2-20, more preferably 2-15, and still more preferably 2-8. The carbon number of the arylcarbonyl group is preferably 7-30, more preferably 7-20, and still more preferably 7-12. The alkyl part of the alkylcarbonyl group and the aryl part of the arylcarbonyl group may have a substituent or may be unsubstituted. As a substituent, the group demonstrated in the substituent T mentioned later can be mentioned.

In -NR ^X1 R ^X2 , -SO ₂ NR ^X1 R ^X2 and -CONR ^X1 R ^X2 , R ^X1 and R ^X2 may be bonded to each other to form a ring. The formed ring is preferably a 5-membered ring or a 6-membered ring.

Adjacent groups among Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ may be bonded to each other to form a ring. The formed ring may be a hydrocarbon ring or a heterocyclic ring. In addition, the hydrocarbon ring and the heterocyclic ring may be an aromatic ring or a non-aromatic ring. In addition, the hydrocarbon ring and the heterocyclic ring may be a monocyclic ring or a condensed ring. The formed ring is preferably a 5-membered or 6-membered hydrocarbon ring or heterocyclic ring, and more preferably a 5-membered or 6-membered hydrocarbon ring.

Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ are each independently a hydrogen atom, an alkyl group, a hydroxyl group, -NR ^X1 R ^X2 , a sulfonic acid group, -SO ₃ M ² , -COOR ^X3 , a nitro group or a halogen atom. Preferably, a hydrogen atom is more preferable.

(Substituent T) Examples of the substituent T include halogen atoms, cyano groups, nitro groups, alkyl groups, alkenyl groups, alkynyl groups, aryl groups, heterocyclic groups, -ORt ¹ , -CORt ¹ , -COORt ¹ , -OCORt ¹ , -NRt ¹ Rt ² , -NHCORt ¹ , -CONRt ¹ Rt ² , -NHCONRt ¹ Rt ² , -NHCOORt ¹ , -SRt ¹ , -SO ₂ Rt ¹ , -SO ₂ ORt ¹ , -NHSO ₂ Rt ^1. -SO ₂ NRt ¹ Rt ² and -SO ₃ Mt ¹ . Rt ¹ and Rt ² each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group. Rt ¹ and Rt ² may be bonded to form a ring. Mt ¹ represents an inorganic cation or an organic cation.

Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. The carbon number of the alkyl group is preferably 1-20, more preferably 1-15, and still more preferably 1-8. The alkyl group may be any of straight chain, branched chain and cyclic, and straight chain or branched chain is preferred. The carbon number of the alkenyl group is preferably 2-20, more preferably 2-12, particularly preferably 2-8. The alkenyl group may be either straight chain or branched chain. The carbon number of the alkynyl group is preferably 2-40, more preferably 2-30, particularly preferably 2-25. The alkynyl group may be either straight chain or branched chain. The carbon number of the aryl group is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The heterocyclic group is preferably a monocyclic heterocyclic group or a condensed heterocyclic group having a condensation number of 2-8, and a monocyclic heterocyclic group or a condensed heterocyclic group having a condensation number of 2 to 4 is more preferred. good. The number of heteroatoms in the ring constituting the heterocyclic group is preferably 1 to 3. The hetero atom constituting the ring of the heterocyclic group is preferably a nitrogen atom, an oxygen atom or a sulfur atom. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The number of carbon atoms constituting the ring of the heterocyclic group is preferably 3-30, more preferably 3-18, and still more preferably 3-12. The alkyl group, alkenyl group, alkynyl group, aryl group, and heterocyclic group may have a substituent or may be unsubstituted. Examples of the substituent include the substituents described in the above-mentioned substituent T. Examples of the inorganic cation or organic cation represented by ^{Mt 1 include alkali metal ions (Li +} , Na ⁺ , K ^+, etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions.

Furthermore, in the formula (SQ1), the cation is non-localized and exists. For example, in the compound of the following structure, the cation exists in a nonlocalized manner as follows. [Chemical formula 9]

The near-infrared absorbing dye represented by the formula (SQ1) is preferably a compound having a maximum absorption wavelength in the wavelength range of 700 to 1300 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength range of 700 to 1000 nm.

[化學式11]

[化學式12]

[化學式13]

[化學式14]

[化學式15]

[化學式16]

[化學式17]

[化學式18]

[化學式19]

[化學式20]

Specific examples of the near-infrared absorbing dye represented by the formula (SQ1) include compounds having the following structures, the compounds described in paragraphs 0224 to 0341 of JP 2019-011455 A, and International Publication No. 2018/230486 No. The compounds described in paragraphs 0221 to 0377. [Chemical formula 10]

[Chemical formula 11]

[Chemical formula 12]

[Chemical formula 13]

[Chemical formula 14]

[Chemical formula 15]

[Chemical formula 16]

[Chemical formula 17]

[Chemical formula 18]

[Chemical formula 19]

[Chemical formula 20]

The content of the near-infrared absorbing dye represented by the formula (SQ1) is preferably 1% by mass or more in the total solid content of the resin composition of the present invention, more preferably 3% by mass or more, and even more preferably 5% by mass or more , 10% by mass or more is particularly good. Moreover, the upper limit of the content of the near-infrared absorbing dye represented by the formula (SQ1) is preferably 50% by mass or less, more preferably 45% by mass or less, and more preferably 40% by mass or less. The resin composition may include only one type of near-infrared absorbing dye represented by the formula (SQ1), or may include two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

式（AS1）中，R^A1 表示氫原子、烷基、烯基、芳基或雜芳基；R^A2 及R^A3 分別獨立地表示烷基、烯基、芳基或雜芳基，R^A1 與R^A2 可以相互鍵結而形成環，R^A2 與R^A3 可以相互鍵結而形成環。<<The compound represented by the formula (AS1)>> The resin composition of the present invention contains the compound represented by the formula (AS1). [Chemical formula 21]

In the formula (AS1), R ^A1 represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or a heteroaryl group; R ^A2 and R ^A3 each independently represent an alkyl group, an alkenyl group, an aryl group or a heteroaryl group, and R ^A1 and R ^A2 may be bonded to each other to form a ring, and R ^A2 and R ^A3 may be bonded to each other to form a ring.

The carbon number of the alkyl group represented by R ^A1 to R ^A3 is preferably 1-20, more preferably 1-15, more preferably 1-8, and still more preferably 1-5. The alkyl group may be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferred, and straight chain is more preferred. The alkyl group may have a substituent, but it is preferably unsubstituted.

The carbon number of the alkenyl group represented by R ^A1 to R ^A3 is preferably 2-20, more preferably 2-12, and still more preferably 2-8. The alkenyl group may be either straight chain or branched chain, and straight chain is preferred. The alkenyl group may have a substituent, but it is preferably unsubstituted.

The carbon number of the aryl group represented by R ^A1 to R ^A3 is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The aryl group may have a substituent, but it is preferably unsubstituted.

The heterocyclic group represented by R ^X1 to R ^X3 is preferably a monocyclic heterocyclic group or a condensed ring heterocyclic group with a condensation number of 2-8, and a monocyclic heterocyclic group or a condensation number of 2 to 4 The heterocyclic group of the condensed ring is more preferable, and the heterocyclic group of a monocyclic ring is still more preferable. The number of heteroatoms in the ring constituting the heterocyclic group is preferably 1 to 3. The hetero atom constituting the ring of the heterocyclic group is preferably a nitrogen atom, an oxygen atom or a sulfur atom, more preferably a nitrogen atom. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The number of carbon atoms constituting the ring of the heterocyclic group is preferably 3-30, more preferably 3-18, and still more preferably 3-12. The heterocyclic group may have a substituent, but it is preferably unsubstituted.

R ^A1 and R ^A2 may be bonded to each other to form a ring, and R ^A2 and R ^A3 may be bonded to each other to form a ring. The ring formed by bonding these groups to each other is preferably a 5-membered ring or a 6-membered ring. Furthermore, in ^{the case where R A1} and R ^{A2 are} bonded to form a ring in the formula (AS1), the formula (AS1) is the structure represented by the formula (AS1-1). In addition, in formula (AS1), when R ^A2 and R ^{A3 are} bonded to form a ring, formula (AS1) is a structure represented by formula (AS1-2). [Chemical formula 22]

In the formula (AS1-1), R ^A3 represents an alkyl group, an alkenyl group, an aryl group or a heteroaryl group, and the ring Z ^A1 represents a 5-membered ring or a 6-membered ring. In the formula (AS1-2), R ^A1 represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or a heteroaryl group, and the ring Z ^A2 represents a 5-membered ring or a 6-membered ring.

In formula (AS1), ^{at least one of R A2} and R ^A3 is preferably an alkyl group. Moreover, as a more preferable aspect, the aspect in which R ^A1 to R ^A3 each independently represent an alkyl group can be mentioned. According to this aspect, it is difficult to inhibit the interaction with the near-infrared absorbing dye represented by the formula (SQ1), and a significant effect can be expected. In addition, as another preferable aspect, an aspect in which R ^A3 represents an alkyl group, and R ^A2 and R ^A3 are bonded to each other to form a ring. According to this aspect, the steric repulsion between the near-infrared absorbing dye represented by the formula (SQ1) and the compound represented by the formula (AS1) is suppressed, and the compound represented by the formula (AS1) becomes more accessible to that represented by the formula (SQ1) Near-infrared absorbing pigments can expect more significant effects.

The boiling point of the compound represented by formula (AS1) is preferably 50°C to 350°C, more preferably 100°C to 300°C, and more preferably 150°C to 250°C. As long as the boiling point is within the above range, the separation of the compound from the near-infrared absorbing dye represented by the formula (SQ1) and the like can be suppressed by heating during film formation or element production, etc., and a more significant effect can be obtained.

The molecular weight of the compound represented by formula (AS1) is preferably 73-1000, more preferably 73-500, and even more preferably 73-300. As long as the molecular weight is within the above-mentioned range, the space of the molecule is less crowded, and the compound represented by formula (AS1) becomes more accessible to the near-infrared absorbing dye represented by formula (SQ1), and a more significant effect can be obtained.

Specific examples of the compound represented by the formula (AS1) include N-methylpyrrolidone, dimethylacetamide, N-ethylpyrrolidone, etc., N-methylpyrrolidone and dimethylpyrrolidone Alkylacetamide is preferred.

The resin composition of the present invention contains 0.001 to 1000 ppm by mass of the compound represented by formula (AS1). Considering that it is easy to suppress the generation of gelatinous foreign matter caused by the interaction of acid salt groups in the liquid and to obtain excellent storage stability, the upper limit is preferably 950 mass ppm or less, and more preferably 500 mass ppm or less. Preferably, it is more preferably 200 ppm by mass or less. From the viewpoint of light resistance, the lower limit is preferably 0.005 ppm by mass or more, more preferably 0.01 ppm by mass or more, and even more preferably 0.1 ppm by mass or more.

In addition, the resin composition of the present invention preferably contains 0.00000001 to 20 parts by mass of the compound represented by formula (AS1) with respect to 100 parts by mass of the near-infrared absorbing dye represented by formula (SQ1). As long as it is in this aspect, the effect of the present invention can be more remarkably obtained. The lower limit is preferably 0.00000005 parts by mass or more, more preferably 0.0000001 parts by mass or more, and even more preferably 0.000001 parts by mass or more. The upper limit is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 2 parts by mass or less.

＜＜Resin＞＞ The resin composition of the present invention contains resin. The resin is blended for the purpose of dispersing particles such as pigments in the resin composition or the use of a binder, for example. In addition, the resin mainly used to disperse pigments and other particles is also called a dispersant. Among them, this kind of use of the resin is an example, and the resin can also be used for purposes other than this kind of use.

The weight average molecular weight (Mw) of the resin is preferably 2,000-2,000,000. The upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is preferably 3000 or more, more preferably 5000 or more.

Examples of resins include (meth)acrylic resins, epoxy resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyether resins, polyether tertene resins, and polystyrene resins. (Polyphenylene resin), polyarylene ether phosphine oxide resin, polyimide resin, polyimide resin, polyolefin resin, cycloolefin resin, polyester resin, styrene resin, etc. These resins may be used individually by 1 type, and 2 or more types may be mixed and used for it. As the cycloolefin resin, a norbornene resin is preferred from the viewpoint of improving heat resistance. As a commercially available product of norbornene resin, for example, ARTON series manufactured by JSR Corporation (for example, ARTON F4520) and the like can be cited. Examples of epoxy resins include epoxy resins which are glycidyl ether compounds of phenolic compounds, epoxy resins which are glycidyl ether compounds of various novolak resins, alicyclic epoxy resins, and aliphatic epoxy resins. , Heterocyclic epoxy resins, glycidyl ester epoxy resins, glycidylamine epoxy resins, epoxy resins made by glycidylation of halogenated phenols, silicon compounds with epoxy groups, and others Condensates of other silicon compounds and copolymers of polymerizable unsaturated compounds having epoxy groups and other polymerizable unsaturated compounds, etc. In addition, the epoxy resin can also use Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, G-01758 (NOF Corporation manufactured, epoxy-containing polymer) and so on. In addition, the resin described in the examples of International Publication No. 2016/088645 can also be used. In addition, when the resin has an ethylenically unsaturated bond-containing group in the side chain, especially a (meth)acrylic acid group, the main chain and the ethylenically unsaturated bond-containing group are connected via an alicyclic structure. A divalent linking group is also preferred.

The resin composition of the present invention preferably contains an alkali-soluble resin. When the resin composition of the present invention contains an alkali-soluble resin, the developability of the resin composition can be improved. When the resin composition of the present invention is used for pattern formation using the photolithography method, the generation of development residues can be effectively suppressed. . Examples of alkali-soluble resins include resins having acid groups. As an acid group, a carboxyl group, a phosphoric acid group, a sulfonic acid group, a phenolic hydroxyl group, etc. are mentioned, and a carboxyl group is preferable. The acid group possessed by the alkali-soluble resin may be only one type or two or more types. Furthermore, alkali-soluble resins can also be used as dispersants.

Alkali-soluble resins preferably contain repeating units having acid groups on the side chains, and more preferably 5 to 70 mol% of the repeating units having acid groups on the side chains are contained in all the repeating units of the resin. The upper limit of the content of the repeating unit having an acid group in the side chain is preferably 50 mol% or less, and more preferably 30 mol% or less. The lower limit of the content of the repeating unit having an acid group in the side chain is preferably 10 mol% or more, and more preferably 20 mol% or more.

The alkali-soluble resin is also preferably an alkali-soluble resin having a polymerizable group. As a polymerizable group, a (meth)allyl group, a (meth)acryloyl group, etc. are mentioned. The alkali-soluble resin having a polymerizable group is preferably a resin including a repeating unit having a polymerizable group on the side chain and a repeating unit having an acid group on the side chain.

Alkali-soluble resins include those derived from a compound represented by the following formula (ED1) and/or a compound represented by the following formula (ED2) (hereinafter, these compounds may be referred to as "ether dimers"). The repeating unit of the body composition is also preferred.

[Chemical formula 23]

式（ED2）中，R表示氫原子或碳數1～30的有機基團。關於式（ED2）的詳細內容，能夠參閱日本特開2010-168539號公報的記載，將該內容編入本說明書中。In the formula (ED1), R ¹ and R ² each independently represent a hydrogen atom or an optionally substituted hydrocarbon group having 1 to 25 carbon atoms. [Chemical formula 24]

In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. Regarding the details of the formula (ED2), refer to the description in JP 2010-168539 A, which is incorporated into this specification.

As a specific example of the ether dimer, for example, the description in paragraph 0317 of JP 2013-029760 A can be referred to, and this content is incorporated in this specification.

式（X）中，R₁ 表示氫原子或甲基，R₂ 表示碳數2～10的伸烷基，R₃ 表示可以包含氫原子或苯環的碳數1～20的烷基。n表示1～15的整數。It is also preferable that the alkali-soluble resin contains a repeating unit derived from the compound represented by the following formula (X). [Chemical formula 25]

In the formula (X), R ₁ represents a hydrogen atom or a methyl group, R ₂ represents an alkylene group having 2 to 10 carbon atoms, and R ₃ represents an alkylene group having 1 to 20 carbon atoms which may contain a hydrogen atom or a benzene ring. n represents an integer of 1-15.

Regarding alkali-soluble resins, refer to the description in paragraphs 0558-0571 of JP 2012-208494 (corresponding to paragraphs 0685-0700 of the corresponding US Patent Application Publication No. 2012/0235099) and Japanese Patent Application Publication No. 2012-198408 The descriptions in paragraphs 0076 to 0099 of the bulletin are incorporated into this specification.

The acid value of the alkali-soluble resin is preferably 30 to 500 mgKOH/g. The lower limit is preferably 50 mgKOH/g or more, and more preferably 70 mgKOH/g or more. The upper limit is preferably 400 mgKOH/g or less, more preferably 300 mgKOH/g or less, and even more preferably 200 mgKOH/g or less.

As a specific example of an alkali-soluble resin, the resin of the following structure etc. are mentioned, for example. In the following structural formulae, Me represents a methyl group. [Chemical formula 26]

It is also preferable that the resin composition of the present invention contains a resin having a basic group. As a base, an amino group, an ammonium salt group, etc. are mentioned. The resin having a base may have an acid group in addition to the base. A resin having a base is preferably used as a dispersant for the near-infrared absorbing dye represented by the formula (SQ1). Furthermore, when the resin having a basic group also has an acid group, the resin is also an alkali-soluble resin.

Examples of resins having basic groups include resins having tertiary amine groups and quaternary ammonium salt groups. A resin having a tertiary amine group and a quaternary ammonium salt group is preferably used as a dispersant for the near-infrared absorbing pigment represented by the formula (SQ1). The resin having a tertiary amine group and a quaternary ammonium salt group is preferably a resin having a repeating unit having a tertiary amine group and a repeating unit having a quaternary ammonium salt group. In addition, the resin having a tertiary amine group and a quaternary ammonium salt group may further have a repeating unit having an acid group. It is also preferable that the resin having a tertiary amine group and a tertiary ammonium salt group has a block structure. A resin with a tertiary amine group and a tertiary ammonium salt group has an amine value of 10 to 250 mgKOH/g and a tertiary ammonium salt value of 10 to 90 mgKOH/g, preferably with an amine value of 50 to 200 mgKOH/g and a grade 4 It is more preferable that the ammonium salt value is 10-50 mgKOH/g. The weight average molecular weight (Mw) of the resin with tertiary amine groups and quaternary ammonium salt groups is preferably 3,000 to 300,000, more preferably 5,000 to 30,000. Regarding resins with tertiary amine groups and quaternary ammonium salt groups, ethylenically unsaturated monomers with tertiary amine groups, ethylenically unsaturated monomers with quaternary ammonium salt groups, and other ethylenic Unsaturated monomer is produced by copolymerization. Regarding ethylenically unsaturated monomers having tertiary amine groups and ethylenically unsaturated monomers having quaternary ammonium salt groups, those described in paragraphs 0150 to 0170 of International Publication No. 2018/230486 can be cited. The content is incorporated into this manual.

In addition, as the resin having a basic group, a resin containing a nitrogen atom in the main chain is also preferable. This resin is also preferably used as a dispersant for the near-infrared absorbing pigment represented by formula (SQ1). The resin containing nitrogen atoms in the main chain (hereinafter also referred to as oligomeric imine resin) contains repeating units selected from poly(lower alkyleneimine), polyallylamine repeating units, and polydienes At least one of the propylamine-based repeating unit, the meta-xylene diamine-epichlorohydrin polycondensate-based repeating unit, and the polyvinylamine-based repeating unit has a nitrogen atom. In addition, as the oligoimine-based resin, a resin having the following repeating unit is preferred, that is, a repeating unit having a partial structure X having a functional group having a pKa14 or less and an oligomer chain containing 40 to 10,000 atoms Or the repeating unit of the side chain of the polymer chain Y. The oligoimine-based resin may further include a repeating unit having an acid group. Regarding the oligoimine-based resin, the description in paragraphs 0102 to 0166 of JP 2012-255128 A can be referred to, and this content is incorporated in this specification.

The resin composition of the present invention can also contain a resin as a dispersant, and preferably contains a resin as a dispersant. Examples of the dispersant include acidic dispersants (acidic resins) and basic dispersants (alkaline resins). Here, the acidic dispersant (acidic resin) means a resin in which the amount of acid groups is greater than the amount of base groups. When the total amount of the amount of acid groups and the amount of bases is set to 100 mol%, a resin in which the amount of acid groups in the acidic dispersant (acidic resin) occupies 70 mol% or more is preferable, and essentially includes only Acid-based resins are better. The acid group of the acidic dispersant (acid resin) is preferably a carboxyl group. In addition, the basic dispersant (basic resin) means a resin in which the amount of base groups is greater than the amount of acid groups. When the total amount of the amount of acid groups and the amount of bases is 100 mol%, it is preferable that the amount of bases in the alkaline dispersant (alkaline resin) exceeds 50 mol%. As the dispersant, a resin having a basic group is preferred, and a basic dispersant is more preferred.

Examples of the resin used as a dispersant include the above-mentioned resins having tertiary amine groups and quaternary ammonium salt groups, oligomeric imine-based resins, and the like. Furthermore, it is also preferable that the resin used as the dispersant is a graft resin. As the graft resin, a resin having a repeating unit having a graft chain can be exemplified. The graft resin may also have a repeating unit having an acid group. For the details of the graft resin, reference can be made to the descriptions in paragraphs 0025 to 0094 of JP 2012-255128 A, and the contents are incorporated into this specification. Moreover, it is also preferable that the resin used as a dispersing agent is a resin containing the repeating unit which has an acid group. In addition, the resin used as the dispersant is preferably a resin having a structure in which a plurality of polymer chains are bonded to the core part. Examples of such resins include dendritic polymers (including star polymers). In addition, as specific examples of dendrimers, polymer compounds C-1 to C-31 and the like described in paragraphs 0196 to 0209 of JP 2013-043962 A can be cited. In addition, the above-mentioned alkali-soluble resin can also be used as a dispersant.

The dispersant can also be obtained as a commercially available product, and as specific examples of this type, Disperbyk-111 (manufactured by BYK-Chemie GmbH), Solsperse76500 (manufactured by Lubrizol Japan Limited), and the like can be cited. In addition, the dispersant described in paragraphs 0041 to 0130 of JP 2014-130338 A can also be used, and the content can be incorporated in this specification.

The content of the resin is preferably 1 to 50% by mass in the total solid content of the resin composition. The lower limit is preferably 5% by mass or more, and more preferably 7% by mass or more. The upper limit is preferably 40% by mass or less, and more preferably 30% by mass or less.

In addition, when the resin composition of the present invention contains a resin having a base, the content of the resin having a base is 1-100 parts by mass relative to 100 parts by mass of the near-infrared absorbing dye represented by formula (SQ1). good. The upper limit is preferably 80 parts by mass or less, and more preferably 60 parts by mass or less. The lower limit is preferably 2.5 parts by mass or more, and more preferably 5 parts by mass or more. In addition, the content of the resin having a basic group in the resin contained in the resin composition is preferably 10 to 90% by mass, more preferably 20 to 80% by mass, and more preferably 30 to 70% by mass.

In addition, when the resin composition of the present invention contains an alkali-soluble resin, the content of the alkali-soluble resin is preferably 1 to 50% by mass in the total solid content of the resin composition. The lower limit is preferably 5% by mass or more, and more preferably 7% by mass or more. The upper limit is preferably 40% by mass or less, and more preferably 30% by mass or less. Furthermore, the content of the alkali-soluble resin in the resin contained in the resin composition is preferably 10-100% by mass, more preferably 30-100% by mass, and still more preferably 50-100% by mass.

Furthermore, when the resin composition of the present invention contains a resin as a dispersant, the content of the resin as a dispersant is preferably 0.1 to 40% by mass in the total solid content of the resin composition. The upper limit is preferably 20% by mass or less, and more preferably 10% by mass or less. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. In addition, the content of the resin as a dispersant is preferably 1 to 100 parts by mass relative to 100 parts by mass of the near-infrared absorbing dye represented by formula (SQ1). The upper limit is preferably 80 parts by mass or less, and more preferably 60 parts by mass or less. The lower limit is preferably 2.5 parts by mass or more, and more preferably 5 parts by mass or more.

The resin composition of this invention may contain only 1 type of resin, and may contain 2 or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Other near-infrared absorbers＞＞ The resin composition of the present invention can contain other near-infrared absorbing agents other than the near-infrared absorbing dye represented by formula (SQ1). Examples of other near-infrared absorbers include pyrrolopyrrole compounds, cyanine compounds, squaraine compounds, phthalocyanine compounds, naphthalocyanine compounds, quatericene compounds, merocyanine compounds, croconium compounds, oxygen Heterocyanine compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithioene metal complexes, Metal oxides and metal borides, etc.

The content of other near-infrared absorbing agents is preferably 400 parts by mass or less relative to 100 parts by mass of the near-infrared absorbing dye represented by formula (SQ1), more preferably 200 parts by mass or less, and more preferably 100 parts by mass or less. In addition, the total content of the near-infrared absorbing dye and other near-infrared absorbing agents represented by the formula (SQ1) is preferably 1% by mass or more in the total solid content of the resin composition of the present invention, and more preferably 3% by mass or more , 5% by mass or more is more preferable, and 10% by mass or more is particularly preferable. The upper limit of the total content is preferably 50% by mass or less, more preferably 45% by mass or less, and more preferably 40% by mass or less. The near-infrared absorbing layer may contain only one kind of other near-infrared absorbing agents, or may contain two or more kinds. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

In addition, it is also preferable that the resin composition of the present invention does not substantially contain other near-infrared absorbers. Substantially not containing other near-infrared absorbers means that the content of other near-infrared absorbers in the total solid content of the resin composition is preferably 0.5% by mass or less, more preferably 0.1% by mass or less, and more preferably 0.05% by mass or less Preferably, it is particularly preferred that it does not contain other near-infrared absorbers.

＜＜Pigment Derivatives＞＞ The resin composition of the present invention can contain a pigment derivative. The pigment derivative may be either an acid pigment derivative or a basic pigment derivative, but from the viewpoint of the dispersibility of the near-infrared absorbing pigment represented by formula (SQ1), the acid pigment derivative is preferred.

Examples of acidic dye derivatives include compounds in which an acid group is bonded to the skeleton of the dye. Examples of the acid group include a sulfonic acid group, a carboxyl group, a phosphoric acid group, a boric acid, a sulfonylimide group, a sulfonamide group, and their salts. Examples of the atoms or atomic groups constituting the salt include alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), alkali metal ions (Ca ²⁺ , Mg ^2+, etc.), ammonium ions, imidazolium ions, pyridinium ions, and Phosphonium ion and so on. As the acid group of the acid pigment derivative, sulfonic acid group, carboxyl group, phosphoric acid group, boric acid, sulfonamide group, sulfonamide group and their salts are preferred, sulfonic acid group, carboxyl group, phosphoric acid group, sulfonamide group An amine group, a sulfonamide group, and their salts are more preferable, a sulfonic acid group, a carboxyl group, and their salts are more preferable, and a sulfonic acid group is particularly preferable.

Examples of basic dye derivatives include compounds in which a base is bonded to a dye skeleton. Examples of the base include an amino group, a pyridyl group and a salt thereof, an ammonium salt, and a phthaliminomethyl group. Examples of atoms or atomic groups constituting the salt include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenate ions. As the base, an amino group, a pyridyl group and a salt thereof, an ammonium salt, and a phthaliminomethyl group are preferred, an amino group and a phthaliminomethyl group are more preferred, and an amino group is still more preferred.

As the pigment derivative, a compound represented by formula (B1) is preferred. In addition, the acidic dye derivative is preferably a compound in which X in the formula (B1) is represented by an acid group. Furthermore, the basic dye derivative is preferably a compound in which X in the formula (B1) is represented by a base.

式（B1）中，P表示色素骨架，L表示單鍵或連接基，X表示酸基或鹼基，m表示1以上的整數，n表示1以上的整數，在m為2以上的情況下，複數個L及X可以互不相同，在n為2以上的情況下，複數個X可以互不相同。[Chemical formula 27]

In the formula (B1), P represents the pigment backbone, L represents a single bond or a linking group, X represents an acid group or a base, m represents an integer of 1 or more, and n represents an integer of 1 or more. When m is 2 or more, The plurality of L and X may be different from each other, and when n is 2 or more, the plurality of X may be different from each other.

The pigment skeleton represented by P of the formula (B1) includes a squarylium pigment skeleton, a pyrrolopyrrole compound pigment skeleton, a diketopyrrolopyrrole compound pigment skeleton, a quinacridone pigment skeleton, an anthraquinone pigment skeleton, and Anthrone pigment skeleton, benzoindole pigment skeleton, thiazide indigo pigment skeleton, azo pigment skeleton, quinoline yellow pigment skeleton, phthalocyanine pigment skeleton, naphthalocyanine pigment skeleton, dioxin pigment skeleton, perylene pigment skeleton, Apurone pigment skeleton, benzimidazolone pigment skeleton, benzothiazole pigment skeleton, benzimidazole pigment skeleton and benzoxazole pigment skeleton, selected from the group consisting of squaraine pigment skeleton, pyrrolopyrrole compound pigment skeleton, diketopyrrole At least one of a pyrrole compound dye skeleton, a phthalocyanine dye skeleton, a quinacridone dye skeleton, and a benzimidazolone dye skeleton is preferable, and a squarylium dye skeleton is more preferable.

As the linking group represented by L of the formula (B1), there can be mentioned 1-100 carbon atoms, 0-10 nitrogen atoms, 0-50 oxygen atoms, 1-200 hydrogen atoms, and 0-20 sulfur atoms. A group of atoms. Examples include hydrocarbon groups, heterocyclic groups, -O-, -S-, -CO-, -COO-, -OCO-, -SO ₂ -, -NR ^L -, -NR ^L CO-, -CONR ^L -, -NR ^L SO ₂ -, -SO ₂ NR ^L -and groups of these combinations. ^RL represents a hydrogen atom, an alkyl group or an aryl group. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. Examples of the hydrocarbon group include an alkylene group, an arylene group, or a group obtained by removing one or more hydrogen atoms from these groups. The carbon number of the alkylene group is preferably 1-30, more preferably 1-15, and still more preferably 1-10. The alkylene group may be any of linear, branched, and cyclic. In addition, the cyclic alkylene group may be either monocyclic or polycyclic. The carbon number of the arylene group is preferably 6-18, more preferably 6-14, and still more preferably 6-10. The heterocyclic group is preferably a monocyclic ring or a condensed ring having a condensation number of 2 to 4. The number of heteroatoms in the ring constituting the heterocyclic group is preferably 1 to 3. The hetero atom constituting the ring of the heterocyclic group is preferably a nitrogen atom, an oxygen atom or a sulfur atom. The number of carbon atoms constituting the ring of the heterocyclic group is preferably 3-30, more preferably 3-18, and still more preferably 3-12. The hydrocarbon group and heterocyclic group may have a substituent. As the substituent, the groups exemplified in the above-mentioned substituent T can be mentioned. In addition, the ^{number of carbon atoms in the alkyl group represented by RL} is preferably 1-20, more preferably 1-15, and still more preferably 1-8. The alkyl group may be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferred, and straight chain is more preferred. ^{The alkyl group represented by RL} may further have a substituent. As a substituent, the above-mentioned substituent T can be mentioned. ^{The carbon number of the aryl group represented by RL} is preferably 6-30, more preferably 6-20, and still more preferably 6-12. ^{The aryl group represented by RL} may further have a substituent. As a substituent, the above-mentioned substituent T can be mentioned.

X represents an acid group or a base, and an acid group is preferred.

上述式中，波線表示鍵結鍵。The pigment derivative is preferably a compound having a maximum absorption wavelength in the wavelength range of 700 to 1200 nm, and a compound having a maximum absorption wavelength in the wavelength range of 700 to 1100 nm is also preferable, in the wavelength range of 700 to 1000 nm Compounds with a maximum absorption wavelength are also preferred. The extension of the π-plane of the pigment derivative having a maximum absorption wavelength in the above-mentioned wavelength range can easily approach the near-infrared absorbing dye represented by formula (SQ1), thereby improving the adsorption of the near-infrared absorbing dye represented by formula (SQ1) And it is easy to obtain further excellent dispersion stability. In addition, it is also preferable that the dye derivative is a compound having a π-conjugated plane having the same structure as the π-conjugated plane contained in the near-infrared absorbing dye represented by formula (SQ1). In addition, the number of π electrons contained in the π-conjugated plane of the pigment derivative is preferably 8-100. The upper limit is preferably 90 or less, and more preferably 80 or less. The lower limit is preferably 10 or more, and more preferably 12 or more. In addition, the pigment derivative is a compound having a π-conjugated plane including a partial structure represented by the following formula (SQ-a) or a π-conjugated plane having a partial structure represented by the following formula (CR-a) Compounds are also preferable, and compounds having a π-conjugated plane including the partial structure represented by the following formula (SQ-a) are more preferable. [Chemical formula 28]

In the above formula, the wave line represents the bonding bond.

The pigment derivative is preferably at least one selected from the compound represented by the following formula (Syn1) and the compound represented by the following formula (Syn2), and more preferably the compound represented by the following formula (Syn1) . [Chemical formula 29]

In the formula (Syn1), Rsy ¹ and Rsy ² each independently represent an organic group, L ¹ represents a single bond or a p1+1 valent group, A ¹ represents an acid group or a base, and p1 and q1 each independently represent 1 The above integer. When p1 is 2 or more, a plurality of A ¹ may be the same or different. When q1 is 2 or more, a plurality of L ¹ and A ¹ may be the same or different.

In the formula (Syn2), Rsy ³ and Rsy ⁴ each independently represent an organic group, L ² represents a single bond or a p2+1 valent group, A ² represents an acid group or a base, and p2 and q2 each independently represent 1 The above integer. When p2 is 2 or more, a plurality of A ² may be the same or different. When q2 is 2 or more, a plurality of L ² and A ² may be the same or different.

Examples of the organic groups represented by Rsy ¹ and Rsy ^{2 in formula (Syn1) and the organic groups represented by Rsy 3} and Rsy ⁴ in formula (Syn2) include aryl groups, heteroaryl groups, and the following formula (R1 ) ~ (R7) represents the group. [Chemical formula 30]

In formula (R1), R ¹ to R ³ each independently represent a hydrogen atom or a substituent, As ³ represents a heteroaryl group, n _r1 represents an integer of 0 or more, R ¹ and R ² may be bonded to each other to form a ring, R ¹ and As ³ may be bonded to each other to form a ring, R ² and R ³ may be bonded to each other to form a ring. When n _r1 is 2 or more, plural R ² and R ³ may be the same or different, respectively, * Represents a bonding key.

In the formula (R2), ring Z ¹ represents a condensed ring containing an aromatic heterocycle or aromatic heterocycle ^{that may have one or more substituents, and ring Z 2} represents 4 to 4 that may have one or more substituents In a 9-membered hydrocarbon ring or heterocyclic ring, when ring Z ¹ and ring Z ² have plural substituents, the plural substituents may be the same or different, and * represents a bonding bond.

In formula (R3), R ¹¹ to R ¹⁴ each independently represent a hydrogen atom or a substituent, ^{two adjacent groups in R 11} to R ¹⁴ may be bonded to each other to form a ring, and R ²⁰ represents an aryl group or For heteroaryl, R ²¹ represents a substituent, and X ¹⁰ represents CO or SO ₂ .

In formula (R4), R ²² and R ²³ each independently represent a hydrogen atom or a substituent, R ²² and R ²³ may be bonded to each other to form a ring, and X ²⁰ represents an oxygen atom, a sulfur atom, NR ²⁴ , a selenium atom, or tellurium Atom, R ²⁴ represents a hydrogen atom or a substituent, when X ²⁰ is NR ²⁴ , R ²⁴ and R ²² may be bonded to each other to form a ring, n _r2 represents an integer from 0 to 5, where n _r2 is 2 or more In this case, the plurality of R ²² may be the same or different, and two R ²² of the plurality of R ²² may be bonded to each other to form a ring, and * represents a bonding bond.

In the formula (R5), R ³⁵ to R ³⁸ each independently represent a hydrogen atom or a substituent, R ³⁵ and R ³⁶ , R ³⁶ and R ³⁷ , R ³⁷ and R ³⁸ may be bonded to each other to form a ring, and * represents bonding key.

In formula (R6), R ³⁹ to R ⁴⁵ independently represent a hydrogen atom or a substituent, R ³⁹ and R ⁴⁵ , R ⁴⁰ and R ⁴¹ , R ⁴⁰ and R ⁴² , R ⁴² and R ⁴³ , R ⁴³ and R ⁴⁴ , R ⁴⁴ and R ⁴⁵ can be bonded to each other to form a ring, and * represents a bonding bond. In the formula (R7), X ²¹ represents a ring structure, R ⁴⁶ to R ⁵⁰ independently represent a hydrogen atom or a substituent, R ⁴⁷ and R ⁴⁸ may be bonded to each other to form a ring, and * represents a bonding bond.

As the p1+1 valent group represented by L ^{1 of the formula (Syn1) and the p2+1 valent group represented by L 2 of} the formula (Syn2), the expression represented by L of the above formula (B1) can be given The linking group is the group for illustration.

As a specific example of a pigment derivative, the compound of the following structure can be mentioned, for example. In addition, in the following structural formulae, Ph is a phenyl group. In addition, as specific examples of pigment derivatives, Japanese Patent Application Publication No. 56-118462, Japanese Patent Application Publication No. 63-264674, Japanese Patent Application Publication No. 01-217077, Japanese Patent Application Publication No. 03-009961 Bulletin, Japanese Patent Application Publication No. 03-026767, Japanese Patent Application Publication No. 03-153780, Japanese Patent Application Publication No. 03-045662, Japanese Patent Application Publication No. 04-285669, Japanese Patent Application Publication No. 06-145546, Japanese Patent Application Publication No. 06-145546 06-212088, Japanese Patent Application Publication No. 06-240158, Japanese Patent Application Publication No. 10-030063, Japanese Patent Application Publication No. 10-195326, International Publication No. 2011/024896, paragraphs 0086 to 0098, International Publication No. 2012 The compounds described in paragraphs 0063 to 0094 of No. /102399 are incorporated into this specification.

[化學式32]

[化學式33]

[化學式34]

[化學式35]

[化學式36]

[化學式37]

[Chemical formula 31]

[Chemical formula 32]

[Chemical formula 33]

[Chemical formula 34]

[Chemical formula 35]

[Chemical formula 36]

[Chemical formula 37]

The content of the dye derivative is preferably 1 to 50 parts by mass relative to 100 parts by mass of the near-infrared absorbing dye represented by the formula (SQ1). The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less. As long as the content of the dye derivative is within the above range, the dispersibility of the near-infrared absorbing dye represented by the formula (SQ1) can be improved, and the aggregation of the near-infrared absorbing dye represented by the formula (SQ1) can be effectively suppressed. Only one type of pigment derivative may be used, or two or more types may be used. When two or more types are used, the total amount is preferably within the above-mentioned range.

＜＜Coloring agent＞＞ The resin composition of the present invention can contain a coloring agent. In the present invention, the color coloring agent means a coloring agent other than the white coloring agent and the black coloring agent. The coloring agent is preferably a coloring agent having absorption in the range of 400 nm or more and less than 650 nm.

Examples of color colorants include red colorants, green colorants, blue colorants, yellow colorants, purple colorants, and orange colorants. The coloring agent may be a pigment or a dye. It is also possible to use pigments and dyes at the same time. In addition, the pigment may be any of an inorganic pigment and an organic pigment. In addition, it is also possible to use a material in which a part of an inorganic pigment or an organic-inorganic pigment is replaced by an organic chromophore. By replacing inorganic pigments or organic-inorganic pigments with organic chromophores, hue design can be easily performed.

The average primary particle diameter of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, and more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. As long as the average primary particle diameter of the pigment is within the above range, the dispersion stability of the pigment in the resin composition is good. Furthermore, in the present invention, the primary particle size of the pigment can be obtained from an image photograph obtained by observing the primary particles of the pigment with a transmission electron microscope. Specifically, the projected area of the primary particles of the pigment is obtained, and the equivalent circle diameter corresponding to this is calculated as the primary particle diameter of the pigment. In addition, the average primary particle diameter in the present invention is taken as the arithmetic average value of the primary particle diameters of 400 pigments. In addition, the primary particles of the pigment refer to independent particles that are not aggregated.

The coloring agent preferably contains a pigment. The content of the pigment in the color colorant is preferably 50% by mass or more, more preferably 70% by mass or more, more preferably 80% by mass or more, and particularly preferably 90% by mass or more. As a pigment, the following can be mentioned.

Color Index (CI) Pigment Yellow (Pigment Yellow) 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232 (methine series) and 233 (quinoline Department) etc. (above are yellow pigments); CI Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64 , 71 and 73, etc. (the above are orange pigments); CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3 , 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2 , 81: 3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178 , 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 270, 272, 279 , 294 (Kou Yamaguchi Galaxy, Organo Ultramarine, Bluish Red), 295 (Azo) and 296 (Azo), etc. (the above are red pigments); C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62 and 63, etc. (the above are green pigments); C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60 (triarylmethane series) and 61 (koushankou galaxy), etc. (the above are purple pigments); CI Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87 (Monoazo series) and 88 (methine series), etc. (the above are blue pigments).

In addition, as a green pigment, a halogenated zinc phthalocyanine pigment having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms in one molecule can be used. As a specific example, the compound described in International Publication No. 2015/118720 can be cited. In addition, as a green pigment, a phthalocyanine compound having the compound described in the specification of Chinese Patent Application No. 106909027 and the phosphate ester described in International Publication No. 2012/102395 as a ligand can also be used.

In addition, as the blue pigment, an aluminum phthalocyanine compound having a phosphorus atom can also be used. As specific examples, the compounds described in paragraphs 0022 to 0030 of JP 2012-247591 and paragraph 0047 of JP 2011-157478 can be cited.

In addition, as the yellow pigment, the pigment described in JP 2008-074985, the compound described in JP 2008-074987, and the quinone described in JP 2013-061622 can also be used. Phlophyllin compounds, quinophthalone compounds described in JP 2013-181015 A, coloring agents described in JP 2014-085565 A, pigments described in JP 2016-145282, The pigments described in Japanese Patent Application Publication No. 2017-201003, the pigments described in Japanese Patent Application Publication No. 2017-197719, and paragraphs 0011 to 0062 and paragraphs 0137 to 0276 of Japanese Patent Application Publication No. 2017-171912 Pigments, the pigments described in paragraphs 0010 to 0062 and paragraphs 0138 to 0295 of JP 2017-171913 A, the pigments described in paragraphs 0011 to 0062, and paragraphs 0139 to 0190 of JP 2017-171914, The pigments described in paragraphs 0010 to 0065 and paragraphs 0142 to 0222 of Japanese Patent Application Publication No. 2017-171915, the quinoline yellow compounds described in Japanese Patent Application Publication No. 2017-197640, and Japanese Patent Application Publication No. 2018-040835 The quinoline yellow pigments described, the pigments described in JP 2018-203798, the pigments described in JP 2018-062578, and the quinones described in JP 2018-155881 Phytochrome yellow pigment, the compound described in JP 2018-062644, the quinophthalone compound described in JP 6432077, and the pigment described in JP 6443711.

In addition, as the yellow pigment, the compound described in JP 2018-062644 A can also be used. The compound can also be used as a pigment derivative.

As the red pigment, a diketopyrrolopyrrole compound in which at least one bromine atom is substituted in the structure described in JP 2017-201384 A, and the ones described in paragraphs 0016 to 0022 of Japanese Patent No. 6248838 can also be used. Diketopyrrolopyrrole compound, diketopyrrolopyrrole compound described in International Publication No. 2012/102399, diketopyrrolopyrrole compound described in International Publication No. 2012/117965, Japanese Patent Application Publication No. 2012-229344 The naphthol azo compound described in the gazette and the like. In addition, as a red pigment, it is also possible to use a compound having a structure in which an aromatic ring is bonded to a diketopyrrolopyrrole skeleton: the aromatic ring is introduced into the aromatic ring and bonded with an oxygen atom, a sulfur atom, or a nitrogen atom. Derived from the group.

In the present invention, dyes can also be used as color materials. The dye is not particularly limited, and known dyes can be used. For example, pyrazole azo series, anilino azo series, triarylmethane series, anthraquinone series, anthrapyridone series, benzylidene series, oxonine series, pyrazolotriazole Azo series, pyridone azo series, cyanine series, phenanthrene series, pyrrolopyrazole imide series, Kouyamaguchi system, phthalocyanine series, benzopyran series, indigo series and pyrromethene series And other dyes. In addition, the thiazole compound described in JP 2012-158649 A, the azo compound described in JP 2011-184493 A, and the azo compound described in JP 2011-145540 A can also be preferably used. Of azo compounds. In addition, as the yellow dye, the quinoline yellow compound described in paragraphs 0011 to 0034 of JP 2013-054339 A, and the quinoline described in paragraphs 0013 to 0058 of JP 2014-026228 A can also be used. Yellow compounds and so on.

When the resin composition of the present invention contains a color colorant, the content of the color colorant is preferably 1 to 50% by mass in the total solid content of the resin composition of the present invention. When the resin composition of the present invention contains two or more color colorants, it is preferable that the total amount is within the above-mentioned range.

＜＜Color materials that transmit near-infrared rays and block visible light＞＞ The resin composition of the present invention can also contain a color material (hereinafter, also referred to as a color material that blocks visible light) that transmits near infrared rays (light of a wavelength in the near-infrared region) and blocks visible light (light of a wavelength in the visible region). A resin composition containing a color material that shields visible light is preferably used as a resin composition for forming a near-infrared transmission filter.

In the present invention, the color material that shields visible light is preferably a color material that absorbs light in the wavelength range from violet to red. Furthermore, in the present invention, the color material that shields visible light is preferably a color material that shields light in the wavelength region of 450 to 650 nm. In addition, the color material that shields visible light is preferably a color material that transmits light with a wavelength of 900 to 1300 nm. In the present invention, the color material that shields visible light preferably satisfies at least one of the following requirements (A) and (B). (A): Contains two or more color colorants, and forms black by a combination of two or more color colorants. (B): Contains organic black colorant.

As a coloring agent, the above-mentioned can be mentioned. Examples of organic black colorants include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds, and bisbenzofuranone compounds and perylene compounds are preferred. Examples of the bisbenzofuranone compound include compounds described in JP 2010-534726, JP 2012-515233, and JP 2012-515234. For example, they can be manufactured by BASF Corporation. "Irgaphor Black". Examples of the perylene compound include the compounds described in paragraphs 0016 to 0020 of JP 2017-226821 A, C.I. Pigment Black 31 and 32, "Lumogen Black" manufactured by BASF Corporation, and the like. Examples of the azomethine compound include the compounds described in Japanese Patent Application Laid-Open No. 01-170601, Japanese Patent Application Laid-Open No. 02-034664, etc., and can be, for example, manufactured by Dainichiseika Color & Chemicals Mfg. Co., Ltd. "CHROMO FINE BLACKA1103".

As a combination of color colorants in the case of forming black by a combination of two or more color colorants, for example, the following can be given. (1) Containing yellow coloring agent, blue coloring agent, purple coloring agent and red coloring agent. (2) Containing yellow coloring agent, blue coloring agent and red coloring agent. (3) Containing yellow coloring agent, purple coloring agent and red coloring agent. (4) Contains yellow colorant and purple colorant. (5) Containing green coloring agent, blue coloring agent, purple coloring agent and red coloring agent (6) Containing purple coloring agent and orange coloring agent. (7) Containing green coloring agent, purple coloring agent and red coloring agent. (8) Containing green coloring agent and red coloring agent.

When the resin composition of the present invention contains a color material that shields visible light, the content of the color material that shields visible light is preferably 1 to 50% by mass in the total solid content of the resin composition.

＜＜Polymerizable compound＞＞ The resin composition of the present invention preferably contains a polymerizable compound. As the polymerizable compound, a compound that can be polymerized by the action of radicals is preferred. That is, the polymerizable compound is preferably a radical polymerizable compound. The polymerizable compound is preferably a compound having at least one ethylenically unsaturated bond-containing group, and more preferably a compound having two or more ethylenically unsaturated bond-containing groups, and has 3 or more ethylenically unsaturated bond-containing groups. The compound of the ethylenically unsaturated bond group is more preferable. The upper limit of the number of ethylenically unsaturated bond-containing groups is preferably 15 or less, and more preferably 6 or less. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a styryl group, a (meth)allyl group, and a (meth)acryloyl group. The (meth)acryloyl group is preferred. The polymerizable compound is preferably a 3 to 15 functional (meth)acrylate compound, and a 3 to 6 functional (meth)acrylate compound is more preferred. Specific examples of polymerizable compounds include paragraphs 0095 to 0108 of Japanese Patent Application Publication No. 2009-288705, paragraphs 0227 of Japanese Patent Application Publication No. 2013-029760, and paragraphs 0254 to 0257 of Japanese Patent Application Publication No. 2008-292970. , Japanese Patent Application Publication No. 2013-253224, paragraphs 0034 to 0038, Japanese Patent Application Publication No. 2012-208494, paragraph 0477, Japanese Patent Application Publication No. 2017-048367, Japanese Patent No. 6057891, Japanese Patent No. 6031807, The compounds described in JP 2017-194662 A are incorporated into this specification.

The polymerizable compound may be in any form of monomers and polymers, but monomers are preferred. The molecular weight of the monomeric polymerizable compound is preferably 100 to 3,000. The upper limit is preferably 2000 or less, and more preferably 1500 or less. The lower limit is preferably 150 or more, more preferably 250 or more. In addition, it is also preferable that the polymerizable compound is a compound having substantially no molecular weight distribution. Here, as a compound having substantially no molecular weight distribution, a compound having a degree of dispersion of the compound (weight average molecular weight (Mw)/number average molecular weight (Mn)) of 1.0 to 1.5 is preferable, and 1.0 to 1.3 is more preferable.

As polymerizable compounds, dineopentylerythritol triacrylate (as a commercial product is KAYARAD D-330; manufactured by NIPPON KAYAKU CO., Ltd.), dineopentylene erythritol tetraacrylate (as a commercial product is KAYARAD D -320; manufactured by NIPPON KAYAKU CO., Ltd.), dineopentyl pentaerythritol penta(meth)acrylate (as a commercially available product is KAYARAD D-310; manufactured by NIPPON KAYAKU CO., Ltd.), dineopentaerythritol Alcohol hexa (meth)acrylate (as commercially available products are KAYARAD DPHA; manufactured by NIPPON KAYAKU CO., Ltd., NK EsterA-DPH-12E; manufactured by Shin-Nakamura Chemical Co., Ltd.) and these (methyl ) Compounds with a structure in which propylene groups are bonded via ethylene glycol and/or propylene glycol residues (for example, SR454 and SR499 sold by SARTOMER Company, Inc.) are preferred. In addition, as the polymerizable compound, diglycerol EO (ethylene oxide) modified (meth)acrylate (M-460 as a commercially available product; manufactured by TOAGOSEI CO., LTD.) and neopentylerythritol can also be used Tetraacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., NK EsterA-TMMT), 1,6-hexanediol diacrylate (manufactured by NIPPON KAYAKU CO., Ltd., KAYARAD HDDA), RP-1040 (NIPPON KAYAKU CO., Ltd.), ARONIX TO-2349 (TOAGOSEI CO., LTD.), NK OligoUA-7200 (Shin-Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (TAISEI FINE CHEMICAL CO,. LTD.), LIGHT ACRYLATEPOB-A0 (KYOEISHA CHEMICAL Co., LTD.), etc.

In addition, as the polymerizable compound, trimethylolpropane tri(meth)acrylate, trimethylolpropane, propylene oxide, and trimethylolpropane, propylene oxide, are used to modify tri(meth)acrylate and trimethylolpropane, ethylene oxide. Tri(meth)acrylate, isocyanuric acid ethylene oxide modified tri(meth)acrylate and neopentylerythritol tri(meth)acrylate and other trifunctional (meth)acrylate compounds are also Better. Commercial products of trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M- 306, M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO., LTD.), NK ester A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A -TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 ( Nippon Kayaku Co., Ltd.), etc.

As the polymerizable compound, a compound having an acid group can also be used. By using a polymerizable compound having an acid group, the polymerizable compound in the unexposed portion can be easily removed during development, and the generation of development residue can be suppressed. As an acid group, a carboxyl group, a sulfonic acid group, a phosphoric acid group, etc. are mentioned, and a carboxyl group is preferable. Examples of commercially available products of polymerizable compounds having acid groups include ARONIX M-305, M-510, M-520, and ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.). The acid value of the polymerizable compound having an acid group is preferably 0.1-40 mgKOH/g, and more preferably 5-30 mgKOH/g.

As the polymerizable compound, a compound having a caprolactone structure can also be used. The polymerizable compound having a caprolactone structure is sold by NIPPON KAYAKU CO., Ltd. as the KAYARAD DPCA series, for example, DPCA-20, DPCA-30, DPCA-60, DPCA-120, and the like.

As the polymerizable compound, a polymerizable compound having an alkoxy group can also be used. The polymerizable compound having an alkoxyl group is preferably a polymerizable compound having a vinyloxy group and/or a propyleneoxy group, and a polymerizable compound having a vinyloxy group is more preferred, and a polymerizable compound having 4-20 vinyloxy groups is preferred. The 3-6 functional (meth)acrylate compound is more preferable. As commercially available products of polymerizable compounds having alkoxylate groups, for example, SR-494, which is a 4-functional (meth)acrylate having four vinyloxy groups manufactured by Sartomer Company, Inc., and three The trifunctional (meth)acrylate of methacrylate is KAYARAD TPA-330 and so on.

As the polymerizable compound, a polymerizable compound having a 茀 skeleton can also be used. As a commercially available product of a polymerizable compound having a stilbene skeleton, OGSOLEA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., a (meth)acrylate monomer having a stilbene skeleton) and the like can be cited.

As the polymerizable compound, it is also preferable to use a compound that does not substantially contain environmentally regulated substances such as toluene. As a commercially available product of this kind of compound, KAYARAD DPHA LT, KAYARAD DPEA-12 LT (manufactured by NIPPON KAYAKU CO., Ltd.), etc. can be mentioned.

As the polymerizable compound, for example, the urethane carboxylic acid described in Japanese Patent Publication No. 48-041708, Japanese Patent Application Publication No. 51-037193, Japanese Patent Publication No. 02-032293, and Japanese Patent Publication No. 02-016765 Ester acrylates or ethylene oxide systems described in Japanese Patent Publication No. 58-049860, Japanese Patent Publication No. 56-017654, Japanese Patent Publication No. 62-039417, and Japanese Patent Publication No. 62-039418 The urethane compound of the skeleton is also preferred. In addition, a polymerizable compound having an amine structure or a sulfide structure in the molecule as described in Japanese Patent Application Publication No. 63-277653, Japanese Patent Application Publication No. 63-260909, and Japanese Patent Application Publication No. 01-105238 are also used. For better. In addition, the polymerizable compound can also be used UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by NIPPON KAYAKU CO., Ltd.), UA-306H, UA-306T, UA-306I, Commercial products such as AH-600, T-600, AI-600 and LINC-202UA (manufactured by KYOEISHA CHEMICAL Co., LTD.).

The content of the polymerizable compound is preferably 0.1 to 40% by mass in the total solid content of the resin composition. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 30% by mass or less, and more preferably 20% by mass or less. The resin composition may contain only one type of polymerizable compound, or may contain two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Photopolymerization initiator＞＞ When the resin composition of the present invention contains a polymerizable compound, the resin composition of the present invention preferably further contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited, and it can be appropriately selected from known photopolymerization initiators. For example, a compound having photosensitivity to light from the ultraviolet region to the visible region is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

Examples of photopolymerization initiators include halogenated hydrocarbon derivatives (for example, compounds having three skeletons, compounds having oxadiazole skeletons, etc.), phosphine compounds, hexaarylbisimidazoles, oxime compounds, and organic peroxides. Compounds, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxy ketone compounds, and α-amino ketone compounds. From the viewpoint of exposure sensitivity, the photopolymerization initiator is a trihalomethyl tris compound, a benzyl dimethyl ketal compound, an α-hydroxy ketone compound, an α-amino ketone compound, an phosphine compound, and a phosphine oxide. Compounds, metallocene compounds, oxime compounds, triarylimidazole dimers, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes, halomethyl Oxadiazole compounds and 3-aryl-substituted coumarin compounds are preferred. Compounds selected from oxime compounds, α-hydroxy ketone compounds, α-amino ketone compounds and phosphine compounds are more preferred, and oxime compounds are further preferred. Better. Examples of the photopolymerization initiator include the compounds described in paragraphs 0065 to 0111 of JP 2014-130173 A and Japanese Patent No. 6301489, which are incorporated in this specification.

Examples of commercially available products of the α-hydroxy ketone compound include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (manufactured by IGM Resins B.V.) and the like. As commercially available products of the α-amino ketone compound, Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379 EG (manufactured by IGM Resins B.V.) and the like can be cited. As commercially available products of the phosphine compound, Omnirad 819 and Omnirad TPO (the above are manufactured by IGM Resins B.V.) and the like can be cited.

Examples of the oxime compound include the compounds described in Japanese Patent Application Publication No. 2001-233842, the compounds described in Japanese Patent Application Publication No. 2000-080068, the compounds described in Japanese Patent Application Publication No. 2006-342166, and JCS The compound described in Perkin II (1979, pp.1653-1660), the compound described in JCS Perkin II (1979, pp.156-162), Journal of Photopolymer Science and Technology (1995, pp.202) -232) The compound described in Japanese Patent Application Publication No. 2000-066385, the compound described in Japanese Patent Application Publication No. 2000-080068, and the compound described in Japanese Patent Application Publication No. 2004-534797 The compound described in JP 2006-342166 A, the compound described in JP 2017-019766 A, the compound described in Japanese Patent No. 6065596, and the compound described in International Publication No. 2015/152153 The compound described in International Publication No. 2017/051680, the compound described in JP 2017-198865 A, the compound described in Paragraphs 0025 to 0038 of International Publication No. 2017/164127, and the compound described in International Publication No. 2017/164127. The compound and the like described in 2013/167515 are disclosed. Specific examples of the oxime compound include 3-benzyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, and 3-acetoxyiminobutan-2-one. Aminobutan-2-one, 2-acetoxyiminopentane-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzyl Oxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one and 2-ethoxycarbonyloxyimino-1 -Phenylpropane-1-one, etc. Examples of commercially available products include IRGACURE-OXE01, IRGACURE-OXE02, IRGACURE-OXE03, IRGACURE-OXE04 (manufactured by BASF), TR-PBG-304 (manufactured by Changzhou Tronly New Electronic Materials CO., LTD.), Adeka Optomer N-1919 (manufactured by ADEKA CORPORATION, photopolymerization initiator 2 described in JP 2012-014052 A). Moreover, as the oxime compound, it is also preferable to use a compound having no colorability or a compound having high transparency and difficult to change color. As commercially available products, ADEKAARKLS NCI-730, NCI-831, and NCI-930 (the above are manufactured by ADEKA CORPORATION) and the like can be cited.

In the present invention, an oxime compound having a sulphur ring can also be used as a photopolymerization initiator. As a specific example of the oxime compound which has a sulphur ring, the compound described in JP 2014-137466 A can be mentioned.

In addition, as the photopolymerization initiator, an oxime compound in which at least one benzene ring having a carbazole ring becomes the skeleton of the naphthalene ring can also be used. As a specific example of such an oxime compound, the compound described in International Publication No. 2013/083505 can be mentioned.

In the present invention, as the photopolymerization initiator, an oxime compound having a fluorine atom can also be used. Specific examples of the oxime compound having a fluorine atom include the compounds described in JP 2010-262028 A, the compounds 24, 36 to 40 described in JP 2014-500852 A, and JP 2010-262028 The compound (C-3) described in the 2013-164471 bulletin, etc.

In the present invention, as the photopolymerization initiator, an oxime compound having a nitro group can be used. The oxime compound having a nitro group is also preferably used as a dimer. Specific examples of the oxime compound having a nitro group include those described in paragraphs 0031 to 0047 of JP 2013-114249, paragraphs 0008 to 0012, and paragraphs 0070 to 0079 of JP 2014-137466. The compound, the compound described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, and ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

In the present invention, as the photopolymerization initiator, an oxime compound having a benzofuran skeleton can also be used. As a specific example, OE-01 to OE-75 described in International Publication No. 2015/036910 can be cited.

Specific examples of oxime compounds preferably used in the present invention are shown below, but the present invention is not limited to these.

[化學式39]

[Chemical formula 38]

[Chemical formula 39]

The oxime compound is preferably a compound having a maximum absorption wavelength in a wavelength range of 350 to 500 nm, and a compound having a maximum absorption wavelength in a wavelength range of 360 to 480 nm is more preferable. Also, from the viewpoint of sensitivity, the oxime compound preferably has a high molar absorption coefficient at a wavelength of 365 nm or a wavelength of 405 nm, more preferably 1,000 to 300,000, more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured using a known method. For example, it is better to use a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian Company) and use an ethyl acetate solvent to measure at a concentration of 0.01 g/L.

As the photopolymerization initiator, a bifunctional or trifunctional or more photoradical polymerization initiator can be used. By using this kind of photo-radical polymerization initiator, two or more radicals are generated from one molecule of the photo-radical polymerization initiator, so that good sensitivity can be obtained. In addition, when a compound having an asymmetric structure is used, the crystallinity is lowered and the solubility in a solvent or the like is improved, and precipitation becomes difficult over time, so that the stability of the resin composition over time can be improved. As specific examples of the photoradical polymerization initiators having difunctional or trifunctional or higher functions, Japanese Patent Application Publication No. 2010-527339, Japanese Patent Application Publication No. 2011-524436, International Publication No. 2015/004565, Japanese Patent Application Publication No. 2010-527339, and International Publication No. 2015/004565 may be mentioned. Table 2016-532675, paragraphs 0407 to 0412, International Publication No. 2017/033680, paragraphs 0039 to 0055, dimers of oxime compounds, compounds described in JP 2013-522445 No. (E ) And compound (G), Cmpd1-7 described in International Publication No. 2016/034963, oxime ester-based photoinitiator described in paragraph 0007 of JP 2017-523465 A, JP 2017- The photoinitiator described in paragraphs 0020 to 0033 of 167399 and the photopolymerization initiator (A) described in paragraphs 0017 to 0026 of JP 2017-151342 A, etc.

It is also preferable that the photopolymerization initiator includes an oxime compound and an α-aminoketone compound. By using both at the same time, the developability is improved and it is easy to form a pattern with excellent rectangularity. When the oxime compound and the α-amino ketone compound are used together, the α-amino ketone compound is preferably 50 to 600 parts by mass relative to 100 parts by mass of the oxime compound, and more preferably 150 to 400 parts by mass.

The content of the photopolymerization initiator is preferably 0.1 to 40% by mass in the total solid content of the resin composition, more preferably 0.5 to 30% by mass, and still more preferably 1 to 20% by mass. The resin composition may contain only one type of photopolymerization initiator, or may contain two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Epoxy compound＞＞ The resin composition of the present invention can contain a compound having an epoxy group (hereinafter, also referred to as an epoxy compound). Examples of epoxy compounds include monofunctional or polyfunctional glycidyl ether compounds, polyfunctional aliphatic glycidyl ether compounds, and compounds having an alicyclic epoxy group. The epoxy compound is preferably a compound having 1 to 100 epoxy groups in one molecule. The upper limit of epoxy groups can also be 10 or less, and can also be 5 or less. The lower limit is preferably 2 or more. The epoxy compound may be a low-molecular compound (for example, a molecular weight of less than 1000) or a macromolecule compound (for example, a molecular weight of 1000 or more, and in the case of a polymer, the weight average molecular weight is 1000 or more). The weight average molecular weight of the epoxy compound is preferably 2,000 to 100,000. The upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and more preferably 3,000 or less.

Examples of commercially available epoxy compounds include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC Corporation), Adeka glycyrrole ED-505 (manufactured by ADEKA CORPORATION), and the like. Moreover, as the epoxy compound, paragraphs 0034 to 0036 of JP 2013-011869 A, paragraphs 0147 to 0156 of JP 2014-043556, and 0085 to 0092 of JP 2014-089408 can also be used. The compound described in the paragraph.

The content of the epoxy compound is preferably 0.1 to 40% by mass in the total solid content of the resin composition. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 30% by mass or less, and more preferably 20% by mass or less. In addition, when the resin composition contains a polymerizable compound and an epoxy compound, the mass ratio of the two is preferably polymerizable compound: epoxy compound = 100:1 to 100:400, 100:1 to 100:100 For better. The resin composition may contain only one type of epoxy compound, or may contain two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Epoxy hardener＞＞ When the resin composition of the present invention contains an epoxy compound, the resin composition of the present invention preferably further contains an epoxy curing agent. Examples of epoxy curing agents include amine compounds, acid anhydride compounds, amide compounds, phenol compounds, polycarboxylic acids, and thiol compounds. As the epoxy curing agent, from the viewpoints of heat resistance and transparency of the cured product, a polycarboxylic acid is preferable, and a compound having two or more carboxylic anhydride groups in the molecule is most preferable. As a specific example of an epoxy hardener, succinic acid etc. are mentioned. The epoxy curing agent can also use the compound described in paragraphs 0072 to 0078 of JP 2016-075720 A, and the content is incorporated in this specification. The content of the epoxy curing agent is preferably 0.01-20 parts by mass relative to 100 parts by mass of the epoxy compound, more preferably 0.01-10 parts by mass, and still more preferably 0.1-6.0 parts by mass. The resin composition may contain only one type of epoxy curing agent, or may contain two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Solvent＞＞ The resin composition of the present invention preferably contains a solvent. As the solvent, organic solvents are preferred. Examples of organic solvents include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. For these details, please refer to paragraph 0223 of International Publication No. 2015/166779, which is incorporated into this specification. In addition, an ester-based solvent substituted with a cyclic alkyl group and a ketone-based solvent substituted with a cyclic alkyl group can also be preferably used. As specific examples of organic solvents, polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, and ethyl cyrus acetic acid can be mentioned. Ester, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, cyclohexyl acetate, cyclopentanone, ethyl carbamide Alcohol acetate, butyl carbitol acetate, propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate, etc. Among them, aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents are sometimes better reduced due to environmental reasons (for example, relative to the total amount of organic solvents, it can also be set as 50 mass ppm (parts per million: parts per million) or less, can also be set to 10 mass ppm or less, or can be set to 1 mass ppm or less).

In the present invention, it is preferable to use an organic solvent with a small metal content. For example, it is preferable that the metal content of the organic solvent is 10 mass ppb (parts per billion) or less. According to needs, organic solvents of quality ppt (parts per trillion: parts per trillion) can also be used, such organic solvents are provided by TOYO Gosei Co., Ltd. (Chemical Industry Daily, November 13, 2015), for example.

As a method for removing impurities such as metals from organic solvents, for example, filtration using distillation (molecular distillation or thin film distillation, etc.) or filtration can be cited. As the filter pore size of the filter used for filtration, 10 μm or less is preferable, 5 μm or less is more preferable, and 3 μm or less is more preferable. The material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon.

Organic solvents can contain isomers (compounds with the same number of atoms but different structures). In addition, the isomer may include only one type, or may include a plurality of types.

The peroxide content in the organic solvent is preferably 0.8 mmol/L or less, and it is more preferred that the peroxide content is not substantially contained.

The content of the solvent is preferably 10 to 97% by mass relative to the total amount of the resin composition. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, more preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more. The upper limit is preferably 96% by mass or less, and more preferably 95% by mass or less. The resin composition may contain only one type of solvent, or may contain two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Polymerization inhibitor＞＞ The resin composition of the present invention can contain a polymerization inhibitor. As polymerization inhibitors, hydroquinone, p-methoxyphenol, di-tertiary butyl-p-cresol, pyrogallol, tertiary butylcatechol, benzoquinone, 4,4 '-Thiobis(3-methyl-6-tertiary butylphenol), 2,2'-methylene bis(4-methyl-6-tertiary butylphenol) and N-nitrosobenzene Hydroxy amine salt (ammonium salt, cerium salt, etc.), p-methoxyphenol is preferred. The content of the polymerization inhibitor is preferably 0.0001 to 5% by mass in the total solid content of the resin composition. The resin composition may contain only one type of polymerization inhibitor, or may contain two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Silane coupling agent＞＞ The resin composition of the present invention can contain a silane coupling agent. In the present invention, the silane coupling agent refers to a silane compound having a hydrolyzable group and other functional groups. In addition, the hydrolyzable group refers to a substituent that is directly connected to a silicon atom and can generate a siloxane bond by at least any one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, and an acyloxy group, and an alkoxy group is preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Moreover, as functional groups other than the hydrolyzable group, for example, vinyl, styryl, (meth)acrylic, mercapto, epoxy, oxetanyl, amino, ureido, sulfur Ether group, isocyanate group, phenyl group, etc., (meth)acryloyl group and epoxy group are preferred. As for the silane coupling agent, the compounds described in paragraphs 0018 to 0036 of JP 2009-288703 A and the compounds described in paragraphs 0056 to 0066 of JP 2009-242604 A can be mentioned, and these contents Included in this manual. The content of the silane coupling agent is preferably 0.01-15.0% by mass in the total solid content of the resin composition, and more preferably 0.05-10.0% by mass. The resin composition may contain only one type of silane coupling agent, or may contain two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Surface active agent＞＞ The resin composition of the present invention preferably contains a surfactant. As the surfactant, various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicon-based surfactants can be used. As for the surfactant, the surfactant described in paragraphs 0238 to 0245 of International Publication No. 2015/166779 can be cited, and this content is incorporated in this specification.

The surfactant is preferably a fluorine-based surfactant. By including a fluorine-based surfactant in the resin composition, liquid properties (especially fluidity) can be further improved, and liquid-saving properties can be further improved. In addition, it is also possible to form a film with less uneven thickness. Furthermore, the effect of suppressing volatilization of the compound of Formula (AS1) by heating can also be acquired.

The fluorine content in the fluorine-based surfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass. In terms of uniformity of the thickness of the coating film and liquid-saving properties, a fluorine-based surfactant having a fluorine content within this range is effective, and its solubility in the composition is also good.

Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of Japanese Patent Application Laid-Open No. 2014-041318 (corresponding to paragraphs 0060 to 0064 of American International Publication No. 2014/017669). The surfactants described in paragraphs 0117 to 0132 of JP 2011-132503 A are incorporated into this specification. Commercial products of fluorine-based surfactants include, for example, MEGAFACE F171, F172, F173, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780, EXP, MFS-330 (manufactured by DIC Corporation above), Fluorad FC430, FC431, FC171 (manufactured by Sumitomo 3M Limited above), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068 , SC-381, SC-383, S-393, KH-40 (manufactured by ASAHI GLASS CO., LTD.), OrganicFTX-218 (manufactured by Neos Corporation), PolyFox PF636, PF656, PF6320, PF6520, PF7002 Manufactured by OMNOVA Solutions Inc.) etc.

In addition, the fluorine-based surfactant can also preferably use an acrylic compound, which has a molecular structure having a functional group containing a fluorine atom, and when heat is applied, the part of the functional group containing the fluorine atom is cut and the fluorine The atom volatilizes. Examples of such fluorine-based surfactants include MEGAFACE DS series manufactured by DIC Corporation (Chemical Industry Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)), for example MEGAFACE DS-21.

Furthermore, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound as the fluorine-based surfactant. The fluorine-based surfactants of this kind include the fluorine-based surfactants described in JP 2016-216602 A, and this content is incorporated in this specification.

關於上述化合物的重量平均分子量，較佳為3000～50000，例如為14000。上述化合物中，表示重複單元的比例之%為莫耳%。Block polymers can also be used for fluorine-based surfactants. Fluorine-based surfactants can also preferably use fluorine-containing polymer compounds, which contain repeating units derived from (meth)acrylate compounds having fluorine atoms and those derived from having 2 or more (preferably 5 One or more) repeating units of (meth)acrylate compounds of alkoxyl groups (preferably ethyleneoxy or propyleneoxy) In addition, as the fluorine-based surfactant used in the present invention, the fluorine-containing surfactant described in paragraphs 0016 to 0037 of JP 2010-032698 A, or the following compounds are also exemplified. [Chemical formula 40]

With regard to the weight average molecular weight of the above compound, it is preferably 3,000 to 50,000, for example, 14,000. In the above compound, the% representing the proportion of the repeating unit is mole %.

In addition, as the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group in the side chain can also be used. Specific examples include the compounds described in paragraphs 0050 to 0090 and paragraphs 0289 to 0295 of JP 2010-164965 A, MEGAFACERS-101, RS-102, RS-718K, RS-72 manufactured by DIC Corporation -K etc. In addition, as the fluorine-based surfactant, the compounds described in paragraphs 0015 to 0158 of JP 2015-117327 A can also be used.

Examples of nonionic surfactants include glycerin, trimethylolpropane, trimethylolethane, and these ethoxylates and propoxylates (for example, glycerol propoxylate, glycerol ethoxylate). Compounds, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether, polyethylene glycol dilaurel Ester, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF Corporation), Solsperse 20000 (manufactured by Lubrizol Japan Limited), NCW-101, NCW-1001, NCW-1002 (manufactured by Wako Pure Chemical Industries, Ltd.), PIONIN D-6112, D-6112- W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), Olfine E1010, Surfynol 104, 400, 440 (manufactured by Nissin Chemical Co., Ltd.), etc.

Examples of silicon-based surfactants include Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, Toray Silicone SH8400 (the above are Dow Corning Toray Co. , Ltd.), TSF-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (manufactured by Momentive Performance Materials Inc.), KP-341, KF-6001, KF-6002 (above Shin-Etsu Chemical Co., Ltd.), BYK307, BYK323, BYK330 (the above are manufactured by BYK Chemie GmbH), etc.

The content of the surfactant is preferably 0.01 to 1% by mass relative to the total amount of the resin composition. The upper limit is preferably 0.5% by mass or less, more preferably 0.1% by mass or less, and more preferably 0.05% by mass or less. The lower limit is preferably 0.015% by mass or more. As long as the content of the surfactant is within the above-mentioned range, the compound of formula (AS1) is prevented from being volatilized by heating and it is easy to obtain excellent coating properties. The resin composition may contain only one type of surfactant, or may contain two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Ultraviolet absorber＞＞ The resin composition can contain an ultraviolet absorber. Examples of ultraviolet absorbers include conjugated diene compounds, amino diene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyl triene compounds, and indole compounds. Dole compounds and three 𠯤 compounds, etc. Specific examples of such compounds include paragraphs 0038 to 0052 of Japanese Patent Application Publication No. 2009-217221, paragraphs 0052 to 0072 of Japanese Patent Application Publication No. 2012-208374, and paragraphs 0317 to of Japanese Patent Application Publication No. 2013-068814. The compounds described in paragraph 0334 and paragraphs 0061 to 0080 of JP 2016-162946 A are incorporated into this specification. As a commercially available product of an ultraviolet absorber, UV-503 (made by DAITO CHEMICAL CO., LTD.) etc. are mentioned, for example. In addition, as the benzotriazole compound, the MYUA series manufactured by MIYOSHI & FAT CO., LTD. (Chemical Industry Daily, February 1, 2016) can be cited. In addition, as the ultraviolet absorber, the compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967 can also be used. The content of the ultraviolet absorber is preferably 0.01 to 10% by mass in the total solid content of the resin composition, and more preferably 0.01 to 5% by mass. The resin composition may contain only one type of ultraviolet absorber, or may contain two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Antioxidant＞＞ The resin composition of the present invention can contain an antioxidant. Examples of antioxidants include phenol compounds, phosphite compounds, and thioether compounds. As the phenol compound, any phenol compound known as a phenol-based antioxidant can be used. As a preferable phenol compound, hindered phenol compound can be mentioned. A compound having a substituent at the position (ortho position) adjacent to the phenolic hydroxyl group is preferred. As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred. Moreover, it is also preferable that the antioxidant is a compound having a phenol group and a phosphite group in the same molecule. In addition, phosphorus-based antioxidants can also be preferably used as antioxidants. Examples of phosphorus antioxidants include tris[2-[[2,4,8,10-tetra(1,1-dimethylethyl)dibenzo[d,f][1,3,2] Dioxaphosphane-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tert-butyldibenzo[d,f] [1,3,2]Dioxaphosphane-2-yl)oxy]ethyl]amine and phosphite ethylbis(2,4-di-tert-butyl-6-methyl) Phenyl) and so on. Commercial products of antioxidants include, for example, Adekastab AO-20, Adekastab AO-30, Adekastab AO-40, Adekastab AO-50, Adekastab AO-50F, Adekastab AO-60, Adekastab AO-60G, Adekastab AO- 80 and Adekastab AO-330 (the above are manufactured by ADEKA CORPORATION), etc. In addition, as the antioxidant, the compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, the compounds described in International Publication No. 2017/006600, and the compounds described in International Publication No. 2017/164024 can also be used. The content of the antioxidant is preferably 0.01 to 20% by mass in the total solid content of the resin composition, and more preferably 0.3 to 15% by mass. The resin composition may contain only one type of antioxidant, or may contain two or more types. When two or more types are included, it is preferable that the total amount is within the above-mentioned range.

＜＜Other ingredients＞＞ The resin composition of the present invention may contain sensitizers, hardening accelerators, fillers, thermal hardening accelerators, plasticizers, and other auxiliary agents (for example, conductive particles, fillers, defoamers, flame retardants, etc.) as required. , Leveling agents, peeling accelerators, fragrances, surface tension regulators, chain transfer agents, etc.). By appropriately containing these components, the properties such as the physical properties of the film can be adjusted. Regarding these ingredients, for example, reference can be made to the description of Japanese Patent Application Laid-Open No. 2012-003225, paragraph 0183 and later (corresponding to US Patent Application Publication No. 2013/0034812, paragraph 0237) and the description of Japanese Patent Application Publication No. 2008-250074 The descriptions of paragraphs 0101 to 0104 and paragraphs 0107 to 0109 are incorporated into this specification. In addition, the resin composition of the present invention may contain a latent antioxidant as necessary. As a potential antioxidant, a compound in which the part that functions as an antioxidant is protected by a protective group can be mentioned, and it can be heated at 100-250°C or at 80-200°C in the presence of an acid/base catalyst. A compound that is heated to release the protective group and functions as an antioxidant. Examples of potential antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and Japanese Patent Application Publication No. 2017-008219. As a commercially available product of a potential antioxidant, ADEKA ARKLS GPA-5001 (manufactured by ADEKA CORPORATION) and the like can be cited.

For example, in the case of forming a film by coating, the viscosity (23° C.) of the resin composition of the present invention is preferably 1 to 100 mPa·s. The lower limit is more preferably 2 mPa·s or more, and more preferably 3 mPa·s or more. The upper limit is more preferably 50 mPa·s or less, more preferably 30 mPa·s or less, and particularly preferably 15 mPa·s or less.

＜Container Container＞ The storage container of the resin composition of the present invention is not particularly limited, and a known storage container can be used. In addition, for the purpose of suppressing the mixing of impurities into the raw material or resin composition as the storage container, it is also preferable to use a multilayer bottle in which the inner wall of the container is composed of 6 types of resins with 6 layers, or a bottle with 6 types of resins in a 7-layer structure. As such a container, for example, the container described in JP 2015-123351 A can be cited. In addition, for the purpose of preventing the elution of metal from the inner wall of the container, improving the storage stability of the resin composition, and suppressing component deterioration, etc., the inner wall of the container is preferably made of glass or stainless steel.

＜Use of resin composition＞ The resin composition of the present invention can be suitably used as a resin composition for forming a near-infrared cut filter or a near-infrared transmission filter. When the resin composition of the present invention is used as a resin composition for forming a near-infrared transmission filter, the resin composition of the present invention preferably further contains a color material that blocks visible light. By using this kind of resin composition, it is possible to form a near-infrared transmissive filter capable of shielding visible light and transmitting only near-infrared rays of a specific wavelength or more.

＜Preparation method of resin composition＞ The resin composition of the present invention can be prepared by mixing the aforementioned components. When preparing a resin composition, all the components can be dissolved or dispersed in a solvent at the same time to prepare a resin composition, or two or more solutions or dispersions obtained by appropriately blending each component can be prepared in advance according to the needs, and in use (At the time of coating) These are mixed and prepared as a composition.

Moreover, when the near-infrared absorbing dye represented by the formula (SQ1) is a pigment, it is preferable to include a process of dispersing the pigment when preparing the resin composition. In the process of dispersing the pigment, as the mechanical force used in the dispersion of the pigment, compression, squeezing, impact, shearing, and cavitation can be mentioned. Specific examples of these processes include bead mills, sand mills, roller mills, ball mills, pain shakers, microfluidizers, high-speed impellers, and sand mills. , Flowjet mixer, high-pressure wet micronization and ultrasonic dispersion, etc. In addition, in the pulverization of the pigment in the sand mixer (bead mill), it is better to perform the treatment under conditions that increase the pulverization efficiency by using beads with a small diameter or increasing the filling rate of the beads. Furthermore, after the crushing treatment, it is preferable to remove coarse particles by filtration, centrifugal separation, or the like. In addition, the process of dispersing the pigment and the dispersing machine can better use the "Dispersion Technology Encyclopedia, issued by JOHOKIKO CO., LTD., July 15, 2005" or "Suspension (solid/liquid dispersion system) as the center The actual comprehensive data collection of dispersion technology and industrial applications, issued by the Publishing Department of the Management Development Center, October 10, 1978", the manufacturing process and dispersion machine described in paragraph 0022 of Japanese Patent Application Publication No. 2015-157893. In addition, in the process of dispersing the pigment, a salt milling step can be used to refine the particles. The materials, equipment, processing conditions, etc. used in the salt milling step can be referred to, for example, the descriptions in Japanese Patent Application Publication No. 2015-194521 and Japanese Patent Application Publication No. 2012-046629.

In addition, when preparing the resin composition, the compound represented by formula (AS1) may be added to the resin composition alone, or may be added to the resin composition in the form of being included in any of the raw materials. Among them, it is preferable to add to the resin composition in a form that the compound represented by the formula (AS1) is included in the raw material containing the near-infrared absorbing dye represented by the formula (SQ1). According to this aspect, the compound represented by the formula (AS1) becomes easily accessible to the near-infrared absorbing dye represented by the formula (SQ1), and it is easy to obtain more significant effects of the present invention. In addition, when the near-infrared absorbing dye represented by the formula (SQ1) is a pigment, if the compound represented by the formula (AS1) is present during the crushing step represented by pigment dispersion, the compound represented by the formula (AS1) It becomes easier to access the near-infrared absorbing dye represented by the formula (SQ1), and it is easy to obtain more significant effects of the present invention. In particular, by including the formula (AS1) in the pulverization step represented by the salt mill of the pigment, a more significant effect can be obtained.

When preparing the resin composition, it is preferable to filter the resin composition with a filter for the purpose of removing foreign matter or reducing defects. As the filter, as long as it has been used for filtration purposes, etc., it can be used without particular limitation. For example, fluororesins such as polytetrafluoroethylene (PTFE), polyamide resins such as nylon (for example, nylon-6, nylon-6, 6), and polyolefin resins such as polyethylene and polypropylene (PP) are used ( Filters containing high-density, ultra-high molecular weight polyolefin resins) and other raw materials. Among these raw materials, polypropylene (including high-density polypropylene) and nylon are preferred.

The pore size of the filter is preferably 0.01 to 7.0 μm, more preferably 0.01 to 3.0 μm, and even more preferably 0.05 to 0.5 μm. If the pore size of the filter is within the above-mentioned range, fine foreign matter can be removed more reliably. Regarding the pore size of the filter, you can refer to the nominal value of the filter manufacturer. The filter can use various filters provided by NIHON PALL LTD. (DFA4201NIEY, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (formerly Nippon micro squirrel Co., Ltd.) and KITZMICROFILTER CORPORATION.

Moreover, it is also preferable to use a fibrous filter material as a filter. As a fibrous filter material, polypropylene fiber, nylon fiber, glass fiber, etc. are mentioned, for example. As commercially available products, SBP type series (SBP008, etc.) manufactured by ROKI TECHNO CO., LTD., TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) can be cited.

When using filters, you can also combine different filters (for example, the first filter and the second filter, etc.). At this time, the filtration by each filter may be performed only once, or it may be performed more than twice. In addition, filters with different pore diameters can be combined within the above-mentioned range. In addition, the filtration by the first filter is performed only on the dispersion liquid, and the second filter can also be used for filtration after mixing other components.

＜Membrane＞ Next, the film of the present invention will be described. The film of the present invention is obtained from the above-mentioned resin composition of the present invention. The film of the present invention can be preferably used as a near-infrared cut filter or a near-infrared transmission filter. In addition, the film of the present invention can also be used as a heat ray shielding filter. The film of the present invention may be a film with a pattern or a film without a pattern (flat film). In addition, the film of the present invention may be laminated on a support and used, or the film of the present invention may be peeled off from the support and used. As the support, a semiconductor substrate such as a silicon substrate or a transparent substrate can be mentioned.

In addition, a charge coupled device (CCD), a complementary metal oxide film semiconductor (CMOS), a transparent conductive film, etc. may be formed on the semiconductor substrate used as the support. In addition, a black matrix that isolates each pixel may be formed on the semiconductor substrate. In addition, an undercoat layer is provided on the semiconductor substrate as needed and in order to improve the adhesion with the upper layer, prevent the diffusion of substances, or flatten the surface of the substrate.

The transparent substrate used as the support is not particularly limited as long as it is made of a material that can transmit at least visible light. For example, a substrate made of materials such as glass and resin can be cited. Examples of resins include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polyethylene, polypropylene, and ethylene-vinyl acetate copolymers, and norbornene resins. , Acrylic resins such as polyacrylate and polymethyl methacrylate, urethane resins, vinyl chloride resins, fluororesins, polycarbonate resins, polyvinyl butyral resins and polyvinyl alcohol resins. Examples of the glass include soda lime glass, borosilicate glass, alkali-free glass, quartz glass, and copper-containing glass. Examples of copper-containing glass include copper-containing phosphate glass and copper-containing fluorophosphate glass. Commercial products can also be used for glass containing copper. Examples of commercially available products of copper-containing glass include NF-50 (manufactured by AGC TECHNO GLASS Co., Ltd.).

The thickness of the film of the present invention can be appropriately adjusted according to the purpose. The thickness of the film is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the thickness of the film is preferably 0.1 μm or more, and more preferably 0.2 μm or more.

When the film of the present invention is used as a near-infrared cut filter, the film of the present invention has a maximum absorption wavelength in the wavelength range of 700 to 1800 nm (preferably 700 to 1300 nm, more preferably 700 to 1000 nm). For better. In addition, the average transmittance of light with a wavelength of 400 to 600 nm is preferably 50% or more, more preferably 70% or more, more preferably 80% or more, and particularly preferably 85% or more. In addition, the transmittance in the entire wavelength range of 400 to 600 nm is preferably 50% or more, more preferably 70% or more, and even more preferably 80% or more. Furthermore, the film of the present invention preferably has a transmittance of 15% or less at at least one point in the wavelength range of 700 to 1800 nm (preferably 700 to 1300 nm, more preferably 700 to 1000 nm), and preferably 10% or less More preferably, 5% or less is even more preferable. _{In addition, the ratio of the maximum absorbance A 1} of the film of the present invention in the wavelength range of 400 to 600 nm _{to the absorbance A 2} in the maximum absorption wavelength, that is, A ₁ /A ₂ is preferably 0.30 or less, and more preferably 0.20 or less. Preferably, 0.15 or less is more preferable, and 0.10 or less is particularly preferable.

When the film of the present invention is used as a near-infrared transmission filter, the maximum value of the transmittance of the film of the present invention in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum transmittance in the wavelength range of 1100 to 1300 nm is 70% or more (preferably 75% or more, more preferably 80% or more). The film of the present invention used as a near-infrared transmission filter preferably satisfies either of the following (1) or (2) spectral characteristics. (1): The maximum transmittance in the wavelength range of 400～830nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1000～1300nm The minimum value is 70% or more (preferably 75% or more, more preferably 80% or more). (2): The maximum transmittance in the wavelength range of 400～950nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1100～1300nm The minimum value is 70% or more (preferably 75% or more, more preferably 80% or more).

The film of the present invention can also be used in combination with a color filter containing a color colorant. The color filter can be manufactured using a coloring composition containing a coloring agent. Examples of the color colorant include color colorants that may be included in the resin composition of the present invention. In addition, the film of the present invention may contain a coloring agent to provide a filter having functions as a near-infrared cut filter and a color filter.

When the film of the present invention is used as a near-infrared cut filter and the film of the present invention and the color filter are used in combination, it is preferable to arrange the color filter on the optical path of the film of the present invention. For example, it is preferable to laminate the film and color filter of the present invention as a laminate. On the laminate, the film of the present invention and the color filter may be adjacent to each other in the thickness direction, or may not be adjacent. When the film of the present invention and the color filter are not adjacent in the thickness direction, the film of the present invention may be formed on another support separate from the support on which the color filter is formed, or the film of the present invention may be Insert other components (for example, microlens, planarization layer, etc.) that constitute the solid-state imaging element between the color filter.

The film of the present invention can be used in various devices such as solid-state imaging devices such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Film Semiconductor), infrared sensors, and image display devices.

＜Method of manufacturing film＞ The film of the present invention can be manufactured through the step of applying the resin composition of the present invention.

As a support body, the above-mentioned can be mentioned. As a coating method of the resin composition, a well-known method can be used. For example, the drop method (drop casting); slit coating method; spray method; roll coating method; spin coating method (spin coating method); cast coating method; slit spin coating method; pre-wet method (For example, the method described in Japanese Patent Application Laid-Open No. 2009-145395); inkjet (for example, on-demand method, piezoelectric method, thermal method), nozzle jet and other ejection system printing, flexographic printing, screen printing, gravure Printing, reverse offset printing, metal mask printing and other printing methods; transfer methods using molds, etc.; nanoimprinting methods, etc. The application method based on inkjet is not particularly limited. For example, "Inkjet that can be promoted and used-Unlimited Possibilities Seen in Patent-Issued in February 2005, SB RESEARCH CO., LTD." The method shown (especially pages 115 to 133) or Japanese Patent Application Publication No. 2003-262716, Japanese Patent Application Publication No. 2003-185831, Japanese Patent Application Publication No. 2003-261827, Japanese Patent Application Publication No. 2012-126830 And the method described in JP 2006-169325 A, etc.

The resin composition layer formed by coating the resin composition can be dried (pre-baked). When performing pre-baking, the pre-baking temperature is preferably 150°C or less, more preferably 120°C or less, and even more preferably 110°C or less. The lower limit can be set to 50°C or higher, or 80°C or higher, for example. The pre-baking time is preferably 10 seconds to 3000 seconds, more preferably 40 to 2500 seconds, and even more preferably 80 to 220 seconds. Drying can be performed using a hot plate, an oven, etc.

In the method of manufacturing the film, a step of forming a pattern may also be included. As the pattern formation method, a pattern formation method using a photolithography method or a pattern formation method using dry etching can be cited, and a pattern formation method using the photolithography method is preferred. Furthermore, when the film of the present invention is used as a flat film, the step of forming a pattern may not be performed. Hereinafter, the steps of forming a pattern will be described in detail.

(In the case of using photolithography to form patterns) The pattern forming method using the photolithography method includes the step of exposing the resin composition layer formed by coating the resin composition of the present invention into a pattern (exposure step) and developing and removing the resin composition layer of the unexposed part. The step of patterning (development step) is preferable. According to needs, the step of baking the developed pattern (post-baking step) can be set. Hereinafter, each step will be described.

＜＜Exposure Step＞＞ In the exposure step, the resin composition layer is exposed in a pattern. For example, the resin composition layer can be exposed in a pattern by exposing the resin composition layer through a mask having a predetermined mask pattern using a stepper exposure machine, a scanning exposure machine, or the like. Thereby, the exposed part can be hardened.

Examples of radiation (light) that can be used for exposure include g-line and i-line. Moreover, light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light having a wavelength of 300 nm or less include KrF line (wavelength 248 nm), ArF line (wavelength 193 nm), and the like. KrF line (wavelength 248 nm) is preferred. In addition, a long-wave light source of 300 nm or more can also be used.

In addition, during exposure, light may be continuously irradiated for exposure, or pulsed may be irradiated for exposure (pulse exposure). In addition, pulse exposure refers to an exposure method in which light is repeatedly irradiated and stopped for exposure in a short-time (for example, millisecond or less) cycle. In the case of pulse exposure, the pulse width is preferably 100 nanoseconds (ns) or less, more preferably 50 nanoseconds or less, and more preferably 30 nanoseconds or less. The lower limit of the pulse width is not particularly limited, and can be set to 1 femtosecond (fs) or more, or can be set to 10 femtoseconds or more. The frequency is preferably 1 kHz or more, more preferably 2 kHz or more, and even more preferably 4 kHz or more. The upper limit of the frequency is preferably 50 kHz or less, more preferably 20 kHz or less, and even more preferably 10 kHz or less. The maximum instantaneous illuminance is ^{preferably 50,000,000 W/m 2} or more, more preferably 100,000,000 W/m ² or more, and even more preferably 200,000,000 W/m ² or more. In addition, the upper limit of the maximum instantaneous illuminance ^{is preferably 1000000000 W/m 2} or less, more preferably 800000000 W/m ² or less, and ^{more preferably 500000000 W/m 2} or less. Furthermore, the pulse width refers to the time during which the light in the pulse period is irradiated. In addition, frequency refers to the number of pulse cycles per second. In addition, the maximum instantaneous illuminance refers to the average illuminance during the time irradiated by light in the pulse period. In addition, the pulse period refers to a period in which the irradiation and stopping of light in pulse exposure is one cycle.

The irradiation amount (exposure amount) ^{is preferably 0.03 to 2.5 J/cm 2, and more} preferably 0.05 to 1.0 J/cm ² . Regarding the oxygen concentration during exposure, it can be appropriately selected. In addition to exposure in the atmosphere, for example, it can be in a low-oxygen environment with an oxygen concentration of 19% by volume or less (for example, 15% by volume, 5% by volume, or substantially oxygen-free ) Exposure can also be carried out in a high oxygen environment with an oxygen concentration exceeding 21% by volume (for example, 22% by volume, 30% by volume, or 50% by volume). In addition, the exposure illuminance can be appropriately set, and can usually be selected from the range of 1000 W/m ² to 100000 W/m ² (for example, 5000 W/m ² , 15000 W/m ² or 35000 W/m ² ). The oxygen concentration and the exposure illuminance can be appropriately combined with conditions. For example, the oxygen concentration can be 10% by ^{volume and the illuminance is 10,000 W/m 2} , the oxygen concentration is 35% by volume, and the illuminance is 20,000 W/m ² .

＜＜Development step＞＞ Next, development removes the resin composition layer in the unexposed part of the exposed resin composition layer to form a pattern. The development and removal of the resin composition layer of the unexposed part can be performed using a developer. Thereby, the resin composition layer of the unexposed part in the exposure step is dissolved in the developing solution, and only the photohardened part remains on the support. The temperature of the developer is preferably 20 to 30°C, for example. The development time is preferably 20 to 180 seconds. In addition, in order to improve the residue removal performance, the following steps may be repeated several times, that is, the developer is shaken off every 60 seconds and the developer is re-supplied.

As for the developer, an organic solvent, an alkali developer, etc. can be mentioned, and an alkali developer is preferably used. As the alkaline developer, an alkaline aqueous solution (alkali developer) obtained by diluting the alkaline agent with pure water is preferred. Examples of alkaline agents include ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, and tetraethylhydroxide. Base ammonium, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, Choline, pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]-7-undecene and other organic alkaline compounds or sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, silicon Inorganic alkaline compounds such as sodium salt and sodium metasilicate. Regarding the alkali agent, a compound with a large molecular weight is preferable in terms of environment and safety. The concentration of the alkali agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, and more preferably 0.01 to 1% by mass. In addition, the developer may also contain a surfactant. As the surfactant, nonionic surfactants are preferred. From the viewpoint of convenient transportation or storage, the developer can be temporarily made into a concentrated solution and diluted to the required concentration during use. The dilution ratio is not particularly limited, and can be set in the range of 1.5 to 100 times, for example. Furthermore, it is also preferable to wash (rinse) with pure water after development. In addition, with regard to rinsing, it is preferable to perform the rinsing liquid to the composition layer after development while rotating the support on which the composition layer after development is formed. Moreover, it is also preferable to perform it by moving the nozzle which discharges a rinse liquid from the center part of a support body to the peripheral part of a support body. At this time, when moving from the center portion of the support body of the nozzle to the peripheral edge portion, the nozzle can be moved while gradually reducing the movement speed of the nozzle. By performing rinsing in this way, the in-plane deviation of rinsing can be suppressed. In addition, even if the nozzle is moved from the central portion of the support to the peripheral edge portion while gradually reducing the rotation speed of the support, the same effect can be obtained.

After development, it is preferable to perform additional exposure treatment or heat treatment (post-baking) after drying. The additional exposure process or post-baking is a curing process after development for making it a fully cured product. The heating temperature in the post-baking is, for example, preferably 100-240°C, more preferably 200-240°C. Regarding post-baking, the film after development can be continuously or intermittently performed using a heating mechanism such as a hot plate, a convection oven (hot air circulation dryer), or a high-frequency heater so as to meet the above-mentioned conditions. When performing additional exposure processing, the light used in the exposure is preferably light with a wavelength of 400 nm or less. In addition, the additional exposure processing can be performed using the method described in Korean Patent Publication No. 10-2017-0122130.

(When dry etching is used to form patterns) The pattern formation by dry etching can be performed by a method such as: curing the resin composition layer formed by coating the resin composition on the support to form a cured layer, and then on the cured layer A patterned photoresist layer is formed, and then the patterned photoresist layer is used as a mask, and an etching gas is used to dry-etch the hardened layer. When forming the photoresist layer, it is better to perform a pre-baking process. Regarding the pattern formation by the dry etching method, refer to the description in paragraphs 0010 to 0067 of JP 2013-064993 A, and this content is incorporated into this specification.

＜Near infrared cut filter＞ The near-infrared cut filter of the present invention has the above-mentioned film of the present invention. The near-infrared cut filter of the present invention preferably has an average transmittance of light with a wavelength of 400 to 600 nm of 70% or more, more preferably 80% or more, more preferably 85% or more, and particularly preferably 90% or more. In addition, the transmittance in the entire wavelength range of 400 to 600 nm is preferably 70% or more, more preferably 80% or more, and more preferably 90% or more. In addition, the preferable range of the near-infrared shielding properties of the near-infrared cut filter differs depending on the application, but at least one point in the range of the wavelength of 700 to 1800 nm (preferably 700 to 1300 nm, more preferably 700 to 1000 nm) The transmittance is preferably 20% or less, more preferably 15% or less, and even more preferably 10% or less.

The near-infrared cut filter of the present invention may have a copper-containing layer, a dielectric multilayer film, an ultraviolet absorbing layer, and the like in addition to the film of the present invention described above. Examples of the ultraviolet absorbing layer include those described in paragraphs 0040 to 0070 and paragraphs 0119 to 0145 of International Publication No. 2015/099060. Examples of the dielectric multilayer film include the dielectric multilayer film described in paragraphs 0255 to 0259 of JP 2014-041318 A. As the layer containing copper, it is also possible to use a glass substrate (glass substrate containing copper) composed of glass containing copper or a layer containing a copper complex compound (layer containing a copper complex compound). Examples of copper-containing glass substrates include copper-containing phosphate glass and copper-containing fluorophosphate glass. Commercial products of copper-containing glass include NF-50 (manufactured by AGC TECHNO GLASS Co., Ltd.), BG-60, BG-61 (manufactured by Schott), CD5000 (manufactured by HOYA CORPORATION), etc. .

＜Near infrared transmission filter＞ The near-infrared transmission filter of the present invention has the above-mentioned film of the present invention. The near-infrared transmission filter of the present invention has a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 830 nm, and in the wavelength range of 1100 to 1300 nm The minimum transmittance is preferably 70% or more (preferably 75% or more, more preferably 80% or more). The near-infrared transmission filter of the present invention preferably satisfies either of the following (1) or (2) spectral characteristics. (1): The maximum transmittance in the wavelength range of 400～830nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1000～1300nm The minimum value is 70% or more (preferably 75% or more, more preferably 80% or more). (2): The maximum transmittance in the wavelength range of 400～950nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1100～1300nm The minimum value is 70% or more (preferably 75% or more, more preferably 80% or more).

＜Solid-state imaging device＞ The solid-state imaging element of the present invention includes the above-mentioned film of the present invention. The structure of the solid-state imaging element is not particularly limited as long as it has the structure of the film of the present invention and functions as a solid-state imaging element. For example, the following structure can be mentioned.

The structure is as follows. That is, the support has a plurality of photodiodes and polysilicon transmission electrodes that constitute the light receiving area of the solid-state imaging element, and the photodiodes and the transmission electrodes have light-receiving openings of only the photodiodes. The light-shielding film including tungsten, etc. has an element protection film including silicon nitride formed to cover the entire surface of the light-shielding film and the light-receiving portion of the photodiode on the light-shielding film, and the film of the present invention is provided on the element protection film. Furthermore, it may be a structure in which the film of the present invention has a light-condensing mechanism (for example, a micro lens, etc.. The same below) on the element protection film and the film of the present invention has a structure on the lower side (the side close to the support), or the film of the present invention has The structure of the concentrating mechanism, etc. In addition, the color filter may have a structure in which a film forming each pixel is buried in a space partitioned by a partition in a lattice shape, for example. At this time, the refractive index of the partition wall is preferably lower than the refractive index of each pixel. As an example of an imaging device having such a structure, the devices described in Japanese Patent Application Publication No. 2012-227478 and Japanese Patent Application Publication No. 2014-179577 can be cited.

＜Image display device＞ The image display device of the present invention includes the film of the present invention. Examples of the image display device include a liquid crystal display device, an organic electroluminescence (organic EL) display device, and the like. The definition or details of the image display device are described in, for example, "Electronic Display Elements (by Akio Sasaki, Kogyo Chosakai Publishing Co., Ltd., published in 1990)", "Display Elements (by Ibuki Junsho, Sangyo Tosho Publishing) Co., Ltd., issued in 1989)” and so on. In addition, the liquid crystal display device is described in, for example, "Next Generation Liquid Crystal Display Technology (Edited by Tatsuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd., 1994)". The liquid crystal display device applicable to the present invention is not particularly limited. For example, it can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology". The image display device may have a white organic EL element. As a white organic EL element, a tandem structure is preferable. Regarding the tandem structure of organic EL elements, it is described in Japanese Patent Application Publication No. 2003-045676, Supervised by Akoyoshi Mikami, "The Forefront of Organic EL Technology Development-High Brightness, High Precision, Long Lifetime, Skill Collection -", Technical Information Institute Co., Ltd., page 326 to page 328, 2008, etc. The spectrum of the white light emitted by the organic EL element is preferably the one that has strong and extremely large luminous peaks in the blue region (430-485 nm), green region (530-580 nm), and yellow region (580-620 nm). In addition to these luminous peaks, it is better to have a very large luminous peak in the red region (650-700nm).

＜Infrared sensor＞ The infrared sensor of the present invention includes the above-mentioned film of the present invention. The structure of the infrared sensor is not particularly limited as long as it functions as an infrared sensor. Hereinafter, an embodiment of the infrared sensor of the present invention will be described using drawings.

In FIG. 1, reference numeral 110 is a solid-state imaging element. A near-infrared cut filter 111 and a near-infrared transmission filter 114 are arranged on the imaging area of the solid-state imaging element 110. In addition, a color filter 112 is arranged on the near-infrared cut filter 111. A microlens 115 is arranged on the incident light hν side of the color filter 112 and the near-infrared transmission filter 114. A planarization layer 116 is formed to cover the microlens 115.

The near-infrared cut filter 111 can be formed using the resin composition of the present invention. The spectral characteristics of the near-infrared cut filter 111 are selected according to the emission wavelength of the infrared light-emitting diode (infrared LED) used. The color filter 112 is a color filter formed with pixels that transmit and absorb light of a specific wavelength in the visible region, and is not particularly limited, and conventionally known color filters for pixel formation can be used. For example, a color filter formed with pixels of red (R), green (G), and blue (B) can be used. For example, reference can be made to the description in paragraphs 0214 to 0263 of JP 2014-043556 A, and the content can be incorporated into this specification. The characteristics of the near-infrared transmission filter 114 are selected according to the emission wavelength of the infrared LED used.

In the infrared sensor shown in FIG. 1, another near infrared cut filter (other near infrared cut filter) separated from the near infrared cut filter 111 may be further disposed on the planarization layer 116. Examples of other near-infrared cut filters include those having copper-containing layers and/or dielectric multilayer films. Regarding these details, the above can be cited. In addition, as another near-infrared cut filter, a dual band pass filter can be used. [Example]

Examples are given below to illustrate the present invention more specifically. The materials, usage amount, ratio, processing content, processing sequence, etc. shown in the following examples can be appropriately changed as long as they do not deviate from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

＜Preparation of dispersions＞ After mixing the raw materials described in the following table with the blending amount (parts by mass) described in the following table, and further adding 230 mass parts of zirconia beads with a diameter of 0.3 mm, and performing a dispersion treatment for 5 hours using a paint stirrer, The beads are separated by filtration to produce a dispersion. The value described in the column of the blending amount in the following table is parts by mass. In addition, the value in the column of "NMP and DMAc content (mass ppm)" in the following table is the total of N-methylpyrrolidone (NMP) and dimethylacetamide (DMAc) in the dispersion The value of content (mass ppm).

[Table 1] Color material Pigment Derivatives Resin Solvent NMP and DMAc content (mass ppm) name Blending amount name Blending amount name Blending amount name Blending amount Dispersion 1 P-1 10 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 2 P-1-A 8 Sy-1 2 D-1 B-1 6 7 S-1 77 20 Dispersion 3 P-1-B 8 Sy-1 2 D-1 B-1 6 7 S-1 77 200 Dispersion 4 P-1-C 8 Sy-1 2 D-1 B-1 6 7 S-1 77 20 Dispersion 5 P-1-D 8 Sy-1 2 D-1 B-1 6 7 S-1 77 20 Dispersion 6 P-1 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 7 P-2 8 Sy-2 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 8 P-3 8 Sy-2 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 9 P-4 8 Sy-2 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 10 P-5 8 Sy-2 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 11 P-5 8 Sy-3 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 12 P-5 8 Sy-4 2 D-4 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 13 P-6 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 14 P-7 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 15 P-8 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 16 P-9 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 17 P-10 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 18 P-11 8 Sy-5 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 19 P-12 8 Sy-6 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 20 P-13 8 Sy-6 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 21 P-14 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 22 P-15 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 23 P-16 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 24 P-2 P-3 4 4 Sy-2 2 D-1 B-1 6 7 S-1 X-1 77 0.0025 25 Dispersion 25 P-1 8 Sy-1 2 D-1 B-1 6 7 S-1 X-2 77 0.0025 25 [Table 2] Color material Pigment Derivatives Resin Solvent NMP and DMAc content (mass ppm) name Blending amount name Blending amount name Blending amount name Blending amount Dispersion 26 P-5 8 Sy-2 Sy-3 1 1 D-1 B-1 67 S-1 X-1 77 0.0025 25 Dispersion 27 P-1-D 12 Sy-1 3 D-1 B-1 9 10.5 S-1 65.5 30 Dispersion 28 P-1-D 4 Sy-1 1 D-1 B-1 3 3.5 S-1 88.5 10 Dispersion 29 P-1-D 6 Sy-1 4 D-1 B-1 6 7 S-1 77 15 Dispersion 30 P-1-D 9 Sy-1 1 D-1 B-1 6 7 S-1 77 22.5 Dispersion 31 P-1-D 8 Sy-1 2 D-1 13 S-1 77 20 Dispersion 32 P-1-D 8 Sy-1 2 D-1 B-1 2 11 S-1 77 20 Dispersion 33 P-1-D 8 Sy-1 2 D-1 B-1 11 2 S-1 77 20 Dispersion 34 P-1-D 8 Sy-1 2 D-1 B-2 6 7 S-1 77 20 Dispersion 35 P-1-D 8 Sy-1 2 D-1 B-1 6 7 S-2 77 20 Dispersion 36 P-1-D 8 Sy-1 2 D-1 B-1 6 7 S-1 S-3 38.5 38.5 20 Dispersion 37 P-1-D 8 Sy-1 2 D-1 B-1 2.8 3.2 S-1 84 20 Dispersion 38 P-1-D 8 Sy-1 2 D-1 B-1 9.2 10.8 S-1 70 20 Dispersion 39 P-1 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.25 2500 Dispersion 40 P-1 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.025 250 Dispersion 41 P-1 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.00025 2.5 Dispersion 42 P-1 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.000025 0.25 Dispersion 43 P-1 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.0000025 0.025 Dispersion 44 P-1 8 Sy-1 2 D-1 B-1 6 7 S-1 X-1 77 0.00000025 0.0025 Dispersion 45 P-17 P-19 10.7 5.3 Sy-8 4 D-1 B-1 5.5 6.5 S-1 68 0 Dispersion 46 P-18 P-20 10.7 5.3 Sy-7 4 D-1 B-1 5.5 6.5 S-1 68 0 Dispersion 47 P-21 16 Sy-8 4 D-1 B-1 5.5 6.5 S-1 68 0 Dispersion 48 P-22 16 Sy-8 4 D-1 B-1 5.5 6.5 S-1 68 0 Dispersion 49 P-1 10 2 D-1 B-1 6 7 S-1 77 0

The abbreviations of the materials listed in the above table are as follows. (Color material)

[化學式42]

[化學式43]

P-1, P-2, P-3, P-4, P-5, P-6, P-7, P-8, P-9, P-10, P-1, P-12, P- 13. P-14, P-15, P-16: Compounds of the following structures (near infrared absorbing dyes represented by any formula (SQ1)) [Chemical formula 41]

[Chemical formula 42]

[Chemical formula 43]

P-1-A: Color material P-1-A manufactured by the following method 550 parts by mass of N-methylpyrrolidone was added with respect to 100 parts by mass of compound P-1, and the mixture was stirred at 25°C for 3 hours. Next, 300 parts by mass of methanol was added and stirred for 10 minutes, and the obtained precipitate was filtered out, washed with methanol, and dried under reduced pressure, thereby producing compounds containing P-1 and N-methyl The color material of pyrrolidone P-1-A. The content of N-methylpyrrolidone in the color material P-1-A was 250 ppm by mass.

P-1-B: Color material P-1-B manufactured by the following method 550 parts by mass of N-methylpyrrolidone was added with respect to 100 parts by mass of compound P-1, and the mixture was stirred at 25°C for 3 hours. Next, 300 parts by mass of methanol was added and stirred for 10 minutes, and the obtained precipitate was filtered out, washed with methanol, and dried under reduced pressure, thereby producing compounds containing P-1 and N-methyl The color material of pyrrolidone P-1-B. The content of N-methylpyrrolidone in the color material P-1-B was 2500 mass ppm.

P-1-C: Color material P-1-C manufactured by the following method 550 parts by mass of dimethylacetamide was added with respect to 100 parts by mass of compound P-1, and the mixture was stirred at 25°C for 3 hours. Then, 300 parts by mass of methanol was added and stirred for 10 minutes, and the obtained precipitate was filtered out, washed with methanol, and dried under reduced pressure to produce compound P-1 and dimethyl ethyl The color material of amide P-1-C. The content of dimethylacetamide in the color material P-1-C was 250 ppm by mass.

P-1-D: Color material P-1-D manufactured by the following method 550 parts by mass of N-methylpyrrolidone was added with respect to 100 parts by mass of compound P-1, and the mixture was stirred at 25°C for 3 hours. Next, 300 parts by mass of methanol was added and stirred for 10 minutes, and the obtained precipitate was filtered out, washed with methanol, and dried under reduced pressure, thereby producing compounds containing P-1 and N-methyl The color material of pyrrolidone is P-1-D1. The content of N-methylpyrrolidone in the color material P-1-D1 was 2500 mass ppm. Next, 5.3 parts by mass of color material P-1-D1, 74.7 parts by mass of grinding agent, and 14 parts by mass of binder were added to Labo Plastomill (manufactured by Toyo Seiki Seisaku-sho, Ltd.), and the temperature was controlled. It was kneaded for 2 hours so that the temperature of the kneaded product in the device was 70°C. OSHIO MICRON T-0 (average particle size (50% diameter (D50) on a volume basis) = 10 μm, manufactured by Ako Kasei Co., Ltd.) was used as the grinding agent, and diethylene glycol was used as the binder. The kneaded product after kneading and grinding was washed with 10L of water at 24°C to remove the grind and binder, and treated in a heating furnace at 80°C for 24 hours to produce compounds containing P-1 and N- Color material P-1-D for methylpyrrolidone. The content of N-methylpyrrolidone in the color material P-1-D was 250 ppm by mass.

P-17: C.I.Pigment Red254 (red pigment) P-18: C.I.Pigment Blue15:6 (blue pigment) P-19: C.I.Pigment Yellow139 (yellow pigment) P-20: C.I.Pigment Violet23 (purple pigment) P-21: Irgaphor Black (manufactured by BASF, bisbenzofuranone compound, organic black colorant) P-22: Limogen Black (manufactured by BASF, perylene compound, organic black colorant)

[化學式45]

(Pigment Derivatives) Sy-1～Sy-8: Compounds of the following structure [Chemical formula 44]

[Chemical formula 45]

D-4：下述結構的樹脂（重量平均分子量=7500，所附記之數值表示重複單元的莫耳比） [化學式47]

B-1：下述結構的樹脂（重量平均分子量=26000，所附記之數值表示重複單元的莫耳比） [化學式48]

B-2：下述結構的樹脂（重量平均分子量=10000，在主鏈上所附記之數值表示重複單元的莫耳比。） [化學式49]

(Resin) D-1: Block type resin with the following structure (amine value=90mgKOH/g, quaternary ammonium salt value=30mgKOH/g, weight average molecular weight=9800). The numerical value attached to the main chain indicates the molar ratio of the repeating unit. [Chemical formula 46]

D-4: Resin with the following structure (weight average molecular weight=7500, and the attached value represents the molar ratio of the repeating unit) [Chemical formula 47]

B-1: Resin with the following structure (weight average molecular weight = 26000, the attached value represents the molar ratio of the repeating unit) [Chemical formula 48]

B-2: Resin with the following structure (weight average molecular weight = 10000, and the numerical value attached to the main chain represents the molar ratio of the repeating unit.) [Chemical formula 49]

(Solvent) S-1: Propylene glycol methyl ether acetate (PGMEA) X-1: N-Methylpyrrolidone (NMP)

<Preparation of resin composition> The raw materials described in the following table were mixed to prepare a resin composition. The value described in the column of the blending amount in the following table is parts by mass. In addition, the value in the column of "NMP and DMAc content (mass ppm)" in the following table is the ratio of N-methylpyrrolidone (NMP) and dimethylacetamide (DMAc) in the resin composition The value of the total content (mass ppm).

[table 3] Dispersions Polymeric compound Resin Photopolymerization initiator additive Surfactant Polymerization inhibitor Solvent NMP and DMAc content (mass ppm) name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount Example 101 Dispersion 1 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 102 Dispersion 2 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 103 Dispersion 3 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 80 Example 104 Dispersion 4 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 105 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 106 Dispersion 6 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 107 Dispersion 7 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 108 Dispersion 8 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 109 Dispersion 9 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 110 Dispersion 10 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 111 Dispersion 11 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 112 Dispersion 12 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 113 Dispersion 13 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 114 Dispersion 14 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 115 Dispersion 15 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 116 Dispersion 16 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 117 Dispersion 17 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 118 Dispersion 18 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 119 Dispersion 19 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 120 Dispersion 20 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 121 Dispersion 21 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 122 Dispersion 22 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 123 Dispersion 23 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 124 Dispersion 24 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 125 Dispersion 25 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 126 Dispersion 26 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 10 Example 127 Dispersion 27 26.7 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 62.5 8 Example 128 Dispersion 28 80 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 9.2 8 Example 129 Dispersion 29 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 6 Example 130 Dispersion 30 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 9 [Table 4] Dispersions Polymeric compound Resin Photopolymerization initiator additive Surfactant Polymerization inhibitor Solvent NMP and DMAc content (mass ppm) name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount Example 131 Dispersion 31 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 132 Dispersion 32 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 133 Dispersion 33 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 134 Dispersion 34 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 135 Dispersion 35 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 136 Dispersion 36 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 137 Dispersion 37 40 M-1 5.6 B-1 7 I-1 1 Su-1 0.0005 In-1 0.02 S-1 46.4 8 Example 138 Dispersion 38 40 M-1 5.6 B-1 1.4 I-1 1 Su-1 0.0005 In-1 0.02 S-1 52 8 Example 139 Dispersion 39 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 1000 Example 140 Dispersion 40 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 100 Example 141 Dispersion 41 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 1 Example 142 Dispersion 42 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 0.1 Example 143 Dispersion 43 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 0.01 Example 144 Dispersion 44 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 0.001 Example 145 Dispersion 5 40 M-1 7.5 B-1 2.3 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 146 Dispersion 5 40 M-1 3.5 B-1 6.3 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 147 Dispersion 5 40 M-2 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 148 Dispersion 5 40 M-3 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 149 Dispersion 5 40 M-4 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 150 Dispersion 5 40 M-5 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 151 Dispersion 5 40 M-1 M-3 2.8 2.8 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 152 Dispersion 5 40 M-1 5.6 B-2 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 153 Dispersion 5 40 M-1 5.6 B-3 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 154 Dispersion 5 40 M-1 5.6 B-1 B-2 2.1 2.1 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 155 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 156 Dispersion 5 40 M-1 5.6 B-1 4.2 I-2 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 157 Dispersion 5 40 M-1 5.6 B-1 4.2 I-3 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 158 Dispersion 5 40 M-1 5.6 B-1 4.2 I-4 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 159 Dispersion 5 40 M-1 5.6 B-1 4.2 I-5 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 160 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 I-2 0.5 0.5 Su-1 0.0005 In-1 0.02 S-1 49.2 8 [table 5] Dispersions Polymeric compound Resin Photopolymerization initiator additive Surfactant Polymerization inhibitor Solvent NMP and DMAc content (mass ppm) name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount Example 161 Dispersion 5 40 M-1 5.5 B-1 4 I-1 1 A-1 0.2 Su-1 0.0005 In-1 0.02 S-1 49.3 8 Example 162 Dispersion 5 40 M-1 5.5 B-1 4 I-1 1 A-2 0.2 Su-1 0.0005 In-1 0.02 S-1 49.3 8 Example 163 Dispersion 5 40 M-1 5.5 B-1 4 I-1 1 A-3 0.2 Su-1 0.0005 In-1 0.02 S-1 49.3 8 Example 164 Dispersion 5 40 M-1 5.5 B-1 4 I-1 1 A-4 0.2 Su-1 0.0005 In-1 0.02 S-1 49.3 8 Example 165 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.00025 In-1 0.02 S-1 49.2 8 Example 166 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.001 In-1 0.02 S-1 49.2 8 Example 167 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-2 0.0005 In-1 0.02 S-1 49.2 8 Example 168 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-3 0.0005 In-1 0.02 S-1 49.2 8 Example 169 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-4 0.0005 In-1 0.02 S-1 49.2 8 Example 170 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 8 Example 171 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-2 0.02 S-1 49.2 8 Example 172 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.002 S-1 49.2 8 Example 173 Dispersion 5 40 M-1 5.6 B-1 4.1 I-1 1 Su-1 0.0005 In-1 0.1 S-1 49.2 8 Example 174 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 S-2 24.6 24.6 8 Example 175 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 S-3 24.6 24.6 8 Example 176 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-2 49.2 8 Example 177 Dispersion 49 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 X-1 49.1 0.1 1000 Example 178 Dispersion 49 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 X-1 49.2 0.0001 1 Example 179 Dispersion 49 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 X-1 49.2 0.00001 0.1 Example 180 Dispersion 49 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 X-1 49.2 0.0000001 0.001 [Table 6] Dispersions Polymeric compound Resin Photopolymerization initiator additive Surfactant Polymerization inhibitor Solvent NMP and DMAc content (mass ppm) name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount name Blending amount Example 181 Dispersion 49 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 X-2 49.2 0.1 1000 Example 182 Dispersion 49 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 X-1 X-2 49.2 0.001 0.001 20 Example 183 Dispersion 5 Dispersion 45 Dispersion 46 20 15 15 M-1 4.1 B-1 0.7 I-1 1 Su-1 0.0005 In-1 0.02 S-1 44.2 4 Example 184 Dispersion 5 Dispersion 46 Dispersion 47 20 10 20 M-1 4.1 B-1 0.7 I-1 1 Su-1 0.0005 In-1 0.02 S-1 44.2 4 Example 185 Dispersion 5 Dispersion 46 Dispersion 48 20 10 20 M-1 4.1 B-1 0.7 I-1 1 Su-1 0.0005 In-1 0.02 S-1 44.2 4 Example 186 Dispersion 5 40 M-1 5.6 B-1 4.2 I-1 1 In-1 0.02 S-1 49.2 8 Comparative example 1 Dispersion 49 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 49.2 0 Comparative example 2 Dispersion 49 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 X-1 49.2 0.00000001 0.0001 Comparative example 3 Dispersion 49 40 M-1 5.6 B-1 4.2 I-1 1 Su-1 0.0005 In-1 0.02 S-1 X-1 49.2 1 10000

The abbreviations of the materials listed in the above table are as follows.

(Dispersions) Dispersion 1～49: The above dispersion 1～49

(Polymerizable compound) M-1: NK EsterA-TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.) M-2: ARONIX M-350 (manufactured by TOAGOSEI CO., LTD.) M-3: NK EsterA-TMMT (manufactured by Shin-Nakamura Chemical Co., Ltd.) M-4: ARONIX M-403 (manufactured by TOAGOSEI CO., LTD.) M-5: ARONIX M-510 (manufactured by TOAGOSEI CO., LTD.)

(Resin) B-1, B-2: The above-mentioned resins B-1, B-2 B-3: Resins with the following structure (weight average molecular weight = 10000, the numerical value attached to the main chain represents the mole of the repeating unit Than.) [Chemical formula 50]

(Photopolymerization initiator) I-1: IRGACURE-907 (manufactured by BASF) I-2: IRGACURE-OXE01 (manufactured by BASF) I-3: IRGACURE-OXE02 (manufactured by BASF) I-4, I-5 : A compound of the following structure [Chemical formula 51]

(additive) A-1: 4,4’-bis(diethylamino)benzophenone (sensitizer) A-2: Irganox1010 (made by BASF, antioxidant) A-3: EX-611 (manufactured by Nagase ChemteX Corporation, epoxy hardener) A-4: KBM-502 (manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent)

Su-2：FtergentFTX218（Neos Corporation製） Su-3：MEGAFACEF-554（DIC Corporation製） Su-4：KF-6001（Shin-Etsu Chemical Co., Ltd.製）(Surfactant) Su-1: A compound of the following structure (Mw=14000, in the following formula, the percentage of the repeating unit is represented by mole%.) [Chemical formula 52]

Su-2: FtergentFTX218 (manufactured by Neos Corporation) Su-3: MEGAFACEF-554 (manufactured by DIC Corporation) Su-4: KF-6001 (manufactured by Shin-Etsu Chemical Co., Ltd.)

(Polymerization inhibitor) In-1: p-methoxyphenol In-2: 1,4-Benzoquinone

(Solvent) S-1: Propylene glycol methyl ether acetate (PGMEA) S-2: Propylene glycol methyl ether (PGME) S-3: Cyclohexanone X-1: N-Methylpyrrolidone (NMP) X-2: Dimethylacetamide (DMAc)

<Performance evaluation> (Light resistance) Using a spin coater (manufactured by Mikasa Corporation), each resin composition was coated on a glass substrate so that the film thickness after prebaking became 0.8 μm to form a coating film. Next, after 120 seconds using a hot plate was heated (pre-baked) at 100 deg.] C, using an i-line stepper exposure apparatus FPA-3000i5 + (Canon Inc.) at a exposure amount of 1000mJ / cm ² to the entire After the surface was exposed, it was heated again at 200°C for 300 seconds (post-baking) using a hot plate to obtain a film. The obtained film was placed in a light resistance tester (illuminance: 5 thousand Lx, temperature: 50°C, humidity: 50%) for 6 months, and then a light resistance test was carried out. For the film before and after the light resistance test, measure the light transmittance T% at a wavelength of 400 to 1300 nm, and obtain the difference ΔT%=|T% (before the light resistance test)-T% (after the light resistance test) |, and evaluated the light resistance based on the following criteria. 5: ΔT%＜3% 4:3%≤ΔT%＜5% 3:5%≤ΔT%＜10% 2:10%≤ΔT%＜20% 1:20%≤ΔT%

(Storage stability) After storing the newly manufactured resin composition at a temperature of 7°C for 9 months, it was spin-coated on an 8-inch (20.32cm) using CLEAN TRACK ACT-8 (manufactured by Tokyo Electron Limited) On the silicon wafer, preheating (prebaking) was performed at 100°C for 120 seconds to produce a film with a thickness of 0.8μm. The defect inspection device ComPLUS3 manufactured by Applied Materials Technology was used to inspect the silicon wafer with the film formed to detect the defect, and the number of defects of 1μm or more ^{per 2462cm 2 was extracted.} 5: The number of defects is less than 5 4: The number of defects is more than 5 and less than 20 3: The number of defects is more than 20 and less than 50 2: The number of defects is more than 50 and less than 1001: The number of defects is more than 100

(Coatability) Use CLEAN TRACK ACT-8 (manufactured by Tokyo Electron Limited) to spin-coat the newly manufactured resin composition on an 8-inch (20.32cm) silicon wafer, and then apply it at 100°C for 120 seconds Pre-heating (pre-baking) to produce a film with a thickness of 0.8μm, and use the i-line stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.) to expose the entire surface with an exposure amount of ^{1000mJ/cm 2} , The heating plate was used again at 200°C for 300 seconds (post-baking) to obtain the film. Using the stylus type film thickness system DEKTAK (manufactured by Bluker), the film thickness of the center part and the part 2cm from the outer periphery of the obtained film was evaluated, and the film thickness of the center part of the film (FTcenter) and the film thickness of 2cm from the outer periphery were calculated. The ratio of partial film thickness (FTedge) (FTcenter/FTedge) was evaluated based on the following criteria. A: 0.9＜FTcenter/FTedge＜1.1 B: 0.9≥FTcenter/FTedge or 1.1≤FTcenter/FTedge

[Table 7] Evaluation results Evaluation results Light fastness Storage stability Coatability Light fastness Storage stability Coatability Example 101 4 4 A Example 146 5 5 A Example 102 5 4 A Example 147 5 5 A Example 103 5 4 A Example 148 5 5 A Example 104 5 4 A Example 149 5 5 A Example 105 5 5 A Example 150 5 5 A Example 106 4 4 A Example 151 5 5 A Example 107 4 4 A Example 152 5 5 A Example 108 4 4 A Example 153 5 5 A Example 109 4 4 A Example 154 5 5 A Example 110 4 4 A Example 155 5 5 A Example 111 4 4 A Example 156 5 5 A Example 112 4 4 A Example 157 5 5 A Example 113 4 4 A Example 158 5 5 A Example 114 4 4 A Example 159 5 5 A Example 115 4 4 A Example 160 5 5 A Example 116 4 4 A Example 161 5 5 A Example 117 4 4 A Example 162 5 5 A Example 118 4 4 A Example 163 5 5 A Example 119 4 4 A Example 164 5 5 A Example 120 4 4 A Example 165 5 5 A Example 121 4 4 A Example 166 5 5 A Example 122 4 4 A Example 167 5 5 A Example 123 4 4 A Example 168 5 5 A Example 124 4 4 A Example 169 5 5 A Example 125 4 4 A Example 170 5 5 A Example 126 4 4 A Example 171 5 5 A Example 127 5 5 A Example 172 5 5 A Example 128 5 5 A Example 173 5 5 A Example 129 5 5 A Example 174 5 5 A Example 130 5 5 A Example 175 5 5 A Example 131 5 5 A Example 176 5 5 A Example 132 5 5 A Example 177 5 5 A Example 133 5 5 A Example 178 4 4 A Example 134 5 5 A Example 179 4 4 A Example 135 5 5 A Example 180 3 5 A Example 136 5 5 A Example 181 5 3 A Example 137 5 5 A Example 182 4 4 A Example 138 5 5 A Example 183 4 4 A Example 139 5 3 A Example 184 4 4 A Example 140 4 4 A Example 185 4 4 A Example 141 4 4 A Example 186 4 4 B Example 142 4 4 A Comparative example 1 1 5 A Example 143 3 4 A Comparative example 2 2 5 A Example 144 3 5 A Comparative example 3 5 1 A Example 145 5 5 A

As shown in the above table, the examples are excellent in the evaluation of light resistance and storage stability. Furthermore, the coatability is also good. In Comparative Example 2, even if the content of N-methylpyrrolidone was changed to 0.0008 ppm and evaluated in the same manner, the same results as in Comparative Example 2 were obtained. In Comparative Example 3, even if the content of N-methylpyrrolidone was changed to 1500 ppm and evaluated in the same manner, the same results as in Comparative Example 3 were obtained.

(Example 1001) Using a spin coating method, the resin composition of Example 101 was coated on a silicon wafer so that the film thickness after film formation became 1.0 μm. Next, it heated at 100 degreeC for 2 minutes using a hotplate. Next, using an i-line stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.), exposure was performed at an exposure amount of ^{1000 mJ/cm 2.} Then, it was heated at 200°C for 5 minutes to form a near-infrared cut filter. Next, using a spin coating method, the red composition was coated on the near-infrared cut filter so that the film thickness after film formation became 1.0 μm. Next, it heated at 100 degreeC for 2 minutes using a hotplate. Next, using an i-line stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.), ^{exposure was performed at an exposure amount of 1000 mJ/cm 2} through a mask having a Bayer pattern of 2 μm square. Next, a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) was used to perform spin immersion development at 23° C. for 60 seconds. Then, it was rinsed with a rotary shower, and rinsed with pure water. Next, using a hot plate, heating was performed at 200°C for 5 minutes to pattern the red composition on the near-infrared cut filter. In the same way, the green composition and the blue composition were patterned in sequence, and colored patterns of red, green, and blue were formed, thereby fabricating a structure. The structure is assembled in the solid-state imaging element according to a known method. The solid-state imaging element has better image recognition capabilities. In addition, the incident angle dependence is good.

The red composition, green composition, and blue composition used in Example 1001 are shown below.

(Red composition) After mixing and stirring the following components, they were filtered with a nylon filter (manufactured by NIHON PALL LTD.) with a pore size of 0.45 μm to prepare a red composition. Red pigment dispersion……51.7 parts by mass Resin 1……0.6 parts by mass Polymerizable compound 2……0.6 parts by mass Photopolymerization initiator 1...0.4 parts by mass Surfactant 1……4.2 parts by mass Ultraviolet absorber (UV-503, manufactured by DAITO CHEMICAL CO., LTD.)... 0.3 parts by mass Propylene glycol monomethyl ether acetate (PGMEA)...... 42.6 parts by mass

(Green composition) After mixing and stirring the following components, they were filtered with a nylon filter (manufactured by NIHON PALL LTD.) with a pore size of 0.45 μm to prepare a green composition. Green pigment dispersion...73.7 parts by mass Resin 1……0.3 parts by mass Polymerizable compound 1...1.2 parts by mass Photopolymerization initiator 1...0.6 parts by mass Surfactant 1……4.2 parts by mass Ultraviolet absorber (UV-503, manufactured by DAITO CHEMICAL CO., LTD.)...0.5 parts by mass PGMEA……19.5 parts by mass

(Blue composition) After mixing and stirring the following components, they were filtered with a nylon filter (manufactured by NIHON PALL LTD.) with a pore size of 0.45 μm to prepare a blue composition. Blue pigment dispersion...44.9 parts by mass Resin 1……2.1 parts by mass Polymerizable compound 1...1.5 parts by mass Polymerizable compound 2……0.7 parts by mass Photopolymerization initiator 1……0.8 parts by mass Surfactant 1……4.2 parts by mass Ultraviolet absorber (UV-503, manufactured by DAITO CHEMICAL CO., LTD.)... 0.3 parts by mass ・PGMEA……45.8 parts by mass

The raw materials used in the red composition, green composition, and blue composition are as follows.

・The red pigment dispersion liquid was mixed with a bead mill (zirconia beads 0.3mm diameter), including 9.6 parts by mass CIPigment Red254, 4.3 parts by mass CIPigment Yellow139, and 6.8 parts by mass dispersant (Disperbyk-161, BYK-Chemie GmbH Company-made) and 79.3 parts by mass of PGMEA mixture were mixed and dispersed for 3 hours to prepare a pigment dispersion. Furthermore, a high-pressure dispersion machine NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) with a pressure reducing mechanism was further used, and the dispersion treatment was performed at a flow rate of 500 g/min under a pressure of ^{2000 kg/cm 3.} This dispersion treatment was repeated 10 times to obtain a red pigment dispersion liquid.

・The green pigment dispersion liquid was mixed with a bead mill (zirconia beads 0.3mm diameter), including 6.4 parts by mass of CIPigment Green36, 5.3 parts by mass of CIPigment Yellow 150, and 5.2 parts by mass of dispersant (Disperbyk-161, BYK Chemie GmbH) Manufacture) and 83.1 parts by mass of PGMEA mixed liquid and mixed and dispersed for 3 hours, thereby preparing a pigment dispersion liquid. Furthermore, a high-pressure dispersion machine NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) with a pressure reducing mechanism was further used, and the dispersion treatment was performed at a flow rate of 500 g/min under a pressure of ^{2000 kg/cm 3.} This dispersion treatment was repeated 10 times to obtain a green pigment dispersion liquid.

・The blue pigment dispersion liquid was mixed with a bead mill (zirconia beads 0.3mm diameter), including 9.7 parts by mass of CIPigment Blue 15:6, 2.4 parts by mass of CIPigment Violet 23, and 5.5 parts by mass of dispersant (Disperbyk-161, BYK -Chemie GmbH) and a mixture of 82.4 parts by mass of PGMEA were mixed and dispersed for 3 hours to prepare a pigment dispersion. Furthermore, a high-pressure dispersion machine NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) with a pressure reducing mechanism was further used, and the dispersion treatment was performed at a flow rate of 500 g/min under a pressure of ^{2000 kg/cm 3.} This dispersion treatment was repeated 10 times to obtain a blue pigment dispersion liquid.

・Polymerizable compound 1: KAYARAD DPHA (manufactured by NIPPON KAYAKU CO., Ltd.) ・Polymerizable compound 2: a compound of the following structure [Chemical formula 53]

・Resin 1: Resin with the following structure (acid value: 70mgKOH/g, Mw=11000, ratio of structural units is molar ratio) [Chemical formula 54]

・Photopolymerization initiator 1: IRGACURE-OXE01 (manufactured by BASF)

・Surfactant 1: 1% by mass PGMEA solution of the following mixture (Mw=14000). In the following formula, the% representing the proportion of the repeating unit is mole %. [Chemical formula 55]

110: solid-state image sensor 111: Near infrared cut filter 112: color filter 114: Near infrared transmission filter 115: Micro lens 116: Planarization layer hν: incident light

Fig. 1 is a schematic diagram showing an embodiment of an infrared sensor.

no.

Claims (16)

A resin composition containing a near-infrared absorbing dye represented by the following formula (SQ1), a compound represented by the following formula (AS1) in a range of 0.001 mass ppm to 1000 mass ppm, and a resin,

In the formula, Rs ¹¹⁹ and Rs ¹²⁰ each independently represent a substituent, A ¹ and A ² each independently represent an oxygen atom or -N(Rs ¹²⁵ )-, Rs ¹²¹ to Rs ¹²⁵ each independently represent a hydrogen atom or a substituent, E ¹ and E ² each independently represent a carbon atom, a boron atom, or -C(=O)-. When E ¹ is a carbon atom, ns32 is 2, and when E ¹ is a boron atom, ns32 is 1. When E ¹ is -C(=O)-, ns32 is 0, when E ² is a carbon atom, ns33 is 2, and when E ² is a boron atom, ns33 is 1, and E ² is -C( =O)-In the case of ns33 is 0, ns30 and ns31 each independently represent an integer from 0 to 5, and when ns30 is 2 or more, the plural Rs ¹¹⁹ may be the same or different, and 2 of the ^{plural Rs 119} Rs ¹¹⁹ can be bonded to each other to form a ring. When ns31 is 2 or more, a plurality of Rs ¹²⁰ may be the same or different. ^{Two Rs 120s} of a plurality of Rs ¹²⁰ may be bonded to each other to form a ring. In ns32 is 2, the two Rs ¹²¹ may be the same also different, two Rs ¹²¹ may be bonded to each other to form a ring, in ns33 it is 2, the two Rs ¹²² may be the same also different, two Rs ¹²² They can be bonded to each other to form a ring, Ar ¹⁰⁰ represents an aryl group or heteroarylene group, ns100 represents an integer of 0-2,

In the formula (AS1), R ^A1 represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or a heterocyclic group, and R ^A2 and R ^A3 each independently represent an alkyl group, an alkenyl group, an aryl group or a heterocyclic group, and R ^A1 and R ^A2 may be bonded to each other to form a ring, and R ^A2 and R ^A3 may be bonded to each other to form a ring. The resin composition according to claim 1, wherein ^{at least one of RA2} and ^RA3 in the formula (AS1) is an alkyl group. The resin composition according to claim 1, wherein ^RA1 to ^{RA3 in} formula (AS1) each independently represent an alkyl group or ^RA3 represents an alkyl group, and ^RA2 and ^RA3 are bonded to each other to form a ring. The resin composition according to claim 1, wherein The compound represented by the aforementioned formula (As1) is at least one selected from the group consisting of N-methylpyrrolidone and dimethylacetamide. The resin composition according to any one of claims 1 to 4, wherein the near-infrared absorbing dye represented by the aforementioned formula (SQ1) is a near-infrared absorbing dye represented by the formula (SQ2),

In the formula, L ⁴¹ to L ⁴⁴ each independently represent an alkylene group, an alkynylene group, an aryl group, a heterocyclic group or a divalent group obtained by bonding two or more of these groups, Z ⁴¹ and Z ⁴² Each independently represents a single bond, -O-, -C(=O)-, -S-, -N(R ^N1 )-, -S(=O)- or -S(=O) ₂ -, A ⁴¹ And A ⁴² each independently represent an oxygen atom or -N(R ^N2 )-, R ^N1 and R ^N2 each independently represent a hydrogen atom, an alkyl group or an aryl group, Rs ¹⁴¹ and Rs ¹⁴² each independently represent a substituent, ns41 and ns42 each independently represent an integer of 0 to 5, in a case where ns41 is 2 or more, plural Rs ¹⁴¹ may be the same can also be different, a plurality of Rs ¹⁴¹ in which two Rs ¹⁴¹ may be bonded to each other to form a ring, in ns42 is 2 or more, plural Rs ¹⁴² also may be the same or different, a plurality of Rs ¹⁴² in which two Rs ¹⁴² may be bonded to each other to form a ring, wherein L ⁴¹ ~ L ⁴⁴ is an alkylene group, Z ⁴¹ When and Z ⁴² are a single bond, and A ⁴¹ and A ⁴² are -N(R ^N2 )-, at least one of ns41 and ns42 is an integer of 1 to 5. The resin composition according to any one of claims 1 to 4, wherein the near-infrared absorbing dye represented by the aforementioned formula (SQ1) is a near-infrared absorbing dye represented by the formula (SQ3),

In the formula, Q ¹ , Q ⁴ , Q ⁵ , Q ⁸ , Q ¹¹ , Q ¹⁴ , Q ¹⁵ and Q ¹⁸ each independently represent a carbon atom or a nitrogen atom, and Rs ¹ to Rs ⁵ , Rs ¹¹ to Rs ¹⁵ each independently Represents a hydrogen atom, an alkyl group, a sulfonic acid group, -SO ₃ M ¹ or a halogen atom, M ¹ represents an inorganic cation or an organic cation, Rs ² and Rs ³ , Rs ¹² and Rs ¹³ can be bonded to each other to form a ring, Rs ²¹ ~Rs ²⁸ and Rs ³¹ to Rs ³⁸ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, a hydroxyl group, -NR ^X1 R ^X2 , a sulfonic acid group, and- SO ₃ M ² , -SO ₂ NR ^X1 R ^X2 , -COOR ^X3 , -CONR ^X1 R ^X2 , nitro group, cyano group or halogen atom, M ² represents inorganic cation or organic cation, R ^X1 ～R ^X3 each independently represent A hydrogen atom, an alkyl group, an aryl group, an acyl group or a heterocyclic group, R ^X1 and R ^X2 can be bonded to each other to form a ring, and adjacent groups among ^{Rs 21} to Rs ²⁸ and Rs ³¹ to Rs ^{38 can be mutually} Bonded to form a ring, when Q ¹ is a nitrogen atom, Rs ²¹ does not exist, when Q ⁴ is a nitrogen atom, Rs ²⁴ does not exist, and when Q ⁵ is a nitrogen atom, Rs ^{25 does not exist} , When Q ⁸ is a nitrogen atom, there is no Rs ²⁸ , when Q ¹¹ is a nitrogen atom, there is no Rs ³¹ , when Q ¹⁴ is a nitrogen atom, there is no Rs ³⁴ , and Q ¹⁵ is In the case of a nitrogen atom, Rs ³⁵ does not exist, and when Q ¹⁸ is a nitrogen atom, Rs ³⁸ does not exist. The resin composition according to any one of claims 1 to 4, wherein The aforementioned resin system includes a resin having a basic group. The resin composition according to any one of claims 1 to 4, wherein The aforementioned resin system includes an alkali-soluble resin. The resin composition according to any one of claims 1 to 4, which further includes a polymerizable compound and a photopolymerization initiator. The resin composition according to any one of claims 1 to 4, which further includes a color material that transmits near-infrared rays and shields visible light. A film obtained by using the resin composition according to any one of claims 1 to 10. A near-infrared cut filter having the film according to claim 11. A near-infrared transmission filter having the film according to claim 11. A solid-state imaging device having the film described in claim 11. An image display device having the film according to claim 11. An infrared sensor having the film according to claim 11.

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