TW202101095A - Interconnection system and method of manufacturing the same, and substrate - Google Patents

Abstract

Interconnection systems are provided that include a plurality of core segments for use in electrically connecting two substrates. The system provides redundant and reliable electrical interconnection between two surfaces within a device, and such surfaces may be oriented face-to-face. In an exemplary Liquid Crystal Assembly device, the backplane, which contains the pixel display circuitry, and the cover glass, which has a transparent conductive layer which requires application of electrical potential, are electrically connected using the system. A crossover connection at the wafer of the assembly is achieved using the system and methods herein with a high degree of accuracy and scalability. A single substrate having electrical connectors and methods of manufacturing the interconnection systems are also provided.

Description

Interconnection system and its manufacturing method and substrate

The invention relates to an interconnection system for electronic devices and a manufacturing method thereof. More specifically, the present invention relates to an interconnection system using a deformable electrical connector and a manufacturing method thereof. The deformable electrical connector provides redundant contact points for various devices including Liquid Crystal Assembly (LCA) .

In electronic devices, the Interconnection structure is realized by direct metal-to-metal contact. For example, metal studs (metal studs) of aluminum, copper, silver, gold, etc. are provided on each side of the bonding interface. However, in order to form this bond, a direct metal-to-metal interconnect structure usually requires ultra-high temperature (for example, 300° C. or higher) and ultra-high pressure (for example, the bonding force of 200 mm wafers is greater than 50 kN). Therefore, the available devices and substrate types have many limitations. For example, there may be temperature limitations because some substrates are not suitable for temperatures greater than 200° C. or cannot withstand the required bonding force due to the fragility of the device. The amount of high temperature and/or high pressure may limit the uniformity, color, and brightness that can be achieved. The amount of high temperature may also increase the wafer process time due to the heating and cooling operations associated with such temperature.

The traditional liquid crystal display assembly realizes its interconnection structure through the offset between the backplane device and the connected glass cover, so that the glass cover has a protrusion. This protrusion is usually connected to the circuit board by soldering or conductive paste.

The known internal crossover form of liquid crystal display components includes polymer spheres suspended in epoxy (Epoxy) with a metal coating. For example, the conductive/contact area of the back plate is coated with epoxy resin carrying spheres, and when the glass cover plate is coated, the spheres contact two surfaces. However, there are some problems with components currently using this connection method. First, it is difficult to find spheres with a diameter of less than 3 µm, which leads to increased manufacturing costs associated with them. In addition, in practice, only when the ball is crushed to a height of about 1.5μm, can the epoxy resin with the ball be used. Accordingly, the metal covering the sphere is often damaged and may crack, resulting in loss of electrical interconnectivity. Since the ball system is embedded in the epoxy resin, the integrity of the electrical connection will be subject to additional resistance and interference. In addition, these spheres may require more expensive precious metals, (eg, gold) to avoid oxide growth.

In view of the foregoing, the present invention provides an interconnection system, a manufacturing method thereof, and a substrate that meet the foregoing requirements.

An interconnection system according to an embodiment of the present invention includes: a first substrate including a plurality of first deformable electrical connectors, the first deformable electrical connectors including a plurality of first core segments and are disposed on the A first metal layer on the first core segment, wherein each of the first core segments has a Young coefficient smaller than that of the first metal layer; and a second substrate including a plurality of second deformable electrodes Connector, the second deformable electrical connectors include a plurality of second core segments and a second metal layer disposed on the second core segments, wherein each of the second core segments has a Young coefficient less than A Yang-type coefficient of the second metal layer.

In one embodiment, the first deformable electrical connectors are formed substantially perpendicular to the second deformable electrical connectors. In an embodiment, the first deformable electrical connectors are coupled to a first common contact, the first common contact is associated with the first substrate, and the second deformable electrical connectors are coupled to A second common contact, the second common contact is associated with the second substrate. In one embodiment, the first core segments are formed of a material selected from the group consisting of polymer and epoxy resin. In one embodiment, the first metal layer is formed of a material selected from the group of aluminum, nickel, titanium, copper, gold, tungsten, silver, and indium tin oxide. In one embodiment, the second core segments are formed of a material selected from the group consisting of polymer and epoxy resin. In one embodiment, the second gold layer is formed of a material selected from the group of aluminum, nickel, titanium, copper, gold, tungsten, silver, and indium tin oxide. In one embodiment, when the first deformable electrical connectors and the second deformable electrical connectors are squeezed together, the first deformable electrical connectors and the second deformable electrical connectors The connector forms a plurality of redundant electrical contact points, causing a deformation at the intersecting points of the first deformable electrical connectors and the second deformable electrical connectors. In an embodiment, the first core segments are formed of a material that can deform at 60-80 degrees Fahrenheit. In an embodiment, the first metal layer is formed of a material that can deform at 60-80 degrees Fahrenheit.

According to a method of manufacturing an interconnection system according to an embodiment of the present invention, the method includes the steps of: providing a first substrate; forming a plurality of first core segments on the first substrate in a desired pattern and shape; The metal layer is disposed on the first core segments in the first substrate to form a plurality of first deformable electrical connectors; a first common contact is coupled to all or part of the first substrate Some first deformable electrical connectors; providing a second substrate; forming a plurality of second core segments in the second substrate in a desired style and shape; disposing a second metal layer in the second substrate A plurality of second deformable electrical connectors are formed on the second core segments; a second common contact is coupled to all or part of the second deformable electrical connectors on the second substrate; and The first substrate and the second substrate are pressed together to form a plurality of redundant electrical contact points. In one embodiment, the first core segments and the second core segments are each formed of a material selected from the group consisting of polymer and epoxy resin. In one embodiment, the first metal layer and the second metal layer are formed of materials selected from the group of aluminum, nickel, titanium, copper, gold, tungsten, silver, and indium tin oxide. In one embodiment, the first core segments are formed of a material that can deform at 60-80 degrees Fahrenheit. In one embodiment, the first metal layer is formed of a material that can deform at 60-80 degrees Fahrenheit. In one embodiment, the second metal layer is formed of a material that can deform at 60-80 degrees Fahrenheit.

A substrate according to an embodiment of the present invention includes a plurality of deformable electrical connectors, the deformable electrical connectors include a plurality of core segments, and a metal layer disposed on the core segments, each of which The core segment has a Young coefficient smaller than that of the metal layer. In one embodiment, the substrate further includes: a common contact is coupled to all or part of the deformable electrical connectors on the substrate. In one embodiment, the deformable electrical connectors are formed on the substrate by photolithography.

The above description of the content of the disclosure and the description of the following embodiments are used to demonstrate and explain the spirit and principle of the present invention, and to provide a further explanation of the patent application scope of the present invention.

The detailed features and advantages of the present invention are described in detail in the following embodiments, and the content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and the drawings Anyone who is familiar with the relevant art can easily understand the related purpose and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

An embodiment of the present invention includes a redundant and reliable electrical interconnection between two surfaces oriented face-to-face in an electronic device. In one embodiment, a liquid crystal assembly (Liquid Crystal Assembly, LCA) is provided, which includes a back plate of a pixel display circuit and a glass cover plate with a transparent conductive layer. A voltage can be applied to one or two surfaces so that when the two surfaces are electrically connected, an electric field exists between the two surfaces. Compared with conventional systems and methods, the various embodiments of the present invention achieve several benefits and advantages. These embodiments allow cross-connections to be established between wafers with high accuracy. The cell gap of these embodiments can be adjusted to any desired height. In this way, the possible height range of interconnection can be realized. For example, SU-8, one of the materials that can be used to make deformable electrical connectors, can be spin-coated (Spin Coat) to greater than 500 µm. According to the embodiment of the present invention, the combined height of the deformable electrical connectors of the top and bottom substrates exceeds the required cell gap to ensure that interconnection occurs between the substrates. In addition, the embodiments of the present invention are highly extensible, for example, when the deformable material used for the deformable electrical connector is photopatterned in line on the substrate, the deformable electrical connector can be modified Any size or shape to achieve the extrusion procedure provided in this article. The embodiments of the present invention help to promote the precise placement of the components of the device, partly because the wires of the deformable electrical connector are formed by photolithography, so that the alignment of the deformable core section to the substrate can reach approximately micrometers or more. small. In addition, the embodiments of the present invention contribute to a significant reduction in size and footprint compared with known devices.

Another advantage of the embodiments of the present invention is that no protrusions are generated, and the protrusions make the edges of the substrate unusable for other purposes (for example, wire-bond or fill-port). Accordingly, compared to the known interconnection method in which the size must be increased to accommodate the protrusion, the device using the system and method of the present invention has a smaller footprint.

FIG. 1A is a top view of a deformable interconnection system 100A according to an embodiment of the invention. The interconnection system 100A of this embodiment includes a plurality of deformable electrical connectors 104A, 104B,... And 104N (hereinafter referred to as “104A-N”) disposed on the substrate 102. Each deformable electrical connector 104A-N is electrically coupled to the common contact 108. The common contact 108 is a structure that provides a conductive connection/location (for example, a through hole (via), or a conductive surface that establishes an electrical connection between the circuit under the surface of the substrate 102 and the exposed surface of the substrate 102), and can be formed On the surface of the substrate 102, coupled to the surface of the substrate 102, or bonded to the surface of the substrate 102. In some embodiments, the surface of the substrate 102 may be conductive. Therefore, the common contact 108 may be located on the surface of the substrate 102, layered on the surface of the substrate 102, bonded to the surface of the substrate 102, or formed on the substrate 102. s surface. The individual deformable electrical connectors 104A-N can be coupled to the contact points individually or collectively. For example, Figure 1A and Figure 1B.

FIG. 1B shows a cross-sectional view 100B of the electrical connection of the deformable interconnection system 100A of FIG. 1A taken along the line A-A. 1A, the deformable electrical connector 104A-N includes a plurality of core segments 106A, 106B, ... and 106N (hereinafter referred to as "106A-N"), and the core segments 106A-N and common connection Point 108 of the metal layer 110. The core segments 106A-N may be formed of deformable materials, for example, Benzocyclobutene (BCB; Cyclotene manufactured by Dawu Chemical Company), photopatternable polyimide (Polyimide), etc., and/ Or other deformable materials, such as epoxy (Epoxy) (such as SU-8), plastic, rubber, etc. The material used to manufacture the core segments 106A-N may be a material that deforms in a room temperature environment (for example, including approximately 60-80 degrees Fahrenheit). In an embodiment, each core segment 106A-N may be formed to have a width of, for example, 2-10 µm; including a length approximately and between 10-50 µm; and overall and/or higher than the substrate 102 including Approximately and at a height between 0.3-10µm. Each of these core segments 106A-N may be spaced apart from each other. For example, the interval between the core segments 106A-N may be between approximately 2-50 µm and contain approximately 2-50 µm. The embodiment of the present invention does not limit the above exemplary size or interval size. The metal layer 110 may be formed of conductive metal, for example, aluminum, nickel, titanium, copper, gold, tungsten, silver, indium tin oxide, etc., and/or amalgam of these metals, and/or other metal materials, and / Or amalgam of other metal materials. The metal layer 110 may be deformable in a room temperature environment (for example, including approximately 60-80 degrees Fahrenheit). The metal layer 110 may have an overall/or average thickness of, for example, 300-2000 Å, and cover the entire area of the core segments 106A-N and the common contact 108. According to the present invention, the size of the core segments 106A-N and/or the metal layer 110 can be selected based on, for example, desired tolerances, deposition methods (Deposition Methodologies), overall package size tolerances, and the like. The metal layer 110 may have one or more of the following features, namely: (1) covering designated interconnections (for example, vias); (2) not interfering with external input/output of components or devices (Input /Output, I/O) point (for example, Bond Pad); and (3) does not extend to the area where the component or device is to be illuminated.

FIG. 2A is a plan view of a deformable interconnection system 200A according to an embodiment of the present invention. The deformable interconnection system 200A of this embodiment includes a plurality of individual deformable electrical connectors 204A, 204B, ..., and 204N (hereinafter referred to as "204A-N") disposed on the substrate 202 and share the contact 208 contact. The common contact 208 may be coupled to all or part of the electrical connectors 204A-N. The coupling can be performed by photolithography, coating, welding, or other electrical or mechanical connection methods. The coupling of the respective deformable electrical connectors 204A-N to the common contact 208 can occur individually or in groups. FIG. 2B shows a cross-sectional view 200B of the deformable interconnection system of FIG. 2A taken along the line B-B. 2A and 2B, each deformable electrical connector 204A-N includes a core section 206A, 206B, ... and 206N (hereinafter referred to as "206A-N"), and each core section 206A-N series They are respectively covered by metal layers 210A, 210B, ... and 210N (hereinafter referred to as "210A-N"). Therefore, in this embodiment, each deformable electrical connector 204A-N can be individually formed on the substrate 202, wherein the metal layer 210A-N is disposed on each core segment 206A-N. The size and material of the deformable electrical connector 204A-N may be the same as the description about the deformable electrical connector 104A-N.

In an embodiment of the present invention, as shown in FIGS. 1A and 2A, the deformable electrical connectors 104A-N and 204A-N on the substrates 101 and 202 as described above may be parallel on the substrates 101 and 202. It is substantially parallel to other deformable electrical connectors on the same substrate. However, it should be particularly noted that the deformable electrical connectors 104A-N and 204A-N formed on a given substrate may not be parallel, and in an embodiment of the present invention, the deformable electrical connectors 104A-N And 204A-N can be formed on the substrate in a pattern of concentric circles (or semi-concentric circles), diagonal lines, concentric rectangles, trapezoids, etc., and includes, but is not limited to, nonlinear and/or asymmetric shapes. In addition, in an embodiment of the present invention, the deformable electrical connectors 104A-N and 204A-N may be formed by a continuous line pattern instead of the line segments shown in FIGS. 1A and 2A. In addition, the cross-sectional shapes of the deformable electrical connectors 104A-N and 204A-N may be trapezoidal shapes or substantially trapezoidal shapes as shown in FIGS. 1B and 2B. Those with ordinary knowledge in the technical field of the present invention should understand that the shape of the cross-section will vary according to the layout pattern or placement position of the deformable electrical connector on the substrate and/or the shape of the deformable electrical connector.

In an embodiment of the present invention, the cross-sectional shape of the deformable electrical connector can be circular, semi-circular, rectangular, and/or other cross-sectional shapes that can be controlled by a selected deposition process. The deformable electrical connector may be formed by, for example, conventional and/or proprietary deposition procedures, including, for example, photolithography, vapor deposition, and the like. The core segments 106A-N and 206A-N described herein are deformable, and can be formed of materials having a Young's modulus (Young's modulus) smaller than that of the metal layer laminated on the core segment, and the core segment can It is a conductive or non-conductive core segment. This structure enables, for example, the deformable electrical connector to be crushed or deformed by a relatively small force (for example, equal to or less than about 3000 Newtons).

FIG. 3 is an interconnection system 300 according to an embodiment of the invention. The interconnection system 300 generally describes the use of deformable electrical connectors 304A, 304B, 304C,..., and 304N (hereinafter referred to as "304A-N") and 354A, 354B,..., and 354M between two substrates as described herein. Hereafter referred to as "354A-M") form an electrical coupling. The interconnection system 300 includes two substrates, a first substrate 302 and a second substrate 352 respectively. The first substrate 302 includes a plurality of first deformable electrical connectors 304A-N disposed on the surface of the first substrate 302 and connected to the first common contact 308 of the first substrate 302. The second substrate 352 includes a plurality of second deformable electrical connectors 354A-M disposed on the surface of the second substrate 352 and connected to the second common contact 358 of the second substrate 352. In order to establish an electrical connection between the first common contact 308 of the first substrate 302 and the second common contact 358 of the second substrate 352, the two substrates can be pressed together to make at least part of the first The deformable electrical connectors 304A-N and at least part of the second deformable electrical connectors 354A-M are deformed. Deformation and conductivity occur at the intersection point where the deformable electrical connector 304A-N coated with the metal layer and the deformable electrical connector 354A-M coated with the metal layer contact, and on the first substrate 302 and the second substrate 302 Electrical connections are established between the substrates 352, for example, as shown by point 350, thereby forming potential N×M connectors. In an embodiment of the present invention, this electrical connection provides a reference voltage to the glass cover for use in a liquid crystal display. Therefore, a plurality of redundant electrical contact points may be formed at the intersection of the first deformable electrical connector 304A-N and the second deformable electrical connector 354A-M (as used herein, "redundancy" refers to, for example, Multiple electrical connection points, thus reducing or eliminating the failure of a single electrical connection point).

The deformable electrical connectors shown in FIG. 3 roughly form an array, in which the first deformable electrical connectors 304A-N are generally arranged perpendicular to the second deformable electrical connectors 354A-M. It should be understood that the embodiment of FIG. 3 is an exemplary layout of deformable electrical connectors, and in other embodiments, the electrical connectors may not be perpendicular to each other.

FIG. 4 is a cross-sectional view of an interconnection system 400 according to an embodiment of the invention. This embodiment illustrates an interconnection system using electrical connectors as shown in FIGS. 1A and 1B. In this embodiment, the first substrate 402 and the second substrate 452 are pressed together. The first substrate 402 includes at least one deformable electrical connector, and the deformable electrical connector includes a core section 406 (for example, a polymer section) and a metal layer 410 disposed on the core section 406 and coupled to the common contact 408 . The second substrate 452 includes at least two deformable electrical connectors, and the two deformable electrical connectors include core segments 456A and 456B and a metal layer 460 disposed on the core segments 456A and 456B and coupled to a common contact 458. When the first substrate 402 and the second substrate 452 are pressed together, the metal layer 410 and the polymer core section 406 are deformed, and the metal layer 460 and the core sections 456A and 456B of the second substrate 452 are deformed, such as 450 and As shown at 470, redundant electrical connections 450 and 470 are formed. Although not shown in this drawing, the metal layer 460 and the core segments 456A and 456B can similarly deform other deformable electrical connectors that may be on the first substrate 402.

FIG. 5 shows a liquid crystal display assembly 500 including a deformable interconnection system according to an embodiment of the present invention. The liquid crystal display assembly 500 of the present embodiment includes a backplane substrate 502, and the backplane substrate 502 includes a display or a spatial light modulator 504 (Spatial Light Modulator) (for example, active matrix display, LCD display, LCoS display, reflective display) , LED displays, OLED displays, micro LED displays, etc.), and a transparent conductive layer 552 placed on the backplane substrate 502 (for example, a partially transparent layer, such as a glass or plastic layer, an indium tin oxide layer (Indium Tin Oxide, ITO) etc.), thereby forming a cell gap between the backplane substrate 502 and the transparent conductive layer 552. A plurality of interconnection systems 554 provide electrical connections between the contact points on the backplane substrate 502 (not shown in the figure) and the conductive surface of the transparent conductive layer 552. Each interconnection system, such as interconnection system 554, is formed by a plurality of first deformable electrical connectors formed on the backplane substrate 502 and a plurality of second deformable electrical connectors formed on the transparent conductive layer 552 The formed array.

6 is a cross-sectional view of the liquid crystal display assembly 500 of FIG. 5, which shows the relative positions of the interconnection structure shown in FIG. 4 and other structures in the liquid crystal display assembly 500. The interconnection array shown uses a structure composed of polymer core segments 456A-D and backplane common contacts 458 on the display backplane substrate 502, and is covered by a continuous metal layer 460, and a transparent conductive layer 552 (for example, The structure on the glass cover is composed of a polymer core segment 406 covered by a metal layer 410 extending to a common joint 408 (eg, IMITO). The structure 558 is a perimeter seal 558 (Perimeter Seal), which creates a cell gap 566 space or gap between the glass cover and the back plate, or in one embodiment, the cell gap can surround the display area, and the liquid crystal 562 can Is placed in it. When the liquid crystal material fills the cell gap and is sealed on all sides, as shown in FIG. 5, the liquid crystal material can be stored in the liquid crystal display assembly 500. An additional seal 560 can optionally be included to protect the interconnected array from environmental hazards. The wavy structure 564 shown in FIG. 6 indicates that the transparent conductive layer 552 (glass cover) is much larger than the cell gap 566 of the liquid crystal display assembly 500.

The redundant electrical connectors described above can provide an electrical interconnection structure between the substrates by applying a pressure less than that which would cause damage and/or deformation of the substrate. A specific example is assuming that the deformable electrical connector is formed using a polymer core with a Young's coefficient of 1-5 GPa and an aluminum coating with a Young's coefficient of 69 GPa. And for example, each substrate may include 160 deformable electrical connectors. The average width of each deformable electrical connector can be or approximately 3 µm. Therefore, when the two substrates are pressed together, the number of possible electrical contact positions (the intersection of the deformable electrical connector) is 25,600. If the area of each of these electrical contact locations is 3x3µm, then each contact location is 9µm ² , or 9E-6mm ² . The total extrusion area (defined as the total area where the deformable electrical connectors meet) is 0.23mm ² . For example, when the substrate is squeezed together, applying a force of 3500 Newtons (N) to the substrate will cause the contact point of the deformable electrical connector to withstand a pressure of more than 150,000 bar (Bar). Based on the assumptions of the above example, this force will deform at least most of the deformable electrical connectors, thus forming thousands of redundant electrical contacts, and this pressure will not damage the general substrate. The core material and/or metal layer material and/or thickness (height) of the deformable electrical connector can be selected to ensure that the substrate is deformed when being pressed together without compromising the integrity of the substrate itself.

FIG. 7 is a flowchart of a method for manufacturing an interconnection system according to an embodiment of the present invention. In step 701, a first substrate is provided. In step 702, a plurality of deformable core segments are formed on a substrate in a desired pattern and shape. In step 703, a metal layer is disposed or coated on the deformable core segment in the substrate to form a plurality of electrical connectors. In step 704, the common contact is coupled to all or part of the electrical connectors on the substrate. The coupling technology can be performed by photolithography, coating, welding, or other electrical or mechanical connection methods. In step 705, steps 701-704 are repeatedly performed on the second substrate (step 705 can also be performed simultaneously with steps 701-704). In step 706, the first and second substrates now each having a plurality of electrical connectors formed thereon are pressed together to form redundant electrical connections. In an embodiment, the plurality of first core segments may each have a Young's coefficient smaller than that of the first metal layer. In an embodiment, the plurality of second core segments may each have a Young's coefficient smaller than that of the second metal layer. The entire disclosure of the present invention has described other aspects and embodiments of the interconnection system and its manufacturing method according to the present invention.

Although the present invention is disclosed in the foregoing embodiments, it is not intended to limit the present invention. All changes and modifications made without departing from the spirit and scope of the present invention fall within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the attached patent scope.

100A, 200A: Deformable interconnection system 100B, 200B: Sectional view 102, 202: substrate 104A-N, 204A-N, 304A-N, 354A-M: deformable electrical connectors 106A-N, 206A-N, 406, 456A-D: core segment 108, 208, 408, 458: common contacts 110, 210A-N, 410, 460: metal layer 302, 402: first substrate 352, 452: second substrate 308: first common contact 358: second common contact 300, 400, 554: interconnection system 350: points 450, 470: redundant electrical connection 500: LCD display assembly 502: backplane substrate 504: Spatial Light Modulator 552: Transparent conductive layer 558: Perimeter Seal 560: Seal 562: LCD 564: wavy structure 566: cell gap A-A, B-B: line

FIG. 1A shows a deformable interconnection system according to an embodiment of the present invention. FIG. 1B is a cross-sectional view of the deformable interconnection system of FIG. 1A. FIG. 2A shows a deformable interconnection system according to an embodiment of the invention. Fig. 2B is a cross-sectional view of the deformable interconnection system of Fig. 2A. FIG. 3 shows a deformable interconnection system associated with two substrates according to various embodiments of the present invention. 4 is a cross-sectional view of a deformable interconnection system associated with two substrates according to an embodiment of the present invention. FIG. 5 shows a liquid crystal display assembly including a deformable interconnection system according to an embodiment of the present invention. 6 shows a side view of the liquid crystal display assembly of FIG. 5 including liquid crystals and the position of the internal crossover relative to other components. FIG. 7 is a flowchart of a method for manufacturing an interconnection system according to an embodiment of the present invention.

100B: Sectional view

102: substrate

104A-N: Deformable electrical connector

106A-N: core segment

110: Metal layer

Claims (20)

An interconnection system, comprising: a first substrate comprising a plurality of first deformable electrical connectors, the first deformable electrical connectors comprising a plurality of first core segments and the first core segments A first metal layer, wherein each of the first core segments has a Young coefficient smaller than a Young coefficient of the first metal layer; and a second substrate includes a plurality of second deformable electrical connectors, the first Two deformable electrical connectors include a plurality of second core segments and a second metal layer disposed on the second core segments, wherein each of the second core segments has a Young's coefficient smaller than that of the second metal layer One Yang coefficient. The interconnection system according to claim 1, wherein the first deformable electrical connectors are formed substantially perpendicular to the second deformable electrical connectors. The interconnection system according to claim 1, wherein the first deformable electrical connectors are coupled to a first common contact, the first common contact is associated with the first substrate, and the second deformable electrical connectors The electrical connector is coupled to a second common contact, and the second common contact is associated with the second substrate. The interconnection system according to claim 1, wherein the first core segments are formed of materials selected from the group consisting of polymers and epoxy resins. The interconnection system according to claim 1, wherein the first metal layer is formed of a material selected from the group consisting of aluminum, nickel, titanium, copper, gold, tungsten, silver, and indium tin oxide. The interconnection system according to claim 1, wherein the second core segments are formed of materials selected from the group consisting of polymers and epoxy resins. The interconnection system according to claim 1, wherein the second gold layers are formed of a material selected from the group of aluminum, nickel, titanium, copper, gold, tungsten, silver, and indium tin oxide. The interconnection system according to claim 1, wherein when the first deformable electrical connectors and the second deformable electrical connectors are squeezed together, the first deformable electrical connectors and the These second deformable electrical connectors form a plurality of redundant electrical contacts. The interconnection system according to claim 8 further includes a deformation at the intersecting point of the first deformable electrical connectors and the second deformable electrical connectors. The interconnection system according to claim 1, wherein the first core segments are formed of a material that can be deformed at 60-80 degrees Fahrenheit. The interconnection system according to claim 1, wherein the first metal layer is formed of a material that can deform at 60-80 degrees Fahrenheit. A method for manufacturing an interconnection system. The method includes the steps of: providing a first substrate; forming a plurality of first core segments in the first substrate in a desired pattern and shape; and disposing a first metal layer on the first substrate. A plurality of first deformable electrical connectors are formed on the first core segments in a substrate; a first common contact is coupled to all or part of the first deformable electrical connectors on the first substrate Connector; providing a second substrate; forming a plurality of second core segments in the second substrate in a desired style and shape; placing a second metal layer on the second core segments of the second substrate To form a plurality of second deformable electrical connectors; coupling a second common contact to all or part of the second deformable electrical connectors on the second substrate; and the first substrate and The second substrate is pressed together to form a plurality of redundant electrical contacts. The method according to claim 12, wherein the first core segments and the second core segments are each formed of a material selected from the group consisting of a polymer and an epoxy resin. The method according to claim 12, wherein the first metal layer and the second metal layer are made of a material selected from the group of aluminum, nickel, titanium, copper, gold, tungsten, silver, and indium tin oxide form. The method according to claim 12, wherein the first core segments are formed of a material that can deform at 60-80 degrees Fahrenheit. The method according to claim 12, wherein the first metal layer is formed of a material that can deform at 60-80 degrees Fahrenheit. The method according to claim 12, wherein the second metal layer is formed of a material that can deform at 60-80 degrees Fahrenheit. A substrate, comprising: a plurality of deformable electrical connectors, the deformable electrical connectors comprising a plurality of core segments, and a metal layer disposed on the core segments, wherein each of the core segments has a Yang-type coefficient It is smaller than the one-Yang-type coefficient of the metal layer. The substrate according to claim 18, wherein the substrate further comprises: a common contact is coupled to all or part of the deformable electrical connectors on the substrate. The substrate according to claim 18, wherein the deformable electrical connectors are formed on the substrate by photolithography.

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