TW202045653A - Adhesive sheet and use thereof - Google Patents

Abstract

Provided is a novel adhesive sheet suitably used for simultaneous batch inspection of a plurality of electrically-conductive small pieces. This adhesive sheet comprises an adhesive agent layer. The adhesive agent layer has a surface resistance value of 1.0 * 108 [Omega]/□ or less. In addition, this adhesive sheet has an adhesive strength in the range of 0.01-4.0 N/20 mm with respect to a stainless steel sheet.

Description

Adhesive sheet and its utilization

The present invention relates to adhesive sheets and their utilization. This application claims priority based on Japanese Patent Application No. 2019-020095 filed on February 6, 2019, and the entire content of the application is incorporated into this specification by reference.

Background technique Generally speaking, the adhesive (also called pressure-sensitive adhesive, the same below) presents a soft solid (viscoelastic) state in a temperature region near room temperature, and has the property of being easily adhered to the adherend by pressure. Based on the good workability of adhesion to the adherend, the adhesive is in the form of an adhesive sheet with an adhesive layer on the support, or an adhesive sheet without a support without a support It is widely used in various fields. Such an adhesive can be removed from the adherend after it is attached to the adherend and its bonding purpose is completed. With regard to prior art documents that disclose such prior art, patent documents 1 and 2 can be cited. Patent Documents 1 and 2 relate to the surface protection film used to temporarily protect the polarizing plate attached to the liquid crystal cell when manufacturing the liquid crystal display panel, and disclose an antistatic adhesive. Advanced technical literature Patent literature

Patent Document 1: Japanese Patent No. 5061898 Specification Patent Document 2: Japanese Patent No. 5535987 Specification

Summary of the invention Problems to be solved by the invention However, the output of various semiconductor components used in electronic products with display functions has increased year by year, and due to the demand for miniaturization and high performance of products, the components are also progressing towards miniaturization. Therefore, it is faced with the problem of increased inspection of components and increased time required for inspection. Specifically, in order to ensure the quality of semiconductor wafers such as light-emitting diodes, all of the multiple wafers formed during the manufacturing process are energized and inspected. In this inspection, the probe is brought into direct contact with the electrode of each chip and then energized, and the defective product is judged, and the chip is classified. However, due to the miniaturization of the above-mentioned wafers, the electrode area has also become smaller, making it difficult for the probe to correctly contact the tiny electrodes. In addition, as mentioned above, the inspection is carried out in units of wafers, so compared with the miniaturization of wafers that can be implemented in units of wafers (usually miniaturization using a dicing step or an expansion step), it is caused by the miniaturization of the wafers The time required for the inspection has increased significantly.

In view of the above-mentioned technical limitations and the reduction in productivity, the present inventor came up with a novel solution that is different from the previous one. The idea is to fix a plurality of conductive small pieces (such as semiconductor chips) with a conductive adhesive, so that the electrodes of the conductive small pieces are in contact with the adhesive at the same time, and the current flows through the conductive small pieces through the adhesive. At the same time, check all the conductive small pieces on the adhesive as a whole. Based on the above-mentioned ideas, research was conducted on the realization of the structure suitable for the simultaneous inspection of a plurality of conductive small pieces in a batch, and as a result, the present invention was finally completed. That is, the object of the present invention is to provide a novel adhesive sheet suitable for simultaneous inspection of a whole batch of a plurality of conductive small pieces. Another object of the present invention is to provide a method for manufacturing the conductive small chip after inspection. Means to solve the problem

According to this specification, an adhesive sheet with an adhesive layer is provided. The surface resistance value of the aforementioned adhesive layer is 1.0×10 ⁸ Ω/□ or less. In addition, the adhesive force of the adhesive sheet to the stainless steel plate is within the range of 0.01~4.0N/20mm.

Since the adhesive layer of the above-mentioned structure has conductivity above a predetermined level, by fixing a plurality of conductive small pieces (such as semiconductor chips) on the adhesive layer, the plurality of pieces arranged on the adhesive can be paired by the adhesive layer The conductive small pieces are energized at the same time in the whole batch. In addition, by setting the adhesive force of the adhesive sheet to a predetermined range, the conductive small piece can be fixed with good reliability, and the conductive small piece can be well separated from the surface of the adhesive layer after the energization step is completed.

In some preferred aspects, the haze value of the adhesive sheet is less than 50%. According to the adhesive sheet whose haze value is limited to a predetermined value or less, the inspection of the adherend fixed to the adhesive sheet can be performed through the adhesive sheet.

In some preferred aspects, the aforementioned adhesive layer contains oxyalkylene structural units. According to the adhesive layer containing the oxyalkylene structural unit, it is easy to obtain good conductivity, and it is also easy to achieve both conductivity and transparency.

In some aspects, the adhesive layer preferably includes a polymer having the oxyalkylene structural unit. By using a polymer with oxyalkylene structural units, an adhesive layer with good conductivity and bonding reliability and separation and removal of the adherend can be obtained. In some aspects, the polymer having the aforementioned oxyalkylene structural unit has the aforementioned oxyalkylene structural unit in the side chain. By arranging the oxyalkylene structural unit on the side chain with a higher degree of freedom of movement than the polymer main chain, it is easy to obtain higher conductivity based on the degree of freedom.

In some preferred aspects, the content ratio of the oxyalkylene structural unit in the adhesive layer is 20-95% by weight. By making the adhesive layer contain a specific amount of oxyalkylene structural units, it is easy to obtain higher conductivity, and it is easy to have both bonding reliability and separation and removal of the adherend.

In some preferred aspects, the aforementioned adhesive layer contains an ionic compound. By containing the ionic compound, the adhesive layer can preferably exhibit high conductivity. In addition, the use of ionic compounds is ideal for maintaining the transparency of the adhesive layer. Furthermore, compared with metal particles, it is also advantageous in that the thickness of the adhesive layer can be reduced.

In some preferred aspects, the adhesive sheet further has a substrate layer. In addition, the aforementioned adhesive layer is provided on at least one side (for example, one side) of the substrate layer. Since the adhesive sheet with the base layer has a specific rigidity, it can be excellent in processability and operability. In a more preferable aspect, the aforementioned substrate layer is composed of a resin film having an elastic modulus of 50 MPa or more.

In some preferred aspects, a primer layer is disposed between the substrate layer and the adhesive layer. By providing the primer layer, the anchorage of the adhesive layer can be improved, and the adhesive residue can be better prevented from being left in the adherend during peeling.

In addition, according to this specification, a method for manufacturing an inspected conductive chip (for example, a semiconductor wafer) is provided. The method includes the following steps: preparing an adhesive sheet with a plurality of conductive small pieces of inspection object fixed, wherein the adhesive sheet has a conductive adhesive layer, and the plurality of conductive small pieces of inspection object are separable Ground is fixed on the surface of the adhesive layer; and the step of energizing at least a part of the plurality of conductive small pieces of the inspection object through the adhesive layer, and inspecting the conductive small pieces of the inspection object in the energized state. According to the above method, the whole batch of multiple conductive small pieces can be energized at the same time. The above method generally precedes the inspection step and may further include the step of contacting the surface of the plurality of inspection target conductive small pieces on the opposite side of the fixing surface of the adhesive layer with the conductive material. In the above method, in the inspection step, the conductive small piece of the inspection object is energized through the adhesive layer and the conductive material. Furthermore, the manufacturing method of the above-mentioned inspected conductive chip may be an inspection method of the conductive chip (for example, a semiconductor wafer).

Furthermore, in some aspects of the above method, before the step of preparing an adhesive sheet to which a conductive small piece (such as a semiconductor chip) is fixed, it may have the following steps: a step of fixing the conductive wafer on the adhesive sheet; and The step of forming the plurality of conductive small pieces from the conductive wafer by processing the conductive wafer. The processing steps of the conductive wafer may include the cutting step and the expansion step of the conductive wafer. In some other aspects, before the step of preparing the adhesive sheet to which the conductive small pieces are fixed, the following steps may be included: fixing a plurality of conductive small pieces formed by using different adhesive sheets or by different methods to the adhesive Steps of sheeting. Regarding the adhesive sheet used in the above method, it is appropriate to use the adhesive sheet disclosed in this case. In addition, the conductive material used in the above method is preferably the adhesive sheet disclosed in the present application, or a metal plate, or a well-known or conventional conductive adhesive sheet can be used. In some aspects, the inspection step of the conductive small piece of the inspection object may include inspection using an inspection mechanism such as a camera or visual inspection through the adhesive sheet (for example, inspection of the luminous intensity or light wavelength of the light-emitting semiconductor device).

The form used to implement the invention Hereinafter, preferred embodiments of the present invention will be described. In addition, matters other than the matters specifically mentioned in this specification and matters necessary to implement the present invention can be understood by those skilled in the art based on the teachings on the implementation of the invention described in this specification and common technical knowledge at the time of application. The present invention can be implemented based on the content disclosed in this specification and common technical knowledge in the field. In addition, in the following drawings, members and parts that perform the same function may be described with the same reference numerals, and repeated descriptions may be omitted or simplified. In addition, the embodiments described in the drawings are schematic in order to clearly explain the present invention, and do not necessarily accurately represent the size or scale of the product actually provided.

In this specification, the so-called "adhesive" refers to a material that exhibits a soft solid (viscoelastic) state in a temperature region near room temperature, and has the property of being easily adhered to the adherend by pressure. The so-called adhesive system in this case is as defined in "CA Dahlquist, "Adhesion: Fundamental and Practice", McLaren & Sons, (1966) P. 143", and generally can have a complex tensile elastic modulus E ^* (1Hz) Materials with properties of <10 ⁷ dyne/cm ² (usually materials with the above properties at 25°C).

＜Example of composition of adhesive sheet＞ The adhesive sheet disclosed in this case can be an adhesive sheet with a substrate in the form of the above-mentioned adhesive layer on one side or both sides of a non-peelable substrate (supporting substrate), or the adhesive layer can be held Adhesive sheets without substrates in the form of release liners (ie, adhesive sheets without non-releasable substrates). The so-called adhesive sheet concept in this case may include those called adhesive tape, adhesive label, adhesive film, etc. In addition, the adhesive sheet disclosed in this case can be a roll shape or a single sheet shape. Or it may be an adhesive sheet that is further processed into various shapes.

Figure 1 shows an example of the composition of the adhesive sheet disclosed in this case. The adhesive sheet 1 includes a base layer 10 and an adhesive layer 20. The adhesive layer 20 is provided on one surface (first surface) 10A of the base layer 10. Details will be described later, but the adhesive layer 20 has conductivity. The surface (adhesive surface) 20A of the adhesive layer 20 has a structure in which at least the side of the adhesive layer is protected by a release liner (not shown) as a release surface. Alternatively, the other side 10B of the base layer 10 becomes a peeling surface, and if the adhesive sheet 1 is wound so that the adhesive layer 20 is in contact with the other side 10B, the adhesive surface 20A can also be protected by the other side 10B of the base layer .

Fig. 2 is another example of the structure of the single-sided adhesive sheet. The adhesive sheet 2 shown in FIG. 2 includes a base layer 10 and an adhesive layer 20, and further includes a primer layer 30 between the base layer 10 and the adhesive layer 20. Specifically, one surface 30B of the primer layer 30 is in contact with the base layer 10, and the other surface (a surface opposite to the one surface) 30A of the primer layer 30 is in close contact with the adhesive layer 20. By having such a primer layer 30, the anchoring property of the adhesive layer 20 can be improved, and glue residue can be prevented when it is separated and removed from the adherend. Details will be described later, but the primer layer 30 may be conductive.

<Adhesive layer> (Surface resistance value) The adhesive layer of the adhesive sheet disclosed in this case, in some general aspects, is characterized in that its surface resistance value is 1.0×10 ⁸ Ω/□ or less (for example, less than 1.0×10 ⁸ Ω/□). In this way, the adhesive layer whose surface resistance value is limited to below the specified value can have good conductivity, and the adherend can be energized through the adhesive layer. From the viewpoint of conductivity suitable for the energization of the adherend, the surface resistance value is preferably 1.0×10 ⁷ Ω/□ or less (for example, less than 1.0×10 ⁷ Ω/□), preferably 1.0×10 ⁶ Ω/□ Or less (for example, less than 1.0×10 ⁶ Ω/□), more preferably 5.0×10 ⁵ Ω/□ or less, still more preferably 1.0×10 ⁵ Ω/□ or less (for example, 5.0×10 ⁴ Ω/□ or less). The lower limit of the surface resistance value is not particularly limited, and it is usually 1.0×10 ² Ω/□ or more, and may be 1.0×10 ³ Ω/□ or more (for example, 1.0×10 ⁴ Ω/□ or more). The surface resistance value of the adhesive layer can be measured by the method described in the following examples. Furthermore, the adhesive sheet disclosed in this specification includes an aspect in which the surface resistance value of the adhesive layer is unlimited, and the adhesive layer in this aspect is not limited to having the surface resistance value.

(Haze value) The haze value of the adhesive layer is not particularly limited. For example, it may be about 80% or less. When inspecting the adherend through the adhesive sheet, the adhesive layer needs to have proper penetration. From the above point of view, the haze value of the adhesive layer is preferably about 50% or less (for example, about 30% or less), preferably about 10% or less, more preferably about 3% or less, and even more preferably about 1% or less ( For example, less than 0.1%). The haze value can be measured by the method described in the examples described later.

(Oxyalkylene structural unit) In some preferred aspects, the adhesive layer (which can also be an adhesive composition, and the following is the same unless otherwise specified) contains oxyalkylene structural units. According to the adhesive layer containing the oxyalkylene structural unit, it is easy to obtain good conductivity, and it is also easy to achieve both conductivity and transparency. Regarding the aspect of the adhesive layer containing the oxyalkylene structural unit, it can be enumerated: the use of a polymer or oligomer having an oxyalkylene structural unit, any one of other additives, or a plurality of combinations thereof Among them, a polymer having an oxyalkylene structural unit is preferably used. By using this polymer as the main component (base polymer) in the adhesive, the oxyalkylene structural unit can be contained in the entire system at a predetermined content rate.

The oxyalkylene structural unit contained in the adhesive layer can be defined as a (poly)oxyalkylene unit. Regarding the (poly)oxyalkylene unit, a unit composed of (poly)oxyethylene or (poly)oxypropylene can be exemplified. These units can generally be added by ethylene oxide, propylene oxide, or polyethylene oxide. It is obtained by addition of polyalkylene glycol such as alcohol. The oxyalkylene structural unit preferably contains a polyoxyethylene unit.

The molar number of the (poly)oxyalkylene unit in the oxyalkylene structural unit (also called the addition molar number, generally the repeating number of the oxyalkylene) is usually 1 or 2 or more. From the viewpoint of improving the mobility (electron conductivity) of the electrons (which may be in the form of ions) in the adhesive layer, the molar number of the (poly)oxyalkylene unit is preferably greater than 2, preferably 3 or greater, more preferably It is 5 or more, more preferably 7 or more (for example, 8 or more). The upper limit of the number of moles of the above-mentioned (poly)oxyalkylene unit is not particularly limited, and it is preferably set from the viewpoints of the synthesis (easy of polymerization) and operability of polymers having oxyalkylene structural units. It is less than 30, preferably less than 20, for example, it can be 15 or less, 13 or less, or 11 or less (generally 10 or less). In the case of using a polymer, oligomer, etc. having an oxyalkylene structural unit, the value of the (poly)oxyalkylene unit in the oxyalkylene structural unit of the polymer, oligomer, etc. The number of moles can also be selected from the above range.

The content ratio of the oxyalkylene structural unit in the adhesive layer (which may also be the solid component of the adhesive composition) is set according to the electrical conductivity to the adherend, so it is not limited to a specific range. The content ratio of the oxyalkylene structural unit in the adhesive layer can be, for example, about 5 wt% or more. From the viewpoint of improving conductivity, it is preferably about 10 wt% or more, preferably about 20 wt% or more. It is more preferably about 30% by weight or more, still more preferably about 40% by weight or more, and particularly preferably about 50% by weight or more (for example, about 60% by weight or more). In consideration of bonding reliability and adherence separation and removal properties, the upper limit of the content ratio of the oxyalkylene structural unit in the adhesive layer is preferably set to about 95% by weight or less, for example, about 85% by weight or less, or about 75% by weight or less, and may be about 65% by weight or less (for example, about 55% by weight or less).

(polymer) In the technology disclosed in this case, the type of adhesive constituting the adhesive layer is not particularly limited. The above-mentioned adhesive (also an adhesive composition) can be comprised of acrylic polymers, rubber-based polymers, polyester-based polymers, urethane-based polymers, and polyether-based polymers known in the adhesive field. One or two or more of various rubber-like polymers such as polymers, silicone polymers, polyamide polymers, and fluorine polymers. From the standpoint of adhesive performance and cost, acrylic polymers and urethane polymers are suitable. Among them, an adhesive (acrylic adhesive) having an acrylic polymer as a main component is preferred.

The term "acrylic polymer" refers to a polymer containing a monomer unit derived from a monomer having at least one (meth)acrylic acid group in one molecule as a monomer unit constituting the polymer. Hereinafter, a monomer having at least one (meth)acrylic acid group in one molecule is also referred to as an "acrylic monomer". Therefore, the acrylic polymer in this specification is defined as a polymer containing monomer units derived from acrylic monomers. Regarding a typical example of an acrylic polymer, an acrylic polymer in which the ratio of acrylic monomers in all monomer components of the acrylic polymer is more than 50% by weight can be exemplified. In addition, the term "(meth) acryloyl group (meta) acryloyl group" means including an acryloyl group and a methacryloyl group. Similarly, the "(meth)acrylate" refers to the inclusion of acrylate and methacrylate, and the "(meth)acryl group" refers to the inclusion of an acrylic group and a methacrylic group.

The so-called "urethane-based polymer" refers to a polyol and a polyfunctional isocyanate as the unit constituting the polymer, the hydroxyl group of the polyol and the isocyanate group of the polyfunctional isocyanate undergo polymerization through the urethane bond (Multi-addition) polymer. The polyols and multifunctional isocyanates before the reaction generally exist in the form of monomers or oligomers (hereinafter sometimes collectively referred to as "monomers"). The urethane polymers obtained by the above reactions generally A structure in which alcohol segments and segments derived from polyfunctional isocyanates alternately repeat. In addition, the above-mentioned monomer includes what is called a so-called macromonomer. In addition, the "oligomer" in this specification means a polymer having a molecular weight of less than 3.0×10 ⁴ . Regarding the molecular weight of the oligomer, the weight average molecular weight (Mw) obtained by gel permeation chromatography (GPC) and converted into standard polystyrene or the molecular weight calculated from the chemical formula is used.

(Polymer with oxyalkylene structural unit) In some preferred aspects, the adhesive layer (which can also be an adhesive composition) includes a polymer containing oxygen alkylene structural units. Thereby, it is easy to obtain good conductivity. The polymer containing an oxyalkylene structural unit may be one having an oxyalkylene structural unit in its main chain or side chain. The oxyalkylene structural unit may also be incorporated in the structure of the polymer (for example, in the network structure). Among them, it is preferably used for polymers having oxyalkylene structural units in the side chain. By arranging the oxyalkylene structural unit in the side chain, it is easy to obtain higher conductivity due to its high degree of freedom. In the configuration in which the polymer side chain has an oxyalkylene structural unit, as long as the chemical structure of the side chain has an oxyalkylene structural unit, there is no particular limitation. The polymer side chain may be in the form of (poly)oxyalkylene monool or (poly)oxyalkylene monoalkyl ether, for example. The form of the side chain terminal is not particularly limited, and it may be an alkyl group such as a methyl group, a phenyl group, etc., or a functional group such as a hydroxyl group.

The content of the oxyalkylene structural unit in the polymer containing the oxyalkylene structural unit is set according to the conductivity to the adherend, etc., so it is not limited to a specific range. The ratio of the oxyalkylene structural unit in the polymer can be, for example, about 10% by weight or more. From the viewpoint of improving conductivity, it is preferably about 25% by weight or more, preferably about 35% by weight or more, more preferably It is about 45% by weight or more, more preferably about 55% by weight or more, and particularly preferably about 65% by weight or more (for example, about 70% by weight or more). The upper limit of the ratio of the oxyalkylene structural unit in the polymer is not particularly limited in consideration of bonding reliability and adherence separation and removal properties, etc. It is preferably set to about 95% by weight or less, for example, about 90% by weight or less. It may be about 85% by weight or less, and may be about 75% by weight or less (for example, about 70% by weight or less).

The polymer containing an oxyalkylene structural unit can be obtained by polymerizing a monomer having an oxyalkylene structural unit. The polymerization method is not particularly limited, and may be radical polymerization, ionic polymerization, polycondensation, compound addition, and the like. Or, for example, by adding an oxyalkylene structural unit to the polymer, a polymer having an oxyalkylene structural unit can also be obtained. For example, a method of adding a compound having an oxyalkylene structure unit such as polyethylene glycol (PEG) to a polymer obtained by a general method by a known or customary method. According to the above method, a polymer having an oxyalkylene structure unit in the side chain can be preferably obtained.

The monomer having an oxyalkylene structural unit is, in some aspects, a compound having a polymerizable reactive group such as a vinyl group and a (meth)acrylic acid group and an oxyalkylene structural unit. For example, an acrylic monomer having an oxyalkylene structure unit, a vinyl ether monomer having an oxyalkylene structure unit, or a polycarboxylic acid monomer having an oxyalkylene structure unit (for example, in maleic anhydride) Addition (for example, esterification) of PEG and other compounds containing oxygen alkylene structural units). In terms of polymerizability, etc., it is preferable to use acrylic monomers having oxyalkylene structural units.

(Acrylic polymer with oxyalkylene structural unit) In some preferred aspects, the polymer containing the oxyalkylene structural unit is an acrylic polymer with the oxyalkylene structural unit. Hereinafter, the preferred examples are described centering on the acrylic polymer containing the oxyalkylene structural unit, but it is not intended to limit the oxyalkylene structural unit-containing polymer disclosed in this application to the acrylic polymer.

The acrylic polymer containing the oxygen alkylene structural unit can be preferably obtained by polymerizing an acrylic monomer having the oxygen alkylene structural unit. Regarding the acrylic monomers containing oxygen alkylene structural units, acrylic monomers containing (poly)oxyethylene units, acrylic monomers containing (poly)oxypropylene units, and (poly)oxyethylene units can be used And (poly)oxypropylene unit of acrylic monomers or one or more.

Regarding the (poly)oxyethylene unit-containing acrylic monomers, alkoxy polyethylene glycol (meth)acrylate, ethoxy polyethylene glycol (meth)acrylate, and other alkoxy (poly) ) Ethylene glycol (meth)acrylate; polyethylene glycol (meth)acrylate, etc. (poly)ethylene glycol (meth)acrylate, etc. Regarding the (poly)oxypropylene unit-containing acrylic monomers, alkoxy (poly)propylene glycol (poly)propylene glycol (meth) acrylate, such as methoxy polypropylene glycol (meth) acrylate and ethoxy polypropylene glycol (meth) acrylate, etc. Base) acrylate; polypropylene glycol (meth)acrylate, etc. (poly)propylene glycol (meth)acrylate, etc. These can be used individually by 1 type or in combination of 2 or more types. Among them, from the viewpoint of electron conductivity, it is preferable to use acrylic monomers containing (poly)oxyethylene units. In the above monomers, the terminal on the side of the oxyalkylene structural unit may be an alkyl group such as a methyl group, a phenyl group, etc., or a functional group such as a hydroxyl group. The terminal structure of the monomer can be appropriately set in consideration of crosslinking reaction and the like.

The amount of the monomer containing the oxygen alkylene structural unit (preferably the acrylic monomer containing the oxygen alkylene structural unit) is set according to the conductivity and adhesion characteristics of the adherend, so it is not limited In a specific range. The usage amount of the monomer of the oxygen-containing alkylene structural unit can be set to about the total amount of monomers used to synthesize the polymer of the oxygen-containing alkylene structural unit (hereinafter also referred to as "total monomer components") 10 mol% or more (for example, 30 mol% or more). From the viewpoint of improving conductivity, the usage amount of the oxygen-containing alkylene structural unit monomer in the total monomer is preferably about 30 mol% or more, preferably about 45 mol% or more, more preferably about 55 mol% or more, More preferably, it is about 65 mol% or more, particularly preferably about 75 mol% or more (for example, about 80 mol% or more). In addition, from the viewpoints of cohesiveness and adhesion, the amount of the oxygen-containing alkylene structural unit monomer in the total monomer is preferably about 95 mol% or less, preferably about 90 mol% or less, or about 80 mol% or less, may be about 70 mol% or less, and may be about 60 mol% or less (for example, about 50 mol% or less).

Regarding the polymer containing the oxygen alkylene structural unit in the technology disclosed in this case, a monomer copolymerized with a hydroxyl group (-OH) can be preferably used. Specific examples of hydroxyl-containing monomers include: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2 -Hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate and other hydroxyl-containing acrylic monomers. This hydroxyl-containing monomer may be used individually by 1 type, and may be used in combination of 2 or more types. According to the polymer formed by copolymerization of the monomer, it is easy to obtain an adhesive that has both the subsequent fixation and separation and removal of the adherend, so it is preferred. For example, since it is easy to control the peeling force from the adherend to be low, it is easy to obtain an adhesive with excellent separation and removability from the adherend. In addition, since the shorter the hydroxyl-containing side chain in the polymer, the easier it is to obtain the effect of improving cohesion, so it is preferable to use polymerizable reactive groups from the above-mentioned hydroxyl-containing monomers (generally (meth)acrylic acid groups). A hydroxyl group-containing monomer with a short distance to the hydroxyl group (in the case of a hydroxyl (meth)acrylate, it is a monomer with a smaller hydroxyalkyl group).

From the viewpoint of fully exerting the use effect of the monomer, the hydroxyl-containing monomer is preferably used at a ratio of about 1 mol% or more in the total amount of monomers used to synthesize the polymer of the oxygen-containing alkylene structural unit, preferably It is about 3 mol% or more, more preferably about 5 mol% or more, still more preferably about 8 mol% or more, and may also be about 12 mol% or more (about 15 mol% or more). In addition, considering the cohesiveness and adhesion of the adhesive, in the total amount of monomers used to synthesize the above-mentioned polymer, the amount of hydroxyl-containing monomers is preferably about 40 mol% or less, preferably about 30 mol% or less, More preferably, it is about 20 mol% or less.

In some preferred aspects, the polymer containing the oxyalkylene structural unit includes a monomer (high Tg monomer) with a homopolymer having a Tg (glass transition temperature) of about 10°C or higher as the monomer unit. By copolymerizing high Tg monomers, the cohesiveness of the adhesive can be improved and the adhesive force can be improved. In addition, there is a tendency to improve the separation and removal properties of preventing glue residue. From the viewpoint of improving agglutinability, in some preferred aspects, the Tg of a homopolymer of a high Tg monomer is preferably about 30°C or higher (for example, about 50°C or higher), may be about 70°C or higher, or about Above 90°C. In addition, the upper limit of the Tg of the homopolymer of the high Tg monomer is not particularly limited. From the viewpoint of ease of synthesis of the polymer, it is generally preferably about 200°C or less. In some aspects, the Tg of the homopolymer of the high Tg monomer can be about 180°C or less, or about 150°C or less, or about 120°C or less.

The high Tg single system is exemplified as a monomer that can be used to synthesize a polymer containing an oxygen-containing alkylene structural unit, and among them, those having a homopolymer Tg of a specific value or higher can be used without particular limitation. For example, one or two or more monomers selected from other monomers such as alkyl (meth)acrylates and monomers containing various functional groups as exemplified below can be used. Among them, alkyl (meth)acrylates are preferred, and alkyl methacrylates (generally methyl methacrylate) having an alkyl group in the range of 1 to 4 carbon atoms are preferred.

The high Tg monomer can be set at a ratio of about 1 mol% or more in the total amount of monomers used to synthesize the polymer of the oxygen-containing alkylene structural unit. From the viewpoint of improving the cohesiveness of the adhesive and improving the adhesion, it is suitable It is about 5 mol% or more, preferably about 10 mol% or more, more preferably about 15 mol% or more, and can also be about 25 mol% or more (for example, about 35 mol% or more). In addition, considering the adhesion, in the total amount of monomers used to synthesize the above polymer, the amount of the high Tg monomer should preferably be about 60 mol% or less, preferably about 50 mol% or less, and more preferably about 40 mol% or less ( For example, about 30 mol% or less). In some other aspects, the amount of high Tg monomers in the total amount of monomers mentioned above may be less than 10 mol%, or less than 1 mol%. The polymer containing the oxygen alkylene structural unit may also be one that does not substantially contain a high Tg monomer as a monomer unit.

The polymer containing the oxygen alkylene structural unit disclosed in this case may also contain alkyl (meth)acrylate as the monomer unit. The alkyl group which the alkyl (meth)acrylate has may be a chain alkyl group or an alicyclic alkyl group. Regarding the number of carbon atoms of the alkyl group, those in the range of 1-20 can be used. Specific examples of the above alkyl (meth)acrylate include: ethyl (meth)acrylate, butyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethyl (meth)acrylate Base hexyl ester, nonyl (meth)acrylate, etc.

From the viewpoints of cohesiveness and adhesion, the amount of alkyl (meth)acrylate (for example, alkyl (meth)acrylate that does not correspond to the above-mentioned high Tg monomer) can be used to synthesize oxygen-containing alkylene The total monomer amount of the polymer of the structural unit is about 30 mol% or less, for example, about 10 mol% or less, or about 1 mol% or less. The polymer of the oxygen-containing alkylene structural unit may also be substantially free of alkyl (meth)acrylate (for example, alkyl (meth)acrylate that does not correspond to the above-mentioned high Tg monomer) as a monomer unit.

In the oxygen-containing alkylene structural unit polymer disclosed in this case, monomers other than the oxygen-containing alkylene structural unit and monomers (other monomers) other than the hydroxyl-containing monomer can also be copolymerized. The monomer can be used, for example, for the purpose of adjusting the adhesion performance (for example, the separation and removability of the adherend). For example, the monomers that can improve the cohesive force and heat resistance of the adhesive include: sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, cyano group-containing monomers, vinyl esters such as vinyl acetate , Styrene and other aromatic vinyl compounds. In addition, with regard to the introduction of functional groups that can serve as crosslinking points in acrylic polymers, or monomers (functional group-containing monomers) that can help improve adhesion, examples include acrylic acid, methacrylic acid, and other carboxyl-containing monomers. Monomers; monomers containing acid anhydride groups such as maleic anhydride; monomers containing amide groups such as acrylamide; monomers containing amine groups; monomers containing imidine groups; monomers containing epoxy groups; (Meth)acrylic morpholine, N-vinylpyrrolidone and other cyclic monomers having nitrogen atoms; vinyl ethers, etc. Furthermore, regarding other monomers, a polyfunctional monomer can be used as a copolymerizable component for the purpose of crosslinking treatment and the like. Regarding the above-mentioned polyfunctional monomer, one or two or more of hexanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, etc. can be used. The above-mentioned other monomers may be used alone or in combination of two or more kinds.

From the viewpoint of making full use of the characteristics of the monomer containing the oxygen-containing alkylene structural unit, the usage amount of the above-mentioned other monomers can be set to about 30 mol% of the total monomer used for synthesizing the polymer of the oxygen-containing alkylene structural unit Below, for example, it may be about 10 mol% or less, and may be about 1 mol% or less. The polymer containing the oxygen alkylene structural unit may substantially not contain the above-mentioned other monomers as monomer units.

The method for obtaining the polymer containing the oxygen-containing alkylene structural unit is not particularly limited, and the known polymers such as solution polymerization method, emulsion polymerization method, bulk polymerization method, suspension polymerization method, photopolymerization method, etc. can be suitably adopted (for example, Acrylic polymer) various polymerization methods. For example, a solution polymerization method can be preferably used. The polymerization temperature during solution polymerization can be appropriately selected according to the types of monomers and solvents used, and the types of polymerization initiators. For example, it can be set at about 20°C to 170°C (generally about 40°C to 140°C). In addition, the above-mentioned polymer may be a random copolymer, a block copolymer or a graft copolymer. From the viewpoint of productivity, etc., a random copolymer is generally preferred.

The solvent (polymerization solvent) used for the solution polymerization can be appropriately selected from previously known organic solvents. For example, any one solvent or a mixed solvent of two or more selected from the following can be used: aromatic compounds such as toluene (generally aromatic hydrocarbons); acetates such as ethyl acetate; hexane or cyclohexane, etc. Aliphatic or alicyclic hydrocarbons; halogenated alkanes such as 1,2-dichloroethane; lower alcohols such as isopropanol (for example, monohydric alcohols with 1 to 4 carbon atoms); tertiary butyl methyl ether and other ethers ; Ketones such as methyl ethyl ketone and so on.

The initiator used for the polymerization can be appropriately selected from previously known polymerization initiators according to the type of polymerization method. For example, one or more of azo polymerization initiators such as 2,2'-azobisisobutyronitrile (AIBN) can be preferably used. Other examples of polymerization initiators include persulfates such as potassium persulfate; peroxide-based initiators such as benzyl peroxide and hydrogen peroxide; substituted ethane-based initiators such as phenyl substituted ethane; aromatics Group carbonyl compounds and so on. As another example of the polymerization initiator, a redox initiator using a combination of a peroxide and a reducing agent can be exemplified. Such a polymerization initiator can be used individually by 1 type or in combination of 2 or more types. The usage amount of the polymerization initiator may be a general usage amount. For example, it can be selected from the range of about 0.005 to 1 part by weight (generally about 0.01 to 1 part by weight) relative to 100 parts by weight of the monomer components.

The weight average molecular weight (Mw) of the oxyalkylene-containing structural unit polymer disclosed in this case, which is obtained by GPC (gel permeation chromatography), converted into standard polystyrene, is preferably about 3×10 ⁴ or more. From the viewpoint of separation and removability of the adherend, it is preferably about 10×10 ⁴ or more, more preferably about 20×10 ⁴ or more, and still more preferably about 30×10 ⁴ or more. In addition, the upper limit of the aforementioned Mw is not particularly limited. For example, it is preferably about 500×10 ⁴ or less. From the viewpoints of adhesion and coating properties when forming the adhesive layer, it is preferably about 100×10 ⁴ or less, more preferably It is about 70×10 ⁴ or less, and may be about 50×10 ⁴ or less.

The dispersion degree (Mw/Mn) of the polymer containing the oxygen alkylene structural unit disclosed in this case is not particularly limited. The degree of dispersion (Mw/Mn) referred to herein refers to the degree of dispersion (Mw/Mn) expressed as the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn). In a preferred aspect, the degree of dispersion (Mw/Mn) of the polymer containing the oxygen-containing alkylene structural unit is preferably about 15 or less. From the viewpoint that a more uniform high-molecular-weight body has better agglomeration, it is more It is preferably about 10 or less, more preferably about 7 or less. In addition, the aforementioned Mw/Mn is theoretically 1 or more, and may be, for example, 2 or more, 3 or more, or 4 or more (generally 5 or more).

Specifically, the above-mentioned Mw and Mn can be measured under the following conditions using the trade name "HLC-8120GPC" (manufactured by Tosoh Corporation) which is a GPC measuring device. [GPC measurement conditions] Sample concentration: 0.2% by weight (tetrahydrofuran solution) Sample injection volume: 100μL Eluent: Tetrahydrofuran (THF) Flow rate (flow rate): 0.8mL/min. Column temperature (measurement temperature): 40℃ Column: East Produced by Cao Company, G7000H _XL + GMH _XL + GMH _XL column size: each 7.8mmφ×30cm total 90cm Detector: Differential Refractometer (RI) Standard sample: Polystyrene

(Urethane-based polymer with oxyalkylene structural unit) In some aspects, the adhesive layer may be one containing a urethane-based polymer having an oxyalkylene structural unit. Urethane polymers containing oxyalkylene structural units generally have oxyalkylene structural units in the main chain skeleton. In some aspects (for example, polyols are added in excess than polyfunctional isocyanates). In the composition), it may have an oxyalkylene structural unit in the side chain. The oxyalkylene structural unit can be derived from any of the polyols and polyfunctional isocyanates constituting the urethane-based polymer. From the viewpoint of the ease of introduction into the polymer structure, by using For the polyol of the structural unit, the oxyalkylene structural unit can be introduced into the urethane-based polymer.

Regarding the polyol used to form the above-mentioned urethane-based polymer, one or more suitable compounds can be selected from compounds having plural hydroxyl groups. For example, one type or two or more types such as polyester polyol, polyether polyol, polycaprolactone polyol, polycarbonate polyol, and castor oil-based polyol can be used. Among them, polyester polyols and polyether polyols are preferably used, and polyether polyols are more preferred. As for the polyether polyol, poly(ethylene glycol), poly(propylene glycol), poly(butylene glycol), polyoxyethylene glyceryl ether, polyoxypropylene glyceryl ether, and the like can be mentioned.

The average number of functional groups of the polyol used to form the urethane-based polymer is about 2 or more, and it is preferably about 2.5 or more (for example, about 2.8 or more) from the viewpoint of improving the cohesive force. The above-mentioned average number of functional groups is usually about 5 or less, and it is preferably about 4 or less (for example, about 3.5 or less) from the viewpoint of adhesion and the like.

The molecular weight of the above-mentioned polyol is appropriately set according to conductivity, adhesive properties, etc., so it is not limited to a specific range. It is usually about 300 or more, preferably about 500 or more, preferably about 800 or more, or about 1000. The above may be about 3000 or more, or about 5000 or more. The upper limit of the molecular weight of the above polyol is, for example, less than 3.0×10 ⁴ , preferably less than about 2.0×10 ⁴ , may be less than about 1.5×10 ⁴ , or less than about 1.2×10 ⁴ (for example, less than 1.0× 10 ⁴ ). The aforementioned polyol may also be a polymer having a number average molecular weight of about 10×10 ⁴ or less (for example, about 5×10 ⁴ or less).

In some preferred aspects, the polyol used to form the above-mentioned urethane-based polymer may be a polyol containing a main component (main polyol), and a secondary component polyol having a lower molecular weight than the main component ( One or more of subpolyols). By using the main polyol and the auxiliary polyol in combination, the effects of the technology disclosed in this case can be better exerted or adjusted. The types of the main polyol and the auxiliary polyol are not particularly limited, and each may be any of polyester polyol, polyether polyol, polycaprolactone polyol, polycarbonate polyol, castor oil-based polyol, etc., respectively. Among them, polyester polyols and polyether polyols are preferred, and polyether polyols are more preferred. Specific examples of polyether polyols include the polyether polyols exemplified above.

The molecular weight of the main polyol used is appropriately set according to conductivity, adhesive properties, etc., so it is not limited to a specific range, and is usually about 3000 or more, preferably about 5000 or more (for example, about 8000 or more). The upper limit of the molecular weight of the main polyol is, for example, less than 3.0×10 ⁴ , preferably about 2.0×10 ⁴ or less, or about 1.5×10 ⁴ or less (for example, 1.2×10 ⁴ or less). As for the secondary polyol, one or more polyols having a molecular weight smaller than that of the main polyol can be used. The molecular weight of one or more of the secondary polyols is respectively about 300 or more, preferably about 500 or more, preferably about 800 or more, or may also be about 1000 or more, for example, about 1500 or more, and for example, about It is less than 1.0×10 ⁴ , preferably about 7000 or less, more preferably about 5000 or less, or about 2500 or less, for example, about 1200 or less.

The average number of functional groups of the main polyol is about 2 or more, and it is preferably about 2.5 or more (for example, about 2.8 or more) from the viewpoint of improving the cohesive force. The above-mentioned average number of functional groups is usually about 5 or less, and it is preferably about 4 or less (for example, about 3.5 or less) from the viewpoint of adhesion and the like. The average number of functional groups of the subpolyol is about 2 or more, and it is preferably about 2.5 or more (for example, about 2.8 or more) from the viewpoint of improving the cohesive force. The above-mentioned average number of functional groups is usually about 5 or less, and it is preferably about 4 or less (for example, about 3.5 or less) from the viewpoint of adhesion and the like.

Regarding the polyol used to form the above-mentioned urethane-based polymer, in the case where the main polyol and the auxiliary polyol are used together, the weight ratio of the main polyol and the auxiliary polyol (main polyol/secondary polyol) It is not particularly limited. For example, it can be about 10/90 or more, preferably about 25/75 or more, preferably about 50/50 or more, or about 70/30 or more (for example, about 80/20 or more). In addition, the above-mentioned weight ratio (main polyol/subpolyol) can be set to, for example, about 99/1 or less, preferably about 95/5 or less (for example, about 90/10 or less).

Regarding the polyfunctional isocyanate used to form the above-mentioned urethane-based polymer, one or more suitable compounds can be selected from compounds having a plurality of isocyanate groups. Examples of polyfunctional isocyanates include aromatic isocyanates such as toluene diisocyanate, diphenylmethane diisocyanate, and xylene diisocyanate; esters such as cyclopentyl diisocyanate, cyclohexyl diisocyanate, and isophorone diisocyanate. Cyclic isocyanate; aliphatic isocyanate such as butylene diisocyanate and hexamethylene diisocyanate. More specifically, it is suitable to use: trimethylolpropane/toluene diisocyanate trimer adduct (manufactured by Tosoh Corporation, trade name "CORONATE L"), trimethylolpropane/hexamethylene diisocyanate tripolymer Polymer adduct (manufactured by Tosoh Corporation, brand name "CORONATE HL"), isocyanurate of hexamethylene diisocyanate (manufactured by Tosoh Corporation, brand name "CORONATE HX") and other isocyanate addition Things etc. These polyfunctional isocyanates may be used individually by 1 type, and may be used in combination of 2 or more types.

The polyol and the polyfunctional isocyanate are blended so that the equivalent ratio of the OH group of the polyol and the NCO group of the polyfunctional isocyanate (NCO group/OH group) becomes an appropriate range. The aforementioned equivalent ratio (NCO group/OH group) is usually about 5.0 or less, preferably about 3.0 or less, may be about 2.5 or less, or may be about 2.0 or less. In addition, the above-mentioned equivalent ratio (NCO group/OH group) is usually about 0.1 or more (for example, about 0.2 or more), preferably about 0.3 or more, and may also be about 0.5 or more.

The content of the polyfunctional isocyanate used to form the aforementioned urethane-based polymer can be set according to the equivalent ratio of the aforementioned polyol (NCO group/OH group), the molecular weight of the polyol, the molecular weight of the polyfunctional isocyanate, etc. Not limited to a specific range. In the adhesive composition used to form the adhesive layer, the content of the polyfunctional isocyanate can be, for example, about 1 part by weight or more, preferably about 5 parts by weight or more, preferably about 5 parts by weight relative to 100 parts by weight of the polyol. 10 parts by weight or more, or about 15 parts by weight or more. In addition, the upper limit of the content of the polyfunctional isocyanate relative to 100 parts by weight of the polyol can be, for example, about 50 parts by weight or less, preferably about 30 parts by weight or less, preferably about 25 parts by weight or less, for example, It may be about 20 parts by weight or less.

The urethane-based polymer disclosed in this case can be obtained by reacting an adhesive composition containing the above-mentioned polyol and polyfunctional isocyanate, using a catalyst if necessary, and the like, under specific temperature conditions. The reaction temperature is usually about 85°C or higher, for example, preferably about 100°C or higher, and preferably about 115°C or higher. The upper limit of the reaction temperature is, for example, preferably 170°C or lower, or about 150°C or lower.

The content ratio of the polymer of the oxygen-containing alkylene structural unit in the adhesive layer disclosed in this case is set according to the electrical conductivity to the adherend, so it is not limited to a specific range. The content ratio of the oxyalkylene structural unit polymer in the adhesive layer can be, for example, about 30% by weight or more. From the viewpoint of improving conductivity, bonding reliability, and separation and removal of the adherend, it is preferable to set It is about 50% by weight or more (generally more than 50% by weight), preferably about 60% by weight or more, more preferably about 70% by weight or more, still more preferably about 80% by weight or more, and may also be about 90% by weight or more. In consideration of bonding reliability, adherence, separation and removal properties, conductivity, etc., the upper limit of the content of the oxygen alkylene structural unit polymer in the adhesive layer is preferably about 95% by weight or less, for example, about 90% by weight the following.

(Ionic compound) The adhesive layer (also an adhesive composition) disclosed in this case preferably contains ionic compounds as conductive components. By including ionic compounds, the adhesive layer can better exhibit good conductivity. The use of ionic compounds is preferable in terms of maintaining the transparency of the adhesive layer. In the case of using an adhesive layer containing an oxyalkylene structural unit, the oxyalkylene structural unit in the adhesive layer can become a mobile medium of an ionic compound or electrically support an ionic compound. Play good electrical conductivity.

Regarding ionic compounds, alkali metal salts, ionic liquids, and the like can be exemplified. These may be used individually by 1 type, and may be used in combination of 2 or more types. Furthermore, the term "ionic liquid" (sometimes referred to as normal temperature molten salt) in this case refers to molten salt (ionic compound) that is liquid at 40°C or lower. Since the ionic liquid is liquid below 40°C, it is easier to add to the adhesive and to disperse or dissolve in this temperature range than solid salt. Furthermore, since ionic liquids have no vapor pressure (non-volatile), they will not disappear over time and continue to exhibit conductivity.

(Alkali metal salt) In some preferred aspects, an alkali metal salt is used as an ionic compound. Typical examples of alkali metal salts include lithium salts, sodium salts, and potassium salts. For example, it can be used by a Li cation component of ^+, Na ⁺ or K ^+, and as the Cl anion component of ^{-, Br -, I -,} BF 4 -, PF 6 -, SCN -, ClO 4 -, CF 3 SO _{^{3 -, (FSO 2) 2}} N -, (CF 3 SO 2) 2 N -, (C 2 F 5 SO 2) 2 N - or _{(CF 3 SO 2) 3 C} - the metal salt. From the viewpoint of higher dissociability, lithium salt is suitable. Preferred specific examples include: LiBr, LiI, LiBF ₄ , LiPF ₆ , LiSCN, LiClO ₄ , LiCF ₃ SO ₃ , Li(CF ₃ SO ₂ ) ₂ N, Li(C ₂ F ₅ SO ₂ ) ₂ N , Li(CF ₃ SO ₂ ) ₃ C and other lithium salts. Among them, it is particularly preferred that the anion component is a lithium salt of a fluorine-containing anion such as bis(perfluoroalkylsulfonyl)imide anion and perfluoroalkylsulfonium anion (for example, Li(CF ₃ SO ₂ ) ₂ N, Li( C ₂ F ₅ SO ₂ ) ₂ N, LiCF ₃ SO ₃ ). These alkali metal salts may be used individually by 1 type, and may be used in combination of 2 or more types.

(Ionic liquid) Regarding the above-mentioned ionic liquid, any one or more of nitrogen-containing onium salts, sulfur-containing onium salts, and phosphonium-containing onium salts can be preferably used. In a preferred aspect, the adhesive layer includes an ionic liquid having at least one organic cation component represented by any one of the following general formulas (A) to (E).

[Chemical formula 1]

Wherein, in the above formula (A), Ra represents _a hydrocarbon group having 4 to 20 carbon atoms or a functional group containing a heteroatom. R _b and R _c may be the same or different, and each represents a hydrogen atom or a hydrocarbon group having 1 to 16 carbon atoms or a functional group containing a heteroatom. However, when the nitrogen atom contains a double bond, R _c does not exist. In the above formula (B), R _d represents a hydrocarbon group having 2 to 20 carbon atoms or a functional group containing a hetero atom. R _e , R _f and R _g may be the same or different, and each represents a hydrogen atom or a hydrocarbon group having 1 to 16 carbon atoms or a functional group containing a hetero atom. In the above formula (C), R _h represents a hydrocarbon group having 2 to 20 carbon atoms or a functional group containing a hetero atom. R _i , R _j and R _k may be the same or different, and each represents a hydrogen atom or a hydrocarbon group having 1 to 16 carbon atoms or a functional group containing a heteroatom. In the above formula (D), Z represents a nitrogen atom, a sulfur atom, or a phosphorus atom. R _l , R _m , R _n and R _o may be the same or different, and each represents a hydrocarbon group having 1 to 20 carbon atoms or a functional group containing a heteroatom. However, when Z is a sulfur atom, R _o does not exist. In the above formula (E), R _p represents a hydrocarbon group having 1 to 18 carbon atoms or a functional group containing a hetero atom.

Regarding the cation represented by the formula (A), pyridinium cations, pyrrolidinium cations, piperidinium cations, cations having a pyrroline skeleton, and cations having a pyrrole skeleton can be exemplified.

Specific examples of pyridinium cations include: 1-methylpyridinium, 1-ethylpyridinium, 1-propylpyridinium, 1-butylpyridinium, 1-pentylpyridinium, and 1-hexylpyridinium. Onium, 1-heptylpyridinium, 1-octylpyridinium, 1-nonylpyridinium, 1-decylpyridinium, 1-allylpyridinium, 1-propyl-2-methylpyridinium, 1-Butyl-2-methylpyridinium, 1-pentyl-2-methylpyridinium, 1-hexyl-2-methylpyridinium, 1-heptyl-2-methylpyridinium, 1-octyl 2-methylpyridinium, 1-nonyl-2-methylpyridinium, 1-decyl-2-methylpyridinium, 1-propyl-3-methylpyridinium, 1-butyl- 3-methylpyridinium, 1-butyl-4-methylpyridinium, 1-heptyl-3-methylpyridinium, 1-hexyl-3-methylpyridinium, 1-heptyl-3-methyl Pyridinium, 1-octyl-3-methylpyridinium, 1-octyl-4-methylpyridinium, 1-nonyl-3-methylpyridinium, 1-decyl-3-methylpyridinium Onium, 1-propyl-4-methylpyridinium, 1-heptyl-4-methylpyridinium, 1-hexyl-4-methylpyridinium, 1-heptyl-4-methylpyridinium, 1 -Nonyl-4-methylpyridinium, 1-decyl-4-methylpyridinium, 1-butyl-3,4-dimethylpyridinium, etc.

Specific examples of pyrrolidinium cations include: 1,1-dimethylpyrrolidinium, 1-ethyl-1-methylpyrrolidinium, 1-methyl-1-propylpyrrolidinium, 1 -Methyl-1-butylpyrrolidinium, 1-methyl-1-pentylpyrrolidinium, 1-methyl-1-hexylpyrrolidinium, 1-methyl-1-heptylpyrrolidinium, 1-methyl-1-octylpyrrolidinium, 1-methyl-1-nonylpyrrolidinium, 1-methyl-1-decylpyrrolidinium, 1-methyl-1-methoxyethyl Oxyethylpyrrolidinium, 1-ethyl-1-propylpyrrolidinium, 1-ethyl-1-butylpyrrolidinium, 1-ethyl-1-pentylpyrrolidinium, 1-ethyl 1-hexylpyrrolidinium, 1-ethyl-1-heptylpyrrolidinium, 1,1-dipropylpyrrolidinium, 1-propyl-1-butylpyrrolidinium, 1,1- Dibutylpyrrolidinium, pyrrolidinium-2-one, etc.

Specific examples of piperidinium cations include: 1-propylpiperidinium, 1-pentylpiperidinium, 1,1-dimethylpiperidinium, 1-methyl-1-ethylpiperidine Onium, 1-methyl-1-propylpiperidinium, 1-methyl-1-butylpiperidinium, 1-methyl-1-pentylpiperidinium, 1-methyl-1-hexylpiperidinium Iridium, 1-methyl-1-heptylpiperidinium, 1-methyl-1-octylpiperidinium, 1-methyl-1-decylpiperidinium, 1-methyl-1-methyl Oxyethoxyethylpiperidinium, 1-ethyl-1-propylpiperidinium, 1-ethyl-1-butylpiperidinium, 1-ethyl-1-pentylpiperidinium, 1-Ethyl-1-hexylpiperidinium, 1-ethyl-1-heptylpiperidinium, 1,1-dipropylpiperidinium, 1-propyl-1-butylpiperidinium, 1 -Propyl-1-pentylpiperidinium, 1-propyl-1-hexylpiperidinium, 1-propyl-1-heptylpiperidinium, 1,1-dibutylpiperidinium, 1- Butyl-1-pentylpiperidinium, 1-butyl-1-hexylpiperidinium, 1-butyl-1-heptylpiperidinium and the like.

Specific examples of cations having a pyrroline skeleton include 2-methyl-1-pyrroline and the like. Specific examples of cations having a pyrrole skeleton include 1-ethyl-2-phenylindole, 1,2-dimethylindole, 1-ethylcarbazole, and the like.

Regarding the cation represented by formula (B), imidazolium cation, tetrahydropyrimidinium cation, dihydropyrimidinium cation, etc. can be exemplified.

Specific examples of imidazolium cations include: 1,3-dimethylimidazolium, 1,3-diethylimidazolium, 1-methyl-3-ethylimidazolium, 1-methyl-3- Hexylimidazolium, 1-ethyl-3-methylimidazolium, 1-propyl-3-methylimidazolium, 1-butyl-3-methylimidazolium, 1-pentyl-3-methylimidazole Onium, 1-hexyl-3-methylimidazolium, 1-heptyl-3-methylimidazolium, 1-octyl-3-methylimidazolium, 1-nonyl-3-methylimidazolium, 1 -Decyl-3-methylimidazolium, 1-dodecyl-3-methylimidazolium, 1-tetradecyl-3-methylimidazolium, 1-hexadecyl-3-methyl Imidazolium, 1-octadecyl-3-methylimidazolium, 1,2-dimethyl-3-propylimidazolium, 1-ethyl-2,3-dimethylimidazolium, 1-butyl Yl-2,3-dimethylimidazolium, 1-hexyl-2,3-dimethylimidazolium, 1-(2-methoxyethyl)-3-methylimidazolium, etc.

Specific examples of tetrahydropyrimidinium cations include: 1,3-dimethyl-1,4,5,6-tetrahydropyrimidinium, 1,2,3-trimethyl-1,4,5, 6-tetrahydropyrimidinium, 1,2,3,4-tetramethyl-1,4,5,6-tetrahydropyrimidinium, 1,2,3,5-tetramethyl-1,4,5, 6-Tetrahydropyrimidinium and the like.

Specific examples of dihydropyrimidinium cations include: 1,3-dimethyl-1,4-dihydropyrimidinium, 1,3-dimethyl-1,6-dihydropyrimidinium, 1,2 ,3-Trimethyl-1,4-dihydropyrimidinium, 1,2,3-trimethyl-1,6-dihydropyrimidinium, 1,2,3,4-tetramethyl-1,4 -Dihydropyrimidinium, 1,2,3,4-tetramethyl-1,6-dihydropyrimidinium, etc.

Regarding the cation represented by the formula (C), pyrazolium cation, dihydropyrazolium cation and the like can be exemplified.

Specific examples of pyrazolium cations include: 1-methylpyrazolium, 3-methylpyrazolium, 1-ethyl-2,3,5-trimethylpyrazolium, 1-propyl -2,3,5-trimethylpyrazolium, 1-butyl-2,3,5-trimethylpyrazolium, 1-(2-methoxyethyl)pyrazolium, etc. Specific examples of dihydropyrazolium cations include 1-ethyl-2-methylpyrazolium dihydrogen and the like.

Regarding the cation represented by the formula (D), it can be exemplified that each of the same or different R _l , R _m , R _n and R _o is a cation of an alkyl group having 1 to 20 carbon atoms. Examples of this cation include tetraalkylammonium cation, trialkylsulfonium cation, and tetraalkylphosphonium cation. Regarding other examples of the cation represented by the formula (D), one in which a part of the above-mentioned alkyl group is substituted with an alkenyl group or an alkoxy group, and further an epoxy group, etc. may be mentioned. In addition, one or two or more of R _l , R _m , R _n and R _o may include an aromatic ring or an aliphatic ring.

The cation represented by the formula (D) may be a cation with a symmetric structure or an asymmetric cation. Regarding the ammonium cation with a symmetric structure, examples can be given: R _l , R _m , R _n and R _o are the same alkyl groups (for example, methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl , Nonyl, decyl, dodecyl, hexadecyl, octadecyl) tetraalkylammonium cation.

Regarding representative examples of asymmetric ammonium cations, three of R _l , R _m , R _n and R _o are the same and the remaining one is different. Specific examples are: trimethylethylammonium, trimethylammonium Methylpropylammonium, trimethylbutylammonium, trimethylpentylammonium, trimethylhexylammonium, trimethylheptylammonium, trimethyloctylammonium, trimethylnonylammonium, trimethyl Decylammonium, triethylmethylammonium, triethylpropylammonium, triethylbutylammonium, triethylpentylammonium, triethylhexylammonium, triethylheptylammonium, triethyloctyl Ammonium, triethylnonylammonium, triethyldecylammonium, tripropylmethylammonium, tripropylethylammonium, tripropylbutylammonium, tripropylpentylammonium, tripropylhexylammonium, Tripropylheptylammonium, tripropyloctylammonium, tripropylnonylammonium, tripropyldecylammonium, tributylmethylammonium, tributylethylammonium, tributylpropylammonium, tributyl Pentyl ammonium, tributylhexyl ammonium, tributylheptyl ammonium, tripentyl methyl ammonium, tripentyl ethyl ammonium, tripentyl propyl ammonium, tripentyl butyl ammonium, tripentyl hexyl ammonium, three Pentylheptylammonium, trihexylmethylammonium, trihexylethylammonium, trihexylpropylammonium, trihexylbutylammonium, trihexylpentylammonium, trihexylheptylammonium, triheptylmethylammonium, three Heptylethylammonium, triheptylpropylammonium, triheptylbutylammonium, triheptylpentylammonium, triheptylhexylammonium, trioctylmethylammonium, trioctylethylammonium, trioctyl Propylammonium, trioctylbutylammonium, trioctylpentylammonium, trioctylhexylammonium, trioctylheptylammonium, trioctyldodecylammonium, trioctylhexadecylammonium, trioctyl Asymmetric tetraalkylammonium cations such as octadecylammonium, trinonylmethylammonium, and tridecylmethylammonium.

Other examples of asymmetric ammonium cations include: dimethyl diethyl ammonium, dimethyl dipropyl ammonium, dimethyl dibutyl ammonium, dimethyl dipentyl ammonium, dimethyl dihexyl ammonium , Dimethyl diheptyl ammonium, dimethyl dioctyl ammonium, dimethyl dinonyl ammonium, dimethyl didecyl ammonium, dipropyl diethyl ammonium, dipropyl dibutyl ammonium, two Propyl dipentyl ammonium, dipropyl dihexyl ammonium, dimethyl ethyl propyl ammonium, dimethyl ethyl butyl ammonium, dimethyl ethyl pentyl ammonium, dimethyl ethyl hexyl ammonium, two Methyl ethyl heptyl ammonium, dimethyl ethyl nonyl ammonium, dimethyl propyl butyl ammonium, dimethyl propyl pentyl ammonium, dimethyl propyl hexyl ammonium, dimethyl propyl heptyl Ammonium, dimethylbutylhexylammonium, dimethylbutylheptylammonium, dimethylpentylhexylammonium, dimethylhexylheptylammonium, diethylmethylpropylammonium, diethylmethylpentylammonium , Diethylmethylheptylammonium, Diethylpropylpentylammonium, Dipropylmethylethylammonium, Dipropylmethylpentylammonium, Dipropylbutylhexylammonium, Dibutylmethylpentyl Tetraalkylammonium cations such as ammonium, dibutylmethylhexylammonium, methylethylpropylbutylammonium, methylethylpropylpentylammonium, methylethylpropylhexylammonium; trimethylcyclohexylammonium, etc. Ammonium cations containing cycloalkyl groups; diallyl dimethyl ammonium, diallyl dipropyl ammonium, diallyl methylhexyl ammonium, diallyl methyl octyl ammonium, etc. containing alkenyl ammonium Cation; triethyl(methoxyethoxyethyl)ammonium, dimethylethyl(methoxyethoxyethyl)ammonium, dimethylethyl(ethoxyethoxyethyl)ammonium , Diethyl methyl (2-methoxyethyl) ammonium, diethyl methyl (methoxyethoxy ethyl) ammonium and other ammonium cations containing alkoxy; Glyoxypropyl trimethyl ammonium Such as ammonium cations containing epoxy groups.

Regarding the symmetric structure of the alumium cation, R ₁ , R _m and R _n are trialkyl alumium cations of the same alkyl group (for example, any one of methyl, ethyl, propyl, butyl, and hexyl). Regarding the asymmetric sulfonium cations, asymmetric trialkyl sulfonium cations such as dimethyl decyl sulfonium, diethyl methyl sulfonium, and dibutyl ethyl sulfonium cation can be mentioned.

Regarding the phosphonium cation of the symmetrical structure, examples include: R _l , R _m , R _n and R _o are the same alkyl groups (for example, methyl, ethyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl Any one of, decyl) tetraalkylphosphonium cation. Regarding asymmetric phosphonium cations, three of R _l , R _m , R _n and R _o are the same, and the remaining one is different. Examples include: trimethylpentyl phosphonium, three Methylhexyl phosphonium, trimethylheptyl phosphonium, trimethyl octyl phosphonium, trimethyl nonyl phosphonium, trimethyl decyl phosphonium, triethyl methyl phosphonium, tributyl ethyl phosphonium, tributyl -(2-Methoxyethyl) phosphonium, tripentyl methyl phosphonium, trihexyl methyl phosphonium, triheptyl methyl phosphonium, trioctyl methyl phosphonium, trinonyl methyl phosphonium, tridecyl methyl phosphonium Ji Jiong et al. Other examples of asymmetric phosphonium cations include: trihexyl tetradecyl phosphonium, dimethyl dipentyl phosphonium, dimethyl dihexyl phosphonium, dimethyl diheptyl phosphonium, dimethyl dioctyl phosphonium , Dimethyl dinonyl phosphonium, dimethyl didecyl phosphonium and other asymmetric tetraalkyl phosphonium cations; trimethyl (methoxyethoxyethyl) phosphonium, dimethyl ethyl (methoxyethyl) (Oxyethyl) phosphonium and other alkoxy-containing cations.

Preferred examples of the cation represented by formula (D) include: the above-mentioned asymmetric tetraalkylammonium cation, asymmetric trialkylaluminium cation, and asymmetric tetraalkylphosphonium cation.

The cation represented by the formula (E) can be exemplified: R _p is any one of the alkyl groups having 1 to 18 carbon atoms. Specific examples of R _p include: methyl, ethyl, propyl, butyl, hexyl, octyl, nonyl, decyl, dodecyl, tridecyl, tetradecyl, octadecyl Alkyl and so on.

The anion component of the above-mentioned ionic liquid is not particularly limited as long as the salt of any one of the cations disclosed in the present application can become an ionic liquid. About Specific examples ^{include: Cl -, Br -, I} -, AlCl 4 -, Al 2 Cl 7 -, BF 4 -, PF 6 -, ClO 4 -, NO 3 -, CH 3 COO -, CF 3 COO _{^{-, CH 3 SO 3 -,}} CF 3 SO 3 -, (FSO 2) 2 N -, (CF 3 SO 2) 2 N -, (CF 3 SO 2) 3 C -, AsF 6 -, SbF 6 -, _{^{NbF 6 -, TaF 6 -,}} F (HF) n -, (CN) 2 N -, C 4 F 9 SO 3 -, (C 2 F 5 SO 2) 2 N -, C 3 F 7 COO -, ( _{CF 3 SO 2) (CF 3} CO) N -, C 9 H 19 COO -, (CH 3) 2 PO 4 -, (C 2 H 5) 2 PO 4 -, C 2 H 5 OSO 3 -, C 6 _{^{H 13 OSO 3 -, C 8}} H 17 OSO 3 -, CH 3 (OC 2 H 4) 2 OSO 3 -, C 6 H 4 (CH 3) SO 3 -, (C 2 F 5) 3 PF 3 -, ^{_{CH 3 CH (OH) COO -}} , and the following formula (F) denotes the anion.

[Chemical formula 2]

Among them, the hydrophobic anionic component tends to be difficult to ooze out on the surface of the adhesive, so it is suitable for use from the viewpoint of low pollution. In addition, an anion component containing a fluorine atom (for example, an anion component containing a perfluoroalkyl group) can be preferably used because an ionic compound with a low melting point can be obtained. As preferred embodiments of the anion component include: bis (perfluoroalkyl sulfonic acyl) acyl imide anion (e.g. _{(CF 3 SO 2) 2 N} -, (C 2 F 5 SO 2) 2 N -) , sulfonium perfluoroalkyl anions (e.g., CF ₃ SO ₃ ^-) fluorine-containing anions. Regarding the number of carbon atoms of the aforementioned perfluoroalkyl group, it is usually 1 to 3, and 1 or 2 is particularly preferable.

The ionic liquid used in the technology disclosed in this case may be an appropriate combination of the above-mentioned cationic components and anionic components. As an example, when the cationic component is a pyridinium cation, specific combinations with the above-mentioned anionic component include: 1-butylpyridinium tetrafluoroborate, 1-butylpyridinium hexafluorophosphate, 1-butyl -3-methylpyridinium tetrafluoroborate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl) Imidine, 1-butyl-3-methylpyridinium bis(pentafluoroethanesulfonyl) imine, 1-hexylpyridinium tetrafluoroborate, 1-allylpyridinium bis(trifluoromethyl) Sulfonyl) imide and the like. Regarding each of the above-mentioned other cations, ionic liquids related to any combination of anionic components disclosed in this case can also be used in the same way.

Such an ionic liquid can be commercially available, or can be easily synthesized by a known method. The synthesis method of the ionic liquid is not particularly limited as long as the target ionic liquid can be obtained. Generally speaking, the halide method, hydroxide method, acid ester method, complex formation method, and neutralization method described in the well-known document "Ionic Liquid-Development Frontier and Future-" (CMC Publishing) can be used Wait.

(Other ionic compounds) Furthermore, regarding ionic compounds, in addition to the above-mentioned alkali metal salts and ionic liquids (for example, organic cation-anion salts), ammonium chloride, aluminum chloride, copper chloride, ferrous chloride, ferric chloride, and sulfuric acid can also be used. Inorganic salts such as ammonium. In addition, the ionic compound disclosed in this case includes what is generally called an ionic surfactant. Regarding ionic surfactants, cationic surfactants having cationic functional groups such as quaternary ammonium salts, phosphonium salts, sulfonium salts, pyridinium salts, and amine groups; carboxylic acids, sulfonates, sulfates, Anionic surfactants with anionic functional groups such as phosphate and phosphite; Sultaine and its derivatives, alkyl betaine and its derivatives, imidazoline and its derivatives, alkyl imidazolium betaine Zwitterionic surfactants such as its derivatives. These may be used individually by 1 type, and may be used in combination of 2 or more types.

The amount of the ionic compound contained in the adhesive layer is not particularly limited. It can be set to about 1% by weight or more in the adhesive layer (in the solid content of the adhesive composition). From the viewpoint of improving conductivity, it is preferably set to about 3 % By weight or more, preferably about 6% by weight or more, more preferably about 9% by weight or more, still more preferably about 12% by weight or more. The amount of the ionic compound in the adhesive layer is usually about 40% by weight or less. From the viewpoint of the influence on the adhesion properties and the prevention of contamination by the adherend, it is preferably about 30% by weight or less, preferably about 25% by weight or less ( For example, about 20% by weight or less).

Furthermore, in the adhesive layer disclosed in this case, the conductive agent may contain organic conductive materials such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, allylamine-based polymers, or tin oxide, antimony oxide, Indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, iron, cobalt, copper iodide, ITO (indium oxide/tin oxide), ATO (Antimony oxide/tin oxide) and other metal particles or metal oxide particles and other inorganic conductive materials. Regarding the conductive agent, an inorganic composite conductive material in which inorganic particles such as glass are coated with a metal such as silver, or an organic-inorganic composite conductive material in which inorganic particles are coated with an organic material such as a conductive polymer can also be used. From the standpoint of having both adhesive strength, separation and removal of the adherend, and transparency, the content of conductive materials (generally inorganic conductive materials) other than ionic compounds should be limited to less than 20% by volume in the adhesive layer , Preferably it is less than 10% by volume, more preferably less than 3% by volume, and even more preferably less than 1% by volume. The technology disclosed in this case can be preferably implemented in a state where the adhesive layer does not substantially contain conductive materials other than ionic compounds.

In the technology disclosed in this case, the shape of the adhesive composition used to form the adhesive layer is not particularly limited. For example, it can be: an adhesive composition in the form of an adhesive component in an organic solvent (solvent adhesive composition), an adhesive composition in a form in which the adhesive component is dispersed in an aqueous solvent (water dispersion adhesive composition, Generally, it is an aqueous emulsion adhesive composition), an adhesive composition in which the adhesive component is dissolved in water (aqueous solution adhesive composition), and a solvent-free adhesive composition (for example, using active energy rays such as ultraviolet rays or electron beams) Adhesive composition, hot-melt adhesive composition, etc. which are cured by irradiation. In some preferred aspects, the adhesive sheet has an adhesive layer formed of a solvent-based adhesive composition. The organic solvent contained in the solvent-based adhesive composition may be, for example, any one of toluene, xylene, ethyl acetate, hexane, cyclohexane, methylcyclohexane, heptane, and isopropanol. The single solvent may also be a mixed solvent with any of them as the main component.

In the technology disclosed in this case, the adhesive composition (preferably a solvent-based adhesive composition) used to form the adhesive layer can be preferably used so that the polymer contained in the composition (generally is (Polymers containing oxygen alkylene structural units) are formed in a manner obtained by appropriately cross-linking. Regarding the specific cross-linking method, the following method can be preferably used: by copolymerizing monomers with appropriate functional groups (hydroxyl, carboxyl, etc.) to introduce cross-linking points into the polymer, and then adding it to the polymer A method of reacting with a compound (crosslinking agent) that can react with its functional group to form a crosslinked structure.

The type of crosslinking agent used is not particularly limited. Examples include: isocyanate crosslinking agent, epoxy crosslinking agent, oxazoline crosslinking agent, aziridine crosslinking agent, melamine crosslinking agent Agent, peroxide-based cross-linking agent, urea-based cross-linking agent, metal alkoxide-based cross-linking agent, metal chelate-based cross-linking agent, metal salt-based cross-linking agent, carbodiimide-based cross-linking agent, amine Department of crosslinking agent and so on. These crosslinking agents can be used individually by 1 type or in combination of 2 or more types. Among them, isocyanate-based crosslinking agents are preferred.

The amount of cross-linking agent used can be appropriately selected according to the type, structure, molecular weight, etc. of the polymer, adhesion properties, such as adhesion or peelability. For example, by setting the usage amount of the crosslinking agent to a specific amount or more, the cohesive force of the adhesive can be improved, and residual glue can be prevented from remaining on the adherend. From this point of view, the amount of crosslinking agent used relative to 100 parts by weight of the polymer (generally a polymer containing oxygen alkylene structural units) is preferably about 0.01 parts by weight or more, preferably about 0.1 parts by weight or more ( For example, about 0.2 parts by weight or more). In addition, the amount of the crosslinking agent used is preferably about 10 parts by weight or less (for example, about 5 parts by weight or less). In the case of using an isocyanate-based crosslinking agent as the crosslinking agent, the amount of the isocyanate-based crosslinking agent used relative to 100 parts by weight of the polymer (generally a polymer containing oxygen alkylene structural units) is preferably set to about 0.5 Part by weight or more, preferably about 1 part by weight or more, more preferably about 1.5 parts by weight or more (for example, about 2 parts by weight or more), and can be set to about 3 parts by weight or less.

For the purpose of promoting various reactions related to the formation of the adhesive layer, the adhesive composition may further include a catalyst. The above-mentioned catalyst may be what is called a crosslinking catalyst or a hardening catalyst. The type of catalyst can be appropriately selected according to the type of compound (crosslinking agent, etc.) used. Examples of catalysts include iron-containing compounds such as iron acetoacetone and iron 2-ethylhexanoate, dioctyltin dilaurate, dibutyltin dilaurate, dibutyltin diacetate, and dibutyltin diethyl Tin (Sn) compounds such as acetone, tetra-n-butyltin, trimethyltin hydroxide, and organometallic compounds such as titanium-containing compounds such as tetraisopropyl titanate and tetra-n-butyl titanate; N,N,N', N'-Tetramethylhexamethylenediamine, triethylamine and other amines, imidazoles and other nitrogen-containing (N) compounds; lithium hydroxide, potassium hydroxide, sodium methoxide and other basic compounds; p-toluenesulfonic acid, trichloro Acidic compounds such as acetic acid, phosphoric acid, monoalkyl phosphoric acid, dialkyl phosphoric acid, phosphoric acid ester of β-hydroxyethyl acrylate, etc. These can be used individually by 1 type or in combination of 2 or more types. The amount of the catalyst contained in the adhesive composition can be, for example, about 0.001 to 10 parts by weight (preferably about 0.005 to 5 parts by weight) relative to 100 parts by weight of the polymer.

The technology disclosed in this case can also be implemented by using an adhesive layer containing a polymer different from the polymer containing oxygen alkylene structural unit (ie, a polymer without oxygen alkylene structural unit). In the case where the adhesive layer contains a polymer containing an oxyalkylene structural unit, in addition to a polymer containing an oxyalkylene structural unit, a polymer without the above-mentioned oxyalkylene structural unit may also be included. Regarding the polymer not containing the above-mentioned oxyalkylene structural unit, the various polymers exemplified above, that is, those having no oxyalkylene structural unit can be used. The content of the polymer containing no oxygen alkylene structural unit in the adhesive layer is set according to the target adhesive characteristics and conductivity, and is not limited to a specific range. For example, it can be made into the adhesive layer (in the solid content of the adhesive composition) about 70% by weight or less, preferably about 50% by weight or less, and it is made of other adhesives such as polymers that fully utilize oxygen-containing alkylene structural units. From the viewpoint of the role of the layer constituents, it is preferably about 30% by weight or less, preferably about 10% by weight or less, and more preferably about 3% by weight or less (for example, 0 to 1% by weight).

In the above-mentioned adhesive composition, various previously known additives may be further formulated as needed. Examples of the additives include surface lubricants, leveling agents, antioxidants, preservatives, light stabilizers, ultraviolet absorbers, polymerization inhibitors, silane coupling agents, and the like. In addition, an adhesion imparting resin or a peeling regulator can also be formulated. Furthermore, the adhesive layer disclosed in this application may contain an alkylene oxide compound such as polyethylene glycol or polypropylene glycol, or may not contain it. When synthesizing adhesive polymers by emulsion polymerization, it is advisable to use emulsifiers or chain transfer agents (also can be understood as molecular weight regulators or polymerization degree regulators).

(Method of forming adhesive layer) The adhesive layer in the technology disclosed in this case can be formed, for example, by a method (direct method) in which the above-mentioned adhesive composition is directly applied to the substrate film and then dried or cured. Alternatively, the adhesive composition can also be applied to the surface (release surface) of the release liner and then dried or hardened to form an adhesive layer on the surface, and then bond the adhesive layer thus formed It is formed by the method of transferring the adhesive layer (transfer method) on the base film. From the viewpoint of the anchorage of the adhesive layer, the direct method is usually better. When applying the adhesive composition (generally coating), roll coating, gravure coating, reverse coating, roll brushing, spraying, air knife coating, and slit-type coating can be used appropriately. The coating method of the coater is equivalent to various methods previously known in the field of adhesive sheets. The drying of the adhesive composition may be performed under heating (for example, heating to about 60°C to 150°C) as needed. Regarding the method of curing the adhesive composition, ultraviolet rays, lightning rays, α rays, β rays, γ rays, X rays, electron beams, etc. can be suitably used.

(The thickness of the adhesive layer) Although not particularly limited, the thickness of the adhesive layer can be set to, for example, about 1 μm or more. From the viewpoint of the reliability of adhesion to the adherend, it is preferably about 3 μm or more, preferably about 5 μm or more (for example, about 7 μm or more) ). Furthermore, the above-mentioned thickness can be set to, for example, about 100 μm or less, and from the viewpoint of adherence separation and removability, it is preferably about 50 μm or less, more preferably about 30 μm or less (for example, about 20 μm or less). Since the adhesive layer disclosed in this case can exhibit good conductivity without using conductive agents such as metal particles, it is possible to form an adhesive layer showing a surface resistance value below a predetermined value with a thin thickness.

<Adhesive composition> As described above, the adhesive layer of the adhesive sheet disclosed in this case is formed of an adhesive composition. Therefore, the technology disclosed in this case includes an adhesive composition. According to the above-mentioned adhesive composition, the following adhesive can be preferably realized: it can have both conductivity above the specified and adhesive force within the specified range, for example, with a surface resistance value of 1.0×10 ⁸ Ω/□ or less, to adhere to SUS board The force is within the range of 0.01~4.0N/20mm. As described above, the adhesive composition disclosed in this case may contain an oxyalkylene structural unit. Some preferred aspects of the adhesive composition include a polymer having an oxyalkylene structural unit and/or an oligomer or monomer used to form the polymer, and may further include an ionic compound as an optional component, or Various additives. The details of its composition (specific examples and contents of contained components) are as described above, so the description will not be repeated.

＜Base layer＞ In a single-sided adhesive or double-sided adhesive adhesive sheet with a substrate, various substrate films can be used for the substrate layer for supporting (backing) the adhesive layer. As for the above-mentioned base film, resin films, paper, cloth, rubber sheets, foam sheets, metal foils, composites thereof, etc. can be used. Among them, a resin film is preferably used. The so-called resin film in this case is generally a non-porous resin sheet, for example, a concept that is distinguished from non-woven fabric (that is, non-woven fabric is not included), and generally refers to molding various resin materials into a film shape.

Examples of resin films include: polyolefin resin films such as polyethylene (PE), polypropylene (PP), and ethylene-propylene copolymer; polyethylene terephthalate (PET), polyethylene naphthalate Polyester resin films such as diesters (PEN); vinyl chloride resin films; vinyl acetate resin films; polyimide resin films; polyimide resin films; fluororesin films; cellophane, etc. The above-mentioned resin film may have a single-layer structure or a structure formed by a plurality of layers with different compositions. Generally, a resin film with a single-layer structure is preferably used.

Examples of paper include Japanese paper, kraft paper, cellophane, high-quality paper, synthetic paper, and top coat paper. Examples of fabrics include woven fabrics or non-woven fabrics of various fibrous materials alone or by blending. Examples of the above-mentioned fibrous substance include cotton, staple fiber, manila hemp, pulp, rayon, acetate fiber, polyester fiber, polyvinyl alcohol fiber, polyamide fiber, polyolefin fiber, and the like. Examples of rubber sheets include natural rubber sheets and butyl rubber sheets. Examples of foam sheets include foamed polyurethane sheets, foamed polychloroprene rubber sheets, and the like. Examples of metal foils include aluminum foil and copper foil.

The modulus of elasticity of the substrate film (generally a resin film) constituting the substrate layer is not particularly limited, but it is preferably about 50 MPa or more from the viewpoint of having a specific rigidity so as to stably support the adherend. In addition, from the viewpoints of adhesion and handling properties, the above-mentioned elastic modulus is preferably about 50,000 MPa or less. The elastic modulus of the substrate film can be set by selecting the best material with specific rigidity and flexibility according to the purpose of use. In some preferred aspects, the elastic modulus of the substrate film (such as a soft vinyl chloride resin film) can be about 100 MPa or more (generally about 150 MPa or more, for example, about 200 MPa or more), and can be about 1,000 MPa or less (generally about 600 MPa or less, for example, about 300 MPa or less). In other aspects, the elastic modulus of the substrate film (for example, olefin resin film) may be about 300 MPa or more (generally 400 MPa or more) and about 10,000 MPa or less (generally 3,000 MPa or less, for example, 1,000 MPa or less) . In some other aspects, the elastic modulus of the base film (for example, polyester resin film) may be about 500 MPa or more (generally 1,000 MPa or more, for example, 3,000 MPa or more), and about 30,000 MPa or less (generally 15,000 MPa). MPa or less, for example, 7,000 MPa or less).

Furthermore, the elastic modulus of the base film (generally a resin film) is a tensile elastic modulus calculated from the linear regression of a stress-strain curve, which is derived from the resin film along any direction (for example, MD (Machine Direction) or TD (Transverse Direction; the direction orthogonal to MD), preferably MD) cut a test piece with a specific width, according to JIS K7161 at room temperature (23°C) at a tensile speed of 300mm/min The condition is a curve obtained by extending the test piece in one direction.

Regarding the above-mentioned base film (generally a resin film), it is preferable to adopt a transparent one from the viewpoint of the checkability through the adhesive sheet. Therefore, the above-mentioned resin film preferably has transparency such that the total light transmittance in the visible light wavelength region is about 70% or more. More preferably, it is a transparent resin film with a total light transmittance of 80% or more (for example, 85% or more). In addition, the upper limit of the above-mentioned total light transmittance is ideally 100%, but as long as it has a total light transmittance of about 99% or less (generally 97% or less, for example, 95% or less), it can be practically used as a transparent resin film Better use. Regarding the value of the above-mentioned total light transmittance, the manufacturer's trademark can be used. When there is no nominal value, the value measured according to JIS K 7361-1 can be used.

Various additives such as fillers, antioxidants, ultraviolet absorbers, antistatic components, plasticizers, lubricants, colorants (pigments, dyes, etc.) can also be formulated in the substrate layer as needed. On the surface of the adhesive layer side of the substrate layer, for example, corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, acid treatment, alkali treatment, primer coating and other well-known or customary surface treatments may also be performed. Such a surface treatment may be, for example, a treatment for improving the anchoring property of the adhesive layer. In addition, when the single-sided adhesive sheet is wound so that the surface of the adhesive layer contacts the back surface of the base material layer, it can also be on the back surface of the base material layer (the surface on the opposite side to the surface where the adhesive layer is provided) If necessary, a peeling treatment using a silicone-based, long-chain alkyl-based, fluorine-based and other peeling treatment agent is performed. By performing the peeling treatment, the effect of making the roll-shaped roll of the adhesive sheet easy to rewind can be obtained.

The thickness of the substrate layer can be appropriately selected in consideration of the application, purpose, and use form of the adhesive sheet. In view of workability such as strength and handleability, a base film with a thickness of about 10 μm or more is generally preferable, preferably about 15 μm or more, more preferably about 20 μm or more, and still more preferably 30 μm or more (for example, 35 μm or more). In addition, from the viewpoints of cost and inspection properties, the thickness of the substrate layer is usually about 1 mm or less, preferably about 200 μm or less, preferably about 150 μm or less, more preferably about 100 μm or less, and still more preferably about 75 μm or less.

＜Undercoating＞ In some aspects, a primer layer is provided on the side surface of the adhesive layer of the substrate layer. In other words, the primer layer is arranged between the base layer and the adhesive layer. The primer layer can have a single-layer structure or a multi-layer structure with two or more layers. The material (primer) for forming the primer layer is not particularly limited, and it can be used: urethane resin, polyester resin, acrylic resin, acrylic-urethane resin, acrylic-benzene Vinyl resins, polyamide resins, melamine resins, olefin resins, polystyrene resins, epoxy resins, phenol resins, isocyanurate resins, polyvinyl acetate resins, etc.1 One or more than two. When an acrylic-based adhesive layer is provided on a resin film substrate, it is preferably a polyester-based, urethane-based, or acrylic-based primer, and an acrylic adhesive is provided on a polyester-based substrate layer such as PET film When layering, it is particularly preferably a polyester primer.

＜Conductive primer layer＞ In some preferred aspects, the primer layer disposed between the substrate layer and the adhesive layer preferably contains a conductive agent. Thereby, the conductivity of the adhesive sheet can be improved, and the conductivity of the adherend can be improved. Hereinafter, the undercoat layer containing a conductive agent is also referred to as a conductive undercoat layer. The conductive primer layer may have a single-layer structure or a multilayer structure of two or more layers. In the case of disposing a multi-layered primer layer between the base layer and the adhesive layer, it is advisable to set at least one of them (generally at least one layer including the layer in contact with the adhesive layer) as conductive Undercoat. Regarding the conductive agent, it can be used: organic conductive materials such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, allylamine polymer, or gold, silver, copper, platinum, palladium, aluminum, nickel, chromium, titanium, Metals such as iron, cobalt, tin, magnesium, tungsten or alloys of these metals, metal oxides of indium, tin, zinc, gallium, antimony, zirconium, cadmium (tin oxide, antimony oxide, indium oxide, cadmium oxide, oxide Metal particles such as titanium, zinc oxide, ITO (indium oxide/tin oxide), ATO (antimony oxide/tin oxide), copper iodide, or inorganic conductive materials such as metal oxide particles, metal compound particles, etc. As for the conductive agent, it is also possible It is used for an inorganic composite conductive material in which inorganic particles such as glass are coated with a metal such as silver, or, for example, an organic-inorganic composite conductive material in which inorganic particles are coated with an organic material such as a conductive polymer. The above-mentioned ionic compounds can also be used. These can be used individually by 1 type or in 2 or more types.

In the aspect of disposing the undercoat layer, polythiophene and polyaniline can be exemplified as the conductive polymer that the undercoat layer may contain. Regarding polythiophene, it is preferable that the Mw in terms of polystyrene is 40×10 ⁴ or less, and preferably 30×10 ⁴ or less. Regarding polyaniline, Mw is preferably 50×10 ⁴ or less, more preferably 30×10 ⁴ or less. In addition, the Mw of these conductive polymers is usually preferably 0.1×10 ⁴ or more, more preferably 0.5×10 ⁴ or more. Furthermore, the term "polythiophene" in this specification refers to unsubstituted or substituted thiophene polymers. Regarding a preferred example of the substituted thiophene polymer in the technology disclosed in this case, for example: poly(3,4-ethylenedioxythiophene).

In some preferred aspects, the conductive primer layer may include polystyrene sulfonate (PSS) as a dopant (for example, a dopant of a thiophene-based polymer). In some aspects, a conductive primer layer is formed using a composition for forming a primer layer containing an aqueous polythiophene solution containing PSS (which may be a form in which PSS is added as a dopant to the polythiophene). The aqueous solution may contain polythiophene:PSS in a weight ratio of 1:1 to 1:10. The total content of polythiophene and PSS in the above-mentioned aqueous solution may be, for example, about 1 to 5% by weight. Furthermore, when using a polythiophene aqueous solution containing PSS, it is preferable to set the total amount of polythiophene and PSS to 5 parts by weight or more (usually 10 parts by weight or more, for example, 25 parts by weight or more) with respect to 100 parts by weight of the binder. Preferably it is 40 parts by weight or more. In addition, the total amount of the above-mentioned polythiophene and PSS is preferably 200 parts by weight or less, preferably 120 parts by weight or less (for example, 100 parts by weight or less), or 80 parts by weight or less (for example, 60 parts by weight) relative to 100 parts by weight of the binder. the following).

From the viewpoint of improving conductivity, the amount of organic conductive material (generally conductive polymer) used can be about 10 parts by weight or more relative to 100 parts by weight of the binder contained in the undercoat layer, and it is usually appropriate 25 parts by weight or more, preferably 40 parts by weight or more. Considering the compatibility of the organic conductive material (generally a conductive polymer) in the undercoat layer, and the decrease in transparency due to the lowering of the compatibility, the difference between the organic conductive material (generally a conductive polymer) The amount used is preferably 200 parts by weight or less (for example, 150 parts by weight or less), and preferably 120 parts by weight or less (for example, 100 parts by weight or less) relative to 100 parts by weight of the binder. The use amount of the organic conductive substance (generally a conductive polymer) may be 80 parts by weight or less (for example, 60 parts by weight or less) relative to 100 parts by weight of the binder.

The total amount of conductive agent in the conductive primer layer (the total amount of all conductive agents including organic conductive material, inorganic conductive material, and organic-inorganic composite conductive material) depends on the target conductivity and can be set In the primer layer, it is about 5% by weight (for example, about 10% by weight or more), preferably about 30% by weight or more, and for example, it may exceed 50% by weight. The upper limit of the total amount of conductive agent in the conductive primer layer is not particularly limited. It is preferably about 90% by weight or less (for example, 80% by weight or less), considering the adhesion, transparency, etc., to the substrate layer or the adhesive layer. It may be about 40% by weight or less (for example, about 30% by weight or less).

In addition to the above-mentioned conductive agent, the conductive primer layer may also contain a binder. Regarding the binder that the conductive undercoat layer may contain, the aforementioned undercoat layer forming material (primer) can be used without particular limitation. Among them, polyester resins are preferably used. The ratio of the binder in the entire conductive primer layer can be, for example, about 30% by weight or more, preferably about 40% by weight or more (for example, about 50% by weight or more). In addition, considering conductivity, etc., the ratio of the above-mentioned binder is preferably less than 90% by weight (less than 80% by weight).

Also, in some aspects, the undercoat layer contains a crosslinking agent. Regarding the crosslinking agent, crosslinking agents such as melamine-based, isocyanate-based, and epoxy-based crosslinking agents generally used for crosslinking resins can be appropriately selected and used. Thereby, it is possible to better have both anchoring properties to the base material layer and adhesion properties to the adhesive layer. In some preferred aspects, the above-mentioned cross-linking agent includes a melamine-based cross-linking agent.

The undercoat layer may contain antioxidants, colorants (pigments, dyes, etc.), fluidity regulators (thixotropic agents, tackifiers, etc.), film forming aids, and surfactants (defoamers, dispersants, etc.) as needed. Etc.), preservatives and other additives.

The primer layer can be coated with a well-known or customary coater such as a gravure roll coater or a reverse roll coater, and the above-mentioned resin components and additives used as needed are dispersed or dissolved in a suitable solvent when applied to the substrate film. The finished liquid composition (coating material for forming an undercoat layer) is well formed by a method including drying or hardening treatment if necessary. From the viewpoint of forming a thin and uniform layer, the NV (non-volatile component) of the coating material can be set to, for example, 5 wt% or less (generally 0.05 to 5 wt%). Regarding the solvent that can constitute the coating material, any one of organic solvents, water, or these mixed solvents may also be used, and water or a mixed solvent mainly composed of water (for example, a mixed solvent of water and ethanol) is preferable.

In some other aspects, the conductive primer layer may be, for example, a layer composed of the aforementioned metal or metal oxide. Regarding the conductive primer in the above aspect, from the viewpoint of conductivity, it is preferably a metal layer such as silver and aluminum, and from the viewpoint of transparency, it is preferably an ITO layer or an ATO layer. Regarding ITO, it is preferable to use one containing about 80 to 99% by weight of indium oxide and about 1 to 20% by weight of tin oxide. The metal layer or metal oxide layer as the conductive primer layer may be a metal vapor-deposited layer such as aluminum, a plating layer, or the like.

The thickness of the primer layer in the technology disclosed in this case is not particularly limited, and is usually about 0.01 μm or more. From the viewpoint of properly exhibiting the function of the primer layer, it is preferably about 0.05 μm or more, preferably about 0.1 μm or more (for example, about 0.2 μm or more). The upper limit of the thickness of the undercoat layer may be about 50 μm or less (for example, about 10 μm or less). From the viewpoint of transparency and the like, it is preferably about 3 μm or less, preferably about 1 μm or less (for example, about 0.6 μm or less).

＜Release liner＞ In order to protect the adhesive surface (the surface of the adhesive layer attached to the side of the adherend), the adhesive sheet disclosed in this case may be attached to the adhesive surface in the form of a release liner (adhesive with release liner). Sheet form) provided. The release liner is not particularly limited. For example, a release liner made of a fluorine-based polymer (polytetrafluoroethylene, etc.) or a polyolefin-based resin ( Polyethylene, polypropylene, etc.) of the release liner composed of low adhesion materials. In the above-mentioned peeling treatment, for example, a silicone-based, fluorine-based, long-chain alkyl-based, fatty acid amide-based peeling treatment agent, or silicon dioxide powder can be used. In some aspects, it is preferable to use a release-treated resin film (for example, polyester film) as a release liner. The thickness of the release liner can be, for example, about 5 μm to 200 μm, and usually about 10 μm to 100 μm.

＜Total thickness of adhesive sheet＞ The total thickness of the adhesive sheet (which may include an adhesive layer, a substrate layer and a primer layer, but does not contain a release liner) disclosed in this case is not particularly limited, and it is preferably set to a range of about 5 to 1000 μm. Considering the adhesive properties, etc., the total thickness of the adhesive sheet should be set to about 10~500μm (for example, 15~300μm, generally 20~200μm). In addition, from the viewpoint of handleability and the like, the total thickness of the adhesive sheet is preferably about 30 μm or more, preferably about 150 μm or less (for example, 120 μm or less), and may also be about 80 μm or less.

＜Characteristics of Adhesive Sheet＞ Some typical types of adhesive sheets are characterized by the 180-degree peel strength (adhesion, adhesion to SUS plate) measured at a peeling angle of 180 degrees and a speed of 300 mm/min under conditions of 23°C. The force) is within the range of about 0.01~4.0N/20mm. According to the adhesive sheet exhibiting the adhesive force within the specified range, it is possible to reliably fix the adhered body such as a conductive small sheet, and can be separated from the adhered body well after use, thereby preventing damage to the adhered body. From the viewpoint of bonding reliability, the above-mentioned adhesive force may be about 0.02N/20mm or more, may be about 0.03N/20mm or more, may be about 0.05N/20mm or more, or may be about 0.08N/20mm or more. From the viewpoint of the separation and removability of the adherend, the above-mentioned adhesive force should be less than 3.0N/20mm (generally less than 2.0N/20mm, such as less than 1.0N/20mm), preferably less than about 0.5N/20mm (generally less than 0.5N/20mm, for example, less than 0.3N/20mm). The above-mentioned adhesive force to the SUS board can be measured by the method described in the following examples. Furthermore, the adhesive sheet disclosed in this specification includes an aspect that does not limit the above-mentioned adhesive force. In this aspect, the adhesive sheet is not limited to one having the above-mentioned adhesive force.

The haze value of the adhesive sheet is not particularly limited, and it may be about 80% or less, for example. When inspecting the adherend through the adhesive sheet, the adhesive sheet needs to have proper penetration. From this point of view, the haze value of the adhesive sheet is preferably about 50% or less (for example, about 30% or less), preferably about 10% or less, more preferably about 3% or less, and even more preferably about 1% or less ( For example, less than 0.1%). The haze value can be measured by the method described in the examples described later.

<Use> The application of the adhesive sheet disclosed in this case is not particularly limited. It can be used for various purposes such as peeling off after sticking to the adherend by taking advantage of the reliability of the adhesion and the good separation and removal of the adherend. Regarding the above-mentioned use, for example, a sheet for temporary fixation or a protective sheet. In addition, for example, it is preferably used as a process material for fixing to the adherend and peeling off in the process of electronic equipment and electronic parts.

In addition, the adhesive sheet disclosed in this case can be used as a conductive adhesive sheet for various purposes because the surface resistance value of the adhesive layer is limited to a predetermined value or less. For example, it can preferably be used as a conductive adhesive member in various electronic devices. The above-mentioned conductive adhesive sheet can also be used for electromagnetic wave shielding or antistatic purposes such as electronic equipment and cables.

Some preferred aspects of the adhesive sheet can be used as an adhesive sheet for detachably holding a plurality of conductive small pieces. The so-called conductive chips in this case can be metal wafers, semiconductor wafers, organic conductive wafers, etc. used in various applications, such as light-emitting semiconductor wafers (usually LED chips) used in electronic products with display functions, etc. Wafer. The number of conductive small pieces arranged in an adhesive sheet is 1 or more than two. In some aspects, the above-mentioned conductive small pieces may be formed by cutting a conductive wafer (for example, more than 10, Furthermore, 100 or more, 1,000 or more, 10,000 or more, and 100,000 or more) small pieces. The size of each small piece is not particularly limited, and may be, for example, about 4 to 5 mm square or less. The adhesive sheet disclosed in this case can be fixed on the adhesive layer by arranging the above-mentioned plurality of conductive small pieces, and all the conductive small pieces on the adhesive are energized at the same time, and the whole batch of conductive small pieces can be inspected by the energization . Therefore, the adhesive sheet disclosed in this case can also be said to be an adhesive sheet for energization inspection of conductive small pieces. The above-mentioned energization method fundamentally solves the technical and time-constrained method of using a probe to perform individual full inspections that was previously required. It can be a method to improve productivity while also achieving miniaturization and high performance of products. Because the adhesive sheet disclosed in this case can be better used for the above-mentioned purposes, it has great practical advantages.

<The manufacturing method of the conductive small piece after inspection> Based on the above description, according to this specification, a method for manufacturing a conductive small chip (such as a semiconductor wafer) that has been inspected can be provided. This method can also be an inspection method for conductive small pieces. The above method includes a step of preparing an adhesive sheet with a plurality of conductive small pieces of the inspection target fixed (preparation step). In the preparation step, the plurality of conductive small pieces to be inspected are detachably fixed on the surface of the adhesive layer. Regarding the adhesive sheet, a conductive adhesive layer is used. The above method further includes a step of energizing at least a part (for example, all) of the plurality of inspection object conductive small pieces through the adhesive layer, and inspecting the inspection object conductive small pieces in the energized state. According to the above method, the whole batch of multiple conductive small pieces can be energized at the same time. In addition, the above-mentioned method generally may further include a step of contacting a conductive material with the surfaces of the plurality of conductive small pieces of the inspection target opposite to the fixed surface of the adhesive layer before the inspection step. Thereby, the whole batch of conductive small pieces of the inspection object can be energized through the adhesive layer and the conductive material in the inspection step. The detailed description is given below.

First, in this method, an adhesive sheet with a plurality of conductive small pieces to be inspected is fixed (preparation step). For example, a conductive wafer is fixed to an adhesive sheet, and then the conductive wafer is processed on the adhesive sheet to form the plurality of conductive small pieces from the conductive wafer. Thereby, it is possible to prepare an adhesive sheet with a plurality of conductive small pieces to be inspected fixed. Regarding the adhesive sheet, it is suitable to use the adhesive sheet disclosed in this case, but it is not limited to this, and an adhesive sheet having a well-known or customary conductive adhesive layer can also be used. The processing steps of a conductive wafer (such as a semiconductor wafer) may include a cutting step and a wafer expanding step of the conductive wafer. The dicing step may be, for example, a step of dicing the wafer by splitting after laser dicing using a laser beam or the like. Then, through the expansion of the adhesive sheet holding the small pieces (sheet expansion step), the small pieces on the adhesive layer are arranged at specific intervals.

In some other aspects, a plurality of conductive small sheets formed by using a well-known and even customary adhesive sheet for cutting or an adhesive sheet for expansion are transferred to an adhesive sheet with a conductive adhesive layer On the adhesive layer, prepare an adhesive sheet with a plurality of small conductive pieces to be inspected. Regarding the conductive adhesive sheet, the adhesive sheet disclosed in this case is preferably used.

Then, the exposed surface (the surface opposite to the surface fixed to the adhesive layer) of the conductive small pieces to be inspected fixed on the surface of the adhesive layer of the prepared adhesive sheet is brought into contact with the conductive material. Specifically, at least a part (preferably all) of the plurality of inspection target conductive small pieces are brought into contact with the conductive material. As for the conductive material, it is preferable to use the adhesive sheet (conductive adhesive sheet) disclosed in this case. Alternatively, a well-known or commonly used conductive adhesive sheet can be used. Regarding the conductive material, a metal plate used for current conduction inspection of semiconductor wafers and the like can also be used. Since the conductive material is usually arranged on the opposite side of the inspection surface, transparency is not required.

Next, connect the terminals for energization inspection such as probes to the adhesive layer of the adhesive sheet to be in a conductive state, and connect different terminals for energization inspection (probes, etc.) to conductive materials, etc. to make the conductive materials conductive State, the current flows between the adhesive layer and the conductive material. Thereby, at least a part (preferably all) of the conductive small pieces to be inspected can be energized simultaneously and in batches. In this way, power-on inspection can be implemented.

Figure 3 is a schematic cross-sectional view illustrating the energization inspection of this method. In FIG. 3, symbols 101, 110, and 120 respectively represent the adhesive sheet, base material layer, and adhesive layer (conductive adhesive layer) disclosed in this case, and symbol 201 represents a conductive material. In this embodiment, the conductive material 201 uses the adhesive sheet disclosed in this case, and the conductive material (adhesive sheet) 201 includes a base layer 210 and an adhesive layer (conductive adhesive layer) 220. A plurality of conductive small pieces 150 fixed on the surface of the adhesive layer 120 of the adhesive sheet 101, which are fixed on the opposite side of the surface of the adhesive layer 120 and the surface of the adhesive layer 220 of the conductive material (adhesive sheet) 201 Contact (specifically, subsequent fixation). Specifically, as shown in the figure, a plurality of conductive small pieces 150 are arranged in a state of being separated from each other on the surface of the adhesive layer 120. The surfaces of the plurality of conductive small pieces 150 that are opposite to the fixed surface of the adhesive layer 120 are covered with a conductive material (adhesive sheet) 201, whereby each conductive small piece 150 becomes its double side and the adhesive sheet. The surface of the adhesive layer 120 of 101 and the surface of the adhesive layer 220 of the conductive material (adhesive sheet) 201 are in contact (specifically, bonded) and can be energized through the adhesive sheet 101 and the conductive material 201. In addition, in FIG. 3, P is a terminal (probe) for energization inspection, and C is a camera for inspection. In addition, the conductive small pieces 150 in the figure are given symbols only to representative ones. In addition, the conductive chip 150 in this embodiment is a light-emitting semiconductor chip, and has electrodes on both sides of the chip for contacting the adhesive layers 120 and 220.

In this embodiment, although the inspection camera C is used for inspection, it is not limited to this, and various optical inspection mechanisms or inspection by visual inspection may be used. By inspecting a plurality of conductive small pieces 150 that have been energized in a batch at the same time by an inspection organization such as an inspection camera C through the adhesive sheet 101 (specifically, inspection of the luminous intensity or light wavelength of the light-emitting semiconductor chip), The whole batch is used to identify and classify defective products of a plurality of conductive small pieces 150. After the inspection, each conductive small piece is separated and removed from the adhesive sheet 101 and the conductive material 201, and then shipped as a product. Regarding other specific matters related to the above method, since it is as described in this manual, repeated description is omitted.

The items disclosed in this manual include the following. (1) An adhesive sheet with an adhesive layer, the surface resistance of the adhesive layer is 1.0×10 ⁸ Ω/□ or less, and the adhesive force to the stainless steel plate is within the range of 0.01~4.0N/20mm . (2) An adhesive sheet having an adhesive layer, the adhesive layer comprising a polymer having an oxyalkylene structural unit, and the oxyalkylene structural unit has a molar number greater than 2 The polyoxyalkylene unit, the aforementioned polymer contains the oxyalkylene structural unit at a ratio of 35% by weight or more. (3) The adhesive sheet of (1) or (2) above has a haze value of 50% or less. (4) The adhesive sheet of any one of (1) to (3) above, wherein the adhesive layer contains an oxyalkylene structural unit. (5) The adhesive sheet of (4) above, wherein the adhesive layer contains a polymer having the oxyalkylene structural unit. (6) The adhesive sheet of (5) above, wherein the polymer having the oxyalkylene structural unit has the oxyalkylene structural unit in the side chain. (7) The adhesive sheet according to any one of (4) to (6) above, wherein the content ratio of the oxyalkylene structural unit in the adhesive layer is 20 to 95% by weight. (8) The adhesive sheet according to any one of (1) to (7) above, wherein the adhesive layer contains an ionic compound. (9) The adhesive sheet according to any one of (1) to (8) above, which further includes a substrate layer, and the adhesive layer is provided on at least one side of the substrate layer. (10) The adhesive sheet of (9) above, wherein the substrate layer is composed of a resin film having an elastic modulus of 50 MPa or more. (11) The adhesive sheet according to (9) or (10) above, wherein a primer layer is arranged between the base layer and the adhesive layer.

(12) A method for manufacturing an inspected conductive small sheet, including the following steps: preparing an adhesive sheet holding a plurality of inspected conductive small pieces (such as semiconductor chips), wherein the adhesive sheet has conductivity The adhesive layer, and the plurality of inspection object conductive small pieces are detachably fixed on the surface of the adhesive layer; and A step of energizing at least a part of the plurality of conductive small pieces of the inspection object through the adhesive layer, and inspecting the conductive small pieces of the inspection object in the energized state. (13) The method of (12) above, wherein before the inspection step, it further includes a step of contacting the surfaces of the plurality of inspection target conductive small pieces on the opposite side to the fixed surface of the adhesive layer with the conductive material. (14) The method of (12) or (13) above, wherein before the step of preparing the adhesive sheet to which the conductive small sheet is fixed, further comprises the following step: fixing the conductive wafer to the adhesive sheet Step; and processing the aforementioned conductive wafer to form the plurality of conductive small pieces from the conductive wafer. (15) The method according to (14) above, wherein the processing step of the conductive wafer includes a dicing step of the conductive wafer, and may optionally include a wafer expansion step. (16) The method of (12) or (13) above, wherein before the step of preparing the adhesive sheet to which the conductive small pieces are fixed, the step of fixing the plurality of conductive small pieces on the adhesive sheet is included. (17) The method according to any one of (12) to (16) above, wherein the adhesive sheet is the adhesive sheet of any one of (1) to (11) above. (18) The method of (13) above, wherein the conductive material is the adhesive sheet of any one of (1) to (11) above. (19) The method according to (13) above, wherein the conductive material is a metal plate or a conductive adhesive sheet. (20) The method according to any one of (12) to (19) above, wherein the inspection step of the conductive small piece of the inspection object includes inspection using an inspection mechanism such as a camera or visual inspection through an adhesive sheet (for example, a light-emitting semiconductor element Inspection of luminous state).

(21) An adhesive composition comprising a polymer containing oxyalkylene structural units, The aforementioned oxyalkylene structural unit includes a polyoxyalkylene unit with a molar number of oxyalkylene greater than 2, The aforementioned polymer contains oxyalkylene structural units at a ratio of 35% by weight or more. (22) The adhesive composition of (21) above, wherein the polymer having the aforementioned oxyalkylene structural unit has the aforementioned oxyalkylene structural unit in the side chain. (23) The adhesive composition according to the above (21) or (22), wherein the ratio of the aforementioned oxyalkylene structural unit is 20 to 95% by weight on a solid basis. (24) The adhesive composition according to any one of (21) to (23) above, which contains an ionic compound. (25) The adhesive composition according to any one of (21) to (24) above, wherein the polymer having the aforementioned oxyalkylene structural unit is an acrylic polymer.

Hereinafter, some embodiments related to the present invention will be described, but it is not intended to limit the present invention to these specific examples. Also, unless otherwise specified, "parts" or "%" in the following descriptions are based on weight.

＜Evaluation method＞ [Adhesion] The adhesive sheet was cut into a size of 20mm width×120mm length, and a measurement sample was made. The measurement sample was laminated under the conditions of a linear pressure of 78.5N/cm and a speed of 0.3m/min and was cleaned by ultrasound in toluene. Stainless steel plate (SUS430BA plate). The bonding is performed under an atmosphere of 23°C and 50%RH. After standing for 30 minutes in the same environment, use a tensile testing machine to peel the sample from the stainless steel plate at a tensile angle of 180 degrees and a speed of 0.3 m/min, and measure the peel strength [N/20mm] as Adhesion. For the tensile tester, the product name "AUTOGRAPH AG-IS" manufactured by Shimadzu Corporation or its equivalent can be used. In addition, when the measurement sample is a double-sided adhesive sheet (for example, an adhesive sheet without a substrate), the measurement is performed after backing the non-measurement surface with a PET film with a thickness of about 50 μm.

[Surface resistance value] At a temperature of 23°C and 50%RH, a resistivity meter (manufactured by Mitsubishi Chemical Analytech, trade name "Loresta GX MCP-T700") is used, and the 4-probe method is used to apply a predetermined voltage according to JIS K 7194: 1994 (Automatically adjust each sample), and measure the resistance value [Ω/□] on the surface of the adhesive layer under the condition of applying time of 30 seconds. For the measurement sample, for example, an adhesive sheet cut into a size of 50 mm width×50 mm length is used.

[Haze value] (1) Haze value of adhesive sheet Cut the adhesive sheet into a size of 50mm width×50mm length to make a measurement sample. For this measurement sample, the haze value (H1) was measured in accordance with JIS K 7136:2000 using "Haze Meter HM150" manufactured by Murakami Color Technology Research Institute. Let the haze value (H1) be the haze value [%] of the adhesive sheet. (2) Haze value of the adhesive layer In addition, only the substrate film used in the measurement sample was cut into a size of 50mm×50mm, the haze value (H2) was measured in the same way as in (1) above, and the haze value of the adhesive layer monomer was calculated from the following formula ( H3). Let the haze value (H3) be the haze value [%] of the adhesive layer. Formula: H3=H1-H2 In the case of a substrate-less adhesive sheet composed of only an adhesive layer, the haze value (H1) is measured by the one attached to a PET film with a thickness of about 50μm, and the PET film monomer is measured in the same way as the case of the above-mentioned substrate film The haze value (H2) of the adhesive layer is calculated from the above formula (H3). In addition, when the calculated value is less than 0.1 [%], it is described as 0 [%].

[Preparation of Adhesive Composition] (Preparation Example A1) In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a cooler, put the methoxy polyoxyethylene mixture at a molar ratio of 80/5/15 Ethylene (average addition mole number of ethylene oxide 9) methacrylate/polyoxyethylene (average addition mole number of ethylene oxide 9) methacrylate/hydroxyethyl methacrylate Winner. Add 0.15 mol% of 2,2'-azobisisobutyronitrile (AIBN) and ethyl acetate to 100 mol% of the monomer mixture as a polymerization initiator. While slowly stirring, nitrogen is introduced, and the polymerization reaction is carried out under specific conditions. A polymer A1 of Mw 38×10 ⁴ and Mn 6.5×10 ⁴ was obtained.

(Preparation Example A2) Regarding the monomer, methacrylate/polyoxyethylene (average addition mole number of ethylene oxide 9) methacrylic acid is used A monomer mixture with a molar ratio of ester/hydroxyethyl methacrylate/methyl methacrylate of 65/5/10/20. The rest is the same as Preparation Example A1 to obtain polymer A2.

(Preparation Example A3) Regarding the monomer, methacrylate/polyoxyethylene (average addition mole number of ethylene oxide 9) methacrylic acid is used A monomer mixture in which the molar ratio of ester/hydroxyethyl methacrylate/methyl methacrylate is 45/5/10/40. The rest is the same as Preparation Example A1 to obtain polymer A3.

(Preparation Example A4) Regarding the monomer, a monomer mixture in which the molar ratio of polyoxyethylene (average addition molar number of ethylene oxide 9) methacrylate/hydroxyethyl methacrylate is 80/20 is used. The rest is the same as Preparation Example A1 to obtain polymer A4.

(Preparation Example A5) Regarding the monomer, the molar ratio of polyoxyethylene (average added molar number of ethylene oxide 9) methacrylate/hydroxyethyl methacrylate/methyl methacrylate is 60/20/20 The monomer mixture. The rest is the same as Preparation Example A1 to obtain polymer A5.

[Making of base material] (Manufacturing Example B1) Prepare a conductive polymer containing 0.5% poly(3,4-ethylenedioxythiophene) (PEDOT) and polystyrene sulfonate (number average molecular weight 150,000) (PSS) 0.8% aqueous solution (Bytron P , HCStark company system). In addition, a dispersion containing 25% polyester resin (manufactured by Toyobo Co., Ltd., trade name "Vylonal MD-1480" (water dispersion of saturated copolyester resin) is prepared as a binder. In a mixed solvent of water and ethanol, Add 100 parts of the above-mentioned binder dispersion liquid in terms of solid content, 50 parts of the above-mentioned conductive polymer aqueous solution in terms of solid content, and 5 parts of melamine-based crosslinking agent, and stir for about 20 minutes to fully mix them. Thus, NV is prepared. About 0.4% of the conductive primer layer forming composition. The conductive primer layer forming composition was coated on one side of a PET film (modulus of elasticity 4.2GPa) with a thickness of 50μm, and dried at 120°C for 60 seconds , A conductive primer layer with a thickness of 300 nm was formed, thereby obtaining a substrate film B1 with a conductive primer layer.

(Manufacturing Example B2) Instead of PET film, polyvinyl chloride film with a thickness of 70μm (plasticizer uses dioctyl terephthalate, elastic modulus 250MPa) as the substrate. The rest was the same as in Production Example B1 to obtain a base film B2 with a conductive primer layer.

(Manufacturing Example B3) Instead of PET film, a multi-layer strong extruded film of polypropylene/polyethylene-vinyl acetate copolymer with a thickness of 100μm (elastic modulus 600MPa) is used as the substrate. The rest was the same as in Production Example B1 to obtain a base film B3 with a conductive primer.

(Manufacturing Example B4) Instead of PET film, a polypropylene/polyethylene mixed film with a thickness of 40μm (modulus of elasticity 600MPa) is used as the substrate. The rest was the same as in Production Example B1 to obtain a base film B4 with a conductive primer.

<Example 1> It contains 85 parts of polymer A1, 2.5 parts of isocyanate-based crosslinking agent ("CORONATE HX" manufactured by Tosoh Corporation), and lithium bis(trifluoromethanesulfonyl) imide (trade name manufactured by Mitsubishi Materials Electrochemicals Co., Ltd.) An ethyl acetate solution of 15 parts of FTOP EF-N115") and 0.016 parts of acetoacetone iron ("NASEM iron" manufactured by Nippon Chemical Industry Co., Ltd.) was prepared as the adhesive composition of this example. The adhesive composition was coated on the surface of the conductive primer layer of the substrate film B1 with a conductive primer layer, and dried at 130° C. for 90 seconds to form an adhesive layer with a thickness of 10 μm. Thus, the single-sided adhesive sheet of this example was obtained.

＜Example 2~5＞ Except that instead of polymer A1, polymer A2 (example 2), polymer A3 (example 3), polymer A4 (example 4) or polymer A5 (example 5) were used to prepare the adhesives of each example in the same way as example 1. Except for the use of the adhesive composition, the same method as in Example 1 was used to obtain single-sided adhesive sheets of each example.

<Example 6> Except that the adhesive composition of Example 2 was prepared and the substrate film B2 with a conductive primer layer was used, the above adhesive composition was applied to the substrate film B2 with a conductive primer layer in the same manner as in Example 2. The surface of the conductive primer layer was dried to obtain the single-sided adhesive sheet of this example.

＜Example 7~8＞ Except that the adhesive composition of Example 1 was prepared and the substrate film B3 (Example 7) or B4 (Example 8) with a conductive primer layer was used, the adhesive composition was applied to the adhesive in the same manner as in Example 1. Conduct the conductive primer surface of the substrate film of the conductive primer and dry it to obtain the single-sided adhesive sheet of each example.

<Example 9> It will contain 85 parts of polyether polyol A ("PREMINOL S 3011" manufactured by AGC, molecular weight 10000), polyether polyol B ("SANNIX GP-3000" manufactured by Sanyo Chemical Co., Ltd., polyoxypropylene glycerol ether, quantity Average molecular weight 3000) 13 parts, polyether polyol C ("SANNIX GP-1000" manufactured by Sanyo Chemical Industry Co., Ltd., polyoxypropylene glycerol ether, number average molecular weight 1000) 2 parts, polyfunctional isocyanate-based crosslinking agent (Tosoh 18 parts of "CORONATE HX" manufactured by the company, 15 parts of lithium bis(trifluoromethanesulfonyl) imide (trade name "FTOP EF-N115" manufactured by Mitsubishi Materials Electronic Chemicals), and iron acetone (Nippon Chemical Co., Ltd.) An ethyl acetate solution of 0.12 parts of adhesive (“NASEM iron” manufactured by Sangyo Co., Ltd.) was prepared as the adhesive composition of this example. The adhesive composition was coated on the surface of the conductive primer layer of the substrate film B1 with a conductive primer layer, and cured at 130°C for 90 seconds to form an adhesive layer with a thickness of 10 μm. Thus, the single-sided adhesive sheet of this example was obtained.

<Example 10> An ultraviolet (UV) curable slurry was prepared as the adhesive composition of this example in a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a cooler. The ultraviolet (UV) curable slurry was It consists of 82 parts of 2-ethylhexyl acrylate, 12 parts of N-vinylpyrrolidone, 3 parts of 4-hydroxyethyl acrylate, 3 parts of acrylic acid, and 0.05 parts of photoinitiator ("Omnirad651" manufactured by IGM Resins Itaria Srl), Anti-aging agent ("Songnox1010") 0.1 part, crosslinking agent ("NK ester A-HD-N" manufactured by Shinnakamura Chemical Industry Co., Ltd.) 0.05 part, conductive filler ("Sil-shield Ag/glass manufactured by ECKA"5/25s") 50 parts, conductive filler ("TP25S12" made by Potters) 150 parts. The adhesive composition is coated on the release layer of the polyester film with the silicone release layer, and then the polyester film with the silicone release layer is attached, and irradiated with UV with an illuminance of 50mW/cm ² for 5 minutes to make Of hardening. Thus, a substrate-free double-sided adhesive sheet composed of an adhesive layer with a thickness of 30 μm was obtained.

<Example 11> Except that the thickness of the adhesive layer was changed to 50 μm, the same method as in Example 10 was used to obtain the substrate-free double-sided adhesive sheet of this example.

Table 1 shows the rough composition, adhesive force [N/20mm], surface resistance value [Ω/□], and haze value [%] evaluation results of the adhesive sheets of each example.

[Table 1]

As shown in Table 1, since the surface resistance of the adhesive layer of the adhesive sheet of Examples 1-9 is 10 ⁸ Ω/□ or less, the adhesive layer can be used to pair a plurality of conductive small pieces arranged on the adhesive (such as Semiconductor wafers) are energized at the same time for the entire batch. In addition, since the adhesive sheet of these examples has an adhesive force in the range of 0.01~4.0N/20mm to the SUS board, the conductive small piece can be fixed with good reliability, and the conductive small piece can be removed from the The surface of the adhesive layer is separated well. On the other hand, although the adhesive sheets of Examples 10-11 have good electrical conductivity, the adhesive force exceeds 4.0N/20mm. Compared with Examples 1-9, it is considered that the separation and removal of the adherend is poor. In addition, the haze value exceeds 50%, and it is considered that the inspection cannot be performed through the adhesive sheet or the inspection performance is poor. From the above results, the surface resistance value of the adhesive layer is 10 ⁸ Ω/□ or less, and the adhesive force to the SUS board is within the range of 0.01~4.0N/20mm, which can be applied to the entire batch of multiple conductive small pieces Also check.

The specific examples of the present invention have been described in detail above, but these specific examples are only examples and are not intended to limit the scope of patent applications. The technology described in the scope of the patent application includes various changes and modifications to the specific examples illustrated above.

1,2,101,201: Adhesive sheet 10,110,210: substrate layer 10A: One side of the substrate layer (side 1) 10B: The other side of the substrate layer 20, 120, 220: Adhesive layer 20A: The surface of the adhesive layer (adhesive surface) 30: Primer 30A: The other side of the primer 30B: One side of the primer 150: Conductive small piece 201: conductive material C: Inspection camera P: Terminal for power-on inspection

Fig. 1 is a schematic cross-sectional view showing a configuration example of an adhesive sheet of an embodiment. Fig. 2 is a schematic cross-sectional view showing a configuration example of an adhesive sheet of another embodiment. FIG. 3 is a schematic cross-sectional view illustrating the energization inspection of a conductive small piece of an embodiment.

1: Adhesive sheet

10: Substrate layer

10A: One side of the substrate layer (side 1)

10B: The other side of the substrate layer

20: Adhesive layer

20A: The surface of the adhesive layer (adhesive surface)

Claims (32)

An adhesive sheet with an adhesive layer, the surface resistance of the adhesive layer is 1.0×10 ⁸ Ω/□ or less, and the adhesive force to the stainless steel plate is within the range of 0.01~4.0N/20mm. For example, the adhesive sheet of claim 1, the haze value is less than 50%. The adhesive sheet of claim 1 or 2, wherein the adhesive layer contains an oxyalkylene structural unit. The adhesive sheet of claim 3, wherein the adhesive layer comprises a polymer having the oxyalkylene structural unit. The adhesive sheet of claim 4, wherein the polymer having the aforementioned oxyalkylene structural unit has the aforementioned oxyalkylene structural unit in the side chain. The adhesive sheet according to any one of claims 3 to 5, wherein the content ratio of the oxyalkylene structural unit in the adhesive layer is 20 to 95% by weight. The adhesive sheet according to any one of claims 1 to 6, wherein the adhesive layer contains an ionic compound. The adhesive sheet according to any one of claims 1 to 7, further comprising a substrate layer, and the aforementioned adhesive layer is provided on at least one side of the substrate layer. The adhesive sheet of claim 8, wherein the aforementioned substrate layer is composed of a resin film having an elastic modulus of 50 MPa or more. The adhesive sheet of claim 8 or 9, wherein a primer layer is arranged between the base layer and the adhesive layer. An adhesive sheet that has an adhesive layer, The aforementioned adhesive layer contains a polymer having oxyalkylene structural units, The aforementioned oxyalkylene structural unit includes a polyoxyalkylene unit with a molar number of oxyalkylene greater than 2, The aforementioned polymer contains oxyalkylene structural units at a ratio of 35% by weight or more. For example, the adhesive sheet of claim 11 has a haze value of 50% or less. The adhesive sheet of claim 11 or 12, wherein the polymer having the aforementioned oxyalkylene structural unit has the aforementioned oxyalkylene structural unit in the side chain. The adhesive sheet according to any one of claims 11 to 13, wherein the content ratio of the oxyalkylene structural unit in the adhesive layer is 20 to 95% by weight. The adhesive sheet according to any one of claims 11 to 14, wherein the adhesive layer contains an ionic compound. The adhesive sheet according to any one of claims 11 to 15, further comprising a substrate layer, and the aforementioned adhesive layer is provided on at least one side of the substrate layer. The adhesive sheet of claim 16, wherein the aforementioned substrate layer is composed of a resin film having an elastic modulus of 50 MPa or more. The adhesive sheet of claim 16 or 17, wherein a primer layer is arranged between the base layer and the adhesive layer. A method of manufacturing a conductive small chip after inspection, including the following steps: The step of preparing an adhesive sheet with a plurality of conductive small pieces of inspection object fixed, wherein the adhesive sheet has a conductive adhesive layer, and the plurality of conductive small pieces of inspection object are detachably fixed to the adhesive layer Surface; and A step of energizing at least a part of the plurality of conductive small pieces of the inspection object through the adhesive layer, and inspecting the conductive small pieces of the inspection object in the energized state. The method of claim 19, wherein before the inspection step, it further comprises a step of contacting the surface of the plurality of inspection object conductive small pieces on the opposite side to the fixed surface of the adhesive layer with the conductive material. The method of claim 19 or 20, wherein before the step of preparing the adhesive sheet to which the conductive small sheet is fixed, the method further comprises the following steps: The step of fixing the conductive wafer to the aforementioned adhesive sheet; and The step of processing the aforementioned conductive wafer to form the plurality of conductive small pieces from the conductive wafer. The method of claim 21, wherein the processing step of the conductive wafer includes a dicing step of the conductive wafer, and may optionally include a wafer expansion step. The method of claim 19 or 20, wherein before the step of preparing the adhesive sheet to which the conductive small piece is fixed, the step of fixing the plurality of conductive small pieces on the adhesive sheet is included. The method according to any one of claims 19 to 23, wherein the aforementioned adhesive sheet is the adhesive sheet according to any one of claims 1 to 18. The method of claim 20, wherein the aforementioned conductive material is an adhesive sheet as described in any one of claims 1 to 18. The method of claim 20, wherein the aforementioned conductive material is a metal plate or a conductive adhesive sheet. The method according to any one of claims 19 to 26, wherein the step of inspecting the conductive small piece of the inspection object includes inspection using an inspection mechanism or visual inspection through an adhesive sheet. An adhesive composition comprising a polymer containing oxyalkylene structural units, The aforementioned oxyalkylene structural unit includes a polyoxyalkylene unit with a molar number of oxyalkylene greater than 2, The aforementioned polymer contains oxyalkylene structural units at a ratio of 35% by weight or more. The adhesive composition of claim 28, wherein the polymer having the aforementioned oxyalkylene structural unit has the aforementioned oxyalkylene structural unit in the side chain. The adhesive composition of claim 28 or 29, wherein the ratio of the aforementioned oxyalkylene structural unit is 20 to 95% by weight on a solid basis. The adhesive composition according to any one of claims 28 to 30, which contains an ionic compound. The adhesive composition according to any one of claims 28 to 31, wherein the polymer having the aforementioned oxyalkylene structural unit is an acrylic polymer.

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