TW202045426A - Semiconductor level calibration device capable of intuitively and quickly using the battery to supply power to allow the horizon sensor and the level sensor to perform measurement - Google Patents

Abstract

The present invention relates to a semiconductor level calibration device. The main structure of the semiconductor level calibration device is provided with a calibration frame, and the calibration frame includes a positioning surface provided on a jig, and a measurement surface provided in perpendicular to one side of the positioning surface. The measurement surface is provided with a plurality of horizon sensors for adjusting the levelness of the load port door of the equipment. Each of the horizon sensors is provided with at least one battery part inside, and there are a plurality of level sensors arranged on the measurement surface for adjusting the position of the load port of the equipment. With the aforementioned structure, when the user combines the calibration frame with the equipment, it is able to intuitively and quickly use the battery to supply power to allow the horizon sensor and the level sensor to perform measurement without connecting with an external power supply or tapping and using the electrical power of the equipment.

Description

Semiconductor level correction device

The present invention is to provide a semiconductor level correction device, in particular to a semiconductor level correction device that has simple structure and convenient operation, and can be directly powered by a built-in power supply for measurement and correction.

According to the fact that the semiconductor manufacturing process has also evolved by leaps and bounds with technological progress, including the high integration of components, the miniaturization of circuits, and the enlargement of wafers, etc., but the management of small dust in a clean room is for cost and technology All aspects are difficult.

With regard to the enlargement of wafers, wafer storage containers, such as FOUP (Front-Opening Unified Pod), have the ability to open and close the load port door on the vertical surface of the FOUP side. The load door is defined on the container mounting table and has a load port corresponding to the door opening and closing mechanism of the wafer storage container, so that the load port can be opened and closed in a state close to the load door. When the door is open, the transfer robot executes the transfer of wafers in the Equipment Front End Module (EFEM) with loading ports. The opening formed on the loading door is configured to fit into the outer wall part of the equipment front-end module with the loading port, so when the loading door is to be operated in an open state, the door opening and closing machine can be operated.

However, in the above-mentioned automated operation process, the wafer holding container and the loading port of the equipment front-end module need to have a high degree of accuracy in the alignment process, so multiple sets of precision sensors must be used together to feedback position information For the user to adjust, and the power source of the precision sensor generally needs to be externally powered, whether it is pulled to an unrelated power supply device (such as a socket), or connected to the front-end module of the equipment to tap the power for use. It is necessary to electrically connect the power lines of each precision sensor to a designated location one by one, which is quite inconvenient to use, and it will take a lot of time for the electrical connection. Even after the connection is completed, because multiple power lines are exposed to the outside, the external appearance of the equipment is not good, and the normal operation of the equipment is affected by collisions and pulls, and there is a risk of danger.

Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the creators of the present invention and related manufacturers engaged in this industry urgently want to study and improve.

Therefore, in view of the above-mentioned deficiencies, the creator of the present invention collected relevant information, evaluated and considered by multiple parties, and based on the accumulated years of experience in this industry, through continuous trials and modifications, the design was simple and easy to operate. He is the inventor of the semiconductor level calibration device that can be directly powered by the built-in power supply for measurement and calibration.

The main purpose of the present invention is to directly install at least one battery part in the level sensor to use the battery part as a built-in power source, save the operating time of the external power source, increase the convenience of operation, and prevent the power line from being exposed, which affects appearance and safety .

In order to achieve the above-mentioned object, the main structure of the present invention includes: a calibration frame including a positioning surface provided on the jig and a measurement surface perpendicularly provided on one side of the positioning surface, and a plurality of calibration frames are provided on the measurement surface. A level sensor for adjusting the level of the loading door of the equipment on the surface, a plurality of battery parts installed in each level sensor, and a plurality of sensors on the measuring surface for adjusting the position of the loading port of the equipment The level sensor.

When the user uses the present invention to calibrate the load port door and load port, the positioning surface of the calibration frame is directly set on the fixture of the equipment, and then the measuring surface The level sensor of the device is against the loading door of the equipment to measure and calibrate the level of the loading door. Then, the level sensor on the measuring surface is combined with the loading port of the equipment to use the level sensor Adjust the up, down, left, and right positions of the loading port to precise positions, thereby adjusting the relative positions of the loading door, loading port, and jig to positioning. In particular, during the measurement process, the power source required by the level sensor is directly supplied by its internal battery section, and there is no need to connect an external power source with a power line, so the user can complete the calibration action simply, quickly and conveniently.

With the above technology, it is possible to break through the inconvenience of the conventional equipment front-end module loading port, which requires time-consuming additional connection of external power, and the aesthetic and safety problems caused by the exposed power cord, and achieve the practical progress of the above advantages Sex.

1. 1a‧‧‧Calibration frame

11, 11a‧‧‧Locating surface

111, 111a‧‧‧positioning part

12‧‧‧Measuring surface

13a‧‧‧Auxiliary positioning piece

131a‧‧‧Guide slope

132a‧‧‧Perforation

2‧‧‧Level Sensor

21‧‧‧Digital pointer

22‧‧‧Display

3‧‧‧Battery Department

4‧‧‧Level sensor

41‧‧‧Joint

42‧‧‧ Gauge pointer

43‧‧‧Hand marking part

5‧‧‧Equipment

51‧‧‧Fixture

511‧‧‧Locating convex part

52‧‧‧Loading door

53‧‧‧Load port

54‧‧‧Guiding device

The first figure is a perspective view of a preferred embodiment of the present invention.

The second figure is a perspective view of the level sensor of the preferred embodiment of the present invention.

The third figure is a three-dimensional view of the level sensor of the preferred embodiment of the present invention.

The fourth figure is a schematic diagram of the positioning of the fixture in the preferred embodiment of the present invention.

The fifth figure is a schematic diagram of the loading door calibration of the preferred embodiment of the present invention.

The sixth figure is a schematic diagram (1) of the load port calibration of the preferred embodiment of the present invention.

The seventh figure is a schematic diagram (2) of the load port calibration of the preferred embodiment of the present invention.

The eighth figure is a schematic structural diagram of yet another preferred embodiment of the present invention.

In order to achieve the above-mentioned objectives and effects, the technical means and structure adopted by the present invention are illustrated in detail below to illustrate the features and functions of the preferred embodiments of the present invention for a complete understanding.

Please refer to Figures 1 to 4, which are a perspective view of a preferred embodiment of the present invention to a schematic diagram of the positioning of the jig. It can be clearly seen from the figures that the present invention includes: a calibration frame 1, which includes There is a positioning surface 11 provided on the fixture 51, and a measuring surface 12 perpendicularly arranged on one side of the positioning surface 11; a plurality of positioning portions 111 defined on the positioning surface 11; a plurality of positioning portions defined on the fixture 51 The positioning convex part 511 on the upper part and corresponding to each of the positioning parts 111; the plurality of level sensors 2 provided on the measuring surface 12 are used to adjust the levelness of the loading door 52 of the equipment 5, and each level The sensor 2 has a digital pointer 21 and a display portion 22 electrically connected to the digital pointer 21; plural numbers are respectively arranged in the battery part 3 in each level sensor 2; and plural numbers are arranged on the measuring surface The level sensor 4 on 12 is for adjusting the position of the loading port 53 of the device 5, and each of the level sensors 4 has a joint 41 and a plurality of resists on the joint 41 The scale pointer 42 and a pointer indicating portion 43 that cooperates with the scale pointer 42 to move.

Through the above description, we can understand the structure of this technology, and according to the corresponding cooperation of this structure, it can achieve the advantages of simple structure, convenient operation, and direct measurement and calibration with the built-in power supply, and detailed explanation Will be explained below.

Please also refer to the first to seventh figures, which are a perspective view of a preferred embodiment of the present invention to a schematic diagram of loading port calibration (2). When the above components are assembled, it can be clearly seen from the figure. The calibration frame 1 of the present invention performs level calibration with the device 5 by simulating the positioning structure of a wafer cassette, and the device 5 is implemented by a wafer loader (Loadport).

In actual operation, it is necessary to set the positioning surface 11 of the calibration frame 1 on the fixture 51 of the device 5 first, so first set the positioning protrusion 511 on the fixture 51 (this embodiment uses a circular convex post as Example) Align the positioning portion 111 coupled to the positioning surface 11 (in this embodiment, a circular hole pattern is taken as an example), Moreover, the positioning protrusion 511 and the positioning portion 111 of this embodiment form a triangular plane on the fixture 51 and the positioning surface 11 respectively, and can avoid sliding or rotating when the positioning surface 11 is flat against the surface of the fixture 51 (such as Shown in the fourth picture).

Then use the guide 54 of the device 5 (in this embodiment, the slide rail is taken as an example, and it can also be driven by a power element such as a motor and a screw) to drive the jig 51 so that the jig 51 and the calibration frame 1 are moved to the loading door When the level sensor 2 on the measuring surface 12 hits the loading door 52 of the device 5, the shrinkage of the digital pointer 21 is reflected on the display unit 22 to determine the loading door 52 and the amount The level of measurement surface 12. Specifically, the number of level sensors 2 in this embodiment is four, and they are respectively arranged at the four corners of the measuring surface 12. When the measuring surface 12 is close to the loading door 52, if the loading door 52 and the measuring surface 12 The non-parallel state will only cause the digital pointer 21 of one or two level sensors 2 to collide with the loading door 52 (as shown in the fifth figure) at the same time, and then continue to move the measuring surface 12 to make the four level sensors The digital pointer 21 of the device 2 is in contact with the loading door 52. At this time, the value difference reflected by the display part 22 of each level sensor 2 (the left and right difference of 0.2mm is taken as an example) can be calculated. The deflection direction and deflection amount of the loading door 52 are further used for the user to adjust the angle of the loading door 52 so that the measuring surface 12 and the loading door 52 are parallel.

Then, please refer to the sixth and seventh diagrams, continue to move the calibration frame 1 to combine the level sensor 4 on the measuring surface 12 with the loading port 53 of the device 5 to use level sensing The device 4 adjusts the up, down, left, and right positions of the loading port 53 to a precise position, thereby adjusting the relative positions of the loading door 52, the loading port 53, and the fixture 51 to positioning. Specifically, when the level sensor 4 is combined with the load port 53, the coupling portion 41 of the level sensor 4 (corresponds to the shape of the load port 53 on the device 5, such as Latch Key or R-Pin), serves as a pair The implementation mode of the quasi-pin) will first contact the loading port 53. At this time, if the loading port 53 has a position deviation of up, down, left, and right, it will directly reflect on the gauge pointer 42 outside the joint 41. According to this embodiment In other words, there are four gauge pointers 42 located on the upper, lower, left, and right sides of the joint 41 of each position sensor 4, and the loading port 53 is shifted to the left by 0.02mm as an example, so each group position In the quasi-sensor 4, the gauge pointer 42 located on the left side of the joint 41 is in a compressed state, and its compression is reflected in the pointer marking portion 43, while the gauge pointer 42 on the right is due to the loading port 53 Offset and separated from the load port 53. Based on the above values, the user can accurately adjust the position of the load port 53. The level sensor 2 or the level sensor 4 is a dial gauge, and the measurement accuracy is at least 10 ^-3 mm. As far as the wafer container is concerned, the accuracy is very high.

It is worth mentioning that in the above measurement process, the power source of the level sensor 2 is directly derived from it. The power source of the level sensor 4 is also directly achieved by the internal gear linkage. Therefore, the level sensor 2 and the level sensor 4 do not need to be connected to the outside by a power line The power supply, so the user can complete the corrective action simply, quickly and conveniently, and save the time spent connecting the power line, and because there is no exposed power line, the overall appearance is more concise, and at the same time, it can avoid the collision or pulling problem during the operation. Increase operational safety.

Please also refer to the eighth figure, which is a schematic structural diagram of another preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment and the above-mentioned embodiment are similar to each other, except that the plural number is set to The auxiliary positioning member 13a on each positioning portion 111a is defined with two symmetrically formed guide slopes 131a and a perforated portion formed between the guiding slopes 131a and communicating with the positioning portion 111a. 132a. As a result, when the user connects the calibration frame 1a to the fixture of the equipment, the auxiliary positioning member 13a has a long strip structure, which can increase the alignment tolerance range of the positioning convex portion, and the guiding slope 131a is The concave left and right inclined surfaces can guide the positioning convex portion to move to the center of the auxiliary positioning member 13a, and then guide the positioning convex portion into the perforated portion 132a, and the perforated portion 132a and the positioning portion 111a communicate with each other, so it can help the user simply and quickly The combination of the positioning convex portion and the positioning portion 111a is completed, and the friction between the positioning convex portion and the positioning surface 11a is reduced, and its service life is increased.

However, the above descriptions are only preferred embodiments of the present invention, and are not limited to the scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be the same. It is included in the scope of the patent of the present invention, and it is hereby stated.

In summary, the semiconductor level correction device of the present invention can indeed achieve its efficacy and purpose when used. Therefore, the present invention is truly an invention with excellent practicability. In order to meet the requirements of an invention patent application, it is proposed according to law. For the application, I hope that the review committee will approve the invention as soon as possible to protect the hard work of the creator. If the review committee has any doubts, please feel free to write instructions. The creator will do our best to cooperate and feel good.

1‧‧‧Calibration frame

11‧‧‧Locating surface

111‧‧‧Positioning Department

12‧‧‧Measuring surface

2‧‧‧Level Sensor

3‧‧‧Battery Department

4‧‧‧Level sensor

Claims (7)

A level calibration device for semiconductors, which mainly includes: a calibration frame body, which includes a positioning surface provided on the jig, and a measurement surface vertically installed on one side of the positioning surface; The level sensor on the measuring surface is used to adjust the level of the loading door of the equipment; the plural numbers are respectively arranged in the battery part of each level sensor; and the plural number is arranged in the level sensor on the measuring surface The device is used to adjust the position of the load port of the device. The semiconductor level correction device described in the first item of the scope of patent application, wherein the positioning surface has a plurality of positioning parts, and the jig has positioning convex parts corresponding to each of the positioning parts. For the semiconductor level correction device described in item 2 of the scope of patent application, each of the positioning parts has an auxiliary positioning member. For the semiconductor level correction device described in item 3 of the scope of patent application, each of the auxiliary positioning members is defined with two symmetrically formed guiding slopes, and a guide slope formed between the guiding slopes and communicating with the positioning portion Perforated part. For the semiconductor level calibration device described in the first item of the patent application, each of the level sensors has a digital pointer and a display part electrically connected to the digital pointer. For the semiconductor level calibration device described in item 1 of the scope of the patent application, each of the level sensors has a coupling part, and a plurality of gauge pointers resisting the coupling part, and a contact with the quantity The pointer of the watch is matched with the pointer marking part of the cooperation. For the semiconductor level calibration device described in item 1 of the scope of patent application, the level sensor or the level sensor is a dial indicator.

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