TW202042324A - Single wafer wet processing apparatus - Google Patents

Abstract

The present disclosure provides a single wafer wet processing apparatus including: a rotating stage for placing a wafer thereon, a liquid supply device for applying a plurality of kinds of processing liquid to the wafer, a liquid recovery device comprising a plurality of recycling rings, wherein each of the recovery rings is configured to collect a corresponding one kind of the processing liquid and a gas-liquid mixture accompanying the collected processing liquid, and a plurality of gas recovery devices respectively connected to the plurality of recovery rings of the liquid recovery device for discharging the collected gas-liquid mixture.

Description

Single wafer wet processing equipment

This disclosure relates to a wet processing equipment, in particular to a single wafer wet processing equipment.

In the manufacturing process of semiconductor wafers, it is necessary to perform multiple processing steps on the component mounting surface of the semiconductor wafer, including wet processing procedures such as etching and cleaning. With the increase in the complexity of the semiconductor wafer process, a single-wafer wet processing machine has been developed, which uses a rotating table corresponding to the design of multiple liquid recovery modules, so that the single-wafer wet processing machine can rotate A variety of different chemical liquids are applied to the wafers on the stage, and the chemical liquids are collected through the corresponding recovery module. Various metal layers or thin film layers of other materials on the semiconductor wafer can be cleaned and etched by applying different chemical liquids. In other words, a variety of different chemical liquids are used in a single-wafer wet processing machine, which makes the functional requirements of the collecting device for collecting the chemical liquid and the gas-liquid mixture entrained in it become extremely strict.

However, the existing single-wafer wet processing machine adopts a design in which multiple liquid recovery modules are connected to one gas recovery device. In other words, although the existing single-wafer wet processing machine can collect different chemical liquids through multiple liquid recovery modules, it cannot collect different gas-liquid mixtures carried by different chemical liquids separately. The above-mentioned design of a single gas recovery device will cause different gas-liquid mixtures to be mixed together in the gas recovery device. Since different gas-liquid mixtures contain chemicals with different properties (such as acids, alkalis, solvents, etc.), if they are mixed together, they are likely to cause additional chemical reactions, which may cause injury to personnel or machines, and increase the processing and recovery of gas Difficulty. Furthermore, if the mixed mixture flows back into the multiple liquid recovery modules, it will cause the problem of cross-contamination between the chemical liquid collected by the liquid recovery module and the mixture.

In view of this, it is necessary to provide a single wafer wet processing equipment to solve the problems existing in the conventional technology.

In order to solve the above-mentioned problems of the conventional technology, the purpose of the present disclosure is to provide a single-wafer wet processing equipment, which can independently recover gas-liquid mixtures carried by different process liquids to avoid mixing of different gas-liquid mixtures. .

In order to achieve the above objective, the present disclosure provides a single wafer wet processing equipment, which includes: a rotating table for placing a wafer; a liquid supply device arranged above the rotating table for applying a plurality of types to the wafer Process liquid; a liquid recovery device that is circumferentially arranged around the rotary table and can move relative to the rotary table along a vertical direction, wherein the liquid recovery device includes a plurality of recovery rings stacked along the vertical direction, And each of the recovery rings is used to collect one of the corresponding process liquids and the gas-liquid mixture entrained therewith; and a plurality of gas recovery devices are respectively connected to the plurality of recovery rings of the liquid recovery device, wherein each of the gas The recovery device includes: a wind box including a first connection port and a second connection port, wherein the first connection port is connected to a corresponding recovery ring, so that the gas-liquid mixture in the recovery ring passes through the first connection port Into the inside of the wind box; and an exhaust pipe connected with the second connection port of the wind box for exhausting the collected gas-liquid mixture.

In one of the preferred embodiments of the present disclosure, the wind box of each gas recovery device further includes: an upper surface, a lower surface, a side surface, and a cavity, the upper surface and the lower surface are disposed oppositely, and The side surface is located between the upper surface and the lower surface, and the cavity is formed by interconnecting the upper surface, the lower surface, and the side surface, wherein the first connection port is provided on the side surface, And the second connection port is arranged on the upper surface.

In one of the preferred embodiments of the present disclosure, the wind box of each of the gas recovery devices further includes: a liquid discharge port arranged on the lower surface to allow the gas-liquid mixture to pass through the wind box to produce condensed liquid Discharge through the drain.

In one of the preferred embodiments of the present disclosure, each of the recovery rings of the liquid recovery device includes: a liquid receiving port aligned with the rotating table; and a partition plate arranged inside the recovery ring to separate An inner ring space and an outer ring space are provided, wherein the inner ring space is used to receive the process liquid and the gas-liquid mixture entrained from the liquid receiving port, and the partition plate blocks the process liquid from the inner The annular space flows to the outer annular space, and a plurality of through holes are formed on the partition plate for allowing the gas-liquid mixture in the inner annular space to enter the outer annular space through the through holes; and a liquid collection Port, connected with the inner ring space, for allowing the process liquid to be discharged from the liquid collection port; and a plurality of gas recovery devices, respectively connected with the plurality of recovery rings of the liquid recovery device, for collecting the The gas-liquid mixture is discharged.

In one of the preferred embodiments of the present disclosure, each of the recovery rings further includes: an annular upper cover; an annular bottom plate corresponding to the annular upper cover; an outer ring wall corresponding to the outer periphery of the annular upper cover and the annular The outer periphery of the bottom plate is connected; a gas passage opening is provided on the outer ring wall and connected to one of the corresponding gas recovery devices, wherein the partition plate is provided between the annular upper cover and the annular bottom plate, and The liquid receiving port is located between the inner periphery of the annular upper cover and the inner periphery of the annular bottom plate.

In one of the preferred embodiments of the present disclosure, the bellows of each gas recovery device further includes a viewing window, and the inside of the bellows can be seen through the viewing window; and the single wafer is wet The processing equipment also includes a plurality of water pipes, and the wind box of each gas recovery device is connected with one water pipe, and the clean water is transmitted to the wind box through the water pipe to clean the inside of the wind box.

The present disclosure also provides a single wafer wet processing equipment, which includes: a rotating table for placing a wafer; a liquid supply device arranged above the rotating table for applying a plurality of process liquids to the wafer; The liquid recovery device is circumferentially arranged around the rotating platform and can move relative to the rotating platform along a vertical direction, wherein the liquid recovery device includes a plurality of recovery rings stacked along the vertical direction, and each of the The recovery ring includes: a liquid receiving port aligned with the rotating table for receiving one of the corresponding process liquids and the gas-liquid mixture entrained therewith; and a partition plate arranged inside the recovery ring to separate an inner An annular space and an outer annular space, wherein the inner annular space is used to receive the process liquid and the gas-liquid mixture entrained from the liquid receiving port, and the partition plate blocks the flow of the process liquid from the inner annular space A plurality of through holes are formed on the outer ring space and the partition plate for allowing the gas-liquid mixture in the inner ring space to enter the outer ring space through the through holes; and a liquid collection port, and The inner ring space is connected to allow the process liquid to be discharged from the liquid collection port; and a plurality of gas recovery devices are respectively connected to the plurality of recovery rings of the liquid recovery device for collecting the gas-liquid mixture discharge.

In one of the preferred embodiments of the present disclosure, each of the recovery rings further includes: an annular upper cover; an annular bottom plate corresponding to the annular upper cover; an outer ring wall corresponding to the outer periphery of the annular upper cover and the annular The outer periphery of the bottom plate is connected; a gas passage opening is provided on the outer ring wall and connected to one of the corresponding gas recovery devices, wherein the partition plate is provided between the annular upper cover and the annular bottom plate, and The liquid receiving port is located between the inner periphery of the annular upper cover and the inner periphery of the annular bottom plate.

In one of the preferred embodiments of the present disclosure, each gas recovery device includes: a wind box including a first connection port and a second connection port, wherein the first connection port is connected to the corresponding recovery ring, So that the gas-liquid mixture in the recovery ring enters the inside of the wind box through the first connection port; and an exhaust pipe connected to the second connection port of the wind box for collecting the gas-liquid mixture discharge.

In one of the preferred embodiments of the present disclosure, the wind box of each gas recovery device further includes: an upper surface, a lower surface, a side surface, and a cavity, the upper surface and the lower surface are disposed oppositely, and The side surface is located between the upper surface and the lower surface, and the cavity is formed by interconnecting the upper surface, the lower surface, and the side surface, wherein the first connection port is provided on the side surface, And the second connection port is arranged on the upper surface.

In one of the preferred embodiments of the present disclosure, the wind box of each of the gas recovery devices further includes: a liquid discharge port arranged on the lower surface to allow the gas-liquid mixture to pass through the wind box to produce condensed liquid Discharge through the drain.

In one of the preferred embodiments of the present disclosure, the bellows of each gas recovery device further includes a viewing window, and the inside of the bellows can be seen through the viewing window; and the single wafer is wet The processing equipment also includes a plurality of water pipes, and the wind box of each gas recovery device is connected with one water pipe, and the clean water is transmitted to the wind box through the water pipe to clean the inside of the wind box.

Compared with the prior art, the present disclosure uses the same number of gas recovery devices as the number of recovery rings, and each recovery ring is connected to a corresponding gas recovery device. With this design, the process gas from different recovery loops can be pumped independently by different gas recovery devices to prevent different gas-liquid mixtures entrained by different process liquids from being mixed together, resulting in additional chemical reactions. Single wafer wet processing equipment or personnel injury, and also reduces the complexity of processing recovered gas. Furthermore, it can also avoid the contamination of wafers or other processing chambers caused by mixed exhaust gas flowing back to the rotating table or recovery ring.

In order to make the above and other objectives, features, and advantages of the present disclosure more obvious and understandable, the following will describe the preferred embodiments of the present disclosure in conjunction with the accompanying drawings in detail.

Please refer to FIG. 1, which shows a three-dimensional schematic diagram of the single-wafer wet processing equipment 1 of the preferred embodiment of the present disclosure. The single wafer wet processing equipment 1 includes a rotating table 10, a liquid supply device (not shown in the figure), a liquid recovery device 20, a plurality of gas recovery devices 30, and a lifting device 40. In this embodiment, the number of gas recovery devices 30 is four, but the present disclosure is not limited to this. The rotating table 10 is used to place a single wafer (not shown in the figure). In this embodiment, the top of the rotating table 10 includes a vacuum chuck, and the wafer can be fixed on the top of the rotating table 10 by the suction force applied by the vacuum chuck. The rotating table 10 is equipped with a driving mechanism for driving the rotating table 10 to rotate around an axis. In other embodiments, other methods may be used to fix the wafer on the rotating table, such as a clamping device. Furthermore, the liquid supply device is arranged above the rotating table 10 and is used to apply a plurality of processing liquids to the wafer. Specifically, the liquid supply device includes a nozzle and a plurality of liquid transfer lines, wherein the nozzle is arranged to be aligned with the top of the rotating table 10, and one end of the plurality of liquid transfer lines is connected to the nozzle, and the other end is connected to different process liquids. On the supply side. With this design, the liquid supply device can be controlled to apply the corresponding process liquid to the wafer on the turntable 10 according to the process requirements, so as to perform operations such as etching or cleaning on the wafer.

As shown in FIG. 1, the liquid recovery device 20 is arranged around the rotating table 10 to collect the processing liquid thrown from the wafer surface on the rotating table 10 due to centrifugal force, and to discharge the processing liquid. A plurality of gas recovery devices 30 are correspondingly connected with the liquid recovery device 20 for discharging the collected gas-liquid mixture. The specific structures of the liquid recovery device 20 and the gas recovery device 30 of this embodiment will be described in detail later. The lifting device 40 is connected to the liquid recovery device 20 and is used to control the liquid recovery device 20 to move up and down relative to the rotating table 10 along a vertical direction. In addition, since the plurality of gas recovery devices 30 are connected to the liquid recovery device 20, when the liquid recovery device 20 is raised and lowered, the plurality of gas recovery devices 30 will rise or fall together.

Please refer to FIG. 1 and FIG. 2. FIG. 2 shows an enlarged partial cross-sectional view of the single wafer wet processing equipment 1 of FIG. 1. The liquid recovery device 20 includes a plurality of recovery rings 21-24 stacked in a vertical direction. Each recovery ring 21-24 is used to collect one of the corresponding process liquids and the entrained gas-liquid mixture. By the control of the lifting device 40, the recovery rings 21-24 are moved together in synchronization, so that the designated recovery rings 21-24 can be moved to be aligned with the rotating table 10. The alignment refers to one of the recovery rings 21 The liquid receiving port of ~24 is adjacent to the wafer on the turntable 10, so that when the liquid supply device applies process liquid to the wafer on the turntable 10, and the turntable 10 rotates, the surface of the wafer on the turntable 10 is caused by centrifugal force. The thrown process liquid can be collected by one of the adjacent recovery rings 21-24. In other words, the single-wafer wet processing equipment 1 of the present disclosure is a cleaning and etching equipment with a mobile liquid recovery device 20, which can keep the wafers on the rotating table 10 fixed horizontally and not move up and down. When performing a single wafer spin cleaning or etching process, control the designated recovery ring to move to the alignment turntable 10 according to the executed steps, and then spray the specific process liquid onto the wafer surface from the liquid supply device above the wafer, and The rotating table 10 drives the wafer to rotate to collect the specific process liquid and its entrained gas-liquid mixture.

Please refer to FIG. 2 and FIG. 3. FIG. 3 shows a partial schematic diagram of the recovery ring 21 and the gas recovery device 30 of the single wafer wet processing equipment 1 in FIG. Fig. 3 illustrates the recovery ring 21 located on the first layer and the gas recovery device 30 connected to it. It should be understood that the structure of the remaining recovery rings 22-24 is substantially the same as the structure of the recovery ring 21 of the first layer. As shown in FIG. 2, the recovery ring 21 includes an annular upper cover 201, an annular bottom plate 202, an outer ring wall 203, and a liquid receiving port 204. Moreover, as shown in FIG. 3, the recovery ring 21 further includes a partition plate 205, a gas passage port 206, and a liquid collection port 207. The annular bottom plate 202 of the recovery ring 21 and the annular upper cover 201 are arranged correspondingly. In this embodiment, the recovery rings 21-24 are stacked in a vertical direction, and the annular bottom plate 202 of the upper recovery ring serves as the ring upper cover 201 of the lower recovery ring, so that the inner part of each recovery ring The space is maximized, the materials used in the liquid recovery device 20 are saved, and the overall volume of the liquid recovery device 20 is effectively reduced. The outer ring wall 203 of the recovery ring 21 is connected to the outer periphery of the annular upper cover 201 and the outer periphery of the annular bottom plate 202. The ring-shaped upper cover 201, the ring-shaped bottom plate 202, and the outer ring wall 203 are connected to each other and define the internal space of the recovery ring 21. The liquid receiving port 204 of the recovery ring 21 is located between the inner periphery of the annular upper cover 201 and the inner periphery of the annular bottom plate 202. When the designated recovery ring 21 moves to align with the rotating table 10, the liquid receiving port 204 of the designated recovery ring 21 will be aligned with the rotating table 10, so that the recovery ring 21 can receive the corresponding process liquid and its Entrained gas-liquid mixture.

As shown in FIG. 3, the partition plate 205 of the recovery ring 21 is disposed inside the recovery ring 21 to separate the internal space of the recovery ring 21 into an inner ring space 208 and an outer ring space 209. The inner ring space 208 is used to receive the process liquid entering from the liquid receiving port 204 and its entrained gas-liquid mixture, and the partition plate 205 can prevent the process liquid from flowing from the inner ring space 208 to the outer ring space 209. A plurality of through holes 2051 are formed on the partition plate 205 so that the gas-liquid mixture in the inner ring space 208 can enter the outer ring space 209 through the through holes 2051. In this embodiment, 28 through holes 2051 are formed on the partition plate 205, but it is not limited thereto. Preferably, the aperture of the through hole 2051 of the partition plate 205 is about 5 to 10 mm to ensure that the gas-liquid mixture entrained by the process liquid can be fully drawn from the inner ring space 208 to the outer ring space 209 on the one hand, and the other On the other hand, the process liquid can be blocked in the inner ring space 208.

As shown in Figure 3, the gas channel opening 206 of the recovery ring 21 is provided on the outer ring wall 203, and the gas channel opening 206 is connected to the corresponding gas recovery device 30, so that the gas-liquid mixture collected by the recovery ring 21 enters the outer ring The space 209 can then be conveyed to the gas recovery device 30 through the gas passage port 206. The liquid collection port 207 of the recovery ring 21 is in communication with the inner ring space 208 for allowing the process liquid to be discharged from the liquid collection port 207. Specifically, the liquid collection port 207 is located at the lowest point of the horizontal position of the recovery ring 21, so that the process liquid collected by the recovery ring 21 flows to the liquid collection port 207 due to gravity. In addition, the liquid collection port 207 of the recovery ring 21 is connected to a corresponding recovery pipe, so as to discharge or recover the collected process liquid. For example, as shown in FIG. 2, the recovery ring 22 on the second layer is connected to the recovery pipe 50 inside the single wafer wet processing equipment 1, and the process liquid collected by the recovery ring 22 is discharged through a path 51. Optionally, the recovery pipe 50 can be connected to a circulation system to return the processed process liquid to the liquid supply device of the single wafer wet processing equipment 1 again. Preferably, the aperture of the liquid collection port 207 is about 10 to 15 mm, so as to ensure that the etched impurities, the collected process liquid or the formed crystals can pass through.

Please refer to Figure 4, which shows an exploded view of the parts of the recovery ring 21 in Figure 3. The plate surface of the partition plate 205 is parallel to the stacking direction of the recovery ring 21. One side of the partition plate 205 is installed in the lower groove 2021 of the annular bottom plate 202, and the other side of the partition plate 205 is installed in the upper groove 2011 of the annular upper cover 201 (see FIG. 5). With the above-mentioned installation method of the partition plate 205, the assembly and replacement of the partition plate 205 can be facilitated. Furthermore, in this embodiment, the partition plate 205 of the recovery ring 21 adopts a four-piece structure, and with this design, when the through hole 2051 of one of the partition plates 205 is blocked, it can only be used for the partition plate. 205 is replaced, without the need to replace the entire set of partitions 205. In other embodiments, other numbers of partition plates may be used, and it is not limited thereto. It should be noted that the multiple through holes 2051 of the partition plate 205 are arranged in a ring at equal or similar intervals to form a ring-shaped air extraction structure, thereby ensuring that the extraction air flow of the recovery ring 21 is uniform. Fully extract the gas-liquid mixture entrained by the cleaning or etching process liquid. Moreover, the design of the ring-shaped air extraction structure can prevent the process liquid on the wafer from being biased to one side due to the large airflow in a single direction when the wafer is etched, causing uneven etching of the wafer.

As shown in FIGS. 1 and 2, the number of gas recovery devices 30 is the same as the number of recovery rings 21-24, and each recovery ring 21-24 is connected to one gas recovery device 30 correspondingly. With this design, different gas recovery devices 30 can be used to pump the process gases from different recovery rings 21-24 independently, so as to prevent different gas-liquid mixtures entrained by different process liquids from being mixed together, thereby generating additional The chemical reaction causes damage to the single wafer wet processing equipment 1 or personnel, and also reduces the complexity of processing the recovered gas. Furthermore, it can also prevent the mixed exhaust gas from flowing back to the turntable 10 or the recovery ring 21-24, thereby causing contamination of the wafer or other processing chambers.

Please refer to FIG. 5, which shows another partial cross-sectional enlarged view of the single wafer wet processing equipment 1 of FIG. 1. Figure 5 illustrates the recovery ring 21 located on the first layer and the gas recovery device 30 connected to it. It should be understood that the structures of the remaining recovery rings 22-24 and the remaining gas recovery device 30 are substantially the same as the structures of the recovery ring 21 and the gas recovery device 30 of the first layer. The gas recovery device 30 applies negative pressure to the recovery ring 21, so that the inside of the recovery ring 21 and the gas recovery device 30 will generate a gas flow like the path 61. Specifically, the gas-liquid mixture collected by the recovery ring 21 is drawn from the inner ring space 208 to the outer ring space 209 through the through hole 2051 of the partition plate 205. In addition, the gas-liquid mixture in the outer ring space 209 will be transferred to the inside of the gas recovery device 30 through the gas passage opening 206 on the outer ring wall 203.

As shown in FIG. 5, the gas recovery device 30 includes a wind box 31 and an exhaust pipe 32. The bellows 31 includes an upper surface 301, a lower surface 302, a side surface 303, a cavity 304, a first connection port 305, a second connection port 306, and a liquid discharge port 307. The upper surface 301 and the lower surface 302 of the bellows 31 are disposed opposite to each other, and the side surface 303 is located between the upper surface 301 and the lower surface 302. The upper surface 301, the lower surface 302, and the side surface 303 are connected to each other to form a cavity 304. The side surface 303 of the wind box 31 is formed with a first connection port 305, the upper surface 301 is formed with a second connection port 306, and the lower surface 302 is formed with a liquid discharge port 307. The first connection port 305 of the wind box 31 is connected to the gas passage port 206 of the recovery ring 21 so that the gas-liquid mixture in the recovery ring 21 enters the cavity 304 of the wind box 31 through the first connection port 305. The exhaust pipe 32 is connected to the second connecting port 306 of the wind box 31 for exhausting the collected gas-liquid mixture. Furthermore, when the gas-liquid mixture passes through the wind box 31, part of the gas will condense into liquid. In order to prevent liquid from accumulating in the cavity 304 of the wind box 31, the liquid discharge port 307 located on the lower surface 302 of the wind box 31 can discharge the condensed liquid along the path 62 through the liquid discharge port 307 to maintain the wind The inside of box 31 is clean.

In addition, as shown in FIG. 3, the single wafer wet processing equipment 1 further includes a plurality of water pipes 70, and the wind box 31 of each gas recovery device 30 is connected to a water pipe 70. Moreover, the wind box 31 of each gas recovery device 30 also includes a viewing window 80. Therefore, when a person sees crystals or foreign matter accumulation in the wind box 31 through the viewing window 80, the water pipe 70 can clean the inside of the wind box. Specifically, a small amount of clean water is transferred to the inside of the wind box 31 through the water pipe 70, so that crystals or foreign objects are discharged from the drain 307 of the wind box 31 along the path 62 (as shown in FIG. 5).

To sum up, the present disclosure uses the same number of gas recovery devices as the number of recovery rings, and each recovery ring is connected to one gas recovery device. With this design, the process gas from different recovery loops can be pumped independently by different gas recovery devices to prevent different gas-liquid mixtures entrained by different process liquids from being mixed together, resulting in additional chemical reactions. Single wafer wet processing equipment or personnel injury, and also reduces the complexity of processing recovered gas. Furthermore, it can also prevent mixed exhaust gas from flowing back to the turntable or recovery ring, which may cause contamination of wafers or other processing chambers.

The above are only the preferred embodiments of the present disclosure. It should be pointed out that for those skilled in the art, without departing from the principles of the present disclosure, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the present disclosure. protected range.

1: Single wafer wet processing equipment 10: Rotating table 20: Liquid recovery device 21~24: recycling ring 201: ring upper cover 2011: upper groove 202: Ring bottom plate 2021: Lower groove 203: Outer Ring Wall 204: Liquid receiving port 205: divider 2051: Through hole 206: Gas Channel Port 207: Liquid collection port 208: Inner Ring Space 209: Outer Ring Space 30: Gas recovery device 31: Bellows 32: Exhaust pipe 301: upper surface 302: lower surface 303: side surface 304: Cavity 305: first connection port 306: second connection port 307: Drain 40: Lifting device 50: recovery tube 51, 61, 62: path 70: Water pipe 80: viewing window

Figure 1 shows a three-dimensional schematic diagram of a single wafer wet processing equipment according to a preferred embodiment of the present disclosure; Figure 2 shows an enlarged partial cross-sectional view of the single wafer wet processing equipment in Figure 1; Figure 3 shows a partial schematic diagram of the recovery ring and gas recovery device of the single wafer wet processing equipment in Figure 1; Figure 4 shows an exploded view of the parts of the recovery ring in Figure 3; and Fig. 5 shows another partial cross-sectional enlarged view of the single wafer wet processing equipment of Fig. 1.

1: Single wafer wet processing equipment

10: Rotating table

20: Liquid recovery device

30: Gas recovery device

40: Lifting device

Claims (12)

A single wafer wet processing equipment, including: A rotating table for placing a wafer; A liquid supply device, arranged above the rotating table, for applying a plurality of process liquids to the wafer; A liquid recovery device is circumferentially arranged around the rotating platform and can move relative to the rotating platform along a vertical direction, wherein the liquid recovery device includes a plurality of recovery rings stacked along the vertical direction, and each The recovery ring is used to collect one of the corresponding process liquids and their entrained gas-liquid mixture; and A plurality of gas recovery devices are respectively connected to the plurality of recovery rings of the liquid recovery device, and each of the gas recovery devices includes: A wind box includes a first connection port and a second connection port, wherein the first connection port is connected to a corresponding recovery ring, so that the gas-liquid mixture in the recovery ring enters the wind box through the first connection port Inside; and An exhaust pipe is connected with the second connection port of the wind box, and is used to discharge the collected gas-liquid mixture. For example, the single-wafer wet processing equipment of claim 1, wherein the air box of each gas recovery device further includes: an upper surface, a lower surface, a side surface, and a cavity, and the upper surface and the lower surface are arranged oppositely, And the side surface is located between the upper surface and the lower surface, and the cavity is formed by connecting the upper surface, the lower surface, and the side surface to each other, wherein the first connection port is provided on the side surface , And the second connecting port is provided on the upper surface. For example, the single-wafer wet processing equipment of claim 2, wherein the wind box of each gas recovery device further includes: a liquid discharge port is provided on the lower surface, so that the gas-liquid mixture passes through the wind box to produce condensation The liquid is discharged through the discharge port. For example, the single wafer wet processing equipment of claim 1, wherein each of the recovery loops of the liquid recovery device includes: A liquid receiving port aligned with the rotating table; A partition plate is arranged inside the recovery ring to separate an inner ring space and an outer ring space, wherein the inner ring space is used to receive the process liquid entering from the liquid receiving port and the entrained gas and liquid And the partition plate blocks the process liquid from flowing from the inner ring space to the outer ring space, and a plurality of through holes are formed on the partition plate for allowing the gas-liquid mixture in the inner ring space to pass through The through holes enter the outer ring space; and A liquid collection port in communication with the inner ring space for allowing the process liquid to be discharged from the liquid collection port; and A plurality of gas recovery devices are respectively connected to the plurality of recovery rings of the liquid recovery device, and are used to discharge the collected gas-liquid mixture. For example, the single-wafer wet processing equipment of claim 4, wherein each of the recycling loops also includes: A ring-shaped upper cover; An annular bottom plate corresponding to the annular upper cover; An outer ring wall connected with the outer periphery of the annular upper cover and the outer periphery of the annular bottom plate; A gas passage opening is arranged on the outer ring wall and connected to one of the corresponding gas recovery devices, wherein the partition plate is arranged between the annular upper cover and the annular bottom plate, and the liquid receiving opening is located at Between the inner periphery of the annular upper cover and the inner periphery of the annular bottom plate. For example, the single-wafer wet processing equipment of claim 1, wherein the bellows of each gas recovery device further includes a viewing window, and the inside of the bellows can be seen through the viewing window; and The single-wafer wet processing equipment further includes a plurality of water pipes, and the wind box of each gas recovery device is connected to a water pipe, and clean water is transmitted to the wind box through the water pipe to clean the water pipe. The inside of the bellows. A single wafer wet processing equipment, including: A rotating table for placing a wafer; A liquid supply device, arranged above the rotating table, for applying a plurality of process liquids to the wafer; A liquid recovery device is circumferentially arranged around the rotating platform and can move relative to the rotating platform along a vertical direction, wherein the liquid recovery device includes a plurality of recovery rings stacked along the vertical direction, each of which The recycling ring contains: A liquid receiving port, aligned with the rotating table, for receiving one of the corresponding process liquids and the gas-liquid mixture entrained therein; A partition plate is arranged inside the recovery ring to separate an inner ring space and an outer ring space, wherein the inner ring space is used to receive the process liquid entering from the liquid receiving port and the entrained gas and liquid And the partition plate blocks the process liquid from flowing from the inner ring space to the outer ring space, and a plurality of through holes are formed on the partition plate for allowing the gas-liquid mixture in the inner ring space to pass through The through holes enter the outer ring space; and A liquid collection port in communication with the inner ring space for allowing the process liquid to be discharged from the liquid collection port; and A plurality of gas recovery devices are respectively connected to the plurality of recovery rings of the liquid recovery device, and are used to discharge the collected gas-liquid mixture. For example, the single-wafer wet processing equipment of claim 7, wherein each recycling ring also includes: A ring-shaped upper cover; An annular bottom plate corresponding to the annular upper cover; An outer ring wall connected with the outer periphery of the annular upper cover and the outer periphery of the annular bottom plate; A gas passage opening is arranged on the outer ring wall and connected to one of the corresponding gas recovery devices, wherein the partition plate is arranged between the annular upper cover and the annular bottom plate, and the liquid receiving opening is located at Between the inner periphery of the annular upper cover and the inner periphery of the annular bottom plate. For example, the single-wafer wet processing equipment of claim 7, wherein each of the gas recovery devices includes: A wind box includes a first connection port and a second connection port, wherein the first connection port is connected to a corresponding recovery ring, so that the gas-liquid mixture in the recovery ring enters the wind box through the first connection port Inside; and An exhaust pipe is connected with the second connection port of the wind box, and is used to discharge the collected gas-liquid mixture. For example, the single-wafer wet processing equipment of claim 9, wherein the wind box of each gas recovery device further includes: an upper surface, a lower surface, a side surface, and a cavity, and the upper surface and the lower surface are arranged oppositely, And the side surface is located between the upper surface and the lower surface, and the cavity is formed by connecting the upper surface, the lower surface, and the side surface to each other, wherein the first connection port is provided on the side surface , And the second connecting port is provided on the upper surface. For example, the single-wafer wet processing equipment of claim 9, wherein the wind box of each of the gas recovery devices further includes: a liquid discharge port arranged on the lower surface, so that the gas-liquid mixture passes through the wind box to produce condensation The liquid is discharged through the discharge port. For example, the single-wafer wet processing equipment of claim 9, wherein the bellows of each gas recovery device further includes a viewing window, and the inside of the bellows can be seen through the viewing window; and The single-wafer wet processing equipment further includes a plurality of water pipes, and the wind box of each gas recovery device is connected to a water pipe, and clean water is transmitted to the wind box through the water pipe to clean the water pipe. The inside of the bellows.

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