TW202040641A - Substrate processing apparatus and article manufacturing method - Google Patents

Substrate processing apparatus and article manufacturing method Download PDF

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TW202040641A
TW202040641A TW109106860A TW109106860A TW202040641A TW 202040641 A TW202040641 A TW 202040641A TW 109106860 A TW109106860 A TW 109106860A TW 109106860 A TW109106860 A TW 109106860A TW 202040641 A TW202040641 A TW 202040641A
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Taiwan
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substrate
conveying
unit
stage
processing apparatus
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TW109106860A
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Chinese (zh)
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TWI798535B (en
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西村光英
神野健一
松本華宗
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日商佳能股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
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    • G05B2219/26—Pc applications
    • G05B2219/2621—Conveyor, transfert line
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The present invention provides a substrate processing apparatus that processes a substrate, the apparatus including a stage configured to hold and move the substrate, a conveying unit configured to hold and convey the substrate between conveying unit and the stage, an accumulation unit configured to accumulate control information concerning the stage and the conveying unit which is generated by processing the substrate, and a determination unit configured to determine a conveying procedure when conveying the substrate between the stage and the conveying unit by selecting one of a plurality of conveying procedures which can be set for the stage and the conveying unit based on control information accumulated in the accumulation unit.

Description

基板處理設備以及物品製造方法Substrate processing equipment and article manufacturing method

本發明涉及基板處理設備以及物品製造方法。The present invention relates to substrate processing equipment and article manufacturing methods.

隨著使用曝光設備的各種裝置製造方法(製程)的增加，有必要以高生產率(以高速)輸送各種類型的基板。各種類型的基板包括例如具有大量翹曲的基板、具有低平坦度的反面的基板以及具有塗覆有化學試劑或塗覆劑的反面的基板。 日本專利公開No.2006-269867和No.2017-108169提出了關於基板的輸送的技術。日本專利公開No.2006-269867公開了透過改變輸送機構的各個單元的驅動參數、夾持基板的壓力(基板夾持壓力)等來以高生產率輸送基板的技術。日本專利公開No.2017-108169公開了透過使用用於基板的雙重輸送路徑來以高生產率輸送基板的技術。 常規技術中的任何一個都不是能夠關於各種類型基板針對每個製程在設備側自動確定(選擇)最佳驅動參數、基板夾持壓力、輸送路徑等的技術。 根據日本專利公開No.2006-269867，有必要提供用於測量基板的翹曲量的單元或預先掌握基板的翹曲量。此外，根據日本專利公開No.2006-269867，從基板的翹曲量來確定輸送機構的各個單元的驅動參數和基板夾持壓力，但是不考慮基板的反面的狀態。另一態樣，日本專利公開No.2017-108169中公開的技術需要提供兩條輸送路徑(第一輸送路徑和第二輸送路徑)以便提高基板輸送的生產率。With the increase in various device manufacturing methods (processes) using exposure equipment, it is necessary to transport various types of substrates with high productivity (at high speed). Various types of substrates include, for example, a substrate having a large amount of warpage, a substrate having a reverse surface with low flatness, and a substrate having a reverse surface coated with a chemical agent or coating agent. Japanese Patent Publication Nos. 2006-269867 and No. 2017-108169 propose technologies related to the transportation of substrates. Japanese Patent Laid-Open No. 2006-269867 discloses a technique of conveying substrates with high productivity by changing the driving parameters of the respective units of the conveying mechanism, the pressure for clamping the substrate (substrate clamping pressure), and the like. Japanese Patent Publication No. 2017-108169 discloses a technique of conveying substrates with high productivity by using dual conveying paths for substrates. None of the conventional technologies is capable of automatically determining (selecting) optimal driving parameters, substrate clamping pressure, conveying path, etc. on the device side for each process for various types of substrates. According to Japanese Patent Publication No. 2006-269867, it is necessary to provide a unit for measuring the warpage amount of the substrate or grasp the warpage amount of the substrate in advance. In addition, according to Japanese Patent Publication No. 2006-269867, the drive parameters and substrate clamping pressure of each unit of the conveying mechanism are determined from the warpage amount of the substrate, but the state of the reverse surface of the substrate is not considered. On the other hand, the technology disclosed in Japanese Patent Publication No. 2017-108169 needs to provide two conveying paths (a first conveying path and a second conveying path) in order to improve the productivity of substrate conveying.

本發明提供了基板處理設備，該基板處理設備有利於確定在輸送基板時的輸送過程。 根據本發明的一態樣，提供了一種用於處理基板的基板處理設備，該設備包括被配置成保持和移動基板的台、被配置成在輸送單元與台之間保持和輸送基板的輸送單元、被配置成累積透過處理基板而生成的與台和輸送單元有關的控制資訊的累積單元以及確定單元，該確定單元被配置成透過基於在累積單元中累積的控制資訊來選擇能夠針對台和輸送單元設定的多個輸送過程中的一個輸送過程來確定在台與輸送單元之間輸送基板時的輸送過程。 根據本發明的第二態樣，提供了一種物品製造方法，該物品製造方法包括透過使用上述基板處理設備在基板上形成圖案、處理在形成中形成了圖案的基板以及從經處理的基板製造物品。 透過以下參考圖式對範例性實施例的描述，本發明的更多態樣將變得清楚。The present invention provides a substrate processing equipment, which facilitates determining the conveying process when conveying a substrate. According to an aspect of the present invention, there is provided a substrate processing apparatus for processing a substrate, the apparatus including a table configured to hold and move the substrate, and a transport unit configured to hold and transport the substrate between the transport unit and the table , An accumulation unit and a determination unit configured to accumulate control information related to the stage and the conveying unit generated by processing the substrate, the determination unit being configured to select the stage and conveyance based on the control information accumulated in the accumulation unit One of the multiple transport processes set by the unit determines the transport process when the substrate is transported between the table and the transport unit. According to a second aspect of the present invention, there is provided a method for manufacturing an article, which includes forming a pattern on a substrate by using the substrate processing apparatus described above, processing a substrate on which the pattern is formed during formation, and manufacturing an article from the processed substrate . Through the following description of exemplary embodiments with reference to the drawings, more aspects of the present invention will become clear.

在下文中，將參考圖式詳細描述實施例。注意的是，以下實施例並非意於限制所要求保護的發明的範圍。在實施例中描述了多個特徵，但是並不限制要求所有這樣的特徵的發明，並且可以適當地組合多個這樣的特徵。此外，在圖式中，相同的圖式標記被賦予相同或相似的配置，並且省略其重複描述。 圖1是顯示根據本發明的一態樣的曝光設備1的佈置的示意圖。曝光設備1是在作為裝置的製造製程的微影製程中使用的微影設備，並且對基板進行處理。在這個實施例中，曝光設備1被實現為在基板上形成圖案的基板處理設備。曝光設備1透過步進掃描系統或步進重複系統經由掩模(原件)曝光基板，並且將掩模圖案轉印到基板上。 注意的是，本發明不將基板處理設備限於曝光設備，並且還可以應用於壓印設備和繪圖設備。在這種情況下，壓印設備使供應到基板上的壓印材料與模具接觸，並將固化能量施加到壓印材料，以在其上轉印有模具圖案的固化材料上形成圖案。繪圖設備透過用帶電粒子束(電子束)或雷射束在基板上繪圖來在基板上形成圖案(潛像圖案)。此外，本發明可以應用於諸如各種類型的高精度處理設備和各種類型的高精度測量設備之類的被配置成處理基板的設備。 曝光設備1包括利用來自光源101的光照亮掩模109的照明光學系統104、投影光學系統110、第一驅動單元112、第二驅動單元113、基板台116、雷射干涉儀118和第三驅動單元119。曝光設備1還包括對準測量系統124、聚焦測量系統140、主控制單元103、照明系統控制單元108、投影系統控制單元114、台控制單元120和輸送單元130。 光源101發射(輸出)多個波長帶中的光作為曝光光。照明光學系統104還包括整形光學系統(未顯示)和光學積分器(未顯示)。照明光學系統104還包括遮光板105、半反射鏡106和光感測器107。 從光源101發射並進入照明光學系統104的光經由整形光學系統被整形為預定形狀。由整形光學系統整形的光進入光學積分器。光學積分器形成用於以均勻的照度分佈來照亮掩模109的許多二次光源。遮光板105佈置在照明光學系統104的光路上以在掩模上形成任意照明區域。半反射鏡106佈置在照明光學系統104的光路上以反射(提取)照亮掩模109的光(曝光光)的一部分。光感測器107佈置在由半反射鏡106反射的光的光路上以檢測光的強度(曝光能量)。照明系統控制單元108在主控制單元103的控制下控制照明光學系統104的每個單元(例如，遮光板105)。 掩模109具有要被轉印到基板115上的圖案，即，半導體裝置的電路圖案，並且被照明光學系統104照亮。投影光學系統110由例如折射系統或折反射(catadioptric)系統形成。投影光學系統110以預定的倍率(例如，1/2)將掩模109的圖案(其圖像)投影(形成)在塗覆有光阻劑(光敏劑)的基板115(基板115的一個壓射區域)上。投影光學系統110包括孔徑光欄111。孔徑光欄111佈置在投影光學系統110的光瞳面(即，與掩模109相對應的傅立葉變換面)中，並且包括幾乎圓形的開口部。 第一驅動單元112包括馬達，並且透過控制孔徑光欄111的開口部的直徑來設定預定的NA(數值孔徑)。第二驅動單元113沿著投影光學系統110的光軸驅動(移動)構成投影光學系統110的透鏡系統的一部分的光學元件。這使得可以在適當地維持投影倍率的同時抑制投影光學系統110的像差的退化並且減小畸變誤差。投影系統控制單元114在主控制單元103的控制下經由第一驅動單元112和第二驅動單元113控制投影光學系統110的各個單元(孔徑光欄111和光學元件)。 如上所述，基板115是在其上要轉印(投影)掩模109的圖案並且施加光阻劑的基板。基板115包括晶片、玻璃板和其它類型的基板。 基板台116是保持基板115的台。第三驅動單元119在三維方向上，即，沿著投影光學系統110的光軸的方向(Z方向)和與該方向正交的面(X-Y面)移動基板台116。第三驅動單元119包括用於移動基板台116的馬達。在這個實施例中，沿著投影光學系統110的光軸的方向是Z方向(Z軸)，並且與投影光學系統110的光軸正交的方向是X方向(X軸)和Y方向(Y軸)。 雷射干涉儀118檢測距固定到基板台116的鏡117的距離，以測量基板台116在X-Y面上的位置。對準測量系統124測量在基板115與基板台116之間的位置偏移。台控制單元120在主控制單元103的控制下基於由雷射干涉儀118獲得的測量結果和由對準測量系統124獲得的測量結果經由第三驅動單元119將基板台116移動到X-Y面中的預定位置。 聚焦測量系統140包括投影光學系統121和檢測光學系統122，並且在沿著投影光學系統110的光軸的方向上測量基板115的位置，即，基板115的表面的高度。投射光學系統121投影不使施加在基板115上的光阻劑敏感的光(非曝光光)，並且將光聚焦在基板115上的每個位置處。在基板115上的每個位置處反射的光進入檢測光學系統122。 檢測光學系統122具有與在基板115上的每個位置處反射的光對應地佈置的用於位置檢測的多個光接收元件。更具體地，用於位置檢測的多個光接收元件被佈置成使得每個光接收元件的光接收表面經由成像光學系統幾乎與基板115上的每個位置(每個反射點)共軛。因此，基板115在沿著投影光學系統110的光軸的方向上的位置偏移被測量作為進入佈置在檢測光學系統122上的每個光接收元件的光的位置偏移。 輸送單元130是用於在輸送單元130與基板台116之間保持並輸送基板115的輸送機構。如圖2中所示，輸送單元130包括輸送埠201、第一基板手202、預對準單元203和第二基板手204。稍後將與基板115在基板台116與輸送單元130之間的輸送一起描述輸送單元130的細節。圖2是顯示基板台116和輸送單元130的佈置的示意性平面圖。 儲存單元123儲存操作曝光設備1所需的各種類型的程式、資料等。在這個實施例中，儲存單元123還用作累積單元，該累積單元儲存並累積由於在曝光設備1中處理基板115而生成的與基板台116和輸送單元130有關的控制資訊。在這種情況下，控制資訊包括基板台116和輸送單元130用來保持基板115的保持力以及基板台116和輸送單元130以預設的保持力保持基板115所需的時間。此外，控制資訊包括與當基板115在基板台116與輸送單元130之間輸送時基板115的對準有關的測量值以及對準錯誤的數量。然而，注意的是，控制資訊不必總是包括所有以上資訊，並且可以包括以上資訊中的至少一條。 主控制單元103由資訊處理設備(電腦)形成，並且根據儲存在儲存單元123中的程式經由照明系統控制單元108、投影系統控制單元114和台控制單元120來全面地控制曝光設備1中的各個單元。主控制單元103控制透過經由掩模109曝光基板115而在基板115上形成圖案的曝光處理。此外，在這個實施例中，主控制單元103用作確定單元，該確定單元基於累積在儲存單元123中的控制資訊來確定在基板台116與輸送單元130之間輸送基板115時的輸送過程。 將參考圖2描述在基板台116與輸送單元130之間的基板115的輸送。基板台116設置有將基板115保持在保持表面上的卡盤206。基板台116還設置有提重銷205，該提重銷205透過驅動單元(未顯示)相對於卡盤206將基板115保持在其上的保持表面上下移動。注意的是，代替提重銷205，卡盤206可以透過驅動單元(未顯示)上下移動以使提重銷205相對於卡盤206的保持表面上下移動。 首先將描述與基板115的裝載有關的裝載處理。在裝置製造工廠中，基板115經由將曝光設備1連接到外部設備的輸送埠201被裝載到曝光設備1中。第一基板手202將裝載到曝光設備1中的基板115輸送到執行基板115的預對準(粗定位)的預對準單元203。第二基板手204將經歷了由預對準單元203進行的預對準的基板115輸送到基板台116。此時，基板台116已預先移動到基板裝載位置(第一位置)。當第二基板手204將基板115傳送到基板台116時，在提重銷205上升到了卡盤206的保持表面上方的同時，提重銷205首先接收基板115。提重銷205接著向下移動以使卡盤206保持(傳送)由提重銷205接收的基板115。第一基板手202、預對準單元203、第二基板手204、提重銷205和卡盤206各自透過例如真空抽吸來保持基板115。卡盤206透過保持基板115來完成裝載處理。 接下來將描述與基板115的卸載有關的卸載處理。當完成對基板115的曝光處理時，保持基板115的基板台116移動到基板卸載位置(第一位置)。當基板台116將基板115傳送到第一基板手202時，提重銷205首先在基板台116上向上移動，以將基板115從卡盤206傳送到提重銷205。接著，由提重銷205保持的基板115被傳送到第一基板手202。第一基板手202將基板115輸送到輸送埠201。透過從輸送埠201卸載基板115來完成卸載處理。 ＜第一實施例＞ 將參考圖3描述曝光設備1的操作。在步驟S101中，曝光設備1確定裝載到曝光設備1中的用於目標批次(批次中包括的多個基板)的配方(製程)是否是過去處理過的配方。如果目標批次的配方是過去處理過的配方，那麼處理移動到步驟S102。如果目標批次的配方不是過去處理過的配方，那麼處理移動到步驟S103。 在步驟S102中，當與用於目標批次的配方相同的配方被處理作為在基板台116與輸送單元130之間輸送基板115時的輸送過程時，曝光設備1選擇與該配方相關聯地儲存在儲存單元123中的輸送過程(過去的輸送過程)。 在步驟S103中，曝光設備1選擇預設設定的輸送過程(預設輸送過程)作為在基板台116與輸送單元130之間輸送基板115時的輸送過程。 在這個實施例中，可以針對基板台116和輸送單元130設定的多個輸送過程被儲存在儲存單元123中作為在基板台116與輸送單元130之間輸送基板115時的輸送過程。例如，儲存單元123儲存第一輸送過程和第二輸送過程作為多個輸送過程。假定在這種情況下，與第二輸送過程相比，第一輸送過程(下文中被稱為“面向生產率的過程”)優先考慮與基板115的輸送有關的生產率。與第一輸送過程相比，第二輸送過程(下文中被稱為“面向穩定性的過程”)優先考慮與基板115的輸送有關的穩定性。預設輸送過程可以是面向生產率的過程。注意的是，在這個實施例中，多個輸送過程是兩種類型的輸送過程。然而，這不是詳盡的。此外，預設輸送過程可以是利用參數能夠設定的。 在步驟S104中，曝光設備1執行將基板115裝載到曝光設備1中的裝載處理。裝載處理與參考圖2描述的裝載處理相同，因此將省略該處理的詳細描述。 在步驟S105中，曝光設備1將由於裝載基板115而生成的與基板台116和輸送單元130有關的控制資訊儲存在儲存單元123中。更具體地，儲存單元123儲存提重銷205和卡盤206用來保持基板115的夾持壓力(保持力)以及提重銷205和卡盤206以預設的夾持壓力來保持基板115所需的夾持時間。 在步驟S106中，曝光設備1執行對準測量處理。對準測量處理是與基板115的對準有關的處理，該對準測量處理在基板115在基板台116與輸送單元130之間輸送時被執行。對準測量處理是用於測量基板115的位置偏移的處理。更具體地，對準測量處理包括測量基板115與基板台116之間的位置偏移的處理以及測量掩模109與基板115之間的位置偏移的處理。 在步驟S107中，曝光設備1將透過對準基板115而生成的與基板台116和輸送單元130有關的控制資訊儲存在儲存單元123中。更具體地，儲存單元123儲存與當基板115在基板台116與輸送單元130之間輸送時執行的基板115的對準有關的測量值以及對準中的錯誤的數量。 在步驟S108中，曝光設備1執行透過經由掩模109對基板115進行曝光而在基板115上形成圖案的曝光處理，同時根據在步驟S106中執行的對準測量處理來控制掩模109與基板115之間的相對位置。 在步驟S109中，曝光設備1執行從曝光設備1卸載基板115的卸載處理。卸載處理與參考圖2描述的卸載處理相同，因此將省略該處理的詳細描述。 在步驟S110中，曝光設備1將由於卸載基板115而生成的與基板台116和輸送單元130有關的控制資訊儲存在儲存單元123中。更具體地，儲存單元123儲存提重銷205和卡盤206用來保持基板115的夾持壓力(保持力)以及提重銷205和卡盤206以預設的夾持壓力來保持基板115所需的夾持時間。 在步驟S111中，曝光設備1儲存指示是否發生了預設的特定錯誤的資訊。在這種情況下，特定錯誤包括例如夾持錯誤，即，透過提重銷205或卡盤206夾持基板115的故障。 在步驟S112中，曝光設備1執行確定在基板台116與輸送單元130之間輸送基板115時的輸送過程的確定處理。稍後將參考圖4描述確定處理的細節。 在步驟S113中，曝光設備1確定是否針對批次中包括的所有基板115執行了曝光處理。如果尚未針對該批次中包括的所有基板115執行曝光處理，那麼處理移動到步驟S104以針對下一基板115執行曝光處理。如果已針對該批次中包括的所有基板115執行了曝光處理，那麼處理移動到步驟S114。 在步驟S114中，曝光設備1將用於在步驟S101中輸入的目標批次的配方的最佳輸送過程(即，在步驟S102或S103中選擇的輸送過程或在步驟S112中確定的輸送過程)與該配方相關聯地儲存在儲存單元123中。 將參考圖4A和圖4B描述確定在基板台116與輸送單元130之間輸送基板115時的輸送過程的確定處理(步驟S112)的細節。在下面的描述中，針對在儲存單元123中累積(儲存)的每個控制資訊設定的臨界值被設定為第一臨界值，並且針對批次中超過第一臨界值的基板115的數量設定的臨界值被設定為第二臨界值。 在步驟S201中，曝光設備1讀出儲存在儲存單元123中的輸送過程。在步驟S202中，曝光設備1確定在步驟S105中儲存在儲存單元123中的與裝載處理中的卡盤206有關的夾持壓力和夾持時間是否等於或小於為其設定的第一臨界值。如果與卡盤206有關的夾持力和夾持時間不等於或小於第一臨界值，那麼處理移動到步驟S203。如果與卡盤206有關的夾持力和夾持時間等於或小於第一臨界值，那麼處理移動到步驟S205。 在步驟S203中，曝光設備1對批次中超過依據與裝載處理中的卡盤206有關的夾持壓力和夾持時間的第一臨界值的基板115的數量進行計數。在步驟S204中，曝光設備1確定在步驟S203中計數的基板115的數量是否等於或小於為其設定的第二臨界值。如果在步驟S203中計數的基板115的數量不等於或小於第二臨界值，那麼處理移動到步驟S223。如果在步驟S203中計數的基板115的數量等於或小於第二臨界值，那麼處理移動到步驟S205。 在步驟S223中，曝光設備1確定在批次中輸送過程是否被改變(確定)。如果在批次中輸送過程沒有被改變，那麼處理移動到步驟S224。如果在批次中輸送過程被改變，那麼處理移動到步驟S225。 在步驟S224中，曝光設備1改變(確定)輸送過程並且將該輸送過程儲存在儲存單元123中。在這個實施例中，例如，如果當前的輸送過程是面向生產率的過程，那麼出於以下原因，該輸送過程被改變為面向穩定性的過程。如果輸送過程是面向生產率的過程，那麼有必要執行針對錯誤的恢復處理，導致生產率惡化。因此，將輸送過程改變為優先考慮穩定性的面向穩定性的過程將提高生產率。如日本專利公開No.2006-269867中所公開的，曝光設備1可以改變與基板台116和輸送單元130的各個單元有關的驅動參數和第一臨界值，並且改變輸送過程。 在步驟S225中，曝光設備1確定與對準有關的測量值和對準中的錯誤的數量是否超過為其設定的第一臨界值。如果與對準有關的測量值和對準中的錯誤的數量超過第一臨界值，那麼處理移動到步驟S226以通知例如指示錯誤因素可能是製程(批次)因素的資訊之類的對應的資訊。換句話說，如果輸送過程被改變並且與對準有關的測量值和對準中的錯誤的數量在改變輸送過程之前和之後沒有改變，那麼曝光設備1通知該對應的資訊。這種通知是經由例如曝光設備1的顯示器或音訊輸出裝置執行的，並且因此顯示器或音訊輸出裝置用作通知單元。 在步驟S205中，曝光設備1確定在步驟S105中儲存在儲存單元123中的與裝載處理中的提重銷205有關的夾持壓力和夾持時間是否等於或小於為其設定的第一臨界值。如果與提重銷205有關的夾持壓力和夾持時間不等於或小於第一臨界值，那麼處理移動到步驟S206。如果與提重銷205有關的夾持壓力和夾持時間等於或小於第一臨界值，那麼處理移動到步驟S208。 在步驟S206中，曝光設備1對批次中超過與和裝載處理中的提重銷205有關的夾持壓力和夾持時間有關的第一臨界值的基板115的數量進行計數。在步驟S207中，曝光設備1確定在步驟S206中計數的基板115的數量是否等於或小於為其設定的第二臨界值。如果在步驟S206中計數的基板115的數量不等於或小於第二臨界值，那麼處理移動到步驟S223。如果在步驟S206中計數的基板115的數量等於或小於第二臨界值，那麼處理移動到步驟S208。 在步驟S208中，曝光設備1確定在步驟S107中儲存在儲存單元123中的對準測量處理中的對準測量值是否等於或小於為對準測量值設定的第一臨界值。如果對準測量值不等於或小於第一臨界值，那麼處理移動到步驟S209。如果對準測量值等於或小於第一臨界值，那麼處理移動到步驟S211。 在步驟S209中，曝光設備1對批次中超過與對準測量值有關的第一臨界值的基板115的數量進行計數。在步驟S210中，曝光設備1確定在步驟S209中計數的基板115的數量是否等於或小於針對基板數量設定的第二臨界值。如果在步驟S209中計數的基板115的數量不等於或小於第二臨界值，那麼處理移動到步驟S223。如果在步驟S209中計數的基板115的數量等於或小於第二臨界值，那麼處理移動到步驟S211。 在步驟S211中，曝光設備1基於在步驟S107中儲存在儲存單元123中的對準測量處理中的對準錯誤的數量來確定是否發生了對準錯誤。如果發生了對準錯誤，那麼處理移動到步驟S212。如果沒有發生對準錯誤，那麼處理移動到步驟S214。 在步驟S212中，曝光設備1對批次中發生了與對準錯誤的數量有關的對準錯誤的基板115的數量進行計數。在步驟S213中，曝光設備1確定在步驟S212中計數的基板115的數量是否等於或小於針對基板數量設定的第二臨界值。如果在步驟S212中計數的基板115的數量不等於或小於第二臨界值，那麼處理移動到步驟S223。如果在步驟S212中計數的基板115的數量等於或小於第二臨界值，那麼處理移動到步驟S214。 在步驟S214中，曝光設備1確定在步驟S110中儲存在儲存單元123中的與卸載處理中的卡盤206有關的夾持壓力和夾持時間是否等於或小於為其設定的第一臨界值。如果與卡盤206有關的夾持壓力和夾持時間不等於或小於第一臨界值，那麼處理移動到步驟S215。如果與卡盤206有關的夾持壓力和夾持時間等於或小於第一臨界值，那麼處理移動到步驟S217。 在步驟S215中，曝光設備1對批次中超過與和卸載處理中的卡盤206有關的夾持壓力和夾持時間有關的第一臨界值的基板115的數量進行計數。在步驟S216中，曝光設備1確定在步驟S215中計數的基板115的數量是否等於或小於第二臨界值。如果在步驟S215中計數的基板115的數量不等於或小於第二臨界值，那麼處理移動到步驟S223。如果在步驟S215中計數的基板115的數量等於或小於第二臨界值，那麼處理移動到步驟S217。 在步驟S217中，曝光設備1確定在步驟S110中儲存在儲存單元123中的與卸載處理中的提重銷205有關的夾持壓力和夾持時間是否等於或小於為其設定的第一臨界值。如果與提重銷205有關的夾持壓力和夾持時間不等於或小於第一臨界值，那麼處理移動到步驟S218。如果與提重銷205有關的夾持壓力和夾持時間等於或小於第一臨界值，那麼處理移動到步驟S220。 在步驟S218中，曝光設備1對批次中超過與和卸載處理中的提重銷205有關的夾持壓力和夾持時間有關的第一臨界值的基板115的數量進行計數。在步驟S219中，曝光設備1確定在步驟S218中計數的基板115的數量是否等於或小於針對基板數量設定的第二臨界值。如果在步驟S218中計數的基板115的數量不等於或小於第二臨界值，那麼處理移動到步驟S223。如果在步驟S218中計數的基板115的數量等於或小於第二臨界值，那麼處理移動到步驟S220。 在步驟S220中，曝光設備1基於在步驟S111中儲存在儲存單元123中的指示特定錯誤的存在/不存在的資訊來確定是否發生了特定錯誤。如果發生了特定錯誤，那麼處理移動到步驟S221。如果沒有發生特定錯誤，那麼確定處理終止。 在步驟S221中，曝光設備1對批次中發生了特定錯誤的基板115的數量進行計數。在步驟S222中，曝光設備1確定在步驟S221中計數的基板115的數量是否等於或小於針對基板數量設定的第二臨界值。如果在步驟S221中計數的基板115的數量不等於或小於第二臨界值，那麼處理移動到步驟S223。注意的是，關於特定錯誤，在步驟S224中，曝光設備1例如改變用於卡盤206和提重銷205的夾持壓力的第一臨界值。如果在步驟S221中計數的基板115的數量等於或小於第二臨界值，那麼確定處理終止。 將參考圖5描述作為這個實施例中的輸送過程之一的面向生產率的過程。在步驟S301中，基板115經由輸送埠201被裝載到曝光設備1中。在步驟S302中，第一基板手202將裝載到曝光設備1中的基板115輸送(移動)到預對準單元203。在步驟S303中，預對準單元203將基板115傳送到第二基板手204。在步驟S304中，基板115在基板裝載位置處被從第二基板手204傳送到提重銷205。 在步驟S305中，曝光設備1在Y軸負方向上移動第二基板手204，以使第二基板手204從基板裝載位置縮回。在步驟S306中，曝光設備1在Y軸正方向上移動基板台116，以使基板台116縮回到基板台116不干擾已在步驟S305中縮回的第二基板手204的非干擾區域。在步驟S307中，曝光設備1在Z軸正方向上移動基板台116，以將基板台116驅動到基板台116干擾第二基板手204的前干擾區域。 在面向生產率的過程中，曝光設備1以這種方式並行地執行步驟S305、S306和S307。換句話說，面向生產率的過程是用於並行地執行以下過程的過程：用於在輸送單元130在基板裝載位置處將基板115傳送到基板台116之後使輸送單元130從基板裝載位置縮回的過程和用於使基板台116從基板裝載位置縮回的過程。這提高了與基板115的裝載有關的生產率。 在完成步驟S305、S306和S307的並行處理之後，在步驟S308中，提重銷205將基板115傳送到卡盤206。因此，曝光設備1終止優先考慮生產率的輸送過程。 將參考圖6描述作為這個實施例中的輸送過程之一的面向穩定性的過程。在步驟S401中，基板115經由輸送埠201被裝載到曝光設備1中。在步驟S402中，第一基板手202將裝載到曝光設備1中的基板115輸送(移動)到預對準單元203。在步驟S403中，預對準單元203將基板115傳送到第二基板手204。在步驟S404中，第二基板手204在基板裝載位置處將基板115傳送到提重銷205。 在步驟S405中，曝光設備1在Y軸負方向上移動第二基板手204以使第二基板手204從基板裝載位置縮回。在步驟S406中，曝光設備1在Z軸正方向上移動基板台116以將基板台116驅動到基板台116干擾第二基板手204的干擾區域。 以這種方式，在面向穩定性的過程中，曝光設備1在提重銷205保持基板115的同時抑制基板台116的移動。換句話說，面向穩定性的過程是用於順序地執行以下過程的過程：用於在輸送單元130在基板裝載位置處將基板115傳送到基板台116之後使輸送單元130從基板裝載位置縮回的過程和用於使基板台116從基板裝載位置縮回的過程。這提高了與基板115的裝載有關的穩定性。 在步驟S405和S406中的處理完成之後，在步驟S407中，提重銷205將基板115傳送到卡盤206。因此，曝光設備1終止優先考慮穩定性的輸送過程。 這個實施例已經例示了在基板115被裝載時使用的輸送過程。然而，本發明也可以應用於在基板115被卸載時的輸送過程。下面將描述在卸載基板115時優先考慮生產率的輸送過程和優先考慮穩定性的輸送過程。 將參考圖7描述在卸載基板115時優先考慮生產率的輸送過程。在步驟S501中，卡盤206將基板115傳送到提重銷205。在步驟S502中，曝光設備1在Z軸負方向上移動基板台116以將基板台116驅動到基板台116不干擾第一基板手202的非干擾區域。 在步驟S503中，曝光設備1移動基板台116以將基板台116驅動到基板卸載位置。在步驟S504中，曝光設備1在Y軸正方向上移動第一基板手202以將第一基板手202驅動到基板卸載位置。 以這種方式，在優先考慮生產率的輸送過程中，曝光設備1並行地執行步驟S503和S504。換句話說，這個輸送過程是用於並行地執行以下過程的過程：用於在輸送單元130在基板卸載位置處從基板台116接收基板115之前將基板台116移動到基板卸載位置的過程和用於將輸送單元130移動到基板卸載位置的過程。這提高了與基板115的卸載有關的生產率。 在步驟S503和S504中的並行處理完成之後，在步驟S505中，提重銷205將基板115傳送到第一基板手202。在步驟S506中，基板115透過輸送埠201從曝光設備1被卸載。因此，當卸載基板115時，曝光設備1終止優先考慮生產率的輸送過程。 將參考圖8描述在卸載基板115時優先考慮穩定性的輸送過程。在步驟S601中，曝光設備1移動基板台116以將基板台116驅動到基板卸載位置。在步驟S602中，卡盤206將基板115傳送到提重銷205。在步驟S603中，曝光設備1在Z軸負方向上移動基板台116以將基板台116驅動到基板台116不干擾第一基板手202的非干擾區域。在步驟S604中，曝光設備1在Y軸正方向上移動第一基板手202以將第一基板手202驅動到基板輸送位置。 以這種方式，在優先考慮穩定性的輸送過程中，曝光設備1在提重銷205保持基板115的同時抑制基板台116的移動。換句話說，這個輸送過程是用於順序地執行以下過程的過程：用於在輸送單元130在基板卸載位置處從基板台116接收基板115之前將基板台116移動到基板卸載位置的過程和用於將輸送單元130移動到基板卸載位置的過程。這提高了與基板115的卸載有關的穩定性。 在步驟S605中，提重銷205將基板115傳送到第一基板手202。在步驟S606中，基板115透過輸送埠201從曝光設備1卸載。因此，當卸載基板115時，曝光設備1終止優先考慮穩定性的輸送過程。 以這種方式，在這個實施例中，曝光設備1基於由於輸送基板115而生成的與基板台116和輸送單元130有關的控制資訊來確定(改變)當在基板台116與輸送單元130之間輸送基板115時的輸送過程。在這種情況下，曝光設備1透過基於每個控制資訊以及在每個控制資訊與針對每個控制資訊設定的臨界值之間的比較結果來選擇儲存在儲存單元123中的多個輸送過程之一，來確定在輸送基板115時的輸送過程。在該實施例中，在連續處理同一批次中包括的多個基板115的同時，曝光設備1確定在基板台116與輸送單元130之間輸送基板115時的輸送過程。然而，曝光設備1還可以針對每個批次或每個預設數量的基板來確定在基板台116與輸送單元130之間輸送基板115時的輸送過程。根據該實施例，可以根據製程自動地確定(改變)用於在基板台116與輸送單元130之間輸送基板115的最佳輸送過程。這使得可以在維持穩定性的同時提高生產率。 將描述圖4中所示的確定處理的具體效果的範例。例如，當當前夾持壓力低於儲存(累積)在儲存單元123中的夾持壓力或者當前夾持時間短於儲存(累積)在儲存單元123中的夾持時間時，估計基板115的翹曲量大或者基板115的反面的平坦度低。假設曝光設備1根據面向生產率的過程來輸送基板115。在這種情況下，當曝光設備1在提重銷205保持基板115的同時移動基板台116時(步驟S306)，可能發生基板115的位置偏移。此外，基板115可能從提重銷205掉落。在這種情況下，因為與面向生產率的過程相比，面向穩定性的過程可以提高與基板115的輸送有關的生產率，所以曝光設備1選擇面向穩定性的過程。 當夾持壓力和夾持時間與儲存(累積)在儲存單元123中的夾持壓力和夾持時間相似時，使用與對準有關的測量值和對準中的錯誤的數量。如果與對準有關的測量值是異常值或發生了對準錯誤，那麼估計在基板115與提重銷205之間的接觸表面已被污染或存在實體缺陷。在這種情況下，因為與面向生產率的過程相比，面向穩定性的過程可以提高與基板115的輸送有關的生產率，所以曝光設備1選擇面向穩定性的過程。 曝光設備1還可以包括用戶介面150，該用戶介面150向用戶提供用於設定第一臨界值和第二臨界值的設定畫面。圖9顯示了被設置(顯示)在顯示器或觸控板上作為用戶介面150的用於設定第一臨界值和第二臨界值的設定畫面701的範例。主控制單元103提供用戶介面150。 在設定畫面701上，參數702用於設定用於裝載處理中的卡盤206的夾持壓力的第一臨界值。參數703用於設定與裝載處理中的卡盤206的夾持壓力超過第一臨界值的各基板115的數量有關的第二臨界值。參數704用於設定在同一批次中超過第二臨界值時要確定(改變)的輸送過程。 參數705用於設定用於裝載處理中的卡盤206的夾持時間的第一臨界值。參數706用於設定與裝載處理中的卡盤206的夾持時間超過第一臨界值的各基板115的數量有關的第二臨界值。參數707用於設定在同一批次中超過第二臨界值時要確定(改變)的輸送過程。 參數708用於設定用於裝載處理中的提重銷205的夾持壓力的第一臨界值。參數709用於設定與裝載處理中的提重銷205的夾持壓力超過第一臨界值的各基板115的數量有關的第二臨界值。參數710用於設定在同一批次中超過第二臨界值時要確定(改變)的輸送過程。 參數711用於設定用於裝載處理中的提重銷205的夾持時間的第一臨界值。參數712用於設定與裝載處理中的提重銷205的夾持時間超過第一臨界值的各基板115的數量有關的第二臨界值。參數713用於設定在同一批次中超過第二臨界值時要確定(改變)的輸送過程。 參數714用於設定用於與對準有關的測量值的第一臨界值。注意的是，可以針對與對準有關的測量值設定多個第一臨界值。例如，可以針對X軸、Y軸和旋轉軸分別設定第一臨界值。參數715用於設定與和對準有關的測量值超過第一臨界值的各基板115的數量有關的第二臨界值。參數716用於設定在同一批次中超過第二臨界值時要確定(改變)的輸送過程。 參數717用於設定用於對準錯誤的數量的第二臨界值。參數718用於設定在同一批次中超過第二臨界值時要確定(改變)的輸送過程。 參數719用於設定用於卸載處理中的卡盤206的夾持壓力的第一臨界值。參數720用於設定與卸載處理中的卡盤206的夾持壓力超過第一臨界值的各基板115的數量有關的第二臨界值。參數721用於設定在同一批次中超過第二臨界值時要確定(改變)的輸送過程。 參數722用於設定用於卸載處理中的卡盤206的夾持時間的第一臨界值。參數723用於設定與卸載處理中的卡盤206的夾持時間超過第一臨界值的各基板115的數量有關的第二臨界值。參數724用於設定在同一批次中超過第二個臨界值時要確定(改變)的輸送過程。 參數725用於設定用於卸載處理中的提重銷205的夾持壓力的第一臨界值。參數726用於設定與卸載處理中的提重銷205的夾持壓力超過第一臨界值的各基板115的數量有關的第二臨界值。參數727用於設定在同一批次中超過第二臨界值時要確定(改變)的輸送過程。 參數728用於設定用於卸載處理中的提重銷205的夾持時間的第一臨界值。參數729用於設定與卸載處理中的提重銷205的夾持時間超過第一臨界值的各基板115的數量有關的第二臨界值。參數730用於設定在同一批次中超過第二臨界值時要確定(改變)的輸送過程。 參數731用於設定與特定錯誤相對應的錯誤編號。參數732用於設定與經歷了特定錯誤的基板115的數量有關的第二臨界值。參數733用於設定在同一批次中超過第二臨界值時要確定(改變)的輸送過程。 參數734用於設定預設輸送過程。 ＜第二實施例＞ 第一實施例已經例示了透過使用針對每條控制資訊設定的每個臨界值來確定(改變)輸送過程的情況。然而，這不是詳盡的。例如，可以透過使用透過機器學習獲得的學習模型來確定(改變)輸送過程。 在第二實施例中，首先，準備指示輸入資料與教師資料之間的關係的學習資料。在這種情況下，輸入資料是包括與夾持壓力、夾持時間或對準有關的測量值和對準錯誤的數量中的至少一個的資料。教師資料是指示輸入資料的適當的輸送過程的資料。指示適當的輸送過程的資料可以是指示分別表示適當和不適當的兩個值的資料。注意的是，指示表示適當性的逐步評估的值(例如，從1到10的自然數)的資料或指示適當的可能性(例如，從0到1的實數)的資料作為指示適當的輸送過程的資料。 可以透過常規基板處理來獲得諸如與夾持壓力、夾持時間和對準有關的測量值以及對準錯誤的數量之類的輸入資料。可以透過從累積在儲存單元123中的每個輸入資料(控制資訊)和生產率來計算統計量來導出作為輸出資料的輸送過程。還可以從透過處理各種類型的基板115並比較生產率來獲得每個輸入資料的實驗中導出輸送過程。 透過使用學習資料來獲得用於確定適當的輸送過程的學習模型。學習資料可以透過使用例如神經網路來獲得。神經網路是具有包括輸入層、中間層和輸出層的多層網路結構的模型。可以透過使用指示輸入資料與教師資料之間的關係的學習資料的諸如反向傳播方法之類的演算法來透過最佳化網路內部的隨機變量來獲得學習資料。這個實施例例示了透過使用神經網路來獲得學習模型的情況。然而，這不是詳盡的。例如，可以使用諸如支援向量機和確定樹之類的其它模型和演算法。 將新的輸入資料輸入到所獲得的學習模型將輸出指示適當的輸送過程的資料作為輸出資料。可以基於輸出資料來確定適當的輸送過程。 注意的是，可以選擇性地執行第一實施例和第二實施例。換句話說，可以進行設定來透過使用針對每條控制資訊設定的每個臨界值來確定輸送過程或者透過使用透過機器學習獲得的學習模型來確定輸送過程。例如，如圖10中所示，在設置在用戶介面150上的設定畫面701上設置了兩個核取方塊741和742。核取方塊741是用於選擇透過使用每個臨界值來確定輸送過程的核取方塊。核取方塊742是用於選擇透過使用學習模型來確定輸送過程的核取方塊。 ＜第三實施例＞ 根據本發明的實施例的物品製造方法適合於製造物品，例如，裝置(半導體裝置、磁儲存媒體、液晶元件等)。這種製造方法包括透過使用曝光設備1在基板上形成圖案的步驟、處理在其上形成圖案的基板的步驟以及從經處理的基板製造物品的步驟。這種製造方法還包括其它已知步驟(氧化、沉積、氣相沉積、摻雜、平坦化、刻蝕、抗蝕劑去除、切割、接合、封裝等)。與常規方法相比，根據該實施例的物品製造方法在物品的性能、品質、生產率和生產成本中的至少一個態樣是有利的。 雖然已經參考範例性實施例描述了本發明，但是應該理解的是，本發明不限於所公開的範例性實施例。所附請求項的範圍應被賦予最廣泛的解釋，以涵蓋所有這樣的修改以及等同的結構和功能。Hereinafter, the embodiments will be described in detail with reference to the drawings. Note that the following examples are not intended to limit the scope of the claimed invention. A plurality of features are described in the embodiments, but the invention requiring all such features is not limited, and a plurality of such features may be appropriately combined. In addition, in the drawings, the same drawing marks are given the same or similar configurations, and repeated descriptions thereof are omitted. FIG. 1 is a schematic diagram showing the arrangement of an exposure apparatus 1 according to an aspect of the present invention. The exposure equipment 1 is a lithography equipment used in a lithography process as a manufacturing process of an apparatus, and processes a substrate. In this embodiment, the exposure apparatus 1 is implemented as a substrate processing apparatus that forms a pattern on a substrate. The exposure apparatus 1 exposes a substrate through a mask (original) through a step-and-scan system or a step-and-repeat system, and transfers the mask pattern onto the substrate. Note that the present invention does not limit the substrate processing equipment to exposure equipment, and can also be applied to imprint equipment and drawing equipment. In this case, the imprint device brings the imprint material supplied to the substrate into contact with the mold, and applies curing energy to the imprint material to form a pattern on the cured material on which the mold pattern is transferred. The drawing device forms a pattern (latent image pattern) on the substrate by drawing on the substrate with a charged particle beam (electron beam) or a laser beam. In addition, the present invention can be applied to equipment configured to process substrates such as various types of high-precision processing equipment and various types of high-precision measurement equipment. The exposure apparatus 1 includes an illumination optical system 104 that illuminates a mask 109 with light from a light source 101, a projection optical system 110, a first driving unit 112, a second driving unit 113, a substrate stage 116, a laser interferometer 118, and a third Drive unit 119. The exposure apparatus 1 further includes an alignment measurement system 124, a focus measurement system 140, a main control unit 103, an illumination system control unit 108, a projection system control unit 114, a stage control unit 120, and a conveying unit 130. The light source 101 emits (outputs) light in a plurality of wavelength bands as exposure light. The illumination optical system 104 also includes a shaping optical system (not shown) and an optical integrator (not shown). The illumination optical system 104 further includes a light shielding plate 105, a half mirror 106, and a light sensor 107. The light emitted from the light source 101 and entering the illumination optical system 104 is shaped into a predetermined shape via the shaping optical system. The light shaped by the shaping optical system enters the optical integrator. The optical integrator forms many secondary light sources for illuminating the mask 109 with a uniform illuminance distribution. The light shielding plate 105 is arranged on the light path of the illumination optical system 104 to form an arbitrary illumination area on the mask. The half mirror 106 is arranged on the optical path of the illumination optical system 104 to reflect (extract) a part of the light (exposure light) that illuminates the mask 109. The light sensor 107 is arranged on the optical path of the light reflected by the half mirror 106 to detect the intensity of the light (exposure energy). The lighting system control unit 108 controls each unit (for example, the light shielding plate 105) of the lighting optical system 104 under the control of the main control unit 103. The mask 109 has a pattern to be transferred onto the substrate 115, that is, a circuit pattern of a semiconductor device, and is illuminated by the illumination optical system 104. The projection optical system 110 is formed of, for example, a refractive system or a catadioptric system. The projection optical system 110 projects (forms) the pattern (the image) of the mask 109 at a predetermined magnification (for example, 1/2) on the substrate 115 coated with a photoresist (photosensitizer) (a pressure of the substrate 115). Shooting area). The projection optical system 110 includes an aperture stop 111. The aperture stop 111 is arranged in the pupil plane of the projection optical system 110 (ie, the Fourier transform plane corresponding to the mask 109), and includes an almost circular opening. The first driving unit 112 includes a motor, and sets a predetermined NA (numerical aperture) by controlling the diameter of the opening of the aperture diaphragm 111. The second driving unit 113 drives (moves) optical elements constituting a part of the lens system of the projection optical system 110 along the optical axis of the projection optical system 110. This makes it possible to suppress degradation of aberrations of the projection optical system 110 and reduce distortion errors while appropriately maintaining the projection magnification. The projection system control unit 114 controls the respective units (aperture diaphragm 111 and optical elements) of the projection optical system 110 via the first drive unit 112 and the second drive unit 113 under the control of the main control unit 103. As described above, the substrate 115 is a substrate on which the pattern of the mask 109 is to be transferred (projected) and photoresist is applied. The substrate 115 includes wafers, glass plates, and other types of substrates. The substrate stage 116 is a stage that holds the substrate 115. The third driving unit 119 moves the substrate stage 116 in a three-dimensional direction, that is, along the direction (Z direction) of the optical axis of the projection optical system 110 and a plane (X-Y plane) orthogonal to the direction. The third driving unit 119 includes a motor for moving the substrate stage 116. In this embodiment, the direction along the optical axis of the projection optical system 110 is the Z direction (Z axis), and the directions orthogonal to the optical axis of the projection optical system 110 are the X direction (X axis) and the Y direction (Y axis). The laser interferometer 118 detects the distance from the mirror 117 fixed to the substrate stage 116 to measure the position of the substrate stage 116 on the X-Y plane. The alignment measurement system 124 measures the positional deviation between the substrate 115 and the substrate stage 116. The stage control unit 120 moves the substrate stage 116 into the XY plane via the third drive unit 119 based on the measurement result obtained by the laser interferometer 118 and the measurement result obtained by the alignment measurement system 124 under the control of the main control unit 103 Reservation location. The focus measurement system 140 includes a projection optical system 121 and a detection optical system 122, and measures the position of the substrate 115 in the direction along the optical axis of the projection optical system 110, that is, the height of the surface of the substrate 115. The projection optical system 121 projects light (non-exposure light) that does not make the photoresist applied on the substrate 115 sensitive, and focuses the light at each position on the substrate 115. The light reflected at each position on the substrate 115 enters the detection optical system 122. The detection optical system 122 has a plurality of light receiving elements for position detection arranged corresponding to the light reflected at each position on the substrate 115. More specifically, the plurality of light receiving elements for position detection are arranged so that the light receiving surface of each light receiving element is almost conjugate to each position (each reflection point) on the substrate 115 via the imaging optical system. Therefore, the positional deviation of the substrate 115 in the direction along the optical axis of the projection optical system 110 is measured as the positional deviation of light entering each light receiving element arranged on the detection optical system 122. The conveying unit 130 is a conveying mechanism for holding and conveying the substrate 115 between the conveying unit 130 and the substrate stage 116. As shown in FIG. 2, the conveying unit 130 includes a conveying port 201, a first substrate hand 202, a pre-alignment unit 203 and a second substrate hand 204. The details of the conveying unit 130 will be described later together with the conveying of the substrate 115 between the substrate stage 116 and the conveying unit 130. FIG. 2 is a schematic plan view showing the arrangement of the substrate stage 116 and the conveying unit 130. The storage unit 123 stores various types of programs, data, etc. required to operate the exposure apparatus 1. In this embodiment, the storage unit 123 also functions as an accumulation unit that stores and accumulates control information related to the substrate stage 116 and the conveying unit 130 generated as a result of processing the substrate 115 in the exposure apparatus 1. In this case, the control information includes the holding force of the substrate stage 116 and the conveying unit 130 to hold the substrate 115 and the time required for the substrate stage 116 and the conveying unit 130 to hold the substrate 115 with a preset holding force. In addition, the control information includes measurement values related to the alignment of the substrate 115 when the substrate 115 is transported between the substrate stage 116 and the transport unit 130 and the number of alignment errors. However, it should be noted that the control information need not always include all of the above information, and may include at least one of the above information. The main control unit 103 is formed by an information processing device (computer), and comprehensively controls each of the exposure apparatus 1 via the lighting system control unit 108, the projection system control unit 114, and the stage control unit 120 according to the program stored in the storage unit 123 unit. The main control unit 103 controls an exposure process of forming a pattern on the substrate 115 by exposing the substrate 115 through the mask 109. In addition, in this embodiment, the main control unit 103 serves as a determination unit that determines the conveying process when conveying the substrate 115 between the substrate stage 116 and the conveying unit 130 based on the control information accumulated in the storage unit 123. The conveyance of the substrate 115 between the substrate stage 116 and the conveying unit 130 will be described with reference to FIG. 2. The substrate stage 116 is provided with a chuck 206 that holds the substrate 115 on the holding surface. The substrate stage 116 is also provided with a lifting pin 205 that moves up and down with respect to the holding surface on which the substrate 115 is held by the chuck 206 through a driving unit (not shown). Note that, instead of the lifting pin 205, the chuck 206 may be moved up and down through a drive unit (not shown) to move the lifting pin 205 up and down with respect to the holding surface of the chuck 206. First, the loading process related to the loading of the substrate 115 will be described. In the device manufacturing plant, the substrate 115 is loaded into the exposure equipment 1 via the transport port 201 that connects the exposure equipment 1 to external equipment. The first substrate hand 202 transports the substrate 115 loaded in the exposure apparatus 1 to the pre-alignment unit 203 that performs pre-alignment (rough positioning) of the substrate 115. The second substrate hand 204 transports the substrate 115 that has undergone the pre-alignment by the pre-alignment unit 203 to the substrate stage 116. At this time, the substrate stage 116 has been moved to the substrate loading position (first position) in advance. When the second substrate hand 204 transfers the substrate 115 to the substrate stage 116, while the lifting pin 205 rises above the holding surface of the chuck 206, the lifting pin 205 first receives the substrate 115. The lifting pin 205 then moves downward to allow the chuck 206 to hold (transmit) the substrate 115 received by the lifting pin 205. The first substrate hand 202, the pre-alignment unit 203, the second substrate hand 204, the lifting pin 205, and the chuck 206 each hold the substrate 115 by, for example, vacuum suction. The chuck 206 completes the loading process by holding the substrate 115. Next, the unloading process related to the unloading of the substrate 115 will be described. When the exposure processing of the substrate 115 is completed, the substrate stage 116 holding the substrate 115 is moved to the substrate unloading position (first position). When the substrate stage 116 transfers the substrate 115 to the first substrate hand 202, the lifting pin 205 first moves upward on the substrate stage 116 to transfer the substrate 115 from the chuck 206 to the lifting pin 205. Next, the substrate 115 held by the lifting pin 205 is transferred to the first substrate hand 202. The first substrate hand 202 transfers the substrate 115 to the transfer port 201. The unloading process is completed by unloading the substrate 115 from the transfer port 201. <First embodiment> The operation of the exposure apparatus 1 will be described with reference to FIG. 3. In step S101, the exposure apparatus 1 determines whether the recipe (process) for the target lot (a plurality of substrates included in the lot) loaded in the exposure apparatus 1 is a recipe that has been processed in the past. If the recipe of the target batch is a recipe processed in the past, the process moves to step S102. If the recipe of the target batch is not a recipe processed in the past, the process moves to step S103. In step S102, when the same recipe as the recipe used for the target lot is processed as the transport process when the substrate 115 is transported between the substrate stage 116 and the transport unit 130, the exposure apparatus 1 selects to store in association with the recipe The transportation process in the storage unit 123 (past transportation process). In step S103, the exposure apparatus 1 selects a preset transport process (preset transport process) as a transport process when the substrate 115 is transported between the substrate stage 116 and the transport unit 130. In this embodiment, a plurality of conveying processes that can be set for the substrate stage 116 and the conveying unit 130 are stored in the storage unit 123 as conveying processes when the substrate 115 is conveyed between the substrate stage 116 and the conveying unit 130. For example, the storage unit 123 stores the first conveying process and the second conveying process as a plurality of conveying processes. It is assumed that in this case, the first conveying process (hereinafter referred to as a “productivity-oriented process”) prioritizes the productivity related to the conveying of the substrate 115 compared to the second conveying process. Compared with the first conveying process, the second conveying process (hereinafter referred to as a "stability-oriented process") prioritizes stability related to the conveying of the substrate 115. The preset conveying process may be a process oriented to productivity. Note that in this embodiment, the multiple conveying processes are two types of conveying processes. However, this is not exhaustive. In addition, the preset delivery process can be set using parameters. In step S104, the exposure apparatus 1 performs a loading process of loading the substrate 115 into the exposure apparatus 1. The loading process is the same as the loading process described with reference to FIG. 2, so a detailed description of the process will be omitted. In step S105, the exposure apparatus 1 stores the control information related to the substrate stage 116 and the conveying unit 130 generated by loading the substrate 115 in the storage unit 123. More specifically, the storage unit 123 stores the lifting pin 205 and the chuck 206 to maintain the clamping pressure (holding force) of the substrate 115, and the lifting pin 205 and the chuck 206 hold the substrate 115 at a preset clamping pressure. The required clamping time. In step S106, the exposure apparatus 1 performs alignment measurement processing. The alignment measurement process is a process related to the alignment of the substrate 115, which is executed when the substrate 115 is transported between the substrate stage 116 and the transport unit 130. The alignment measurement processing is processing for measuring the positional deviation of the substrate 115. More specifically, the alignment measurement process includes a process of measuring the positional deviation between the substrate 115 and the substrate stage 116 and a process of measuring the positional deviation between the mask 109 and the substrate 115. In step S107, the exposure apparatus 1 stores the control information related to the substrate stage 116 and the conveying unit 130 generated by aligning the substrate 115 in the storage unit 123. More specifically, the storage unit 123 stores measurement values related to the alignment of the substrate 115 performed when the substrate 115 is transported between the substrate stage 116 and the transport unit 130 and the number of errors in the alignment. In step S108, the exposure apparatus 1 performs an exposure process of forming a pattern on the substrate 115 by exposing the substrate 115 through the mask 109, while controlling the mask 109 and the substrate 115 according to the alignment measurement process performed in step S106. The relative position between. In step S109, the exposure apparatus 1 performs an unloading process of unloading the substrate 115 from the exposure apparatus 1. The uninstallation process is the same as the uninstallation process described with reference to FIG. 2, so a detailed description of the process will be omitted. In step S110, the exposure apparatus 1 stores the control information related to the substrate stage 116 and the conveying unit 130 generated due to the unloading of the substrate 115 in the storage unit 123. More specifically, the storage unit 123 stores the lifting pin 205 and the chuck 206 to maintain the clamping pressure (holding force) of the substrate 115, and the lifting pin 205 and the chuck 206 hold the substrate 115 at a preset clamping pressure. The required clamping time. In step S111, the exposure apparatus 1 stores information indicating whether a preset specific error has occurred. In this case, the specific error includes, for example, a clamping error, that is, a failure to clamp the substrate 115 through the lifting pin 205 or the chuck 206. In step S112, the exposure apparatus 1 performs a determination process that determines the conveyance process when conveying the substrate 115 between the substrate stage 116 and the conveying unit 130. The details of the determination processing will be described later with reference to FIG. 4. In step S113, the exposure apparatus 1 determines whether exposure processing has been performed for all the substrates 115 included in the batch. If the exposure process has not been performed for all the substrates 115 included in the lot, the process moves to step S104 to perform the exposure process for the next substrate 115. If the exposure process has been performed for all the substrates 115 included in the lot, the process moves to step S114. In step S114, the exposure apparatus 1 will use the optimal conveying process of the recipe of the target batch input in step S101 (ie, the conveying process selected in step S102 or S103 or the conveying process determined in step S112) It is stored in the storage unit 123 in association with the recipe. The details of the determination process (step S112) for determining the conveyance process when the substrate 115 is conveyed between the substrate stage 116 and the conveying unit 130 will be described with reference to FIGS. 4A and 4B. In the following description, the threshold value set for each control information accumulated (stored) in the storage unit 123 is set as the first threshold value, and the threshold value is set for the number of substrates 115 exceeding the first threshold value in the lot. The threshold is set as the second threshold. In step S201, the exposure apparatus 1 reads out the conveying process stored in the storage unit 123. In step S202, the exposure apparatus 1 determines whether the clamping pressure and the clamping time related to the chuck 206 in the loading process stored in the storage unit 123 in step S105 are equal to or less than a first critical value set therefor. If the clamping force and the clamping time related to the chuck 206 are not equal to or less than the first critical value, the process moves to step S203. If the clamping force and the clamping time related to the chuck 206 are equal to or less than the first critical value, the process moves to step S205. In step S203, the exposure apparatus 1 counts the number of substrates 115 in the batch that exceed the first critical value based on the clamping pressure and clamping time related to the chuck 206 in the loading process. In step S204, the exposure apparatus 1 determines whether the number of substrates 115 counted in step S203 is equal to or less than a second critical value set therefor. If the number of substrates 115 counted in step S203 is not equal to or less than the second critical value, the process moves to step S223. If the number of substrates 115 counted in step S203 is equal to or less than the second critical value, the process moves to step S205. In step S223, the exposure apparatus 1 determines whether the conveying process is changed in the batch (determination). If the conveying process has not been changed in the batch, the process moves to step S224. If the conveying process is changed in the batch, the process moves to step S225. In step S224, the exposure apparatus 1 changes (determines) the conveying process and stores the conveying process in the storage unit 123. In this embodiment, for example, if the current conveying process is a productivity-oriented process, the conveying process is changed to a stability-oriented process for the following reasons. If the conveying process is a productivity-oriented process, it is necessary to perform recovery processing for errors, resulting in deterioration of productivity. Therefore, changing the conveying process to a stability-oriented process that prioritizes stability will increase productivity. As disclosed in Japanese Patent Laid-Open No. 2006-269867, the exposure apparatus 1 can change the driving parameters and first critical values related to the respective units of the substrate stage 116 and the conveying unit 130, and change the conveying process. In step S225, the exposure apparatus 1 determines whether the measurement value related to the alignment and the number of errors in the alignment exceed the first critical value set for it. If the measurement value related to the alignment and the number of errors in the alignment exceed the first critical value, the process moves to step S226 to notify corresponding information such as information indicating that the error factor may be a process (batch) factor . In other words, if the conveying process is changed and the measurement value related to the alignment and the number of errors in the alignment are not changed before and after the conveying process is changed, the exposure apparatus 1 notifies the corresponding information. Such notification is performed via, for example, the display or the audio output device of the exposure apparatus 1, and therefore the display or the audio output device serves as the notification unit. In step S205, the exposure apparatus 1 determines whether the clamping pressure and the clamping time related to the lifting pin 205 in the loading process, which are stored in the storage unit 123 in step S105, are equal to or less than the first critical value set therefor . If the clamping pressure and clamping time related to the lifting pin 205 are not equal to or less than the first critical value, the process moves to step S206. If the clamping pressure and the clamping time related to the lifting pin 205 are equal to or less than the first critical value, the process moves to step S208. In step S206, the exposure apparatus 1 counts the number of substrates 115 in the batch that exceed the first critical value related to the clamping pressure and the clamping time related to the lifting pin 205 in the loading process. In step S207, the exposure apparatus 1 determines whether the number of substrates 115 counted in step S206 is equal to or less than a second critical value set therefor. If the number of substrates 115 counted in step S206 is not equal to or less than the second critical value, the process moves to step S223. If the number of substrates 115 counted in step S206 is equal to or less than the second critical value, the process moves to step S208. In step S208, the exposure apparatus 1 determines whether the alignment measurement value in the alignment measurement process stored in the storage unit 123 in step S107 is equal to or smaller than the first critical value set for the alignment measurement value. If the alignment measurement value is not equal to or smaller than the first critical value, the process moves to step S209. If the alignment measurement value is equal to or smaller than the first critical value, the process moves to step S211. In step S209, the exposure apparatus 1 counts the number of substrates 115 in the batch that exceed the first critical value related to the alignment measurement value. In step S210, the exposure apparatus 1 determines whether the number of substrates 115 counted in step S209 is equal to or less than a second critical value set for the number of substrates. If the number of substrates 115 counted in step S209 is not equal to or less than the second critical value, the process moves to step S223. If the number of substrates 115 counted in step S209 is equal to or less than the second critical value, the process moves to step S211. In step S211, the exposure apparatus 1 determines whether an alignment error has occurred based on the number of alignment errors in the alignment measurement processing stored in the storage unit 123 in step S107. If an alignment error has occurred, the process moves to step S212. If no alignment error has occurred, the process moves to step S214. In step S212, the exposure apparatus 1 counts the number of substrates 115 in the lot on which alignment errors related to the number of alignment errors have occurred. In step S213, the exposure apparatus 1 determines whether the number of substrates 115 counted in step S212 is equal to or less than a second critical value set for the number of substrates. If the number of substrates 115 counted in step S212 is not equal to or less than the second critical value, the process moves to step S223. If the number of substrates 115 counted in step S212 is equal to or less than the second critical value, the process moves to step S214. In step S214, the exposure apparatus 1 determines whether the clamping pressure and the clamping time related to the chuck 206 in the unloading process stored in the storage unit 123 in step S110 are equal to or less than the first critical value set therefor. If the clamping pressure and the clamping time related to the chuck 206 are not equal to or less than the first critical value, the process moves to step S215. If the clamping pressure and the clamping time related to the chuck 206 are equal to or less than the first critical value, the process moves to step S217. In step S215, the exposure apparatus 1 counts the number of substrates 115 in the batch that exceed the first critical value related to the clamping pressure and the clamping time of the chuck 206 in the unloading process. In step S216, the exposure apparatus 1 determines whether the number of substrates 115 counted in step S215 is equal to or less than a second critical value. If the number of substrates 115 counted in step S215 is not equal to or less than the second critical value, the process moves to step S223. If the number of substrates 115 counted in step S215 is equal to or less than the second critical value, the process moves to step S217. In step S217, the exposure apparatus 1 determines whether the clamping pressure and the clamping time related to the lifting pin 205 in the unloading process stored in the storage unit 123 in step S110 are equal to or less than a first critical value set therefor . If the clamping pressure and the clamping time related to the lifting pin 205 are not equal to or less than the first critical value, the process moves to step S218. If the clamping pressure and the clamping time related to the lifting pin 205 are equal to or less than the first critical value, the process moves to step S220. In step S218, the exposure apparatus 1 counts the number of substrates 115 in the batch that exceed the first critical value related to the clamping pressure and the clamping time related to the lifting pin 205 in the unloading process. In step S219, the exposure apparatus 1 determines whether the number of substrates 115 counted in step S218 is equal to or less than a second critical value set for the number of substrates. If the number of substrates 115 counted in step S218 is not equal to or less than the second critical value, the process moves to step S223. If the number of substrates 115 counted in step S218 is equal to or less than the second critical value, the process moves to step S220. In step S220, the exposure apparatus 1 determines whether a specific error has occurred based on the information indicating the presence/absence of a specific error stored in the storage unit 123 in step S111. If a specific error has occurred, the process moves to step S221. If no specific error occurs, it is determined that the processing is terminated. In step S221, the exposure apparatus 1 counts the number of substrates 115 in the lot on which a specific error has occurred. In step S222, the exposure apparatus 1 determines whether the number of substrates 115 counted in step S221 is equal to or less than a second critical value set for the number of substrates. If the number of substrates 115 counted in step S221 is not equal to or less than the second critical value, the process moves to step S223. Note that, regarding the specific error, in step S224, the exposure apparatus 1 changes the first critical value of the clamping pressure for the chuck 206 and the lifting pin 205, for example. If the number of substrates 115 counted in step S221 is equal to or less than the second critical value, it is determined that the process is terminated. The productivity-oriented process as one of the conveying processes in this embodiment will be described with reference to FIG. 5. In step S301, the substrate 115 is loaded into the exposure apparatus 1 via the transfer port 201. In step S302, the first substrate hand 202 conveys (moves) the substrate 115 loaded in the exposure apparatus 1 to the pre-alignment unit 203. In step S303, the pre-alignment unit 203 transfers the substrate 115 to the second substrate hand 204. In step S304, the substrate 115 is transferred from the second substrate hand 204 to the lifting pin 205 at the substrate loading position. In step S305, the exposure apparatus 1 moves the second substrate hand 204 in the negative direction of the Y axis to retract the second substrate hand 204 from the substrate loading position. In step S306, the exposure apparatus 1 moves the substrate stage 116 in the positive Y-axis direction so that the substrate stage 116 is retracted to the substrate stage 116 without interfering with the non-interference area of the second substrate hand 204 that has been retracted in step S305. In step S307, the exposure apparatus 1 moves the substrate stage 116 in the positive Z-axis direction to drive the substrate stage 116 to the front interference area where the substrate stage 116 interferes with the second substrate hand 204. In the productivity-oriented process, the exposure apparatus 1 performs steps S305, S306, and S307 in parallel in this manner. In other words, the productivity-oriented process is a process for performing the following processes in parallel: for retracting the conveying unit 130 from the substrate loading position after the conveying unit 130 conveys the substrate 115 to the substrate stage 116 at the substrate loading position The process and the process for retracting the substrate stage 116 from the substrate loading position. This improves the productivity related to the loading of the substrate 115. After the parallel processing of steps S305, S306, and S307 is completed, in step S308, the lifting pin 205 transfers the substrate 115 to the chuck 206. Therefore, the exposure apparatus 1 terminates the conveying process that prioritizes productivity. The stability-oriented process as one of the conveying processes in this embodiment will be described with reference to FIG. 6. In step S401, the substrate 115 is loaded into the exposure apparatus 1 via the transfer port 201. In step S402, the first substrate hand 202 conveys (moves) the substrate 115 loaded in the exposure apparatus 1 to the pre-alignment unit 203. In step S403, the pre-alignment unit 203 transfers the substrate 115 to the second substrate hand 204. In step S404, the second substrate hand 204 transfers the substrate 115 to the lifting pin 205 at the substrate loading position. In step S405, the exposure apparatus 1 moves the second substrate hand 204 in the negative direction of the Y-axis to retract the second substrate hand 204 from the substrate loading position. In step S406, the exposure apparatus 1 moves the substrate stage 116 in the positive direction of the Z axis to drive the substrate stage 116 to the interference area where the substrate stage 116 interferes with the second substrate hand 204. In this way, in the process facing stability, the exposure apparatus 1 suppresses the movement of the substrate stage 116 while the weight pin 205 holds the substrate 115. In other words, the stability-oriented process is a process for sequentially performing the following processes: for retracting the conveying unit 130 from the substrate loading position after the conveying unit 130 conveys the substrate 115 to the substrate stage 116 at the substrate loading position And the process for retracting the substrate stage 116 from the substrate loading position. This improves the stability related to the loading of the substrate 115. After the processing in steps S405 and S406 is completed, in step S407, the lifting pin 205 transfers the substrate 115 to the chuck 206. Therefore, the exposure apparatus 1 terminates the conveying process that prioritizes stability. This embodiment has exemplified the conveying process used when the substrate 115 is loaded. However, the present invention can also be applied to a conveying process when the substrate 115 is unloaded. Hereinafter, a conveying process that prioritizes productivity and a delivery process that prioritizes stability when unloading the substrate 115 will be described. A conveying process that prioritizes productivity when unloading the substrate 115 will be described with reference to FIG. 7. In step S501, the chuck 206 transfers the substrate 115 to the lifting pin 205. In step S502, the exposure apparatus 1 moves the substrate stage 116 in the negative direction of the Z axis to drive the substrate stage 116 to a non-interference area where the substrate stage 116 does not interfere with the first substrate hand 202. In step S503, the exposure apparatus 1 moves the substrate stage 116 to drive the substrate stage 116 to the substrate unloading position. In step S504, the exposure apparatus 1 moves the first substrate hand 202 in the positive direction of the Y axis to drive the first substrate hand 202 to the substrate unloading position. In this way, the exposure apparatus 1 executes steps S503 and S504 in parallel during the transportation process that prioritizes productivity. In other words, this conveying process is a process for performing the following processes in parallel: a process for moving the substrate stage 116 to the substrate unloading position before the conveying unit 130 receives the substrate 115 from the substrate stage 116 at the substrate unloading position In the process of moving the conveying unit 130 to the substrate unloading position. This improves the productivity related to the unloading of the substrate 115. After the parallel processing in steps S503 and S504 is completed, in step S505, the lifting pin 205 transfers the substrate 115 to the first substrate hand 202. In step S506, the substrate 115 is unloaded from the exposure apparatus 1 through the transfer port 201. Therefore, when the substrate 115 is unloaded, the exposure apparatus 1 terminates the conveying process that prioritizes productivity. A conveying process that prioritizes stability when unloading the substrate 115 will be described with reference to FIG. 8. In step S601, the exposure apparatus 1 moves the substrate stage 116 to drive the substrate stage 116 to the substrate unloading position. In step S602, the chuck 206 transfers the substrate 115 to the lifting pin 205. In step S603, the exposure apparatus 1 moves the substrate stage 116 in the negative direction of the Z axis to drive the substrate stage 116 to a non-interference area where the substrate stage 116 does not interfere with the first substrate hand 202. In step S604, the exposure apparatus 1 moves the first substrate hand 202 in the positive direction of the Y axis to drive the first substrate hand 202 to the substrate conveying position. In this way, in the conveyance process where stability is given priority, the exposure apparatus 1 suppresses the movement of the substrate stage 116 while the weight pin 205 holds the substrate 115. In other words, this conveying process is a process for sequentially performing the following processes: a process and a process for moving the substrate stage 116 to the substrate unloading position before the conveying unit 130 receives the substrate 115 from the substrate stage 116 at the substrate unloading position In the process of moving the conveying unit 130 to the substrate unloading position. This improves the stability related to the unloading of the substrate 115. In step S605, the lifting pin 205 transfers the substrate 115 to the first substrate hand 202. In step S606, the substrate 115 is unloaded from the exposure apparatus 1 through the transfer port 201. Therefore, when the substrate 115 is unloaded, the exposure apparatus 1 terminates the conveying process that prioritizes stability. In this way, in this embodiment, the exposure apparatus 1 determines (changes) when between the substrate stage 116 and the conveying unit 130 based on the control information related to the substrate stage 116 and the conveying unit 130 generated by conveying the substrate 115. The conveying process when conveying the substrate 115. In this case, the exposure apparatus 1 selects one of the plurality of conveying processes stored in the storage unit 123 based on each control information and the comparison result between each control information and the threshold value set for each control information. One, to determine the transport process when transporting the substrate 115. In this embodiment, while continuously processing a plurality of substrates 115 included in the same batch, the exposure apparatus 1 determines the conveying process when conveying the substrate 115 between the substrate stage 116 and the conveying unit 130. However, the exposure apparatus 1 may also determine the conveying process when conveying the substrate 115 between the substrate stage 116 and the conveying unit 130 for each batch or each preset number of substrates. According to this embodiment, the optimal transport process for transporting the substrate 115 between the substrate table 116 and the transport unit 130 can be automatically determined (changed) according to the manufacturing process. This makes it possible to increase productivity while maintaining stability. An example of specific effects of the determination processing shown in FIG. 4 will be described. For example, when the current clamping pressure is lower than the clamping pressure stored (accumulated) in the storage unit 123 or the current clamping time is shorter than the clamping time stored (accumulated) in the storage unit 123, the warpage of the substrate 115 is estimated The amount is large or the flatness of the reverse surface of the substrate 115 is low. Assume that the exposure apparatus 1 conveys the substrate 115 according to a process oriented to productivity. In this case, when the exposure apparatus 1 moves the substrate stage 116 while the lifting pin 205 holds the substrate 115 (step S306), a positional shift of the substrate 115 may occur. In addition, the substrate 115 may fall from the lifting pin 205. In this case, because the stability-oriented process can improve the productivity related to the transportation of the substrate 115 compared to the productivity-oriented process, the exposure apparatus 1 selects the stability-oriented process. When the clamping pressure and clamping time are similar to the clamping pressure and clamping time stored (accumulated) in the storage unit 123, the measurement value related to the alignment and the number of errors in the alignment are used. If the measurement value related to the alignment is an abnormal value or an alignment error has occurred, it is estimated that the contact surface between the substrate 115 and the lifting pin 205 has been contaminated or has a physical defect. In this case, because the stability-oriented process can improve the productivity related to the transportation of the substrate 115 compared to the productivity-oriented process, the exposure apparatus 1 selects the stability-oriented process. The exposure device 1 may further include a user interface 150, which provides a user with a setting screen for setting the first threshold and the second threshold. FIG. 9 shows an example of a setting screen 701 for setting the first threshold value and the second threshold value which is set (displayed) on the display or touch panel as the user interface 150. The main control unit 103 provides a user interface 150. On the setting screen 701, the parameter 702 is used to set the first critical value of the clamping pressure of the chuck 206 in the loading process. The parameter 703 is used to set a second threshold value related to the number of each substrate 115 whose clamping pressure of the chuck 206 during the loading process exceeds the first threshold value. The parameter 704 is used to set the delivery process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 705 is used to set a first critical value for the clamping time of the chuck 206 in the loading process. The parameter 706 is used to set a second threshold value related to the number of each substrate 115 whose clamping time of the chuck 206 during the loading process exceeds the first threshold value. The parameter 707 is used to set the delivery process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 708 is used to set the first critical value of the clamping pressure of the lifting pin 205 used in the loading process. The parameter 709 is used to set a second critical value related to the number of each substrate 115 whose clamping pressure of the lifting pin 205 in the loading process exceeds the first critical value. The parameter 710 is used to set the delivery process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 711 is used to set a first critical value for the clamping time of the lifting pin 205 in the loading process. The parameter 712 is used to set a second critical value related to the number of each substrate 115 whose clamping time of the lifting pin 205 in the loading process exceeds the first critical value. The parameter 713 is used to set the delivery process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 714 is used to set the first critical value for the measurement related to the alignment. Note that multiple first critical values can be set for measurement values related to alignment. For example, the first critical value can be set separately for the X axis, Y axis, and rotation axis. The parameter 715 is used to set a second critical value related to the number of each substrate 115 whose measurement value related to alignment exceeds the first critical value. The parameter 716 is used to set the delivery process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 717 is used to set a second critical value for the number of alignment errors. The parameter 718 is used to set the delivery process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 719 is used to set the first critical value of the clamping pressure of the chuck 206 in the unloading process. The parameter 720 is used to set a second critical value related to the number of each substrate 115 whose clamping pressure of the chuck 206 during the unloading process exceeds the first critical value. The parameter 721 is used to set the delivery process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 722 is used to set a first critical value for the clamping time of the chuck 206 in the unloading process. The parameter 723 is used to set a second critical value related to the number of each substrate 115 whose clamping time of the chuck 206 in the unloading process exceeds the first critical value. The parameter 724 is used to set the delivery process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 725 is used to set the first critical value of the clamping pressure of the lifting pin 205 used in the unloading process. The parameter 726 is used to set a second critical value related to the number of each substrate 115 whose clamping pressure of the lifting pin 205 in the unloading process exceeds the first critical value. The parameter 727 is used to set the conveying process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 728 is used to set the first critical value of the clamping time of the lifting pin 205 used in the unloading process. The parameter 729 is used to set a second critical value related to the number of each substrate 115 whose clamping time of the lifting pin 205 in the unloading process exceeds the first critical value. The parameter 730 is used to set the delivery process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 731 is used to set the error number corresponding to the specific error. The parameter 732 is used to set a second critical value related to the number of substrates 115 that have experienced a specific error. The parameter 733 is used to set the delivery process to be determined (changed) when the second critical value is exceeded in the same batch. The parameter 734 is used to set the preset delivery process. <Second embodiment> The first embodiment has exemplified the case where the conveying process is determined (changed) by using each threshold value set for each piece of control information. However, this is not exhaustive. For example, the delivery process can be determined (changed) by using a learning model obtained through machine learning. In the second embodiment, first, learning materials indicating the relationship between input materials and teacher materials are prepared. In this case, the input data is data including at least one of measurement values related to clamping pressure, clamping time, or alignment, and the number of alignment errors. The teacher data is data that instructs the proper delivery process of the input data. The data indicating the proper delivery process may be data indicating two values indicating proper and inappropriate respectively. Note that data indicating a value indicating a stepwise evaluation of suitability (for example, a natural number from 1 to 10) or a data indicating an appropriate possibility (for example, a real number from 0 to 1) is used as an indication of an appropriate delivery process data of. Input data such as measurement values related to clamping pressure, clamping time and alignment, and the number of alignment errors can be obtained through conventional substrate processing. The delivery process as output data can be derived by calculating statistics from each input data (control information) and productivity accumulated in the storage unit 123. It is also possible to derive the transportation process from an experiment in which each input data is obtained by processing various types of substrates 115 and comparing productivity. The learning model used to determine the appropriate delivery process is obtained by using learning data. Learning materials can be obtained by using, for example, neural networks. A neural network is a model with a multi-layer network structure including an input layer, an intermediate layer, and an output layer. The learning data can be obtained by optimizing random variables within the network by using algorithms such as the back propagation method of learning data indicating the relationship between the input data and the teacher data. This embodiment exemplifies a case where a learning model is obtained by using a neural network. However, this is not exhaustive. For example, other models and algorithms such as support vector machines and deterministic trees can be used. The new input data is input to the obtained learning model, and data indicating an appropriate delivery process is output as output data. The appropriate delivery process can be determined based on the output data. Note that the first embodiment and the second embodiment can be selectively performed. In other words, it can be set to determine the conveying process by using each threshold set for each piece of control information or by using a learning model obtained through machine learning. For example, as shown in FIG. 10, two check boxes 741 and 742 are set on the setting screen 701 set on the user interface 150. The check box 741 is used to select a check box for determining the delivery process by using each threshold value. The check box 742 is a check box for selecting the transportation process by using the learning model. <The third embodiment> The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles, for example, devices (semiconductor devices, magnetic storage media, liquid crystal elements, etc.). This manufacturing method includes a step of forming a pattern on a substrate by using the exposure apparatus 1, a step of processing the substrate on which the pattern is formed, and a step of manufacturing an article from the processed substrate. This manufacturing method also includes other known steps (oxidation, deposition, vapor deposition, doping, planarization, etching, resist removal, cutting, bonding, packaging, etc.). Compared with the conventional method, the article manufacturing method according to this embodiment is advantageous in at least one aspect of the article's performance, quality, productivity, and production cost. Although the present invention has been described with reference to exemplary embodiments, it should be understood that the present invention is not limited to the disclosed exemplary embodiments. The scope of the appended claims should be given the broadest interpretation to cover all such modifications and equivalent structures and functions.

1:曝光設備 101:光源 103:主控制單元 104:照明光學系統 105:遮光板 106:半反射鏡 107:光感測器 108:照明系統控制單元 109:掩模 110:投影光學系統 111:孔徑光欄 112:第一驅動單元 113:第二驅動單元 114:投影系統控制單元 115:基板 116:基板台 117:鏡 118:雷射干涉儀 119:第三驅動單元 120:台控制單元 121:投射光學系統 122:檢測光學系統 123:儲存單元 124:對準測量系統 130:輸送單元 140:聚焦測量系統 150:用戶介面 201:輸送埠 202:第一基板手 203:預對準單元 204:第二基板手 205:升降銷 206:卡盤 S101~S114:步驟 S201~S213:步驟 S214~S226:步驟 S301~S308:步驟 S401~S407:步驟 S501~S506:步驟 S601~S606:步驟 701:設定畫面 702~734:參數 741:核取方塊 742:核取方塊1: Exposure equipment 101: light source 103: main control unit 104: Illumination optical system 105: shading plate 106: half mirror 107: Light Sensor 108: Lighting system control unit 109: Mask 110: Projection optical system 111: aperture diaphragm 112: The first drive unit 113: second drive unit 114: Projection system control unit 115: substrate 116: substrate table 117: Mirror 118: Laser interferometer 119: The third drive unit 120: control unit 121: Projection optical system 122: detection optical system 123: storage unit 124: Alignment measurement system 130: Conveying unit 140: Focus measurement system 150: User Interface 201: Delivery port 202: first board hand 203: Pre-alignment unit 204: Second Board Hand 205: Lift pin 206: Chuck S101~S114: steps S201~S213: steps S214~S226: steps S301~S308: steps S401~S407: steps S501~S506: steps S601~S606: steps 701: Setting screen 702~734: Parameters 741: check box 742: check box

[圖1]是顯示根據本發明的一態樣的曝光設備的佈置的示意圖。 [圖2]是顯示基板台和輸送單元的佈置的示意性平面圖。 [圖3]是用於說明曝光設備的操作的流程圖。 [圖4A]和[圖4B]是用於說明圖3中所示的確定處理(步驟S112)的細節的流程圖。 [圖5]是用於說明面向生產率的過程的流程圖。 [圖6]是用於說明面向穩定性的過程的流程圖。 [圖7]是用於說明在輸送基板時優先考慮生產率的輸送過程的流程圖。 [圖8]是用於說明在輸送基板時優先考慮穩定性的輸送過程的流程圖。 [圖9]是顯示作為用戶介面的設定畫面的範例的視圖。 [圖10]是顯示作為用戶介面的設定畫面的範例的視圖。[Fig. 1] is a schematic diagram showing the arrangement of an exposure apparatus according to an aspect of the present invention. [Fig. 2] is a schematic plan view showing the arrangement of the substrate stage and the conveying unit. [Fig. 3] is a flowchart for explaining the operation of the exposure apparatus. [Fig. 4A] and [Fig. 4B] are flowcharts for explaining the details of the determination processing (step S112) shown in Fig. 3. [Fig. 5] is a flowchart for explaining the process for productivity. [Fig. 6] is a flowchart for explaining the stability-oriented process. [Fig. 7] is a flowchart for explaining a conveying process that prioritizes productivity when conveying substrates. [Fig. 8] is a flowchart for explaining a conveying process in which stability is given priority when conveying a substrate. [Fig. 9] is a view showing an example of a setting screen as a user interface. [Fig. 10] is a view showing an example of a setting screen as a user interface.

1:曝光設備 1: Exposure equipment

101:光源 101: light source

103:主控制單元 103: main control unit

104:照明光學系統 104: Illumination optical system

105:遮光板 105: shading plate

106:半反射鏡 106: half mirror

107:光感測器 107: Light Sensor

108:照明系統控制單元 108: Lighting system control unit

109:掩模 109: Mask

110:投影光學系統 110: Projection optical system

111:孔徑光欄 111: aperture diaphragm

112:第一驅動單元 112: The first drive unit

113:第二驅動單元 113: second drive unit

114:投影系統控制單元 114: Projection system control unit

115:基板 115: substrate

116:基板台 116: substrate table

117:鏡 117: Mirror

118:雷射干涉儀 118: Laser interferometer

119:第三驅動單元 119: The third drive unit

120:台控制單元 120: control unit

121:投射光學系統 121: Projection optical system

122:檢測光學系統 122: detection optical system

123:儲存單元 123: storage unit

124:對準測量系統 124: Alignment measurement system

130:輸送單元 130: Conveying unit

140:聚焦測量系統 140: Focus measurement system

150:用戶介面 150: User Interface

Claims (12)

一種用於處理基板的基板處理設備，所述基板處理設備包括： 台，被配置成保持和移動基板； 輸送單元，被配置成在輸送單元與台之間保持和輸送基板； 累積單元，被配置成累積透過處理基板而生成的與台和輸送單元有關的控制資訊；以及 確定單元，被配置成透過基於在累積單元中累積的控制資訊來選擇能夠針對台和輸送單元設定的多個輸送過程中的一個輸送過程來確定在台與輸送單元之間輸送基板時的輸送過程。A substrate processing equipment for processing substrates, the substrate processing equipment comprising: The stage is configured to hold and move the substrate; The conveying unit is configured to hold and convey the substrate between the conveying unit and the table; The accumulation unit is configured to accumulate control information related to the stage and the conveying unit generated by processing the substrate; and The determining unit is configured to determine the conveying process when the substrate is conveyed between the table and the conveying unit by selecting one of the multiple conveying processes that can be set for the table and the conveying unit based on the control information accumulated in the accumulation unit . 根據請求項1所述的基板處理設備，還包括儲存單元，所述儲存單元被配置成儲存所述多個輸送過程， 其中，確定單元透過基於在累積單元中累積的控制資訊來選擇儲存在儲存單元中的所述多個輸送過程中的一個輸送過程來確定在輸送基板時的輸送過程。The substrate processing apparatus according to claim 1, further comprising a storage unit configured to store the plurality of conveying processes, Wherein, the determining unit determines the conveying process when the substrate is conveyed by selecting one of the plurality of conveying processes stored in the storage unit based on the control information accumulated in the accumulating unit. 根據請求項1所述的基板處理設備，其中，所述多個輸送過程包括第一輸送過程和第二輸送過程， 第一輸送過程是比第二輸送過程優先考慮與基板的輸送有關的生產率的輸送過程，以及 第二輸送過程是比第一輸送過程優先考慮與基板的輸送有關的穩定性的輸送過程。The substrate processing apparatus according to claim 1, wherein the plurality of conveying processes include a first conveying process and a second conveying process, The first conveying process is a conveying process that prioritizes the productivity related to the conveying of the substrate over the second conveying process, and The second conveying process is a conveying process that prioritizes the stability related to the conveying of the substrate over the first conveying process. 根據請求項3所述的基板處理設備，其中，第一輸送過程是用於並行地執行以下過程的過程：用於使輸送單元在第一位置處將基板傳送到台並且接著使輸送單元從第一位置縮回的過程和用於使台從第一位置縮回的過程，以及 第二輸送過程是用於順序地執行以下過程的過程：用於使輸送單元在第一位置處將基板傳送到台並且接著使輸送單元從第一位置縮回的過程和用於使台從第一位置縮回的過程。The substrate processing apparatus according to claim 3, wherein the first conveying process is a process for executing the following process in parallel: for causing the conveying unit to convey the substrate to the stage at the first position and then causing the conveying unit to transfer from the first position A process of retracting a position and a process for retracting the stage from the first position, and The second conveying process is a process for sequentially performing the following processes: a process for causing the conveying unit to transfer the substrate to the stage at the first position and then the process for retracting the conveying unit from the first position and a process for making the stage from the first position The process of retracting a position. 根據請求項3所述的基板處理設備，其中，第一輸送過程是用於並行地執行以下過程的過程：用於在輸送單元在第一位置處從台接收基板之前將台移動到第一位置的過程和用於使輸送單元移動到第一位置的過程，以及 第二輸送過程是用於順序地執行以下過程的過程：用於在輸送單元在第一位置處從台接收基板之前將台移動到第一位置的過程和用於使輸送單元移動到第一位置的過程。The substrate processing apparatus according to claim 3, wherein the first conveying process is a process for executing the following processes in parallel: for moving the table to the first position before the conveying unit receives the substrate from the table at the first position The process and the process used to move the conveying unit to the first position, and The second conveying process is a process for sequentially performing the following processes: a process for moving the table to the first position before the conveying unit receives the substrate from the table at the first position and a process for moving the conveying unit to the first position the process of. 根據請求項1所述的基板處理設備，其中，控制資訊包括以下中的至少一個：台和輸送單元中的每個用來保持基板的保持力、台和輸送單元中的每個以預設的保持力來保持基板所需的時間、與在台與輸送單元之間輸送基板時執行的基板的對準有關的測量值以及對準中的錯誤的數量。The substrate processing apparatus according to claim 1, wherein the control information includes at least one of the following: each of the stage and the conveying unit is used to hold the holding force of the substrate, and each of the stage and the conveying unit is preset The holding force is the time required to hold the substrate, the measurement value related to the alignment of the substrate performed when the substrate is transported between the stage and the transport unit, and the number of errors in the alignment. 根據請求項6所述的基板處理設備，其中，確定單元基於將保持力、時間、測量值和錯誤數量中的每個與針對保持力、時間、測量值和錯誤數量中的每個設定的臨界值進行比較的結果來確定在台與輸送單元之間輸送基板時的輸送過程。The substrate processing apparatus according to claim 6, wherein the determination unit is based on combining each of the holding force, time, measurement value, and number of errors with a threshold set for each of the holding force, time, measurement value, and number of errors The result of the value comparison is used to determine the transport process when the substrate is transported between the table and the transport unit. 根據請求項7所述的基板處理設備，還包括用戶介面，所述用戶介面被配置成向用戶提供用於設定臨界值的設定畫面。The substrate processing apparatus according to claim 7, further comprising a user interface configured to provide a user with a setting screen for setting the threshold value. 根據請求項1所述的基板處理設備，其中，基板處理設備連續地處理在同一批次中包括的多個基板，以及 確定單元在所述多個基板被連續處理的同時確定在台與輸送單元之間輸送基板時的輸送過程。The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus continuously processes a plurality of substrates included in the same batch, and The determining unit determines a conveying process when the substrates are conveyed between the stage and the conveying unit while the plurality of substrates are continuously processed. 根據請求項9所述的基板處理設備，還包括通知單元，所述通知單元被配置成當在所述多個基板的連續處理期間在台與輸送單元之間輸送基板時輸送過程被改變並且在改變輸送過程之前和之後與在台與輸送單元之間輸送基板時執行的基板的對準有關的測量值以及對準中的錯誤的數量沒有發生改變時通知對應的資訊。The substrate processing apparatus according to claim 9, further comprising a notification unit configured to change the transport process when the substrate is transported between the stage and the transport unit during the continuous processing of the plurality of substrates and The measurement value related to the alignment of the substrate performed when the substrate is transferred between the stage and the transfer unit and the corresponding information is notified when the number of errors in the alignment has not changed before and after the transfer process is changed. 根據請求項1所述的基板處理設備，還包括投影光學系統，所述投影光學系統被配置成將掩模圖案的圖像投影在由台保持的基板上。The substrate processing apparatus according to claim 1, further comprising a projection optical system configured to project an image of the mask pattern on the substrate held by the stage. 一種物品的製造方法，包括： 透過使用請求項1中所定義的基板處理設備在基板上形成圖案； 處理在所述形成中形成了圖案的基板；以及 從經處理的基板製造物品。A method of manufacturing an article, including: Form a pattern on the substrate by using the substrate processing equipment defined in claim 1; Processing the substrate patterned in the formation; and An article is manufactured from the processed substrate.
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