TW202040283A - Exposure device, illumination optical system, and device production method - Google Patents

Abstract

This exposure device is provided with: an illumination optical system that has an optical integrator; a projection optical system; a substrate stage that moves a substrate to be exposed in a scanning direction relatively to the projection optical system; an illuminance change member that is disposed to be movable relatively to the optical integrator, and changes one of an exposure amount with which a second region where respective portions of a first exposure region and a second exposure region overlap each other on the substrate to be exposed is exposed and an exposure amount with which a first region that is a region indicating the other portions of the first exposure region and the other portions of the second exposure region relatively to the other; and a control unit that moves the illuminance change member such that the exposure amount in the first region becomes larger relatively to the exposure amount in the second region.

Description

Exposure device, illumination optical system, and element manufacturing method

The invention relates to an exposure device, an illuminating optical system and a component manufacturing method.

As an apparatus for exposing and transferring the pattern original plate on the mask to a large substrate, there is known a sweep-type exposure apparatus that scans the mask and the substrate relative to the projection optical system to perform exposure. By sweeping exposure, the exposure field of view is expanded in the sweeping direction (scanning direction). However, the following exposure devices are also known in order to further expand in the direction intersecting the sweeping direction (non-sweeping direction) Expose the field of view so that the exposed area overlaps in the non-sweep direction for multiple sweep exposures. Furthermore, there is also known a method in which a plurality of projection optical systems are included in parallel in a non-sweep direction, and a part of the exposure field of view of the plurality of projection optical systems is exposed while being exposed, thereby using one scan To expose and transfer the electronic circuit onto the substrate (for example, Patent Document 1). [Prior Art Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2016-54230

According to a first aspect, an exposure apparatus utilizes a first exposure for exposing a first exposure area on a substrate to be exposed within a first time, and a second time that is different from the first time. The second exposure of the second exposure area on the exposed substrate is to expose the exposed substrate. The exposure device includes: an illumination optical system with an optical integrator to supply illumination light; a projection optical system; The stage is configured to move the exposed substrate relative to the projection optical system in the scanning direction in such a manner that a predetermined pattern is exposed on the exposed substrate; the illuminance changing member is installed on the exposed substrate The incident surface of the optical integrator at a position where the upper surface of the exposed substrate becomes conjugated to the incident surface side of the optical integrator is configured to be relatively movable with respect to the optical integrator to expose the second area One of the exposure amount and the exposure amount for exposing the first area is relatively changed with respect to the other, and the illuminance of the illumination light is changed. The second area is the first area on the exposed substrate. An area in which a part of each of the exposure area and the second exposure area overlaps, the first area being an area of other parts of the first exposure area and other parts of the second exposure area; and a control section, The relative movement of the illuminance changing member with respect to the optical integrator is controlled; the control unit makes the exposure amount in the first area relatively larger than the exposure amount in the second area, The illuminance changing member is moved relative to the optical integrator. According to a second aspect, an exposure apparatus uses a first exposure for exposing a first exposure area on a substrate to be exposed within a first time, and a second time that is different from the first time. The second exposure of the second exposure area on the exposed substrate is to expose the exposed substrate. The exposure device includes: an illumination optical system with an optical integrator to supply illumination light; a projection optical system; The stage is configured to move the exposed substrate relative to the projection optical system in the scanning direction in such a manner that a predetermined pattern is exposed on the exposed substrate; the illuminance changing member is installed on the exposed substrate The incident surface of the optical integrator at a position where the upper surface of the exposed substrate becomes conjugated to the incident surface side of the optical integrator is configured to be relatively movable with respect to the optical integrator to change the exposure of the second area The illuminance of the illumination light is changed in the manner of the ratio of one of the exposure amount and the exposure amount for exposing the first area to the other, and the second area is the first exposure on the exposed substrate A region and a region in which a part of each region of the second exposure region overlaps, the first region being an area of other parts of the first exposure region and other parts of the second exposure region; and a control unit that controls The relative movement of the illuminance changing member with respect to the optical integrator; the control unit makes the illuminance changing member with respect to the optical integrator during the movement of the substrate stage relative to the projection optical system The device performs relative movement. According to a third aspect, an exposure apparatus includes: a projection optical system; an illumination optical system having an optical integrator for supplying illuminating light to the projection optical system; and a substrate stage that is exposed on a substrate to be exposed in a predetermined pattern , The exposed substrate is relatively moved in the scanning direction with respect to the projection optical system; the illuminance changing member is relative to the exposure amount of one of the exposure amount in the first region and the exposure amount in the second region The exposure amount of the other is changed, the first area is the area on the exposed substrate that is continuously exposed in time by the scanning exposure field of view of the projection optical system during the exposure The second area is an area that is discretely exposed in time by the scanning exposure field of view; and the control unit makes the illuminance changing member optically correspond to the direction of the optical integrator The first direction of the scanning direction is relatively moved, and the optical integrator is arranged at a position where the incident surface of the illumination light becomes a conjugate surface with respect to the scanning exposure field of view on the exposed substrate; the control The part moves the illuminance changing member relative to the optical integrator so that the exposure amount in the first area becomes relatively larger than the exposure amount in the second area. According to a fourth aspect, an exposure apparatus includes: a projection optical system; an illumination optical system having an optical integrator for supplying illuminating light to the projection optical system; and a substrate stage for exposing a predetermined pattern on a substrate to be exposed , The exposed substrate is moved relative to the projection optical system in the scanning direction; the illuminance changing member is provided on the incident surface of the illuminating light and the upper surface of the exposed substrate becomes conjugate The position of the incident surface side of the optical integrator is configured to be relatively movable with respect to the optical integrator so as to change the amount of exposure in the first region and the amount of exposure in the second region relative to the other The exposure ratio is to change the illuminance of the illumination light, and the first area is the area on the exposed substrate that is continuously exposed in time by the scanning exposure field of view of the projection optical system, The second area is an area that is discretely exposed in time by the scanning exposure field of view; and a control unit that controls the relative movement of the illuminance changing member with respect to the optical integrator; the control unit During the movement of the substrate stage relative to the projection optical system, the illuminance changing member is moved relative to the optical integrator. According to a fifth aspect, a device manufacturing method includes: performing exposure processing on a substrate to be exposed by the exposure device of any one of the first to fourth aspects; and performing development processing on the exposed substrate after exposure. According to a sixth aspect, an illuminating optical system is an illuminating optical system used in an exposure device that irradiates a substrate with illuminating light, and irradiates a first illuminating area on an object moving in a scanning direction with illuminating light for a first time, and The illumination light is irradiated on a second illumination area on the object moving in the scanning direction in a second time that is different from the first time, and the illumination optical system includes: an optical integrator arranged to be incident The incident surface of the illuminating light and the upper surface of the substrate become conjugate positions; an illuminance changing member for adjusting the illuminance of the illuminating light illuminating the second area with respect to the illuminance of the illuminating light illuminating the first area The illuminance is relatively changed, the second area is among the illumination areas on the object irradiated with the illumination light, and a part of each of the first illumination area and the second illumination area overlaps Area, the first area is an illumination area of the other part of the first illumination area and the other part of the second illumination area; and a control unit that controls the illumination intensity changing member with respect to the optical integrator Relative movement; the control unit moves the illuminance changing member relative to the optical integrator during the movement of the substrate stage relative to the projection optical system. According to a seventh aspect, an illuminating optical system is an illuminating optical system used in an exposure device that irradiates a substrate with illuminating light, irradiating a first illuminating area on an object moving in a scanning direction within a first time, and The illumination light is irradiated on a second illumination area on the object moving in the scanning direction in a second time that is different from the first time, and the illumination optical system includes: an optical integrator arranged to be incident The incident surface of the illuminating light and the upper surface of the substrate become conjugate positions; the illuminance changing member changes the illuminance of the illuminating light for illuminating the second area and the illuminance of the illuminating light for illuminating the first area The illuminance ratio of the illuminance of one illuminance to the illuminance of the other illuminance, the second area is an area where a part of each of the first illumination area and the second illumination area on the substrate overlaps, so The first area is an area of other parts of the first illumination area and other parts of the second illumination area; and a control unit that controls the relative movement of the illuminance changing member with respect to the optical integrator; The control unit moves the illuminance changing member relative to the optical integrator during the movement of the substrate stage relative to the projection optical system. According to an eighth aspect, an exposure apparatus includes: the illumination optical system of the seventh or eighth aspect; and a substrate stage that holds the substrate and exposes a predetermined pattern of the object on the substrate , Making the substrate relatively move in a first direction with respect to the illumination light.

(First Embodiment of Exposure Device) FIG. 1 is a side view showing the exposure apparatus 100 of the first embodiment. As described later, the exposure apparatus 100 includes five projection optical systems 19a to 19e. However, in FIG. 1, only two projection optical systems 19a and 19b are shown. The projection optical system 19a to the projection optical system 19e are optical systems that form an upright image with a projection magnification (transverse magnification) of +1. The pattern drawn on the mask 15 is exposed and transferred to the photosensitive film formed on the upper surface of the substrate 22 material. Furthermore, the substrate 22 formed with a photosensitive material may be interpreted as a substrate to be exposed.

The substrate 22 is held by the substrate stage 27 via a substrate holder not shown. The substrate stage 27 scans in the X direction on the substrate stage table 28 by a linear motor or the like not shown, and can move in the Y direction. The position of the substrate stage 27 in the X direction is measured by the laser interferometer 25 via the position of the moving mirror 24 mounted on the substrate stage 27. The position of the substrate stage 27 in the Y direction is similarly measured by a laser interferometer not shown. The position detection optical system 23 detects the position of an existing pattern such as an alignment mark formed on the substrate 22.

The mask 15 is held by the mask stage 16. The mask stage 16 scans in the X direction on the mask stage platform 17 and can move in the Y direction by a linear motor or the like not shown. The position of the mask stage 16 in the X direction is measured by the laser interferometer 14 via the position of the movable mirror 13 attached to the mask stage 16. The position of the mask stage 16 in the Y direction is similarly measured by a laser interferometer not shown.

A control system not shown controls the XY positions of the mask stage 16 and the substrate stage 27 based on the measurement values of the laser interferometer 14, the laser interferometer 25, etc., and controls the linear motor not shown. When exposing the mask pattern on the substrate 22, the control system, not shown, maintains the imaging relationship formed by the projection optical system 19a to the projection optical system 19e so that the mask 15 and the substrate 22 are substantially the same The speed scans in the X direction relative to the projection optical system 19a to the projection optical system 19e. In this specification, the direction in which the substrate 22 is scanned (X direction) during exposure is also referred to as "scanning direction" and "sweeping direction". In addition, the direction (Y direction) orthogonal to the X direction included in the surface of the substrate 22 is also referred to as a “non-scanning direction” and a “non-sweeping direction”. The Z direction is a direction orthogonal to the X direction and the Y direction. In addition, in the X direction, Y direction, and Z direction indicated by the arrows in FIG. 1 and the following figures, the direction indicated by the arrows is the + direction.

2 is a perspective view showing a portion from the downstream portion of the illumination optical system ILa to the illumination optical system ILe to the substrate 22 of the exposure apparatus 100 of the first embodiment. Hereinafter, the description will also be continued with reference to FIG. 2. As shown in Figure 2, among the five projection optical systems 19a to 19e, three projection optical systems 19a, 19c, 19e (hereinafter, also collectively or individually referred to as "the first row of projection optical systems 19F") Arranged in the Y direction. Furthermore, the two projection optical systems 19b and 19d (hereinafter, also collectively or individually referred to as "the projection optical system 19R in the second row") are arranged in the Y direction and arranged compared to the projection optical system 19F in the first row On the +X side. The projection optical systems of the projection optical systems 19F in the first row are arranged such that their optical axes are separated at predetermined intervals in the Y direction. The optical systems of the projection optical system 19R in the second row are also arranged in the same manner as the projection optical system 19F in the first row. Moreover, the projection optical system 19b is arrange|positioned so that the position of the Y direction of the optical axis may coincide with the approximate center of the straight line which connects each optical axis of the projection optical system 19a and the projection optical system 19c. In addition, the projection optical system 19d is also arranged in the same manner as the projection optical system 19b.

The exposure apparatus 100 of the first embodiment corresponds to each of the projection optical systems 19a to 19e, and includes a plurality of illumination optical systems ILa to ILe. As an example, as shown in FIG. 1, the illumination optical system ILa corresponding to the projection optical system 19a includes an input lens 8a, a fly-eye lens 11a, and a condenser lens 12a along the optical axis IXa. The other illumination optical systems ILb to ILe also include an input lens 8b to an input lens 8e, a fly-eye lens 11b to a fly-eye lens 11e, and a condenser lens 12b to a condenser lens 12e. In addition, as described above, only the fly-eye lens 11a to the fly-eye lens 11e and the condenser lens 12a to the condenser lens 12e in the respective illumination optical systems ILa to ILe are shown in FIG. In addition, in FIG. 1 which is a side view, since the position of the projection optical system 19c-the projection optical system 19e overlaps with the projection optical system 19a or the projection optical system 19b, it is not shown in figure. Similarly, the illumination optical system ILc-the illumination optical system ILe are not shown because the position in the X direction overlaps with the illumination optical system ILa or the illumination optical system ILb.

Illumination light supplied from a light source 1 such as a lamp is supplied to the respective illumination optical systems ILa to ILe via light guiding optical systems such as the elliptical mirror 2, the deflecting mirror 3, the relay lens 4, the deflecting mirror 5, the relay lens 6, and the optical fiber 7. The optical fiber 7 branches the illuminating light that has entered one incident side 71 substantially evenly, and emits it toward the five emission sides 72a to 72e. The illumination light respectively emitted from the five emission sides 72a to 72e of the optical fiber 7 enters the input lens 8a to the input lens 8e in each of the illumination optical systems ILa to ILe. Then, the illumination light further passes through the fly-eye lens 11a to the fly-eye lens 11e, and the condenser lens 12a to the condenser lens 12e, and irradiates the respective illumination regions MIa to MIe on the mask 15.

The fly-eye lens 11a to the fly-eye lens 11e are arranged at the position where the incident side (the surface on the input lens 8b to the input lens 8e side) becomes the conjugate surface CP. The conjugate surface CP passes through the projection optical system 19a to the projection optical system 19e. The optical lens 12a to the condensing lens 12e and the fly-eye lens 11a to the fly-eye lens 11e are conjugate (imaging relationship) with the upper surface of the substrate 22 (the upper surface of the substrate holder on which the substrate 22 is placed or its vicinity).

As an example, FIG. 3 is an enlarged perspective view showing the fly-eye lens 11c and the condenser lens 12c included in the illumination optical system ILc, and the illumination area MIc on the mask 15. The fly-eye lens 11c is formed by arranging a plurality of lens elements 110 in the X direction and the Y direction. The lens elements 110 have a rectangular cross-sectional shape in the Y direction that is similar to the illumination area MIc (shape in the XY plane). ). The incident surface 11ci of each lens element 110 (the upper surface, that is, the surface on the +Z side), by the optical system including each lens element 110 and the condenser lens 12c, becomes relative to the illumination area MIc (loaded) on the mask 15 Set the conjugate surface CP of the upper surface of the mask stage of the mask 15 or its vicinity). Therefore, the incident surface 11ci is also the conjugate surface CP relative to the exposure field of view PIc on the substrate 22. The illumination light irradiated to the incident surface of each lens element 110 is overlapped and irradiated to the illumination area MIc on the mask 15. Thereby, the illuminance of the illumination light in the illumination area MIc is substantially uniform.

The configurations of the illumination optical systems ILa to ILe other than the illumination optical system ILc are also the same as those shown in FIG. 3. The fly-eye lens 11a to the fly-eye lens 11e are an example of an optical integrator that superimposes and irradiates illumination light to the respective illumination areas MIa to MIe. On the side of the incident surface 11ai to the incident surface 11ei (the input lens 8a to the input lens 8e side) of the fly-eye lens 11a to the fly-eye lens 11e, the light reduction member 10a to the light reduction member 10e described later are arranged, and the light reduction member 10a to the light reduction member The member 10e is held by the light-reducing member holding portion 9a to the light-reducing member holding portion 9e.

In order to form an upright image, the projection optical system 19a to the projection optical system 19e each include, for example, a secondary imaging type optical system. In this case, the optical system that constitutes the upper half of each projection optical system 19a-19e is located near the middle of the direction (Z direction) from the optical axis PAXa to the optical axis PAXe of each projection optical system 19a-19e The intermediate image surface 20 forms an intermediate image of the pattern of the mask 15. The intermediate image is imaged again by the optical system constituting the lower half of each of the projection optical systems 19 a to 19 e, and an image of the pattern of the mask 15 is formed on the substrate 22.

The intermediate image plane 20 and the substrate 22 are conjugate. Therefore, the field diaphragm 21a to the field diaphragm 21e are respectively arranged on the intermediate image plane 20 in the projection optical systems 19a-19e, thereby defining the projection optical systems on the substrate 22 The exposure field of view Pia of 19a to 19e-the exposure field of view PIe.

4 is a diagram showing the relationship between the illumination area MIa to the illumination area MIe on the mask 15 and the field of view diaphragm 21a to the field of view diaphragm 21e, and the exposure field of view PIa to the exposure field of view PIe. (A1) of FIG. 4 is a diagram showing the illumination area MIc on the mask 15 corresponding to the projection optical system 19c. The illumination area MIc becomes a rectangle similar to the cross-sectional shape of the lens element 110 of the fly-eye lens 11c.

(A2) of FIG. 4 is a diagram showing the field of view diaphragm 21c in the projection optical system 19c and the illumination light MIc2 irradiated to the field of view diaphragm 21c. The illumination light MIc2 indicated by the broken line as the intermediate image of the illumination area MIc on the mask 15 is irradiated to the field diaphragm 21c. Among the illuminating light MIc2, the illuminating light that has been irradiated to the light shielding portion (the portion indicated by the diagonal line) of the field diaphragm 21c is shielded by the field diaphragm 21c. On the other hand, the illumination light passing through the opening 21co of the field diaphragm 21c is again imaged on the substrate 22 by the optical system constituting the lower half of the projection optical system 19c, forming an exposure field of view PIc on the substrate 22.

FIG. 4( a3) shows the exposure field of view PIc on the substrate 22. As an example, when the projection optical system 19c to the projection optical system 19e include a total refractive optical system, the illuminating light MIC2 as the intermediate image is an inverted upright image with respect to the illumination area MIc (the X and Y directions of the image are both reversed, not Mirror image), the exposure field of view PIc becomes an inverted upright image with respect to the field of view diaphragm 21c. Therefore, as shown in Fig. 4(a2) and Fig. 4(a3), the shape of the opening 21co of the field diaphragm 21c and the shape of the exposure field of view PIc coincide with the shape rotated 180 degrees around the Z axis. .

As an example, the exposure field of view PIc is a trapezoid in which the short side of the two sides parallel to the Y direction is located on the +X side, and the long side is located on the −X side. Here, a rectangular area surrounded by all the short sides on the +X side and a part of the long sides on the -X side in the exposure field of view PIc is referred to as the central area PIcc. On the other hand, in the exposure field of view PIc, the end in the +Y direction that is not included in the central area PIcc is called the left end area PIcl, and the exposure field of view PIc is not included in the central area PIcc -Y The end of the direction is called the right end area PIcr. The length (width) in the Y direction of the center area PIcc is called the width Ws, and the length (width) of the left end area PIcl and the right end area PIcr in the Y direction are equal, and this is called the width Wo.

On the other hand, FIGS. 4( b1) to 4( b3) are diagrams respectively showing the illumination area MIb, the field of view diaphragm 21 b, and the exposure field of view PIb on the mask 15 corresponding to the projection optical system 19 b. As shown in Fig. 4(b2), in the projection optical system 19b, the shape of the opening 21bo of the field diaphragm 21b is changed to reverse the shape of the opening 21co of the field diaphragm 21c of the projection optical system 19c in the X direction Into the shape. As a result, as shown in (b3) of FIG. 4, the shape of the exposure field of view PIb of the projection optical system 19 b becomes a shape in which the shape of the exposure field of view PIc of the projection optical system 19 c is inverted in the X direction.

Similar to the exposure field of view PIc, regarding the exposure field of view PIb, a rectangular area surrounded by all of the short sides on the -X side and a part of the long sides on the +X side is also referred to as the central area PIbc. In the exposure field of view PIb, the end in the +Y direction that is not included in the central area PIbc is called the left end area PIbl, and the end in the exposure field of view PIb that is not included in the -Y direction in the central area PIbc It is called the right end area PIcr.

FIG. 5( a) is a diagram showing each exposure field of view PIa to PIe of the five projection optical systems 19 a to 19 e on the substrate 22. The projection optical system 19a of the projection optical system 19F as the first row, the exposure field of view PIa, and the exposure field of view PIe of the projection optical system 19e are similar to the exposure field of view PIc of the projection optical system 19c, and are parallel to the Y direction A trapezoid with the short side on the +X side and the long side on the -X side. On the other hand, the exposure field of view PId of the projection optical system 19d, which is the projection optical system 19R in the second row, is similar to the exposure field of view PIb of the projection optical system 19b. The short side of the two sides parallel to the Y direction is located -X side, the long side is a trapezoid on the +X side.

Regarding the exposure field of view PIa, the exposure field of view PId, and the exposure field of view PIe of the projection optical system 19a, the projection optical system 19d, and the projection optical system 19e, the central area may be the same as the exposure field of view PIb and exposure field of view PIc. PIac, central area PIDc, central area PIec, left end area PIal, left end area PIDl, left end area PIel, right end area PIar, right end area PIdr, and right end area PIer are defined. However, the exposure field of view PIa arranged at the end of the -Y direction is blocked by the field diaphragm 21a so that the end of the -Y direction becomes parallel to the X direction, and therefore there is no right end area PIar. In addition, the exposure field of view PIe arranged at the end of the +Y direction is shielded by the field diaphragm 21a so that the end of the +Y direction becomes parallel to the X direction, so there is no left end area PIal. Furthermore, the shape of the field diaphragm 21a and the field diaphragm 21e may be different from the shape of the field diaphragm 21c, and other members may be used to shield the illumination light so that the right end area PIar does not exist in the exposure field of view Pia.

The lengths in the Y direction of the central regions PIac to PIec of the exposure fields of view Pia to PIe are all equal to the width Ws, and the lengths of the left end area PIal to the left end area PIDl and the right end area PIbr to the right end area PIer are all equal to the width Wo. Furthermore, in the two exposure fields adjacent in the Y direction among the exposure field of view PIa to the exposure field of view PIe, the positions of the adjacent left end area PIal to the left end area PIDl and the right end area PIbr to the right end area PIer coincide with each other in the Y direction. . The setting of the shape and position of each exposure field of view Pia-PIe can be done by setting the arrangement position of the projection optical system 19a-projection optical system 19e, and the opening 21ao-opening 21eo of the field diaphragm 21a-field diaphragm 21e The shape and location of the

Fig. 5(b) shows when the substrate 22 is scanned in the X direction by the substrate stage 27, and exposure is obtained through the exposure field of view Pia to the exposure field of view PIe shown in Fig. 5(a) , A view of the exposure area formed on the substrate 22. On the substrate 22, scanning exposure is used to form a scanning exposure field of view SIa to a scanning exposure field of view SIe that are exposed by each exposure field of view PIa to PIE. In Figure 5(b), the scanning exposure field of view SIa, the scanning exposure field of view SIc, and the scanning exposure field of view SIe formed by the projection optical system 19a, the projection optical system 19c, and the projection optical system 19e in the first row are drawn by a double dot The lines indicate that the scanning exposure field of view SIb and the scanning exposure field of view SId formed by the projection optical system 19b and the projection optical system 19d in the second row are indicated by a chain line.

The scanning exposure field of view SIa to SIe is obtained by extending the exposure field of view Pia to the exposure field of view PIe in the X direction by scanning exposure in the X direction. The ends in the Y direction (non-scanning direction) of the respective scanning exposure fields of view SIa to SIe overlap with the ends of the adjacent other scanning exposure fields of view SIa to SIe in the non-scanning direction, respectively. For example, the exposure area formed by the left end area PIal is the same as the exposure area formed by the right end area PIbr. The same is true in other exposure areas, so the description is omitted.

Hereinafter, in the Y direction, the portion exposed by each scanning exposure field of view SIa to SIe is also referred to as non-overlapping portion Sa to non-overlapping portion Se, and each scanning exposure is made to two of the field of view SIa to SIe. The part exposed by overlapping is also referred to as overlapping portion Oa to overlapping portion Od. Among the exposure field of view PIa to the exposure field of view PIe, the left end area PIal to the left end area PIDl and the right end area PIbr to the right end area PIer are the exposure fields of view corresponding to the overlap portion Oa to the overlap portion Od, and the central area PIac to the central area PIec are It corresponds to the exposure field of view of the non-overlapping portion Sa to the non-overlapping portion Se.

The overlapping part Oa to the overlapping part Od obtained by overlapping two of the scanning exposure fields of view SIa-SIe are first exposed by the projection optical system 19a, the projection optical system 19c, and the projection optical system 19e in the first row, and thereafter by the second The two-row projection optical system 19b and the projection optical system 19d perform exposure, so the exposure is divided in time. In other words, the overlapping portion Oa to the overlapping portion Od are exposed discretely in time. On the other hand, the non-overlapping portion Sa to the non-overlapping portion Se are areas exposed by scanning one of the scanning exposure field of view SIa to the scanning exposure field of view SIe, and are continuous without being divided in time. To get the exposed area. The non-overlapping portion Sa to the non-overlapping portion Se that are continuously exposed in time may also be interpreted as the first region. On the other hand, the overlapping portion Oa to the overlapping portion Od that are exposed discretely in time can also be interpreted as the second region.

FIG. 5(c) is a graph showing the exposure amount E exposed on the substrate 22 by scanning exposure in the X direction. The vertical axis of the graph is the coordinates of the exposure, and the horizontal axis is the coordinates in the Y direction. As shown in Figure 5(a), the values obtained by accumulating the exposure fields of view PIa～PIe in the X direction in each minute section in the Y direction are equal, and the illuminance in each exposure field of view Pia～PIe is used by the compound eye The effect of the lens 11 is uniform, so the exposure amount E on the substrate 22 becomes a fixed value E1. That is, in the Y direction, the value of the exposure amount E in the non-overlapping portion Sa to the non-overlapping portion Se and the exposure amount E in the overlapping portion Oa to the overlapping portion Od becomes equal to E1.

However, for example, when the scanning exposure field of view SIa, the scanning exposure field of view SIc, the scanning exposure field of view SIe, the scanning exposure field of view SIb, and the scanning exposure field of view SId are generated in the Y direction from the state of Figure 5(a) When the position is shifted, the exposure amount in the overlapping portion Oa to the overlapping portion Od becomes different from the exposure amount E1 in the non-overlapping portion Sa to the non-overlapping portion Se. For example, when the projection optical system 19a, the projection optical system 19c, and the projection optical system 19e in the first row and the projection optical system 19b and the projection optical system 19d in the second row have the scanning exposure field of view SIb and the scanning exposure field of view SId mutually in Y This phenomenon occurs when there is a positional deviation in the direction. Or, when the exposed substrate 22 is deformed due to heat generated by the process, etc., in order to correct the deformation, the substrate stage 27 is scanned in a direction deviated from the X direction for exposure, this phenomenon also occurs .

FIG. 5( d) is a graph showing the exposure amount E when the exposure amount in the overlapping portion Oa to the overlapping portion Od is different from the exposure amount E1 in the non-overlapping portion Sa to the non-overlapping portion Se. As an example, (d) of FIG. 5 shows an example when the scanning exposure field of view SIb and the scanning exposure field of view SId deviate from the scanning exposure field of view SIa, the scanning exposure field of view SIc, and the scanning exposure field of view SIe in the -Y direction. . In this case, relative to the exposure amount E1, the exposure amount increases in the overlapping portion Oa and the overlapping portion Oc, and the exposure amount decreases in the overlapping portion Ob and the overlapping portion Od. Although not shown, when the scanning exposure field of view SIb, the scanning exposure field of view SId and the scanning exposure field of view SIa, the scanning exposure field of view SIc, and the scanning exposure field of view SIe deviate in the +Y direction, they are relative to the exposure amount. E1, the amount of exposure decreases in the overlap portion Oa and the overlap portion Oc, and the amount of exposure increases in the overlap portion Ob and the overlap portion Od.

When the exposure is performed at the exposure amount shown in FIG. 5(d), the degree of reaction of the photosensitive material on the substrate 22 is different in the overlapping portion Oa to the overlapping portion Od and the non-overlapping portion Sa to the non-overlapping portion Se , So the line width or thickness of the pattern that has been transferred to the photosensitive material changes. Furthermore, in addition to the above-mentioned cases, for example, when the exposed substrate 22 is partially deformed due to heat generated by the manufacturing process, the same phenomenon occurs. However, in this case, in the entire surface of the exposed substrate 22, the distribution of the exposure amount E shown in the graph of FIG. 5(d) is not changed, and only in the area of the exposed substrate 22 that has been locally deformed. , It becomes the distribution of the exposure amount E shown in the graph of FIG. 5(d). In addition, not all regions of the overlap region Oa to the overlap region Od, but at least one overlap region, a region having an exposure amount different from the exposure amount E1 occurs. In addition, it is not limited to the local deformation of the exposed substrate 22. Due to the uneven thickness of the photosensitive material applied to the exposed substrate 22, as described above, in at least one overlapping area, the occurrence becomes different from the exposure amount E1. The area of exposure.

Therefore, in the exposure apparatus 100 of the first embodiment, the incident surface 11ai to the incident surface 11ei side of the fly eye lens 11a to the fly eye lens 11e of the illumination optical system ILa to the illumination optical system ILe, that is, the input lens 8a to the input lens 8e At a position between the fly eye lens 11a to the fly eye lens 11e, and in the vicinity of the incident surface 11ai to the incident surface 11ei of the fly eye lens 11a to the fly eye lens 11e, there are provided a light reduction member 10a to a light reduction member 10e as an example of an illuminance changing member . Furthermore, the light reduction member 10a to the light reduction member 10e are arranged in a direction substantially orthogonal to the optical axis IXa to the optical axis IXe of the respective illumination optical systems ILa to ILe through the light reduction member holding portion 9a to the light reduction member holding portion 9e. The movement in the X direction is maintained freely. The positions of the dimming member 10a-the dimming member 10e in the X direction are controlled by the control signal SigA-the control signal SigE from the control unit 50.

6 is a view of the fly-eye lens 11c provided in the illumination optical system ILc, the light reduction member 10c (10ca1, 10ca2, 10cb1, 10cb2, 10cc1, 10cc2), and the light reduction member holding portion 9c (9ca, 9cb, 9cc). Hereinafter, referring to FIG. 6, the light-reducing member 10c and the light-reducing member holding portion 9c provided in the illumination optical system ILc will be described. In addition, the light reduction member 10a-the light reduction member 10e and the light reduction member holding part 9a-the light reduction member holding part 9e provided in the other illumination optical systems ILa to ILe are also the same as the following.

In the fly-eye lens 11c, a plurality of lens blocks are arranged in the Y direction, and the lens blocks are obtained by arranging a plurality of lens elements 110 having a rectangular cross section in the Y direction in the X direction. As described above, FIG. 6 is a diagram of the fly-eye lens 11c viewed from the side of the input lens 8c which is the side of the incident surface 11ai to the incident surface 11ei. Furthermore, the incident side surface of each lens element 110 becomes a conjugate surface CP with respect to the exposure field of view PIc formed on the substrate 22. Therefore, in FIG. 6, in each lens element 110, a dotted line indicates an exposure field corresponding area IPIc as an area corresponding to the exposure field of view PIc. Furthermore, the horizontal magnification of the exposure field of view corresponding area IPIc to the exposure field of view PIc is set to β times.

The exposure apparatus 100 of the first embodiment includes a first end light reduction member 10cb1, a first end light reduction member 10cb2, a second end light reduction member 10cc1, a second end light reduction member 10cc2, and a third end light reduction member 10cb1 The member 10ca1 and the third light reduction member 10ca2 serve as the light reduction member 10c. Among them, the Y-direction width Wb of the first end dimming member 10cb1, the first end dimming member 10cb2, and the second end dimming member 10cc1 and the second end dimming member 10cc2 is the same as the right end of the exposure field of view PIc The area PIcr is approximately equal to β times the width Wo of the left end area PIcl.

The first end light reduction member 10cb1 and the first end light reduction member 10cb2 are arranged on the +X direction side of the fly-eye lens 11c, and cover the left end of the exposure field of view PIc corresponding to the exposure field of the several lens elements 110. The part corresponding to the area PIcl is dimmed. The second end light reduction member 10cc1 and the second end light reduction member 10cc2 are arranged on the +X direction side of the fly-eye lens 11c, covering the right end of the exposure field of view PIc corresponding to the exposure field of the several lens elements 110. The part corresponding to area PIcr is dimmed.

Furthermore, as described above, the fly-eye lens 11c has a plurality of lens groups arranged in the Y direction, and the lens groups are formed by arranging a plurality of lens elements 110 in the X direction. Therefore, the first end dimming member 10cb1 and the first end dimming member 10cb2 can be interpreted as a member that pairs the overlapping portion Oc of one or more lens elements 110 arranged in at least one lens group. At least a part of the corresponding left end area PIcl is dimmed. Similarly, the second end dimming member 10cc1 and the second end dimming member 10cc2 can be interpreted as the following members for the overlapping parts of more than one lens element 110 arranged in at least one lens group At least a part of the right end area PIcr corresponding to Ob is dimmed.

The width Wa of the third light reduction member 10ca1 and the third light reduction member 10ca2 in the Y direction is approximately equal to β times the width Ws of the central region PIcc of the exposure field of view PIc. The third end light reduction member 10ca1 and the third end light reduction member 10ca2 are arranged on the -X direction side of the fly-eye lens 11c, and cover the center of the exposure field of view PIc corresponding to the exposure field IPIc of the several lens elements 110 The part corresponding to area PIcc is dimmed. The third end light reduction member 10ca1 and the third end light reduction member 10ca2 can be interpreted as a member corresponding to the non-overlapping portion Sc of one or more lens elements 110 arranged in at least one lens group At least a part of the PIcc of the central area is dimmed.

The first end dimming member 10cb1 and the first end dimming member 10cb2 are held by a slider 91b, and the slider 91b is movably held in the X direction by the dimming member holding portion 9cb. The relative positional relationship between the slider 91b and the light reduction member holding portion 9cb is measured by an encoder or the like, and is transmitted to the control portion 50. In addition, the relative positional relationship between the slider 91b and the light reduction member holding portion 9cb, that is, the position of the first end light reduction member 10cb1 and the first end light reduction member 10cb2 in the X direction is controlled by a control signal SigCb from the control unit 50 .

The second end dimming member 10cc1 and the second end dimming member 10cc2 are similarly held by the slider 91c, and the slider 91c is movably held in the X direction by the dimming member holding portion 9cc. The third light reduction member 10ca1 and the third light reduction member 10ca2 are similarly held by the slider 91a, and the slider 91a is movably held in the X direction by the light reduction member holding portion 9ca. The X-direction positions of the second end dimming member 10cc1, the second end dimming member 10cc2, the third dimming member 10ca1, and the third dimming member 10ca2 are also measured in the same manner as described above. The control signal SigCc, control signal SigCa control.

The first end dimming member 10cb1 and the first end dimming member 10cb2 are moved in the ±X direction to change the dimming performed by the first end dimming member 10cb1 and the first end dimming member 10cb2 The number of lens elements 110. Thereby, the exposure amount of the overlapping portion Oc on the substrate 22 can be increased or decreased. The second end dimming member 10cc1 and the second end dimming member 10cc2 are moved in the ±X direction to change the dimming by the second end dimming member 10cc1 and the second end dimming member 10cc2 The number of lens elements 110. Thereby, the exposure amount of the overlapping portion Ob on the substrate 22 can be increased or decreased.

Similarly, by moving the third light reduction member 10ca1 and the third light reduction member 10ca2 in the ±X direction, the lens element 110 whose light is reduced by the third light reduction member 10ca1 and the third light reduction member 10ca2 can be changed. Quantity. In this way, the exposure amount of the non-overlapping portion Sc on the substrate 22 can be increased or decreased. According to the above, by appropriately adjusting the first end dimming member 10cb1, the first end dimming member 10cb2, the second end dimming member 10cc1, the second end dimming member 10cc2, and the third dimming member 10cb1, The position of each of the member 10ca1 and the third light reduction member 10ca2 in the X direction allows the exposure amount of the overlapping portion Ob on the substrate 22 to be relatively increased or decreased compared to the exposure amount of the non-overlapping portion Sc on the substrate 22.

In addition, the control unit 50 may appropriately adjust the first end light reduction member 10cb1, the first end light reduction member 10cb2, and the second end during the period of scanning in the X direction for exposing the substrate 22. The position of each of the light reduction member 10cc1, the second end light reduction member 10cc2, the third light reduction member 10ca1, and the third light reduction member 10ca2 in the X direction. The control unit 50 may also appropriately adjust the first end light reduction member 10cb1, the first end light reduction member 10cb2, and the second end light reduction member 10cb1, and the second end light reduction member 10cb1, immediately before exposing the locally deformed area of the substrate 22. The X-direction position of the light member 10cc1, the second end light reduction member 10cc2, the third light reduction member 10ca1, and the third light reduction member 10ca2 are changed after the exposure of the deformed area is completed. The positions of the members 10cb1, the first end dimming member 10cb2, the second end dimming member 10cc1, the second end dimming member 10cc2, the third dimming member 10ca1, and the third dimming member 10ca2 in the X direction. In addition, when exposing the substrate 22 with uneven coating of the photosensitive material, the control section may also move the light-reducing member in the X direction corresponding to the thickness of the photosensitive material on the substrate 22. Furthermore, the exposure apparatus 100 may also be provided with a measuring unit that detects a local area on the substrate 22 during a period of scanning in the X direction in order to expose the substrate 22 or before scanning and exposing the substrate 22 Deformation or uneven coating of photosensitive materials.

Light reduction member 10c (first end light reduction member 10cb1, first end light reduction member 10cb2, second end light reduction member 10cc1, second end light reduction member 10cc2, third end light reduction member 10ca1, third The light-reducing member 10ca2) may be a thin metal plate, or a light-reducing film formed on a transparent glass plate by a light-reducing member. The light reduction member 10c is not limited to one that completely shields the illuminating light like a filter, and may be a member that shields only a part of the illuminating light and transmits the remaining illuminating light. That is, the light reduction member 10c may be an illuminance changing member for changing the illuminance.

The dimming member 10a, the dimming member 10b, the dimming member 10d, the dimming member 10e, and the dimming member holding portion 9a, the dimming member holding portion 9b, and the dimming member included in the other illumination optical systems ILa, ILb, ILd, ILe The structure of the member holding portion 9d and the light reducing member holding portion 9e is also the same as the light reducing member 10c and the light reducing member holding portion 9c. Thereby, the ratio of the exposure amount of the overlapping portion Oa to the overlapping portion Od to the exposure amount of the non-overlapping portion Sa to the non-overlapping portion Se can be adjusted in each of the illumination optical systems ILa to ILe, and the transfer to the overlapping portion Oa can be prevented. -Variation in the line width or thickness of the pattern of the overlapping portion Od and the non-overlapping portion Sa to the non-overlapping portion Se.

As an example, in the state shown in (d) of FIG. 5, the second end dimming member in the illumination optical system ILb and the illumination optical system ILd is moved in the +X direction to reduce the right end of each exposure field of view PIb, PId The exposure amount of the area PIbr and the right end area PIdr, or the first end dimming member in the illumination optical system ILa, the illumination optical system ILc, and the illumination optical system ILe is moved in the -X direction to increase the exposure field of view PIa, PIc, The exposure amounts of the left end area PIal, the left end area PIcl, and the left end area PIel of the PIe make the exposure amounts of the overlapping portion Oa and the overlapping portion Oc equal to the exposure amounts of the non-overlapping portion Sa to the non-overlapping portion Se. Furthermore, the second end light reduction member may be moved in the +X direction and the first end light reduction member may be moved in the −X direction to adjust the exposure amount. In addition, regarding the overlapping portion Ob and the overlapping portion Od, the second end dimming member in the illumination optical system ILa, the illumination optical system ILc, and the illumination optical system ILe may be moved in the +X direction, or the illumination optical system ILb, The first end dimming member in the illumination optical system ILd is moved in the -X direction, or both are moved, whereby the exposure amount of the overlapping portion Ob and the overlapping portion Od and the non-overlapping portion Sa to the non-overlapping portion Se The exposure is equal.

When the light reduction member 10c is moved in the −X direction from above the fly-eye lens 11c, the exposure amount of the non-overlapping portion Sc is increased compared to before the movement. Therefore, it can also be said that the light reduction member 10c functions as an increasing member. Similarly, if the first end dimming member and the second end dimming member are moved in the +X direction from above the fly-eye lens 11c, the exposure amount of the overlapping portion Oc will increase compared to before the movement. The one end dimming member and the second end dimming member function as adding members. The light-reducing member 10c moves in the -X direction from above the fly-eye lens 11c, but in the X direction, it can also be moved to a position that does not overlap with the fly-eye lens 11c. The light-reducing member 10c and the fly-eye lens 11c can also be moved in the X direction. Move in a way that the amount of overlap becomes smaller.

The light-reducing member 10c is arranged at a position separated by a predetermined distance in the Z direction from the incident surface 11ci of the fly-eye lens 11c. Therefore, the edge of the light-reducing member 10c in the XY direction is blurred and projected on the incident surface 11ci of the fly-eye lens 11c. Conversely, how much distance the light-reducing member 10c is separated from the incident surface 11ci of the fly-eye lens 11c in the Z direction can be determined based on the following value, which is used to determine the light-reducing member on the substrate 22 The parameter of the amount of penumbra blur at the edge of 10c is the lateral magnification (the above β) of the incident surface 11ci of the fly-eye lens 11c and the substrate 22, and the numerical aperture of the illumination light on the incident surface 11ci of the fly-eye lens 11c. Furthermore, it can also be determined with reference to the width of the Y direction of the overlapping portion Oa to the overlapping portion Od on the substrate 22. Furthermore, it is preferable to have a mechanism capable of changing the position of the light reducing member 10c with respect to the incident surface 11ci of the fly-eye lens 11c in the Z direction, so that the distance between the light reducing member 10c and the fly eye lens 11c in the Z direction can be changed.

As an example, assuming that the Y-direction width of the overlapping portion Oa to the overlapping portion Od is DW, the lateral magnification of the substrate 22 to the incident surface 11ci of the fly-eye lens 11c is set to β, and the illumination in the incident surface 11ci of the fly-eye lens 11c When the numerical aperture of light is NA, it is preferable to set the distance D in the Z direction of the light reducing member 10c from the incident surface 11ci of the fly-eye lens 11c as 0≦D≦1.2×DW/(β・NA)...(1). When the distance D satisfies the formula (1), the influence of the variation of the exposure amount (uneven exposure amount) on the substrate 22 generated by the edge of the light-reducing member 10c can be further reduced.

Furthermore, it is better to determine the position of the light-reducing member 10c in the X direction, for example, by setting the insertion amount of the light-reducing member 10c (position in the X direction) to be tested under multiple conditions in several different stages. The result is to determine the most appropriate amount of insertion. In addition, the thickness of the coated photosensitive material of the substrate 22 may be measured by a measuring device provided inside the exposure apparatus 100, and the most suitable insertion amount of the light reduction member 10c may be determined based on the result. Furthermore, the measuring device may also be one installed outside the exposure device 100. In addition, when determining the insertion amount of the light-reducing member 10c, it is desirable to use the illuminance sensor 26 provided on the substrate stage 27 to determine the illuminance while measuring the illuminance of each part in the exposure field of view PIc.

Furthermore, the ends in the +X direction of each of the two light reduction members 10ca1 and 10ca2 constituting the third light reduction member shown in FIG. 6 deviate only from the pitch PX of the arrangement of the lens elements 110 of the fly eye lens 11c in the X direction. Half of it. As described above, each lens element 110 has an exposure field of view corresponding area IPIcw corresponding to the exposure field of view PIc, but the exposure field of view corresponding area IPIcw does not extend across the entire surface of the lens element 110 in the X direction. That is, the both ends of the lens element 110 in the X direction are parts that do not correspond to the exposure field of view PIc on the substrate 22 and are projected onto the field diaphragm 21c in the projection optical system 19c, and are blocked by the field diaphragm 21c.

Therefore, when the ends in the +X direction of the light reduction member 10ca1 and the light reduction member 10ca2 are located near the both ends of the lens element 110 in the X direction, even if the light reduction member 10ca1 and the light reduction member 10ca2 are moved in the X direction, It is also impossible to change the amount of exposure on the substrate 22. Therefore, in the first embodiment, the ends in the +X direction of the two light reduction members 10ca1 and 10ca2 are shifted by only half of the pitch PX of the arrangement of the lens elements 110 in the X direction.

With this arrangement, when the +X-direction end of one of the two light-reducing members 10ca1, 10ca2 is located near the both ends of the lens element 110 in the X direction, the +X-direction end of the other is arranged at Near the center of the lens element 110 in the X direction. Therefore, by moving both of the two light-reducing members 10ca1 and 10ca2 in the X direction, the amount of exposure on the substrate 22 can be constantly changed. Furthermore, it may be set as the structure which makes the light reduction member 10c1 and the light reduction member 10c2 move to the X direction independently, respectively.

Furthermore, the light-reducing member 10ca1 and the light-reducing member 10ca2 are not limited to the two, and there may be three or more, and they may be respectively arranged in different lens groups. In this case, if the number of light-reducing members is m (m is a natural number of 2 or more), the end of each light-reducing member in the +X direction is preferably deviated from the pitch PX by PX/m Way to set. Regarding the position or number of the +X-direction ends of the light-reducing member 10ca1 and the light-reducing member 10ca2 constituting the third light-reducing member, the same applies to the light-reducing member 10cb1 and the light-reducing member 10cb1 that constitute the first end light-reducing member. The position or number of the light-reducing member 10cb2 and the light-reducing member 10cc1 constituting the second end light-reducing member 10cc2 in the -X direction.

In addition, the light-reducing member 10c is arrange|positioned at the position separated only by the predetermined distance in the Z direction from the incident surface 11ci of the fly-eye lens 11c, but it is not limited to this. The light reduction member 10c may also be provided on the incident surface 11ci with respect to the fly-eye lens 11c, that is, the conjugate surface CP of the upper surface of the substrate 22. If the light-reducing member 10c is one that completely shields the illuminating light, when it is arranged to coincide with the conjugate plane CP, there are the exposure amount of the overlapping portion Oa to the overlapping portion Od and the non-overlapping portion Sa to the non-overlapping portion Se The exposure amount of the part may change discontinuously. Therefore, in this case, it is preferable that the light-reducing member 10c deforms its shape or continuously changes the light-shielding rate of the illuminating light in a position corresponding to the Y direction like a filter. In addition, the first end dimming member 10cb1, the first end dimming member 10cb2, and the second end dimming member 10cc1, the second end dimming member 10cc2, and the third end dimming member 10ca1 can also be used. , The third end dimming member 10ca2 changes the shading rate of the illumination light.

(Modification 1) In the above first embodiment, the first end dimming member 10cb1, the first end dimming member 10cb2, the second end dimming member 10cc1, and the second end dimming member 10cc2 are arranged on the fly-eye lens 11c On the −X direction side, the third end light reduction member 10ca1 and the third end light reduction member 10ca2 are arranged on the +X direction side of the fly-eye lens 11c, but the arrangement is not limited to this arrangement. As long as the dimming members 10c do not collide with each other or mechanically interfere when the dimming members 10c are moved in the X direction, all the dimming members 10c may be arranged on the +X direction side or -X of the fly-eye lens 11c. On the direction side, the size of the illumination optical system ILa to the illumination optical system ILe can be reduced in the X direction.

(Modification 2) Since the light reduction member 10c can move the first end light reduction member 10cb1, the first end light reduction member 10cb2, and the second end light reduction member 10cc1 and the second end light reduction member 10cc2 in the X direction, The ratio of the exposure amount of the overlapping portion Ob and the overlapping portion Od to the exposure amount of the non-overlapping portion Sa to the non-overlapping portion Se is changed, so the third end light reduction member 10ca1 and the third end light reduction member 10ca2 may also be omitted. Only the first end dimming member 10cb1, the first end dimming member 10cb2, and the second end dimming member 10cc1 and the second end dimming member 10cc2 are included. In addition, the light reduction member 10 may omit the first end light reduction member 10cb1, the first end light reduction member 10cb2, and the second end light reduction member 10cc1 and the second end light reduction member 10cc2, and only include the third end The light reduction member 10ca1 and the third end light reduction member 10ca2.

In addition, in the first embodiment, the configurations of the dimming members 10a to 10e in all the illumination optical systems ILa to ILe are the same, but it is not limited to this, for example, it may be in the first row. The configuration of the dimming member is changed in the projection optical system 19F and the projection optical system 19R in the second row, and the configuration of the dimming member may be changed in each of the illumination optical systems ILa to ILe. In addition, in the case where the substrate 22 has been locally deformed or when there is uneven coating of the photosensitive material, etc., only the illumination optical system ILa to the illumination optical system ILe are used to project the illumination light toward the area. The light-reducing member of the system ILa to the illumination optical system ILe moves, and the light-reducing member may not be moved in the illumination optical system that projects the lighting items to other areas.

(Modification 3) As described above, in the first embodiment, the first end light reduction member 10cb1 and the first end light reduction member 10cb2 are relatively moved in the X direction with respect to the two rows in the +Y direction of the lens element, and the second end The light reduction member 10cc1 and the second end light reduction member 10cc2 move relative to the two rows in the -Y direction of the lens element in the X direction, so that the third end light reduction member 10ca1 and the third end light reduction member 10ca2 moves in the X direction with respect to the center two rows of the lens element, but it is not limited to this. The first end dimming member 10cb1, the first end dimming member 10cb2, the second end dimming member 10cc1, the second end dimming member 10cc2, and the third end dimming member 10ca1, third All of the end light reduction members 10ca2 move relative to the lens elements arranged in the same row in the X direction, and some of them may be different.

(Modification 4) The dimming member 10a to 10e, which are examples of the illuminance changing member, are described as being freely movable in the X direction with respect to the fly-eye lens 11, but they may be freely movable in the Z direction. In addition, each of the light reduction member 10a to 10e may include a plurality of light reduction members stacked in the Z direction. The plurality of light-reducing members may also move relative to each other in the Y direction. In other words, the multiple light-reducing members may also move relative to the fly-eye lens 11 in the Y direction. In this way, the illuminance changing member moves relative to the fly-eye lens 11 in any one of the X direction, the Y direction, and the Z direction, whereby the exposure amount distribution on the substrate 22 can be changed.

(Modification 5) In the above first embodiment and each modification, it is assumed that there are five projection optical systems 19a-19e, but the number of projection optical systems is not limited to five, and may be any number such as three or eight. . In addition, in the above first embodiment and each modification, it is assumed that there are a plurality of projection optical systems 19a to 19e, and the plurality of exposure fields of view SIa to SIE formed by each projection optical system are mutually scanned by one scan in the X direction. Overlap in the Y direction.

However, it is also possible to use one projection optical system, which moves the substrate 22 and the mask 15 in the Y direction, and performs multiple scanning exposures of the substrate 22 in the X direction, so that multiple exposures formed by each scanning exposure The fields overlap each other in the Y direction. In this case, it is desirable that the illumination optical system corresponding to one projection optical system also includes the same configuration as the illumination optical system ILa to the illumination optical system ILe. Furthermore, the device having a plurality of projection optical systems 19a-19e as in the first embodiment and each modification can expose a larger area on the substrate 22 by one scanning exposure, and has excellent processing capability.

In the above first embodiment and each modification example, the plurality of projection optical systems 19a to 19e are configured to include a total refractive optical system, but it is not limited to this, and a catadioptric optical system or a total reflection optical system may also be used. In addition, in the above first embodiment and each modification, the shape of the exposure field of view PIa to the exposure field of view PIe is a trapezoid, but the shape is not limited to a trapezoid. For example, it may be a portion corresponding to the central portion. The shape of is an arc, and the two ends of the arc include the field of view of the right end area and the left end area of the triangle.

In the above first embodiment and each modification example, the optical axis PAXa to the optical axis PAXe of the projection optical systems 19a to 19e, and the optical axis IXa to the optical axis IXe of the illumination optical systems ILa to ILe are basically Set parallel to the Z direction. However, when a deflecting mirror is used in any optical system, the direction of the optical axis becomes non-parallel to the Z direction. In addition, when a deflection mirror is used in any optical system, the moving direction of the light reduction member 10 a to the light reduction member 10 e also becomes a direction different from the scanning direction (X direction) of the substrate 22. However, even in this case, based on the conjugate relationship between the substrate 22 including the deflecting mirror and the fly-eye lens 11a to the fly-eye lens 11e, the light-reducing member 10a to the light-reducing member 10e are set to optically correspond to the substrate 22. Move freely in the direction of the scanning direction.

In addition, in the above embodiments, each of the projection optical systems 19a to 19e is assumed to be a two-row optical system in which the first-row projection optical system 19F and the second-row projection optical system 19R are arranged in the X direction. However, it is not limited to two rows, and three or more optical systems may be arranged in the X direction.

As an optical integrator, a rod integrator can also be used instead of the fly-eye lens 11. In the case of a rod integrator, the conjugate plane CP with the substrate 22 and the mask 15 becomes the emission side (the mask 15 side) of the rod integrator, so the light reduction member 10 is also arranged on the emission side of the rod integrator nearby. In addition, it is configured to partially shield the vicinity of the X-side end of the exit surface of the rod integrator.

The light reduction member 10a-the light reduction member 10e may be arranged in the vicinity of the intermediate image plane 20 of the projection optical system 19a-the projection optical system 19e instead of being arranged in the illumination optical system ILa-the illumination optical system ILe. In this case, the light reduction member is also set in the vicinity of the intermediate image plane 20 to shield the part corresponding to the central area PIac to the central area PIec of the exposure field of view Pia to the exposure field of view PIe.

It is also possible to install an intermediate image plane (conjugate surface with respect to the mask 15) inside the illumination optical system ILa to the illumination optical system ILe, and to install a predetermined substrate 22 on the intermediate image plane in the illumination optical system ILa to the illumination optical system ILe Instead of the above-mentioned field diaphragm of the shape of the exposure field of view PIa-the exposure field of view PIe, the field diaphragm 21a-field diaphragm 21e are arranged in the projection optical system 19a-the projection optical system 19e.

In the above embodiment, it is assumed that the projection optical system 19a to the projection optical system 19e and the illumination optical system ILa to the illumination optical system ILe are fixed, and the substrate 22 is moved by the substrate stage 27. However, the projection The optical system 19a-the projection optical system 19e and the illumination optical system ILa-the illumination optical system ILe are installed on the substrate stage, and the structure which scans the substrate 22 is substituted. In addition, the mask 15 is not limited to a mask with a pattern formed on a glass substrate, and may be a variable-shaping mask including a digital multi-mirror element or a liquid crystal element.

The use of the exposure device 100 can also be applied to an exposure device for liquid crystal that transfers a liquid crystal display element pattern to a square glass plate, for example, an exposure device for manufacturing an organic electroluminescence (EL) panel. In addition, it can also be used for manufacturing not only micro-elements such as semiconductor devices, but also masks or masks for light exposure devices, extreme ultraviolet (EUV) exposure devices, X-ray exposure devices, and electron beam exposure devices. Photomask, and transfer the circuit pattern to the exposure device such as glass substrate or silicon wafer. The substrate (glass plate, etc.) exposed by the exposure device 100 is developed by a developing device not shown, and if necessary, etching processing or the like is performed in accordance with the pattern of the photosensitive material formed by the exposure and development processing.

In addition, the exposure object is not limited to a glass substrate, and may be other objects such as a wafer, a ceramic substrate, a film member, or a blank mask, for example. In addition, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited. For example, a film-like (a flexible sheet-like member) is also included. Furthermore, when a substrate having a length of one side or a diagonal length of 500 mm or more is an exposure target object, the exposure apparatus of the first embodiment and each modification example is particularly effective. Moreover, when the board|substrate of an exposure object is a flexible sheet shape, this sheet may be formed in a roll shape.

According to the first embodiment and each modification example, the following effects can be obtained. (1) The exposure apparatus 100 of the first embodiment or each modification uses the first exposure area (scanning exposure field of view Sia, scanning exposure field of view SIc, scanning exposure field of view SIe) on the substrate 22 to be exposed within the first time. ) Performing the first exposure of exposure and the second exposure of exposing the second exposure area (scanning exposure field of view SIb, scanning exposure field of view SId) on the exposed substrate 22 in a second time different from the first time , Expose the exposed substrate 22, the exposure device includes: illumination optical system ILa ~ illumination optical system ILe, with optical integrator 11a ~ optical integrator 11e, supplying illumination light; projection optical system 19a ~ projection optical system 19e; And the substrate stage 27 moves the exposed substrate 22 relative to the projection optical system 19a to the projection optical system 19e in the scanning direction (X direction) in such a way that a predetermined pattern is exposed on the exposed substrate 22. In addition, it includes: illuminance changing member 10a to illuminance changing member 10e, which are provided at a position where the incident surface 11ai to 11ei of the illuminating light is conjugated to the upper surface of the exposed substrate 22 (conjugate surface CP). The incident surface side of the integrator 11a to the optical integrator 11e is relatively movably arranged with respect to the optical integrator 11a to the optical integrator 11e, and the exposure amount for exposing the second area (overlap part Oa to overlap part Od) , The first area (non-overlapping portion Sa-non-overlapping portion Se) is relatively changed with respect to the other, the illuminance of the illumination light is changed, the second area is exposed An area where a portion of each of the first exposure area and the second exposure area on the substrate 22 overlaps, the first area being an area of other parts of the first exposure area and other parts of the second exposure area; and the control unit 50 The relative movement of the illuminance changing member 10a to the illuminance changing member 10e with respect to the optical integrator 11a to the optical integrator 11e is controlled. Furthermore, the control unit 50 relatively increases the exposure amount in the first area (non-overlapping portion Sa to non-overlapping portion Se) relative to the exposure amount in the second area (overlapping portion Oa to overlapping portion Od), The illuminance changing member 10a to the illuminance changing member 10e are moved relative to the optical integrator. With this configuration, the ratio of the exposure amount of the first area (non-overlapping portion Sa to non-overlapping portion Se) to the exposure amount of the second area (overlapping portion Oa to overlapping portion Od) can be adjusted, and it is possible to prevent transfer to Variation of the line width or thickness of the pattern of the first region and the second region.

(2) The exposure apparatus 100 of the first embodiment or each modification uses the first exposure that exposes the first exposure regions (SIa, SIc, SIe) on the substrate 22 to be exposed within the first time, and the A second exposure in which the second exposure area (SIb, SId) on the exposed substrate 22 is exposed in a second time with a different time, and the exposed substrate 22 is exposed. The exposure device includes: an illumination optical system ILa~ The illumination optical system ILe has an optical integrator 11a to an optical integrator 11e for supplying illumination light; a projection optical system 19a to a projection optical system 19e; and a substrate stage 27, which is exposed in a predetermined pattern on the exposed substrate 22, The exposed substrate 22 is relatively moved in the scanning direction (X direction) with respect to the projection optical system 19a to the projection optical system 19e. Furthermore, it includes: illuminance changing member 10a to illuminance changing member 10e, which are provided on the incident surface side of the optical integrator at a position where the incident surface 11ai to 11ei of the illuminating light is conjugated with the upper surface of the exposed substrate 22 , The optical integrator is relatively movably arranged to change the amount of exposure for the second area (overlapping part Oa-overlapping part Od) and for the first area (non-overlapping part Sa-non-overlapping part Se) The illuminance of the illuminating light is changed by the ratio of one of the exposure amount to the other exposure amount, and the second area is a part of each area of the first exposure area and the second exposure area on the exposed substrate 22 A repeated area, where the first area is the other part of the first exposure area and the other part of the second exposure area; and the control section 50 controls the relative movement of the illuminance changing member with respect to the optical integrator. Furthermore, the control unit 50 relatively moves the illuminance changing member 10a to the illuminance changing member 10e with respect to the optical integrator during the movement of the substrate stage 27 with respect to the projection optical system 19a to the projection optical system 19e. With this configuration, the ratio of the exposure amount of the first area (non-overlapping portion Sa to non-overlapping portion Se) to the exposure amount of the second area (overlapping portion Oa to overlapping portion Od) can be adjusted, and it is possible to prevent transfer to Variation of the line width or thickness of the pattern of the first region and the second region.

(3) The exposure apparatus 100 of the first embodiment or each modified example includes: a projection optical system 19a to a projection optical system 19e; an illumination optical system ILa to an illumination optical system ILe, and an optical integrator 11a to an optical integrator 11e are provided for projection The optical system 19a to the projection optical system 19e supply illuminating light; and the substrate stage 27, which scans the exposed substrate 22 with respect to the projection optical system 19a to the projection optical system 19e in such a manner that a predetermined pattern is exposed on the exposed substrate 22 Relative movement in the direction. Furthermore, it includes: illuminance changing member 10a to illuminance changing member 10e, relative to the amount of exposure in the first area (non-overlapping portion Sa to non-overlapping portion Se), and the amount of light in the second area (overlapping portion Oa to overlapping portion Od) The exposure level of one of the exposure levels is relatively changed to the exposure level of the other. The first area is in the exposure, and the scanning exposure field of view SIa~the scanning exposure field of view SIe of the projection optical system is time-dependent Continuously obtain an exposed area on the exposed substrate 22, the second area being an area discretely exposed in time by scanning the exposure field of view; and the control unit makes the illuminance changing member 10a-the illuminance changing member 10e With respect to the optical integrator, the relative movement is performed in the first direction corresponding to the scanning direction in an optical manner. The optical integrator is arranged on the incident surface 11ai to 11ei of the illuminating light relative to the scanning exposure view on the exposed substrate 22 The field SIa to the scanning exposure field of view SIe becomes the position of the conjugate plane CP. In addition, the control unit 50 relatively increases the exposure amount in the first area (non-overlapping portion Sa to non-overlapping portion Se) relative to the exposure amount in the second area (overlapping portion Oa to overlapping portion Od), The illuminance changing member 10a to the illuminance changing member 10e are moved relative to the optical integrator. With this configuration, the ratio of the exposure amount of the first area (non-overlapping portion Sa to non-overlapping portion Se) to the exposure amount of the second area (overlapping portion Oa to overlapping portion Od) can be adjusted, and it is possible to prevent transfer to Variation of the line width or thickness of the pattern of the first region and the second region.

(4) The exposure apparatus 100 of the first embodiment or each modification includes: a projection optical system 19a to a projection optical system 19e; an illumination optical system ILa to an illumination optical system ILe, and an optical integrator 11a to an optical integrator 11e are provided for the projection The optical system 19a to the projection optical system 19e supply illuminating light; and the substrate stage 27, which scans the exposed substrate 22 with respect to the projection optical system 19a to the projection optical system 19e in such a manner that a predetermined pattern is exposed on the exposed substrate 22 Direction (X direction) for relative movement. Furthermore, it includes: illuminance changing member 10a to illuminance changing member 10e, which are provided at a position where the incident surface 11ai to 11ei of the illuminating light is conjugated with the upper surface of the exposed substrate 22 (conjugate surface CP). The incident surface side of the integrator is relatively movably arranged with respect to the optical integrator to change the exposure amount in the first area (non-overlapping portion Sa to non-overlapping portion Se) and the second area (overlapping portion Oa to overlapping portion Od) The ratio of one of the exposures to the other is to change the illuminance of the illuminating light. The first area is defined by the scanning exposure field of view of the projection optical system 19a to the projection optical system 19e The area on the exposed substrate 22 that is continuously exposed in time, and the second area is an area that is discretely exposed in time by scanning the exposure field of view; and the control unit 50 controls the illuminance changing member 10a~illuminance The relative movement of the changing member 10e with respect to the optical integrator 11a to the optical integrator 11e; the control unit 50 makes the illuminance changing member 10a to the illuminance changing member during the movement of the substrate stage relative to the projection optical system 19a to the projection optical system 19e 10e moves relative to the optical integrator-optical integrator 11a to the optical integrator-optical integrator 11e. With this configuration, it is possible to adjust the ratio of the exposure amount of the first area (non-overlapping portion Sa to non-overlapping portion Se) to the exposure amount of the second area (overlapping portion Oa to overlapping portion Od), which prevents transfer to Variation of the line width or thickness of the pattern of the first region and the second region.

(5) By setting the illuminance changing member 10a to 10e to include the first end dimming member 10cb1, the first end dimming member 10cb2, and the second end dimming member 10cc1, the second end dimming member The configuration of the light member 10cbc can reduce the exposure of the overlapping portion Oa to the overlapping portion Od with high accuracy. The first end light reducing member 10cb1 and the first end light reducing member 10cb2 are provided in the corresponding conjugate plane CP. In the vicinity of the end on the first side in the second direction intersecting the first direction in the portion of the second region (overlapping portion Oa to overlapping portion Od), the second end dimming member 10cc1 and the second end diminish The optical member 10cbc is provided in the vicinity of an end portion on the second side opposite to the first side in the second direction of the portion corresponding to the second region (overlapping portion Oa to overlapping portion Od) in the conjugate surface CP. (6) The control unit 50 is configured to control the first end dimming member 10cb1, the first end dimming member 10cb2, and the second end dimming member 10cc1, and the second end dimming member 10cbc, respectively. The structure in which the light-reducing members move in the first direction can individually adjust the exposure amount of each of the plurality of second regions (overlap part Oa to overlap part Od), and can make the line width or thickness of the transferred pattern more Evenly.

(7) By setting the illuminance changing member 10a to the illuminance changing member 10e as a third light reducing member including a portion corresponding to the first region (non-overlapping portion Sa to non-overlapping portion Se) provided on the conjugate surface CP The configuration of 10ca1 and the third light reduction member 10ca2 can adjust the exposure amount of the first region (non-overlapping portion Sa to non-overlapping portion Se) and the exposure amount of the second region (overlapping portion Oa to overlapping portion Od) with higher accuracy The ratio. (8) By setting the control section 50 to make the third light reduction member 10ca1, the third light reduction member 10ca2 independent of the first end light reduction member 10cb1, the first end light reduction member 10cb2, and the second end light reduction member 10cb2, The configuration in which the light member 10cc1 and the second end light reduction member 10cbc move in the first direction can adjust the exposure amount of the first region (non-overlapping part Sa to non-overlapping part Se) and the second region (overlapping part) with higher accuracy. The ratio of the exposure amount of the part Oa-the overlapping part Od).

Various embodiments and modifications have been described above, but the present invention is not limited to these contents. In addition, each embodiment and modification examples can be applied individually or in combination. Other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention.

The disclosure content of the following priority basic application is incorporated into this case as a quotation. Japanese Patent Application No. 2019-069148 (filed on March 29, 2019)

1: light source 2: Oval mirror 3: Deflection mirror 4: Relay lens 5: Deflection mirror 6: Relay lens 7: Optical fiber 8a, 8b: input lens 9a, 9b, 9ca, 9cb, 9cc: light-reducing member holding part 10a～10e: Dimming member (illuminance changing member) 10ca1, 10ca2: third dimming component 10cb1, 10cb2: first end dimming member 10cc1, 10cc2: second end dimming member 11a～11e: Fly-eye lens (optical integrator) 11ci: incident surface 12a～12e: Condenser lens 13: moving mirror 14: Laser interferometer 15: Mask 16: Mask stage 17: Mask stage platform 19a～19e: Projection optical system 20: Intermediate image surface 21a～21e: Field of view aperture 21bo, 21co: opening 22: substrate 23: Position detection optical system 24: moving mirror 25: Laser interferometer 26: Illumination sensor 27: substrate stage 28: substrate stage platform 50: Control Department 71: incident side 72a, 72b: Injection side 91a, 91b, 91c: Slider 100: Exposure device 110: lens element CP: Conjugate surface E, E1: Exposure ILa～ILe: Illumination optical system IPIc: the corresponding area of the exposure field of view IXa, IXb, PAXa, PAXb: optical axis MIa～MIe: Illuminated field of view MIb2, MIc2: Illumination light Oa～Od: overlapping part PIa～PIe: Exposure field of view PIbc, PIcc: central area PIbl, PIcl: left end area PIbr, PIcr: Right end area PX: Pitch Sa～Se: non-overlapping part SIa～SIe: Scanning exposure field of view SigA, SigB, SigCa, SigCb, SigCc: control signal Wa, Wb, Ws, Wo: width X, Y, Z: direction

FIG. 1 is a side view showing the configuration of the exposure apparatus of the first embodiment. Fig. 2 is a perspective view showing a part of the exposure apparatus of the first embodiment. 3 is an enlarged perspective view showing a fly-eye lens of the exposure apparatus of the first embodiment to a mask. 4 is a diagram showing the relationship between the field of view on the mask of the exposure apparatus of the first embodiment and the field of view on the substrate. Figure 4 (a1), Figure 4 (a2) and Figure 4 (a3) respectively show the field of view on the mask in the projection optical system 19c in Figure 1, the field of view diaphragm in the projection optical system, and the substrate The field of view above, Figure 4 (b1), Figure 4 (b2) and Figure 4 (b3) are respectively showing the field of view on the mask in the projection optical system 19b in Figure 1, the projection optical system A diagram of the field of view inside the aperture and the field of view on the substrate. 5 is a diagram showing an example of the exposure energy irradiated to the substrate and the effective light-sensing amount in the photosensitive material when the exposure device of the first embodiment performs scanning exposure on the substrate. FIG. 5(a) is a diagram showing the exposure field of view on the substrate of each projection optical system, FIG. 5(b) is a diagram showing the exposure area formed on the substrate 22, and FIG. 5(c) is a diagram showing irradiation FIG. 5(d) is a diagram showing another example of the exposure amount to the substrate. FIG. 5(d) is a diagram showing another example of the exposure amount to the substrate. 6 is a view of the fly-eye lens, the light reduction member, and the light reduction member holding portion of the exposure apparatus of the first embodiment viewed from the light source side.

9ca, 9cb, 9cc: light-reducing member holding part

10ca1, 10ca2: third dimming component

10cb1, 10cb2: first end dimming member

10cc1, 10cc2: second end dimming member

11c: Fly-eye lens (optical integrator)

91a, 91b, 91c: Slider

110: lens element

IPIc: The corresponding area of the exposure field of view

PX: Pitch

SigCa, SigCb, SigCc: control signal

Wa, Wb: width

X, Y, Z: direction

Claims (27)

An exposure device that uses a first exposure for exposing a first exposure area on a substrate to be exposed within a first time, and a second time that is different from the first time for exposure on the substrate. The second exposure of the second exposure area is to expose the exposed substrate, and the exposure device includes: Illumination optical system with optical integrator to supply illuminating light; Projection optical system; A substrate stage for relatively moving the exposed substrate relative to the projection optical system in a scanning direction in a manner that a predetermined pattern is exposed on the exposed substrate; The illuminance changing member is arranged on the side of the incident surface of the optical integrator provided at a position where the incident surface of the illumination light and the upper surface of the exposed substrate become conjugate with respect to the optical integrator It can be moved relatively to change the illuminance of the illuminating light so that one of the exposure amount for exposing the second area and the exposure amount for exposing the first area can be changed relative to the other. The second area is an area where a part of each area of the first exposure area and the second exposure area on the exposed substrate overlaps, and the first area is the other part of the first exposure area and all areas. The area of the other part of the second exposure area; and A control unit, which controls the relative movement of the illuminance changing member with respect to the optical integrator; The control unit relatively moves the illuminance changing member with respect to the optical integrator such that the amount of exposure in the first area becomes relatively larger than the amount of exposure in the second area. The exposure apparatus according to claim 1, wherein the control unit relatively moves the illuminance changing member with respect to the optical integrator during the movement of the substrate stage with respect to the projection optical system. An exposure device that uses a first exposure for exposing a first exposure area on a substrate to be exposed within a first time, and a second time that is different from the first time for exposure on the substrate. The second exposure of the second exposure area is to expose the exposed substrate, and the exposure device includes: Illumination optical system with optical integrator to supply illuminating light; Projection optical system; A substrate stage for relatively moving the exposed substrate relative to the projection optical system in a scanning direction in a manner that a predetermined pattern is exposed on the exposed substrate; The illuminance changing member is arranged on the side of the incident surface of the optical integrator provided at a position where the incident surface of the illumination light and the upper surface of the exposed substrate become conjugate with respect to the optical integrator It can be moved relatively to change the illuminance of the illumination light in such a way that the ratio of one of the exposure amount for exposing the second area and the exposure amount for exposing the first area to the other is changed. The second area is an area where a part of each of the first exposure area and the second exposure area on the exposed substrate overlaps, and the first area is the other part of the first exposure area and the The area of the other part of the second exposure area; and A control unit, which controls the relative movement of the illuminance changing member with respect to the optical integrator; The control unit moves the illuminance changing member relative to the optical integrator during the movement of the substrate stage relative to the projection optical system. An exposure device, including: Projection optical system; An illumination optical system having an optical integrator to supply illumination light to the projection optical system; A substrate stage, which moves the exposed substrate relative to the projection optical system in a scanning direction in a manner that a predetermined pattern is exposed on the exposed substrate; The illuminance changing member relatively changes the exposure amount of one of the exposure amount in the first area and the exposure amount in the second area, the first area being in the exposure, The area on the exposed substrate that is continuously exposed in time by the scanning exposure field of view of the projection optical system, and the second area is discretely in time by the scanning exposure field of view The exposed area; and The control unit moves the illuminance changing member relative to the optical integrator in a first direction that optically corresponds to the scanning direction, and the optical integrator is provided on the incident surface of the illumination light with respect to The scanning exposure field of view on the exposed substrate becomes the position of the conjugate plane; The control unit relatively moves the illuminance changing member with respect to the optical integrator such that the amount of exposure in the first area becomes relatively larger than the amount of exposure in the second area. The exposure apparatus according to claim 4, wherein the control unit relatively moves the illuminance changing member with respect to the optical integrator during the movement of the substrate stage with respect to the projection optical system. An exposure device, including: Projection optical system; An illumination optical system having an optical integrator to supply illumination light to the projection optical system; A substrate stage, which moves the exposed substrate relative to the projection optical system in a scanning direction in a manner that a predetermined pattern is exposed on the exposed substrate; The illuminance changing member is arranged on the side of the incident surface of the optical integrator provided at a position where the incident surface of the illumination light and the upper surface of the exposed substrate become conjugate with respect to the optical integrator It can be moved relatively, and the illuminance of the illumination light can be changed by changing the ratio of one of the exposure in the first area and the exposure in the second area to the other, and the first area is borrowed The area on the exposed substrate that is continuously exposed in time by the scanning exposure field of view of the projection optical system, and the second area is obtained discretely in time by the scanning exposure field of view The exposed area; and A control unit, which controls the relative movement of the illuminance changing member with respect to the optical integrator; The control unit moves the illuminance changing member relative to the optical integrator during the movement of the substrate stage relative to the projection optical system. The exposure apparatus according to any one of claim 1 to claim 6, wherein the illuminance changing member includes: The first end light-reducing member is provided near the end on the first side in the second direction of the portion corresponding to the second region in the conjugate surface of the upper surface of the exposed substrate, the The second direction crosses the first direction optically corresponding to the scanning direction; and A second end light-reducing member is provided in the vicinity of an end of a second side opposite to the first side in the second direction of the portion corresponding to the second region in the conjugate surface . The exposure apparatus according to claim 7, wherein the control section respectively controls the first end light reduction member and the second end light reduction member to move in the first direction. The exposure apparatus according to claim 7 or claim 8, wherein the illuminance changing member includes a third light reduction member provided in a portion of the conjugate surface corresponding to the first region. The exposure apparatus according to claim 9, wherein the control section causes the third light reduction member to move toward the first end light reduction member independently of the first end light reduction member and the second end light reduction member. Move in direction. The exposure apparatus according to any one of claims 1 to 6, wherein the illuminance changing member is provided at a position separated by a predetermined distance from the conjugate surface in the optical axis direction of the illumination optical system , The predetermined distance corresponds to the width of the second region in the non-scanning direction orthogonal to the scanning direction, and the lateral magnification of the conjugate surface with respect to the upper surface of the exposed substrate and the exposed substrate , And the numerical aperture of the illumination light in the conjugate surface. The exposure apparatus according to any one of claims 7 to 10, wherein the illuminance changing member is provided at a position separated from the conjugate surface by a predetermined distance in the optical axis direction of the illumination optical system , The predetermined distance corresponds to the width of the second region in the non-scanning direction orthogonal to the scanning direction, the lateral magnification of the conjugate surface and the exposed substrate, and the width of the conjugate surface The numerical aperture of the illumination light is determined. The exposure apparatus according to claim 12, wherein the optical integrator is a fly-eye lens in which a plurality of lens groups are arranged in a second direction crossing the first direction, and the lens group includes A plurality of lens elements in a first direction corresponding to the scanning direction, The first end dimming member dim at least a part of the portion corresponding to the second region of one or more lens elements arranged in at least one of the lens groups, The second end dimming member dims at least a part of a portion corresponding to the second region of one or more lens elements arranged in at least one of the lens groups. The exposure apparatus according to claim 13, wherein the first end dimming member and the second end dimming member each correspond to m (m is 2 or more natural) among the plurality of lens groups. Number) Each lens group is configured with m pieces, One end of the m first end dimming members and the second end dimming member in the first direction is set at a position relative to the lens group The period P of the arrangement of the lens elements in the first direction in the first direction differs from each other by only P/m. The exposure apparatus according to claim 13 or claim 14, wherein the illuminance changing member further includes a third light reduction member, and the third light reduction member is arranged in at least one lens in the lens group At least a part of the part of the element corresponding to the first region is dimmed. The exposure apparatus according to claim 15, wherein the third light reduction member is arranged corresponding to each of the n (n is a natural number of 2) lens groups among the plurality of lens groups, and One end in the first direction of the n first end dimming members and the second end dimming member is set at a position relative to the lens group The period P of the arrangement of the lens elements in the first direction in the first direction differs from each other by only P/n positions. The exposure apparatus according to any one of claims 1 to 16, wherein a plurality of the projection optical system and the illumination optical system are arranged in parallel in a direction crossing the scanning direction, The second area on the exposed substrate is an area where a part of the first exposure area overlaps with a part of the second exposure area, and the first exposure area is during the exposure, by the multiple projections The scanning exposure field of view of the first projection optical system in the optical system obtains the exposed area on the exposed substrate, and the second exposure area is relative to the first projection optical system in the scanning The scanning exposure field of view of the second projection optical system that is separated from the scanning direction and the non-scanning direction orthogonal to the scanning direction obtains the exposed area on the exposed substrate. The exposure apparatus according to claim 17, wherein the first area on the substrate to be exposed is exposed by the scanning exposure field of view of the first projection optical system during the exposure The area of other parts of the first exposure area on the exposed substrate, or other parts of the second exposure area on the exposed substrate that are exposed by the scanning exposure field of view of the second projection optical system Area. A method of component manufacturing includes: Use the exposure device according to any one of claim 1 to 18 to perform exposure processing on the exposed substrate; and The exposed substrate is subjected to development processing. An illuminating optical system is an illuminating optical system used in an exposure device that irradiates illuminating light to a substrate, illuminating a first illuminating area on an object moving in a scanning direction within a first time, and is in contact with the first The illumination light is irradiated on the second illumination area on the object moving in the scanning direction within the second time with different time, and the illumination optical system includes: An optical integrator, arranged at a position where the incident surface of the illumination light and the upper surface of the substrate become conjugate; The illuminance changing member relatively changes the illuminance of the illumination light irradiated on the second area with respect to the illuminance of the illumination light illuminating the first area, the second area being irradiated on the object Among the illumination areas of the illumination light, a part of the illumination areas of the first illumination area and the second illumination area overlaps, and the first area is the other part of the first illumination area and the The lighting area of the other part of the second lighting area; and A control unit, which controls the relative movement of the illuminance changing member with respect to the optical integrator; The control unit moves the illuminance changing member relative to the optical integrator during the movement of the substrate stage relative to the projection optical system. The illumination optical system according to claim 20, wherein the control unit relatively moves the illuminance changing member with respect to the optical integrator during the relative movement of the substrate with respect to the illumination light. An illuminating optical system is an illuminating optical system used in an exposure device that irradiates illuminating light to a substrate, illuminating a first illuminating area on an object moving in a scanning direction within a first time, and is in contact with the first The illumination light is irradiated on the second illumination area on the object moving in the scanning direction within the second time with different time, and the illumination optical system includes: An optical integrator, arranged at a position where the incident surface of the illumination light and the upper surface of the substrate become conjugate; The illuminance changing means changes the illuminance ratio of one of the illuminance of the illuminating light for illuminating the second area and the illuminance of the illuminating light for illuminating the first area to the illuminance of the other, the second An area is an area where a part of each of the first illumination area and the second illumination area on the substrate overlaps, and the first area is the other part of the first illumination area and the second illumination The other parts of the area; and A control unit, which controls the relative movement of the illuminance changing member with respect to the optical integrator; The control unit moves the illuminance changing member relative to the optical integrator during the movement of the substrate stage relative to the projection optical system. The illumination optical system according to any one of claim 20 to claim 22, wherein the illuminance changing member includes: The first end dimming member is provided near an end on the first side in a second direction with respect to a portion of the conjugate surface of the object corresponding to the second region, and the second direction is similar to The optical method corresponds to the first direction crossing of the scanning direction; and A second end light-reducing member is provided at an end of a second side opposite to the first side in the second direction of the portion corresponding to the second illumination area in the conjugate surface nearby. The illumination optical system according to claim 23, wherein the control section respectively controls the first end dimming member and the second end dimming member to move in the first direction. The illumination optical system according to claim 23 or claim 24, wherein the illuminance changing member includes a third light reduction member provided in a portion of the conjugate surface corresponding to the first region. The illumination optical system according to claim 25, wherein the control section causes the third dimming member to move toward the first end dimming member independently of the first end dimming member and the second end dimming member. Move in one direction. An exposure device, comprising: the illumination optical system according to any one of claim 20 to claim 26; and A substrate stage holds the substrate, and moves the substrate relative to the illumination light in a first direction in such a manner that a predetermined pattern of the object is exposed on the substrate.

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