TW202040231A - 基板分斷方法及基板分斷裝置 - Google Patents

基板分斷方法及基板分斷裝置 Download PDF

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Publication number
TW202040231A
TW202040231A TW109103439A TW109103439A TW202040231A TW 202040231 A TW202040231 A TW 202040231A TW 109103439 A TW109103439 A TW 109103439A TW 109103439 A TW109103439 A TW 109103439A TW 202040231 A TW202040231 A TW 202040231A
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TW
Taiwan
Prior art keywords
substrate
breaking
along
scribe
scribed
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TW109103439A
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English (en)
Chinese (zh)
Inventor
西尾仁孝
Original Assignee
日商三星鑽石工業股份有限公司
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Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW202040231A publication Critical patent/TW202040231A/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
TW109103439A 2019-03-19 2020-02-05 基板分斷方法及基板分斷裝置 TW202040231A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019051528A JP2020151911A (ja) 2019-03-19 2019-03-19 基板分断方法及び基板分断装置
JP2019-051528 2019-03-19

Publications (1)

Publication Number Publication Date
TW202040231A true TW202040231A (zh) 2020-11-01

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ID=72557179

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109103439A TW202040231A (zh) 2019-03-19 2020-02-05 基板分斷方法及基板分斷裝置

Country Status (4)

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JP (1) JP2020151911A (ja)
KR (1) KR20200111628A (ja)
CN (1) CN111718117A (ja)
TW (1) TW202040231A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115124230A (zh) * 2022-06-16 2022-09-30 盐城市益维光电科技有限公司 一种自动化led切割设备及其使用方法

Also Published As

Publication number Publication date
KR20200111628A (ko) 2020-09-29
CN111718117A (zh) 2020-09-29
JP2020151911A (ja) 2020-09-24

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