TW202040105A - Vibration sensor - Google Patents

Abstract

Provided is a vibration sensor which can be attached to a curved surface subjected to measurement. An organic piezoelectric element (20) has a first surface and a second surface on the side opposite to the first surface, the organic piezoelectric element being polarized such that a positive charge is distributed on the first surface and a negative charge is distributed on the second surface. A positive electrode layer is made of a metal material and layered on the first surface. A first insulating layer (50) is made of an insulating material and layered on the positive electrode layer. A first shield layer is made of a metal layer and layered on the first insulating layer (50). A cathode layer (40) is made of a metal material and layered on the second surface. A second insulating layer (60) is made of an insulating material and layered on the cathode layer. A second shield layer (80) is made of a metal material and layered on the second insulating layer (60).

Description

Vibration sensor

The invention relates to a vibration sensor.

Previously, regarding the acceleration sensor, a technology of mounting an acceleration detecting element and an electronic circuit on a ceramic substrate and adhering the ceramic cover to the ceramic substrate was proposed (for example, refer to Japanese Patent Laid-Open No. 7-234244 (Patent Document 1)) . [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 7-234244

[The problem to be solved by the invention]

In the structure described in the above-mentioned literature, the space for accommodating the acceleration detection element and the electronic circuit is surrounded by a ceramic substrate and a ceramic cover. Since the ceramic material with a large Young's modulus and not easily deformed forms the housing, the sensor body has no flexibility, and it is difficult to install the sensor on the surface of the curved surface to be measured.

In the present invention, there is provided a vibration sensor that can be installed on a curved surface of a measurement object. [Technical means to solve the problem]

According to the present invention, there is provided a vibration sensor including a thin-film organic piezoelectric element, a positive electrode layer, a first insulating layer, a first shielding layer, a cathode layer, a second insulating layer, and a second shielding layer. The organic piezoelectric element has a first surface and a second surface on the opposite side of the first surface, and is polarized in such a manner that positive charges are concentrated on the first surface and negative charges are concentrated on the second surface. The positive electrode layer is made of metal material and is laminated on the first surface. The first insulating layer is made of insulating material and is laminated on the positive electrode layer. The first shielding layer is made of a metal material and is laminated on the first insulating layer. The cathode layer is made of metal material and is laminated on the second surface. The second insulating layer is made of insulating material and is laminated on the cathode layer. The second shielding layer is made of metal material and is laminated on the second insulating layer.

The vibration sensor further includes a first covering layer and a second covering layer. The first covering layer is made of insulating material and is laminated on the first shielding layer. The second covering layer is made of insulating material and laminated on the second shielding layer.

The above-mentioned vibration sensor further includes an interposing member. The interposition member is laminated on at least a part of the periphery of the second covering layer. In a state where the vibration sensor is attached to the vibration measurement object whose vibration is to be measured by the vibration sensor, the interposition member is interposed between the vibration measurement object and the second covering layer.

The vibration sensor described above includes a mounting member and a connecting member. The mounting member is laminated on the first covering layer. The connecting member is installed on the mounting member and is electrically connected to the positive electrode layer.

In the above-mentioned vibration sensor, the connecting member is mounted on the mounting member by screwing.

The vibration sensor further includes a lead wire. The wire has one end connected to the connecting member and the other end connected to the positive electrode layer.

In the above vibration sensor, the other end of the wire is connected to the positive electrode layer by welding.

The vibration sensor further includes a bolt member that bolts the interposing member and the mounting member.

In the above-mentioned vibration sensor, the bolt member is arranged to penetrate the cathode layer. The cathode layer and the connecting member are electrically connected via a bolt member. [Effects of Invention]

According to the present invention, it is possible to provide a vibration sensor that can be mounted on a curved surface to be measured.

Hereinafter, the embodiment will be described with reference to the drawings. In the following description, the same symbol is attached to the same part. Their names and functions are also the same. Therefore, the detailed description of them will not be repeated.

Fig. 1 is a perspective view of a vibration sensor 1 based on the embodiment. Fig. 2 is a partial cross-sectional view of the vibration sensor 1 shown in Fig. 1. Fig. 3 is a side view of the vibration sensor 1 shown in Fig. 1. Fig. 4 is an exploded perspective view of the vibration sensor 1 shown in Fig. 1. FIG. 5 is an exploded perspective view of the vibration sensor 1 shown in FIG. 1 viewed from different angles. Furthermore, in FIG. 2, the vibration sensor 1 viewed from the direction of arrow II in FIG. 1 is illustrated, and in FIG. 3, the vibration sensor viewed from the direction of arrow III in FIG. 1 is illustrated.器1.

As shown in FIGS. 1 and 2, the vibration sensor 1 includes a sensor unit 10. As shown in FIGS. 4 and 5, the sensor unit 10 has an organic piezoelectric element 20, a positive electrode layer 30, a cathode layer 40, a first insulating layer 50, a second insulating layer 60, a first shielding layer 70, and a second shielding layer. 80. The first covering layer 90 and the second covering layer 100. The sensor section 10 is composed of a second covering layer 100, a second shielding layer 80, a second insulating layer 60, a cathode layer 40, an organic piezoelectric element 20, a positive electrode layer 30, a first insulating layer 50, and a first shielding layer. 70 and the first covering layer 90 are sequentially laminated and joined together to be formed.

As shown in FIGS. 4 and 5, the organic piezoelectric element 20 has a rectangular film shape. The organic piezoelectric element 20 has a pair of long edges forming a rectangular shape and a pair of short edges forming a rectangular shape. FIG. 6 is a schematic diagram showing the polarization of the organic piezoelectric element 20. As shown in FIG. As shown in FIG. 6, the organic piezoelectric element 20 has a first surface 21 and a second surface 23 on the opposite side of the first surface 21. The organic piezoelectric element 20 is polarized in such a manner that positive charges are concentrated on the first surface 21 and negative charges are concentrated on the second surface 23. The organic piezoelectric element 20 is polarized by performing any polarization treatment such as a known corona treatment before assembling the sensor part 10.

As shown in FIG. 5, the positive electrode layer 30 has a film-like shape. The positive electrode layer 30 is laminated on the first surface 21 of the organic piezoelectric element 20. The positive electrode layer 30 is formed of a conductive material, for example, a metal material represented by copper or SUS. As shown in FIG. 5, the positive electrode layer 30 has a body portion 31 having a substantially rectangular shape, and a connecting portion 32 protruding outward from the central portion of the short side of the rectangle of the body portion 31. A connection hole 33 penetrating the positive electrode layer 30 in the thickness direction is formed in the connection portion 32. The connection hole 33 has a circular shape.

As shown in FIG. 4, the cathode layer 40 has a film-like shape. The cathode layer 40 is laminated on the second surface 23 of the organic piezoelectric element 20. The cathode layer 40 is formed of a conductive material, such as a metal material represented by copper or SUS. As shown in FIG. 4, the cathode layer 40 has a main body 41 having a substantially rectangular shape, and two connecting parts 42 protruding outward from both ends of the short sides of the rectangle of the main body 41. Each connecting portion 42 is formed with a coupling hole 44 penetrating the cathode layer 40 in the thickness direction. The coupling hole 44 has a circular shape.

As shown in FIGS. 4 and 5, the first insulating layer 50 has a rectangular film shape. The first insulating layer 50 is laminated on the positive electrode layer 30. The first insulating layer 50 is formed of an electrically insulating material, for example, a resin material represented by polyimide. The first insulating layer 50 has a pair of long edges forming a rectangular shape and a pair of short edges forming a rectangular shape.

One connection hole 53 and two coupling holes 54 penetrating the first insulating layer 50 in the thickness direction are formed near one short edge portion. The connecting hole 53 and the connecting hole 54 each have a circular shape. The connecting hole 53 is formed in the central portion of the short edge portion. The coupling holes 54 are formed at both ends of the short edge portion. The coupling hole 54 is formed at the corner portion of the rectangle. The connection holes 53 and the coupling holes 54 are arranged along the short sides of the rectangle of the first insulating layer 50. The center of the connecting hole 53 and the centers of the two connecting holes 54 are located on a straight line.

The diameter of the connecting hole 53 of the first insulating layer 50 is less than the diameter of the connecting hole 33 of the positive electrode layer 30. In a state where the positive electrode layer 30 and the first insulating layer 50 are laminated, the connection hole 33 of the positive electrode layer 30 and the connection hole 53 of the first insulating layer 50 are arranged concentrically. In the state where the positive electrode layer 30 and the first insulating layer 50 are laminated, the center of the connection hole 33 of the positive electrode layer 30 is consistent with the center of the connection hole 53 of the first insulating layer 50. All the connection holes 53 of the first insulating layer 50 overlap the connection holes 33 of the positive electrode layer 30.

FIG. 7 is a schematic diagram of a laminate of the organic piezoelectric element 20, the positive electrode layer 30, and the first insulating layer 50. As shown in FIG. 7, the organic piezoelectric element 20 overlaps the body portion 31 of the positive electrode layer 30. The connecting portion 32 of the positive electrode layer 30 does not overlap the organic piezoelectric element 20 but protrudes from the short edge of the organic piezoelectric element 20. The connection hole 33 of the positive electrode layer 30 overlaps the connection hole 53 of the first insulating layer 50, and the connection holes 33 and 53 are arranged concentrically. The connection holes 33 and 53 are arranged between the pair of coupling holes 54. A pair of coupling holes 54 sandwich the connecting holes 33 and 53 in the middle. The two connecting holes 54 and the connecting holes 33 and 53 are arranged along the short sides of the rectangle of the first insulating layer 50 such that the distance between the centers of the two connecting holes 54 and the centers of the connecting holes 33 and 53 is equal.

The positive electrode layer 30 and the first insulating layer 50 can be produced by the following method: prepare a commercially available copper foil laminated board formed by bonding copper foil to a polyimide film by thermocompression bonding or the like, and appropriately etch and polymerize it. The imide film and copper foil are patterned.

As shown in FIGS. 4 and 5, the second insulating layer 60 has a rectangular film shape. The second insulating layer 60 is laminated on the cathode layer 40. The second insulating layer 60 is formed of an electrically insulating material, for example, a resin material represented by polyimide. The second insulating layer 60 has a pair of long edges forming a rectangular shape and a pair of short edges forming a rectangular shape.

One connection hole 63 and two coupling holes 64 penetrating the second insulating layer 60 in the thickness direction are formed near one short edge portion. The connecting hole 63 and the connecting hole 64 each have a circular shape. The connecting hole 63 is formed in the central part of the short edge part. The coupling holes 64 are formed at both ends of the short edge portion. The coupling hole 64 is formed at the corner portion of the rectangle. The connecting holes 63 and the connecting holes 64 are arranged along the short sides of the rectangle of the second insulating layer 60. The center of the connecting hole 63 and the center of the two connecting holes 64 are located on a straight line.

The diameter of the coupling hole 64 of the second insulating layer 60 is less than the diameter of the coupling hole 44 of the cathode layer 40. In a state where the cathode layer 40 and the second insulating layer 60 are laminated, the coupling holes 44 of the cathode layer 40 and the coupling holes 64 of the second insulating layer 60 are arranged concentrically. In the state where the cathode layer 40 and the second insulating layer 60 are laminated, the center of the coupling hole 44 of the cathode layer 40 is consistent with the center of the coupling hole 64 of the second insulating layer 60. The bonding holes 64 of the second insulating layer 60 all overlap with the bonding holes 44 of the cathode layer 40.

FIG. 8 is a schematic diagram of a laminate of the organic piezoelectric element 20, the cathode layer 40, and the second insulating layer 60. As shown in FIG. 8, the organic piezoelectric element 20 overlaps the body portion 41 of the cathode layer 40. The connecting portion 42 of the cathode layer 40 does not overlap the organic piezoelectric element 20 but protrudes from the short edge of the organic piezoelectric element 20. The coupling hole 44 of the cathode layer 40 overlaps the coupling hole 64 of the second insulating layer 60, and the coupling holes 44 and 64 are arranged concentrically. The connecting hole 63 is arranged between the pair of connecting holes 44 and 64. A pair of coupling holes 44 and 64 sandwich the connecting hole 63 in the middle. The two connecting holes 44, 64 and the connecting hole 63 are arranged along the short sides of the rectangle of the second insulating layer 60 such that the distance between the centers of the two connecting holes 44, 64 and the center of the connecting hole 63 is equal.

The cathode layer 40 and the second insulating layer 60 can be produced by the following method: prepare a commercially available copper foil laminated board formed by bonding copper foil to a polyimide film by thermocompression bonding or the like, and appropriately etch the polymer The imide film and copper foil are patterned.

As shown in FIG. 5, the first shielding layer 70 has a rectangular film shape. The first shield layer 70 is laminated on the first insulating layer 50. The first shielding layer 70 is formed of a conductive material, for example, a metal material represented by copper or SUS. The first shielding layer 70 has a pair of long edges forming a rectangle with long sides and a pair of short edges forming a rectangle with short sides.

One connection hole 73 and two connection holes 74 penetrating the first shield layer 70 in the thickness direction are formed near one short edge portion. The connecting hole 73 and the coupling hole 74 each have a circular shape. The connecting hole 73 is formed in the central portion of the short edge portion. The coupling holes 74 are formed at both ends of the short edge portion. The coupling hole 74 is formed at the corner portion of the rectangle. The connecting hole 73 and the connecting hole 74 are arranged along the short side of the rectangle of the first shielding layer 70. The center of the connecting hole 73 and the center of the two connecting holes 74 are located on a straight line.

As shown in FIG. 4, the second shielding layer 80 has a rectangular film shape. The second shield layer 80 is laminated on the second insulating layer 60. The second shielding layer 80 is formed of a conductive material, for example, a metal material represented by copper or SUS. The second shielding layer 80 has a pair of long edges forming a rectangular shape and a pair of short edges forming a rectangular shape.

One connection hole 83 and two coupling holes 84 penetrating the second shield layer 80 in the thickness direction are formed in the vicinity of the pair of short edge portions. The connecting hole 83 and the connecting hole 84 each have a circular shape. The connecting hole 83 is formed in the central portion of the short edge portion. The coupling holes 84 are formed at both ends of the short edge portion. The coupling hole 84 is formed at the corner portion of the rectangle. The connecting hole 83 and the connecting hole 84 are arranged along the short side of the rectangle of the second shielding layer 80. The center of the connecting hole 83 and the center of the two connecting holes 84 are located on a straight line.

As shown in FIGS. 4 and 5, the first covering layer 90 has a rectangular film shape. The first covering layer 90 is laminated on the first shielding layer 70. The first covering layer 90 is formed of an electrically insulating material, for example, a resin material represented by polyimide. The first covering layer 90 has a pair of long edges forming a rectangular shape and a pair of short edges forming a rectangular shape.

One connection hole 93 and two connection holes 94 penetrating the first covering layer 90 in the thickness direction are formed near one short edge portion. The connection hole 93 and the coupling hole 94 each have a circular shape. The connecting hole 93 is formed in the central part of the short edge. The coupling holes 94 are formed at both ends of the short edge portion. The coupling hole 94 is formed at the corner portion of the rectangle. The connecting hole 93 and the connecting hole 94 are arranged along the short sides of the rectangle of the first covering layer 90. The center of the connecting hole 93 and the center of the two connecting holes 94 are located on a straight line.

The connecting hole 93 of the first covering layer 90 has the same diameter as the connecting hole 73 of the first shielding layer 70. In a state where the first shielding layer 70 and the first covering layer 90 are laminated, the connecting hole 73 of the first shielding layer 70 and the connecting hole 93 of the first covering layer 90 are arranged concentrically. In the state where the first shielding layer 70 and the first covering layer 90 are laminated, the center of the connecting hole 73 of the first shielding layer 70 is consistent with the center of the connecting hole 93 of the first covering layer 90. All the connection holes 93 of the first cover layer 90 overlap with the connection holes 73 of the first shield layer 70.

The connecting holes 73 and 93 are arranged between the pair of connecting holes 74 and 94. A pair of coupling holes 74 and 94 sandwich the connecting holes 73 and 93 in between. The two connecting holes 74, 94 and the connecting holes 73, 93 are along the first shielding layer 70 and the first covering layer 90 so that the distance between the centers of the two connecting holes 74, 94 and the center of the connecting holes 73, 93 is equal. The short sides of the rectangle are arranged.

The first shielding layer 70 and the first covering layer 90 can be produced by the following method: attaching a polyimide film to a copper foil with a conductive adhesive on one side, and appropriately etching the polyimide film and Copper foil forms a pattern.

As shown in FIGS. 4 and 5, the second covering layer 100 has a rectangular film shape. The second covering layer 100 is laminated on the second shielding layer 80. The second covering layer 100 is formed of an electrically insulating material, for example, a resin material represented by polyimide. The second covering layer 100 has a pair of long edges forming a rectangular shape and a pair of short edges forming a rectangular shape.

One connection hole 103 and two connection holes 104 penetrating the second covering layer 100 in the thickness direction are formed near one short edge portion. The connecting hole 103 and the coupling hole 104 each have a circular shape. The connecting hole 103 is formed in the central portion of the short edge portion. The coupling holes 104 are formed at both ends of the short edge portion. The coupling hole 104 is formed at the corner portion of the rectangle. The connecting hole 103 and the connecting hole 104 are arranged along the short sides of the rectangle of the second covering layer 100. The center of the connecting hole 103 and the center of the two connecting holes 104 are located on a straight line.

The connecting hole 103 of the second covering layer 100 has the same diameter as the connecting hole 83 of the second shielding layer 80. In the state where the second shielding layer 80 and the second covering layer 100 are laminated, the connection holes 83 of the second shielding layer 80 and the connecting holes 103 of the second covering layer 100 are arranged concentrically. In the state where the second shielding layer 80 and the second covering layer 100 are laminated, the center of the connecting hole 83 of the second shielding layer 80 is consistent with the center of the connecting hole 103 of the second covering layer 100. All the connection holes 103 of the second covering layer 100 overlap with the connection holes 83 of the second shield layer 80.

The connecting holes 83 and 103 are arranged between the pair of connecting holes 84 and 104. A pair of coupling holes 84, 104 sandwich the connecting holes 83, 103 in the middle. The two bonding holes 84, 104 and the connecting holes 83, 103 are along the second shielding layer 80 and the second covering layer 100 such that the distance between the centers of the two bonding holes 84, 104 and the centers of the connecting holes 83, 103 is equal. The short sides of the rectangle are arranged.

The second shielding layer 80 and the second covering layer 100 can be produced by the following method: attaching a polyimide film to a copper foil with a conductive adhesive on one side, and appropriately etching the polyimide film and Copper foil forms a pattern.

The sensor section 10 is each laminated with a film-like second covering layer 100, a second shielding layer 80, a second insulating layer 60, a cathode layer 40, an organic piezoelectric element 20, a positive electrode layer 30, a first insulating layer 50, and a second insulating layer. The first shielding layer 70 and the first covering layer 90 are formed in a thin plate shape having flexibility as a whole.

As shown in FIGS. 1 to 5, the vibration sensor 1 further includes an interposing member 110, a mounting member 120, a connecting member 130, a wire 140 and a bolt member 150.

As shown in FIGS. 4 and 5, the interposing member 110 is laminated on the second covering layer 100. The interposing member 110 has a first member 111 laminated on one of the short edges of the second covering layer 100 and a second member 112 laminated on the other short edge of the second covering layer 100. The first member 111 and the second member 112 have a substantially rectangular box-like outer shape.

As shown in FIG. 2, in the state where the vibration sensor 1 is mounted on the vibration measurement object 200 whose vibration is to be measured by the vibration sensor 1, the interposition member 110 is interposed between the vibration measurement object 200 and the sensor portion Between 10. The first member 111 is interposed between the vibration measurement target 200 and the second covering layer 100. The second member 112 is interposed between the vibration measurement target 200 and the second covering layer 100.

The interposition member 110 is formed of an electrically insulating material represented by a resin material. Due to the interposition of the interposing member 110, the sensor section 10 is arranged to be separated from the vibration measurement object 200, and the interposing member 110 has electrical insulation, so that the sensor section 10 and the vibration measurement object can be held 200 electrical insulation. Therefore, the influence of noise from the vibration measurement object 200 on the sensor section 10 is suppressed.

As shown in FIGS. 3 to 5, two coupling holes 114 and a support hole 116 are formed in the first member 111. The coupling hole 114 and the supporting hole 116 each have a circular shape in a plan view. The support hole 116 is formed in the central part of the first member 111. The coupling holes 114 are formed at both end portions of the first member 111. The coupling holes 114 and the supporting holes 116 are arranged along the length direction of the first member 111. The centers of the two coupling holes 114 and the support hole 116 are located on a straight line.

The two coupling holes 114 penetrate the first member 111 in the thickness direction. The support hole 116 is formed by recessing an opposite surface of the outer surface of the first member 111 that faces the sensor portion 10. The supporting hole 116 is a bottomed hole. The support hole 116 does not penetrate the first member 111.

The mounting member 120 is made of a conductive material. As shown in FIGS. 4 and 5, the mounting member 120 is laminated on the first covering layer 90. The mounting member 120 can be attached to the first covering layer 90. A hollow receiving space 121 is formed inside the mounting member 120. A female thread is formed on the engaging surface 122 forming the inner peripheral surface of the receiving space 121. A connecting hole 123 is formed in the mounting member 120, and the connecting hole 123 forms an opening on the engaging surface 122 and an opening on the outer surface of the mounting member 120. The connecting hole 123 communicates with the receiving space 121 and the outside of the mounting member 120. Two coupling holes 124 are further formed in the mounting member 120.

As shown in FIGS. 2 and 4, the connecting member 130 has a core 131, an insulating tube 132 and an outer sheath 133. The core 131 is made of a conductive material and penetrates the connecting member 130. The insulating cylindrical portion 132 is formed of an insulating material represented by resin. The insulating cylindrical portion 132 is interposed between the core portion 131 and the outer sheath portion 133 to electrically insulate the core portion 131 and the outer sheath portion 133.

The sheath 133 is made of a conductive material. The sheath 133 has an engagement surface 134. A male thread is formed on the engagement surface 134. The engaging surface 134 is engaged with the engaging surface 122 of the mounting member 120. The connecting member 130 is installed to the mounting member 120 by screwing. By rotating the connecting member 130 relative to the mounting member 120, the connecting member 130 can be fitted to the mounting member 120. When the connecting member 130 is mounted on the mounting member 120, one end of the core 131 is exposed to the outside, and the other end of the core 131 is disposed in the receiving space 121 inside the mounting member 120.

The wire 140 is made of a conductive material. As shown in FIG. 2, the wire 140 has one end 141 and the other end 142. One end 141 of the wire 140 is connected to the connecting member 130. In more detail, one end 141 is connected to the core 131 of the connecting member 130. One end 141 is connected to the core 131 by welding. The welding part is between the core 131 of the connecting member 130 and one end 141 of the wire 140.

As shown in FIG. 5, the other end 142 of the wire 140 is connected to the positive electrode layer 30. In more detail, the other end 142 is connected to the connection portion 32 of the positive electrode layer 30. The other end 142 is connected to the connecting portion 32 by welding. The welding part is between the connecting part 32 of the positive electrode layer 30 and the other end 142 of the wire 140. The core 131 of the connecting member 130 is electrically connected to the positive electrode layer 30 via a wire 140.

In the assembled state of the vibration sensor 1 shown in FIGS. 1 to 3, the wire 140 passes from the receiving space 121 of the mounting member 120 through the connecting hole 123 of the mounting member 120 and the connecting holes of each layer constituting the sensor section 10 33, 53, 63, 73, 83, 93, 103 are arranged to reach the support hole 116 of the first member 111.

The bolt member 150 is made of a conductive material. The bolt member 150 has a head 151 and a shaft 152. As shown in FIG. 3, the bolt member 150 bolts the intermediate member 110 and the mounting member 120. The shaft portion 152 of the bolt member 150 penetrates the sensor portion 10 and is screwed into the coupling hole 114 of the interposing member 110 and the coupling hole 124 of the mounting member 120. By screwing the bolt member 150 into the interposing member 110 and the mounting member 120 for installation, the sensor portion 10 is pressed up and down by the interposing member 110 and the mounting member 120, and the vibration sensor 1 is assembled.

As shown in FIG. 3, when the bolt member 150 is bolted to the intermediate member 110 and the mounting member 120, the entire head 151 is arranged in the coupling hole 114 of the intermediate member 110. Therefore, when the vibration sensor 1 is attached to the vibration measurement object 200, the bolt member 150 does not hinder the attachment.

The shaft portion 152 of the bolt member 150 penetrates the sensor portion 10. The shaft portion 152 penetrates through the coupling holes 44, 54, 64, 74, 84, 94, and 104 of each layer constituting the sensor portion 10. The shaft 152 penetrates the cathode layer 40. The shaft 152 penetrates the coupling hole 44 formed in the cathode layer 40. The diameter of the coupling hole 44 is set to be equal to or less than the diameter of the shaft 152. When the shaft portion 152 penetrates the coupling hole 44, the edge portion of the coupling hole 44 contacts the shaft portion 152. The cathode layer 40 is electrically connected to the mounting member 120 via a bolt member 150 combined with the mounting member 120. The outer sheath 133 of the connecting member 130 is electrically connected to the cathode layer 40 via the mounting member 120 and the bolt member 150.

Although there are parts that partially overlap with the above description, the characteristic configuration of this embodiment is listed below. As shown in FIGS. 4 and 5, the vibration sensor 1 of the embodiment is provided with a sensor portion 10 having a positive electrode layer 30 sequentially laminated on the first surface 21 of a thin-film organic piezoelectric element 20 , A first insulating layer 50 and a first shielding layer 70, and a cathode layer 40, a second insulating layer 60, and a second shielding layer 80 are sequentially laminated on the second surface 23 of the organic piezoelectric element 20. As shown in FIGS. 1 to 3, the entire sensor portion 10 is formed in a flexible thin plate shape.

In order to make full use of the thin shape and flexibility of the organic piezoelectric element 20, the sensor portion 10 is formed into a thin plate shape, and the sensor portion 10 can be bent and deformed. Thereby, the vibration sensor 1 can be configured to be able to be attached to a measurement target surface having a curved surface. Since the vibration sensor 1 has a thin shape, the vibration sensor 1 can also be arranged in narrow spaces such as between adjacent machines or between machines and a wall. Therefore, the vibration sensor 1 of the embodiment can also be installed in a location where it is difficult to install the previous vibration sensor, and the versatility of the vibration sensor 1 is improved.

Since the vibration sensor 1 is lightweight, the influence of the weight of the vibration sensor 1 on the vibration of the vibration measurement object 200 is reduced, and therefore the vibration can be detected with higher accuracy.

In the sensor unit 10, the positive electrode layer 30 and the cathode layer 40 form positive and negative electrodes, and a first shield layer 70 made of a metal material is laminated on the positive electrode layer 30 and a second shield layer 80 made of a metal material is laminated on the cathode The structure of the layer 40 can reduce the influence of noise on the vibration sensor 1. Therefore, the vibration detection accuracy of the vibration sensor 1 of the embodiment can be improved. Since the first insulating layer 50 is interposed between the positive electrode layer 30 and the first shield layer 70, the positive electrode layer 30 and the first shield layer 70 can be reliably electrically insulated. Similarly, by interposing the second insulating layer 60 between the cathode layer 40 and the second shield layer 80, the cathode layer 40 and the second shield layer 80 can be reliably electrically insulated.

In addition, as shown in FIGS. 4 and 5, the vibration sensor 1 further includes a first covering layer 90 laminated on the first shielding layer 70 and a second covering layer 100 laminated on the second shielding layer 80. The first covering layer 90 and the second covering layer 100 made of resin material such as polyimide are laminated on the first shielding layer 70 and the second shielding layer 80 made of a metal material, respectively, and the sensor portion is formed of the resin material The outermost layer of 10 can improve the rust resistance and chemical resistance of the sensor part 10.

Moreover, as shown in FIGS. 1 to 5, the vibration sensor 1 further includes an interposing member 110. As shown in FIG. 2, the interposing member 110 is interposed between the second covering layer 100 of the sensor section 10 and the vibration measurement object 200. Since the interposing member 110 is interposed, the sensor unit 10 is arranged to be separated from the vibration measurement target 200. Therefore, the electrical insulation between the sensor unit 10 and the vibration measurement object 200 can be maintained, and the influence of noise from the vibration measurement object 200 on the vibration sensor 1 can be reduced.

By fixing the magnet plate to the interposing member 110 and attaching the interposing member 110 to the vibration measurement object 200 using magnetic force, or bonding the interposing member 110 and the vibration measurement object 200 with bonding tape such as double-sided tape, or By attaching the interposition member 110 to the vibration measurement object 200 or the like, the vibration sensor 1 can be easily attached to the vibration measurement object 200 without affecting the sensor unit 10.

Moreover, as shown in FIGS. 1 to 5, a connecting member 130 electrically connected to the positive electrode layer 30 is mounted on the mounting member 120 laminated on the first covering layer 90. The detection result of the vibration of the vibration measurement object detected by the vibration sensor 1 can be output to the outside via the connection member 130. If the core part 131 of the connecting member 130 is connected to the charge converter, the charge signal can be converted into a voltage signal by the charge converter, and the detection result of vibration can be output as a voltage. As the connecting member 130, a commercially available product such as a 10-32 connector can be used economically. In this case, the manufacturing cost of the vibration sensor 1 can be reduced.

In addition, the connecting member 130 is attached to the mounting member 120 by screwing. The connecting member 130 can be easily mounted on the mounting member 120 only by rotating the connecting member 130. Since no special tools or welding are required, the assembly time of the vibration sensor 1 can be shortened.

Moreover, as shown in FIGS. 2 and 5, one end 141 of the wire 140 is electrically connected to the connecting member 130, and the other end 142 of the wire 140 is connected to the positive electrode layer 30. With this structure, the positive electrode layer 30 and the connection member 130 can be reliably electrically connected via the lead wire 140.

In addition, the other end 142 of the wire 140 is connected to the positive electrode layer 30 by welding. With this structure, the lead wire 140 can be reliably fixed to the positive electrode layer 30 by welding, and the electrical connection between the positive electrode layer 30 and the connecting member 130 via the lead wire 140 can be ensured.

In addition, as shown in FIG. 3, the bolt member 150 bolts the interposing member 110 and the mounting member 120. By mounting the bolt member 150 in the coupling hole 114 of the interposing member 110 so as to penetrate the sensor portion 10 and screw into the coupling hole 124 of the mounting member 120, the vibration sensor 1 can be easily assembled as a whole.

In addition, the bolt member 150 is arranged to penetrate the cathode layer 40, and the cathode layer 40 and the connecting member 130 are electrically connected via the bolt member 150. When the bolt member 150 is used to bolt the vibration sensor 1, since the shaft portion 152 of the bolt member 150 is in contact with the cathode layer 40, the cathode layer 40 and the connecting member 130 are electrically connected through the bolt member 150. Since there is no need to provide a dedicated step to electrically connect the cathode layer 40 and the connecting member 130, it is possible to shorten the assembly work time of the vibration sensor 1 and improve the productivity.

Above, the embodiment has been described, but the embodiment disclosed this time is an example in all respects and is not restrictive. The scope of the present invention is indicated by the scope of the patent application rather than the above description, and is intended to include the meaning equivalent to the scope of the patent application and all changes within the scope. [Industrial availability]

The vibration sensor of the present invention can be preferably applied to the following applications: multiple vibration sensors are installed in a vibration measurement object such as a machine or factory, and the vibration tendency of the vibration measurement object is verified in a time series for prediction Sexual maintenance.

1: Vibration sensor 10: Sensor section 20: Organic piezoelectric element 21: Side 1 23: Side 2 30: positive layer 31, 41: body part 32, 42: connecting part 33,53,63,73,83,93,103,123: connecting hole 40: Cathode layer 41: body part 42: Connection part 44,54,64,74,84,94,104,114,124: Combination hole 50: The first insulating layer 53,83,93,103: connecting hole 60: 2nd insulating layer 70: first shielding layer 80: 2nd shielding layer 90: 1st covering layer 100: 2nd covering layer 110: Intermediate component 111: first member 112: The second member 116: Support hole 120: Installation components 121: installation space 122,134: engagement surface 130: connecting member 131: Core 132: Insulated cylinder 133: Outer Sheath 140: Wire 141: One end 142: The other end 150: Bolt member 151: Head 152: Shaft 200: Vibration measurement object

Figure 1 is a perspective view of a vibration sensor based on the embodiment. Fig. 2 is a partial cross-sectional view of the vibration sensor shown in Fig. 1. Figure 3 is a side view of the vibration sensor shown in Figure 1. Fig. 4 is an exploded perspective view of the vibration sensor shown in Fig. 1. Fig. 5 is an exploded perspective view of the vibration sensor shown in Fig. 1 viewed from different angles. Fig. 6 is a schematic diagram showing the polarization of the organic piezoelectric element. Fig. 7 is a schematic diagram of a laminate of an organic piezoelectric element, a positive electrode layer, and a first insulating layer. Fig. 8 is a schematic diagram of a laminate of an organic piezoelectric element, a cathode layer, and a second insulating layer.

10: Sensor section

20: Organic piezoelectric element

40: Cathode layer

41: body part

42: Connection part

44,54,64,84,94,104,114,124: Combination hole

50: The first insulating layer

53,63,83,93,103,123: connecting hole

60: 2nd insulating layer

80: 2nd shielding layer

90: 1st covering layer

100: 2nd covering layer

110: Intermediate component

111: first member

112: The second member

116: Support hole

120: Installation components

122,134: engagement surface

130: connecting member

131: Core

132: Insulated cylinder

133: Outer Sheath

140: Wire

150: Bolt member

151: Head

152: Shaft

Claims (9)

A vibration sensor, which has: A thin-film organic piezoelectric element having a first surface and a second surface on the opposite side of the first surface, and having positive charges on the first surface and negative charges on the second surface Be polarized The positive electrode layer, which is made of a metal material, is laminated on the first surface; The first insulating layer, which is made of insulating material, is laminated on the positive electrode layer; The first shielding layer, which is made of metal material, is laminated on the above-mentioned first insulating layer; The cathode layer, which is made of a metal material, is laminated on the second surface; The second insulating layer, which is made of insulating material, is laminated on the cathode layer; and The second shielding layer is made of a metal material and is laminated on the second insulating layer. Such as the vibration sensor of claim 1, which further has: The first covering layer, which is made of insulating material, is laminated on the above-mentioned first shielding layer; and The second covering layer is made of an insulating material and is laminated on the second shielding layer. Such as the vibration sensor of claim 2, which further includes an interposing member laminated on at least a part of the peripheral portion of the second covering layer, and the vibration sensor is mounted on the vibration sensor to be sensed by the vibration In the state of the vibration measurement object whose vibration is measured by the device, it is interposed between the vibration measurement object and the second coating layer. Such as the vibration sensor of claim 3, which has: The mounting member is laminated on the above-mentioned first covering layer; and The connecting member is mounted on the mounting member and is electrically connected to the positive electrode layer. The vibration sensor of claim 4, wherein the connecting member is mounted on the mounting member by screwing. The vibration sensor of claim 4 or 5 further includes a wire having one end connected to the connecting member and the other end connected to the positive electrode layer. The vibration sensor of claim 6, wherein the other end is connected to the positive electrode layer by welding. Such as the vibration sensor of claim 4 or 5, which further includes a bolt member that bolts the interposing member and the mounting member. For the vibration sensor of claim 8, the bolt member is arranged to penetrate the cathode layer, The cathode layer and the connecting member are electrically connected via the bolt member.

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