TW202035486A - Photosensitive resin composition, polymer, pattern, color filter, black matrix, display device and image sensor - Google Patents

Photosensitive resin composition, polymer, pattern, color filter, black matrix, display device and image sensor Download PDF

Info

Publication number
TW202035486A
TW202035486A TW109102806A TW109102806A TW202035486A TW 202035486 A TW202035486 A TW 202035486A TW 109102806 A TW109102806 A TW 109102806A TW 109102806 A TW109102806 A TW 109102806A TW 202035486 A TW202035486 A TW 202035486A
Authority
TW
Taiwan
Prior art keywords
polymer
structural unit
group
photosensitive resin
resin composition
Prior art date
Application number
TW109102806A
Other languages
Chinese (zh)
Inventor
田邊潤壱
久保山俊治
Original Assignee
日商住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW202035486A publication Critical patent/TW202035486A/en

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/08Anhydrides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04Acids; Metal salts or ammonium salts thereof
    • C08F220/06Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/04Anhydrides, e.g. cyclic anhydrides
    • C08F222/06Maleic anhydride
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • C08F8/14Esterification
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133512Light shielding layers, e.g. black matrix
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133514Colour filters
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007Filters, e.g. additive colour filters; Components for display devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Optical Filters (AREA)
  • Liquid Crystal (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The invention provides a photosensitive resin composition containing a polymer having a first structural unit represented by general formula (1), and having an acid value of 70 to 300 mg KOH/g and a double bond equivalent of 100 to 500 g/mol. In addition, the invention provides a polymer having a first structural unit represented by general formula (1), and having an acid value of 70 to 300 mg KOH/g and a double bond equivalent of 100 to 500 g/mol. In general formula (1), RD represents a group containing a polymeric carbon-carbon double bond.

Description

感光性樹脂組成物、聚合物、圖案、濾色器、黑矩陣、顯示裝置及成像元件Photosensitive resin composition, polymer, pattern, color filter, black matrix, display device and imaging element

本發明係關於感光性樹脂組成物、聚合物、圖案、濾色器、黑矩陣、顯示裝置及成像元件。The present invention relates to photosensitive resin compositions, polymers, patterns, color filters, black matrices, display devices, and imaging elements.

顯示裝置(液晶顯示器等)或成像元件(CCD、CMOS等)通常具備濾色器或黑矩陣。 在濾色器或黑矩陣的形成中使用感光性樹脂組成物之情況較多。具體而言,藉由光硬化性感光性樹脂組成物於基板上形成感光性樹脂膜,並對該膜進行曝光-顯影而於基板上形成濾色器或黑矩陣等圖案。Display devices (liquid crystal displays, etc.) or imaging elements (CCD, CMOS, etc.) usually have color filters or black matrixes. In many cases, a photosensitive resin composition is used in the formation of a color filter or a black matrix. Specifically, a photosensitive resin film is formed on a substrate from a photocurable photosensitive resin composition, and the film is exposed and developed to form a pattern such as a color filter or a black matrix on the substrate.

專利文獻1中記載有一種硬化性聚合物,其於分子中含有酸基、聚合性不飽和基及封端異氰酸酯基,酸值係20~300mgKOH/g,不飽和基當量係100~4,000g/mol,且封端異氰酸酯基當量係400~6,000g/mol。又,記載有使用該硬化性聚合物而形成濾色器。Patent Document 1 describes a curable polymer containing an acid group, a polymerizable unsaturated group, and a blocked isocyanate group in the molecule, the acid value is 20 to 300 mgKOH/g, and the unsaturated group equivalent is 100 to 4,000 g/ mol, and the equivalent weight of blocked isocyanate groups is 400-6,000 g/mol. Furthermore, it is described that a color filter is formed using this curable polymer.

專利文獻2中記載有使用重均分子量係1000~6000,酸值係80~200mgKOH/g,乙烯性不飽和鍵當量係500以下的黏合劑樹脂而形成黑矩陣。Patent Document 2 describes that a binder resin having a weight average molecular weight of 1000 to 6000, an acid value of 80 to 200 mgKOH/g, and an ethylenically unsaturated bond equivalent of 500 or less is used to form a black matrix.

專利文獻3中記載有一種感光性樹脂,其藉由使包含「不具有羧基之式量70~120的乙烯性不飽和單體與含有羧基之乙烯性不飽和單體」之乙烯性不飽和單體自由基聚合而成之共聚物中的羧基1mol與0.2~0.9mol的含有環氧基之乙烯性不飽和單體中環氧基反應而得。又,記載有一種感光性組成物,其含有該感光性樹脂。進而,記載有使用該感光性組成物而形成濾色器。 專利文獻3中記載有感光性樹脂的酸值較佳為20~200mgKOH/g。又,記載有感光性樹脂的雙鍵當量較佳為300~1000。Patent Document 3 describes a photosensitive resin obtained by making an ethylenically unsaturated monomer containing an ethylenically unsaturated monomer having a formula weight of 70 to 120 without a carboxyl group and an ethylenically unsaturated monomer containing a carboxyl group. It is obtained by reacting 1 mol of the carboxyl group in the copolymer formed by bulk radical polymerization with the epoxy group in the 0.2-0.9 mol epoxy-containing ethylenically unsaturated monomer. In addition, a photosensitive composition containing the photosensitive resin is described. Furthermore, it is described that a color filter is formed using this photosensitive composition. Patent Document 3 describes that the acid value of the photosensitive resin is preferably 20 to 200 mgKOH/g. Moreover, it is stated that the double bond equivalent of the photosensitive resin is preferably 300 to 1,000.

專利文獻4中記載有一種使由特定的通式表示之含有羧基之聚合物與(i)具有與羧酸反應之基團和乙烯性不飽和基之化合物或(ii)具有與羧酸反應之基團和矽系官能基之化合物反應而得的鹼溶性樹脂及含有該鹼溶性樹脂之感光性樹脂組成物。又,記載有使用該感光性樹脂組成物而形成濾色器。 專利文獻4中記載有鹼溶性樹脂的酸值較佳為25~100mgKOH/g,乙烯性不飽和基當量較佳為50~400。Patent Document 4 describes a method of combining a carboxyl group-containing polymer represented by a specific general formula with (i) a compound having a group reactive with carboxylic acid and an ethylenically unsaturated group or (ii) having a compound reactive with carboxylic acid An alkali-soluble resin obtained by reacting a compound with a silicon-based functional group and a photosensitive resin composition containing the alkali-soluble resin. Furthermore, it is described that a color filter is formed using this photosensitive resin composition. Patent Document 4 describes that the acid value of the alkali-soluble resin is preferably 25-100 mgKOH/g, and the ethylenically unsaturated group equivalent is preferably 50-400.

[專利文獻1]國際公開第2014/141731號 [專利文獻2]日本特開2015-197619號公報 [專利文獻3]日本特開2011-33951號公報 [專利文獻4]日本特開2007-264433號公報[Patent Document 1] International Publication No. 2014/141731 [Patent Document 2] Japanese Patent Application Publication No. 2015-197619 [Patent Document 3] JP 2011-33951 A [Patent Document 4] JP 2007-264433 A

當使用感光性樹脂組成物,尤其使用負型感光性樹脂組成物而形成圖案時,曝光部的光硬化的容易度(亦即靈敏度)與未曝光部對顯影液的溶解容易度(顯影性)往往成為權衡關係。 尤其,最近以液晶顯示裝置或固體攝像元件的進一步複雜化、微細化等為背景而需要兼備高水準的靈敏度和顯影性。When a photosensitive resin composition is used, especially a negative photosensitive resin composition is used to form a pattern, the ease of photocuring (ie sensitivity) of the exposed portion and the ease of solubility of the unexposed portion in the developer (developing property) Often becomes a trade-off relationship. In particular, in recent years, it is necessary to have both high-level sensitivity and developability against the background of further complication and miniaturization of liquid crystal display devices and solid-state imaging elements.

本發明人等此次以提供兼備靈敏度和顯影性的感光性樹脂組成物為目的之一而進行了研究。The inventors of the present invention conducted studies this time with one of the objectives of providing a photosensitive resin composition having both sensitivity and developability.

本發明人等進行深入研究之結果,完成了以下提供之發明。As a result of intensive research conducted by the inventors, the invention provided below was completed.

依本發明,提供如下者。According to the present invention, the following are provided.

1. 一種感光性樹脂組成物,其含有如下聚合物,前述聚合物具有由以下通式(1)表示之第一結構單元,酸值係70~300mgKOH/g,且雙鍵當量係100~500g/mol。

Figure 02_image003
通式(1)中,RD 係含有聚合性碳-碳雙鍵之基團。 2. 如1.之感光性樹脂組成物,其中, 前述第一結構單元包含RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元。 3. 如1.或2.之感光性樹脂組成物,其中, 前述第一結構單元包含:RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元、和RD 係僅含有1個聚合性碳-碳雙鍵之基團之結構單元。 4. 如1.~3.中任一項之感光性樹脂組成物,其中, 前述聚合物還包含由以下式(MA)表示之第二結構單元。
Figure 02_image005
5. 如1.~4.中任一項之感光性樹脂組成物,其中, 前述聚合物還包含具有環狀烴骨架之結構單元。 6. 如1.~5.中任一項之感光性樹脂組成物,其中, 前述聚合物的總結構單元中的前述第一結構單元的比率係10~40mol%。 7. 如1.~6.中任一項之感光性樹脂組成物,其中, 前述聚合物的重均分子量係6,000~25,000。 8. 如1.~7.中任一項之感光性樹脂組成物,其還含有著色劑。 9. 如1.~7.中任一項之感光性樹脂組成物,其還含有遮光劑。 10. 一種聚合物,其具有由以下通式(1)表示之第一結構單元,酸值係70~300mgKOH/g,且雙鍵當量係100~500g/mol。
Figure 02_image003
通式(1)中,RD 係含有聚合性碳-碳雙鍵之基團。 11. 如10.之聚合物,其中, 前述第一結構單元包含RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元。 12. 如10.或11.之聚合物,其中 前述第一結構單元包含:RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元、和RD 係僅含有1個聚合性碳-碳雙鍵之基團之結構單元。 13. 如10.~12.中任一項之感光性樹脂組成物,其還包含由以下式(MA)表示之第二結構單元。
Figure 02_image005
14. 如10.~13.中任一項之聚合物,其還包含具有環狀烴骨架之結構單元。 15. 如10.~14.中任一項之聚合物,其中, 總結構單元中的前述第一結構單元的比率係10~40mol%。 16. 如10.~15.中任一項之聚合物,其重均分子量係6,000~25,000。 17. 一種圖案,其使用1.~7.中任一項之感光性樹脂組成物而得。 18. 一種濾色器,其使用8.之感光性樹脂組成物而得。 19. 一種顯示裝置,其具備18.之濾色器。 20. 一種成像元件,其具備18.之濾色器。 21. 一種黑矩陣,其使用9.之感光性樹脂組成物而得。 22. 一種顯示裝置,其具備21.之黑矩陣。 23. 一種成像元件,其具備21.之黑矩陣。1. A photosensitive resin composition containing a polymer having a first structural unit represented by the following general formula (1), an acid value of 70 to 300 mgKOH/g, and a double bond equivalent of 100 to 500 g /mol.
Figure 02_image003
In the general formula (1), R D is a group containing a polymerizable carbon-carbon double bond. 2. The photosensitive resin composition according to 1., wherein the first structural unit includes a structural unit having an R D group containing two or more polymerizable carbon-carbon double bonds. 3. The photosensitive resin composition of 1. or 2., wherein the aforementioned first structural unit includes: an R D- based structural unit of a group containing two or more polymerizable carbon-carbon double bonds, and an R D- based A structural unit containing only one polymerizable carbon-carbon double bond group. 4. The photosensitive resin composition according to any one of 1. to 3., wherein the polymer further includes a second structural unit represented by the following formula (MA).
Figure 02_image005
5. The photosensitive resin composition according to any one of 1. to 4., wherein the polymer further includes a structural unit having a cyclic hydrocarbon skeleton. 6. The photosensitive resin composition according to any one of 1. to 5., wherein the ratio of the first structural unit in the total structural unit of the polymer is 10 to 40 mol%. 7. The photosensitive resin composition according to any one of 1. to 6., wherein the weight average molecular weight of the polymer is 6,000 to 25,000. 8. The photosensitive resin composition according to any one of 1. to 7. which further contains a colorant. 9. The photosensitive resin composition of any one of 1. to 7. which further contains a sunscreen. 10. A polymer having the first structural unit represented by the following general formula (1), the acid value is 70-300 mgKOH/g, and the double bond equivalent is 100-500 g/mol.
Figure 02_image003
In the general formula (1), R D is a group containing a polymerizable carbon-carbon double bond. 11. The polymer according to 10., wherein the first structural unit includes a structural unit of an R D group containing two or more polymerizable carbon-carbon double bonds. 12. The polymer of 10. or 11., wherein the aforementioned first structural unit includes: Rd is a structural unit of a group containing more than two polymerizable carbon-carbon double bonds, and R D contains only one The structural unit of the group of polymerizable carbon-carbon double bond. 13. The photosensitive resin composition according to any one of 10. to 12., which further includes a second structural unit represented by the following formula (MA).
Figure 02_image005
14. The polymer of any one of 10.-13., which further comprises a structural unit having a cyclic hydrocarbon skeleton. 15. The polymer of any one of 10.-14., wherein the ratio of the aforementioned first structural unit in the total structural unit is 10-40 mol%. 16. The polymer of any one of 10.-15. has a weight average molecular weight of 6,000-25,000. 17. A pattern obtained by using the photosensitive resin composition of any one of 1. to 7. 18. A color filter obtained by using the photosensitive resin composition of 8. 19. A display device with the color filter of 18. 20. An imaging element with the color filter of 18. 21. A black matrix obtained by using the photosensitive resin composition of 9. 22. A display device with a black matrix of 21. 23. An imaging element with a black matrix of 21.

依本發明,可提供一種兼備靈敏度和顯影性之感光性樹脂組成物。又,可提供適宜製造該等感光性樹脂組成物的之聚合物。According to the present invention, a photosensitive resin composition having both sensitivity and developability can be provided. In addition, it is possible to provide polymers suitable for the production of such photosensitive resin compositions.

以下,參考圖式對本發明的實施形態進行詳細說明。 在所有的圖式中,對相同的構成要件標註相同的符號,並適當地省略其說明。 為了避免複雜,當同一圖式內存在複數個相同的構成要件時,有時僅對其中1個標註符號而不對所有的構成要件標註符號。 圖式僅用於說明。圖式中的各部件的形狀或尺寸比等並不一定與真實物品對應。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings, the same components are denoted by the same symbols, and their descriptions are appropriately omitted. In order to avoid complexity, when there are multiple identical constituent elements in the same schema, sometimes only one of the constituent elements is marked with a symbol instead of all constituent elements. The diagram is for illustration only. The shape or size ratio of each part in the drawing does not necessarily correspond to the real article.

本說明書中,“雙鍵當量”的“雙鍵”係指聚合性碳-碳雙鍵。 本說明書中,除非另有說明,則“大致”這一術語表示包括考慮了製造公差或組裝偏差等的範圍。 本說明書中,除非另有說明,則數值範圍的說明中的“a~b”的標記表示a以上b以下。例如“1~5質量%”表示“1質量%以上5質量%以下”。In this specification, the "double bond" of the "double bond equivalent" means a polymerizable carbon-carbon double bond. In this specification, unless otherwise specified, the term "approximately" means that a range that takes into account manufacturing tolerances or assembly deviations, etc. is included. In this specification, unless otherwise specified, the symbols "a to b" in the description of the numerical range indicate a or more and b or less. For example, "1 to 5 mass%" means "1 mass% or more and 5 mass% or less".

在本說明書中的基團(原子團)的標記中,未記載經取代或未經取代之標記包含不具有取代基之基團和具有取代基之基團這兩者。例如“烷基”不僅包含不具有取代基之烷基(未經取代烷基),還包含具有取代基之烷基(經取代烷基)。 本說明書中的“(甲基)丙烯酸”這一標記表示包含丙烯酸和甲基丙烯酸這兩者的概念。關於“(甲基)丙烯酸酯”等相似的標記亦相同。 除非另有說明,則本說明書中的“有機基”這一詞係指從有機化合物去除1個以上的氫原子而成之原子團。例如,“1價有機基”係指從任意有機化合物去除1個氫原子而成之原子團。In the label of the group (atomic group) in the present specification, there is no description that the substituted or unsubstituted label includes both a group having no substituent and a group having a substituent. For example, "alkyl" includes not only unsubstituted alkyl (unsubstituted alkyl), but also substituted alkyl (substituted alkyl). The notation of "(meth)acrylic acid" in this specification means a concept including both acrylic acid and methacrylic acid. The same applies to similar marks such as "(meth)acrylate". Unless otherwise specified, the term "organic group" in this specification refers to an atomic group obtained by removing one or more hydrogen atoms from an organic compound. For example, the "monovalent organic group" refers to an atomic group obtained by removing one hydrogen atom from any organic compound.

<感光性樹脂組成物> 本實施形態的感光性樹脂組成物含有如下聚合物,該聚合物具有由以下通式(1)表示之第一結構單元,酸值係70~300mgKOH/g,且雙鍵當量係100~500g/mol。 通式(1)中,RD 係含有聚合性碳-碳雙鍵之基團。<Photosensitive resin composition> The photosensitive resin composition of the present embodiment contains a polymer having a first structural unit represented by the following general formula (1), an acid value of 70 to 300 mgKOH/g, and a double The bond equivalent is 100~500g/mol. In the general formula (1), R D is a group containing a polymerizable carbon-carbon double bond.

Figure 02_image003
Figure 02_image003

藉由使用上述聚合物而製造感光性樹脂組成物,能夠得到兼備靈敏度和顯影性之感光性樹脂組成物。關於其理由,能夠如下進行說明。 此外,本發明不應解釋為受以下說明的限制。By producing a photosensitive resin composition using the above-mentioned polymer, a photosensitive resin composition having both sensitivity and developability can be obtained. The reason can be explained as follows. In addition, the present invention should not be interpreted as being limited by the following description.

由通式(1)表示之結構單元於1個結構單元中包含含有聚合性碳-碳雙鍵之基團(通式中的RD )與羧基這“兩者”。 聚合性基團與羧基在同一結構單元內,藉此容易將聚合物中的聚合性基團的量與羧基的量這“兩者”設計成大值(認為(甲基)丙烯酸系樹脂等其他樹脂中難以進行該種設計)。該情況在提高靈敏度的同時還提高顯影性之方面有利。The structural unit represented by the general formula (1) includes "both" of a polymerizable carbon-carbon double bond-containing group (R D in the general formula) and a carboxyl group in one structural unit. The polymerizable group and the carboxyl group are in the same structural unit, so it is easy to design the "both" of the polymerizable group and the carboxyl group to a large value (think (meth)acrylic resin, etc.) This kind of design is difficult in resin). This case is advantageous in terms of improving the sensitivity and also improving the developability.

並且,作為聚合物整體,將酸值設計成70~300mgKOH/g,將雙鍵當量設計成100~500g/mol,藉此能夠兼備高水準的靈敏度和顯影性。 亦即,聚合物的酸值係70mgKOH/g以上,藉此能夠得到良好的顯影性。又,雙鍵當量係500g/mol以下,藉此能夠提高組成物的靈敏度。In addition, as the entire polymer, the acid value is designed to be 70 to 300 mgKOH/g, and the double bond equivalent is designed to be 100 to 500 g/mol, thereby achieving both high-level sensitivity and developability. That is, the acid value of the polymer is 70 mgKOH/g or more, whereby good developability can be obtained. In addition, the double bond equivalent is 500 g/mol or less, which can improve the sensitivity of the composition.

此外,若酸值過大,則用鹼顯影液進行顯影時,有可能曝光部分易溶解而導致光硬化中所需要的曝光量增加,或者圖案形狀變得不夠充分。因此,本實施形態中,將酸值的上限值設為300mgKOH/g。 又,若雙鍵當量過小(亦即,聚合物中的雙鍵的密度過大),則用鹼顯影液進行顯影時,存在未曝光部或低曝光部變得不易溶解的傾向,在顯影時往往會產生殘膜。又,若雙鍵當量過小,則有可能因交聯而分子量過度增大,且溶解性過度降低等。因此,本實施形態中將雙鍵當量的下限值設為100g/mol。In addition, if the acid value is too large, when developing with an alkali developer, the exposed portion is easily dissolved, which may increase the amount of exposure required for photohardening, or the pattern shape may become insufficient. Therefore, in this embodiment, the upper limit of the acid value is set to 300 mgKOH/g. In addition, if the double bond equivalent is too small (that is, the density of the double bonds in the polymer is too large), the unexposed or low-exposure part tends to become difficult to dissolve during development with an alkali developer, and this tends to occur during development. Will produce residual film. In addition, if the double bond equivalent is too small, the molecular weight may increase excessively due to crosslinking, and the solubility may decrease excessively. Therefore, in this embodiment, the lower limit of the double bond equivalent is set to 100 g/mol.

聚合物的酸值為70~300mgKOH/g,較佳為80~200mgKOH/g。 聚合物的雙鍵當量為100~500g/mol,較佳為200~470g/mol。 藉由調整聚合物的酸值和/或雙鍵當量,能夠兼備更高水準的靈敏度和顯影性。The acid value of the polymer is 70 to 300 mgKOH/g, preferably 80 to 200 mgKOH/g. The double bond equivalent of the polymer is 100 to 500 g/mol, preferably 200 to 470 g/mol. By adjusting the acid value and/or double bond equivalent of the polymer, a higher level of sensitivity and developability can be achieved.

應注意,酸值及雙鍵當量能夠藉由光譜測定等而求出。例如,能夠藉由如下步驟而求出(更具體之說明,請參閱實施例)。 (1)從聚合物的1 H-NMR圖求出與羧基的氫原子或聚合性碳-碳雙鍵附近的氫原子對應的峰的面積(積分值)。 (2)以在(1)中求出的面積為基準,從源自標準物質之峰的面積求出羧基的量及碳-碳雙鍵的量。 (3)將在(2)中求出之羧基的量換算成酸值(mgKOH/g)。又,將在(2)中求出之聚合性碳-碳雙鍵的量換算成雙鍵當量(g/mol)。It should be noted that the acid value and the double bond equivalent can be determined by spectrometry or the like. For example, it can be obtained by the following steps (for more specific description, please refer to the examples). (1) The area (integrated value) of the peak corresponding to the hydrogen atom of the carboxyl group or the hydrogen atom near the polymerizable carbon-carbon double bond is obtained from the 1 H-NMR chart of the polymer. (2) Based on the area obtained in (1), the amount of carboxyl groups and the amount of carbon-carbon double bonds are obtained from the area of the peak derived from the standard material. (3) Convert the amount of carboxyl groups calculated in (2) into acid value (mgKOH/g). In addition, the amount of polymerizable carbon-carbon double bonds determined in (2) is converted into double bond equivalent (g/mol).

藉由適當地設計聚合物中的由通式(1)表示之結構單元的比率、通式(1)中的RD 的結構、RD 所含有之聚合性碳-碳雙鍵的數等,能夠將聚合物的酸值和雙鍵當量設為適當的值。By appropriately designing the ratio of the structural units represented by the general formula (1) in the polymer, the structure of the R D in the general formula (1), the number of polymerizable carbon-carbon double bonds contained in the R D , etc., The acid value and double bond equivalent of the polymer can be set to appropriate values.

以下對本實施形態的感光性樹脂組成物能夠含有之成分等進行說明。The components etc. which can be contained in the photosensitive resin composition of this embodiment are demonstrated below.

(聚合物) 如前述,本實施形態的感光性樹脂組成物含有如下聚合物,該聚合物具有由通式(1)表示之第一結構單元,酸值係70~300mgKOH/g,且雙鍵當量係100~500g/mol。通式(1)中,只要RD 係含有聚合性碳-碳雙鍵之基團,則能夠為任意基團。(Polymer) As mentioned above, the photosensitive resin composition of this embodiment contains a polymer having the first structural unit represented by the general formula (1), an acid value of 70 to 300 mgKOH/g, and a double bond The equivalent is 100~500g/mol. In the general formula (1), as long as R D is a group containing a polymerizable carbon-carbon double bond, it can be any group.

•第一結構單元 第一結構單元包含RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元為較佳。換言之,聚合物中的由通式(1)表示之結構單元的一部分或所有的RD 較佳為包含2個以上的聚合性碳-碳雙鍵之基團。 當RD 含有2個以上的聚合性碳-碳雙鍵時,RD 內的聚合性碳-碳雙鍵的數較佳為2~6,更佳為2~5,進一步較佳為3~5。藉由調整RD 所含有之聚合性雙鍵的數,能夠兼備更高水準的靈敏度和顯影性。• The first structural unit The first structural unit preferably includes an R D- based structural unit containing two or more polymerizable carbon-carbon double bonds. In other words, a part or all of R D in the structural unit represented by the general formula (1) in the polymer is preferably a group containing two or more polymerizable carbon-carbon double bonds. When R D contains two or more polymerizable carbon-carbon double bonds, the number of polymerizable carbon-carbon double bonds in R D is preferably 2-6, more preferably 2-5, and still more preferably 3- 5. By adjusting the number of polymerizable double bonds contained in R D , a higher level of sensitivity and developability can be achieved.

當RD 含有2個以上的聚合性碳-碳雙鍵時,較佳為2個以上的聚合性雙鍵中的至少一個(更佳為全部)存在於RD 的末端。藉由設為該種結構,聚合性雙鍵容易與從光聚合起始劑產生之活性化學物種反應。因此,能夠進一步提高靈敏度。When R D contains two or more polymerizable carbon-carbon double bonds, it is preferable that at least one (more preferably all) of the two or more polymerizable double bonds is present at the terminal of R D. With this structure, the polymerizable double bond easily reacts with the active chemical species generated from the photopolymerization initiator. Therefore, the sensitivity can be further improved.

當RD 含有2個以上的聚合性碳-碳雙鍵時,作為一例,RD 含有2個以上的(甲基)丙烯醯基。更具體而言,RD 含有2~6,較佳為2~5,更佳為3~5個(甲基)丙烯醯基。此外,為了進一步提高靈敏度,(甲基)丙烯醯基係丙烯醯基為較佳。其原因為,與甲基丙烯醯基相比,未經甲基取代之丙烯醯基更易與從光聚合起始劑產生之活性化學物種反應。When R D contains two or more polymerizable carbon-carbon double bonds, as an example, R D contains two or more (meth)acryloyl groups. More specifically, R D contains 2 to 6, preferably 2 to 5, more preferably 3 to 5 (meth)acryloyl groups. In addition, in order to further improve the sensitivity, a (meth)acryl-based acrylic group is preferred. The reason is that, compared with the methacryloyl group, the unmethyl-substituted acrylic group is more likely to react with the active chemical species generated from the photopolymerization initiator.

當RD 含有2個以上的(甲基)丙烯醯基時,RD 例如能夠為由下述通式(1b)或(1c)表示之基團。When R D contains two or more (meth)acrylic groups, R D can be, for example, a group represented by the following general formula (1b) or (1c).

Figure 02_image009
Figure 02_image009

通式(1b)中, K為2或3, R為氫原子或甲基,複數個R可以相同亦可以不同, X1 為單鍵、碳數1~6的伸烷基或由-Z-X-表示之基團(Z為-O-或-OCO-,X為碳數1~6的伸烷基),存在複數個之X1 可以相同亦可以不同, X1 ’為單鍵、碳數1~6的伸烷基或由-X’-Z’-表示之基團(X’為碳數1~6的伸烷基,Z’為-O-或-COO-), X2 為碳數1~12的k+1價有機基。In the general formula (1b), K is 2 or 3, R is a hydrogen atom or a methyl group, and a plurality of Rs may be the same or different. X 1 is a single bond, an alkylene group with 1 to 6 carbon atoms, or -ZX- represents a group of (Z is -O- or -OCO-, X is an alkylene group having a carbon number of 1 to 6), presence of a plurality of X 1 may be also the same or different, X 1 'is a single bond, a carbon number of 1 ~6 alkylene group or a group represented by -X'-Z'- (X' is an alkylene group with 1 to 6 carbons, Z'is -O- or -COO-), X 2 is a carbon number 1-12 k+1 valent organic group.

從進一步提高靈敏度(聚合容易度)等考慮,R係氫原子為較佳。 k可以為2亦可以為3,但從原料的易獲得性或靈敏度的進一步提高的方面考慮,較佳為3。From the viewpoint of further improving sensitivity (easy degree of polymerization), etc., R-based hydrogen atoms are preferred. k may be 2 or 3, but from the viewpoint of the availability of raw materials or the further improvement of sensitivity, 3 is preferable.

當X1 為碳數1~6的伸烷基時,伸烷基可以為直鏈狀亦可以為分支狀。 當X1 為碳數1~6的伸烷基時,X1 較佳為直鏈狀伸烷基,更佳為碳數1~3的直鏈狀伸烷基,進一步較佳為-CH2 -(亞甲基)。When X 1 is an alkylene group having 1 to 6 carbon atoms, the alkylene group may be linear or branched. When X 1 is an alkylene group having 1 to 6 carbons, X 1 is preferably a linear alkylene group, more preferably a linear alkylene group having 1 to 3 carbons, and still more preferably -CH 2 -(Methylene).

當X1 為由-Z-X-表示之基團(Z為-O-或-OCO-,X為碳數1~6的伸烷基)時,X的碳數1~6的伸烷基可以為直鏈狀亦可以為分支狀。 X的碳數1~6的伸烷基較佳為直鏈狀伸烷基,更佳為碳數1~3的直鏈狀伸烷基,進一步較佳為-CH2 -CH2 -(伸乙基)或-CH2 -CH(CH3 )-。When X 1 is a group represented by -ZX- (Z is -O- or -OCO-, X is an alkylene having 1 to 6 carbons), the alkylene having 1 to 6 carbons of X may be The linear shape may also be branched. The alkylene having 1 to 6 carbon atoms of X is preferably a linear alkylene group, more preferably a linear alkylene group having 1 to 3 carbon atoms, and still more preferably -CH 2 -CH 2 -(extension Ethyl) or -CH 2 -CH(CH 3 )-.

當X1 ’為碳數1~6的伸烷基時,其具體態樣與X1 相同。 當X1 ’為由-X’-Z’-表示之基團時,X’的具體態樣與上述X相同。When X 1 ′ is an alkylene group having 1 to 6 carbon atoms, the specific aspect is the same as X 1 . When X 1 'is a group represented by -X'-Z'-, the specific aspect of X'is the same as the above-mentioned X.

作為X2 的碳數1~12的k+1價有機基,能夠舉出從任意有機化合物去除k+1個氫原子而成之任意基團。其中,作為“任意有機化合物”,例如為分子量300以下,較佳為200以下,更佳為100以下的有機化合物。 X2 例如為從碳數1~12(較佳為碳數1~6)的直鏈狀或分支狀烴去除k+1個氫原子而成之基團。更佳為從碳數1~3的直鏈狀烴去除k+1個氫原子而成之基團。此外,其中烴可以含有氧原子(例如醚鍵或羥基等)。又,烴係飽和烴為較佳。 作為另一態樣,X2 可以為含有環狀結構之基團。作為含有環狀結構之基團,能夠舉出含有脂環結構之基團、含有雜環結構(例如,異三聚氰酸結構)之基團等。Examples of the k+1 valent organic group having 1 to 12 carbons for X 2 include any group obtained by removing k+1 hydrogen atoms from any organic compound. Among them, the "arbitrary organic compound" is, for example, an organic compound having a molecular weight of 300 or less, preferably 200 or less, and more preferably 100 or less. X 2 is, for example, a group obtained by removing k+1 hydrogen atoms from a linear or branched hydrocarbon having 1 to 12 carbons (preferably 1 to 6 carbons). More preferably, it is a group obtained by removing k+1 hydrogen atoms from a linear hydrocarbon having 1 to 3 carbon atoms. In addition, the hydrocarbon may contain oxygen atoms (such as ether bonds or hydroxyl groups). In addition, hydrocarbon-based saturated hydrocarbons are preferred. As another aspect, X 2 may be a group containing a cyclic structure. As a group containing a cyclic structure, a group containing an alicyclic structure, a group containing a heterocyclic structure (for example, an isocyanuric acid structure), etc. can be mentioned.

Figure 02_image011
Figure 02_image011

通式(1c)中, k、R、X1 及X2 的定義分別與通式(1b)中的R、k、X1 及X2 相同,複數個R彼此可以相同亦可以不同,複數個X1 彼此可以相同亦可以不同, X3 為碳數1~6的2價有機基, X4 及X5 分別獨立地為單鍵或碳數1~6的2價有機基, X6 為碳數1~6的2價有機基。In the general formula (1c), the definitions of k, R, X 1 and X 2 are the same as the definitions of R, k, X 1 and X 2 in the general formula (1b). A plurality of Rs may be the same or different from each other. X 1 may be the same or different from each other, X 3 is a divalent organic group with 1 to 6 carbons, X 4 and X 5 are each independently a single bond or a divalent organic group with 1 to 6 carbons, and X 6 is a carbon A divalent organic group of 1 to 6.

R、k、X1 及X2 的具體態樣、較佳態樣等與藉由通式(1b)進行說明者相同。 作為X3 及X6 的碳數1~6的2價有機基,例如能夠舉出從碳數1~6的直鏈狀或分支狀烴去除2個氫原子而成之基團。此外,其中烴可以含有氧原子(例如醚鍵或羥基等)。又,烴係飽和烴為較佳。 作為X4 及X5 的碳數1~6的2價有機基,能夠舉出直鏈狀或分支狀伸烷基。直鏈狀或分支狀伸烷基的碳數較佳為1~3。The specific aspects and preferred aspects of R, k, X 1 and X 2 are the same as those explained by the general formula (1b). Examples of the divalent organic group having 1 to 6 carbons for X 3 and X 6 include groups obtained by removing two hydrogen atoms from a linear or branched hydrocarbon having 1 to 6 carbons. In addition, the hydrocarbon may contain oxygen atoms (such as ether bonds or hydroxyl groups). In addition, hydrocarbon-based saturated hydrocarbons are preferred. Examples of the divalent organic group having 1 to 6 carbon atoms of X 4 and X 5 include linear or branched alkylene groups. The carbon number of the linear or branched alkylene group is preferably 1-3.

第一結構單元包含RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元和RD 係僅含有1個聚合性碳-碳雙鍵之基團之結構單元為較佳。作為另一種說法,較佳為聚合物中的由通式(1)表示之結構單元中,一部分結構單元中的RD 係含有2個以上的聚合性碳-碳雙鍵之基團,聚合物中的由通式(1)表示之結構單元中,剩餘結構單元中的RD 係僅含有1個聚合性碳-碳雙鍵之基團。 藉由如此設計聚合物,提高靈敏度的同時易得到更良好的顯影性。R D comprises structural units of the first system containing two or more polymerizable carbon - based structural units and R D to carbon double bond group containing only one polymerizable carbon - a group of the structural unit is preferably a carbon double bond . In another way, it is preferable that among the structural units represented by the general formula (1) in the polymer, R D in a part of the structural units is a group containing two or more polymerizable carbon-carbon double bonds. Among the structural units represented by the general formula (1), the R D in the remaining structural units contains only one polymerizable carbon-carbon double bond. By designing the polymer in this way, it is easy to obtain better developability while improving the sensitivity.

“RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元”的具體態樣如上所述(通式(1)中,RD 係由通式(1b)或(1c)表示之基團之情況等)。The specific aspect of "R D is a structural unit of a group containing two or more polymerizable carbon-carbon double bonds" is as described above (in general formula (1), R D is defined by general formula (1b) or (1c) ) Indicates the situation of the group, etc.).

“RD 係僅含有1個聚合性碳-碳雙鍵之基團之結構單元”中,聚合性雙鍵較佳為存在於RD 的末端。又,作為一態樣,RD 含有1個(甲基)丙烯醯基。從進一步提高靈敏度的觀點考慮,(甲基)丙烯醯基係丙烯醯基為較佳。更具體而言,RD 能夠為由以下通式(2a)表示之基團。In "R D is a structural unit of a group containing only one polymerizable carbon-carbon double bond", the polymerizable double bond is preferably present at the terminal of R D. In addition, as one aspect, R D contains one (meth)acryloyl group. From the viewpoint of further improving the sensitivity, a (meth)acryloyl-based acryloyl group is preferred. More specifically, R D can be a group represented by the following general formula (2a).

Figure 02_image013
Figure 02_image013

通式(2a)中,X10 為2價有機基,R為氫原子或甲基。 X10 的總碳數較佳為1~30,更佳為1~20,進一步較佳為1~10。In the general formula (2a), X 10 is a divalent organic group, and R is a hydrogen atom or a methyl group. The total carbon number of X 10 is preferably 1-30, more preferably 1-20, and still more preferably 1-10.

作為X10 的2價有機基,例如伸烷基為較佳。該伸烷基中的一部分-CH2 -可以為醚基(-O-)。伸烷基可以為直鏈狀亦可以為分支狀,直鏈狀為更佳。As the divalent organic group of X 10 , for example, an alkylene group is preferable. A part of -CH 2 -in the alkylene group may be an ether group (-O-). The alkylene group may be straight-chain or branched, and straight-chain is more preferred.

作為X10 的2價有機基更佳為總碳數3~6的直鏈狀伸烷基。藉由適當地選擇X10 的碳數(相當於X10 的“長度”),由通式(2a)表示之基團更容易參與硬化反應。因此,能夠進一步提高靈敏度。The divalent organic group as X 10 is more preferably a linear alkylene group having 3 to 6 total carbons. By appropriately selecting the number of carbon X 10 (corresponding to the "length" X 10), the group represented by the formula (2a) involved in the curing reaction more easily. Therefore, the sensitivity can be further improved.

X10 的2價有機基(例如伸烷基)可以經任意取代基取代。作為取代基,能夠舉出烷基、芳基、烷氧基、芳氧基等。 又,X10 的2價有機基可以為除了伸烷基以外的任意基團。例如,可以為由選自伸烷基、環伸烷基、伸芳基、醚基、羰基、羧基等中之1種或2種以上的基團連結而構成之2價基團。The divalent organic group (for example, alkylene) of X 10 may be substituted with any substituent. As a substituent, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, etc. can be mentioned. In addition, the divalent organic group of X 10 may be any group other than an alkylene group. For example, it may be a divalent group constituted by linking one or more groups selected from alkylene, cycloalkylene, arylene, ether, carbonyl, carboxyl, and the like.

聚合物的總結構單元中的第一結構單元的比率較佳為10~40mol%,更佳為15~35mol%。 又,當聚合物包含RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元和RD 係僅含有1個聚合性碳-碳雙鍵之基團之結構單元這兩者來作為第一結構單元時,前者:後者的莫耳比較佳為5:95~50:50,更佳為10:90~40:60。藉由適當地調整該比,容易兼備更高的靈敏度和顯影性。 在此,前者:後者的莫耳比例如能夠如下求出。 將聚合物中的前者的量設為X1 (mol/g),後者的量設為X2 (mol/g),羧基的量設為C(mol/g),聚合性碳-碳雙鍵的量設為D(mol/g)。又,設為前者含有n個聚合性碳-碳雙鍵。 前者和後者均具有1個羧基。因此,記載為X1 +X2 =C(假定聚合物不包含其他含有羧基之結構單元)。 又,關於聚合性碳-碳雙鍵的量,記載為n•X1 +X2 =D(假定聚合物不包含其他含有聚合性雙鍵之結構單元)。 C和D從NMR測定中得到之峰面積等可知。又,n根據原料的化學結構而確定。因此,藉由將該等2個數式作為聯立方程式而求出未知數X1 及X2 ,能夠求出前者:後者的莫耳比。 進而,能夠從X1 與X2 之和、原料聚合物(後述)中所含有之各結構單元的莫耳數(mol/g)、成為原料聚合物中所含有之各結構單元的基礎的單體的分子量等求出聚合物的總結構單元中的第一結構單元(當存在複數個第一結構單元時,為其合計)的比率。The ratio of the first structural unit in the total structural unit of the polymer is preferably 10-40 mol%, more preferably 15-35 mol%. Also, when the polymer comprises R D system containing two or more polymerizable carbon - based structural units and R D to carbon double bond group containing only one polymerizable carbon - a structural unit of a group of two carbon double bond When the former is used as the first structural unit, the molar ratio of the former: the latter is preferably 5:95-50:50, and more preferably 10:90-40:60. By appropriately adjusting the ratio, it is easy to achieve both higher sensitivity and developability. Here, the molar ratio of the former:the latter can be obtained as follows, for example. Set the amount of the former in the polymer as X 1 (mol/g), the amount of the latter as X 2 (mol/g), the amount of carboxyl groups as C (mol/g), polymerizable carbon-carbon double bond The amount of is set to D (mol/g). Furthermore, it is assumed that the former contains n polymerizable carbon-carbon double bonds. Both the former and the latter have 1 carboxyl group. Therefore, it is described as X 1 +X 2 =C (assuming that the polymer does not contain other structural units containing carboxyl groups). In addition, the amount of polymerizable carbon-carbon double bonds is described as n•X 1 +X 2 =D (assuming that the polymer does not contain other structural units containing polymerizable double bonds). C and D can be known from the peak area obtained from NMR measurement. In addition, n is determined based on the chemical structure of the raw material. Therefore, by using these two numerical formulas as simultaneous equations to find the unknowns X 1 and X 2 , the molar ratio of the former:the latter can be found. Further, it is possible with the X 1 and X, 2 of the base polymer (described later) of the number of moles of each structural unit contained in the (mol / g), the basis for the respective structural units contained in the polymer material of a single The ratio of the first structural unit (when there are a plurality of first structural units, the total) in the total structural units of the polymer is determined by the molecular weight of the polymer.

•第二結構單元 聚合物還包含由以下式(MA)表示之第二結構單元為較佳。 第二結構單元可藉由鹼顯影液而開環。若開環則產生2個羧基,因此認為可實現顯影性的進一步提高。•The second structural unit Preferably, the polymer further includes a second structural unit represented by the following formula (MA). The second structural unit can be ring-opened by an alkaline developer. If the ring is opened, two carboxyl groups are generated, so it is considered that the developability can be further improved.

Figure 02_image005
Figure 02_image005

當聚合物包含由式(MA)表示之結構單元時,聚合物的總結構單元中的由式(MA)表示之結構單元的比例較佳為1~25mol%,更佳為3~20mol%。When the polymer contains the structural unit represented by the formula (MA), the ratio of the structural unit represented by the formula (MA) in the total structural unit of the polymer is preferably 1-25 mol%, more preferably 3-20 mol%.

•溶解性調整結構單元 聚合物可以包含由下述通式(a2-1)、(a2-2)或(a2-3)表示之結構單元中的1個或2個以上。聚合物中包含這種結構單元,藉此能夠調整對顯影液的溶解性,並調整對有機溶劑的溶解性等。 通式(a2-1)及通式(a2-2)中,R14 、R15 及R16 分別獨立地為碳數1~30的有機基。• The solubility adjusting structural unit polymer may contain 1 or 2 or more structural units represented by the following general formula (a2-1), (a2-2) or (a2-3). By including such a structural unit in the polymer, it is possible to adjust the solubility to the developer, and to adjust the solubility to the organic solvent. In general formula (a2-1) and general formula (a2-2), R 14 , R 15 and R 16 are each independently an organic group having 1 to 30 carbon atoms.

Figure 02_image016
Figure 02_image016

構成R14 、R15 及R16 之碳數1~30的有機基可以於其結構中含有O、N、S、P、Si中的任意1個以上。又,構成R14 、R15 及R16 之有機基能夠設為不含有酸性官能基者。藉此,能夠輕鬆地控制酸值。The organic group having 1 to 30 carbon atoms constituting R 14 , R 15 and R 16 may contain any one or more of O, N, S, P, and Si in the structure. And, constituting R 14, R 15 R 16 and an organic group capable of containing an acidic functional group to those not. In this way, the acid value can be easily controlled.

作為構成R14 、R15 及R16 之有機基,例如可舉出烷基、烯基、炔基、次烷基、芳基、芳烷基、烷芳基、環烷基及雜環基。 作為烷基,例如可舉出甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、戊基、新戊基、己基、庚基、辛基、壬基、癸基等。 作為烯基,例如可舉出烯丙基、戊烯基、乙烯基等。 作為炔基,例如可舉出乙炔基等。 作為次烷基,例如可舉出次甲基、次乙基等。 作為芳基,例如可舉出苯基、萘基、蒽基等。 作為芳烷基,例如可舉出苄基、苯乙基等。 作為烷芳基,例如可舉出甲苯基、二甲苯基等。 作為作為環烷基,例如可舉出金剛烷基、環戊基、環己基、環辛基等。 作為雜環基,例如可舉出環氧基、氧雜環丁基等。Examples of the organic groups constituting R 14 , R 15 and R 16 include alkyl groups, alkenyl groups, alkynyl groups, alkylene groups, aryl groups, aralkyl groups, alkaryl groups, cycloalkyl groups, and heterocyclic groups. Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, tertiary butyl, pentyl, neopentyl, hexyl, and heptyl. Base, octyl, nonyl, decyl, etc. Examples of alkenyl groups include allyl groups, pentenyl groups, and vinyl groups. As an alkynyl group, an ethynyl group etc. are mentioned, for example. As a ethylene group, a methine group, a ethylene group, etc. are mentioned, for example. As an aryl group, a phenyl group, a naphthyl group, an anthryl group etc. are mentioned, for example. As an aralkyl group, a benzyl group, a phenethyl group, etc. are mentioned, for example. As an alkaryl group, a tolyl group, a xylyl group, etc. are mentioned, for example. As a cycloalkyl group, an adamantyl group, a cyclopentyl group, a cyclohexyl group, a cyclooctyl group, etc. are mentioned, for example. As a heterocyclic group, an epoxy group, an oxetanyl group, etc. are mentioned, for example.

該等烷基、烯基、炔基、次烷基、芳基、芳烷基、烷芳基、環烷基及雜環基中,1個以上的氫原子可以經鹵素原子取代。作為鹵素原子,可舉出氟、氯、溴及碘。其中,烷基的1個以上的氫原子經鹵素原子取代之鹵代烷基為較佳。In these alkyl groups, alkenyl groups, alkynyl groups, alkylene groups, aryl groups, aralkyl groups, alkaryl groups, cycloalkyl groups, and heterocyclic groups, one or more hydrogen atoms may be substituted with halogen atoms. Examples of the halogen atom include fluorine, chlorine, bromine, and iodine. Among them, a halogenated alkyl group in which one or more hydrogen atoms of the alkyl group is substituted with a halogen atom is preferred.

•具有環狀烴骨架之結構單元 聚合物較佳為包含具有環狀烴骨架之結構單元。藉由環狀烴骨架的剛性結構,例如能夠提高使感光性樹脂組成物硬化時的硬化膜的耐熱性、機械性能等。• Structural unit with cyclic hydrocarbon skeleton The polymer preferably contains a structural unit having a cyclic hydrocarbon skeleton. The rigid structure of the cyclic hydrocarbon skeleton can improve the heat resistance and mechanical properties of the cured film when the photosensitive resin composition is cured, for example.

具有環狀烴骨架之結構單元例如係源自以下單體者。The structural unit having a cyclic hydrocarbon skeleton is derived from the following monomers, for example.

環狀烯烴單體。具體而言,降莰烯、降冰片二烯、雙環[2.2.1]-庚-2-烯(慣用名:2-降莰烯)、5-甲基-2-降莰烯、5-乙基-2-降莰烯、5-丁基-2-降莰烯、5-己基-2-降莰烯、5-癸基-2-降莰烯、5-烯丙基-2-降莰烯、5-(2-丙烯基)-2-降莰烯、5-(1-甲基-4-戊烯基)-2-降莰烯、5-次乙基-2-降莰烯、5-苄基-2-降莰烯、5-苯乙基-2-降莰烯等具有降莰烯骨架或降冰片二烯骨架之單體。Cyclic olefin monomers. Specifically, norbornene, norbornadiene, bicyclo[2.2.1]-hept-2-ene (common name: 2-norbornene), 5-methyl-2-norbornene, 5-ethyl 2-Norcamene, 5-Butyl-2-Norbornene, 5-hexyl-2-Norbornene, 5-Decyl-2-Norbornene, 5-Allyl-2-Norbornene Alkene, 5-(2-propenyl)-2-norbornene, 5-(1-methyl-4-pentenyl)-2-norbornene, 5-ethylidene-2-norbornene, Monomers such as 5-benzyl-2-norbornene and 5-phenethyl-2-norbornene, which have a norbornene skeleton or norbornadiene skeleton.

茚、2-甲基茚、3-甲基茚、苊等具有茚骨架或苊骨架之單體。 11,5,9-環十二烷三烯、順-反-反-1,5,9-環十二烷三烯、反-反-反-1,5,9-環十二烷三烯、反-順-順-1,5,9-環十二烷三烯、順-順-順-1,5,9-環十二烷三烯等具有三烯結構之單體。 苯乙烯、乙烯基甲苯、羥基苯乙烯、乙醯氧基苯乙烯、α-甲基苯乙烯等具有苯乙烯骨架之單體。Indene, 2-methylindene, 3-methylindene, acenaphthylene and other monomers having an indene skeleton or acenaphthene skeleton. 11,5,9-cyclododecanetriene, cis-trans-trans-1,5,9-cyclododecanetriene, trans-trans-trans-1,5,9-cyclododecanetriene , Trans-cis-cis-1,5,9-cyclododecanetriene, cis-cis-cis-1,5,9-cyclododecanetriene and other monomers with triene structure. Styrene, vinyl toluene, hydroxystyrene, acetoxystyrene, α-methylstyrene and other monomers with styrene skeleton.

N-環己基順丁烯二醯亞胺、N-環戊基順丁烯二醯亞胺、N-降莰基順丁烯二醯亞胺、N-環己基甲基順丁烯二醯亞胺、N-環戊基甲基順丁烯二醯亞胺等N-環烷基順丁烯二醯亞胺。 N-苯基順丁烯二醯亞胺、N-氯苯基順丁烯二醯亞胺、N-甲基苯基順丁烯二醯亞胺、N-萘基順丁烯二醯亞胺、N-羥基苯基順丁烯二醯亞胺、N-甲氧基苯基順丁烯二醯亞胺、N-羧基苯基順丁烯二醯亞胺、N-硝基苯基順丁烯二醯亞胺等N-芳基順丁烯二醯亞胺。N-cyclohexyl maleimide, N-cyclopentyl maleimide, N-norbornyl maleimide, N-cyclohexyl methyl maleimide N-cycloalkyl maleimines such as amines and N-cyclopentylmethyl maleimines. N-phenylmaleimide, N-chlorophenyl maleimide, N-methylphenyl maleimide, N-naphthyl maleimide , N-hydroxyphenyl maleimide, N-methoxyphenyl maleimide, N-carboxyphenyl maleimide, N-nitrophenyl maleimide N-aryl maleimines such as enediimines.

作為具有環狀烴骨架之結構單元,源自環狀烯烴單體之結構單元為較佳,源自具有降莰烯骨架或降冰片二烯骨架之單體之結構單元為更佳。更具體而言,具有環狀烴骨架之結構單元係由以下通式(NB)表示者為較佳。As the structural unit having a cyclic hydrocarbon skeleton, a structural unit derived from a cyclic olefin monomer is preferable, and a structural unit derived from a monomer having a norbornene skeleton or a norbornadiene skeleton is more preferable. More specifically, the structural unit having a cyclic hydrocarbon skeleton is preferably represented by the following general formula (NB).

Figure 02_image018
Figure 02_image018

通式(NB)中, R1 、R2 、R3 及R4 分別獨立地為氫原子或碳數1~30的有機基, a1 係0、1或2。In the general formula (NB), R 1 , R 2 , R 3 and R 4 are each independently a hydrogen atom or an organic group having 1 to 30 carbon atoms, and a 1 is 0, 1 , or 2.

作為通式(NB)中的R1 、R2 、R3 及R4 的碳數1~30的有機基,能夠舉出烷基、烯基、炔基、次烷基、芳基、芳烷基、烷芳基、環烷基、烷氧基、雜環基、羧基等。Examples of the organic groups having 1 to 30 carbon atoms in R 1 , R 2 , R 3 and R 4 in the general formula (NB) include alkyl groups, alkenyl groups, alkynyl groups, alkylene groups, aryl groups, and aralkyl groups. Group, alkaryl group, cycloalkyl group, alkoxy group, heterocyclic group, carboxyl group, etc.

作為烷基,例如可舉出甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、戊基、新戊基、己基、庚基、辛基、壬基、癸基等。 作為烯基,例如可舉出烯丙基、戊烯基、乙烯基等。 作為炔基,例如可舉出乙炔基等。 作為次烷基,例如可舉出次甲基、次乙基等。 作為芳基,例如可舉出甲苯基、二甲苯基、苯基、萘基、蒽基。 作為芳烷基,例如可舉出苄基、苯乙基等。 作為烷芳基,例如可舉出甲苯基、二甲苯基等。 作為環烷基,例如可舉出金剛烷基、環戊基、環己基、環辛基等。 作為烷氧基,例如可舉出甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、第二丁氧基、異丁氧基、第三丁氧基、正戊氧基、新戊氧基、正己氧基等。 作為雜環基,例如可舉出環氧基、氧雜環丁基等。Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, tertiary butyl, pentyl, neopentyl, hexyl, and heptyl. Base, octyl, nonyl, decyl, etc. Examples of alkenyl groups include allyl groups, pentenyl groups, and vinyl groups. As an alkynyl group, an ethynyl group etc. are mentioned, for example. As a ethylene group, a methine group, a ethylene group, etc. are mentioned, for example. Examples of aryl groups include tolyl, xylyl, phenyl, naphthyl, and anthracenyl. As an aralkyl group, a benzyl group, a phenethyl group, etc. are mentioned, for example. As an alkaryl group, a tolyl group, a xylyl group, etc. are mentioned, for example. As a cycloalkyl group, an adamantyl group, a cyclopentyl group, a cyclohexyl group, a cyclooctyl group etc. are mentioned, for example. Examples of alkoxy groups include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, second butoxy, isobutoxy, tertiary butoxy, n Pentyloxy, neopentyloxy, n-hexyloxy, etc. As a heterocyclic group, an epoxy group, an oxetanyl group, etc. are mentioned, for example.

作為通式(NB)中的R1 、R2 、R3 及R4 ,氫或烷基為較佳,氫為更佳。 R1 、R2 、R3 及R4 的碳數1~30的有機基中的氫原子可以經任意原子團取代。例如,可以經氟原子、羥基、羧基等取代。更具體而言,作為R1 、R2 、R3 及R4 的碳數1~30的有機基,可以選擇氟化烷基等。 通式(NB)中,a1 較佳為0或1,更佳為0。As R 1 , R 2 , R 3 and R 4 in the general formula (NB), hydrogen or an alkyl group is preferred, and hydrogen is more preferred. The hydrogen atom in the C 1-30 organic group of R 1 , R 2 , R 3 and R 4 may be substituted with any atomic group. For example, it may be substituted with a fluorine atom, a hydroxyl group, a carboxyl group, and the like. More specifically, as the C 1-30 organic group of R 1 , R 2 , R 3 and R 4 , a fluorinated alkyl group or the like can be selected. In the general formula (NB), a 1 is preferably 0 or 1, more preferably 0.

當聚合物包含具有環狀烴骨架之結構單元時,其量於聚合物的總結構單元中較佳為10~90mol%,更佳為30~70mol%,進一步較佳為40~60mol%。藉由適當地調整該比例,兼備靈敏度和顯影性的同時易得到追加效果(例如作為硬化膜時的耐熱性提高或機械性能的提高)。 順便提及,從綜合性能或成本等觀點考慮,聚合物不包含與作為必要結構單元的第一結構單元、以及作為任意結構單元的第二結構單元及具有環狀烴骨架之結構單元不同之“其他結構單元”,或者即使包含亦係少量為較佳。具體而言,聚合物中的“其他結構單元”的比率較佳為0~20mo%,更佳為0~10mol%。When the polymer contains a structural unit having a cyclic hydrocarbon skeleton, the amount is preferably 10 to 90 mol% in the total structural units of the polymer, more preferably 30 to 70 mol%, and still more preferably 40 to 60 mol%. By appropriately adjusting the ratio, it is easy to obtain additional effects (for example, improvement of heat resistance or improvement of mechanical properties when used as a cured film) while having both sensitivity and developability. Incidentally, from the viewpoint of overall performance or cost, the polymer does not contain any difference from the first structural unit as an essential structural unit, the second structural unit as an arbitrary structural unit, and the structural unit having a cyclic hydrocarbon skeleton. "Other structural units", or a small amount even if it is contained, is preferable. Specifically, the ratio of the "other structural unit" in the polymer is preferably 0-20 mol%, more preferably 0-10 mol%.

聚合物的重均分子量較佳為6,000~25,000,更佳為7,000~20,000。藉由適當地調整重均分子量,能夠適當地調整對鹼顯影液的溶解性或對有機溶劑的溶解性等。 聚合物的分散度(重均分子量Mw/數均分子量Mn)較佳為1.0~5.0,更佳為1.0~4.0,進一步較佳為1.0~3.0。藉由適當地調整分散度,能夠使聚合物的物性均勻,因此為較佳。 該等的值能夠藉由將聚苯乙烯用作標準物之凝膠滲透色譜(GPC)測定而求出。The weight average molecular weight of the polymer is preferably from 6,000 to 25,000, more preferably from 7,000 to 20,000. By appropriately adjusting the weight average molecular weight, it is possible to appropriately adjust the solubility to the alkali developer, the solubility to the organic solvent, and the like. The degree of dispersion of the polymer (weight average molecular weight Mw/number average molecular weight Mn) is preferably 1.0 to 5.0, more preferably 1.0 to 4.0, and still more preferably 1.0 to 3.0. By appropriately adjusting the degree of dispersion, the physical properties of the polymer can be made uniform, which is preferable. These values can be obtained by gel permeation chromatography (GPC) measurement using polystyrene as a standard.

聚合物可以藉由任意方法而製造(合成)。例如,能夠藉由如下步驟而製造聚合物,即 •準備步驟,準備至少包含由前述式(MA)表示之結構單元之原料聚合物;及 •反應步驟,於鹼性觸媒的存在下,使該原料聚合物與具有羥基及聚合性碳-碳雙鍵之化合物反應。The polymer can be produced (synthesized) by any method. For example, a polymer can be produced by the following steps, namely • The preparation step is to prepare a raw polymer containing at least the structural unit represented by the aforementioned formula (MA); and • In the reaction step, in the presence of a basic catalyst, the raw material polymer is reacted with a compound having a hydroxyl group and a polymerizable carbon-carbon double bond.

以下,對藉由上述準備步驟及反應步驟而製造(合成)聚合物之方法進行進一步具體的說明。說明中,以包含由通式(1)表示之結構單元和由通式(NB)表示之結構單元之聚合物的合成為例而進行,但不會因此失去聚合物製造方法的通常性。例如,包含由通式(1)表示之結構單元和並非由通式(NB)表示之結構單元(共聚合單元)之聚合物亦能夠藉由與以下說明相似的步驟而進行合成。Hereinafter, the method of producing (synthesizing) a polymer through the above-mentioned preparation step and reaction step will be further specifically described. In the description, the synthesis of a polymer including the structural unit represented by the general formula (1) and the structural unit represented by the general formula (NB) is taken as an example, but the generality of the polymer manufacturing method will not be lost. For example, a polymer containing a structural unit represented by the general formula (1) and a structural unit (copolymerization unit) not represented by the general formula (NB) can also be synthesized by a procedure similar to the following description.

•準備步驟 原料聚合物例如能夠藉由將由下述通式(NB-m)表示之單體與順丁烯二酸酐聚合(加成聚合)而得。 通式(NB-m)的R1 、R2 、R3 及R4 以及a1 的定義與通式(NB)相同。較佳態樣亦相同。•Preparation step The base polymer can be obtained, for example, by polymerizing (addition polymerization) a monomer represented by the following general formula (NB-m) and maleic anhydride. The definitions of R 1 , R 2 , R 3 and R 4 and a 1 in the general formula (NB-m) are the same as those in the general formula (NB). The preferred aspect is also the same.

Figure 02_image020
Figure 02_image020

作為由通式(NB-m)表示之單體,例如可舉出,雙環[2.2.1]-庚-2-烯(慣用名:2-降莰烯)、5-甲基-2-降莰烯、5-乙基-2-降莰烯、5-丁基-2-降莰烯、5-己基-2-降莰烯、5-癸基-2-降莰烯、5-烯丙基-2-降莰烯、5-(2-丙烯基)-2-降莰烯、5-(1-甲基-4-戊烯基)-2-降莰烯、5-乙炔基-2-降莰烯、5-苄基-2-降莰烯、5-苯乙基-2-降莰烯、2-乙醯基-5-降莰烯、5-降莰烯-2-羧酸甲酯、5-降莰烯-2,3二羧酸酐、降冰片二烯等。 聚合時,由通式(NB-m)表示之單體可以僅使用1種,亦可以組合使用2種以上。As the monomer represented by the general formula (NB-m), for example, bicyclo[2.2.1]-hept-2-ene (common name: 2-norbornene), 5-methyl-2-nor Camphene, 5-ethyl-2-norbornene, 5-butyl-2-norbornene, 5-hexyl-2-norbornene, 5-decyl-2-norbornene, 5-allyl 2-norcamphetene, 5-(2-propenyl)-2-norcampoene, 5-(1-methyl-4-pentenyl)-2-norcampoene, 5-ethynyl-2 -Norbornene, 5-benzyl-2-norbornene, 5-phenylethyl-2-norbornene, 2-acetyl-5-norbornene, 5-norbornene-2-carboxylic acid Methyl ester, 5-norbornene-2,3 dicarboxylic acid anhydride, norbornadiene, etc. During the polymerization, the monomer represented by the general formula (NB-m) may be used alone or in combination of two or more.

關於聚合的方法並無限定,但使用了自由基聚合起始劑之自由基聚合為較佳。 作為聚合起始劑,例如能夠使用偶氮化合物、有機過氧化物等。 作為偶氮化合物,具體而言,能夠舉出偶氮雙異丁腈(AIBN)、2,2'-偶氮雙(2-甲基丙酸)二甲酯、1,1'-偶氮雙(環己腈(cyclohexanecarbonitrile))(ABCN)等。 作為有機過氧化物,例如能夠舉出過氧化氫、二第三丁基過氧化物(DTBP)、過氧化苯甲醯(Benzoyl Peroxide,BPO)及甲乙酮過氧化物(MEKP)等。 關於聚合起始劑,可以僅使用1種,亦可以組合使用2種以上。The method of polymerization is not limited, but radical polymerization using a radical polymerization initiator is preferred. As the polymerization initiator, for example, an azo compound, an organic peroxide, etc. can be used. As the azo compound, specifically, azobisisobutyronitrile (AIBN), 2,2'-azobis(2-methylpropionic acid) dimethyl ester, 1,1'-azobis (Cyclohexanecarbonitrile) (ABCN) and so on. Examples of organic peroxides include hydrogen peroxide, di-tert-butyl peroxide (DTBP), benzoyl peroxide (BPO), methyl ethyl ketone peroxide (MEKP), and the like. Regarding the polymerization initiator, only one type may be used, or two or more types may be used in combination.

作為聚合溶劑,例如能夠使用二乙醚、四氫呋喃、甲苯、甲基乙基酮等有機溶劑。聚合溶劑可以為單一溶劑亦可以為混合溶劑。As the polymerization solvent, for example, organic solvents such as diethyl ether, tetrahydrofuran, toluene, and methyl ethyl ketone can be used. The polymerization solvent may be a single solvent or a mixed solvent.

使由通式(NB-m)表示之單體、順丁烯二酸酐及聚合起始劑溶解於溶劑後裝入反應容器,之後加熱而進行加成聚合。加熱溫度例如為50~80℃,加熱時間例如為5~20小時。 裝入反應容器時的由通式(NB-m)表示之單體與順丁烯二酸酐的莫耳比係0.5:1~1:0.5為較佳。從控制分子結構之觀點考慮,莫耳比係1:1為較佳。 藉由如上步驟能夠得到“原料聚合物”。 此外,原料聚合物可以為無規共聚物、交替共聚物、嵌段共聚物、週期共聚物等中的任一種。典型地為無規共聚物或交替共聚物(通常,作為交替共聚合性強之單體已知順丁烯二酸酐)。The monomer represented by the general formula (NB-m), the maleic anhydride, and the polymerization initiator are dissolved in a solvent and then placed in a reaction vessel, and then heated to perform addition polymerization. The heating temperature is, for example, 50 to 80°C, and the heating time is, for example, 5 to 20 hours. The molar ratio of the monomer represented by the general formula (NB-m) to the maleic anhydride when it is charged into the reaction vessel is preferably 0.5:1 to 1:0.5. From the viewpoint of controlling the molecular structure, a molar ratio of 1:1 is preferred. The "raw polymer" can be obtained through the above steps. In addition, the base polymer may be any of random copolymers, alternating copolymers, block copolymers, periodic copolymers, and the like. It is typically a random copolymer or an alternating copolymer (usually, maleic anhydride is known as a monomer with strong alternating copolymerization).

合成原料聚合物之後,可以進行去除未反應單體、寡聚物、殘存之聚合起始劑等低分子量成分之步驟。 具體而言,對含有所合成之原料聚合物和低分子量成分之有機層進行濃縮,之後與四氫呋喃(THF)等有機溶劑進行混合而得到溶液。接著,將該溶液與甲醇等不良溶劑進行混合而使單體沉澱。藉由濾取該沈殿物並進行乾燥而能夠提高原料聚合物的純度。After the raw polymer is synthesized, a step of removing low molecular weight components such as unreacted monomers, oligomers, and remaining polymerization initiators can be performed. Specifically, the organic layer containing the synthesized raw material polymer and low molecular weight components is concentrated, and then mixed with an organic solvent such as tetrahydrofuran (THF) to obtain a solution. Next, this solution is mixed with a poor solvent such as methanol to precipitate the monomer. The purity of the raw material polymer can be improved by filtering and drying the sediment.

•反應步驟 於鹼性觸媒的存在下,使在準備步驟中得到之原料聚合物與具有羥基及聚合性碳-碳雙鍵之化合物反應,藉此原料聚合物中所包含之式(MA)的結構單元開環。藉此,形成通式(1)的結構單元。• Reaction steps In the presence of a basic catalyst, the base polymer obtained in the preparation step is reacted with a compound having a hydroxyl group and a polymerizable carbon-carbon double bond, thereby the structural unit of formula (MA) contained in the base polymer Open loop. Thereby, the structural unit of general formula (1) is formed.

更具體而言,首先準備將原料聚合物溶解於適當的有機溶劑而成之聚合物溶液。 作為在此能夠使用之有機溶劑,可舉出甲基乙基酮(MEK)、丙二醇單甲醚乙酸酯(PGMEA)、二甲基乙醯胺(DMAC)、N-甲基吡咯啶酮(NMP)、四氫呋喃(THF)等單一溶劑或混合溶劑。當然,溶劑並不限定於該等而能夠使用有機化合物或高分子的合成中使用之各種有機溶劑。More specifically, first, a polymer solution obtained by dissolving a base polymer in an appropriate organic solvent is prepared. Examples of organic solvents that can be used here include methyl ethyl ketone (MEK), propylene glycol monomethyl ether acetate (PGMEA), dimethylacetamide (DMAC), and N-methylpyrrolidone ( Single solvent or mixed solvent such as NMP) and tetrahydrofuran (THF). Of course, the solvent is not limited to these, and various organic solvents used in the synthesis of organic compounds or polymers can be used.

接著,向該聚合物溶液添加具有羥基及聚合性碳-碳雙鍵之化合物。進而,添加鹼性觸媒。進而適當的進行混合而形成均勻的溶液。Next, a compound having a hydroxyl group and a polymerizable carbon-carbon double bond is added to the polymer solution. Furthermore, an alkaline catalyst is added. Furthermore, they are mixed appropriately to form a uniform solution.

作為具有羥基及聚合性碳-碳雙鍵之化合物,例如能夠舉出含有1或2個以上的(甲基)丙烯醯基和羥基之化合物。 藉由使用含有2個以上的(甲基)丙烯醯基和羥基之化合物(多官能化合物)而能夠向聚合物中導入於通式(1)中RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元。 另一方面,藉由使用僅含有1個(甲基)丙烯醯基和羥基之化合物(單官能化合物)而能夠向聚合物中導入於通式(1)中RD 係僅含有1個聚合性碳-碳雙鍵之基團之結構單元。 藉由使用該等多官能化合物和單官能化合物這兩者,能夠將RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元和RD 係僅含有1個聚合性碳-碳雙鍵之基團之結構單元這兩者導入聚合物中來作為第一結構單元。其中,從立體阻礙方面考慮,單官能化合物具有比多官能化合物更容易與聚合物反應的傾向,因此在反應步驟中,並不從一開始將單官能化合物裝入反應系中而進行“追加”為較佳。As the compound having a hydroxyl group and a polymerizable carbon-carbon double bond, for example, a compound containing 1 or 2 or more (meth)acryloyl groups and a hydroxyl group can be cited. By using a compound (polyfunctional compound) containing two or more (meth)acrylic groups and hydroxyl groups, it can be introduced into the polymer. In the general formula (1), the R D system contains two or more polymerizable carbons- The structural unit of the carbon double bond group. On the other hand, by using a compound (monofunctional compound) containing only one (meth)acryloyl group and a hydroxyl group, it can be introduced into the polymer. In the general formula (1), the R D system contains only one polymerizable The structural unit of the group of carbon-carbon double bond. By using both of these polyfunctional compounds and monofunctional compounds, it is possible to convert the R D system to a structural unit containing two or more polymerizable carbon-carbon double bonds and the R D system to contain only one polymerizable carbon -The two structural units of the carbon double bond group are introduced into the polymer as the first structural unit. Among them, from the perspective of steric hindrance, monofunctional compounds have a tendency to react with polymers more easily than polyfunctional compounds. Therefore, in the reaction step, the monofunctional compound is not charged into the reaction system from the beginning to perform "addition". For better.

作為“含有2個以上的(甲基)丙烯醯基與羥基之化合物”,具體而言,能夠舉出由以下通式(1b-m)表示之化合物或由以下通式(1c-m)表示之化合物。 通式(1b-m)中的k、R、X1 、X1 ’及X2 的定義及具體態樣與通式(1b)相同。 通式(1c-m)中的k、R、X1 、X2 、X3 、X4 、X5 及X6 的定義及具體態樣與通式(1c)相同。As a "compound containing two or more (meth)acrylic groups and a hydroxyl group", specifically, a compound represented by the following general formula (1b-m) or a compound represented by the following general formula (1c-m) can be cited The compound. The definitions and specific aspects of k, R, X 1 , X 1 ′, and X 2 in the general formula (1b-m) are the same as those in the general formula (1b). The definitions and specific aspects of k, R, X 1 , X 2 , X 3 , X 4 , X 5 and X 6 in the general formula (1c-m) are the same as those of the general formula (1c).

Figure 02_image022
Figure 02_image022

Figure 02_image024
Figure 02_image024

作為含有2個以上的(甲基)丙烯醯基和羥基之化合物,以下示出能夠較佳地使用者。此外,還能夠使用將以下所示之化合物的丙烯醯基的一部分或全部設為(甲基)丙烯醯基者(或與其相反者)等。As a compound containing two or more (meth)acrylic groups and a hydroxyl group, the following shows that it can be used suitably. In addition, it is also possible to use a part or all of the acryloyl groups of the compounds shown below as (meth)acryloyl groups (or the opposite).

Figure 02_image026
Figure 02_image028
Figure 02_image026
Figure 02_image028

Figure 02_image030
Figure 02_image030

Figure 02_image032
Figure 02_image032

Figure 02_image034
Figure 02_image034

Figure 02_image036
Figure 02_image036

另一方面,作為“含有僅1個(甲基)丙烯醯基和羥基作化合物”,例如可舉出由以下通式(2a-m)表示之化合物。 通式(2a-m)中,X10 及R的定義和具體態樣與通式(2a)相同。On the other hand, as "compounds containing only one (meth)acryloyl group and a hydroxyl group", for example, compounds represented by the following general formula (2a-m) can be cited. In the general formula (2a-m), the definitions and specific aspects of X 10 and R are the same as those in the general formula (2a).

Figure 02_image038
Figure 02_image038

作為由通式(2a-m)表示之化合物的具體例,能夠舉出(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸4-羥丁酯、1,4-環己烷二甲醇單(甲基)丙烯酸酯、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸2-羥丁酯、-(甲基)丙烯酸2-羥基-3-苯氧基丙酯、2-(甲基)丙烯醯氧基乙基-2-羥乙基鄰苯二甲酸等。Specific examples of the compound represented by the general formula (2a-m) include 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and 1,4-cyclohexanedimethanol Mono(meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl -(meth)acrylate, 2- (Methyl) propylene oxyethyl-2-hydroxyethyl phthalic acid, etc.

反應步驟之後,用有機溶劑稀釋反應溶液,並且/或者為了中和鹼性觸媒而添加酸,藉此停止反應。 藉由以上步驟能夠得到聚合物。After the reaction step, the reaction solution is diluted with an organic solvent, and/or an acid is added to neutralize the alkaline catalyst, thereby stopping the reaction. The polymer can be obtained through the above steps.

僅作為參考,於反應步驟中藉由適當地調整具有羥基及聚合性碳-碳雙鍵之化合物的量等,原料聚合物中的順丁烯二酸酐結構不會全部開環而最終聚合物中會包含式(MA)的結構。 又,在反應步驟中藉由使原料聚合物中的順丁烯二酸酐結構與水、醇、其他適當的物質反應而能夠將由通式(a2-1)、(a2-2)或(a2-3)表示之結構單元導入聚合物中。For reference only, in the reaction step, by appropriately adjusting the amount of the compound having a hydroxyl group and a polymerizable carbon-carbon double bond, etc., the maleic anhydride structure in the raw polymer will not be completely ring-opened and the final polymer Will contain the structure of formula (MA). In addition, in the reaction step, the maleic anhydride structure in the base polymer can be reacted with water, alcohol, and other appropriate substances to convert the formula (a2-1), (a2-2) or (a2- 3) The indicated structural unit is introduced into the polymer.

為了去除除了所希望的聚合物以外的多餘成分等,進而適當地進行以下步驟為較佳。In order to remove unnecessary components and the like other than the desired polymer, it is further preferable to appropriately perform the following steps.

首先,使用分液漏斗將在上述中用有機溶劑進行稀釋並添加酸(例如甲酸等)而成之反應溶液至少劇烈攪拌3分鐘。將其靜置30分鐘以上而分為有機相和水相,並去除水相。如此得到聚合物的有機溶液。First, use a separatory funnel to dilute the above-mentioned organic solvent and add acid (such as formic acid, etc.) to the reaction solution and vigorously stir for at least 3 minutes. Let it stand for more than 30 minutes to separate into an organic phase and an aqueous phase, and remove the aqueous phase. In this way, an organic solution of the polymer is obtained.

向所得到之聚合物的有機溶液添加過量的甲苯而使聚合物再沉澱。又,進而用甲苯將藉由再沉澱而得到之聚合物粉末清洗幾次。 進而,為了去除甲酸或鹼性觸媒而重複幾次(3次左右)用離子交換水清洗所得到之聚合物粉末之操作。 將用離子交換水清洗之後的聚合物粉末例如在30~60℃乾燥16小時以上,藉此能夠得到高純度的聚合物。An excess of toluene was added to the organic solution of the obtained polymer to re-precipitate the polymer. Furthermore, the polymer powder obtained by reprecipitation was washed several times with toluene. Furthermore, in order to remove formic acid or alkaline catalyst, the operation of washing the obtained polymer powder with ion exchange water was repeated several times (about 3 times). The polymer powder after washing with ion-exchange water is dried, for example, at 30 to 60°C for 16 hours or more, whereby a high-purity polymer can be obtained.

(光聚合起始劑) 本實施形態的感光性樹脂組成物較佳為含有光聚合起始劑。 藉由光照射而產生之成分只要為使聚合物的通式(1)的結構單元中所含有之聚合性雙鍵反應而成者,則作為光聚合起始劑而能夠使用任意者。光聚合起始劑例如可以為光自由基聚合起始劑、光陽離子聚合起始劑、光陰離子聚合起始劑等。 此外,光聚合起始劑典型地藉由紫外光,更具體而言藉由g射線、i射線等的照射而產生活性化學物種。(Photopolymerization initiator) The photosensitive resin composition of this embodiment preferably contains a photopolymerization initiator. As long as the component generated by light irradiation reacts the polymerizable double bond contained in the structural unit of the general formula (1) of the polymer, any one can be used as a photopolymerization initiator. The photopolymerization initiator may be, for example, a photoradical polymerization initiator, a photocationic polymerization initiator, a photoanionic polymerization initiator, and the like. In addition, the photopolymerization initiator typically generates active chemical species by irradiation with ultraviolet light, more specifically, g-ray, i-ray, or the like.

從更高的靈敏度化等觀點考慮,光聚合起始劑較佳為光自由基聚合起始劑。 作為光自由基聚合起始劑並無特別限定,能夠適當地使用公知的化合物。例如,能夠舉出以下化合物。From the viewpoint of higher sensitivity, the photopolymerization initiator is preferably a photoradical polymerization initiator. The radical photopolymerization initiator is not particularly limited, and a known compound can be suitably used. For example, the following compounds can be mentioned.

2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-〔4-(2-羥基乙氧基)苯基〕-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-1-{4-〔4-(2-羥基-2-甲基丙醯基)苄基〕苯基}-2-甲基丙烷-1-酮、2-甲基-1-(4-甲基苯硫基)-2-

Figure 109102806-A0304-12-01
啉基丙烷1-酮、2-苄基-2-二甲胺基-1-(4-
Figure 109102806-A0304-12-01
啉基苯基)-丁酮-1、2-二甲胺基-2-〔(4-甲基苯基)甲基〕-1-〔4-(4-
Figure 109102806-A0304-12-01
啉基)苯基〕-1-丁酮等烷基苯酮系化合物。2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-benzene Propane-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propane-1-one, 2-hydroxy-1-{4- [4-(2-Hydroxy-2-methylpropanyl)benzyl]phenyl}-2-methylpropan-1-one, 2-methyl-1-(4-methylphenylthio)- 2-
Figure 109102806-A0304-12-01
Linyl propane 1-ketone, 2-benzyl-2-dimethylamino-1-(4-
Figure 109102806-A0304-12-01
Alkylphenyl)-butanone-1, 2-dimethylamino-2-[(4-methylphenyl)methyl]-1-[4-(4-
Figure 109102806-A0304-12-01
Alkylphenone-based compounds such as linyl)phenyl]-1-butanone.

二苯甲酮、4,4'-雙(二甲胺基)二苯甲酮、2-羧基二苯甲酮等二苯甲酮系化合物。 安息香甲醚、安息香乙醚、安息香異丙醚、安息香異丁基醚等安息香系化合物。 噻噸酮(thioxanthone)、2-乙基噻噸酮、2-異丙基噻噸酮、2-氯噻噸酮、2,4-二甲基噻噸酮、2、4-二乙基噻噸酮等噻噸酮系化合物。Benzophenone compounds such as benzophenone, 4,4'-bis(dimethylamino)benzophenone, and 2-carboxybenzophenone. Benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether and other benzoin compounds. Thioxanthone (thioxanthone), 2-ethylthioxanthone, 2-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone Thioxanthone compounds such as xanthone.

2-(4-甲氧基苯基)-4,6-雙(三氯甲基)-對稱三𠯤、2-(4-甲氧基萘基)-4,6-雙(三氯甲基)-對稱三𠯤、2-(4-乙氧基萘基)-4,6-雙(三氯甲基)-對稱三𠯤、2-(4-乙氧基羰基萘基)-4,6-雙(三氯甲基)-對稱三𠯤等鹵甲基化三𠯤系化合物。 2-三氯甲基-5-(2'-苯并呋喃基)-1,3,4-㗁二唑、2-三氯甲基-5-〔β-(2'-苯并呋喃基)乙烯基〕-1,3,4-㗁二唑、4-㗁二唑、2-三氯甲基-5-呋喃基-1,3,4-㗁二唑等鹵甲基化㗁二唑系化合物。2-(4-Methoxyphenyl)-4,6-bis(trichloromethyl)-symmetric tris, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl) )-Symmetric tris, 2-(4-ethoxynaphthyl)-4,6-bis(trichloromethyl)-symmetric tris, 2-(4-ethoxycarbonylnaphthyl)-4,6 -Bis(trichloromethyl)-symmetrical tris, and other halomethylated tris series compounds. 2-Trichloromethyl-5-(2'-benzofuranyl)-1,3,4-oxadiazole, 2-trichloromethyl-5-〔β-(2'-benzofuranyl) Vinyl]-1,3,4-oxadiazole, 4-oxadiazole, 2-trichloromethyl-5-furyl-1,3,4-oxadiazole and other halomethylated oxadiazole series Compound.

2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,4-二氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,4,6-三氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑等聯咪唑系化合物。 1,2-辛二酮、1-〔4-(苯硫基)-2-(O-苯甲醯基肟)〕、O-乙醯基-1-[6-(2-甲基苯甲醯基)-9-乙基-9H-咔唑-3-基]乙酮肟等肟酯系化合物。 雙(η5-2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1H-吡咯-1-基)-苯基)鈦等茂鈦系化合物。 對二甲胺基苯甲酸、對二乙胺基苯甲酸等苯甲酸酯系化合物。 9-苯基吖啶等吖啶系化合物。2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4-dichlorobenzene Yl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4,6-trichlorophenyl)-4,4',5 , 5'-tetraphenyl-1,2'-biimidazole and other biimidazole compounds. 1,2-octanedione, 1-[4-(phenylthio)-2-(O-benzyloxime)], O-acetyl-1-[6-(2-methylbenzyl (Acidyl)-9-ethyl-9H-carbazol-3-yl]ethanone oxime and other oxime ester compounds. Titanocene compounds such as bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium. Benzoate compounds such as p-dimethylaminobenzoic acid and p-diethylaminobenzoic acid. Acridine compounds such as 9-phenylacridine.

感光性樹脂組成物可以僅含有1種光聚合起始劑,亦可以含有2種以上的光聚合起始劑。 光聚合起始劑的使用量相對於聚合物100質量份,例如係1~20質量份,較佳為3~10質量份。The photosensitive resin composition may contain only one type of photopolymerization initiator, or may contain two or more types of photopolymerization initiators. The amount of the photopolymerization initiator used is, for example, 1-20 parts by mass, preferably 3-10 parts by mass with respect to 100 parts by mass of the polymer.

(溶劑) 本實施形態的感光性樹脂組成物典型地含有溶劑。藉此,能夠在各種基板表面形成均勻的感光性樹脂膜。 作為溶劑可較佳地使用有機溶劑。具體而言,能夠使用酮系溶劑、酯系溶劑、醚系溶劑、醇系溶劑、內酯系溶劑、碳酸酯系溶劑等中的1種或2種以上。(Solvent) The photosensitive resin composition of this embodiment typically contains a solvent. Thereby, a uniform photosensitive resin film can be formed on the surface of various substrates. As the solvent, an organic solvent can be preferably used. Specifically, one or two or more of ketone solvents, ester solvents, ether solvents, alcohol solvents, lactone solvents, carbonate solvents, and the like can be used.

作為溶劑的例,能夠舉出丙二醇單甲醚(PGME)、丙二醇單甲醚乙酸酯(PGMEA)、乳酸乙酯、甲基異丁基甲醇(MIBC)、γ-丁內酯(GBL)、N-甲基吡咯啶酮(NMP)、甲基正戊酮(MAK)、二乙二醇單甲醚、二乙二醇二甲醚、二乙二醇甲基乙基醚、環己酮或該等的混合物。Examples of solvents include propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate, methyl isobutyl carbinol (MIBC), γ-butyrolactone (GBL), N-methylpyrrolidone (NMP), methyl n-pentanone (MAK), diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, cyclohexanone or A mixture of these.

溶劑的使用量並無特別限定。例如,以不揮發成分的濃度例如成為10~70質量%,較佳為15~60質量%的量而使用。The amount of solvent used is not particularly limited. For example, it is used in an amount such that the concentration of the non-volatile component becomes 10 to 70% by mass, preferably 15 to 60% by mass.

(交聯劑) 本實施形態的感光性樹脂組成物可含有交聯劑。 交聯劑只要為能夠藉由由光聚合起始劑產生之活性化學物種的作用而交聯聚合物者(能夠與聚合物化學鍵結者),則並無特別限定。 交聯劑可以藉由交聯劑彼此反應而形成鍵而不僅與聚合物化學鍵結。(Crosslinking agent) The photosensitive resin composition of this embodiment may contain a crosslinking agent. The crosslinking agent is not particularly limited as long as it is capable of crosslinking the polymer (which can be chemically bonded to the polymer) by the action of the active chemical species generated by the photopolymerization initiator. The cross-linking agent can form a bond by reacting the cross-linking agent with each other instead of chemically bonding with the polymer.

交聯劑例如為於一分子中具有2個以上的聚合性雙鍵之多官能化合物為較佳,於一分子中具有2個以上的(甲基)丙烯醯基之多官能(甲基)丙烯酸化合物為更佳(其中,交聯劑並不相當於前述聚合物)。從均勻的硬化性、靈敏性的進一步提高等方面考慮,使用具有種類與聚合物所具有之交聯性基團(聚合性雙鍵)相同之交聯性基團之交聯劑為較佳。 交聯劑的每一分子的官能數(聚合性雙鍵的數)的上限並無特別限定,例如為8以下,較佳為6以下。The crosslinking agent is preferably a multifunctional compound having two or more polymerizable double bonds in one molecule, and a multifunctional (meth)acrylic acid having two or more (meth)acryloyl groups in one molecule. The compound is more preferable (wherein, the crosslinking agent is not equivalent to the aforementioned polymer). From the viewpoints of uniform curability and further improvement of sensitivity, it is preferable to use a crosslinking agent having a crosslinkable group (polymerizable double bond) of the same kind as that of the polymer. The upper limit of the number of functions (number of polymerizable double bonds) per molecule of the crosslinking agent is not particularly limited, and is, for example, 8 or less, preferably 6 or less.

作為交聯劑,具體而言,能夠舉出以下。As a crosslinking agent, the following can be mentioned specifically,.

乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯、環己烷二甲醇二(甲基)丙烯酸酯、雙酚A環氧烷二(甲基)丙烯酸酯、雙酚F環氧烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二三羥甲基丙烷四(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、環氧乙烷加成三羥甲基丙烷三(甲基)丙烯酸酯、環氧乙烷加成二三羥甲基丙烷四(甲基)丙烯酸酯、環氧乙烷加成新戊四醇四(甲基)丙烯酸酯、環氧乙烷加成二新戊四醇六(甲基)丙烯酸酯、環氧丙烷加成三羥甲基丙烷三(甲基)丙烯酸酯、環氧丙烷加成二三羥甲基丙烷四(甲基)丙烯酸酯、環氧丙烷加成新戊四醇四(甲基)丙烯酸酯、環氧丙烷加成二新戊四醇六(甲基)丙烯酸酯、ε-己內酯加成三羥甲基丙烷三(甲基)丙烯酸酯、ε-己內酯加成二三羥甲基丙烷四(甲基)丙烯酸酯、ε-己內酯加成新戊四醇四(甲基)丙烯酸酯、ε-己內酯加成二新戊四醇六(甲基)丙烯酸酯等多官能(甲基)丙烯酸酯類。Ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate Base) acrylate, hexanediol di(meth)acrylate, cyclohexane dimethanol di(meth)acrylate, bisphenol A alkylene oxide two (meth)acrylate, bisphenol F alkylene oxide two (Meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, glycerol tri(meth)acrylate, neopentaerythritol tetra(meth)acrylate Base) acrylate, dineopentyl erythritol penta(meth)acrylate, dineopentol hexa(meth)acrylate, ethylene oxide addition trimethylolpropane tri(meth)acrylate, Ethylene oxide addition ditrimethylolpropane tetra (meth) acrylate, ethylene oxide addition neopentyl erythritol tetra (meth) acrylate, ethylene oxide addition dineopentaerythritol hexa (Meth) acrylate, propylene oxide addition trimethylolpropane tri(meth)acrylate, propylene oxide addition ditrimethylolpropane tetra(meth)acrylate, propylene oxide addition new Pentaerythritol tetra(meth)acrylate, propylene oxide addition, dineopentaerythritol hexa(meth)acrylate, ε-caprolactone addition, trimethylolpropane tri(meth)acrylate, ε -Caprolactone addition ditrimethylolpropane tetra(meth)acrylate, ε-caprolactone addition neopentylerythritol tetra(meth)acrylate, ε-caprolactone addition Multifunctional (meth)acrylates such as alcohol hexa (meth)acrylate.

乙二醇二乙烯基醚、二乙二醇二乙烯基醚、聚乙二醇二乙烯基醚、丙二醇二乙烯基醚、丁二醇二乙烯基醚、己二醇二乙烯基醚、雙酚A環氧烷二乙烯基醚、雙酚F環氧烷二乙烯基醚、三羥甲基丙烷三乙烯基醚、二三羥甲基丙烷四乙烯基醚、甘油三乙烯基醚、新戊四醇四乙烯基醚、二新戊四醇五乙烯基醚、二新戊四醇六乙烯基醚、環氧乙烷加成三羥甲基丙烷三乙烯基醚、環氧乙烷加成二三羥甲基丙烷四乙烯基醚、環氧乙烷加成新戊四醇四乙烯基醚、環氧乙烷加成二新戊四醇六乙烯基醚等多官能乙烯基醚類。Ethylene glycol divinyl ether, diethylene glycol divinyl ether, polyethylene glycol divinyl ether, propylene glycol divinyl ether, butylene glycol divinyl ether, hexanediol divinyl ether, bisphenol A alkylene oxide divinyl ether, bisphenol F alkylene oxide divinyl ether, trimethylolpropane trivinyl ether, ditrimethylolpropane tetravinyl ether, glycerol trivinyl ether, neopentyl four Alcohol tetravinyl ether, dineopentaerythritol pentavinyl ether, dineopentaerythritol hexavinyl ether, ethylene oxide addition trimethylolpropane trivinyl ether, ethylene oxide addition two or three Multifunctional vinyl ethers such as methylol propane tetravinyl ether, ethylene oxide addition neopentyl erythritol tetravinyl ether, ethylene oxide addition dineopentaerythritol hexavinyl ether, etc.

(甲基)丙烯酸2-乙烯氧基乙酯、(甲基)丙烯酸3-乙烯氧基丙酯、(甲基)丙烯酸1-甲基-2-乙烯氧基乙酯、(甲基)丙烯酸2-乙烯氧基丙酯、(甲基)丙烯酸4-乙烯氧基丁酯、(甲基)丙烯酸4-乙烯氧基環己酯、(甲基)丙烯酸5-乙烯氧基戊酯、(甲基)丙烯酸6-乙烯氧基己酯、(甲基)丙烯酸4-乙烯氧基甲基環己基甲酯、(甲基)丙烯酸對乙烯氧基甲基苯基甲酯、(甲基)丙烯酸2-(乙烯氧基乙氧基)乙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基乙氧基乙氧基)乙酯等含有乙烯基醚基的(甲基)丙烯酸酯類。2-vinyloxyethyl (meth)acrylate, 3-vinyloxypropyl (meth)acrylate, 1-methyl-2-vinyloxyethyl (meth)acrylate, (meth)acrylic acid 2 -Vinyloxypropyl, 4-vinyloxybutyl (meth)acrylate, 4-vinyloxycyclohexyl (meth)acrylate, 5-vinyloxypentyl (meth)acrylate, (methyl) ) 6-vinyloxyhexyl acrylate, 4-vinyloxymethylcyclohexylmethyl (meth)acrylate, p-vinyloxymethylphenylmethyl (meth)acrylate, 2-(meth)acrylate Vinyl ether group-containing (meth)acrylates such as (vinyloxyethoxy)ethyl and 2-(vinyloxyethoxyethoxyethoxy)ethyl (meth)acrylate.

乙二醇二烯丙基醚、二乙二醇二烯丙基醚、聚乙二醇二烯丙基醚、丙二醇二烯丙基醚、丁二醇二烯丙基醚、己二醇二烯丙基醚、雙酚A環氧烷二烯丙基醚、雙酚F環氧烷二烯丙基醚、三羥甲基丙烷三烯丙基醚、二三羥甲基丙烷四烯丙基醚、甘油三烯丙基醚、新戊四醇四烯丙基醚、二新戊四醇五烯丙基醚、二新戊四醇六烯丙基醚、環氧乙烷加成三羥甲基丙烷三烯丙基醚、環氧乙烷加成二三羥甲基丙烷四烯丙基醚、環氧乙烷加成新戊四醇四烯丙基醚、環氧乙烷加成二新戊四醇六烯丙基醚等多官能烯丙基醚類。Ethylene glycol diallyl ether, diethylene glycol diallyl ether, polyethylene glycol diallyl ether, propylene glycol diallyl ether, butylene glycol diallyl ether, hexanediol diene Propyl ether, bisphenol A alkylene oxide diallyl ether, bisphenol F alkylene oxide diallyl ether, trimethylolpropane triallyl ether, ditrimethylolpropane tetraallyl ether , Glycerol triallyl ether, neopentyl erythritol tetraallyl ether, dineopentyl erythritol pentaallyl ether, dineopentaerythritol hexaallyl ether, ethylene oxide addition trimethylol Propane triallyl ether, ethylene oxide addition ditrimethylolpropane tetraallyl ether, ethylene oxide addition neopentyl erythritol tetraallyl ether, ethylene oxide addition dinepentyl ether Multifunctional allyl ethers such as tetraol hexaallyl ether.

(甲基)丙烯酸烯丙酯等含有烯丙基的(甲基)丙烯酸酯類。 三(丙烯醯氧基乙基)三聚異氰酸酯、三(甲基丙烯醯氧基乙基)三聚異氰酸酯、環氧烷加成三(丙烯醯氧基乙基)三聚異氰酸酯、環氧烷加成三(甲基丙烯醯氧基乙基)三聚異氰酸酯等含有多官能(甲基)丙烯醯基的三聚異氰酸酯類。 三烯丙基三聚異氰酸酯等具有多官能烯丙基的三聚異氰酸酯類。 甲苯二異氰酸酯、異佛爾酮二異氰酸酯、二亞甲基二異氰酸酯等藉由多官能異氰酸酯與(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯等含有羥基的(甲基)丙烯酸酯類的反應而得的多官能(甲基)丙烯酸胺酯(urethane (meth)acrylate)類。 二乙烯基苯等多官能芳香族乙烯類。(Meth)acrylates containing allyl groups, such as allyl (meth)acrylate. Tris (propylene oxyethyl) trimer isocyanate, tris (methacryloyloxy ethyl) trimer isocyanate, alkylene oxide addition Tris (propylene oxyethyl) trimer isocyanate, alkylene oxide addition Tris (methacryloxyethyl) trimer isocyanate and other trimeric isocyanates containing polyfunctional (meth)acrylic groups. Trimeric isocyanates having polyfunctional allyl groups such as triallyl isocyanate. Toluene diisocyanate, isophorone diisocyanate, dimethylene diisocyanate, etc. are combined with polyfunctional isocyanate and 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, etc. ( Polyfunctional (meth)acrylate (urethane (meth)acrylate) obtained by the reaction of meth)acrylates. Multifunctional aromatic vinyls such as divinylbenzene.

其中,三羥甲基丙烷三(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯等三官能(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二三羥甲基丙烷四(甲基)丙烯酸酯等四官能(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯等六官能(甲基)丙烯酸酯為較佳。Among them, trifunctional (meth)acrylates such as trimethylolpropane tri(meth)acrylate, neopentaerythritol tri(meth)acrylate, neopentaerythritol tetra(meth)acrylate, di-tris Tetrafunctional (meth)acrylates such as methylolpropane tetra(meth)acrylate and hexafunctional (meth)acrylates such as dineopentaerythritol hexa(meth)acrylate are preferred.

當感光性樹脂組成物含有交聯劑時,感光性樹脂組成物可僅含有1種交聯劑,亦可以含有2種以上的交聯劑。 當感光性樹脂組成物含有交聯劑時,其量依目的或用途而適當設定即可。作為一例,交聯劑的量相對於聚合物100質量份通常能夠設為30~70質量份,較佳為40~60質量份。When the photosensitive resin composition contains a crosslinking agent, the photosensitive resin composition may contain only 1 type of crosslinking agent, and may contain 2 or more types of crosslinking agents. When the photosensitive resin composition contains a crosslinking agent, the amount may be appropriately set according to the purpose or application. As an example, the amount of the crosslinking agent can be generally 30 to 70 parts by mass, and preferably 40 to 60 parts by mass relative to 100 parts by mass of the polymer.

(著色劑) 本實施形態的感光性樹脂組成物能夠含有著色劑。組成物含有著色劑,藉此能夠較佳地用作顯示裝置或成像元件的濾色器的形成材料。 作為著色劑,能夠使用各種顏料或染料。(Colorant) The photosensitive resin composition of this embodiment can contain a coloring agent. The composition contains a colorant, and thereby can be preferably used as a material for forming a color filter of a display device or an imaging element. As the coloring agent, various pigments or dyes can be used.

作為顏料,能夠使用有機顏料或無機顏料。 作為有機顏料,能夠使用偶氮系顏料、酞菁系顏料、喹吖酮系顏料、苝系顏料、紫環酮(perinone)系顏料、異吲哚啉酮系顏料、異吲哚啉系顏料、二㗁𠯤系顏料、硫靛系顏料、蒽醌系顏料、喹啉黃系顏料、金屬絡合物系顏料、二酮吡咯并吡咯(diketopyrrolopyrrole)系顏料、

Figure 109102806-A0304-12-02
Figure 109102806-A0304-12-03
系顏料、吡咯亞甲基(pyrromethene)系顏料、染料色澱系顏料等。 作為無機顏料,能夠使用白色、體質顏料(氧化鈦、氧化鋅、硫化鋅、黏土、滑石、硫酸鋇、碳酸鈣等)、彩色顏料(鉻黃、鎘系、鉻朱紅(chrome vermilion)、鎳鈦、鉻鈦、黃色氧化鐵、紅丹、鉻酸鋅、鉛丹、群青、鐵藍、鈷藍、鉻綠、氧化鉻、釩酸鉍等)、發亮材料顏料(珍珠顏料、鋁顏料、青銅顏料等)、螢光顏料(硫化鋅、硫化鍶、鋁酸鍶等)等。As the pigment, organic pigments or inorganic pigments can be used. As organic pigments, azo pigments, phthalocyanine pigments, quinacridone pigments, perylene pigments, perinone pigments, isoindolinone pigments, isoindoline pigments, Diketopyrrolopyrrole pigments, thioindigo pigments, anthraquinone pigments, quinoline yellow pigments, metal complex pigments, diketopyrrolopyrrole pigments,
Figure 109102806-A0304-12-02
Figure 109102806-A0304-12-03
Pigments, pyrromethene pigments, dye lake pigments, etc. As inorganic pigments, white, extender pigments (titanium oxide, zinc oxide, zinc sulfide, clay, talc, barium sulfate, calcium carbonate, etc.), color pigments (chrome yellow, cadmium series, chrome vermilion), nickel titanium can be used , Chrome titanium, yellow iron oxide, red lead, zinc chromate, lead lead, ultramarine blue, iron blue, cobalt blue, chrome green, chromium oxide, bismuth vanadate, etc.), brightening material pigments (pearl pigments, aluminum pigments, bronze Pigments, etc.), fluorescent pigments (zinc sulfide, strontium sulfide, strontium aluminate, etc.), etc.

作為染料,例如能夠使用日本特開2003-270428號公報、日本特開平9-171108號公報、日本特開2008-50599號公報等中所記載之公知的染料。As the dye, for example, known dyes described in JP 2003-270428 A, JP 9-171108 A, and JP 2008-50599 A can be used.

著色劑(尤其顏料)能夠依目的或用途而使用具有適當的平均粒徑者。尤其當要求如濾色器的透明性時,0.1μm以下的較小的平均粒徑為較佳。另一方面,當需要塗料等的隱蔽性時,0.5μm以上的較大的平均粒徑為較佳。 著色劑亦可以依目的、用途,而加以實施松香處理、界面活性劑處理、樹脂系分散劑處理、顏料衍生物處理、氧化皮膜處理、二氧化矽塗佈、蠟塗佈等表面處理。Colorants (especially pigments) can be used with appropriate average particle diameters according to the purpose or use. Particularly when transparency as a color filter is required, a smaller average particle size of 0.1 μm or less is preferable. On the other hand, when concealment properties of paint or the like are required, a larger average particle size of 0.5 μm or more is preferable. The colorant can also be subjected to surface treatments such as rosin treatment, surfactant treatment, resin-based dispersant treatment, pigment derivative treatment, oxide film treatment, silica coating, wax coating, etc., depending on the purpose and application.

當感光性樹脂組成物含有著色劑時,感光性樹脂組成物可以僅含有1種著色劑,亦可以含有2種以上的著色劑。 當感光性樹脂組成物含有著色劑時,其量依目的或用途而適當設定即可,但從兼顧著色濃度與著色劑的分散穩定性等考慮,相對於所有的感光性樹脂組成物的不揮發成分(除了溶劑以外的成分),較佳為3~70質量%,更佳為5~60質量%,進一步較佳為10~50質量%。When the photosensitive resin composition contains a coloring agent, the photosensitive resin composition may contain only 1 type of coloring agent, and may contain 2 or more types of coloring agents. When the photosensitive resin composition contains a coloring agent, the amount may be appropriately set according to the purpose or use. However, considering the balance of the coloring concentration and the dispersion stability of the coloring agent, it is non-volatile with respect to all photosensitive resin compositions The components (components other than the solvent) are preferably 3 to 70% by mass, more preferably 5 to 60% by mass, and still more preferably 10 to 50% by mass.

(遮光劑) 本實施形態的感光性樹脂組成物能夠含有遮光劑。組成物含有遮光劑,藉此能夠較佳地用作顯示裝置或成像元件的黑矩陣的形成材料。 作為遮光劑,能夠使用公知的遮光劑而並無特別限制。例如,能夠使用碳黑、骨黑、石墨、鐵黑(iron black)、鈦黑等黑色顏料來作為遮光劑。(Sunscreen) The photosensitive resin composition of this embodiment can contain a light-shielding agent. The composition contains a light-shielding agent, whereby it can be preferably used as a black matrix forming material of a display device or an imaging element. As the light-shielding agent, a well-known light-shielding agent can be used without particular limitation. For example, black pigments such as carbon black, bone black, graphite, iron black, and titanium black can be used as the sunscreen.

當感光性樹脂組成物含有遮光劑時,其量依目的或用途而適當設定即可,但從兼備遮光性能與遮光劑的分散穩定性等考慮,相對於所有的感光性樹脂組成物的不揮發成分(除了溶劑以外的成分),較佳為3~70質量%,更佳為5~60質量%,進一步較佳為10~50質量%。When the photosensitive resin composition contains a light-shielding agent, the amount may be appropriately set according to the purpose or application. However, considering the compatibility of light-shielding performance and the dispersion stability of the light-shielding agent, it is non-volatile with respect to all photosensitive resin compositions The components (components other than the solvent) are preferably 3 to 70% by mass, more preferably 5 to 60% by mass, and still more preferably 10 to 50% by mass.

(其他成分) 本實施形態的感光性樹脂組成物亦可以依各種目的或要求特性而含有除了上述以外的成分。 作為可以含有之成分,例如可舉出,填料、除了上述聚合物以外的黏合劑樹脂、多官能(甲基)丙烯酸酯化合物、產酸劑、耐熱改善劑、顯影助劑、塑化劑、聚合抑制劑、紫外線吸收劑、抗氧化劑、消光劑、消泡劑、整平劑、界面活性劑、抗靜電劑、分散劑、滑澤劑(slipping agent)、表面改質劑、觸變劑、矽烷偶合劑、多元酚化合物等。(Other ingredients) The photosensitive resin composition of this embodiment may contain components other than the above according to various purposes or required characteristics. Examples of components that may be contained include fillers, binder resins other than the above-mentioned polymers, polyfunctional (meth)acrylate compounds, acid generators, heat resistance improvers, development aids, plasticizers, and polymerizers. Inhibitors, UV absorbers, antioxidants, matting agents, defoamers, leveling agents, surfactants, antistatic agents, dispersants, slipping agents, surface modifiers, thixotropic agents, silanes Coupling agents, polyphenol compounds, etc.

<圖案、濾色器、黑矩陣、顯示裝置、成像元件及顯示裝置或成像元件的製造方法> 使用上述感光性樹脂組成物而形成膜,並對該膜進行曝光、顯影而能夠形成圖案。該圖案例如適用於濾色器或黑矩陣等。具體而言,使用含有著色劑之感光性樹脂組成物而形成圖案,藉此能夠得到濾色器。又,使用含有遮光劑之感光性樹脂組成物而形成圖案,藉此能夠得到黑矩陣。進而,能夠製造具備濾色器和/或黑矩陣之顯示裝置(典型地為液晶顯示裝置)或成像元件(典型地為固體攝像元件)<Pattern, color filter, black matrix, display device, imaging device, and display device or imaging device manufacturing method> The photosensitive resin composition is used to form a film, and the film can be exposed and developed to form a pattern. This pattern is suitable for, for example, color filters or black matrices. Specifically, a color filter can be obtained by forming a pattern using a photosensitive resin composition containing a colorant. In addition, by forming a pattern using a photosensitive resin composition containing a light-shielding agent, a black matrix can be obtained. Furthermore, it is possible to manufacture a display device (typically a liquid crystal display device) or an imaging element (typically a solid-state imaging device) equipped with a color filter and/or a black matrix

以下對形成圖案之典型步驟進行說明。The typical steps of pattern formation are described below.

•感光性樹脂膜的形成 例如,將本實施形態的感光性樹脂組成物塗佈於任意基板上,並依需要進行乾燥。藉此,首先得到感光性樹脂膜。• Formation of photosensitive resin film For example, the photosensitive resin composition of this embodiment is coated on an arbitrary substrate, and it is dried as needed. By this, first, a photosensitive resin film is obtained.

基板並無特別限定。例如能夠舉出玻璃基板、矽晶圓、陶瓷基板、鋁基板、SiC晶圓、GaN晶圓、覆銅層壓板等。 基板可以為未加工的基板,亦可以為表面形成有電極或元件之基板。為了提高接著性而可以對基板進行表面處理。 感光性樹脂組成物的塗佈方法並無特別限定。塗佈能夠藉由使用了旋轉器之旋轉塗佈、使用了噴塗器之噴霧塗佈、浸漬、印刷、輥塗、噴墨法等而進行。The substrate is not particularly limited. For example, glass substrates, silicon wafers, ceramic substrates, aluminum substrates, SiC wafers, GaN wafers, copper clad laminates, etc. can be cited. The substrate may be an unprocessed substrate or a substrate with electrodes or elements formed on the surface. In order to improve adhesion, the substrate may be surface-treated. The coating method of the photosensitive resin composition is not specifically limited. Coating can be performed by spin coating using a spinner, spray coating using a sprayer, dipping, printing, roll coating, inkjet method, etc.

塗佈到基板上之感光性樹脂組成物的乾燥典型地藉由加熱板、熱風、烘箱等而進行加熱處理。加熱溫度通常為80~140℃,較佳為90~120℃。加熱時間通常為30~600秒,較佳為30~300秒左右。The drying of the photosensitive resin composition applied on the substrate is typically heated by a hot plate, hot air, oven, or the like. The heating temperature is usually 80 to 140°C, preferably 90 to 120°C. The heating time is usually 30 to 600 seconds, preferably about 30 to 300 seconds.

感光性樹脂膜的膜厚並無特別限定,依最終獲得之圖案適當調整即可。膜厚通常為0.5~10μm,較佳為1~5μm。此外,膜厚能夠依感光性樹脂組成物中的溶劑的含量或塗佈方法而調整。The thickness of the photosensitive resin film is not particularly limited, and may be appropriately adjusted according to the pattern finally obtained. The film thickness is usually 0.5 to 10 μm, preferably 1 to 5 μm. In addition, the film thickness can be adjusted depending on the content of the solvent in the photosensitive resin composition or the coating method.

•曝光 曝光典型地經由適當的光罩向感光性樹脂膜照射活性光線而進行。 作為活性光線,例如可舉出X射線、電子束、紫外線、可見光線等。從波長的角度而言,200~500nm的光為較佳。從圖案的解析度或操作性的方面考慮,光源係水銀燈的g射線、h射線或i射線為較佳,尤其i射線為較佳。又,亦可以混合使用2個以上的光線。作為曝光裝置,接觸對準器(contact aligner)、鏡面投影儀(mirror projecter)或步進機為較佳。 曝光的光量依感光性樹脂膜中的光聚合起始劑的量或感光性樹脂膜的膜厚等而適當調整即可。曝光的光量例如為100~500mJ/cm2 左右。• Exposure Exposure is typically performed by irradiating active light to the photosensitive resin film through an appropriate photomask. Examples of active rays include X-rays, electron beams, ultraviolet rays, and visible rays. From the viewpoint of wavelength, light of 200 to 500 nm is preferable. From the viewpoint of pattern resolution and operability, the g-ray, h-ray, or i-ray of a mercury lamp as the light source is preferred, and the i-ray is particularly preferred. In addition, two or more lights may be mixed and used. As the exposure device, a contact aligner, a mirror projecter, or a stepper is preferable. The amount of light for exposure may be appropriately adjusted depending on the amount of the photopolymerization initiator in the photosensitive resin film, the film thickness of the photosensitive resin film, or the like. The amount of exposure light is about 100 to 500 mJ/cm 2, for example.

曝光後,可以依需要而再次對感光性樹脂膜進行加熱(曝光後加熱:Post Exposure Bake(曝光後烘烤))。其中加熱溫度例如為70~150℃,較佳為90~120℃。加熱時間例如為30~600秒,較佳為30~300秒。藉由進行曝光後加熱,藉由光聚合起始劑產生之活性種之聚合反應被促進,且硬化反應被進一步促進。亦即,從製程方面考慮,能夠實現更高的靈敏度化。After exposure, the photosensitive resin film can be heated again as needed (post exposure heating: Post Exposure Bake). The heating temperature is, for example, 70 to 150°C, preferably 90 to 120°C. The heating time is, for example, 30 to 600 seconds, preferably 30 to 300 seconds. By heating after exposure, the polymerization reaction of the active species generated by the photopolymerization initiator is promoted, and the hardening reaction is further promoted. That is, from the viewpoint of manufacturing process, higher sensitivity can be achieved.

•顯影 藉由適當的顯影液對經曝光之感光性樹脂膜進行顯影,藉此能夠得到圖案,且能夠製造具備圖案之基板。 在顯影步驟中,能夠使用適當的顯影液,並例如使用浸漬法、旋覆浸沒法(paddle method)、旋轉噴霧法(spin spray method)等方法而進行顯影。藉由顯影溶析去除感光性樹脂膜的曝光部(當為正型時)或未曝光部(當為負型時)而得到圖案。於使用了本實施形態的感光性樹脂組成物之情形,通常得到負型圖案。•development The exposed photosensitive resin film is developed by an appropriate developer, whereby a pattern can be obtained, and a pattern-equipped substrate can be manufactured. In the development step, an appropriate developer can be used, and development can be performed using methods such as a dipping method, a paddle method, and a spin spray method. The pattern is obtained by removing the exposed portion (when it is a positive type) or the unexposed portion (when it is a negative type) of the photosensitive resin film by development and elution. When the photosensitive resin composition of this embodiment is used, a negative pattern is usually obtained.

能夠使用之顯影液並無特別限定。例如,能夠使用鹼水溶液或有機溶劑。 作為鹼水溶液,具體而言可舉出(i)氫氧化鈉、碳酸鈉、矽酸鈉、氨等無機鹼水溶液、(ii)乙胺、二乙胺、三乙胺、三乙醇胺等有機胺水溶液、(iii)四甲基氫氧化銨、四丁基氫氧化銨等4級氫氧化銨的水溶液等。 作為有機溶劑,具體而言可舉出環戊酮等酮系溶劑、丙二醇單甲醚乙酸酯(PGMEA)或乙酸丁酯等酯系溶劑、丙二醇單甲醚等醚系溶劑等。 顯影液例如可以含有甲醇、乙醇等水溶性有機溶劑或界面活性劑等添加劑。The developer that can be used is not particularly limited. For example, an aqueous alkali solution or an organic solvent can be used. Specific examples of the aqueous alkali solution include (i) aqueous inorganic alkali solutions such as sodium hydroxide, sodium carbonate, sodium silicate, and ammonia, and (ii) aqueous organic amine solutions such as ethylamine, diethylamine, triethylamine, and triethanolamine. , (Iii) Aqueous solutions of quaternary ammonium hydroxide such as tetramethylammonium hydroxide and tetrabutylammonium hydroxide. Specific examples of the organic solvent include ketone solvents such as cyclopentanone, ester solvents such as propylene glycol monomethyl ether acetate (PGMEA) or butyl acetate, and ether solvents such as propylene glycol monomethyl ether. The developer may contain, for example, water-soluble organic solvents such as methanol and ethanol, or additives such as surfactants.

本實施形態中,作為顯影液而使用鹼水溶液為較佳,使用四甲基氫氧化銨或碳酸鈉的水溶液為更佳。 鹼水溶液的濃度較佳為0.1~10質量%,進一步較佳為0.5~5質量%。In this embodiment, it is preferable to use an aqueous alkali solution as the developer, and it is more preferable to use an aqueous solution of tetramethylammonium hydroxide or sodium carbonate. The concentration of the aqueous alkali solution is preferably 0.1 to 10% by mass, more preferably 0.5 to 5% by mass.

顯影後,進而可以進行各種處理。 例如,顯影後,可以藉由沖洗液而清洗圖案和/或基板。作為沖洗液,例如可舉出蒸餾水、甲醇、乙醇、異丙醇、丙二醇單甲醚等。該等可以單獨使用,亦可以組合使用2種以上After development, various treatments can be performed. For example, after development, the pattern and/or the substrate can be cleaned by a rinse liquid. Examples of the rinse liquid include distilled water, methanol, ethanol, isopropanol, and propylene glycol monomethyl ether. These can be used alone or in combination of two or more

又,可以對所得到之圖案進行加熱而使其充分硬化。加熱溫度典型地為150~400℃,較佳為160~300℃,更佳為200~250℃。加熱時間並無特別限定,例如在15~300分的範圍內。該加熱處理能夠藉由加熱板、烘箱、能夠設定溫度程序之升溫式烘箱等進行。作為進行加熱處理時的環境氣體,可以為空氣,亦可以為氮或氬等非活性氣體。又,亦可以於減壓下進行加熱。In addition, the obtained pattern can be heated to fully harden it. The heating temperature is typically 150 to 400°C, preferably 160 to 300°C, more preferably 200 to 250°C. The heating time is not particularly limited, and is, for example, in the range of 15 to 300 minutes. The heating treatment can be performed by a heating plate, an oven, a temperature-rising oven capable of setting a temperature program, and the like. As the ambient gas when the heat treatment is performed, air or inert gas such as nitrogen or argon may be used. In addition, heating may be performed under reduced pressure.

藉由以上步驟,能夠得到圖案並製造具備圖案之基板。更具體而言,能夠使用含有著色劑之感光性樹脂組成物而得到濾色器。又,能夠使用含有遮光劑之感光性樹脂組成物而得到黑矩陣。進而,能夠製造具備濾色器和/或黑矩陣之顯示裝置(典型地為液晶顯示裝置)或成像元件(典型地為固體攝像元件)。Through the above steps, a pattern can be obtained and a patterned substrate can be manufactured. More specifically, a color filter can be obtained using a photosensitive resin composition containing a colorant. In addition, a black matrix can be obtained using a photosensitive resin composition containing a light-shielding agent. Furthermore, it is possible to manufacture a display device (typically a liquid crystal display device) or an imaging element (typically a solid-state imaging device) provided with a color filter and/or a black matrix.

圖1中示意性地示出具備濾色器和/或黑矩陣之顯示裝置和/或成像元件的結構的一例。 於基板10上形成有黑矩陣11和濾色器12。又,於該黑矩陣11和濾色器12的上部設置有保護膜13及透明電極層14。 基板10通常由透射光之材料構成。例如由玻璃、聚酯、聚碳酸酯、聚烯烴、聚碸、環狀烯烴的聚合物等中的任一種構成。 基板10可以被實施電暈放電處理、臭氧處理、化學處理等。 基板10例如由玻璃構成。FIG. 1 schematically shows an example of the structure of a display device and/or an imaging element provided with a color filter and/or a black matrix. A black matrix 11 and color filters 12 are formed on the substrate 10. In addition, a protective film 13 and a transparent electrode layer 14 are provided on the upper part of the black matrix 11 and the color filter 12. The substrate 10 is usually made of a material that transmits light. For example, it is composed of any one of glass, polyester, polycarbonate, polyolefin, polysulfide, and cyclic olefin polymer. The substrate 10 may be subjected to corona discharge treatment, ozone treatment, chemical treatment, or the like. The substrate 10 is made of glass, for example.

黑矩陣11通常為含有遮光劑之感光性樹脂組成物的硬化物。 作為濾色器12,通常存在紅、綠、藍這三種顏色。濾色器12通常為含有與各顏色對應之著色劑之感光性樹脂組成物的硬化物。The black matrix 11 is usually a cured product of a photosensitive resin composition containing a light-shielding agent. As the color filter 12, there are usually three colors of red, green, and blue. The color filter 12 is usually a cured product of a photosensitive resin composition containing a coloring agent corresponding to each color.

以上,對本發明的實施形態進行了敘述,但該等為本發明的例示,且能夠採用除了上述以外的各種構成。又,本發明並不限定於上述實施形態,在能夠實現本發明的目的的範圍內的變形、改良等亦包含於本發明中。 [實施例]The embodiments of the present invention have been described above, but these are examples of the present invention, and various configurations other than the above can be adopted. In addition, the present invention is not limited to the above-mentioned embodiment, and modifications, improvements, etc., within the range that can achieve the object of the present invention are also included in the present invention. [Example]

根據實施例及比較例對本發明的實施態樣進行說明。此外,本發明並不限定於實施例。The embodiments of the present invention will be described based on examples and comparative examples. In addition, this invention is not limited to an Example.

關於實施例中的使用化合物,有時以以下縮寫或商品名表示。 •MA:順丁烯二酸酐 •NB:2-降莰烯 •MEK:甲基乙基酮 •BHEA:丙烯酸2-羥基乙酯 •4-HBA:丙烯酸4-羥丁酯The compounds used in the examples are sometimes represented by the following abbreviations or trade names. •MA: Maleic anhydride •NB: 2-Norbornene •MEK: Methyl ethyl ketone • BHEA: 2-hydroxyethyl acrylate • 4-HBA: 4-hydroxybutyl acrylate

•A-TMM-3L:以下2種化合物的混合物、基於氣相層析儀測定之混合物中的左側化合物的量為約55%(Shin-Nakamura Chemical Co.,Ltd製)• A-TMM-3L: A mixture of the following two compounds, the amount of the left compound in the mixture measured by gas chromatograph is about 55% (manufactured by Shin-Nakamura Chemical Co., Ltd.)

Figure 02_image040
Figure 02_image040

•A-TMM-3LM-N:以下2種化合物的混合物、基於氣相層析儀測定之混合物中的左側化合物的量為約57%(Shin-Nakamura Chemical Co.,Ltd製)•A-TMM-3LM-N: A mixture of the following two compounds, the amount of the left compound in the mixture measured by gas chromatograph is about 57% (manufactured by Shin-Nakamura Chemical Co., Ltd.)

Figure 02_image040
Figure 02_image040

•A-9550:以下2種化合物的混合物、根據羥基值估算之混合物中的右側化合物的量為約50%(Shin-Nakamura Chemical Co.,Ltd製)•A-9550: A mixture of the following two compounds. The amount of the right compound in the mixture estimated from the hydroxyl value is about 50% (manufactured by Shin-Nakamura Chemical Co., Ltd.)

Figure 02_image043
Figure 02_image043

<原料聚合物的合成> 首先,合成了含有順丁烯二酸酐結構單元和2-降莰烯結構單元之原料聚合物。以下示出詳細內容。<Synthesis of raw polymer> Firstly, a raw polymer containing maleic anhydride structural unit and 2-norbornene structural unit was synthesized. The details are shown below.

(原料聚合物1) 稱取353.02g的順丁烯二酸酐(3.6mol)、338.94g 的2-降莰烯(3.6mol)及33.16g的二甲基-2,2’-偶氮雙(2-甲基丙酸酯)(0.144mol)而裝入到具備攪拌機及冷卻管之適當尺寸的反應容器。將該等溶解於由1030.1g的甲基乙基酮及113.0g的甲苯組成之混合溶劑而製作了溶解液。 對該溶解液通入30分鐘的氮而去除氧,接著攪拌的同時在溫度65℃加熱1.5小時之後,進而在80℃加熱6小時使順丁烯二酸酐與2-降莰烯聚合而製作了聚合溶液。 將在上述中得到之聚合溶液滴加到8519.9g的甲醇中而使白色固體沉澱。將所得到之白色固體在溫度120℃進行真空乾燥而得到了具備源自2-降莰烯之結構單元和源自順丁烯二酸酐之結構單元之聚合物(原料聚合物1)607.5g。 使用凝膠滲透層析術(GPC)對所得到之聚合物進行了測定之結果,重均分子量Mw為7000,多分散度(重均分子量Mw)/(數均分子量Mn)為1.82。(Raw polymer 1) Weigh 353.02g of maleic anhydride (3.6mol), 338.94g of 2-norbornene (3.6mol) and 33.16g of dimethyl-2,2'-azobis(2-methylpropionic acid) Ester) (0.144mol) and put it into a reaction vessel of appropriate size equipped with a stirrer and a cooling tube. These were dissolved in a mixed solvent composed of 1030.1 g of methyl ethyl ketone and 113.0 g of toluene to prepare a solution. Nitrogen was passed through the solution for 30 minutes to remove oxygen, followed by heating at 65°C for 1.5 hours while stirring, and then heating at 80°C for 6 hours to polymerize maleic anhydride and 2-norbornene. Polymerization solution. The polymerization solution obtained above was dropped into 8519.9 g of methanol to precipitate a white solid. The obtained white solid was vacuum-dried at a temperature of 120° C. to obtain 607.5 g of a polymer (base polymer 1) having a structural unit derived from 2-norbornene and a structural unit derived from maleic anhydride. The polymer was measured by gel permeation chromatography (GPC), and the weight average molecular weight Mw was 7000, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.82.

(原料聚合物2) 稱取353.02g的順丁烯二酸酐(3.6mol)、338.94g 的2-降莰烯(3.6mol)及33.16g的二甲基-2,2’-偶氮雙(2-甲基丙酸酯)(0.144mol)而裝入到具備攪拌機及冷卻管之適當尺寸的反應容器。將該等溶解於由2654.9g 的MEK及113.0g的甲苯組成之混合溶劑而製作了溶解液。 對該溶解液溶入30分鐘的氮而去除氧,接著攪拌的同時在溫度65℃加熱1.5小時之後,進而在80℃加熱6小時使順丁烯二酸酐與2-降莰烯聚合而製作了聚合溶液。 將在上述中得到之聚合溶液滴加到13972.1g的甲醇中而使白色固體再次沉澱。將所得到之白色固體在溫度120℃進行真空乾燥而得到了具備源自2-降莰烯之結構單元和源自順丁烯二酸酐之結構單元之聚合物(原料聚合物2)569.1g。 對所得到之聚合物進行了GPC測定之結果,重均分子量Mw為4300,多分散度(重均分子量Mw)/(數均分子量Mn)為1.59。(Raw polymer 2) Weigh 353.02g of maleic anhydride (3.6mol), 338.94g of 2-norbornene (3.6mol) and 33.16g of dimethyl-2,2'-azobis(2-methylpropionic acid) Ester) (0.144mol) and put it into a reaction vessel of appropriate size equipped with a stirrer and a cooling tube. These were dissolved in a mixed solvent composed of 2654.9 g of MEK and 113.0 g of toluene to prepare a solution. This solution was dissolved in nitrogen for 30 minutes to remove oxygen, and then heated at 65°C for 1.5 hours while stirring, and then heated at 80°C for 6 hours to polymerize maleic anhydride and 2-norbornene. Polymerization solution. The polymerization solution obtained above was dropped into 1,3972.1 g of methanol to precipitate a white solid again. The obtained white solid was vacuum-dried at a temperature of 120°C to obtain 569.1 g of a polymer (base polymer 2) having a structural unit derived from 2-norbornene and a structural unit derived from maleic anhydride. As a result of GPC measurement of the obtained polymer, the weight average molecular weight Mw was 4300, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.59.

<聚合物的合成(原料聚合物的源自MA之結構單元的開環)> (比較合成例1) 製作了使用含羥基的3官能丙烯酸酯對原料聚合物1的源自MA之結構單元(以下,亦簡單記載為“MA單元”)進行開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加64.15g 的MEK而製作了溶解液。接著,對該溶解液添加96.85g 的A-TMM-3L(上述2種混合物的添加量,以下相同),之後添加9.00g的三乙胺(0.089mol)並在溫度70℃反應6小時而製作了反應溶液。<Synthesis of polymer (ring-opening of MA-derived structural unit of raw polymer)> (Comparative Synthesis Example 1) A polymer in which the MA-derived structural unit (hereinafter, also simply referred to as "MA unit") of the base polymer 1 was ring-opened using a hydroxyl-containing trifunctional acrylate was produced. The details will be described below. First, 64.15 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, add 96.85g of A-TMM-3L (the amount of the above two mixtures, the same below) to this solution, then add 9.00g of triethylamine (0.089mol) and react at 70°C for 6 hours. The reaction solution.

用甲酸水溶液對所製作之反應溶液進行處理而從反應溶液去除了水相。然後,藉由以下步驟對聚合物進行了純化。 •用過量甲苯使聚合物再次沉澱。 •對藉由再次沉澱而得到的聚合物粉末重複進行了2次用過量甲苯進行清洗之操作。 •對上述2次清洗之後的聚合物粉末進行了3次用過量水清洗之操作。The prepared reaction solution was treated with an aqueous formic acid solution to remove the water phase from the reaction solution. Then, the polymer was purified by the following steps. • Use excess toluene to precipitate the polymer again. • The polymer powder obtained by reprecipitation was repeatedly washed with excess toluene twice. • The polymer powder after the above 2 washings was washed with excess water 3 times.

以上得到了用A-TMM-3L對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物23.39g。In the above, 23.39 g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened with A-TMM-3L was obtained.

(比較合成例2) 製作了僅用含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加55.50g 的MEK而製作了溶解液。接著,對該溶解液添加22.65g 的BHEA(0.195mol),之後添加9.00g的三乙胺(0.089mol)進而在溫度70℃反應6小時而製作了反應溶液。 用甲酸水溶液對所得到之反應溶液進行處理而從反應溶液去除了水相。然後,將溶液注入大量純水中而析出了聚合物。濾取所得到之聚合物,進而用純水進行了清洗。 以上得到了僅用BHEA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物27.21g。(Comparative Synthesis Example 2) A polymer in which the MA unit of the base polymer 1 was ring-opened with only a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 55.50 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, 22.65 g of BHEA (0.195 mol) was added to this solution, and then 9.00 g of triethylamine (0.089 mol) was added, and the reaction was further performed at a temperature of 70° C. for 6 hours to prepare a reaction solution. The resulting reaction solution was treated with an aqueous formic acid solution to remove the water phase from the reaction solution. Then, the solution was poured into a large amount of pure water to precipitate a polymer. The obtained polymer was filtered and washed with pure water. In the above, 27.21 g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened only with BHEA was obtained.

(比較合成例3) 製作了僅用含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加55.50g的MEK而製作了溶解液。接著,對該溶解液添加28.11g的4-HBA(0.195mol),之後添加9.00g的三乙胺(0.089mol)進而在溫度70℃反應6小時而製作了反應溶液。 用甲酸水溶液對所得到之反應溶液進行處理而從反應溶液去除了水相。然後,將溶液注入大量純水中而析出了聚合物。濾取所得到之聚合物,進而用純水進行了清洗。 以上得到了用4-HBA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物26.54g。(Comparative Synthesis Example 3) A polymer in which the MA unit of the base polymer 1 was ring-opened with only a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 55.50 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, 28.11 g of 4-HBA (0.195 mol) was added to this solution, and then 9.00 g of triethylamine (0.089 mol) was added, and the reaction was carried out at a temperature of 70° C. for 6 hours to prepare a reaction solution. The resulting reaction solution was treated with an aqueous formic acid solution to remove the water phase from the reaction solution. Then, the solution was poured into a large amount of pure water to precipitate a polymer. The obtained polymer was filtered and washed with pure water. The above obtained 26.54 g of a polymer in which the structural unit derived from maleic anhydride in the raw polymer was ring-opened with 4-HBA.

(合成例1) 製作了用含羥基的3官能丙烯酸酯及含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加67.72g的MEK而製作了溶解液。接著,對該溶解液添加58.12g的A-TMM-3L,之後添加9.00g的三乙胺(0.089mol)並在溫度70℃反應了2小時。然後,進而添加22.65g的BHEA(0.195mol)並在溫度70℃反應4小時而製作了反應溶液。 以與比較合成例1同樣地,用甲酸水溶液、過量甲苯、過量水等對所得到之反應溶液進行了純化。 以上得到了用A-TMM-3L及BHEA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物22.21g。(Synthesis example 1) A polymer in which the MA unit of the base polymer 1 was ring-opened with a hydroxyl-containing trifunctional acrylate and a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 67.72 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, 58.12 g of A-TMM-3L was added to this solution, and then 9.00 g of triethylamine (0.089 mol) was added, and the reaction was carried out at a temperature of 70°C for 2 hours. Then, 22.65 g of BHEA (0.195 mol) was further added and reacted at a temperature of 70° C. for 4 hours to prepare a reaction solution. In the same manner as in Comparative Synthesis Example 1, the resulting reaction solution was purified with formic acid aqueous solution, excess toluene, excess water, and the like. Above, 22.21 g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened with A-TMM-3L and BHEA was obtained.

(合成例2) 製作了用含羥基的3官能丙烯酸酯及含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加49.41g的MEK而製作了溶解液。接著,對該溶解液添加19.37g的A-TMM-3L,之後添加9.00g的三乙胺(0.089mol)並在溫度70℃反應了2小時。然後,進而添加22.65g的BHEA(0.195mol)並在溫度70℃反應4小時而製作了反應溶液。 以與比較合成例1同樣地,用甲酸水溶液、過量甲苯、過量水等對所得到之反應溶液進行了純化。 以上得到了用A-TMM-3L及BHEA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物22.53g。(Synthesis example 2) A polymer in which the MA unit of the base polymer 1 was ring-opened with a hydroxyl-containing trifunctional acrylate and a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 49.41 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, 19.37 g of A-TMM-3L was added to this solution, and then 9.00 g of triethylamine (0.089 mol) was added, and the reaction was carried out at a temperature of 70°C for 2 hours. Then, 22.65 g of BHEA (0.195 mol) was further added and reacted at a temperature of 70° C. for 4 hours to prepare a reaction solution. In the same manner as in Comparative Synthesis Example 1, the resulting reaction solution was purified with formic acid aqueous solution, excess toluene, excess water, and the like. In the above, 22.53 g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened with A-TMM-3L and BHEA was obtained.

(合成例3) 製作了用含羥基的3官能丙烯酸酯及含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加49.51g的MEK而製作了溶解液。接著,對該溶解液添加19.37g 的A-TMM-3L之後,添加18.00g的三乙胺(0.178mol)並在溫度70℃反應了2小時。然後,進而添加22.65g的BHEA(0.195mol)並在溫度70℃反應4小時而製作了反應溶液。 以與比較合成例1同樣地,用甲酸水溶液、過量甲苯、過量水等對所得到之反應溶液進行了純化。 以上得到了用A-TMM-3L及BHEA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物22.10g。(Synthesis example 3) A polymer in which the MA unit of the base polymer 1 was ring-opened with a hydroxyl-containing trifunctional acrylate and a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 49.51 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, after adding 19.37 g of A-TMM-3L to this solution, 18.00 g of triethylamine (0.178 mol) was added and reacted at a temperature of 70° C. for 2 hours. Then, 22.65 g of BHEA (0.195 mol) was further added and reacted at a temperature of 70° C. for 4 hours to prepare a reaction solution. In the same manner as in Comparative Synthesis Example 1, the resulting reaction solution was purified with formic acid aqueous solution, excess toluene, excess water, and the like. The above obtained 22.10 g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened with A-TMM-3L and BHEA.

(合成例4) 製作了用含羥基的3官能丙烯酸酯及含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加49.86g的MEK而製作了溶解液。接著,對該溶解液添加19.37g的A-TMM-3L,之後添加9.00g的三乙胺(0.089mol)並在溫度70℃反應了2小時。然後,進而添加28.13g的4-HBA(0.195mol)並在溫度70℃反應4小時而製作了反應溶液。 以與比較合成例1同樣地,用甲酸水溶液、過量甲苯、過量水等對所得到之反應溶液進行了純化。 以上得到了用A-TMM-3L及4-HBA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物24.64g(Synthesis example 4) A polymer in which the MA unit of the base polymer 1 was ring-opened with a hydroxyl-containing trifunctional acrylate and a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 49.86 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, 19.37 g of A-TMM-3L was added to this solution, and then 9.00 g of triethylamine (0.089 mol) was added, and the reaction was carried out at a temperature of 70°C for 2 hours. Then, 28.13 g of 4-HBA (0.195 mol) was further added and reacted at a temperature of 70° C. for 4 hours to prepare a reaction solution. In the same manner as in Comparative Synthesis Example 1, the resulting reaction solution was purified with formic acid aqueous solution, excess toluene, excess water, and the like. The above obtained 24.64g of a polymer in which the structural unit derived from maleic anhydride in the raw polymer was ring-opened with A-TMM-3L and 4-HBA

(合成例5) 製作了用含羥基的3官能丙烯酸酯及含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加47.35g的MEK而製作了溶解液。接著,對該溶解液添加19.37g的A-TMM-3L,之後添加18.00g的三乙胺(0.178mol)並在溫度70℃反應了2小時。然後,進而添加28.13g的4-HBA(0.195mol)並在溫度70℃反應4小時而製作了反應溶液。 以與比較合成例1同樣地,用甲酸水溶液、過量甲苯、過量水等對所得到之反應溶液進行了純化。 以上得到了用A-TMM-3L及4-HBA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物25.77g。(Synthesis example 5) A polymer in which the MA unit of the base polymer 1 was ring-opened with a hydroxyl-containing trifunctional acrylate and a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 47.35 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, 19.37 g of A-TMM-3L was added to this solution, and then 18.00 g of triethylamine (0.178 mol) was added, and the reaction was carried out at a temperature of 70°C for 2 hours. Then, 28.13 g of 4-HBA (0.195 mol) was further added and reacted at a temperature of 70° C. for 4 hours to prepare a reaction solution. In the same manner as in Comparative Synthesis Example 1, the resulting reaction solution was purified with formic acid aqueous solution, excess toluene, excess water, and the like. The above obtained 25.77 g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened with A-TMM-3L and 4-HBA.

(合成例6) 製作了用含羥基的5官能丙烯酸酯及含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加71.03g的MEK而製作了溶解液。接著,對該溶解液添加43.78g的A-9550,之後添加9.00g的三乙胺(0.089mol)並在溫度70℃反應了2小時。然後,進而對反應溶液添加22.65g的BHEA(0.195mol)並在溫度70℃反應4小時而製作了反應溶液。 以與比較合成例1同樣地,用甲酸水溶液、過量甲苯、過量水等對所得到之反應溶液進行了純化。 以上得到了用A-9550及BHEA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物25.51g。(Synthesis example 6) A polymer in which the MA unit of the base polymer 1 was ring-opened with a hydroxyl group-containing 5-functional acrylate and a hydroxyl group-containing monofunctional acrylate was produced. The details will be described below. First, 71.03 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, 43.78 g of A-9550 was added to this solution, and then 9.00 g of triethylamine (0.089 mol) was added, and the reaction was carried out at a temperature of 70°C for 2 hours. Then, 22.65 g of BHEA (0.195 mol) was further added to the reaction solution and reacted at a temperature of 70° C. for 4 hours to prepare a reaction solution. In the same manner as in Comparative Synthesis Example 1, the resulting reaction solution was purified with formic acid aqueous solution, excess toluene, excess water, and the like. The above obtained 25.51g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened with A-9550 and BHEA.

(合成例7) 製作了用含羥基的3官能丙烯酸酯及含羥基的單官能丙烯酸酯對原料聚合物2的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物2(MA換算0.156mol)添加49.41g的MEK而製作了溶解液。接著,對該溶解液添加19.37g的A-TMM-3LM-N,之後添加9.00g的三乙胺(0.089mol)並在溫度70℃反應了2小時。然後,進而添加22.65g的BHEA(0.195mol)並在溫度70℃反應4小時而製作了反應溶液。 以與比較合成例1同樣地,用甲酸水溶液、過量甲苯、過量水等對所得到之反應溶液進行了純化。 以上得到了用A-TMM-3L及BHEA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物21.11g。(Synthesis example 7) A polymer in which the MA unit of the base polymer 2 was ring-opened with a hydroxyl-containing trifunctional acrylate and a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 49.41 g of MEK was added to 30 g of base polymer 2 (0.156 mol in terms of MA) to prepare a solution. Next, 19.37 g of A-TMM-3LM-N was added to this solution, and then 9.00 g of triethylamine (0.089 mol) was added, and the reaction was carried out at a temperature of 70°C for 2 hours. Then, 22.65 g of BHEA (0.195 mol) was further added and reacted at a temperature of 70° C. for 4 hours to prepare a reaction solution. In the same manner as in Comparative Synthesis Example 1, the resulting reaction solution was purified with formic acid aqueous solution, excess toluene, excess water, and the like. In the above, 21.11 g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened with A-TMM-3L and BHEA was obtained.

(合成例8) 製作了用含羥基的3官能丙烯酸酯及含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加50.60g的MEK而製作了溶解液。接著,對該溶解液添加7.75g的A-TMM-3LM-N,之後添加9.00g的三乙胺(0.089mol)並在溫度70℃反應了2小時。然後,進而添加22.65g的BHEA(0.195mol)並在溫度70℃反應4小時而製作了反應溶液。 以與比較合成例1同樣地,用甲酸水溶液、過量甲苯、過量水等對所得到之反應溶液進行了純化。 以上得到了用A-TMM-3LM-N及BHEA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物20.66g。(Synthesis example 8) A polymer in which the MA unit of the base polymer 1 was ring-opened with a hydroxyl-containing trifunctional acrylate and a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 50.60 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, 7.75 g of A-TMM-3LM-N was added to this solution, and then 9.00 g of triethylamine (0.089 mol) was added, and the reaction was carried out at a temperature of 70°C for 2 hours. Then, 22.65 g of BHEA (0.195 mol) was further added and reacted at a temperature of 70° C. for 4 hours to prepare a reaction solution. In the same manner as in Comparative Synthesis Example 1, the resulting reaction solution was purified with formic acid aqueous solution, excess toluene, excess water, and the like. The above obtained 20.66 g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened with A-TMM-3LM-N and BHEA.

(合成例9) 製作了用含羥基的3官能丙烯酸酯及含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加46.60g的MEK而製作了溶解液。接著,對該溶解液添加7.75g的A-TMM-3L,之後添加18.00g的三乙胺(0.178mol)並在溫度70℃反應了2小時。然後,進而添加22.65g的BHEA(0.195mol)並在溫度70℃反應4小時而製作了反應溶液。 以與比較合成例1同樣地,用甲酸水溶液、過量甲苯、過量水等對所得到之反應溶液進行了純化。 以上得到了用A-TMM-3L及BHEA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物21.22g。(Synthesis Example 9) A polymer in which the MA unit of the base polymer 1 was ring-opened with a hydroxyl-containing trifunctional acrylate and a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 46.60 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, 7.75 g of A-TMM-3L was added to this solution, and then 18.00 g of triethylamine (0.178 mol) was added, and the reaction was carried out at a temperature of 70°C for 2 hours. Then, 22.65 g of BHEA (0.195 mol) was further added and reacted at a temperature of 70° C. for 4 hours to prepare a reaction solution. In the same manner as in Comparative Synthesis Example 1, the resulting reaction solution was purified with formic acid aqueous solution, excess toluene, excess water, and the like. The above obtained 21.22 g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened with A-TMM-3L and BHEA.

(合成例10) 製作了用含羥基的3官能丙烯酸酯及含羥基的單官能丙烯酸酯對原料聚合物1的MA單元進行了開環之聚合物。以下,對詳細內容進行說明。 首先,對30g的原料聚合物1(MA換算0.156mol)添加54.13g的MEK而製作了溶解液。接著,對該溶解液添加29.06g的A-TMM-3LM-N,之後添加18.00g的三乙胺(0.178mol)並在溫度70℃反應了2小時。然後,進而添加22.65g的BHEA(0.195mol)並在溫度70℃反應4小時而製作了反應溶液。 以與比較合成例1同樣地,用甲酸水溶液、過量甲苯、過量水等對所得到之反應溶液進行了純化。 以上得到了用A-TMM-3LM-N及BHEA對原料聚合物中的源自順丁烯二酸酐之結構單元進行了開環之聚合物24.54g。(Synthesis example 10) A polymer in which the MA unit of the base polymer 1 was ring-opened with a hydroxyl-containing trifunctional acrylate and a hydroxyl-containing monofunctional acrylate was produced. The details will be described below. First, 54.13 g of MEK was added to 30 g of base polymer 1 (0.156 mol in terms of MA) to prepare a solution. Next, 29.06 g of A-TMM-3LM-N was added to this solution, and then 18.00 g of triethylamine (0.178 mol) was added, and the reaction was carried out at a temperature of 70°C for 2 hours. Then, 22.65 g of BHEA (0.195 mol) was further added and reacted at a temperature of 70° C. for 4 hours to prepare a reaction solution. In the same manner as in Comparative Synthesis Example 1, the resulting reaction solution was purified with formic acid aqueous solution, excess toluene, excess water, and the like. In the above, 24.54 g of a polymer in which the structural unit derived from maleic anhydride in the base polymer was ring-opened with A-TMM-3LM-N and BHEA was obtained.

<GPC測定> 對於各聚合物,藉由作為聚苯乙烯標準物質之GPC測定而求出了重均分子量及分散度(重均分子量/數均分子量)。 此外,藉由GPC測定確認了丙烯酸酯化合物(BHEA、4-HBA、A-TMM-3L、A-TMM-3LM-N、A-9550)的峰的消失。即,確認到在各合成例及比較合成例的聚合物中,未與原料聚合物的MA單元反應的丙烯酸酯或一開始就未與MA單元反應的丙烯酸酯化合物(不含羥基之丙烯酸酯)被充分去除。<GPC measurement> For each polymer, the weight average molecular weight and the degree of dispersion (weight average molecular weight/number average molecular weight) were determined by GPC measurement as a polystyrene standard material. In addition, the disappearance of the peaks of acrylate compounds (BHEA, 4-HBA, A-TMM-3L, A-TMM-3LM-N, A-9550) was confirmed by GPC measurement. That is, it was confirmed that in the polymers of the respective synthesis examples and comparative synthesis examples, acrylates that did not react with the MA units of the base polymer or acrylate compounds that did not react with the MA units at the beginning (hydroxyl-free acrylates) Is fully removed.

<聚合物的NMR測定> 對於各合成例及比較合成例的聚合物進行了1 H-NMR測定。 以1 H-NMR測定內標準對苯二甲酸二甲酯的苯基的4H的峰(8.1ppm附近)的積分值為基準,並根據聚合物的羧基(-COOH)的H的峰(12.4ppm附近)的積分值求出了羧基的量。進而,根據該量計算出酸值(mgKOH/g)。 酸值的值越大,表示聚合物的每單位質量的羧基的量越多。<NMR measurement of polymer> 1 H-NMR measurement was performed on the polymers of each synthesis example and comparative synthesis example. Based on the integrated value of the 4H peak (near 8.1 ppm) of the phenyl group of the internal standard dimethyl terephthalate measured by 1 H-NMR, and based on the H peak (12.4 ppm) of the carboxyl group (-COOH) of the polymer Near the integral value of) the amount of carboxyl groups is calculated. Furthermore, the acid value (mgKOH/g) was calculated from this amount. The larger the acid value, the larger the amount of carboxyl groups per unit mass of the polymer.

又,同樣地,以對苯二甲酸二甲酯的苯基的4H的峰(8.1ppm附近)的積分值為基準,並根據聚合物中的丙烯醯基部分(CH2 =CH-COO-)的3H的峰(6.2ppm附近)的積分值求出C=C雙鍵的量,根據該量量計算出雙鍵當量(C=C雙鍵每1莫耳的聚合物質量、g/mol)。 雙鍵當量的值越小,表示聚合物的每單位質量的C=C雙鍵的量越多。Also, similarly, based on the integrated value of the 4H peak (near 8.1 ppm) of the phenyl group of dimethyl terephthalate, based on the propylene moiety (CH 2 =CH-COO-) in the polymer The integrated value of the 3H peak (near 6.2ppm) is the amount of C=C double bond, and the double bond equivalent is calculated based on this amount (C=C double bond per mole of polymer mass, g/mol) . The smaller the value of the double bond equivalent, the greater the amount of C=C double bonds per unit mass of the polymer.

表1中匯總示出各合成例及比較合成例的聚合物在合成中所使用的丙烯酸酯化合物、聚合物的重均分子量、分散度、酸值及雙鍵當量。Table 1 collectively shows the acrylate compound used in the synthesis of the polymers of the respective synthesis examples and comparative synthesis examples, and the weight average molecular weight, degree of dispersion, acid value, and double bond equivalent of the polymer.

另外,第一結構單元中RD 為含有2個以上的聚合性碳-碳雙鍵之基團之結構單元的比率和第一結構單元中RD 為僅含有1個聚合性碳-碳雙鍵之基團之結構單元的比率(聚合物的總結構單元中的比率)亦示於表1。該等比率以原料聚合物1或2中的降莰烯結構單元:順丁烯二酸酐結構單元的比率為50:50(莫耳比)為前提,如前述藉由解“聯立方程式”等而求出。 其中,各聚合物中該等2個比率之和小於50mol%。因此,可以說聚合物中的順丁烯二酸酐結構單元未全部開環而一部分仍為由式(MA)表示之結構。In addition, R D in the first structural unit is the ratio of the structural unit of a group containing two or more polymerizable carbon-carbon double bonds, and R D in the first structural unit contains only one polymerizable carbon-carbon double bond The ratio of the structural unit of the group (the ratio of the total structural unit of the polymer) is also shown in Table 1. These ratios are based on the premise that the ratio of the norbornene structural unit: the maleic anhydride structural unit in the raw polymer 1 or 2 is 50:50 (molar ratio), as described above by solving the "simultaneous equation", etc. And find out. Wherein, the sum of these two ratios in each polymer is less than 50 mol%. Therefore, it can be said that not all of the maleic anhydride structural units in the polymer are ring-opened but a part of them still has a structure represented by the formula (MA).

[表1] 聚合物 比較合成例1 比較合成例2 比較合成例3 合成例1 合成例2 合成例3 合成例4 使用丙烯酸酯 A-TMM-3L (3官能) BHEA (單官能) 4-HBA (單官能) A-TMM-3L (3官能) BHEA (單官能) A-TMM-3L (3官能) BHEA (單官能) A-TMM-3L (3官能) BHEA (單官能) A-TMM-3L (3官能) 4-HBA (單官能) 重均分子量Mw 15100 7000 9800 11700 11700 14100 16300 分散度 1.87 1.76 2.05 1.80 1.88 2.08 1.98 酸值(mgKOH/g) 68 103 113 86 95 100 98 雙鍵當量(g/mol) 286 537 530 348 378 323 367 RD 含有2個以上的C=C之結構單元的含有率(所有聚合物中的mol%) 18 0 0 9 6 9 7 RD 僅含有1個C=C之結構單元的含有率(所有聚合物中的mol%) 0 23 27 12 16 16 18 聚合物 合成例5 合成例6 合成例7 合成例8 合成例9 合成例10 使用丙烯酸酯 A-TMM-3L (3官能) 4-HBA (單官能) A-9550 (5官能) BHEA (單官能) A-TMM-3LM-N (3官能) BHEA (單官能) A-TMM-3LM-N (3官能) BHEA (單官能) A-TMM-3L (3官能) BHEA (單官能) A-TMM-3LM-N (3官能) BHEA (單官能) 重均分子量Mw 17300 12600 8200 11400 11000 17600 分散度 2.10 3.45 1.74 1.78 1.72 2.33 酸值(mgKOH/g) 101 72 110 104 126 72 雙鍵當量(g/mol) 323 348 325 459 358 311 RD 含有2個以上的C=C之結構單元的含有率(所有聚合物中的mol%) 10 6 8 2 4 11 RD 僅含有1個C=C之結構單元的含有率(所有聚合物中的mol%) 18 12 20 22 28 15 [Table 1] polymer Comparative Synthesis Example 1 Comparative Synthesis Example 2 Comparative Synthesis Example 3 Synthesis example 1 Synthesis Example 2 Synthesis Example 3 Synthesis Example 4 Use acrylic A-TMM-3L (3 functions) BHEA (monofunctional) 4-HBA (monofunctional) A-TMM-3L (3-functional) BHEA (monofunctional) A-TMM-3L (3-functional) BHEA (monofunctional) A-TMM-3L (3-functional) BHEA (monofunctional) A-TMM-3L (3-functional) 4-HBA (monofunctional) Weight average molecular weight Mw 15100 7000 9800 11700 11700 14100 16,300 Dispersion 1.87 1.76 2.05 1.80 1.88 2.08 1.98 Acid value (mgKOH/g) 68 103 113 86 95 100 98 Double bond equivalent (g/mol) 286 537 530 348 378 323 367 R D contains more than 2 C=C structural units (mol% in all polymers) 18 0 0 9 6 9 7 R D contains only 1 C=C structural unit (mol% in all polymers) 0 twenty three 27 12 16 16 18 polymer Synthesis Example 5 Synthesis Example 6 Synthesis Example 7 Synthesis Example 8 Synthesis Example 9 Synthesis Example 10 Use acrylic A-TMM-3L (3-functional) 4-HBA (monofunctional) A-9550 (5-functional) BHEA (monofunctional) A-TMM-3LM-N (3-functional) BHEA (monofunctional) A-TMM-3LM-N (3-functional) BHEA (monofunctional) A-TMM-3L (3-functional) BHEA (monofunctional) A-TMM-3LM-N (3-functional) BHEA (monofunctional) Weight average molecular weight Mw 17,300 12600 8200 11400 11000 17,600 Dispersion 2.10 3.45 1.74 1.78 1.72 2.33 Acid value (mgKOH/g) 101 72 110 104 126 72 Double bond equivalent (g/mol) 323 348 325 459 358 311 R D contains more than 2 C=C structural units (mol% in all polymers) 10 6 8 2 4 11 R D contains only 1 C=C structural unit (mol% in all polymers) 18 12 20 twenty two 28 15

在此,合成例的聚合物的酸值及雙鍵當量的數值證實了合成例1~10的聚合物中包含由通式(1)表示之結構單元,亦即RD 為含有2個以上的聚合性碳-碳雙鍵之基團之結構單元。以下對該情況進行說明。Here, the acid value and double bond equivalent values of the polymers of Synthesis Examples confirm that the polymers of Synthesis Examples 1 to 10 contain the structural unit represented by the general formula (1), that is, R D contains two or more The structural unit of the group of polymerizable carbon-carbon double bond. This situation will be described below.

考慮用具有羥基及聚合性碳-碳雙鍵之化合物對原料聚合物中的MA單元進行開環。 具有1分子的羥基及聚合性碳-碳雙鍵之化合物使1個MA單元開環,則如通式(1)生成1個羧基。 其中,當具有羥基及聚合性碳-碳雙鍵之化合物如BHEA或4-HBA為單官能化合物時,導入之C=C雙鍵的數為1個。亦即,藉由1個MA單元的開環而羧基增加1個,且C=C雙鍵增加1個。Consider using a compound having a hydroxyl group and a polymerizable carbon-carbon double bond to open the ring of the MA unit in the base polymer. A compound with one molecule of hydroxyl group and polymerizable carbon-carbon double bond opens one MA unit to generate one carboxyl group as shown in the general formula (1). Among them, when a compound having a hydroxyl group and a polymerizable carbon-carbon double bond such as BHEA or 4-HBA is a monofunctional compound, the number of C=C double bonds introduced is one. That is, by ring opening of one MA unit, one carboxyl group increases, and one C=C double bond increases.

另一方面,當具有羥基及聚合性碳-碳雙鍵之化合物如A-TMM-3L或A-9550為多官能化合物時,藉由1個MA單元的開環而羧基增加1個,且C=C雙鍵增加“2個以上”。On the other hand, when a compound with a hydroxyl group and a polymerizable carbon-carbon double bond, such as A-TMM-3L or A-9550, is a polyfunctional compound, the ring opening of one MA unit increases the carboxyl group by one, and C =C double bond increases by "2 or more".

如此,酸值為相同程度(亦即,MA單元的開環量為相同程度)的2種以上的聚合物中,用多官能化合物使MA單元開環之聚合物的雙鍵當量比用單官能化合物使MA單元開環之聚合物的雙鍵當量少。In this way, among two or more polymers with the same acid value (that is, the ring-opening amount of the MA unit is the same), the double bond equivalent of the polymer in which the MA unit is ring-opened with a polyfunctional compound is higher than that of the monofunctional polymer The compound has a small double bond equivalent to open the MA unit of the polymer.

基於該情況確認上表。 合成例1~10的聚合物的酸值(與基於開環之羧基的生成量對應)與比較合成例2、3的聚合物(僅用單官能化合物使MA單元開環者)的酸值相等或比其小。儘管如此,合成例1~10的聚合物的雙鍵當量有較比較合成例2、3的聚合物的雙鍵當量小的趨勢(亦即,聚合物的每單位質量的C=C雙鍵的量多)。這表示合成例1~10的聚合物中導入了源自如A-TMM-3L或A-9550的多官能化合物之結構。Based on this situation, confirm the above table. The acid value of the polymers of Synthesis Examples 1 to 10 (corresponding to the amount of carboxyl group generated based on ring opening) is equal to the acid value of the polymers of Comparative Synthesis Examples 2 and 3 (only monofunctional compounds are used to open the MA unit) Or smaller. Nevertheless, the double bond equivalents of the polymers of Synthesis Examples 1 to 10 tended to be smaller than those of the polymers of Comparative Synthesis Examples 2 and 3 (that is, the C=C double bond equivalent per unit mass of the polymer Large amount). This means that the polymers of Synthesis Examples 1 to 10 have introduced structures derived from polyfunctional compounds such as A-TMM-3L or A-9550.

從合成步驟明確可知源自如A-TMM-3L或A-9550的多官能化合物之結構被導入到原料聚合物中,但如上述,酸值與雙鍵當量的関係亦證實了源自多官能化合物之結構的導入。It is clear from the synthesis steps that the structure derived from a polyfunctional compound such as A-TMM-3L or A-9550 is introduced into the base polymer. However, as mentioned above, the relationship between the acid value and the double bond equivalent also proves that it is derived from polyfunctional Introduction of the structure of the compound.

<評價> [顯影性評價](對TMAH水溶液之聚合物的溶解速度) 將各合成例及比較合成例的聚合物溶解於丙二醇單甲醚乙酸酯(PGMEA)而製作了固體成分濃度30質量%的溶液。 接著,於晶圓上旋塗上述溶液,並對PGMEA進行乾燥,進而在溫度100℃預烘2分鐘而製作了膜厚約2μm的樹脂膜。 將該樹脂膜連同晶圓浸漬於溫度23℃的2.38質量%四甲基氫氧化銨(TMAH)水溶液而測定了樹脂膜的溶解速度。 關於溶解速度,藉由肉眼觀察所浸漬之晶圓而測定直至樹脂膜溶解而看不到干涉圖案為止的時間,並將膜厚除以該時間而進行了計算。<Evaluation> [Developability evaluation] (Dissolution rate of polymer in TMAH aqueous solution) The polymers of each synthesis example and comparative synthesis example were dissolved in propylene glycol monomethyl ether acetate (PGMEA) to prepare a solution with a solid content concentration of 30% by mass. Next, the above solution was spin-coated on the wafer, the PGMEA was dried, and then pre-baked at a temperature of 100° C. for 2 minutes to produce a resin film with a film thickness of about 2 μm. The resin film and the wafer were immersed in a 2.38% by mass tetramethylammonium hydroxide (TMAH) aqueous solution at a temperature of 23° C., and the dissolution rate of the resin film was measured. The dissolution rate was calculated by visually observing the immersed wafer and measuring the time until the resin film was dissolved and the interference pattern was not seen, and the film thickness was divided by the time.

顯影性的好壞依以下基準進行了判斷。 ○(良好):溶解速度500nm/s以上 ×(差):溶解速度小於500nm/sThe developability was judged based on the following criteria. ○(Good): The dissolution rate is 500nm/s or more × (poor): the dissolution rate is less than 500nm/s

[靈敏度評價](2.0質量%碳酸鈉水溶液) 首先,得到了以總固體成分濃度成為30質量%之方式將以下成分溶解於丙二醇單甲醚乙酸酯(PGMEA)而成之感光性樹脂組成物。 •聚合物(合成例1~10或比較合成例1~3的聚合物):100質量份 •多官能丙烯酸酯(二新戊四醇六丙烯酸酯):50質量份 •光聚合起始劑(BASF公司製、Ingacure OXE01):5質量份 •密著助劑(Shin-Etsu Chemical Co., Ltd.製、KBM-403):1質量份 •界面活性劑(DIC CORPORATION製、F-556):0.5質量份[Sensitivity evaluation] (2.0% by mass sodium carbonate aqueous solution) First, a photosensitive resin composition in which the following components were dissolved in propylene glycol monomethyl ether acetate (PGMEA) so that the total solid content concentration became 30% by mass was obtained. •Polymer (polymers of Synthesis Examples 1 to 10 or Comparative Synthesis Examples 1 to 3): 100 parts by mass • Multifunctional acrylate (dineopentaerythritol hexaacrylate): 50 parts by mass • Photopolymerization initiator (made by BASF, Ingacure OXE01): 5 parts by mass • Adhesion aid (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403): 1 part by mass • Surfactant (manufactured by DIC CORPORATION, F-556): 0.5 parts by mass

將所得到之樹脂組成物旋塗於進行了HMDS(HexamethyIdisilazane:六甲基二矽氮烷)處理之3英吋矽晶圓上,用加熱板於100℃進行120秒鐘的烘烤而得到了約3.0μm厚(±0.3μm)的薄膜A。 對該薄膜A,經由具有遮光率1~100%的灰度之光罩,並使用Canon Inc.製g+h+i射線光罩對準曝光機(PLA-501F)以100mJ/cm2 的曝光量曝光了g+h+i射線。 曝光後,用2.0質量%碳酸鈉水溶液在23℃對薄膜進行60秒鐘的顯影(連同晶圓浸漬)而得到了以1~100mJ/cm2 的各曝光量進行了曝光、顯影之薄膜B。The obtained resin composition was spin-coated on a 3-inch silicon wafer treated with HMDS (Hexamethy Idisilazane: hexamethyldisilazane), and baked on a hot plate at 100°C for 120 seconds. Film A about 3.0μm thick (±0.3μm). The film A was exposed to 100mJ/cm 2 by using a g+h+i-ray mask alignment exposure machine (PLA-501F) made by Canon Inc. through a mask with a gray scale of 1-100%. The amount of exposure is g+h+i rays. After exposure, the film was developed with a 2.0% by mass sodium carbonate aqueous solution at 23° C. for 60 seconds (including wafer immersion) to obtain film B exposed and developed at each exposure amount of 1-100 mJ/cm 2 .

根據藉由上述方法得到之薄膜A、薄膜B的膜厚並藉由以下式計算出殘膜率。 殘膜率(%)=(各曝光量下的薄膜B的膜厚/薄膜A的膜厚)×100 進而,將殘膜率成為95%以上之曝光量作為各感光性樹脂組成物的靈敏度並依以下基準進行了評價。 ◎(靈敏度非常良好):20mJ/cm2 以下 ○(靈敏度良好):21~50mJ/cm2 ×(靈敏度差):51mJ/cm2 以上Based on the film thicknesses of film A and film B obtained by the above method, the residual film rate was calculated by the following formula. Residual film rate (%) = (film thickness of film B under each exposure amount/film thickness of film A)×100 Furthermore, the exposure amount at which the residual film rate becomes 95% or more is used as the sensitivity of each photosensitive resin composition The evaluation was performed based on the following criteria. ◎(Very good sensitivity): 20mJ/cm 2 or less ○(Good sensitivity): 21~50mJ/cm 2 × (Poor sensitivity): 51mJ/cm 2 or more

[顯影性評價](追加:對Na2 CO3 水溶液之聚合物的溶解速度) 為了探索對各種顯影製程之適應性,對作為顯影液而使用了碳酸鈉水溶液之情況下的顯影性亦進行了評價。 具體而言,對於上述[靈敏度評價]中所製備之感光性樹脂組成物中作為聚合物而使用了合成例1~10中的任意聚合物之組成物,作為顯影液而使用2.0質量%碳酸鈉水溶液,並作為步驟以與上述[顯影性評價]同樣地進行了樹脂膜的製作和溶解速度的測定。進而,以以下基準進行了評價。 ○(良好):溶解速度50nm/s以上 ×(差):溶解速度小於50nm/s[Developability evaluation] (addition: the dissolution rate of polymer in Na 2 CO 3 aqueous solution) In order to explore the adaptability to various development processes, the developability when sodium carbonate aqueous solution is used as the developer Evaluation. Specifically, for the photosensitive resin composition prepared in the above-mentioned [Sensitivity Evaluation], any polymer in Synthesis Examples 1 to 10 was used as the polymer, and 2.0% by mass sodium carbonate was used as the developer. The aqueous solution was used as a procedure, and the production of the resin film and the measurement of the dissolution rate were performed in the same manner as in the above-mentioned [Developability Evaluation]. Furthermore, it evaluated based on the following criteria. ○ (good): dissolution rate of 50nm/s or more × (poor): dissolution rate of less than 50nm/s

以下匯總示出評價結果。The evaluation results are summarized below.

[表2] 實施例/比較例No. 比較例1 比較例2 比較例3 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 實施例7 實施例8 實施例9 實施例10 使用聚合物 比較合成例1 比較合成例2 比較合成例3 合成例1 合成例2 合成例3 合成例4 合成例5 合成例6 合成例7 合成例8 合成例9 合成例10 評價 顯影性(TMAH顯影液) × 靈敏度 × × 顯影性(Na2 CO3 顯影液) × [Table 2] Example/Comparative Example No. Comparative example 1 Comparative example 2 Comparative example 3 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Use polymer Comparative Synthesis Example 1 Comparative Synthesis Example 2 Comparative Synthesis Example 3 Synthesis example 1 Synthesis Example 2 Synthesis Example 3 Synthesis Example 4 Synthesis Example 5 Synthesis Example 6 Synthesis Example 7 Synthesis Example 8 Synthesis Example 9 Synthesis Example 10 Evaluation Development (TMAH developer) X Sensitivity X X Developability (Na 2 CO 3 developer) X

如表2所示,在使用了合成例1~10的聚合物之評價中,顯影性與靈敏度這兩性能良好。亦即,能夠兼備靈敏度和顯影性。 尤其,關於顯影性,不僅在使用了TMAH顯影液之情況下良好,在使用了碳酸鈉顯影液之情況下亦良好。可知本實施形態的感光性樹脂組成物或聚合物對各種顯影液之溶解性良好。As shown in Table 2, in the evaluation using the polymers of Synthesis Examples 1 to 10, both the developability and the sensitivity were good. That is, it is possible to have both sensitivity and developability. In particular, the developability was good not only when TMAH developer was used, but also when sodium carbonate developer was used. It can be seen that the photosensitive resin composition or polymer of this embodiment has good solubility in various developing solutions.

另一方面,在使用了比較合成例1的聚合物之評價中,顯影性差。認為儘管聚合物中含有相對多的聚合性碳-碳雙鍵(雙鍵當量:286g/mol),但由於酸值小於70mgKOH/g而未得到充分的顯影性。 又,在使用了比較合成例2、3的聚合物之評價中,靈敏度差。認為其原因為在聚合物中不存在高靈敏度化中所需要之密度的雙鍵。On the other hand, in the evaluation using the polymer of Comparative Synthesis Example 1, the developability was poor. It is considered that although the polymer contains relatively many polymerizable carbon-carbon double bonds (double bond equivalent: 286 g/mol), the acid value is less than 70 mgKOH/g, and sufficient developability is not obtained. In addition, in the evaluation using the polymers of Comparative Synthesis Examples 2 and 3, the sensitivity was poor. It is considered that the reason for this is that there are no double bonds of the density required for high sensitivity in the polymer.

<濾色器的製作> 製備了對於[靈敏度評價]中所製備之感光性樹脂組成物中含有合成例1的聚合物者進一步添加了適量的顏料分散液NX-061(Dainichiseika Color & Chemicals Mfg.Co.,Ltd.製、綠色)之著色感光性樹脂組成物。於基板上對其進行製膜並進行曝光、鹼顯影處理等而形成了綠色濾色器。 又,作為顏料分散液,替代NX-061而使用Dainichiseika Color & Chemicals Mfg.Co.,Ltd.製NX-053(藍色)、NX-032(紅色)等而形成了藍色或紅色濾色器。 順便提及,該等濾色器對於在設備製作步驟中可能暴露之高溫具有充分的耐性。認為這與聚合物包含具有環狀烴骨架之結構單元有關。<Production of color filter> The photosensitive resin composition prepared in [Sensitivity Evaluation] contains the polymer of Synthesis Example 1 and further added an appropriate amount of pigment dispersion NX-061 (manufactured by Dainichiseika Color & Chemicals Mfg. Co., Ltd., Green) colored photosensitive resin composition. A film was formed on the substrate, and exposure, alkali development, etc. were performed to form a green color filter. In addition, as a pigment dispersion, instead of NX-061, NX-053 (blue), NX-032 (red) manufactured by Dainichiseika Color & Chemicals Mfg. Co., Ltd., etc. were used to form a blue or red color filter. . Incidentally, these color filters are sufficiently resistant to high temperatures that may be exposed during the equipment manufacturing process. It is believed that this is related to the fact that the polymer contains a structural unit having a cyclic hydrocarbon skeleton.

<黑矩陣的製作> 製備了對於[靈敏度評價]中所製備之感光性樹脂組成物中含有合成例1的聚合物者進一步添加了適量的碳黑分散液NX-595(Dainichiseika Color & Chemicals Mfg.Co.,Ltd.製)之黑色感光性樹脂組成物。於基板上對其進行製膜並進行曝光、鹼顯影處理等而形成了黑矩陣。 順便提及,該黑矩陣對於在設備製作步驟中可能暴露之高溫具有充分的耐性。認為這與聚合物包含具有環狀烴骨架之結構單元有關。<Creation of black matrix> For the photosensitive resin composition prepared in [Sensitivity Evaluation] that contains the polymer of Synthesis Example 1, an appropriate amount of carbon black dispersion NX-595 (manufactured by Dainichiseika Color & Chemicals Mfg. Co., Ltd. was added ) Black photosensitive resin composition. This was formed into a film on a substrate, and exposure, alkali development treatment, etc. were performed to form a black matrix. Incidentally, the black matrix is sufficiently resistant to high temperatures that may be exposed during the equipment manufacturing process. It is believed that this is related to the fact that the polymer contains a structural unit having a cyclic hydrocarbon skeleton.

本申請基於2019年1月31日於日本申請之日本專利申請2019-015715號之優先權,並將其揭示全部援用於此。This application is based on the priority of Japanese Patent Application No. 2019-015715 filed in Japan on January 31, 2019, and uses all the disclosures here.

10:基板 11:黑矩陣 12:濾色器 13:保護膜 14:透明電極層10: substrate 11: black matrix 12: Color filter 13: Protective film 14: Transparent electrode layer

藉由以下描述之較佳實施形態及付隨其之以下圖式而進一步明確上述目的及其他目的、特徵及優點。The above objectives and other objectives, features and advantages are further clarified by the preferred embodiments described below and the accompanying drawings.

[圖1]係示意性地表示液晶顯示裝置和/或固體攝像元件的結構的一例之圖(剖面圖)。Fig. 1 is a diagram (cross-sectional view) schematically showing an example of the structure of a liquid crystal display device and/or a solid-state imaging element.

Figure 109102806-A0101-11-0002-1
Figure 109102806-A0101-11-0002-1

10:基板 10: substrate

11:黑矩陣 11: black matrix

12:濾色器 12: Color filter

13:保護膜 13: Protective film

14:透明電極層 14: Transparent electrode layer

Claims (23)

一種感光性樹脂組成物,其含有如下聚合物,前述聚合物具有由以下通式(1)表示之第一結構單元,酸值係70~300mgKOH/g,且雙鍵當量係100~500g/mol,
Figure 03_image003
通式(1)中,RD 係含有聚合性碳-碳雙鍵之基團。
A photosensitive resin composition comprising a polymer having a first structural unit represented by the following general formula (1), an acid value of 70 to 300 mgKOH/g, and a double bond equivalent of 100 to 500 g/mol ,
Figure 03_image003
In the general formula (1), R D is a group containing a polymerizable carbon-carbon double bond.
如請求項1之感光性樹脂組成物,其中, 前述第一結構單元包含RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元。The photosensitive resin composition of claim 1, wherein the first structural unit includes a structural unit in which the R D is a group containing two or more polymerizable carbon-carbon double bonds. 如請求項1或2之感光性樹脂組成物,其中, 前述第一結構單元包含:RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元、和RD 係僅含有1個聚合性碳-碳雙鍵之基團之結構單元。The photosensitive resin composition of claim 1 or 2, wherein the first structural unit includes: R D is a structural unit containing two or more polymerizable carbon-carbon double bonds, and R D contains only A structural unit of a polymerizable carbon-carbon double bond group. 如請求項1之感光性樹脂組成物,其中, 前述聚合物還包含由以下式(MA)表示之第二結構單元,
Figure 03_image046
The photosensitive resin composition of claim 1, wherein the aforementioned polymer further includes a second structural unit represented by the following formula (MA),
Figure 03_image046
.
如請求項1之感光性樹脂組成物,其中, 前述聚合物還包含具有環狀烴骨架之結構單元。Such as the photosensitive resin composition of claim 1, wherein The aforementioned polymer also contains a structural unit having a cyclic hydrocarbon skeleton. 如請求項1之感光性樹脂組成物,其中, 前述聚合物的總結構單元中的前述第一結構單元的比率係10~40mol%。Such as the photosensitive resin composition of claim 1, wherein The ratio of the first structural unit in the total structural unit of the polymer is 10 to 40 mol%. 如請求項1之感光性樹脂組成物,其中, 前述聚合物的重均分子量係6,000~25,000。Such as the photosensitive resin composition of claim 1, wherein The weight average molecular weight of the aforementioned polymer is 6,000-25,000. 如請求項1之感光性樹脂組成物,其還含有著色劑。The photosensitive resin composition of claim 1, which further contains a colorant. 如請求項1之感光性樹脂組成物,其還含有遮光劑。The photosensitive resin composition of claim 1, which further contains a sunscreen agent. 一種聚合物,其具有由以下通式(1)表示之第一結構單元,酸值係70~300mgKOH/g,且雙鍵當量係100~500g/mol,
Figure 03_image003
通式(1)中,RD 係含有聚合性碳-碳雙鍵之基團。
A polymer having a first structural unit represented by the following general formula (1), an acid value of 70-300 mgKOH/g, and a double bond equivalent of 100-500 g/mol,
Figure 03_image003
In the general formula (1), R D is a group containing a polymerizable carbon-carbon double bond.
如請求項10之聚合物,其中, 前述第一結構單元包含RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元。Structural units to carbon double bond group - such as a polymer of 10, wherein the first structural unit R D comprises a system containing two or more polymerizable carbon request entry. 如請求項10或11之聚合物,其中, 前述第一結構單元包含:RD 係含有2個以上的聚合性碳-碳雙鍵之基團之結構單元、和RD 係僅含有1個聚合性碳-碳雙鍵之基團之結構單元。The polymer of claim 10 or 11, wherein the first structural unit includes: R D is a structural unit of a group containing two or more polymerizable carbon-carbon double bonds, and R D contains only one polymer The structural unit of the radical carbon-carbon double bond. 如請求項10之聚合物,其還包含由以下式(MA)表示之第二結構單元,
Figure 03_image046
Such as the polymer of claim 10, which further comprises a second structural unit represented by the following formula (MA),
Figure 03_image046
.
如請求項10之聚合物,其還包含具有環狀烴骨架之結構單元。Such as the polymer of claim 10, which further comprises a structural unit having a cyclic hydrocarbon skeleton. 如請求項10之聚合物,其中, 總結構單元中的前述第一結構單元的比率係10~40mol%。Such as the polymer of claim 10, in which, The ratio of the aforementioned first structural unit in the total structural unit is 10-40 mol%. 如請求項10之聚合物,其重均分子量係6,000~25,000。For example, the polymer of claim 10 has a weight average molecular weight of 6,000-25,000. 一種圖案,其使用請求項1之感光性樹脂組成物而得。A pattern obtained using the photosensitive resin composition of claim 1. 一種濾色器,其使用請求項8之感光性樹脂組成物而得。A color filter obtained by using the photosensitive resin composition of claim 8. 一種顯示裝置,其具備請求項18之濾色器。A display device is provided with the color filter of claim 18. 一種成像元件,其具備請求項18之濾色器。An imaging element provided with the color filter of claim 18. 一種黑矩陣,其使用請求項9之感光性樹脂組成物而得。A black matrix obtained using the photosensitive resin composition of claim 9. 一種顯示裝置,其具備請求項21之黑矩陣。A display device is provided with the black matrix of claim 21. 一種成像元件,其具備請求項21之黑矩陣。An imaging element having the black matrix of claim 21.
TW109102806A 2019-01-31 2020-01-30 Photosensitive resin composition, polymer, pattern, color filter, black matrix, display device and image sensor TW202035486A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019015715 2019-01-31
JPJP2019-015715 2019-01-31

Publications (1)

Publication Number Publication Date
TW202035486A true TW202035486A (en) 2020-10-01

Family

ID=71841354

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109102806A TW202035486A (en) 2019-01-31 2020-01-30 Photosensitive resin composition, polymer, pattern, color filter, black matrix, display device and image sensor

Country Status (5)

Country Link
JP (2) JPWO2020158741A1 (en)
KR (1) KR20210121169A (en)
CN (1) CN113366029A (en)
TW (1) TW202035486A (en)
WO (1) WO2020158741A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI792112B (en) * 2020-12-04 2023-02-11 晨豐光電股份有限公司 Glass with low color difference and low scattering

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6930679B1 (en) * 2019-10-16 2021-09-01 住友ベークライト株式会社 Resin composition, photosensitive resin composition and cured product thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4786388B2 (en) 2006-03-29 2011-10-05 新日鐵化学株式会社 Color filter having a cured film of photosensitive resin composition
JP5384914B2 (en) * 2008-11-19 2014-01-08 株式会社日本触媒 Photosensitive resin, method for producing the same, and photosensitive resin composition
JP5504738B2 (en) 2009-08-05 2014-05-28 東洋インキScホールディングス株式会社 Photosensitive composition
JP5588503B2 (en) * 2010-04-13 2014-09-10 昭和電工株式会社 Addition copolymer, photosensitive resin composition, and color filter
JP6217296B2 (en) * 2013-01-22 2017-10-25 東洋インキScホールディングス株式会社 Photosensitive resin composition and coating film using the same
TWI511986B (en) 2013-03-13 2015-12-11 Showa Denko Kk Blocked isocyanate group-containing polymer, composition comprising same and use thereof
JP6405670B2 (en) 2014-04-02 2018-10-17 凸版印刷株式会社 Color filter substrate and liquid crystal display device
KR20180012313A (en) * 2015-05-29 2018-02-05 스미또모 베이크라이트 가부시키가이샤 A colored photosensitive resin composition, a coloring pattern or a black matrix, a color filter, a liquid crystal display device, or a solid-state imaging device and a method of manufacturing a color filter
KR20180122381A (en) * 2016-03-08 2018-11-12 스미또모 베이크라이트 가부시키가이샤 METHOD FOR PRODUCING POLYMER, METHOD FOR MANUFACTURING negative-type photosensitive resin composition, method for manufacturing resin film, method for manufacturing electronic device, and polymer
JP6886827B2 (en) * 2017-02-03 2021-06-16 株式会社日本触媒 Alkali-soluble resin, photosensitive resin composition and its uses
JP2018197833A (en) * 2017-05-25 2018-12-13 東レ株式会社 Insulating resin composition, method for producing insulating member and touch panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI792112B (en) * 2020-12-04 2023-02-11 晨豐光電股份有限公司 Glass with low color difference and low scattering

Also Published As

Publication number Publication date
JPWO2020158741A1 (en) 2021-02-18
JP7052900B2 (en) 2022-04-12
CN113366029A (en) 2021-09-07
JP2021120741A (en) 2021-08-19
KR20210121169A (en) 2021-10-07
WO2020158741A1 (en) 2020-08-06

Similar Documents

Publication Publication Date Title
JP7074051B2 (en) Polymer manufacturing method, negative photosensitive resin composition manufacturing method, resin film manufacturing method, electronic device manufacturing method and polymer
JP7052900B2 (en) Photosensitive resin compositions, polymers, patterns, color filters, black matrices, display devices and image sensors
KR20220084320A (en) Polymers and Resin Compositions
WO2022065225A1 (en) Polymer, polymer solution, and photosensitive resin composition
JP2023100610A (en) Photosensitive resin composition, pattern, color filter, black matrix, display device, imaging element, and method for producing display device or imaging element
JP2023024401A (en) Polymer, polymer solution, photosensitive resin composition, and cured product
JP2021196596A (en) Polymer solution
JP6930679B1 (en) Resin composition, photosensitive resin composition and cured product thereof
WO2023140257A1 (en) Polymer, polymer solution, photosensitive resin composition, and cured object
TWI841797B (en) Polymer and resin composition
JP7255166B2 (en) Polymer, method for producing polymer, photosensitive resin composition, pattern, color filter, black matrix, liquid crystal display device and solid-state imaging device
JP2021063222A (en) Polymer, method for producing polymer, photosensitive resin composition, and cured product
JP2021116406A (en) Polymer solution
JP2022046309A (en) Polymer solution, photosensitive resin composition, and use thereof
JP2022085232A (en) Polymer, polymer solution, photosensitive resin composition, and cured product
JP2022165664A (en) Photosensitive resin composition and cured film
JP2022022060A (en) Polymer, polymer solution, photosensitive resin composition, and applications thereof
JP2023091961A (en) Polymer, polymer solution, photosensitive resin composition, and cured product
JP2022085872A (en) Polymer, polymer solution, photosensitive resin composition, and cured product
JP2021140133A (en) Polymer solution for forming color filters or black matrices
JP2021175784A (en) Polymer solution and photosensitive resin composition
JP2022085873A (en) Polymer, polymer solution, photosensitive resin composition, and cured product
JP2023091438A (en) Polymer, polymer solution, photosensitive resin composition, and cured product
JP2022170248A (en) Polymer, polymer solution, photosensitive resin composition, and cured product
JP2022082436A (en) Polymer solution, photosensitive resin composition and usage thereof