TW202035339A - Joining method of ceramic pieces capable of permanently and firmly adhering the ceramic pieces without influencing the appearance - Google Patents

Joining method of ceramic pieces capable of permanently and firmly adhering the ceramic pieces without influencing the appearance Download PDF

Info

Publication number
TW202035339A
TW202035339A TW108109607A TW108109607A TW202035339A TW 202035339 A TW202035339 A TW 202035339A TW 108109607 A TW108109607 A TW 108109607A TW 108109607 A TW108109607 A TW 108109607A TW 202035339 A TW202035339 A TW 202035339A
Authority
TW
Taiwan
Prior art keywords
parts
ceramic
weight
filler
joining
Prior art date
Application number
TW108109607A
Other languages
Chinese (zh)
Other versions
TWI703109B (en
Inventor
董俊言
顏豐明
張景星
呂志偉
林欣儀
顏棕埼
Original Assignee
法藍瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 法藍瓷股份有限公司 filed Critical 法藍瓷股份有限公司
Priority to TW108109607A priority Critical patent/TWI703109B/en
Application granted granted Critical
Publication of TWI703109B publication Critical patent/TWI703109B/en
Publication of TW202035339A publication Critical patent/TW202035339A/en

Links

Images

Landscapes

  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

Disclosed is a joining method of ceramic pieces, which includes the following steps: firstly, providing a first ceramic piece, a second ceramic piece and a filler, wherein the first ceramic piece and the second ceramic piece have been sintered for densification in advance, and include a first coupling part and a second coupling part, respectively; secondly, coupling the first coupling part of the first ceramic piece and the second coupling part of the second ceramic piece, and filling up the filler between the first coupling part and the second coupling part; and finally, sintering the first ceramic piece, the second ceramic piece and the filler. Accordingly, the present invention arranges coupling parts that are corresponding to each other on two ceramic pieces that are to be joined, and then fills up the filler between the two coupling parts and sinters the two ceramic pieces and the filler, such that, once the two ceramic pieces have been cooled down, the two ceramic pieces will be permanently and firmly adhered without influencing the appearance.

Description

陶瓷件之接合方法 Joining method of ceramic parts

本發明係關於一種陶瓷件之接合方法,尤指一種適用於對多個陶瓷件進行永久接合之方法。 The present invention relates to a method for joining ceramic parts, in particular to a method suitable for permanent joining of multiple ceramic parts.

傳統陶瓷件的製造方式大多採模具澆鑄乾燥後,再進行高溫燒結,如我國專利公告第402555號「坯體表面密佈短小倒角陶瓷裝飾品的製造方法」一案所揭露之技術。然而,此一傳統方式固然適合大量製造,但因為採用一體成形的方式,故當高溫燒結而瓷化緻密後,有時因為熱膨脹關係,導致變形或甚至不同部位相互擠壓而破裂,而且此一方式也難以製造出相當精細的物件。 Traditional ceramic parts are mostly manufactured by casting and drying the mold and then sintering at a high temperature, such as the technology disclosed in the case of my country Patent Publication No. 402555 "Method for Manufacturing Ceramic Ornaments with Densely Short Chamfered Surfaces". However, this traditional method is certainly suitable for mass production, but because of the integrated molding method, after high-temperature sintering and compaction, sometimes due to thermal expansion, it may cause deformation or even squeeze between different parts to break, and this It is also difficult to produce very fine objects.

再者,現有技術中已經開發出陶瓷件的附接方式,不論是同陶瓷材料的附接、或異質材料的附接,現有技術大多採用黏膠黏附的方式。但是,黏附的方式使用壽命較短,且容易受溫度或濕度的影響,且異質材料也容易因熱漲冷縮的收縮膨脹率不同,而造成接合處剝離或崩裂,另外黏膠也容易老化。此外,同時也必須考量到黏接的介面大小,故很難適用於相當精細的微型物件。 Furthermore, in the prior art, attachment methods for ceramic parts have been developed. Whether it is attachment to ceramic materials or attachment to heterogeneous materials, most of the prior art uses adhesive attachment methods. However, the bonding method has a short service life and is easily affected by temperature or humidity. In addition, heterogeneous materials are also prone to peeling or cracking at the joint due to different shrinkage and expansion rates due to thermal expansion and contraction. In addition, the adhesive is also prone to aging. In addition, the size of the bonding interface must also be considered at the same time, so it is difficult to apply to fairly fine micro-objects.

另一方面,雖然現有技術中亦有採物理方式來連接陶瓷件,例如我國專利公告第I548610號「三維積層製造之陶瓷鎖附件及其製造方法」;其係將陶瓷鎖附件埋設於陶瓷胚體而一體燒成。然而,此種方式固然可以穩固地連接不同陶瓷件,但仍然難以適用於相當精細的微型物件。 On the other hand, although there are physical methods to connect ceramic parts in the prior art, for example, my country Patent Publication No. I548610 "Ceramic Lock Attachment Made by Three-Dimensional Laminates and Its Manufacturing Method"; it embeds the ceramic lock attachment in the ceramic body And one is fired. However, although this method can firmly connect different ceramic pieces, it is still difficult to apply to fairly fine micro-objects.

本發明之主要目的係在提供一種陶瓷件之接合方法,俾能對相同陶瓷件或不同陶瓷件,如精密陶瓷和傳統陶瓷,進行永久性的接合,而且如同一體成形般相當穩固,毫不會有鬆脫之虞,也不會對整體外型造成改變。 The main purpose of the present invention is to provide a method of joining ceramic parts, so that the same ceramic parts or different ceramic parts, such as precision ceramics and traditional ceramics, can be permanently joined, and it is quite stable as if it is integrally formed. There is a risk of loosening, and it will not change the overall appearance.

為達成上述目的,本發明一種陶瓷件之接合方法,包括以下步驟:首先,提供一第一陶瓷件、一第二陶瓷件、以及一填料,第一陶瓷件與第二陶瓷件係先經高溫燒結緻密,且分別包括一第一耦合部、及一第二耦合部;接著,第一陶瓷件之第一耦合部與第二陶瓷件之第二耦合部耦合,並使填料充填於第一耦合部與第二耦合部之間;再者,共燒第一陶瓷件、第二陶瓷件、及填料。 In order to achieve the above object, a method of joining ceramic parts of the present invention includes the following steps: first, a first ceramic part, a second ceramic part, and a filler are provided. The first ceramic part and the second ceramic part are subjected to high temperature The sintering is dense and each includes a first coupling portion and a second coupling portion; then, the first coupling portion of the first ceramic piece is coupled with the second coupling portion of the second ceramic piece, and the filler is filled in the first coupling Between the part and the second coupling part; further, co-fire the first ceramic piece, the second ceramic piece, and the filler.

據此,本發明藉由在二陶瓷件間欲結合之部位上設置可相互對應之耦合部,且在該二耦合部間充填填料,並加熱燒結該二陶瓷件和填料,待冷卻後該二陶瓷件將永久地穩固黏接,且不影響外觀。 According to this, in the present invention, a coupling part corresponding to each other is provided on the part to be joined between the two ceramic parts, and filler is filled between the two coupling parts, and the two ceramic parts and the filler are heated and sintered. The ceramic parts will be permanently and firmly bonded without affecting the appearance.

其中,本發明之第一陶瓷件可為一由三維積 層製造形成之精密陶瓷件,其先經過1500℃~1600℃之高溫燒結緻密;而第二陶瓷件可為一傳統陶瓷件,其先經過1200℃~1300℃之高溫燒結緻密。據此,本發明可適用於不同類陶瓷件之接合,不過本發明並不以此為限,亦可適用於或同類陶瓷件之接合。 Wherein, the first ceramic piece of the present invention can be a three-dimensional product The precision ceramic parts formed by layer manufacturing are first sintered at a high temperature of 1500℃~1600℃ to be dense; and the second ceramic part can be a traditional ceramic part, which is first sintered at a high temperature of 1200℃~1300℃ to be dense. Accordingly, the present invention can be applied to the joining of different types of ceramic parts, but the present invention is not limited to this, and can also be applied to the joining of similar ceramic parts.

較佳的是,本發明之第一耦合部可包括一插銷,第二耦合部可包括一插槽,且插銷與插槽係以鬆配合方式耦接。不過,本發明也不以此為限,凡可固定填料於第一陶瓷件和第二陶瓷件之間的耦合結構均可適用於本發明。另外,在本發明中,當插銷與插槽耦接時,插銷與插槽之間的空隙佔插槽總容量的30%以內,而其中的空隙便是用於容納填料。 Preferably, the first coupling portion of the present invention may include a pin, the second coupling portion may include a slot, and the pin and the slot are coupled in a loose fit manner. However, the present invention is not limited to this, and any coupling structure that can fix the filler between the first ceramic part and the second ceramic part can be applied to the present invention. In addition, in the present invention, when the plug is coupled to the socket, the gap between the plug and the socket occupies within 30% of the total capacity of the socket, and the gap is used to accommodate the filler.

再者,共燒第一陶瓷件、第二陶瓷件、及填料之溫度可介於700℃~1000℃之間,即本發明採用低溫共燒以確保陶瓷件之外觀及顏色不會因為第二次共燒時而遭受到改變。此外,本發明之填料的熱膨脹係數可為8ppm/℃以下,以避免填料因高溫燒結時受熱而過度膨脹,導致陶瓷件之接合位置或角度產生位移、以及填料膨脹過度而影響外觀。 Furthermore, the temperature of co-firing the first ceramic part, the second ceramic part, and the filler can be between 700°C and 1000°C. That is, the present invention uses low-temperature co-firing to ensure that the appearance and color of the ceramic part will not be affected by the second ceramic part. From time to time, sub-co-fires have undergone changes. In addition, the thermal expansion coefficient of the filler of the present invention can be less than 8 ppm/°C to avoid excessive expansion of the filler due to heat during high-temperature sintering, resulting in displacement of the joint position or angle of the ceramic parts, and excessive expansion of the filler, which affects the appearance.

另外,本發明之填料可包括填料包括介於40重量份至60重量份之硼矽酸玻璃、介於20重量份至40重量份之陶瓷粉末、以及介於15重量份至30重量份之水。其中,硼矽酸玻璃可包括介於10重量份至30重量份之長石、介於15重量份至20重量份之石英、介於6重量份至10重量份之碳酸鈣、介於5重量份至15重量 份之硼酸、以及介於2重量份至5重量份之氧化鋅。 In addition, the filler of the present invention may include fillers including borosilicate glass between 40 parts by weight and 60 parts by weight, ceramic powder between 20 parts by weight and 40 parts by weight, and water between 15 parts by weight and 30 parts by weight. . Among them, the borosilicate glass may include between 10 parts by weight and 30 parts by weight of feldspar, between 15 parts by weight and 20 parts by weight of quartz, between 6 parts by weight and 10 parts by weight of calcium carbonate, and between 5 parts by weight. Up to 15 weight Parts of boric acid, and between 2 parts by weight and 5 parts by weight of zinc oxide.

此外,前述之硼矽酸玻璃又可進一步包括大於0且60重量份以內之氧化鉛、以及大於0且5重量份以內之高嶺土或黏土。又,前述之陶瓷粉末可包含氧化鋁、氧化鋯粉末及傳統陶瓷粉末中至少一者。 In addition, the aforementioned borosilicate glass may further include more than 0 and less than 60 parts by weight of lead oxide, and more than 0 and less than 5 parts by weight of kaolin or clay. In addition, the aforementioned ceramic powder may include at least one of alumina, zirconia powder, and traditional ceramic powder.

2‧‧‧第一陶瓷件 2‧‧‧The first ceramic piece

3‧‧‧第二陶瓷件 3‧‧‧Second ceramic piece

4‧‧‧填料 4‧‧‧Packing

21‧‧‧第一耦合部 21‧‧‧First coupling part

31‧‧‧第二耦合部 31‧‧‧Second coupling part

211‧‧‧插銷 211‧‧‧Latch

311‧‧‧插槽 311‧‧‧Slot

圖1係本發明一較佳實施例之立體圖。 Figure 1 is a perspective view of a preferred embodiment of the present invention.

圖2係本發明第一陶瓷件一較佳實施例之立體圖。 Figure 2 is a perspective view of a preferred embodiment of the first ceramic piece of the present invention.

圖3係本發明一較佳實施例之第一陶瓷件之第一耦合部與第二陶瓷件之第二耦合部分離時之局部示意圖。 3 is a partial schematic diagram of the first coupling portion of the first ceramic piece and the second coupling portion of the second ceramic piece in a preferred embodiment of the present invention.

圖4係本發明一較佳實施例之第一陶瓷件與第二陶瓷件接合共燒後之局部示意圖。 4 is a partial schematic diagram of a first ceramic piece and a second ceramic piece after being joined and co-fired in a preferred embodiment of the present invention.

本發明陶瓷件之接合方法在本實施例中被詳細描述之前,要特別注意的是,以下的說明中,類似的元件將以相同的元件符號來表示。再者,本發明之圖式僅作為示意說明,其未必按比例繪製,且所有細節也未必全部呈現於圖式中。 Before the joining method of the ceramic parts of the present invention is described in detail in this embodiment, it should be particularly noted that in the following description, similar components will be represented by the same component symbols. Furthermore, the drawings of the present invention are only for illustrative purposes, and they are not necessarily drawn to scale, and all details are not necessarily presented in the drawings.

請先同時參閱圖1至圖4,圖1係本發明一較佳實施例之立體圖;圖2係本發明第一陶瓷件一較佳實施例之立體圖;圖3係本發明一較佳實施例之第一陶瓷件之第一耦合部與第二陶瓷件之第二耦合部分離時之局部示意圖;圖4係本發明一較佳實施例之第一陶瓷件 與第二陶瓷件接合共燒後之局部示意圖。本實施例之方法詳述如下: Please refer to Figures 1 to 4 at the same time. Figure 1 is a perspective view of a preferred embodiment of the present invention; Figure 2 is a perspective view of a preferred embodiment of the first ceramic piece of the present invention; Figure 3 is a preferred embodiment of the present invention A partial schematic diagram of the first coupling portion of the first ceramic piece and the second coupling portion of the second ceramic piece separated; Figure 4 is the first ceramic piece of a preferred embodiment of the present invention Partial schematic diagram after co-firing with the second ceramic part. The method of this embodiment is detailed as follows:

首先,第一步驟,提供一第一陶瓷件2、一第二陶瓷件3、以及一填料4;其中,第一陶瓷件2係一由三維積層製造形成之精密陶瓷件,其係經過1500℃~1600℃之高溫燒結緻密;第二陶瓷件3係一傳統陶瓷件,其係經過1200℃~1300℃之高溫燒結緻密。換言之,本實施例特別呈現不同陶瓷種類之接合,即精密陶瓷與傳統陶瓷之接合,而且是已經經過高溫燒結後的陶瓷件,事實上這兩種陶瓷之接合遠比相同種類陶瓷之接合更佳困難,因二者不論硬度、熱膨脹係數、或其他特性都不盡相同。 First, in the first step, a first ceramic piece 2, a second ceramic piece 3, and a filler 4 are provided; among them, the first ceramic piece 2 is a precision ceramic piece formed by three-dimensional layered manufacturing, which is subjected to 1500°C High temperature sintering at ~1600℃ is dense; The second ceramic part 3 is a traditional ceramic part, which is sintered at a high temperature of 1200℃~1300℃ to be dense. In other words, this embodiment particularly presents the bonding of different types of ceramics, that is, the bonding of precision ceramics and traditional ceramics, and is a ceramic piece that has been sintered at a high temperature. In fact, the bonding of these two ceramics is far better than the bonding of the same type of ceramics. Difficult, because the two are not the same regardless of hardness, thermal expansion coefficient, or other characteristics.

再者,第一陶瓷件2具備一第一耦合部21,第二陶瓷件3具備一第二耦合部31;在本實施例中第一耦合部21為一插銷211,第二耦合部31為一插槽311。其中,值得一提的是,插銷211和插槽311之具體尺寸是透過電腦輔助設計(Computer aided design,簡稱CAD/CAM)而得,主要是因為二者尺寸之規劃和製造相當重要,如果不當時,插銷211有可能無法插入插槽311,抑或插銷211和插槽311間的空隙過大,將導致插銷211無法固定於插槽311內。 Furthermore, the first ceramic piece 2 has a first coupling portion 21, and the second ceramic piece 3 has a second coupling portion 31; in this embodiment, the first coupling portion 21 is a plug 211, and the second coupling portion 31 is A slot 311. Among them, it is worth mentioning that the specific dimensions of the plug 211 and the socket 311 are obtained through computer aided design (CAD/CAM), mainly because the planning and manufacturing of the two dimensions are very important. At that time, the plug 211 may not be inserted into the slot 311, or the gap between the plug 211 and the slot 311 is too large, and the plug 211 cannot be fixed in the slot 311.

承上,插銷211和插槽311二者尺寸之設計中一個相當重要的參數就是空隙率,即當插銷211插入插槽311內時,該二者間之空隙佔插槽311總容量之百分比。此一參數關係到插銷211位於插槽311內時的穩 定度;空隙率越大穩定度越差,其原因如前段所述,因填料4受高溫熔融時呈液態,故插銷211很容易移位或偏轉。另一方面,如果空隙率過低,也有可能發生填料不足,或插銷211與插槽311因熱膨脹率不同而彼此擠壓破裂。然而,本實施例之空隙率為5%~30%。 In conclusion, a very important parameter in the design of the dimensions of the plug 211 and the socket 311 is the air gap ratio, that is, when the plug 211 is inserted into the socket 311, the gap between the two is a percentage of the total capacity of the socket 311. This parameter is related to the stability of the plug 211 in the slot 311. Constant degree; the greater the porosity, the worse the stability. The reason is as described in the previous paragraph. Because the filler 4 is liquid when it is melted at a high temperature, the plug 211 is easily displaced or deflected. On the other hand, if the porosity is too low, insufficient packing may also occur, or the plug 211 and the socket 311 may be crushed due to different thermal expansion rates. However, the porosity of this embodiment is 5%-30%.

另外,關於填料4,在本實施例中,填料4主要由40重量份至60重量份之硼矽酸玻璃、介於20重量份至40重量份之陶瓷粉末、以及介於15重量份至30重量份之水所構成。其中,硼矽酸玻璃包括介於10重量份至30重量份之長石、介於15重量份至20重量份之石英、介於6重量份至10重量份之碳酸鈣、介於5重量份至15重量份之硼酸、介於2重量份至5重量份之氧化鋅、0且60重量份以內之氧化鉛、以及大於0且5重量份以內之高嶺土或黏土。再者,氧化鉛的含量多寡,決定了硼矽酸玻璃的熔點;亦即氧化鉛含量提升,硼矽酸玻璃熔點就降低,故可適用於低溫共燒。 In addition, regarding the filler 4, in the present embodiment, the filler 4 is mainly composed of 40 parts by weight to 60 parts by weight of borosilicate glass, between 20 parts by weight and 40 parts by weight of ceramic powder, and between 15 parts by weight and 30 parts by weight. Consists of parts by weight of water. Wherein, the borosilicate glass includes between 10 parts by weight and 30 parts by weight of feldspar, between 15 parts by weight and 20 parts by weight quartz, between 6 parts by weight and 10 parts by weight calcium carbonate, between 5 parts by weight and 15 parts by weight of boric acid, 2 parts by weight to 5 parts by weight of zinc oxide, 0 and less than 60 parts by weight of lead oxide, and greater than 0 and less than 5 parts by weight of kaolin or clay. Furthermore, the content of lead oxide determines the melting point of borosilicate glass; that is, as the content of lead oxide increases, the melting point of borosilicate glass decreases, so it is suitable for low-temperature co-firing.

再且,針對陶瓷粉末的添加再特別說明之,因為上述填料4當在進行共燒時,會受熱熔融而成為液狀,此時插銷211就有可能會在插槽311移動,因為液狀填料4已無法固定插銷211。此時,陶瓷粉末就扮演相當重要的角色,因為陶瓷粉末可以增加填料4的稠度,至少讓填料4形成膏狀,如此就可以避免插銷211和插槽311受流動之填料的影響而產生相對位移。然而,陶瓷粉末的添加比例可視填料4的其他成分和共燒溫度等因素適當調配,整體而言應佔該填料4的30重量 %以下。 In addition, the addition of ceramic powder will be specifically explained, because the filler 4 will be heated and melted and become liquid during co-firing. At this time, the plug 211 may move in the slot 311 because of the liquid filler 4The bolt 211 cannot be fixed. At this time, the ceramic powder plays a very important role, because the ceramic powder can increase the consistency of the filler 4, at least make the filler 4 into a paste shape, so as to avoid the relative displacement of the plug 211 and the slot 311 due to the influence of the flowing filler . However, the addition ratio of the ceramic powder can be appropriately adjusted depending on the other components of the filler 4 and the co-firing temperature, and it should account for 30 weight of the filler 4 as a whole. %the following.

另外值得一提的是,本實施例之填料4經過特殊調配,並特別選用低熱膨脹係數,較佳為8ppm/℃以內,更佳為5ppm/℃以下。本實施例採用低熱膨脹係數填料4之意義在於,避免填料4因高溫燒結時受熱而過度膨脹,導致陶瓷件之接合位置或角度產生位移、以及填料4膨脹過度而影響外觀;此外,低熱膨脹係數也可以減少因溫度梯度應力造成的影響,從而具有更強的抗斷裂性能。 It is also worth mentioning that the filler 4 of this embodiment is specially formulated, and a low thermal expansion coefficient is particularly selected, preferably within 8 ppm/°C, more preferably within 5 ppm/°C. The significance of using the low thermal expansion coefficient filler 4 in this embodiment is to avoid excessive expansion of the filler 4 due to heat during high temperature sintering, resulting in displacement of the joint position or angle of the ceramic parts, and excessive expansion of the filler 4, which affects the appearance; in addition, the low thermal expansion coefficient It can also reduce the influence caused by temperature gradient stress, thereby having stronger fracture resistance.

接著,第二步驟,將第一陶瓷件2之第一耦合部21與第二陶瓷件3之第二耦合部31耦合,亦即使插銷211插入插槽311內,並使填料4充填於第一耦合部21與第二耦合部31之間。然而,在充填過程中,可另外使用超音波震盪器,據而使填料4能夠完整地充填於插銷211和插槽311之間,以避免填料4中包含空穴,而影響接合效果。 Then, the second step is to couple the first coupling portion 21 of the first ceramic piece 2 with the second coupling portion 31 of the second ceramic piece 3, even if the plug 211 is inserted into the slot 311, and the filler 4 is filled in the first Between the coupling portion 21 and the second coupling portion 31. However, during the filling process, an ultrasonic vibrator can be additionally used, so that the filler 4 can be completely filled between the plug 211 and the slot 311, so as to prevent the filler 4 from containing cavities and affect the joining effect.

最後,第三步驟,將第一陶瓷件2、第二陶瓷件3、及填料4置入燒結爐內進行共燒,其共燒溫度係介於700℃~1000℃之間,共燒時間為6~12小時。此步驟所採用之陶瓷燒結為低溫燒結,其主要目的係為了避免陶瓷件之外觀及顏色不會因為第二次共燒時而遭受到改變。 Finally, in the third step, the first ceramic piece 2, the second ceramic piece 3, and the filler 4 are placed in the sintering furnace for co-firing. The co-firing temperature is between 700°C and 1000°C, and the co-firing time is 6~12 hours. The ceramic sintering used in this step is low-temperature sintering, and its main purpose is to prevent the appearance and color of the ceramic parts from being changed due to the second co-firing.

據上結論,本發明之特色在於,可適用於相同或不同種類之陶瓷接合,且接合強度極高,使用壽命長,又不影響外觀,更重要的是製成步驟簡單,成本低 廉。 According to the above conclusions, the present invention is characterized by being applicable to the same or different types of ceramic bonding, with extremely high bonding strength, long service life, without affecting appearance, and more importantly, simple manufacturing steps and low cost inexpensive.

上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。 The above-mentioned embodiments are merely examples for the convenience of description, and the scope of rights claimed in the present invention should be subject to the scope of the patent application, rather than limited to the above-mentioned embodiments.

2‧‧‧第一陶瓷件 2‧‧‧The first ceramic piece

3‧‧‧第二陶瓷件 3‧‧‧Second ceramic piece

4‧‧‧填料 4‧‧‧Packing

21‧‧‧第一耦合部 21‧‧‧First coupling part

31‧‧‧第二耦合部 31‧‧‧Second coupling part

211‧‧‧插銷 211‧‧‧Latch

311‧‧‧插槽 311‧‧‧Slot

Claims (10)

一種陶瓷件之接合方法,包括以下步驟:(A)提供一第一陶瓷件、一第二陶瓷件、以及一填料,該第一陶瓷件與該第二陶瓷件係先經高溫燒結緻密,且分別包括一第一耦合部、及一第二耦合部;(B)該第一陶瓷件之該第一耦合部與該第二陶瓷件之該第二耦合部耦合,並使該填料充填於該第一耦合部與該第二耦合部之間;以及(C)共燒該第一陶瓷件、該第二陶瓷件、及該填料。 A method for joining ceramic pieces includes the following steps: (A) providing a first ceramic piece, a second ceramic piece, and a filler, the first ceramic piece and the second ceramic piece are first sintered at high temperature to be dense, and Each includes a first coupling portion and a second coupling portion; (B) the first coupling portion of the first ceramic piece is coupled with the second coupling portion of the second ceramic piece, and the filler is filled in the Between the first coupling portion and the second coupling portion; and (C) co-fire the first ceramic piece, the second ceramic piece, and the filler. 如請求項1之陶瓷件之接合方法,其中,該第一陶瓷件係一由三維積層製造形成之精密陶瓷件,其先經過1500℃~1600℃之高溫燒結緻密;該第二陶瓷件係一傳統陶瓷件,其先經過1200℃~1300℃之高溫燒結緻密。 Such as the joining method of ceramic parts of claim 1, wherein the first ceramic part is a precision ceramic part formed by three-dimensional laminated manufacturing, which is first sintered at a high temperature of 1500°C to 1600°C to be dense; the second ceramic part is a Traditional ceramic parts are first sintered at a high temperature of 1200℃~1300℃ to compact. 如請求項1之陶瓷件之接合方法,其中,該第一耦合部係包括一插銷,該第二耦合部係包括一插槽,該插銷與該插槽係以鬆配合方式耦接。 According to the method for joining a ceramic piece of claim 1, wherein the first coupling portion includes a pin, the second coupling portion includes a slot, and the pin and the slot are loosely coupled. 如請求項3之陶瓷件之接合方法,其中,於該步驟(B)中,當該插銷與該插槽耦接時,該插銷與該插槽之間的空隙佔該插槽總容量的30%以內。 For example, the method of joining ceramic parts of claim 3, wherein, in the step (B), when the plug is coupled with the socket, the gap between the plug and the socket accounts for 30% of the total capacity of the socket Within %. 如請求項1之陶瓷件之接合方法,其中,於該步驟(C)中,該共燒溫度係介於700℃~1000℃之間。 Such as the joining method of ceramic parts of claim 1, wherein, in the step (C), the co-firing temperature is between 700°C and 1000°C. 如請求項1之陶瓷件之接合方法,其中,該填料之熱膨脹係數為8ppm/℃以下。 Such as the joining method of ceramic parts of claim 1, wherein the thermal expansion coefficient of the filler is 8 ppm/°C or less. 如請求項1之陶瓷件之接合方法,其中,該填料包括 介於40重量份至60重量份之硼矽酸玻璃、介於20重量份至40重量份之陶瓷粉末、以及介於15重量份至30重量份之水。 The method for joining ceramic parts of claim 1, wherein the filler includes Between 40 and 60 parts by weight of borosilicate glass, between 20 and 40 parts by weight of ceramic powder, and between 15 and 30 parts by weight of water. 如請求項7之陶瓷件之接合方法,其中,該硼矽酸玻璃包括介於10重量份至30重量份之長石、介於15重量份至20重量份之石英、介於6重量份至10重量份之碳酸鈣、介於5重量份至15重量份之硼酸、以及介於2重量份至5重量份之氧化鋅。 According to claim 7, the method of joining ceramic parts, wherein the borosilicate glass includes between 10 parts by weight and 30 parts by weight of feldspar, between 15 parts by weight and 20 parts by weight of quartz, and between 6 parts by weight and 10 parts by weight. Parts by weight of calcium carbonate, between 5 parts by weight and 15 parts by weight of boric acid, and between 2 parts by weight and 5 parts by weight of zinc oxide. 如請求項8之陶瓷件之接合方法,其中,該硼矽酸玻璃進一步包括大於0且60重量份以內之氧化鉛。 According to the method for joining ceramic parts of claim 8, wherein the borosilicate glass further comprises more than 0 and less than 60 parts by weight of lead oxide. 如請求項8之陶瓷件之接合方法,其中,該硼矽酸玻璃進一步包括大於0且5重量份以內之高嶺土或黏土。 According to the method for joining ceramic parts of claim 8, wherein the borosilicate glass further comprises kaolin or clay greater than 0 and within 5 parts by weight.
TW108109607A 2019-03-20 2019-03-20 Joining method of ceramic parts TWI703109B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW108109607A TWI703109B (en) 2019-03-20 2019-03-20 Joining method of ceramic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108109607A TWI703109B (en) 2019-03-20 2019-03-20 Joining method of ceramic parts

Publications (2)

Publication Number Publication Date
TWI703109B TWI703109B (en) 2020-09-01
TW202035339A true TW202035339A (en) 2020-10-01

Family

ID=73644236

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109607A TWI703109B (en) 2019-03-20 2019-03-20 Joining method of ceramic parts

Country Status (1)

Country Link
TW (1) TWI703109B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114956849A (en) * 2022-06-28 2022-08-30 西安国宏天易智能科技有限公司 Ceramic co-firing connection method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202353000U (en) * 2011-10-20 2012-07-25 中国科学院光电研究院 Preionization electrode and ceramic tube combined structure
DE102012207405B3 (en) * 2012-05-04 2013-08-14 Schott Ag Glass-ceramic additive for aggregate material, contains specified amount of silica, boric oxide, alumina, calcium oxide, barium oxide, magnesium oxide, zirconium oxide and yttrium oxide, and has preset thermal expansion coefficient

Also Published As

Publication number Publication date
TWI703109B (en) 2020-09-01

Similar Documents

Publication Publication Date Title
JP2019048179A (en) Presintering blank for dental purposes
US10322973B2 (en) Porous silicate ceramic body, dental restorations and method for the production thereof
JP4230492B2 (en) Low adhesion materials, resin molds and antifouling materials
KR102144685B1 (en) Manufacturing method for digital metal-ceramic prosthesis and glass melt bond
BR112012006934A2 (en) method and system for the manufacture of layered dental braces
CN108495598A (en) Method, blank and dental prosthesis for producing blank
TWI703109B (en) Joining method of ceramic parts
US11718731B2 (en) Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface
US20040197738A1 (en) Dental ceramic frame, preparation of the same and dental prosthesis comprising the frame
CN107021771A (en) A kind of calcium oxide-based ceramic-mould manufacture method based on 3D printing technique
US11534279B2 (en) Method for producing dentures
CN106478081A (en) The method that vacuum carbothermal reduction strengthens vitreous silica high-temperature behavior
CN104948016B (en) Three-dimensional laminated ceramic locking accessory and manufacturing method thereof
KR102134327B1 (en) Bonded body of ceramic member and metal member and method for manufacturing the same
US7600398B2 (en) Method for making ceramic artificial dental bridges
KR101993181B1 (en) Metal-ceramic dental prosthesis with enhanced bonding strength based on porous structure and method of manufacturing the same
JP3089973B2 (en) Method for sintering glass ceramic laminate
WO2015122445A1 (en) Method for producing ceramic sintered body and ceramic sintered body
TWI294412B (en) Self-constrained low temperature glass-ceramic unfired tape for microelectronics and method for making and using the same
JP7216611B2 (en) Manufacturing method of SiC sintered member
CN204905236U (en) Encapsulation of tempering ceramic glass
JP2005179160A (en) Clay for earthenware repair or shape modification, and method for earthenware repair or shape modification
TW555721B (en) Manufacturing method of low temperature cofired ceramic
TWI228112B (en) High-temperature hybrid ceramic microwave component and its processing
CN105801115A (en) Dental zirconia substrate veneering ceramic and preparation method thereof