TWI294412B - Self-constrained low temperature glass-ceramic unfired tape for microelectronics and method for making and using the same - Google Patents

Description

1294412

V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) <Technical Field to Which the Invention Is Alonged> The present invention relates to a method for sintering a single-piece self-expanding strip in a low-temperature ceramic co-sintering, whereby an economically improved method, lameness,咼 Product production efficiency and precise control of layer thickness. Related Application 1 ° This application requires priority on US Provisioning 60/326, 350 on October 1, 2001, and US Provisional "Month 60/362, 656 on March 8, 2002. Qiao <Previous Technology> In the microelectronics industry, co-sintering of layered ceramic strips is a one-of-a-kind module manufacturing method. The term &quot;low-temperature co-sintered ceramics (LTc ^ two - used in the manufacture of multi-layer Tao Jing circuit Technology. In this method = glass and ceramic powder uniformly distributed in the organic binder.": lower. = more layers of strips are joined in a layered structure in -#, shaped "road. An electrically conductive connection is formed between the layers, which is filled with a through-hole, as described in US Pat. No. 4,654, to 〇95 to Steinberg. Partial t:::T: The screen printing method will be able to form a circuit for each on-board ceramic or glass powder distribution. After the volatilized band m ^ i is applied to the strip to form a multi-layer strip layer 2t required for the complete circuit, the strips are aligned with each other to ensure that the connectors in one layer can The conductor track in the lower-layer strip; the conductor trace) or the via hole is in contact. The strip laminated together by heat and pressure, so as to form a next bar =

1294412 V. INSTRUCTION DESCRIPTION (2) That is, a structure fixed together by an organic binder is a polyvinyl butyral or acrylate material. The organic binder can, for example, form the final ceramic body, and needs to be sintered in one (four) material, and the temperature in the y is up to about 850 t to 9 〇〇k before returning to room temperature. Within the temperature range between C, the chain will have a '' 】 to the mixture which will volatilize or burn out. In order to make the organic point of the sintered organic zone sinter zone profile: =, bleed, that is, the change in temperature during the early time is usually reduced. The slope of the profile of the upper part of the department will increase, and it will be straight and hot until it reaches the highest burning society and the sound of the field. τ often contains glass, so that the LTCC strip;:: T ". When the temperature is higher than the softening temperature of the LTCC glass, the :::J powder will begin to sinter into a dense body, so 2 and Tao Jing often compare 1 , high _ to 2....丄= = = : The resistive material will also change shape due to the electrical polarity of the organic bonding powder. When the highest sintering to a dense enough texture, these parts are cooled to room temperature.

UrJrCi is generally described in U.S. Patent No. 5,821,181 to Ursula et al. In this method (the inorganic and organic components of the strip are on the top surface of the mixed film or carrier before drying. One disadvantage of using this cleaning technique Ik strip is that the strip is increasingly thinner to control the thickness. Specifically, when it is cast at 2 mils (5 〇 micron wide, two brothers see 1294412 five, invention description (3) - - =, the thickness, accuracy and deviation cannot be determined, and this measurement result It refers to the gap between the scraper and the pad when the mud flows. Therefore, the control of the layer thickness, especially the thickness of the inner layer, is difficult and often inaccurate. Although a single layer of precision casting can be achieved, U.S. Patent 5, The method for laminating strips as disclosed in 102,720 is to increase the manufacturing cost without drying and heating and pressurization, and also to limit other manufacturing methods including moving one to the carrier film. A capillary force is applied between the mud and the wet organic binder and the surface of the polyester film. In other words, the layer is then thermally laminated by casting a wet layer. Within the field , still need to bring the economical improved method, so as to precisely control the layer thickness. Bub dry the strip, and then put these benefits. Therefore, including the method of laminating the layers together not only understand the product Production efficiency. The moving carrier film is immersed in the mud to form a meniscus. However, the meniscus formed between the films will be dry, which is a known method of drying one at the top of a dry layer or carrying the tape. There are many shortcomings that provide a production efficiency and ability to manufacture LTCC strip products.

And witnessed: surgery has developed beyond the field of microelectronic circuits, abundance; the use of multi-layer strips to form a three-dimensional structure. Example (6), Bio-ΐ == The industry uses LTCC to manufacture the cavity for transporting pump parts and the modularization of the test, which is beneficial to achieve the automatic control of biological and chemical materials.

The pump is used on an in-line delivery device for pharmaceuticals. ,, 1294412 V. Description of invention (4) Testing. f The telecommunications industry requires an integrated optoelectronic module. The drive electronics and well guide A threshold # Λ丨 + m is enough to co-sinter the human 庶卞 and 尤 fibers together. Thus, a medium, crying, and attending 5i $ device (mes〇iyst (4)) containing LTCC is capable of utilizing a sensing sigma connector, a control component, and/or a signal processing component for at least two types of secondary materials, such as electricity and fluids. Small components processed. Miniaturization: The S::3, the maximum movement ☆, enables the 70-piece element (SIp) with a plurality of components to be inserted into a single-piece component. An advantageous feature of the LTCC strip is that it can be used to create a cavity for the dream circuit. For example, as shown in Fig. 1A, an electronic mold spoon includes a cavity 15A on the surface of the body, a metal passage center and a metal line (metallic line trac〇 15c. Figure ib shows a set of micro The panel 17 of the electronic module 15. The surface is usually fabricated and processed into a single piece and then cut into individual modules. The cavity is such that the module has a small profile and A cover can be attached to the top of the cavity for sealing. However, in the process of surface constraining or sacrificial constrained sintering, as described below, a phenomenon called a bottleneck occurs in the cavity wall, that is, from the top. The surface interface has a vertical curved portion to the bottom surface of the sintered substrate. During the sintering process of the sacrificial constrained structure, stress distribution occurs due to shear and in-plane tensile stress from top to bottom. It has been shown that the stress of the shrinkage interface is significantly higher. High. Along the Z axis toward the sintered substrate

Mn 1294412 V. INSTRUCTIONS (5) There are very few forces that can offset the tensile stress in the plane. Therefore, a more dense portion is formed in the middle of the 早A early film member, and the outer layer is produced. Because of the large stress at the interface, the layer or the shrinkage phenomenon is usually caused. The above characteristics are all we do not want to exist: characteristics, especially machining cavities or other precise structures on ceramic components. Although LTCC technology can be applied in many fields, LTCC technology still has some disadvantages. First, the size of the monolithic structure of the ceramic varies greatly during the sintering process. Specifically, when the component powder of the LTCC structure becomes dense during conventional unconstrained sintering or free sintering, all dimensions are

Will produce shrinkage. In general, the strips are nearly equal in their width or length direction (X direction or y direction) and are only slightly different from the amount of shrinkage in the thickness direction of the laminate (z direction). Typically, the structure = after sintering is about 84% to 87% of the size of the unsintered preform. This change and related changes have created some shortcomings in the application of traditional LTCC technology. First, the shrinkage in the x-y direction requires that the area of the green strip used to make the unconstrained circuit be 2 times the area of the final sintered formed 丨/(1 _Sxy ). Thus, the blank strip used to make the free-sintering circuit should be 25% to 40% larger than the final finished circuit. A second disadvantage of unconstrained sintering is that it reduces the accuracy of the geometry in the free sintered circuit. This reduction in accuracy limits the ability to fabricate a large number of individual microelectronic components or individual modules within the size of an Ltcc panel, in which a large set of modules are placed on the substrate of the LTCC panel.

Page 9 ft#% 1294412 V. INSTRUCTIONS (6) imr Due to the shrinkage of the plane size (x and y), the shrinkage flux is generally ±0.2% to ±. .4%. When the size of the LTCC circuit or the J is constantly increasing, or when the connection pitch (_: space between the connectors) is decreasing, this = will be: =! For example, if the panel size is 8 inches, it will result in a positional deviation of about 16 mils (41 m). The standard location is constantly changing. For the sintering of the conductors or the resistance of the sintered conductor or resistor, or for the two-port process diagram, according to the required standard position. If there is enough conductive contact on the conductor, then the actual sintering position of the circuit feature and the distance between f will be too large, which will cause the circuit to fail due to the lack of overnight connection vla = nn tlon) or the error due to the enemy error. Layers cause changes, but they reduce the density of the circuit. ^ The kind of enemy contraction The above problem limits the ability to embed components into the industry by co-sintering: the ability of the two inner abundance/non-deformation cavity, so that: medium: inch error. There have been many types of constraint methods that have been applied to workers' filial pies in an attempt to solve the problem of shrinkage and the prevention of shrinkage. ,, top neighbor? The sintering of == and the application of external loads to the band of the ceramics are disclosed in U.S. Patent 4,340,436. European Patent No. 24385 has a mechanical clamping of the periphery of the μ panel to maintain its flaws

1294412 V. INSTRUCTIONS (7) A method of y size. These solutions have some potential problems and drawbacks for manufacturers. Since the platen provided may cause functional defects in the conductor or resistor that directly contacts the LTCC surface, care must be taken to control the contact shape of the platen and align the contacts with the blank. The use of mechanical clamping techniques may require different platen configurations for use in different circuits. Finally, a separate platen must be used in each batch sintered constraining structure.

As a further method, U.S. Patent No. 6,1,396, 666 discloses the use of a porous contact sheet which is easily disassembled after sintering to be joined to an LTCC panel. In addition, as described in U.S. Patent No. 6,205,032 and U.S. Patent Application Publication No. 2001/0018797, it is directed to the use of a constrained ceramic core which is constrained by a subsequent sintering process. Another method for constraining the χ-y geometry of an LTCC circuit includes laminating a plurality of sacrificial constraining strip layers onto the top and bottom surfaces of the LTCC circuit body. </ RTI> </ RTI> <RTIgt; The sacrificial strip layer is formed of a porous, high temperature refractory ceramic powder which is not itself sintered during the LTCC sintering process. Due to the sacrificial strip = sintering and densification in the sintered zone, it is able to maintain the geometry of the blank

However, in order to enable the sacrificial refractory strip to constrain the geometry in the &quot; direction of the strip&apos;, at least two turns should be satisfied. First, sufficient friction must be formed between the two strip materials to mechanically join the materials. Second, the LTCC II

1294412 V. INSTRUCTION OF THE INVENTION (8 〇 glass component can dissolve in the LTCC sintered surface, so that it can be sintered and become sensitive. The salt layer of the insoluble portion of the strip is saturated. Don't make all the external restraint methods mentioned above have the pressure-assisted sintering and peripheral constraints. It is necessary to use special equipment to prevent the shrinkage of the ceramics. Other J = ceramic porous molds, To form a refractory strip for the cavity, the manufacturer uses the sacrificial strip process to still have the sintered 'slave strip layer must be fully finished' to avoid interference with the subsequent manufacturing process, however; Uggressively) so as not to damage the remaining LTcc body. Similar to the mechanical clamping technique of the pressure plate, the sacrificial strip may not be compatible with the conductor or resistor on the surface of the body of the LTCC circuit. Because of these surface features, printing and sintering are carried out. ϊ 二社二成太克墙士's continuous processing steps, and will increase the continuous J (solution cost). From the production efficiency and production of the simple "-: consideration" it is best to print some features to the other parts of the billet bar to co-sinter. In addition, in the sintering 胄, ::: mechanical strength, it is impossible to install to LTCCm: i about The thickness of the body that can be restrained by this method, because the refractory ceramic sacrificial strip is dipped by 1 Η 士 W 被 可 , , , , , , , , , , , , , , , , , , , The contact sheet of strip ▼ has the cost of polluting the module b on the surface of the LTCC strip. P or dust and sacrificial layers will increase and affect the single

Page 12 1294412

In the art, the beam sintering method is limited by this side. The size of this technique must be sintered to reduce the size of the ceramic component. Many of the electrical requirements are still needed. </ RTI> There is still a need for a method that does not have the current use to ensure that it can be maintained during stamping and processing. The inch error is eliminated and the design and manufacture of the low temperature co-sintered ceramics are developed. The defects in the method and the formation of X-y in the printing process should be able to eliminate the dimensional error and misalignment steps. The plane and the supply plant are used in the low-temperature ceramic co-sintering, and have a X-y &lt;1 glass and the first ceramic layer containing the first ceramic, and the first one enters the ancient one machine binder particle At least one self-constraining layer, the self-conducting +11 such as μ "refractory ceramic, the humectant for the first glass and the second having the second, the granule. The refractory ceramic is not at the sintering temperature of the low temperature ceramic layer Threat 2, = 'sampling' When the strip is at the sintering temperature of the low temperature ceramic layer, the two layers will become dense along the ζ direction, and will be lifted without applying external constraints to make the x-y plane The inner wrinkles are reduced by 1%. The dense monolithic low-temperature co-sintering self-constrained multi-component structure comprises a plurality of ceramic substrates, especially the stack of the above-mentioned single-piece blank strips on each dummy strip or Each strip has at least one circuit component therein. Each base includes at least one low temperature ceramic layer and at least one self-constrained layer, wherein the low temperature ceramic layer contains sintered particles of the first ceramic and the first glass, and the self-constrained layer Contains refractory ceramics and first glass humectant particles. Refractory pottery and wet At least partially melted together with the first glass.

The present invention also provides a method of making a monolithic multilayer blank strip.

Page 13

1294412

V. INSTRUCTIONS (ίο) The method comprises the following steps: (a) preparing a first mud, a first clay, a glass, a tribute, a chocolate, a ceramic, a) Μ &amp; g - organic a mixture and a first solvent particle; (b) a first slurry, the second slurry comprising a hard organic, a chelating agent and a second solvent particle; the ceramic, the (c) first and the first through a slot die The second clay is attached as a first layer to a carrier; the seed mud (d) is attached to the first layer by the first and second muds as a first layer of the flute-T through a slot die. On the mud, a muddy name #Μ, this action is to be carried out while the first and the ί are still wet, so that the first layer and the first layer remain substantially discrete; (4) Qi ^. The attached mud is gathered and dried to remove the solvent substantially, instead of the dry one. A manufacturing method for the early structure of the phantom k, and port on the multilayer circuit or the hydraulic module has An x-v early and dipped in the steps of the escape: provide the sub-'on the 'Tao's strip; install the circuit components to the strips of the strips, and strip the strips Put together; the laminate of the adhesive is co-sintered to form a Hu-V organic dry mixture, and the monolithic structure with no direction is shrunk, and the surface is not wrinkled and only along the 2 porcelain strips. The steps include providing at least two of the steps of providing the green ceramic tape 'co-sintering without prejudice::, the strip of the scoop layer is the detailed description of the present invention in conjunction with the accompanying drawings. Describe the invention well, so that it can be better geographically fa'

Page 14 #14. 1294412 V. DESCRIPTION OF THE INVENTION (11) A preferred embodiment, but the specific structure and mode <embodiment> As described above, the entire solution of the wrinkle-reduced ceramic strip is processed, and the processing method is processed and installed. . In addition to or in the case of metallization, it is preferred that the present invention, which is capable of being used in the field of multi-layer microelectronics, is capable of processing a similar strip, which is self-contained, thereby reducing the single low dielectric loss and the non-panel size. Many problems with the purpose. For example, the conventional thick film metal surface resistance and surface cavity of the formed product. According to the invention, the printing on the strip should be understood that the invention is not limited to the steps of the electronic model shown in the figure, and the strip source is added at the same time, and the ceramic knot is embedded. Traditional single-beam, pre-adopted, such as root-surface, coated electric shields, improved metal guides. The ideal belt is processed in the same way. The quasi-LTCC row is sintered, which is sufficient for the purpose of the common source element. Thus, such a conductor pattern layer LTCC strip is thus capable of externally constraining a single, embedded strip that is electrically usable according to the invention and can not be found. An economical and safe solution is a method and a conventional one. The advantages of the LTCC strips, such as lamination, lamination, and co-sintering of the strip at the printing temperature, will be more pronounced. To solve the problem of integration like the south frequency state, while eliminating the problem of the error. Specifically, the single-piece strip-shaped ceramic layer structure includes the blank strips for three, as described below, and after sintering, due to the sintering process that maintains the geometry in the xy direction. The constrained blank strip can be applied to the fabrication of ceramic multilayer circuits and by modules, including surface conductors, passive/active components and voids to improve printing within the strip or characteristics, including solderability, bonding 1294412 V. DESCRIPTION OF THE INVENTION (12) Properties, electrical conductivity and electrical resistivity „ Chain strips are used for bundles in low temperature co-sintering, 'strips, as described below, because the strips of the blank can be called, and there is no shrinkage from the approximation, Therefore, in the process of realizing the 1 burn, the strip has two layers in the Xy direction. The first layer is not limited by the low temperature ceramics. The strip includes the porcelain, the first glass and the first organic ceramic. The layers including the ceramics and glass in the first pottery can be collectively referred to as the "fine particles". Including the layers in the low temperature ceramic layer ... the strips of the pots &quot;inorganic ingredients&quot;, the group changes according to the specific use = evil This is well known in the art and can be This use - of a layer may be referred to as "low temperature,; &quot; L4 with; new kinds of components. select. Glass is the use of -= _ strip to determine the physical properties of the glass, for example: 非晶 amorphous material, its characteristics ^ &gt; 丨 丄 丄 r r, such as Tg (glass transition temperature), viscosity, milk porosity , translucent #, dielectric constant and thermal expansion record (TCE). These characteristics can be controlled depending on the specific application desired. For example, a glass that has been properly heat treated during sintering may lose the brilliance of the glass, which causes the glass to become a crystalline structure. The glass can also be designed in a form that is capable of reacting with the refractory component at the sintering temperature to form different crystalline phases having different characteristics, such as low loss at high frequencies. For other applications, the glass can be designed to A high-permittivity structural form can be provided for use in the field of capacitors. The most important physical property of the glass used in the present invention is its viscosity and wetting angle, which is passed by those skilled in the art.

Page 16

1294412 V. INSTRUCTIONS 彳 13) Mixing various inorganic oxides to change the properties of the glass. Any type of glass known in the art can be used for the LTCC layer, not limited to bismuth silicate glass, and is preferably borosilicate glass such as lead borosilicate, calcium borosilicate or lithium borosilicate glass. The second inorganic material in the LTCC layer is a ceramic which has a melting temperature higher than that of glass and can be used as a supplement to glass. Although some ceramics can be used to react with glass, ceramics can also be used as fillers. This ceramic can also have special applications that affect the overall properties of the 3$ strip, such as strength, TCE or thermal frequency coefficient (τ f ), ie the change in frequency versus temperature change. The ceramic may be one of alumina, titania, cerium oxide, and many ceramics known in the art are also suitable for low temperature ceramic layer 0 nucleating agent.

In a preferred embodiment, the inorganic component of the LTCC layer further comprises a nucleating agent. The nucleating agent is typically a shell metal or transition metal oxide that is incorporated into the inorganic component of the LTCC layer. When sintered, these precious metals or transition metal oxides will become part of the bulk of the glass structure. The nucleating agent is used to increase the crystallization rate of the glass to form a desired crystal phase during sintering, thereby increasing the bulk density of the desired crystal phase, or controlling the crystal structure by forming more and smaller crystal particles. granularity. The preferred nucleating agent is titanium oxide, which may be included in the LTCC layer in an amount sufficient to reduce the porosity between the LTCC layer and the self-constraining layer, as described below. Other nucleating agents: such as zirconia, anorthite, molybdenum oxide, tungsten oxide, magnesium cobalt spinel or

1294412

V. INSTRUCTIONS (14) Other compositions may also be included in the low temperature ceramic layer. Specific choices for specific types of glass and ceramics. X, according to the LTCC layer, you are not bound by theory, so we believe that when you burn the chain, you will form a new type of ceramic material with a new crystal structure that will be made from the strip of material. In one embodiment, the nucleating agent is titanium dioxide, and in the process of 曰6 steepness = the formation of the boat 4 in the LTCC layer is redundant, and under the k,, and under the mouth, burning the name #f and # # # ,弓长石. In the absence of a nucleating agent, the L : = f characteristic, a large volume of material without the desired crystalline phase may not have the desired dielectric properties, and the = degree may be weaker than the strength of the crystalline phase. In addition, the mobility of silver in the glassy material is better than that in the crystalline material, and this can be used, and the reliability of the conductor made of the chain strip is not (4) affected. However, many problems arise when the glass in the LTCC layer loses the gloss of the glass too quickly or completely loses the luster of the glass. In particular, since the crystal phase prevents the flow of material during the sintering process, premature appearance of the crystal phase may prevent sufficient glass to flow into the constraining layer and also hinder the formation of a dense structure. The surface hardness of the ^(3) material with too low glass content can be lower than the surface hardness of the material with a large glass content, and this surface hardness may cause problems in some application environments. Setting up a nucleating agent in the inorganic component may avoid some potential problems. We also have an inorganic component such as titanium oxide included in the ltcc layer which inevitably affects the viscosity and porosity (interfacial porosity) between the LTCC layer and the self-constrained layer. If there are too many nucleating agents, the result may have existed

Page 18 eta 1294412 V. INSTRUCTIONS (15) Large interfacial porosity' to form an open channel. These open channels may reduce the mechanical strength of the component and may seriously compromise reliability due to the penetration of water into the sintered structure. The high porosity also allows the multilayer structure to be separated into a plurality of separate layers (porosity 丨〇 % ). In summary, it is desirable to be able to reduce the overall volume ratio of porosity in the sintered structure. It is also important to note that the pores exist as isolated bubbles rather than in interconnected channels. It has been found that the inclusion of 7% of the stomach in the LTCC inorganic component produces a large number of unfavorable pores at the interface. When the titration of titanium oxide drops to about 5%, the interfacial porosity decreases, but open pores still exist in some areas. When only 2.7 % of the titanium oxide is contained in the LTCC layer, the porosity of the interface can be reduced to an optimum level, which is capable of removing open pores. Further reduction of the content of titanium oxide further enhances the density of the sintered structure, but it is also possible to make the content of the fracture excessively high in the sintered LTCC layer. The final component of the low temperature ceramic layer is an organic dry agent suspended in glass and is included in the dry agent = plasticizer and/or a dispersant. Groups of organic dry binders Decomposition and/or firing in the temperature range from C to 500 t: The organic dry mixture can be based on industry standard formulations, such as the United States. 4/69 294, 5, 387, 4? 4 and 4, 536 53 5, or the specific inorganic constituents of the patent strips and the desired uses. The specific handling of the strips is called the preliminary processing (green handHng), this preliminary processing package:

1294412 V. INSTRUCTIONS (IQ: parameters such as separation of carrier film, dryness efficiency, brittleness, strength, etc. The selection and adjustment of these components of the dry binder belong to the field. For example, the wrinkles of the strip during sintering The shrinkage may be selected and rang. Conventional polymeric resins include a variety of polymeric materials, such as Ding'er, :::: polyglycolic acid compounds, high molecular weight (tetra), and propylene organics, the ratio of which is the solid Sensitivity during low sintering. However, in order to avoid damage, such as twist or stratification of the material (: 3⁄4 material sheet #g #二量 ratio is 8〇%. 胄大重里 ratio is 2G% 'solid The second layer of the composition of the vocal layer is also called &quot; self-constraining the ability of the adjacent coffee layer, which is outside; the bundle: the square piece can be bundled; Or a plurality of physical materials or physical constraints. In this context, the application to the blank is applied to the blank body and can be bound in the blank. 1 means: material, component or force, but After sintering, the inner yellow = outer body exerts the constraint: the external constraint can be imagined as After the layer is removed from the alkane, it is still not part of the monolithic structure. However, the self-constrained layer can be used as a sintered single piece, and the present invention is in the form of - part of the body

#·?# 1294412 V. INSTRUCTIONS (17) This self-constrained layer includes: refractory pottery-tantalum, a first layer of humectant and an organic dry binder particle. An organic binder glass polymer resin and a plasticizer and/or dispersant, such as &amp; an organic dry binder which is the same as or different from the organic binder in the first layer, preferably used to form a green strip The low, w layer organic binder has the same composition. The two machines in the self-constrained layer can be either a known formula or a self-constrained::. θ, ",, machine into refractory ceramics ^ melting ceramics is a kind of ceramics usually in the range of 75 〇 to 9 〇〇. (: The low temperature ceramics will not sinter at the junction temperature. In fact, all refractory Materials:: Suitable, this includes Tg glass or high temperature glass materials, including 卩疋1 000. (: preferably high K150 (TC crystal and amorphous. Specifically, + point 2 in Tao Jing's melting point should be at least about absolute The sintering temperature is 13 times. Example 1, the best refractory ceramics that are refractory to the self-constrained layer include inorganic oxides, gold salts, metal sulphides, metal bromides, metal nitrides, and mineral salts. The molten ceramic may include Mgx0y (magnesium oxide), Bex0y (yttrium oxide), AlxNy (aluminum nitride), BxNy (boron nitride),

BaO· A1 203· 2Si〇 (钡石石), Ca〇A12〇3· 2Si〇2 (alkaline), .2MgO· Si〇2 (forsterite), calcium borate, barium titanate or Ca0.Si02 (矽Graystone). In these formulations, X and y represent the relative proportions of specific elements. In the present invention, perovskite can also be used as a refractory pottery. The term "π perovskite" should be understood by those skilled in the art, and the terminology: a group of inorganic gases having a composition of ΑΒ03 such as CaTi〇3, srTi03 and LaA103. 1294412

Things. The best refractory ceramics, zirconium oxide, titanium oxide, cerium oxide 0 handles such as alumina, anorthite, mullite and its derivative ceramics and pottery in the LTCC layer: phase:: layer The compatibility of refractory ceramic materials (such as the matching of thermal expansion coefficient: the required chemical compatibility, so that the reaction between the ceramics and the ceramics forms an unfavorable phase I... will be due to the wet sword of glass and ceramics A glass wetting agent in the second component layer of the inorganic component of the self-constraining layer of the blank strip. The presence of the wetting agent causes the glass to flow from the LTCC layer into the other microporous self-constrained layer during sintering to form a ceramic matrix. For example, cerium oxide, alkali metal oxides (such as lithium oxide, sodium oxide, potassium oxide, and oxidizing) and ceric acid salts (including both alkali metals and alkaline earth metals) are the preferred humectants in the present invention, but Lithium niobate (L i 2 § i 〇 3 ) is the best wetting agent. However, it is also possible to select a specific wetting agent for a particular blank strip depending on the particular glass used in the first layer. Any wet known to those skilled in the art In particular, if the wetting agent is not melted by the first glass at the conventional sintering temperature of the LTCC structure, the sintering temperature is generally about 850 ° C to 900 ° C. In the case of t, the glass may not penetrate sufficiently into the self-constrained layer. In the absence of a wetting agent, the self-constrained layer must be very thin (not more than about 2 microns) to avoid separation of the multilayer strip into multiple layers. By adding a wetting agent, such as lithium niobate, it will increase the glass that moves into the ceramic.

V. INSTRUCTIONS (19) Quantities and can form thicker layers without delamination. As described below, a thicker layer is very effective for reducing shrinkage in the X-y direction during sintering. Limiting the excess glass or moving floating glass and reducing the amount of glass on the surface of the sintered strip is an important aspect of the present invention. In the sintering process of the conventional glass Tauman LTCC strip, not all of the glass microcrystals participate in the reaction and crystallize. A certain proportion of unreacted glass is in a drifting state and moves toward the surface of the strip. The movement of the glass or the control of the unreacted glass is particularly disadvantageous when the metal is sprayed onto the co-sintered surface. During the sintering process, concentration will occur in the metal inorganic particles constituting the conductor track and the spacer. If the glass moves and flows into the conductor, it cures to the surface mount component. In addition, the non-conducting glass phase will reduce conductivity. Similarly, the same is true for surface-printed resistors, which fluctuate when the glass moves into the resistor during the glow process. Therefore, 0 is best to prevent the glass from moving to the outer layer of the strip. Thus, due to the precise thickness of the intermediate layer of the three-layer strip of the present invention, control of the movement of excess glass into the surface of the strip can be achieved. The glass is contained in the middle of the strip, and the number can be blocked by the intermediate layer. Control, so that the conductivity and electrical annoyance of the printed portion of the surface can be improved, and the degree of compaction of the particles in the self-constrained layer of the strip of the blank is preferably higher. Micro 曰^ f is also called packing density, which refers to the volume ratio of solid particles, and t is determined by the size, shape and distribution of the particles. The size of the refractory ceramic particles is J-solid and wide, and the inside is the best. Smaller microcans, X, sputum, and contact between particles will increase the volume density in the self-constrained layer. 1294412 V. Inventive Note (20) Degree. Further, in order to obtain the maximum packing density, it is preferable to make the solid refractory particles of a regular shape account for 60% of the total volume. In one embodiment, the self-constraining layer further comprises at least one glass known to those skilled in the art. This glass acts as a wetting agent. Unlike the humectants described above, the glass used in the self-constrained layer will melt into the glass used in the LTCC layer. Therefore, if the average particle size of the glass is about 1/10 of the average particle size of the self-constrained layer, it is possible to add a large amount of glass to the large ceramic particles during the layering process of the strip. Between the pore locations, thereby reducing the resulting shrinkage as the glass particles melt. In a preferred embodiment, the blank strip includes a self-constraining layer sandwiched between two low temperature ceramic or LTCC layers, as shown in FIG. In such a three-layer structure, these layers may be referred to as a top layer, an intermediate layer, and a bottom layer, respectively. A three-layer structure of the second embodiment comprises a low temperature ceramic top layer 2, a = layer 22 and a low temperature ceramic substrate 24. In one implementation: and the bottom low temperature ceramic layer has substantially the same composition. The intermediate self-constraining layer preferably has a thickness greater than about 20 microns. The f degree of the intermediate layer has an important influence on the shrinkage of the green strips. The thickness ratio of each of the three (four) strips is shown in the figure. It can be seen that the curve of the amount of wrinkle in the direction of the y direction is increased by a small amount, and the amount of shrinkage in the X-y direction is reduced. In the three-layer strip of the lower layer of 5.3 mils (135 micrometers), I also produced an intermediate self-constrained layer of 12. 5 micrometers to produce 〇. 5 · = 〇, ,, micron intermediate layer 〇.17% of the enemy. The thickness is 3.

Age 4 1294412 V. INSTRUCTIONS (21) When the strip of the billet is sintered at a sintering temperature of the low temperature ceramic layer _ °C, the strip: 75 〇. . To the density 'and produced along the x-y plane of the layer; J to J is 0.2%. j is about 1%, preferably not super. Although it is not desired to be bound by theory, the low shrinkage produced by the y-plane can be explained as follows. After the X-binder evaporates from the various layers during the weld last name, the LTC: layer. In the 'when eight organic to sintering and begin to densify, this # ..., the machine will be reduced, and the particles begin to occur;; the apparent size will become larger, (4) shape to light: grain: ^;; The particles are densified. At the same time, due to the presence of ^: t force in the middle i, and between the glass and the material in the self-constrained layer: Once? The glass is thick enough ‘then it will flow into the optimal 咼 filling density, the intrinsic contact between the high solids particles and the particles of the self-constrained layer, and the friction between the layers and the layer, k The chain strips become dense only in the Z direction. In order to achieve this low level of shrinkage, the specific = of the strip must be carefully chosen to complement each other. For example, LTC (: glass in the layer should meet ^ ^ requirements, such as dielectric constant, sealability, sinterability, reactivity, and, crystal. Second, the viscosity and wettable of glass relative to insoluble ceramics The nature of this property is also very important. The wettability of the glass is determined by the adhesion of the liquid to the solid and the interface between the dry glass and the refractory ceramic. Finally, the insoluble ceramics of the porous structure that is intended to be compressed are also Very important. As mentioned above, the glass will penetrate into the tightly compressed refractory ceramic in the self-constrained layer and pass through

Page 25 1294412 V. INSTRUCTIONS (22) The replacement of at least one bonded road component in the blank, such as an electric pattern or a non-conductive core or core component, should be understood: The current is generated around the conductor. Voltage (inductance) For example, a waveguide, a watch can be a semiconductor element: one or more of the strips in the chain layer can be stripped to the strip, the electrical pattern, the transformer, the non-conducting Magnetic field. It is also possible to mount the surface acoustic wave component to the inner surface of the belt for control. Outside of at least two layers, an external flat resistor, and with at least one container, such as an inductor, but not a local structure means a structure, from the use of other parts, the resonant strip process, the strip also has a surface dielectric or Not limited to this. A method that enables a flow to form a current circuit structure or an inverter or a mixing tube. on the surface. The circuit component can also include electrical, metal-conducting conductors with ferromagnetic domains on the surface of the change in the conductors relative to the source 7L. In addition, it is also conceivable to mount each of the multilayered strips for manufacturing the invention according to the invention. The best way to do this is to apply the wet ceramic to the wet ceramic approach (7疋simultaneous wet on wet ceramic approach)

In the method, a plurality of layers are mounted by a grooved mold, as described below, or the strip may be produced by any known method. For example, multiple layers can be applied to a carrier by a wet on wet approach or other sliding spray method, such as nozzle spraying. Although three wet strips can be sequentially cast using a plurality of doctor blades in a jig or sequence, as described above, the strip casting technique has some of the disadvantages described above, including the difficulty of controlling the thickness of the intermediate layer in the multilayer strip and Its inaccuracy. In another method, it can be formed by a wet method or a dry method.

1294412 &quot;&quot;&quot;&quot; 丨_ 5, invention description (23) multiple layers, but this cost is higher. The use of two ίίίί 链 chain strips is self-constrained, so the well-known method of the field 11 and 1 processing can be used to solve the new type of blanks by solving the problem in the ceramics. Strips, and the source of dimensional error to reduce the manufacturing of the external technology:::, "," the present invention also provides a table of tantalum-joined constraining materials, capable of:: electric strips are co-sintered 1 While reducing the sintering cycle of the L-sintering process involves the coplanarity of the surface conductors, it refers to the sintered substrate in the "flat mouth: degree. The term "language" is used to quantify the curvature of the outer surface of the eclipse. The surface is caused by a mismatch in the sintering speed of the conductor and ^, Γ = . It is believed that the velocity deviation of the II junction before the peak is produced on the dielectric will produce shear stress. The tensile stress or tensile force in these planes is not offset by the soft spring strip during k t, causing it to bend. From the tightly compressed structure according to the present invention and the intermediate layer or self-conducting layer of the green strip, the solid component, the inherent rigidity of the layer outweighs the sintering deviation of the conductor, because: the force acting on the strip can be counteracted. The glass &amp; in the low temperature ceramic layer is placed in the strip to increase its inherent strength. A similar principle can be applied to a show-through that can show the placement of a fixed curved or curved portion on a particular printed structure. Perspective is typically quantified by the maximum reflection over the range of feature distances. 1294412 V. INSTRUCTIONS (24) It has been demonstrated that by using a plurality of silver-incorporated self-constraining strips, the application of the LTCC strips containing the self-constrained strips of the present invention, substantially as described above, in conventional constraints, . Specifically, the self-constraint is evenly distributed over the entire structure, so that the beam layer is evenly distributed in a module that can withstand the sintering in a plurality of layers, and the JL can be significantly reduced. A laminate of self-constrained multi-layer ceramic substrates with an outer sheet of low temperature co-sintered, each circuit component. These elements, such as a susceptor, a dielectric, a metal conductive pattern inductor, or a self-constrained layer of at least one glass of low temperature ceramic layer and one agent particle, may or may not be included with or without a ferromagnetic layer. Tao, the humectant in the structure is as described above. In the ceramic and self-constrained layers in the layer, if the first low-temperature ceramic layer also includes erbium, anorthite, molybdenum oxide, oxidized paste, and different sintering velocities, the surface or perspective is zero according to the present. The method allows the structure for mounting to the cavity of the integrated circuit to have poor characteristics. Overcoming these characteristics, such as shrinking the method, causes the stresses or forces in the plane to bring the cavity and the peripheral wall close to a straight line. When the top of the structure is about to the bottom, the stress is stretched. When the constraining layer is distributed in the curvature of the neck. The present invention also provides a dense green structure. The structure includes at least one transformer on or in at least two of which are resistors, capacitors, varistor or inductive structures such as anger or core elements as described above. Each of the first ceramics containing the sintered and the first containing the refractory ceramic and the first glass wet glass, the refractory ceramic and the multicomponent are used in a preferred embodiment, the first ceramic insoluble ceramic has the same composition . Nucleating agents, such as titanium oxide, cerium oxide, town surface spinel, etc., as described above

Page 28 1294412 V. Inventive Note (25), the nucleating agent can exist in an amount effective to reduce the porosity between the LTCC layer and the self-constraining layer. The multi-element structure can be produced by stacking a plurality of ceramic substrates such as the above-described blank strips to form a laminate, and sintering them to form a refractory ceramic in the self-constrained layer. The humectant and the glassy soil ^ : fuse together and form a dense monolithic structure. This structure is a three-part self-constrained structure because of the sintering process of the laminate of the multilayer ceramic substrate: the undesirable wrinkles in the xy plane are reduced by 2%, in the preferred embodiment, less than 〇·, 2% And no other materials or other external constraints are required. In the shrinkage, the desired shrinkage is produced in the ζ direction so that they are dense and form a dense monolithic structure. In 鳅, the monolithic structure may further comprise a sandwiched between the two first interlayers to form a three-layer structure. As shown in Figure c, the top layer 10 and a ^ ^^ containing the insoluble ceramics, the middle bottom layer and the top layer are low temperature ceramic layers. 4B 3 is not a sheet 14 in the scope B of the present invention, the beauty laminate may further include at least one additional dragon material sheet L including a layer of steep base particles containing the second ceramic and the second glass and The entanglement of the whistle and the glass can be adjacent to at least one low temperature terracotta layer. ‘ In one embodiment: the pottery in force ί! is the same or different from the glass. Ξ The capable r-addition substrate can be an LTCC strip. In the corps and 16, "冓 (Fig. 4C) +, the laminate can include at least two additional = two substrates can be phased :::: sheet 14 set in the top of the laminated shirt T y On the additional substrate 14 and another substrate is positioned at the bottom of the laminate. ^, it can also be placed in two multi-layered film pairs

Page 29 ^ &lt;Between and 1294412

H. Description of the invention (26) and the two of them y 1 , which are adjacent to each other, as shown in Fig. 4D. The substrate (eg: = can be called π cladding n structure, in which the multilayer uses the traditional gamma: = 枉 strip, but is not limited to this) can be knotted in the process, It is formed and co-sintered to prevent the laminate from wrinkling under the windings according to the crucible. These cladding structures enable the use of constrained strips, thus it is a special LTCC strip and self-recording that can be purchased. ", and the external constraint technology of the upper 4 can form a multi-layer microelectronic circuit wedge set: square band particles and the first solvent, the second two layers; the pottery, the second organic binder and the second solvent Particles: Ceramic machine binders and refractory ceramics are as described above; the first glass, the agent may be all known in the art for rapid evaporation: a good solvent) solvent which dissolves the binder resin. Evaporative pressure, such as methanol, ethanol, butanol, such as a solvent including rotenyl ethyl ketone, or other solvents, but not limited to this methyl isopropanone or phenyl ether or glycol ether, Or a mixture of these solvents, such as cyclohexane, may be the same or different, and may be selected according to the respective K:2 organic. However, if the first loach is in the middle The organic binder in the organic binder has the same composition, then / and the first mud selection. Rolling sword can be L7 county Zhang female I into AA 1 〇 ^ the best choice

The wet oxide bismuth salt of the first ~ 'one ~', ----! _ 1294412 is the best wet description. This is described in the oxime and oxidation. The refractory metal mold in the layer will be the second layer of the slurry. The slurry coated in the art can be applied to the coating base if it is necessary to use a large air-fired heating. 2. The relative proportions of the components can be adjusted. In a preferred embodiment, the second emollient 'as described above, the humectant can be (e.g., lithium oxide, sodium oxide, oxidized (including both alkali metals and alkaline earth sizing agents. The second slurry can also include at least outer' The first slurry may further comprise a zirconium, anorthite, molybdenum oxide, tungsten oxide. In a preferred embodiment, the ceramic is the same in the first slurry. The method further comprises spraying onto a carrier through a trough layer and at One time the other slurry is passed through the slot die so that the first and second layers remain substantially unsupported film, such as a film, or body. Finally, the method also includes spraying the solvent instead of the binder. Thereafter, the tape is wound onto a reel. The most entangled strip of the strip removes the solvent from the strip and gradually increases the temperature to above 80 t, which is known as any of the well-known methods in the art. In the example, two of the seven zeros to control or regulate the evaporation of the slurry also include the first glass of sulphur dioxide, the metal potassium and the oxidized planer, or the lithium silicate is a glass, such as a nucleating agent, such as dioxide. Or magnesium cobalt spinel, such as The ceramic and the second mud seed slurry as the first still wet sprayed to the first body can be known for other drying, so that the group can be in the flow and the device can complete the present invention is the same condition On the next layer, an organically suitable strip of solvent that is substantially removed from the drying is soaked in the strip to dry the strip, but in the process.

Page 31 1294412 V. Inventive Description (28) In one embodiment, the method further includes three muds including a second ceramic, a second spot magnet, a flute, and a first organic dry mixture of the first glass And the third &gt; granules are granulated. In a preferred embodiment, the first slurry and the third: corpse will: have substantially the same composition, but the composition of the third slurry can be selected independently of the ingredients of 5 2 ς. The method of scalding, g., / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / The second mud consists of the second layer, so that the second heart; no; continued. It is best to spray all three layers at the same time. In the first and third) muds including the conventional LTCC strips* knife's attack sample invention provides an improved method for making self-constrained multilayer strips ▼ that protects the traditional LTCC strips. Γ Referring to Figure 5, a preferred embodiment of a method for fabricating a single-piece three-layer blank can be better understood. This method can be called, wet on wet ceramic appr〇ach This wet-on-wet, no-processing method is an improvement on the conventional mold tungsten manufacturing technology. In this way, the wet ceramic is sprayed into a polyester film ceramic slurry through a grooved mold. 2A and 3A are coated and sealed in the separate container 1 spear 3. The mud gathers 1A and 3A preferably have the same composition, but may also have a thickness of 2. The slurry 2A containing the refractory ceramic is formed in the middle. The self-contained layer, each mud mash, 2A*3A contains a mixture of inorganic components, organic binders, and an alternative solvent. The vessels are respectively pumped through separate pumps to four separate tanks that are adjacent to each other. Forming mold feed. Three ceramic muds are simultaneously applied to the movement On the carrier film 5, although the carrier film 5 shown in Fig. 5 is not moved upward at an angle of about 45 with respect to the horizontal plane, the film is also

Page 32 1294412 V. INSTRUCTIONS (29) Can move at different angles, move horizontally, or even vertically. ^ As shown in Figure 5, the bottom mud is pumped to the bottom of the grooved mold structure 4 by the pump 1β and sprayed. At the bottom position adjacent to the film 5, a first layer 8 is formed on the film 5. The intermediate layer slurry 2 is pumped by the pump 2β into the intermediate groove + die structure 4 and sprayed onto the first layer/on the carrier film 5 such that the slurry 2 a forms an intermediate layer on the carrier film 5. 7. Most =, the top slurry 3A is pumped into the channel mold structure 4 by the pump 3B and sprayed onto the intermediate layer 7 on the carrier film 5. The sprayed loach 3A forms a top layer 6 on the carrier film. It should be understood that these muds are sprayed substantially simultaneously in a manner similar to co-extrusion. By using this method, the surface tension between the carrier film and the viscous fluid slurry forms a meniscus on the interface between the mold and the film: Button:: Belt: When moving at a specific speed, the ceramic slurry can be ^ ^ ^ ^7 The viscosity of each mud is very large, so the phase ==3_±5 does not occur. . Centipoise (cps). Carrier = = : Speed ί also with drying parameters: · The thicker the belt, then the carrier moves = the purpose is to be able to finish the drying correctly. By making the pressure corpse: Ϊ疋 not 35, the control of the pumping pressure can be further controlled by the pump's angular velocity RPM by separately adjusting the thickness t' required for pumping the second layer in each container. The descriptions are made for the preferred embodiment of the present invention, and those skilled in the art can make modifications to them by conventional design means. For example, the wetness of the wet mud pack 1294412 V. The invention description (30) varies between 6〇〇cps. The other can be changed, for example, the type and pressure of the mold and the position of the grooved mold. The two molds can be placed in such a way that the individual molds can exist independently or can be picked up. 'Or placing more than three molds as described above, after drying, the method: the inner and the inner stream may comprise at least one of the strips of the film blank comprising the sprayed layer, at least one The circuit components are bonded to any of the foregoing. Steps on the surface of the plane. The circuit component can have a thickness greater than that of the interlayer (consisting of the second slurry). Finally, the present invention provides an improvement in the fabrication of a single piece, structure. =f € Road or hydraulic module on the air, m M is enough to allow fluid to flow through the scorpion 2 '...cooling the power generation device or in the strip: the::: these channels and / or cavities are in The lamination step is formed by internally forming a structure made of organic: such as wax or poly = as desired organic material. When the organic dot mixture is burned out, this = the strip will disappear, leaving only the open channel structure preserved after sintering. The strip-direction is "in-and-on"

Page 34 1294412

V. INSTRUCTIONS (31) Decommissioning: These stacked strip layers are then removed to form an organic structure. This type of clamping pressure or self-constrained layer. Forming a layer of ceramic layer, the organic binder in the strip layer of the constraining layer preferably encasing the crucible method in the constraining layer, and it is necessary to utilize a beam or material to a degree to better understand Mixture 'then will be laminated strips without dryness: Π only = toward shrinking along the &quot;planar wrinkle-free: the method needs to apply to the laminate -: sacrificial layer. According to the present invention, for example, a strip of field material, and = two J for - a kind of scrap with a roaring sound of + +, and the outer neighboring constraining element into a co-sintering operation The strip preferably has a low temperature ceramic layer comprising: a first pottery low/dish particle. The self-constraining layer is the most: the package: is the upper; the glass and the first component are the same as the above-mentioned strip and the same. As described in the ,, the low-temperature ceramics 'and the ceramics in the low-temperature ceramic layer and the self-refractory: the same ' 'in addition, the self-constrained layer also includes glass /, the traditional constrained sintering method is different, in the traditional square f An improved method of the invention for applying an external constraint, such as a pressure or sacrificial layer, within the belt, can reduce the amount of shrinkage in the xy plane to less than i% and preferably to less than 〇·2% without external physical approximation Degree. The invention will be described by reading the following non-limiting specific examples. XM1 A three-layer strip comprising the same top and bottom (outer) low temperature ceramic layers and an intermediate self-constraining layer was fabricated as follows. In order to manufacture the outer layer, it is necessary to prepare 336.65 pounds of mud, which is obtained by using Table 1.

Page 35

1294412 V. Description of invention (32)

The first eight components are not filled together in a water-cooled medium grinder (purchased by Premier Mi lls) and the cerium oxide pellets are added to the mixing medium. The mill is equipped with a mounting shaft. ^ On ^, aluminum plate. The resulting mixture was milled for 9·9 hours. Next, the last component is added to the mixture in 1/3 increments and L is combined after the addition until the newly added material is not visible on the top surface. When the ^1 addition work is completed, the drop is continued for two hours to form a homogenous mud with a viscosity of 362 〇 cps. The dryness is achieved by using a #5 shaft set with a speed of 2〇1^11] Measured by Brookfield viscometer (Brookfield ViSC0meter). Then the mud gathers are evenly separated and tied to two separate containers.

Table 1: Component composition of outer mud weight percent methyl ethyl ketone (solvent) 8.13 ethanol (solvent) 7. 60 Ah03 29. 26 glass 32.81 Ti〇2 1.75 blue pigment 0.29 dispersant 1.98 lubricant 2.10 prefabricated dry Mixture mixture, plasticizer and methyl ethyl ketone 16. 08 The mixture of the components listed in Table 2 can be mixed by a media grinder on page 36 1294412 V. Invention description (33)彳古浆. Join the pre-located self-constrained layer of mud in the middle to join the last two sites, Π: grinding for 5 hours. &gt; previously described, and the viscosity is exceeded. Above::; continue to stir for 2 hours, then pump to the third and today π U to determine the muddy l^OOcps. Blade Degree Table 2 · Components of the inner layer of mud accumulation I~1~——__ ----- J and points A1203

Dispersant A Dispersant B Pre-formed binder mixture, plasticizer and methyl ethyl hydrazine, in a separate tank mold of mud # in three containers and simultaneously sprayed to a thick household

Mylar's polyester film (which can be moved from the Dup〇nt company's film at a speed of 1 ft/min in a vertical direction. On one, the polyester is thin for spraying to form a bottom low temperature ceramic layer. And the middle self-fixing trough mold slurry, the second trough mold spraying the top low temperature ceramic layer. The ceramic layer mud is then passed through the heating chamber and the air flow including the three mud layers at different temperatures. Four

▽丹 for dry: 48· 8 〇C

1294412 V. INSTRUCTIONS (34) (500 cubic feet per minute (cfm)), 54.4 °C (5 ft cubic feet per minute), 54.4 °C (3000 cubic feet per minute), and 76.7 °C (2000 cubic feet) /Minute). The thickness of the top layer, the middle layer, and the bottom layer is determined to be about 2 · 3 mils, about 1.6 mils, and about 2. 3 mils, respectively. Next, the resulting strip is cut into a plurality of 5, X 5" portions, and the four portions are stacked together and laminated at a pressure of 4 psi and a temperature of 70 ° C. 5 minutes. Then, the laminate was sintered by a sintering furnace (prof 1 le ) described below, and the temperature was changed from normal temperature to 4j0 ° C at a rate of 1 〇 / minute to remove organic components; then, at 75 t / minute The speed is increased to 870 ° C. After the temperature is maintained at 87 〇 ^ 3 〇 minutes, the temperature is cooled to room temperature at a rate of 10 ° C / min. After sintering, the strip shrinks in the Xy direction. The rates are approximately 〇· 154 ± 〇· 〇〇 49 % and 〇 0.0 0.0133%. · — Examples 2 to 6 嚷 之 〜 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对The top and bottom layers of the belt are commercial LTCC strips with the ingredients listed in Table 3. For the parent strip, the various glass, filler and nucleation listed in the glass/ceramic package are listed in Table 5. The physical properties of the parent LTCC strips are specially prepared for each intermediate layer, which is obtained by including the organic and &amp; listed in Table 4. Machine 8 &amp; Mill Grinding 24 knives to cast the mud into a strip of 2 mud. Using a scraper (available from DuPont), the layer of polyester enamel. To form a thickness of 1.6 mils

1294412

V. INSTRUCTIONS (33⁄4) To make a three-layer strip, make a stack between the self-constrained win layers. The resulting stack is under stress conditions of 4_0 Psi and 7 (t). The next heating was carried out for 15 minutes to form: a green strip of the layer. Then, the crucible was sintered in the sintering furnace described in Example 1 and the shrinkage ratio in the xy direction was determined. The strip ▼ can be seen from Table 5:: All of the five strips of the present invention have a shrinkage ratio in the xy direction of less than 〇·2%, and in the following T: the shrinkage rate is only 0.12%. The shrinkage ratio is far lower than that of no book, shrinkage rate. See: by making a suitable self-contract

Layers, it is possible to push a variety of different types of commercial LTCC strips * Table 3: The composition of the LTCC strips" 咿, force beam. Glass / ceramic mixture β strips 1 strips 2 ϋ 5 · 3 57. 9? Acrylic Polymer 7.0 - 6. 97 Butyraldehyde Resin - 3. 96 Methyl Ethyl Ketone 15.4 - 15.40 Dioctyl Phthalate 1.4 - 1.38 Methyl Isobutyl Ketone - 27.51 Casting Isopropanol - __ The liquid is formed into two gas methane--.^Fluorine--------------------------------------------------------------------------------------- 1.06 Solvent One - Withered! One One - Ethanol 7.8 One - ^Ϊϋ2 XX BaO XXX AI2O3 XX B2O3 XXX

Page 39 1294412 V. Description of invention (36)

Glass/ceramic components CaO SrO MgO K2〇PbO ZnO U2O Na2〇XXXXXXXXXXXXXXX j XXX AI2CM XX AI2O3B XX Ti O2 XXX Filler/nucleating agent a mullite X Cu2〇Si〇2 XX CaB2〇i X α glass/ The ceramic mixture contains both glass/ceramic components and filler/nucleating agents' as shown in the table. The b strip 5 contains both crystal glass and amorphous glass. Table 4: Slurry component strips of self-constrained layer 1 strip 2 strips 3 strips 4 strips 5 organic components (phase acrylic polymer butyraldehyde resin 7.0 7,0 7.0 7.0 7.0 contrast ratio) methyl ethyl Ketone 15.4 15.4 15.4 15.4 15.4 Dioctyl phthalate 1.4 1.4 1.4 1.4 1.4 Surfactant 2.0 2.0 2.0 2.0 2.0 Plasticizer 1. 1 1. 1 1. 1 1. 1 1. 1 Ethanol 7.8 7.8 7.8 7.8 7.8 Inorganic Composition ai2〇3 90.0 60.5 60.5 60.5 90.0 (relative ratio) Li2〇3 Glass 10.0 27.5 27.5 27.5 10.0 — 10 10 10 -

Page 40 1294412

V. INSTRUCTIONS (37) Table 5: Characteristics of LTCC and three-layer strips Characteristics of LTCC strips TCE (ppm/ °C) Entrapment rate along the X-γ direction Band 1 Band 2 5.6 14% 6.7 JA4Q% The tapping rate of the three-layer strip along the XY direction is 0.1 different from the traditional one. In the single-chip sacrificial method, the mechanical method is the least constrained material, and the constraining material is ^^ is used for monolithic melting and is burned out to give two advantages according to the present invention and conventional non-burning. 1 5 % of the traditional sacrificial constraint method and the monolithic constraint of the present invention. For example, in the sacrificial method, there is a method in which the constraint material # ϋ # / is removed after the splicing, and the material becomes part of the final structure. For , , the force beam material does not have a tensile constraint material after sintering after sintering and its surroundings, and at early ^ π , the 1 ^ " strip around Dan has a genus. In addition, in the sacrificial constraint, the branching is corrected from the earthy type. In the early film method, the penetration of the glass is outside the main body of the saturated circuit, and inside the monolithic method. Finally, in the sacrificial method, about: Yannan is sintered under the conditions of the sintering temperature of LTCC. The constrained material becomes an integral part of the final structure at a condition below the sintering temperature. In addition, these differences can also provide a number of advantages over the conventional sintering method. Specifically, the := uniform LTCC strip has a shrinkage rate of at least the first 'Xy direction' that can be reduced from about 丨〇% to a shrinkage rate to less than 1%, or even less than about 〇·2. %. its

1294412

• 2% to 0.4% decline. 5. Inventive Note (38) Person; mouth X-y direction of the enemy's rate of change can vary from about 〇 to about 0.1%. Compared to mechanically constrained sintering, the monolithic constraint is in a sintering furnace without the need for a platen that is shaped on each part. Finally, the constrained firing with the sacrificial constraining layer is very advantageous because after sintering, it is not necessary to have the adjacent conductor and resistor co-sintered onto the monolithic constraint. Furthermore, it is possible to form a component having a greater thickness and a new type of self-constrained blank strip compliant component according to the present invention in a field of constraining the beam material uniformly over the entire thickness of the component only on the surface LTCC body, and It can also be applied in the field of multi-layer pottery. The step after the formation of the ceramic structure is particularly important since there is no misalignment of the layers. Its domain, such as the biomedical field of electromechanical devices, meso-structure, and also domain 0, provides a method for forming strips that eliminates the root cause on ceramic components. And make it more economical by eliminating many of the dimensions errors = development and manufacturing steps. The tape strip has a structure in which the following material is produced in two dimension directions (Xh direction). The method has the following advantages: Do not install a structure supported by an LTCC circuit having a suitable knot compared to a bundle material for a porcelain structure. Therefore, this application package is applied to the 'single-piece constrained removal' and the surface ratio of the structure is about 5 monolithic structures as a whole, and the circuit technology is formed by using a plurality of sintered ceramics for the different collars without shrinkage. The method and method of use thereof and the circuit required to produce a plurality of dimensional error generation and misalignment are designed in accordance with the present invention to prevent shrinkage.

Page 42 1294412 V. INSTRUCTIONS (39) A mechanical material for forming an object according to the present invention; it is possible to control the formation of defects according to the present invention which can be formed with various advantages in the art. The invention is not limited to the surface material and the disadvantages of the blanks of the patented material, the porosity of the blank. The skilled artisan should limit the scope of the disclosure to a number of advantages, including without reducing the occurrence of unburned delamination; without sacrificing sacrificial and compatibility with co-sintered conductors; thicker laminates that can be carried; The material is burnt and bonded. Thus, the present invention provides a method and there are no known methods and materials. It is known that many variations are possible within the scope of the inventive concept. Therefore, it is to be understood that the particular embodiments of the invention are intended to include modifications and modifications within the scope of the invention.

Page 43 1294412 Schematic description of the figure JA is a transparent design of a conventional single module with a cavity, a metal conductor and a connecting path (4) for bonding a plurality of figures": multi-planar, layer secret Figure 2 is a cross-sectional view of the three-layer strip of the present invention. Figure 3 is a graph showing the thick sound and relationship of the three-layer strip of the present invention; & size and shrinkage ratio of each other Figs. 4A, 4B 4C and 4D are cross-sectional views of a plurality of self-boring soils of the present invention; FIG. 5 of the self-constrained multi-element structure is an unsuccessful view of the ceramic synchronous attachment device of the present invention. Description: 1, 2, 3 containers 1A, 2A, 3A p IB , 2B pump 10 bottom layer and top 7 12 intermediate self-constrained layer 14 ' 16 substrate 20 low temperature ceramic top layer 22 self-constrained layer 24 low temperature ceramic bottom layer 4 grooved mold knot 5 film 8 first layer 7 middle layer 6 top layer Φ

Page 44

Claims (1)

~一_? ^ wj a strip of monolithic material used in low temperature ceramic co-sintering and having a Z-direction thickness, the strip comprising a y-plane and a layer along at least one low temperature ceramic layer, The second glass and the first organic binder particles; there is the first pottery; the glass = two: there is difficulty · ' 'Use these layers to become capitalized in the Z direction, and the U layer temperature of the layer is 2, The shrinkage rate in the W plane is made less than 1%. The premise of knowing the use of external constraints: Shen:Special: the strip of the scope of the item, in which the tile layer and a self-constrained layer sandwiched between them. The mouth is low, and the pottery is ϋίίΐτ成围/. The two strips 'two of the low temperature pottery layers have a second rhyme strip, wherein at least one self-constrained layer of elements: the strip of the item', and also includes at least one circuit surface on the surface Γ 70 * Connected to at least one external flat of the fun strip. • As claimed in the fifth section from the following set of devices: • One less circuit component selection structure and metal conductive pattern. , dielectric, sense 7 · If you apply for a patent range! The band of the item, wherein the insoluble ceramics are selected from the following materials of the 1294412 group: inorganic oxides, compounds, metal nitrides and minerals. Barium salts, metal carbides, metal bromides such as the patent scope of the patent range 7 Δ A ^ group of materials: oxidation in VI咿, wherein the inorganic oxide is selected from the following aluminum halide, bismuth, stone, perovskite and Yttrium oxide. ,, anorthite, aluminum-rich red column 9 as at least one of the two organic binders of the scope of the patent application, at least one of the first organic binder and the first agent and the dispersing agent Polymer resin and plasticizing 10. If you apply for a patent scope! Among the following materials, the humectant of the first glass of the preparation, f, /, and the medium includes lithium niobate. Article f, wherein the wetting of the glass is 12. If the patent scope is #, the shrinkage rate in the item is not more than 0.2%. /, A 垸 π 私 私 私 y y 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. 13. ", at least one self-constrained layer 14. The same material is included in the first paragraph of the patent application. ", /, the first ceramic and refractory ceramics μ. As claimed in the scope of the patent article, i also includes a nucleating agent., medium to > a low temperature ceramic layer 16 · as claimed in the scope of the 15th Among the materials selected: titanium oxide, oxidation plant, which makes the nucleating agent from the following group and magnesium diamond spinel. Wrong, dancing feldspar, oxidation pin, tungsten oxide Π. - a dense monolithic low temperature co-fired society The structure of the self-constrained multi-element of several, and the port, the package 1294412 = the stack of two multi-layered ceramic substrates; at least one circuit component is installed in the middle; each substrate is packaged::: base: = layer The low temperature ceramic layer comprises a first ceramic and a second glass: , = recorded, and at least one from the (four) layer contains a type of difficult particle = 'particles' wherein the refractory and the agent At least the knives are melted together with the Leyi glass. The 丨 丨 丨 18 structures, such as the material range, each of which includes a self-constrained layer sandwiched between two low temperature ceramic layers. Apply for the structure of the 17th item; the laminate also includes the additional substrate including - including the second ceramic Wen 2: a layer of particles, the additional 20 of which is the structure of the 19th item, wherein the laminate further comprises at least two Γ η - one substrate is positioned on top of the laminate, and the other The sheet is positioned at the bottom of the stack. 21 The structure of item 19, wherein at least one additional base phase = between the two layers of the ceramic substrate and the two multilayer ceramic substrates, such as the structure of the patent application 帛17, at least one of which There are two types of low temperature ceramics J, which are sufficient to reduce the porosity between at least one lower layer and at least one self-constraining layer. 23 Structure of 22, in which _ is taken from the following group: titanium, oxygen storage, feldspar, oxy-oil and magnesium-cobalt spinel. 1294412 24· Porcelain as claimed in Clause 17 includes the same material. . - Zhongdi - Tao Wan and difficult to marry 25 = Please request the structure of the 17th patent range, +, from the following: group of devices: resistors, capacitors, varistor induction structures and metal conductive patterns. σ电; Mussel, I-m ^ Yi Chengdi a mud, continued 筮 ^ ^ A ^ ^, water 4 brother a mud contains the first Tao luxury, Chu Yishi / Γ, the first - organic dry mixture and the first The particles of the solvent; the particles of the _== agent described in the item; the mouth y and the young one dissolve the first layer of the mouth onto the carrier through a slot die; the slurry of the water is used as a groove The mold mold sprays the first and second muds as a second layer onto a kind of mud water carrier and is still in a wet mouth; so that it remains unread; the k-like makes the brothers one and the second layer still (Ο will spray After the mud is removed, the solvent is removed substantially, instead of bonding, as in the method of claim 26, and the wetness of the first glass. 〃-mud also includes - 28· The method of the item, which is selected from the following group of materials: · 2 gas * $ away from the wet _ 29 · as bitten by, &gt; eve, metal oxides and bismuth ruthenate. Fang Bu Xia owes - a wet ab with a broken glass c (d) 1294412 The agent is Shixi acid Wei. The method pots of the 26th item of the scope of the patent application are basically carried out simultaneously. 'Method wherein the steps (C) and (4) 31. The method of claim 26, wherein the slurry is the first slurry, the polymerization in step (d) (c) and further comprises the following steps: - the slurry is a third mud (f) made of a third mud, the third mud comprising a spot, a 辕-'di 陶陶, a second glass 〃 有机 organic binder and a third solvent particle; U) In the second mud is still wet, the third mud is applied as the third layer to the first = a slot mold and the third mud is substantially discontinuous to the younger one, so that the second 32 · as claimed The party of the scope of item 31 and (g) are carried out substantially simultaneously. "中^(7), (4) 33. The method of the 31st item of the patent application, in which the first mud and the first mud have substantially the same composition. Μ弟一龙34. As for the application of the patent # The glazed pottery is selected from the following: inorganic oxides, metal (tetra) salts, metal carbides, genus bromide, metal nitrides and minerals. 35. The method of claim 34: inorganic oxidation The material is selected from the following = and materials: oxidation 33, oxidation, titanium oxide, #5 feldspar, rich, ',,, colloidal stone, perovskite and cerium oxide. 36. Please refer to the method of claim 26 Wherein at least one of the first organic drying agent and the ten organic drying agent comprises at least one of a polymeric resin and a plasticizer and a releasing agent. 1294412 The method of claim 26 of the patent scope is 攸 攸~π Also included is a method of selecting at least one of the at least one outer planar surface of at least one of the ribbons, wherein at least one of the circuit elements is: a resistor, a capacitor, a varistor, and a sensing Structure and metal conduction Wherein the thickness of the second mud layer is further included in the second slurry, wherein the first slurry further comprises a nucleating agent from the group of 39. The method of claim 26 is greater than 20 microns. For example, the method of claim 26 includes at least one type of glass. 41. A method of nucleating agent according to the method of claim 26 of the patent scope. 42. The method material of claim 41 is selected from the group consisting of titanium oxide and cerium oxide. , Jieshi Bu Xi 1" and magnesium drill spinel. Stone, indium oxide, oxidized crane 43. For the method of claim 26, Actually included the same material. - Zhongdi Tao Jing and difficult to dissolve pottery 44. The method of making a monolithic structure 'where the monolithic structure is used on a multi-layer electric package' The method comprises the following steps: providing a plurality of descriptions of the ceramic π, the parent strip The strips all have an x_y plane; the circuit = the filaments: the strips are stacked in the 2 direction; the stacked strips are heated to remove the organic strips from the strips a mixture; the binder-free layered structure is co-sintered to form a monolithic structure that is only shrunk in the z-direction and substantially free of wrinkles along the x-y plane, and the first is 1294412 in that: a blank ceramic strip is provided The step includes providing at least one blank strip, the blank strip comprising: (a) a first low temperature ceramic layer, the first low temperature ceramic layer i layer comprising: first ceramic, first glass and first Organic dry binder particles; (b) a self-constraining layer comprising: a refractory ceramic, a first glass wetting agent and a second organic binder particle; and the first glass is wetted The agent is selected from the group consisting of cerium oxide, metal oxides and cerium salts; The sintering step is carried out under the premise of without the external application constraints. 45. The method of claim 44, wherein the refractory ceramic is selected from the group consisting of inorganic oxides, metal silicates, metal carbides, metal bromides, metal nitrides, and minerals. 46. The method of claim 45, wherein the inorganic oxide is selected from the group consisting of oxidized, oxidized, titanium oxide, smectite, mullite, perovskite, and cerium oxide. 47. The method of claim 44, wherein the humectant comprises lithium niobate. 48. The method of claim 44, wherein the self-constraining layer further comprises at least one type of glass. 49. The method of claim 44, wherein the first low temperature ceramic layer further comprises a nucleating agent. 50. The method of claim 49, wherein the nucleating agent is selected from the group consisting of titanium oxide, cerium oxide, anorthite, molybdenum oxide, tungsten oxide, and magnesia. 51. The method of claim 44, wherein the first ceramic and the refractory ceramic comprise the same material. 1294412 52. The method of claim 44, wherein the shrinkage rate in the x-y plane is less than 1%. 53. The method of claim 52, wherein the shrinkage rate in the x-y plane is not more than 0.2%. 1294412 IV. Summary of Chinese invention (invention name: self-constrained low-temperature glass ceramic non-sintered strip for microelectronics and its manufacturing method and application) Tuwu, (1), representative figure of this case is · (2) In this case, the representative symbol of the representative figure is a simple description. 20 Low-temperature ceramic top layer 22 Self-constrained layer 24 Low-temperature ceramic bottom layer I» Lu, English abstract (Invention name: Sel f Cbnst rai ned Low Tenperat ure G ass- &amp;raniic Lhf i red Tape For Mcroel ectroni cs and Nfethods for l\Aki ng and Lfei ng the Sane) Page 3