TW202035146A - Laminate method for checking conduction and method for manufacturing electronic device - Google Patents

Abstract

Provided is a laminate which comprises: a glass material-based supporting base; and a polyimide resin substrate disposed on the supporting base. The polyimide resin substrate has a first main surface at a side of a supporting base, a second main surface at the opposite side of the first main surface, and a cross section in connection with the first main surface and the second main surface. At least a part of the cross section is an inclined surface protruding from the second main surface toward the first main surface. By the laminate of the present invention, conduction checking of a member for an electronic device formed on the polyimide resin substrate can be performed with excellent precision.

Description

Laminated body, conduction inspection method, and manufacturing method of electronic device

The present invention relates to a laminated body, a conduction inspection method, and a manufacturing method of an electronic device.

Thinning of an electronic device as follows, the weight being: a solar cell (the PV); a liquid crystal panel (the LCD); the organic EL panel (OLED, Organic Light-Emitting Diode ( Organic Light Emitting Diode material)); sensing electromagnetic waves, X-rays , Ultraviolet, visible light, infrared and other receiving sensor panels. Along with this, the thinning of substrates such as polyimide resin substrates used in electronic devices is also progressing. If the strength of the substrate is insufficient due to the thinning of the board, the substrate will be degraded locally, which may cause problems in the step of forming electronic device components on the substrate (component formation step).

Therefore, recently, in order to improve the rationality of the substrate, a technique for using a laminate in which a polyimide resin substrate is arranged on a supporting base material has been proposed (Patent Document 1). In this technique, a member for an electronic device is formed on a polyimide resin substrate of a laminate, and then the polyimide resin substrate on which the member for an electronic device is formed (ie, an electronic device) is separated. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-104843

[The problem to be solved by the invention]

In the process of manufacturing an electronic device using a laminate in which a polyimide resin substrate is arranged on a supporting base material, the inventors conducted a continuity inspection in order to confirm whether the electronic device components are operating normally. More specifically, the wiring extending from the electronic device component on the polyimide resin substrate to the outside was formed by sputtering, and the continuity inspection was performed using a tester. As a result, the present inventors discovered that the wiring formed by sputtering on the end surface of the polyimide resin substrate tends to become thinner or disconnected, and therefore, the continuity inspection cannot be performed correctly, and the accuracy may be insufficient.

Therefore, an object of the present invention is to provide a laminated body that can accurately perform conduction inspection of the electronic device member formed on the polyimide resin substrate. Furthermore, another object of the present invention is to provide a continuity inspection method using the above-mentioned laminated body and a manufacturing method of an electronic device. [Technical means to solve the problem]

After intensive research by the inventors, it was found that the above object can be achieved by the following configuration.

[1] A laminate comprising a glass supporting substrate and a polyimide resin substrate arranged on the supporting substrate, the polyimide resin substrate having a first main surface on the supporting substrate side, A second main surface opposite to the first main surface, and an end surface connected to the first main surface and the second main surface, and at least a part of the end surface goes from the second main surface to the first An inclined surface that protrudes from the main surface. [2] The layered product according to the above [1], wherein the angle formed by the inclined surface and the first main surface is 10° or more. [3] The laminate according to the above [1] or [2], wherein the thickness of the supporting substrate is 0.3 mm or more. [4] The layered product according to any one of [1] to [3] above, wherein a silicone resin layer is further provided between the support base material and the polyimide resin substrate. [5] A continuity inspection method comprising the step of forming an electronic device on the second principal surface of the polyimide resin substrate of the laminate as described in any one of [1] to [4] Forming a wiring extending from the above-mentioned electronic device component to the outside by sputtering or vapor deposition; and connecting the above-mentioned wiring to a tester to conduct a conduction inspection of the above-mentioned electronic device component; the above-mentioned wiring is from the above electronic device component It extends and is formed along the second main surface of the polyimide resin substrate, the inclined surface of the polyimide resin substrate, and the surface of the support base. [6] A method of manufacturing an electronic device, comprising: a step of forming a member on the second principal surface of the polyimide resin substrate of the laminate according to any one of [1] to [4] Forming a member for an electronic device to obtain a laminated body with a member for an electronic device; and a separating step of obtaining an electronic device having the polyimide resin substrate and the member for an electronic device from the laminated body with the member for electronic device . [Effects of Invention]

According to the present invention, it is possible to provide a laminated body capable of accurately performing conduction inspection of the electronic device member formed on the polyimide resin substrate. Furthermore, according to the present invention, it is also possible to provide a continuity inspection method using the above-mentioned laminate and a method of manufacturing an electronic device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various changes and substitutions can be added to the following embodiments without departing from the scope of the present invention.

＜Laminated body＞ (First Embodiment) Fig. 1 is a cross-sectional view schematically showing a laminate 10 of the first embodiment. The laminated body 10 of the first embodiment includes a glass supporting base 12 and a polyimide resin substrate 16 (hereinafter, simply referred to as "substrate 16") arranged on the supporting base 12. The substrate 16 has a first main surface 16a on the side of the support base 12, a second main surface 16b on the opposite side of the first main surface 16a, and an end surface 16c connected to the first main surface 16a and the second main surface 16b. At least a part of the end surface 16c of the substrate 16 is an inclined surface 16d that protrudes toward the first main surface 16a from the second main surface 16b. In the laminate 10 of the first embodiment, the first main surface 16a of the substrate 16 is in contact with the support base 12. The supporting base 12 functions as a reinforcing plate of the reinforcing substrate 16. When the layered body 10 of the first embodiment is subjected to stress in the direction in which the support base 12 and the substrate 16 are peeled off, the support base 12 and the substrate 16 are separated.

The details will be described later. The electronic device member is formed on the second main surface 16b of the substrate 16 of the laminate 10, and then the substrate 16 on which the electronic device member is formed (ie, the electronic device) is separated. In this way, an electronic device is manufactured. In the process of manufacturing the electronic device, a continuity check is performed to confirm whether the components for the electronic device are operating normally.

Fig. 2 is a cross-sectional view showing an example of conduction inspection. First, the electronic device member 20 is formed on the second main surface 16b of the substrate 16. Then, the wiring 40 extending from the electronic device member 20 to the outside is formed by vapor deposition such as sputtering, CVD (chemical vapor deposition, chemical vapor deposition), etc. (hereinafter, these are also collectively referred to as "sputtering, etc."). Sputtering or the like is preferably sputtering or vapor deposition. The wiring 40 includes, for example, a metal having conductivity. In more detail, as shown in FIG. 2, the wiring 40 extends from the electronic device member 20 and is formed along the second main surface 16 b of the substrate 16, the inclined surface 16 d, and the surface of the support base 12. The wiring 40 is connected to a test machine not shown, and the conduction inspection of the electronic device member 20 is performed.

However, there are cases where the end surface 16c of the substrate 16 is a vertical surface that is not inclined, and the wiring 40 is formed along the vertical surface by sputtering or the like. Fig. 3 is a cross-sectional view showing another example of continuity inspection. As shown in FIG. 3, there is a case where the wiring 40 is formed by sputtering or the like along the end surface 16c, which is a vertical surface. In this case, as shown in FIG. 3, it is difficult for the wiring 40 to adhere to the end surface 16c as a vertical surface, and the wiring 40 is likely to be partially thinned or disconnected. In the state where the wiring 40 is partially thinned or disconnected, the continuity inspection of the electronic device member 20 cannot be performed correctly, and the accuracy may be insufficient.

However, as explained on the basis of FIG. 2, in the first embodiment, the wiring 40 is formed along the inclined surface 16 d which is not a vertical surface, and therefore it is not easy to be partially thinned or disconnected. Therefore, the conduction inspection of the electronic device member 20 can be accurately performed, and the accuracy is good.

When the shape of the substrate 16 (the shape of the main surface) is rectangular, it is preferable that all the four end surfaces 16c are inclined surfaces 16d. Thereby, regardless of which inclined surface 16d is formed with the wiring 40, the accuracy of the continuity inspection is good.

(Second Embodiment) FIG. 4 is a cross-sectional view schematically showing the laminate 10 of the second embodiment. The same parts as in the first embodiment are indicated by the same symbols, and the description is also omitted (the same shall apply hereinafter). The laminate 10 of the second embodiment includes a supporting base 12, a silicone resin layer 14, and a substrate 16 in this order. In other words, the laminate 10 of the second embodiment further includes the silicone resin layer 14 between the support base 12 and the substrate 16. One surface (first main surface 14a) of the silicone resin layer 14 is in contact with the support base 12, and the other surface (second main surface 14b) is in contact with the first main surface 16a of the substrate 16.

Hereinafter, when referring to the laminated body 10 having the silicone resin layer 14, unless otherwise specified, it refers to the laminated body 10 of the second embodiment.

In the laminate 10 of the second embodiment, at least a part of the end surface 16c of the substrate 16 is also an inclined surface 16d that protrudes toward the first main surface 16a from the second main surface 16b. As shown in FIG. 4, when the end surface of the silicone resin layer 14 is an end surface continuous with the inclined surface 16d of the substrate 16, it is also preferably an inclined surface 14d inclined in the same manner as the inclined surface 16d. In the second embodiment, the wiring 40 is also formed along the inclined surface 16d which is not a vertical surface, so it is not easy to be partially thinned or disconnected. Therefore, the continuity inspection of the electronic device member 20 can be accurately performed, and the accuracy is good.

In the laminate 10 of the second embodiment, a two-layer portion (hereinafter, also referred to as "supporting substrate with silicone resin layer 18") including a supporting base 12 and a silicone resin layer 14 is used as the reinforcing substrate 16 The reinforcing plate functions.

Preferably, by applying heat treatment to the laminated body 10, the peeling strength between the support base 12 and the silicone resin layer 14 is greater than the peeling strength between the silicone resin layer 14 and the substrate 16. This is caused by the bonding of the hydroxyl groups of the supporting substrate 12 and the silicone resin layer 14 by heat treatment. As a result, if a stress in the direction in which the support base 12 and the substrate 16 are peeled is applied, peeling occurs between the silicone resin layer 14 and the substrate 16.

(Angle of inclined surface) FIG. 5 is an enlarged cross-sectional view showing the end of the polyimide resin substrate 16. In the substrate 16, since the inclined surface 16d is not a vertical surface, the angle θ1 formed by the inclined surface 16d and the first main surface 16a is of course less than 90°.

On the other hand, if the angle θ1 of the inclined surface 16d is too sharp, when the substrate 16 is separated from the supporting base 12 (when the silicone resin layer 14 is provided, the substrate 16 is separated from the silicone resin layer 14). It is difficult to insert a sharp knife-shaped object between the support base 12 and the substrate 16 (when the silicone resin layer 14 is provided, between the silicone resin layer 14 and the substrate 16). Therefore, it is easy to insert a sharp knife-shaped object between the support base 12 and the substrate 16 (in the case of the silicone resin layer 14 between the silicone resin layer 14 and the substrate 16), and the peelability is excellent For the reason, the angle θ1 formed by the inclined surface 16d and the first main surface 16a is preferably 10° or more, more preferably 30° or more, and still more preferably 50° or more. Furthermore, it is preferable that the inclined surface 16d of the substrate 16 is a cut surface formed by cutting the substrate 16 with a cutter. In this case, for example, the above-mentioned angle can be easily obtained compared to a surface formed by spreading the coating liquid on a flat surface.

The angle θ1 formed by the inclined surface 16d of the substrate 16 and the first main surface 16a is obtained from the cross-sectional shape of the substrate 16 using the non-contact surface property measuring device "PF-60" manufactured by Mitaka Lighting Co., Ltd. . In more detail, as shown in FIG. 5, based on the cross-sectional view of the substrate 16, the length of the line segment AB and the length of the line segment AC are measured, and the angle θ1 is calculated according to the following formula. θ1=arctan(AC/AB)

Furthermore, as shown in FIG. 5, it is preferable that the inclined surface 14d of the silicone resin layer 14 is a continuous surface with the inclined surface 16d of the substrate 16. At this time, it is preferable that in the silicone resin layer 14, the angle θ2 formed by the inclined surface 14d and the first main surface 14a is the same as the angle θ1 formed by the inclined surface 16d and the first main surface 16a. The measuring method of angle θ2 is the same as that of angle θ1.

Hereinafter, the respective layers (support base 12, substrate 16, and silicone resin layer 14) constituting the laminate 10 are first described in detail, and then the manufacturing method of the laminate 10 is described in detail.

＜Support base material＞ The supporting substrate 12 is a member that supports the reinforcing substrate 16, such as a glass plate. Since the supporting substrate 12 is made of glass, it has a hydroxyl group on the surface. The type of glass is not particularly limited, and alkali-free borosilicate glass, borosilicate glass, soda-lime glass, high silica glass, and other oxide-based glasses mainly composed of silica are preferred. As the oxide-based glass, a glass in which the content of silicon oxide in terms of oxide is 40 to 90% by mass is preferred. As the glass plate, more specifically, a glass plate containing alkali-free borosilicate glass (manufactured by AGC Co., Ltd., trade name "AN100"). The manufacturing method of a glass plate is not specifically limited, Usually, it can obtain by melting a glass raw material, and shaping|molding the molten glass into a plate shape. Such a forming method may be a usual method, and examples thereof include a float method, a melting method, and a flow hole down-drawing method.

The thickness of the supporting substrate 12 may be thicker than the substrate 16 or thinner. In terms of the operability of the laminate 10, it is preferable that the thickness of the support base 12 is thicker than the substrate 16. It is preferable that the supporting substrate 12 has no flexibility. Therefore, the thickness of the supporting substrate 12 is preferably 0.3 mm or more, more preferably 0.5 mm or more. On the other hand, the thickness of the support base 12 is preferably 1.0 mm or less.

<Substrate (Polyimide resin substrate)> The substrate 16 is a polyimide resin substrate. The polyimide resin substrate is a substrate containing polyimide resin. For example, a polyimide film is used. Commercially available products include "XENOMAX" manufactured by Toyobo Co., Ltd., and manufactured by Ube Kosan Co., Ltd. "UPILEX 25S" and so on. In order to form high-definition wiring of electronic devices on the polyimide resin substrate, it is preferable that the surface of the polyimide resin substrate be smooth. More specifically, the surface roughness Ra of the polyimide resin substrate is preferably 50 nm or less, more preferably 30 nm or less, and still more preferably 10 nm or less. The thickness of the polyimide resin substrate is preferably 1 μm or more, more preferably 5 μm or more, and still more preferably 10 μm or more from the viewpoint of rationality in the manufacturing steps. From the viewpoint of flexibility, it is preferably 1 mm or less, and more preferably 0.2 mm or less. The smaller the difference between the thermal expansion coefficient of the polyimide resin substrate and the thermal expansion coefficient of the electronic device or the supporting substrate can suppress the warpage of the laminated body after heating or cooling, which is preferable. More specifically, the difference in the thermal expansion coefficient between the polyimide resin substrate and the supporting base material is preferably 0 to 90×10 ^-6 /°C, more preferably 0 to 30×10 ^-6 /°C.

The area of the substrate 16 (the area of the first main surface 16a and the second main surface 16b) is not particularly limited, but in terms of the productivity of the electronic device, it is preferably 300 cm ² or more. The shape of the substrate 16 is also not particularly limited, and may be rectangular or circular. Orientation planes (so-called ORIENTATION FLAT. A flat portion formed on the outer periphery of the substrate) or notches (one or more V-shaped notches formed on the outer periphery of the substrate) may also be formed on the substrate 16.

However, as described above, at least a part of the end surface 16c of the substrate 16 is the inclined surface 16d that protrudes toward the first main surface 16a from the second main surface 16b. It is preferable that all the end surfaces 16c are inclined surfaces 16d. In the substrate 16, the angle formed by the inclined surface 16d and the first main surface 16a is also as described above.

＜Silicone resin layer＞ The silicone resin layer 14 mainly contains silicone resin. The structure of the silicone resin is not particularly limited. Generally, a curable silicone resin that can be cured into a silicone resin by curing treatment (cross-linked curing) can obtain a silicone resin. Curable silicones are classified into condensation reaction type silicones, addition reaction type silicones, ultraviolet curable silicones, and electron beam curable silicones according to their curing mechanism, and they can all be used. The weight average molecular weight (Mw) of the curable silicone is preferably 5,000 to 60,000, more preferably 5,000 to 30,000.

As a method of manufacturing the silicone resin layer 14, it is preferable to apply a curable composition containing curable silicone as the aforementioned silicone resin to the first main surface 16a of the substrate 16, and remove the solvent as necessary to form a coating film , Harden the curable silicone in the coating film to form the silicone resin layer 14. The curable composition may contain, in addition to the curable silicone, a solvent, a platinum catalyst (in the case of using an addition reaction type silicone as the curable silicone), a leveling agent, a metal compound, and the like. Examples of the metal element containing the metal compound include 3d transition metals, 4d transition metals, lanthanide series metals, bismuth (Bi), aluminum (Al), tin (Sn), and the like. The content of the metal compound is not particularly limited and should be adjusted appropriately.

The silicone resin layer 14 preferably has a hydroxyl group. A part of the Si-O-Si bond of the silicone resin constituting the silicone resin layer 14 is cut, and hydroxyl groups may appear. In addition, when a condensation reaction type silicone is used, its hydroxyl group can become the hydroxyl group of the silicone resin layer 14.

The thickness of the silicone resin layer 14 is preferably 100 μm or less, more preferably 50 μm or less, and still more preferably 30 μm or less. On the other hand, the thickness of the silicone resin layer 14 is preferably more than 1 μm, more preferably 4 μm or more. The above-mentioned thickness is obtained by measuring the thickness of the silicone resin layer 14 at any position above 5 points using a contact-type film thickness measuring device, and averaging the arithmetic averages.

In addition, as described above, when the end surface of the silicone resin layer 14 is an end surface continuous with the inclined surface 16d of the substrate 16, it is also preferably an inclined surface inclined in the same manner as the inclined surface 16d.

<The manufacturing method of the laminated body of the first embodiment> The method of manufacturing the laminate 10 of the first embodiment is preferably a method of laminating the substrate 16 on the surface of the support base 12. At this time, for example, after the substrate 16 is layered on the support base 12, the end of the substrate 16 on the support base 12 is cut obliquely (cut by an inclined knife) to form the inclined surface 16d of the substrate 16 (pattern A). In the case of aspect A, since the substrate 16 is cut while being fixed to the support base 12, it is easy to obtain good dimensional accuracy. In addition, the inclined surface 16d may be formed on the substrate 16 in advance, and the substrate 16 formed with the inclined surface 16d may be laminated on the surface of the support base 12 (pattern B). In the case of aspect B, since there is no need to provide a step for processing the corner material (waste material) of the cut substrate 16 in the middle, it is not susceptible to time constraints. Furthermore, whether it is aspect A or aspect B, before laminating the substrate 16 on the support substrate 12, a known silane coupling agent can be applied to the surface of the support substrate 12, and thereafter, The substrate 16 is laminated on the surface of the supporting substrate 12 coated with the silane coupling agent.

<The manufacturing method of the laminate of the second embodiment> The method of manufacturing the laminate 10 of the second embodiment is preferably a method of forming the silicone resin layer 14 on the first main surface 16 a of the substrate 16. Specifically, it is preferable to apply a curable composition containing curable silicone on the first main surface 16a of the substrate 16, and to perform curing treatment on the obtained coating film to obtain the silicone resin layer 14. The material 12 is laminated on the surface of the silicone resin layer 14 to manufacture the laminated body 10.

In more detail, the method of manufacturing the laminate 10 of the second embodiment includes at least forming a layer of curable silicone on the first principal surface 16a of the substrate 16, and forming a silicone resin on the first principal surface 16a of the substrate 16. The step of layer 14 (resin layer forming step); and the step of laminating the supporting substrate 12 on the surface of the silicone resin layer 14 to obtain the laminate 10 (layering step). Hereinafter, the order of the above steps will be described in detail.

(Resin layer formation step) The resin layer forming step is a step of forming a curable silicone layer on the first main surface 16a of the substrate 16 and forming the silicone resin layer 14 on the first main surface 16a of the substrate 16. According to this step, a substrate with a silicone resin layer including a substrate 16 and a silicone resin layer 14 in this order can be obtained. The substrate with a silicone resin layer can be manufactured by the so-called roll to roll method in which the silicone resin layer 14 is formed on the first main surface 16a of the substrate 16 rolled into a roll shape and then wound into a roll shape again. , Excellent production efficiency. In this step, in order to form a curable silicone layer on the first main surface 16a of the substrate 16, the curable composition is applied to the first main surface 16a of the substrate 16. Then, it is preferable to form a hardened layer by hardening the layer of hardenable silicone. The method of applying the curable composition to the first main surface 16a of the substrate 16 is not particularly limited, and known methods can be cited. For example, spray coating method, die nozzle coating method, spin coating method, dip coating method, roll coating method, bar coating method, screen printing method, and gravure coating method are mentioned. Then, the curable silicone in the first main surface 16a of the substrate 16 is cured to form a cured layer (silicone resin layer 14). The curing method is not particularly limited, and the most appropriate treatment is carried out according to the type of curing silicone used. For example, when a condensation reaction type silicone and an addition reaction type silicone are used, the curing treatment is preferably a thermal curing treatment. The conditions of the thermal curing treatment are implemented within the range of the heat resistance of the substrate 16, for example, the temperature conditions of the thermal curing are preferably 50-400°C, more preferably 100-300°C. The heating time is generally preferably 10 to 300 minutes, more preferably 20 to 120 minutes. The aspect of the formed silicone resin layer 14 is as described above.

(Layering step) The layering step is a step of obtaining the layered body 10 by supporting the base material 12 due to the surface area of the silicone resin layer 14. The layering step is a step of forming a layered body 10 using a substrate with a silicone resin layer and a supporting base material 12. The method of laminating the support base 12 on the surface of the silicone resin layer 14 is not particularly limited, and known methods can be cited. For example, a method of overlaying the supporting substrate 12 on the surface of the silicone resin layer 14 under a normal pressure environment can be cited. If necessary, after the supporting substrate 12 is overlapped on the surface of the silicone resin layer 14, a roller or a pressing machine may be used to press the supporting substrate 12 to the silicone resin layer 14. By crimping by a roller or a press, it is relatively easy to remove air bubbles mixed between the silicone resin layer 14 and the supporting substrate 12, which is preferable. If pressure bonding is performed by a vacuum lamination method or a vacuum pressure method, mixing of bubbles can be suppressed, and good adhesion can be achieved, which is preferable. By crimping under vacuum, there is an advantage that the bubbles are not easy to grow due to heat treatment even if there are minute bubbles remaining. When laminating the support base material 12, it is preferable to fully clean the surface of the support base material 12 in contact with the silicone resin layer 14 and laminate in a clean environment.

(Cut off) When manufacturing the laminate 10 of the second embodiment, for example, the substrate 16 on which the silicone resin layer 14 is formed and the supporting base 12 are laminated, and then the supporting base 12 is cut obliquely (cutting with an inclined knife). The end portions of the substrate 16 and the silicone resin layer 14 form the inclined surface 16d of the substrate 16 and the inclined surface 14d of the silicone resin layer 14. In this case, since the substrate 16 and the silicone resin layer 14 are cut while being fixed to the supporting base 12, it is easy to obtain good dimensional accuracy. In addition, for the substrate 16 on which the silicone resin layer 14 is formed, the inclined surface 16 d of the substrate 16 and the inclined surface 14 d of the silicone resin layer 14 may be formed in advance and laminated on the support base 12. In this case, since there is no need to process the cut-off substrate 16 and the corner material (waste material) of the silicone resin layer 14 in the middle, it is not susceptible to time constraints.

＜Use of laminated body＞ The laminated body 10 can be used for various applications, for example, applications for manufacturing electronic components such as display device panels, PV, thin film secondary batteries, semiconductor wafers with circuits formed on the surface, and receiving sensor panels described later. In these applications, there are also cases where the layered body is exposed to high temperature conditions (for example, 450° C. or higher) under the atmosphere (for example, 20 minutes or more). Panels for display devices include LCD, OLED, electronic paper, plasma display panels, field emission panels, quantum dot LED (Light Emitting Diode) panels, micro LED display panels, and MEMS (Micro Electro Mechanical Systems) System) Shutter panel, etc. The receiving sensor panel includes an electromagnetic wave receiving sensor panel, an X-ray receiving sensor panel, an ultraviolet receiving sensor panel, a visible light receiving sensor panel, an infrared receiving sensor panel, etc. The substrate for receiving the sensor panel can also be reinforced with a reinforcing sheet such as resin.

＜Method of manufacturing electronic device＞ Using the laminate 10, an electronic device including the substrate 16 and the electronic device member 20 is manufactured. The manufacturing method of the electronic device is, for example, a method including the following steps: a component forming step in which the electronic device member 20 is formed on the second main surface 16b of the substrate 16 of the laminated body 10 to obtain a laminated body with the electronic device member; and In the separation step, the electronic device having the substrate 16 and the electronic device member 20 is obtained from the laminated body with the electronic device member attached.

Hereinafter, a case where the layered body 10 of the second embodiment is used as an example will be described in more detail, and the same applies when the layered body 10 of the first embodiment is used.

The method of manufacturing the electronic device is preferably to form the electronic device member 20 on the substrate 16 of the laminated body 10 to obtain the electronic device member-attached laminated body 22, and then from the obtained electronic device member-attached laminated body 22 to The interface between the silicone resin layer 14 and the substrate 16 is used as a peeling surface to separate the electronic device (the substrate 24 with components) and the support base 18 with the silicone resin layer. Hereinafter, the step of forming the member 20 for an electronic device is referred to as the "member forming step", and the step of separating the substrate 24 with the member and the support base 18 with the silicone resin layer is referred to as the "separation step".

The continuity inspection of the electronic device member 20 on the substrate 16 may be performed in the middle of the member forming step or after the member forming step. Since the wiring 40 for the continuity inspection is formed along the inclined surface 16d (refer to FIG. 2), the accuracy of the continuity inspection is good.

The materials and sequence used in each step are described in detail below.

(Component formation step) The component forming step is a step of forming components for electronic devices on the substrate 16 of the laminate 10. More specifically, as shown in FIG. 6, the electronic device member 20 is formed on the second main surface 16 b (exposed surface) of the substrate 16 to obtain a laminate 22 with the electronic device member. First, the electronic device component 20 used in this step will be described in detail, and then the sequence of the steps will be described in detail.

(Components for electronic devices) The electronic device member 20 is a member that is formed on the substrate 16 in the laminate 10 and constitutes at least a part of the electronic device. More specifically, as the electronic device member 20, it can be used for display device panels, solar cells, thin-film secondary batteries, or electronic parts such as semiconductor wafers with circuits formed on the surface, and receiving sensor panels. Components (for example, LTPS (Low Temperature Poly-Silicon, low temperature polysilicon) components for display devices, components for solar cells, components for thin-film secondary batteries, components for electronic parts, components for receiving sensors), for example, can be listed in the United States Patent Application Publication No. 2018/0178492 Specification Paragraph [0192] of the solar cell component, the thin film secondary battery described in the same paragraph [0193], the same paragraph [0194] described in the electronic parts Circuit.

(Sequence of steps) The manufacturing method of the above-mentioned laminated body 22 with components for electronic devices is not particularly limited. According to the type of the constituent members of the components for electronic devices, it is formed on the second principal surface 16b of the substrate 16 of the laminated body 10 by a previously known method. The member 20 for an electronic device. The electronic device member 20 is not all of the members finally formed on the second main surface 16b of the substrate 16 (hereinafter referred to as "all members"), and may be a part of all members (hereinafter referred to as "partial members"). The substrate with some members peeled from the silicone resin layer 14 can also be set as a substrate with all the members in the subsequent steps (equivalent to the electronic device described later). For the substrate with all the components peeled from the silicone resin layer 14, other electronic device components may be formed on the peeling surface (first main surface 16a). Furthermore, it is also possible to use and assemble two laminates with all the components, and then peel off the two support base materials 18 with silicone resin layers from the laminate with all the components to produce two substrates 24 with components.

For example, in the case of manufacturing OLED, in order to form an organic EL structure on the surface (the second main surface 16b) opposite to the silicone resin layer 14 side of the substrate 16 of the laminate 10, the following various layer formation or treatments are performed: A transparent electrode is formed, and a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, etc. are vapor-deposited on the surface where the transparent electrode is formed, a back electrode is formed, and a sealing plate is used for sealing. Specific examples of the layer formation or treatment include film formation treatment, vapor deposition treatment, and bonding treatment of a sealing plate.

(Separation step) As shown in FIG. 7, the separation step is from the laminated body 22 with the electronic device member obtained in the above-mentioned member forming step, and the interface between the silicone resin layer 14 and the substrate 16 is used as a peeling surface to separate into a laminated electronic device. The step of obtaining the substrate 16 of the component 20 (the substrate 24 with the component) and the supporting base material 18 with the silicone resin layer to obtain the substrate 24 (electronic device) including the component 20 for the electronic device and the substrate 16 with the component.

When the electronic device member 20 on the substrate 16 to be peeled off is a part of the formation of all necessary constituent members, the remaining constituent members may be formed on the substrate 16 after separation.

The method of peeling off the substrate 16 and the silicone resin layer 14 is not particularly limited. For example, a sharp knife-shaped object is inserted into the interface between the substrate 16 and the silicone resin layer 14 to give an opportunity for peeling. On this basis, a mixed fluid of water and compressed air can be blown off. Preferably, the laminated body 22 with the electronic device member is placed on the platen such that the supporting base 12 becomes the upper side and the electronic device member 20 side is the lower side, and the electronic device member 20 side is vacuum sucked on the platen In this state, the tool-shaped object is first allowed to enter the interface between the substrate 16 and the silicone resin layer 14. Thereafter, a plurality of vacuum suction pads are used to suck the support substrate 12 side, and the vacuum suction pads are sequentially raised from the vicinity of the position where the tool-shaped object is inserted. In this way, the support base 18 with the silicone resin layer can be easily peeled off.

When the substrate 24 with a component is separated from the laminated body 22 with a component for an electronic device, it is possible to further prevent the fragments of the silicone resin layer 14 from being electrostatically attracted to the substrate 24 with a component by controlling the blowing or humidity with an ionizer. The above-mentioned manufacturing method of the electronic device (substrate 24 with a component) is suitable for the manufacture of the display device described in paragraph [0210] of the specification of US Patent Application Publication No. 2018/0178492, for example, as the substrate 24 with a component, for example The substrate with components described in the same paragraph [0211]. [Example]

Hereinafter, the present invention will be described in detail with examples, but the present invention is not limited to these examples.

The following uses a glass plate containing alkali-free borosilicate glass (linear expansion coefficient 38×10 ^-7 /°C, manufactured by AGC Co., Ltd., trade name "AN100") as a supporting substrate. On the surface of the glass plate before lamination, the presence of hydroxyl groups (OH groups) was confirmed by micro-infrared spectroscopy analysis. In addition, a polyimide film (manufactured by Toyobo Co., Ltd., trade name "XENOMAX") is used as a substrate (polyimide resin substrate) below. Hereinafter, Examples 1 to 2 are examples, and Example 3 is a comparative example.

<Example 1> (Preparation of curable silicone 1) A curable silicone 1 was obtained by mixing organohydrogen silicone and alkenyl-containing silicone. The composition of the curable silicone 1 is: the molar ratio of the M unit, the D unit, and the T unit is 9:59:32, the molar ratio of the methyl group and the phenyl group of the organic group is 44:56, all alkenyl groups and bonds The molar ratio (hydrogen atom/alkenyl group) of hydrogen atoms bonded to all silicon atoms is 0.7, and the average number of OX groups is 0.1. The average number of OX groups indicates the number of OX groups (X is a hydrogen atom or a hydrocarbon group) that are on average bonded to one Si atom. Furthermore, the M unit refers to a monofunctional organosilicon alkoxy unit represented by (R) ₃ SiO _1/2 . The D unit refers to a bifunctional organosilicon alkoxy unit represented by (R) ₂ SiO _2/2 (R represents a hydrogen atom or an organic group). The T unit refers to a trifunctional organosilicon alkoxy unit represented by RSiO _3/2 (R represents a hydrogen atom or an organic group). The ratio of the number (molar amount) of M unit, D unit and T unit is calculated based on the value of the peak area ratio obtained by ²⁹ Si-NMR.

(Preparation of curable composition 1) Add platinum (0)-1,3-diethylene-1,1,3,3-tetramethyldisiloxane (CAS No. 68478-) to curable silicone 1 so that the content of platinum element becomes 60 ppm. 92-2), a mixture A is obtained. Mixture A (200 g), bismuth 2-ethylhexanoate ("PUCAT 25", manufactured by Nippon Chemical Industry Co., Ltd., with a metal content of 25%) (0.08 g), and diethylene glycol diethyl ether ( "Hisolve EDE" (manufactured by Toho Chemical Industry Co., Ltd.) (84.7 g) was mixed, and the obtained mixed solution was filtered using a filter with a pore size of 0.45 μm to obtain a curable composition 1.

(Production of multilayer body) The prepared curable composition 1 was applied to a polyimide film with a thickness of 0.038 mm (trade name "XENOMAX" manufactured by Toyobo Co., Ltd.) as a polyimide resin substrate, by using a hot plate at 140°C Heat for 10 minutes to form a silicone resin layer. The thickness of the silicone resin layer is 10 μm. Then, after washing with a water-based glass cleaner ("PK-LGC213" manufactured by Parker Corporation), the 200×200 mm glass plate "AN100" (supported by The base material) is placed on the silicone resin layer and bonded by a bonding device to produce a laminate. Furthermore, the presence of hydroxyl groups (OH groups) in the cured silicone resin layer was confirmed by micro-infrared spectroscopy analysis.

(Formation of inclined surface) In the laminated body produced, the end of the polyimide resin substrate and the silicone resin layer on the support base material (glass plate) is obliquely cut by an inclined cutter to form an inclined surface. The inclined surface of the polyimide resin substrate and the inclined surface of the silicone resin layer are mutually continuous continuous surfaces. The angle θ1 formed by the inclined surface in the polyimide resin substrate and the first main surface and the angle θ2 formed by the inclined surface in the silicone resin layer and the first main surface are both 10°.

<Example 2> The angle θ1 between the inclined surface in the polyimide resin substrate and the first main surface and the angle θ2 between the inclined surface in the silicone resin layer and the first main surface are both 60°. Except for this, a laminated body was produced in the same manner as in Example 1.

<Example 3> The angle θ1 formed by the inclined surface in the polyimide resin substrate and the first main surface and the angle θ2 formed by the inclined surface in the silicone resin layer and the first main surface are both 90°. Except for this, a laminated body was produced in the same manner as in Example 1.

＜Evaluation＞ The following evaluation was performed using the produced laminate. The evaluation results are shown in Table 1 below.

(Continuity check) In the produced laminate, a simulation test was performed on the conduction inspection of the electronic device component formed on the second main surface of the polyimide resin substrate. Specifically, in each layered body, 100 slanted surfaces of the polyimide resin substrate and the second main surface of the polyimide resin substrate were continuously formed one by one (in Example 3, it is not an inclined surface but an inclined surface). The end surface of the vertical surface), and the linear wiring (metal type: Al/Nd alloy, line width: 100 μm, thickness: 50 nm) on the surface of the support substrate (glass plate). For each wiring, a continuity check was performed using a commercially available tester. When all wirings are confirmed to be continuity, write "A" in Table 1 below, and even if one wiring is not conductive, write "B" in Table 1 below. If it is "A", it is actually a case where the electronic device member is formed on the second main surface of the polyimide resin substrate, and the wiring extending from the electronic device member is formed by sputtering or the like to conduct continuity inspection It can also be evaluated as a continuity inspection that can be performed with high accuracy.

(Peelability) In the laminated body produced, insert a stainless steel knife with a thickness of 0.1 mm between the polyimide resin substrate and the supporting substrate (glass plate) 10 times. Furthermore, the position where the tool is inserted is different in each time. When the tool enters between the polyimide resin substrate and the supporting substrate in all the operations, write "A" in the following table 1, even if the tool does not enter the polyimide resin substrate once In the case between the substrate and the supporting substrate, "B" is described in Table 1 below. If it is "A", when the polyimide resin substrate is separated (peeled) from the supporting base material, it is easy to insert a cutter between the supporting base material and the polyimide resin substrate, and it can be evaluated that the peelability is excellent.

[Table 1] Table 1 example 1 Example 2 Example 3 Angle θ1[°] 10 60 90 Angle θ2[°] 10 60 90 Continuity check A A B Peelability B A A

<Summary of evaluation results> As shown in Table 1 above, in Examples 1 to 2, the accuracy of the continuity inspection is good, but in Example 3, the accuracy of the continuity inspection is insufficient.

Comparing Examples 1 to 2, the angle θ1 between the inclined surface in the polyimide resin substrate and the first main surface, and the angle θ2 between the inclined surface in the silicone resin layer and the first main surface Example 2 where the angle is 60° is better than Example 1 where the same angle is 10°.

The present invention has been described in detail with reference to specific embodiments, but it is clear to the industry that various modifications or changes can be made without departing from the scope and spirit of the present invention. This application is based on the Japanese patent application 2018-204918 filed on October 31, 2018, the content of which is incorporated herein by reference.

10: Laminated body 12: Support substrate 14: Silicone resin layer 14a: The first main surface of the silicone resin layer 14b: The second main surface of the silicone resin layer 14d: Inclined surface of silicone resin layer 16: Substrate (Polyimide resin substrate) 16a: The first main surface of the substrate 16b: The second main surface of the substrate 16c: The end face of the substrate 16d: Inclined surface of substrate 18: Supporting substrate with silicone resin layer 20: Components for electronic devices 22: Laminated body with components for electronic devices 24: Substrate with components (electronic device) 40: Wiring AB: line segment AC: line segment θ1: Angle θ2: Angle

Fig. 1 is a cross-sectional view schematically showing the laminate of the first embodiment. Fig. 2 is a cross-sectional view showing an example of conduction inspection. Fig. 3 is a cross-sectional view showing another example of continuity inspection. Fig. 4 is a cross-sectional view schematically showing the laminate of the second embodiment. Fig. 5 is an enlarged cross-sectional view showing the end of the polyimide resin substrate. Fig. 6 is a cross-sectional view schematically showing a step of forming a member. Fig. 7 is a cross-sectional view schematically showing the separation step.

10: Laminated body

12: Support substrate

16: Substrate (Polyimide resin substrate)

16a: The first main surface of the substrate

16b: The second main surface of the substrate

16d: Inclined surface of substrate

20: Components for electronic devices

40: Wiring

Claims (10)

A laminated body comprising a supporting substrate made of glass and a polyimide resin substrate arranged on the supporting substrate, The polyimide resin substrate has a first main surface on the supporting substrate side, a second main surface opposite to the first main surface, and an end surface connected to the first main surface and the second main surface , At least a part of the end surface is an inclined surface that protrudes from the second main surface toward the first main surface. The laminated body of claim 1, wherein the angle formed by the inclined surface and the first main surface is 10° or more. The laminate of claim 1 or 2, wherein the thickness of the supporting substrate is 0.3 mm or more. The laminated body according to any one of claims 1 to 3, wherein the inclined surface of the substrate is a cut surface formed by cutting the substrate with a cutter. The laminate according to any one of claims 1 to 4, wherein a silicone resin layer is further provided between the support base material and the polyimide resin substrate. Such as the laminate of any one of claims 1 to 5, wherein when the shape of the substrate is rectangular, all four end surfaces are inclined surfaces. The laminated body of claim 5, wherein the inclined surface of the silicone resin layer is a continuous surface with the inclined surface of the substrate. The laminate of claim 7, wherein in the silicone resin layer, the angle formed by the inclined surface of the silicone resin layer and the first principal surface of the silicone resin layer is between the inclined surface of the substrate and the first principal surface of the substrate 1 The angle formed by the main surface is the same. A continuity inspection method, which has the following steps: Forming an electronic device member on the second main surface of the polyimide resin substrate of the laminate of any one of claims 1 to 8; Forming wiring extending from the above-mentioned electronic device component to the outside by sputtering or evaporation; and Connect the above-mentioned wiring to the testing machine, and conduct the conduction inspection of the above-mentioned electronic device components; The wiring extends from the electronic device member and is formed along the second main surface of the polyimide resin substrate, the inclined surface of the polyimide resin substrate, and the surface of the support base. A manufacturing method of an electronic device, which includes: A component forming step of forming a component for an electronic device on the second main surface of the polyimide resin substrate of the laminated body of any one of claims 1 to 8 to obtain a laminated body with a component for electronic devices; and In the separation step, an electronic device having the polyimide resin substrate and the electronic device member is obtained from the laminate with the electronic device member.

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