TW202033568A - Adhesive composition - Google Patents

Abstract

The invention relates to an adhesive composition comprising 100 parts by weight of epoxy modified polymer, 90 to 300 parts by weight of urethane acrylate oligomer, 100 to 300 parts by weight of acrylate monomer, 10 to 30 parts by weight of silane compound, and 300 to 800 parts by weight of the filler. The acrylate monomer comprises alicyclic acrylate monomer, mono- or bi-functional acrylate monomer, and multifunctional acrylate monomer.

Description

Adhesive composition

The invention relates to an adhesive composition.

With the development of semiconductor packages such as the miniaturization of semiconductor devices and the high integration of integrated circuits (IC: integrated circuits), the volume of packages has gradually become smaller and the number of pins has increased. In recent years, with the rapid development of microelectronics technology and the development of electronic components, new packages are being actively developed, and with the rapid increase in demand for various highly integrated and high-performance semiconductor packages, the development of new packages is also accelerating.

With the miniaturization, integration and miniaturization of such packages, the tolerances of semiconductor chips and substrates have gradually become smaller, and the importance of semiconductor adhesives has been emphasized. Use a variety of resins as a lead frame for semiconductor molds and various lead frames (bare copper plate, silver coated copper plate) or plastic ball grid arrays coated with solder resist paint/ink (solder resist paint/ink) , PBGA) is an adhesive that imparts adhesion, especially epoxy resin is mainly used in the semiconductor field.

In the case of using an epoxy solvent-based paste adhesive containing a solvent or a diluent of such an epoxy resin, the epoxy resin in a state of equilibrium with the surrounding environment absorbs moisture. The water absorbed in this way is converted into saturated steam during the reflow process of printed circuit board (PCB). As a result, there is excessive pressure generated by the steam and bending of the molded plastic and molded adhesive The weakening of the strength causes a fatal imbalance to the package. In addition, in the case of solvent-based paste adhesives, there is a problem that the coating method is limited to the screen printing method. In the case of solvent-based paste adhesives, there is a need to perform a separate drying process for volatilizing the solvent (step B) And, the working environment problems caused by the solvent volatilization process.

As another example of the adhesive for semiconductors, the film-type adhesive of Japanese Patent Publication No. 2017-122193 has a very uniform thickness of the adhesive layer that is easy to control in the process of laminating the film and the adhesive, and, The adhesive layer has the advantages of excellent roughness and high performance. However, the film-type adhesive has the disadvantages that the adhesive force is lower than that of the liquid-type paste adhesive, it is difficult to cope with changes over time, and it is expensive.

Therefore, it is necessary to develop an adhesive that does not contain volatile solvents, improves workability, has excellent adhesion to various adhesive materials, and has excellent storage stability and reliability.

[Prior Technical Literature]

[Patent Literature]

(Patent Document 1) Japanese Patent Publication No. 2017-122193

The present invention is proposed to solve the problems of semiconductor adhesives based on existing epoxy resins as described above, and its purpose is to provide an adhesive composition that does not contain volatile solvents. , It also ensures suitable viscosity and Thixotropic Index (TI) to improve workability, and provides excellent adhesion to various adhesive materials by increasing adhesion, and has excellent storage stability and reliability.

The present invention provides an adhesive composition, which comprises: 100 parts by weight of epoxy modified polymer; 90 to 300 parts by weight of urethane acrylate oligomer; 100 to 300 parts by weight of acrylic monomer, Acrylic monomers include cycloaliphatic acrylate monomers, monofunctional or bifunctional acrylate monomers, and multifunctional acrylate monomers; 10 to 30 parts by weight of silane compound; and 300 to 800 parts by weight of filler materials.

Invention effect

The adhesive composition of the present invention relates to a non-solvent type semiconductor adhesive composition (Die Attach Paste, DAP), and by including three different acrylics in epoxy-containing polybutadiene and urethane acrylate oligomer The ester monomer thus improves workability with a low modulus. In addition, it has an effect of excellent adhesion to various substrates, and the adhesive composition described above has an effect of improving storage stability and reliability.

Hereinafter, the present invention will be explained in detail.

The present invention provides an adhesive composition for solvent-free semiconductor bonding.

The adhesive composition of the present invention includes: 100 parts by weight of epoxy modified polymer; 90 to 300 parts by weight of urethane acrylate oligomer; 100 to 300 parts by weight of acrylic monomers, the acrylic The monomers include alicyclic acrylate monomers, monofunctional or bifunctional acrylate monomers, and multifunctional acrylate monomers; 10 to 30 parts by weight of silane compound; and 300 to 800 parts by weight of filler materials.

>Epoxy modified polymer>

The epoxy-modified polymer contained in the adhesive composition of the present invention includes an epoxy group at the end of the polymer or an epoxy group bonded to the main chain or side chain of the polymer. Specifically, it can be used for An epoxy group-containing polybutadiene containing an epoxy group in a polymer composed of an unsaturated hydrocarbon monomer having a double bond.

The epoxy-modified polymer imparts flexibility to the adhesive composition of the present invention, and has the effect of realizing a low modulus.

The epoxy-modified polymer may be an epoxy-modified polymer containing a hydroxyl group in at least one terminal. Specifically, the epoxy-modified polymer may contain hydroxyl groups at both ends.

[化學式2]

The epoxy-modified polymer may include an epoxy group or at least one kind selected from repeating units represented by the following chemical formulas 1 and 2 at the end of the polymer. [Chemical formula 1]

[Chemical formula 2]

In the chemical formulas 1 and 2,

a and b are the repeating numbers of the unit in parentheses, which are numbers from 1 to 10.

是結合於主鏈的部位。

It is bonded to the main chain.

[化學式4]

Moreover, the epoxy-modified polymer further includes at least one selected from repeating units represented by the following chemical formulas 3 and 4. [Chemical formula 3]

[Chemical formula 4]

In the chemical formulas 3 and 4,

c and d are the repeating numbers of the unit in parentheses, which are numbers from 1 to 10.

是結合於主鏈的部位。

It is bonded to the main chain.

Specifically, the epoxy-modified polymer may include at least one repeating unit selected from the chemical formula 1 and the chemical formula 2, and at least one repeating unit selected from the chemical formula 3 and the chemical formula 4. As an example, the epoxy-modified polymer may include hydroxyl groups at both ends, and may include at least one repeating unit selected from the chemical formula 1 and chemical formula 2, and a repeating unit selected from the chemical formula 3 and chemical formula 4 At least one repeating unit. Alternatively, the epoxy-modified polymer includes a hydroxyl group at one end of the polymer and an epoxy group at the other end, and may include at least one repeating unit selected from the chemical formula 3 and the chemical formula 4.

The epoxy modified polymer can use liquid resin in order to adjust viscosity and improve workability.

Specifically, the epoxy equivalent weight (EEW) of the epoxy modified polymer may be 150 to 250 g/eq. When the epoxy equivalent of the epoxy-modified polymer is less than 150g/eq., the problem of decreased adhesion of the adhesive prepared from the adhesive composition may occur, and when it exceeds 250g/eq., the adhesive may occur The flexibility of the composition is reduced, and the workability is reduced.

The acid value of the epoxy modified polymer may be 0.05 to 100 mg KOH/g. When the acid value of the epoxy-modified polymer is less than 0.05 mg KOH/g, the problem of reduced adhesion may occur, and when it exceeds 100 mg KOH/g, the problem of reduced flexibility may occur.

The weight average molecular weight (Mw) of the epoxy-modified polymer may be 500 to 100,000 g/mol. When the weight average molecular weight of the epoxy-modified polymer is less than 500 g/mol, the problem of reduced flexibility may occur, and when it exceeds 100,000 g/mol, the problem of increased viscosity may occur.

When the viscosity of the epoxy-modified polymer is measured at 45°C with a Brookfield viscometer, it can be 20,000 to 40,000 cPs. When the viscosity of the epoxy-modified polymer is less than 20,000 cPs, there will be a problem in workability due to the low viscosity, and when it exceeds 40,000 cPs, the high viscosity will cause a problem in workability reduction.

>Polyurethane acrylate oligomer>

The urethane acrylate oligomer contained in the adhesive composition of the present invention imparts flexibility to the adhesive composition and can play a role in achieving a low modulus.

The urethane acrylate oligomer may include an aliphatic urethane acrylate oligomer. As an example, it may include an aliphatic urethane acrylate oligomer with one or more functional groups (for example, 1 to 4 functional groups). When the aliphatic urethane acrylate oligomer has more than 4 functional groups, the flexibility will decrease, and when there are no functional groups, the reactivity will decrease, resulting in a decrease in adhesion.

The urethane acrylate oligomer may be an aliphatic urethane acrylate oligomer that does not contain a benzene ring in terms of adhesion, curability, etc., as an example, it may be an aliphatic urethane acrylate having a linear or branched alkyl group Ester oligomer.

The urethane acrylate oligomer may include PU2560, PU340, PU500, PU2100, etc. manufactured by Miwon, but is not limited thereto.

The weight average molecular weight of the urethane acrylate oligomer may be 100 to 10,000 g/mol, specifically, 1,000 to 5,000 g/mol. When the weight average molecular weight of the urethane acrylate oligomer is less than 100 g/mol, it may cause problems in the flexibility of the adhesive composition, and when it exceeds 10,000 g/mol, it may cause problems in reactivity.

When the viscosity of the urethane acrylate oligomer is measured at 25°C with a Brookfield viscometer, it can be 2,000 to 15,000 cPs. When the viscosity of the urethane acrylate oligomer is less than 2,000 cPs, workability occurs due to low viscosity, and when the viscosity exceeds 15,000 cPs, workability becomes problematic due to high viscosity.

The content of the urethane acrylate oligomer is based on 100 parts by weight of the epoxy-modified polymer, and may include a content of 90 to 300 parts by weight, specifically, may include 90 to 300 parts by weight, 100 parts by weight To 250 parts by weight, 100 to 200 parts by weight, 150 to 200 parts by weight. When the content of the urethane acrylate oligomer is less than 90 parts by weight based on 100 parts by weight of the epoxy-modified polymer, it is difficult to achieve a low modulus in the adhesive composition, thereby reducing workability. Moreover, when it exceeds 300 parts by weight, the adhesiveness may decrease.

>Acrylic monomers>

The acrylate monomer contained in the adhesive composition of the present invention can be used as an adhesive in the adhesive composition to play the role of diluting the epoxy modified polymer and the urethane acrylate oligomer. , Can be included in the adhesive composition to improve the adhesion.

The content of the acrylic monomer is based on 100 parts by weight of the epoxy-modified polymer, and may include a content of 100 to 300 parts by weight, specifically, it may include 120 to 300 parts by weight, 120 to 290 parts by weight, 150 to 200 parts by weight. Based on 100 parts by weight of the epoxy modified polymer, when the content of the acrylate monomer is less than 100 parts by weight, the adhesive force of the adhesive composition using the adhesive composition will decrease, and when it exceeds 300 parts by weight Workability will be reduced when serving time.

The acrylate monomers may include alicyclic acrylate monomers, monofunctional or difunctional acrylate monomers, and multifunctional acrylate monomers.

The alicyclic acrylate monomer may include selected from the group consisting of isobornyl methacrylate, dicyclopentenyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, 4- Tert-butyl cyclohexyl acrylate, 3,3,5-trimethylcyclohexyl acrylate, acrylomorpholine, cyclotrimethylolpropane methylal acrylate, isobornyl acrylate, tetrahydrofurfuryl acrylate , 2-phenoxyethyl acrylate, exo-1,7,7-trimethylbicyclo(2,2,1)-2-heptyl acrylate (exo-1,7,7-Trimethylbicyclo(2.2.1 ) at least one of the group consisting of hept-2-yl acrylate) and combinations thereof.

The monofunctional or bifunctional acrylate monomer plays a role in adjusting the viscosity of the adhesive composition of the present invention, thereby playing a role in improving workability. The monofunctional or bifunctional acrylate monomer may include caprolactone acrylate, octyldecyl acrylate, isooctyl acrylate, lauryl acrylate, tetrahydrofurfuryl acrylate, 1,6-hexanediol diacrylate , Butanediol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, neopentyl glycol diacrylate, 1,6-hexanediol diacrylate (2-Propenoic acid 1,6-hexanediyl ester) and combinations thereof.

The content of the monofunctional or difunctional acrylate monomer is based on 100 parts by weight of the alicyclic acrylate monomer, and may include a content of 20 to 50 parts by weight, specifically, may include 25 to 35 parts by weight. Parts by weight, 25 to 30 parts by weight. Based on 100 parts by weight of the alicyclic acrylate monomer, when the content of the monofunctional or difunctional acrylate monomer is less than 20 parts by weight, the storage property of the adhesive composition will decrease, when it exceeds 50 parts by weight. In parts by weight, it is difficult to achieve low modulus.

The multifunctional acrylate monomer contained in the adhesive composition of the present invention functions as a binder resin to improve adhesion. At this time, the multifunctional acrylate monomer has three or more functional groups, which can be distinguished from the monofunctional or difunctional acrylate monomer.

The multifunctional acrylate monomer may include trimethylolpropane triacrylate, ditrimethylolpropane tetraacrylate, pentaerythritol triacrylate, trimethylene propane triacrylate, trimethylene propyl triacrylate Ester, propoxylated glycerol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, 2-[[[2,2-bis[[(1-oxo-2-propenyl)-oxy] Methyl]butoxy]methyl]-2-ethyl-1,3-propanediyl 2-acrylate (2-[[2,2-bis[[(1-oxo-2-propenyl)-oxy ]methyl]butoxy]methyl]-2-ethyl-1,3-propanediyl 2-propenoate) and at least one of the group consisting of combinations thereof.

The content of the multifunctional acrylate monomer is based on 100 parts by weight of the alicyclic acrylate monomer, and may include a content of 30 to 80 parts by weight, specifically, may include 30 to 70 parts by weight, and 40 to 40 parts by weight. 60 parts by weight and 40 to 55 parts by weight. Based on 100 parts by weight of the alicyclic acrylate monomer, when the content of the multifunctional acrylate monomer is less than 30 parts by weight, the adhesive force of the adhesive composition will decrease. When it exceeds 80 parts by weight, Problems can arise when implementing low modulus.

>Silane Compounds>

The silane compound contained in the adhesive composition of the present invention is included in the adhesive composition and functions to improve the dispersibility of the filler, and in addition, it may also function to improve the adhesive force.

The silane compound may include an alkoxy-containing silane compound. Specifically, trialkoxy-containing silane compounds may be included.

The alkoxy-containing silane compound may include at least one selected from the group consisting of epoxy-alkoxy-containing silane compounds and propenyl-alkoxy-containing silane compounds.

Preferably, the silane compound may both include the epoxy-alkoxy-containing silane compound and the propenyl-alkoxy-containing silane compound.

The epoxy-alkoxy-containing silane compound may include at least one selected from the group consisting of glycidoxypropyltrimethoxysilane, glycidoxypropyltriethoxysilane, and combinations thereof. Specifically, the epoxy-alkoxy-containing silane compound may include S-510 of Chisso Co., Ltd., KBM-403 of Shin-Etsu Co., Ltd., A-187 of Luotai Enterprise Co., Ltd., and the like.

The propenyl-alkoxy-containing silane compound may include 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-propene At least one of oxypropyltrimethoxysilane, 3-propenoxypropyltriethoxysilane, and combinations thereof. Specifically, the propenyl-alkoxy-containing silane compound may include PC4600 of Power Chemical Company and the like.

The content of the silane compound, based on 100 parts by weight of the epoxy-modified polymer, may include 10 to 30 parts by weight, specifically, may include 10 to 20 parts by weight, 15 to 20 parts by weight Content. Based on 100 parts by weight of the epoxy-modified polymer, when the content of the silane compound is less than 10 parts by weight, the adhesion will decrease, and when it exceeds 30 parts by weight, it will be difficult to achieve a low modulus.

>Filling material>

The filler contained in the adhesive composition of the present invention is included in the adhesive composition and can play a role in enhancing the strength of the adhesive and other physical properties.

The filling material may be an inorganic filling material composed of inorganic particles such as titanium oxide, aluminum oxide, zirconium oxide, chromium oxide, zinc sulfide, zinc oxide, silicon dioxide, chromium oxide, etc., and may be silicon dioxide as an example.

The filler material may include at least one selected from a first filler material having an average particle diameter (D ₅₀ ) of 1 to 10 μm and a second filler material having an average particle diameter (D ₅₀ ) of 0.01 to 0.8 μm. The average particle diameter (D ₅₀ ) can be measured using a laser diffraction method or the like, for example.

When the filler material includes both the first filler material and the second filler material, the first filler material and the second filler material may be included in a weight ratio of 0.66:1 to 1.5:1, preferably The first filling material and the second filling material are included in a weight ratio of 0.9:1 to 1.1:1. When the weight ratio of the first filling material to the second filling material does not satisfy the above range, the Thixotropic Index (TI) value of the adhesive composition will decrease, resulting in a decrease in workability.

The content of the filler material is based on 100 parts by weight of the epoxy-modified polymer, and may include a content of 300 to 800 parts by weight, specifically, may include 300 to 500 parts by weight, and 350 to 500 parts by weight. , 400 to 500 parts by weight. When 100 parts by weight of the epoxy-modified polymer is used as the standard and the content of the filler is less than 300 parts by weight, the strength of the adhesive will decrease. When it exceeds 800 parts by weight, it cannot be used in the adhesive composition. Evenly dispersed, it is difficult to achieve low modulus, and the adhesion will be reduced.

>Pigment>

The pigment contained in the adhesive composition of the present invention is included in the adhesive composition and functions to realize the color of the adhesive. By realizing the color of the adhesive as described above, when inspecting the quality of the adhesive prepared from the adhesive composition, it is easy to identify the adhesive surface on the device.

The pigment may use red series, yellow/orange series, blue series, green series, black series, white series, pearl and metallic series, etc., but is not limited to this. However, in the present invention, it is preferable to use a red pigment for use in a semiconductor adhesive.

The content of the pigment, based on 100 parts by weight of the epoxy-modified polymer, may include 5 to 20 parts by weight, specifically, may include 5 to 15 parts by weight, 10 to 15 parts by weight content. When 100 parts by weight of the epoxy-modified polymer is used as the standard and the content of the pigment is less than 5 parts by weight, the color of the adhesive becomes lighter and it is difficult to identify the bonding surface in the device. When the content exceeds 20 parts by weight At this time, the adhesion of the adhesive will decrease, and it is difficult to achieve low modulus.

>Catalyst>

The catalyst contained in the adhesive composition of the present invention is contained in the adhesive composition and functions to control the reactivity of the adhesive composition.

The catalyst may include a peroxide-based catalyst, specifically, may include tert-amyl peroxy-2-ethylhexanoate (tert-amyl peroxy-2-ethylhexanoate), specifically, may include Akzo Nobel The company’s Perkadox, Cho YA Fine Chmical’s benzoyl peroxide, etc.

The content of the catalyst, based on 100 parts by weight of the epoxy-modified polymer, may include a content of 5 to 15 parts by weight, specifically, it may include 7 to 15 parts by weight, or 7 to 10 parts by weight. content. Based on 100 parts by weight of the epoxy-modified polymer, when the content of the catalyst is less than 5 parts by weight, the curing rate is significantly reduced and cannot be used as a binder. When it exceeds 15 parts by weight, it is difficult to achieve low modulus , The viscosity becomes low and the workability is problematic.

>Examples>

>Examples 1 to 7>

The adhesive composition was prepared by blending the compositions shown in Table 1 below. [Table 1] distinguish Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Epoxy modified polymer 10.9 6.5 10.9 10.9 15.2 10.9 10.9 Urethane acrylate oligomer 17.6 17.6 10 17.6 17.6 17.6 25.0 Acrylic monomer Alicyclic acrylate monomer 10.9 10.9 10.9 6 10.9 16.4 10.9 Bifunctional acrylate monomer 3 3 3 2.5 3 5.2 3 Multifunctional acrylate monomer 5 5 5 4 5 9.2 5 Silane compounds Silane compounds containing epoxy-alkoxy groups 0.3 0.3 0.3 0.3 0.3 0.3 0.3 Propyl-alkoxy-containing silane compound 1.5 1.5 1.5 1.5 1.5 1.5 1.5 Filler First filling material 24.3 24.3 24.3 24.3 24.3 24.3 24.3 Second filling material 24.3 24.3 24.3 24.3 24.3 24.3 24.3 pigment 1.3 1.3 1.3 1.3 1.3 1.3 1.3 catalyst 0.9 0.9 0.9 0.9 0.9 0.9 0.9 (Unit: g)

>Comparative Examples 1 to 6>

The adhesive composition was prepared by blending the compositions shown in Table 2 below. [Table 2] distinguish Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Comparative example 5 Comparative example 6 Comparative example 7 Comparative example 8 Epoxy modified polymer 10.9 5.45 10.9 10.9 10.9 10.9 10.9 10.9 Urethane acrylate oligomer 17.6 17.6 8.8 17.6 17.6 35.2 - 17.6 Acrylic monomer Alicyclic acrylate monomer 10.9 10.9 10.9 5.45 10.9 10.9 10.9 - Bifunctional acrylate monomer 3 3 3 1 3 3 3 3 Multifunctional acrylate monomer 5 5 5 2 5 5 5 5 Silane compounds Silane compounds containing epoxy-alkoxy groups 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 Silane compounds containing propenyl-alkoxy groups 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 Filler First filling material 24.3 24.3 24.3 24.3 12.15 24.3 24.3 24.3 Second filling material 24.3 24.3 24.3 24.3 24.3 24.3 24.3 24.3 pigment 1.3 1.3 1.3 1.3 1.3 1.3 1.3 1.3 catalyst 0.5 0.9 0.9 0.9 0.9 0.9 0.9 0.9 (Unit: g)

The components used in the examples and comparative examples are as follows.

1. Epoxy modified polymer: Epoxidized polybutadiene, Cas No. 68441-49-6, with a viscosity of 29,000 cPs at 45°C.

2. Polyurethane acrylate oligomer: Aliphatic urethane acrylate, with a weight average molecular weight (Mw) of 1,400g/mol, and a viscosity of 7,000 cPs at 25°C.

3. Alicyclic acrylate monomer: Isobornyl methacrylate, Cas number 5888-33-5, viscosity at 25°C from 5 to 10 cPs, specific gravity: 0.993 (20°C).

4. Bifunctional acrylate monomer: 2-Propenoic acid 1,6-hexanediyl ester, Cas No. 13048-33-4, with a viscosity of 5 to 15 at 25°C cPs, specific gravity: 1.01 (25°C).

5. Multifunctional acrylate monomer: 2-[[2,2-bis[[(1-oxo-2-propenyl]methyl]butoxy]methyl]-2-ethyl-1,3 -Propanediyl-2-acrylate (2-[[2,2-bis[[(1-oxo-2-propenyl)-oxy]methyl]butoxy]methyl]-2-ethyl-1,3-propanediyl 2 -propenoate), Cas No. 94108-97-1, with a viscosity of 450 to 750 cPs at 25°C.

6. Silane compounds containing epoxy-alkoxy groups: trimethoxy[3-(oxiranylmethoxy)propyl]-silane (trimethoxy[3-(oxiranylmethoxy)propyl]-Silane), Cas No. 2530-83-8.

7. Silane compounds containing propenyl-alkoxy groups: Acryloxy Silane, 2-Propenoic acid 3-(trimethoxysilyl)propyl ester , Cas number 4369-14-6.

8. The first filling material: amorphous silicon dioxide (SiO ₂ ), average particle size 1.1μm, Cas number 7631-86-9.

9. The second filling material: silicon dioxide (SiO ₂ ), with an average particle size of 0.2 to 0.3 μm.

10. Pigment: Red organic pigment, Irgazin DPP red BO (L3660 HD), BASF Corporation.

11. Catalyst: peroxide catalyst, tert-Pentyl 2-ethylperoxyhexanoate, Cas No. 686-31-7.

>Experimental example>

The physical properties of the adhesive compositions obtained in the Examples 1 to 7 and Comparative Examples 1 to 8 and the adhesives prepared by the following methods were measured by the following methods, and the measurement results are shown in Table 3 and Table 4 below .

1) Viscosity

The measurement was carried out using a cone-plate Brookfield viscometer at 25°C and 5 rpm.

2) TI (Shake Index)

Use cone-plate Brookfield viscometer to measure at 25℃

3) Modulus

Use dynamic mechanical analysis (Dynamic mechanical Analysis) for measurement

4) Glass transition temperature (Tg)

Use a thermomechanical analyzer (TMA, Thermomechanical Analysis) to check the inflection point.

5) Pot life

Using a cone-plate Brookfield viscometer, measure at 25°C, and measure the time required to increase twice the initial viscosity.

6) Adhesion

Die Shear Strength (Die Shear Strength) is measured by bonding PCB and Si Wafer. [table 3] distinguish Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Viscosity (cps) 11000 10200 9700 13,200 12100 9400 11500 TI 5 5 5 5 5 5 5 Modulus (MPa) 2500 3200 3500 2600 2000 1800 2100 Tg (℃) 65 69 75 61 62 70 61 Applicable period (h) 72 72 72 72 72 72 72 Adhesion (kgf) twenty one 20 18 15 17 13 twenty three Reactivity (175℃ * 15 min) Curing Curing Curing Curing Curing Curing Curing [Table 4] distinguish Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Comparative example 5 Comparative example 6 Comparative example 7 Comparative example 8 Viscosity (cps) 11000 9400 8400 9200 9200 34000 8000 20000 TI 5 5 5 5 2.5 3.2 5 5 Modulus (MPa) 2500 4200 4900 6700 1800 11000 4300 2800 Tg (℃) 65 78 82 53 49 twenty two 83 58 Applicable period (h) 336 72 72 72 72 72 72 72 Adhesion (kgf) 0 19 17 9 11 6 16 13 Reactivity (175℃ * 15 min) Uncured Curing Curing Curing Curing Curing Curing Curing

Claims (5)

An adhesive composition including: 100 parts by weight of epoxy modified polymer; 90 to 300 parts by weight of polyurethane acrylate oligomer; 100 to 300 parts by weight of acrylate monomers, the acrylate monomers including alicyclic acrylate monomers, monofunctional or difunctional acrylate monomers, and multifunctional acrylate monomers; 10 to 30 parts by weight of silane compound; and 300 to 800 parts by weight of filler material. The adhesive composition according to claim 1, wherein the epoxy-modified polymer contains an epoxy group or at least one selected from repeating units represented by the following chemical formulas 1 and 2 at the end of the polymer. [Chemical formula 1]

[Chemical formula 2]

In the chemical formulas 1 and 2, a and b are the repeating numbers of the units in parentheses, which are numbers from 1 to 10.

It is bonded to the main chain. The adhesive composition according to claim 2, wherein the epoxy-modified polymer further includes at least one selected from the repeating units represented by the following chemical formulas 3 and 4. [Chemical formula 3]

[Chemical formula 4]

In the chemical formulas 3 and 4, c and d are the repeating numbers of the units in parentheses, which are numbers from 1 to 10.

It is bonded to the main chain. The adhesive composition according to claim 1, wherein the acrylic monomer includes: 100 parts by weight of the alicyclic acrylate monomer; 20 to 50 parts by weight of the monofunctional or difunctional acrylate monomer; and 30 to 80 parts by weight of the multifunctional acrylate monomer. The adhesive composition according to claim 1, wherein the filler material comprises a first filler material and a second filler material in a weight ratio of 0.66:1 to 1.5:1, and the average particle size (D) of the first filler material ₅₀ ) is 1 to 10 μm, and the average particle diameter (D ₅₀ ) of the second filler material is 0.01 to 0.8 μm.