TW202027583A - Burn-in board structure with independent large-current supply layer capable of simplifying power supply module, reducing configuration cost and making test operation more convenient and easy to carry out - Google Patents

Abstract

A burn-in board structure with independent large-current supply layer is characterized in: a burn-in board is configured with a plurality of test units thereon at intervals, wherein the burn-in board is externally connected to a first power supply which supplies DC power of normal voltage and normal current; and, a large-current supply layer configured with a plurality of contact units thereon at intervals, wherein each contact unit is electrically connected to a corresponding test unit on the burn-in board, and the large-current supply layer is externally connected to a second power supply which supplies DC power of low voltage and high current. Thus, the invention may effectively separate the general normal-current power supply from the special large-current power supply, so as to achieve the practical benefits, such as simplifying the power supply module, reducing configuration cost, making test operation more convenient and easy to carry out, providing a variety of burn-in boards for different components that may be exchanged and applied, and sharing the separated power supplies.

Description

Burn-in board structure with independent high current supply layer

The present invention relates to the technical field of burn-in boards, in particular to a burn-in board structure with an independent high-current supply layer.

The design and manufacture of a new generation of high-performance chips with technological advancement are more complicated. Because of the fast computing speed and super powerful functions, they must work under high current and consume relatively large power. These chips need to be aging tested at high temperatures before they leave the factory. Reliability tests are carried out in semiconductor factories during manufacturing.

Because high-performance chips must consume a lot of power, if the current of each chip IC is 20A, for example, if a burn-in board (BIB) tests 16 chips at the same time, its power supply (Power Supply) must supply a current of 320A. However, if such a large current is transmitted through the circuit board (PCB), a great voltage drop will affect the test, or the number of PCB conductive layers will increase and the cost will increase.

For this reason, US Patent No. 6140829 provides a DC to DC converter (DC to DC Converter) that converts high voltage and low current into low voltage and high current and sends it to the burn-in plate in the oven. Although the above problems are effectively solved, the structure has to be connected through a plurality of special high-specification connector slots (connectors), making the test equipment very complicated and expensive. Moreover, after multiple boards and connector slots in the structure, In addition to power loss, the phase of the analog control signal will also change, so that high-speed chips cannot be tested correctly.

Therefore, our country’s invention patent I406346 has been further improved by integrating the DC to DC converter directly on the burn-in test board. However, this kind of burn-in test board requires normal power supply and general analog control signals. In addition, it must also be equipped with low voltage and high current supplied by the DC-to-DC converter, so the integrated burn-in test board must still use special specifications of thick copper plates and special high-specification connector slots, which cannot effectively reduce the setting The cost simplifies the power supply module, and such burn-in boards can only be used exclusively. When faced with different components, the entire burn-in boards must be remade, and they cannot be shared and applied with each other, resulting in waste of duplicate boards and test disassembly and replacement. The inconvenience is its main disadvantage.

In view of this, the main purpose of the present invention is to provide a burn-in board structure with an independent high-current supply layer, which mainly includes: a burn-in board, a high-current supply layer, and a support frame which are mutually movably stacked. The burn-in board pair is externally connected with a first power supply, the high current supply layer pair is externally connected with a second power supply, the second power supply is a low-voltage high-current direct current, and the first power supply is a normal voltage and current The direct current is characterized by:

A plurality of test units are distributed on the burn-in board, and each test unit is provided with at least one test socket. The burn-in board is connected to an external first power supply, which can provide the normal working voltage and voltage of the multiple test units internally. General standard signals, and;

The high-current supply layer is provided with a plurality of contact groups at intervals, each contact group has at least one positive contact and one negative contact, and each contact group is electrically connected to all of the burn-in boards Corresponding to the test unit, the high-current supply layer is connected to an external second power supply, and the low-voltage and high-current direct current is connected to the plurality of test units on the burn-in board through the plurality of contact groups internally, And the first power supply and the second power supply are separate and independent.

Compared with the prior art, the present invention can effectively separate the general normal current power supply and the special high current power supply independently, so it can effectively reduce the pre-burned board and the high current power supply layer manufacturing specifications, and there is no need to use too much. Special high-priced parts materials. Thus, it can simplify the power supply module, reduce the cost of installation, make the test operation more convenient and easy to carry out, and can provide various pre-burned boards with different components to replace each other, so that they can all share the practical benefits of separate power supply.

In order to facilitate the further introduction and disclosure of the purpose, system composition, application functional characteristics and effects of the present invention, the embodiments are shown in conjunction with the diagrams, and the detailed description is as follows: Please refer to Figures 1 to 3, the present invention Suppose a burn-in board structure with an independent high-current supply layer, which mainly includes: a burn-in board 1, a large-current supply layer 2, and a support frame 3 which are movably overlapped with each other. The first power supply 100, the large current supply layer 2 are connected to a second power supply 200, the second power supply 200 is a low-voltage high-current direct current, and the first power supply 100 is a normal normal voltage and current direct current , Characterized by:

The burn-in board 1 is provided with a plurality of test units 11 distributed at intervals, and each test unit 11 is provided with at least one test socket 111, and the burn-in board 1 pair is externally connected to the first power supply 100, and the plurality of test units 11 can be provided internally. The normal operating voltage and general standard signal of the test unit 11, and;

The high-current supply layer 2 is provided with a plurality of contact groups 21 at intervals. Each contact group has at least a positive contact 211 and a negative contact 212, and each contact group 21 is electrically connected to the preset The corresponding test unit 11 on the burn-in board 1 uses the large current supply layer 2 to externally connect the second power supply 200, and through the plurality of contact groups 21, the low voltage and high current direct current can be connected and supplied to the A plurality of test units 11 on the burn-in board 1 and the first power supply 100 and the second power supply 200 are provided separately.

In a preferred implementation, the pre-fired board 1 is arranged on the uppermost layer, the high current supply layer 2 is arranged on the middle layer, and the support frame 3 is a bottom layer of the frame, in which the pre-burned board 1 and the stacked pre-burned board 1 and The high current supply layer 2, but the actual configuration is not limited to this.

In a preferred implementation, a connector slot 301 is provided between the burn-in board 1 and the first power supply 100, and a connector slot 302 is provided between the high-current layer 2 and the second power supply 200.

In a preferred implementation, as shown in Figure 4, the large current supply layer 2 is a thick copper circuit board 20, which includes at least an intermediate insulating board 201 with an etching circuit 202 with thick copper sheets on both sides. The thick copper circuit The board 20 is drilled. The fixed end of the positive contact 211 of each contact group 21 is electrically connected to one of the thick copper sheet etching circuits 202, and the fixed end of the negative contact 212 is etched with the other thick copper sheet. The circuit 202 is electrically conductive and connected.

As a result, the general normal current power supply and the special high-current power supply can be effectively and independently separated, which can effectively reduce the conditional restrictions on the manufacturing specifications of the burn-in board 1 and the high-current power supply layer 2, and it is not necessary to use too many special high-priced parts and materials. Therefore, the purpose of simplifying the power supply module and reducing the installation cost can be achieved.

In application, as shown in Figures 1 to 3, the burn-in board 1 pair is connected to an external first power supply 100, which can provide the normal working voltage and general standard signals of the plurality of test units 11 internally; with the high current supply layer 2 pairs of externally connected second power supplies 200, internally through the plurality of contact groups 21, can provide low voltage and high current direct current connections to the plurality of test units 11 on the burn-in board 1, making the test operation more convenient Easy to proceed.

In a preferred implementation, as shown in Figs. 4 and 5A to 5B, the contact end of the positive contact 211 and the contact end of the negative contact 212 are of equal height configuration or unequal height configuration. Alternatively, the contact group 21 can also be directly formed by a connector 210, but it is not limited in practice.

In a preferred implementation, as shown in Figure 6, the high current supply layer 2 can also be changed to a wiring frame 25 with a plurality of connectors 210 and a plurality of power lines 251 connected to each other at intervals, and the plurality of power lines 251 The other end of is connected to the second power supply 200, but it is not limited to this in practice.

Compared with the prior art, as shown in Figures 1 to 6, this creation is because the burn-in board 1 and the high-current supply layer 2 are separated, and the positions of the contact groups 21 on it have been set at fixed points. Therefore, when planning and designing the burn-in boards 1 of different components, the required power connection positions can be arranged in advance. In this way, the burn-in boards 1 of different components can be easily replaced and applied to each other, so that they can be shared. The benefit of separate power supply, thus, achieves the practical purpose of simplifying the power supply module, reducing the set-up cost, and making the test operation more convenient and easy to perform.

In summary, the present invention can indeed achieve the aforementioned objectives, and it has actually complied with the provisions of the Patent Law, so a patent application was filed in accordance with the law. However, the above are only the preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention; therefore, all simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are All should fall within the scope of the invention patent.

1: Burn-in board 11: Test unit 100: First power supply 111: Test socket 2: High current supply layer 20: Thick copper circuit board 200: second power supply 201: Intermediate insulating board 202: Etching circuit 21: Contact group 210: Connector 211: Positive contact 212: Negative contact 25: Wiring frame 251: Power cord 3: Support frame 301: connector slot 302: Connector slot

Figure 1 A perspective exploded view of the present invention. Figure 2 A three-dimensional assembly diagram of the present invention. Figure 3 is a cross-sectional view of the application of the present invention. Figure 4 is a partial enlarged view of the large current supply layer of the present invention. Figures 5A and 5B are diagrams of different types of contact groups. Fig. 6 Another embodiment of the high current supply layer of the present invention.

1: Burn-in board

11: Test unit

100: First power supply

111: Test socket

2: High current supply layer

20: Thick copper circuit board

200: second power supply

21: Contact group

3: Support frame

301: connector slot

302: Connector slot

Claims (7)

A burn-in board structure with an independent high-current supply layer, which mainly includes: a burn-in board, a high-current supply layer, and a support frame movably stacked with each other, wherein the burn-in board is connected to an external first power supply, The high-current supply layer is externally connected to a second power supply, the second power supply is a low-voltage high-current direct current, and the first power supply is a normal normal voltage and current direct current, which is characterized by: Space between the burn-in boards A plurality of test units are distributed, each test unit is provided with at least one test socket, and the burn-in board is used to connect the external first power supply to provide the normal working voltage and general standard signals of the test units internally, and; A plurality of contact groups are distributed on the high current supply layer at intervals. Each contact group has at least one positive contact and one negative contact, and each contact group is electrically connected to the burn-in board. The one test unit of the high current supply layer is connected to the external second power supply, and the low voltage and high current direct current is connected to the plurality of test units on the burn-in board through the plurality of contact groups. The first power supply and the second power supply are separate and independent. As described in item 1 of the scope of patent application, the burn-in board structure with an independent high-current supply layer, wherein the burn-in board is arranged on the uppermost layer, the large current supply layer is arranged on the middle layer, and the support frame is a bottom layer of the frame, wherein The pre-fired board and the high-current supply layer are placed in the middle of the stack. As described in item 2 of the scope of patent application, the burn-in board structure with an independent high-current supply layer, wherein a connector slot is provided between the burn-in board and the first power supply, and the high-current layer is provided between the second power supply There are connector slots. As described in item 3 of the scope of patent application, the burn-in board structure with an independent high-current supply layer, wherein the high-current supply layer is a thick copper circuit board, including at least an intermediate insulating board with a thick copper sheet on both sides of the etching The circuit is drilled on a thick copper circuit board, the positive contact fixed end of each contact group is electrically connected to one of the thick copper etched circuits, and the negative contact fixed end is electrically connected to the other thick copper etched circuit The electrical conduction is connected. As described in item 3 of the scope of patent application, the burn-in board structure with independent high current supply layer, wherein the positive contact contact end and the negative contact contact end are of equal height configuration or unequal height configuration. As described in item 3 of the scope of patent application, the burn-in board structure with an independent high-current supply layer, wherein the contact group is formed by a connector. As described in item 3 of the scope of patent application, the burn-in board structure with an independent high-current supply layer, wherein the high-current supply layer is composed of a wiring frame with a plurality of connectors and a plurality of power lines connected to it. The other end of the power cord is connected to the second power supply source.

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