TWM606025U - Burn-in test device with flexible selection of modular core power supply - Google Patents
Burn-in test device with flexible selection of modular core power supply Download PDFInfo
- Publication number
- TWM606025U TWM606025U TW109209646U TW109209646U TWM606025U TW M606025 U TWM606025 U TW M606025U TW 109209646 U TW109209646 U TW 109209646U TW 109209646 U TW109209646 U TW 109209646U TW M606025 U TWM606025 U TW M606025U
- Authority
- TW
- Taiwan
- Prior art keywords
- burn
- board
- power
- test
- power supply
- Prior art date
Links
Images
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
一種彈性選用模組化核心電源的預燒測試裝置,其包括:一預燒板及一配電板,彼此相互活動疊接組成,其中預燒板電連接至一第一電源而配電板電連接至一第二電源,該第二電源用以提供一大電流的直流電。預燒板上間隔分佈設置複數個測試單元,每一測試單元至少設置一測試插座,用以測試一半導體元件。該第一電源用以提供該預燒板上的該複數個測試單元正常工作電壓及一般標準訊號。配電板上間隔分佈設置可活動拆換的複數個模組式降壓轉換器,該複數個模組式降壓轉換器可任意分組成複數個降壓轉換器群組,每個降壓轉換器群組對應於一個測試單元,用以降低該第二電源的電壓並提昇該第二電源的電流來轉換該第二電源所供應的直流電,並且將轉換的直流電供給該預燒板上對應的測試單元。A burn-in test device for flexible selection of modular core power supplies, comprising: a burn-in board and a power distribution board, which are movably overlapped with each other, wherein the burn-in board is electrically connected to a first power source and the power distribution board is electrically connected to A second power source for providing a large current of direct current. A plurality of test units are arranged on the burn-in board at intervals, and each test unit is provided with at least one test socket for testing a semiconductor element. The first power supply is used to provide normal operating voltages and general standard signals of the plurality of test units on the burn-in board. A plurality of modular buck converters that can be movably dismantled are arranged at intervals on the distribution board. The modular buck converters can be arbitrarily grouped into a plurality of buck converter groups, each buck converter The group corresponds to a test unit for reducing the voltage of the second power supply and increasing the current of the second power supply to convert the direct current supplied by the second power supply, and supply the converted direct current to the corresponding test on the burn-in board unit.
Description
本創作係有關預燒裝置的技術領域,尤指一種彈性選用模組化核心電源的預燒測試裝置。This creation is related to the technical field of burn-in devices, especially a burn-in test device that flexibly selects modular core power supplies.
隨著科技進步,新一代的高性能晶片設計及製造上更為複雜。因為運算速度快功能超強,必須在大電流下工作相對消耗功率也大,使得這些晶片出廠前需要在高溫下進行老化測試,所以半導體廠生產製造時都會進行可靠度測試。With the advancement of science and technology, the design and manufacture of new generation high-performance chips have become more complex. Because the calculation speed is fast and the function is super powerful, it must work under high current and consume a lot of power, which makes these chips need to be aging tested at high temperatures before they leave the factory. Therefore, semiconductor factories will conduct reliability tests during production.
由於高性能晶片必須消耗很大的功率,若以每一晶片IC 600A的電流為例,一塊預燒測試板(Burn-in Board ;BIB) 若同時對4顆晶片進行測試,則其電源供應器(Power Supply)就必須供應2400A的電流,然而如此的大電流若透過電路板( PCB )來傳遞,會產生極大的電壓降影響測試進行,或需要增加PCB導電層數而增加成本。Since high-performance chips must consume a lot of power, if the current of each chip IC is 600A, for example, if a burn-in board (BIB) tests 4 chips at the same time, its power supply (Power Supply) must supply a current of 2400A. However, if such a large current is transmitted through the circuit board (PCB), a great voltage drop will affect the test, or the number of PCB conductive layers will increase and the cost will be increased.
為此,美國專利第6140829提供一種以直流對直流轉換器( DC to DC Converter)將高電壓低電流轉換成低電壓高電流送至位於烤箱內的預燒板。雖然有效解決上述問題,但其架構中間還得經過複數個特製高規格的連接器插槽(connector)相連,使得測試設備非常複雜又昂貴,而且架構中經過多塊板子及連接器插槽後,會造成電壓降低,以致高速的晶片無法正確進行測試。To this end, US Patent No. 6,140,829 provides a DC to DC converter (DC to DC Converter) to convert high voltage and low current into low voltage and high current to be sent to the burn-in plate in the oven. Although the above problems are effectively solved, the structure has to be connected through a plurality of special high-specification connector sockets (connectors), making the test equipment very complicated and expensive, and after multiple boards and connector sockets in the structure, Will cause the voltage to drop, so that high-speed chips cannot be tested correctly.
因此,我國新型專利 I406346 進一步改良,將直流對直流轉換器( DC to DC Converter)直接整合設在預燒測試板上,但這種預燒測試板除了要有正常供電及一般模擬的控制訊號之外,另外還必須設置直流對直流轉換器供給的低電壓高電流,故其整合後的預燒測試板仍必須採用特殊規格厚銅板材及特製高規格的連接器插槽,無法有效降低設置成本簡化供電模組、而且這樣的預燒板只能專用,當面對不同元件時整個預燒板都必須重新再製,彼此間不能相互共享套用,造成重複製板的浪費及測試拆裝更換上的不便,為其主要缺點。Therefore, China’s new patent I406346 has been further improved, integrating the DC to DC converter directly on the burn-in test board, but this kind of burn-in test board requires normal power supply and general analog control signals. In addition, the low voltage and high current supplied by the DC-to-DC converter must also be set. Therefore, the integrated burn-in test board must still use special specifications of thick copper plates and special high-specification connector slots, which cannot effectively reduce the installation cost. The power supply module is simplified, and such burn-in boards can only be used exclusively. When facing different components, the entire burn-in boards must be remade. They cannot be shared and applied with each other, resulting in waste of duplicate boards and testing, disassembly, and replacement. Inconvenience is its main disadvantage.
另外,我國新型專利I689240提出了進一步的改良,其使用一般普通電源來供給正常的直流電壓和電流給預燒板進行信號模擬和測試,以及一個特殊大電流供電層,其與該一般普通電源獨立分開而設置,用以提供低電壓大電流給預燒板上的測試單元,藉此有效降低預燒板與大電流供電層製造規格的條件限制,不必另外採用太多特殊高價的零件材料,而達到簡化供電模組、降低設置成本、讓測試作業更為方便易於進行,並可提供多樣不同元件的預燒板更換相互套用,讓其皆能共享分開供電的實用效益。然而,這種預燒板結構中的大電流供電層所輸出的直流電流,若超過1000A將會變得不容易處理且非常昂貴。若是要將這種預燒板結構運用到測試複數個處理大電流的半導體元件 (例如電源管理IC)的應用中,這種預燒板結構將無法達成這個需求。In addition, China's new patent I689240 proposes a further improvement. It uses a general general power supply to supply normal DC voltage and current to the burn-in board for signal simulation and testing, and a special high-current power supply layer, which is independent of the general general power supply. Separately arranged to provide low voltage and high current to the test unit on the burn-in board, thereby effectively reducing the conditional restrictions on the manufacturing specifications of the burn-in board and the high-current power supply layer, without using too many special high-priced parts and materials. It simplifies the power supply module, reduces the set-up cost, makes the test operation more convenient and easy to carry out, and can provide a variety of different components of the burn-in board replacement and mutual application, so that they can all share the practical benefits of separate power supply. However, the direct current output by the high-current power supply layer in this burn-in board structure will become difficult to handle and very expensive if it exceeds 1000A. If this burn-in board structure is to be used in the application of testing multiple semiconductor components that handle large currents (such as power management ICs), this burn-in board structure will not be able to meet this requirement.
舉例來說,隨著科技的進步,晶片所消耗的功率也越來越大,且晶片需要處理的電流安培數也急遽增加。例如,用於基地台或交換機房的晶片,所需要處理的電流值通常都會高達600A。若同時對4個用於基地台或交換機房的晶片做測試,則提供給預燒板的測試單元的直流電源,必須要能夠提供2400A的電流。如此一來,若要測試複數個處理大電流的半導體元件,例如用於基地台或交換機房的晶片,則需要增加PCB的導電層數來提供超過1000A的大電流,因而會增加成本。For example, with the advancement of technology, the power consumed by the chip is also increasing, and the current amperage that the chip needs to handle has also increased sharply. For example, a chip used in a base station or a switch room usually has a current value as high as 600A. If testing four chips used in base stations or switch rooms at the same time, the DC power supply provided to the test unit of the burn-in board must be able to provide 2400A current. As a result, to test multiple semiconductor components that handle large currents, such as chips used in base stations or switch rooms, it is necessary to increase the number of conductive layers of the PCB to provide large currents exceeding 1000A, which will increase the cost.
職是之故,基於克服習用技術中所存在的缺點,新型人經過悉心試驗與研究,並一本鍥而不捨之精神,終發展出本創作的「彈性選用模組化核心電源的預燒測試裝置」,除能夠克服上述先前技術之缺點,還增加許多不同的優點,以下為本創作之簡要說明。For this reason, based on overcoming the shortcomings in the conventional technology, the new type of people after careful experimentation and research, and a spirit of perseverance, finally developed the "flexible selection of modular core power supply burn-in test device" In addition to overcoming the shortcomings of the prior art, it also adds many different advantages. The following is a brief description of the creation.
有鑑於此,本創作之主要目的,在提供一種彈性選用模組化核心電源的預燒測試裝置,其包括一預燒板及一配電板,彼此相互活動疊接組成,其中預燒板電連接至一第一電源而配電板電連接至一第二電源,該第二電源用以提供一大電流的直流電。預燒板上間隔分佈設置複數個測試單元,每一測試單元至少設置一測試插座,用以測試一半導體元件。該第一電源用以提供該預燒板上的該複數個測試單元正常工作電壓及一般標準訊號。配電板上間隔分佈設置可活動拆換的複數個模組式降壓轉換器,該複數個模組式降壓轉換器可任意分組成複數個降壓轉換器群組,每個降壓轉換器群組對應於一個測試單元,用以降低該第二電源的電壓並提昇該第二電源的電流來轉換該第二電源所供應的直流電,並且將轉換的直流電供給該預燒板上對應的測試單元。In view of this, the main purpose of this creation is to provide a burn-in test device for flexible selection of modular core power supplies, which includes a burn-in board and a power distribution board, which are flexibly stacked with each other, wherein the burn-in board is electrically connected To a first power source and the distribution board is electrically connected to a second power source, the second power source is used to provide a large current of direct current. A plurality of test units are arranged on the burn-in board at intervals, and each test unit is provided with at least one test socket for testing a semiconductor element. The first power supply is used to provide normal operating voltages and general standard signals of the plurality of test units on the burn-in board. A plurality of modular buck converters that can be movably dismantled are arranged at intervals on the distribution board. The modular buck converters can be arbitrarily grouped into a plurality of buck converter groups, each buck converter The group corresponds to a test unit for reducing the voltage of the second power supply and increasing the current of the second power supply to convert the direct current supplied by the second power supply, and supply the converted direct current to the corresponding test on the burn-in board unit.
本創作的優點和效益,將由底下的實施例連同所附的圖式來詳細解說。The advantages and benefits of this creation will be explained in detail by the following embodiments together with the attached drawings.
為方便對本創作之目的、系統組成、應用功能特徵及其功效,做更進一步之介紹與揭露,茲舉實施例配合圖式,詳細說明如下:請參見圖1至圖2,其中圖1為本創作的預燒測試裝置的立體外觀圖,圖2為本創作的預燒測試裝置的分解圖。須注意的是在本創作中,相同的元件符號係指向相同的元件。如圖1和圖2所示,本創作提出一種彈性選用模組化核心電源的預燒測試裝置,主要包括一預燒板1和一配電板2,彼此相互活動疊接組成。預燒板1安裝於配電板2的上層,預燒板1上間隔分佈設置複數個測試單元11,每一測試單元11至少設置一測試插座111。每一測試插座111係設定為容納一半導體元件112來對半導體元件112進行信號的模擬和測試。預燒板1電連接第一電源100 (顯示於圖4)和訊號源,配電板2電連接一第二電源200 (顯示於圖4)。電源100可提供該複數個測試單元11正常工作電壓及一般標準訊號給預燒板1做模擬測試。電源100為一般正常電壓電流的直流電。較佳者,半導體元件112為晶片。電源200為一個大電流的直流電源。In order to facilitate the further introduction and disclosure of the purpose, system composition, application features and effects of this creation, the examples are provided with diagrams and detailed descriptions are as follows: Please refer to Figures 1 to 2, of which Figure 1 is The three-dimensional appearance of the burn-in test device created. Figure 2 is an exploded view of the burn-in test device created. It should be noted that in this creation, the same component symbol refers to the same component. As shown in Figures 1 and 2, this creation proposes a burn-in test device for flexible selection of modular core power supplies, which mainly includes a burn-in
請參見圖2至圖6,其中圖3為本創作的預燒測試裝置的上視圖,圖4為本創作的預燒測試裝置沿著圖3的線段X-X所得到的剖面圖,圖5為本創作的預燒測試裝置沿著圖3的線段Y-Y所得到的剖面圖,而圖6為本創作的預燒測試裝置的透視圖。如圖2至圖6所示,配電板2上間隔分佈設置可活動拆換的複數個模組式降壓轉換器211,每一模組式降壓轉換器211用以降低第二電源200的電壓並提昇第二電源200的電流。較佳者,預燒板1與第一電源100間設置連接器插槽401,而配電板2與第二電源200間設置連接器插槽402。此外,該配電板2的每個降壓轉換器211的邊上都會設置一個電源接頭212。Please refer to Figures 2 to 6, where Figure 3 is the top view of the burn-in test device created, Figure 4 is the cross-sectional view of the burn-in test device created along the line XX in Figure 3, and Figure 5 is the top view The created burn-in test device is a cross-sectional view taken along the line segment YY in Figure 3, and Figure 6 is a perspective view of the created burn-in test device. As shown in Figures 2 to 6, a plurality of
藉由該配電板2上間隔分佈設置的複數個模組式降壓轉換器211,使其應用時可依不同待測半導體元件112的供電規格大小不同,而快速進行模組式活動拆換,使單一的配電板2上可快速機動組合替換成不同供電規格的模組式降壓轉換器211,如此即使多種不同供電規格都可共用同一配電板2,而不用每種不同供電規格都另外準備一配電板2造成重覆配置無謂的浪費,整體有效的設計能達到大幅降低成本並節省存放空間的實用目的。With a plurality of modular step-
如圖2和圖6所示,複數個模組式降壓轉換器211會分組成複數個降壓轉換器群組210,且每個降壓轉換器群組210會對應於一個測試單元11。如圖2至圖6所示,在本實施例中鄰近的4個降壓轉換器211會組成一個降壓轉換器群組210,其會對應於位於其上層的測試單元11。每個降壓轉換器群組210會用以降低第二電源200的電壓並提昇第二電源200的電流來轉換第二電源200所供應的直流電,並且將轉換的直流電,通過配電板2上的電源接頭212供給預燒板1上對應的測試單元11。As shown in FIGS. 2 and 6, a plurality of
因此,第二電源200所供應的直流電,便可以經過每個降壓轉換器群組210中的降壓轉換器211進行轉換,亦即第二電源200所供應的直流電會經過數次的降壓和升流轉換,再將轉換的直流電,通過配電板2上的電源接頭212供給預燒板1上對應的測試單元11。如此便可以將第二電源200所供應的直流電的電流進行大幅度地提昇,達到超過1000A甚或超過2000A的電流值,藉此可供應預燒板1上的測試單元11足夠的直流電流來測試半導體元件112。Therefore, the DC power supplied by the
甚至,將來還可藉由本創作配電板2上間隔分佈設置可活動拆換的複數個模組式降壓轉換器211的實用設計,來提供更高直流電流大於3000A或超過4000A的電流值,而滿足供應預燒板1上其測試單元11能有足夠的直流電來測試未來更高供電規格的半導體元件112。Even in the future, the practical design of a plurality of movably removable
然而,須注意的是,此間所揭露的實施例僅為示範說明之用,而非用以限制本創作。本創作的保護範圍,並非可限制為實施例所顯示的精確形式。例如,本實施例顯示複數個模組式降壓轉換器211的分組方式為鄰近的四個模組式降壓轉換器211組成一個降壓轉換器群組210。然而,也可以採用鄰近的二個、三個、五個甚或六個模組式降壓轉換器211組成一個降壓轉換器群組210的分組方式來提供不同的應用。However, it should be noted that the embodiments disclosed here are for demonstration purposes only, and are not intended to limit the creation. The protection scope of this creation is not limited to the precise form shown in the embodiments. For example, this embodiment shows that the grouping manner of a plurality of
再者,本創作配電板2具有相當高的相容性,亦即配電板2可以與其他不同種類的預燒板1互相搭配。因此可增加配電板2應用在預燒測試裝置上的靈活度。Furthermore, the creative
與前述的習知技術我國新型專利I689240相較,如圖1至圖6所示,本創作在配電板上設置複數個模組式降壓轉換器211並將複數個模組式降壓轉換器211分組成複數個降壓轉換器群組210,且設定每個降壓轉換器群組210負責將第二電源200供應的直流電進行數次的降壓和升流操作,再將轉換好的低電壓高電流的直流電供給給預燒板1上對應的插座單元11。如此即可提供超大電流給預燒板1上對應的插座單元11對半導體元件112進行測試,達到以低成本來達成測試處理大電流的半導體元件的預燒裝置的目的。Compared with the aforementioned conventional technology China's new patent I689240, as shown in Figs. 1 to 6, this creation is equipped with a plurality of
雖然本創作已經以優選實施例公開如上,然其並非用以限定本創作,任何本領域的技術人員,在不脫離本創作的精神和範圍內所作的各種更動與潤飾,亦屬本創作的範圍。因此,本創作的保護範圍當視權利要求所界定的為準。Although this creation has been disclosed as above in preferred embodiments, it is not intended to limit this creation. Any changes and modifications made by any person skilled in the art without departing from the spirit and scope of this creation are also within the scope of this creation . Therefore, the protection scope of this creation shall be subject to the definition of the claims.
綜上所述,本創作的確可達成前述目的,實已符合專利法之規定,爰依法提出專利申請。惟以上所述者,僅為本創作之較佳實施例而已,當不能以此限定本創作實施之範圍;故,凡依本創作申請專利範圍及專利說明書內容所作簡單的等效變化與修飾,皆應屬本創作專利涵蓋之範圍內。In summary, this creation can indeed achieve the aforementioned purpose, and it has actually complied with the provisions of the Patent Law, so I filed a patent application in accordance with the law. However, the above are only the preferred embodiments of this creation, and should not be used to limit the scope of implementation of this creation; therefore, any simple equivalent changes and modifications made in accordance with the scope of the patent application for this creation and the content of the patent specification, All should fall within the scope of this creation patent.
1:預燒板 2:配電板 11:測試單元 111:測試插座 112:半導體元件 100:第一電源 200:第二電源 211:模組式降壓轉換器 210:降壓轉換器群組 212:電源接頭 401:連接器插槽 402:連接器插槽1: Burn-in board 2: Distribution board 11: Test unit 111: Test socket 112: Semiconductor components 100: first power supply 200: second power supply 211: Modular Buck Converter 210: Buck converter group 212: power connector 401: connector slot 402: connector slot
圖1為本創作的預燒測試裝置的立體外觀圖。 圖2為本創作的預燒測試裝置的分解圖。 圖3為本創作的預燒測試裝置的上視圖。 圖4為本創作的預燒測試裝置沿著圖3的線段X-X所得到的剖面圖。 圖5為本創作的預燒測試裝置沿著圖3的線段Y-Y所得到的剖面圖。 圖6為本創作的預燒測試裝置的透視圖。 Figure 1 is a three-dimensional appearance of the burn-in test device created. Figure 2 is an exploded view of the burn-in test device created. Figure 3 is the top view of the burn-in test device created. Figure 4 is a cross-sectional view of the created burn-in test device along the line X-X in Figure 3. Figure 5 is a cross-sectional view of the created burn-in test device along the line Y-Y in Figure 3. Figure 6 is a perspective view of the burn-in test device created.
1:預燒板 1: Burn-in board
2:配電板 2: Distribution board
11:測試單元 11: Test unit
111:測試插座 111: Test socket
112:半導體元件 112: Semiconductor components
211:模組式降壓轉換器 211: Modular Buck Converter
210:降壓轉換器群組 210: Buck converter group
212:電源接頭 212: power connector
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109209646U TWM606025U (en) | 2020-07-28 | 2020-07-28 | Burn-in test device with flexible selection of modular core power supply |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109209646U TWM606025U (en) | 2020-07-28 | 2020-07-28 | Burn-in test device with flexible selection of modular core power supply |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM606025U true TWM606025U (en) | 2021-01-01 |
Family
ID=75238458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109209646U TWM606025U (en) | 2020-07-28 | 2020-07-28 | Burn-in test device with flexible selection of modular core power supply |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM606025U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI736372B (en) * | 2020-07-28 | 2021-08-11 | 華烽科技股份有限公司 | Burn-in test device for flexible selection of modular core power supply |
-
2020
- 2020-07-28 TW TW109209646U patent/TWM606025U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI736372B (en) * | 2020-07-28 | 2021-08-11 | 華烽科技股份有限公司 | Burn-in test device for flexible selection of modular core power supply |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWM582137U (en) | Burn-in board structure with independent large current supply layer | |
US11476657B2 (en) | DC power attachment device | |
TW201438038A (en) | Transformer device | |
JP2691809B2 (en) | Semiconductor device test equipment | |
RU2013100003A (en) | MINIATURING TECHNOLOGIES, SYSTEMS AND EQUIPMENT APPLICABLE TO POWER SUPPLIES, MEMORY, CONNECTORS AND LEDS | |
TWM606025U (en) | Burn-in test device with flexible selection of modular core power supply | |
TWI453577B (en) | Power source equipment for cabinet for server | |
TWM606024U (en) | Burn-in test high current boosting device | |
TWI736372B (en) | Burn-in test device for flexible selection of modular core power supply | |
TWI743907B (en) | Burn-in test high current lifting device | |
TWI596849B (en) | Universal connection adapter | |
TWI689240B (en) | Burn-in board structure with independent large current supply layer | |
CN212364489U (en) | Pre-burning test device with flexible selection of modularized core power supply | |
CN212364490U (en) | High current lifting device for burn-in test | |
CN108242609A (en) | Wire connection terminal and the electric power source distribution device using the wire connection terminal | |
CN114167247A (en) | Pre-burning test device with flexible selection of modularized core power supply | |
CN114167248A (en) | High current lifting device for burn-in test | |
CN209764909U (en) | Special switching terminal board of 37 cores | |
TWI749690B (en) | Semiconductor component burn-in test module and its burn- in test equipment | |
Liu | Smart DC/DC Wall Plug Design for the DC House Project | |
TW201713183A (en) | Connection structure and many export power supply feeding mechanism are exported to circuit board more | |
TWM541597U (en) | Power supply featuring dual input power sources | |
CN104460918A (en) | Power supply unit and server power structure | |
CN216350808U (en) | Master-slave board test system for collecting multiple station resources | |
CN114546089B (en) | Chip power supply circuit and electronic equipment |