TWM606025U - Burn-in test device with flexible selection of modular core power supply - Google Patents

Abstract

A burn-in test device for flexible selection of modular core power supplies, comprising: a burn-in board and a power distribution board, which are movably overlapped with each other, wherein the burn-in board is electrically connected to a first power source and the power distribution board is electrically connected to A second power source for providing a large current of direct current. A plurality of test units are arranged on the burn-in board at intervals, and each test unit is provided with at least one test socket for testing a semiconductor element. The first power supply is used to provide normal operating voltages and general standard signals of the plurality of test units on the burn-in board. A plurality of modular buck converters that can be movably dismantled are arranged at intervals on the distribution board. The modular buck converters can be arbitrarily grouped into a plurality of buck converter groups, each buck converter The group corresponds to a test unit for reducing the voltage of the second power supply and increasing the current of the second power supply to convert the direct current supplied by the second power supply, and supply the converted direct current to the corresponding test on the burn-in board unit.

Description

Burn-in test device for flexible selection of modular core power supply

This creation is related to the technical field of burn-in devices, especially a burn-in test device that flexibly selects modular core power supplies.

With the advancement of science and technology, the design and manufacture of new generation high-performance chips have become more complex. Because the calculation speed is fast and the function is super powerful, it must work under high current and consume a lot of power, which makes these chips need to be aging tested at high temperatures before they leave the factory. Therefore, semiconductor factories will conduct reliability tests during production.

Since high-performance chips must consume a lot of power, if the current of each chip IC is 600A, for example, if a burn-in board (BIB) tests 4 chips at the same time, its power supply (Power Supply) must supply a current of 2400A. However, if such a large current is transmitted through the circuit board (PCB), a great voltage drop will affect the test, or the number of PCB conductive layers will increase and the cost will be increased.

To this end, US Patent No. 6,140,829 provides a DC to DC converter (DC to DC Converter) to convert high voltage and low current into low voltage and high current to be sent to the burn-in plate in the oven. Although the above problems are effectively solved, the structure has to be connected through a plurality of special high-specification connector sockets (connectors), making the test equipment very complicated and expensive, and after multiple boards and connector sockets in the structure, Will cause the voltage to drop, so that high-speed chips cannot be tested correctly.

Therefore, China’s new patent I406346 has been further improved, integrating the DC to DC converter directly on the burn-in test board, but this kind of burn-in test board requires normal power supply and general analog control signals. In addition, the low voltage and high current supplied by the DC-to-DC converter must also be set. Therefore, the integrated burn-in test board must still use special specifications of thick copper plates and special high-specification connector slots, which cannot effectively reduce the installation cost. The power supply module is simplified, and such burn-in boards can only be used exclusively. When facing different components, the entire burn-in boards must be remade. They cannot be shared and applied with each other, resulting in waste of duplicate boards and testing, disassembly, and replacement. Inconvenience is its main disadvantage.

In addition, China's new patent I689240 proposes a further improvement. It uses a general general power supply to supply normal DC voltage and current to the burn-in board for signal simulation and testing, and a special high-current power supply layer, which is independent of the general general power supply. Separately arranged to provide low voltage and high current to the test unit on the burn-in board, thereby effectively reducing the conditional restrictions on the manufacturing specifications of the burn-in board and the high-current power supply layer, without using too many special high-priced parts and materials. It simplifies the power supply module, reduces the set-up cost, makes the test operation more convenient and easy to carry out, and can provide a variety of different components of the burn-in board replacement and mutual application, so that they can all share the practical benefits of separate power supply. However, the direct current output by the high-current power supply layer in this burn-in board structure will become difficult to handle and very expensive if it exceeds 1000A. If this burn-in board structure is to be used in the application of testing multiple semiconductor components that handle large currents (such as power management ICs), this burn-in board structure will not be able to meet this requirement.

For example, with the advancement of technology, the power consumed by the chip is also increasing, and the current amperage that the chip needs to handle has also increased sharply. For example, a chip used in a base station or a switch room usually has a current value as high as 600A. If testing four chips used in base stations or switch rooms at the same time, the DC power supply provided to the test unit of the burn-in board must be able to provide 2400A current. As a result, to test multiple semiconductor components that handle large currents, such as chips used in base stations or switch rooms, it is necessary to increase the number of conductive layers of the PCB to provide large currents exceeding 1000A, which will increase the cost.

For this reason, based on overcoming the shortcomings in the conventional technology, the new type of people after careful experimentation and research, and a spirit of perseverance, finally developed the "flexible selection of modular core power supply burn-in test device" In addition to overcoming the shortcomings of the prior art, it also adds many different advantages. The following is a brief description of the creation.

In view of this, the main purpose of this creation is to provide a burn-in test device for flexible selection of modular core power supplies, which includes a burn-in board and a power distribution board, which are flexibly stacked with each other, wherein the burn-in board is electrically connected To a first power source and the distribution board is electrically connected to a second power source, the second power source is used to provide a large current of direct current. A plurality of test units are arranged on the burn-in board at intervals, and each test unit is provided with at least one test socket for testing a semiconductor element. The first power supply is used to provide normal operating voltages and general standard signals of the plurality of test units on the burn-in board. A plurality of modular buck converters that can be movably dismantled are arranged at intervals on the distribution board. The modular buck converters can be arbitrarily grouped into a plurality of buck converter groups, each buck converter The group corresponds to a test unit for reducing the voltage of the second power supply and increasing the current of the second power supply to convert the direct current supplied by the second power supply, and supply the converted direct current to the corresponding test on the burn-in board unit.

The advantages and benefits of this creation will be explained in detail by the following embodiments together with the attached drawings.

In order to facilitate the further introduction and disclosure of the purpose, system composition, application features and effects of this creation, the examples are provided with diagrams and detailed descriptions are as follows: Please refer to Figures 1 to 2, of which Figure 1 is The three-dimensional appearance of the burn-in test device created. Figure 2 is an exploded view of the burn-in test device created. It should be noted that in this creation, the same component symbol refers to the same component. As shown in Figures 1 and 2, this creation proposes a burn-in test device for flexible selection of modular core power supplies, which mainly includes a burn-in board 1 and a power distribution board 2, which are flexibly overlapped with each other. The burn-in board 1 is installed on the upper layer of the power distribution board 2. A plurality of test units 11 are arranged on the burn-in board 1 at intervals, and each test unit 11 is provided with at least one test socket 111. Each test socket 111 is set to accommodate a semiconductor device 112 to simulate and test the signal of the semiconductor device 112. The burn-in board 1 is electrically connected to a first power source 100 (shown in FIG. 4) and a signal source, and the distribution board 2 is electrically connected to a second power source 200 (shown in FIG. 4). The power supply 100 can provide the normal operating voltages and general standard signals of the plurality of test units 11 to the burn-in board 1 for simulation testing. The power supply 100 is a direct current with a normal voltage and current. Preferably, the semiconductor device 112 is a wafer. The power supply 200 is a high-current DC power supply.

Please refer to Figures 2 to 6, where Figure 3 is the top view of the burn-in test device created, Figure 4 is the cross-sectional view of the burn-in test device created along the line XX in Figure 3, and Figure 5 is the top view The created burn-in test device is a cross-sectional view taken along the line segment YY in Figure 3, and Figure 6 is a perspective view of the created burn-in test device. As shown in Figures 2 to 6, a plurality of modular buck converters 211 that can be movably dismantled are arranged at intervals on the distribution board 2, and each modular buck converter 211 is used to reduce the power of the second power supply 200. Voltage and increase the current of the second power supply 200. Preferably, a connector slot 401 is provided between the burn-in board 1 and the first power supply 100, and a connector slot 402 is provided between the power distribution board 2 and the second power supply 200. In addition, a power connector 212 is provided on the side of each step-down converter 211 of the distribution board 2.

With a plurality of modular step-down converters 211 arranged at intervals on the power distribution board 2, it can be used for different power supply specifications of different semiconductor components 112 to be tested, and the modular activities can be quickly replaced. The single power distribution board 2 can be quickly and flexibly replaced by modular buck converters 211 of different power supply specifications, so that even a variety of different power supply specifications can share the same power distribution board 2 without having to prepare separately for each different power supply specification A distribution board 2 causes unnecessary waste of repeated configuration, and the overall effective design can achieve the practical purpose of greatly reducing costs and saving storage space.

As shown in FIGS. 2 and 6, a plurality of modular buck converters 211 are grouped into a plurality of buck converter groups 210, and each buck converter group 210 corresponds to a test unit 11. As shown in FIGS. 2 to 6, in this embodiment, four adjacent buck converters 211 form a buck converter group 210, which corresponds to the test unit 11 located on the upper layer. Each buck converter group 210 is used to reduce the voltage of the second power source 200 and increase the current of the second power source 200 to convert the DC power supplied by the second power source 200, and pass the converted DC power through the power distribution board 2 The power connector 212 supplies the corresponding test unit 11 on the burn-in board 1.

Therefore, the DC power supplied by the second power supply 200 can be converted by the buck converters 211 in each buck converter group 210, that is, the DC power supplied by the second power supply 200 will be stepped down several times. And the up-current conversion, and then the converted direct current is supplied to the corresponding test unit 11 on the burn-in board 1 through the power connector 212 on the distribution board 2. In this way, the current of the direct current supplied by the second power supply 200 can be greatly increased to reach a current value exceeding 1000A or even more than 2000A, thereby supplying sufficient direct current for the test unit 11 on the burn-in board 1 to test semiconductors Component 112.

Even in the future, the practical design of a plurality of movably removable modular buck converters 211 arranged at intervals on the distribution board 2 of this invention can provide a higher DC current greater than 3000A or more than 4000A. The test unit 11 on the burn-in board 1 can be supplied with sufficient direct current to test the semiconductor components 112 with higher power supply specifications in the future.

However, it should be noted that the embodiments disclosed here are for demonstration purposes only, and are not intended to limit the creation. The protection scope of this creation is not limited to the precise form shown in the embodiments. For example, this embodiment shows that the grouping manner of a plurality of modular buck converters 211 is that four adjacent modular buck converters 211 form a buck converter group 210. However, it is also possible to use two, three, five or even six modular buck converters 211 adjacent to each other to form a buck converter group 210 to provide different applications.

Furthermore, the creative power distribution board 2 has a relatively high compatibility, that is, the power distribution board 2 can be matched with other different types of burn-in boards 1. Therefore, the flexibility of applying the distribution board 2 to the burn-in test device can be increased.

Compared with the aforementioned conventional technology China's new patent I689240, as shown in Figs. 1 to 6, this creation is equipped with a plurality of modular buck converters 211 and a plurality of modular buck converters on the distribution board. 211 is divided into a plurality of buck converter groups 210, and each buck converter group 210 is set to be responsible for performing several buck and boost operations on the direct current supplied by the second power supply 200, and then convert the converted low The DC power with high voltage and high current is supplied to the corresponding socket unit 11 on the burn-in board 1. In this way, a super high current can be provided to the corresponding socket unit 11 on the burn-in board 1 to test the semiconductor element 112, so as to achieve the purpose of testing a burn-in device for processing large current semiconductor elements at low cost.

Although this creation has been disclosed as above in preferred embodiments, it is not intended to limit this creation. Any changes and modifications made by any person skilled in the art without departing from the spirit and scope of this creation are also within the scope of this creation . Therefore, the protection scope of this creation shall be subject to the definition of the claims.

In summary, this creation can indeed achieve the aforementioned purpose, and it has actually complied with the provisions of the Patent Law, so I filed a patent application in accordance with the law. However, the above are only the preferred embodiments of this creation, and should not be used to limit the scope of implementation of this creation; therefore, any simple equivalent changes and modifications made in accordance with the scope of the patent application for this creation and the content of the patent specification, All should fall within the scope of this creation patent.

1: Burn-in board 2: Distribution board 11: Test unit 111: Test socket 112: Semiconductor components 100: first power supply 200: second power supply 211: Modular Buck Converter 210: Buck converter group 212: power connector 401: connector slot 402: connector slot

Figure 1 is a three-dimensional appearance of the burn-in test device created. Figure 2 is an exploded view of the burn-in test device created. Figure 3 is the top view of the burn-in test device created. Figure 4 is a cross-sectional view of the created burn-in test device along the line X-X in Figure 3. Figure 5 is a cross-sectional view of the created burn-in test device along the line Y-Y in Figure 3. Figure 6 is a perspective view of the burn-in test device created.

1: Burn-in board

2: Distribution board

11: Test unit

111: Test socket

112: Semiconductor components

211: Modular Buck Converter

210: Buck converter group

212: power connector

Claims (4)

A burn-in test device for flexible selection of modular core power supplies, comprising: a burn-in board and a power distribution board, which are movably overlapped with each other, wherein the burn-in board is electrically connected to a first power source and the power distribution board is electrically connected to A second power source, which is used to provide a large current of direct current, and is characterized by: A plurality of test units are arranged on the burn-in board at intervals, and each test unit is provided with at least one test socket for testing a semiconductor device, and the first power supply is used to provide the plurality of test units on the burn-in board to work normally Voltage and general standard signal; A plurality of modular buck converters that can be movably dismantled are arranged at intervals on the distribution board, and the plurality of modular buck converters are arbitrarily grouped into a plurality of buck converter groups, and each buck converter The device group corresponds to a test unit for reducing the voltage of the second power source and increasing the current of the second power source to convert the DC power supplied by the second power source, and supply the converted DC power to the corresponding one on the burn-in board Test unit. The burn-in test device for flexible selection of modular core power supplies as described in claim 1, wherein the burn-in board is arranged on the upper layer, and the power distribution board is arranged on the lower layer of the burn-in board. The burn-in test device for flexible selection of modular core power supply as described in claim 1, wherein a connector slot is provided between the burn-in board and the first power supply, and a connector slot is provided between the power distribution board and the second power supply Connector slot. The pre-burning test device for flexible selection of modular core power supply as described in claim 1, wherein the power distribution board is equipped with a plurality of power connectors, and each power connector is arranged on the side of a buck converter for the conversion The direct current is supplied to the corresponding test unit on the burn-in board.

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