TW202024189A - Photosensitive resin composition, method for producing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component - Google Patents

Abstract

This photosensitive resin composition contains (A) a polyimide precursor having a polymerizable unsaturated bond, (B) a polymerizable monomer having an aliphatic cyclic skeleton, (C) a photopolymerization initiator, (D) a compound having an anthracene structure, and (E) a solvent.

Description

Photosensitive resin composition, manufacturing method of patterned cured product, cured product, interlayer insulating film, cover coat, surface protective film, and electronic parts

The present invention relates to a photosensitive resin composition, a method for producing a patterned cured product, a cured product, an interlayer insulating film, a cover coat, a surface protective film, and electronic parts.

Conventionally, polyimide or polybenzoxazole, which has excellent heat resistance, electrical properties, and mechanical properties, has been used for surface protection films and interlayer insulating films of semiconductor elements. In recent years, a photosensitive resin composition that imparts photosensitive properties to the resin itself has been used. If the photosensitive resin composition is used, the manufacturing process of the pattern cured product can be simplified, and the complicated manufacturing process can be shortened. (For example, refer to Patent Document 1)

However, in recent years, the miniaturization of transistors that support computer performance has reached the limit of the scaling law, and for further performance or high speed, multilayer device structures in which semiconductor elements are stacked three-dimensionally have attracted attention.

In the multilayer device structure, Multi-die Fanout Wafer Level Packaging is a package manufactured by sealing multiple dies in one package, which is similar to the fan-out wafer level previously proposed. Compared with the level packaging (manufactured by sealing one die in one package), lower cost and higher performance can be expected, so it is attracting attention.

In the production of multi-die fan-out wafer-level packaging, from the viewpoint of high-performance die protection or protection of low-heat-resistant sealing materials to improve yield, low-temperature curability is strongly required (for example, refer to Patent Literature 2).

In addition, as a resin composition, a resin composition containing a polyimide precursor is disclosed (for example, refer to Patent Document 3). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2009-265520 [Patent Document 2] International Publication No. 2008/111470 [Patent Document 3] Japanese Patent Laid-Open No. 2016-199662

The object of the present invention is to provide a photosensitive resin composition that can form a good cured product even at a low temperature of 200°C or less and has excellent resolution and patterning properties after development, a method for producing a patterned cured product, and a cured product , Interlayer insulation film, cover coating, surface protection film and electronic parts.

（式（1）中，X₁ 為具有一個以上的芳香族基的四價基，-COOR₁ 基與-CONH-基相互處於鄰位，-COOR₂ 基與-CO-基相互處於鄰位。Y₁ 為二價芳香族基。R₁ 及R₂ 分別獨立地為氫原子、由下述式（2）所表示的基、或碳數1～4的脂肪族烴基，且R₁ 及R₂ 的至少一者為由所述式（2）所表示的基。） [化2]

（式（2）中，R₃ ～R₅ 分別獨立地為氫原子或碳數1～3的脂肪族烴基，m為1～10的整數。） 3.如1或2所述的感光性樹脂組成物，其中所述（B）成分包含聚合性單體，所述聚合性單體具有包含聚合性的不飽和雙鍵的基且具有脂肪族環狀骨架。 4.如3所述的感光性樹脂組成物，其中所述（B）成分為聚合性單體，所述聚合性單體具有兩個以上的包含聚合性的不飽和雙鍵的基且具有脂肪族環狀骨架。 5.如1至3中任一項所述的感光性樹脂組成物，其中所述（B）成分包含由下述式（3）所表示的聚合性單體。 [化3]

（式（3）中，R₆ 及R₇ 分別獨立地為碳數1～4的脂肪族烴基或由下述式（4）所表示的基。n1為0或1，n2為0～2的整數，n1+n2為1以上。n1個R₆ 及n2個R₇ 的至少一個為由下述式（4）所表示的基。） [化4]

（式（4）中，R₉ ～R₁₁ 分別獨立地為氫原子或碳數1～3的脂肪族烴基，l為0～10的整數。） 6.如5所述的感光性樹脂組成物，其中n1+n2為2或3。 7.如1至6中任一項所述的感光性樹脂組成物，其中所述（B）成分包含由下述式（5）所表示的聚合性單體。 [化5]

8.如1至7中任一項所述的感光性樹脂組成物，其中所述（D）成分包含由下述式（31）所表示的化合物。 [化6]

（式（31）中，R₆₁ 分別獨立地為碳數1～10的烷基、碳數1～10的烷氧基、碳數6～18的芳基、原子數5～18的雜芳基、或鹵素原子，n10為0～8的整數。） 9.如1至7中任一項所述的感光性樹脂組成物，其中所述（D）成分為選自由二丁氧基蒽、二甲氧基蒽、二乙氧基蒽及二乙氧基乙基蒽所組成的群組中的一種以上。 10.如1至9中任一項所述的感光性樹脂組成物，其中更包含（F）熱聚合起始劑。 11.如1至10中任一項所述的感光性樹脂組成物，其用於面板級封裝。 12.一種圖案硬化物的製造方法，包括： 將如1至11中任一項所述的感光性樹脂組成物塗佈於基板上並進行乾燥而形成感光性樹脂膜的步驟； 對所述感光性樹脂膜進行圖案曝光而獲得樹脂膜的步驟； 使用有機溶劑對所述圖案曝光後的樹脂膜進行顯影而獲得圖案樹脂膜的步驟；以及 對所述圖案樹脂膜進行加熱處理的步驟。 13.如12所述的圖案硬化物的製造方法，其中所述加熱處理的溫度為200℃以下。 14.一種硬化物，其為將如1至11中任一項所述的感光性樹脂組成物硬化而成。 15.如14所述的硬化物，其為圖案硬化物。 16.一種層間絕緣膜、覆蓋塗層或表面保護膜，其為使用如14或15所述的硬化物製作而成。 17.一種電子零件，其含有如16所述的層間絕緣膜、覆蓋塗層或表面保護膜。According to the present invention, the following photosensitive resin composition and the like are provided. 1. A photosensitive resin composition containing: (A) a polyimide precursor having polymerizable unsaturated bonds; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) photopolymerization Starting agent; (D) a compound containing an anthracene structure; and (E) a solvent. 2. The photosensitive resin composition according to 1, wherein the (A) component is a polyimide precursor having a structural unit represented by the following formula (1). [化1]

(In formula (1), X ₁ is a tetravalent group having one or more aromatic groups, the -COOR ₁ group and the -CONH- group are in the ortho position to each other, and the -COOR ₂ group and the -CO- group are in the ortho position to each other. Y ₁ is a divalent aromatic group. R ₁ and R ₂ are each independently a hydrogen atom, a group represented by the following formula (2), or an aliphatic hydrocarbon group having 1 to 4 carbons, and R ₁ and R ₂ At least one of is the base represented by the formula (2).) [化2]

(In formula (2), R ₃ to R ₅ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and m is an integer of 1 to 10.) 3. The photosensitive resin according to 1 or 2 A composition in which the (B) component contains a polymerizable monomer having a group containing a polymerizable unsaturated double bond and an aliphatic cyclic skeleton. 4. The photosensitive resin composition according to 3, wherein the component (B) is a polymerizable monomer, and the polymerizable monomer has two or more groups containing a polymerizable unsaturated double bond and has fat Family cyclic skeleton. 5. The photosensitive resin composition according to any one of 1 to 3, wherein the component (B) contains a polymerizable monomer represented by the following formula (3). [化3]

(In formula (3), R ₆ and R ₇ are each independently an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a group represented by the following formula (4). n1 is 0 or 1, and n2 is 0 to 2. Integer, n1+n2 is 1 or more. At least one of n1 R ₆ and n 2 R ₇ is a group represented by the following formula (4).) [formation 4]

(In formula (4), R ₉ to R ₁₁ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and l is an integer of 0 to 10.) 6. The photosensitive resin composition according to 5 , Where n1+n2 is 2 or 3. 7. The photosensitive resin composition according to any one of 1 to 6, wherein the component (B) contains a polymerizable monomer represented by the following formula (5). [化5]

8. The photosensitive resin composition according to any one of 1 to 7, wherein the component (D) contains a compound represented by the following formula (31). [化6]

(In formula (31), R _{61 is} each independently an alkyl group having 1 to 10 carbons, an alkoxy group having 1 to 10 carbons, an aryl group having 6 to 18 carbons, and a heteroaryl group having 5 to 18 atoms. , Or a halogen atom, n10 is an integer of 0-8.) 9. The photosensitive resin composition according to any one of 1 to 7, wherein the component (D) is selected from dibutoxyanthracene and dibutoxyanthracene. One or more kinds of methoxyanthracene, diethoxyanthracene, and diethoxyethylanthracene. 10. The photosensitive resin composition according to any one of 1 to 9, which further contains (F) a thermal polymerization initiator. 11. The photosensitive resin composition according to any one of 1 to 10, which is used for panel-level packaging. 12. A method of manufacturing a patterned cured product, comprising: applying the photosensitive resin composition according to any one of 1 to 11 on a substrate and drying to form a photosensitive resin film; A step of pattern exposure of the resin film to obtain a resin film; a step of developing the resin film after the pattern exposure using an organic solvent to obtain a patterned resin film; and a step of heating the patterned resin film. 13. The method of manufacturing a patterned hardened product according to 12, wherein the temperature of the heat treatment is 200°C or less. 14. A cured product obtained by curing the photosensitive resin composition according to any one of 1 to 11. 15. The cured product according to 14, which is a pattern cured product. 16. An interlayer insulating film, a cover coat or a surface protection film, which is produced using the hardened product as described in 14 or 15. 17. An electronic component comprising the interlayer insulating film, cover coating or surface protection film as described in 16.

According to the present invention, it is possible to provide a photosensitive resin composition, a method for manufacturing a patterned cured product, and a cured product that can form a good cured product even at a low temperature of 200°C or less and have excellent resolution and patterning properties after development , Interlayer insulation film, cover coating, surface protection film and electronic parts.

Hereinafter, embodiments of the photosensitive resin composition of the present invention, the method for producing a cured pattern using the same, the cured product, interlayer insulating film, cover coat, surface protective film, and electronic parts will be described in detail. In addition, this invention is not limited by the following embodiment.

In this specification, the so-called "A or B" may include any of A and B, and may include both. In addition, in this specification, the term "step" not only includes an independent step, but even if it cannot be clearly distinguished from other steps, as long as the desired effect of the step is achieved, it is included in the term. The numerical range indicated by "～" means the range that includes the numerical values described before and after "～" as the minimum and maximum values, respectively. In addition, in this specification, regarding the content of each component in the composition, when multiple substances corresponding to each component are present in the composition, unless otherwise specified, it means the multiple The total amount of the substance. Furthermore, as for the exemplified materials, unless otherwise specified, they may be used alone or in combination of two or more kinds. The "(meth)acryl group" in this specification means "acryl group" and "methacryl group".

The photosensitive resin composition of the present invention contains: (A) a polyimide precursor having a polymerizable unsaturated bond (hereinafter, also referred to as "(A) component"); (B) having an aliphatic cyclic skeleton Polymerizable monomer (also referred to as "crosslinking agent") (hereinafter also referred to as "(B) component"); (C) photopolymerization initiator (hereinafter also referred to as "(C) component") ; (D) A compound containing an anthracene structure (hereinafter, also referred to as "(D) component"); and (E) solvent (hereinafter, also referred to as "(E) component").

With this, even if it is cured at a low temperature of 200° C. or less, a good cured product can be formed, and the resolution and patterning properties after development are excellent. In addition, as an arbitrary effect, even if it is cured at a low temperature of 200° C. or less, a good cured product can be formed, and a cured product with excellent resolution after curing can be formed.

The photosensitive resin composition of the present invention is preferably a negative photosensitive resin composition. In addition, from the viewpoint of photosensitivity during h-ray exposure, the photosensitive resin composition of the present invention is preferably used for panel level package (for example, without a package substrate, instead, it is made from a wafer The terminal leads to the rewiring layer of the wiring and connects to the package of the external terminal structure). The photosensitive resin composition of the present invention is preferably a material for panel-level packaging or a material for electronic parts.

(A) The component is not particularly limited, but it is preferably polyimide which has high transmittance when i-rays are used as the light source for patterning and exhibits high cured properties even when cured at a low temperature below 200°C Precursor.

Examples of the polymerizable unsaturated bond include carbon-carbon double bonds.

(A) The component is preferably a polyimide precursor having a structural unit represented by the following formula (1). Thereby, the transmittance of i-rays is high, and even when it is cured at a low temperature of 200°C or less, a good cured product can be formed. The content of the structural unit represented by formula (1) is preferably 50 mol% or more, more preferably 80 mol% or more, and still more preferably 90 mol% or more with respect to all the structural units of the component (A). The upper limit is not particularly limited, and may be 100 mol%.

（式（1）中，X₁ 為具有一個以上的芳香族基的四價基，-COOR₁ 基與-CONH-基相互處於鄰位，-COOR₂ 基與-CO-基相互處於鄰位。Y₁ 為二價芳香族基。R₁ 及R₂ 分別獨立地為氫原子、由下述式（2）所表示的基、或碳數1～4的脂肪族烴基，且R₁ 及R₂ 的至少一者為由所述式（2）所表示的基。）[化7]

(In formula (1), X ₁ is a tetravalent group having one or more aromatic groups, the -COOR ₁ group and the -CONH- group are in the ortho position to each other, and the -COOR ₂ group and the -CO- group are in the ortho position to each other. Y ₁ is a divalent aromatic group. R ₁ and R ₂ are each independently a hydrogen atom, a group represented by the following formula (2), or an aliphatic hydrocarbon group having 1 to 4 carbons, and R ₁ and R ₂ At least one of is the base represented by the formula (2).)

（式（2）中，R₃ ～R₅ 分別獨立地為氫原子或碳數1～3的脂肪族烴基，m為1～10的整數（較佳為2～5的整數，更佳為2或3）。）[化8]

(In formula (2), R ₃ to R ₅ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and m is an integer of 1 to 10 (preferably an integer of 2 to 5, more preferably 2 Or 3).)

Among the tetravalent groups having one or more (preferably one to three, more preferably one or two) aromatic groups in X ₁ of formula (1), the aromatic group may be an aromatic hydrocarbon group or It is an aromatic heterocyclic group. Preferably it is an aromatic hydrocarbon group.

Examples of the aromatic hydrocarbon group of X ₁ in formula (1) include: a divalent to tetravalent (divalent, trivalent, or tetravalent) group formed from a benzene ring, and a divalent to tetravalent group formed from naphthalene , Divalent to tetravalent base formed by perylene, etc.

（式（6）中，X及Y分別獨立地表示不與各自所鍵結的苯環共軛的二價基或單鍵。Z為醚基（-O-）或硫醚基（-S-）（較佳為-O-）。）As the X of formula (1) having at least one aromatic group, a tetravalent group _1, for example, the following formula (6) is a tetravalent group, which is not limited to these. [化9]

(In formula (6), X and Y each independently represent a divalent group or a single bond that is not conjugated to the benzene ring to which they are bonded. Z is an ether group (-O-) or a thioether group (-S- ) (Preferably -O-).)

In formula (6), the divalent groups of X and Y that are not conjugated to the benzene ring to which they are bonded are preferably -O-, -S-, methylene, bis(trifluoromethyl)methylene , Or difluoromethylene, more preferably -O-.

The divalent aromatic group of Y ₁ in the formula (1) may be a divalent aromatic hydrocarbon group or a divalent aromatic heterocyclic group. Preferably, it is a divalent aromatic hydrocarbon group.

（式（7）中，R₁₂ ～R₁₉ 分別獨立地為氫原子、一價脂肪族烴基或具有鹵素原子的一價有機基。）As the divalent aromatic hydrocarbon group of Y ₁ in the formula (1), for example, the group of the following formula (7) can be cited, but it is not limited to this. [化10]

(In formula (7), R ₁₂ to R ₁₉ are each independently a hydrogen atom, a monovalent aliphatic hydrocarbon group, or a monovalent organic group having a halogen atom.)

Examples of the monovalent aliphatic hydrocarbon group of R ₁₂ to R ₁₉ in the formula (7) (preferably having 1 to 10 carbons, more preferably 1 to 6 carbons) include methyl groups and the like. For example, R ₁₂ and R ₁₅ to R _{19 may} be hydrogen atoms, and R ₁₃ and R _{14 may} be monovalent aliphatic hydrocarbon groups.

The monovalent organic group having a halogen atom (preferably a fluorine atom) of R ₁₂ to R ₁₉ of formula (7) is preferably a monovalent aliphatic hydrocarbon group having a halogen atom (preferably having 1 to 10 carbon atoms, more preferably It is carbon number 1-6), trifluoromethyl etc. are mentioned.

Examples of the aliphatic hydrocarbon group having 1 to 4 carbon atoms (preferably 1 or 2) in R ₁ and R ₂ of formula (1) include: methyl, ethyl, n-propyl, 2-propyl, n-butyl Base etc.

At least one of R ₁ and R ₂ in formula (1) is a group represented by formula (2), and it is preferable that both of R ₁ and R ₂ are groups represented by formula (2).

Examples of the aliphatic hydrocarbon group having 1 to 3 carbon atoms (preferably 1 or 2) of R ₃ to R ₅ in the formula (2) include methyl, ethyl, n-propyl, 2-propyl and the like. Preferably it is methyl.

The polyimide precursor having the structural unit represented by the formula (1) can be obtained, for example, by combining the tetracarboxylic dianhydride represented by the following formula (8) with the tetracarboxylic dianhydride represented by the following formula (9) ) The diamine-based compound represented by the reaction in an organic solvent such as N-methyl-2-pyrrolidone to obtain polyamide acid, the compound represented by the following formula (10) is added, and it is added to the organic solvent The reaction proceeds to introduce ester groups locally. The tetracarboxylic dianhydride represented by the formula (8) and the diamino compound represented by the formula (9) may be used alone or in combination of two or more.

（式（8）中，X₁ 為與式（1）的X₁ 相對應的基。）[化11]

(In formula (8), X ₁ is a base corresponding to X _{1 in} formula (1).)

（式（9）中，Y₁ 如式（1）中所定義般。）[化12]

(In formula (9), Y _{1 is} as defined in formula (1).)

（式（10）中，R為由所述式（2）所表示的基。）[化13]

(In the formula (10), R is a group represented by the formula (2).)

（式（11）中，X₂ 為具有一個以上的芳香族基的四價基，-COOR₅₁ 基與-CONH-基相互處於鄰位，-COOR₅₂ 基與-CO-基相互處於鄰位。Y₂ 為二價芳香族基。R₅₁ 及R₅₂ 分別獨立地為氫原子或碳數1～4的脂肪族烴基。）(A) A component may have a structural unit other than the structural unit represented by Formula (1). As a structural unit other than the structural unit represented by Formula (1), the structural unit represented by Formula (11), etc. are mentioned. [化14]

(In formula (11), X ₂ is a tetravalent group having one or more aromatic groups, the -COOR ₅₁ group and the -CONH- group are in the ortho position to each other, and the -COOR ₅₂ group and the -CO- group are in the ortho position to each other. Y ₂ is a divalent aromatic group. R ₅₁ and R ₅₂ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 4 carbons.)

The tetravalent group having one or more aromatic groups in X ₂ of the formula (11) may be the same as the tetravalent group having one or more aromatic groups in X ₁ of the formula (1). The divalent aromatic group of Y ₂ in the formula (11) may be the same as the divalent aromatic group of Y ₁ in the formula (1). Examples of the aliphatic hydrocarbon group having 1 to 4 carbons in R ₅₁ and R ₅₂ of the formula (11) are the same as the aliphatic hydrocarbon group having 1 to 4 carbons in R ₁ and R ₂ .

Structural units other than the structural unit represented by formula (1) may be used alone or in combination of two or more.

The content of structural units other than the structural unit represented by formula (1) is preferably less than 50 mol% with respect to all structural units of the component (A).

In component (A), the ratio of carboxyl groups esterified by the group represented by formula (2) is preferably 50 mol% or more, and more preferably 60 mol%-100 mol%, relative to all carboxyl groups and all carboxyl esters. Ear%, more preferably 70 mol% to 90 mol%.

(A) The molecular weight of the component is not particularly limited, but it is preferably 10,000 to 200,000 in terms of number average molecular weight. The number average molecular weight can be measured by gel permeation chromatography, for example, and can be calculated by conversion using a standard polystyrene calibration curve.

The photosensitive resin composition of the present invention contains (B) a polymerizable monomer having an aliphatic cyclic skeleton (the carbon number is preferably 4-15, more preferably 5-12). Thereby, it is possible to impart hydrophobicity to the cured product that can be formed, and it is possible to suppress the deterioration of the adhesiveness between the cured product and the substrate under high temperature and high humidity conditions.

The component (B) preferably contains a group having (preferably two or more) unsaturated double bonds containing polymerizable properties (because polymerization can be carried out by a photopolymerization initiator, it is preferably (meth)acrylic acid) Base) and a polymerizable monomer having an aliphatic cyclic skeleton. In order to increase the crosslinking density and light sensitivity, and suppress pattern swelling after development, the component (B) preferably has two to three polymerizable monomers containing The base of a saturated double bond.

（式（3）中，R₆ 及R₇ 分別獨立地為碳數1～4的脂肪族烴基或由下述式（4）所表示的基。n1為0或1，n2為0～2的整數，n1+n2為1以上（較佳為2或3）。n1個R₆ 及n2個R₇ 的至少一個（較佳為兩個或三個）為由下述式（4）所表示的基。）The (B) component preferably contains a polymerizable monomer represented by the following formula (3). [化15]

(In formula (3), R ₆ and R ₇ are each independently an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a group represented by the following formula (4). n1 is 0 or 1, and n2 is 0 to 2. Integer, n1+n2 is 1 or more (preferably 2 or 3). At least one (preferably two or three) of n1 R ₆ and n 2 R ₇ is represented by the following formula (4) base.)

In the case where R ₇ is two, two R ₇ may be the same or different.

（式（4）中，R₉ ～R₁₁ 分別獨立地為氫原子或碳數1～3的脂肪族烴基，l為0～10的整數（較佳為0、1或2）。）[化16]

(In formula (4), R ₉ to R ₁₁ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and l is an integer of 0 to 10 (preferably 0, 1 or 2).)

The (B) component more preferably contains a polymerizable monomer represented by the following formula (5). [化17]

Moreover, as (B) component, the following polymerizable monomers can also be used, for example.

式（12）中，R₂₁ ～R₂₄ 分別獨立地為碳數1～4的脂肪族烴基或由所述式（4）所表示的基。n3為1～3的整數（較佳為2或3）。n4為1～3的整數（較佳為2或3）。n5為0或1，n6為0或1。n5+n6為1以上（較佳為2）。[化18]

In formula (12), R ₂₁ to R ₂₄ are each independently an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a group represented by the above formula (4). n3 is an integer of 1 to 3 (preferably 2 or 3). n4 is an integer of 1 to 3 (preferably 2 or 3). n5 is 0 or 1, and n6 is 0 or 1. n5+n6 is 1 or more (preferably 2).

When two or more R ₂₁ are present, the two or more R ₂₁ may be the same or different. R ₂₂ in the case where there are two or more, two or more of R ₂₂ may be the same or different.

At least one (preferably two or three) of n3 R ₂₁ is a group represented by the above formula (4). At least one (preferably two or three) of n4 R ₂₂ is a group represented by the above formula (4). At least one (preferably two) of n5 R ₂₃ and n 6 R ₂₄ is a group represented by the aforementioned formula (4).

Examples of R ₆ and R _{7 in} formula (3) and the aliphatic hydrocarbon group having 1 to 4 carbons in R ₂₁ to R ₂₄ in formula (12) include those with 1 to R ₁ and R ₂ in formula (1). The aliphatic hydrocarbon groups of ~4 are the same.

Examples of the aliphatic hydrocarbon groups having 1 to 3 carbons in R ₉ to R ₁₁ in the formula (4) include the same aliphatic hydrocarbon groups having 1 to 3 in R ₃ to R ₅ in the formula (2).

(B) A component may be used individually by 1 type, and may combine 2 or more types.

The content of the (B) component is preferably 1 part by mass to 50 parts by mass relative to 100 parts by mass of the (A) component. From the viewpoint of improving the hydrophobicity of the cured product, it is more preferably 3 parts by mass to 50 parts by mass, and still more preferably 5 parts by mass to 35 parts by mass. When it is in the said range, it is easy to obtain a practical relief pattern, and it is easy to suppress the residue after development of an unexposed part.

As the (C) component, for example, benzophenone, methyl phthalate benzoate, 4-benzyl-4'-methyl benzophenone, dibenzyl ketone, Benzophenone derivatives such as quinone, acetophenone derivatives such as 2,2'-diethoxyacetophenone, 2-hydroxy-2-methylpropiophenone, 1-hydroxycyclohexylphenylketone, etc. Xanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, diethylthioxanthone and other thioxanthone derivatives, benzyl, benzyl dimethyl ketal, benzyl-β-methyl Benzyl derivatives such as oxyethyl acetal, benzoin derivatives such as benzoin and benzoin methyl ether, and 1-phenyl-1,2-butanedione-2-(O-methoxycarbonyl)oxime, 1- Phenyl-1,2-propanedione-2-(O-methoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime, 1- Phenyl-1,2-propanedione-2-(O-benzyl)oxime, 1,3-diphenylglycerin-2-(O-ethoxycarbonyl)oxime, 1-phenyl -3-ethoxyglycerol-2-(O-benzyl)oxime, ethyl ketone, 1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazole -3-yl]-,1-(O-acetoxyoxime), oxime esters such as compounds represented by the following formula, etc., but are not limited to these. [化19]

Especially in terms of photosensitivity, oxime esters are preferred.

The (C) component preferably contains (C1) a compound represented by the following formula (15) (hereinafter, also referred to as "(C1) component"). The component (C1) is preferably a higher sensitivity to actinic rays than the component (C2) described later, and is preferably a high-sensitivity photosensitive agent.

式（15）中，R_11A 為碳數1～12的烷基，a1為0～5的整數。R_12A 為氫原子或碳數1～12的烷基。R_13A 及R_14A 分別獨立地表示氫原子、碳數1～12（較佳為碳數1～4）的烷基、苯基或甲苯基。於a1為2以上的整數的情況下，R_11A 分別可相同亦可不同。[化20]

In the formula (15), R _11A is an alkyl group having 1 to 12 carbon atoms, and a1 is an integer of 0-5. R _12A is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms. R _13A and R _14A each independently represent a hydrogen atom, an alkyl group having 1 to 12 carbons (preferably 1 to 4 carbons), a phenyl group or a tolyl group. When a1 is an integer of 2 or more, R _11A may be the same or different.

R _{11A is} preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group. a1 is preferably 1. R _{12A is} preferably an alkyl group having 1 to 4 carbon atoms, more preferably an ethyl group. R _13A and R _{14A are} preferably each independently an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group.

As the compound represented by the formula (15), for example, the compound represented by the following formula (15A) can be cited as "IRGACURE OXE 02" manufactured by BASF Japan Co., Ltd. Obtain. [化21]

In addition, the (C) component preferably contains (C2) a compound represented by the following formula (16) (hereinafter, also referred to as "(C2) component"). The component (C2) is preferably a sensitizer with a lower sensitivity to actinic rays than the component (C1), and is preferably a standard sensitivity.

式（16）中，R_21A 為碳數1～12的烷基，R_22A 及R_23A 分別獨立地為氫原子、碳數1～12的烷基（較佳為碳數1～4）、碳數1～12的烷氧基（較佳為碳數1～4）、碳數4～10的環烷基、苯基或甲苯基，c1為0～5的整數。於c1為2以上的整數的情況下，R_21A 分別可相同亦可不同。[化22]

In the formula (16), R _21A is an alkyl group having 1 to 12 carbons, R _22A and R _23A are each independently a hydrogen atom, an alkyl group having 1 to 12 carbons (preferably having 1 to 4 carbons), carbon An alkoxy group having 1 to 12 (preferably a carbon number of 1 to 4), a cycloalkyl group having a carbon number of 4 to 10, a phenyl group or a tolyl group, and c1 is an integer of 0 to 5. When c1 is an integer of 2 or more, R _21A may be the same or different.

c1 is preferably 0. R _{22A is} preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group. R _{23A is} preferably an alkoxy group having 1 to 12 carbons, more preferably an alkoxy group having 1 to 4 carbons, and still more preferably a methoxy group or an ethoxy group.

Examples of the compound represented by the formula (16) include a compound represented by the following formula (16A), which can be obtained as "G-1820 (PDO)" manufactured by Lambson Corporation. [化23]

(C) A component may be used individually by 1 type, and may combine 2 or more types.

The (C) component preferably contains one or more selected from the group consisting of (C1) and (C2) components. Moreover, (C)component preferably contains (C1)component and (C2)component.

With respect to 100 parts by mass of (A) component, the content of (C) component is preferably 0.1 parts by mass to 20 parts by mass, more preferably 0.1 parts by mass to 15 parts by mass, and still more preferably 0.2 parts by mass to 10 parts by mass. When it is within the above range, the photo-crosslinking is likely to become uniform in the film thickness direction, and it is easy to obtain a practical relief pattern.

When the component (C1) is contained, the content of the component (C1) is usually 0.05 parts by mass to 5.0 parts by mass, preferably 0.07 parts by mass to 2.5 parts by mass, more preferably relative to 100 parts by mass of the (A) component 0.09 parts by mass to 1.0 parts by mass.

When (C2) component is contained, content of (C2) component is 0.5 mass part-15.0 mass parts normally with respect to 100 mass parts of (A) component, Preferably it is 1.0 mass part-13.0 mass parts.

When containing (C1) component and (C2) component, it is preferable that the content of (C1) component is 0.05 to 5.0 parts by mass relative to 100 parts by mass of (A) component, and the content of (C2) component It is 0.5 mass part-15.0 mass parts with respect to 100 mass parts of (A) components.

When the (C1) component and the (C2) component are contained, the quality ratio of the content of the (C1) component and the (C2) component is preferably 1:30 to 1:70, and more preferably 1:35 to 1:65.

（式（31）中，R₆₁ 分別獨立地為碳數1～10的烷基、碳數1～10的烷氧基、碳數6～18的芳基、原子數5～18的雜芳基、或鹵素原子（較佳為氟原子），n10為0～8的整數（較佳為1～4的整數，更佳為2、3或4）。）From the viewpoint of achieving both sensitivity and resolution, the component (D) preferably contains a compound represented by the following formula (31). [化24]

(In formula (31), R _{61 is} each independently an alkyl group having 1 to 10 carbons, an alkoxy group having 1 to 10 carbons, an aryl group having 6 to 18 carbons, and a heteroaryl group having 5 to 18 atoms. , Or a halogen atom (preferably a fluorine atom), n10 is an integer of 0-8 (preferably an integer of 1 to 4, more preferably 2, 3 or 4).)

Examples of the alkyl group having 1 to 10 carbon atoms (preferably 1 to 6, more preferably 2 to 5) include methyl, ethyl, tertiary butyl, n-butyl, and the like. Examples of the alkoxy group having 1 to 10 carbon atoms (preferably 1 to 6, more preferably 2 to 5) include butoxy (for example, n-butoxy), methoxy, and ethoxy.

Examples of the aryl group having 6 to 18 carbon atoms (preferably 6 to 12, more preferably 6 to 10) include phenyl and naphthyl. Examples of the heteroaryl group having 5 to 18 atoms (preferably 5 to 12, more preferably 5 to 10) include pyridyl, quinolyl, and carbazolyl.

In addition, from the viewpoint of both the solubility to the photosensitive resin composition and the photosensitive properties, the component (D) is preferably a dialkoxyanthracene which may have a substituent (for example, 9,10 dialkoxyanthracene), Preferably, it is selected from dibutoxyanthracene (for example 9,10 dibutoxyanthracene), dimethoxyanthracene (for example 9,10-dimethoxyanthracene), diethoxyanthracene (for example 9,10 -Diethoxy anthracene) and diethoxy ethyl anthracene (for example, 9,10-dimethoxy-2 ethyl anthracene). As a substituent, a methyl group, an ethyl group, a tertiary butyl group, a n-butyl group, etc. are mentioned.

(D) A component may be used individually by 1 type, and may combine 2 or more types.

With respect to 100 parts by mass of (A) component, the content of (D) component is preferably 0.1 parts by mass to 20 parts by mass, more preferably 0.2 parts by mass to 10 parts by mass, and still more preferably 0.3 parts by mass to 5 parts by mass. When it is in the said range, the solubility to a photosensitive resin composition and the improvement of photosensitive characteristics can be compatible.

The photosensitive resin composition of this invention contains (E) solvent. (E) component includes N-methyl-2-pyrrolidone, γ-butyrolactone, ethyl lactate, propylene glycol monomethyl ether acetate, benzyl acetate, n-butyl acetate, ethoxy propionate Ethyl ester, 3-methylmethoxypropionate, N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfinium, hexamethylphosphamide, Tetramethylene sulfonate, cyclohexanone, cyclopentanone, diethyl ketone, diisobutyl ketone, methyl amyl ketone, N-dimethylmorpholine, etc., usually as long as they can fully dissolve other ingredients There are no special restrictions. Among them, it is preferable to use N-methyl-2-pyrrolidone, γ-butyrolactone, ethyl lactate, etc. from the viewpoints of excellent solubility of each component and excellent coatability during the formation of the photosensitive resin film. Propylene glycol monomethyl ether acetate, N,N-dimethylformamide, N,N-dimethylacetamide.

（式中，R₄₁ ～R₄₃ 分別獨立地為碳數1～10的烷基。）In addition, as the (E) component, a compound represented by the following formula (21) can also be used. [化25]

(In the formula, R ₄₁ to R ₄₃ are each independently an alkyl group having 1 to 10 carbons.)

Examples of the alkyl group having 1 to 10 carbon atoms (preferably 1 to 3, more preferably 1 or 3) of R ₄₁ to R ₄₃ in formula (21) include methyl, ethyl, n-propyl, Isopropyl, n-butyl, tertiary butyl, pentyl, hexyl, heptyl, octyl, etc. The compound represented by formula (21) is preferably 3-methoxy-N,N-dimethylpropanamide (for example, the trade name "KJCMPA-100" (manufactured by KJ Chemicals (KJ Chemicals) Co., Ltd.) )).

(E) A component may be used individually by 1 type, and may combine 2 or more types. The content of the (E) component is not particularly limited, but in general, it is 50 parts by mass to 1000 parts by mass relative to 100 parts by mass of the (A) component.

From the viewpoint of accelerating the polymerization reaction, the photosensitive resin composition of the present invention may further contain (F) a thermal polymerization initiator (hereinafter, also referred to as "(F) component"). The component (F) is preferably a compound that does not decompose during heating (drying) to remove the solvent during film formation, but decomposes by heating during curing to generate free radicals, thereby promoting each component (B) , Or the polymerization reaction of (A) component and (B) component. (F) The component is preferably a compound having a decomposition point of 110°C or higher and 200°C or less, and from the viewpoint of accelerating the polymerization reaction at a lower temperature, a compound having a decomposition point of 110°C or higher and 175°C or lower is more preferable .

Specific examples include: ketone peroxide such as methyl ethyl ketone peroxide; 1,1-bis(third hexyl peroxide)-3,3,5-trimethylcyclohexane, 1,1-bis(the third Peroxy ketals such as trihexylperoxy) cyclohexane, 1,1-bis(tert-butylperoxy)cyclohexane; 1,1,3,3-tetramethylbutylhydroperoxide, Hydrogen peroxides such as olefin hydroperoxide and p-methane hydroperoxide; dialkyl peroxides such as dicumyl peroxide and di-tertiary butyl peroxide; dilaurolyl peroxide, diphenylmethyl Diacyl peroxide such as acyl peroxide; Peroxy dicarbonate such as bis(4-tertiary butylcyclohexyl) peroxydicarbonate and bis(2-ethylhexyl)peroxydicarbonate; Tertiary butylperoxy-2-ethylhexanoate, tertiary hexylperoxy isopropyl monocarbonate, tertiary butylperoxybenzoate, 1,1,3,3-tetramethylbutyl Peroxy esters such as phenylperoxy-2-ethylhexanoate, bis(1-phenyl-1-methylethyl) peroxide, etc. As a commercially available product, trade names "Percumyl D", "Percumyl P", "Percumyl H" (the above are manufactured by NOF Corporation) and the like can be cited.

When the component (F) is contained, the content of the component (F) is preferably 0.1 to 20 parts by mass relative to 100 parts by mass of the component (A). In order to ensure good flux resistance, it is more preferably 0.2 Parts by mass to 20 parts by mass, and from the viewpoint of suppressing the decrease in solubility due to decomposition during drying, it is more preferably 0.3 parts by mass to 10 parts by mass.

The photosensitive resin composition of the present invention may further contain a coupling agent (adhesive agent), a surfactant or leveling agent, a rust inhibitor, a crosslinking agent other than the (B) component, a sensitizer, a polymerization inhibitor, and the like.

Generally, the coupling agent reacts with the component (A) in the heat treatment after development to be crosslinked, or the coupling agent itself is polymerized in the step of performing the heat treatment. Thereby, the adhesiveness of the obtained cured product and the substrate can be further improved.

（式（13）中，R₃₁ 及R₃₂ 分別獨立地為碳數1～5的烷基。a為1～10的整數，b為1～3的整數。）As a preferable silane coupling agent, a compound having a urea bond (-NH-CO-NH-) can be cited. With this, even when curing is performed at a low temperature of 200° C. or less, the adhesion to the substrate can be further improved. In order to make it excellent in the development of adhesiveness at the time of hardening at low temperature, it is more preferable that it is a compound represented by following formula (13). [化26]

(In formula (13), R ₃₁ and R ₃₂ are each independently an alkyl group having 1 to 5 carbons. a is an integer of 1 to 10, and b is an integer of 1 to 3.)

As specific examples of the compound represented by the formula (13), ureidomethyltrimethoxysilane, ureidomethyltriethoxysilane, 2-ureaethyltrimethoxysilane, 2-ureaethyltriethyl Oxysilane, 3-ureapropyltrimethoxysilane, 3-ureapropyltriethoxysilane, 4-ureabutyltrimethoxysilane, 4-ureabutyltriethoxysilane, etc., preferably 3-Ureapropyltriethoxysilane.

As the silane coupling agent, a silane coupling agent having a hydroxyl group or a glycidyl group can also be used. If a silane coupling agent having a hydroxyl group or a glycidyl group is used in combination with a silane coupling agent having a urea bond in the molecule, the adhesion of the cured product to the substrate during low-temperature curing can be further improved. As the silane coupling agent having a hydroxyl group or a glycidyl group, methyl phenyl silane diol, ethyl phenyl silane diol, n-propyl phenyl silane diol, isopropyl phenyl silane diol, normal Butyl phenyl silane diol, isobutyl phenyl silane diol, tert-butyl phenyl silane diol, diphenyl silane diol, ethyl methyl phenyl silanol, n-propyl methyl phenyl Silanol, isopropyl methyl phenyl silanol, n-butyl methyl phenyl silanol, isobutyl methyl phenyl silanol, tertiary butyl methyl phenyl silanol, ethyl n-propyl phenyl silanol, ethyl Isopropyl phenyl silanol, n-butyl ethyl phenyl silanol, isobutyl ethyl phenyl silanol, tertiary butyl ethyl phenyl silanol, methyl diphenyl silanol, ethyl two Phenyl silanol, n-propyl diphenyl silanol, isopropyl diphenyl silanol, n-butyl diphenyl silanol, isobutyl diphenyl silanol, tertiary butyl diphenyl silanol , Phenylsilantriol, 1,4-bis(trihydroxysilyl)benzene, 1,4-bis(methyldihydroxysilyl)benzene, 1,4-bis(ethyldihydroxysilyl)benzene, 1,4-bis(propyldihydroxysilyl)benzene, 1,4-bis(butyldihydroxysilyl)benzene, 1,4-bis(dimethylhydroxysilyl)benzene, 1,4-bis (Diethylhydroxysilyl)benzene, 1,4-bis(dipropylhydroxysilyl)benzene, 1,4-bis(dibutylhydroxysilyl)benzene, and represented by the following formula (14) The compound and so on. Among them, in order to further improve adhesion to the substrate, the compound represented by formula (14) is preferred.

（式（14）中，R₃₃ 為具有羥基或縮水甘油基的一價有機基，R₃₄ 及R₃₅ 分別獨立地為碳數1～5的烷基。c為1～10的整數，d為1～3的整數。）[化27]

(In formula (14), R ₃₃ is a monovalent organic group having a hydroxyl group or a glycidyl group, and R ₃₄ and R ₃₅ are each independently an alkyl group having 1 to 5 carbons. c is an integer of 1 to 10, and d is An integer from 1 to 3.)

Examples of the compound represented by formula (14) include: hydroxymethyltrimethoxysilane, hydroxymethyltriethoxysilane, 2-hydroxyethyltrimethoxysilane, and 2-hydroxyethyltriethoxy Silane, 3-hydroxypropyltrimethoxysilane, 3-hydroxypropyltriethoxysilane, 4-hydroxybutyltrimethoxysilane, 4-hydroxybutyltriethoxysilane, glycidoxymethyl Trimethoxysilane, glycidoxymethyltriethoxysilane, 2-glycidoxyethyltrimethoxysilane, 2-glycidoxyethyltriethoxysilane, 3-glycidoxysilane Propyl trimethoxy silane, 3-glycidoxy propyl triethoxy silane, 4-glycidoxy butyl trimethoxy silane, 4-glycidoxy butyl triethoxy silane, etc.

The silane coupling agent having a hydroxyl group or a glycidyl group preferably further contains a group having a nitrogen atom, and is preferably a silane coupling agent further having an amine group or an amide bond. As a silane coupling agent with more amino groups, bis(2-hydroxymethyl)-3-aminopropyltriethoxysilane, bis(2-hydroxymethyl)-3-aminopropyltrimethyl Oxysilane, bis(2-glycidoxymethyl)-3-aminopropyltriethoxysilane, bis(2-hydroxymethyl)-3-aminopropyltrimethoxysilane, etc.

As a silane coupling agent with a more amido bond, R ₃₆ -(CH ₂ ) _e -CO-NH-(CH ₂ ) _f -Si(OR ₃₇ ) ₃ (R ₃₆ is a hydroxyl group or a glycidyl group, e And f are each independently an integer of 1 to 3, and R ₃₇ is a compound represented by methyl, ethyl, or propyl).

The silane coupling agent can be used alone or in combination of two or more.

In the case of using a silane coupling agent, relative to 100 parts by mass of the component (A), the content of the silane coupling agent is preferably 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass, and even more preferably 1 Parts by mass ~ 10 parts by mass.

By including a surfactant or a leveling agent, coating properties (for example, suppression of striation (uneven film thickness)) and developability can be improved.

As the surfactant or leveling agent, for example, polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octyl phenol ether, etc. can be cited. Commercially available products are available. List the trade names "Megafac F171", "Megafac F173", "Megafac R-08" (above, manufactured by DIC Co., Ltd.); trade names "Flo "Fluorad FC430", "Fluorad FC431" (above, manufactured by Sumitomo 3M Co., Ltd.); trade names "organic siloxane polymer (organic siloxane polymer) KP341", "KBM303", "KBM403 ", "KBM803" (above, manufactured by Shin-Etsu Chemical Co., Ltd.), etc.

Surfactant and leveling agent may be used alone or in combination of two or more.

When a surfactant or leveling agent is included, the content of the surfactant or leveling agent is preferably 0.01 parts by mass to 10 parts by mass, and more preferably 0.05 parts by mass to 100 parts by mass of component (A). 5 parts by mass, more preferably 0.05 to 3 parts by mass.

By including rust inhibitor, it can inhibit the corrosion of copper and copper alloy or prevent discoloration. As a rust inhibitor, a triazole derivative, a tetrazole derivative, etc. are mentioned, for example. Examples of rust inhibitors include 5-aminotetrazole (for example, 5-amino-1H-tetrazole), benzotriazole, 1-hydroxybenzotriazole, and 1H-benzotriazole-1-acetonitrile , Benzotriazole-5-carboxylic acid, 1H-benzotriazole-1-methanol, carboxybenzotriazole, mercaptobenzotriazole, etc. Among these, 5-aminotetrazole, benzotriazole or 1-hydroxybenzotriazole is preferable. The rust inhibitor can be used alone or in combination of two or more.

In the case of using a rust inhibitor, relative to 100 parts by mass of component (A), the content of the rust inhibitor is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, and still more preferably 0.5 Parts by mass ~ 3 parts by mass.

By including a crosslinking agent other than the component (B), it is possible to flexibly adjust the photosensitivity, the characteristics of the cured product, etc., and in particular, the characteristics of the cured product can be greatly changed.

Examples of crosslinking agents other than component (B) include diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol diacrylate, and triethylene glycol diacrylate. Ethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,4-butanediol dimethyl Base acrylate, 1,6-hexanediol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, trimethylolpropane dimethacrylate, trimethylol Propane trimethacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, Tetramethylolmethane tetraacrylate, tetramethylolmethane tetramethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, ethoxylated pentaerythritol tetraacrylate, ethoxylated heterotrimerization Cyanate triacrylate, ethoxylated isocyanuric acid trimethacrylate, isocyanuric acid acryloxy ethyl ester, isocyanuric acid methacryloxy ethyl ester, etc.

(B) A crosslinking agent other than a component may be used individually by 1 type, and may combine 2 or more types.

When a crosslinking agent other than the (B) component is included, the content of the crosslinking agent other than the (B) component is preferably 0.01 to 20 parts by mass relative to 100 parts by mass of the (A) component, and more preferably 0.05 to 15 parts by mass, more preferably 1 to 12 parts by mass.

As the sensitizer, Michele ketone, benzoin, 2-methylbenzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin butyl ether, 2-tert-butylanthraquinone, 1,2- Benzo-9,10-anthraquinone, anthraquinone, methylanthraquinone, 4,4'-bis-(diethylamino)benzophenone, acetophenone, benzophenone, thioxanthone , 1,5-acenaphthylene, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-[4-(methylthio)phenyl] -2-morpholinyl-1-acetone, diacetyl benzyl, benzyl dimethyl ketal, benzyl diethyl ketal, diphenyl disulfide, anthracene, phenanthrenequinone, nuclear Riboflavin tetrabutyrate, acridine orange, erythrosine, phenanthrenequinone, 2-isopropylthioxanthone, 2,6-bis(p-diethylamine) 4-methyl-4-azacyclohexanone, 6-bis(p-dimethylaminobenzylidene)-cyclopentanone, 2,6-bis(p-diethyl) Aminobenzylidene)-4-phenylcyclohexanone, aminostyryl ketone, 3-coumarin ketone compound, dicoumarin compound, N-phenylglycine, N-phenyl two Ethanolamine, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, a compound represented by the following formula, and the like. [化28]

A sensitizer may be used individually by 1 type, and may use 2 or more types together.

In the case of containing a sensitizer, the blending amount of the sensitizer is preferably 0.1 to 1.5 parts by mass, more preferably 0.2 to 1.2 parts by mass relative to 100 parts by mass of the (A) component.

By containing a polymerization inhibitor, good storage stability can be ensured. Examples of the polymerization inhibitor include radical polymerization inhibitors, radical polymerization inhibitors, and the like.

Examples of polymerization inhibitors include: 1,4,4-trimethyl-2,3-diazabicyclo[3.2.2]-non-2-ene-2,3-dioxide, p-methoxy Phenol, diphenyl-p-benzoquinone, benzoquinone, hydroquinone, pyrogallol, phenothiazine, resorcinol, o-dinitrobenzene, p-dinitrobenzene, meta-dinitrobenzene Nitrobenzene, phenanthrenequinone, N-phenyl-2-naphthylamine, cupferron (cupferron), 2,5-toluquinone (2,5-toluquinone), tannic acid, p-benzylaminophenol , Nitrosoamines, etc.

The polymerization inhibitor may be used alone or in combination of two or more.

When a polymerization inhibitor is contained, the content of the polymerization inhibitor is relative to 100 parts by mass of the component (A) in terms of the storage stability of the photosensitive resin composition and the heat resistance of the cured product obtained. It is preferably 0.01 parts by mass to 30 parts by mass, more preferably 0.01 parts by mass to 10 parts by mass, and still more preferably 0.05 parts by mass to 5 parts by mass.

The photosensitive resin composition of the present invention essentially contains (A) component to (E) component, and optional (F) component, coupling agent, surfactant, leveling agent, rust inhibitor, and other than (B) component The crosslinking agent, sensitizer, and polymerization inhibitor may contain other unavoidable impurities within a range that does not impair the effects of the present invention. The photosensitive resin composition of the present invention may contain, for example, 80% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, or 100% by mass (A) component ~ (E) component, (A) component ~ (F) component, or (A) component ~ (E) component, and optional (F) component, coupling agent, surfactant, leveling agent, rust inhibitor, crosslinking agent, sensitizer and polymerization inhibitor other than (B) component .

The cured product of the present invention can be obtained by curing the photosensitive resin composition. The cured product of the present invention can be used as a patterned cured product or as a non-patterned cured product. The film thickness of the cured product of the present invention is preferably 5 μm to 20 μm.

In the method for producing a patterned cured product of the present invention, the method includes: coating the photosensitive resin composition on a substrate and drying to form a photosensitive resin film; and pattern exposure of the photosensitive resin film to obtain a resin A step of filming; a step of developing a resin film after pattern exposure using an organic solvent to obtain a patterned resin film; and a step of heating the patterned resin film. Thereby, a pattern hardened product can be obtained.

The method of manufacturing a non-patterned cured product includes, for example, a step of forming the photosensitive resin film and a step of performing heat treatment. Furthermore, the step of exposing may be included.

Examples of the substrate include glass substrates; semiconductor substrates such as Si substrates (silicon wafers); metal oxide insulator substrates such as TiO ₂ substrates and SiO ₂ substrates; silicon nitride substrates; copper substrates; copper alloy substrates.

The coating method is not particularly limited, and it can be performed using a spinner or the like.

Drying can be performed using a hot plate, oven, etc. The drying temperature is preferably 90°C to 150°C, and more preferably 90°C to 120°C from the viewpoint of ensuring dissolution contrast. The drying time is preferably 30 seconds to 5 minutes. Drying can also be carried out more than twice. Thereby, a photosensitive resin film obtained by forming the photosensitive resin composition into a film shape can be obtained.

The thickness of the photosensitive resin film is preferably 5 μm to 100 μm, more preferably 6 μm to 50 μm, and still more preferably 7 μm to 30 μm.

Regarding pattern exposure, for example, exposure is performed in a predetermined pattern through a photomask. The actinic rays to be irradiated include ultraviolet rays such as i-rays and h-rays, visible rays, and radiation rays, and i-rays are preferred. As the exposure device, a parallel exposure machine, a projection exposure machine, a stepper, a scanning exposure machine, etc. can be used.

By performing development, a patterned resin film (patterned resin film) can be obtained. When using a negative photosensitive resin composition, the unexposed part is usually removed with a developing solution. As the organic solvent used as the developer, a good solvent for the photosensitive resin film may be used alone, or a good solvent and a poor solvent may be appropriately mixed and used as the developer. Examples of good solvents include: N-methyl-2-pyrrolidone, N-acetyl-2-pyrrolidone, N,N-dimethylacetamide, and N,N-dimethylformamide Amine, dimethyl sulfide, γ-butyrolactone, α-acetyl-γ-butyrolactone, cyclopentanone, cyclohexanone, etc. Examples of poor solvents include toluene, xylene, methanol, ethanol, isopropanol, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, and water.

Surfactants can also be added to the developer. The addition amount is preferably 0.01 parts by mass to 10 parts by mass, and more preferably 0.1 parts by mass to 5 parts by mass relative to 100 parts by mass of the developer.

The development time can be set to twice the time until the photosensitive resin film is immersed and completely dissolved, for example. The development time also varies depending on the component (A) used, but is preferably 10 seconds to 15 minutes, more preferably 10 seconds to 5 minutes, and further preferably 20 seconds to 5 minutes from the viewpoint of productivity.

After developing, it can also be cleaned by rinsing liquid. As the eluent, distilled water, methanol, ethanol, isopropanol, toluene, xylene, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, etc. can be used alone or in a suitable mixture. In addition, they can also be used in combination in stages. .

By heating the patterned resin film, a patterned cured product can be obtained. The polyimide precursor of component (A) can cause a dehydration ring-closure reaction through a heat treatment step, and usually becomes the corresponding polyimide.

The temperature of the heat treatment is preferably 250°C or lower, more preferably 120°C to 250°C, and still more preferably 200°C or lower or 160°C to 200°C. By being within the above range, damage to the substrate or the device can be suppressed to be small, the device can be produced with a good yield, and the energy saving of the manufacturing process can be realized.

The heat treatment time is preferably 5 hours or less, more preferably 30 minutes to 3 hours. By being within the above-mentioned range, the crosslinking reaction or the dehydration ring-closing reaction can sufficiently proceed. The environment for the heat treatment may be in the atmosphere or in an inert environment such as nitrogen. From the viewpoint of preventing oxidation of the patterned resin film, the environment is preferably under a nitrogen atmosphere.

Examples of devices used in the heat treatment include quartz tube furnaces, heating plates, rapid annealing furnaces, vertical diffusion furnaces, infrared curing furnaces, electron beam curing furnaces, microwave curing furnaces, and the like.

The cured product of the present invention can be used as a passivation film, a buffer coating film, an interlayer insulating film, a cover coating, a surface protection film, and the like. Using one or more selected from the group consisting of the passivation film, buffer coating film, interlayer insulating film, cover coating, and surface protection film, etc., it is possible to manufacture highly reliable semiconductor devices, multilayer wiring boards, and various electronic devices , Laminated devices (multi-chip fan-out wafer level packaging, etc.) and other electronic components.

An example of the manufacturing process of the semiconductor device as the electronic component of the present invention will be described with reference to the drawings. 1 is a manufacturing process diagram of a semiconductor device with a multilayer wiring structure as an electronic component according to an embodiment of the present invention. In FIG. 1, a semiconductor substrate 1 such as a Si substrate with circuit elements is covered with a protective film 2 such as a silicon oxide film except for predetermined portions of the circuit elements, and a first conductor layer 3 is formed on the exposed circuit elements. Thereafter, an interlayer insulating film 4 is formed on the semiconductor substrate 1.

Next, a photosensitive resin layer 5 of chlorinated rubber type, phenol novolac type, etc. is formed on the interlayer insulating film 4, and it is placed in such a way that a predetermined portion of the interlayer insulating film 4 is exposed by a known photo etching technique Window 6A.

The interlayer insulating film 4 exposed in the window 6A is selectively etched, thereby providing the window 6B. Then, the photosensitive resin layer 5 is completely removed using an etching solution that does not corrode the first conductor layer 3 exposed from the window 6B and only corrodes the photosensitive resin layer 5.

Furthermore, using a known photo etching technique, the second conductor layer 7 is formed, and electrical connection with the first conductor layer 3 is made. In the case of forming a multilayer wiring structure of three or more layers, the above steps may be repeated to form each layer.

Next, using the photosensitive resin composition, the window 6C is opened by pattern exposure, and the surface protective film 8 is formed. The surface protection film 8 protects the second conductor layer 7 from external stress, alpha rays, etc., and the obtained semiconductor device has excellent reliability. Furthermore, in the above example, the photosensitive resin composition of the present invention can also be used to form an interlayer insulating film. [Example]

Hereinafter, the present invention will be described in more detail based on Examples and Comparative Examples. In addition, the present invention is not limited to the following examples.

Synthesis Example 1 (Synthesis of A1) Combine 7.07 g of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride (ODPA) with 4.12 g of 2,2'-dimethylbiphenyl-4,4'-diamine (DMAP ) Was dissolved in 30 g of N-methyl-2-pyrrolidone (NMP), stirred at 30°C for 4 hours, and thereafter, stirred at room temperature overnight to obtain polyamide acid. Under water cooling, 9.45 g of trifluoroacetic anhydride was added thereto, stirred at 45° C. for 3 hours, and 7.08 g of 2-hydroxyethyl methacrylate (HEMA) was added. The reaction liquid was added dropwise to distilled water, the precipitate was filtered, separated and collected, and dried under reduced pressure, thereby obtaining a polyimide precursor A1. Under the following conditions, the gel permeation chromatography (Gel Permeation Chromatograph, GPC) method is used, and the number average molecular weight is calculated by standard polystyrene conversion. The number average molecular weight of A1 is 40,000.

The measurement was performed using a solution of 1 mL of solvent [tetrahydrofuran (THF)/dimethylformamide (DMF)=1/1 (volume ratio)] relative to 0.5 mg of A1.

Measurement device: Detector L4000UV manufactured by Hitachi, Ltd. Pump: L6000 manufactured by Hitachi, Ltd. C-R4A Chromatopac manufactured by Shimadzu, Ltd. Measurement conditions: Column Gelpack GL-S300MDT-5×2 elution Liquid: THF/DMF=1/1 (volume ratio) LiBr (0.03 mol/L), H ₃ PO ₄ (0.06 mol/L) Flow rate: 1.0 mL/min, detector: UV 270 nm

In addition, under the following conditions, nuclear magnetic resonance (Nuclear Magnetic Resonance, NMR) measurement was performed to calculate the esterification rate of A1 (the reaction rate of the carboxyl group of ODPA with HEMA). The esterification rate is 80 mol% (the remaining 20 mol% are carboxyl groups) with respect to all the carboxyl groups of the polyamide acid.

Measuring equipment: AV400M manufactured by Bruker BioSpin Magnetic field strength: 400 MHz Reference substance: tetramethylsilane (TMS) Solvent: dimethyl sulfoxide (DMSO)

Example 1 to Example 9 and Comparative Example 1 to Comparative Example 3 (Preparation of photosensitive resin composition) The photosensitive resin compositions of Examples 1 to 9 and Comparative Examples 1 to 3 were prepared in accordance with the components and blending amounts shown in Tables 1 and 2. The compounding amounts in Table 1 and Table 2 are parts by mass of each component relative to 100 parts by mass of A1.

The components used are as follows. As the (A) component, A1 obtained in Synthesis Example 1 was used.

(B) Component: Polymerizable monomer with aliphatic cyclic skeleton B1: A-DCP (manufactured by Shinnakamura Chemical Industry Co., Ltd., tricyclodecane dimethanol diacrylate, compound represented by the following formula B1 ) [化29]

(C) Component: photopolymerization initiator C1: IRGACURE OXE 02 (manufactured by BASF Japan Co., Ltd., ethyl ketone, 1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazole -3-yl]-,1-(O-acetyloxime)) C2: G-1820 (PDO) (manufactured by Lambson Co., Ltd., 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime)

(D) Ingredients D1: 9,10 dibutoxyanthracene (manufactured by Kawasaki Chemical Industry Co., Ltd.)

(E) Component: solvent E1: N-methyl-2-pyrrolidone E2: KJCMPA-100 (manufactured by KJ Chemicals Co., Ltd., a compound represented by the following formula E2) [Chemical Formula 30]

(F) Component: Thermal polymerization initiator F1: Percumyl D (manufactured by NOF Corporation, bis(1-phenyl-1-methylethyl) peroxide, represented by the following formula Represented compound) [化31]

(B) Crosslinking agent ATM-4E other than components: ethoxylated pentaerythritol tetraacrylate (manufactured by Shinnakamura Chemical Industry Co., Ltd., compound represented by the following formula (n11+n12+n13+n14 is 4) ) [化32]

Sensitizer BCIM: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (Hampford Research (Hampford Research) company manufacture, by the following The compound represented by the formula) [Chemical Formula 33]

Leucochrome LCV: Leucocrystal Violet (manufactured by Yamada Chemical Industry Co., Ltd., a compound represented by the following formula) [Chemical 34]

EMK: 4,4'-bis(diethylamino)benzophenone

Polymerization inhibitor Tobin (Taobn): 1,4,4-trimethyl-2,3-diazabicyclo[3.2.2]-non-2-ene-2,3-dioxide (Hemford Research ( Hampford Research)

Rust inhibitor 5Atz: 5-amino-1H-tetrazole (manufactured by Tokyo Chemical Industry Co., Ltd.)

Adjuvant UCT-801: 3-Ureapropyltriethoxysilane (manufactured by United Chemical Technologies)

(Measurement of residual film rate after development 1) Using the coating device Act8 (manufactured by Tokyo Electronics Co., Ltd.), the obtained photosensitive resin composition was spin-coated on a silicon wafer and dried at 100°C for 2 minutes , Dried at 110°C for 2 minutes to form a photosensitive resin film with a dry film thickness of 7 μm to 15 μm. The development time was twice the time until the obtained photosensitive resin film was immersed in cyclopentanone and completely dissolved. In addition, a photosensitive resin film was produced in the same manner as above, and the obtained photosensitive resin film was irradiated with an i-ray stepper FPA-3000iW (manufactured by Canon (Canon) Co., Ltd.) at 200 mJ/cm ² Ray for exposure. Using Act8, the exposed resin film was developed in cyclopentanone for the above-mentioned development time, and then rinsed with propylene glycol monomethyl ether acetate (PGMEA) to obtain a resin film. Regarding the film thickness after heating on a hot plate at 110°C for 2 minutes and the film thickness after development, the silicon wafer is exposed by scribing a part of the film, using a contact-pin profiler Dektak 150 (Manufactured by Bruker) The height from the surface of the exposed silicon wafer to the surface of the film is measured (the measurement of the film thickness is the same in the following). The film thickness after development of 10 μm was divided by the film thickness after heating on a hot plate at 110° C. for 2 minutes, and the percentage was used to determine the residual film rate after development. A case where the residual film rate after development is 55% to 100% is referred to as A, a case where 40% or more and less than 55% is referred to as B, and a case where 0% or more and less than 40% is referred to as C. The results are shown in Table 1 and Table 2.

(Production of hardened material 1) Regarding Examples 1 to 9, a vertical diffusion furnace μ-TF (manufactured by Koyo Thermo Systems Co., Ltd.) was used to measure the residual film rate after development at 175°C in a nitrogen atmosphere. The obtained resin film is heated for 1 hour to obtain a cured product (the film thickness after curing is 7 μm to 10 μm). Regarding Examples 1 to 9, good cured products were obtained.

(Measurement of residual film rate after development 2) Using the coating device Act8, the photosensitive resin composition was spin-coated on a silicon wafer, dried at 100°C for 2 minutes, and then dried at 110°C for 2 minutes. A photosensitive resin film with a dry film thickness of 7 μm to 15 μm is formed. The development time was twice the time until the obtained photosensitive resin film was immersed in cyclopentanone and completely dissolved. In addition, a photosensitive resin film was produced in the same manner as above, and for the obtained photosensitive resin film, an h-ray bandpass filter pair mask aligner MA-8 (manufactured by SUSS MicroTec) was used. ) Exposure is performed by irradiating h-rays of 200 mJ/cm ² . Using Act8, the exposed resin film was developed in cyclopentanone for the above-mentioned development time, and then rinsed and cleaned with PGMEA to obtain a resin film. The film thickness after heating on a hot plate at 110° C. for 2 minutes and the film thickness after development were measured in the same manner as the measurement 1 of the residual film rate after development. The film thickness after development of 10 μm was divided by the film thickness after heating on a hot plate at 110° C. for 2 minutes, and the percentage was used to determine the residual film rate after development. A case where the residual film rate after development is 55% to 100% is referred to as A, a case where 40% or more and less than 55% is referred to as B, and a case where 0% or more and less than 40% is referred to as C. The results are shown in Table 1 and Table 2.

(Manufacturing of hardened material 2) Regarding Examples 1 to 9, the resin film obtained in the measurement of residual film rate after development 2 was heated for 1 hour at 175°C in a nitrogen atmosphere using a vertical diffusion furnace μ-TF to obtain a cured product (after curing) The film thickness is 7 μm～10 μm). Regarding Examples 1 to 9, good cured products were obtained.

(Pattern evaluation) Using the coating device Act8, the photosensitive resin composition was spin-coated on a silicon wafer, dried at 100°C for 2 minutes, and then dried at 110°C for 2 minutes to form a dry film thickness of 7 μm-15 μm photosensitive resin film. The development time was twice the time until the obtained photosensitive resin film was immersed in cyclopentanone and completely dissolved. In addition, a photosensitive resin film was produced in the same manner as above, and for the obtained photosensitive resin film, an h-ray bandpass filter pair mask aligner MA-8 (manufactured by SUSS MicroTec) was used. ) Exposure is performed by irradiating 500 mJ/cm ² of h-rays in a predetermined pattern (10 μm line and space pattern). Using Act8, the exposed resin film was developed in cyclopentanone with a coating solution for the development time, and then rinsed and cleaned with PGMEA to obtain a patterned resin film. The obtained patterned resin film was observed with an optical microscope, and the case where there was no peeling in the line pattern was designated as A, the case where even one of the line patterns was peeled was designated as B, and the case where patterning was impossible was designated as C. The results are shown in Table 1 and Table 2.

(Manufacturing of hardened patterns) The obtained resin film was heated at 175°C for 1 hour in a vertical diffusion furnace μ-TF in a nitrogen atmosphere to obtain a patterned cured product (the film thickness after curing was 10 μm). Regarding Examples 1 to 9, good cured products were obtained.

[Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 (A) Ingredient A1 100 100 100 100 100 100 100 100 100 (B) Ingredients B1 25 25 25 25 25 25 25 25 25 (C) Ingredients C1 - - - 0.1 0.1 - - 2 2 C2 6 9 12 5 5 6 9 - - (D) Ingredients D1 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 (E) Ingredients E1 165 165 165 160 - 165 165 165 165 E2 - - - - 160 - - - - (F) Ingredients F1 2 2 2 2 2 2 2 2 2 (B) Crosslinking agent other than components ATM-4E 10 10 10 10 10 10 10 10 10 Sensitizer BCIM - - - - - - - - - Leucochrome LCV - - - - - 0.5 0.5 - - EMK 0.5 0.5 0.5 0.4 0.4 0.5 0.5 0.5 - Polymerization inhibitor Taobn 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 Rust inhibitor 5Atz 2 2 2 2 2 2 2 2 2 Adjuvant UCT-801 3 3 3 3 3 3 3 3 3 Residual film rate after development 1 A A A A A A A A A Residual film rate after development 2 A A A A A A A A A Patterned evaluation A A A A A A A A A

[Table 2] Comparative example 1 Comparative example 2 Comparative example 3 (A) Ingredient A1 100 100 100 (B) Ingredients B1 25 25 25 (C) Ingredients C1 0.2 - - C2 5 - 9 (D) Ingredients D1 - 0.7 - (E) Ingredients E1 160 165 165 E2 - - - (F) Ingredients F1 2 2 2 (B) Crosslinking agent other than components ATM-4E 10 10 10 Sensitizer BCIM - 3.5 - Leucochrome LCV - - - EMK 0.4 - 0.5 Polymerization inhibitor Taobn 0.3 0.3 0.3 Rust inhibitor 5Atz 2 2 2 Adjuvant UCT-801 3 3 3 Residual film rate after development 1 A C A Residual film rate after development 2 C C B Patterned evaluation B C A [Industrial availability]

The photosensitive resin composition of the present invention can be used for interlayer insulating films, cover coats, or surface protective films, and the interlayer insulating film, cover coats, or surface protective films of the present invention can be used for electronic parts and the like.

In the foregoing, several embodiments and/or embodiments of the present invention have been described in detail, but those skilled in the art can easily use these exemplary embodiments and embodiments without substantially departing from the novel teachings and effects of the present invention. / Or the embodiment is subject to various changes. Therefore, these various changes are included in the scope of the present invention. The documents described in this specification and the entire contents of the application which became the basis of the priority of this application based on the Paris Treaty are cited.

1: Semiconductor substrate 2: Protective film 3: The first conductor layer 4: Interlayer insulating film 5: Photosensitive resin layer 6A, 6B, 6C: window 7: The second conductor layer 8: Surface protective film

Fig. 1 is a manufacturing process diagram of an electronic component according to an embodiment of the present invention.

Claims (17)

A photosensitive resin composition containing: (A) Polyimide precursors with polymerizable unsaturated bonds; (B) Polymerizable monomer with aliphatic cyclic skeleton; (C) Photopolymerization initiator; (D) Compounds containing an anthracene structure; and (E) Solvent. The photosensitive resin composition described in claim 1, wherein the component (A) is a polyimide precursor having a structural unit represented by the following formula (1),

(In formula (1), X ₁ is a tetravalent group with more than one aromatic group, the -COOR ₁ group and the -CONH- group are in the ortho position with each other, and the -COOR ₂ group and the -CO- group are in the ortho position with each other; Y ₁ is a divalent aromatic group; R ₁ and R ₂ are each independently a hydrogen atom, a group represented by the following formula (2), or an aliphatic hydrocarbon group having 1 to 4 carbons, and R ₁ and R ₂ At least one of is the base represented by the formula (2);

In formula (2), R ₃ to R ₅ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and m is an integer of 1 to 10). The photosensitive resin composition according to claim 1 or 2, wherein the component (B) contains a polymerizable monomer, and the polymerizable monomer has a group containing a polymerizable unsaturated double bond And has an aliphatic cyclic skeleton. The photosensitive resin composition according to claim 3, wherein the component (B) is a polymerizable monomer, and the polymerizable monomer has two or more groups containing polymerizable unsaturated double bonds And has an aliphatic cyclic skeleton. The photosensitive resin composition according to any one of items 1 to 3 in the scope of patent application, wherein the component (B) contains a polymerizable monomer represented by the following formula (3),

(In formula (3), R ₆ and R ₇ are each independently an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a group represented by the following formula (4); n1 is 0 or 1, and n2 is 0 to 2 Integer, n1+n2 is 1 or more; at least one of n1 R ₆ and n 2 R ₇ is a group represented by the following formula (4);

In formula (4), R ₉ to R ₁₁ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and l is an integer of 0 to 10). The photosensitive resin composition described in item 5 of the scope of patent application, wherein n1+n2 is 2 or 3. The photosensitive resin composition according to any one of the claims 1 to 6, wherein the component (B) contains a polymerizable monomer represented by the following formula (5),

. The photosensitive resin composition according to any one of claims 1 to 7, wherein the component (D) contains a compound represented by the following formula (31),

(In formula (31), R _{61 is} each independently an alkyl group having 1 to 10 carbons, an alkoxy group having 1 to 10 carbons, an aryl group having 6 to 18 carbons, and a heteroaryl group having 5 to 18 atoms. , Or a halogen atom, n10 is an integer of 0-8). The photosensitive resin composition according to any one of items 1 to 7 in the scope of patent application, wherein the component (D) is selected from dibutoxyanthracene, dimethoxyanthracene, diethoxy One or more types of anthracene and diethoxyethylanthracene. The photosensitive resin composition according to any one of items 1 to 9 of the scope of patent application, which further contains (F) a thermal polymerization initiator. The photosensitive resin composition according to any one of items 1 to 10 of the scope of patent application is used for panel-level packaging. A method for manufacturing a patterned hardened object includes: The step of coating the photosensitive resin composition as described in any one of items 1 to 11 in the scope of the patent application on a substrate and drying to form a photosensitive resin film; A step of patterning the photosensitive resin film to obtain a resin film; The step of developing the resin film after the pattern exposure using an organic solvent to obtain a pattern resin film; and The step of heating the patterned resin film. The method for manufacturing a patterned hardened product as described in item 12 of the scope of patent application, wherein the temperature of the heat treatment is 200°C or less. A cured product obtained by curing the photosensitive resin composition as described in any one of items 1 to 11 in the scope of patent application. The cured product described in item 14 of the scope of patent application is a pattern cured product. An interlayer insulating film, a covering coating or a surface protection film, which is produced by using the hardened product as described in item 14 or item 15 of the scope of the patent application. An electronic component containing the interlayer insulating film, covering coating or surface protection film as described in item 16 of the scope of patent application.

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