TW202028862A - Photosensitive resin composition, method for producing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component - Google Patents

Abstract

This photosensitive resin composition contains (A) a polyimide precursor, (B) a polymerizable monomer, (C) a photopolymerization initiator, (D) an antirust agent, (E) an antioxidant, (F) a cyclization catalyst, and (G) a solvent.

Description

Photosensitive resin composition, manufacturing method of patterned cured product, cured product, interlayer insulating film, cover coat, surface protective film, and electronic parts

The present invention relates to a photosensitive resin composition, a method for producing a patterned cured product, a cured product, an interlayer insulating film, a cover coat, a surface protective film, and electronic parts.

Conventionally, polyimide or polybenzoxazole, which has excellent heat resistance, electrical properties, and mechanical properties, has been used for surface protection films and interlayer insulating films of semiconductor elements. In recent years, photosensitive resin compositions that impart photosensitive properties to these resins have been used. If this photosensitive resin composition is used, the manufacturing steps of the patterned cured product can be simplified and the complicated manufacturing steps can be shortened (for example, refer to Patent Document 1).

However, in recent years, the miniaturization of transistors that support computer performance has reached the limit of the scaling law. In order to further increase performance or speed, multilayer device structures in which semiconductor elements are stacked three-dimensionally have attracted attention.

In the multilayer device structure, Multi-die Fanout Wafer Level Packaging (Multi-die Fanout Wafer Level Packaging) is a package manufactured by sealing multiple dies in one package, which is similar to the fan-out wafer level previously proposed. The level of packaging (manufactured by sealing one die in one package) is expected to be lower cost and higher performance, so it has attracted attention.

In the production of multi-die fan-out wafer-level packaging, from the viewpoint of high-performance die protection or protection of low-heat-resistant sealing materials to improve yield, low-temperature curability is strongly required (for example, refer to Patent Literature 2).

In addition, as a resin composition or a photosensitive composition, a composition containing a polyimide precursor has been disclosed (for example, refer to Patent Document 3 and Patent Document 4). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2009-265520 [Patent Document 2] International Publication No. 2008/111470 [Patent Document 3] Japanese Patent Laid-Open No. 62-127840 [Patent Document 4] Japanese Patent Laid-Open No. 2016-199662

The object of the present invention is to provide a photosensitive resin composition, a method for producing a cured product of a pattern, and a cured product that can form a cured product with excellent insulation reliability, adhesiveness, and migration and excellent sensitivity even at a low temperature of 230°C or less , Interlayer insulation film, cover coating, surface protection film and electronic parts.

（式（1）中，X₁ 為具有一個以上的芳香族基的四價基，-COOR₁ 基與-CONH-基相互處於鄰位，-COOR₂ 基與-CO-基相互處於鄰位。Y₁ 為二價芳香族基。R₁ 及R₂ 分別獨立地為氫原子、由下述式（2）所表示的基、或碳數1～4的脂肪族烴基，且R₁ 及R₂ 的至少一者為由所述式（2）所表示的基。） [化2]

（式（2）中，R₃ ～R₅ 分別獨立地為氫原子或碳數1～3的脂肪族烴基，m為1～10的整數。） 4.如1至3中任一項所述的感光性樹脂組成物，其中所述（B）成分包含具有脂肪族環狀骨架的聚合性單體。 5.如1至4中任一項所述的感光性樹脂組成物，其中所述（B）成分具有包含聚合性的不飽和雙鍵的基。 6.如5所述的感光性樹脂組成物，其中所述（B）成分為具有兩個以上的包含聚合性的不飽和雙鍵的基的聚合性單體。 7.如1至5中任一項所述的感光性樹脂組成物，其中所述（B）成分包含由下述式（3）所表示的聚合性單體。 [化3]

（式（3）中，R₆ 及R₇ 分別獨立地為碳數1～4的脂肪族烴基或由下述式（4）所表示的基。n1為0或1，n2為0～2的整數，n1+n2為1以上。n1個R₆ 及n2個R₇ 的至少一個為由下述式（4）所表示的基。） [化4]

（式（4）中，R₉ ～R₁₁ 分別獨立地為氫原子或碳數1～3的脂肪族烴基，l為0～10的整數。） 8.如7所述的感光性樹脂組成物，其中n1+n2為2或3。 9.如1至8中任一項所述的感光性樹脂組成物，其中所述（B）成分包含由下述式（5）所表示的聚合性單體。 [化5]

10.如1至9中任一項所述的感光性樹脂組成物，其中所述（F）成分為選自由N-苯基二乙醇胺、N-甲基苯胺、N-乙基苯胺、N,N'-二甲基苯胺、N-苯基乙醇胺、4-苯基嗎啉及2,2'-(4-甲基苯基亞胺基)二乙醇所組成的群組中的一種以上。 11.如1至9中任一項所述的感光性樹脂組成物，其中所述（F）成分包含由下述式（17）所表示的化合物。 [化6]

（式（17）中，R_31A ～R_33A 分別獨立地為氫原子、一價脂肪族烴基、具有羥基的一價脂肪族烴基、或一價芳香族基，R_31A ～R_33A 的至少一個為一價芳香族基。R_31A ～R_33A 可藉由鄰接的基彼此形成環。） 12.如1至11中任一項所述的感光性樹脂組成物，其中更包含（H）熱聚合起始劑。 13.一種圖案硬化物的製造方法，包括： 將如1至12中任一項所述的感光性樹脂組成物塗佈於基板上並進行乾燥而形成感光性樹脂膜的步驟； 對所述感光性樹脂膜進行圖案曝光而獲得樹脂膜的步驟； 使用有機溶劑對所述圖案曝光後的樹脂膜進行顯影而獲得圖案樹脂膜的步驟；以及 對所述圖案樹脂膜進行加熱處理的步驟。 14.如13所述的圖案硬化物的製造方法，其中所述加熱處理的溫度為230℃以下。 15.一種硬化物，其為將如1至12中任一項所述的感光性樹脂組成物硬化而成。 16.如15所述的硬化物，其為圖案硬化物。 17.一種層間絕緣膜、覆蓋塗層或表面保護膜，其為使用如15或16所述的硬化物製作而成。 18.一種電子零件，其含有如17所述的層間絕緣膜、覆蓋塗層或表面保護膜。According to the present invention, the following photosensitive resin composition and the like are provided. 1. A photosensitive resin composition containing: (A) polyimide precursor; (B) polymerizable monomer; (C) photopolymerization initiator; (D) rust inhibitor; (E) antioxidant ; (F) cyclization catalyst; and (G) solvent. 2. The photosensitive resin composition according to 1, wherein the component (A) has a polymerizable unsaturated bond. 3. The photosensitive resin composition according to 1 or 2, wherein the component (A) is a polyimide precursor having a structural unit represented by the following formula (1). [化1]

(In formula (1), X ₁ is a tetravalent group having one or more aromatic groups, the -COOR ₁ group and the -CONH- group are in the ortho position to each other, and the -COOR ₂ group and the -CO- group are in the ortho position to each other. Y ₁ is a divalent aromatic group. R ₁ and R ₂ are each independently a hydrogen atom, a group represented by the following formula (2), or an aliphatic hydrocarbon group having 1 to 4 carbons, and R ₁ and R ₂ At least one of is the base represented by the formula (2).) [化2]

(In formula (2), R ₃ to R ₅ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and m is an integer of 1 to 10.) 4. As described in any one of 1 to 3 The photosensitive resin composition of wherein the component (B) contains a polymerizable monomer having an aliphatic cyclic skeleton. 5. The photosensitive resin composition according to any one of 1 to 4, wherein the component (B) has a group containing a polymerizable unsaturated double bond. 6. The photosensitive resin composition according to 5, wherein the component (B) is a polymerizable monomer having two or more groups containing a polymerizable unsaturated double bond. 7. The photosensitive resin composition according to any one of 1 to 5, wherein the (B) component contains a polymerizable monomer represented by the following formula (3). [化3]

(In formula (3), R ₆ and R ₇ are each independently an aliphatic hydrocarbon group having 1 to 4 carbons or a group represented by the following formula (4). n1 is 0 or 1, and n2 is 0 to 2 Integer, n1+n2 is 1 or more. At least one of n1 R ₆ and n 2 R ₇ is a group represented by the following formula (4).) [formation 4]

(In formula (4), R ₉ to R ₁₁ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and l is an integer of 0 to 10.) 8. The photosensitive resin composition according to 7 , Where n1+n2 is 2 or 3. 9. The photosensitive resin composition according to any one of 1 to 8, wherein the component (B) contains a polymerizable monomer represented by the following formula (5). [化5]

10. The photosensitive resin composition according to any one of 1 to 9, wherein the component (F) is selected from N-phenyldiethanolamine, N-methylaniline, N-ethylaniline, N, One or more of N'-dimethylaniline, N-phenylethanolamine, 4-phenylmorpholine, and 2,2'-(4-methylphenylimino)diethanol. 11. The photosensitive resin composition according to any one of 1 to 9, wherein the component (F) contains a compound represented by the following formula (17). [化6]

(In formula (17), R _31A to R _33A are each independently a hydrogen atom, a monovalent aliphatic hydrocarbon group, a monovalent aliphatic hydrocarbon group having a hydroxyl group, or a monovalent aromatic group, and at least one of R _31A to R _33A is A monovalent aromatic group. R _31A to R _33A may form a ring with each other by adjacent groups.) 12. The photosensitive resin composition according to any one of 1 to 11, further comprising (H) thermal polymerization Beginner. 13. A method for producing a patterned cured product, comprising: applying the photosensitive resin composition according to any one of 1 to 12 on a substrate and drying to form a photosensitive resin film; A step of pattern exposure of the resin film to obtain a resin film; a step of developing the resin film after the pattern exposure using an organic solvent to obtain a pattern resin film; and a step of heating the pattern resin film. 14. The method of manufacturing a patterned cured product according to 13, wherein the temperature of the heat treatment is 230°C or less. 15. A cured product obtained by curing the photosensitive resin composition according to any one of 1 to 12. 16. The cured product according to 15, which is a pattern cured product. 17. An interlayer insulating film, a cover coat or a surface protection film, which is produced by using the hardened product as described in 15 or 16. 18. An electronic component comprising the interlayer insulating film, cover coating or surface protection film as described in 17.

According to the present invention, it is possible to provide a photosensitive resin composition, a method for manufacturing a cured product, and a cured product that can form a cured product with excellent insulation reliability, adhesiveness, and migration and excellent sensitivity even at a low temperature of 230°C or less. , Interlayer insulation film, cover coating, surface protection film and electronic parts.

Hereinafter, embodiments of the photosensitive resin composition of the present invention, a patterned cured product using the same, a cured product, an interlayer insulating film, a cover coat, a surface protective film, and electronic parts will be described in detail. In addition, this invention is not limited by the following embodiment.

In this specification, the so-called "A or B" may include any one of A and B, and may include both. In addition, in this specification, the term "step" not only includes an independent step, but even when it cannot be clearly distinguished from other steps, it is included in this term as long as the desired effect of the step is achieved. The numerical range indicated by "～" means the range that includes the numerical values described before and after "～" as the minimum and maximum values, respectively. In addition, in this specification, regarding the content of each component in the composition, when there are multiple types of substances corresponding to each component in the composition, unless otherwise specified, it means the multiple types present in the composition. The total amount of the substance. Furthermore, as for the exemplified materials, unless otherwise specified, they may be used alone or in combination of two or more kinds. The "(meth)acryl group" in this specification means "acryl group" and "methacryl group".

The photosensitive resin composition of the present invention contains: (A) a polyimide precursor (hereinafter also referred to as "(A) component"); (B) a polymerizable monomer (hereinafter also referred to as "(B)) Ingredients"); (C) photopolymerization initiator (hereinafter, also referred to as "(C) component"); (D) rust inhibitor (hereinafter, also referred to as "(D) component"); (E) anti Oxidant (hereinafter, also referred to as "(E) component"); (F) cyclization catalyst (hereinafter, also referred to as "(F) component"); and (G) solvent (hereinafter, also referred to as "(G) )ingredient").

Thereby, even if it is cured at a low temperature of 230°C or less, a cured product with excellent insulation reliability, adhesiveness, and migration can be formed, and the sensitivity can be excellent. As an arbitrary effect, even when the wiring width is extremely small and is 2 μm or less, it is possible to form a cured product that can maintain excellent insulation and can suppress peeling from the electrode and Cu migration.

The photosensitive resin composition of the present invention is preferably a negative photosensitive resin composition. The photosensitive resin composition of the present invention is preferably a material for electronic parts.

The photosensitive resin composition of the present invention is preferably used for a fine Cu wiring pattern with a width of 2 μm and an interval of 2 μm. In addition, the photosensitive resin composition of the present invention is preferably used for wafer level packaging (WLP) with thousands of input and output pins (the current number of input and output pins is several hundred). In addition, the photosensitive resin composition of the present invention is preferably a device for collecting devices divided into two or more wafers into one wafer. In this way, a very space-saving, lightweight and high-functional package can be provided. In addition, the photosensitive resin composition of the present invention is preferably used in devices such as smart watches, smart glasses, smart contact lenses, and nano drones.

(A) The component is not particularly limited, but it is preferably polyimide that has high transmittance when i-rays are used as the light source for patterning and exhibits high cured properties even when cured at a low temperature of 230°C or less Precursor.

From the viewpoint of improving photosensitivity, the component (A) preferably has a polymerizable unsaturated bond. Examples of the polymerizable unsaturated bond include carbon-carbon double bonds.

(A) The component is preferably a polyimide precursor having a structural unit represented by the following formula (1). Thereby, the transmittance of i-rays is high, and even when it is cured at a low temperature of 230°C or less, a good cured product can be formed. The content of the structural unit represented by formula (1) is preferably 50 mol% or more, more preferably 80 mol% or more, and still more preferably 90 mol% or more with respect to all the structural units of the component (A). The upper limit is not particularly limited, and may be 100 mol%.

（式（1）中，X₁ 為具有一個以上的芳香族基的四價基，-COOR₁ 基與-CONH-基相互處於鄰位，-COOR₂ 基與-CO-基相互處於鄰位。Y₁ 為二價芳香族基。R₁ 及R₂ 分別獨立地為氫原子、由下述式（2）所表示的基、或碳數1～4的脂肪族烴基，且R₁ 及R₂ 的至少一者為由所述式（2）所表示的基。）[化7]

(In formula (1), X ₁ is a tetravalent group having one or more aromatic groups, the -COOR ₁ group and the -CONH- group are in the ortho position to each other, and the -COOR ₂ group and the -CO- group are in the ortho position to each other. Y ₁ is a divalent aromatic group. R ₁ and R ₂ are each independently a hydrogen atom, a group represented by the following formula (2), or an aliphatic hydrocarbon group having 1 to 4 carbons, and R ₁ and R ₂ At least one of is the base represented by the formula (2).)

（式（2）中，R₃ ～R₅ 分別獨立地為氫原子或碳數1～3的脂肪族烴基，m為1～10的整數（較佳為2～5的整數，更佳為2或3）。）[化8]

(In formula (2), R ₃ to R ₅ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and m is an integer of 1 to 10 (preferably an integer of 2 to 5, more preferably 2 Or 3).)

Among the tetravalent groups having one or more (preferably one to three, more preferably one or two) aromatic groups in X ₁ of formula (1), the aromatic group may be an aromatic hydrocarbon group or It is an aromatic heterocyclic group. Preferably it is an aromatic hydrocarbon group.

Examples of the aromatic hydrocarbon group of X ₁ in the formula (1) include a divalent to tetravalent (divalent, trivalent, or tetravalent) group formed from a benzene ring, and a divalent to tetravalent group formed from naphthalene , Divalent to tetravalent base formed by perylene, etc.

（式（6）中，X及Y分別獨立地表示不與各自所鍵結的苯環共軛的二價基或單鍵。Z為醚基（-O-）或硫醚基（-S-）（較佳為-O-）。）As the X of formula (1) having at least one aromatic group, a tetravalent group _1, for example, the following formula (6) is a tetravalent group, which is not limited to these. [化9]

(In formula (6), X and Y each independently represent a divalent group or a single bond that is not conjugated to the benzene ring to which they are bonded. Z is an ether group (-O-) or a thioether group (-S- ) (Preferably -O-).)

In formula (6), the divalent groups of X and Y that are not conjugated to the benzene ring to which they are bonded are preferably -O-, -S-, methylene, bis(trifluoromethyl)methylene , Or difluoromethylene, more preferably -O-.

The divalent aromatic group of Y ₁ in formula (1) may be a divalent aromatic hydrocarbon group or a divalent aromatic heterocyclic group. Preferably, it is a divalent aromatic hydrocarbon group.

（式（7）中，R₁₂ ～R₁₉ 分別獨立地為氫原子、一價脂肪族烴基或具有鹵素原子的一價有機基。）As the divalent aromatic hydrocarbon group of Y ₁ in the formula (1), for example, the group of the following formula (7) may be mentioned, but it is not limited to this. [化10]

(In formula (7), R ₁₂ to R ₁₉ are each independently a hydrogen atom, a monovalent aliphatic hydrocarbon group, or a monovalent organic group having a halogen atom.)

Examples of the monovalent aliphatic hydrocarbon group of R ₁₂ to R ₁₉ in the formula (7) (preferably having 1 to 10 carbons, more preferably 1 to 6 carbons) include a methyl group and the like. For example, R ₁₂ and R ₁₅ to R _{19 may} be a hydrogen atom, and R ₁₃ and R _{14 may} be a monovalent aliphatic hydrocarbon group.

The monovalent organic group having a halogen atom (preferably a fluorine atom) of R ₁₂ to R ₁₉ of formula (7) is preferably a monovalent aliphatic hydrocarbon group having a halogen atom (preferably having 1 to 10 carbon atoms, more preferably It is carbon number 1-6), trifluoromethyl etc. are mentioned.

Examples of the aliphatic hydrocarbon group having 1 to 4 carbon atoms (preferably 1 or 2) in R ₁ and R ₂ of formula (1) include: methyl, ethyl, n-propyl, 2-propyl, n-butyl Base etc.

At least one of R ₁ and R ₂ in formula (1) is a group represented by formula (2), and it is preferable that both of R ₁ and R ₂ are groups represented by formula (2).

Examples of the aliphatic hydrocarbon group having 1 to 3 carbon atoms (preferably 1 or 2) of R ₃ to R ₅ in formula (2) include methyl, ethyl, n-propyl, 2-propyl and the like. Preferably it is methyl.

The polyimide precursor having the structural unit represented by the formula (1) can be obtained, for example, by combining a tetracarboxylic dianhydride represented by the following formula (8) with a tetracarboxylic dianhydride represented by the following formula (9) The diamine compound represented by) is reacted in an organic solvent such as N-methyl-2-pyrrolidone to obtain polyamide acid, and the compound represented by the following formula (10) is added and mixed in an organic solvent The reaction proceeds to introduce ester groups locally. The tetracarboxylic dianhydride represented by the formula (8) and the diamino compound represented by the formula (9) may be used alone or in combination of two or more.

（式（8）中，X₁ 為與式（1）的X₁ 相對應的基。）[化11]

(In formula (8), X ₁ is a base corresponding to X _{1 in} formula (1).)

（式（9）中，Y₁ 如式（1）中所定義般。）[化12]

(In formula (9), Y _{1 is} as defined in formula (1).)

（式（10）中，R為由所述式（2）所表示的基。）[化13]

(In the formula (10), R is a group represented by the formula (2).)

（式（11）中，X₂ 為具有一個以上的芳香族基的四價基，-COOR₅₁ 基與-CONH-基相互處於鄰位，-COOR₅₂ 基與-CO-基相互處於鄰位。Y₂ 為二價芳香族基。R₅₁ 及R₅₂ 分別獨立地為氫原子或碳數1～4的脂肪族烴基。）(A) A component may have a structural unit other than the structural unit represented by Formula (1). As a structural unit other than the structural unit represented by Formula (1), the structural unit represented by Formula (11), etc. are mentioned. [化14]

(In formula (11), X ₂ is a tetravalent group having one or more aromatic groups, the -COOR ₅₁ group and the -CONH- group are in the ortho position to each other, and the -COOR ₅₂ group and the -CO- group are in the ortho position to each other. Y ₂ is a divalent aromatic group. R ₅₁ and R ₅₂ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 4 carbons.)

The tetravalent group having one or more aromatic groups in X ₂ of the formula (11) may be the same as the tetravalent group having one or more aromatic groups in X ₁ of the formula (1). The divalent aromatic group of Y ₂ in the formula (11) may be the same as the divalent aromatic group of Y ₁ in the formula (1). Examples of the aliphatic hydrocarbon groups having 1 to 4 carbons in R ₅₁ and R ₅₂ of the formula (11) are the same as the aliphatic hydrocarbon groups having 1 to 4 carbons in R ₁ and R ₂ .

Structural units other than the structural unit represented by formula (1) may be used alone or in combination of two or more.

The content of structural units other than the structural unit represented by formula (1) is preferably less than 50 mol% with respect to all structural units of the component (A).

In component (A), the ratio of carboxyl groups esterified by the group represented by formula (2) is preferably 50 mol% or more, and more preferably 60 mol%-100 mol%, relative to all carboxyl groups and all carboxyl esters. Ear%, more preferably 70 mol% to 90 mol%.

(A) The molecular weight of the component is not particularly limited, but it is preferably 10,000 to 200,000 in terms of number average molecular weight. The number average molecular weight can be measured by gel permeation chromatography, for example, and can be calculated by conversion using a standard polystyrene calibration curve.

From the viewpoint of improving the hydrophobicity of the cured product, the component (B) preferably has (preferably two or more) groups containing polymerizable unsaturated double bonds (because it can be carried out by a photopolymerization initiator Polymerization, it is preferably (meth)acrylic group). In order to increase the crosslinking density and light sensitivity, and to suppress pattern swelling after development, the component (B) preferably has two to three groups containing polymerizable unsaturated double bonds.

The component (B) preferably contains a polymerizable monomer having an aliphatic cyclic skeleton (preferably carbon number 4-15, more preferably carbon number 5-12). Thereby, it is possible to impart hydrophobicity to the cured product that can be formed, and it is possible to suppress the deterioration of the adhesiveness between the cured product and the substrate under high temperature and high humidity conditions.

（式（3）中，R₆ 及R₇ 分別獨立地為碳數1～4的脂肪族烴基或由下述式（4）所表示的基。n1為0或1，n2為0～2的整數，n1+n2為1以上（較佳為2或3）。n1個R₆ 及n2個R₇ 的至少一個（較佳為兩個或三個）為由下述式（4）所表示的基。）The (B) component preferably contains a polymerizable monomer represented by the following formula (3). [化15]

(In formula (3), R ₆ and R ₇ are each independently an aliphatic hydrocarbon group having 1 to 4 carbons or a group represented by the following formula (4). n1 is 0 or 1, and n2 is 0 to 2 Integer, n1+n2 is 1 or more (preferably 2 or 3). At least one (preferably two or three) of n1 R ₆ and n 2 R ₇ is represented by the following formula (4) base.)

In the case where R ₇ is two, two R ₇ may be the same or different.

（式（4）中，R₉ ～R₁₁ 分別獨立地為氫原子或碳數1～3的脂肪族烴基，l為0～10的整數（較佳為0、1或2）。）[化16]

(In formula (4), R ₉ to R ₁₁ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and l is an integer of 0 to 10 (preferably 0, 1 or 2).)

The (B) component more preferably contains a polymerizable monomer represented by the following formula (5). [化17]

Moreover, as (B) component, the following polymerizable monomers can also be used, for example.

式（12）中，R₂₁ ～R₂₄ 分別獨立地為碳數1～4的脂肪族烴基或由所述式（4）所表示的基。n3為1～3的整數（較佳為2或3）。n4為1～3的整數（較佳為2或3）。n5為0或1，n6為0或1。n5+n6為1以上（較佳為2）。[化18]

In formula (12), R ₂₁ to R ₂₄ are each independently an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a group represented by the above formula (4). n3 is an integer of 1 to 3 (preferably 2 or 3). n4 is an integer of 1 to 3 (preferably 2 or 3). n5 is 0 or 1, and n6 is 0 or 1. n5+n6 is 1 or more (preferably 2).

Where two or more in R _21, R ₂₁ may be two or more identical or different. R ₂₂ in the case where there are two or more, two or more of R ₂₂ may be the same or different.

At least one (preferably two or three) of n3 R ₂₁ is a group represented by the above formula (4). At least one (preferably two or three) of n4 R ₂₂ is a group represented by the above formula (4). At least one (preferably two) of n5 R ₂₃ and n 6 R ₂₄ is a group represented by the aforementioned formula (4).

Examples of R ₆ and R _{7 in} formula (3) and the aliphatic hydrocarbon group having 1 to 4 carbons in R ₂₁ to R ₂₄ in formula (12) include those with 1 to R ₁ and R ₂ in formula (1). The aliphatic hydrocarbon groups of ~4 are the same.

Examples of the aliphatic hydrocarbon groups having 1 to 3 carbons in R ₉ to R ₁₁ in the formula (4) include the same aliphatic hydrocarbon groups having 1 to 3 in R ₃ to R ₅ in the formula (2).

(B) The component may contain polymerizable monomers other than the polymerizable monomer having an aliphatic cyclic skeleton.

Examples of polymerizable monomers other than the polymerizable monomer having an aliphatic cyclic skeleton include diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, and diethylene diacrylate. Alcohol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1 ,4-Butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, trimethylolpropane dimethyl Hydroxymethyl acrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, tetramethylolmethane tetraacrylate, tetrahydroxymethyl Methylmethane tetramethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, ethoxylated pentaerythritol tetraacrylate, ethoxylated isocyanuric acid triacrylate, ethoxylated isocyanurate Cyanuric acid trimethacrylate, isocyanuric acid acryloxy ethyl, isocyanuric acid methacryloxy ethyl, etc. Preferably it is tetraethylene glycol dimethacrylate.

(B) A component may be used individually by 1 type, and may combine 2 or more types.

From the viewpoint of both the mechanical strength of the cured product and the improvement of the hydrophobicity, the component (B) preferably contains polymerizable monomers having an aliphatic cyclic skeleton and polymerization other than polymerizable monomers having an aliphatic cyclic skeleton. Sex monomer. When it contains a polymerizable monomer other than a polymerizable monomer having an aliphatic cyclic skeleton and a polymerizable monomer having an aliphatic cyclic skeleton, it has an aliphatic cyclic ring based on 100 parts by mass of the component (A) The content of the polymerizable monomer of the skeleton is preferably 1 part by mass to 40 parts by mass. From the viewpoint of improving the hydrophobicity of the cured product, it is more preferably 5 parts by mass to 35 parts by mass. The content of polymerizable monomers other than the polymerizable monomer having an aliphatic cyclic skeleton is preferably 1 part by mass to 20 parts by mass relative to 100 parts by mass of the component (A). From the viewpoint of improving the hydrophobicity of the cured product, it is more preferably 5 parts by mass to 15 parts by mass.

The content of the component (B) is preferably 1 part by mass to 50 parts by mass relative to 100 parts by mass of the component (A). From the viewpoint of improving the hydrophobicity of the cured product, it is more preferably 3 parts by mass to 50 parts by mass, and still more preferably 5 parts by mass to 40 parts by mass. When it is in the said range, it is easy to obtain a practical relief pattern, and it is easy to suppress the residue after development of an unexposed part.

As the (C) component, for example, benzophenone, methyl phthalate benzoate, 4-benzyl-4'-methyl benzophenone, dibenzyl ketone, Benzophenone derivatives such as quinone, acetophenone derivatives such as 2,2'-diethoxyacetophenone, 2-hydroxy-2-methylpropiophenone, 1-hydroxycyclohexylphenylketone, etc. Xanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, diethylthioxanthone and other thioxanthone derivatives, benzyl, benzyl dimethyl ketal, benzyl-β-methyl Benzyl derivatives such as oxyethyl acetal, benzoin derivatives such as benzoin and benzoin methyl ether, and 1-phenyl-1,2-butanedione-2-(O-methoxycarbonyl)oxime, 1- Phenyl-1,2-propanedione-2-(O-methoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime, 1- Phenyl-1,2-propanedione-2-(O-benzyl)oxime, 1,3-diphenylglycerol-2-(O-ethoxycarbonyl)oxime, 1-phenyl -3-ethoxyglycerol-2-(O-benzyl)oxime, ethyl ketone, 1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazole -3-yl]-, 1-(O-acetoxyoxime), oxime esters such as compounds represented by the following formula, etc., but are not limited to these. [化19]

Especially in terms of photosensitivity, oxime esters are preferred.

The (C) component preferably contains (C1) a compound represented by the following formula (15) (hereinafter, also referred to as "(C1) component"). The component (C1) preferably has a higher sensitivity to actinic rays than the component (C2) described later, and is preferably a high-sensitivity photosensitizer.

式（15）中，R_11A 為碳數1～12的烷基，a1為0～5的整數。R_12A 為氫原子或碳數1～12的烷基。R_13A 及R_14A 分別獨立地表示氫原子、碳數1～12（較佳為碳數1～4）的烷基、苯基或甲苯基。於a1為2以上的整數的情況下，R_11A 分別可相同亦可不同。[化20]

In the formula (15), R _11A is an alkyl group having 1 to 12 carbons, and a1 is an integer of 0 to 5. R _12A is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms. R _13A and R _14A each independently represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms (preferably, a phenyl group or tolyl group). When a1 is an integer of 2 or more, R _11A may be the same or different.

R _{11A is} preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group. a1 is preferably 1. R _{12A is} preferably an alkyl group having 1 to 4 carbon atoms, more preferably an ethyl group. R _13A and R _{14A are} preferably each independently an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group.

As the compound represented by the formula (15), for example, the compound represented by the following formula (15A) can be cited as "IRGACURE OXE 02" manufactured by BASF Japan Co., Ltd. Obtain. [化21]

In addition, the (C) component preferably contains (C2) a compound represented by the following formula (16) (hereinafter, also referred to as "(C2) component"). The component (C2) is preferably a sensitizer with a lower sensitivity to actinic rays than the component (C1), and is preferably a sensitizer with a standard sensitivity.

式（16）中，R_21A 為碳數1～12的烷基，R_22A 及R_23A 分別獨立地為氫原子、碳數1～12的烷基（較佳為碳數1～4）、碳數1～12的烷氧基（較佳為碳數1～4）、碳數4～10的環烷基、苯基或甲苯基，c1為0～5的整數。於c1為2以上的整數的情況下，R_21A 分別可相同亦可不同。[化22]

In the formula (16), R _21A is an alkyl group having 1 to 12 carbons, R _22A and R _23A are each independently a hydrogen atom, an alkyl group having 1 to 12 carbons (preferably having 1 to 4 carbons), carbon An alkoxy group having 1 to 12 (preferably carbon numbers 1 to 4), a cycloalkyl group having 4 to 10 carbon atoms, a phenyl group or a tolyl group, and c1 is an integer of 0-5. When c1 is an integer of 2 or more, R _21A may be the same or different.

c1 is preferably 0. R _{22A is} preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group. R _{23A is} preferably an alkoxy group having 1 to 12 carbons, more preferably an alkoxy group having 1 to 4 carbons, and still more preferably a methoxy group or an ethoxy group.

As the compound represented by the formula (16), for example, a compound represented by the following formula (16A) can be cited, which can be obtained as "G-1820 (PDO)" manufactured by Lambson Corporation. [化23]

(C) A component may be used individually by 1 type, and may combine 2 or more types.

The (C) component preferably contains one or more selected from the group consisting of (C1) and (C2) components. Moreover, it is preferable that (C)component contains (C1)component and (C2)component.

With respect to 100 parts by mass of (A) component, the content of (C) component is preferably 0.1 parts by mass to 20 parts by mass, more preferably 0.1 parts by mass to 10 parts by mass, and still more preferably 0.1 parts by mass to 5 parts by mass. When it is in the above range, the photo-crosslinking is likely to become uniform in the film thickness direction, and it is easy to obtain a practical relief pattern.

When the component (C1) is contained, the content of the component (C1) is usually 0.05 to 5.0 parts by mass, preferably 0.07 to 2.5 parts by mass, more preferably, relative to 100 parts by mass of the (A) component 0.09 parts by mass to 1.0 parts by mass.

When containing (C2) component, content of (C2) component is 0.5 mass part-15.0 mass parts normally with respect to 100 mass parts of (A) component, Preferably it is 1.0 mass part-15.0 mass parts.

When (C1) component and (C2) component are contained, it is preferable that the content of (C1) component is 0.05 to 5.0 parts by mass relative to 100 parts by mass of (A) component, and the content of (C2) component It is 0.5 mass part-15.0 mass parts with respect to 100 mass parts of (A) components.

When the (C1) component and the (C2) component are contained, the quality ratio of the content of the (C1) component and the (C2) component is preferably 1:2 to 1:15, and more preferably 1:3 to 1:10.

By including (D) component, corrosion of copper and copper alloy or discoloration can be prevented. As (D) component, a triazole derivative, a tetrazole derivative, etc. are mentioned, for example. (D) Component includes: 5-aminotetrazole (for example, 5-amino-1H-tetrazole), benzotriazole, 1-hydroxybenzotriazole, 1H-benzotriazole-1- Acetonitrile, benzotriazole-5-carboxylic acid, 1H-benzotriazole-1-methanol, carboxybenzotriazole, mercaptobenzotriazole, etc. Among these, 5-aminotetrazole, benzotriazole or 1-hydroxybenzotriazole is preferable. (D) A component may be used individually by 1 type, and may combine 2 or more types.

With respect to 100 parts by mass of (A) component, the content of (D) component is preferably 0.01 parts by mass to 10 parts by mass, more preferably 0.1 parts by mass to 5 parts by mass, and still more preferably 0.5 parts by mass to 3 parts by mass.

By containing the (E) component, oxygen radicals and peroxide radicals generated during high-temperature storage or insulation reliability tests can be supplemented, and the deterioration of adhesion (adhesion) can be further suppressed.

(E) component includes: N,N'-bis[2-[2-(3,5-di-tert-butyl-4-hydroxyphenyl)ethylcarbonyloxy]ethyl]oxalin Amine, N,N'-bis-3-(3,5-di-tert-butyl-4'-hydroxyphenyl) propanyl hexamethylene diamine, 1,3,5-tris(3- Hydroxy-4-tert-butyl-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,6-Di-tert-butyl-4-methylphenol, 2,5-di-tert-butyl-hydroquinone, octadecyl-3-(3,5-di-tert-butyl 4-hydroxyphenyl) propionate, 4,4'-methylenebis(2,6-di-tert-butylphenol), 4,4'-thio-bis(3-methyl- 6-tert-butylphenol), 4,4'-butylene-bis(3-methyl-6-tert-butylphenol), triethylene glycol-bis[3-(3-tert-butyl- 5-methyl-4-hydroxyphenyl)propionate], 2,2-thio-diethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propane Acid ester), N,N'-hexamethylene bis(3,5-di-tert-butyl-4-hydrocinnamamide), isooctyl-3-(3,5-di-tert-butyl 4-hydroxyphenyl) propionate, 1,3,5-tris[4-triethylmethyl-3-hydroxy-2,6-dimethylbenzyl]-1,3,5-tris Oxazine-2,4,6-(1H,3H,5H)-trione, 2,2'-methylene-bis(4-methyl-6-tertiary butylphenol), 2,2'- Methyl-bis(4-ethyl-6-tertiary butylphenol), Tris-(3,5-di-tert-butyl-4-hydroxybenzyl)-isocyanurate, 1,3,5-trimethyl-2,4,6-tris(3,5-di -Tert-butyl-4-hydroxybenzyl)benzene, 1,3,5-tris(3-hydroxy-2,6-dimethyl-4-isopropylbenzyl)-1,3,5-tris Oxazine-2,4,6-(1H,3H,5H)-trione, 1,3,5-tris(4-tertiarybutyl-3-hydroxy-2,6-dimethylbenzyl)-1 ,3,5-Triazine-2,4,6-(1H,3H,5H)-trione, 1,3,5-tris(4-secondbutyl-3-hydroxy-2,6-dimethyl Benzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione, 1,3,5-tris[4-(1-ethylpropyl)- 3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione, 1,3,5-tris(4 -Tert-butyl-3-hydroxy-2-methylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione, 1,3,5- Tris(4-tert-butyl-3-hydroxy-2,5-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione, Pentaerythritol-tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 1,6-hexanediol-bis[3-(3,5-di-th Tributyl-4-hydroxyphenyl)propionate], 1,3,5-tris(4-tertiarybutyl-3-hydroxy-2,5,6-dimethylbenzyl)-1,3 ,5-Triazine-2,4,6-(1H,3H,5H)-trione, 1,3,5-tris(4-tertiarybutyl-5-ethyl-3-hydroxy-2,6 -Dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione, 1,3,5-tris(4-tertiary butyl-6 -Ethyl-3-hydroxy-2,5-methylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione, 1,3,5- Tris(4-tert-butyl-5,6-diethyl-3-hydroxy-2-methylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H )-Triketone, 1,3,5-tris(4-tertiary butyl-6-ethyl-3-hydroxy-2-methylbenzyl)-1,3,5-triazine-2,4, 6-(1H,3H,5H)-triketone, 1,3,5-Tris(4-tert-butyl-5-ethyl-3-hydroxy-2-methylbenzyl)-1,3,5-triazine-2,4,6-(1H, 3H,5H)-triketone, 1,3,5-tris(3-hydroxy-2,6-dimethyl-4-phenylbenzyl)-1,3,5-triazine-2,4,6 -(1H,3H,5H)-triketone, and 1,3,5-Tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)isocyanuric acid and the like.

(E) A component may be used individually by 1 type, and may combine 2 or more types.

With respect to 100 parts by mass of (A) component, the content of (E) component is preferably 0.1 parts by mass to 20 parts by mass, more preferably 0.1 parts by mass to 10 parts by mass, and still more preferably 0.1 parts by mass to 5 parts by mass.

The photosensitive resin composition of this invention contains (F) cyclization catalyst. From the viewpoint of improving the cyclization rate or sensitivity, the component (F) is preferably selected from 2-(methylphenylamino)ethanol, 2-(ethylanilino)ethanol, N-phenyldiethanolamine, N-methylaniline, N-ethylaniline, N,N'-dimethylaniline, N-phenylethanolamine, 4-phenylmorpholine and 2,2'-(4-methylphenylimino ) One or more of the group consisting of diethanol, more preferably selected from N-phenyldiethanolamine, N-methylaniline, N-ethylaniline, N,N'-dimethylaniline, N-benzene One or more types of ethanolamine, 4-phenylmorpholine, and 2,2'-(4-methylphenylimino)diethanol.

（式（17）中，R_31A ～R_33A 分別獨立地為氫原子、一價脂肪族烴基、具有羥基的一價脂肪族烴基、或一價芳香族基，R_31A ～R_33A 的至少一個（較佳為一個或兩個）為一價芳香族基。R_31A ～R_33A 可藉由鄰接的基彼此形成環（例如，可具有取代基（例如，甲基、苯基）的五員環或六員環）。）It is preferable that (F) component contains the compound represented by following formula (17). [化24]

(In formula (17), R _31A to R _33A are each independently a hydrogen atom, a monovalent aliphatic hydrocarbon group, a monovalent aliphatic hydrocarbon group having a hydroxyl group, or a monovalent aromatic group, and at least one of R _31A to R _33A ( Preferably one or two) are monovalent aromatic groups. R _31A to R _33A may form a ring (for example, a five-membered ring which may have a substituent (for example, methyl, phenyl) or Six-member ring).)

Furthermore, at least one of R _31A to R _33A is preferably a monovalent aliphatic hydrocarbon group, a monovalent aliphatic hydrocarbon group having a hydroxyl group, or a monovalent aromatic group.

As the monovalent aliphatic hydrocarbon group of R _31A to R _33A in the formula (17) (preferably carbon number 1-10, more preferably carbon number 1-6), a methyl group, an ethyl group, and the like can be mentioned. Examples of the monovalent aliphatic hydrocarbon group having a hydroxyl group of R _31A to R _33A of formula (17) include one or more (preferably one to three) bonded to the monovalent aliphatic hydrocarbon group of R _31A to R _33A The hydroxyl group and so on. Specifically, hydroxymethyl, hydroxyethyl, etc. are mentioned. Preferably it is hydroxyethyl.

As the monovalent aromatic group of R _31A to R _33A in formula (17), it may be a monovalent aromatic hydrocarbon group (preferably carbon number 6-12, more preferably carbon number 6-10), or monovalent Aromatic heterocyclic group. Preferably, it is a monovalent aromatic hydrocarbon group. As a monovalent aromatic hydrocarbon group, a phenyl group, a naphthyl group, etc. are mentioned.

(F) A component may be used individually by 1 type, and may combine 2 or more types. From the viewpoint of sufficiently capturing oxygen radicals, the content of the (F) component is preferably 0.1 to 20 parts by mass relative to 100 parts by mass of the (A) component. From the viewpoint of suppressing a decrease in the glass transition temperature (Tg), the content of the component (F) is more preferably 0.3 parts by mass to 15 parts by mass, and still more preferably 0.5 parts by mass to 10 parts by mass.

The photosensitive resin composition of this invention contains (G) solvent. (G) Component includes N-methyl-2-pyrrolidone, γ-butyrolactone, ethyl lactate, propylene glycol monomethyl ether acetate, benzyl acetate, n-butyl acetate, ethoxy propionate Ethyl ester, 3-methyl methoxy propionate, N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfide, hexamethylphosphamide, Tetramethylene sulfonate, cyclohexanone, cyclopentanone, diethyl ketone, diisobutyl ketone, methyl amyl ketone, N-dimethylmorpholine, etc., usually as long as they can fully dissolve other ingredients There are no special restrictions. Among them, it is preferable to use N-methyl-2-pyrrolidone, γ-butyrolactone, ethyl lactate, etc. from the viewpoints of excellent solubility of each component and excellent coatability during formation of the photosensitive resin film. Propylene glycol monomethyl ether acetate, N,N-dimethylformamide, N,N-dimethylacetamide.

（式中，R₄₁ ～R₄₃ 分別獨立地為碳數1～10的烷基。）In addition, as the (G) component, a compound represented by the following formula (21) can also be used. [化25]

(In the formula, R ₄₁ to R ₄₃ are each independently an alkyl group having 1 to 10 carbons.)

Examples of the alkyl group having 1 to 10 carbon atoms (preferably 1 to 3, more preferably 1 or 3) of R ₄₁ to R ₄₃ in formula (21) include methyl, ethyl, n-propyl, Isopropyl, n-butyl, tertiary butyl, pentyl, hexyl, heptyl, octyl, etc. The compound represented by formula (21) is preferably 3-methoxy-N,N-dimethylpropanamide (for example, trade name "KJCMPA-100" (manufactured by KJ Chemicals (KJ Chemicals) Co., Ltd.) )).

(G) A component may be used individually by 1 type, and may combine 2 or more types. The content of the (G) component is not particularly limited, but in general, it is 50 parts by mass to 1000 parts by mass relative to 100 parts by mass of the (A) component.

From the viewpoint of accelerating the polymerization reaction, the photosensitive resin composition of the present invention may further contain (H) a thermal polymerization initiator (hereinafter, also referred to as "(H) component"). The component (H) is preferably a compound that does not decompose during heating (drying) to remove the solvent during film formation, but decomposes and generates free radicals by heating during curing, thereby promoting each other component (B) , Or the polymerization reaction of (A) component and (B) component. (H) The component is preferably a compound having a decomposition point of 110°C or higher and 200°C or less, and from the viewpoint of accelerating the polymerization reaction at a lower temperature, a compound having a decomposition point of 110°C or higher and 175°C or lower is more preferable .

Specific examples include: ketone peroxides such as methyl ethyl ketone peroxide; 1,1-bis(tertiary hexylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(the third Peroxy ketals such as trihexyl peroxide) cyclohexane, 1,1-bis(tertiary butyl peroxide) cyclohexane; 1,1,3,3-tetramethylbutyl hydroperoxide, cumene Hydrogen peroxides such as olefin hydroperoxide, p-methane hydroperoxide; dicumyl peroxide, di-tertiary butyl peroxide and other dialkyl peroxides; dilaurolyl peroxide, diphenylmethyl Diacyl peroxide such as acyl peroxide; Peroxy dicarbonate such as bis(4-tertiarybutylcyclohexyl)peroxydicarbonate, bis(2-ethylhexyl)peroxydicarbonate; Tertiary butylperoxy-2-ethylhexanoate, tertiary hexylperoxyisopropyl monocarbonate, tertiary butylperoxybenzoate, 1,1,3,3-tetramethylbutyl Peroxy esters such as oxy-2-ethylhexanoate, bis(1-phenyl-1-methylethyl) peroxide, etc. As a commercially available product, a brand name "Percumyl (Percumyl) D", "Percumyl (Percumyl) P", "Percumyl (Percumyl) H" (above manufactured by NOF Corporation), etc. are mentioned.

When the (H) component is contained, the content of the (H) component is preferably 0.1 to 20 parts by mass relative to 100 parts by mass of the (A) component. In order to ensure good flux resistance, it is more preferably 0.2 Part by mass to 20 parts by mass, and from the viewpoint of suppressing the decrease in solubility due to decomposition during drying, it is more preferably 0.3 part by mass to 10 parts by mass.

The photosensitive resin composition of the present invention may further contain a coupling agent (adhesive assistant), a surfactant or a leveling agent, a polymerization inhibitor, and the like.

Generally, the coupling agent reacts with the component (A) in the heat treatment after development to be crosslinked, or the coupling agent itself is polymerized in the heat treatment step. Thereby, the adhesiveness of the obtained cured product and the substrate can be further improved.

（式（13）中，R₃₁ 及R₃₂ 分別獨立地為碳數1～5的烷基。a為1～10的整數，b為1～3的整數。）As a preferable silane coupling agent, a compound having a urea bond (-NH-CO-NH-) can be cited. Thereby, even when hardening is performed at a low temperature of 230°C or less, the adhesion to the substrate can be further improved. In order to make it excellent in the development of adhesiveness at the time of hardening at low temperature, the compound represented by following formula (13) is more preferable. [化26]

(In formula (13), R ₃₁ and R ₃₂ are each independently an alkyl group having 1 to 5 carbons. a is an integer of 1 to 10, and b is an integer of 1 to 3.)

As specific examples of the compound represented by the formula (13), ureidomethyl trimethoxy silane, ureidomethyl triethoxy silane, 2-ureoethyl trimethoxy silane, 2-ureoethyl triethyl Oxysilane, 3-ureapropyltrimethoxysilane, 3-ureapropyltriethoxysilane, 4-ureabutyltrimethoxysilane, 4-ureabutyltriethoxysilane, etc., preferably 3-Ureapropyltriethoxysilane.

As the silane coupling agent, a silane coupling agent having a hydroxyl group or a glycidyl group can also be used. If a silane coupling agent having a hydroxyl group or a glycidyl group and a silane coupling agent having a urea bond in the molecule are used in combination, the adhesion of the cured product to the substrate during low-temperature curing can be further improved. As the silane coupling agent having a hydroxyl group or a glycidyl group, methyl phenyl silane diol, ethyl phenyl silane diol, n-propyl phenyl silane diol, isopropyl phenyl silane diol, normal Butyl phenyl silane diol, isobutyl phenyl silane diol, tertiary butyl phenyl silane diol, diphenyl silane diol, ethyl methyl phenyl silanol, n-propyl methyl phenyl Silanol, isopropyl methyl phenyl silanol, n-butyl methyl phenyl silanol, isobutyl methyl phenyl silanol, tertiary butyl methyl phenyl silanol, ethyl n-propyl phenyl silanol, ethyl Isopropyl phenyl silanol, n-butyl ethyl phenyl silanol, isobutyl ethyl phenyl silanol, tertiary butyl ethyl phenyl silanol, methyl diphenyl silanol, ethyl two Phenyl silanol, n-propyl diphenyl silanol, isopropyl diphenyl silanol, n-butyl diphenyl silanol, isobutyl diphenyl silanol, tertiary butyl diphenyl silanol , Phenylsilantriol, 1,4-bis(trihydroxysilyl)benzene, 1,4-bis(methyldihydroxysilyl)benzene, 1,4-bis(ethyldihydroxysilyl)benzene, 1,4-bis(propyldihydroxysilyl)benzene, 1,4-bis(butyldihydroxysilyl)benzene, 1,4-bis(dimethylhydroxysilyl)benzene, 1,4-bis (Diethylhydroxysilyl)benzene, 1,4-bis(dipropylhydroxysilyl)benzene, 1,4-bis(dibutylhydroxysilyl)benzene, and represented by the following formula (14) The compound and so on. Among them, in order to further improve the adhesion to the substrate, the compound represented by formula (14) is preferred.

（式（14）中，R₃₃ 為具有羥基或縮水甘油基的一價有機基，R₃₄ 及R₃₅ 分別獨立地為碳數1～5的烷基。c為1～10的整數，d為1～3的整數。）[化27]

(In formula (14), R ₃₃ is a monovalent organic group having a hydroxyl group or a glycidyl group, and R ₃₄ and R ₃₅ are each independently an alkyl group having 1 to 5 carbons. c is an integer of 1 to 10, and d is An integer from 1 to 3.)

Examples of the compound represented by formula (14) include: hydroxymethyltrimethoxysilane, hydroxymethyltriethoxysilane, 2-hydroxyethyltrimethoxysilane, and 2-hydroxyethyltriethoxy Silane, 3-hydroxypropyltrimethoxysilane, 3-hydroxypropyltriethoxysilane, 4-hydroxybutyltrimethoxysilane, 4-hydroxybutyltriethoxysilane, glycidoxymethyl Trimethoxysilane, glycidoxymethyltriethoxysilane, 2-glycidoxyethyltrimethoxysilane, 2-glycidoxyethyltriethoxysilane, 3-glycidoxysilane Propyl trimethoxy silane, 3-glycidoxy propyl triethoxy silane, 4-glycidoxy butyl trimethoxy silane, 4-glycidoxy butyl triethoxy silane, etc.

The silane coupling agent having a hydroxyl group or a glycidyl group preferably further contains a group having a nitrogen atom, and is preferably a silane coupling agent further having an amine group or an amide bond. As a silane coupling agent having more amino groups, bis(2-hydroxymethyl)-3-aminopropyltriethoxysilane, bis(2-hydroxymethyl)-3-aminopropyltrimethyl Oxysilane, bis(2-glycidoxymethyl)-3-aminopropyltriethoxysilane, bis(2-hydroxymethyl)-3-aminopropyltrimethoxysilane, etc.

As a silane coupling agent having more amide bonds, R ₃₆ -(CH ₂ ) _e -CO-NH-(CH ₂ ) _f -Si(OR ₃₇ ) ₃ (R ₃₆ is a hydroxyl group or a glycidyl group, e And f are each independently an integer of 1 to 3, and R ₃₇ is a compound represented by methyl, ethyl, or propyl).

The silane coupling agent can be used alone or in combination of two or more.

In the case of using a silane coupling agent, relative to 100 parts by mass of component (A), the content of the silane coupling agent is preferably 0.1 to 20 parts by mass, more preferably 1 to 10 parts by mass, and even more preferably 0.3 Parts by mass ~ 10 parts by mass.

By containing a surfactant or a leveling agent, coating properties (for example, suppression of striation (uneven film thickness)) and developability can be improved.

As the surfactant or leveling agent, for example, polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenol ether, etc. can be cited. List the trade names "Megafac F171", "Megafac F173", "Megafac R-08" (above, manufactured by DIC Co., Ltd.); trade names "Flo "Fluorad FC430", "Fluorad FC431" (above, manufactured by Sumitomo 3M Co., Ltd.); trade names "organic siloxane polymer KP341", "KBM303", "KBM403 ", "KBM803" (above, manufactured by Shin-Etsu Chemical Co., Ltd.), etc.

Surfactant and leveling agent may be used alone or in combination of two or more.

In the case of containing a surfactant or a leveling agent, the content of the surfactant or a leveling agent is preferably 0.01 parts by mass to 10 parts by mass, more preferably 0.05 parts by mass to 100 parts by mass of the component (A). 5 parts by mass, more preferably 0.05 parts by mass to 3 parts by mass.

By containing a polymerization inhibitor, good storage stability can be ensured. Examples of the polymerization inhibitor include radical polymerization inhibitors, radical polymerization inhibitors, and the like.

As the polymerization inhibitor, for example, p-methoxyphenol, diphenyl-p-benzoquinone, benzoquinone, hydroquinone, pyrogallol, phenothiazine (phenothiazine), resorcinol, phthalic acid Nitrobenzene, p-dinitrobenzene, m-dinitrobenzene, phenanthrenequinone, N-phenyl-2-naphthylamine, cupferron (cupferron), 2,5-toluquinone (2,5-toluquinone) ), tannic acid, p-benzylaminophenol, nitrosoamines, etc.

The polymerization inhibitor may be used alone or in combination of two or more.

When a polymerization inhibitor is contained, the content of the polymerization inhibitor is relative to 100 parts by mass of the component (A) in terms of the storage stability of the photosensitive resin composition and the heat resistance of the cured product obtained. It is preferably 0.01 parts by mass to 30 parts by mass, more preferably 0.01 parts by mass to 10 parts by mass, and still more preferably 0.05 parts by mass to 5 parts by mass.

The photosensitive resin composition of the present invention essentially contains (A) components to (G) components, and optional (H) components, coupling agents, surfactants, leveling agents, and polymerization inhibitors, and can be used without sacrificing the cost. Other unavoidable impurities are included in the range of the effect of the invention. The photosensitive resin composition of the present invention may contain, for example, 80% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, or 100% by mass (A) component ~ (G) component, (A) component ~ (H) component, or (A) component-(G) component, and optional (H) component, coupling agent, surfactant, leveling agent, and polymerization inhibitor.

The cured product of the present invention can be obtained by curing the photosensitive resin composition. The cured product of the present invention can be used as a patterned cured product or as a non-patterned cured product. The film thickness of the cured product of the present invention is preferably 5 μm to 20 μm.

In the method for producing a patterned cured product of the present invention, the method includes: coating the photosensitive resin composition on a substrate and drying to form a photosensitive resin film; and pattern exposure of the photosensitive resin film to obtain a resin The step of filming; the step of developing the resin film after pattern exposure using an organic solvent to obtain the patterned resin film; and the step of heating the patterned resin film. Thereby, a pattern hardened product can be obtained.

The method of manufacturing a non-patterned cured product includes, for example, a step of forming the photosensitive resin film and a step of performing heat treatment. Furthermore, the step of exposure may be included.

Examples of the substrate include glass substrates; semiconductor substrates such as Si substrates (silicon wafers); metal oxide insulator substrates such as TiO ₂ substrates and SiO ₂ substrates; silicon nitride substrates; copper substrates; copper alloy substrates.

The coating method is not particularly limited, and it can be performed using a spinner or the like.

Drying can be performed using a hot plate, oven, etc. The drying temperature is preferably 90°C to 150°C, and more preferably 90°C to 120°C from the viewpoint of ensuring dissolution contrast. The drying time is preferably 30 seconds to 5 minutes. Drying can also be carried out more than twice. Thereby, a photosensitive resin film obtained by forming the photosensitive resin composition into a film shape can be obtained.

The thickness of the photosensitive resin film is preferably 5 μm to 100 μm, more preferably 6 μm to 50 μm, and still more preferably 7 μm to 30 μm.

Regarding pattern exposure, for example, exposure is performed in a predetermined pattern through a photomask. The actinic rays to be irradiated include ultraviolet rays such as i-rays, visible rays, and radiation, and i-rays are preferred. As the exposure device, a parallel exposure machine, a projection exposure machine, a stepper, a scanning exposure machine, etc. can be used.

By performing development, a patterned resin film (patterned resin film) can be obtained. When using a negative photosensitive resin composition, the unexposed part is usually removed with a developing solution. As the organic solvent used as the developer, a good solvent for the photosensitive resin film may be used alone, or a good solvent and a poor solvent may be appropriately mixed and used as the developer. Examples of good solvents include N-methyl-2-pyrrolidone, N-acetyl-2-pyrrolidone, N,N-dimethylacetamide, and N,N-dimethylformamide Amine, dimethyl sulfide, γ-butyrolactone, α-acetyl-γ-butyrolactone, cyclopentanone, cyclohexanone, etc. Examples of poor solvents include toluene, xylene, methanol, ethanol, isopropanol, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, and water.

Surfactants can also be added to the developer. The addition amount is preferably 0.01 parts by mass to 10 parts by mass, and more preferably 0.1 parts by mass to 5 parts by mass relative to 100 parts by mass of the developer.

The development time can be set to twice the time until the photosensitive resin film is immersed and completely dissolved, for example. The development time also varies depending on the (A) component used, and is preferably 10 seconds to 15 minutes, more preferably 10 seconds to 5 minutes, and further preferably 20 seconds to 5 minutes from the viewpoint of productivity.

After developing, it can also be cleaned by rinsing liquid. As the eluent, distilled water, methanol, ethanol, isopropanol, toluene, xylene, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, etc. can be used alone or in a suitable mixture. In addition, they can also be used in combination in stages. .

By heating the patterned resin film, a patterned cured product can be obtained. The polyimide precursor of component (A) can cause a dehydration ring-closure reaction through a heat treatment step, and usually becomes the corresponding polyimide.

The temperature of the heat treatment is preferably 250°C or lower, more preferably 120°C to 250°C, and still more preferably 230°C or lower or 160°C to 230°C. By being within the above range, damage to the substrate or device can be suppressed to be small, the device can be produced with good yield, and the energy saving of the manufacturing process can be realized.

The heat treatment time is preferably 5 hours or less, more preferably 30 minutes to 3 hours. By being within the above range, the crosslinking reaction or the dehydration ring-closing reaction can sufficiently proceed. The heat treatment environment may be in the atmosphere or in an inert environment such as nitrogen. From the viewpoint of preventing oxidation of the patterned resin film, it is preferably a nitrogen environment.

Examples of devices used in the heat treatment include quartz tube furnaces, heating plates, rapid annealing furnaces, vertical diffusion furnaces, infrared curing furnaces, electron beam curing furnaces, microwave curing furnaces, and the like.

The cured product of the present invention can be used as a passivation film, a buffer coating film, an interlayer insulating film, a cover coating, a surface protection film, and the like. Using at least one selected from the group consisting of the passivation film, buffer coating film, interlayer insulating film, cover coating, and surface protection film, etc., highly reliable semiconductor devices, multilayer wiring boards, and various electronic devices can be manufactured , Multilayer devices (multi-chip fan-out wafer-level packaging, etc.) and other electronic components.

An example of the manufacturing process of the semiconductor device as the electronic component of the present invention will be described with reference to the drawings. 1 is a manufacturing process diagram of a semiconductor device with a multilayer wiring structure as an electronic component according to an embodiment of the present invention. In FIG. 1, a semiconductor substrate 1 such as a Si substrate with circuit elements is covered with a protective film 2 such as a silicon oxide film except for predetermined portions of the circuit elements, and a first conductor layer 3 is formed on the exposed circuit elements. Thereafter, an interlayer insulating film 4 is formed on the semiconductor substrate 1.

Next, a photosensitive resin layer 5 of chlorinated rubber type, phenol novolak type, etc. is formed on the interlayer insulating film 4, and is provided by a known photo etching technique so that a predetermined portion of the interlayer insulating film 4 is exposed Window 6A.

The interlayer insulating film 4 exposed in the window 6A is selectively etched, thereby providing the window 6B. Then, the photosensitive resin layer 5 is completely removed using an etching solution that does not corrode the first conductor layer 3 exposed from the window 6B but only corrodes the photosensitive resin layer 5.

Furthermore, a well-known photo etching technique is used to form the second conductor layer 7 and make electrical connection with the first conductor layer 3. In the case of forming a multilayer wiring structure of three or more layers, the above steps may be repeated to form each layer.

Next, using the photosensitive resin composition, the window 6C is opened by pattern exposure, and the surface protective film 8 is formed. The surface protection film 8 protects the second conductor layer 7 from external stress, alpha rays, etc., and the obtained semiconductor device has excellent reliability. Furthermore, in the above example, the photosensitive resin composition of the present invention can also be used to form an interlayer insulating film. [Example]

Hereinafter, the present invention will be described in more detail based on Examples and Comparative Examples. In addition, the present invention is not limited to the following examples.

Synthesis Example 1 (Synthesis of A1) Combine 7.07 g of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride (ODPA) with 4.12 g of 2,2'-dimethylbiphenyl-4,4'-diamine (DMAP ) Was dissolved in 30 g of N-methyl-2-pyrrolidone (NMP), stirred at 30°C for 4 hours, and thereafter, stirred at room temperature overnight to obtain polyamide acid. Under water cooling, 9.45 g of trifluoroacetic anhydride was added thereto, stirred at 45° C. for 3 hours, and 7.08 g of 2-hydroxyethyl methacrylate (HEMA) was added. The reaction liquid was added dropwise to distilled water, the precipitate was filtered, separated and collected, and dried under reduced pressure, thereby obtaining a polyimide precursor A1. Under the following conditions, use the Gel Permeation Chromatograph (GPC) method and calculate the number average molecular weight by standard polystyrene conversion. The number average molecular weight of A1 is 40,000.

The measurement was performed using a solution containing 0.5 mg of A1 and a solvent [tetrahydrofuran (THF)/dimethylformamide (DMF)=1/1 (volume ratio)] of 1 mL.

Measuring device: Detector L4000UV manufactured by Hitachi, Ltd. Pump: L6000 manufactured by Hitachi, Ltd. C-R4A Chromatopac manufactured by Shimadzu Co., Ltd. Measuring conditions: Column Gelpack GL-S300MDT-5×2 elution Liquid: THF/DMF=1/1 (volume ratio) LiBr (0.03 mol/L), H ₃ PO ₄ (0.06 mol/L) Flow rate: 1.0 mL/min, detector: UV 270 nm

In addition, under the following conditions, a nuclear magnetic resonance (Nuclear Magnetic Resonance, NMR) measurement was performed to calculate the esterification rate of A1 (the reaction rate of the carboxyl group of ODPA with HEMA). The esterification rate is 80 mol% (the remaining 20 mol% are carboxyl groups) with respect to all the carboxyl groups of the polyamide acid.

Measuring equipment: AV400M manufactured by Bruker BioSpin Magnetic field strength: 400 MHz Reference substance: tetramethylsilane (TMS) Solvent: dimethyl sulfoxide (DMSO)

Example 1 to Example 3 and Comparative Example 1 to Comparative Example 3 (Preparation of photosensitive resin composition) The photosensitive resin compositions of Examples 1 to 3 and Comparative Examples 1 to 3 were prepared according to the components and blending amounts shown in Table 1. The compounding amount of Table 1 is the mass part of each component with respect to 100 mass parts of A1.

The components used are as follows. As the (A) component, A1 obtained in Synthesis Example 1 was used.

B2：TGDMA（新中村化學工業股份有限公司製造，四乙二醇二甲基丙烯酸酯）(B) Component: Polymerizable monomer B1: A-DCP (manufactured by Shinnakamura Chemical Industry Co., Ltd., tricyclodecane dimethanol diacrylate, a compound represented by the following formula B1) [Chemical Formula 28]

B2: TGDMA (manufactured by Shinnakamura Chemical Industry Co., Ltd., tetraethylene glycol dimethacrylate)

(C) Component: photopolymerization initiator C1: IRGACURE OXE 02 (manufactured by BASF Japan Co., Ltd., ethyl ketone, 1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazole -3-yl]-,1-(O-acetyloxime)) C2: G-1820 (PDO) (manufactured by Lambson Co., Ltd., 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime)

(D) Ingredient: Anti-rust agent D1: 5-Amino-1H-tetrazole (manufactured by Tokyo Chemical Industry Co., Ltd.)

E2：安塔基（ANTAGE）HP300（川口化學工業股份有限公司製造，N,N'-雙-3-(3,5-二-第三丁基-4'-羥基苯基)丙醯基六亞甲基二胺，由下述式E2所表示的化合物） [化30]

E3：THTT（康比樂（Combi-Blocks）公司製造，1,3,5-三(3-羥基-4-第三丁基-2,6-二甲基苄基)-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮，由下述式E3所表示的化合物） [化31]

(E) Ingredient: Antioxidant E1: ANTAGE HP200 (manufactured by Kawaguchi Chemical Industry Co., Ltd., N,N'-bis[2-[2-(3,5-di-tertiary butyl-4) -Hydroxyphenyl) ethylcarbonyloxy] ethyl] glufamide, a compound represented by the following formula E1) [Chemical Formula 29]

E2: ANTAGE HP300 (manufactured by Kawaguchi Chemical Industry Co., Ltd., N,N'-bis-3-(3,5-di-tertiarybutyl-4'-hydroxyphenyl) propionyl six Methylene diamine, a compound represented by the following formula E2) [Chemical Formula 30]

E3: THTT (manufactured by Combi-Blocks, 1,3,5-tris(3-hydroxy-4-tert-butyl-2,6-dimethylbenzyl)-1,3,5 -Triazine-2,4,6(1H,3H,5H)-trione, a compound represented by the following formula E3) [Chemical Formula 31]

(F) Ingredient: cyclization catalyst F1: 2HE (manufactured by Morin Chemical Industries Co., Ltd., N-phenyldiethanolamine)

(G) Component: Solvent G1: KJCMPA-100 (manufactured by KJ Chemicals Co., Ltd., a compound represented by the following formula G1) [Chemical Formula 32]

(H) Component: Thermal polymerization initiator H1: Percumyl D (manufactured by NOF Corporation, bis(1-phenyl-1-methylethyl) peroxide, represented by the following formula Represented compound) [化33]

(Evaluation of sensitivity) Using the coating device Act8 (manufactured by Tokyo Electronics Co., Ltd.), the obtained photosensitive resin composition was spin-coated on a silicon wafer, dried at 100°C for 2 minutes, and then dried at 110°C A photosensitive resin film having a dry film thickness of 11 μm to 14 μm is formed in 2 minutes. The development time was twice the time until the obtained photosensitive resin film was immersed in cyclopentanone and completely dissolved. In addition, a photosensitive resin film was produced in the same manner as described above. For the obtained photosensitive resin film, an i-ray stepper FPA-3000iW (manufactured by Canon Co., Ltd.) was used at a rate of 50 mJ/cm ² Exposure is performed by irradiating 50 mJ/cm ² to 550 mJ/cm ² with i-rays in a predetermined pattern at a unit irradiation amount. Using Act8, the exposed resin film was developed in cyclopentanone for the above-mentioned development time, and then rinsed and cleaned with propylene glycol monomethyl ether acetate (PGMEA) to obtain a patterned resin film.

The lower limit of the exposure amount when the film thickness of the obtained patterned resin film exceeds 75% of the film thickness of the photosensitive resin film before exposure is made the sensitivity. Regarding the film thickness, the silicon wafer was exposed by scribing a part of the film, and the contact pin profiler Dektak 150 (manufactured by Bruker) was used to measure the surface of the exposed silicon wafer to the film. The height from the surface (the measurement of the film thickness is the same in the following). Let A when the sensitivity is less than 300 mJ/cm ² . Let B be the case of 300 mJ/cm ² to 400 mJ/cm ² . Let C be the case where it exceeds 300 mJ/cm ² . The results are shown in Table 1.

(Manufacturing of hardened patterns) The patterned resin film obtained in the evaluation of sensitivity was heated at 200°C for 1 hour in a nitrogen atmosphere using a vertical diffusion furnace μ-TF (manufactured by Koyo Thermo Systems Co., Ltd.) to obtain a patterned cured product ( The film thickness after curing is 10 μm). Regarding Examples 1 to 3, good pattern hardened products were obtained.

<Evaluation of insulation reliability> Highly accelerated stress and bias test (biasHAST) (high-speed accelerated life test) test substrate (layer structure of silicon wafer/SiO ₂ layer (1 μm)/TiCu seed layer (100 nm) is used /Cu layer (3.5 μm) wafers, wafers composed of silicon wafers/SiO ₂ layers/TiCu seed layers are manufactured by Advanced Material Technologies Co., Ltd. The TiCu seed layer and Cu layer have combs Teeth pattern (line width of comb teeth: 2 μm, number of teeth: 9 anodes and 9 cathodes, spacing: 2 μm). The obtained photosensitive resin composition was spin-coated on a test substrate for biasHAST, at 120 Dried at ℃ for 3 minutes to form a photosensitive resin film with a thickness of 10 μm after drying. In addition, there is a pad part on the surface of the test substrate for biasHAST, so the photosensitive resin composition is not applied to the pad part Coating. Using μ-TF, the obtained photosensitive resin film was heated in a nitrogen atmosphere at 200°C for 1 hour to obtain a test substrate with a cured product (film thickness 8 μm after curing). The soldering pad part of the test substrate of the hardened substance is soldered and connected to a migration tester MIG-8600B (manufactured by IMV Co., Ltd.) at 130°C and 85% relative humidity (RH). ), Direct Current (DC): 3.3 V conditions are put into the thermostatic bath HASTEST PC-R8D (manufactured by Hirayama Manufacturing Co., Ltd.) for 300 hours of continuity confirmation. Will start to Those who did not have a short circuit within 300 hours were set to A. The ones that had a short circuit in more than 100 hours and less than 300 hours from the start of the test were set to B. The ones that had a short circuit within 100 hours from the start of the test were set to C. The results are shown in Table 1.

<Evaluation of Cu Adhesion> For the test substrate with the hardened substance after the insulation reliability evaluation, a scanning electron microscope (scanning electron microscope, SEM) IM4000 (manufactured by Hitachi High-Tech Co., Ltd.) was used for cross-sectional observation. The case where peeling is not observed at the interface between the Cu layer and the cured product is designated as A. Let B be the person who observed peeling of less than 0.2 μm. Let C be the one where peeling of 0.2 μm or more is observed. The results are shown in Table 1.

＜Cu migration evaluation＞ For the test substrate with hardened substance after the insulation reliability evaluation, a Schottky field emission scanning electron microscope (Schottky field emission scanning electron microscope) JSM-7800F-prime (manufactured by JEOL Ltd.) was used ), perform SEM-energy dispersive X-Ray spectroscopy (EDX) analysis. The case where no Cu diffusion is detected between the cathode and anode of the comb tooth pattern is set to A. The case where Cu diffusion is detected within 0.5 μm from the electrode is set as B. C is the case where Cu diffusion is detected in the range of 0.5 μm or more from the electrode. The results are shown in Table 1.

Specifically, the test substrate with the cured product after the insulation reliability evaluation was subjected to Pt sputtering and arranged in JSM-7800F-prime. The current value under the acceleration voltage of 2 kV: electron beam 16 (2.7 nA) was measured for 1 hour.

[Table 1] Example 1 Example 2 Example 3 Comparative example 1 Comparative example 2 Comparative example 3 (A) Ingredient A1 100 100 100 100 100 100 (B) Ingredients B1 25 25 25 25 25 25 B2 10 10 10 10 10 10 (C) Ingredients C1 0.4 0.4 0.4 0.4 0.4 0.4 C2 3 3 3 3 3 3 (D) Ingredients D1 2 2 2 2 2 2 (E) Ingredients E1 3.05 - - - - - E2 - 2.79 - - - - E3 - - 2 - 2 - (F) Ingredients F1 3 3 3 - - 3 (G) Ingredients G1 170 170 170 170 170 170 (H) Ingredient H1 2 2 2 2 2 2 Sensitivity A A A B C A Insulation reliability A A A B C A Cu adhesion A A B C C B Cu migration A A B C B C [Industrial availability]

The photosensitive resin composition of the present invention can be used for interlayer insulating films, cover coats, or surface protective films, and the interlayer insulating film, cover coats, or surface protective films of the present invention can be used for electronic parts and the like.

In the foregoing, several embodiments and/or embodiments of the present invention have been described in detail, but those skilled in the art can easily use these exemplary embodiments and embodiments without substantially departing from the novel teachings and effects of the present invention. / Or the embodiment is subject to various changes. Therefore, these various changes are included in the scope of the present invention. The documents described in this specification and the entire contents of the application which became the basis of the priority of this application based on the Paris Treaty are cited.

1: Semiconductor substrate 2: Protective film 3: The first conductor layer 4: Interlayer insulating film 5: Photosensitive resin layer 6A, 6B, 6C: window 7: The second conductor layer 8: Surface protective film

Fig. 1 is a manufacturing process diagram of an electronic component according to an embodiment of the present invention.

Claims (18)

A photosensitive resin composition containing: (A) Polyimide precursor; (B) Polymerizable monomer; (C) Photopolymerization initiator; (D) Rust inhibitor; (E) Antioxidant; (F) Cyclization catalyst; and (G) Solvent. The photosensitive resin composition as described in claim 1, wherein the component (A) has a polymerizable unsaturated bond. The photosensitive resin composition according to item 1 or item 2 of the scope of patent application, wherein the component (A) is a polyimide precursor having a structural unit represented by the following formula (1),

(In formula (1), X ₁ is a tetravalent group having more than one aromatic group, the -COOR ₁ group and the -CONH- group are in the ortho position with each other, and the -COOR ₂ group and the -CO- group are in the ortho position with each other; Y ₁ is a divalent aromatic group; R ₁ and R ₂ are each independently a hydrogen atom, a group represented by the following formula (2), or an aliphatic hydrocarbon group having 1 to 4 carbons, and R ₁ and R ₂ At least one of is the base represented by the formula (2);

In formula (2), R ₃ to R ₅ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbon atoms, and m is an integer of 1 to 10). The photosensitive resin composition according to any one of claims 1 to 3, wherein the component (B) contains a polymerizable monomer having an aliphatic cyclic skeleton. The photosensitive resin composition according to any one of claims 1 to 4, wherein the component (B) has a group containing a polymerizable unsaturated double bond. The photosensitive resin composition according to claim 5, wherein the component (B) is a polymerizable monomer having two or more groups containing polymerizable unsaturated double bonds. The photosensitive resin composition according to any one of items 1 to 5 in the scope of patent application, wherein the component (B) contains a polymerizable monomer represented by the following formula (3),

(In formula (3), R ₆ and R ₇ are each independently an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a group represented by the following formula (4); n1 is 0 or 1, and n2 is 0 to 2 Integer, n1+n2 is 1 or more; at least one of n1 R ₆ and n 2 R ₇ is a group represented by the following formula (4);

In formula (4), R ₉ to R ₁₁ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 3 carbons, and l is an integer of 0 to 10). The photosensitive resin composition described in item 7 of the scope of patent application, wherein n1+n2 is 2 or 3. The photosensitive resin composition according to any one of items 1 to 8 in the scope of patent application, wherein the component (B) contains a polymerizable monomer represented by the following formula (5),

. The photosensitive resin composition according to any one of items 1 to 9 in the scope of patent application, wherein the component (F) is selected from the group consisting of N-phenyldiethanolamine, N-methylaniline, and N-ethyl Benzylaniline, N,N'-dimethylaniline, N-phenylethanolamine, 4-phenylmorpholine and 2,2'-(4-methylphenylimino)diethanol More than one kind. The photosensitive resin composition according to any one of claims 1 to 9, wherein the component (F) contains a compound represented by the following formula (17),

(In formula (17), R _31A to R _33A are each independently a hydrogen atom, a monovalent aliphatic hydrocarbon group, a monovalent aliphatic hydrocarbon group having a hydroxyl group, or a monovalent aromatic group, and at least one of R _31A to R _33A is Monovalent aromatic group; R _31A to R _33A may form a ring with each other through adjacent groups). The photosensitive resin composition according to any one of items 1 to 11 in the scope of the patent application, which further contains (H) a thermal polymerization initiator. A method for manufacturing a patterned hardened object, including: The step of coating and drying the photosensitive resin composition as described in any one of items 1 to 12 of the scope of patent application on a substrate to form a photosensitive resin film; A step of patterning the photosensitive resin film to obtain a resin film; The step of using an organic solvent to develop the resin film after the pattern exposure to obtain a pattern resin film; and The step of heating the patterned resin film. According to the method for manufacturing a patterned hardened product described in the scope of patent application, the temperature of the heat treatment is 230°C or less. A cured product obtained by curing the photosensitive resin composition described in any one of items 1 to 12 in the scope of patent application. The cured product described in item 15 of the scope of patent application is a pattern cured product. An interlayer insulating film, a covering coating or a surface protection film, which is produced by using the hardened product as described in item 15 or item 16 of the scope of patent application. An electronic component containing the interlayer insulating film, covering coating or surface protection film as described in item 17 of the scope of patent application.

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