TW202023357A - Inverter device having heat dissipation mechanism - Google Patents

Abstract

The present disclosure relates to an inverter device having a heat dissipation mechanism. The inverter device has a casing, a heating element, a heat dissipation structure and a fan. The casing has a base and a cover covering the base. An internal and an external surface are defined on the cover. The inner surface is disposed corresponding to the base. The heating element is disposed in the casing and arraged on the base. The heat dissipation structure is thermal connected with the internal surface. The fan is accommodated in the casing corresponding to the heat dissipation structure. an air flow in the casing is accelerating by the fan, and the heat dissipation structure absorbs heat from the air flow in the casing and thermal conductively transfers to the external surface of the cover. An efficiency of the inverter device is thereby improved and the inverter device is thereby more durable.

Description

Inverter device with heat dissipation mechanism

The present invention relates to an inverter structure, and particularly relates to an inverter device with a heat dissipation mechanism.

Inverter (also known as converter, inverter; Inverter) is an electronic device that uses a high-frequency bridge circuit to convert direct current into alternating current. Among them, because the inverter bottom case is installed with a circuit board or IGBT (Insulated Gate Bipolar Transistor), MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), passive components For components that require heat dissipation, a plurality of heat dissipation fins are connected to the outside of the inverter bottom case to help the inverter dissipate heat.

However, the temperature 度 of the inverter case is mainly distributed in the bottom case, and the temperature 度 of the upper cover is relatively low. Therefore, 若 can conduct heat to the upper cover, and the heat dissipation effect of the whole inverter will increase, which helps to reduce 降The temperature 度 inside the machine and prolong the service life of the product.

In view of this, the inventor of the present invention focused on the above-mentioned prior art, and made great efforts to solve the above-mentioned problems, which became the goal of the inventor's development.

The present invention provides an inverter device with a heat dissipation mechanism, which uses a heat dissipation structure to thermally adhere to the inner wall surface of a cover plate. The heat dissipation structure absorbs the heat of the air inside the casing and conducts the heat to the outer wall surface of the cover plate. The inverter device has the advantages of improving heat dissipation efficiency and extending service life.

In an embodiment of the present invention, the present invention provides an inverter device with a heat dissipation mechanism, including: a housing, including a base and a cover plate covering the base, the cover plate having opposite inner and outer walls, and the inner wall Corresponding to the base; at least one heating element accommodated in the housing and installed on the base; a heat dissipation structure, thermally attached to the inner wall; and at least one fan, accommodated in the housing and corresponding to the heat dissipation structure.

Based on the above, the fan accelerates the movement of the air inside the casing and enables the airflow to pass through the heat dissipation structure. The heat dissipation structure then absorbs the heat in the airflow and conducts the heat to the outer wall surface of the cover, so that the inverter device can achieve a relatively low temperature The cover plate accelerates the heat dissipation, so that the inverter device has the advantages of improving the heat dissipation efficiency and prolonging the service life.

Based on the above, a plurality of radiating fins are bent together to form a curved arc section, which is used for turning and laying on the cover plate, thereby increasing the heat dissipation area of the plurality of radiating fins, and increasing the air duct to keep heat as much as possible for heat dissipation Inside the structure, the heat is dissipated through the cover.

The detailed description and technical content of the present invention will be described as follows in conjunction with the drawings. However, the accompanying drawings are for illustrative purposes only and are not intended to limit the present invention.

Please refer to FIGS. 1-7. The present invention provides an inverter device with a heat dissipation mechanism. The inverter device 10 mainly includes a housing 1, one or more heating elements 2, a heat dissipation structure 3, and one or more Fan 4.

As shown in Figures 1 to 7, the housing 1 includes a base 11 and a cover plate 12. The cover plate 12 covers the base 11, and the cover plate 12 has opposite inner wall surfaces 121 and outer wall surfaces 122, and the inner wall surface 121 corresponds to the base 11 Set up.

The detailed description is as follows. The base 11 has a bottom wall 111 and a side wall 112 ringed around the bottom wall 111. The inner wall surface 121 is provided corresponding to the bottom wall 111. The exterior of the bottom wall 111 is integrally extended or connected with a plurality of auxiliary fins 113 in an overlapping manner. The plurality of auxiliary fins 113 are used to dissipate the heat accumulated to the bottom wall 111 to the outside.

As shown in Figures 3 to 4 and Figure 6, the number of heating elements 2 in this embodiment is plural. Each heating element 2 is housed in the housing 1 and installed on the bottom wall 111 of the base 11. Each heating element 2 is The electronic components of the inverter device 10, the complex heating element 2 includes a circuit board 21, a complex capacitor 22, power semiconductor components 23 such as IGBT or MOSFET, a relay 24, a common mode choke 25, and an inductor 26. The circuit board 21 is fixed on the bottom wall 111, the capacitor 22, power semiconductor components 23 such as IGBT or MOSFET, the relay 24, and the common mode choke 25 are fixed on the circuit board 21, and the inductor 26 of this embodiment is configured On one side of the circuit board 21 and fixed to the bottom wall 111, but not limited to this, the inductor 26 can also be fixed to the circuit board 21. The heat generated by the heating elements 2 is transferred to the bottom wall 111, and then the heat is dissipated to the outside through the auxiliary fins 113.

Among them, power semiconductor components 23 such as IGBTs or MOSFETs are used as power conversion circuits, for example: switching components such as DC/AC or DC/DC; Relay 24 is used to disconnect the electricity of the machine from external electricity; common mode Common Mode Choke 25 is used for common mode inductance for electromagnetic interference (Electromagnetic Interference, referred to as EMI). In addition, the housing 1 further accommodates a plurality of support posts 27 fixed on the bottom wall 111 and arranged on the side of the circuit board 21. The support posts 27 are used to provide electrical connections for wires and support the circuit board 21 or other circuit boards. .

In addition, the number of the above-mentioned circuit boards 21 is not limited to a single number. The number of the above-mentioned circuit boards 21 can also be adjusted to a plural number according to the situation. The plural circuit boards can be fixed on the bottom wall 111 in a horizontal or stacked parallel manner, and the plural capacitors 22 , The power semiconductor component 23, the relay 24, and the common mode choke coil 25 are respectively fixedly connected to the plural circuit boards.

Further explanation is as follows. When the number of the above-mentioned circuit boards 21 is plural, some of the plural capacitors 22, power semiconductor components 23, relay 24, and common mode choke coil 25 may be located on the same circuit board. The plural capacitors 22, power semiconductors Another part of the components 23, the relay 24, and the common mode choke coil 25 may be located on a different circuit board. The inductor 26 can be arranged on one side of the plurality of circuit boards or fixedly connected to one of the circuit boards.

As shown in FIGS. 1 to 3, 5, and 7, the heat dissipation structure 3 is thermally attached to the inner wall surface 121. The heat dissipation structure 3 of this embodiment is a fin member, that is, the heat dissipation structure 3 includes a plurality of heat dissipation fins 31 and heat conduction One side of the heat-conducting plate 32 is thermally attached to the inner wall surface 121, and the other side of the heat-conducting plate 31 is connected with a plurality of radiating fins 31. The plurality of radiating fins 31 are arranged side by side with each other and two vents 311 are formed at both ends. But this is not a limitation.

To further explain as follows, the heat dissipation structure 3 can also be a temperature-uniform plate member, that is, the heat-dissipation structure 3 includes a uniform temperature plate, which is thermally attached to the inner wall surface 121; or, the heat dissipation structure 3 can also be a heat pipe member, that is, the heat dissipation structure 3 It includes a heat-conducting block and one or more heat pipes. The heat-conducting block is thermally attached to the inner wall surface 121, and the heat pipe is connected to the heat-conducting block.

In addition, the heat conducting plate 32 of this embodiment is fixed on the inner wall surface 121 by bonding or locking, that is, the heat conducting plate 32 and the cover plate 12 are assembled in two pieces with each other, but this is not a limitation. The heat conducting plate 32 is also It can be integrally formed with the cover plate 12.

As shown in FIGS. 1 to 3 and 5 to 7, the fan 4 of this embodiment is housed in the housing 1 and is provided corresponding to one of the vents 311, but it is not limited to this. The fan 4 can be set in Any position inside the casing 1, but the fan 4 must be arranged corresponding to the heat dissipation structure 3 so that the air flow generated by the fan 4 can pass through the heat dissipation structure 3.

Among them, the fan 4 is used to accelerate the movement of the air inside the casing 1, and the heat dissipation structure 3 is used to absorb the heat of the air inside the casing 1 and conduct the heat to the outer wall 122 of the cover plate 12.

As shown in FIGS. 1 to 3 and 5 to 6, the inverter device 10 of the present invention further includes a wind deflector 5. The wind deflector 5 is fixed to the inner wall 121 and covered by a plurality of heat dissipation fins 31, The wind hood 5 is provided with two openings 51 corresponding to the two vents 311, and the wind hood 5 has an extension section 52 arranged between one of the openings 51 and the plurality of radiating fins 31, and the fan 4 is installed on the extension section 52, thereby The fan 4 is arranged corresponding to one of the openings 51.

As shown in Figures 1 to 7, the use state of the inverter device 10 of the present invention is that the heat dissipation structure 3 is thermally attached to the inner wall surface 121 of the cover 12, the fan 4 is provided corresponding to the heat dissipation structure 3, and the fan 4 is used for Accelerate the movement of the air inside the casing 1 and enable the airflow to pass through the heat dissipation structure 3. The heat dissipation structure 3 then absorbs the heat in the airflow and conducts the heat to the outer wall 122 of the cover plate 12, so that the inverter device 10 can face each other at a temperature 度The lower cover plate 12 accelerates heat dissipation, so that the inverter device 10 has the advantages of improving heat dissipation efficiency and prolonging the service life.

In addition, the inverter device 10 of the present invention further includes a wind deflector 5 covering the plurality of radiating fins 31. The wind deflector 5 is provided with two openings 51. The fan 4 is arranged corresponding to one of the openings 51 to guide the fan 4 to produce The airflow can pass through the heat dissipation structure 3, so that the heat dissipation structure 3 can reliably absorb the heat in the airflow.

Please refer to FIG. 8, which is another embodiment of the inverter device 10 of the present invention. The embodiment of FIG. 8 is substantially the same as the embodiment of FIGS. 1 to 7, and the embodiment of FIG. 8 is similar to that of FIGS. 1 to 7. The difference of the embodiment is that a plurality of heat dissipation fins 31 are bent together to form one or more curved arc segments 312, which are used for turning and laying on the cover plate 12, thereby increasing the heat dissipation area of the plurality of heat dissipation fins 31, and can Increase the air duct to keep the heat in the heat dissipation structure 3 as much as possible, and then dissipate the heat through the cover plate 12.

Please refer to FIG. 9, which is another embodiment of the inverter device 10 of the present invention. The embodiment of FIG. 9 is substantially the same as the embodiment of FIGS. 1-7, and the embodiment of FIG. 9 is similar to that of FIGS. 1-7. The difference of the embodiment is that the outer wall 122 of the cover plate 12 is integrally extended or connected with a plurality of auxiliary fins 123 in an overlapping manner, and the plurality of auxiliary fins 123 are used to dissipate the heat of the cover plate 12 to the outside. The inner wall 121 is thermally attached to the heat dissipation structure 3, so the area of the auxiliary fin 123 does not need to cover the entire outer wall 122. The auxiliary fin 123 only needs to be arranged on a part of the outer wall 122 to quickly dissipate the heat of the cover 12 to the outside , And avoid the problem of heat accumulation in the cover 12.

To sum up, the inverter device with heat dissipation mechanism of the present invention has never been seen in similar products and publicly used, and has industrial applicability, novelty and progress, and fully meets the requirements of patent application. Please check carefully and grant the patent for this case to protect the rights of the inventor.

10: Inverter device

1: shell

11: Base

111: bottom wall

112: sidewall

113: auxiliary fin

12: Cover

121: inner wall

122: outer wall

123: auxiliary fin

2: heating element

21: Circuit board

22: Capacitance

23: Power semiconductor components

24: Relay

25: common mode choke

26: Inductance

27: Support column

3: Heat dissipation structure

31: cooling fins

311: Vent

312: Curved arc

32: thermal board

4: fan

5: Wind hood

51: opening

52: Extension

Fig. 1 is a three-dimensional exploded view of the cover plate, heat dissipation structure and fan of the present invention.

Figure 2 is a three-dimensional assembly diagram of the cover plate, heat dissipation structure and fan of the present invention.

Figure 3 is an exploded perspective view of the heat dissipation structure of the present invention.

Fig. 4 is another three-dimensional exploded view of the heat dissipation structure of the present invention.

Figure 5 is a three-dimensional assembly diagram of the heat dissipation structure of the present invention.

Fig. 6 is a schematic cross-sectional view of the heat dissipation structure of the present invention.

Figure 7 is a schematic bottom view of the cover of the present invention.

Fig. 8 is a schematic bottom view of another embodiment of the cover plate of the present invention.

Fig. 9 is a perspective view of another embodiment of the cover plate of the present invention.

12: Cover

121: inner wall

122: outer wall

3: Heat dissipation structure

31: cooling fins

311: Vent

32: thermal board

4: fan

5: Wind hood

51: opening

52: Extension

Claims (13)

An inverter device with a heat dissipation mechanism includes: A housing, including a base and a cover plate covering the base, the cover plate has an inner wall surface and an outer wall surface opposite to each other. The base is set up; at least one heating element should be housed inside the housing and installed on the base; the heat dissipation structure should be at least on the inside of the housing and be thermally attached to the inner wall; and Structure settings. The inverter device with a heat dissipation mechanism according to claim 1, wherein the fan is used to accelerate the movement of air inside the casing, and the heat dissipation structure is used to absorb heat from the air inside the casing and conduct the heat to The outer wall surface of the cover plate. The inverter device with a heat dissipation mechanism according to claim 1, wherein the heat dissipation structure includes a plurality of heat dissipation fins and a heat conducting plate, one side of the heat conducting plate is thermally attached to the inner wall surface, and the other side is connected with the plurality of heat dissipation Fins. According to claim 3, the inverter device with a heat dissipation mechanism, wherein the plurality of heat dissipation fins are arranged side by side with each other and two vents are formed at both ends, and the fan is provided corresponding to one of the vents. The inverter device with a heat dissipation mechanism according to claim 4, further comprising a wind deflector, the wind deflector is fixedly connected to the inner wall surface and covers the plurality of heat dissipation fins, and the wind deflector is provided with Corresponding to the two openings configured with the two vents, the fan is arranged corresponding to one of the openings. The inverter device with a heat dissipation mechanism according to claim 5, wherein the wind deflector has an extension section arranged between one of the openings and the plurality of heat dissipation fins, and the fan is installed in the extension section. The inverter device with a heat dissipation mechanism according to claim 3, wherein the plurality of heat dissipation fins are bent together to form at least one curved arc segment. The inverter device with heat dissipation mechanism according to claim 3, wherein the heat conducting plate and the cover plate are integrally formed with each other. The inverter device with a heat dissipation mechanism according to claim 3, wherein the heat conducting plate is fixed on the inner wall surface by bonding or locking. The inverter device with a heat dissipation mechanism according to claim 1, wherein the base has a bottom wall and a side wall surrounding the bottom wall, the heating element is mounted on the bottom wall, and the inner wall faces the The bottom wall is provided with a plurality of auxiliary fins connected to the outside of the bottom wall. The inverter device with a heat dissipation mechanism according to claim 1, wherein the number of heating elements is plural, and the plural heating elements include a circuit board, a plurality of capacitors, a power semiconductor element, a relay, a common mode choke and An inductor, the circuit board is fixedly connected to the bottom wall, the plurality of capacitors, the power semiconductor element, the relay, and the common mode choke coil are fixedly connected to the circuit board, and the inductance is arranged on one side of the circuit board Or fixed to the circuit board. The inverter device with a heat dissipation mechanism according to claim 1, wherein the number of heating elements is plural, and the plural heating elements include plural circuit boards, plural capacitors, a power semiconductor element, a relay, a common mode choke coil, and An inductor, the complex circuit board is fixedly connected to the bottom wall, the complex capacitor, the power semiconductor element, the relay, and the common mode choke coil are respectively fixedly connected to the complex circuit board, and the inductor is arranged on the complex circuit One side of the board is fixedly connected to one of the circuit boards. The inverter device with heat dissipation mechanism according to claim 1, wherein a plurality of auxiliary fins are connected to the outer wall surface of the cover plate.

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