TW202022971A - Carrier receiving device having substrate and adapting component for receiving carriers to be mounted capable of enhancing precision for mounting non-packaged dies onto carrier in a simple and cost-effective manner - Google Patents

Abstract

The present invention relates to a carrier receiving device (130) for receiving a carrier (190) of non-packaged dies (282) to be mounted. The carrier receiving device (130) comprises: (a) a base body (140); (b) a pneumatic system (444) disposed in the base body (140); (c) an adapting component (150) having a first side (451) and a second side (452) opposite to the first side, wherein the first side (451) is attached to the surface (142) of the base body (140) in a releasable manner and the second side (452) is configured to attach the carrier (190) to be mounted onto the adapting component (150); and, (d) a pneumatic connecting structure (454), which is arranged in the adapting component (150), penetrates through the adapting component (150) and is extended from the first side (451) to the second side (452). The pneumatic system (444) and the pneumatic connecting structure (454) are configured to apply the negative pressure onto the surface of the carrier (190).

Description

Use carrier accommodating device with base body and adapter element to accommodate carrier to be mounted

The present invention generally relates to the technical field of electronic component manufacturing. The present invention particularly relates to a carrier accommodating device for accommodating a carrier to be mounted with a shellless wafer. The present invention also relates to a system and a placement machine having such a carrier accommodating device, and a method for attaching a shellless chip to a carrier, especially in the manufacture of electronic components, which have at least one chip encapsulated in a package And suitable electrical connection contacts, with which the packaged chip can be electrically contacted.

In the manufacturing process of packaged electronic components, shellless (semiconductor) wafers, so-called "bare wafers", should be mounted on the carrier. In the context of the so-called "embedded wafer level packaging" (eWLP) technology, one or more chips of each package are placed on an adhesive film located on a carrier with the active side facing down. The placed multiple chips were subsequently potted with a large amount of plastic, which later represented the package. Then the entire potting product is baked under high pressure, and then peeled from the carrier or adhesive film. In the subsequent technical steps, the wafer is contacted again, electrical connections are made if necessary, and solder balls used as electrical connection contacts are plated. Finally, the entire potted product after further processing is sawed or otherwise divided into individual devices.

In short, eWLP is a package configuration for integrated circuits in which electrical connection contacts are created on a chip made of a chip and a potting compound. In this way, all the necessary processing steps to form the envelope on the artificial wafer are performed. Compared with the typical package technology that uses so-called "wire bonding", this allows the manufacture of extremely small flat packages with excellent electrothermal performance at very low manufacturing costs. Using this technique, you can The piece is made of, for example, a ball grid array (BGA).

In microelectronics, another well-known integration method is to manufacture so-called system-in-package (SiP) modules. In SIP technology, passive devices and active devices and other components are manufactured from multiple (semiconductor) wafers, and then these wafers are placed on a carrier by means of mounting technology, where the carrier can be, for example, printed circuit board epoxy material, adhesive Film or metal foil. Then, the placed chips are combined in a package with the help of well-known construction and connection techniques, often referred to as IC packaging. The required electrical connections between the various wafers can be achieved, for example, by bonding wires, where other connection principles may also be used, such as conductive thin layers on the sides of the wafers or interlayer connections. In the context of eWLP technology or in the production of SIP modules, a (improved) placement machine compared with the known surface mount technology is usually used to process wafers that have not yet been packaged. This type of placement machine has a placement head that is used to place the wafer at a predetermined placement position on the corresponding carrier. The positioning accuracy requirements for placement are extremely high here. At present, both eWLP technology and SIP module production require positioning accuracy or placement accuracy of 15μm/3σ or higher, where σ (sigma) is the standard deviation of the placement position. Due to the increasing miniaturization of electronic components, it is expected that higher requirements for placement accuracy will be put forward in the future.

This highly accurate placement requires not only high temperature stability of the components participating in the placement, but also low thermal expansion of the carrier containing device, and the carrier to be placed is fixed on the carrier containing device by means of vacuum or negative pressure. Therefore, for example, refer to DE102015101759B3, the carrier containing device (i) is maintained at the most constant temperature by means of a temperature regulating device and (ii) is composed of about 64% iron and 36% nickel and has a very low thermal expansion coefficient of Hengfan steel ( Made of invar steel) alloy. In addition, refer to DE102015101759B3 and DE102015112518B3, for example, a mark is attached to the carrier receiving device. According to the measurement marks, the distortion of the gantry system caused by thermal expansion can be determined, and the placement head of the placement machine moves with it. In the case of knowing the distortion of the gantry, the motor of the gantry can be at least roughly Eliminate this distortion. In addition, the so-called placement machine mapping data can be modified to match the placement position to the thermal expansion of the carrier. Therefore, it is particularly necessary to further improve the placement accuracy to 10 μm/3σ or more, and the carrier uses the same material (having the same thermal expansion coefficient) as the carrier accommodating device. However, the use of Hengfan steel is very expensive due to the high cost of this material.

Although different materials are used for the carrier accommodating device and the carrier to solve the above-mentioned cost problem, this cannot achieve the desired placement accuracy of 10 μm/3σ or more.

The purpose of the present invention is to improve the accuracy of mounting the shellless wafer to the carrier in a simple and cost-effective manner.

The solution of the present invention to achieve the above-mentioned object is the subject of a separate item. See the appendix for advantageous embodiments of the invention.

According to a first aspect of the present invention, a carrier accommodating device for accommodating a carrier to be mounted with a shellless wafer is described. The carrier containing device includes: (a) a base body; (b) a pneumatic system constructed in the base body; (c) an adapter element having a first side and a second side opposite to the first side, wherein the first side One side is detachably attached to the surface of the base, and the second side is configured so that the carrier to be mounted can be (flatly) attached to the adapter element; (d) a pneumatic connection structure, which is configured in the adapter The element extends through the adapter element from the first side to the second side, wherein the pneumatic system and the pneumatic connection structure are configured to apply negative pressure to the (lower) surface of the carrier.

The carrier accommodating device is based on the following recognition: Compared with the conventional (one-piece or single-piece) carrier accommodating device (without adapter plate), the carrier accommodating device is "suitable for" different types of carriers. The performance and/or flexibility can be easily and efficiently expanded by the (at least) two-part or two-part embodiment of the carrier containing device with the base body and the adapter element. That is, for different types of loading The body provides different adapter elements, wherein the first sides of all the adapter elements are constructed to be the same and compatible with the surface of the base body. The second side of the adapter element can then be configured to be compatible with at least one of a plurality of different types of carriers, so that it can reliably accommodate one type of carrier.

In short, with replaceable adapter elements, it is also possible to use a carrier that has a different material from the base body and thus has a different coefficient of thermal expansion. In order to obtain high placement accuracy, it is only necessary for the adapter element and the carrier to be composed of or have materials with at least approximately the same thermal expansion coefficient. In this way, a more cost-effective material than the base material can be used to manufacture the carrier. In particular, a carrier material with a higher coefficient of thermal expansion can be used.

For example, for certain component manufacturing processes that (depending on technology) require a very special carrier material, the carrier material may be required to be (significantly) different from the base material and have a particularly higher coefficient of thermal expansion. Compared with the conventional carrier accommodating device, through the replaceable adapter element, the flexibility of the carrier accommodating device in processing or manufacturing different (encapsulated) components (which are made by different manufacturing techniques) can be expanded Sex.

Preferably, a material is used for the material of the adapter element, and the material has a thermal expansion coefficient at least approximately the same as the material of the carrier. It is particularly preferred that the same material is used for the adapter element and the carrier.

In the present invention, the term "carrier" refers in principle to any mountable medium that can be placed (with its bottom side) on the adapter element. According to the corresponding application, the carrier can be a (one-piece) substrate, for example also a printed circuit board, on which the wafer is placed. The carrier may also be a multi-piece carrier. For example, the carrier may have a mechanically relatively rigid frame structure that spans the (adhesive) carrier film on which the wafer can be placed in a known manner for further processing. This further processing may include, in particular, the production of so-called artificial wafers, which The sheet can be used in a known manner to manufacture electronic components of the package. In the present invention, the term "substrate" refers to any such spatial entity structure: (i) it can be placed in the placement machine, and/or it can represent a part of the placement machine; and (ii) it has such (space ) The configuration surface, that is, the adapter element can be attached to the surface in a detachable manner.

In the present invention, the term "adapting element" refers to any spatial entity structure: (i) its first side can be (flatly) attached to the (upper) surface of the base; and (ii) to be mounted The carrier can be attached (flatly) to its second side. The adapter element can be of multi-piece or preferably single-piece construction.

The term "pneumatic system" refers to any channel system attached or constructed in or on a base body. The pneumatic system can have a pneumatic interface on the input side, and the pneumatic interface can be connected with a vacuum generating unit or a suction pump. The pneumatic system has a suitable outlet on the output side, so that the vacuum generated in the pneumatic system can also be "transferred" to the pneumatic connection structure.

The term "pneumatic connection structure" also refers to any channel system that transfers the vacuum received from the input side of the pneumatic system to the bottom side of the carrier attached to the second side of the adapter element. In a particularly simple embodiment, the pneumatic connection structure can be realized by means of suitable through holes, for example through holes.

According to an embodiment of the present invention, the base includes a first material having a first thermal expansion coefficient, and the adapter element includes a second material having a second thermal expansion coefficient. In this case, the second coefficient of thermal expansion is greater than the first coefficient of thermal expansion. This has the advantage that, in order to carry out highly accurate placement, the carrier accommodating device can also reliably accommodate or hold a carrier that has a carrier material or is made of a carrier material, and the carrier material is different from the first material of the base. The coefficient of thermal expansion. As described above, this can improve the flexibility of the carrier accommodating device for different types of carriers.

According to another embodiment of the present invention, the first material is Hengfan steel, special Don't be Super Hengfan Steel.

The advantage of using the material Hengfan steel is that the temperature change of the carrier containing device only has a relatively small impact on the placement accuracy. For example, this temperature change may be caused by the residual heat of the component in which the carrier accommodating device is built in the placement machine and/or the environmental temperature change.

As mentioned above, the Hengfan steel material can be an alloy composed of approximately 64% iron and 36% nickel. The so-called ultra-constant steel can be a Ni-Co-Fe alloy composed of 31% Ni, 5% Co and the rest of iron.

According to another embodiment of the present invention, the adapter element includes a plate or is realized by a plate in which a pneumatic connection structure is constructed. This has the advantage that the adapter element is easy to manufacture. This applies particularly to embodiments where the plates are plane-parallel plates.

According to another embodiment of the present invention, the surface of the base has a rectangular shape. Alternatively or in combination, at least the second side of the adapter element has a circular shape that matches the shape of the carrier.

The adapter element can also be (geometrically) composed of a rectangular plate and a circular disk located or arranged on it in two parts. In operation, the bottom side of the rectangular plate is attached to the base. The carrier rests on the top side of the disc. The thickness of the disc can be adjusted to give the carrier the desired height position of the circular support surface. This height position may preferably match the height position of a specific mark attached to the top side of the rectangular plate and used in the calibration process described below.

The advantage of using relatively simple geometric shapes for the base body and/or the adapter element is that the base body or the adapter element can be manufactured in a simple manner and with high precision.

According to another embodiment of the present invention, the carrier accommodating device further includes a plurality of fastening elements, especially screws, for fastening the adapter element to the base in a detachable manner.

Each fastening element can be evenly or unevenly distributed on the base body On the surface, it is therefore helpful for the adapter element to be fixedly and possibly over-determined to dock to the base.

In the case of using screws as the fastening element, it is obvious that both the base body and the adapter element must have appropriate openings at positions that are spatially related to each other, and at least one of the openings is correspondingly provided with an internal thread.

According to another embodiment of the present invention, the carrier accommodating device further comprises three supporting elements arranged or constructed between the base body and the adapter element, wherein, in particular, these supporting elements are realized as pedestal supporting elements. This has the advantage that the adapter element can be attached to and removed from the base body in a simple way (manually). By avoiding the flat fixed butt joint, it is possible to prevent the strain and/or distortion of the adapter element due to temperature changes (due to different thermal expansion coefficients). According to another embodiment of the present invention, the three supporting elements are configured such that the adapter element is statically attached to the base body.

The advantage of statically indeterminate support over statically indeterminate support is that when the temperature changes, the thermal expansion gain of the base body and the adapter element are different, so the adapter element will not undergo any spatial distortion. In this way, in the placement machine, it can be ensured that the (shell-less) wafer is particularly accurately positioned to the carrier element to be placed, which is an important prerequisite for high placement accuracy.

The statically determinate support can be realized, for example, as three ball bearings, which can be constructed as follows:

(1) First ball bearing: There is a (tapered) perforation on the first (lower) side of the adapter element, such as a 90° counterbore. There is a part of the first ball on the (upper) surface of the base, which snaps into the (conical) perforation and therefore "sinks" into it. (Individually) With this first ball bearing, the adapter element can still rotate and swing around the ball bearing.

(2) The second ball bearing: there is a (V-shaped) groove on or in the first lower side of the adapter element, and the longitudinal axis of the groove points to the first ball bearing. A part of the second ball on the base is locked into the (V-shaped) groove. Pass the first ball bearing and the first With the combination of two ball bearings, the adapter element can only swing around an axis, which is defined as the shortest line between the (first) fulcrum of the first ball bearing and the (second) fulcrum of the second ball bearing.

(3) The third ball bearing: the vertex of a part of the third ball constructed on the base abuts against the first plane side of the adapter element. Therefore, the adapter element can be statically supported on the base body.

It should be pointed out that in a statically determinate support state, the adapter element may still be lifted from the three (partial) support balls. A specific way to avoid this is, for example, that the adapter element is held on the base body magnetically or by a (partial) ball screwing centered through the first ball support.

It should also be pointed out that each of the above-mentioned ball bearings can also be implemented as follows: the corresponding (part of) ball is attached or constructed on the adapter element, and the corresponding pair of accessories, namely (conical) perforation, (V-shaped) concave The groove or plane is attached or constructed on the base body.

According to a further embodiment of the invention, the adapter element includes at least two first markings which are optically recognizable and are in particular attached or configured on the adapter element outside the space area provided for receiving the carrier. At present, it is preferable to provide four such first marks.

Based on at least one such first mark, through appropriate optical measurement, the position of the mounted wafer relative to the mark can be determined with high accuracy. At the same time, in the coordinate system of the carrier, the placement position of the corresponding chip is understood very accurately. This knowledge can then be used to further process the at least partially wafer-mounted carrier. In addition, when an undesired deviation of the chip's placement position in the carrier coordinate system is recognized, the information can be forwarded to the controller of the gantry system that moves or positions the placement head. This information can then be used to control the gantry system during subsequent placement of other chips in order to avoid deviations in placement positions in the future.

According to another embodiment of the present invention, the base body includes at least two second Markings, which are optically recognizable and are in particular attached or constructed on the base body outside the space area provided for accommodating the adapter element.

Based on at least one such second mark, through appropriate optical measurement, the position of the mounted wafer relative to the mark can be determined with high accuracy. At the same time, in the coordinate system of the substrate, the placement position of the corresponding chip can be understood very accurately. As mentioned above, if the base is made of a high-quality material with a low coefficient of thermal expansion, the coordinate system of the base can be approximately regarded as the coordinate system of the entire placement machine.

If the position of the relevant second mark in the placement machine is accurately known, the actual position of the mounted chip in the placement machine coordinate system can be accurately determined. In addition, if the position of the carrier to be mounted in the coordinate system of the placement machine is accurately known (directly or indirectly through the position of the transfer component), the actual position of the mounted chip in the carrier coordinate system can be determined with high precision. position.

Similarly, in this case, if it is determined in this position measurement that there is a certain undesired deviation between the actual placement position and the predetermined placement position, in the subsequent placement process, the placement head should be properly controlled. The movement at least roughly compensates for this deviation.

Before the substrate is built into the placement machine, a high-precision optical measuring instrument can be used to measure the precise position of the optically recognizable second mark. In this way, the above-mentioned optical measurement of the mounting position can be performed with particularly high accuracy.

The advantage of the two second marks being spatially arranged outside the area provided for accommodating the adapter element during the operation of the placement machine is that these can be measured during carrier placement even if the carrier does not extend beyond the adapter element on the side. Mark (location). In this way, during the mounting process, depending on the number of wafers to be mounted, it may take several hours to accurately identify the mounting position optically, so as to ensure high mounting accuracy for a long time.

According to another aspect of the present invention, a method for accommodating to be mounted System of different carriers without shell wafers. The system includes: (a) a carrier receiving device of the aforementioned type; (b) an additional adapter element having an additional first side and an additional second side opposite to the additional first side, wherein the additional The first side is detachably attached to the surface of the base, and the other second side is configured so that another carrier to be mounted can (flatly) be attached to another adapter element; and (c) Another pneumatic connection structure is constructed in another adapter element and extends from the other first side through the other adapter element to the other second side. The other pneumatic system and the pneumatic connection structure are configured to apply negative pressure to the (lower) surface of the other carrier.

The system is based on the recognition that different adapter plates can be provided for the basic elements, and these adapter plates are respectively associated with one type of carrier. The interconnected components (ie, the carrier and the adapter plate) are preferably made of the same material, or they at least have materials with the same or similar thermal expansion coefficients. Generally speaking, in the system, it is possible to keep (any number) of different adapter elements, which have different thermal expansion coefficients, so that multiple different types of carriers with different thermal expansion coefficients can be safely and accurately accommodated.

In short, a placement machine with a (fixed) built-in substrate is used, and a matching adapter component is used for each type of carrier, so that different types of carriers can be placed on wafers. In this way, it is not necessary to use a matching single-piece carrier accommodating device for each type of carrier. Otherwise, when the type of loading body to be attached is changed, this single-piece carrier accommodating device must be completely replaced with another one-piece carrier accommodating device . When using the multi-piece carrier accommodating device according to the present invention, this need not be the case, because only the adapter element needs to be matched. Compared with the (single-piece) carrier accommodating device, the adaptor element is obviously lower in cost, so the use of the system with at least two adaptor elements can save considerable cost. In addition, compared with the (single-piece) carrier accommodating device, the adapter element can obviously be replaced more easily. Therefore, the system can significantly reduce the time required for such replacement when changing the type of loading body to be attached.

According to another aspect of the present invention, a placement machine is described for attaching shellless wafers to a carrier, especially for manufacturing electronic components each having at least one chip in the package, the package particularly having a fully hardened Of potting materials. The placement machine includes: (a) a supply device for supplying wafers with a plurality of wafers; (b) a carrier housing device of the aforementioned type; and (c) a placement head for picking up wafers from the supplied wafers And place the picked up wafer on the predetermined mounting position on the carrier.

The placement machine is based on the recognition that a two-part carrier containing device with a base and an adapter plate can be specifically matched to the type of loading body to be placed, and can optimally contain various types of carriers in a simple manner. This kind of optimal holding position is accurate and without mechanical stress as much as possible, especially when temperature fluctuations are not easily avoided, which is an important prerequisite for obtaining extremely high placement accuracy.

According to another aspect of the present invention, a method for mounting a shellless wafer to a carrier using a placement machine, particularly the aforementioned type of placement machine, is described. The method includes: (a) using a supply device to provide wafers with multiple wafers; (b) using the aforementioned type of carrier accommodating device to accommodate the carrier to be mounted; (c) using negative pressure to load the wafer to be mounted The carrier is fixed to the carrier accommodating device, and the negative pressure is applied to the (lower) surface of the carrier via the pneumatic system in the base body and the pneumatic connection structure in the adapter element; (d) the chip is picked up from the supply device by means of the placement head (E) Transfer the picked wafer to the mounting area; and (f) Place the transferred wafer at a predetermined mounting position on the carrier. The method is also based on the following recognition: by using the aforementioned carrier accommodating device, it has an adapter plate, which can be specifically matched to the type of carrier to be loaded, and the optimal accommodation for various carrier types can be realized in a simple manner. . This is particularly applicable in view of the fact that there will be no unavoidable temperature fluctuations in the process of mounting the carrier on the wafer.

It should be pointed out that the above has described the implementation of the present invention in combination with different subject matters. In particular, some aspects of the present invention are described through the scope of product patent application Embodiments, and other embodiments of the present invention are described through the method patent scope. However, it is clear to those skilled in the art after reading this application that, in addition to the feature combination belonging to one type of invention subject, there may also be any feature combination belonging to different types of invention subject, unless explicitly stated otherwise.

By exemplifying the preferred embodiments of the present invention below, more advantages and features of the present invention will be apparent.

100: Placement machine

114: load rail

116: Carrier arm

118: Carrier plate

120: Mounting head

130: carrier holding device

140: matrix

142: Surface

148: Second Mark

150: Adapter element

158: First Mark

160: supply device

161: Wafer Supply Device

180: chip

190: Carrier

222: Wafer holding device

265: chip memory

270: Camera

282: Chip

292: Carrier Board

294: Adhesive Film

296: Optical Structure

372: Thermostat

375: Vacuum generating unit

376: Vacuum line

444: Pneumatic system

451: first side

452: second side

454: Pneumatic connection structure

456: screw

530: carrier holding device

557: Hemispherical support element

Figure 1 shows a placement machine according to an embodiment of the present invention, including: (i) a two-piece carrier containing device with a base and an adapter element; (ii) two wafer supply devices; and (iii) two placements head.

Fig. 2 shows an enlarged view of a part of the placement machine shown in Fig. 1.

Figure 3 shows a top view of a two-piece carrier containing device having a vacuum generating unit and a temperature regulating device pneumatically coupled to it.

Figure 4 shows a cross-sectional view of the two-piece carrier containment device, in which the adapter element and its pneumatic connection structure are screwed to the base body and its pneumatic system.

FIG. 5 shows a cross-sectional view of another embodiment of the two-part carrier receiving device, in which the adapter element rests statically on the base body by three support elements.

It should be pointed out that in the following detailed description, features or elements that are the same or at least functionally the same as the corresponding features or elements of a different embodiment and another embodiment are marked with the same reference signs or the last two digits of the reference signs. The elements are the same as the reference signs corresponding to the same or at least functionally identical features or elements. In order to avoid repetition, the features or elements that have been described based on the foregoing embodiments will not be described in detail below.

FIG. 1 shows a placement machine 100 according to an embodiment of the present invention. Placement machine 100 includes a frame 112 to which two surface positioning systems are attached to move each placement head 120 and 121 so that they can move in a plane parallel to the plane of the drawing. The two surface positioning systems include a carrier rail 114 that is stationary relative to the frame as a common first element. Two transverse load-bearing arms 116 are attached to the load-bearing rail 114 as a (non-common) second element, which can move in the y direction. The carrying arm 116 is a positioning system, and the carrying arm 116 is associated with another positioning system. The two positioning systems further respectively include a movable carrier plate 118, which is attached to the corresponding carrier arm 116 and can move in the x direction. The placement heads 120 and 121 are attached to the two carrier boards 118 by means of fixed screw connections.

The placement machine 100 further includes two wafer supply devices, namely one wafer supply device 160 and the other wafer supply device 161. In other non-illustrated embodiments, instead of at least one wafer supply device, another type of supply device (for example, a tape or cassette type supply device) may be used. Using each of the two wafer supply devices 160, 161, the wafer 180 can be brought from the chip memory (not shown in FIG. 1) to the supply area of the placement machine 100 by using the corresponding placement heads 120, 121 Individual wafers can be picked from it. The placement heads 120 and 121 are preferably so-called multiple placement heads, both of which have multiple suction pipes (shown as small circles in FIG. 1). The suction tube can temporarily pick up one wafer each. According to the embodiment shown in this figure, the suction pipe can be moved independently in the z direction, which is oriented perpendicular to the plane of the drawing, and thus perpendicular to both the y direction and the x direction. Alternatively, placement heads with other topologies can also be used, such as the so-called "collect and place turret head".

Then, through appropriate control of the relevant surface positioning system, the wafers picked up by the corresponding placement heads 120 and 121 are transferred to the placement area, where they are placed at the predetermined placement position to be placed. On the carrier 190.

The placement machine 100 provided with two placement heads 120, 121 and two supply devices 160, 161 can be operated in an operating mode in an advantageous manner, where In the operation mode, the two placement heads 120 and 121 alternately accommodate the wafers of their respective associated supply devices 160 and 161 and place the wafers on the carrier 190 to be placed. This can significantly improve placement performance. In this regard, the term "mounting performance" refers to the number of wafers that can be picked up and placed on the carrier 190 by the two mounting heads 120 and 121 within a predetermined time unit (for example, 1 hour).

The placement machine 100 further includes a carrier containing device 130. The carrier accommodating device 130 includes (at least) two elements or components, namely a base 140 and an adapter element 150. According to the embodiment shown in this figure, the base 140 is made of Hengfan steel (about 64% Fe, 36% Ni) or super Hengfan steel (about 31% Ni, 5% Co, the rest is Fe) material Therefore, it has very low thermal expansion under temperature fluctuations that may occur during the operation of the placement machine. The adapter element, which basically has a board shape, is made of another material. The material is the same as or has at least substantially the same coefficient of thermal expansion as the material constituting the carrier 190 to be mounted. According to the embodiment shown in this figure, the carrier 190 includes a mechanically relatively rigid frame structure that is entirely made of the material from which the adapter element 150 is made. The configuration of the carrier 190 will be described below with reference to FIG. 2.

During the placement process, the carrier 190 is held or fixed at a fixed spatial position of the placement machine 100 in the coordinate system. In this regard, it should be pointed out that compared to mounting the packaged electronic components on the printed circuit board, it usually takes longer to mount the chip without a package to the carrier 190, because the number of chips to be mounted on the carrier 190 is generally much larger. For the number of electronic components to be mounted on the printed circuit board. For this reason, the accuracy of positioning and fixing the carrier 190 to be mounted on the carrier accommodating device 130 is extremely high. For this reason, it must be ensured that the position of the entire carrier 190 or the position of each partition of the carrier 190 does not change during the entire mounting cycle of, for example, two hours. The same applies to the stroke of the relevant surface positioning system.

In order to obtain high placement accuracy and ensure a longer duration, multiple marks are constructed or attached to the carrier receiving device. These markers can be captured by the camera, And the precise location of these markers can be determined by performing corresponding image analysis on the captured images. Then, the gantry system can be calibrated according to the precise position of the determined mark, or recalibrated repeatedly in a long placement program. Preferably, as shown in Fig. 2, such a camera is directly or indirectly attached to one of the placement heads.

According to the embodiment shown in this figure, there are a total of four first marks 158 on the adapter element 150, which are laterally located beside the carrier 190. On the (upper) surface 142 of the base 140, outside of the adapter element 150 and seen from above, there are a total of four second marks 148.

FIG. 2 shows an enlarged view of a part of the placement machine 100 shown in FIG. 1. The wafer supply device 160 is associated with a wafer memory 265 in which a plurality of wafers are arranged with a plurality of shellless wafers (not shown in the figure) stacked on top of each other. With the help of the wafer supply device 160, each wafer 180 can be picked up from the wafer storage 265, and after the corresponding wafer is mounted, the wafer 180 whose wafers are at least partially emptied is returned to the wafer storage 265.

In order to roughly position or center the carrier 190 on the carrier accommodating device 130 or on the adapter element 150 by means of the carrier accommodating device, two mutually opposite optical structures 296 are formed in the outer region of the carrier 190. According to the embodiment shown in this figure, each of these two optical structures is realized by means of simple holes 296.

It should be noted that the carrier 190 used is a commonly used carrier, and the carrier preferably includes a metal carrier plate 292 and an adhesive film 294 applied to the carrier plate 292 by a known method. Wafers are placed on the adhesive film 294, which are represented by the reference numeral 282 in FIG. 2. The placement of the wafer 282 is accomplished by a well-known method by appropriately positioning the placement head 120 and lowering the wafer holding device 222 configured as a suction tube in the z direction perpendicular to the (xy) plane.

The above-mentioned centering of the carrier 190 on the adapter element 150 is based on the alignment Optical measurement of the position of the structure 296. For this purpose, according to the embodiment shown in this figure, a camera 270 is used, which is attached to the movable placement head 120 in an advantageous manner, thereby by appropriately controlling the surface positioning system (not shown in FIG. 2) , Place the camera 270 above the structure 296 to be measured in an appropriate manner. If the position of the camera 270 in the coordinate system of the placement machine 100 or the surface positioning system is accurately known in this measurement, the image collected by the camera 270 can be analyzed to determine the position of the carrier 190 on the placement machine 100. The coordinates in the coordinate system.

Alternatively or in combination, the marks 148 and 158 described above can also be used to optically determine the relative position of the carrier 190 with respect to these marks 148 and 158. For this, it is only necessary to use the camera 270 to detect the optically identifiable structure 296 and at least two of the marks 148 and 158. It should be noted that the number of marks used is by no means limited to a total of eight marks 148, 158 as shown in FIG. 2. Generally: the greater the number of marks, the more accurate the corresponding optical measurement. At least one of the marks 148 and 158 may also be measured together with the wafer 282 that has been mounted. In this way, as with the known automatic optical inspection (AOI) of the mounting content, the precise actual position of the relevant wafer 282 can be measured. Therefore, when other wafers are to be mounted in the future, any deviations that may exist from their target positions can be considered, and such deviations can be compensated by proper control of the surface positioning system.

It should be noted that the marks 148 and 158 have a highly accurate internal structure, and their positions on the base 140 and the adapter element 150 can be understood with extremely high accuracy. For this reason, it is preferable to use a high-precision optical measuring instrument to measure the base 140 and/or the adapter element 150 together with the related marks 148 and 158, and then build them into the placement machine 100. In this way, the position data of the coordinates of the marks 148 and 158 can be accurately understood, so that they can be used to measure the position of the mounted wafer 282 with high accuracy.

It should also be noted that the adapter element 150 can maintain a variety of different specifications or sizes. In this way, the placement machine 100 can be matched with different carriers in a simple manner Specification operation. In addition, the adapter element 150 can maintain different thermal expansion coefficients, so that the placement machine 100 can also be adapted to the operation of different carriers in a simple manner, wherein the different carriers include materials with different thermal expansion coefficients.

FIG. 3 shows a top view of the two-piece carrier receiving device 130. The carrier 190 is fixed to the adapter element 150 in a detachable manner by means of negative pressure. The corresponding pneumatic channels formed in the adapter element 150 and the base 140 are not shown in the top view of FIG. 3. FIG. 3 schematically shows a vacuum generating unit 375 which is pneumatically connected to the pneumatic system 444 of the base 140 via a vacuum line 376 (not shown in the figure).

In addition, FIG. 3 also shows a schematic diagram of the temperature control device 372 thermally connected to the base 140. In operation, the temperature adjustment device 372 controlled in a suitable manner ensures that the base 140 is maintained at an at least substantially constant temperature. If the adapter element 150 is made of a material with good heat conduction, especially metal, the thermal coupling between the adapter element 150 and the base 140 is good, and the adapter element 150 and the carrier 190 attached to it can be maintained At least approximately constant temperature.

FIG. 4 shows a cross-sectional view of the (at least) two-piece carrier receiving device 130. A pneumatic system 444 is constructed in the base 140, which is composed of a plurality of channels. The pneumatic system 444 is pneumatically connected to the vacuum line 376 on the input side (as shown). During the operation of the vacuum generating unit 375, a negative pressure is generated in the pneumatic system 444, and the negative pressure is transmitted to the pneumatic connection structure constructed in the adapter element 150. The pneumatic connection structure 454 also has a plurality of channels. When the adapter element 150 is correctly positioned on the base 140, these channels correspond to the position and size of the outlet of the pneumatic system 444 on the upper surface of the base 140. By means of the pneumatic connection structure 454, the negative pressure applied to the second lower side 452 of the adapter element 150 is transferred to the opening of the first upper side 451 of the adapter element 150. The opening of the pneumatic connection structure 454 on the first upper side 451 of the adapter element 150 is at least approximately completely closed by the carrier 190 to be mounted, so that the negative pressure in the pneumatic system 444 and the pneumatic connection structure 454 causes the carrier 190 to be fixed to it in a vacuum. Adapter element 150 First side 451.

It should be noted that FIG. 4 only schematically or exemplarily shows the spatial configuration of the pneumatic system 444 and/or the pneumatic connection structure 454. Depending on the specific application, completely different geometries can be used. For example, an annular groove may be constructed on the first upper side of the adapter element 150, and the annular groove can withstand negative pressure.

According to the embodiment shown in FIG. 4, the adapter element 150 is screwed to the base 140 in a detachable manner by means of a plurality of schematically shown screws 456 and corresponding internal threads. The screws 456 ensure that the adapter element 150 is mechanically docked to the base 140 firmly. When replacing the adapter component 150, all the screws 456 must be loosened, and after another adapter component is installed, the screws 456 must be tightened.

FIG. 5 shows a cross-sectional view of another embodiment of the (at least) two-piece carrier receiving device 530. The only difference between the carrier accommodating device 530 and the carrier accommodating device 130 shown in FIG. 4 is that a hemispherical support element 557 is used instead of the screw 456, and the adapter element 150 is placed on the hemispherical support element 557. For clarity, the gap between the second lower side 452 of the adapter element 150 and the upper side of the base 140 is enlarged and shown in FIG. 5. In fact, the gap is so small that only a small amount of outside air can penetrate into the pneumatic system 444 through the gap. The vacuum generating unit 375 can "easily pump away" these small amounts of air.

According to the embodiment shown in this figure, a supporting element 557 or a space recess (not shown) is configured on the second underside 452 of the adaptor element 150 in order to achieve a statically stable support of the adaptor element 150 on the base 140. In the present invention, a feasible solution for realizing this statically determinate support by means of three ball bearings has been described in detail, and will not be repeated here.

It should be noted that the term "comprising" does not exclude other elements, and "a" does not exclude a plurality. Moreover, elements described in combination with different embodiments may be combined. It should also be pointed out that the reference signs in the scope of patent applications should not be construed as limiting patent applications The scope of the scope.

130: carrier holding device

140: matrix

148: Second Mark

150: Adapter element

158: First Mark

375: Vacuum generating unit

376: Vacuum line

444: Pneumatic system

451: first side

452: second side

454: Pneumatic connection structure

456: screw

Claims (13)

A carrier accommodating device (130) for accommodating a carrier (190) for mounting a shellless wafer (282), the carrier accommodating device (130) includes: Base body (140); A pneumatic system (444) constructed in the base body (140); The adapter element (150) has a first side (451) and a second side (452) opposite to the first side (451), wherein, The first side (451) is detachably attached to the surface (142) of the base body (140), and The second side (452) is configured so that the carrier (190) to be mounted can be attached to the adapter element (150); A pneumatic connection structure (454), which is constructed in the adapter element (150) and extends from the first side (451) through the adapter element (150) to the second side (452), wherein , The pneumatic system (444) and the pneumatic connection structure (454) are configured such that negative pressure can be applied to the surface of the carrier (190). The carrier containing device (130) described in item 1 of the scope of patent application, Wherein, the base body (140) includes a first material having a first thermal expansion coefficient, and the adapter element (150) includes a second material having a second thermal expansion coefficient, Wherein, the second thermal expansion coefficient is greater than the first thermal expansion coefficient. The carrier containing device (130) described in item 2 of the scope of patent application, Wherein, the first material is Hengfan steel, especially super Hengfan steel. The carrier accommodating device (130) described in any one of the aforementioned patent applications, Wherein, the adapter element is a plate (150) in which the pneumatic connection structure (454) is constructed. The carrier accommodating device (130) described in any one of the aforementioned patent applications, Wherein, the surface (142) of the base body (140) has a rectangular shape, and/or Wherein, at least the second side (452) of the adapter element (150) has a circular shape. The carrier accommodating device (130) according to any one of items 1 to 5 in the scope of the patent application further includes: A plurality of fastening elements (456), especially screws (456), are used to fasten the adapter element (150) to the base body (140) in a detachable manner. The carrier accommodating device (530) described in any one of items 1 to 5 in the scope of the patent application further includes: Three supporting elements (557) arranged or constructed between the base body (140) and the adapter element (150), Among them, in particular, the supporting elements (557) are all realized as pedestal supporting elements. The carrier containing device (530) described in item 7 of the scope of patent application, Wherein, the three supporting elements (557) are configured such that the adapter element (150) is statically attached to the base body (140). The carrier accommodating device (130) described in any one of the aforementioned patent applications, Wherein, the adapter element (150) includes at least two first marks (158), which are optically recognizable and are especially attached or configured on the adapter element (150) to accommodate the The carrier (190) is outside the space area. The carrier accommodating device (130) described in any one of the aforementioned patent applications, Wherein, the base (140) includes at least two second marks (148), which are optically recognizable and are especially attached or configured on the base (140) to accommodate the adapter element ( 150) outside the space area. A system for accommodating different carriers (190) of a shellless chip (282) to be mounted, the system comprising: The carrier containing device (130) as described in any one of the aforementioned patent applications; An additional adapter element having an additional first side and an additional second side opposite to the additional first side, wherein the additional first side is detachably attached to the base body And the other second side is configured so that another carrier to be mounted can be attached to the other adapter element; and Another pneumatic connection structure, which is constructed in the other adapter element and extends from the other first side through the other adapter element to the other second side, Wherein, the other pneumatic system and the pneumatic connection structure are configured to be able to apply negative pressure to the surface or the lower surface of the other carrier. A placement machine (100) for attaching a shellless wafer (282) to a carrier (190), especially for manufacturing electronic components each having at least one chip in the package, the package in particular having a fully hardened The potting material, the placement machine includes: A supply device (160) for supplying a wafer (180) with a plurality of wafers (282); The carrier accommodating device (130) described in any one of items 1 to 10 in the scope of the patent application is used for accommodating the carrier (190) to be mounted; and The placement head (120) is used to pick up the wafer (282) from the provided wafers (180) and place the picked up wafer (282) on the predetermined placement position on the carrier (190). A method for using the placement machine (100) is a method of using the placement machine (100) as described in item 12 of the scope of patent application to mount the shellless wafer (282) to the carrier (190), the method include: Provide a wafer (180) with a plurality of wafers (282) by means of the supply device (160); With the aid of the carrier accommodating device (130) described in any one of items 1 to 10 in the scope of the patent application, the carrier to be mounted is accommodated; The carrier (190) to be mounted is fixed to the carrier accommodating device (130) by means of negative pressure, and the negative pressure passes through the pneumatic system (444) in the base body (140) and the adapter The pneumatic connection structure (454) in the element (150) is applied to the surface of the carrier (190); Pick up the provided wafer (282) from the supply device (160) by means of the placement head (120); Transfer the picked wafer (282) to the placement area; and The transferred wafer (282) is placed at a predetermined mounting position on the carrier (190).

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